Rogers罗杰斯板材技术参数
罗杰斯电路板参数4000系列
方向
介电常数，Ɛ r (制造标
称值)
3.38±0.05
(1)3.48±0.05
Z
介电常数，Ɛ r 3.55
（电路设计推荐值）
3.66
Z
损耗因子，tan δ
介电常数的温度系数 体积电阻 表面电阻 耐电强度 拉伸模量
拉伸强度 弯曲强度 尺寸稳定性 热膨胀系数
0.0027 0.0021
0.0037 Z
0.0031
RO4000系列高频线路板材料是由玻璃纤维增强的碳氢化合 物/陶瓷基材（非PTFE）构成，针对对性能要求较高，大批 量商用市场而设计的。
RO4000 系 列 材 料 特 点 是 具 备 高 频 性 能 而 线 路 板 生 产 成 本 低。它具有低损耗，和普通环氧树脂/玻璃编织布（FR4） 类似的加工工艺，因此有很强的价格竞争力。
标准铜厚
1/2 oz ( 17µm), 1 oz (35µm） 2 oz (70µm) 电解铜
本产品资料表和加工说明中的信息旨在协助您应用罗杰斯线路板材料和半固化片进行设计。它并不计划且不创造任何承担、说明或暗示，包括 出于一个特殊目的的适销性或匹配性担保或用户出于某一特殊目的可以获取到的产品资料表和加工说明中显示的结果。用户需针对每一应用确 定罗杰斯印刷线路板的适用性。
= 12 × [400]
= 51,800 RPM
3.14 × [0.0295]
= [51,800]×[0.003]
= 155 IPM
本产品资料表和加工说明中的信息旨在协助您应用罗杰斯线路板材料和半固化片进行设计。它并不计划且不创造任何承担、 说明或暗示，包括出于一个特殊目的的适销性或匹配性担保或用户出于某一特殊目的可以获取到的产品资料表和加工说明中 显示的结果。用户需针对每一应用确定罗杰斯印刷线路板的适用性。
特殊板料培训
特殊板料绪言:目前我司的特殊板料供应商有:Rogers：厂家：USATaconic厂家：爱尔兰，USANeltec: PTFE：厂家：法国，USAFR4：NELCO：厂家：新加坡。
Arlon：厂家：USADK: 指介电常数,国外称DK,国内称Σr板材厚度(匀为介质厚度,即不含CU的厚度): 依MIL为单位,1MIL=0.0254MMCU由两种组成: ROLLEAL: …….R1R1(R表压延铜箔,1表1OZ)电解CU箔:… C1C1(C表电解铜箔, 1表1OZ)****************************************************************************************** Rogers：1.陶瓷+PTFE+玻璃纤维.2.PTFE:真正的高频材料,聚四氟乙烯.注: Rogers生产的板材均以RO……命名.一.料号1．RT5880 DK=2.2 PTFE2．RT5870 DK=2.33 PTFE3．UL2000 DK=2.4-2.64．UL22 DK=2.2 PTFE5．RT6002 DK=2.946．RT6006 DK=6.15 可与RO3008互换使用.7．RT6010 DK=10.28．RO3003 DK=3.0------陶瓷+PTFE+玻璃纤维9．RO3203 DK=3.0210. RO3006 DK=6.15-----陶瓷+PTFE+玻璃纤维11.RO3010 DK-10.2 -----陶瓷+PTFE+玻璃纤维.12.RO3210 DK=10.2 -----陶瓷+PTFE+玻璃纤维.13.RO4003 DK=3.38------陶瓷+PTFE+玻璃纤维. (不需要做UL认证)不经PLEUSMA?14.RO4350 DK=3.48------陶瓷+PTFE+玻璃纤维不经PLEUSMA?二.CU厚1/4OZ; 1/2OZ; 1/1OZ; 2/2OZ二.常规尺寸36*48; 18*24; 18*12; 16*18;****************************************************************************************** ARLON板材1.Diclacl 系列2.Cuclacl3.Isoclacl4.AD5.陶瓷6.25N(高频)一．Diclacl 系列：522 DK= 2.4-2.6 +-0.05527 DK=2.4-2.6+-0.04870 DK=2.33880 DK=2.17 DK=2.2 (两种DK)型号: Diclacl 880 B125 55 17 (如果是1OZ,则55为11)型号介质厚度HOZ DK二. Isoclacl (无钾玻璃纤维PTFE基材—我们很少用此材料)Isoclacl : 917 DK=2.17:918 DK=2.33三.Cuclacl: 250 DK=2.4-2.6: 233 DK=2.33: 217 DK= 2.17 DK=2.2 (这种材料与Diclacl 880不同)型号表示法同Diclacl.********* ****介质厚度:10MIL/15MIL/20MIL/31MIL/62MIL/94/125.四.AD 系列AD250 DK=2.5AD270 DK=2.7AD300 DK=3.0AD320 DK=3.2AD350 DK=3.5五.AR系列AR250 DK=2.5AR270 DK=2.7AR300 DK-3.0AR320 DK-3.2AR350 DK-3.5 (可与RF-35共用,DK一样)介质厚度: 15MIL/20/24/31/47/62/93/125六:高频系列25N DK=3.38 (可与RO4003互换使用)25FR DK=3.58 (可与RO4350互换使用)尺寸:36”*36”; 36*48; 48*54; 36*72****************************************************************************************** Taconic型号表示为: TLC- 32 - 0310 - CH/CH供应商DK值介质厚CU厚CU由两种组成: ROLLEAL: …….R1R1(R表压延铜箔,1表1OZ)电解CU箔:… C1C1(C表电解铜箔, 1表1OZ)A.TL系列1.TLC :型号: TLC-27(27为介电常数) DK=2.75TLC-30(30为介电常数) DK=3.0TLC-32(32为介电常数) DK-3.2介质厚度: 14.5MIL/20/31/45/62/93/125/2502. TLE-95DK=2.95 (PTEF+无纺玻璃布)介质厚度:5.2MIL/10/20/31/62/93/1253. TLT/TLX: 主要用于天线方面DK=2.45-2.65TLT-0/TLX-0 DK=2.05TLT-9/TLX-9 DK=2.5-8/ -8 DK=2.55-7/ -7 DK=2.60-6/ -6 DK=2.65介质厚度:3.5MIL/8/10/15/20/25/31/45/624. TLY TL Y-5A DK=2.17TL Y-5 DK=2.20TL Y-3 DK=2.33介质厚度: 5MIL/10/15/20/25/31/45/62/93/125/187/250B.RF 系列(用于射频)RF30 DK=3.0 介质厚度:10MIL/11/20/30/60/125RF35 DK=3.5 介质厚度:10MIL/20/30/60 (可与AR350共用,DK一样)RF35P DK=3.5 介质厚度:2MIL/4/6/8/15/20/30RF60 DK=6.15 介质厚度:4MIL/15/25/31/50/60C. CR(陶瓷的缩写)-10DK=10.2 介质厚度:4MIL/8/11/15/25/30/47/50/62/75/100/125 CU厚: 1/4OZ; HOZ; 1OZ; 2OZ.NELTEC分为FR4/NELCO(新加坡生产) N4000/5000/7000/80000PTFE----N90000系列一.FR4/NELCO :N4000系列N4000-2 TG=140 DK-4.1-4.4 (我们常用的普通FR4板材DK=4.2-4.8)N4000-2 EF 无卤素多功能环氧树脂. TG=130 DK=4.2-4.5N4000-2 CD:多功能环氧树脂,可提高激光钻孔的可钻性.N4000-6 高TG多功能环氧TG=170 DK=4.1-4.3.N4000-6BC TG=125 DK=3.6-3.8N4000-7 低热膨胀率多功能环氧树脂. TG=155 DK=3.9-4.5N4000-7 SI(SIGNAL):信号完整性好.N4000-11: 低热膨胀率多功能环氧树脂高TG TG=175. DK=3.8-4.3N4000-13; 高速,低损耗环氧树脂TG=210, DK=3.6-3.7N4000-13 SI TG=210 DK=3.2-3.5N4000-13BC 高速低损耗环氧树脂BC料TG=210, DK=3.3-3.5N5000系列N5000BT料, 三氮树脂TG=185, DK=3.6-3.8.N7000非MDA聚亚酰氨.(用于软板).****NEC4000 系列PP106 0.05MM 2MIL1080 0.066MM 2.5MIL2114 0.09MM 3.5MIL2125 0.105MM 4.1MIL2116 0.115MM 4.5MIL2157/2165 0.15MM 6MIL7628 0.175MM 7MIL二.PTFE N9000系列NY9 220 ST 0762 CHCHDK=2.2 标准介质厚C表电解CU,H表HOZN9000 DK=3.0-3.48 TG=220NY9000NY9208 DK=2.08NY9217 DK=2.17NY9220 DK-2.2NY9233 DK=2.33NX9000NX9240 DK=2.4NX9245 DK=2.45NX9250 DK=2.5NX9265 DK=2.65NX9300 DK=3.0NX9320 DK=3.2NX9260 DK=2.6NH9000NH9294 DK=2.94NH9300 DK=3.0NH9320 DK=3.2NH9338 DK=3.38NH9348 DK=3.48NH9350 DK=3.5NH9450 DK=4.5介质厚度: 2MIL/3/4/5/6/7/8/10/12/13/14/15/16………28.。
rogoers板材资料
ROGERS（罗杰斯）板材ROGERS（罗杰斯）板材产品简介RT/duroid®5000（PTFE/random microfiber glass）该家族有两种产品：RT/duroid5870（r＝2.33）和5880（r＝2.2），是Rogers 六十年代最早的产品，其介电常数各向同性，并可以与现今发展的PTFE/woven glass材料一起选择使用。
其介电常数是所有产品中最低且有低的损耗，非常适合于很高的频率/宽带应用以使传播损耗最小，由于它吸水性极小，RT/duroid5870和5880可作为高湿度环境应用的理想选择。
（可用到40G）Ultralam®2000（PTFE/woven glass）Ultralam®2000是Rogers的PTFE/woven glass材料以提供高性能大容量商用市场，Ultralam2000仅使用1080玻璃纤维适合于高可靠应用。
RT/duroid®6000（PTFE/ceramic）这产品家族有三种，RT/duroid6006（r＝6.15）和6010（r＝10.2）材料发展于七十年代，为设计人员提供选项以减少电路板的尺寸。
较高介电常数材料使信号的波导波长更小，电路也可以做得更小。
RT/duroid6002（r＝2.94）发展引入于八十年代，材料的特点是具有优越的介电常数的温度稳定性，介电常数的热胀系数与铜箔非常一致，用以改善PTFE基材的不足。
这个产品是环境温度急剧变化场合的理想应用（宇航），由于其低的介质损耗和金属化过孔的高可靠性，可以用于较高的频率和多层板结构。
TMM®（Thermoset ceramic loaded plastic）TMM基板，TMM3（r＝3.27），TMM4（r＝4.5），TMM6（r＝6.0），TMM10（r＝9.2）和TMM10I（r＝9.8），是陶瓷与PTFE基板的完美结合。
罗杰斯电路板参数4000系列
2.5.5.5 IPC-TM-650 2.5.5.5 IPC-TM-650 2.5.17.1 IPC-TM-650 2.5.17.1 IPC-TM-650 2.5.6.2
ASTM D638
ASTM D638 IPC-TM-650 2.4.4 IPC-TM-650 2.4.39A IPC-TM-650 2.1.41 IPC-TM-650 2.4.24
计算轴转速和进刀量:
轴转速 （RPM） = 12×[表面速度 （SFM）]
π ×[钻头直径 （in） ]
进刀量 （IPM） = [ 轴转速 （RPM）] × [ 进刀量 （in/rev.）]
示例： 表面速度： 进刀量： 钻头直径： 轴转速
进刀量
400 FM 0.003” (0.08mm)/rev. 0.0295” (0.75mm)
钻孔条件:
即使在可能的情况下，也要避免钻头表面（线）速度大于500 SFM 和进刀量小于 0.002”(0.05mm).
推荐参数范围： 钻头表面速度： 进刀量： 退刀速度：
工具类型： 工具寿命：
300 - 500 SFM
(90 – 150 m/mm)
0.002” - 0.004”/rev (0.05 – 0.10 mm/rev)
＋40
＋50
Z
1.7×1010
1.2×1010
4.2×109
5.7×109
31.2 (780) 31.2 (780) Z
26,889 11,473（1664） Y （3900）
141（20.4） 175 (25.4)
Y
276（40） 255（37）
< 0.3
<0.5
聚四氟乙烯玻璃布覆铜箔板F4B—12-Rogers罗杰斯PCB
-80～+260
/小时
热膨胀数×1
≤1×10-5
收缩率
沸水中煮2小时
%
0.0001
表面绝缘电阻
500V直流
常态
M.Ω
≥1×105
恒定湿热
≥1×103
体积电阻
常态
MΩ.cm
≥1×105
恒定湿热
≥1×104
插销电阻
500V直流
常态
MΩ
≥1×106
恒定湿热
≥1×104
聚四氟乙烯玻璃布覆铜箔板F4B—1/2
本产品是根据微波电路的电性能要求，选用优质材料层压制成，它具有良好的电气性能和较高机械强度，是一种优良微波印制电路基板。
技术条件
外观
符合微波印制电路基板材料国、军标规定指标
常规板面尺寸（mm）
300×250
380×350
440×550
500×500
460×610
能
指标名称
测试条件
单位
指标数值
比重
常态
g/cm3
2.2～2.3
吸水率
在20±2℃蒸馏水中浸24小时
%
≤0.02
使用温度
高低温箱
℃
-50～+260
热导系数
千卡/米小时℃
0.8
热膨胀数
升温96℃/小时
热膨胀系数×1
≤5×10-5
收缩率
沸水中煮2小时
%
0.0002
表面绝缘电阻
500V直流
常态
M.Ω
≥5×103
表面抗电强度
常态
δ=1mm(kv/mm)
≥1.6
恒定湿热
≥1.4
Rogers高频印刷线路板产品选型指南
射频功率放大器、微带天线、卫星广播的LNB、微波通讯1和光通讯、高性能高速数字电路多层板
服务热线：40088 73266 Email: service@
About SEKORM
关于世强
成立于1993年，总部深圳，中国电子行业最优秀的半导体分销商 以帮助客户成功为最高服务宗旨，多次帮助客户实现产品创新，打破市场空白，占领市场先机 我们分销的产品全部来自欧美和日本的最具技术创新实力和拥有严苛品质管理的领先半导体原厂 我们同多家世界500强和行业龙头企业已合作多年，同时也是快速成长的新兴企业信任和选择的合作伙伴 提供新元件推荐、新技术导入、参考设计、应用咨询及方案等服务
1.44
(16) 19 (16) 19 (16) 39
7.9 (1.4)
2.2
V-0
RT/duroid 6035HTC 是
PTFE 陶瓷
0.86
24 24 47
12.3 (2.1)
3.1
V-0
RT/duroid 6010LM 是
PTFE 陶瓷
0.70
15 15 23
5.7 (1.0)
1.8
非阻燃
是
TMM® 3 碳氢化合物陶瓷
罗杰斯拥有全球领先的先进线路板材料，实现了全球有线和无线通讯电路板高频、高性能的巨大突破，主要市场包括：无 线基站，航空和国防，汽车，高速电子等。
定制材料
RT/duroid™, TMM®, XT/duroid®, ULTRALAM® 高频层压板材料
产品
介电常数, εr @ 10 GHz
(典型值)
制造过程(1)
2.90
3.14
液晶聚合物
XT/duroid® 8000 (聚醚醚酮)
ROGERS板材参数
Custom MaterialsHigh Frequency LaminatesRT/duroid®, ULTRALAM®, TMM®, XT/duroid™Commercial Grade MaterialsProductDielectric Constant,e r @ 10 GHz(Typical)Dissipation(1)FactorTAN d @ 2.5 GHz10 GHz(Typical)Thermal (2)Coefficient of e r-50°C to 150°Cppm/°C(Typical)VolumeResistivityMohm • cm(Typical)SurfaceResistivityMohm(Typical)Moisture(4)AbsorptionD48/50%(Typical) Process(1)Design(12)RO3730™PTFE Ceramic 3.00 ± 0.06 3.000.00130.0016-20101210110.04RO4730™Hydrocarbon Ceramic 3.00 ± 0.08 3.000.00230.0033+22 1.3 X 104 5.5 X 1020.13RO4533™Hydrocarbon Ceramic 3.30 ± 0.08 3.450.00200.0029+40 1.1 X 10109.9 X 1080.02RO4534™Hydrocarbon Ceramic 3.40 ± 0.08-0.00220.0030+40 1.7 X 1010 4.2 X 1090.06Antenna Grade MaterialsRO3730™, RO4500™ series, RO4730™ LaminatesPlatesAlloyMachinabilityDensity gm/cm 3Thermal ConductivityW/m/ºKCoefficient of Thermal Expansion pm/ºCAluminum 6061Poor 2.715024Brass 70/30 CartridgeGood 8.512020Copper110Fair to Good0.939017zPropertyElectrodeposited (EDC)Rolled (RLD)¼ oz (8m m)0.5 oz (18m m)1 oz. (35m m)2 oz (70m m)0.5 oz (18m m)1 oz. (35m m)2 oz.(70m m)Tensile Strength, kpsi 15334040202228Elongation, %*223381327Vol Resistivity Mohm • cm 1.66 1.62 1.62 1.78 1.74 1.74Thickness: in (mm)0.0004 (0.0102)0.0007 (0.0178)0.0014 (0.0356)0.0028(0.0711)0.0004(0.0102)0.0007(0.0178)0.0028(0.0711)High Frequency LaminatesPRODUCT STANDARD DIELECTRIC THICKNESS(WITHOUT THE CLADDING)STANDARD CLADDINGS STANDARD PANEL SIZESRT/duroid®5870 RT/duroid 58800.005" (0.127mm) ± 0.0005"0.010" (0.254mm) ± 0.0007"0.015" (0.381mm) ± 0.001"0.020" (0.508mm) ± 0.001"0.031" (0.787mm) ± 0.001"0.062" (1.570mm) ± 0.002"0.125" (3.175mm) ± 0.004"¼, ½, 1, 2 oz EDC, (8.5, 18, 35, 70m m EDC)½,1,2 oz Rolled Cu (18, 35, 70m m Rolled Cu)Thick metal AL, Cu, BR18" X 12" (457mm X 305mm)18" X 24" (457mm X 610mm)18" X 36" (457mm X 915mm)18" X 48" (457mm X 1.219m)RT/duroid 5880LZ0.010" (0.256mm) ± 0.0010.020" (0.508mm) ± 0.0010.025" (0.625mm) ± 0.00150.030" (0.762mm) ± 0.0020.040" (1.026mm) ± 0.0020.050" (1.270mm) ± 0.0030.100" (2.540mm) ± 0.005Other thicknesses available in 10mil increments.½, 1 oz EDC (18m m, 35m m EDC)12" X 18" (305 X 457mm)24" X 18" (610 X 457mm)24" X 54" (610 X 1.37m)RT/duroid 6002 RT/duroid 6202*RT/duroid 6202PR *0.005" (0.127mm) ± 0.0005"*0.010" (0.254mm) ± 0.0007"*0.020" (0.508mm) ± 0.001"*0.030" (0.762mm) ± 0.001"0.060" (1.524mm) ± 0.002"0.120" (3.048mm) ± 0.004"¼, ½, 1, 2 oz EDC, (8.5, 18, 35, 70m m EDC½,1,2 oz Rolled Cu ( 18, 35, 70m m Rolled Cu)*½, 1 oz (18, 35m m) resistive foilThick metal AL, Cu, BR18" X 12" (457mm X 305mm)18" X 24" (457mm X 610mm)18" X 36" (457mm X 915mm)18" X 48" (457mm X 1.219m)RT/duroid 6006 RT/duroid 6010LM 0.005" (0.127mm) ± 0.0005"0.010" (0.254mm) ± 0.0007"0.025" (0.635mm) ± 0.001"0.050" (1.270mm) ± 0.002"0.075" (1.905mm) ± 0.004"0.100" (2.540mm) ± 0.005"¼, ½, 1, 2 oz EDC (8.5, 18, 35, 70m m EDC)½,1,2 oz Rolled Cu (17, 35, 70m m Rolled Cu)Thick metal AL, Cu, BR18" X 12" (457mm X 305mm)not available in 0.005" (0.127mm)and 0.010" (0.254mm)18" X 24" (457 X 610mm)not available in 0.005" (0.127mm)and 0.010" (0.254mm)10" X 10" (254mm X 254mm)10" X 20" (254mm X 508mm)20" X 20" (508mm X 508mm)TMM®3 TMM 40.015" (0.381mm) ± 0.0015"0.020" (0.508mm) ± 0.0015"0.030" (0.762mm) ± 0.0015"0.060" (1.524mm) ± 0.0015"0.125" (3.175mm) ± 0.0015"½, 1, 2 oz EDC (18, 35, 70m m EDC)Thick metal AL, BR18" X 12" (457mm X 305mm)18" X 24" (457mm X 610mm)TMM 6 TMM 10 TMM 10i TMM 13i 0.015" (0.381mm) ± 0.0015"0.025" (0.635mm) ± 0.0015"0.050" (1.270mm) ± 0.0015"0.075" (1.905mm) ± 0.0015"0.100" (2.540mm) ± 0.0015"½, 1, 2 oz EDC (18, 35, 70m m EDC)Thick metal AL, BR18" X 12" (457mm X 305mm)18" X 24" (457mm X 610mm)ULTRALAM® 20000.004" (0.101mm) ± 0.00040.0101" (0.256mm) ± 0.00090.0147" (0.373mm) ± 0.0010.0190" (0.482mm) ± 0.0010.030" (0.762mm) ± 0.0010.060" (1.524mm) ± 0.002½, 1, 2 oz EDC (8.5, 18, 35, 70m m EDC)½,1,2 oz Rolled Cu (18, 35, 70m m Rolled Cu)18" X 12" (457 X 305mm)18" X 24" (457 X 610mm)18" X 36" (457 X 915mm)18" X 48" (457 X 1.219m)ULTRALAM 38500.001" (0.025mm) ± 12.5%0.002" (0.051mm) ± 12.5%0.004" (0.101mm) ± 12.5% ½, 1 oz (18, 35m m) EDC9m m very low profile reverse treat EDC foil18" X 12" (457mm X 305mm)18" X 24" (457mm X 610mm)XT/duroid™ 80000.002" (0.051mm) ± 12.5%½ (18m m) very low profile reverse treat EDC foil18" X 12" (457mm X 305mm)18" X 24" (457mm X 610mm) Prepreg and Bonding Film3001 Bonding Film Thermoplastic .0015"(0.038mm)N/A12" X 50’ Roll(304mm X 152.4m)ULTRALAM 3908 (LCP) Bond-ply .001" (0.025mm).002" (0.051mm)N/A12" X 18" (305mm X 457mm)24" X 18" (610mm X 457mm)RO3003™ Bond-ply.005" (0.127mm)N/A25.5" X 18" RO3006™/RO3010™Bond-ply.005" (0.127mm)N/A25.5" X 18"RO4450B™ Prepreg.0036" (0.091mm).004" (0.102mm)N/A12" X 18" (305mm X 457mm)24" X 18" (610mm X 457mm)48" X 36" (1.220m X 914mm)RO4450F™ Prepreg.004" (0.102mm)N/APRODUCT STANDARD DIELECTRICTHICKNESS(WITHOUT THE CLADDING)STANDARD CLADDINGS STANDARD PANEL SIZESRO3003™RO3035™*RO3203™*not available in 0.005" (0.127mm)0.005" (0.127mm) ± 0.0005"0.010" (0.254mm) ± 0.0007"0.020" (0.508mm) ± 0.001"0.030" (0.762mm) ± 0.0015"0.060" (1.524mm) ± 0.003"½, 1, 2 oz EDC (18, 35, 70m m EDC)½, 1, 2 oz Rolled Cu (18, 35, 70m m Rolled Cu)12" X 18" (305mm X 457mm)24" X 18" (610mm X 457mm)RO3006™RO3010™*RO3206™*RO3210™*not available in0.005"(0.127mm) and 0.010"(0.254mm)0.005" (0.127mm) ± 0.0005"0.010" (0.254mm) ± 0.0007"0.025" (0.635mm) ± 0.001"0.050" (1.270mm) ± 0.002"½, 1, 2 oz EDC (18, 35, 70m m EDC)12" X 18" (305mm X 457mm)24" X 18" (610mm X 457mm)*RO4003C™RO4360™0.008" (0.203mm) ± 0.001"0.012" (0.305mm) ± 0.001"0.016" (0.406mm) ± 0.0015"0.020" (0.508mm) ± 0.0015"0.032" (0.813mm) ± 0.002"0.060" (1.524mm) ± 0.004"½, 1, 2 oz EDC (18, 35, 70m m EDC)*½, 1 oz. LoPro™ reverse treated EDC foil(18, 35µm LoPro reverse treated EDC foil)LoPro foil will add .0007" (0.0177mm) to theboard thickness12" X 18" (305mm X 457mm)24" X 18" (610mm X 457mm)48" X 36" (1.220m X 914mm)RO4350B™0.0040" (0.101mm) ± 0.0007"0.0066" (0.168mm) ± 0.0007"0.010" (0.254mm) ± 0.001"0.0133" (0.338mm) ± 0.0015"0.0166" (0.422mm) ± 0.0015"0.020" (0.508mm) ± 0.0015"0.030" (0.762mm) ± 0.002"0.060" (1.524mm) ± 0.004"½, 1, 2 oz EDC(18, 35, 70m m EDC)½, 1 oz. LoPro reverse treated EDC foil(18, 35µm LoPro reverse treated EDC foil)LoPro foil will add .0007" (0.0177mm) to theboard thickness12" X 18" (305mm X 457mm)24" X 18" (610mm X 457mm)48" X 36" (1.220m X 914mm)SYRON™ 70000.002" (0.051mm) ± 12.5%½ (18mm) very low profile reverse treat EDC foil18" X 12" (457mm X 305mm)18" X 24" (457mm X 610mm) Antenna Grade LaminatesRO3730™0.030" (0.762mm) ± 0.0015"0.060" (1.524mm) ± 0.003"1 oz. Rolled Cu (35m m Rolled CU)24" X 18" (610mm X 457mm)24" X 54" (610mm X 1.37m)RO4533™0.030" (0.762mm) ± 0.002"0.040" (1.016mm) ± 0.002"0.060" (1.524mm) ± 0.004"½, 1 oz EDC (18, 35m m EDC)12" X 18" (305mm X 457mm)24" X 18" (610mm X 457mm)48" X 36" (1.220m X 914mm)0.0307" (0.780mm) ± 0.002"0.0407" (1.034mm) ± 0.002"0.0607" (1.542mm) ± 0.004"½, 1 oz. LoPro reverse treated EDC foil (18, 35m m LoPro reverse treated EDC foil)RO4534™0.032" (0.813mm) ± 0.002"0.040" (1.016mm) ± 0.0020.060" (1.524mm) ± 0.004"½, 1 oz EDC (18, 35m m EDC)12" X 18" (305mm X 457mm)24" X 18" (610mm X 457mm)48" X 36" (1.220m X 914mm)0.0327" (0.831mm) ± 0.002"0.0407" (1.034mm) ± 0.002 0.0607" (1.542mm) ± 0.004"½, 1 oz. LoPro reverse treated EDC foil (18, 35m m LoPro reverse treated EDC foil)RO4535™0.030" (0.762mm) ± 0.002"0.040" (1.016mm) ± 0.002"0.060" (1.524mm) ± 0.004"½, 1 oz EDC (18, 35m m EDC)12" X 18" (305mm X 457mm)24" X 18" (610mm X 457mm)48" X 36" (1.220m X 914mm)RO4730™0.0327"(0.831mm) ± 0.002"0.0607"(1.542mm) ± 0.004"½, 1 oz. LoPro reverse treated EDC foil(18, 35m m LoPro reverse treated EDC foil)12" X 18" (305mm X 457mm)24" X 18" (610mm X 457mm)48" X 36" (1.220m X 914mm)High Frequency LaminatesOther dielectric thicknesses and panel sizes may be available. Contact customer service.11Ordering Information:GRADE:Laminates - RT/duroid ® 5870, 5880, 6002, 6202, 6202PR, 6006, 6010LM, ULTRALAM ® 2000, ULTRALAM 3000, TMM ® 3,4,6,10, and 10i, XT/duroid™, SYRON™, RO3003™, RO3035™, RO3203™, RO3006™, RO3206™ RO3010™, RO3210™, RO4003C™, RO4360™ and RO4350B™ high frequency laminates. Bonding Film -3001 Prepreg - RO3003, RO3006, RO3010, RO4403™, RO4450B™, RO4450F™ and RT/duroid 6002.THICKNESS AND TOLERANCE:Laminate thickness is normally specified as the dielectric thickness without copper cladding. Custom tolerances are available on RT/duroid laminates upon request.TYPE OF FOIL CLADDING:¼, ½, 1, 2 oz. electrodeposited copper foil, ½, 1, 2 oz. rolled copper foil. TMM and RO4000® series laminates are not supplied with ¼ oz. electrodeposited or rolled copper foil. Some material grades may be supplied unclad. Call Rogers’ Customer Service Representatives for unclad options.Thick aluminum, copper and brass claddings are available on Rogers RT/duroid laminates. Thick aluminum and brass claddings are available on most TMM laminates. Thick metal cladding is not available on RO4000 laminates. Thick aluminum, copper, and brass claddings are also available in a range of thicknesses and thickness tolerances. Other thick metal backings are available upon request.SPECIFICATION REQUIREMENTS:Standard specifications are Rogers’ material specifications. Certificates of conformance are available.All other requirements must be identified at the time the order is placed. If special testing or data generation is required, additional costs may be incurred.AbOUT ADvANCED CIRCUIT MATERIALSIn our Advanced Circuit Materials Division, we manufacture high frequency laminates and prepregs for applications in the wireless base station, aerospace and defense, automotive, high-speed digital and advanced chip packaging industries. All of our products are manufactured in an ISO-9001:2008 certified facility with "ahead of the curve" process technology.OUR CUSTOMERSOur customers include Original Equipment Manufacturers (OEM) and printed circuit board fabricators (from quick-turn prototype shops to high volume corporations) for advanced electronic applications. We serve customers around the globe withmanufacturing facilities and customer support in Asia, Europe, and North America.HOw wE wORK wITH YOUWe work closely with your product designers to anticipate rapidly changing needs and technological advances, and we manufacture products to your exact performance requirements. We provide all the necessary training and technical support to ensure that our materials work in your processes. We are committed to helping you meet intense competition with unique high-performance solutions.Rogers’ high frequency laminates can be purchased by contacting a Rogers' Customer Service Representative at (480) 961-1382 or one of our international offices.To ensure you receive the material for your application, please include order information for each of the categories listed below. For more detailed product information, refer to the charts in this product selector guide.12For Rogers Ordering Terms and Conditions go to /pages/termsconditions.aspxThe information contained in this product selector guide is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular purpose. The user should determine the suitability of Rogers’ circuit materials for each application.These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.LoPro, SYRON, XT/duroid, RT/duroid, ULTRALAM, TMM, RO2808, RO3000, RO3003, RO3006, RO3010, RO3035, RO3200, RO3203, RO3206, RO3210, RO3730, RO4003C, RO4350B, RO4360, RO4500, RO4533, RO4534, RO4535, RO4403, RO4450B, RO4450F , RO4730, RO4000, The world runs better with Rogers. and the Rogers' logo are licensed trademarks of Rogers Corporation.TCR is a licensed trademark of JX Nippon Mining & Metals Corporation. Ticer Technologies is the licensee of the technology and trademark of TCR ®.OhmegaPly is a registered trademark of Ohmega Technologies.© 1987, 1991, 1994, 1995, 1999, 2001, 2002, 2004, 2005, 2007, 2008, 2010 All Rights Reserved. Printed in USA. Revised 11/2010 0929-1110-15.0SLN Publication #92-601Contact Information:USA: Rogers Advanced Circuit Materials, ISO 9002 certified Tel: 480-961-1382 Fax: 480-961-4533Belgium: Rogers BVBA - Belgium Tel: 32-9-2353611 Fax: 32-9-2353658Japan: Rogers Japan Inc. Tel: 81-3-5200-2700 Fax: 81-3-5200-0571Taiwan: Rogers Taiwan Inc. Tel: 886-2-86609056 Fax: 886-2-86609057Korea:Rogers Korea Inc.Tel: 82-31-291-3660 Fax: 82-31-291-3610Singapore: Rogers Technologies Singapore Inc. Tel: 65-747-3521 Fax: 65-747-7425China: Rogers International Trading Co., Ltd (Shanghai Office) Tel: 86-21-62175599 Fax: 86-21-62677913China: Rogers International Trading Co., Ltd (Beijing Office) Tel: 86-10-5820-7667Fax: 86-10-5820-7997China:Rogers International Trading Co., Ltd (Shenzhen Office)Tel: 86-755-8236-6060 Fax: 86-755-8236-6123VIew The LATeSTPrOduCT OFFerInGSFollow these 3 simple steps:1 | O n your mobile phone, go to web sitehttp://gettag.mobi 2 | D ownload the free application for yourspecific phone type 3 | O pen the app and snap a picture of theQR Tag to the right You can also go directly to www.tagrog.mobiTo receive the latest version of Rogers' impedance calculator, go to the following website: /acm/downloads/mwi。
RO4835T芯板 RO4450T粘结片多层板加工指南说明书
RO4835T™芯板 / RO4450T™粘结片多层板加工指南本加工指南是为RO4835T™ 芯板及与RO4450T™粘结片使用铜箔压合工艺制作多层线路板（PWB）提供基本的加工信息。
本加工指南同样适用于RO4000®系列芯板做多层板加工。
存储：RO4835T层压板和RO4450T粘结片，当两面都覆金属层时，可以在室温下储存（50-90°F/ 10-32°C）。
建议采用“先进先出”的库存系统，并且从PWB制程到成品交付都记录板材的批号。
内层制作：工具孔：RO4835T板材能兼容多种对位系统。
根据加工长的能力和产品的对位要求来选择相应的对位孔，如圆形或方形定位销、标准或多行定位孔、蚀刻前或蚀刻后冲孔等。
通常方形定位销配合多行定位孔，采用蚀刻后冲孔的方式能满足大多数客户的需求。
图形转印的表面处理和蚀刻工序：图形转印的前处理运用的化学工艺通常包括清洗、微蚀、水洗和烘干等步骤。
根据压合后的厚度，机械磨板方法也可以用于积层法压合后的次外层芯板的表面处理。
RO4835T板材能兼容能兼容大多数的液态感光膜和干膜，图形转印后，可以与FR-4一样的显影、蚀刻和褪膜（DES 拉）等制作流程。
为了提升多层板对位控制，OPE冲孔流程是首选。
氧化处理：RO4835T板材能兼容任何一种氧化或氧化替代法的工艺对铜箔表面进行处理。
根据芯板的厚度和设备的能力，非常薄的内层芯板过水平氧化线时，可能会用到牵引板支撑。
压合：RO4835T板材能兼容任所有的Ro4400粘结片，但是更好的是与RO4450T粘结片匹配压合。
为了达到最好的外层铜箔附着力， 需要使用CU4000™ & CU4000 LoPro铜箔与之配合，CU4000™ & CU4000 LoPro 铜箔可以从罗杰斯公司购买获得，它适用于所有铜箔压合的多层板结构。
钻孔：RO4835T芯板，以及与Ro4450T粘结片压合的多层板都适用于UV和CO2镭射工艺制作微盲孔及通孔。
浅谈PCB高频板、板材材料及高频参数
浅谈PCB高频板、板材材料及高频参数摘要：随着通讯和计算机技术的迅速发展，对印制板技术的研发提出了越来越高的要求，系统工作频率从MHz频段向GHz频段转移，其所追求的即是信息处理的高速化、存储容量的海量化以及系统能耗的绿色化。
在这一发展方向下，作为海量信号载体的高频印制电路板应运而生，并承担着信息传输的艰巨任务。
主要对PCB高频板的定义与特点、常见板材类型和复介电常数进行了简单的论述。
关键词：PCB高频板；板材类型；复介电常数1.引言伴随着信息化的高速发展，计算机、无线通信、数据网络等已经融入到了我们生活中的方方面面。
电子设备高频化是发展趋势，尤其在无线网络、卫星通讯的发展过程中，信息产品走向高速与高频化，通信产品走向容量大速度快的无线传输，因此每一代新产品的诞生都离不开高频板。
2.PCB高频板2.1PCB高频板的定义高频板是指电磁频率较高的特种线路板，用于高频率（频率大于300MHz或者波长小于1米）与微波（频率大于3GHz或者波长小于0.1米）领域的PCB，是在微波基材覆铜板上利用普通刚性线路板制造方法的部分工序或者采用特殊处理方法而生产的电路板。
一般来说，高频板可定义为频率在1GHz以上线路板。
2.2PCB高频板的特点2.2.1效率高介电常数小的高频电路板，损耗也会很小，而且先进的感应加热技术能够实现目标加热的需求，效率非常高。
当然，注重效率的同时，也有环保的特性，十分适合当今社会的发展方向。
2.2.2速度快由于传输速度与介电常数的平方根成反比，那么介电常数越小，传输速度就越快。
这正是高频电路板的优点所在，它采用特殊材质，不仅保证了介电常数小的特性，还保持运行的稳定，对于信号传导来说非常重要。
2.2.3可调控度大高频电路板广泛应用于各个行业。
如对精密金属材质加热处理需求的高频电路板，在其领域的工艺中，不仅可实现不同深度部件的加热，而且还能针对局部的特点进行重点加热，无论是表面还是深层次、集中性还是分散性的加热方式，都能轻松完成。
罗杰斯 RO3000 和 RO3200 系列高频板加工指南说明书
RO3000® 和RO3200™ 系列高频板带状线和多层线路RO3003™、RO3003G2™、RO3006™和RO3010™覆铜板是添加了填料的PTFE复合材料，具有优异的热稳定性和电气性能，并且可提供多种介电常数。
RO3000®系列没有玻璃布强化，所以具有很好的均质特性。
RO3203™、RO3206™、和RO3210™有玻璃布增强， 提供相近的热性能和电气性能， 它通过玻璃布的强化来改善操作与对位的控制。
RO3000和RO3200™系列产品与用PTFE材料设计的双面和多层板的加工工艺一致。
本文提供用RO3000和RO3200系列覆铜板设计的双面和多层板的加工基本信息。
如需要了解更详细的加工信息，请联系罗杰斯技术服务工程师或销售代表。
存储: RO3000和RO3200系列覆铜板可以在常温环境下长期储存。
建议采用“先进先出”的库存管理原则，这样从PCB制程到交付的成品板都可以追溯原材料的批号。
储存在原始出货的纸箱内：1) 将纸板箱叠放在安全的水平地面上，并需要远离设备运输通道。
纸板箱之间避免垂直堆叠放置。
2) 垂直堆叠放置时不能超过5箱，避免最底层的包装箱承受过大的压力。
覆铜板从纸板箱中取出后的储存：1) 薄的覆铜板是用密封的塑封袋包装，厚的覆铜板用塑料薄膜保护铜箔表面。
这些包装材料能防止金属层的氧化和腐蚀，以及机械损伤 (如刮痕、凹点、凹坑等)，故储存时不能拆除这些包装。
对于RO3000系列的厚铜基材，其厚铜层是没有用抗氧化膜保护。
因此，在存储期间，特别是在温度和湿度升高的条件下，RO3000系列厚铜基材铜表面会因为氧化问题而引起一些变色。
这种氧化在经过PCB 标准制作流程中，可以通过机械磨刷（去披锋）或化学方式（微蚀）正常去除。
2) 将板子垂直插入插架内，这样能降低金属表面受损的风险。
3) 如果没有条件垂直放置：A ) 储存架必须要足够平整、光滑和干净；B ) 储存架要大于板面的面积；C ) 覆铜板表面要保持干净；D ) 确保储存架承受的力小于50磅/平方英尺；E ) 板与板之间需要用柔软的无摩擦的隔垫隔开。
罗杰斯 高频板材
Advanced Circuit Materials Division100 S. Roosevelt Avenue, Chandler, AZ 85226Tel: 480-961-1382 Fax: 480-961-4533 RO4400™Series Prepreg Data SheetRO4450B ™and RO4450F ™ PrepregRO4000® dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a performance upgrade of standard FR-4 multi-layer designs. RO4003C ™, RO4350B ™ , and RO4000 LoPro ™ glass reinforced hydrocarbon/ceramic laminates have been used in layers where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials. FR-4 cores and prepreg are still commonly used to inexpensively form less critical signal layers.The RO4400™ prepreg family is comprised of four grades based on the RO4000 series core materials, and are compatible in multi-layer constructions with either RO4003C, RO4350B or RO4000 LoPro laminates. A high post-cure Tg (>280°C / >536°F ) makes RO4400 series prepreg an excellent choice for multi-layers requiring sequential laminations as fully cured RO4400 prepregs are capable of handling multiple lamination cycles. In addition, FR-4 compatible bond requirements (177°C/350°F) permit RO4400 prepreg and low flow FR-4 prepreg to be combined into non-homogenous multi-layer constructions using a single bond cycle.RO4450F ™ prepreg has demonstrated improvement in lateral flow capability, and is becoming the first choice for new designs or as a replacement in designs that have difficult fill requirements.Each of the RO4450B and RO4450F prepregs are recognized by Underwriter Laboratories with the UL-94 flame rating, and are compatible with lead-free processes.The information contained in this data sheet and processing guide is intended to assist you in designing with Rogers ’ circuit materials and prepreg. It is not intended to and does not create any warranties, express or implied, including any warranty of merch antability or fitness for a particular purpose or that the results shown on this data sheet and processing guide will be achieved by a user for a particular purpose. The user is responsible for determining the suitability of Rogers’ circuit materials and prepreg for each application.Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based materials. The rate of change increases at higher temperatures and is highly dependent on the circuit design. Although Rogers’ high freq uency materials have been used successfully in innumerable applications and reports of oxidation resulting in performance problems are ex tremely rare, Rogers recommends that the customer evaluate each material and design combination to determine fitness for use over the entire life of the end product.These commodities, technology and software are exported from the United States in accordance with the Export Adm inistration regulations. Diversion contrary to U.S. law prohibited.The world runs better with Rogers. and the Rogers' logo are licensed trademarks of Rogers Corporation.RO4000, RO4400, RO4003C, RO4350B, RO4450B, RO4450F and LoPro are licensed trademarks of Rogers Corporation .© 1999, 2003, 2004, 2005, 2006, 2007, 2008, 2009, 2010, 2011, 2012 Rogers Corporation, Printed in U.S.A, All rig hts reserved.Revised 01/30/2012 -0112-CC Publication #92-150Rogers UL file number is E102763B.For specification values contact Rogers Corporation.。
罗杰斯公司(Rogers泡棉材料PORON 手机应用精品PPT课件
D eflectio n (% )
83
70 80 70 85
60 73 60 80 73 33 73 80
40 60 40 60 70 60 70 70 70 43 76 51 80 62
20 47 20 47 60 47 60 60 60 68 25 34 73 49 62
33 50 33 33 50 50 50 60 67 18 37 52 47 58
手机中的应用
闪光灯垫圈 FPC压合 连接器压合 侧键 元器件支撑 插孔密封 马达减震 遮光 内置天线衬垫
电池衬垫 • 92 • 30
填隙方案 (Gap Filling)
扣合力
• LCD垫圈扣合力在0.07N/mm2左右，其他应用需 视具体要求而定，一般应大于该值
压缩比
• 建议在30％－80%之间
间隙(Gap)公差
0 .7 5 1 .0 0 1 .0 0 1 .0 0 1 .0 0 1 .2 4 0 .7 9 1 .5 0 1 .0 4 0 .9 4 1 .1 9 1 .6 3
1 .0 0 1 .0 0 1 .0 0 1 .0 0 0 .9 4 1 .2 4 1 .5 0 1 .0 4 1 .1 9 1 .6 3
手机常用的级别： 15, 92, 30
产品描述
4701-92-12020-04P
市场代码
4701 General - Resilient 4790 General – Slow Rebound
罗杰斯公司 RT duroid
产品安全信息表1.材料（制剂）和公司（企业）的正式名称商品名：RT/duroid 6006 及 6010 层压板化学分类：聚四氟乙烯复合材料HMIS 等级：H 1F1R0物品用途 印刷电路板发布日期：2014 年 3 月 13 日公司（企业）的正式名称：罗杰斯公司 (Rogers Corporation)100 South Roosevelt AvenueChandler, AZ 85226-3415电话：001-480-961-1382传真：001-480-961-4533电子邮件：******************************2.危害识别材料分类：NE标签要求：NE过度暴露影响：正常操作下无预期危害。
加工会产生粉尘。
在超过分解温度的条件下加工材料会释放有害烟雾。
吸入：粉尘会刺激呼吸系统。
暴露于铜尘或 PTFE分解产物会引起金属或聚合物烟热症状。
以流感样症状（发热、寒颤、肌肉疼痛）为特征，约持续 24 小时。
眼睛接触：粉尘会引起机械性刺激。
皮肤接触：粉尘会引起机械性刺激。
吞食：未知。
慢性危害：IARC 将微纤玻璃列为“2B 类”（疑似人体致癌性）。
3.原料成分/信息该材料根据 20 CFR 1910.1200 和 REGULATION (EC) N° 1907/2006 生产，因此不属于《危害沟通标准》及 REACH 范畴内。
在正常使用状况下该材料不会释放有害化学物质，因此无需《安全数据说明书》。
化学品名称CAS 编号欧洲现有商业化学物质名录/欧洲已通报化学物质名录%OSHA容许接触限值ACGIH最高浓度阈限值欧盟分类微纤玻璃（包封在某个聚合物基体内）65997-17-3266-046-0有所不同5毫克/立方米（呼吸型粉尘）1f/cc（电容量）根据 67/548/EEC 未分类二氧化钛13463-67-7236-675-5有所不同15毫克/立方米（总粉尘量）10毫克/立方米（总粉尘量）根据 67/548/EEC 未分类第1铜7440-50-8231-159-6有所不同1毫克/立方米（粉尘和烟雾）1毫克/立方米（粉尘和烟雾）根据 67/548/EEC 未分类铝7429-90-5231-072-3有所不同5毫克/立方米（呼吸型粉尘）1毫克/立方米（呼吸型粉尘）根据 67/548/EEC 未分类（仅有铝粉末分类）4.急救措施吸入：（粉尘和烟雾）移至空气新鲜处。
罗杰斯板材4350data sheet
RO4000® SeriesHigh Frequency Circuit MaterialsRO4000® Series High Frequency Circuit Materials are glass reinforced hydrocarbon/ceramic laminates (Not PTFE ) designed for performance sensitive, high volume commercial applications.RO4000 laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR4) processes offered at competitive prices.The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. RO4000 material possesses the properties needed by designers of RF Microwave circuits. Stable electrical properties over environmental conditions allow for repeatable design of filters, matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4000 series material to be used in many applications where higher operating frequencies limit the use of conventional circuit board laminates. The temperature coefficient of dielectric constant is among the lowest of any circuit board material (Chart 1),making it ideal for temperature sensitive applications. RO4000 materials exhibit a stable dielectric constant over a broad frequency range (Chart 2). This makes it an ideal substrate for broadband applications.RO4000 material's thermal coefficient of expansion (CTE) provides several key benefits to the circuit designer. The expansion coefficient of RO4000 material is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multilayer board constructions. The Z-axis CTE provides reliable plated through-hole quality,even in severe thermal shock applications. RO4000 series material has a Tg of >280°C (536°F)so its expansion characteristics remain stable over the entire range of circuit processing temperatures.RO4000 series laminates can easily be fabricated into printed circuit boards using standard FR4circuit board processing techniques. Unlike PTFE based high performance materials, RO4000series laminates do not require specialized processes such as sodium etch. This material is a rigid laminate that is capable of being processed by automated handling systems and scrubbing equipment used for copper surface preparation.RO4003 laminates are currently offered in two styles, which indicate the type of glass reinforcement used.Style A - The original RO4003 product configuration. All plies utilize 1080 glass reinforcement.Style C - Coarser 1675 glass reinforcement is used for some plies, while 1080 glass is usedas required to meet overall thickness requirements. Some dielectric thicknesses may not be available in Style C.Regardless of the style chosen, all electrical properties are held constant. RO4003 Style C exhibits improved dimensional stability and flatnessRO 1.4000DATARogers CorporationMicrowave Materials DivisionHigh FrequencyCircuit MaterialsRO 1.4000Page 2 of 4RO4000® Series Laminate Product Information:YT R E P O R P S L A C Y T E U L A V I P NO I T C E R I D ST I N U NO I T I D N O C T S E T DO H T E M 3004O R 0534O R c i r t c e l e i D t n a t s n o C εr 83.3±50.084.3±50.0Z_C32/z H G 01056-M T -C P I 5.5.5.2n o i t a p i s s i D r o t c a F 7200.00400.0Z -C32/z H G 01056-M T -C P I 5.5.5.2l a m r e h T fo t n e i c i f f e o C εr 04+05+Z C /m p p C052o t C 001-056-M T -C P I 5.5.5.2e m u l o V y t i v i t s i s e R 01x 7.10101x 2.101-M ΩAD N O C 056-M T -C P I 1.71.5.2e c a f r u S y t i v i t s i s e R 01x 2.4901x 7.59-M ΩA D N O C 056-M T -C P I 1.71.5.2l a c i r t c e lE h t g n e r t S 6.52)056(5.13)008(Zm m /V K )l i m /V (m m 15.0)"020.0(056-M T -C P I 2.6.5.2e l i s n e T s u l u d o M 988,62)0093(374,11)4661(Ya P M )i s p k (TR 836D M T S A e l i s n e T h t g n e r t S 141)4.02(571)4.52(Y s P M )i s p k (T R 836D M T S A l a r u x e l F h t g n e r t S 672)04(552)73(-a P M )i s p k (-056-M T -C P I .4.4.2l a n o i s n e m i D y i t l i b a t S 3.0<5.0<Y ,X m /m m )h c n i /s l i m (h c t e r e t f A 051/2E +056-M T -C P I 42.2t n e i c i f f e o C l a m r e h T f o no i s n a p x E 114164416105X Y Z C /m p p C882o t 55-056-M T -C P I 1.4.1.2g T 082>082>-C -AM T l a m r e h T y t i v i t c u d n o C 46.026.0-K /m /W C 001334F M T S A c i f i c e p S yt i v a r G 97.168.1--C 32297D M T S A r e t a W no i t p r o s b A 60.060.0-%.s r h 84n o i s r e m m i e l p m a s "060.0er u t a r e p m e T C 05075D M T S A l e e P r e p p o C h t g n e r t S 50.1)0.6(88.0)0.5(-m m /N )i l p (ta o l f r e d l o s r e t f a 056-M T -C P I 84.2yt i l i b a m m a l F A/N O-V 49L U ----RO 1.4000Page 3 of 4Chart 1: RO4000 Series Materials Dielectric Constant vs. TemperatureChart 2: RO4000 Series Materials Dielectric Constant vs. Frequency1.0081.0061.0041.0021.0000.9980.9960.9940.9920.9900.988-50 -30 -10 10 30 50 70 90 110 130 150RO4003RO4350PTFE/Woven GlassT emp˚CE r (T )E r (25)1.071.061.051.041.031.021.0110.990.980 2.5 5 7.5 10RO4003RO4350FR4Chart 3: Microstrip Insertion Loss(0.030" Dielectric Thickness)Ordering Information:Standard Thicknesses and Tolerances:RO4003 Materials:RO4350 Materials:0.0080 ± 0.0010 (0.20 ± 0.03 mm)0.0100 ± 0.0010 (0.25 ± 0.03 mm)0.0200 ± 0.0015 (0.51 ± 0.04 mm)0.0200 ± 0.0015 (0.51 ± 0.04 mm)0.0320 ± 0.0020 (0.81 ± 0.05 mm)0.0300 ± 0.0020 (0.76 ± 0.05 mm)0.0600 ± 0.0040 (1.52 ± 0.10 mm)0.0600 ± 0.0040 (1.52 ± 0.10 mm)Standard Claddings:½ ounce (17 µm) electrodeposited copper.1 ounce (35 µm) electrodeposited copper.Standard Panels Sizes:The standard panel sizes are 24 x 18" (610 x 457 mm) and 12 x 18" (305 x 457 mm).Information on other thicknesses, claddings and panels sizes available call your CustomerRO4003 and RO4350 are licensed trademarks of Rogers Corporation for its microwave laminate.The above data represents typical values, not statistical minimums. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular purpose. The relative merits of materials for a specific application should be determined by your evaluation.Rogers CorporationMicrowave Materials DivisionISO 9002 CERTIFIED© 1995 ,1996, 1997, 1999 Rogers Corporation Printed in U.S.A.Revised 2/99 2260-029-10.0-ON。
rogers 的标准厚度
rogers 的标准厚度Rogers 的标准厚度。
在电子产品设计和制造中，材料的选择至关重要。
对于 PCB 材料来说，Rogers 板材因其优异的性能而备受青睐。
在选择 Rogers 板材时，标准厚度是一个至关重要的因素。
本文将介绍 Rogers 板材的标准厚度，以帮助您更好地了解如何选择适合您项目的板材厚度。
Rogers 板材的标准厚度通常包括 10mil、20mil、30mil、60mil 等。
每种厚度都有其特定的应用领域和优势。
首先，10mil 的薄型板材适用于要求轻薄的应用场景，如手机、平板电脑等电子产品。
其优势在于重量轻、体积小，能够满足现代电子产品对轻薄化的需求。
其次，20mil 的中厚板材适用于一般的电子产品设计，如通信设备、射频模块等。
20mil 的中厚度既能满足一般电子产品的要求，又不至于过于薄弱。
再次，30mil 的厚型板材适用于对机械强度要求较高的应用场景，如汽车电子、航空航天等领域。
30mil 的厚度能够提供更好的机械支撑和抗震能力，适合在恶劣环境下使用。
最后，60mil 的超厚板材适用于特殊要求的应用场景，如高功率应用、高频应用等。
60mil 的超厚度能够提供更好的散热和功率承受能力，适合在高功率、高频率的场景下使用。
在选择 Rogers 板材的标准厚度时，需要根据具体的应用场景和需求来进行选择。
首先，需要考虑产品的尺寸和重量要求。
如果产品对轻薄化有较高要求，可以选择薄型的 10mil 板材；如果产品对机械强度有较高要求，可以选择厚型的 30mil板材。
其次，需要考虑产品的工作环境和工作条件。
如果产品需要在恶劣环境下使用，如高温、高湿、高压等条件下，可以选择更厚的板材来提供更好的机械支撑和环境适应能力。
最后，需要考虑产品的性能要求。
如果产品需要在高功率、高频率下工作，可以选择超厚的 60mil 板材来提供更好的散热和功率承受能力。
总的来说，Rogers 板材的标准厚度是根据不同的应用场景和需求来进行选择的。
陶瓷板参数
型号 RO4350 RO4350 RO4350 25FR 25FR 25FR
规格（铜厚/板厚） 1/1OZ 0.51± 0mm 1/1OZ 0.762± 0.08mm 1/1OZ 1.52± 0mm 0.305mm 1/1oz、h/hoz 0.508mm 1/1oz、h/hoz 0.762mm 1/1oz、h/hoz
材料特性 陶瓷填充碳氢化合物材料 陶瓷填充碳氢化合物材料 陶瓷填充碳氢化合物材料 陶瓷填充碳氢化合物材料 陶瓷填充碳氢化合物材料 陶瓷填充碳氢化合物材料
加工难点 材料较脆，加工工艺与常规FR-4加工相近 材料较脆，加工工艺与常规FR-4加工相近 材料较脆，加工工艺与常规FR-4加工相近 材料较脆，加工工艺与常规FR-5加工相近 材料较脆，加工工艺与常规FR-6加工相近 材料较脆，加工工艺与常规FR-7加工相近
可替代材料 ARLON 25FR ARLON 25FR ARLON 25FR RO4350、RF-35、AD350 RO4350、RF-35、AD350 RO4350、RF-35、AD350
大料尺寸 18*24inch 18*24 18*24 18*24 18*24 18*24
DK 3.48 3.48 3.4 0.004 0.0035 0.0035 0.0035
使用频率 10G 10G 10G 10G 10G 10G
备注： 1.普通导热:耐热性288度以下,热传导率1W/mk以下; 2.高导热:耐热性288度以上,热传导率大于1W/mk;
罗杰斯公司产品介绍说明书
EngineeredMaterialSolutionsFOCUSED ON INNOVATIONLeading your designchallenges to theperfect solutionChip Scale Packaging.at the local level.application needs and environments. Rogers’application anddevelopment process.already best in class, enables us to anticipatequestions and work collaborativelyto push the materialperformance envelope.Join Our TechnologySupport Hub Today& Access Online Tools:Instructional Videos• Fabricator Focused Learning Series• Coonrod’s Corner• Webinars• 5G VideosTechnical Articles• Extensive database of articles and whitepapersTools• Interactive Product Properties Tool• Resonator Calculator• Microwave Impedance Calculator• Dk Calculator• Conversion Calculator/techubContact InformationThe Americas Rogers Corporation 480-961-1382Europe/Africa Rogers BV 32-9-2353611Asia Rogers Suzhou 86-512-6258-2872© 2022 Rogers Corporation. All Rights Reserved. PUB 92-606, 1571 060722The Rogers’logo, RT/duroid, RO3000, RO4000, CLTE, CuClad, DiClad, IsoClad, RO4725JXR,MAGTREX, Radix, curamik, COOLSPAN, TC300, TC600 and TMM are trademarks of RogersCorporation or one of its subsidiaries.RF/HIGH RELIABILITY LAMINATESModern Aerospace and Defense systems rely on high performance and high reliability materials toachieve peak performance in demanding mission critical applications. Rogers is the leader in high reliability /high performance / high frequency PCB laminate solutions. • RT/duroid® 5000 and RT/duroid 6000 product families • R O3000®, CLTE™, CuClad®, DiClad® and IsoClad® PTFE based systems • R O4000® thermoset systems, including RO4725JXR™, low Dk thermoset laminate, the lowest in the industry• Cladding includes copper, and heavy metal backed options • Compatible bondply and prepreg materialsFOR MORE DETAILED INFORMATIONScan the QR code to view our Product Selector GuideRADOME & RF TRANSPARENT WINDOWSRogers is the leading supplier of low loss PTFEmaterials used in RF Transparent windows and high performance Radome systems. • A blative solutions in high speed / high velocity systems• Molded and shaped dielectric composites • Metallized options available• RF Transparent materials for use in WindowsANTENNA SOLUTIONSRogers’ advanced material developments are leading performance enhancements to many antenna solutions. Rogerssupports customers from the idea phase through production and have referencedesigns to accelerate customer design cycles. • M AGTREX® Magnetodielectric System, enables miniaturization with 6x the bandwidth• RT/duroid 5000 and RT/duroid 6000 PTFE systems• RO3000, CLTE, CuClad, DiClad and IsoClad PTFE based systems • RO4000 thermoset systems• Radix™ 3D Printable Dielectric SystemsADVANCED MATERIALSRogers curamik® product suite offers best-in-class metallized ceramic substrates that enable higher power efficiency. Our curamik substrates consist of pure copper bonded or brazed to a ceramic substrate and are designed to carry higher currents, provide higher voltage isolation and operate over a wide temperature range. • D BC (Direct Bond Copper) available on AlN, Al2O3, HPS substrate circuit solutions - curamik Thermal - curamik Power - curamik Endurance - curamik Power Plus • A MB (Active Metal Brazed) copper available on Si3N4 ceramic substrates - curamik PerformanceAdvanced materials with high reliability under extreme conditions, critical for aerospace, commercial aircraft and defense applications.For decades, design engineers have relied on Rogers’ ad-vanced materials to enable commercial aircraft and aerospace and defense systems, even in the harshest conditions. Today, our high reliability, high performance solutions can be found in the majority of the world’s commercial and military aircraft. Look to Rogers for high frequency circuit materials for radar and navigation systems, ceramic substrates and laminated busbars that improve performance and dissipate heat, and gasketing solutions for extreme sealing and protection.• Ultra Low Loss Laminates and Dielectrics • High Thermally Conductive Materials • Advanced Thermal Control Solutions• Magnetodielectric Materials for Antenna Miniaturization • Ablative and RF Transparent Materials for Radomes and Windows • 3D Additive Manufacturing Low Loss, High Dk Resin Systems • Advanced Phased Array Material Systems• Formed and Shaped Dielectric Systems with Metallization SolutionsTHERMAL MANAGEMENTThermal management is a critical element in the design and manufacturing of printed circuit boards (PCBs) for a wide range of applications. Quite simply, heat can be destructive. The more effectively heat is dissipated through and from a PCB, the better the opportunity for a long, reliable operating lifetime of that PCB. • curamik micro-channel coolers • C OOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) • T C300™ and TC600™ series high thermal conductivity PTFE solutions • R T/duroid 6035HTC and other high thermal conductivity solutionsSPECIALTY DIELECTRICSRogers’ specialty dielectrics include Radix 3D printable dielectrics and TMM® (Thermoset Microwave Material) moldable shaped thermoset materials. • R adix 3D Printable dielectric expands design windows allowing unique spatially variant dielectric constant solutions such as Lenses and Radomes • T MM systems with Dk ranges from ~3-~13. Material is moldable and shapable into unique configurations for Radome, Windows and other high frequency applications • R adix and TMM materials are compatible with various metallization solutions。
Rogers罗杰斯板材技术参数
3.27±0.032
0.0020
3x109
0.04
0.70
16
16
20
1.78
5.7 (1.0)
N/A
4.50±0.045
0.0020
6x108
1x109
0.010
0.70
14
14
20
2.07
5.7 (ቤተ መጻሕፍቲ ባይዱ.0)
N/A
6.00±0.080
0.0023
1x108
1x109
0.06
0.72
16
16
20
2.37
阻燃 等级
UL 94V-0
标准厚度
in.(mm) 0.127/0.254/0.381/0.508/ 0.787/1.575/3.175(mm) 0.127/0.254/0.381/0.508/ 0.787/1.575/3.175(mm) 0.101/0.256/0.373/ 0.482/0.762/1.524(mm) 0.127/0.254/0.381/0.508/ 0.762/1.524/3.048(mm) 0.254/0.635/1.270/ 1.905/2.540(mm) 0.254/0.635/1.270/ 1.905/2.540(mm) 0.381/0.508/0.762/ 1.524/3.175(mm) 0.381/0.508/0.762/ 1.524/3.175(mm) 0.381/0.635/1.270/ 1.905/2.540/3.175(mm) 0.381/0.635/1.270/ 1.905/2.540/3.175(mm) 0.381/0.635/1.270/ 1.905/2.540/3.175(mm) 0.203/0.508/ 0.813/1.524(mm) 0.101/0.168/0.254/ 0.508/0.762/1.524mm 0.101(mm) 0.127/0.254/0.508/ 0.762/1.524(mm) 0.254/0.508/ 0.762/1.524(mm) 0.254/0.635/1.270(mm) 0.254/0.635/1.270(mm) 0.635/1.270(mm)
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RT/duroid® 5870 RT/duroid® 5880 ULTRALAM® 2000 RT/duroid® 6002 RT/duroid® 6006 RT/duroid® 6010LM TMM®3 TMM®4 TMM®6 TMM®10 TMM®10i RO4003C®
(8)RO4350B ®
(7)3.00±0.04
0.004 107 107 103 103 104 107 107 103 103 104 300 (2,068) 300 (2,068) 300 (2,068) 300 (2,068) 300 (2,068) 300 (2,068)
0.05 <0.1 <0.1 <0.1 <0.1 <0.1
阻燃 等级
UL 94V-0
标准厚度
in.(mm) 0.127/0.254/0.381/0.508/ 0.787/1.575/3.175(mm) 0.127/0.254/0.381/0.508/ 0.787/1.575/3.175(mm) 0.101/0.256/0.373/ 0.482/0.762/1.524(mm) 0.127/0.254/0.381/0.508/ 0.762/1.524/3.048(mm) 0.254/0.635/1.270/ 1.905/2.540(mm) 0.254/0.635/1.270/ 1.905/2.540(mm) 0.381/0.508/0.762/ 1.524/3.175(mm) 0.381/0.508/0.762/ 1.524/3.175(mm) 0.381/0.635/1.270/ 1.905/2.540/3.175(mm) 0.381/0.635/1.270/ 1.905/2.540/3.175(mm) 0.381/0.635/1.270/ 1.905/2.540/3.175(mm) 0.203/0.508/ 0.813/1.524(mm) 0.101/0.168/0.254/ 0.508/0.762/1.524mm 0.101(mm) 0.127/0.254/0.508/ 0.762/1.524(mm) 0.254/0.508/ 0.762/1.524(mm) 0.254/0.635/1.270(mm) 0.254/0.635/1.270(mm) 0.635/1.270(mm)
0.05
0.78
24
24
24
3.1
12.3 (2.1)
UL 94V-0
碳氢化合物 陶瓷 碳氢化合物 陶瓷 碳氢化合物 陶瓷 碳氢化合物 陶瓷 碳氢化合物 陶瓷 碳氢化合物 陶瓷 碳氢化合物 陶瓷 碳氢化合物 陶瓷
PTFE 陶瓷 PTFE/陶瓷 强化玻璃布 PTFE 陶瓷 PTFE 陶瓷 PTFE/陶瓷
3.27±0.032
0.0020
3x109
0.04
0.70
16
16
20
1.78
5.7 (1.0)
N/A
4.50±0.045
0.0020
6x108
1x109
0.010
0.70
14
14
20
2.07
5.7 (1.0)
N/A
6.00±0.080
0.0023
1x108
1x109
0.06
0.72
16
16
20
2.37
58 24 24 34
2.1 2.6 3.0 3.0
10 (1.7) 12.2 (2.1) 13.4 (2.4) 13.4 (2.4)
UL 94V-0 UL 94V-0 UL 94V-0 UL 94V-0
6.15±0.15 10.2±0.30 10.2±0.50
强化玻璃布
北京快捷兴科技有限公司
地址： 海淀知春里 28 号开源写字楼 107 室
TEL：010-62544395
62535437 13910209710 E-Mail/QQ：ChinaKuaijie@
罗杰斯网址：
2.2
UL 94V-0
0.0012
106
107
0.1
0.60
16
16
24
2.1
8.9 (1.6)
UL 94V-0
6.15±0.150
0.0019
2x107
7x107
0.05
0.49
47
34
117
2.7
14.3 (2.5)
UL 94V-0
10.2±0.250
0.0023
5x106
5x106 ＞9x109
成 分
PTFE
介电常数
Er(1)(10GHz) 2.33±0.020
耗散(1)因数
TAN δ (10GHz) 0.0012
-50°-150℃
体积电阻率 表面电阻值
Mohm cm Mohm
的热(2)系数
ppm℃(典型值) -115 -125 -100 -+12 -410 -425 +39 +15.3 -10 -38 -43
吸湿性(4) 导热性(5) 抗剥强度 lbs/in(N/mm) 密 度 (典型值) D24/23% W/m/°K
(典型值) (典型值)
0.015 0.22 X 22 Y 28 Z 173 2.2
抗剥强度
lbs/in(N/mm)
(典型值)
2x107
(典型值)
2x108
gm/cm3
(典型值)
20.8 (3.7) 22.8 (4.0) 18.0 (3.2)
玻璃纤维
PTFE
玻璃纤维
PTFE
2.20±0.020 2.40-2.60± 0.040 2.94±0.040
0.0009
2x107
3x107
15
0.20
31
48
237
2.2
UL 94V-0
玻璃纤维
PTFE 陶瓷 PTFE 陶瓷 PTFE 陶瓷
0.0019
2x107
4x107
0.03
0.24
15
15
200
5.7 (1.0)
N/A
9.20±0.230
0.0023
2x108
4x107
0.09
0.76
16
16
20
2.77
5.0 (0.9)
N/A
9.80±0.245
0.0020
2x108
4x107
0.16
0.76
16*
16*
20*
2.77
5.0 (0.9)
N/A
3.38±0.05
0.0027
+40 +50
1.7x1010 1.2x1010
4.2x109 5.7x109
0.16
0.64
11
14
46
1.8
6.4 (1.1)
N/A
3.48±0.05
0.0037
0.06
0.62
14
16
50
1.9
5.3 (0.9)
UL 94V-0
RO4450B® RO3003® RO3203® RO3006® RO3010® RO3210®
3.54±0.05
0.60
19
17
60
1.86
UL 94V-0
0.00
24
2.1
17.6 (3.1)
UL 94V-0
(7)3.02±0.04
0.0016 0.0020 0.0023 0.0027
13 -160 -280
0.50 0.61 0.66 0.81
13 17 17 13
13 17 17 13
杨氏模数(3) kpsi(MPa) (典型值)
X 189 (1.340) 156 (1.076) 1,700 (11,730) 120 (828) 75 (511) 135 (932) 1,916 (13,210) 2,000 (13,790) 2,200 (15,168) 2,400 (16,547) 2,400 (16,547) 3,700 (25,510) Y 185 (1.277) 125 (863) 1,300 (8,970) 120 (828) 91 (628) 81 (559) 1,916 (13,210) 2,000 (13,790) 2,200 (1,5168) 2,400 (16,457) 2,400 (16,457) 3,900 (26,889) 1,664 (11,473) 360 (2,482) 155 (1,070) 311 (2,146) 742 (5,116) 752 (5,185) 736 (5,075) 575 (3,964) 575 (3,964) Z 120 (828) 136 (938)