笔记本主板电路图资料共33页
通用主板图解华硕联想戴尔
主板图解一块主板主要由线路板和它上面的各种元器件组成1.线路板PCB印制电路板是所有电脑板卡所不可或缺的东东。
它实际是由几层树脂材料粘合在一起的，内部采用铜箔走线。
一般的PCB线路板分有四层，最上和最下的两层是信号层，中间两层是接地层和电源层，将接地和电源层放在中间，这样便可容易地对信号线作出修正。
而一些要求较高的主板的线路板可达到6-8层或更多。
此主题相关图片如下：主板(线路板)是如何制造出来的呢？PCB的制造过程由玻璃环氧树脂(Glass Epoxy)或类似材质制成的PCB“基板”开始。
制作的第一步是光绘出零件间联机的布线，其方法是采用负片转印(Subtractive transfer)的方式将设计好的PCB线路板的线路底片“印刷”在金属导体上。
这项技巧是将整个表面铺上一层薄薄的铜箔，并且把多余的部份给消除。
而如果制作的是双面板，那么PCB的基板两面都会铺上铜箔。
而要做多层板可将做好的两块双面板用特制的粘合剂“压合”起来就行了。
接下来，便可在PCB板上进行接插元器件所需的钻孔与电镀了。
在根据钻孔需求由机器设备钻孔之后，孔璧里头必须经过电镀(镀通孔技术，Plated-Through-Hole technology，PTH)。
在孔璧内部作金属处理后，可以让内部的各层线路能够彼此连接。
在开始电镀之前，必须先清掉孔内的杂物。
这是因为树脂环氧物在加热后会产生一些化学变化，而它会覆盖住内部PCB层，所以要先清掉。
清除与电镀动作都会在化学过程中完成。
接下来，需要将阻焊漆(阻焊油墨)覆盖在最外层的布线上，这样一来布线就不会接触到电镀部份了。
然后是将各种元器件标示网印在线路板上，以标示各零件的位置，它不能够覆盖在任何布线或是金手指上，不然可能会减低可焊性或是电流连接的稳定性。
此外，如果有金属连接部位，这时“金手指”部份通常会镀上金，这样在插入扩充槽时，才能确保高品质的电流连接。
最后，就是测试了。
测试PCB是否有短路或是断路的状况，可以使用光学或电子方式测试。
戴尔DELLD400DP1笔记本主板电路图
monoINT SPKINT MICCODECPCI BUSMEM BUSHOST BUSQSWDDR 266/200SO-DIMM*2CLK GENGMCHTouchPadPS2 SMBusUSB 2.0 KB CONNK/BAC97BIOS LPC BUSUSB 2.0ICH4-MSMsCSIO&KBCPrimary IDE USB*4PCI BUS TPA0312STAC9750LPC BUSHUB I/FMic jack ICS 950810CGMontara-GMOPOP AMPX-BUSMiniPCILPC47N254PCI75101394 conn.RJ45MODEM Gigabit LANBroadcom BCM5705M RJ45X f o r m e rCRT D- DockDVIS-video CONNLCD LVDSSPDIFDVO BMDCS/W MODEM RJ11CH7009BSocketCardBusSLOT*1POWERUSBCPU BaniasLAN SwitchCRTS-video,DVI,CRTVcc_core: 0.7~1.708V @32A Vccp:1.05V @3AVcc_GMCH:1.2V @1.65AVcc_mem:2.5V @1.2A + 2*SO-DIMMIrDAP.10P.11P.11P.19P.24P.25P.25P.25P.25P.25Headphone jackP.26P.27P.31P.31P.31P.3P.4,5P.7,8,9P.12,13,14P.15,16,17P.18P.18P.18P.18P.20P.21P.21P.22P.22P.23P.28,29P.30TPS2211APWR SWP.2191.42Y01.001Pebble Mar.7 '03INPUT +DC_INMAX1645BMAX1632CHARGEROUTPUT BATT++RTC_PWRP.39MAX1644/MAX17923V/5V/12VP.35P.38DDR 2.5V/1.25VSC1486P.37SC1476Vcc_core: 0.7~1.708V @32ACPU CORE POWERP.36VCC_IO:1.05V @3AVcc_GMCH:1.2V @1.65A1.05V/1.2VP.38MAX1715SerialPortP.31P.19QVJ3/5/6Ver.B1Ver.A2Ver.A2500mA02203-SEVCC_mem:2.5V @1.2A+2*SO-DIMMVer.B1BlueToothP.31USB 1.1Module conn.Qual Build QD68QE27Ver.B A11.5V/1.8VCC1Pass 2Cypress CY28346-2PI31301DANCN6000I/F ICP.21Smart CardP.21TitleWistron Corporation21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih,Taipei Hsien 221, Taiwan, R.O.C. QQ:453100829A-PDF Watermark DEMO: Purchase from to remove the watermarkCG_* : CPU GTL+CC_* : CPU CMOS P_* : PCI BUS G_* : AGP BUS HL_* : HUB LINK I/F M_* : MEMORY BUS LPC_* : LPC I/FICH_AC_* : AC'97 LINK I/F IDE_* : IDE BUSPCI TABLEDEVICE IDSEL IRQ REQ# / GNT#DREQ/DGNT PCMCIA PCI7510LAN Broadcom BCM5705M MINIPCI SLOTAD19AD16AD17PIRQB#PIRQC#PIRQD#REQ#1 / GNT#1REQ4# / GNT4#REQ3# / GNT3#01.BLOCK DIAGRAM 02.TABLE OF CONTENT 04.CPU05.CPU CONFIGURATION 03.CLOCK GENERATOR 06.MAX6654 & ITP & FAN 07.GMCH (1/3)08.GMCH (2/3)09.GMCH (3/3)12.DDR SOCKET13.DDR SERIAL/TERMINATOR RESISTOR 11.LCD / INVERTER & CRT CONN 15.ICH-4M (1/3)16.ICH-4M (2/3)17.ICH-4M (3/3)18.GIGABIT LAN 19.HDD & MDC CONN.20.CARDBUS CONTROLLER21.CARDBUS & 1394 CONNECTOR & POWER SWITCH 23.MINIPCI CONN B POWER SWITCH & CONN 24.AUDIO CODEC 31.TOUCHPAD, KB ,BLUETOOTH CONN, IR 27.D DOCK 28.SIO (1/2)34.POWER-ON RESET LOGIC 36.CPU VCORE-IMVP4 SC147638.VCC_IO,1.2V, 1.5V, 1.8V 35.DCDC 3V/5V33.POWER PLANE ENABLES 39.CHARGER40.HOLES & GND PADSREQB# / GNTB#PIRQC#D-DOCKPIRQB#REQ0# / GNT0#10.S-VIDEO/DVI14.DDR DECOUPLING CAP 25.AUDIO AMP & JACK 26.D DOCK BUFFERS 29.SIO (2/2)30.BIOS32.LED & BUTTON CONN 37.DDR 2.5V/1.25V & RTC & BIRIDGE BATTERY AD24PIRQD#Montania to Montania+ changes1.Changed VR resistor to generate 1.35V for MGM+ core(R529,R530)2.Changed R112 from 27.4 to 37.4 Ohm (changes HLZCOMP for MGM+)3.Put R612,R613,R614 1K ohm(For Pebble don't need change because we use +1.5VRUN)4.Need Changed PSWING,HLVREF for MGM+ if use MGM core your meet DDR333 require (For Pebble already done)Wistron Corporation21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih,Taipei Hsien 221, Taiwan, R.O.C.+DC_IN +1.8VRUN +5VSUS +3VRUN +5VALW +5VRUN+3.3VRTC +3VALW +3VSUSVCC_IO VCC_CORE LCDVDD DOCK_DC_IN CRT_VCC +1.5VRUN +5VHDDAC97_3V AC97_5V +3VAUX_LAN DOCK_PWR_SRCPWR_SRC+5V_QDOCK BATT++2.5VAUX_LAN+1.2VAUX_LAN CBS_VCC CBS_VPP CBS_VCCF +2.5VSUS ICH_VBIAS VCC_RTC +RTCSRC +RTC_PWR+1.25VRUN +1.2VRUN+DC_IN 27,37,39PWR_SRC 11,22,27,33,35,36,37,38,39+1.8VRUN 4,33,38+3.3VRTC 16,28,34,37+5VALW 11,27,28,32,33,34,39+3VRUN 3,4,6,8,9,10,11,12,15,16,17,18,19,23,24,26,28,29,31,32,33,34,36,38,40+5VRUN 6,8,10,11,17,19,23,26,29,31,32,33,34,36,37,40+3VALW 16,25,27,28,29,30,34,40+5VSUS 6,11,17,21,22,24,25,31,32,33,34,35,37,38,40+3VSUS 6,11,15,16,17,18,19,20,21,23,25,27,31,33,34,37,38,40VCC_IO 4,5,6,7,9,16,17,33,38VCC_CORE 5,33,36LCDVDD 11DOCK_DC_IN 27CRT_VCC 11+1.5VRUN 4,7,8,9,10,11,15,17,33+5VHDD 19,33AC97_3V 19AC97_5V 19+3VAUX_LAN 18,23,33DOCK_PWR_SRC 27+5V_QDOCK 26BATT+39+2.5VAUX_LAN 18,27+1.2VAUX_LAN 18CBS_VCC 20,21CBS_VPP 21CBS_VCCF 21+2.5VSUS 6,7,9,12,14,33,37ICH_VBIAS 16VCC_RTC 16+RTCSRC 37+RTC_PWR 34,35,37,39,40+1.25VRUN 13,14,33,37+1.2VRUN 7,9,38 QQ:453100829。
笔记本ASUS K40AB电路图VER 1.2
PAGE 50
SYSTEM PWR
PAGE 81
HT 3.0 2.6GHZ
CLOCK GEN ICS/9LPR363
PAGE 29
BAT & CHARGER
PAGE 88
ATI
CRT
PAGE 46
PCI-E x16
Other PWR
PAGE 82, 83, 84, 85, 90, 91, 92, 93, 94
Engineer: <OrgAddr1>
Date: Wednesday, April 08, 2009
5 4 3 2
5
4
3
2
1
K40AA
D
Block Diagram
AMD
S1G2 CPU
D
FAN + SENSOR
CPU VCORE
PAGE 3,4,5 PAGE 80
GDDR2 64M*16 x8
PAGE 74, 75
CMOS Camera
PAGE 45
PAGE 63
SATA HDD
PAGE 51
A
SATA ODD
PAGE 51
A
Title :
ASUSTeK COMPUTER INC. NB1 Size Custom
5 4 3 2
Block Diagram
Rev 1.00
Engineer: <OrgAddr1>
Project Name
C
POWER PAGE REF.
80_POWER_VCORE 81_POWER_SYSTEM 82_POWER_I/O_1.5VS & 1.05VS 83_POWER_I/O_DDR & VTT 85_POWER_VGA_CORE & +1.1VO 87_POWER_SHUTDOWN# 88_POWER_CHARGER 90_POWER_PROTECT 91_POWER_LOAD SWITCH 92_POWER_PROTECT 93_POWER_SIGNAL 94_POWER_FLOWCHART
topstar笔记本主板电路图纸(全)
Address
1101 001x 1101 010x 1010 000x 1010 001x 1010 111x 0001 011x 1001 110x
Hex
D2 D4 A0 A2 AE 16 9C
Bus
SMB_ICH_S SMB_ICH_S SMB_ICH_S SMB_ICH_S SMB_ICH_S I2C_591 I2C_591
732 uFCBGA
+V3.3S,+V2.5 +V1.5S,+V1.2S +VCCP
1.6-2.1GB/s
DDR266 SODIMM1
+V1.25S,+V2.5,+V3.3S
C
VGA
Page 16
R/G/B
Page 11,12,13 LAN Controller
RTL8100BL
+V3.3AL
Page 7,8,9 IDE1
With AC IN
G3
With Battery
TOPSTAR TECHNOLOGY Andy Han Page Name Size A4 Project Name Annotations & Information P21i Rev A
A
A
of Date: Monday, April 21, 2003 Sheet 2 46 PROPERTY NOTE: this document contains information confidential and property to TOPSTAR and shall not be reproduced or transferred to other documents or disclosed to others or used for any purpose other than that for which it was obtained without the expressed written consent of TOPSTAR
华硕ASUSF3Jvrev2.0笔记本电脑电路图
Finger Print
PAGE 31
4 3 2
Engineer:
Ryan Wang
Rev 2.0
Project Name Sheet 1 of 94
5
4
3
2
1
Pin Pin
32 33 36 37 38
D
Pin Name
Signal Name
VSUS_ON VSUS_GD# CPUPWR_GD# PM_PWRBTN# SUSC_ON SUSB_ON CPU_VRON PM_RSMRST# ICH7_PWROK WATCH_DOG# / CHG_EN# PRECHG BAT_LL# BAT_LEARN O O O O O I I O O O O O O O
PAGE 76
SOUTH BRIDGE
ICH7-M
PAGE 72
SATA HDD
PAGE 72
ISA ROM
PAGE 64
EC
ITE IT8510E
PAGE 59
AZALIA CODEC
Realtek ALC660
PAGE 15,16,17,18 PAGE 56
AUDIO AMP
PAGE 57
Internal KB
USB Port X4
PAGE 62 PAGE 44,45
Bluetoot52
A
A
54 55 56 57 58 59 60
CMOS Camera
PAGE 33
Title : Block Diagram
ASUSTek Computer INC. NB1 Size Custom Date: Wednesday, September 13, 2006
华硕ASUS笔记本电脑电路原理图(PDF 70页)
<Variant Name><Variant Name><Variant Name>DIM DDR3 SP-DIMM CHANNEL BEngineer:<Variant Name><Variant Name><Variant Name>Engineer:<Variant Name>Engineer: ASUSTeK COMPUTER INC<Variant Name>Title :Engineer: ASUSTeK COMPUTER INCSize Project Name<Variant Name>Engineer: ASUSTeK COMPUTER INC<Variant Name>Engineer: ASUSTeK COMPUTER INC<Variant Name>Engineer: ASUSTeK COMPUTER INC<Variant Name>Title :Engineer: ASUSTeK COMPUTER INCSize Project NameEngineer: ASUSTeK COMPUTER INC<Variant Name>Engineer: ASUSTeK COMPUTER INC<Variant Name>Engineer: ASUSTeK COMPUTER INC<Variant Name>Engineer: ASUSTeK COMPUTER INC<Variant Name>Engineer:<Variant Name>Engineer: ASUSTeK COMPUTER INCEngineer: ASUSTeK COMPUTER INCROM FLASH ROM TOUCH PAD KB <Variant Name>Engineer:ASUSTeK COMPUTER INC<Variant Name>Title :Engineer: ASUSTeK COMPUTER INCSize Project Name<Variant Name>Engineer:<Variant Name>Engineer:Engineer: ASUSTeK COMPUTER INC. NB1Engineer:<Variant Name>Engineer:Engineer:<Variant Name>Engineer:<Variant Name>Engineer:Engineer:<Variant Name>FAN THERMAL SENSOR FAN CONNEngineer:Engineer:<Variant Name>Engineer:<Variant Name><Variant Name>Engineer:Engineer:<Variant Name>Engineer: ASUSTeK COMPUTER INCEngineer:<Variant Name>Engineer: ASUSTeK COMPUTER INCEngineer:<Variant Name>Title :Engineer: ASUSTeK COMPUTER INC. NBSize Project Name<Variant Name>Engineer: ASUSTeK COMPUTER INC. NB<Variant Name>Title :Engineer: ASUSTeK COMPUTER INC. NBSize Project NameEngineer:ASUSTeK COMPUTER INC. NBTotal count: 29 pcs。
dell d600电路图
HD#[0..63]
R867 schould be close to ICH4
HD#[0..63] 6 THERMTRIP# IERR# CPUPWRGD R867 R538 R539 56 56 332/F TCK TRST# R544 R546 27 680
A
VTT
Banias
1 OF 3
A
R546 should be place within 2" of the processor ; others place near ITP
Reset circuit RTC BATTERY
GND AGND GNDP
ALL PAGES
DIGITAL GROUND AUDIO GND CPU POWER GND CHARGER GND DC/DC POWER GND COMBO CONN GND
D
Battery Selector & Charger CPU Power
RUN_ON SUS_ON
RUN_ON
B
21 22 23-24 25-26 27-28 29 30-31 32 33-34 35-36
C
SUS_ON HDDC_EN# MODC_EN# FDD/LPT# FAN_OFF/ON# RUN_ON
MINI-PCI & MDC CONN
SIO SERIAL & PARALLEL FLASH
TOUCH PAD & SWITCH&LED FAN & THERMAL AC97 CODEC & connector LAN(KENAI32-LAVON) & JACK
FIR
C
37 38-39 40 41 42-43 44 45 46 47
DELL13系统笔记本主板的电路图
1 1. 2
• POWER_SW#為開機瞬時脈沖,是低有效信號,當此信號被按Switch拉Low時 去觸發U17(KBC) ,其寬度與按switch時間相關 ,使KBC發給ICH的 PM_PWRBTN#也瞬時被拉Low ,ICH收到脈沖信號就會發出信號去開啟後 面的電壓 .同時KBC還給一個RSMRST#_KBC高電位送給ICH .
-5 -
4.9 -5
4.9
• DCBATOUT供給U69(TPS51120)DCBATOUT_51120 .直接產生 +5V_AUX_S5 , +3D3V_AUX_S5兩個最基礎的電壓 . power_sw#触發前狀 態下主板需要的各種電壓 . +3D3V_AUX_S5也替代Battery給CMOS供電 .
4.1
-4
-
3.9
-6
-5
-6
- 5.1
-4 -
• AD+供給U36(Charge chip)MAX8731_DCIN ,和經R145.1/R17分壓的 MAX8731_ACIN . U36產生MAX8731_LDO ===>>ACAV_IN (3.3V高電位) .
• ACAV_IN為Hi經Q5(N溝道MOS)將AC_IN#拉成低電位Low給U17(KBC) .
U46的導通條件 AD+_JK轉換成AD+ 19V .
-6 -5
-6 -
5.1
• AD+供給U36(Charge chip)MAX8731_DCIN,和AD+經R15/R17分壓的 MAX8731_ACIN.
• AD+ 又經U50(P溝道MOS)轉換成DCBATOUT(M/B真正需要的電壓19V) .
典型笔记本电脑电路原理图_K43-090909
RP5 1 3 RP6 1 3
CLK_PCIE_MINI_C 35 CLK_PCIE_MINI_C# 35 2 *4P2R-S-0 DREFCLK 7 4 DREFCLK# 7 2 *4P2R-S-0 DREFSSCLK 7 4 DREFSSCLK# 7 CLK_PCIE_SATA 19 CLK_PCIE_SATA# 19
1
】
2
3
4
典典典典典典典典笔（INTEL PM45 PLATFORM）
整
理
转 载
D
CPU CORE(ISL6266A)
第43页
CPU
Penryn 478pin uPGA 35W
第4、5页
CPU THERMAL SENSOR
第5页
14.318MHz
D
CLK_CPU_BCLK,CLK_CPU_BCLK# CLK_MCH_BCLK,CLK_MCH_BCLK# DREFCLK,DREFCLK# DREFSSCLK,DREFSSCLK#
+3V
10U/6.3V
0.1U/10V
0.1U/10V
0.1U/10V
0.1U/10V
54 53 51 50 47 46
m
CLK_CPU_BCLK CLK_CPU_BCLK# CLK_MCH_BCLK CLK_MCH_BCLK# CPU_ITP RP1 1 3 CPU_ITP# R_DOT96 R_DOT96#
1 2 3
典典 笔笔笔笔笔笔笔笔笔笔 （INTEL PM45 ） 内内： 制笔制： qiumanliang 4 页页： 日日：
1 of 45 200909
1 +3V
L1
HI0805R800R-00