第02讲——测试过程和设备 超大规模集成电路测试技术课件

2020/10/3
VLSI Test: lpx/Lecture 2
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1. Motivation 驱动
Need to understand some Automatic Test Equipment (ATE) technology / 理解ATE技术
➢Influences what tests are possible / 可能的测试 ➢Serious analog measurement limitations at high digital
IIL, IIH
2020/10/3
VLSI Test: Lecture 2 -> Motivation
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2.2 Verification Testing 验证测试
阶段：量产前 目的：确保设计正确，满足所有规范 任务：进行功能测试和参数测试，甚至内部节
点的测试：
➢Scanning Electron Microscope tests ➢Bright-Lite detection of defects ➢Electron beam testing ➢Repeated functional tests
frequency or in the analog domain / 模拟测量限制
➢Need to understand capabilities for digital logic, memory, and analog test in System-on-a-Chip (SOC) technology / SOC技术下的测试
2020/10/3
VLSI Test: lpx/Lectturing Test 生产测试
阶段：量产
目的：Determines whether manufactured chip meets specs /
确保生产出的芯片满足规范
任务：
➢Must cover high % of modeled faults / 高覆盖率 ➢Must minimize test time (to control cost) / 低成本 ➢No fault diagnosis / 非诊断 ➢Tests every device on chip / 每个器件 ➢Test at speed of application or speed guaranteed by
Lecture 2 VLSI Testing Process and Equipment
第二讲：VLSI测试过程和设备
2020/10/3
VLSI Test: lpx/Lecture 2
1
Contents 内容目录
1. Motivation / 驱动 2. Types of Testing / 测试类型 3. Test Specifications and Plan / 测试规范和计划 4. Test Programming / 测试编程 5. Test Data Analysis / 测试数据分析 6. Automatic Test Equipment / 自动测试设备 7. Parametric Testing / 参数测试 8. Summary / 总结
supplier / 尽量实速测试
分类：对应生产环节：生产过程中=〉wafer=〉封装
2020/10/3
VLSI Test: lpx/Lecture 2
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2.3.1 Progress Tests 生产过程中测试
为了确保wafer处理过程自身的完整性，有时 会在生产过程中做些测试，但大多数测试是 在wafer生产出后进行：
2020/10/3
VLSI Test: lpx/Lecture 2
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2.3.2 Wafer Tests 圆片测试
阶段：第一次生产测试– done before wafer is
scribed and cut into chips
任务：Wafer sort or probe test / 分级
方法：Includes test site characterization – specific
test devices are checked with specific patterns to measure:
阶段： Continue throughout production life of chips
to improve design and process to increase yield
目的：确定器件操作（内外环境）的确切限制 手段： 根据设计规范，进行Worst-case test
➢Choose test that passes/fails chips / 是否通过 ➢Select statistically significant sample of chips / 统计采样 ➢Repeat test for every combination of 2+ environmental
variables / 环境变量组合
➢Plot results in Shmoo plot / 图示 ➢Diagnose and correct design errors / 分析诊断
2020/10/3
VLSI Test: lpx/Lecture 2
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2.2.2 Shmoo Plot Shmoo点图
Need to understand parametric testing/理解参数测试
➢Used to take setup, hold time measurements ➢Use to compute VIL , VIH , VOL , VOH , tr , tf , td , IOL, IOH ,
手段：使用特殊的、专门的工具
➢Artificial intelligence (expert system) methods
成本：Ferociously expensive / 极度昂贵
2020/10/3
VLSI Test: lpx/Lecture 2
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2.2.1 Characterization Test 特性测试