2013届电子汽车类英文翻译原文

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4 - 8kV(MM); 15 kV some cases
I I
LIN
Generally required Gateway Performance
In order to handle the increasing complexity of the incar network system engineering and architecturing was introduced, leading to so-called domain oriented bus topologies. The electronic systems of a car are divided into domains like body electronics or vehicle motion management. Within such a domain a so-called domain controller takes care of managing the tasks (e.g. reading sensor outputs, sending messages to actuators) within the domain. This controller connects intelligent sensors and actuators via local bus systems and is by itself connected via a central gateway to other domain controllers. There are many different architectures in use and new ones are under development. They are based on central domain control units consisting of a [tC (microcontroller) with embedded NVM (non-volatile memory, mostly flash EEPROM) and some automotive specific mixed signal IC's, which are very often customer specific designed (ASICs). These ASICs are connected via point-to-point lines to the automotive specific electronics either at sensors or actuators. There is a clear trend to replace analog communication by digital communication in this area.
Automotive electronics increased in functionality and complexity heavily during the past decades and was undergoing major changes in architecture, functionality, networking capabilities - and there are many new systems coming up soon. The harsh environment in cars and the high requirements on quality of all components led to many automotive specific solutions for semiconductors, their packaging, and the process technologies used to manufacture them. Apart from this manufacturing of automotive semiconductors needs focus on test and release procedures and on specific logistic process. In this paper we will give an overview on automotive specific requirements for semiconductors and their manufacturers.
Automotive electronics and its specific requirements
Starting from a few simple and isolated functions in corresponding electronic devices, automotive electronics developed into a completely networked architecture of as many as 100 microprocessors and we expect the system complexity in cars to increase further during the next decades. More and more mission critical functions (e.g. ABS) rely on electronic components leading to permanently increasing requirements for the robustness of the so-called E/E-system (electric/electronic system) of cars. Due to budget limitations of the end-user all new functions of cars can only be implemented, if existing functions decrease in cost. Cost pressure will
During the past 35 years the automotive industry in Europe was capable to reduce the number of casualties from accidents by 60% although the traffic density increased by more than 250% and there will be further improvements coming up. The emission of cars (particles, HC, NOx, CO) was reduced by 91-98% since 1990 with the help of new electronic control units and strategies including new sensor technologies and electronically controlled actuators. In parallel, fuel
Introduction
Automotive electronics changed dramatically during the past 50 years due to increasing requirements by legislation - emission, fuel consumption, safety for passengers, and last but not least convenience and entertainment.
OBD: On-Board Diagnostic Central Gatewayf
LS-CAN m
<1
'FlexRay
Humidity
ESD
Tolerated Field Failure Rate
< 1,000 ppm
4 - 8kV
Low
0% up to 100% target: zero failure
consumption decreased by 35% since 1972. These driving forces fueled an enormous amount of new electronic functions which are the basis for the mentioned improvements.
Automotive Electronics - Enabling the future of individual mobility
Dr. Claus Schmidt Robert Bosch GmbH D-72703 Reutlingen, Germany
P.O. Box 14342
Abstract
Requirements on Automotive Semiconductors
With help of some examples of applications we will show where these requirements are coming from:
Modern direct injection engines use many different sensors (knock signal, air mass flow, lambda sensor) and actuators (valves, electric motors, pumps). The high pressure injection valves are directly connected to the corresponding integrated power stages. These power stages and the valves are co-designed and have to be handled as a single entity (so-called component package) including even the necessary software. These power stages drive voltages of more than 80V to open and close the valves.
Having the electronics close to sensors and actuators and the control units very often under the hood or within other challenging environments, completely different requirements on automotive semiconductors are necessary compared to consumer electronics.
1-4244-0439-X/07/$25.00 © 2007 IEEE3
therefore be a continuous challenge for the engineers. Parameter Temperature
LS-CAN: 100 kBitls ................Ethernet HS-CAN: 500 kBit/s (100 Base FlexRay: 10 MBitIs _...................... Ethernet: 100 MBitIs MOST: 24,5 MBit/s
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7
Consumer 0°C - 400C 3,3V pA ... mA 1-3 years
Automotive -400C - 850/1750C
>80V
LIN:
20 kBitls
Voltage
Power
DiagnostsTX
Operation Time
pA ... >1OA up to 25 years
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