铜线工艺介绍-2012 Nov
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3
铜线与金线相比的优势
Advantages between copper wire and gold wire
ü 物理性能比较 Physical properties comparison
铜线和金线的硬度比较 Comparison of the hardness of the copper and gold wire
铜线和金线的抗断裂比较 Copper and gold wire relative breaking load
l与金线相比，铜线的物理性能具有硬度高、抗断裂强度大的特点，在键合工艺方面弧性和一致性好，可以避 免塌丝现象。
Compared with gold wire, the physical properties of the copper has higher hardness, higher fracture resistance, the better wire loop and consistency in the bonding process, and that can avoid the sagging wire phenomena too.
•
金铜产品失效率相当 DPPM is equivalent between Cu and Au l 总体来说，铜线和金线的产品客户投诉失效率都小于0.1PPM Overall, Cu wire and Au wire returned DPPM is less than 0.1 PPM l 两年来未收到由于铜线产品切换导致的客户投诉 There is no any Cu wire related complaint from the marketing in the recent 2 years (~1500KK shipment). 8
金线 Gold wire
金线是铜线的3-8倍 The price of gold wire is 3-8 times more ewenku.baidu.compensive than
copper
5.88
4.55
1.6uΩ/cm
2.3uΩ/cm
备注 Remark
铜线成本低 Copper low cost
铜线导电性更好 Copper excellent conductivity 铜线在相同的线径情况下可承载更大的电流 The same diameter copper can carry larger current
ü 铜线的硬度比金线大，需要更高的键合功率，如果氧化了会更硬，易产生Pad Al的挤出问题；易造成Pad 金属下的Si衬底破损，出现弹坑。 High bonding power needed due to copper hardness. Harder if oxidized, easy to cause the Pad Al extrusion; easily lead to the Si substrate Pad metal damage and appeared crater.
2
铜线与金线相比的优势 Advantages between copper wire and gold wire
n铜线封装相比金线封装的优势在哪里？ What’s the advantages between copper wire and gold wire?
ü 金线与铜线性能比较 The characteristic comparison table between copper and gold wire
(certainly, which is a copper process difficulty point)
121天生长1um Cu/Al 化合物 1天生长8um Au/Al 化合物
121um /day IMC
8um/day IMC
铜线金属化合物生长慢，可靠性更高 Copper IMC growth slow and high reliability
• Cu线镀Pd，提高抗氧化性。 Cu wire plating Pd, improve the oxidation resistance
The first key point is to select the high quality copper wire supplier is very important , for example: HERAUES , Nippon , MKE, Heesung, ,
401W/m*k
318W/m*k
铜线热传导好，容易散热 Good thermal conductivity of copper wire, easy to dissipate heat
369mn/m2 210-370N/mm2
216mn/m2 120-220N/mm2
铜线弧形和一致性好，无塌丝现象
Good arcs and consistency, no sagging wire (当然,这也是铜线工艺的难点)
The reference data about reliability study
ü铜线可靠性认证条件
• The formal copper wire evaluation standard (only for package qualification and don’t include the device qualification).
Copper is easy to oxidation than gold wire, causing the solder balls are not round、bonding non-stick and other issues.
未氧化的Cu线焊球 Un-oxidized Cu Ball
已氧化的Cu线焊球 Oxidized Cu Ball
The Cu wire monocrystalline: improve the oxidation (polycrystalline Cu wire 2 days,, monocrystalline Cu wire 7 days)
• Cu线软化，降低其硬度（4N,无氧，掺微量元素） Cu wire soften, reduce the hardness (4N, anaerobic, doped trace elements)
铜线和金线的电阻值比较 Comparison of resistance value of copper and gold wire
l与金线焊点相比，铜线电阻小能承受更大的电流并且铜线焊点中的金属间生长速度慢，因此降低了电阻、减小 了产热，老化速度减慢并最终提高了焊接可靠性和器件性能。
lCompared with the gold wire, copper wire resistance is smaller can load larger currents ,also IMC growth speed is slower than gold . Copper wire reducing the resistance, heat and slowing aging to improve bondi5ng reliability and performance of the device.
l但是从上面图表来看, 随着线经的增加, 铜线与金线在硬度上面与断裂强度上面都有更大的差异性, 所以, 铜 线工艺也具有更加明显的优缺点.
Based on the upper trend chart, there is the more obvious excellence and shortcoming. 4
铜线与金线相比的优势
Advantages between copper wire and gold wire
ü可靠性比较 Reliability Comparison
铜线和金线的金属化合物生长速度比较 Comparison of IMC growth speed between copper and gold wire
铜线工艺介绍 Copper wire process
instruction
QRA: Nov.2012
铜线工艺介绍 Copper wire process instruction
n铜线封装与金线封装相比的优势 Advantages of Copper wire compared to the Gold wire process n铜线产品业务趋势 Copper wire business development trend n铜线制程的技术难点及解决方案 Copper wire process technical challenges and solutions n铜线产品设计和制造工艺 Copper wire products design and manufacturing process n铜线封装判定主要标准 The main criteria of Copper wire bonding
BCD Cu Wire Shipment Trend
2500 2000 1500 1000
500 0
Y2009
Y2010
Y2011
Y2012
Shipment(kk)
7
铜线产品业务趋势 Copper wire business development trend n Yield : Equivalent between Cu and Au
Subcon Cu Wire Transition Trend
70%
60% Cu Wire Loading
50%
40%
30%
20%
10%
0% Y2009
Y2010
Y2011
Y2012
• BCD has shipped more than 1500KK Cu parts in the past years.
• For customer special requirement, we will follow up the customer standard.
铜线产品业务趋势
Copper wire business development trend
n 金线价格逐年上涨
Au wire cost is increasing almost year by year
9
No crater
Crater photos
铜线制程的技术难点及解决方案 Copper wire process technical challenges & solutions
n铜线制程预防氧化解决方案 Copper wire oxidation Prevention solutions for processing. ü 预防铜线氧化 Oxidation Prevention ---Cu线的改进Cu wire improvements • Cu线单晶化，提高抗氧化性（多晶Cu线2天，单晶Cu线7天）
对比类型 Contrast type
成本 Cost
导电率20℃ Conductivity 20℃
电阻率 20℃ Resistivity 20℃
热传导率 Thermal conductivity
硬度 Hardness 抗张强度 Tensile Strength
老化实验 Aging test
铜线 Copper wire
铜线制程的技术难点及解决方案
Copper wire process technical challenges & solutions
n铜线封装制程技术难点有哪些？ What ‘s the technical challenges of copper wire process? ü 铜线比金线易于氧化，造成焊球不圆，压焊不粘等问题。
1
铜线与金线相比的优势
Advantages between copper wire and gold wire
n铜线封装相比金线封装的优势在哪里？ What’s the advantages between copper wire and gold wire?
ü 金线与铜线性能比较 The characteristic comparison table between copper and gold wire
铜线与金线相比的优势
Advantages between copper wire and gold wire
ü 物理性能比较 Physical properties comparison
铜线和金线的硬度比较 Comparison of the hardness of the copper and gold wire
铜线和金线的抗断裂比较 Copper and gold wire relative breaking load
l与金线相比，铜线的物理性能具有硬度高、抗断裂强度大的特点，在键合工艺方面弧性和一致性好，可以避 免塌丝现象。
Compared with gold wire, the physical properties of the copper has higher hardness, higher fracture resistance, the better wire loop and consistency in the bonding process, and that can avoid the sagging wire phenomena too.
•
金铜产品失效率相当 DPPM is equivalent between Cu and Au l 总体来说，铜线和金线的产品客户投诉失效率都小于0.1PPM Overall, Cu wire and Au wire returned DPPM is less than 0.1 PPM l 两年来未收到由于铜线产品切换导致的客户投诉 There is no any Cu wire related complaint from the marketing in the recent 2 years (~1500KK shipment). 8
金线 Gold wire
金线是铜线的3-8倍 The price of gold wire is 3-8 times more ewenku.baidu.compensive than
copper
5.88
4.55
1.6uΩ/cm
2.3uΩ/cm
备注 Remark
铜线成本低 Copper low cost
铜线导电性更好 Copper excellent conductivity 铜线在相同的线径情况下可承载更大的电流 The same diameter copper can carry larger current
ü 铜线的硬度比金线大，需要更高的键合功率，如果氧化了会更硬，易产生Pad Al的挤出问题；易造成Pad 金属下的Si衬底破损，出现弹坑。 High bonding power needed due to copper hardness. Harder if oxidized, easy to cause the Pad Al extrusion; easily lead to the Si substrate Pad metal damage and appeared crater.
2
铜线与金线相比的优势 Advantages between copper wire and gold wire
n铜线封装相比金线封装的优势在哪里？ What’s the advantages between copper wire and gold wire?
ü 金线与铜线性能比较 The characteristic comparison table between copper and gold wire
(certainly, which is a copper process difficulty point)
121天生长1um Cu/Al 化合物 1天生长8um Au/Al 化合物
121um /day IMC
8um/day IMC
铜线金属化合物生长慢，可靠性更高 Copper IMC growth slow and high reliability
• Cu线镀Pd，提高抗氧化性。 Cu wire plating Pd, improve the oxidation resistance
The first key point is to select the high quality copper wire supplier is very important , for example: HERAUES , Nippon , MKE, Heesung, ,
401W/m*k
318W/m*k
铜线热传导好，容易散热 Good thermal conductivity of copper wire, easy to dissipate heat
369mn/m2 210-370N/mm2
216mn/m2 120-220N/mm2
铜线弧形和一致性好，无塌丝现象
Good arcs and consistency, no sagging wire (当然,这也是铜线工艺的难点)
The reference data about reliability study
ü铜线可靠性认证条件
• The formal copper wire evaluation standard (only for package qualification and don’t include the device qualification).
Copper is easy to oxidation than gold wire, causing the solder balls are not round、bonding non-stick and other issues.
未氧化的Cu线焊球 Un-oxidized Cu Ball
已氧化的Cu线焊球 Oxidized Cu Ball
The Cu wire monocrystalline: improve the oxidation (polycrystalline Cu wire 2 days,, monocrystalline Cu wire 7 days)
• Cu线软化，降低其硬度（4N,无氧，掺微量元素） Cu wire soften, reduce the hardness (4N, anaerobic, doped trace elements)
铜线和金线的电阻值比较 Comparison of resistance value of copper and gold wire
l与金线焊点相比，铜线电阻小能承受更大的电流并且铜线焊点中的金属间生长速度慢，因此降低了电阻、减小 了产热，老化速度减慢并最终提高了焊接可靠性和器件性能。
lCompared with the gold wire, copper wire resistance is smaller can load larger currents ,also IMC growth speed is slower than gold . Copper wire reducing the resistance, heat and slowing aging to improve bondi5ng reliability and performance of the device.
l但是从上面图表来看, 随着线经的增加, 铜线与金线在硬度上面与断裂强度上面都有更大的差异性, 所以, 铜 线工艺也具有更加明显的优缺点.
Based on the upper trend chart, there is the more obvious excellence and shortcoming. 4
铜线与金线相比的优势
Advantages between copper wire and gold wire
ü可靠性比较 Reliability Comparison
铜线和金线的金属化合物生长速度比较 Comparison of IMC growth speed between copper and gold wire
铜线工艺介绍 Copper wire process
instruction
QRA: Nov.2012
铜线工艺介绍 Copper wire process instruction
n铜线封装与金线封装相比的优势 Advantages of Copper wire compared to the Gold wire process n铜线产品业务趋势 Copper wire business development trend n铜线制程的技术难点及解决方案 Copper wire process technical challenges and solutions n铜线产品设计和制造工艺 Copper wire products design and manufacturing process n铜线封装判定主要标准 The main criteria of Copper wire bonding
BCD Cu Wire Shipment Trend
2500 2000 1500 1000
500 0
Y2009
Y2010
Y2011
Y2012
Shipment(kk)
7
铜线产品业务趋势 Copper wire business development trend n Yield : Equivalent between Cu and Au
Subcon Cu Wire Transition Trend
70%
60% Cu Wire Loading
50%
40%
30%
20%
10%
0% Y2009
Y2010
Y2011
Y2012
• BCD has shipped more than 1500KK Cu parts in the past years.
• For customer special requirement, we will follow up the customer standard.
铜线产品业务趋势
Copper wire business development trend
n 金线价格逐年上涨
Au wire cost is increasing almost year by year
9
No crater
Crater photos
铜线制程的技术难点及解决方案 Copper wire process technical challenges & solutions
n铜线制程预防氧化解决方案 Copper wire oxidation Prevention solutions for processing. ü 预防铜线氧化 Oxidation Prevention ---Cu线的改进Cu wire improvements • Cu线单晶化，提高抗氧化性（多晶Cu线2天，单晶Cu线7天）
对比类型 Contrast type
成本 Cost
导电率20℃ Conductivity 20℃
电阻率 20℃ Resistivity 20℃
热传导率 Thermal conductivity
硬度 Hardness 抗张强度 Tensile Strength
老化实验 Aging test
铜线 Copper wire
铜线制程的技术难点及解决方案
Copper wire process technical challenges & solutions
n铜线封装制程技术难点有哪些？ What ‘s the technical challenges of copper wire process? ü 铜线比金线易于氧化，造成焊球不圆，压焊不粘等问题。
1
铜线与金线相比的优势
Advantages between copper wire and gold wire
n铜线封装相比金线封装的优势在哪里？ What’s the advantages between copper wire and gold wire?
ü 金线与铜线性能比较 The characteristic comparison table between copper and gold wire