PCB专业英语培训教材(2)
PCB训练教材
寸在此基础上加0.5“ 或1.0”; 如利有率仅相差1~2%时就不必采用特殊板料；
另外在开大料时每切一刀均有0.1“的损耗，如48.5”的大料开两刀最大可以开到
16.1“{16.1” ×3+0.2“（损耗）=48.5”}
板料利用率：客户成品最大边界的面积的总和，与大料sheet的比，如：客户成品为
7.2“×9.2“, 生产panel开16X20,4只成品/panel,共开6个panel, 大料为40X48,
脂制造有阻燃性能的材料 4）Solder mask：阻焊剂 5）Peelable solder mask：蓝胶 6）Carbon Ink：碳油 7）Dry film：干膜 8）RCC：Resin Coated Copper （不含玻璃布）
Training Material
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C）有关工序
1. PTH: (Plated through hole) 电镀孔
Training Material
第16 节 ：V-cut & 外形加工
1. V-cut:
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2. 外型加工
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第17 节 ：E-T/FQC
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将基板上整面的铜皮利用化学蚀刻的方式，将不要的铜蚀去留下线路 干菲林成卷状使用，其规格有10“, 10.25“, 其范围为10~23.75“,每间隔0.25” 递变， 选用D/F的原则是
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Training Material
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PCB专业英语培训
10. Profiling （成型）
Poor profiling Missing bevel edge Damage by punching Damage by routing 碑鑼不良 鑼斜邊 碑板壓傷 板鑼傷
PCB专业英语培训
V-CUT shift V-CUT under spec. V-CUT over spec.
PCB专业英语培训
IQC QA MKT IPQC
FQC
Manufacturing Engineering Production
PE PD
Production Engineer
Production Material Control Management Information System
PCB专业英语培训
FQC QA MKT PMC ME PD IQC IPQC
PCB专业英语培训
市场部 计划部 来料检查 生产过程品质控制 制作工程部 生产部 最终品质管控 品质保证部
Administration &Maintenance HumanResources Research &Development Purchasing andShipping
PMC
ME MIS
PCB专业英语培训
二、Process Flow 工藝流程
PCB专业英语培训
BoardCut (開料)
InnerDryFil m (內層幹菲林)
InnerEtc hing 內層蝕刻 Profiling 成型 E-test 開/短路測試 )
Organic Solderability Preservatives OSP Surface Treatment 表面處理 Component Mark 白字
pcb生产流程培训英文版
pcb生产流程培训英文版Here is the English essay on the topic of "PCB production process training" with a word count of over 1000 words:The production of printed circuit boards (PCBs) is a crucial process in the electronics industry, as these components serve as the backbone for a wide range of electronic devices, from smartphones to industrial equipment. Ensuring the proper training and understanding of the PCB production process is essential for maintaining high standards of quality and efficiency. In this essay, we will delve into the various stages of the PCB production process, providing a comprehensive overview for trainees and professionals alike.The first step in the PCB production process is the design phase. This involves the creation of a digital schematic or layout, which outlines the placement and interconnections of the various components that will be mounted on the board. The design phase requires a thorough understanding of electrical engineering principles, as well as the specific requirements and constraints of the intended application. Designers must consider factors such as component size, heat dissipation, and signal routing to ensure the PCB will function asintended.Once the design is complete, the next step is the fabrication of the PCB itself. This process begins with the creation of the base material, which is typically a thin, rigid substrate made of fiberglass or other insulating materials. The substrate is then coated with a thin layer of copper, which will serve as the conductive pathways for the electronic components. The copper layer is then etched away, leaving behind the desired circuit patterns.After the basic PCB structure has been created, the next step is the drilling process. This involves the use of specialized machinery to create the necessary holes and vias that will allow the components to be mounted and interconnected. The drilling process must be carried out with a high degree of precision, as the placement and size of these holes can have a significant impact on the overall performance and reliability of the PCB.Following the drilling process, the PCB undergoes a series of cleaning and preparation steps to ensure that the surface is ready for the next stage of production. This may include the application of a solder mask, which is a protective coating that helps to prevent short circuits and corrosion, as well as the application of a surface finish, such as gold or tin, to improve the solderability of the board.Once the PCB has been prepared, the next step is the component placement and soldering process. This involves the use of specialized equipment, such as pick-and-place machines, to accurately position the various electronic components on the board. The components are then secured in place using a process called soldering, which involves the melting of a metal alloy to create a strong, conductive bond between the component and the PCB.After the component placement and soldering process, the PCB undergoes a series of quality control checks to ensure that it meets the required standards for performance and reliability. This may include visual inspections, electrical testing, and even more advanced techniques such as automated optical inspection (AOI) and X-ray analysis.Finally, the completed PCB is packaged and prepared for shipment to the end customer. This may involve the addition of protective coatings, the installation of connectors or other hardware, and the labeling and documentation of the PCB.Throughout the entire PCB production process, it is essential that workers and trainees receive comprehensive training on the various techniques and equipment involved. This training should cover not only the practical aspects of the production process, but also the underlying principles and best practices that guide the industry. Byensuring that all personnel involved in the PCB production process are well-trained and knowledgeable, companies can ensure that their products meet the highest standards of quality and reliability.In conclusion, the PCB production process is a complex and multifaceted endeavor that requires a deep understanding of electrical engineering, materials science, and manufacturing techniques. By providing comprehensive training to all personnel involved in the process, companies can ensure that their PCBs are produced to the highest possible standards, helping to drive innovation and advancement in the electronics industry.。
PCB专业英语培训教材(2)
V-CUT shift V-CUT under spec. V-CUT over spec.
移位 v-cut 过浅 v-cut 过深
T O P S E A R C H
Process Flow
11. E-Test(电测) 12. Packing(包装) 13. Output (出货)
T O P S E A R C H
绿油移位 渗油 绿油进孔 不过油 绿油起泡
S\M bubble
T O P S E A R C H
S\M bridge broken
绿油断桥 绿油不良 碳油不良 补油点多
Poor S\M
Poor carbon ink
Excess S\M point rework
T O P S E A R C H
GAME 3----抢答
金指穿孔缺口
金指擦花
锡上金指
T O P S E A R C H
Copper expose on
金脚露铜
金脚甩油 金指斜边偏差
root of G\F S\M peel off on root of G\F G\F bevel edge deviation Insufficient gold thickness
Scl hole rough Poor solder stripping Poor solder surface
锡孔粗糙
退锡不良
锡面不良
S\M on pad SMD
Pitch width under size
绿油上锡指
锡指宽广偏小 锡面灰
Grey solder surface
规则：
桌子上放有两个盒子，一个装的是坏点英 文名称，另一个装的是中文名称。讲师从一个 盒子中随意抽取一张卡,组与组之间进行抢答， 每组有三次机会（第一个人没有回答上，可以 把机会让给组内的其他学员。否则机会就归其 他组）。每对一个单词得一分。
PCB培训胶片二_英文版
Back
LAMINATION
COPPER FOIL
INNER LAYERS
PRE-PREG
Back
LAMINATION
Back
DRILLING
Back
DRILLING
Back
DRILLING
DRILLING
• Design Standards:
IPC – 2221 – For rigid boards. IPC – 2223 – For flex & rigid flex boards.
Pad to Drill Ratio
• Pad size definition rule:
- Pad size = drill size + Annular ring * 2 + minimum standard Fabrication allowance.
PLASMA/ PERMANGANAT
ELECTROLESS COPPEபைடு நூலகம் PLATING
DRY FILM LAMINATION
AFTER IMAGING
DEVELOPING
COPPER PLATING (ELECTROPLATING)
TIN PLATING (ELECTROPLATING)
Basic Design Rules
Layer >
Via Hole Diameter
. -. "
Layer > . - . "
Layer > . - . "
Via Hole Depth
PCB基础知识专题知识课件
PCB应知应会培训教材
3) 曝光
内层曝光机
关键物料：
A、银盐片（黑片）
B、曝光灯（功率7/8KW）
关键控制：
对位精度：人工对位：±3mil
CCD对位：± 1.5mil
解 析 度：3mil
曝光能量：7-9级（21级曝光尺
方式）
PCB应知应会培训教材
3) 曝光
内层曝光机
曝光能量均匀性（曝光能量min/max）
光反射旳不同原理，找出
缺陷产生旳位置。
测试项目：缺陷板测试。
关键设备：AOI、VRS
关键物料：/
关键控制：基准参数
PCB应知应会培训教材
层压：利用半固片将导电图形在高温、高压下粘合起来，形成多层
图形旳PCB。
1) 棕化
.作用：在铜面生成一层有机铜氧
化层，确保后续压合时芯板与PP
旳结合力。
.工作原理：化学氧化络合反应
寸稳定性。
关键控制：不同板材焗
板参数区别，焗板时间，
焗板温度、叠层厚度。
PCB应知应会培训教材
基板分类
基板按TG类型分类：一般TG(≤140℃)，中
TG(150℃), 高TG(≥170℃)。
基板按材料种类分类：CEM、FR-4、无卤素
等
TG值定义：玻璃转化温度，可了解为材料
开始软化如玻璃熔融状态下旳温度点。
一边尺寸（37、41、43inch）为经向，
确保多层板旳PP与基板旳经向、纬向
一致是控制涨缩、翘曲旳首要条件。
常见铜箔厚度：1/3OZ—12um,1/2OZ—
17.5um,1OZ—35um, 2OZ—70ｕｍ。
PCB专业英语资料PCB海外销售英语资料
Engineering Common words 常用词语
• Base Material
• Copper clad laminate(CCL)(覆铜板) • PREPREG(半固化片) • Epoxy resin(环氧树脂) • Copper foil(铜箔) • Dielecteics(介质) • PTFE (Polytetralluoetylene) Teflon(聚四氟乙
• Surface Treatment
• 沉金
• Immersion Gold
• Chemical Gold
• Enectroless Gold Plating
• ENIG= Enectroless Nickel and
•
Immersion Gold
Engineering Common words 常用词语
• QUANTITY IS PER PCB , 10 OFF PCBS REQUIRED , IMMERSION SILVER
• 6 层板，1.6MM 厚，FR-4 板材，两层绿色阻焊，两 层白色字符，UL 标记要加，做裸板测试，拼版铣外形， 板尺寸：265 X 356 MM，交货数量 10 个,沉银
• 桥连邮票孔 • Connecting tabs with Stamp holes • Connecting tabs with Mouse(Mice)
Bite holes • 工艺边 • Rails(Tooling Rails) • Tooling Strip
Engineering Common words 常用词语
处理习惯
• 对于外销客户，客户在回复工程问题后，会问道 Please confirm all the questions are clear and the order could be proceeded ?/Please feedback if you could understand all the comment above?
Expedition_PCB基础培训教材
Expedition PCB基础培训教程Copyright(c) Mentor Graphics Corporation 2010All rights reserved本文档记录的信息属于Mentor Graphics公司所有，未经Mentor Graphics公司书面许可，严禁以任何方式复制其中的任何章节或全文内容。
本文档接收者，应当尽力避免对文档信息采取未经授权的使用行为。
目 录第一章 库的使用 (9)第二章 焊盘的创建 (13)第三章 创建Cell (20)第四章 创建Symbol (34)第五章 创建Part (46)第六章 创建Template (56)第七章 DxDesigner的使用 (61)第八章 PCB Editor的使用 (80)第九章 PCB设计设定 (98)第十章 创建Board Geometries (108)第十一章 布局 (117)第十二章 Layout 设定 (127)第十三章 布线 (143)第十四章 测试点 (156)第十五章 生成Plane (160)第十六章 设计检查 (170)第十七章 生成丝印 (177)第十八章 生成Gerber和Drill (185)第十九章 尺寸标注与文件编制设计 (193)关于本书本书是Expedition PCB Introduction的培训教程,书中介绍了熟练使用Mentor Graphics Expedition PCB工具进行印刷电路板的设计需要掌握的相关概念。
读者该培训课程,主要面向使用Mentor Graphics Expedition PCB工具来设计和编辑印刷电路板,并具有以下预备知识的设计师和工程师。
课程特点z本课程关注Expedition PCB在设计流程中的使用，而不是对Expedition PCB的所有功能进行详尽介绍；z阐述印刷电路板技术及其设计方法，也不是本课程的重点。
预备知识●用户应该掌握基本的PCB布局布线设计思想。
PCB英语培训资料
PCB英语培训资料一. 流程英语及相关词汇❖PCB(Printed Circuit Board) 印制线路板❖Marketing Department市场部❖PE – Product Engineering Department 产品工程部❖MI - Manufacturing Instruction生产制作指示/生产流程单❖CAD/CAM - Computer Aided Design计算机辅助设计/制造❖TQ—Engineering Technical Query 工程问题1. Inner board cutting: 内层开料-1❖Sheet Size大料尺寸❖Panel Size拼板尺寸❖Material Type材料类型❖Supplier供应商❖Base material基材❖Thickness厚度❖Board Thickness板厚❖Laminate Thickness材料厚度❖inner core 芯板/内层板料❖Comparative Tracking Index 比较漏电痕迹指数CTI❖Glass Transition Temperature玻璃态转化温度Tg1. Inner board cutting: 内层开料-2❖Dielectric Thickness介电层厚度❖Dielectric constant介电常数Er❖Base Copper底铜/基铜❖Delamination分层❖Flammability可燃性❖Baking烘板❖Single/double单层/双面❖Double sided board双面板❖Multilayer board 多层板❖Bare board裸板(board without copper)2. Inner Image Transfer:内层图像转移/内光成像3. Inner Etching 内层蚀板4. Inner AOI—Automatic Optical Inspection自动光学检查5. Pressing 层压❖Lamination 压板❖Lay-up structure压板结构❖PP - Prepreg半固化片❖Copper clad/ Copper foil铜箔Cu foil❖Resin树脂❖After Pressed Thickness压板后之厚度6. Drilling 钻孔-1❖Hole孔❖Hole Type孔类型❖Hole Tolerance 孔径公差❖Hole chart 孔表/分孔图❖Plated Though Hole 金属化孔PTH❖Non-Plated Though Hole 非金属化孔NPTH❖Drill tape钻带❖Blind via hole盲孔❖Buried hole埋孔❖Hole Diameter孔径6. Drilling 钻孔-2❖Hole location孔位❖Hole Position Tolerance孔位误差❖Hole Position Deviation孔位置偏差❖2nd Drilling 重钻❖Mounting hole安装孔❖Pin hole销定孔❖Target Hole目标孔❖Slot 槽,坑❖No. of holes孔数❖Laser via hole激光穿孔❖Roughness粗糙度7. Plate Through Hole (PTH)沉铜/孔化❖Hole wall copper thick 孔壁铜厚❖Defect缺陷❖Cracking裂缝8. Outer Dry Film 外层干菲林/外光成像-1❖Dry Film干菲林/干膜D/F❖External layer外层❖Internal layer内层❖Component Side 零件面C/S❖Solder Side焊接面S/S❖Top side/ layer 顶层❖Bottom side/layer底层❖Primary side首面❖Secondary side第二面❖(提示: 层的写法尽量按客户的习惯书写)8. Outer Dry Film 外光成像-2❖Power plane电源层❖Ground 接地层❖Layer层❖Dry-film tenting D/F封孔❖Surface mounting Device表面粘贴装置SMD❖Line Width线宽—LW❖Line Space线隙—LS: Line-Line/Line-Pad/Pad-Pad❖Conductor导体❖Circuit线路❖Pattern线路❖Artwork菲林❖Master drawing菲林图形❖Artwork Modification菲林修改❖Outer Dry Film外光成像-3❖Annular ring锡圈❖Min.Annular Ring最小环宽/焊盘宽❖Hole breakout 破环/崩孔❖Pad焊盘❖Round pad圆盘❖Teardrop泪珠❖Clearance/space间距/间隙❖Minimum 最小---Min.❖Maximum 最大---Max.❖Min.Spacing between Line to Line线与线间的最小距离❖Test coupon图样❖Registration Deviation 对位偏差9. Pattern Plating 线路电镀/图形电镀❖Plating电镀❖Chemical corrosion化学腐蚀❖Copper plating电镀铜❖Copper thickness on hole wall 孔内铜厚❖Max.Board Thickness After Plating电镀后总板厚度之上限10. Outer Etching 外蚀板❖Undercut侧蚀11. Solder Resist 湿绿油/阻焊-1❖S/M(Solder Mask) 阻焊❖Solder resist film阻焊菲林❖SM print SM印油菲林❖SM imaging SM曝光菲林❖Solder Mask opening 阻焊开窗/曝光窗❖Solder Mask material/Type 绿油材料/类型❖Color颜色❖Shiny有光泽的,发光的(光亮油,)❖Matte哑光油的❖Matte Green 哑光绿油❖Liquid Photo-Imaginable (LPI)液态光固化剂11. Solder Mask 湿绿油/阻焊-2❖W/F(Wet Film) 湿膜/湿绿油❖Ball Grid Array (BGA) 球栅阵列❖S/M Bridge 绿油桥❖Cover 盖(油入孔)❖Tenting封孔/盖油❖Via Plugging 封孔❖Plug Hole塞孔❖Filled with solder resist 塞孔❖Solder mask on bare copper (SMOBC) 裸铜覆盖阻焊膜❖Encroach 侵占, 蚕食❖Encroach into holes 入孔12. Carbon Ink 印碳油❖Carbon ink碳油❖Carbon Resistance 碳油电阻13. Component Mark 印字符❖Silk Screen丝印❖Component Marking 元件字符C/M❖Legend字符❖Corner mark板角记号❖Logo标记❖Date Code周期代号❖Cust. P/N: customer part number客户型号❖Revision/Version:版本号14. Gold Finger Plating 金手指❖Bevelling斜边❖Gold Finger(G/F) 金手指❖Chamfer倒角❖Key slot槽孔❖Au/Ni 金/镍15. Hot Air Leveling 喷锡❖HAL(Hot Air Leveling) 热风整平❖HASL Hot Air Solder Leveling❖Impedance阻抗IMP❖Surface Treatment表面处理16. Immersion Silver 沉银17. OSP抗氧化处理18. Immersion Tin 沉锡19. Immersion Gold/Imm Au 沉金20. Solder/Tin/Lead Stripping 退锡❖ENIG----Electroless Nickel/Immersion Gold 沉金(工艺) ❖Ag银21. V-Cutting V-坑❖V-Cut V - 坑❖Remain Thickness 保留厚度❖Scoring==V-CUT刻槽❖Scratch划痕❖V-groove V- 坑22. Routing (铣/锣板)/ Punching 啤板❖Profiling外围成型❖Engineering drawing工程图纸❖Fiducial mark基准点❖Dimension尺寸❖Length 长度❖Width 宽度❖Breakaway tab/area板边位❖Datum hole基准参考孔❖Punching die /Punch 啤模❖Offset偏移量❖Outline外形❖Shape 外形23. Electrical Testing 电测试❖E-test fixture E-T 夹具❖Electrical Test Fixture电测试夹具❖V oltage电压❖Open/short开路/短路❖Probe point测试点24. Outer Final QC 最后检查❖Warpage翘曲度❖Bow and twist 板弯曲25. Peelable Mask 印蓝胶❖Peelable Mask/Blue Mask蓝胶❖Peelable可剥性26. Packing&Shipment 包装出货❖Vacunm Pack真空包装❖No.of Pcs Per Bag每包数量❖Packing包装27. Other其它相关-1❖Gerber Data 客户资料打包文件❖Checklist检查表❖production film 生产菲林❖Paste film粘贴/贴键菲林/钢网❖Solder coating上锡❖Reliability可靠性❖Assembly安装性❖Correspondance符合性❖Pin gauge 针规❖Backplane背板❖Customer客户27. Other其它相关-2❖Customer P/N客户产品编号❖Delivery交货❖Description说明❖Golden board金板❖Missing 缺少❖Mother board 主机板❖Ionic cleanliness离子清洁度/离子污染度❖Location位置❖Max. X-out坏板上限/最大允许报废板数❖No.of Array/Panel每个拼板套板数❖Negative反面的❖Positive正的27. Other其它相关-3❖Production生产板❖Sample样板❖Remark备注❖Special requirement特殊要求❖Specification详细说明，制作规范❖Wiring线路❖Square方形的❖View From…观察方向由…❖Lead free process 无铅处理❖Dummy Pad 为圆形或方形的PAD(加在板边位/标位或空白处起平衡电镀作用)❖Dummy copper实心的铜皮❖Thermal Pad 散热盘❖Fibre纤维面二. 问题之基本模式❖Title: Engineering technical question of 021D2002R2 (JOVE P/N: 20LN21119)==On Hold/Go on with suggestion❖Hello Ye jian,❖Nice to contact with you! I'm Jack, an Engineer from Engineering department in Jove.❖For the captioned project, we found some questions need you to confirm with customer.❖Question 1: As there are PTH (plated-hole) between the edge of unit, after doing V-cut, the holes will be scratched, and after customer divide them into two parts along the v-cut line, the copper showing in A part on the hole wall and that on the board may be picked off, which will lead to solder failure. Please refer to fig01❖Suggestion: a)To avoid this potential fault, we will modify the cad data: to add two PTH holes as position B to insure the connection between top and bottom sides. And to add two NPTH holes as position C (use 2nd drill) at the end-point of V-cut line which closed to that big PTH hole to cut the copper off so as to avoid copper being picked off. Please kindly confirm this modification can be acceptable.❖b) Or we will do sample board to let our customer to approve. Please have one, a) or b)? ❖Question 2: Same case as question 1 except that the PTH holes is only on one edge of unit. Please refer to fig02❖Suggestion: a) We will do them NPTH holes and will shave the copper around holes to get about 8 mil clearance.❖ b) We only add two NPTH holes (use 2nd drill) at the end-point of V-cut line whichclosed to that big PTH hole to avoid that potential fault. Please kindly confirm these modification can be acceptable.❖❖Have a nice day!❖B.Regards❖Ding, you de**********************❖Engineering technical question of 021D2002R2 (JOVE P/N: 20LN21119)==On Hold/Go on with suggestion❖Dear John(名字)❖Hello Mr Smith(姓)❖Hi Miss Green❖Nice day John❖Good Morning Jack❖Nice to contact with you! / I’m glad to cooperate with you!❖I'm Jack, an Engineer from Engineering department in Jove.❖1) After checking the captioned new project/updated gerber data, we have some questions as below. Would you please help to settle them. 在检查完此新板后，我们有如下问题。
英语内部培训资料2
Whirlpool W/C 生产线员工英文培训教材( Unit 2 )一. 公司所用基本单词1.厂区公司: company 工厂factory 宿舍:dormitory 车间: workshop 办公室:office 饭堂: canteen 小商店: Mini-store 医务室: clinic 演讲室: auditorium 篮球场basketball ground 北大门: North Gate 保安:security 建筑物: building 清洁工: cleaner 一楼: the first floor 公交车: bus 房间: room 电视: television 热水器: water heater 桌子：desk 椅子: chair 衣柜: wardrobe 被子: quilt2. 公司各部门制造部: manufacturing 工程部: engineering 质量保证部:QA(Quality Assurance) 计划部：planning 采购部:purchasing 测试部: testing 人事部: HR(human resource) 设施工程部: Facility 财务部:Finance 电脑部:IT(Information Technology)3. 公司各职务名称营运经理: Operation Manager 事业部总监:Business Unit Director(BUD) 事业部经理:Business Unit Manager(BUM) 工作坊经理: Workcell Manager 功能部经理: Functional Manager经理: manager主任: officer 生产线经理: Line Manager 生产线主管: Line Supervisor 工程师: engineer 技术员:technician 高级助理: senior line leader 助理: line leader 替位: floater 物料员:material handler 工人: worker 计划员: planner 采购员: buyer4. 常用的缩写IQC: Incoming Quality Control来料质量控制IPQA: In Process Quality Audit 过程中质量稽核OBA :Out of Box Audit 开箱检查AVL :Approved Vendor List 批准的供应商清单BOM: Bill Of Material 物料清单CAR: Corrective Action Report纠正措施报告CRD :Component Reference Designator元件参考指定DPM: Defects Per Million每百万的坏点DL :Direct Labor直接生产工人IL :Indirect Labor间接生产工人ECN: engineer change notice工程更改通知ESD :electro-static discharge静电放电FPY: first pass yield 第一次通过率FVT: functional verification test功能确认测试ICT: in-circuit test在线测试PCB: printed circuit board印刷线路板PLV: part to line verification system生产线上元件确认系统RMA: returned material authorization授权返回物料SMT: surface mount technology 表面贴装技术MI: manual insertion 手动插件AI: automatic insertion自动插件5.生产线所用的各种文件1> visual aids 直观教具Material & tooling &equipment list 物料/工具/设备清单P/N: part number: 物料编号Description:描述quantity: 数量history tracking of VA changes VA改变历史跟踪2>DA: deviation authorization 授权的背离Initiated by:起草人customer:客户effective date:执行日期expiry date:过期日期Affected product/assembly: 影响的产品/组装affected process:影响的工序Reason for change: 改变的原因description of change 改变的描述Originator:创作者signature:签名approval: 批准3> First Article Build 首件报告Line no 生产线名initiator:填写人model name: 型号名start time: 开始时间Complete time:完成时间process:工序accept:接受reject:拒收comment:意见Approved to run 批准运行not approved to run 不准运行4> Output tracking report 产量跟踪报表time in hour:时间(小时) target qty: 目标数量machine packout qty:机器生产数downtime: 停机时间problem:问题root cause/action 根本原因/采措施PIC :person in charge: 负责人5> model change over time tracking 转机时间跟踪表Normal run 正常生产trial run: 试运行NPI: new product instruction:新产品引进Loading material: 装料start time: 开始时间end time:结束时间spend time:花费时间Machines/Process Change over:机器/过程转换remark:备注Start time: Time of final board SMT(testing) for last model. 开始时间指的是上一产品最后一块板完成SMT的时间End of time: time of first board SMT(testing) for running model. 结束时间指的是正在运行的产品第一块板完成SMT的时间Model change over time:(max of processes’ change over time) 转拉时间指的是在转拉过程中最长工序所花费的时间二.口语训练Nice to Meet You很高兴认识你听下列对话，练习自读跟读。
PCB培训教材
蝕
銅
(ETCHING)
A O I 檢 查 (AOI INSPECTION)
預 疊 板 及 疊 板 (LAYUP )
壓
合
(LAMINATION)
預疊板及疊板 (LAY- UP )
後處理 (POSTTREATMENT)
烘
烤
(BAKING)
壓合 (LAMINATION)
鑽
孔 (PTH
DRILLING)
PCB培訓教材
黑化(Oxide Coating)
2020/5/13
PCB培訓教材
18
PCB制作工藝流程介紹
壓合
• 目的：
– 將內層板、膠片、與外層銅 片壓合成多層板
2020/5/13
PCB作業流程介紹
(4)外觀及成型製作流程
檢查
INSPECTION
液態防焊
LIQUID S/M
前處理
PRELIMINARY TREATMENT
後烘烤
POST CURE
塗佈印刷
S/M COATING
顯影
DEVELOPING
印文 字
SCREEN LEGEND
噴錫
HOT AIR LEVELING
mm • 銅箔厚度:1/1 OZ, H/H OZ • 註: 通常厚度 0.8mm(不含)以下的板
子,廠商的厚度是不含銅箔.
2020/5/13
PCB培訓教材
12
PCB制作工藝流程介紹
內層制作
傳統之雙面板為配合零件之密集裝配，在有限的板面上無法安置這麼多的 零組件以及其所衍生出來的大量線路，因而有多層板之發展.
顯
影
(DEVELOPING)
前處理 (PRELIMINARY TREATMENT)
pcb生产流程培训英文版
pcb生产流程培训英文版**Introduction**PCB, short for Printed Circuit Board, is the foundation of any electronic device. It's where all the components are connected and make the device function. Understanding the PCB production process is crucial for engineers, designers, and anyone involved in the electronics industry. In this comprehensive PCB production process training, we'll delve into each step, from concept to completion.**1. PCB Design**The first step is PCB design, which involves converting the electrical schematic into a physical layout. This is done using PCB design software, where components are placed and connected using tracks or wires. The designer needs to consider factors like component size, spacing, and heat dissipation during this stage.**2. Gerber File Generation**Once the design is complete, it's converted into a Gerber file. This is a standard file format used in PCB manufacturing, which contains all the necessary informationabout the board's layers, tracks, and components. TheGerber file is sent to the PCB fabricator for manufacturing. **3. PCB Fabrication**Fabrication involves cutting the PCB board from alarger sheet of copper-clad laminate. This is done using a machine called a router, which follows the patterns in the Gerber file. After cutting, the board goes through various processes like drilling, etching, and plating to create the necessary circuits and connections.**4. Component Placement**The next step is component placement, where the electronic components are soldered onto the PCB. This is done either manually or using automated machines, depending on the complexity and scale of production. Components like resistors, capacitors, and ICs are carefully placed on the board according to the design.**5. soldering and Testing**After component placement, the board goes through a soldering process to ensure secure connections. This is followed by rigorous testing to ensure the board functionsas designed. Tests include visual inspection, continuity checks, and functional testing.**6. Assembly and Final Testing**Once the PCB passes the initial tests, it's assembled with other components and subsystems to form the final product. The assembled product then goes through final testing to ensure it meets all specifications and is ready for market.**Conclusion**The PCB production process is a complex yet fascinating field. It involves multiple stages, each requiring precision and attention to detail. This training has provided a comprehensive overview of the PCB production process, from design to final testing. With this knowledge, you'll be well-equipped to handle any PCB-related task confidently.**PCB生产流程培训中文版****介绍**PCB，即印刷电路板，是任何电子设备的基础。
PCB培训教材(二)
信号线布线规则
详细描述
根据信号的带宽和频率，选择合 适的线宽以减小信号的延迟和损 耗。
保持线间距在适当的范围内，以 减小串扰和电磁干扰。
总结词：信号线布线规则是确保 信号完整性和可靠性的关键，涉 及到线宽、间距、过孔等要素。
尽量减少过孔的使用，特别是在 高速信号线上，因为过孔会增加 线路的阻抗和电感。
详细描述
03
04
05
多层PCB能提供更多的 设计时需考虑各层的材 布线空间，降低信号间 料、厚度、导热性能和 的干扰，提高信号质量。 电气性能等参数。
电源和接地层的设计对 于多层PCB至关重要， 需确保电源和接地系统 的稳定性和可靠性。
案例二：高频电路PCB设计
总结词：高频电路PCB设 计需要特别关注信号完整 性和电磁兼容性。
绝缘电阻测试
检测PCB的绝缘性能，确保电气 安全。
耐压测试
评估PCB在高压下的工作性能和 安全性。
电磁兼容性测试
检测PCB的电磁干扰和抗干扰能 力，确保正常工作时不影响周围
设备。
06
PCB设计案例与实践
案例一：多层PCB设计
01
02
总结词：多层PCB设计 是PCB设计中的重要一 环，涉及到信号层、电 源层和接地层的合理布 局与布线。
焊接工艺
包括波峰焊、回流焊等工 艺，用于将电子元件与 PCB焊接在一起，实现电 路连接。
贴片工艺
采用自动贴片机将SMT元 件贴装在PCB上，实现微 型化、高密度组装。
检测与返修
对组装完成的PCB进行检 测，发现并修复缺陷，确 保产品质量。
05
PCB可靠性测试与评估
环境适应性测试
温度循环测试
评估PCB在不同温度下的适应性， 确保在温度变化时仍能正常工作。
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T O P S E A R C H
9. Surface Treatment(表面处理)
Scl hole under size
Scl hole over size Solder over thickness Solder lump 喷锡孔小 喷锡孔大 锡高 锡渣
Thin solder
T O P S E A R C H
2.Inner Layer(内层)
Ink residue Spacing under size Insufficient line width
油墨残物 线间偏小 线幼\线偏小 线路缺口
Nick circuit
T O P S E A R C H
Poor exposure
规则：
桌子上放有两个盒子，一个装的是坏点英 文名称，另一个装的是中文名称。讲师从一个 盒子中随意抽取一张卡,组与组之间进行抢答， 每组有三次机会（第一个人没有回答上，可以 把机会让给组内的其他学员。否则机会就归其 他组）。每对一个单词得一分。
T O P S E A R C H
8. Legend Printing（白字）
孔开
板损 掉缸
T O P S E A R C H
6.Outer Layer（外层）
Dry film residue Foreign matter under DF Film peel off Poor exposure Insufficient line width CCT open 干膜残物 干膜下杂物 甩膜 曝光不良 线幼\线偏小 开路
金厚不足
T O P S E A R C H
W\F on G\F
Dent on G\F G\F out of size Gold surface oxidation Gold bleeding Nickle burnt
绿油上金指
金指凹痕 金手指变形 金面氧化 渗金 烧镍
T O P S E A R C H
connection
Pit on golden finger Nick on G\F G\F bevel edge deviation Insufficient gold 金指穿孔缺口 金厚不足 渗金 烧镍
thickness Gold bleeding Nickle burnt
金面针孔
金指斜边偏差
T O P S E A R C H
10. Profiling （成型）
Poor profiling Missing bevel edge Damage by punching Damage by routing 碑锣不良 锣斜边 碑板压伤 板锣伤
T O P S E A R C H
V-CUT shift V-CUT under spec. V-CUT over spec.
移位 v-cut 过浅 v-cut 过深
T O P S E A R C H
Process Flow
11. E-Test(电测) 12. Packing(包装) 13. Output (出货)
T O P S E A R C H
Block hole
塞孔
T O P S E A R C H
GAME２----单词认读
规则：
谁最先读出讲师抽取的卡片 上的单词，便可为本组赢得一分。
T O P S E A R C H
5.Plated-through hole(沉铜)
Scratch 擦花
Hole open
Board damage Drop vat
PCB 坏点英语培训教材
张健利（frak zhang)
JAN. 2007
T O P S E A R C H
目录
• Process Flow • Defect Introduction • Test
T O P S E A R C H
一、Process Flow
T O P S E A R C H
Board Cut (界料)
The end,thank you!
金指穿孔缺口
金指擦花
锡上金指
T O P S E A R C H
Copper expose on
金脚露铜
金脚甩油 金指斜边偏差
root of G\F S\M peel off on root of G\F G\F bevel edge deviation Insufficient gold thickness
Scl hole rough Poor solder stripping Poor solder surface
锡孔粗糙
退锡不良
锡面不良
S\M on pad SMD
Pitch width under size
绿油上锡指
锡指宽广偏小 锡面灰
Grey solder surface
T O P S E A R C H
Uneven edge Board dirty Protrude spot Concave spot Pitting Scratch
板边凹痕 板污 凸点 凹点 针孔 擦花
T O P S E A R C H
GAME1----播音员
规则：
每组派一名代表上来带读， 其它成员跟着念。由全体学 员举手表决，选出最佳“播音 员”。
T O P S E A R C H
GAME 4----互相介绍
规则：
我们刚学过SF里的16个坏点单词，从 第一个学员开始，每位学员分别记一个 单词，每个单词分别代表每位学员的姓 名，记住姓名之后，然后互相介绍。
T O oor on G\F Pit on gold finger Nick on G\F Scratch on G\F Solder on G\F 金面不良 金面针孔
绿油移位 渗油 绿油进孔 不过油 绿油起泡
S\M bubble
T O P S E A R C H
S\M bridge broken
绿油断桥 绿油不良 碳油不良 补油点多
Poor S\M
Poor carbon ink
Excess S\M point rework
T O P S E A R C H
GAME 3----抢答
Poor circuit
曝光不良
线路不良
Scratch circuit
Under etching
线路擦花
蚀板不清
Over etching
蚀板过度
T O P S E A R C H
3.Pressing(压板)
Delamination Warpage Registration Bubble on board Folding on board 爆板\分层 板曲 内层移位 板面起泡 板面起皱
Inner Layer (内层)
Pressing 压板
Drilling 钻 孔
Output 出 货
Packing 包装 E-test 电测 Profiling 成型 Surface Treatment 表面处理 Legend Printing 白字
Plated-through hole 沉铜<孔金属化>
Block hole by scl
锡薄
锡塞孔
T O P S E A R C H
Copper expose on solder Contamination on solder
Solder on carbon ink
锡面漏铜 锡面灰黑
锡上碳油
Solder in hole
锡进孔
T O P S E A R C H
T O P S E A R C H
4.Drilling（钻孔）
Excess hole Hole shift Hole damage Drill burr 多孔 偏孔 孔损 披锋
T O P S E A R C H
Hole contamination
Board dirty
孔灰黑
板污
孔粗
Rough hole
C\M unclear C\M shift 白字不清 白字移位 白字进孔
C\M in hole
Wrong\ missing mark
错\漏标记
T O P S E A R C H
Missing C\M
漏印白字 白字不良
Poor C\M
C\M on wrong side C\M peel off
白字印错面
T O P S E A R C H
Spacing under size Nick CCT(concave)
线间偏小 缺口 线路不良 线路擦花 蚀板不清 蚀板过度
Poor CCT
Scratch CCT Under etching Over etching
T O P S E A R C H
7.Wet Film（湿菲林）
S\M under cure 绿油未干
S\M Peel off
Oxidation under S\M
甩绿油
绿油下氧化
Foreign matter under W\F 湿菲林杂物
T O P S E A R C H
S\M shift S\M bleeding S\M in hole S\M skipping
Outer Layer 外层
Wet Film 绿油<湿菲林>
T O P S E A R C H
二、Defect Introduction
T O P S E A R C H
1.Board Cut (界 料)
Residue on board Foreign matter on board Scratch on board surface 板面胶渍 板面杂物 板面擦花