安美特硬铬工艺Hard chrome process
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ATOTECH Hard chrome processes安美特硬铬工艺
Hard Chrome Developments at Atotech 安美特硬铬的发展历史 2010– Rotogravure
Gravure Chrome® 2007 – Corrosion Resistant HEEF® KR 2005 – Fast, Cold Unichrome® 2700 1995 – Shock Rod System Dynachrome® 1994 – Fast Chrome HEEF® FC 1993 – Piston Ring HEEF® PR 1985 – High Efficiency Etch Free HEEF® 25 1950s – Mixed Catalyst CR 110 & HCR 840 1927 - Conventional Cr bath HCR 710
2 FC Level 2 Training Course – 2011
Applications Key Atotech Processes主要的应用工艺
HEEF® 25销售最好的产品
General Process通用工艺 High performance and maximum quality高性能、高品质 Worldwide market leader领导于国际市场
All base materials所有的基材 Every thickness每一种厚度 Every challenge每一种挑战
HEEF 25
HEEF 25 is fluoride free high speed process HEEF 25是一种不含氟的高速硬铬工艺 It is designed to operate at a chromic acid concentration of 190 – 275 g/l and 1.25 – 1.8 % sulfuric acid 此工艺能在190-275g/L的铬酸和1.25-1.8%的硫酸溶液中进行正常的生产 High cathodic efficiency – 25 % (@ 50A/dm²) 阴极电流效率高达25％ Improved hardness (1050 HV0,1) 硬度能高达 1050 HV0,1 Improved Microcrack number (as plated - 250 cracks/cm) 能获得较高的微裂纹数，可达250条/厘米 Direct positive influence on crack number 阳极对镀层的裂纹数有影响
Low crack number (as plated about 80 – 120 cracks/cm) – low corrosion resistance
镀层的微裂纹数较低（80－120条/厘米）－抗腐蚀性低，调整工艺条件，可以
4 FC Level 2 Training Course – 2011
9 FC Level 2 Training Course – 2011
Applications HEEF® 25应用
World Market leader世界市场的领导者 Very robust and consistent 性能非常稳定 Wide working window 具有很广的操作范围 High quality deposit 镀层质量优良 Suitable for（适合于）:
Quality镀层质量
Consistent performance 镀层性能一致 Better corrosion resistance 具有较强的抗腐蚀性 Better wear resistance 较高的耐磨性能 Very bright deposits 光亮镀层 Lower internal stress 更低的内应力 Smoother finish with fewer pits and nodules 镀层更平整，麻点和铬瘤较少 Highest microcrack count 更高的裂纹数 High hardness高硬度
6 FC Level 2 Training Course – 2011
HCR 840
Hard Chromium Technology硬铬技术 Chemical Solutions Soluble Fluoride Baths • HCR 840氟化物体系溶液
Higher plating speed than any other fluoride baths比其他的氟化物体系 相比有更高的镀速 Good deposit properties 镀层性能佳 High crack count 能获得较多的裂纹数 Good base metal activation 对基材有很好的活化作用 Up to 60 ASD+ 电流密度高达60安培/平方分米 18 - 23% efficiency 电流效率可达18－23％
HEEF® KR针对高耐蚀性的要求
Maximum quality and productivity for hydraulic bars, cylinders and piston rods 高品质，应用于液压杆、汽缸和活塞杆等
源自文库
HEEF® PR
Designed for cast iron substrates (piston rings and cylinder liners) 专门应用于铸铁基体（活塞环和汽缸垫）
GravurChrome®针对印刷滚筒的产品，用白金钛网作为阳极
Utilising Atotech’s Trivalent Chromium Control (TCC) system for rotogravure 利用TCC来控制三价铬的累积
Dynachrome®与设备配套的产品
Equipment and chemistry system designed for high productivity shock absorber piston rod plating设备和产品是专门为高产能的减震活塞杆而设计的
A rounded portfolio to suit all your plating requirements
全面的设计来适应所有的电镀需求
3 FC Level 2 Training Course – 2011
HCR 710不含氟化物
HCR 710 is a self – regulating chrome plating process giving improved performance at low solution concentration and having automatic regulation of the catalyst concentration HCR710是一种自动调节的电镀铬工艺，能在低浓度的条件下镀出高性能的产 品，并且能自动调节催化剂的浓度 It is designed to operate at a chromic acid concentration of 190 – 275 g/l and 0.9 – 1.1 % sulfuric acid 能在190-275 g/l铬酸和0.9 – 1.1 % 硫酸的条件下操作 Because of its non-etching characteristic, the HCR 710 process is particularly recommended for hard chrome plating application 由于其非腐蚀特性，在硬铬电镀工艺中特别推荐HCR710 Low cathodic efficiency (max 15 %) – high energy demand 阴极电流效率较低（最大15％）－电能消耗高 Hardness (850 - 950 HV0,1), depend on current density 硬度在850－950，依赖于电流密度的大小
5 FC Level 2 Training Course – 2011
HCR 840
HCR 840 is mixed catalyst system, containing fluoride 混合催化剂体系，镀液中含氟化物 It is designed to operate at a chromic acid concentration of 190 – 275 g/l and 0.5 – 0.8 % sulfuric acid 能在190 – 275 g/l 铬酸和0.5 – 0.8 % 硫酸镀液中操作 High cathodic efficiency – 25 % (@ 50A/dm²)较高的阴极电流效率（－25％） Due to fluoride good activation when plating stainless steel or nickel 因氟化物的存在镀液对不锈钢和镍有很好的活化效果 Improved hardness (1050 HV0,1) 镀层硬度较高（1050HV) Improved Microcrack number (as plated - 200 cracks/cm) 镀层的微裂纹数较多（－200条/厘米） Cathodic etch effect @ low current density areas低电流密度区有阴极腐蚀
8 FC Level 2 Training Course – 2011
Hard Chromium Technology硬铬技术 Chemical Solutions • HEEF 25硬铬HEEF 25工艺特性
Operational特点
Very fast plating rate 沉积速率快 Electricity savings 节约电能 Better throwing power 良好的分散能力 Uniform deposits (less grinding) 镀层性能一致（镀层均匀度优良） Very wide working window 具有宽广的操作范围 Very low etch to parts, anodes, etc. (like chromic acid) 对工件、阳极等没有腐蚀性
7 FC Level 2 Training Course – 2011
High etching to substrate 对基材有腐蚀性 Loss of performance due to metallics 金属杂质导致镀液性能下降 Narrow working window 具有很窄的操作范围 High etching to anodes, bus bars, etc. 对阳极和导电杆有腐蚀性 Can be difficult to control catalyst很难控制催化剂
HCR 710
Hard Chromium Technology硬铬技术 Chemical Solutions Conventional Chrome Low cost of chemistry 低成本 Non-etch properties 没有腐蚀 Relatively easy maintenance 镀液容易维护 Low deposition rate 沉积速率低 Very limited cathode current density 阴极电流密度范围窄 High electrical costs 电能消耗高 Hardness fluctuations due to process changes 硬度随工艺的改变而变化 Very hard deposits not possible 不能获得高硬度 Lower corrosion protection 抗腐蚀性低
Hard Chrome Developments at Atotech 安美特硬铬的发展历史 2010– Rotogravure
Gravure Chrome® 2007 – Corrosion Resistant HEEF® KR 2005 – Fast, Cold Unichrome® 2700 1995 – Shock Rod System Dynachrome® 1994 – Fast Chrome HEEF® FC 1993 – Piston Ring HEEF® PR 1985 – High Efficiency Etch Free HEEF® 25 1950s – Mixed Catalyst CR 110 & HCR 840 1927 - Conventional Cr bath HCR 710
2 FC Level 2 Training Course – 2011
Applications Key Atotech Processes主要的应用工艺
HEEF® 25销售最好的产品
General Process通用工艺 High performance and maximum quality高性能、高品质 Worldwide market leader领导于国际市场
All base materials所有的基材 Every thickness每一种厚度 Every challenge每一种挑战
HEEF 25
HEEF 25 is fluoride free high speed process HEEF 25是一种不含氟的高速硬铬工艺 It is designed to operate at a chromic acid concentration of 190 – 275 g/l and 1.25 – 1.8 % sulfuric acid 此工艺能在190-275g/L的铬酸和1.25-1.8%的硫酸溶液中进行正常的生产 High cathodic efficiency – 25 % (@ 50A/dm²) 阴极电流效率高达25％ Improved hardness (1050 HV0,1) 硬度能高达 1050 HV0,1 Improved Microcrack number (as plated - 250 cracks/cm) 能获得较高的微裂纹数，可达250条/厘米 Direct positive influence on crack number 阳极对镀层的裂纹数有影响
Low crack number (as plated about 80 – 120 cracks/cm) – low corrosion resistance
镀层的微裂纹数较低（80－120条/厘米）－抗腐蚀性低，调整工艺条件，可以
4 FC Level 2 Training Course – 2011
9 FC Level 2 Training Course – 2011
Applications HEEF® 25应用
World Market leader世界市场的领导者 Very robust and consistent 性能非常稳定 Wide working window 具有很广的操作范围 High quality deposit 镀层质量优良 Suitable for（适合于）:
Quality镀层质量
Consistent performance 镀层性能一致 Better corrosion resistance 具有较强的抗腐蚀性 Better wear resistance 较高的耐磨性能 Very bright deposits 光亮镀层 Lower internal stress 更低的内应力 Smoother finish with fewer pits and nodules 镀层更平整，麻点和铬瘤较少 Highest microcrack count 更高的裂纹数 High hardness高硬度
6 FC Level 2 Training Course – 2011
HCR 840
Hard Chromium Technology硬铬技术 Chemical Solutions Soluble Fluoride Baths • HCR 840氟化物体系溶液
Higher plating speed than any other fluoride baths比其他的氟化物体系 相比有更高的镀速 Good deposit properties 镀层性能佳 High crack count 能获得较多的裂纹数 Good base metal activation 对基材有很好的活化作用 Up to 60 ASD+ 电流密度高达60安培/平方分米 18 - 23% efficiency 电流效率可达18－23％
HEEF® KR针对高耐蚀性的要求
Maximum quality and productivity for hydraulic bars, cylinders and piston rods 高品质，应用于液压杆、汽缸和活塞杆等
源自文库
HEEF® PR
Designed for cast iron substrates (piston rings and cylinder liners) 专门应用于铸铁基体（活塞环和汽缸垫）
GravurChrome®针对印刷滚筒的产品，用白金钛网作为阳极
Utilising Atotech’s Trivalent Chromium Control (TCC) system for rotogravure 利用TCC来控制三价铬的累积
Dynachrome®与设备配套的产品
Equipment and chemistry system designed for high productivity shock absorber piston rod plating设备和产品是专门为高产能的减震活塞杆而设计的
A rounded portfolio to suit all your plating requirements
全面的设计来适应所有的电镀需求
3 FC Level 2 Training Course – 2011
HCR 710不含氟化物
HCR 710 is a self – regulating chrome plating process giving improved performance at low solution concentration and having automatic regulation of the catalyst concentration HCR710是一种自动调节的电镀铬工艺，能在低浓度的条件下镀出高性能的产 品，并且能自动调节催化剂的浓度 It is designed to operate at a chromic acid concentration of 190 – 275 g/l and 0.9 – 1.1 % sulfuric acid 能在190-275 g/l铬酸和0.9 – 1.1 % 硫酸的条件下操作 Because of its non-etching characteristic, the HCR 710 process is particularly recommended for hard chrome plating application 由于其非腐蚀特性，在硬铬电镀工艺中特别推荐HCR710 Low cathodic efficiency (max 15 %) – high energy demand 阴极电流效率较低（最大15％）－电能消耗高 Hardness (850 - 950 HV0,1), depend on current density 硬度在850－950，依赖于电流密度的大小
5 FC Level 2 Training Course – 2011
HCR 840
HCR 840 is mixed catalyst system, containing fluoride 混合催化剂体系，镀液中含氟化物 It is designed to operate at a chromic acid concentration of 190 – 275 g/l and 0.5 – 0.8 % sulfuric acid 能在190 – 275 g/l 铬酸和0.5 – 0.8 % 硫酸镀液中操作 High cathodic efficiency – 25 % (@ 50A/dm²)较高的阴极电流效率（－25％） Due to fluoride good activation when plating stainless steel or nickel 因氟化物的存在镀液对不锈钢和镍有很好的活化效果 Improved hardness (1050 HV0,1) 镀层硬度较高（1050HV) Improved Microcrack number (as plated - 200 cracks/cm) 镀层的微裂纹数较多（－200条/厘米） Cathodic etch effect @ low current density areas低电流密度区有阴极腐蚀
8 FC Level 2 Training Course – 2011
Hard Chromium Technology硬铬技术 Chemical Solutions • HEEF 25硬铬HEEF 25工艺特性
Operational特点
Very fast plating rate 沉积速率快 Electricity savings 节约电能 Better throwing power 良好的分散能力 Uniform deposits (less grinding) 镀层性能一致（镀层均匀度优良） Very wide working window 具有宽广的操作范围 Very low etch to parts, anodes, etc. (like chromic acid) 对工件、阳极等没有腐蚀性
7 FC Level 2 Training Course – 2011
High etching to substrate 对基材有腐蚀性 Loss of performance due to metallics 金属杂质导致镀液性能下降 Narrow working window 具有很窄的操作范围 High etching to anodes, bus bars, etc. 对阳极和导电杆有腐蚀性 Can be difficult to control catalyst很难控制催化剂
HCR 710
Hard Chromium Technology硬铬技术 Chemical Solutions Conventional Chrome Low cost of chemistry 低成本 Non-etch properties 没有腐蚀 Relatively easy maintenance 镀液容易维护 Low deposition rate 沉积速率低 Very limited cathode current density 阴极电流密度范围窄 High electrical costs 电能消耗高 Hardness fluctuations due to process changes 硬度随工艺的改变而变化 Very hard deposits not possible 不能获得高硬度 Lower corrosion protection 抗腐蚀性低