半导体量测设备及应用介绍_201309
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半导体量测设备及应用介绍
陈贵荣 2013/09/11 E_mail : chen.kueijun@msa.hinet.net
芯片凸块制程检验
• 雷射扫瞄仍是目前凸块检测最广为使用的 三维量测技术
Failure Analysis_1
Failure Analysis_2
Examples of solder bump defect
8"~12" Wafer高阶Solder Bump检查机
高Repepeatability(3δ) : 1 um 以下 业界的最快检查能力 对应8"~12" Wafer FOUP自动 机器 提供多种多样化的讯息报告
WVI-600wk.baidu.comα
Falcon 800
Camtek开发的Falcon 800系列先进的 测量系统用于凸起封装晶圆，并保 证凸点达到他们严格的公差。 CTS，Camtek三角测量系统（专利申 请中）应用了比已知的三角测量原 理更新的方式，提高了一系列凸起 技术的精度与可重复性。更宽的角 度范围创造了更多种类凸起形状与 材料更强和更稳定的反射，支持凸 起的真3D几何重建。 Falcon 800更是特别设计用于最精细 的金板的测量。
Toray's Automatic Bump Inspection System Series
Specifications
Test Results
August Technology
Designed for highspeed bump and wafer inspection, the system incorporates the Company's patentpending threedimensional (3D) Rapid Confocal Sensor™, with proprietary twodimensional (2D) bump and active die inspection technologies to provide bump manufacturers with high-speed and high accuracy combined in a single bump inspection solution.
The 3D profiling technique is based on a newly developed optical interferometry, which has the world fastest measurement speed with sub-micron accuracy of height measurement.
Basic Geometry of Laser Triangulation
雷射三角几何示意图
此雷射三维系统之量测精度，主要受限于传感器之分辨 率及投射之雷射光线宽，越细的雷射线宽及高分辨率传 感器，可获得较高之量测精度。
雷射三角法系统架构图
• 利用程控，可以调整雷射光之线宽及扫瞄速度。 • 此系统之组成简单稳健，适合工业环境之实际应用。
ASE
Measuring Method: Triangulation by laser scanning.
IS-100 is high-speed inspection developed for area array bump inspection
Inspection object: Solder bump on the wafer. Handling: Cassette to cassette inspection. Result output: Realtime display per chip and also can be recorder on MO.
• Explain
高阶封装技术
• 300mm晶圆
高阶封装技术
• Wafer Bump
3D Bump Inspection using Laser Triangulation
• 3D and 2D bump inspection is a critical component in manufacturing of bumped wafers. Continuous miniaturization and use of through silicon via (TSV) in 3D packages are pushing bump sizes smaller and smaller. The small bump size, small pitch and high number of bumps are challenging inspection technologies, requiring high accuracies and high throughput. • Laser triangulationis the dominant technology for 3D characterization of solder and pillar bumps used in conventional packaging techniques.The technology is a line scan laser with the ability to collect hundreds of 3D data points along one scan line in a fraction of a second.These data points can then be used to build a 3D model of the top of the bump and surface of the wafer for local height inspection. As bump size and pitch continue to decrease and bump numbers head towards tens of millions per wafer, the speed and accuracy of laser triangulation technology gives 3DIC manufacturers the ability to tightly control bump processes and detect bump defects.
Realtine display for inspection results per chip.
Wafer Bump 3D Inspection System
• Wafer Bump 3D Inspection System Vi-Z800【Wafer Auto Handler】
Wafer Bump 3D Measurement
Bump Inspection System SP-500B
• The SP-500B automaticall y measures the heights, coplanarity, shapes and positions of the bumps on wafers or IC chips.
• Wafer Bump 3D Measurement
• Wafer Gold Bump Measurement Inspection / MEM-5296D
2D、3D、SD for Bumping检测设备
主要用途 ・具有高速及高精度测试Wafer Bump的功能 ・测试分辨力为0.1μm ・世界领先地位的生产能力 产品应用 ・缺陷检测功能 ・高精度Bump Height检测能力及再生产的功能 产品特色 1.高速的检测能力 2.提供有效的Off- Line Review功能 3.对客户端提供简易的操作使用系统 4.用独有的高精度激光变位传感器来实现高精度 的测试 ・采用微细激光线的排列 ・用PSD排列来达到高速测试 ・对高度和缺陷进行高精度的检测，实现了先进 的运算法则。 5.先进的信号处理系统 ・采用高速的A/D转换机板 ・运用DMA技术来实现先进的高速信号处理 ・测试画面清晰
• For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes. • Defects created in the post-fab area between wafer processing, bump processing and final manufacturing can negatively impact product yields and time-to-market. • The Wafer Scanner quickly and reliably locates bump and wafer defects, reducing process costs and improving yield.
M50
La se r
M50 I/O
Object
Driver
Encoder Stage
Slit Scanner
• Slit scanners are a direction extension of the basic triangulation principle
非接触三角法探头原理
Wafer Scanner
Features
High speed measurement of the height for solder bumps with high accuracy (±0.25µm @ aveó). Measuring range from 10 ~ 130µm height.
High-speed inspection by AOD (Acousto Optical Deflector), laser scanning, and triangulation. Input and processing height and brughtness informations at 7 megapoint/sec.
Through-Silicon Via (TSV)
• A through-silicon via3D package (3D IC) contains two or more chips stacked vertically, with vias through the silicon substrates replacing edge wiring to create an electrical connection between the circuit elements on each chip. • TSV technology provides a dramatic increase in the functionality of the device in a very small footprint. Multiple technologies are being explored to form vias during the wafer fabrication process (front-end) and the IC packaging and assembly stage (back-end). • Metrology and inspection of the TSVs are critical for ensuring the performance of the 3D ICs and the profitability of the overall manufacturing process.
陈贵荣 2013/09/11 E_mail : chen.kueijun@msa.hinet.net
芯片凸块制程检验
• 雷射扫瞄仍是目前凸块检测最广为使用的 三维量测技术
Failure Analysis_1
Failure Analysis_2
Examples of solder bump defect
8"~12" Wafer高阶Solder Bump检查机
高Repepeatability(3δ) : 1 um 以下 业界的最快检查能力 对应8"~12" Wafer FOUP自动 机器 提供多种多样化的讯息报告
WVI-600wk.baidu.comα
Falcon 800
Camtek开发的Falcon 800系列先进的 测量系统用于凸起封装晶圆，并保 证凸点达到他们严格的公差。 CTS，Camtek三角测量系统（专利申 请中）应用了比已知的三角测量原 理更新的方式，提高了一系列凸起 技术的精度与可重复性。更宽的角 度范围创造了更多种类凸起形状与 材料更强和更稳定的反射，支持凸 起的真3D几何重建。 Falcon 800更是特别设计用于最精细 的金板的测量。
Toray's Automatic Bump Inspection System Series
Specifications
Test Results
August Technology
Designed for highspeed bump and wafer inspection, the system incorporates the Company's patentpending threedimensional (3D) Rapid Confocal Sensor™, with proprietary twodimensional (2D) bump and active die inspection technologies to provide bump manufacturers with high-speed and high accuracy combined in a single bump inspection solution.
The 3D profiling technique is based on a newly developed optical interferometry, which has the world fastest measurement speed with sub-micron accuracy of height measurement.
Basic Geometry of Laser Triangulation
雷射三角几何示意图
此雷射三维系统之量测精度，主要受限于传感器之分辨 率及投射之雷射光线宽，越细的雷射线宽及高分辨率传 感器，可获得较高之量测精度。
雷射三角法系统架构图
• 利用程控，可以调整雷射光之线宽及扫瞄速度。 • 此系统之组成简单稳健，适合工业环境之实际应用。
ASE
Measuring Method: Triangulation by laser scanning.
IS-100 is high-speed inspection developed for area array bump inspection
Inspection object: Solder bump on the wafer. Handling: Cassette to cassette inspection. Result output: Realtime display per chip and also can be recorder on MO.
• Explain
高阶封装技术
• 300mm晶圆
高阶封装技术
• Wafer Bump
3D Bump Inspection using Laser Triangulation
• 3D and 2D bump inspection is a critical component in manufacturing of bumped wafers. Continuous miniaturization and use of through silicon via (TSV) in 3D packages are pushing bump sizes smaller and smaller. The small bump size, small pitch and high number of bumps are challenging inspection technologies, requiring high accuracies and high throughput. • Laser triangulationis the dominant technology for 3D characterization of solder and pillar bumps used in conventional packaging techniques.The technology is a line scan laser with the ability to collect hundreds of 3D data points along one scan line in a fraction of a second.These data points can then be used to build a 3D model of the top of the bump and surface of the wafer for local height inspection. As bump size and pitch continue to decrease and bump numbers head towards tens of millions per wafer, the speed and accuracy of laser triangulation technology gives 3DIC manufacturers the ability to tightly control bump processes and detect bump defects.
Realtine display for inspection results per chip.
Wafer Bump 3D Inspection System
• Wafer Bump 3D Inspection System Vi-Z800【Wafer Auto Handler】
Wafer Bump 3D Measurement
Bump Inspection System SP-500B
• The SP-500B automaticall y measures the heights, coplanarity, shapes and positions of the bumps on wafers or IC chips.
• Wafer Bump 3D Measurement
• Wafer Gold Bump Measurement Inspection / MEM-5296D
2D、3D、SD for Bumping检测设备
主要用途 ・具有高速及高精度测试Wafer Bump的功能 ・测试分辨力为0.1μm ・世界领先地位的生产能力 产品应用 ・缺陷检测功能 ・高精度Bump Height检测能力及再生产的功能 产品特色 1.高速的检测能力 2.提供有效的Off- Line Review功能 3.对客户端提供简易的操作使用系统 4.用独有的高精度激光变位传感器来实现高精度 的测试 ・采用微细激光线的排列 ・用PSD排列来达到高速测试 ・对高度和缺陷进行高精度的检测，实现了先进 的运算法则。 5.先进的信号处理系统 ・采用高速的A/D转换机板 ・运用DMA技术来实现先进的高速信号处理 ・测试画面清晰
• For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes. • Defects created in the post-fab area between wafer processing, bump processing and final manufacturing can negatively impact product yields and time-to-market. • The Wafer Scanner quickly and reliably locates bump and wafer defects, reducing process costs and improving yield.
M50
La se r
M50 I/O
Object
Driver
Encoder Stage
Slit Scanner
• Slit scanners are a direction extension of the basic triangulation principle
非接触三角法探头原理
Wafer Scanner
Features
High speed measurement of the height for solder bumps with high accuracy (±0.25µm @ aveó). Measuring range from 10 ~ 130µm height.
High-speed inspection by AOD (Acousto Optical Deflector), laser scanning, and triangulation. Input and processing height and brughtness informations at 7 megapoint/sec.
Through-Silicon Via (TSV)
• A through-silicon via3D package (3D IC) contains two or more chips stacked vertically, with vias through the silicon substrates replacing edge wiring to create an electrical connection between the circuit elements on each chip. • TSV technology provides a dramatic increase in the functionality of the device in a very small footprint. Multiple technologies are being explored to form vias during the wafer fabrication process (front-end) and the IC packaging and assembly stage (back-end). • Metrology and inspection of the TSVs are critical for ensuring the performance of the 3D ICs and the profitability of the overall manufacturing process.