集成电路专业英语词汇 - Copy(1)

Abrupt junction突变结Accelerated testing加速实验
Acceptor受主Acceptor atom受主原子
Accumulation积累、堆积Accumulating contact积累接触
Accumulation region积累区Accumulation layer积累层
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Differential capacitance微分电容Diffused junction扩散结
Diffusion扩散Diffusion coefficient扩散系数
Diffusion constant扩散常数Diffusivity扩散率
Diffusion capacitance/barrier/current/furnace扩散电容/势垒/电流/炉
Copper interconnection system铜互连系统Couping耦合
Covalent共阶的Crossover跨交
Critical临界的Crossunder穿交
Crucible坩埚Crystal defect/face/orientation/lattice晶体缺陷/晶面/晶向/晶格
Break down击穿Break over转折
Brillouin布里渊Brillouin zone布里渊区
Built-in内建的Build-in electric field内建电场
Bulk体/体内Bulk absorption体吸收
Bulk generation体产生Bulk recombination体复合
Bipolar双极性的Bipolar Junction Transistor (BJT)双极晶体管
Bloch布洛赫Blocking band阻挡能带
Blocking contact阻挡接触Body - centered体心立方
Body-centred cubic structure体立心结构Boltzmann波尔兹曼
Active region有源区Active component有源元
Active device有源器件Activation激活
Activation energy激活能Active region有源（放大）区
Admittance导纳Allowed band允带
Alloy-junction device合金结器件Aluminum(Aluminium)铝
Channel width沟道宽度Characteristic impedance特征阻抗
Charge电荷、充电Charge-compensation effects电荷补偿效应
Charge conservation电荷守恒Charge neutrality condition电中性条件
Charge drive/exchange/sharing/transfer/storage电荷驱动/交换/共享/转移/存储
Burn - in老化Burn out烧毁
Buried channel埋沟Buried diffusion region隐埋扩散区
Can外壳Capacitance电容
Capture cross section俘获截面Capture carrier俘获载流子
Carrier载流子、载波Carry bit进位位
Delay延迟Density密度
Density of states态密度Depletion耗尽
Depletion approximation耗尽近似Depletion contact耗尽接触
Depletion depth耗尽深度Depletion effect耗尽效应
Depletion layer耗尽层Depletion MOS耗尽MOS
Aluminum–oxide铝氧化物Aluminum passivation铝钝化
Ambipolar双极的Ambient（周围的）temperature环境温度
Amorphous无定形的，非晶体的Amplifier功放扩音器放大器
Analogue(Analog) comparator模拟比较器Angstrom埃（10-10m）
Backward反向Backward bias反向偏置
Ballasting resistor整流电阻Ball bond球形键合
Band能带Band gap能带间隙
Barrier势垒Barrier layer势垒层
Barrier width势垒宽度Base基极
Base contact基区接触Base stretching基区扩展效应
Compensated impurities补偿杂质Compensated semiconductor补偿半导体
Complementary Darlington circuit互补达林顿电路
Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)
Digital circuit数字电路Dipole domain偶极畴
Dipole layer偶极层Direct-coupling直接耦合
Direct-gap semiconductor直接带隙半导体Direct transition直接跃迁
Discharge放电Discrete component分立元件
Double-diffusive MOS(DMOS)双扩散MOS.
Drift漂移Drift field漂移电场
Drift mobility迁移率Dry etching干法腐蚀
Dry/wet oxidation干/湿法氧化Dose剂量
Duty cycle工作周期Dual-in-line package（DIP）双列直插式封装
Base transit time基区渡越时间Base transport efficiency基区输运系数
Base-width modulation基区宽度调制Basis vector基矢
Bias偏置Bilateral switch双向开关
Binary code二进制代码Binary compound semiconductor二元化合物半导体
Deep acceptor level深受主能级Deep donor level深施主能级
Deep impurity level深度杂质能级Deep trap深陷阱
Defeat缺陷
Degenerate semiconductor简并半导体Degeneracy简并度
Degradation退化Degree Celsius(centigrade) /Kelvin摄氏/开氏温度
Czochralski technique切克劳斯基技术（Cz法直拉晶体J）
Dangling bonds悬挂键Dark current暗电流
Dead time空载时间Debye length德拜长度
De.broglie德布洛意Decderate减速
Decibel (dB)分贝Decode译码（encode）
Current density电流密度Curvature曲率
Cut off截止Current drift/dirve/sharing电流漂移/驱动/共享
Current Sense电流取样Curvature弯曲
Custom integrated circuit定制集成电路Cylindrical柱面的
Czochralshicrystal直立单晶
Anneal退火Anisotropic各向异性的
Anode阳极Arsenic (AS)/a:rsnik/砷
Auger俄歇Auger process俄歇过程
Avalanche雪崩Avalanche breakdown雪崩击穿
Avalanche excitation雪崩激发
Background carrier本底载流子Background doping本底掺杂
Dynamics动态Dynamic characteristics动态属性
Dynamic impedance动态阻抗
Early effect厄利效应Early failure早期失效
Chemmical etching化学腐蚀法Chemically-Polish化学抛光
Chemmically-Mechanically Polish (CMP)化学机械抛光Chip芯片
Chip yield芯片成品率Clamped箝位
Clamping diode箝位二极管Cleavage plane解理面
Depletion region耗尽区Deposited film淀积薄膜
Deposition process淀积工艺Design rules设计规则
Die芯片（复数dice）Diode二极管
Dielectric介电的Dielectric isolation介质隔离
Difference-mode input差模输入Differential amplifier差分放大器
Bond键、键合Bonding electron价电子
Bonding pad键合点Bootstrap circuit自举电路
Bootstrapped emitter follower自举射极跟随器Boron硼
Borosilicate glass硼硅玻璃Boundary condition边界条件
Bound electron束缚电子Breadboard模拟板、实验板
Clock rate时钟频率Clock generator时钟发生器
Clock flip-flop时钟触发器Close-packed structure密堆积结构
Close-loop gain闭环增益Collector集电极
Collision碰撞Compensated OP-AMP补偿运放
Common-base/collector/emitter connection共基极/集电极/发射极连接
互补金属氧化物半导体场效应晶体管
Complementary error function余误差函数
Computer-aided design (CAD)/test(CAT)/manufacture(CAM)计算机辅助设计/测试/制造
Compound Semiconductor化合物半导体Conductance电导
Carry-in bit进位输入Carry-out bit进位输出
Cascade级联Case管壳
CathodeBiblioteka Baidu极Center中心
Ceramic陶瓷（的）Channel沟道
Channel breakdown沟道击穿Channel current沟道电流
Channel doping沟道掺杂Channel shortening沟道缩短
Contact接触Contamination治污
Continuity equation连续性方程Contact hole接触孔
Contact potential接触电势Continuity condition连续性条件
Contra doping反掺杂Controlled受控的
Converter转换器Conveyer传输器
Conduction band (edge)导带(底)Conduction level/state导带态
Conductor导体Conductivity电导率
Configuration组态Conlomb库仑
Conpled Configuration Devices结构组态Constants物理常数
Constant energy surface等能面Constant-source diffusion恒定源扩散
Common-gate/drain/source connection共栅/漏/源连接
Common-mode gain共模增益Common-mode input共模输入
Common-mode rejection ratio (CMRR)共模抑制比
Compatibility兼容性Compensation补偿
Dissipation耗散Distribution分布
Distributed capacitance分布电容Distributed model分布模型
Displacement位移Dislocation位错
Domain畴Donor施主
Donor exhaustion施主耗尽Dopant掺杂剂
Doped semiconductor掺杂半导体Doping concentration掺杂浓度