各类IC芯片可靠性分析与测试

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Packing Level Reliability Test
PRECON TEST
T/C
T/S
(option)
HTS
T&H
PCT
(option)
Un-bias HAST
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Simulate Soldering Process Electrical Test
Decision
NDT using SAM
Moisture Sensitive Level
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IC Transportation Environment
T/C
Reflow for Soldering
220/240/260
T&H
PCB
y Dr
k ac P
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Defect after MSL/Pre-con. Test
Die Top Delamination
Die Crack
Package Crack
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Factors cause MSL failure
(滲透必要條件)
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Moisture Distribution(濕度分配)
Critical Point for Interfacial Moisture (界面濕度臨界點)is Pad Top Corner
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MSD control process
Process Material Receive 1. 2. 3. 1. 2. 1. Warehouse storage 2. 3. Control Item Do not open vacuum packing. Check is there any damage of vacuum packing. If vacuum pack damage, ask buyer inform supplier to rework, or change vacuum bag internally by receiving warehouse ,or base on indicator color to decide baking or not when take off vacuum packing.. Finish incoming inspection within 30 minutes after open vacuum packing, then re-packing again. Stick (粘貼)a control label on the bag, to record open/re-packing time for floor life evaluation. Check vacuum packing before issue material, no damage, no improper sealing. For reel package, one reel as one unit when issue material. For tray package, base on MO Q’ty, issue material within 30 minutes. If open the vacuum packing, it’s necessary to stick a control label on the bag to record open/repacking time for floor life evaluation. Check the indicator immediately when take off vacuum bag. If there is no indicator, check is there any control label from IQC or warehouse. Take off vacuum packing on line, and control by component’s moisture sensitive level. Store the MSD component in the moisture-proof cabinet(防潮柜) when line down or SMT machine down time. Record open time & entrance cabinet time on the control label, to evaluate floor life. Programming MSD IC within 1 hour. Use tray & vacuum packing after IC programming. Stick a control label on it for floor life evaluation. Follow component MSL to bake PCBA before repairing. Take of NG IC from PCBA by heat up under the PCBA to avoid IC delamination.
Defect after MSL/Pre-con. Test
1. Package Crack 2. Delamination 3. Electrical Open/Short
PKG CRACK DELAMINATION
CHIP CRACK
PKG CRACK
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Min =0.875mg/cm3 Max =2.216 0.875 1.024 1.173 1.322 1.471 1.620 1.769 1.918 2.067 2.216
Level 3, 30C/60%, 192hr, 20x20x1.4 QFP
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Moisture Absorption & De-sorption
0.40 0.35
MOISTURE ABSORPTION 潮濕吸收
0.40 0.35
MOISTURE DESORPTION 潮氣吸附作用
Moisture(wt %)
Moisture(wt%)
0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 24 48 72 96 120 144 168 192 216 240
l l l l l l l l l l l l l l
MSL or Pre-condition Test T/C Test (Temperature Cycling Test) T/S Test (Thermal Shock Test) HTST (High Temperature Storage Test) T&H Test (Temperature & Humidity Test) THB Test (Temperature, Humidity & Bias Test) PCT (Pressure Cooker Test) Un-Bias HAST (Highly Accelerated Stress Test) HAST (Highly Accelerated Stress Test) HTOL (High Temperature Operation Life Test / Burn-in) Data Retention Teat(數據保持測試) Joint Defect Test(連接點缺陷測試) Migration Defect Test(移植缺陷測試) Other Test
Incoming inspection
SMT
1. 2. 3.
MSL Test Flow & Simulate Item
EXT. Visual INSP & O/S Test SAM Inspection
Electrical Test
NDT(Non-Destructive Test 非破壞性試驗)using SAM
Temperature Cycle Test(-55oC/125oC, 5X) Dry Bake(125oC, 24HRS)
The fifth chapter: 5﹑All kinds of IC Reliability Test and analysis
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Kinds of IC Reliability Test item
0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 6 12 18 24 30 36 42 48
Time(hrs)
L3 L2 L1 L3
Time(hrs)
L2 L1
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1. Moisture Exist Inside Package Liquid Gas : Volume Expansion 1900X
240deg.C
1900X
Gas
Liquid
2. CTE Difference in Semiconductor Materials 3. Low Adhesive (低粘接性)btw Semiconductor Materials 4. Low Strength (低應力)of Semiconductor Materials
Simulate Temp. Changes during Transportation to customer Simulate Drying Process of silica gel(硅膠凝體) by dry pack in Production line
Temp & Humidity Test(Level 1,2,2a,3,4,5,6) Simulate Moisture Absorption Reflow(220/235/260oC, 3X) EXT. Visual INSP & O/S Test SAM Inspection
l
The purpose of pre-condition test is:
(1) To simulate(模擬) the procedure (程序)of shipping, storage and SMD board mount.
Reference: JESD22-A113, J-STD-020
MSL and Pre-condition
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The purpose of MSL (moisture sensitive level) test is:
(1) To specify packing method, dry pack or noБайду номын сангаасmal pack. (2) To specify the level of pre-condition test.