台湾台铭光电7020红光660NM规格书0.1W
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* Package Dimensions：
Unit : mm
Note： 1：All dimensions are in millimeters (inches). 2：Tolerance is ±0.25mm (.010”) unless otherwise noted. 3: Specifications are subject to change without notices. 4：This specification is for reference only for one year
Forward Current (mA)
Forward Voltage (V)
Allowable Forward Current VS Ambient Temperature
Forward Current (MA)
Relative Luminous Intensity VS Ambient Temperature
Lifetest
环境测试 Ambience
test
项目 Item 常温寿命测试 Lifetest(roomtemperature)
高温存储 Hightemperaturestore
低温存储 Low temperature store
高温高湿测试 High temperature/ humidity test
Ａｐｐｒｏｖｅｄ Ｂｙ Ｃｕｓｔｏｍｅｒ
客戶承認
Ｑｕａｌｉｆｉｅｄ Ｂｙ Ｆｏｒｍ Ｄｅｓｉｇｎｅｒ
核准
製作
司徒立勝
歐陽真
台灣臺銘光電科技股份有限公司（東莞）分公司（Ｇｒｅａｔｂｒｉｇｈｔ臺銘光電）
ＡＤＤ：２６， ｔｈｅ ｔｈｉｒｄ ｉｎｄｕｓｔｒｉａｌ ｚｏｎｅ， Ｆｅｎｇｇａｎｇ ｔｏｗｎ ｏｆ Ｙａｎｔｉａｎ， Ｄｏｎｇｇｕａｎ Ｃｉｔｙ， Ｇｕａｎｇｄｏｎｇ Ｐｒｏｖｉｎｃｅ Ｃｈｉｎａ
正向電流 Forward Current
符號 Symbol
IF
數值 Value
150
正向峰值電流 Peck forward current
IF
反向耐壓 Reverse Voltage
耗散功率 Power Dissipation
工作環境溫度 Operation temperature
貯藏溫度 Storage temperature
1. Hand have sweat，Sweat on silicon surface existing optical pollution， Influence luminous。
2. Filling glue for silica gel，Silica gel is relatively soft，Hand hard squeeze will cause、breakline Crushed waf break Cause death light products
Relative Luminous Intensity
Ambient Temperature TA(°C)
Ambient Temperature TA(°C)
Allowable Forward Current (mA)
4
●R ●
五、可靠性实验项目 Reliability Test Project
描述 Description 寿命测试
TEL：０７６９－８７２８ ５３８３
FAX ：０７６９－８７２８ ５３８２
WEB ：ｗｗｗ．ｔａｉｍｉｎｇｌｅｄ．ｃｏｍ
E-MIAL∶ ｈｄｑ＠ｔａｉｍｉｎｇｌｅｄ．ｃｏｍ
1
Features : * Low power consumption * Small efficiency. * Versatile mounting on p.c board or panel. * I.C compatible/ low current requirement.
色温 Color temperature
光譜半寬度 Spectrum line half width
視角 Viewing Angle
符號 測試條件
Symbol Testcondition
VF
IF=150mA
IR
VR=10V
IV
IF=150mA
K
IF=150mA
Δλ
IF=150mA
2θ1/2 IF=150mA
7
二：SM D product dehumidification and baking
1；The experimental result： 1 ； After test, found that the SMD series accord with IPC/JEDECJ - STD - 020 - c plastic
ＳＰＥＣＩＦＩＣＡＴＩＯＮ ＦＯＲ ＡＰＰＲＯＶＡＬ 規 格 書
ＣＵＳＴＯＭＥＲ＇Ｓ ＣＯＤＥ（客戶／代碼）
ＤＥＳＣＲＩＰＴＩＯＮ：（品名） ＲＡＲＴ ＮＯ．：（本廠型號）
ＤＡＴＥ：（日期） ＲＥＦＥＲＥＮＣＥ ＮＯ（． 檔案號）
７０２０红光６６０ＮＭ ＴＭ－Ｓ７０２０Ｒ６６０ＮＭ－Ｅ１
２０１５－０５－１１ Ｇｒｅａｔｂｒｉｇｈｔ２０１５７０２０Ｒ６６０ＮＭ
最小值 Min
2.0 -5 650----
典型值 Type
---
25 120
最大值 Max
2.4 5 8 660 ---
單位 Unit
V μA LM
K C deg
備註：亮度測試公差±15%、波長測試公差±1nm、正向電壓測試公差±0.05V intensity:±15%, The tolerance of wave length:±1nm,The tolerance of forwards voltage: ±0.05V.
integrated circuit (IC)SMD wet/return sensitivity classification criteria。 2: Reflow soldering SMD before use
If after open the sealed container bags. But before welding. SMD exposed to damp environment Is encountered in the welding process. High temperature SMD damage may occur, such as death lamp 3： Stored instructions： Stored in the temperature less than 30 ℃ , relative humidity less than 30% of the environment in the reflow soldering SMD don't need before baking dehumidification。：
冷热冲击测试 Cold / Heat strike test
冷热循环测试 Cold and heat cycle test
测试标准 Testcriterion
测试条件 Testcondition
测试时间 数量 失效数量 Testtime Qty Failqty
JIS7021:B4
Ta=25℃±5℃，IF=150mA 1000Hrs 22
2；Figure 2 Tweezers surface material taking：
1. Product packaging glue for silica gel ， Silica gel is relatively soft ， Use tweezers extrusionCan lead to break 、 Broken wafer causing death light products。
实验条件 Experiment condition
IF=150mA VR=5V
IF=150mA
判断标准
Criteria
Min.
Max.
----
Initial Datex1.1
----
5μA
Initial Datex0.8
----
5
一：SMD The produc ts take note
1；Graph one： Hands material taking：
2. Tweezers will scratch product surface, light Angle effect。
3；FIG. 3 SMT material taking: when the suction nozzle diameter less than products can lead t o suction nozzle stamping silica gel，Can cause gold thread breakage and chip extrusion, cause products die lamp and so on
0
JIS7021:B10 MIL-STD-202:210A MIL-STD-750:2031
JIS7021:B12
Ta=85℃±5℃ Ta=-35℃±5℃
1000Hrs 22
0
1000Hrs 22
0
JIS7021:B11 MIL-STD-202:103D
Ta=85℃±5℃ RH=85%
1000Hrs 22
2
二、光電參數 Photoelectricity Parameter
（環境溫度 Ambient temperature：25℃ 濕度humidity：RH60%）
項目
Item
正向電壓 Forward voltage
反向電流 Reverse current
發光強度 Luminous intensity
0
JIS7021::B4
30min
MIL-STD-202:107D -10℃±5℃←→100℃±5℃ 50Cycles 22
0
MIL-STD-750:1026 5min
5min
JIS7021:A3
5min 5min 5min
MIL-STD-202:107D -35℃～25℃～85℃～-35℃ 50Cycles 22
1. Welding plate after，Directly after the welding of plate overlap，Can damage the product surface，Will affect light Angle very scratch the surface
2. Welding plate after，Welding plate and product overlap there will be a squeeze，Extrusion can cause wafer and gold thread damage and fracture can lead to produce light。
VR Pm Tamb Tstg
180 10 1020
-25 至+80 +40 至+60
單位 Unit
mA
mA
V mW ℃ ℃
備註 Remark
---
F=1KHZ,占空比(duty cycle)1/10
---------
3
焊接溫度 Soldering temperature
Tsol
240
℃
焊接≤3S Soldering≤3S
Remark：The tolerance of Only reference for above data when testing.
三、極限參數 Absolute Maximum Rating （環境溫度 Ambient temperature：25℃ 濕度humidity：RH60%）
項目
Item
0
MIL-STD-705:105E 30min 5min 30min 5min
wk.baidu.com六、判断标准 Judging criterion:
项目 Item
Forward Voltage 正向电压
Reverse Current 反向电流
Luminous Intensity 发光强度
符号 Symbol
VF IR IV
6
4；Figure 4: Blanking: product fell on the ground, can lead to foot a deformation, can cause welding plate position is differ。
5；Figure 5： Welding plate after put：
四、典型光电特性曲线图Typical photoelectricity characteristic curve chart
Forward Current VS Forward Voltage
Relative Luminous Intensity VS Forward Current
Relative Luminous Intensity
Unit : mm
Note： 1：All dimensions are in millimeters (inches). 2：Tolerance is ±0.25mm (.010”) unless otherwise noted. 3: Specifications are subject to change without notices. 4：This specification is for reference only for one year
Forward Current (mA)
Forward Voltage (V)
Allowable Forward Current VS Ambient Temperature
Forward Current (MA)
Relative Luminous Intensity VS Ambient Temperature
Lifetest
环境测试 Ambience
test
项目 Item 常温寿命测试 Lifetest(roomtemperature)
高温存储 Hightemperaturestore
低温存储 Low temperature store
高温高湿测试 High temperature/ humidity test
Ａｐｐｒｏｖｅｄ Ｂｙ Ｃｕｓｔｏｍｅｒ
客戶承認
Ｑｕａｌｉｆｉｅｄ Ｂｙ Ｆｏｒｍ Ｄｅｓｉｇｎｅｒ
核准
製作
司徒立勝
歐陽真
台灣臺銘光電科技股份有限公司（東莞）分公司（Ｇｒｅａｔｂｒｉｇｈｔ臺銘光電）
ＡＤＤ：２６， ｔｈｅ ｔｈｉｒｄ ｉｎｄｕｓｔｒｉａｌ ｚｏｎｅ， Ｆｅｎｇｇａｎｇ ｔｏｗｎ ｏｆ Ｙａｎｔｉａｎ， Ｄｏｎｇｇｕａｎ Ｃｉｔｙ， Ｇｕａｎｇｄｏｎｇ Ｐｒｏｖｉｎｃｅ Ｃｈｉｎａ
正向電流 Forward Current
符號 Symbol
IF
數值 Value
150
正向峰值電流 Peck forward current
IF
反向耐壓 Reverse Voltage
耗散功率 Power Dissipation
工作環境溫度 Operation temperature
貯藏溫度 Storage temperature
1. Hand have sweat，Sweat on silicon surface existing optical pollution， Influence luminous。
2. Filling glue for silica gel，Silica gel is relatively soft，Hand hard squeeze will cause、breakline Crushed waf break Cause death light products
Relative Luminous Intensity
Ambient Temperature TA(°C)
Ambient Temperature TA(°C)
Allowable Forward Current (mA)
4
●R ●
五、可靠性实验项目 Reliability Test Project
描述 Description 寿命测试
TEL：０７６９－８７２８ ５３８３
FAX ：０７６９－８７２８ ５３８２
WEB ：ｗｗｗ．ｔａｉｍｉｎｇｌｅｄ．ｃｏｍ
E-MIAL∶ ｈｄｑ＠ｔａｉｍｉｎｇｌｅｄ．ｃｏｍ
1
Features : * Low power consumption * Small efficiency. * Versatile mounting on p.c board or panel. * I.C compatible/ low current requirement.
色温 Color temperature
光譜半寬度 Spectrum line half width
視角 Viewing Angle
符號 測試條件
Symbol Testcondition
VF
IF=150mA
IR
VR=10V
IV
IF=150mA
K
IF=150mA
Δλ
IF=150mA
2θ1/2 IF=150mA
7
二：SM D product dehumidification and baking
1；The experimental result： 1 ； After test, found that the SMD series accord with IPC/JEDECJ - STD - 020 - c plastic
ＳＰＥＣＩＦＩＣＡＴＩＯＮ ＦＯＲ ＡＰＰＲＯＶＡＬ 規 格 書
ＣＵＳＴＯＭＥＲ＇Ｓ ＣＯＤＥ（客戶／代碼）
ＤＥＳＣＲＩＰＴＩＯＮ：（品名） ＲＡＲＴ ＮＯ．：（本廠型號）
ＤＡＴＥ：（日期） ＲＥＦＥＲＥＮＣＥ ＮＯ（． 檔案號）
７０２０红光６６０ＮＭ ＴＭ－Ｓ７０２０Ｒ６６０ＮＭ－Ｅ１
２０１５－０５－１１ Ｇｒｅａｔｂｒｉｇｈｔ２０１５７０２０Ｒ６６０ＮＭ
最小值 Min
2.0 -5 650----
典型值 Type
---
25 120
最大值 Max
2.4 5 8 660 ---
單位 Unit
V μA LM
K C deg
備註：亮度測試公差±15%、波長測試公差±1nm、正向電壓測試公差±0.05V intensity:±15%, The tolerance of wave length:±1nm,The tolerance of forwards voltage: ±0.05V.
integrated circuit (IC)SMD wet/return sensitivity classification criteria。 2: Reflow soldering SMD before use
If after open the sealed container bags. But before welding. SMD exposed to damp environment Is encountered in the welding process. High temperature SMD damage may occur, such as death lamp 3： Stored instructions： Stored in the temperature less than 30 ℃ , relative humidity less than 30% of the environment in the reflow soldering SMD don't need before baking dehumidification。：
冷热冲击测试 Cold / Heat strike test
冷热循环测试 Cold and heat cycle test
测试标准 Testcriterion
测试条件 Testcondition
测试时间 数量 失效数量 Testtime Qty Failqty
JIS7021:B4
Ta=25℃±5℃，IF=150mA 1000Hrs 22
2；Figure 2 Tweezers surface material taking：
1. Product packaging glue for silica gel ， Silica gel is relatively soft ， Use tweezers extrusionCan lead to break 、 Broken wafer causing death light products。
实验条件 Experiment condition
IF=150mA VR=5V
IF=150mA
判断标准
Criteria
Min.
Max.
----
Initial Datex1.1
----
5μA
Initial Datex0.8
----
5
一：SMD The produc ts take note
1；Graph one： Hands material taking：
2. Tweezers will scratch product surface, light Angle effect。
3；FIG. 3 SMT material taking: when the suction nozzle diameter less than products can lead t o suction nozzle stamping silica gel，Can cause gold thread breakage and chip extrusion, cause products die lamp and so on
0
JIS7021:B10 MIL-STD-202:210A MIL-STD-750:2031
JIS7021:B12
Ta=85℃±5℃ Ta=-35℃±5℃
1000Hrs 22
0
1000Hrs 22
0
JIS7021:B11 MIL-STD-202:103D
Ta=85℃±5℃ RH=85%
1000Hrs 22
2
二、光電參數 Photoelectricity Parameter
（環境溫度 Ambient temperature：25℃ 濕度humidity：RH60%）
項目
Item
正向電壓 Forward voltage
反向電流 Reverse current
發光強度 Luminous intensity
0
JIS7021::B4
30min
MIL-STD-202:107D -10℃±5℃←→100℃±5℃ 50Cycles 22
0
MIL-STD-750:1026 5min
5min
JIS7021:A3
5min 5min 5min
MIL-STD-202:107D -35℃～25℃～85℃～-35℃ 50Cycles 22
1. Welding plate after，Directly after the welding of plate overlap，Can damage the product surface，Will affect light Angle very scratch the surface
2. Welding plate after，Welding plate and product overlap there will be a squeeze，Extrusion can cause wafer and gold thread damage and fracture can lead to produce light。
VR Pm Tamb Tstg
180 10 1020
-25 至+80 +40 至+60
單位 Unit
mA
mA
V mW ℃ ℃
備註 Remark
---
F=1KHZ,占空比(duty cycle)1/10
---------
3
焊接溫度 Soldering temperature
Tsol
240
℃
焊接≤3S Soldering≤3S
Remark：The tolerance of Only reference for above data when testing.
三、極限參數 Absolute Maximum Rating （環境溫度 Ambient temperature：25℃ 濕度humidity：RH60%）
項目
Item
0
MIL-STD-705:105E 30min 5min 30min 5min
wk.baidu.com六、判断标准 Judging criterion:
项目 Item
Forward Voltage 正向电压
Reverse Current 反向电流
Luminous Intensity 发光强度
符号 Symbol
VF IR IV
6
4；Figure 4: Blanking: product fell on the ground, can lead to foot a deformation, can cause welding plate position is differ。
5；Figure 5： Welding plate after put：
四、典型光电特性曲线图Typical photoelectricity characteristic curve chart
Forward Current VS Forward Voltage
Relative Luminous Intensity VS Forward Current
Relative Luminous Intensity