GM55 材质性能说明
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● Measure method:最大施力Contact force至50±10g,阻抗值必須要1Ω以下 (A,B,C,D)
D C
A
B
15
Confidential and Proprietary Information
◆Conclusion
1. Drop Test :heigh is 110 meter . Pass 2.Bending Test : 28 kg .Pass
PS.:單位比重的強度比較
Strength/Gravity比強度 (強度/比重)
Strength 強度 (N/㎜2)
アルミニウム Aluminum (1050-H24)
2.7
125
46
アルミニウムAluminum (5052-H34)
2.7
240
89
アルミニウムAluminum (GM55-H38)
●Tooling L/T :15 days ,For T0 ●T2 ,we can lock down if no ECN 3 Confidential and Proprietary Information
Mechanical Properties
Typical physicБайду номын сангаасl properties:
●Salt Test : 48 HR pass
13
Confidential and Proprietary Information
●Thermal Shock Test:
12 Days Pass
14
Confidential and Proprietary Information
6. Conductivity Issue
16
Confidential and Proprietary Information
(1) Electrical resistivity (2) Thermal conductivity (3) Modulus of elasticity (4) Melting point (5) Density 27.2 (%IACS) 110(w/mK,@25 deg.C) 70 (KN) 575 (deg.C) 2.64 (g/cm3)
Material
SUS-3D GM55-H38
卯釘
$0.0
CNC
$0.2
雷焊
$0.3
$0.03
$0.15
$0.0 3.0 mm
* 1 pcs
●CNC :0.4 t to 0.2 t ,Cycle time :60 sec ●卯釘 : GM55 easy to do than SUS
0.2mm
3.0
2.1mm
2.7
400
148
マグネシウムMagnesium (AZ91 Die-cast)
1.80
230
127
銅 Cupper 鋼 Steel ステンレス Stainless Steel SUS304½H
8.90 7.85 7.90
343 412 834
39 52 106
チタン Titanium
4.5
392
9 9 87
13 kg
●Flatness : Under <=0.3 mm (P1,P2,P3,P4,P5,P6)
After insert mold
●卯釘 : 扭力& 拉力 SUS >GM 55
12
Confidential and Proprietary Information
5. Reliability Test
高強度的GM55-H38用來代替、取代SUS t0.3mm是最合適的。
手機外框、液晶部品等已有很多運用實例。 鋁材是無磁性。 對GPS是毫無任何影響。
Good for changing from SUS304-0.3t mm , for cost-down, light-weight. Very high strength 5 Aluminum GM55-H38. Aluminum never magnetized, no-effect for GPS. 5
4
Confidential and Proprietary Information
GM55 Replace the SUS:
<1>SHARP
SH907(D) JA-03(S) EB-4045 SUS304 800MPa 625MPa
MP
<2>Panasonic
GM55-H38 410MPa 310 M Pa <3>NEC CYCLONE
◆化学成分 Chemical Composition
6
5.Sumitomo Light Metal / Alloys for IT Shell
7 7
◆金属工業の電子產品用途 鋁合金 Aluminum Alloy for IT field
8 8
◆金属素材 (比強度)
Material 素材 Gravity 比重
Material SUS-3D GM55-H38 $USD $6.89 $8.5 PCS/ Cost ($ ) $0.214 $0.085
*no Ni Plate
差異:0.129
10
Confidential and Proprietary Information
3. Process cost ( as .Page 2 )
GM55 Mobile Insert Metal
1
Confidential and Proprietary Information
2
Confidential and Proprietary Information
Rivet ●Process:連續模沖壓--->卯釘(rivet)--->清洗-->皮膜(導電) ●Capacity:40k 1 day/ 1 tooling
◆Comparisons
1. Weight (g)
Material
Dimension (mm) 137 *73*0.4t 137 *73*0.4t
Gravity
Weight (Kg) 0.010 0.031
Weight(g)
GM55 SUS 304
2.64 7.85
10g 31g
2. Material cost ($ )
3.Conductivity : <1 Ω . Pass
4.Flatness : 0.25 mm ,after insert mold .Pass
5.Salt Test :48 hour .Pass
6.Reduced the extra 2nd process.(used the Rivet to replace the laser spot)
UPDATE
2.6
1.9mm
11
Confidential and Proprietary Information
4. SPEC
( as .Page 2 )
Material SUS-3D GM55-H38
平面度(0.2/0.3 mm)
扭力(3KG)
拉力(10KG)
0.25
3 kg
15 kg
0.25
2 kg
D C
A
B
15
Confidential and Proprietary Information
◆Conclusion
1. Drop Test :heigh is 110 meter . Pass 2.Bending Test : 28 kg .Pass
PS.:單位比重的強度比較
Strength/Gravity比強度 (強度/比重)
Strength 強度 (N/㎜2)
アルミニウム Aluminum (1050-H24)
2.7
125
46
アルミニウムAluminum (5052-H34)
2.7
240
89
アルミニウムAluminum (GM55-H38)
●Tooling L/T :15 days ,For T0 ●T2 ,we can lock down if no ECN 3 Confidential and Proprietary Information
Mechanical Properties
Typical physicБайду номын сангаасl properties:
●Salt Test : 48 HR pass
13
Confidential and Proprietary Information
●Thermal Shock Test:
12 Days Pass
14
Confidential and Proprietary Information
6. Conductivity Issue
16
Confidential and Proprietary Information
(1) Electrical resistivity (2) Thermal conductivity (3) Modulus of elasticity (4) Melting point (5) Density 27.2 (%IACS) 110(w/mK,@25 deg.C) 70 (KN) 575 (deg.C) 2.64 (g/cm3)
Material
SUS-3D GM55-H38
卯釘
$0.0
CNC
$0.2
雷焊
$0.3
$0.03
$0.15
$0.0 3.0 mm
* 1 pcs
●CNC :0.4 t to 0.2 t ,Cycle time :60 sec ●卯釘 : GM55 easy to do than SUS
0.2mm
3.0
2.1mm
2.7
400
148
マグネシウムMagnesium (AZ91 Die-cast)
1.80
230
127
銅 Cupper 鋼 Steel ステンレス Stainless Steel SUS304½H
8.90 7.85 7.90
343 412 834
39 52 106
チタン Titanium
4.5
392
9 9 87
13 kg
●Flatness : Under <=0.3 mm (P1,P2,P3,P4,P5,P6)
After insert mold
●卯釘 : 扭力& 拉力 SUS >GM 55
12
Confidential and Proprietary Information
5. Reliability Test
高強度的GM55-H38用來代替、取代SUS t0.3mm是最合適的。
手機外框、液晶部品等已有很多運用實例。 鋁材是無磁性。 對GPS是毫無任何影響。
Good for changing from SUS304-0.3t mm , for cost-down, light-weight. Very high strength 5 Aluminum GM55-H38. Aluminum never magnetized, no-effect for GPS. 5
4
Confidential and Proprietary Information
GM55 Replace the SUS:
<1>SHARP
SH907(D) JA-03(S) EB-4045 SUS304 800MPa 625MPa
MP
<2>Panasonic
GM55-H38 410MPa 310 M Pa <3>NEC CYCLONE
◆化学成分 Chemical Composition
6
5.Sumitomo Light Metal / Alloys for IT Shell
7 7
◆金属工業の電子產品用途 鋁合金 Aluminum Alloy for IT field
8 8
◆金属素材 (比強度)
Material 素材 Gravity 比重
Material SUS-3D GM55-H38 $USD $6.89 $8.5 PCS/ Cost ($ ) $0.214 $0.085
*no Ni Plate
差異:0.129
10
Confidential and Proprietary Information
3. Process cost ( as .Page 2 )
GM55 Mobile Insert Metal
1
Confidential and Proprietary Information
2
Confidential and Proprietary Information
Rivet ●Process:連續模沖壓--->卯釘(rivet)--->清洗-->皮膜(導電) ●Capacity:40k 1 day/ 1 tooling
◆Comparisons
1. Weight (g)
Material
Dimension (mm) 137 *73*0.4t 137 *73*0.4t
Gravity
Weight (Kg) 0.010 0.031
Weight(g)
GM55 SUS 304
2.64 7.85
10g 31g
2. Material cost ($ )
3.Conductivity : <1 Ω . Pass
4.Flatness : 0.25 mm ,after insert mold .Pass
5.Salt Test :48 hour .Pass
6.Reduced the extra 2nd process.(used the Rivet to replace the laser spot)
UPDATE
2.6
1.9mm
11
Confidential and Proprietary Information
4. SPEC
( as .Page 2 )
Material SUS-3D GM55-H38
平面度(0.2/0.3 mm)
扭力(3KG)
拉力(10KG)
0.25
3 kg
15 kg
0.25
2 kg