PCB ENGLISH 英语
PCB专业术语中英文对照
PCB专业术语中英文对照PCB(Printed Circuit Board)是印刷电路板的简称,是电子行业中的重要组成部分,广泛应用于各种电子设备中。
PCB的设计、制造和测试都涉及到许多专业术语,这些术语在中英文之间有不同的表达方式,有时会造成一些理解和沟通上的困难。
为了方便PCB从业者和爱好者学习和交流,本文收集了一些常用的PCB专业术语,并给出了中英文对照的表格,希望能够对大家有所帮助。
本文按照以下几个方面来分类PCB专业术语:PCB基本概念PCB线路PCB孔PCB表面处理PCB测试PCB设计PCB制造每个方面的术语都以表格的形式给出,其中第一列是中文术语,第二列是英文术语,第三列是英文缩写(如果有的话),第四列是简要的解释或注释(如果需要的话)。
表格中的序号仅供参考,不代表任何优先级或重要性。
PCB基本概念序号中文英文缩写解释或注释1印刷电路板Printed Circuit Board PCB一种用导电图形连接电子元器件的硬性或柔性板材2印刷线路板Printed Wiring Board PWB与PCB同义,但更强调线路而非电路3单面板Single-sided Board SSB只有一面有导电图形的PCB4双面板Double-sided Board DSB两面都有导电图形,并通过金属化孔相连的PCB5多层板Multilayer Board MLB由三层或以上导电图形层叠合而成,并通过金属化孔相连的PCB 6刚性板Rigid Board由刚性基材制成的PCB7挠性板Flexible Board由柔性基材制成的PCB8刚挠结合板Rigid-flex Board由刚性和柔性基材组合而成的PCB9金属基板Metal Base Board由金属或金属复合材料作为基材的PCB10高频板High FrequencyBoard由具有特殊介电常数和损耗因数的基材制成的PCB,适用于高频信号传输PCB线路序号中文英文缩写解释或注释1线路图形CircuitPattern由导电材料(通常是铜箔)构成的电路图形,也称为线路或走线2线宽Line Width线路图形的宽度,通常用mil(千分之一英寸)或mm表示序号中文英文缩写解释或注释3线距LineSpacing相邻两条线路图形之间的距离,也称为间距或间隙4焊盘Pad连接元器件引脚或孔的圆形或方形的导电区域,也称为焊点或焊接区5过孔Via连接不同层次线路图形的金属化孔,也称为过孔孔或过孔焊盘6埋孔Buried Via连接内层线路图形但不穿透整个板的金属化孔,也称为埋藏式过孔7盲孔Blind Via连接外层和内层线路图形但不穿透整个板的金属化孔,也称为盲埋式过孔8阻焊层Solder Mask 覆盖在导电图形上的绝缘保护层,用于防止焊接时发生短路或氧化,通常是绿色或其他颜色9字符层Legend 印在PCB表面的文字、符号或标识,用于标明元器件位置、型号、方向等信息,通常是白色或其他颜色PCB孔序号中文英文缩写解释或注释1孔Hole 在PCB上打的圆形孔,用于连接不同层次的线路图形或安装元器件2钻孔Drilling在PCB上打孔的过程,通常使用机械钻头或激光钻头3金属化孔Plated-through Hole PTH在孔壁上镀一层金属(通常是铜)的孔,用于导电或焊接4非金属化孔Non-plated-throughHoleNPTH没有在孔壁上镀金属的孔,用于安装元器件或固定PCB5导通孔Through-hole穿透整个板的金属化孔,也称为通孔6连接孔Connection Hole连接不同层次线路图形的金属化孔,也称为连接点7安装孔Mounting Hole用于固定PCB的非金属化孔,也称为固定孔或螺丝孔PCB表面处理序号中文英文缩写解释或注释1无铅焊接Lead-freeSoldering使用不含铅的焊料进行焊接的过程,符合环保要求2有铅焊接LeadedSoldering使用含铅的焊料进行焊接的过程,有一定的环境污染风险3沉金Immersion Gold 在PCB表面沉积一层金属金的化学方法,用于提高导电性和耐腐蚀性,也称为化学镀金或ENIG(Electroless Nickel Immersion Gold)4沉锡Immersion Tin 在PCB表面沉积一层金属锡的化学方法,用于提高导电性和耐腐蚀性,也称为化学镀锡或ISn5沉银ImmersionSilver在PCB表面沉积一层金属银的化学方法,用于提高导电性和耐腐蚀性,也称为化学镀银或IAg6热风平整化Hot Air SolderLevelingHASL在PCB表面涂覆一层熔融的焊料,然后用热风吹去多余的焊料,形成一层平整的焊料层,用于提高导电性和耐腐蚀性,也称为热风喷锡或HOTPCB测试序号中文英文缩写解释或注释1电气测试Electrical Test检测PCB上的导电图形是否符合设计要求和规范的测试方法,用于发现开路、短路、阻抗不匹配等问题2飞针测试Flying Probe Test使用移动的探针对PCB上的焊盘或过孔进行点对点的电气测试的方法,适用于小批量或样品的测试3治具测试Fixture Test使用固定的探针阵列对PCB上的焊盘或过孔进行一次性的电气测试的方法,适用于大批量或标准化的测试4光学检测Optical Inspection使用光学设备(如显微镜、放大镜、相机等)对PCB的外观进行检查的方法,用于发现划痕、污渍、裂纹等缺陷5自动光学检测Automatic OpticalInspectionAOI使用自动化的光学设备和图像处理软件对PCB进行检测和分析的方法,用于提高检测效率和准确性PCB设计序号中文英文缩写解释或注释1原理图Schematic用符号表示电路元件和连接关系的图形,也称为电路图或逻辑图2网表Netlist用文本表示电路元件和连接关系的文件,也称为连接表或节点表3布局Layout 用图形表示PCB上元件和线路的位置和形状的过程或结果,也称为版图或布线4版面编辑器LayoutEditor用于进行PCB布局的软件工具,也称为版图编辑器或布线软件5元件库Library存储元件符号、封装、参数等信息的数据库,也称为库文件或元件资料库PCB制造序号中文英文缩写解释或注释1切割Cutting将大片的基材切割成小块的过程,也称为分板或划片2钻孔Drilling在PCB上打孔的过程,通常使用机械钻头或激光钻头3金属化Plating在PCB上镀一层金属(通常是铜)的过程,用于形成导电图形或金属化孔4蚀刻Etching 使用化学溶液去除多余的金属层,留下所需的导电图形的过程,也称为腐蚀或刻蚀5压合Lamination 将多层基材和预浸树脂层(Prepreg)叠合在一起,并加热压力使其粘合成一体的过程,也称为叠合或复合6表面处理SurfaceFinishing在PCB表面涂覆一层金属或非金属的保护层,用于提高导电性、耐腐蚀性和焊接性的过程,也称为表面镀层或表面涂层。
PCB中英文对照词汇
PCB 中英文对照词汇一、综合词汇序号中文英文1印刷电路Printed circuit2印制线路Printed wiring3印刷板Printed board4印制板电路Printed circuit board(pcb)5印制线路板Printed wiring board(pwb)6印制元件Printed component7印制接点Printed contact8印制板装配Printed board assembly9板board10单面印制板Single-sided printed board(ssb) 11双面印制板Double-sided printed board(dsb) 12多层印制板Multilayer printed board(mlb) 13多层印制电路板Multilayer printed circuit board 14多层印制线路板Multilayer printed wiring board 15刚性印制板Rigid printed board16刚性单面印制板Rigid single-sided printed board 17刚性双面印制板Rigid double-sided printed board 18刚性多层印制板Rigid multilayer printed board 19挠性多层印制板Flexible multilayer printed board20挠性印制板Flexible printed board21挠性单面印制板Flexible single-sided printed board22挠性双面印制板Flexible double-sided printed board23挠性印制电路Flexible printed circuit(fpc)24挠性印制线路Flexible printed wiring25刚性印制线路Flex-rigid printed board 、 rigid-flexprinted board26刚性双面印制板Flex-rigid double-sided printed board、rigid-flex double-sided printed27刚性多层印制板Flex-rigid multilayer printed board、rigid-flex double-sided printed28齐平印制板Flush printed board29金属芯印制板Metal core printed board30金属基印制板Metal base printed board31多重布线印制板Mulit-wiring printed board32陶瓷印制板Ceramic substrate printed board33导电胶印制板Electroconductive paste printed board34模塑电路板Molded circuit board35模压印制板Stamped printed wiring board36顺序层压多层印制板Sequentially-laminated multilayer37散线印制板Discrete wiring board38微线印制板Micro wire board39积层印制板Build-up printed board40积层多层印板Build-up multilayer printed board (bum) 41积层挠性印制板Build-up flexible printed board42表面层合电路板Surface laminar circuit(slc)43埋入凸块连印制板B2it printed board44多层膜基板Mutil-layered film substrate(mfs) 45层间全内导通多层印Alivh multiplayer printed board制板46载芯片板Chip on board (cob)47埋电阻板Buried resistance board48母板Mother board49子板Daughter board50背板backplane51裸板Bare board52键盘板夹心板Copper-invar-copper board53动态挠性板Dynamic flex board54静态挠性板Static flex board55可断拼板Break-away planel56电缆cable57挠性扁平电缆Flexible flat cable (ffc)58薄膜开关Membrance switch59混合开关Hybrid circuit60厚膜Thick film61厚膜电路Thick film circuit62薄膜Thin film63薄膜混合电路Thin film hybrid circuit 64互连interconnection65导线Conductor trace line 66齐平导线Flush conductor 67传输线Transmission line 68跨交crossover69板边插头Edge-board contact 70增强板stiffener71基底Substrate72基板面Real estate73导线面Conductor side74元件面Component side 75焊接面Solder side76印制Printing77网格Grid78图形Pattern79导电图形Conductive pattern 80非导电图形Non-conductive pattern 81字符legend82标志mark二、基材序号中文英文1基材Base material2层压板Laminate3覆金属箔基材Metal-clad bade material4覆铜箔层压板Copper-clad laminate(ccl)5单面覆铜箔层压板Single-sided copper-clad laminate 6双面覆铜箔层压板Double-sided copper laminate 7复合层压板Composite laminate8薄层压板Thin laminate9金属芯覆铜箔层压板Metal core copper-clad laminate 10金属基覆铜层压板Metal base copper-clad laminate 11挠性覆铜箔绝缘薄膜Flexible copper-clad dielectric film 12基体材料Basis material13预浸材料Prepreg14粘结片Bonding sheet15预浸粘结片Preimpregnated bonding sheet 16环氧玻璃基板Epoxy glass substrate17加成法用层压板Laminate for additive process 18预制内层覆箔板Mass laminate panel19内层芯板Core material20催化板材Catalyzed board21涂胶催化层压板Adhesive-coated catalyzed laminate 22涂胶无催化层压板Adhesive-coated uncatalyzed laminate 23粘结层Bonding layer24粘结膜Film adhesive25涂胶粘剂绝缘薄膜Adhesive coated dielectric film26无支撑胶粘剂膜Unsupported adhesive film27覆盖层Cover layer28增强板材Stiffener material29铜箔面Copper-clad surface30去铜箔面Foil removal surface31层压板面Unclad laminate surface32基膜面Base film surface33胶粘剂面Adhesive face34原始光洁面Plate finish35粗面Matt finish36纵向Length wise direction37横向Cross wise direction38剪切板Cut to size panel39酚醛纸质覆铜箔板Phenolic cellulose paper copper-cladlaminates(phenolic paper ccl)40环氧纸质覆铜箔板Epoxide cellulose paper copper-cladlaminates(epoxy paper ccl)41环氧玻璃布基覆铜箔Epoxide woven glass fabric copper-clad 板laminate42环氧玻璃布纸复合覆Epoxide cellulose paper core glass cloth 铜箔板surfaces copper-clad laminate43环氧玻璃布玻璃纤维Epoxide non woven glass reinforced 复合覆铜箔板copper-clad laminate44聚酯玻璃布覆铜箔板Polyester wovenglass fabric copper-clad laminate45聚酰亚胺玻璃布覆铜Polyimide woven glass fabric copper-clad箔板laminate46双马来酰亚胺三嗪环Bismaleimide triazine epoxide woven 氧玻璃布覆铜板glass fabric copper-clad laminate47环氧合成纤维布覆铜Epoxide synthetic fiber copper-clad箔板laminates48聚四乙烯玻璃纤维覆Teflon fiber glass copper-clad laminate铜箔板49超薄型层压板Ultra thin laminate50陶瓷基覆铜箔板Ceramincs base copper-clad laminate 51紫外线阻挡型覆铜箔Uv blocking copper-clad laminates板三、基材的材料序号中文英文1 a 阶树脂a-stage resin2 b 阶树脂b-stage resin3 c 阶树脂c-stage resin4环氧树脂Epoxy resin5酚醛树脂Phenolic resin6聚酯树脂Polyester resin7聚酰亚胺树脂Polyimide resin8双马来酰亚胺三嗪树Bismaleimide-triazine resin脂9丙烯酸树脂Acrylic resin10三聚氰胺甲醛树脂Melamine formaldehyde resin 11多功能环氧树脂Polyfunctional epoxy resin 12溴化环氧树脂Brominated epoxy resin 13环氧酚醛Epoxy novolac14氟树脂fluroresin15硅树脂Silicone resin16硅烷silane17聚合物polymer18无定形聚合物Amorphous polymer19结晶现象Crystalline polamer20双晶现象dimorphism21共聚物copolymer22合成树脂synthetic23热固性树脂Thermosetting resin24热塑性树脂Thermoplastic resin25感光性树脂Photosensitive resin26环氧当量Weight per epoxy equipvalent(wpe) 27环氧值Epoxy value28双氰胺dicyandiamide29粘结剂binder30固化剂Curing agent31胶粘剂adesive32阻燃剂Flame retardant33遮光剂opaquer34增塑剂plasticizers35不饱和聚酯Unsatuiated polyster36聚酯薄膜polyester37聚酰亚胺薄膜Polyimide film(pi)38聚四氟乙烯Polytetrafluoetylene(ptfe)39聚四氟乙烯丙烯薄膜Perfluorinated ethylene-propylenecopolymer film(fep)40增强材料Reinforcing material41玻璃纤维Glass fiber42 E 玻璃纤维e-glass fiber43 D 玻璃纤维d-glass fiber44S 玻璃纤维s-glass fiber45玻璃布Glass fabric46非织布Non-woven fabric 47玻璃纤维垫Glass mats48纱线yarn49单丝filament50胶股strand51纬纱Weft yarn52经纱Warp yarn53但尼尔denier54经向Warp-wise55纬向Weft-wise 、 filling-wise 56织物经纬密度Thread count57织物组织Weave structure58平纹组织Plain structure59坏布Grey fabric60稀松织物Woven scrim61弓纬Bow of weave62断经End missing63缺纬Mis-picks64纬斜bias65折痕crease66云织waviness67鱼眼Fish eye68毛圈长Feather length69厚薄段mark70裂缝spilt71捻度Twist of yarn72浸润剂含量Size content73浸润剂残留量Size residue74处理剂含量Finish leval75浸润剂size76偶联剂Couplint agent77处理织物Finished fabric78聚酰胺纤维Polyarmide fiber79聚酯纤维非织布Non-woven polyester fabric 80浸渍绝缘纵纸Impregenating insulation paper 81聚芳酰胺纤维纸Aromatic polyamide paper 82断裂长Breaking length83吸水高度Height of capillary rise84湿强度保留率Wet strength retention85白度whitenness86陶瓷ceramics87导电箔Conductive foil88铜箔Copper foil89电解铜箔Electrodeposited copper foil (ed copperfoil)90压延铜箔Rolled copper foil91退火铜箔Annealed copper foil92压延退火铜箔Rolled annealed copper foil (ra copperfoil)93薄铜箔Thin copper foil94涂胶铜箔Adhesive coated foil95涂胶脂铜箔Resin coated copper foil(rcc)96复合金属箔Composite metallic material97载体搏Carrier foil98殷瓦invar99箔(剖面)轮廓Foil profile100光面Shiny side101粗糙面Matte side102处理面Treated side103防锈处理Stain proofing104双面处理铜箔Double treated foil四、设计序号中文英文1原理图Shematic diagram2逻辑图Logic diagram3印制线路布设Printed wire layout4布设总图Master drawing5可制造性设计Design-for-manufacturability6计算机辅助设计Computer-aided design(cad)7计算机辅助制造Computer-aided manufacturability(cim) 8计算机集成制造Computer integrat manufacturing 9计算机辅助工程Computer-aided engineering(cae) 10计算机辅助测试Computer-aided test (cat)11电子设计自动化Electric design automaton(eda) 12工程设计自动化Engineering design automaton(eda2) 13组装设计自动化Assemnly aided architecturaldesign(aaad) 14计算机辅助制图Computer aided drawing15计算机控制显示Computer controlled display(ccd) 16布局placement17布线routing18布图设计layout19重布rerouting20模拟simulation21逻辑模拟Logic simulation22电路模拟Circit simulate23时序模拟Timing simulation24模块化modularization25布线完成率Layout effeciency26机器描述格式Machine descriptionm format(mdf) 27机器描述格式数据库Mdf database28设计数据库Design database29设计原点Design origin30优化(设计)Optimization(design)31供设计优化坐标轴Predominant axis32表格原点Table origin33镜像Mirroring34驱动文件Drive file35中间文件Intermediate file36制造文件Manufacturing documentation 37队列支撑数据库Queue support database38元件安置component positioning 39图形显示Graphics display40比例因子Scaling factor41扫描填充Scan filling42矩形填充Rectangle filling43填充域Region filling44实体设计Physical design45逻辑设计Logic design46逻辑电路Logic design47层次设计Hierarchical design48自顶向下设计Top-down design49自顶向上设计Bottom-up design50线网net51数字化digitzing52设计规则检查Design rule checking53走(布)线路Router(cad)54网络表Net list55计算机辅助电路分析Computer-aided circuit analysis 56子线网Subnet57目标函数Objective function58设计后处理Post design processing(pdp) 59交互式制图设计Interactive drawing design 60费用矩阵Cost metrix61工程图Engineering drawing62方块框图Block diagram63迷宫Moze64元件密度Component density65巡回售货员问题Traveling salesman problem 66自由度Degrees freedom67入度Out going degree68出度Incoming degree69曼哈顿距离Manhatton distance70欧几里德距离Euclidean distance71网络Network72阵列Array73段Segment74逻辑Logic75逻辑设计自动化Logic design automation 76分线Separated time77分层Separated layer78定顺序Definite sequence79对准度registration80孔环Annular ring81公差Tolerance82同心Concentricity83样片coupon84变色discolorations85污点Stains86试样Specimen 87钻孔Drilling88剪裁Shearing 89切外型Routing90刮线Scoring91倒角Chamfering 92切空Blanking 93适应性suitability 94板弯Bow95板扭Twist96应力Stress97防焊膜Solder mask 98阻焊膜Solder resist 99文字标记Legend 100版本代字Revision letter 101料号Part No 102跳漏Skipping 103浮空Soda strawing 104流动Flow 105整平Leveling 106FPR First pass yield ‘。
pcb基本英语(1)
pcb基本英语(1)流程Board cut 开料Carbon printing 碳油印刷Inner dry film 内层⼲膜Peelable blue mask 蓝胶Inner etching 内层蚀刻ENIG(Electroless nickel immersion gold) 沉镍⾦Inner dry film stripping 内层⼲膜退膜 HAL(hot air leveling)喷锡AOI(Automatic Optical Inspection)⾃动光学检测OSP(Organic solderability preservative)有机保焊Pressing 压板Punching 啤板Drilling 钻孔Profiling 外形加⼯Desmear 除胶渣,去钻污 E-Test 电性测试PTH 镀通孔,沉铜FQC(final quality control) 最终品质控制Panel plating 整板电镀FQA(Final quality audit) 最终品质保证Outer dry film 外层⼲膜Packing 包装Etching 蚀刻IPQA(In-process quality audit) 流程QATin stripping 退锡IPQC(In-process quality control) 流程QCEQC(QC after etching)蚀检QCIQC(Incoming quality control) 来料检查Solder mask 感阻MRB(material review board) 材料评审委员会Component mark 字符QA(Quality assurance) 品质保证Physical Laboratory 物理实验室QC(Quality control) 品质控制Chemistry Laboratory 化学实验室Document control center ⽂件控制中⼼2nd Drilling ⼆钻Routing 锣板,铣板Brown oxidation 棕化Waste water treatment 污⽔处理V-cut V坑WIP(work in process)半成品Store/stock 仓库(Finished goods) 成品概述Printed Circuit Board 印制电路板Flexible Printed Circuit, FPC 软板Double-Side Printed Board 双⾯板IPC(The Institute for Interconnecting and Packing Electronic Circuits)电⼦电路互连与封装协会CPAR(Corrective & Preventive Action Request)要求纠正预防措施Flammability Rate 燃性等级Characteristic impedance 特性阻抗BUM(Build-up multilayer)积层多层板Date Code周期代码CCL(Copper-clad laminate)覆铜板Ionic contamination 离⼦性污染Acceptance Quality Level (AQL) 允收⽔平HDI(High density interconnecting)⾼密度互连板Base Material 基材Radius 半径Capacity ⽣产能⼒Diameter 直径Capability ⼯艺能⼒PPM(Parts Per Million) 百万分之⼏CAM(computer-aided manufacturing) 计算机辅助制造Underwriters Laboratories Inc. 美国保险商实验所CAD (computer-aided design) 计算机辅助设计Statistical Process Control 统计过程控制Specification 规格,规范Via 导通孔Dimension 尺⼨Buried /blind via 埋/盲孔Tolerance 公差Tooling hole 定位孔Oven 焗炉Output/throughput 产量湿流程PTH(plated through hole)镀通孔(俗称沉铜)Acid cleaning 酸性除油PP(Panel Plating) 板电Acid dip 酸洗Pattern plating 图电Pre-dip 预浸Line width 线宽Alkaline cleaning 碱性除油Spacing 线隙Flux 松⾹Deburring 去⽑刺(沉铜前磨板) Hot air leveling 喷锡Carbon treatment 碳处理Skip plating 跳镀,漏镀Track/conductor 导线Undercut 侧蚀Aspect ratio深径⽐Water rinsing ⽔洗Etch Factor 蚀刻因⼦Transportation ⾏车Back Light Test 背光测试Rack 挂架Pink ring 粉红圈Maintenance 保养⼲流程Hole location 孔位Annular ring 孔环Image Transfer 图象转移Component Side(C/S) 元件⾯Artwork 底⽚Solder Side(S/S) 焊接⾯Mylar 胶⽚Matte Solder Mask 哑绿油Silkscreen/legend/Component Mark⽂字Hole breakout 破孔Fiducial mark 基点,对光点 Scrubbing 磨板Expose 曝光Developing 显影内层制作Core material 内层芯板Thermal pad 散热PADPre-preg PP⽚Resin content 树脂含量Kraft Paper ⽜⽪纸Brown oxidation 棕化Lay up 排版Black Oxidation ⿊化Registration 对位Base material 板材Delamination 分层其它Wicking 灯芯效应Hole size 孔径(尺⼨)Yield 良品率Touch Up 修理Warp and Twist 板曲度Solvent Test 溶剂测试Peel off 剥离Company Logo 公司标识Tape Test 胶纸试验UL Mark UL 标记Cosmetic 外观Function 功能Tin/Lead Ratio 锡/铅⽐例Reliability Tests 可靠性试验Hole Wall Roughness 孔壁粗糙度Base Copper Thickness 底铜厚度PCB专业英语(PCB SPECIAL ENGLISH)=Printed Circuit Board 电路板=Computer aided manufacture 计算机辅助焊盘ring 焊环=automatic optical inspection ⾃动光学检测 of free 免费=work in process 在线板=document control center ⽂控中⼼字符=Component Side =Top Side (顶层)元件⾯=Solder Side =Bottom Side (底层)焊锡⾯Plated 电⾦,镀⾦Plated 电镍,镀镍Gold 沉⾦=沉镍⾦Ink Print 印碳油Report 切⽚报告,横切⾯报告=Cross-out 打"X"报告(客户称)拼板,(⽣产线称)⼯作板标记,UL 标记code ⽣产周期单元,单位外形,轮廓By Routing 锣(铣)外形Film 湿菲林,湿绿油,湿膜槽,⽅坑Material=Base Laminate 基材,板料=V-score V形槽成品市场部File GERBER⽂件LOGO UL标记=Electric Open/Short Test 电⼦测试=Purchase Order 订单公差,Flexible Board 刚性,软性板cut 开料baking 焗板钻孔=Plated Through Hole 镀通孔,沉铜plating 板⾯电镀,全板电镀Image 图象,线路图形plating 线路电镀蚀板,蚀刻=Solder Mask 防焊,阻焊,绿油=Solder Resist 防焊,阻焊,绿油finger ⾦⼿指丝印字符=HASL=Hot air(Solder)leveling 热风整平喷锡锣板,铣板冲板,啤板=final quality checking 终检,最后检查=final quality audit 最后稽查(抽查)出货松⾹⾦,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合⾦free ⽆铅=compliance of certificate 材料证明书=cross section 微切⽚,横切⽚gold 沉镍⾦=punch die 模具,啤模=manufacture instruction 制作批⽰=quality assurance 品质保证=computer aided design 计算机辅助设计bit size钻咀直径and twist 板弯和板曲击打,孔数邦定,点焊coupon 测试模块(科邦)copper 抢电流铜⽪tab ⼯艺边away tab ⼯艺边=ground 地线,⼤铜⽪edge 孔边,孔内hole 邮票孔天坯,型板,钻孔样板(⾸板)film ⼲菲林,⼲膜=liquid photo image 液态感光=湿绿油多层板=surface mouted device 贴⽚,表⾯贴装器件=surface mouted technology 表⾯贴装技术mask=blue gel 蓝胶hole ⼯艺孔,管位,定位孔,⼯具孔mask 测光点,光学对位点,对光点,电眼foil 铜箔尺⼨负的,positive正的gold 闪镀⾦,镀薄⾦department ⼯程部date 交货期斜边=gap 间隙,⽓隙,线隙PCB的各层定义及描述为了⽅便与印制板⼚家的技术沟通,提⾼对PCB的技术认知⼀致度,特在此将我司常⽤PCB的有关板层特性做简单说明,请爱好者参考此说明进⾏设计和制造。
pcb专业术语英文及翻译
pcb专业术语英文及翻译摘要:本文介绍了PCB(Printed Circuit Board,印刷电路板)专业术语的英文表达和翻译,根据内容实际需求分为三大类:PCB制造术语、PCB组装术语和PCB测试术语。
在每个类别下,将列举相关术语及其英文表达和翻译,从而帮助读者更好地理解和运用PCB专业术语。
正文:I. PCB制造术语1. 单、双面板 (Single-sided, Double-sided board)单面板:一种仅在板的一侧进行布线和元件安装的印刷电路板。
双面板:一种在两侧布线和元件安装的印刷电路板。
2. 环氧树脂 (Epoxy Resin)环氧树脂是一种常用的PCB基材,具有良好的绝缘性和耐热性。
3. 铜盖膜 (Copper Foil)铜盖膜是覆盖在印刷电路板表面的一层铜箔,用于电气连接。
4. 阻焊层 (Solder Mask Layer)阻焊层是一种覆盖在印刷电路板表面的保护层,用于防止元件的误焊。
5. 玻璃纤维布 (Glass Fiber Cloth)玻璃纤维布是PCB制造中一种常用的增强材料,用于提高印刷电路板的强度和耐磨性。
6. 焊盘 (Pad)焊盘是印刷电路板上用于连接元件引脚的焊接区域。
7. 过孔 (Through-hole)过孔是印刷电路板上贯穿两侧的孔洞,用于连接不同电子元器件。
8. 排针 (Pin Header)排针是一种插针式连接器,常用于将PCB与其他设备连接。
9. 焊接 (Soldering)焊接是将电子元件与印刷电路板焊接在一起的一种连接方法。
II. PCB组装术语1. 表面贴装技术 (Surface Mount Technology, SMT)表面贴装技术是一种将电子元件直接焊接在印刷电路板表面的组装方法。
2. 波峰焊接 (Wave Soldering)波峰焊接是一种通过将印刷电路板浸入焊锡浪涌中来实现电子元件的连接。
3. 焊接膏 (Solder Paste)焊接膏是表面贴装技术中使用的一种黏性材料,用于在印刷电路板上确定元件的位置并进行焊接。
PCB专业术语中英文翻译
PCB专业术语中英文翻译很多PCB的书上使用的是英文,但是大多数的人又看不懂英文,这时候怎么办呢,我们需要翻译,但是如果每看到一个不会的词儿就去翻译,那么就太耗费时间了,所以我们捷多邦总结了一些常用的专业术语的中英文对照,希望能对大家有用。
1.印制电路:printed circuit2.印制线路:printed wiring3.印制板:printed board4.印制板电路:printed circuit board (pcb)5.印制线路板:printed wiring board(pwb)6.印制元件:printed component7.印制接点:printed contact8.印制板装配:printed board assembly9.板:board 110.表面层合电路板:surface laminar circuit (slc)11.埋入凸块连印制板:b2it printed board12.多层膜基板:multi-layered film substrate(mfs)13.层间全内导通多层印制板:alivh multilayer printed board14.载芯片板:chip on board (cob)15.埋电阻板:buried resistance board16.母板:mother board17.单面印制板:single-sided printed board(ssb)18.双面印制板:double-sided printed board(dsb)19.多层印制板:mulitlayer printed board(mlb)20.多层印制电路板:mulitlayer printed circuit board21.多层印制线路板:mulitlayer prited wiring board22.刚性印制板:rigid printed board23.刚性单面印制板:rigid single-sided printed borad24.刚性双面印制板:rigid double-sided printed borad25.刚性多层印制板:rigid multilayer printed board26.子板:daughter board27.背板:backplane28.裸板:bare board29.键盘板夹心板:copper-invar-copper board30.动态挠性板:dynamic flex board31.静态挠性板:static flex board32.可断拼板:break-away planel33.电缆:cable34.挠性扁平电缆:flexible flat cable (ffc)35.薄膜开关:membrane switch36.混合电路:hybrid circuit37.厚膜:thick film38.厚膜电路:thick film circuit39.薄膜:thin film40.挠性多层印制板:flexible multilayer printed board41.挠性印制板:flexible printed board42.挠性单面印制板:flexible single-sided printed board43.挠性双面印制板:flexible double-sided printed board44.挠性印制电路:flexible printed circuit (fpc)45.挠性印制线路:flexible printed wiring46.刚性印制板:flex-rigid printed board, rigid-flex printedboard47.刚性双面印制板:flex-rigid double-sided printed board,rigid-flex double-sided printed48.刚性多层印制板:flex-rigid multilayer printed board,rigid-flex multilayer printed board49.齐平印制板:flush printed board50.金属芯印制板:metal core printed board51.金属基印制板:metal base printed board52.多重布线印制板:mulit-wiring printed board53.陶瓷印制板:ceramic substrate printed board54.导电胶印制板:electroconductive paste printed board55.模塑电路板:molded circuit board56.模压印制板:stamped printed wiring board57.顺序层压多层印制板:sequentially-laminated mulitlayer58.散线印制板:discrete wiring board59.微线印制板:micro wire board60.积层印制板:buile-up printed board61.积层多层印制板:build-up mulitlayer printed board (bum)62.积层挠印制板:build-up flexible pr上面是一些比较常见的专业用语,有一些不是特别常用的有时候我们也会遇到,所以我们捷多邦也总结了一些不怎么常用的中英文对照,希望对你来说是有用的:1.Absorption 吸收、吸入2.Accelerated Test(Aging)加速试验、加速老化3.Accelerator 加速剂、速化剂4.Accept/Acceptance 允收5.Acceptable Quality Level(AQL)允收品质水准6.Accuracy 准确度ACF:7.Adhesive copper foil 有胶铜箔8.Activator 活化剂、添加剂比称为9.Activator Active parts(Devices)主动零件,指积体电路或电晶体10.Addition Agent 添加剂11.Additive Process 加成法、分全加成、半加成及部份加成12.Back Light(Back Lighting)背光法13.Back-UP 垫板14.Backpanels/ Backplanes 背板、支持板,厚度较厚,15.Ball Grid Array(BGA)球脚车列(封装)16.Barrel 孔壁17.Base Material 基材18.Batch 批(同时间发料某一数量的板子)19.Bevelling 切斜边20.Binder 黏结剂21.Capacitance 电容22.Carbide 碳化物、碳化钨钻头23.CAR: Corrective Action Report 改善报告24.Carbon Treatment 活性碳处理25.Card 卡板26.Carrier 载体27.Cartridge 滤芯28.Cathode 阴极L: Copper Clad Laminates 铜箔基板30.Ceramics 陶瓷31.Certificate 证明书32.CFC 氟氯碳化物33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角34.Characteristic Impedance 特性阻抗35.Cheek list 检察清单36.Chip 晶粒、晶片37.Chip On Board 晶片黏著板38.Clean Room 无尘室(Class 100)39.Cleanliness 清洁度40.Clearance 余隙、余环41.COB(Chip on Board)晶片在板上直接组装42.COC(Certificate of Compliance)出货合格书。
pcb线路板专业英语(中英)
3
h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 噴砂 ( Pumice)(Wet Blasting) h-12 印可剝離防焊 (Peelable Solder Mask)
化學蒸著鍍 圓周性之孔破 包夾金屬 無塵室 間隙 鍍外表 防焊覆蓋錯誤
8
coefficient of thermal expansion (CTE) 熱澎脹系數
cold solder joint
冷焊點
cold-weld
金屬粉末冷焊
color
顏色
color error
顏色錯誤
compensation
1
* Process Module 說明 :
A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料發料 (Panel)(Shear material to Size)
B. 鑽孔 (Drilling) b-1 內鑽 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射鑽孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔鑽孔 (Blind & Buried Hole Drilling)
突出
coordinate list
資料清單
copper claded laminates (CCL)
銅箔基板
copper exposure
線路露銅
加速試驗
PCB专业英译术语
PCB专业英译术语PCB(Printed Circuit Board,印刷电路板)是现代电子产品中最常用的一种重要的电路载体,其设计、生产和维修需要大量的技术术语支持。
本文将重点介绍PCB专业英译术语。
一、PCB基础术语1. PCB(Printed Circuit Board):印刷电路板2. SMT(Surface Mount Technology):表面贴装技术3. Through-hole Technology:通孔技术4. PTH(Plated Through Hole):贯穿电解孔5. FR4:一种常用的印刷电路板基材材料,即玻璃纤维材料,通常由环氧树脂和玻璃纤维材料构成6. Pad:焊盘7. Trace:线路8. Via:垂直插孔9. Gerber file:Gerber文件格式,一种电路板设计文件格式10. BOM(Bill of Materials):物料清单11. NC(Numerical Control):数控12. DFM(Design for Manufacturability):可制造性设计二、PCB制造过程相关术语1. CAM(Computer Aided Manufacturing):计算机辅助制造2. Etch:蚀刻3. Silkscreen:丝网印刷4. Solder mask:焊盘油墨5. Plating:电镀6. HASL(Hot Air Solder Leveling):热风焊盘处理7. OSP(Organic Solderability Preservatives):有机可焊保护剂8. Gold Fingers:金手指,指电子产品中可进行插拔操作的特殊金属触点9. DIP(Dual In-line Package):双列直插封装10. SOP(Small Outline Package):小封装11. QFN(Quad Flat Package):四角平封12. BGA(Ball Grid Array):球网阵列13. PCBA(Printed Circuit Board Assembly):印刷电路板装配三、PCB测试和维修相关术语1. AOI(Automated Optical Inspection):自动光学检测2. X-ray Inspection:X光检测3. ICT(In-Circuit Test):在线测试4. FCT(Functional Circuit Test):功能测试5. Test point:测试点6. Defect:缺陷7. Repair:修复8. Rework:返工9. Troubleshooting:故障排除四、PCB设计相关术语1. EDA(Electronic Design Automation):电子设计自动化2. Netlist:网表3. DRC(Design Rule Check):设计规则检查4. DFM(Design for Manufacturing):可制造性设计5. Gerber data:Gerber数据6. Simulation:仿真7. Library:元件库8. Footprint:封装9. Copper pour:铜质填充10. Via tenting:垂直插孔塞堵11. Blind vias:盲孔12. Buried vias:穿过孔五、总结本文介绍了PCB专业英译术语中的基础术语、PCB制造过程相关术语、PCB测试和维修相关术语以及PCB设计相关术语。
PCBEnglish(ALL)
PCBEnglish(ALL)aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时返回顶部back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build T o Order) 接单生产burning 烧焦burr 毛边(毛头) 返回顶部camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短返回顶部date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;内层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类返回顶部umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间返回顶部vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查Void 孔破void in hole 孔壁上的破洞void in PTH hole 孔破返回顶部walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼返回顶部galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环返回顶部hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法返回顶部image analysis system影像分析系统image transfer 影像转移immersion gold 浸金(化镍金)immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存返回顶部knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸返回顶部laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板返回顶部mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au) J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling) j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)2、印制线路:printed wiring3、印制板:printed board4、印制板电路:printed circuit board (pcb)5、印制线路板:printed wiring board(pwb)6、印制元件:printed component7、印制接点:printed contact8、印制板装配:printed board assembly9、板:board10、单面印制板:single-sided printed board(ssb)11、双面印制板:double-sided printed board(dsb)12、多层印制板:mulitlayer printed board(mlb)13、多层印制电路板:mulitlayer printed circuit board14、多层印制线路板:mulitlayer prited wiring board15、刚性印制板:rigid printed board16、刚性单面印制板:rigid single-sided printed borad17、刚性双面印制板:rigid double-sided printed borad18、刚性多层印制板:rigid multilayer printed board19、挠性多层印制板:flexible multilayer printed board20、挠性印制板:flexible printed board21、挠性单面印制板:flexible single-sided printed board22、挠性双面印制板:flexible double-sided printed board23、挠性印制电路:flexible printed circuit (fpc)24、挠性印制线路:flexible printed wiring25、刚性印制板:flex-rigid printed board, rigid-flex printed board26、刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板:flush printed board29、金属芯印制板:metal core printed board30、金属基印制板:metal base printed board31、多重布线印制板:mulit-wiring printed board32、陶瓷印制板:ceramic substrate printed board33、导电胶印制板:electroconductive paste printed board35、模压印制板:stamped printed wiring board36、顺序层压多层印制板:sequentially-laminated mulitlayer37、散线印制板:discrete wiring board38、微线印制板:micro wire board39、积层印制板:buile-up printed board40、积层多层印制板:build-up mulitlayer printed board (bum)41、积层挠印制板:build-up flexible printed board42、表面层合电路板:surface laminar circuit (slc)43、埋入凸块连印制板:b2it printed board44、多层膜基板:multi-layered film substrate(mfs)45、层间全内导通多层印制板:alivh multilayer printed board46、载芯片板:chip on board (cob)47、埋电阻板:buried resistance board48、母板:mother board49、子板:daughter board50、背板:backplane51、裸板:bare board52、键盘板夹心板:copper-invar-copper board53、动态挠性板:dynamic flex board54、静态挠性板:static flex board55、可断拼板:break-away planel56、电缆:cable57、挠性扁平电缆:flexible flat cable (ffc)58、薄膜开关:membrane switch59、混合电路:hybrid circuit60、厚膜:thick film61、厚膜电路:thick film circuit62、薄膜:thin film63、薄膜混合电路:thin film hybrid circuit64、互连:interconnection65、导线:conductor trace line66、齐平导线:flush conductor。
PCB的相关英文单词
母板mother board子板daughter board背板backplane裸板bare board印制电路printed circuit印制线路printed wiring印制板printed board印制板电路printed circuit board印制线路板printed wiring board印制元件printed component印制接点printed contact印制板装配printed board assembly刚性印制板rigid printed board挠性印制电路flexible printed circuit挠性印制线路flexible printed wiring齐平印制板flush printed board金属芯印制板metal core printed board金属基印制板metal base printed board多重佈线印制板mulit-wiring printed board 模塑电路板molded circuit board散线印制板discrete wiring board微线印制板micro wire board积层印制板buile-up printed board表面层合电路板surface laminar circuit埋入凸块连印制板B2it printed board载芯片板chip on board埋电阻板buried resistance board键盘板夹心板copper-invar-copper board 动态挠性板dynamic flex board静态挠性板static flex board可断拼板break-away planel电缆cable挠性扁平电缆flexible flat cable (FFC)薄膜开关membrane switch混合电路hybrid circuit厚膜thick film厚膜电路thick film circuit薄膜thin film薄膜混合电路thin film hybrid circuit互连interconnection导线conductor trace line齐平导线flush conductor传输线transmission line跨交crossover板边插头edge-board contact导电图形conductive pattern非导电图形non-conductive pattern字元legend标誌mark基材base material层压板laminate覆金属箔基材metal-clad bade material覆铜箔层压板copper-clad laminate (CCL) 复合层压板composite laminate薄层压板thin laminate基体材料basis material预浸材料prepreg粘结片bonding sheet预浸粘结片preimpregnated bonding sheer 环氧玻璃基板epoxy glass substrate预制内层覆箔板mass lamination panel基底substrate基板面real estate导线面conductor side元件面component side焊接面solder side印制printing网格grid图形pattern内层芯板core material粘结层bonding layer粘结膜film adhesive无支撑胶粘剂膜unsupported adhesive film 覆盖层cover layer (cover lay)增强板材stiffener material铜箔面copper-clad surface去铜箔面foil removal surface层压板面unclad laminate surface基膜面base film surface胶粘剂面adhesive faec超薄型层压板ultra thin laminate结晶现象crystalline polamer双晶现象dimorphism共聚物copolymer环氧值epoxy value双氰胺dicyandiamide粘结剂binder胶粘剂adesive固化剂curing agent阻燃剂flame retardant遮光剂opaquer增塑剂plasticizers氟树脂fluroresin硅树脂silicone resin阶树脂A-stage resin A阶树脂B-stage resin B阶树脂C-stage resin C环氧树脂epoxy resin酚醛树脂phenolic resin聚酯树脂polyester resin聚醯亚胺树脂polyimide resin合成树脂synthetic热固性树脂thermosetting resin热塑性树脂thermoplastic resin感光性树脂photosensitive resin双马来醯亚胺三嗪树脂bismaleimide-triazine resin 丙烯酸树脂acrylic resin三聚氰胺甲醛树脂melamine formaldehyde resin 多官能环氧树脂polyfunctional epoxy resin溴化环氧树脂brominated epoxy resin环氧酚醛epoxy novolac硅烷silane不饱和聚酯unsatuiated polyester导电箔conductive foil铜箔copper foil压延铜箔rolled copper foil退火铜箔annealed copper foil薄铜箔thin copper foil涂胶铜箔adhesive coated foil涂胶脂铜箔resin coated copper foil复合金属箔composite metallic material聚酯薄膜polyester聚醯亚胺薄膜polyimide film (PI)玻璃纤维glass fiber玻璃纤维E-glass fibre E玻璃纤维D-glass fibre D玻璃纤维S-glass fibre S玻璃布glass fabric非织布non-woven fabric玻璃纤维垫glass mats白度whitenness陶瓷ceramics印制线路佈设printed wire layout佈设总图master drawing电脑辅助制图computer aided drawing装配图assembly drawing电脑控制显示computer controlled display 佈局placement佈线routing布图设计layout重布rerouting图形显示graphics dispaly比例因数scaling factor扫描填充scan filling矩形填充rectangle filling填充域region filling实体设计physical design逻辑设计logic design逻辑电路logic circuit元件密度component density导线(通道)conduction (track)导线(体)宽度conductor width导线距离conductor spacing导线层conductor layer导线宽度/间距conductor line/space第一导线层conductor layer No.1分线separated time分层eparated layer孔环annular ring元件孔component hole安装孔mounting hole支撑孔supported hole非支撑孔unsupported hole导通孔via镀通孔plated through hole (PTH)余隙孔access hole盲孔blind via (hole)埋孔buried via hole埋,盲孔buried blind via任意层内部导通孔any layer inner via hole 全部钻孔all drilled hole定位孔toaling hole中间孔interstitial hole无连接盘导通孔landless via hole引导孔pilot hole端接全隙孔terminal clearomee hole准尺寸孔dimensioned hole在连接盘中导通孔via-in-pad孔位hole location孔密度hole density孔图hole pattern钻孔图drill drawing定顺序definite sequence圆形盘round pad方形盘square pad菱形盘diamond pad长方形焊盘oblong pad子弹形盘bullet pad泪滴盘teardrop pad雪人盘snowman padV形盘V-shaped pad环形盘annular pad非圆形盘non-circular pad隔离盘isolation pad非功能连接盘monfunctional pad 偏置连接盘offset land。
线路板PCB专业英语词汇(制造、测试、缺陷名等)
热固性
Clad
覆箔
Layup
叠层
laminating
层压
Postcure
后固化
Curing time
固化时间
Resinflow
树脂流动度
Resin content
树脂含量
PCB英语词汇(二)
3 设计
3.1 通用术语
Computer-aided design (CAD)
计算机辅助设计
导线宽度/ቤተ መጻሕፍቲ ባይዱ距
Conductor layer
导线层
Component hole
元件孔
Mountinghole
安装孔
Supported hole
支撑孔
Unsupported hole
非支撑孔
Via
导通孔
Plated through hole
镀通孔
Blind via (hole)
盲孔
Buried via (hole)
消泡剂
resolution
分辨率
definition
逼真度
ghost image
重影
halation
晕环
air inclusion
夹杂气泡
tackiness
粘着性
post cure
后固化
shelf life
保存期
pot life/ working life
适用期
dip coating
浸涂法
roller coating
网版印刷
Silk screen
丝印网版
Stencil
网版
Screenability
PCB专业英语资料PCB海外销售英语资料
Engineering Common words 常用词语
• Base Material
• Copper clad laminate(CCL)(覆铜板) • PREPREG(半固化片) • Epoxy resin(环氧树脂) • Copper foil(铜箔) • Dielecteics(介质) • PTFE (Polytetralluoetylene) Teflon(聚四氟乙
• Surface Treatment
• 沉金
• Immersion Gold
• Chemical Gold
• Enectroless Gold Plating
• ENIG= Enectroless Nickel and
•
Immersion Gold
Engineering Common words 常用词语
• QUANTITY IS PER PCB , 10 OFF PCBS REQUIRED , IMMERSION SILVER
• 6 层板,1.6MM 厚,FR-4 板材,两层绿色阻焊,两 层白色字符,UL 标记要加,做裸板测试,拼版铣外形, 板尺寸:265 X 356 MM,交货数量 10 个,沉银
• 桥连邮票孔 • Connecting tabs with Stamp holes • Connecting tabs with Mouse(Mice)
Bite holes • 工艺边 • Rails(Tooling Rails) • Tooling Strip
Engineering Common words 常用词语
处理习惯
• 对于外销客户,客户在回复工程问题后,会问道 Please confirm all the questions are clear and the order could be proceeded ?/Please feedback if you could understand all the comment above?
pcb行业英汉词典
一、综合词汇1、印制电路:printed circuit2、印制线路:printed wiring3、印制板:printed board4、印制板电路:printed circuit board (pcb)5、印制线路板:printed wiring board(pwb)6、印制元件:printed component7、印制接点:printed contact8、印制板装配:printed board assembly9、板:board10、单面印制板:single-sided printed board(ssb)11、双面印制板:double-sided printed board(dsb)12、多层印制板:mulitlayer printed board(mlb)13、多层印制电路板:mulitlayer printed circuit board14、多层印制线路板:mulitlayer prited wiring board15、刚性印制板:rigid printed board16、刚性单面印制板:rigid single-sided printed borad17、刚性双面印制板:rigid double-sided printed borad18、刚性多层印制板:rigid multilayer printed board19、挠性多层印制板:flexible multilayer printed board20、挠性印制板:flexible printed board21、挠性单面印制板:flexible single-sided printed board22、挠性双面印制板:flexible double-sided printed board23、挠性印制电路:flexible printed circuit (fpc)24、挠性印制线路:flexible printed wiring25、刚性印制板:flex-rigid printed board, rigid-flex printed board26、刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板:flush printed board29、金属芯印制板:metal core printed board30、金属基印制板:metal base printed board31、多重布线印制板:mulit-wiring printed board32、陶瓷印制板:ceramic substrate printed board33、导电胶印制板:electroconductive paste printed board34、模塑电路板:molded circuit board35、模压印制板:stamped printed wiring board36、顺序层压多层印制板:sequentially-laminated mulitlayer37、散线印制板:discrete wiring board38、微线印制板:micro wire board39、积层印制板:buile-up printed board40、积层多层印制板:build-up mulitlayer printed board (bum)41、积层挠印制板:build-up flexible printed board42、表面层合电路板:surface laminar circuit (slc)43、埋入凸块连印制板:b2it printed board44、多层膜基板:multi-layered film substrate(mfs)45、层间全内导通多层印制板:alivh multilayer printed board46、载芯片板:chip on board (cob)47、埋电阻板:buried resistance board48、母板:mother board49、子板:daughter board50、背板:backplane51、裸板:bare board52、键盘板夹心板:copper-invar-copper board53、动态挠性板:dynamic flex board54、静态挠性板:static flex board55、可断拼板:break-away planel56、电缆:cable57、挠性扁平电缆:flexible flat cable (ffc)58、薄膜开关:membrane switch59、混合电路:hybrid circuit60、厚膜:thick film61、厚膜电路:thick film circuit62、薄膜:thin film63、薄膜混合电路:thin film hybrid circuit64、互连:interconnection65、导线:conductor trace line66、齐平导线:flush conductor67、传输线:transmission line68、跨交:crossover69、板边插头:edge-board contact70、增强板:stiffener71、基底:substrate72、基板面:real estate73、导线面:conductor side74、元件面:component side75、焊接面:solder side76、印制:printing77、网格:grid78、图形:pattern79、导电图形:conductive pattern80、非导电图形:non-conductive pattern81、字符:legend82、标志:mark二、基材:1、基材:base material2、层压板:laminate3、覆金属箔基材:metal-clad bade material4、覆铜箔层压板:copper-clad laminate (ccl)5、单面覆铜箔层压板:single-sided copper-clad laminate6、双面覆铜箔层压板:double-sided copper-clad laminate7、复合层压板:composite laminate8、薄层压板:thin laminate9、金属芯覆铜箔层压板:metal core copper-clad laminate10、金属基覆铜层压板:metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film12、基体材料:basis material13、预浸材料:prepreg14、粘结片:bonding sheet15、预浸粘结片:preimpregnated bonding sheer16、环氧玻璃基板:epoxy glass substrate17、加成法用层压板:laminate for additive process18、预制内层覆箔板:mass lamination panel19、内层芯板:core material20、催化板材:catalyzed board ,coated catalyzed laminate21、涂胶催化层压板:adhesive-coated catalyzed laminate22、涂胶无催层压板:adhesive-coated uncatalyzed laminate23、粘结层:bonding layer24、粘结膜:film adhesive25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film26、无支撑胶粘剂膜:unsupported adhesive film27、覆盖层:cover layer (cover lay)28、增强板材:stiffener material29、铜箔面:copper-clad surface30、去铜箔面:foil removal surface31、层压板面:unclad laminate surface32、基膜面:base film surface33、胶粘剂面:adhesive faec34、原始光洁面:plate finish35、粗面:matt finish36、纵向:length wise direction37、模向:cross wise direction38、剪切板:cut to size panel39、酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-cladlaminates43、环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-cladlaminates44、聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabriccopper-clad lamimates47、环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates49、超薄型层压板:ultra thin laminate50、陶瓷基覆铜箔板:ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板:uv blocking copper-clad laminates三、基材的材料1、a阶树脂:a-stage resin2、b阶树脂:b-stage resin3、c阶树脂:c-stage resin4、环氧树脂:epoxy resin5、酚醛树脂:phenolic resin6、聚酯树脂:polyester resin7、聚酰亚胺树脂:polyimide resin8、双马来酰亚胺三嗪树脂:bismaleimide-triazine resin9、丙烯酸树脂:acrylic resin10、三聚氰胺甲醛树脂:melamine formaldehyde resin11、多官能环氧树脂:polyfunctional epoxy resin12、溴化环氧树脂:brominated epoxy resin13、环氧酚醛:epoxy novolac14、氟树脂:fluroresin15、硅树脂:silicone resin16、硅烷:silane17、聚合物:polymer18、无定形聚合物:amorphous polymer19、结晶现象:crystalline polamer20、双晶现象:dimorphism21、共聚物:copolymer22、合成树脂:synthetic23、热固性树脂:thermosetting resin24、热塑性树脂:thermoplastic resin25、感光性树脂:photosensitive resin26、环氧当量:weight per epoxy equivalent (wpe)27、环氧值:epoxy value28、双氰胺:dicyandiamide29、粘结剂:binder30、胶粘剂:adesive31、固化剂:curing agent32、阻燃剂:flame retardant33、遮光剂:opaquer34、增塑剂:plasticizers35、不饱和聚酯:unsatuiated polyester36、聚酯薄膜:polyester37、聚酰亚胺薄膜:polyimide film (pi)38、聚四氟乙烯:polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (fep)40、增强材料:reinforcing material41、玻璃纤维:glass fiber42、e玻璃纤维:e-glass fibre43、d玻璃纤维:d-glass fibre44、s玻璃纤维:s-glass fibre45、玻璃布:glass fabric46、非织布:non-woven fabric47、玻璃纤维垫:glass mats48、纱线:yarn49、单丝:filament50、绞股:strand51、纬纱:weft yarn52、经纱:warp yarn53、但尼尔:denier54、经向:warp-wise55、纬向:weft-wise, filling-wise56、织物经纬密度:thread count57、织物组织:weave structure58、平纹组织:plain structure59、坏布:grey fabric60、稀松织物:woven scrim61、弓纬:bow of weave62、断经:end missing63、缺纬:mis-picks64、纬斜:bias65、折痕:crease66、云织:waviness67、鱼眼:fish eye68、毛圈长:feather length69、厚薄段:mark70、裂缝:split71、捻度:twist of yarn72、浸润剂含量:size content73、浸润剂残留量:size residue74、处理剂含量:finish level75、浸润剂:size76、偶联剂:couplint agent77、处理织物:finished fabric78、聚酰胺纤维:polyarmide fiber79、聚酯纤维非织布:non-woven polyester fabric80、浸渍绝缘纵纸:impregnating insulation paper81、聚芳酰胺纤维纸:aromatic polyamide paper82、断裂长:breaking length83、吸水高度:height of capillary rise84、湿强度保留率:wet strength retention85、白度:whitenness86、陶瓷:ceramics87、导电箔:conductive foil88、铜箔:copper foil89、电解铜箔:electrodeposited copper foil (ed copper foil)90、压延铜箔:rolled copper foil91、退火铜箔:annealed copper foil92、压延退火铜箔:rolled annealed copper foil (ra copper foil)93、薄铜箔:thin copper foil94、涂胶铜箔:adhesive coated foil95、涂胶脂铜箔:resin coated copper foil (rcc)96、复合金属箔:composite metallic material97、载体箔:carrier foil98、殷瓦:invar99、箔(剖面)轮廓:foil profile100、光面:shiny side101、粗糙面:matte side102、处理面:treated side103、防锈处理:stain proofing104、双面处理铜箔:double treated foil四、设计1、原理图:shematic diagram2、逻辑图:logic diagram3、印制线路布设:printed wire layout4、布设总图:master drawing5、可制造性设计:design-for-manufacturability6、计算机辅助设计:computer-aided design.(cad)7、计算机辅助制造:computer-aided manufacturing.(cam)8、计算机集成制造:computer integrat manufacturing.(cim)9、计算机辅助工程:computer-aided engineering.(cae)10、计算机辅助测试:computer-aided test.(cat)11、电子设计自动化:electric design automation .(eda)12、工程设计自动化:engineering design automaton .(eda2)13、组装设计自动化:assembly aided architectural design. (aaad)14、计算机辅助制图:computer aided drawing15、计算机控制显示:computer controlled display .(ccd)16、布局:placement17、布线:routing18、布图设计:layout19、重布:rerouting20、模拟:simulation21、逻辑模拟:logic simulation22、电路模拟:circit simulation23、时序模拟:timing simulation24、模块化:modularization25、布线完成率:layout effeciency26、机器描述格式:machine descriptionm format .(mdf)27、机器描述格式数据库:mdf databse28、设计数据库:design database29、设计原点:design origin30、优化(设计):optimization (design)31、供设计优化坐标轴:predominant axis32、表格原点:table origin33、镜像:mirroring34、驱动文件:drive file35、中间文件:intermediate file36、制造文件:manufacturing documentation37、队列支撑数据库:queue support database38、元件安置:component positioning39、图形显示:graphics dispaly40、比例因子:scaling factor41、扫描填充:scan filling42、矩形填充:rectangle filling43、填充域:region filling44、实体设计:physical design45、逻辑设计:logic design46、逻辑电路:logic circuit47、层次设计:hierarchical design48、自顶向下设计:top-down design49、自底向上设计:bottom-up design50、线网:net51、数字化:digitzing52、设计规则检查:design rule checking53、走(布)线器:router (cad)54、网络表:net list55、计算机辅助电路分析:computer-aided circuit analysis56、子线网:subnet57、目标函数:objective function58、设计后处理:post design processing (pdp)59、交互式制图设计:interactive drawing design60、费用矩阵:cost metrix61、工程图:engineering drawing62、方块框图:block diagram63、迷宫:moze64、元件密度:component density65、巡回售货员问题:traveling salesman problem66、自由度:degrees freedom67、入度:out going degree68、出度:incoming degree69、曼哈顿距离:manhatton distance70、欧几里德距离:euclidean distance71、网络:network72、阵列:array73、段:segment74、逻辑:logic75、逻辑设计自动化:logic design automation76、分线:separated time77、分层:separated layer78、定顺序:definite sequence五、形状与尺寸:1、导线(通道):conduction (track)2、导线(体)宽度:conductor width3、导线距离:conductor spacing4、导线层:conductor layer5、导线宽度/间距:conductor line/space6、第一导线层:conductor layer no.17、圆形盘:round pad8、方形盘:square pad9、菱形盘:diamond pad10、长方形焊盘:oblong pad11、子弹形盘:bullet pad12、泪滴盘:teardrop pad13、雪人盘:snowman pad14、v形盘:v-shaped pad15、环形盘:annular pad16、非圆形盘:non-circular pad17、隔离盘:isolation pad18、非功能连接盘:monfunctional pad19、偏置连接盘:offset land20、腹(背)裸盘:back-bard land21、盘址:anchoring spaur22、连接盘图形:land pattern23、连接盘网格阵列:land grid array24、孔环:annular ring25、元件孔:component hole26、安装孔:mounting hole27、支撑孔:supported hole28、非支撑孔:unsupported hole29、导通孔:via30、镀通孔:plated through hole (pth)31、余隙孔:access hole32、盲孔:blind via (hole)33、埋孔:buried via hole34、埋/盲孔:buried /blind via35、任意层内部导通孔:any layer inner via hole (alivh)36、全部钻孔:all drilled hole37、定位孔:toaling hole38、无连接盘孔:landless hole39、中间孔:interstitial hole40、无连接盘导通孔:landless via hole41、引导孔:pilot hole42、端接全隙孔:terminal clearomee hole43、准表面间镀覆孔:quasi-interfacing plated-through hole44、准尺寸孔:dimensioned hole45、在连接盘中导通孔:via-in-pad46、孔位:hole location47、孔密度:hole density48、孔图:hole pattern49、钻孔图:drill drawing50、装配图:assembly drawing51、印制板组装图:printed board assembly drawing52、参考基准:datum referance【印制线路板术语中英对照简表】排序英语简称注解A Accelerate Aging加速老化使用人工的方法,加速正常的老化过程。
PCB专业英语和层定义
PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical inspection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side (顶层)元件面11.SS=Solder Side =Bottom Side (底层)焊锡面12.Gold Plated 电金,镀金13.Nickel Plated 电镍,镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告,横切面报告17.X-out=Cross-out 打“X”报告18.Panel (客户称)拼板,(生产线称)工作板19.Marking 标记,UL 标记20.Date code 生产周期21.Unit 单元,单位22.Profile 外形,轮廓<outline>23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO UL标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final quality checking 终检,最后检查52.FOA=final quality audit 最后稽查(抽查)53.Shippment 出货54.Flux 松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Lead free 无铅57.COC=compliance of certificate 材料证明书58.Microsection=cross section 微切片,横切片59.Chamical gold 沉镍金60.Mould=punch die 模具,啤模61.MI=manufacture instruction 制作批示62.QA=quality assurance 品质保证63.CAD=computer aided design 计算机辅助设计64.Drill bit size钻咀直径<diameter>65.Bow and twist 板弯和板曲66.Hit 击打,孔数67.Bonding 邦定,点焊68.Test coupon 测试模块(科邦)69.Thieving copper 抢电流铜皮70.Rail-web71.Break-up tab 工艺边72.Break away tab 工艺边73.GND=ground 地线,大铜皮74.Hole edge 孔边,孔内75.Stamp hole 邮票孔76.Template 天坯,型板,钻孔样板(首板)77.Dry film 干菲林,干膜78.LPI=liquid photo image 液态感光=湿绿油79.Multilayer 多层板80.SMD=surface mouted device 贴片,表面贴装器件81.SMT=surface mouted technology 表面贴装技术82.Peelable mask=blue gel 蓝胶83.Tooling hole 工艺孔,管位,定位孔,工具孔84.Fiducial mask 测光点,光学对位点,对光点,电眼85.Copper foil 铜箔86.Dimension 尺寸87.Nagative负的,positive正的88.Flash gold 闪镀金,镀薄金89.Engineering department 工程部90.Delivery date 交货期91.Bevelling 斜边92.Spacing=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通,提高对PCB的技术认知一致度,特在此将我司常用PCB的有关板层特性做简单说明,请爱好者参考此说明进行设计和制造。
PCB专业英语和层定义
PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical inspection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side (顶层)元件面11.SS=Solder Side =Bottom Side (底层)焊锡面12.Gold Plated 电金,镀金13.Nickel Plated 电镍,镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告,横切面报告17.X-out=Cross-out 打“X”报告18.Panel (客户称)拼板,(生产线称)工作板19.Marking 标记,UL 标记20.Date code 生产周期21.Unit 单元,单位22.Profile 外形,轮廓<outline>23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO UL标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final quality checking 终检,最后检查52.FOA=final quality audit 最后稽查(抽查)53.Shippment 出货54.Flux 松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Lead free 无铅57.COC=compliance of certificate 材料证明书58.Microsection=cross section 微切片,横切片59.Chamical gold 沉镍金60.Mould=punch die 模具,啤模61.MI=manufacture instruction 制作批示62.QA=quality assurance 品质保证63.CAD=computer aided design 计算机辅助设计64.Drill bit size钻咀直径<diameter>65.Bow and twist 板弯和板曲66.Hit 击打,孔数67.Bonding 邦定,点焊68.Test coupon 测试模块(科邦)69.Thieving copper 抢电流铜皮70.Rail-web71.Break-up tab 工艺边72.Break away tab 工艺边73.GND=ground 地线,大铜皮74.Hole edge 孔边,孔内75.Stamp hole 邮票孔76.Template 天坯,型板,钻孔样板(首板)77.Dry film 干菲林,干膜78.LPI=liquid photo image 液态感光=湿绿油79.Multilayer 多层板80.SMD=surface mouted device 贴片,表面贴装器件81.SMT=surface mouted technology 表面贴装技术82.Peelable mask=blue gel 蓝胶83.Tooling hole 工艺孔,管位,定位孔,工具孔84.Fiducial mask 测光点,光学对位点,对光点,电眼85.Copper foil 铜箔86.Dimension 尺寸87.Nagative负的,positive正的88.Flash gold 闪镀金,镀薄金89.Engineering department 工程部90.Delivery date 交货期91.Bevelling 斜边92.Spacing=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通,提高对PCB的技术认知一致度,特在此将我司常用PCB的有关板层特性做简单说明,请爱好者参考此说明进行设计和制造。
PCB基本英语
流程Board cut 开料Carbon printing 碳油印刷Inner dry film 内层干膜Peelable blue mask 蓝胶Inner etching 内层蚀刻ENIG(Electroless nickel immersion gold) 沉镍金Inner dry film stripping 内层干膜退膜HAL(hot air leveling) 喷锡AOI(Automatic Optical Inspection)自动光学检测OSP(Organic solderability preservative)有机保焊Pressing 压板Punching 啤板Drilling 钻孔Profiling 外形加工Desmear 除胶渣,去钻污 E-Test 电性测试PTH 镀通孔,沉铜FQC(final quality control) 最终品质控制Panel plating 整板电镀FQA(Final quality audit) 最终品质保证Outer dry film 外层干膜Packing 包装Etching 蚀刻IPQA(In-process quality audit) 流程QA Tin stripping 退锡IPQC(In-process quality control) 流程QC EQC(QC after etching)蚀检QCIQC(Incoming quality control) 来料检查Solder mask 感阻MRB(material review board) 材料评审委员会Component mark 字符QA(Quality assurance) 品质保证Physical Laboratory 物理实验室QC(Quality control) 品质控制Chemistry Laboratory 化学实验室Document control center 文件控制中心2nd Drilling 二钻Routing 锣板,铣板Brown oxidation 棕化Waste water treatment 污水处理V-cut V坑WIP(work in process)半成品Store/stock 仓库 F.G(Finished goods) 成品概述Printed Circuit Board 印制电路板Flexible Printed Circuit, FPC 软板Double-Side Printed Board 双面板IPC(The Institute for Interconnecting and Packing Electronic Circuits)电子电路互连与封装协会CPAR(Corrective & Preventive Action Request)要求纠正预防措施Flammability Rate燃性等级Characteristic impedance 特性阻抗BUM(Build-up multilayer)积层多层板Date Code周期代码CCL(Copper-clad laminate)覆铜板Ionic contamination 离子性污染Acceptance Quality Level (AQL)允收水平HDI(High density interconnecting)高密度互连板Base Material基材Radius 半径Capacity 生产能力Diameter 直径Capability 工艺能力PPM(Parts Per Million) 百万分之几CAM(computer-aided manufacturing) 计算机辅助制造Underwriters Laboratories Inc. 美国保险商实验所CAD (computer-aided design) 计算机辅助设计Statistical Process Control 统计过程控制Specification 规格,规范Via 导通孔Dimension 尺寸Buried /blind via 埋/盲孔Tolerance 公差Tooling hole 定位孔Oven 焗炉Output/throughput 产量湿流程PTH(plated through hole)镀通孔(俗称沉铜)Acid cleaning 酸性除油PP(Panel Plating) 板电Acid dip 酸洗Pattern plating 图电Pre-dip 预浸Line width 线宽Alkaline cleaning 碱性除油Spacing 线隙Flux 松香Deburring 去毛刺(沉铜前磨板)Hot air leveling 喷锡Carbon treatment 碳处理Skip plating 跳镀,漏镀Track/conductor 导线Undercut 侧蚀Aspect ratio深径比Water rinsing水洗Etch Factor 蚀刻因子Transportation 行车Back Light Test背光测试Rack挂架Pink ring粉红圈Maintenance 保养干流程Hole location孔位Annular ring 孔环Image Transfer图象转移Component Side(C/S) 元件面Artwork 底片Solder Side(S/S) 焊接面Mylar 胶片Matte Solder Mask 哑绿油Silkscreen/legend/Component Mark文字Hole breakout 破孔Fiducial mark 基点,对光点Scrubbing 磨板Expose 曝光Developing 显影内层制作Core material 内层芯板Thermal pad 散热PAD Pre-preg PP片Resin content 树脂含量Kraft Paper牛皮纸Brown oxidation 棕化Lay up 排版Black Oxidation 黑化Registration 对位Base material 板材Delamination 分层其它Wicking灯芯效应Hole size 孔径(尺寸) Yield良品率Touch Up修理Warp and Twist 板曲度Solvent Test 溶剂测试Peel off 剥离Company Logo 公司标识Tape Test 胶纸试验UL Mark UL 标记Cosmetic 外观Function 功能Tin/Lead Ratio 锡/铅比例Reliability Tests 可靠性试验Hole Wall Roughness 孔壁粗糙度Base Copper Thickness 底铜厚度PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical inspection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side (顶层)元件面11.SS=Solder Side =Bottom Side (底层)焊锡面12.Gold Plated 电金,镀金13.Nickel Plated 电镍,镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告,横切面报告17.X-out=Cross-out 打"X"报告18.Panel (客户称)拼板,(生产线称)工作板19.Marking 标记,UL 标记20.Date code 生产周期21.Unit 单元,单位22.Profile 外形,轮廓<outline>23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO UL标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final quality checking 终检,最后检查52.FOA=final quality audit 最后稽查(抽查)53.Shippment 出货54.Flux 松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Lead free 无铅57.COC=compliance of certificate 材料证明书58.Microsection=cross section 微切片,横切片59.Chamical gold 沉镍金60.Mould=punch die 模具,啤模61.MI=manufacture instruction 制作批示62.QA=quality assurance 品质保证63.CAD=computer aided design 计算机辅助设计64.Drill bit size钻咀直径<diameter>65.Bow and twist 板弯和板曲66.Hit 击打,孔数67.Bonding 邦定,点焊68.Test coupon 测试模块(科邦)69.Thieving copper 抢电流铜皮70.Rail-web71.Break-up tab 工艺边72.Break away tab 工艺边73.GND=ground 地线,大铜皮74.Hole edge 孔边,孔内75.Stamp hole 邮票孔76.Template 天坯,型板,钻孔样板(首板)77.Dry film 干菲林,干膜78.LPI=liquid photo image 液态感光=湿绿油79.Multilayer 多层板80.SMD=surface mouted device 贴片,表面贴装器件81.SMT=surface mouted technology 表面贴装技术82.Peelable mask=blue gel 蓝胶83.Tooling hole 工艺孔,管位,定位孔,工具孔84.Fiducial mask 测光点,光学对位点,对光点,电眼85.Copper foil 铜箔86.Dimension 尺寸87.Nagative负的,positive正的88.Flash gold 闪镀金,镀薄金89.Engineering department 工程部90.Delivery date 交货期91.Bevelling 斜边92.Spacing=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通,提高对PCB的技术认知一致度,特在此将我司常用PCB的有关板层特性做简单说明,请爱好者参考此说明进行设计和制造。
PCB常用英语
PCB常用英语Department name 部门名称 English英文Abbreviation简称董事办 T op Management Office厂务部 Plant General Office人事行政部 Human Resources & Administration Department HR&Ad. 资讯部 Information Technology Department IT 市场部 Marketing Department MKT工艺部 Process Engineering Department PE工程部 Pre-production Engineering Department PPE维修部 Maintenance Department MAI计划部 Production Planning and Control Department PPC物控部 Material Control Department MC品质部 Quality Assurance Department QA采购部 Purchasing Department PUR财务部 Finance Department FIN生产部Production Department PROD 研发部Research & Development Department R&D报关组 Shipping (Custom) Department保安队 Security Team SECProcess/Section name 工序/小组名称 English英文Abbreviation简称开料 Material Cutting BC内层 Inner Layer (process) I/L前处理 Pre-treatment涂布 LPI Coating预烤 Pre-Baking曝光(手动/半自动/自动)Exposure(Manual/ Semi-automatic/Auto)显影/蚀刻/退膜 Developing/Etching/ Stripping DES压合 Pressing PRESS 水平棕化 Brown OxidePP裁切 P.P cutting热熔/铆合 Heat melting预叠 Pre-Lay up叠合 Lay-up层压 lamination拆板 Board separating锣边 Routing研磨 Brushing钻孔 Drilling上/下PIN PIN stacking/quitting上套环 Cover / Quit Ring Set电镀 Plating PLT 去毛刺 De-Burr沉铜 Plating Through Hole PTH砂带磨刷 Sand belt grinding压膜(手动/自动) D/F Lamination (Manual/ Semi-automatic) 阻焊 Solder Mask(Wet Film) S/M(W/F)丝印 Silkscreen 字符 Component Mark C/M后烤 Post-curing网房 Stencil Room表面处理 Surface Finish沉金 Immersion Gold ENIG喷锡 Hot Air Solder Leveling HASL抗氧化 Organic Solderability Preservatives OSP后处理 Post--treatment外型加工 Profiling ProcessProcess/Section name 工序/小组名称 English英文Abbreviation简称啤房 Punching Room锣房 Routing Room成品清洗 Finished Product Cleaning自动光学检测 Automatic Optical Inspection AOI自动外观检测 Final Automatic Optical Inspection FAOI电子测试 Electrical Test E-T板翘反直 Warp & Twist Baking烘烤 Baking 包装 Package 来料检查控制小组 Incoming Quality Control IQC最后品质控制小组 Final Quality Control FQC最后稽查小组 Final Quality Assurance FQA品质保证部工程小组 Quality Assurance Engineering QAE品质系统 Quality System QS文件控制中心 Document Control Center DCC客户投诉服务小组 Customer Service section of QA CS内部工序品质控制 In-process Quality Control IPQC内部流程稽查小组 In-Process Quality Assurance IPQA不合格品复审 Materiel Review Board MRB物理实验室 Physical Laboratory Phy. Lab化学实验室 Chemical Laboratory Chem. Lab来料仓 Incoming Material Store成品仓 Finished Goods Store FG STORE制前设计小组 Pre-process Design Team制前制作小组 Pre-process Manufacturing Team样品组 Sample Team底片室 Artwork Room治具室 Fixture Room交叉功能小组 Cross-functional Team CFTTitle name 职称名称 English英文Abbreviation简称总裁 President 副总裁 Vice-President 管理代表 Management Representative MR营运总监 Operation Director OD厂长 Plant Manager PM高级经理/经理/副理Senior Manager/ Manager/ Assistant Manager高级主管/主管/副主管Senior Supervisor /Supervisor/ Assistant Supervisor高级工程师/工程师/助理工程师Senior Engineer/ Engineer/ Assistant Engineer专员 Specialist高级组长/组长 Senior Team Leader/ T eam Leader文员 Clerk储干 Trainee 高级技术员/技术员 Senior Technician/ Technician 高级操作员/操作员 Senior Operator/ OperatorProcess/Equipment name 工序/设备名称 English英文Abbreviation简称自动裁切机 Automatic Trim and Cutting Machine磨边机 Edge De-burring Machine圆角机 Corner Milling Machine烤箱 Oven 前处理线 Pre-treatment Line涂布线 LPI Coating Line曝光机 Exposure MachineDES线 Developing/Etching/ Stripping Line水平棕化线 Brown Oxide Line热溶机 Hot Melt Machine热压机 Hot Press Machine冷压机 Cold Press Machine叠合机 Auto Lay-up SystemX-Ray 钻靶机 X-Ray Target Drilling Machine锣机 Routing Machine自动退销钉机 Automatic Quit Pin MachineCNC 钻孔机 CNC Drilling Machine自动套环机 Automatic Ring Set Machine钻针研磨机 Drill Bit Resharpen Machine沉铜除胶渣线 Desmear &PTH line整板镀铜线 Panel Plating line磨刷线 Scrub Brush line自动压膜机 Automatic Laminator印刷机 Printing Machine拉网机 Stencil Manufacturing Machine油墨搅拌机 Ink Stirring Machine喷锡线 HASL Line抗氧化线 OSP Line沉银线 Immersion Silver Line沉镍金线 Immersion Ni & Au Line冲床 Punching Machine成品清洗机 Finished Product Cleaning Machine E-T 测试机 E-T Testing Machine飞针测试机 Flying Probe Testing Machine板弯板翘整平机 Re-Warping Machine包装机 Packing Machine菲林检查机 Artwork AOI光绘机 Laser Plotter自动冲片机 Artwork Developer复片机 Film Expose Machine中央集尘系统 Center Dust Collecting System DI纯水系统 DI Water GeneratorMaterial name 常见物料名称 English英文Abbreviation简称基材 Base MaterialPP Prepreg铜箔 Copper Foil湿膜 Wet Film菲林 Artwork Film钻针 Drill Bit垫板 Back-up铝片 Aluminium Sheet铜球 Copper Ball干膜 Dry Film油墨 Carbon Ink稀释剂 Thinner锡条 Tin Bar助焊剂 Flux 抗氧化剂 Antioxidant金盐 Gold Salt锣刀 Route bit治具 Fixture模具 Punching DieTest Apparatus name 测试设备名称 English 英文Abbreviation简称电子卡尺 Digital calipers数显千分尺 Digital MicrometerV-CUT深度量测仪 V-CUT depth measurement testerV-CUT深度计 V-CUT depth gauge钳形表 Forcipate amperemeter水银温度计 Mercury Thermometer电子显示温湿度计 Digital Hygrothermograph表面涂层测试仪 X-Ray Coating measurement tester金相显微镜 Metallic Microscope铜箔测厚仪 Copper Foil thickness Tester可焊性测试仪 Solderability Tester二次元测量仪 X,Y Coordinate Dimension Insulation System 红外线感温枪 Infrared temperature induction tester板厚测量仪 Board thickness Guage离子污染度测试仪 Ionic contamination Tester线宽线距测量仪 Line width & space Measurement System 光密度计 Ray densimeter数字钳式万用表 Forcipate multimeterROHS检测仪 ROHS EDXAA光谱仪 AA Spectrum TesterUV能量计 UV Energy Tester恒温恒湿箱 Pro temperature & humidity Chamber湿膜厚度计 Wet film thickness TesterUV光谱仪 UV Spectrum Tester高压测试仪 Hi-pot Tester特性阻抗仪 Impedance Meter油墨厚度计 Solder mask Thickness Guage剥离强度测试仪 Peel Strength Tester电导率计 Conductibility Meter油墨粘度计 Viscosity MeterUV光谱仪 UV Spectrum Tester落尘仪 Dust count Meter凝胶时间测试机 Gel Time Tester凝胶量测试机 Resin Flow Tester手持式测厚仪 Hand-hold thickness tester手动取样机 Manual Sampling Machine双盘研磨机 Double set muller微欧姆计 Microhm Tester电子防潮箱 Electronic dampproof BoxDefect name 不良项目名称 English英文Abbreviation简称功能性不良 Function Defect开/短路 Open/Short孔破 Hole Void偏孔 Hole Shift凹陷 Dent 缺口 Nick circuit碳油阻值偏大/偏小 Carbon resistance Value too high/ too low 外观不良 Cosmetic Defect异物 Foreign material显影不洁 Poor Develop偏移 Track misalignment起泡 Bubble 刮伤 Scratches 字符模糊 Legend blur印刷不良 Improper printing露铜 Exposed Copper防焊偏移 Solder mask misalignmentReliability Test name 确认项目名称 English英文Abbreviation简称剥离强度 Peel Strength离子污染度 Ionic Contamination介质层厚度 Dielectric Layer thickness棕化拉力测试 Brown Oxide Pull Test孔壁粗糙度 Hole wall roughness背光测试 Backlight Test孔面铜量测 Hole surface copper thickness test 铜层延展性测试Copper Layer Ductibility Test磷铜球测试 Phosphorus Copper ball Test蚀刻因子 Etch factor线宽线距测量Line Width & Space Measurement 硬度测试Hardness Test附著力测试 Adhesion Test耐溶剂测试 Solvent resistance Test碳油厚度量测Carbon thickness measurement 碳线宽度量测Carbon width measurement热冲击力测试 Thermal shock Test焊锡性试验 Solderability Test金、镍厚量测 Au Ni thickness measurement抗腐蚀性测试 Corrosion Test拉力测试 Pull test镍腐蚀性测试 Ni Corrosion Test喷锡铜含量 HASL copper content银/锡厚测试 Silver/Tin thickness Test硫含量测试 Sulfur content Test热应力试验 Thermal stress Test绿油/碳油厚度Solder Mask/Carbon thickness 阻抗测量Impedance Measurement高压测试 Hi-pot Test铜箔厚度 Copper foil thickness板厚量测 Board thickness measurement导体宽度量测 Conductor width measurement导体间距量测 Conductor space measurement孔环宽度量测 Hole ring width measurementV-cut残厚量测 V-cut remain thickness measurement 孔径尺寸量测 Hole diameter measurement全尺寸量测 Dimension Measurement斜边深度量测 Bevel edge depth measurement加湿耐热性试验 Constant temperature &humidity testname 名称 English英文Abbreviation简称国际标准化组织International Organization for Standardzation ISO 线路板 Printed Circuit Board PCB 品质管理系统 Quality Management System QMS 环境管理系统 Environment Management System EMS 勉强接受: Use As Is UAI 制作资料工具Manufacturing Date Tool MDT 制作资料文件 Manufacturing Date Document MDD 延期问题报告的纠正回应时间Overdue Problem Report Fix Responsiveness OFR 准时交货 On-Time Delivery OTD 统计流程控制Statistical Process Control SPC 缺陷模式及后果分析Failure Mode and Effects Analysis FMEA 测量系统分析Measurement System Analysis MSA 生产前品质规划Advanced Product Quality Planning APQP 生产部件确认程序 Production Part Approval Process PPAP 工艺指示 Work Instruction WI 生产指示 Manufacturing Instruction MI控制计划 Control Plan CP纠正行动要求 Corrective Action Request CAR 认可供应商一览表Approved Supplier List ASL 符合证明书Certificate of Compliance/Conformance COC 静电释放 Electrostatic discharge ESD 成品Finished Goods FG “先入先出”系统First-in-first-out System FIFO问题报告纠正回应时间 blem Report Fix Response Time PRT 仪器重复性和可再现性 Gage Repeatability & Reproducibility GR&R 申请材料及分发货单 Material Requisition Note MRN 物料安全性数据表Material Safely Date Sheet MSDS 不符合情况报告Nonconformance Reports NCR 新产品通知书New Project Description NPD 问题报告数量 Number of Problem Reports NPR 缺陷原因未发现 No Trouble Found NTF 采购订单 Purchase Order PO采购申请单 Purchase Requisition PR 半成品 Work-in-Process WIP 品质控制 Quality Control QC 运作程序 Operation Procedure OP 工程资料变更通知Engineering Change Notice ECN 待检验区To-be-inspected Area待处理区 To-be-processed Area检验合格区 Inspection Pass Area处理OK区 OK Area收货区 Incoming Area出货区 Outgoing Area待生产区 To-be-produced Area检验区 Inspection Area报废区 Scrap Area不良品区 Defect Product Area不合格品区 Non-conformity Product Area暂存区 Temporary Area。
pcb英文术语
pcb英文术语
以下是一些PCB(Printed Circuit Board,印刷电路板)的英文术语:
1. PCB:Printed Circuit Board,印刷电路板
2. SMD:Surface Mount Device,表面贴装器件
3. BGA:Ball Grid Array,球栅阵列
4. FPGA:Field Programmable Gate Array,现场可编程门阵列
5. DIP:Dual In-line Package,双列直插封装
6. PTH:Plated Through Hole,贯穿孔
7. VIA:Vertical Interconnect Access,垂直互连通孔
8. NC:No Connection,未连接
9. Pads:焊盘
10. Gerber File:Gerber文件,包含PCB设计图层信息的文件格式
11. Silk Screen:丝网印刷,用于标记元件位置或文字的印刷层
12. Copper Trace:铜线追踪,指PCB上的导线路径
13. Solder Mask:焊盘阻焊层,用于保护焊盘和其他不需要焊接的区域
14. Component Footprint:元件封装,描述组件在PCB上的安装尺寸和引脚布局
15. ESD:Electrostatic Discharge,静电放电
希望这些术语能对您有所帮助!如果您有其他问题,请随时提问。
中英文对照的PCB专业用语 英语
一、综合词汇1、印制电路:printed circuit2、印制线路:printed wiring3、印制板:printed board4、印制板电路:printed circuit board (pcb)5、印制线路板:printed wiring board(pwb)6、印制元件:printed component7、印制接点:printed contact8、印制板装配:printed board assembly9、板:board10、单面印制板:single-sided printed board(ssb)11、双面印制板:double-sided printed board(dsb)12、多层印制板:mulitlayer printed board(mlb)13、多层印制电路板:mulitlayer printed circuit board14、多层印制线路板:mulitlayer prited wiring board15、刚性印制板:rigid printed board16、刚性单面印制板:rigid single-sided printed borad17、刚性双面印制板:rigid double-sided printed borad18、刚性多层印制板:rigid multilayer printed board19、挠性多层印制板:flexible multilayer printed board20、挠性印制板:flexible printed board21、挠性单面印制板:flexible single-sided printed board22、挠性双面印制板:flexible double-sided printed board23、挠性印制电路:flexible printed circuit (fpc)24、挠性印制线路:flexible printed wiring25、刚性印制板:flex-rigid printed board, rigid-flex printed board26、刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板:flush printed board29、金属芯印制板:metal core printed board30、金属基印制板:metal base printed board31、多重布线印制板:mulit-wiring printed board32、陶瓷印制板:ceramic substrate printed board33、导电胶印制板:electric-conductive paste printed board34、模塑电路板:molded circuit board35、模压印制板:stamped printed wiring board36、顺序层压多层印制板:sequentially-laminated mulitlayer37、散线印制板:discrete wiring board38、微线印制板:micro wire board39、积层印制板:buile-up printed board40、积层多层印制板:build-up mulitlayer printed board (bum)41、积层挠印制板:build-up flexible printed board42、表面层合电路板:surface laminar circuit (slc)43、埋入凸块连印制板:b2it printed board44、多层膜基板:multi-layered film substrate(mfs)45、层间全内导通多层印制板:alivh multilayer printed board46、载芯片板:chip on board (cob)47、埋电阻板:buried resistance board48、母板:mother board49、子板:daughter board50、背板:backplane51、裸板:bare board52、键盘板夹心板:copper-invar-copper board53、动态挠性板:dynamic flex board54、静态挠性板:static flex board55、可断拼板:break-away planel56、电缆:cable57、挠性扁平电缆:flexible flat cable (ffc)58、薄膜开关:membrane switch59、混合电路:hybrid circuit60、厚膜:thick film61、厚膜电路:thick film circuit62、薄膜:thin film63、薄膜混合电路:thin film hybrid circuit64、互连:interconnection65、导线:conductor trace line66、齐平导线:flush conductor67、传输线:transmission line68、跨交:crossover69、板边插头:edge-board contact70、增强板:stiffener71、基底:substrate72、基板面:real estate73、导线面:conductor side74、元件面:component side75、焊接面:solder side76、印制:printing77、网格:grid78、图形:pattern79、导电图形:conductive pattern80、非导电图形:non-conductive pattern81、字符:legend82、标志:mark二、基材:1、基材:base material2、层压板:laminateadmin2007-03-30 15:525、单面覆铜箔层压板:single-sided copper-clad laminate6、双面覆铜箔层压板:double-sided copper-clad laminate7、复合层压板:composite laminate8、薄层压板:thin laminate9、金属芯覆铜箔层压板:metal core copper-clad laminate10、金属基覆铜层压板:metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film12、基体材料:basis material13、预浸材料:prepreg14、粘结片:bonding sheet15、预浸粘结片:preimpregnated bonding sheer16、环氧玻璃基板:epoxy glass substrate17、加成法用层压板:laminate for additive process18、预制内层覆箔板:mass lamination panel19、内层芯板:core material20、催化板材:catalyzed board ,coated catalyzed laminate21、涂胶催化层压板:adhesive-coated catalyzed laminate22、涂胶无催层压板:adhesive-coated uncatalyzed laminate23、粘结层:bonding layer24、粘结膜:film adhesive25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film26、无支撑胶粘剂膜:unsupported adhesive film27、覆盖层:cover layer (cover lay)28、增强板材:stiffener material29、铜箔面:copper-clad surface30、去铜箔面:foil removal surface31、层压板面:unclad laminate surface32、基膜面:base film surface33、胶粘剂面:adhesive faec34、原始光洁面:plate finish35、粗面:matt finish36、纵向:length wise direction37、模向:cross wise direction38、剪切板:cut to size panel39、酚醛纸质覆铜箔板:phenolic cellulose paper copper-cladlaminates(phenolic/paper ccl)40、环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates(epoxy/paper ccl)41、环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates49、超薄型层压板:ultra thin laminate50、陶瓷基覆铜箔板:ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板:uv blocking copper-clad laminates三、基材的材料1、a阶树脂:a-stage resin2、b阶树脂:b-stage resin3、c阶树脂:c-stage resin4、环氧树脂:epoxy resin5、酚醛树脂:phenolic resin6、聚酯树脂:polyester resin7、聚酰亚胺树脂:polyimide resin8、双马来酰亚胺三嗪树脂:bismaleimide-triazine resin9、丙烯酸树脂:acrylic resin10、三聚氰胺甲醛树脂:melamine formaldehyde resin11、多官能环氧树脂:polyfunctional epoxy resin12、溴化环氧树脂:brominated epoxy resin13、环氧酚醛:epoxy novolac14、氟树脂:fluroresin15、硅树脂:silicone resin16、硅烷:silane17、聚合物:polymer18、无定形聚合物:amorphous polymer19、结晶现象:crystalline polamer20、双晶现象:dimorphism21、共聚物:copolymer22、合成树脂:synthetic23、热固性树脂:thermosetting resin24、热塑性树脂:thermoplastic resin25、感光性树脂:photosensitive resin26、环氧当量:weight per epoxy equivalent (wpe)27、环氧值:epoxy value28、双氰胺:dicyandiamide29、粘结剂:binderadmin2007-03-30 15:5230、胶粘剂:adesive31、固化剂:curing agent32、阻燃剂:flame retardant33、遮光剂:opaquer34、增塑剂:plasticizers35、不饱和聚酯:unsatuiated polyester36、聚酯薄膜:polyester37、聚酰亚胺薄膜:polyimide film (pi)38、聚四氟乙烯:polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (fep)40、增强材料:reinforcing material41、玻璃纤维:glass fiber42、e玻璃纤维:e-glass fibre43、d玻璃纤维:d-glass fibre44、s玻璃纤维:s-glass fibre45、玻璃布:glass fabric46、非织布:non-woven fabric47、玻璃纤维垫:glass mats48、纱线:yarn49、单丝:filament50、绞股:strand51、纬纱:weft yarn52、经纱:warp yarn53、但尼尔:denier54、经向:warp-wise55、纬向:weft-wise, filling-wise56、织物经纬密度:thread count57、织物组织:weave structure58、平纹组织:plain structure59、坏布:grey fabric60、稀松织物:woven scrim61、弓纬:bow of weave62、断经:end missing63、缺纬:mis-picks64、纬斜:bias65、折痕:crease66、云织:waviness67、鱼眼:fish eye68、毛圈长:feather length69、厚薄段:mark70、裂缝:split71、捻度:twist of yarn72、浸润剂含量:size content73、浸润剂残留量:size residue74、处理剂含量:finish level75、浸润剂:size76、偶联剂:couplint agent77、处理织物:finished fabric78、聚酰胺纤维:polyarmide fiber79、聚酯纤维非织布:non-woven polyester fabric80、浸渍绝缘纵纸:impregnating insulation paper81、聚芳酰胺纤维纸:aromatic polyamide paper82、断裂长:breaking length83、吸水高度:height of capillary rise84、湿强度保留率:wet strength retention85、白度:whitenness86、陶瓷:ceramics87、导电箔:conductive foil88、铜箔:copper foil89、电解铜箔:electrodeposited copper foil (ed copper foil)90、压延铜箔:rolled copper foil91、退火铜箔:annealed copper foil92、压延退火铜箔:rolled annealed copper foil (ra copper foil)93、薄铜箔:thin copper foil94、涂胶铜箔:adhesive coated foil95、涂胶脂铜箔:resin coated copper foil (rcc)96、复合金属箔:composite metallic material97、载体箔:carrier foil98、殷瓦:invar99、箔(剖面)轮廓:foil profile100、光面:shiny side101、粗糙面:matte side102、处理面:treated side103、防锈处理:stain proofing104、双面处理铜箔:double treated foil四、设计1、原理图:shematic diagram2、逻辑图:logic diagram3、印制线路布设:printed wire layout4、布设总图:master drawing5、可制造性设计:design-for-manufacturability6、计算机辅助设计:computer-aided design.(cad)7、计算机辅助制造:computer-aided manufacturing.(cam)8、计算机集成制造:computer integrat manufacturing.(cim)9、计算机辅助工程:computer-aided engineering.(cae)10、计算机辅助测试:computer-aided test.(cat)11、电子设计自动化:electric design automation .(eda)12、工程设计自动化:engineering design automaton .(eda2)13、组装设计自动化:assembly aided architectural design. (aaad)14、计算机辅助制图:computer aided drawing15、计算机控制显示:computer controlled display .(ccd)16、布局:placement17、布线:routing18、布图设计:layout19、重布:rerouting20、模拟:simulation21、逻辑模拟:logic simulation22、电路模拟:circit simulation23、时序模拟:timing simulation24、模块化:modularization25、布线完成率:layout effeciency26、机器描述格式:machine descriptionm format .(mdf)admin2007-03-30 15:5327、机器描述格式数据库:mdf databse28、设计数据库:design database29、设计原点:design origin30、优化(设计):optimization (design)31、供设计优化坐标轴:predominant axis32、表格原点:table origin33、镜像:mirroring34、驱动文件:drive file35、中间文件:intermediate file36、制造文件:manufacturing documentation37、队列支撑数据库:queue support database38、元件安置:component positioning39、图形显示:graphics dispaly40、比例因子:scaling factor41、扫描填充:scan filling42、矩形填充:rectangle filling43、填充域:region filling44、实体设计:physical design45、逻辑设计:logic design46、逻辑电路:logic circuit47、层次设计:hierarchical design48、自顶向下设计:top-down design49、自底向上设计:bottom-up design50、线网:net51、数字化:digitzing52、设计规则检查:design rule checking53、走(布)线器:router (cad)54、网络表:net list55、计算机辅助电路分析:computer-aided circuit analysis56、子线网:subnet57、目标函数:objective function58、设计后处理:post design processing (pdp)59、交互式制图设计:interactive drawing design60、费用矩阵:cost metrix61、工程图:engineering drawing62、方块框图:block diagram63、迷宫:moze64、元件密度:component density65、巡回售货员问题:traveling salesman problem66、自由度:degrees freedom67、入度:out going degree68、出度:incoming degree69、曼哈顿距离:manhatton distance70、欧几里德距离:euclidean distance71、网络:network72、阵列:array73、段:segment74、逻辑:logic75、逻辑设计自动化:logic design automation76、分线:separated time77、分层:separated layer78、定顺序:definite sequence五、形状与尺寸:1、导线(通道):conduction (track)2、导线(体)宽度:conductor width3、导线距离:conductor spacing4、导线层:conductor layer5、导线宽度/间距:conductor line/space6、第一导线层:conductor layer no.17、圆形盘:round pad8、方形盘:square pad9、菱形盘:diamond pad10、长方形焊盘:oblong pad11、子弹形盘:bullet pad12、泪滴盘:teardrop pad13、雪人盘:snowman pad14、v形盘:v-shaped pad15、环形盘:annular pad16、非圆形盘:non-circular pad17、隔离盘:isolation pad18、非功能连接盘:monfunctional pad19、偏置连接盘:offset land20、腹(背)裸盘:back-bard land21、盘址:anchoring spaur22、连接盘图形:land pattern23、连接盘网格阵列:land grid array24、孔环:annular ring25、元件孔:component hole26、安装孔:mounting hole27、支撑孔:supported hole28、非支撑孔:unsupported hole29、导通孔:via30、镀通孔:plated through hole (pth)31、余隙孔:access hole32、盲孔:blind via (hole)33、埋孔:buried via hole34、埋/盲孔:buried /blind via35、任意层内部导通孔:any layer inner via hole (alivh)36、全部钻孔:all drilled hole37、定位孔:toaling hole38、无连接盘孔:landless hole39、中间孔:interstitial hole40、无连接盘导通孔:landless via hole41、引导孔:pilot hole42、端接全隙孔:terminal clearomee hole43、准表面间镀覆孔:quasi-interfacing plated-through hole44、准尺寸孔:dimensioned hole45、在连接盘中导通孔:via-in-pad46、孔位:hole location47、孔密度:hole density48、孔图:hole pattern49、钻孔图:drill drawing50、装配图:assembly drawing51、印制板组装图:printed board assembly drawing52、参考基准:datum referanc。
pcb行业英汉词典
一、综合词汇ﻫ1、印制电路:printed circuitﻫ2、印制线路:printed wiring3、印制板:printedboard4、印制板电路:printedcircuit board(pcb)5、印制线路板:printed wiring board(pwb)ﻫ6、印制元件:printedcomponent7、印制接点:printed contact8、印制板装配:printedboard assembly11、双面印制板:do10、单面印制板:single-sided printed board(ssb)ﻫ9、板:boardﻫuble-sided printed board(dsb)12、多层印制板:mulitlayer printed board(mlb)ﻫ13、多层印制电路板:mulitlayer15、刚性印printed circuit boardﻫ14、多层印制线路板:mulitlayer pritedwiring boardﻫ制板:rigidprinted boardﻫ16、刚性单面印制板:rigid single-sided printed borad17、刚性双面印制板:rigid double-sidedprintedborad18、刚性多层印制板:rigid multilayer printed boardﻫ19、挠性多层印制板:flexible multilayer printed board20、挠性印制板:flexible printed board21、挠性单面印制板:flexible single-sided printed boardﻫ22、挠性双面印制板:flexi bledouble-sided printed boardﻫ23、挠性印制电路:flexibleprinted circuit (fpc)ﻫ24、挠性印制线路:flexible printed wiring26、刚性25、刚性印制板:flex-rigid printed board, rigid-flex printedboardﻫ双面印制板:flex-rigiddouble-sided printed board,rigid-flexdouble-s27、刚性多层印制板:flex-rigid multilayerprinted board,rigid-flex ided printedﻫmultilayer printedboardﻫ28、齐平印制板:flush printed board29、金属芯印制板:metal core printed board30、金属基印制板:metal base printedboard32、陶瓷印制板:ceramic substrate 31、多重布线印制板:mulit-wiring printedboardﻫ33、导电胶印制板:electroconductive paste printed boardﻫ34、模printed boardﻫ35、模压印制板:stampedprintedwiring bo塑电路板:molded circuit boardﻫardﻫ36、顺序层压多层印制板:sequentially-laminatedmulitlayer39、积38、微线印制板:microwire boardﻫ37、散线印制板:discrete wiringboardﻫ层印制板:buile-up printedboardﻫ40、积层多层印制板:build-up mulitlayerprinted board(bum)41、积层挠印制板:build-up flexible printed board42、表面层合电路板:surfacelaminar circuit (slc)43、埋入凸块连印制板:b2itprintedboard44、多层膜基板:multi-layered film substrate(mfs)46、载芯片板:chip on45、层间全内导通多层印制板:alivhmultilayer printedboardﻫ48、母板:motherboardboard(cob)ﻫ47、埋电阻板:buried resistance boardﻫ49、子板:daughter board50、背板:backplaneﻫ51、裸板:bare boardﻫ52、键盘板夹心板:copper-invar-copper board53、动态挠性板:dynamic flexboard54、静态挠性板:static flex boardﻫ55、可断拼板:break-awayplanel56、电缆:cable57、挠性扁平电缆:flexible flat cable (ffc)58、薄膜开关:membraneswitchﻫ59、混合电路:hybrid circuitﻫ60、厚膜:thick f61、厚膜电路:thick film circuitilmﻫ64、互连:inter 62、薄膜:thin filmﻫ63、薄膜混合电路:thin film hybrid circuitﻫ66、齐平导线:flush conductorﻫ67、传65、导线:conductor tracelineﻫconnectionﻫ输线:transmissionline68、跨交:crossover69、板边插头:edge-board contact70、增强板:stiffenerﻫ71、基底:substrate73、导线面:conductor sideﻫ74、元件面:component sideﻫ72、基板面:realestateﻫ75、焊接面:solder side76、印制:printingﻫ77、网格:grid80、非导电图形:non-conduc79、导电图形:conductive patternﻫ78、图形:patternﻫ81、字符:legendﻫ82、标志:marktive patternﻫ二、基材:1、基材:basematerialﻫ2、层压板:laminate3、覆金属箔基材:metal-clad bade material4、覆铜箔层压板:copper-cladlaminate(ccl)5、单面覆铜箔层压板:single-sided copper-clad laminate6、双面覆铜箔层压板:double-sidedcopper-clad laminateﻫ7、复合层压板:composite laminateﻫ8、薄层压板:thinlaminate10、金属基覆铜层9、金属芯覆铜箔层压板:metalcorecopper-clad laminateﻫ压板:metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film14、粘结片:bonding s12、基体材料:basis materialﻫ13、预浸材料:prepregﻫheet16、环氧玻璃基板:epoxy glass substra 15、预浸粘结片:preimpregnated bonding sheerﻫ18、预制内层覆箔板:massl teﻫ17、加成法用层压板:laminateforadditive processﻫamination panel19、内层芯板:core materialﻫ20、催化板材:catalyzed board ,coated catalyzedlaminate22、涂胶无催层压板:21、涂胶催化层压板:adhesive-coated catalyzed laminateﻫadhesive-coated uncatalyzed laminate23、粘结层:bonding layer25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film 24、粘结膜:filmadhesiveﻫ26、无支撑胶粘剂膜:unsupported adhesivefilmﻫ27、覆盖层:cover layer (coverlay)ﻫ28、增强板材:stiffener material29、铜箔面:copper-clad surface31、层压板面:uncladlaminatesurf30、去铜箔面:foil removal surfaceﻫaceﻫ32、基膜面:base film surface33、胶粘剂面:adhesivefaecﻫ34、原始光洁面:platefinish35、粗面:matt finishﻫ36、纵向:length wisedirection37、模向:cross wise direction38、剪切板:cut tosize panel39、酚醛纸质覆铜箔板:phenoliccellulosepaper copper-clad laminates(pheno lic/paperccl)ﻫ40、环氧纸质覆铜箔板:epoxidecellulose papercopper-cladlaminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板:epoxidewoven glass fabric copper-clad laminatesﻫ42、环氧玻璃布纸复合覆铜箔板:epoxide cellulose papercore,glass cloth surfacescopper-cladlaminates43、环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glassreinforcedcopper-clad laminates45、44、聚酯玻璃布覆铜箔板:ployesterwoven glass fabriccopper-clad laminatesﻫ聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glas47、环氧合成纤维布覆铜箔板:epoxide synthetic s fabric copper-cladlamimatesﻫfiberfabriccopper-clad laminatesﻫ48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glasscopper-clad laminatesﻫ49、超薄型层压板:ultrathin laminate50、陶瓷基覆铜箔板:ceramicsbase copper-clad laminatesﻫ51、紫外线阻挡型覆铜箔板:uvblockingcopper-clad laminates三、基材的材料ﻫ1、a阶树脂:a-stage resinﻫ2、b阶树脂:b-stage resinﻫ3、c阶树脂:c-stageresinﻫ4、环氧树脂:epoxy resin5、酚醛树脂:phenolicresin6、聚酯树脂:polyesterresin7、聚酰亚胺树脂:polyimide resin8、双马来酰亚胺三嗪树脂:bismaleimide-triazine resinﻫ9、丙烯酸树脂:acryli10、三聚氰胺甲醛树脂:melamineformaldehyde resincresinﻫ11、多官能环氧树脂:polyfunctional epoxy resin12、溴化环氧树脂:brominated epoxy resin13、环氧酚醛:epoxy novolacﻫ14、氟树脂:fluroresin15、硅树脂:silicone resin16、硅烷:silaneﻫ17、聚合物:polymerﻫ18、无定形聚合物:amorphous polymerﻫ19、结晶现象:crystalline polamer20、双晶现象:dimorphism21、共聚物:copolymer22、合成树脂:syntheticﻫ23、热固性树脂:thermosettingresin25、感光性树脂:photosensitive resinﻫ26、环24、热塑性树脂:thermoplastic resinﻫ氧当量:weight per epoxy equivalent(wpe)27、环氧值:epoxy value28、双氰胺:dicyandiamide29、粘结剂:binder32、阻燃剂:flameretardantﻫ33、31、固化剂:curing agentﻫ30、胶粘剂:adesiveﻫ遮光剂:opaquer34、增塑剂:plasticizers36、聚酯薄膜:polyester35、不饱和聚酯:unsatuiatedpolyesterﻫ38、聚四氟乙烯:polytetrafluoetylene (ptfe) 37、聚酰亚胺薄膜:polyimide film (pi)ﻫ39、聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film(fep)40、增强材料:reinforcing material41、玻璃纤维:glass fiber42、e玻璃纤维:e-glass fibre45、玻璃布:glass fabric 43、d玻璃纤维:d-glass fibreﻫ44、s玻璃纤维:s-glass fibreﻫ46、非织布:non-woven fabric47、玻璃纤维垫:glass mats48、纱线:yarn50、绞股:strandﻫ51、纬纱:weft yarnﻫ52、经纱:warp yar 49、单丝:filamentﻫn53、但尼尔:denierﻫ54、经向:warp-wise55、纬向:weft-wise, filling-wise56、织物经纬密度:thread countﻫ57、织物组织:weave structureﻫ58、平纹组织:plainstructure59、坏布:grey fabric61、弓纬:bow of weaveﻫ62、断经:endmissin60、稀松织物:woven scrimﻫg65、折痕:creaseﻫ66、云织:waviness63、缺纬:mis-picksﻫ64、纬斜:biasﻫ68、毛圈长:feather lengthﻫ69、厚薄段:mark67、鱼眼:fisheyeﻫ70、裂缝:split71、捻度:twistof yarn72、浸润剂含量:size contentﻫ73、浸润剂残留量:size residueﻫ74、处理剂含量:finish l evelﻫ75、浸润剂:sizeﻫ76、偶联剂:couplint agentﻫ77、处理织物:finished fa78、聚酰胺纤维:polyarmide fiberﻫ79、聚酯纤维非织布:non-woven polyeste bricﻫ80、浸渍绝缘纵纸:impregnating insulationpaperrfabricﻫ81、聚芳酰胺纤维纸:aromatic polyamide paper82、断裂长:breaking lengthﻫ83、吸水高度:heightof capillary riseﻫ84、湿强度保留率:wetstrength retention85、白度:whitenness86、陶瓷:ceramics87、导电箔:conductive foil89、电解铜箔:electrodeposited copperfoil (ed copper foi 88、铜箔:copperfoilﻫl)90、压延铜箔:rolled copper foil91、退火铜箔:annealed copper foil92、压延退火铜箔:rolled annealed copper foil (ra copper foil)93、薄铜箔:thin copper foil95、涂胶脂铜箔:resin coated copper foil94、涂胶铜箔:adhesive coated foilﻫ(rcc)ﻫ96、复合金属箔:compositemetallic material98、殷瓦:invar97、载体箔:carrier foilﻫ99、箔(剖面)轮廓:foilpro、光面:shinyside101、粗糙面:matteside102、处理面:treated side103、防锈处理:stain proofingﻫ104、双面处理铜箔:double treated foilﻫ四、设计1、原理图:shematic diagram2、逻辑图:logic diagramﻫ3、印制线路布设:printedwirelayout4、布设总图:masterdrawing5、可制造性设计:design-for-manufacturability6、计算机辅助设计:computer-aideddesign.(cad)ﻫ7、计算机辅助制造:computer-aidedmanufacturing.(cam)ﻫ8、计算机集成制造:computer integrat manufacturin g.(cim)ﻫ9、计算机辅助工程:computer-aided engineering.(cae)10、计算机辅助测试:computer-aidedtest.(cat)ﻫ11、电子设计自动化:electric design automation .(eda)ﻫ12、工程设计自动化:engineering design automaton .(eda2)13、组装设计自动化:assembly aided architecturaldesign.(aaad)14、计算机辅助制图:computeraided drawing15、计算机控制显示:computer controlled display .(ccd)17、布线:routing16、布局:placementﻫ20、模拟:simulationﻫ21、逻辑模拟:18、布图设计:layoutﻫ19、重布:reroutingﻫ23、时序模拟:timing silogicsimulationﻫ22、电路模拟:circitsimulationﻫmulation24、模块化:modularizationﻫ25、布线完成率:layout effeciency26、机器描述格式:machine descriptionm format .(mdf)27、机器描述格式数据库:mdfdatabseﻫ28、设计数据库:designdatabaseﻫ29、设计原30、优化(设计):optimization (design)点:design originﻫ32、表格原点:table origin31、供设计优化坐标轴:predominant axisﻫ33、镜像:mirroring34、驱动文件:drive 、中间文件:intermediate、制造文件:manufacturingdocumentation37、队列支撑数据库:queue support database40、比例因子:sc 38、元件安置:component positioningﻫ39、图形显示:graphics dispalyﻫalingfactor41、扫描填充:scan filling43、填充域:regionfilling42、矩形填充:rectanglefillingﻫ44、实体设计:physical design45、逻辑设计:logicdesign48、自顶向下设计:47、层次设计:hierarchicaldesignﻫ46、逻辑电路:logic circuitﻫtop-down design49、自底向上设计:bottom-up design50、线网:net51、数字化:digitzing52、设计规则检查:design rulechecking53、走(布)线器:router(cad)54、网络表:netlistﻫ55、计算机辅助电路分析:computer-aided circuit analysisﻫ56、子线网:subnet57、目标函数:objective functionﻫ58、设计后处理:postdesign processing(pdp)60、费用矩阵:costmetri59、交互式制图设计:interactivedrawingdesignﻫxﻫ61、工程图:engineering drawing65、64、元件密度:componentdensityﻫ62、方块框图:block diagramﻫ63、迷宫:mozeﻫ66、自由度:degrees freedom巡回售货员问题:traveling salesman problemﻫ69、曼哈顿距离:manhatton 67、入度:out going degreeﻫ68、出度:incoming degreeﻫdistance70、欧几里德距离:euclidean distanceﻫ71、网络:network72、阵列:array73、段:segment76、分线:separatedti75、逻辑设计自动化:logic design automationﻫ74、逻辑:logicﻫ78、定顺序:definite sequenceﻫ五、形状与尺寸:meﻫ77、分层:separated layerﻫ1、导线(通道):conduction (track)2、导线(体)宽度:conductor widthﻫ3、导线距离:conductor spacing4、导线层:conductor layer5、导线宽度/间距:conductor line/space6、第一导线层:conductor layer no.17、圆形盘:round padﻫ8、方形盘:squarepadﻫ9、菱形盘:diamond padﻫ10、长方形焊盘:oblong pad12、泪滴盘:teardroppadﻫ13、雪人盘:snowman pad 11、子弹形盘:bulletpadﻫ14、v形盘:v-shaped pad16、非圆形盘:non-circularpadﻫ17、隔离盘:isolatio15、环形盘:annular padﻫn pad18、非功能连接盘:monfunctional pad21、盘址:anchoring 19、偏置连接盘:offset landﻫ20、腹(背)裸盘:back-bardlandﻫspaur22、连接盘图形:land patternﻫ23、连接盘网格阵列:land grid array24、孔环:annular ring25、元件孔:component hole27、支撑孔:supportedhole26、安装孔:mounting holeﻫ28、非支撑孔:unsupportedhole31、余隙孔:access hole30、镀通孔:platedthrough hole(pth)ﻫ29、导通孔:viaﻫ33、埋孔:buried via hole32、盲孔:blind via (hole)ﻫ34、埋/盲孔:buried/blind via36、全部钻孔:all dri 35、任意层内部导通孔:any layer innerviahole(alivh)ﻫlledhole37、定位孔:toaling hole39、中间孔:interstitial hole38、无连接盘孔:landless holeﻫ40、无连接盘导通孔:landlessvia hole41、引导孔:pilot hole43、准表面间镀覆孔:quasi-interfaci 42、端接全隙孔:terminal clearomee holeﻫngplated-through hole44、准尺寸孔:dimensioned holeﻫ45、在连接盘中导通孔:via-in-pad46、孔位:hole location47、孔密度:hole densityﻫ48、孔图:hole pattern49、钻孔图:drill drawingﻫ50、装配图:assembly drawing51、印制板组装图:printed board assemblydrawing52、参考基准:datum referanceﻫﻫ【印制线路板术语中英对照简表】排序英语简称注解A Accelerate Aging加速老化使用人工的方法,加速正常的老化过程。
PCB常用英语
Department name 部门名称 English英文Abbreviation简称董事办 Top Management Office厂务部 Plant General Office人事行政部 Human Resources & Administration Department HR&Ad. 资讯部 Information Technology Department IT市场部 Marketing Department MKT工艺部 Process Engineering Department PE工程部 Pre-production Engineering Department PPE维修部 Maintenance Department MAI计划部 Production Planning and Control Department PPC物控部 Material Control Department MC品质部 Quality Assurance Department QA采购部 Purchasing Department PUR财务部 Finance Department FIN生产部 Production Department PROD 研发部 Research & Development Department R&D报关组 Shipping (Custom) Department保安队 Security Team SECProcess/Section name 工序/小组名称 English英文Abbreviation简称开料 Material Cutting BC内层 Inner Layer (process) I/L前处理 Pre-treatment涂布 LPI Coating预烤 Pre-Baking曝光(手动/半自动/自动) Exposure(Manual/ Semi-automatic/Auto)显影/蚀刻/退膜 Developing/Etching/ Stripping DES压合 Pressing PRESS 水平棕化 Brown OxidePP裁切 P.P cutting热熔/铆合 Heat melting预叠 Pre-Lay up叠合 Lay-up层压 lamination拆板 Board separating锣边 Routing研磨 Brushing钻孔 Drilling上/下PIN PIN stacking/quitting上套环 Cover / Quit Ring Set电镀 Plating PLT 去毛刺 De-Burr沉铜 Plating Through Hole PTH砂带磨刷 Sand belt grinding压膜(手动/自动) D/F Lamination (Manual/ Semi-automatic)阻焊 Solder Mask(Wet Film) S/M(W/F)丝印 Silkscreen 字符 Component Mark C/M后烤 Post-curing网房 Stencil Room表面处理 Surface Finish沉金 Immersion Gold ENIG喷锡 Hot Air Solder Leveling HASL抗氧化 Organic Solderability Preservatives OSP后处理 Post--treatment外型加工 Profiling ProcessProcess/Section name 工序/小组名称 English英文Abbreviation简称啤房 Punching Room锣房 Routing Room成品清洗 Finished Product Cleaning自动光学检测 Automatic Optical Inspection AOI自动外观检测 Final Automatic Optical Inspection FAOI电子测试 Electrical Test E-T板翘反直 Warp & Twist Baking烘烤 Baking 包装 Package 来料检查控制小组 Incoming Quality Control IQC最后品质控制小组 Final Quality Control FQC最后稽查小组 Final Quality Assurance FQA品质保证部工程小组 Quality Assurance Engineering QAE品质系统 Quality System QS文件控制中心 Document Control Center DCC客户投诉服务小组 Customer Service section of QA CS内部工序品质控制 In-process Quality Control IPQC内部流程稽查小组 In-Process Quality Assurance IPQA不合格品复审 Materiel Review Board MRB物理实验室 Physical Laboratory Phy. Lab化学实验室 Chemical Laboratory Chem. Lab来料仓 Incoming Material Store成品仓 Finished Goods Store FG STORE制前设计小组 Pre-process Design Team制前制作小组 Pre-process Manufacturing Team样品组 Sample Team底片室 Artwork Room治具室 Fixture Room交叉功能小组 Cross-functional Team CFTTitle name 职称名称 English英文Abbreviation简称总裁 President 副总裁 Vice-President 管理代表 Management Representative MR营运总监 Operation Director OD厂长 Plant Manager PM高级经理/经理/副理 Senior Manager/ Manager/ Assistant Manager高级主管/主管/副主管 Senior Supervisor /Supervisor/ Assistant Supervisor高级工程师/工程师/助理工程师 Senior Engineer/ Engineer/ Assistant Engineer专员 Specialist高级组长/组长 Senior Team Leader/ Team Leader文员 Clerk储干 Trainee 高级技术员/技术员 Senior Technician/ Technician高级操作员/操作员 Senior Operator/ OperatorProcess/Equipment name 工序/设备名称 English英文Abbreviation简称自动裁切机 Automatic Trim and Cutting Machine磨边机 Edge De-burring Machine圆角机 Corner Milling Machine烤箱 Oven 前处理线 Pre-treatment Line涂布线 LPI Coating Line曝光机 Exposure MachineDES线 Developing/Etching/ Stripping Line水平棕化线 Brown Oxide Line热溶机 Hot Melt Machine热压机 Hot Press Machine冷压机 Cold Press Machine叠合机 Auto Lay-up SystemX-Ray 钻靶机 X-Ray Target Drilling Machine锣机 Routing Machine自动退销钉机 Automatic Quit Pin MachineCNC 钻孔机 CNC Drilling Machine自动套环机 Automatic Ring Set Machine钻针研磨机 Drill Bit Resharpen Machine沉铜除胶渣线 Desmear &PTH line整板镀铜线 Panel Plating line磨刷线 Scrub Brush line自动压膜机 Automatic Laminator印刷机 Printing Machine拉网机 Stencil Manufacturing Machine油墨搅拌机 Ink Stirring Machine喷锡线 HASL Line抗氧化线 OSP Line沉银线 Immersion Silver Line沉镍金线 Immersion Ni & Au Line冲床 Punching Machine成品清洗机 Finished Product Cleaning Machine E-T 测试机 E-T Testing Machine飞针测试机 Flying Probe Testing Machine板弯板翘整平机 Re-Warping Machine包装机 Packing Machine菲林检查机 Artwork AOI光绘机 Laser Plotter自动冲片机 Artwork Developer复片机 Film Expose Machine中央集尘系统 Center Dust Collecting SystemDI纯水系统 DI Water GeneratorMaterial name 常见物料名称 English英文Abbreviation简称基材 Base MaterialPP Prepreg铜箔 Copper Foil湿膜 Wet Film菲林 Artwork Film钻针 Drill Bit垫板 Back-up铝片 Aluminium Sheet铜球 Copper Ball干膜 Dry Film油墨 Carbon Ink稀释剂 Thinner锡条 Tin Bar助焊剂 Flux 抗氧化剂 Antioxidant金盐 Gold Salt锣刀 Route bit治具 Fixture模具 Punching DieTest Apparatus name 测试设备名称 English英文Abbreviation简称电子卡尺 Digital calipers数显千分尺 Digital MicrometerV-CUT深度量测仪 V-CUT depth measurement testerV-CUT深度计 V-CUT depth gauge钳形表 Forcipate amperemeter水银温度计 Mercury Thermometer电子显示温湿度计 Digital Hygrothermograph表面涂层测试仪 X-Ray Coating measurement tester金相显微镜 Metallic Microscope铜箔测厚仪 Copper Foil thickness Tester可焊性测试仪 Solderability Tester二次元测量仪 X,Y Coordinate Dimension Insulation System 红外线感温枪 Infrared temperature induction tester板厚测量仪 Board thickness Guage离子污染度测试仪 Ionic contamination Tester线宽线距测量仪 Line width & space Measurement System 光密度计 Ray densimeter数字钳式万用表 Forcipate multimeterROHS检测仪 ROHS EDXAA光谱仪 AA Spectrum TesterUV能量计 UV Energy Tester恒温恒湿箱 Pro temperature & humidity Chamber湿膜厚度计 Wet film thickness TesterUV光谱仪 UV Spectrum Tester高压测试仪 Hi-pot Tester特性阻抗仪 Impedance Meter油墨厚度计 Solder mask Thickness Guage剥离强度测试仪 Peel Strength Tester电导率计 Conductibility Meter油墨粘度计 Viscosity MeterUV光谱仪 UV Spectrum Tester落尘仪 Dust count Meter凝胶时间测试机 Gel Time Tester凝胶量测试机 Resin Flow Tester手持式测厚仪 Hand-hold thickness tester手动取样机 Manual Sampling Machine双盘研磨机 Double set muller微欧姆计 Microhm Tester电子防潮箱 Electronic dampproof BoxDefect name 不良项目名称 English英文Abbreviation简称功能性不良 Function Defect开/短路 Open/Short孔破 Hole Void偏孔 Hole Shift凹陷 Dent 缺口 Nick circuit碳油阻值偏大/偏小 Carbon resistance Value too high/ too low外观不良 Cosmetic Defect异物 Foreign material显影不洁 Poor Develop偏移 Track misalignment起泡 Bubble 刮伤 Scratches 字符模糊 Legend blur印刷不良 Improper printing露铜 Exposed Copper防焊偏移 Solder mask misalignmentReliability Test name 确认项目名称 English英文Abbreviation简称剥离强度 Peel Strength离子污染度 Ionic Contamination介质层厚度 Dielectric Layer thickness棕化拉力测试 Brown Oxide Pull Test孔壁粗糙度 Hole wall roughness背光测试 Backlight Test孔面铜量测 Hole surface copper thickness test 铜层延展性测试 Copper Layer Ductibility Test磷铜球测试 Phosphorus Copper ball Test蚀刻因子 Etch factor线宽线距测量 Line Width & Space Measurement 硬度测试 Hardness Test附著力测试 Adhesion Test耐溶剂测试 Solvent resistance Test碳油厚度量测 Carbon thickness measurement 碳线宽度量测 Carbon width measurement热冲击力测试 Thermal shock Test焊锡性试验 Solderability Test金、镍厚量测 Au Ni thickness measurement抗腐蚀性测试 Corrosion Test拉力测试 Pull test镍腐蚀性测试 Ni Corrosion Test喷锡铜含量 HASL copper content银/锡厚测试 Silver/Tin thickness Test硫含量测试 Sulfur content Test热应力试验 Thermal stress Test绿油/碳油厚度 Solder Mask/Carbon thickness 阻抗测量 Impedance Measurement高压测试 Hi-pot Test铜箔厚度 Copper foil thickness板厚量测 Board thickness measurement导体宽度量测 Conductor width measurement导体间距量测 Conductor space measurement孔环宽度量测 Hole ring width measurementV-cut残厚量测 V-cut remain thickness measurement 孔径尺寸量测 Hole diameter measurement全尺寸量测 Dimension Measurement斜边深度量测 Bevel edge depth measurement加湿耐热性试验 Constant temperature &humidity testname 名称 English英文Abbreviation简称国际标准化组织 International Organization for Standardzation ISO 线路板 Printed Circuit Board PCB 品质管理系统 Quality Management System QMS 环境管理系统 Environment Management System EMS 勉强接受: Use As Is UAI 制作资料工具 Manufacturing Date Tool MDT 制作资料文件 Manufacturing Date Document MDD 延期问题报告的纠正回应时间 Overdue Problem Report Fix Responsiveness OFR 准时交货 On-Time Delivery OTD 统计流程控制 Statistical Process Control SPC 缺陷模式及后果分析 Failure Mode and Effects Analysis FMEA 测量系统分析 Measurement System Analysis MSA 生产前品质规划 Advanced Product Quality Planning APQP 生产部件确认程序 Production Part Approval Process PPAP 工艺指示 Work Instruction WI生产指示 Manufacturing Instruction MI控制计划 Control Plan CP纠正行动要求 Corrective Action Request CAR 认可供应商一览表 Approved Supplier List ASL 符合证明书 Certificate of Compliance/Conformance COC 静电释放 Electrostatic discharge ESD 成品 Finished Goods FG “先入先出”系统 First-in-first-out System FIFO问题报告纠正回应时间 blem Report Fix Response Time PRT 仪器重复性和可再现性 Gage Repeatability & Reproducibility GR&R 申请材料及分发货单 Material Requisition Note MRN 物料安全性数据表 Material Safely Date Sheet MSDS 不符合情况报告 Nonconformance Reports NCR 新产品通知书 New Project Description NPD 问题报告数量 Number of Problem Reports NPR 缺陷原因未发现 No Trouble Found NTF 采购订单 Purchase Order PO采购申请单 Purchase Requisition PR 半成品 Work-in-Process WIP 品质控制 Quality Control QC 运作程序 Operation Procedure OP 工程资料变更通知 Engineering Change Notice ECN 待检验区 To-be-inspected Area待处理区 To-be-processed Area检验合格区 Inspection Pass Area处理OK区 OK Area收货区 Incoming Area出货区 Outgoing Area待生产区 To-be-produced Area检验区 Inspection Area报废区 Scrap Area不良品区 Defect Product Area不合格品区 Non-conformity Product Area暂存区 Temporary Area。
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Additive process
加成法
Tenting
掩蔽法
Hot air leveling
H.A.L
热风整平
Solder mask on bare copper
SMOBC
裸铜覆阻焊工艺
Organic solder ability preservation
OSP
有机阻焊工艺(有机抗氧化)
Routing
线宽
Conductor thickness
线厚
Edge spacing
边距
Pitch
节距(SMD中心到中心距离)
Span
跨距(第一根线到最后一根线基准边的距离)
Solder mask via plugging
导通孔塞孔
Connector
连接器
Contact
插头
Component lead
元件引线
Component pin
Stencil
网版
Silkscreen/legend
文字
Stack up
分层排列(压合结构)
External layer/internal layer
外层/内层
Primary side
第一层(
Secondary side
辅层
2.设计
Capacity
电容
Resistance
电阻
Clearance hole
波峰焊
Ball grid Area
BGA
6.材料
Base material
基板
Fusing fluid
溶融液
Flux
助焊剂(松香)
Resin content
树脂含量
Binder
粘接剂
Adhesive
胶粘剂
Copper-clud laminate
CCL
覆铜箔层压板
Pre-preg
P.P
树脂
Filler
填充层(夹心板)
Metal core
金属芯
7.检测
Visual examination
目视
AUTO OPTICAL INSPECTOR
AOI
Blister
起泡
Blow hole
气孔
Bulge
凸起
Crack of foil
金属箔裂缝
Crazing
微裂纹
Measling
白斑
De lamination
分层
CSP
芯片安装技术
High density interconnecting
HDI
高密度互连板
Build - up multilayer
BUM
积层多层板
Micro via
微积孔
Blind via/buried via
盲埋孔
Chip-on-board
COB
芯片直装
Solder plugs
锡珠
Wave soldering
金手指
Reworking
重工
Repairing
修复
Screen printing
网印
Liquid Photo image Mask
LPI
液态感光阻焊
Etching
蚀刻
Pattern plating
图形电镀
Panel plating
整板电镀
4.底片
Artwork
A/W
底片(菲林)
Photographic film
邮票孔
Sample
样品
Mass production
小量产
Batch production
批量产
Hole location
孔位
Hole size
孔径(尺寸)
drill map/drill drawing/hole chart
孔图(打带)
Migration
切片
Automatic Optical Inspection
元件插脚
Jumper wire
跨接线
Datum refetrim line
外型线
Probe point
测试点
Transmission line
传输线
Characteristic impedance
特性阻抗
3.工艺
Manufacture
制造
Subtractive process
连片
Warp-wise
经向
Weft-wise
纬向
Registration
对准度
Electrical test
电测
Cleanliness
清洁度
Inspection
检验
乳胶面(药膜面)
Definition
清晰度
Resolution
分辨率
Density
密度
Exposure
曝光
Imaging
成像
5.技术
Through-hole mounting technology
THT
通孔插装技术
Surface mount technology
SMT
表面安装技术
Clip scale package
Dent
压痕
Fiber exposure
露纤维
Weave exposure
露织物
Weave texture
显布纹
Wrinkle
皱褶
Hole breakout
孔破
Void
空洞
Hole void
孔壁空洞
Inclusion
夹杂物
Lifted land
铜皮卷起
Nick
缺口
Pin hole
针孔
Pit
麻点
Scratch
DRC
设计规则检查
Basic dimension
基准尺寸
Center to center spacing
中心距
Design spacing of conductor
导线设计间距
Design width of conductor
导线设计宽度
Conductor spacing
线距
Conductor width
隔离孔
Annular ring
孔环
Thermal pad
散热PAD
Continuity
连接性
Electromagnetic shielding
电磁屏蔽
Computer - aided design
CAD
计算机辅助软件
Computer - aided manufacture
CAM
计算机辅助制造
Design rule checking
类别
英文全称
简写
解释
1.层名
Component side
元件面
Ground plane
GND
接地层
Signal plane
信号层
Power (voltage plane)
VCC
电源层
Solder side
焊锡层
Solder mask
S/M
防焊
Solder resist
防焊
Solder paste
锡膏
光绘底片
Original A/W film
原稿底片
Production master
生产底片
Positive pattern
正像图形
Negative pattern
负像图形
Photo plotting/plotter
光绘(机)
Step - and - repeat
重复排版
Flip flop
镜像排版
Emulsion side
AOI
自动光学检测
Radius
半径
Diameter
直径
Accuracy
精确度
Bow and twist
板弯板翘
Dimension
尺寸
Tolerance
公差
base material
板材
Lamination structure
压合结构
Flammability rating
防火等级
Panelization
CNC成型
Punching Back
反模冲
Computer Numerical Control
CNC
计算机数字控制
Immersion golden
浸金(化金)
Immersion silver
化银
Immersion tin
化锡
Plated golden
镀金(电金,全面金)
Golden finger
G/F
刮痕
8.常用词
barcode
条码
Date code
周期
ToolingHOLE
尾孔
Orientation HOLE
方向孔
Mounting hole/fixed hole
安装孔(定位孔)
fiducial mark/mark point
光学点
Breakaway tab
B.A.T
折断边
Stamp-hole/thread hole