道康宁硅胶资料电子版

道康宁产品介绍

Shampoo with Dimethicone+Amino emulsion
含3% CE1689的香波有最好的湿梳型和柔软度.
16
提高头发颜色保护能力
Effect of Silicone on Color Retention on Hair (Delivered from a Rinse-off Conditoner Formulation)
含3% CE 1689 的香波有最好的干梳性
14
干的感觉
Sum (vote numbers from panelist)
45 40 35 30 25 20 15
10
5 0 Easy Dry Combing Shampoo with CE-1689 Dry Smoothness Dry Softness Shampoo with competitive emulsion
推荐用量:0.5~8%
有机硅乳液新产品介绍
Dow Corning® CE-1689 Smoothing Emulsion
Dow Corning® CE-1689 Smoothing Emulsion
INCI Name:
Dimethicone (and) Amodimethicone (and) Laureth-23 (and) Polyquaternium -10 (and) Laureth-4
Materials that prevent water loss protect hair fibers from heat damage.
香波 – 修复受损发质
100% 80% 150.0 60% 40% 20% 50.0 0% -20% Virgin Hair After Bleach Shampoo with 3% CE1619 0.0 100.0

道康宁部分固态胶资料

典型性能–至规格制定者：这些数据仅供参考，不得直接用于规格制订。

在制订关于这些产品的规格之前，请联系您当地的XIAMETER®销售代表。

有限保证信息—请仔细阅读
此处包含的信息是基于诚信而提供的，并被认为是准确的。

然而，由于使用本公司产品的条件和方法非我们所能控制，本信息不能取代客户为确保道康宁产品安全、有效、并完全满足于特定的最终用途而进行的测试。

我们所提供的使用建议，不得被视为侵犯任何专利权的导因。

道康宁的唯一保证，是产品满足发货时有效的道康宁销售规格。

若道康宁违反该保证，您所能获得的补偿，仅限于退还购货价款或替换不符合保证的任何产品。

道康宁特别声明，不作针对特定目的适用性或适销性的任何其他明示或暗示的保证。

道康宁声明，不对任何间接或附带性的损害承担责任。

Dow Corning 和 XIAMETER 是道康宁公司的注册商标。

AGP11096
Form No. 95-750-40
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道康宁DC791硅酮耐候胶说明书

道康宁DC791硅酮耐候胶——上海连宝特性和优点•是伸张、连接、周边密封和其它移动接口的理想密封材料•中性固化—适用于镀膜玻璃，镀锌钢板，砖石和其它多孔性，非多孔性材料•可将原接口宽度伸长/压缩50%•优良的耐候性、阳光、雨水、冰雪、臭氧或极端温度都不会造成不良影响•对大多数建筑材料和元件无须上底漆就能有良好的粘结性•容易使用—采用一般打胶枪随时挤出应用•优良的抗垂流性能，使用时产生的飘丝现象不明显组成•单组分，中性固化，室温水汽固化的硅酮密封胶应用•DOWSIL™ 791 硅酮耐候密封胶是专为普通玻璃装配和幕墙、建筑物外墙设计的高性能耐候防水产品。

产品说明DOWSIL 791 硅酮耐候密封胶是一种单组份，不垂流，中性固化密封胶，在大部分外界环境温度下能轻易地挤出使用，并借助于空气中的水份，与之反应固化形成耐久、有弹性的硅酮密封胶。

应用方法表面清理清除所有留存在接口处和装配部位的油脂、尘埃、水分、结霜，表面脏污、残留密封胶，玻璃装配附件和保护涂层等杂质及污染物。

注胶按照要求安裝背襯材料，玻璃墊塊，墊杆隔離物和膠帶。

接縫兩側區域應採用遮蔽膠帶，以確保密封膠密封線條的整潔美觀。

對非多孔性材料表面，通常不需要上底漆就有良好的黏結性，但是對於某些多孔性材料表面，可能需要上底漆以確保良好的黏結性，道康寧建議在工程開工前都應做黏結性測試。

使用時，將DOWSIL 791 矽酮耐候密封膠連續不斷地擠入並填滿接縫內(密封膠可以使用氣動膠槍和其他注膠設備進行施工）。

在密封膠表面尚未結皮時（打膠後的15 分鐘內），以適當的工具及力量將密封膠壓平於背襯材料和接縫表面上。

整平完畢後，立即將遮蔽膠帶撕掉。

颜色DOWSIL 791 硅酮耐候密封胶提供现成的8 种标准颜色：黑色、灰色、深灰、金属灰、古铜、岩灰、瓷白和白色。

也可以根据客户要求的特殊颜色。

储存当储存在30°C 以下原始未开封的包装时，DOWSIL 791 保质期为12 个月。

道康宁DC991硅酮密封胶说明书

道康宁DC991硅酮耐候密封胶——上海连宝道康宁991高性能硅酮密封胶特性1、高性能硅酮密封胶 50HM等级；满足美国ASTM C920-2010弹性封缝料规格标准 S型，NS类，50级、国标GB23261-2009 石材用建筑密封胶标准1 SR 50HM等级；2、中模量弹性体密封胶，特为敏感的天然石材、玻璃及金属板等材料设计生产；3、不会污染天然石材，并能有效减少在金属和玻璃面板上出现脏污垂流现象；4、中模量，高承受变位能力—在适当设计的接缝上可承受±50%原来接缝尺寸的变位；5、无需底漆即可与大部分建筑材料，如天然石材、玻璃、金属、瓷砖、含氟碳涂料表面涂层的材质及阳极电镀铝材具有优良的粘结力；6、优越的抗紫外线性能和耐候性能；7、良好的表面固化时间，有利于施工休整；道康宁991高性能硅酮密封胶说明1.道康宁991高性能硅酮密封胶对防止天然石材等多孔性材料的污染及大限度地减少金属板和玻璃的脏污垂流现象有良好效果，可用于新建或修缮建筑工程。

2.道康宁991高性能硅酮密封胶可与大多数建筑材料形成耐久，富弹性的防水接口。

经测试符合，美国ASTM C920-2010和国标GB23261-2009的各项性能指标。

3.储存方式：在27℃以下的干燥通风阴凉处贮存，贮存期为12个月。

4．使用前的准备工作：按照要求安装衬垫材料或接口填补剂，垫杆隔离物和胶带。

同接口相联的区域应采用遮蔽带，以确保密封胶密封线的整洁。

5.为确保在多孔性或非多孔性表面的粘结性，在工程开工前都应做粘结性测试。

6.注胶时应均匀施力，使胶充满被黏缝内然后修整：7.注意事项：不能作为结构密封胶使用；施工时应保持通风，因为密封胶需吸收空气中的水份固化。

8.切勿让小孩接触，若眼睛直接接触到未固化的胶黏剂应及时用大量的清水清洗并向医生求助。

道康宁SE4450 道康宁高导热硅胶北京

道康宁SE4450道康宁高导热硅胶北京
北京瑞德佑业 I8OOII3O865 王雅蓉
道康宁DOW CORNING SE4450
产品描述：
产品规格︰ SE4450
道康宁高导热硅胶SE4450，绝缘、导热，此材料提供了对产生热的电子零件，如IC、电晶体、处理器等具有极佳的导热与传热效果，有膏油脂状，有兼具导热与接着两种功能之橡胶状的接着剂，也有用于灌注用双组份型的产品的导热材料规格化垫片状等应用方式提供选择，产品耐高低温-50C--+200C以上。

产品特点：1、良好的接著力2、高热传导性2、固化时间短2、耐高低温(-60 ~ -250oC)
比重: 2.7；硬度: (JIS A) 85；抗张强度 50Kgf / cm2；延伸性 30 %；绝缘强度: 25KV / mmVolume Resistivity2 x 1014 Ωcm；接着力(铝): 30Kgf / cm2
热传导系数:4.5x10-3 cal / cm.sec.oC
主要市场︰ CPU之热导管
参考单价︰价优
付款方式︰另议
最小订量︰ KG
交货日期︰现货供应
认可标准︰ SGS,UL,MSDS；RTV 液態矽橡膠。

7268硅胶

典型物性
规格制定者：以下数值不可用于制订规格。制订本产品规格之前，请联系当地的道康宁销售处或道康宁全球联络处。
参数
物理形态外观稀释剂活性成分粘度 25℃(77℉) 25℃(77℉)时比重闭杯闪点
单位
% Cp оC оF
数值
高粘液体半透明二甲苯/甲苯 58-62 40,000-100,000 0.98 7.5 45.5
使用 98%的过氧化苯甲酰粉末可以取得最恒宁的效果。通过首先配制浓度为 10%的过氧化物于甲苯溶液, 可以实现过氧化物和粘合剂的最佳混合。
注意：混合配制后和过氧化物溶剂分散液只能使用一至两天，这是因为过氧化物在溶剂中会很快失去其活性。在混合过程中粘合剂和过氧化物的允分分散是保证成品使用效果一致性的必要条件。
2 过氧化苯甲酰：Luperox®A98，即原来 Afofina Chemicals North America 公司生产的 Lucidol® 98，以及美国 Akzo Chemie 公司 Noury Chemical 部生产的 Cadox®BFF 50 粉末或 BP 55 软膏。
由于基材、涂敷设备、固化周期和所需特性等因素的不同，过氧化物的浓度（以粘合剂固体含量计）可以在 0.5%至 3.0%之间变化。增加道康宁 7268 压敏胶中的过氧化物浓度将降低其初期粘力和粘合强度、但却可以提高产品的内聚强度。
在 66℃(150℉)温度下固化 1 分钟以除去溶剂，然后在 177-204℃ (350-400℉)温度下固化 2 分钟，这种方法可用于含过氧化苯甲酰粘合剂的固化。
如果设备和基材允许使用更高的固化温度，那么固化时间可以缩短与低温固化相比，提高固化温度可以在更短时间内达到粘合剂的内聚强度。不管是高温固化或低温固化，

道康宁JCR6101硅胶规格书

Product InformationLED MaterialsDow Corning®JCR 6101 UPTYPICAL PROPERTIESSpecification Writers: Please contact your local Dow Corning sales office or your GlobalDow Corning Connection before writing specifications on this product.Property UnitValue Viscosity cPmPa-secPa-sec194001940019.4Specific Gravity (Uncured) - 1.04Durometer Shore A (JIS) - 35Dielectric Strength volts/milkV/mm62524Volume Resistivity ohm*cm 2.9 E+15Shelf Life @ -5ºC months 6STORAGE AND SHELF LIFEShelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning one-part products require cold storage at or below -5°C (23°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Check the product label for specific storage conditions.DESCRIPTIONDow Corning® brand silicone LED (light emitting diode) encapsulants are designed to meet the challenging needs of the LED market, including high adhesion, high purity, moisture resistance, thermal stability and optical transmittance. Silicone materials can absorb stresses caused by thermal cycling inside the package, protecting the chip and thebonding wires. And with theelectronics industry quickly movingtoward lead-free processing, siliconeencapsulants, with theirdemonstrated, excellent stability atreflow temperatures, are a natural fitfor LED applications.PREPARING SURFACESSurfaces should be clean and dry.Recommended cleaning methodsinclude Dow Corning® brand OSFluids, naphtha, mineral spirits,methyl ethyl ketone (MEK) or othersuitable solvent. Rougher surfacestend to promote adhesion of siliconesto other surfaces.PROCESSING/CURINGThese products are also compatiblewith commercially availableequipment and industry standardprocesses. These materials can bedispensed or molded depending onthe product and application. DowCorning OS Fluids are recommendedto clean cured or uncured siliconeresidue from application equipment.ADHESIONDow Corning LED materials arespecially designed for adhesion tocommonly used LED substrates.Surface treatments such as chemicaletching or plasma treatment mayprovide a reactive surface andimprove adhesion to these types ofsubstrates. In general, increasing thecure temperature and/or cure timewill improve the ultimate adhesion.USEFUL TEMPERATURERANGESFor most uses, silicone encapsulantsand resins should be operational overa temperature range of -45 to 200°C(-49 to 392°F) for long periods oftime. However, at both the low- andhigh-temperature ends of thespectrum, behavior of the materialsand performance in particularapplications can become moreDow Corning and Sylgard are registered trademarks of Dow Corning Corporation. All other trademarks or brand names are the property of their respective owners. ©2008 Dow Corning Corporation. All rights reserved. Printed in USA Form No. 11-1300A-01complex and require additionalconsiderations. For low-temperature performance, thermal cycling toconditions such as -55°C (-67°F) may be possible, but performance should be verified for your parts or assemblies. Factors that may influence performance areconfiguration and stress sensitivity of components, cooling rates and hold times, and prior temperature history. At the high-temperature end, the durability of the cured silicone encapsulants and resins is time and temperature dependent. As expected, the higher the temperature, the shorter the time the material will remain useable.COMPATIBILITYCertain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: Organotin and other organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, polysulfides, polysulfones or other sulfurcontaining materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a givenapplication. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicatesincompatibility and inhibition of cure.HEALTH ANDENVIRONMENTAL INFORMATIONTo support customers in theirproduct safety needs, Dow Corning has an extensive Product Stewardship organization and a team of ProductSafety and Regulatory Compliance (PS&RC) specialists available in each area. For further information, please see our website,, or consult your local Dow Corning representative.LIMITATIONSThese products are neither tested nor represented as suitable for medical or pharmaceutical uses.LIMITED WARRANTY INFORMATION PLEASE READ CAREFULLYThe information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution for customer’s tests to ensure that Dow Corning’s products are safe, effective, and fullysatisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent. Dow Corning’s sole warranty is that the product will meet the DowCorning sales specifications in effect at the time of shipment. Yourexclusive remedy for breach of such warranty is limited to refund ofpurchase price or replacement of any product shown to be other than as warranted. DOW CORNINGSPECIFICALLY DISCLAIMS ANY OTHER EXPRESS OR IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR MERCHANTABILITY. DOW CORNING DISCLAIMS LIABILITY FOR ANY INCIDENTAL ORCONSEQUENTIAL DAMAGES.SAFE HANDLING INFORMATIONPRODUCT SAFETYINFORMATION REQUIRED FOR SAFE USE IS NOT INCLUDED IN THIS DOCUMENT. BEFORE HANDLING, READ PRODUCT AND MATERIAL SAFETY DATA SHEETS AND CONTAINER LABELS FOR SAFE USE, PHYSICAL AND HEALTHHAZARD INFORMATION. THE MATERIAL SAFETY DATA SHEET IS AVAILABLE ON THE DOW CORNING WEBSITE AT , OR FROM YOUR DOW CORNING REPRESENTATIVE, ORDISTRIBUTOR, OR BY CALLING YOUR GLOBAL DOW CORNING CONNECTION.For More InformationTo learn more about these and other products available from Dow Corning, please visit the Dow Corning Electronics website at / electronics.。

道康宁产品PC培训资料

培训内容
• 1、道康宁介绍 • 2、特殊化学品阐述 • 3、消泡剂 • 4、脱模剂 • 5、其他产品 • 6、世界有机硅品牌
道康宁特殊化学品
Dow Corning品牌
• Dow Corning是有机硅的发明者并始终保持领先地位。
• Dow Corning是一家持续创新的化工公司。 • Dow Corning产品销售特点：技术销售。 • 有机硅的广泛应用。 • 了解客户对有机硅的了解情况
罗地亚 8%
信越 13%
其它 10%
DC 36%
WACKER 15%
GE 18%
2 29 9
@A@ 谢谢！！
3 0
材料增强硅烷偶联剂玻纤浸润玻纤增强矿物增强铸造树脂电线电缆填料分散助剂有机硅包覆食品科学1520饮料果奶食品树脂改性3667tpu改性环氧树脂改性其他橡胶产品汽车美容品5211汽车轮胎皮革玻璃清洗养护光亮聚合物生产abs丙烯酸乳液聚氨酯环氧体系丁苯胶等水处理1410120a消泡剂配合杀菌剂等农药及油田dm43091165农药润湿剂消泡剂悬浮液消泡剂高温炼厂消泡剂特殊功能化学品道康宁有机硅产品系列思考
– Degussa Goldschmidt Tego: - Zijiang Trading as distributor (25MT/a) • MR1015(70% Si-organic), pricing RMB 150/kg ( $18.30/kg) • 793(100% Si-organic) RMB150/kg($18.3/kg) • 2840(100% Si-organic) RMB170/kg($21.25/kg)
速率和食品接触规范等。 • 是否直接使用？一般建议预稀释后添加消泡剂。 • 快速消泡or持续抑泡？ • 客户产品用途？丙烯酸胶粘剂产品要求有机硅消泡剂与丙烯酸

Sylgard184-1

组成●双组分硅橡胶固化●25~150℃特性●透明，介电稳定性，物理性能高物理形态●♉固化前：中等粘度液体●♉固化后：有韧性弹性体产品资料书道康宁SYLGARD 184 硅橡胶基本组分与固化剂基本用途灌封与包封概述道康宁SYLGARD 184硅橡胶是由液体组分组成的双组分套件产品，包括基本组分与固化剂。

基本组分与固化剂按10:1重量比完全混合，中等粘度混合液的稠度与SAE 40机油相似。

无论厚薄，混合液将固化成为具有韧性的透明弹性体，最适用于电子／电气方面的封装与灌封应用。

道康宁SYLGARD 184硅橡胶在25~150℃的温度范围内固化，无放热现象，无需二次固化。

固化过程完成后，可立即在-55~200℃的温度范围内使用。

特性●低毒性，在常规的工业操作中，无特别的注意事项；●无溶剂或固化副产物，固化时不放热；无需特殊的通风条件，不会产生腐蚀；固化时，收缩量小；●固化后，透明具有弹性；抗震与减缓机械震动；振动的传递性能小；元件可裸视检查与易修补性；●环保性能；低吸水性，良好的耐辐射性能；高真空状态下的低漏气性；●优异的电性能；●较大温度范围内的稳定性，抗解聚；在-55~200℃范围内，甚至在密闭状态下保持弹性与柔韧性，性能稳定；●阻燃性，UL可燃性分级为94 V-1，温度等级：130℃应用道康宁SYLGARD 184硅橡胶在电气／电子的封装与灌封方面有广泛的应用；以下应用方面具有环保作用：设备模型●继电器、电源和磁放大器●变压器、线圈和铁氧体磁芯●接线器●纤维光学波导涂层●电路板的封装道康宁SYLGARD 184硅橡胶适用于净化应用方面，包括：●太阳能电池的封装●光电显示器的封装典型物性CTM 0001A 比重，25℃11.05CTM 0050 粘度2，25℃，厘泊(cps) 5500双组分混合3CTM 0050 粘度，25℃，厘泊(cps) 3900CTM 0055 操作时间4，≥，小时2固化后－物理性能CTM 0176 外观透明CTM 0099 邵氏A硬度，度40CTM 0137A 拉伸强度，Mpa(psi) 6.20(900) CTM 0137A 扯断伸长率，％，100CTM 0159A 撕裂强度，B型模，kN/m(ppi) 2.6(15)CTM 0022A 比重，25℃ 1.05CTM 0224 热导率，cal/sec/cm2/(℃/ cm) 3.5x104CTM 0585 线性热膨胀系数(-55~150℃), cc/cc/℃ 3.0x104CTM 0585 体积热膨胀系数(-55~150℃), cc/cc/℃9.6x104MIL-I-16923G 抗热冲击性(-49~68℃) 10个循环重量损失，％150℃，1000小时 1.6200℃，1000小时 3.2ASTM D 570 吸水性，25℃，7天，％0.10ASTM D 746 脆点，℃-65CTM 0002 折射率，25℃， 1.430耐辐射性，钴60放射源200兆拉德可使用500兆拉德发硬，变脆UL 94 可燃性分类694V-1UL 温度等级机械，℃130电子，℃130电性能7CTM 0114A 绝缘强度，V/mil8450CTM 0112 介电系数，于60Hz 2.7100Hz 2.661000Hz 2.65CTM 0112 耗散因数，于60Hz 0.001100Hz 0.0009100kHz 0.001CTM 0249A 体积电阻率，Ω/cm 2.0x1015CTM 0171 抗电弧性，秒115电性能－热老化，200℃，1000小时CTM 0114A 绝缘强度，V/mil8600CTM 0112 介电系数，于60Hz 2.7100Hz 2.7CTM 0249A 体积电阻率，Ω/cm 2.0x1015注：1. 在大多数情况下，CTMs（元件测试方法）与ASTM标准测试方法相对应。

道康宁灌封材料技术文档TDS

类型弹性体
双组分有机硅弹性体
外观双组分有机硅弹性体
特性流动性液体；固化后形成柔性弹性体；固化速度均匀，与灌封的厚度和环境的密闭程度无关；使用温度在-45到 200°C(-49 到392°F)；无需二次固化；优良的绝缘性能；模量低，超级的应力释放性能；易于再加工和修理。
潜在用途在高湿、极端温度、热循环应力、机械冲击和振动、霉菌、污垢等恶劣条下为电气/电子装置和元器提供保护。
道康宁 ® SE 1740
无底漆有机硅灌封胶道康宁 ® 3-8264无底漆有机硅粘合剂
道康宁 ® 567无底漆有机硅灌封胶
道康宁 ® 3-4207 介电柔韧凝胶套装
潜在用途
普通灌封；电源供应器；连接器；传感器；工业控制；变压器；放大器；高压电阻器；太阳能电池。
Sylgard® Q3-3600 A&B导双组分，1:1混合，快速热固化，具有无底漆粘结 1:1混合比；长适用期；良好的流动性；无底
热灌封胶
能力和良好的阻燃性质。
漆；导热；UL V-1可燃性等级。
道康宁 ® S1混合，红棕色热固化灌封胶，精炼级和良好的阻燃性质。
150°C (302°F)时需1小时
1以上这些数据是以样品量50-100克进行收集的，都非常具有代表性，因此可作为固化时间的初步估计。固化时间会随样品的不同而有轻微的变化，也会由于您元器的大小和加热速度而变长或变短。建议您在使用前预先测试加以验证。 2对于无底漆粘合产品，其固化时间由达到所需硬度的时间来决定。固化时若需要完全的粘结性能需要更长的时间。
检查。在某些具体设计或应用条下，道康宁 ®
3-4207介电绝缘柔韧凝胶可能会丧失粘合力；建议进行全环境暴露试验。

道康宁产品PC培训资料

殊
• 农化添加剂(润湿摊铺剂/消泡剂)
化
• 油田石油化工 (破乳/消泡)
学品
• 其他 ….
6
特殊化学品业务是个好生意!!
• 应用无处不在 (工业味精) • 难替换, 长期生意 • 成长快, 随整体经济高成长 • Benefit to individual (contribution, learning, self-
速率和食品接触规范等。 • 是否直接使用？一般建议预稀释后添加消泡剂。 • 快速消泡or持续抑泡？ • 客户产品用途？丙烯酸胶粘剂产品要求有机硅消泡剂与丙烯酸
树脂良好相容。 • 针对消泡剂复配商的产品： GP系列消泡剂。 • 针对工业清洗/水处理等价格敏感行业：GP25/1430/120A。 • 为金属加工液行业提供的消泡剂解决方案： Q1-1247/FS-
3
NCM与DC合作目的
• 道康宁是一家管理和品质都具备绝对竞争力和值得NCM学习和合作的公司!NCM非常乐意与全球有机硅领导者展开深入的合作.
• DC与其他国际著名伙伴都是具有领先的战略和战术的国际公司,拥有领先的企业宣传手段.NCM与这些国际顶级企业都有相类似的企业文化和行为操守.NCM也必须更多的产品配套给客户
1226/FS-1266。 • 食品行业消泡剂：1520-US/1500/AF/FG-10。
1 3
金属切削液
• 金属切削液配方添加, 有时在机床使用现场后添加 • 金属切削液分油性和水性 (水性用消泡剂多) • 水性分乳液, 半合成, 全合成 (全合成用消泡剂可卖到300元/公
斤) • 用消泡剂>500吨/年, 性能要求高, 对价格相对不敏感 • 市场成长快; 年均>10% • 竞争对手产品

道康宁2-1912

健康和环境信息
为帮助客户安全使用产品，道康宁公司在各地区设立了严格的产品服务组织，并有一组产品安全和规章规范符合（PS&RC）专家来服务客户。
有关详情，请访问我们的官方网站，或咨询您当地基于诚实信用的前提下，此处提供的信息应被认为是准确无误的。然而，由于使用本公司产品的条件和方法非我们所能控制，本信息不能取代客户为确保我们的产品安全、有效、并完全满足于特定的最终用途，而进行的测试。我们所提供的使用建议，不得被视为侵犯任何专利权的原因。
2010 年 3 月 30 日 Ref No.：26-062-40
如果模制件的上漆或粘结存在问题，道康宁可提供与许多有机涂料和粘合剂系统相容的脱膜剂。这些
Dow Corning 是道康宁公司的注册商标。全心助您创未来是道康宁公司的商标。 XIAMETER 是道康宁公司的注册商标。
© 2010 道康宁公司版权所有。
如何使用脱模剂
作为脱模剂使用时，道康宁®2-1912 硅油可提供一种具有热稳定性的耐久脱模薄膜，其在模具上的堆积量非常小。道康宁® 2-1912 硅油以 100％有机硅的形式供货，用户可以根据实际情况选择溶剂和应用浓度。
剂将道康宁® 2-1912 硅油稀释到 110％有机硅含量，之后采用喷涂、刷涂或擦涂的方式进行涂敷。如果存在润湿问题，可将 10 份道康宁 ®2-1912 硅油与 80 份异丙醇（99％）和 10 份甲苯混合。使用溶剂时应确保通风良好，并遵守制造商标签上的注意事项。
产品信息
脱模剂
道康宁® 2-1912 硅油
特性
易于使用不会导致模制件褪色可用溶剂稀释具有较低的表面张力在大多数情况下，一次使用后可

道康宁胶说明书

种类：OLED材料LED荧光粉配粉胶道康宁OE6550 大功率LED品牌：其他型号：道康宁OE6550A/B 加工定制：否分辨率：LED调粉胶灰度：LED配粉胶亮度：普通模组尺寸：LED硅胶（mm）屏幕尺寸：LED混粉胶（英寸）显示方式：静态显示显示颜色：全彩像素：LED荧光粉胶像素间距：led（mm）像素直径：Ф5（mm）种类：OLED材料技术指标：固化前外观 A组份………………………无色透明液体B组份………………………无色透明液体密度（g/cm3）A组份………………………0.96~0.99B组份………………………0.96~0.99粘度(25℃/ mpa.s)A组份…………………11000-11200B组份…………………1400-1600AB混合比例（重量比）……………………………1：1粘度(混合后)@25℃/mpa.s………………………4500-5000强度(邵氏A) (20)可操作时间（常温25℃）……………………140分钟固化方式................. 150℃）60分钟固化后外观……………………………透明粘弹性体体积电阻Ω.㎝……………………………＞1.0×1015介电常数(1.2MHz) ………………………………≤3击穿电压强度(Kv/mm) …………………………＞25扯断伸长率(﹪) ....................................≥200 耐温范围(℃)....................................-60~200 折射率(ND25)..........................................1.54 透光率(%) 450nm 1mm thick (98)。

道康宁护肤有机硅产品目录及培训材料重新排版

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道康宁硅胶资料电子版

SE4704U RC-4(50P) 0.60 170/10 200/4 1.11
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650
20
3.6 17(150C/22hr)
SE4705U RC-4(50P) 0.60 170/10 200/4 1.11
50
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3.7
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SE4706U RC-4(50P) 0.60 170/10 200/4 1.11
60
80
280 20(JISB)
3.0 12(180C/22hr)
B6670 INT RC-4(50P) 0.45 170/10 200/4 1.34
70
60
280 18(JISB)
2.7 12(180C/22hr)
B6680 INT RC-4(50P) 0.40 170/10 200/4 1.34
80
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140 18(JISB)
3.7 32(180C/22hr)
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[宝典]道康宁脱模剂培训资料

[宝典]道康宁脱模剂培训资料道康宁有机硅脱模剂培训教材DowCorning Performance Chemicals脱模剂的作用• 在模具和模件间形成一层惰性的涂层，使模件能够方便的从模具中脱出• 提高最终产品的抗磨损性能以及抗刮擦性能脱模剂的选择要求• 与大部分的橡胶、塑料、金属不产生反应• 高温稳定性低表面张力•道康宁脱模剂产品• 道康宁提供多种脱模剂形态:硅油、乳液以及成膜剂• 不同产品能满足不同特殊的加工需要; 例如耐久性，后涂装性能，满足食品级要求或者耐高温性能道康宁产品硅油–使用时用溶剂稀释• 不同粘度的200号油203和230硅油•应用指南• 在使用前用溶剂稀释至2-5% 的固含量• 高温条件使用高粘度硅油• 模件需要后涂装加工时使用203和230硅油道康宁产品乳液–使用时用水稀释DC 39 (35wt%);IE 349(60wt%)HV 495(50wt%)DC 5009 (50wt%) 提供模件后涂装性能道康宁产品乳液应用指南使用前用水稀释至2-5% 固含量•• 高温条件请使用高粘度硅油的乳液乳液现场稀释使用，避免长期保存造成的微生物感染•• 模件需要后涂装加工时使用5009乳液道康宁产品半永久或多次脱模型脱模剂• 溶剂稀释• DOW CORNING 20 脱模剂– 95度条件下10分钟成膜应用指南• 使用前用溶剂将DC-20稀释至2-5%浓度• 按照说明在一定温度下固化一定时间后使用脱模剂使用的主要问题1. 模铸材料是什么?2. 模具材料是什么?3. 需要水性还是油性脱模?4. 有没有食品级要求?5. 是否需要后涂装加工?6. 加工时温度范围?7. 是否需要多次脱模?工业脱模1. 聚氨酯脱模剂2. 金属压铸脱模剂3. 轮胎脱模剂1. 聚氨酯脱模剂发泡成型中的热/冷固化• 热固化:- 模具温度: > 100 C - 异氰酸酯种类: TDI - 压缩形变后的回复性: 差于冷固化 - 脱模剂: 水性/溶剂型的都可用• 冷固化:- 模具温度: 35-45 C ( 节能并缩短生产周期) - 异氰酸酯种类: TDI/MDI ( 毒性低于TDI ) - 压缩形变回复性优于热固化- 脱模剂: 绝大部分溶剂型, 也有一些水性的. * 水性脱模剂的问题: 模具表面坑洼处水汽干燥慢,需要使用热空气吹干.自结皮和通用发泡• 通用发泡: 防撞垫, 门缝条, 头靠. • 自结皮发泡: 泡沫表面结一层0.2-0.5 毫米的皮可用于汽车方向盘，扶手及头靠上.• 冷固化型.• 3-6 % 固含量的溶剂型脱模剂.• 将Dow Corning 2-3387 和快速挥发性溶剂稀释鞋底夹层• 要求:后涂装/胶带保护/可粘结性• 冷固化型• 复配有机硅，直接使用于终端产品。

道康宁JCR6101硅胶规格书

Product InformationLED MaterialsDow Corning®JCR 6101 UPTYPICAL PROPERTIESSpecification Writers: Please contact your local Dow Corning sales office or your GlobalDow Corning Connection before writing specifications on this product.Property UnitValue Viscosity cPmPa-secPa-sec194001940019.4Specific Gravity (Uncured) - 1.04Durometer Shore A (JIS) - 35Dielectric Strength volts/milkV/mm62524Volume Resistivity ohm*cm 2.9 E+15Shelf Life @ -5ºC months 6STORAGE AND SHELF LIFEShelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning one-part products require cold storage at or below -5°C (23°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Check the product label for specific storage conditions.DESCRIPTIONDow Corning® brand silicone LED (light emitting diode) encapsulants are designed to meet the challenging needs of the LED market, including high adhesion, high purity, moisture resistance, thermal stability and optical transmittance. Silicone materials can absorb stresses caused by thermal cycling inside the package, protecting the chip and thebonding wires. And with theelectronics industry quickly movingtoward lead-free processing, siliconeencapsulants, with theirdemonstrated, excellent stability atreflow temperatures, are a natural fitfor LED applications.PREPARING SURFACESSurfaces should be clean and dry.Recommended cleaning methodsinclude Dow Corning® brand OSFluids, naphtha, mineral spirits,methyl ethyl ketone (MEK) or othersuitable solvent. Rougher surfacestend to promote adhesion of siliconesto other surfaces.PROCESSING/CURINGThese products are also compatiblewith commercially availableequipment and industry standardprocesses. These materials can bedispensed or molded depending onthe product and application. DowCorning OS Fluids are recommendedto clean cured or uncured siliconeresidue from application equipment.ADHESIONDow Corning LED materials arespecially designed for adhesion tocommonly used LED substrates.Surface treatments such as chemicaletching or plasma treatment mayprovide a reactive surface andimprove adhesion to these types ofsubstrates. In general, increasing thecure temperature and/or cure timewill improve the ultimate adhesion.USEFUL TEMPERATURERANGESFor most uses, silicone encapsulantsand resins should be operational overa temperature range of -45 to 200°C(-49 to 392°F) for long periods oftime. However, at both the low- andhigh-temperature ends of thespectrum, behavior of the materialsand performance in particularapplications can become moreDow Corning and Sylgard are registered trademarks of Dow Corning Corporation. All other trademarks or brand names are the property of their respective owners. ©2008 Dow Corning Corporation. All rights reserved. Printed in USA Form No. 11-1300A-01complex and require additionalconsiderations. For low-temperature performance, thermal cycling toconditions such as -55°C (-67°F) may be possible, but performance should be verified for your parts or assemblies. Factors that may influence performance areconfiguration and stress sensitivity of components, cooling rates and hold times, and prior temperature history. At the high-temperature end, the durability of the cured silicone encapsulants and resins is time and temperature dependent. As expected, the higher the temperature, the shorter the time the material will remain useable.COMPATIBILITYCertain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: Organotin and other organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, polysulfides, polysulfones or other sulfurcontaining materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a givenapplication. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicatesincompatibility and inhibition of cure.HEALTH ANDENVIRONMENTAL INFORMATIONTo support customers in theirproduct safety needs, Dow Corning has an extensive Product Stewardship organization and a team of ProductSafety and Regulatory Compliance (PS&RC) specialists available in each area. For further information, please see our website,, or consult your local Dow Corning representative.LIMITATIONSThese products are neither tested nor represented as suitable for medical or pharmaceutical uses.LIMITED WARRANTY INFORMATION PLEASE READ CAREFULLYThe information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution for customer’s tests to ensure that Dow Corning’s products are safe, effective, and fullysatisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent. Dow Corning’s sole warranty is that the product will meet the DowCorning sales specifications in effect at the time of shipment. Yourexclusive remedy for breach of such warranty is limited to refund ofpurchase price or replacement of any product shown to be other than as warranted. DOW CORNINGSPECIFICALLY DISCLAIMS ANY OTHER EXPRESS OR IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR MERCHANTABILITY. DOW CORNING DISCLAIMS LIABILITY FOR ANY INCIDENTAL ORCONSEQUENTIAL DAMAGES.SAFE HANDLING INFORMATIONPRODUCT SAFETYINFORMATION REQUIRED FOR SAFE USE IS NOT INCLUDED IN THIS DOCUMENT. BEFORE HANDLING, READ PRODUCT AND MATERIAL SAFETY DATA SHEETS AND CONTAINER LABELS FOR SAFE USE, PHYSICAL AND HEALTHHAZARD INFORMATION. THE MATERIAL SAFETY DATA SHEET IS AVAILABLE ON THE DOW CORNING WEBSITE AT , OR FROM YOUR DOW CORNING REPRESENTATIVE, ORDISTRIBUTOR, OR BY CALLING YOUR GLOBAL DOW CORNING CONNECTION.For More InformationTo learn more about these and other products available from Dow Corning, please visit the Dow Corning Electronics website at / electronics.。

道康宁灌封胶资料

Information about Dow Corning ® BrandSilicone EncapsulantsSilicones and ElectronicsLong-term, reliable protection of sensitive circuits and compo -nents is becoming more important in many of today’s delicate and demanding electronic applications. Silicone encapsulants provide unparalleled protection for electronic modules and devices ranging from relatively simple to highly complex archi -tectures and geometries. Silicones function as durable dielectric insulation, as barriers against environmental contaminants, and as stress-relieving shock and vibration absorbers over a wide temperature and humidity range.In addition to sustaining their physical and electrical properties over a broad range of operating conditions, silicones are resistant to ozone and ultraviolet degradation and have good chemical stability. The Dow Corning encapsulant family offers many choices to customize or tune product usage and performance for your specific application.DESCRIPTIONDow Corning ® silicone encapsulants or pottants are supplied as two-part liquid component kits comprised of:Mix RatioComponents (by weight or volume)(as supplied) 1:1 Part A/Part B10:1Base/Curing agentWhen liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is suited for the protec-tion of electrical/electronic applications. Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confine-ment. Dow Corning silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule with an operating temper-ature range of -45 to 200°C (-49 to 392°F). Several products enable easy rework and repair. Select materials have been classified by Underwriters Laboratories and/or meet military specifications. Standard silicone encapsulants require a sur -face treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning.PRODUCT INFORMATION1These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confirm adequate cure for your application.For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.341These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confirm adequate cure for your application.For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.5TYPICAL PROPERTIESSpecification Writers: Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on this product.67MixinG – 1:1/ParT a:ParT BDow Corning silicone 1:1 encapsulants are supplied in two parts that do not require lot matching. The 1:1 mix ratio, by weight or volume, simplifies the proportioning process. To ensure uniform distribution of filler, Parts A and B must each be thoroughly mixed prior to their combination in a 1:1 ratio. When thoroughly blended, the Part A and B liquid mixture should have a uniform appearance. The presence of light-colored streaks or marbling indicates inadequate mix-ing and will result in incomplete cure.Due to the fast-curing characteristics of some encapsulants included in this data sheet, automated mix and dispense equipment should be utilized. In applications sensitive to air entrapment, deairing with 28 to 30 inches Hg vacuum is required.MixinG – 10:1/BaSe:CurinG aGenTDow Corning silicone 10:1 encapsulants are supplied in two parts as lot-matched base and curing agent that are mixed in a ratio of 10 parts base to one part curing agent, by weight. After thoroughly mixing base and curing agent, agitate gently to reduce the amount of air introduced. Allowing the mixture to set for 30 minutes before pouring may be adequate for removal of the air introduced during mixing. If air bubbles are still present, vacuum deairing may be required. Deair in a container with at least four times the liquid volume to allow for expansion of material. Air entrapped in the mixture can be removed by using a vacuum of 28 to 30 inches Hg. Continue the vacuum until the liquid expands and settles to its original volume and bubbling subsides. This may take 15 minutes to 2 hours depending on the amount of air introduced during stirring. For best curing results, glassware and glass or metal stirring implements should be used. Mix with a smooth action that does not introduce excess air.PoT Life/WorkinG TiMeCure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followedby gelation and conversion to a solid elastomer. Pot life is defined as the time required for viscosity to double after Parts A and B (base and curing agent) are mixed. Please refer to individual pot life for each silicone encapsulant.PRIMER SELECTION GUIDESpecification Writers: Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on these products.Product Special Properties Substrates Compatible SiliconesDow Corning®P5 00 Adhesion Promoter – Clear The most versatile of all Dow Corning primers for thewidest range of silicones and electronics applications.This clear primer is similar to Dow Corning® 1 00 OSPrimer but uses a slightly different adhesion promotercombination. It enhances the adhesion of many RTVand heat-cure silicones to a wide variety of surfaces. Notregistered for use in European Union.Wide variety of surfaces includingFR-4, ceramics, and many metalsand plasticsAllDow Corning®1 00 OS Primer Clear The most versatile of all Dow Corning primers for thewidest range of silicone types and electronics applications.This clear primer is supplied in a low-VOC diluent forlower environmental impact and exhibits low odor forconvenient handling. It enhances the adhesion of manyRTV and heat-cure silicones to a variety of surfaces. Thisprimer is very similar to Dow Corning P5 00 AdhesionPromoter and is registered for use in the European Union.Wide variety of surfaces includingFR-4, ceramics, and many metalsand plasticsAllDow Corning®P5 04 Adhesion Promoter This clear primer is supplied in a low-VOC diluent forlower environmental impact and exhibits low odor forconvenient use. It is specially formulated to enhanceadhesion of many moisture-cure RTV silicones to a widevariety of surfaces.Wide variety of surfaces includingFR-4, ceramics, and metals. Notrecommended for plastics.AllDow Corning®1 01 RTV Prime Coat This transparent primer with yellow tint is supplied in amixture of acetone and toluene solvents. It is specificallyformulated to enhance the adhesion of Dow Corning®3110 and 31 0 RTV Silicone Rubber to a wide variety ofsurfaces, especially FR-4 and metals.Wide variety of surfaces, especiallyFR-4 and metalsDow Corning® 3110, 311 , 31 0RTV Silicone RubberDow Corning®1 05 Prime Coat Specially formulated to increase adhesion of a wide rangeof silicones to plastics including more difficult types, suchas acrylic and polycarbonate. This clear primer is suppliedin a mixture of organic solvents.Most plastics, ceramics, andcompositesNot recommended for use withaddition-cure silicones, such asSylgard® 170, 184, 186 SiliconeElastomer Kit, etc.Dow Corning®9 -0 3 Primer Specially formulated for use with addition-cure silicones tomitigate surface cure poisoning. This clear primer is dilutedin heptane solvent and enhances the adhesion of manyaddition-cure silicones to a wide variety of surfaces.FR-4, most metals, and ceramics Non-pigmented, two-part addition-cure silicones8ProCeSSinG and CurinGThoroughly mixed Dow Corning silicone encapsulant may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrap-ment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique can-not be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed.Dow Corning silicone encapsulants may be either room tem-perature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the prod-uct selection table. Two-part condensation cure encapsulants should not be heat accelerated above 60°C (140°F).Dow Corning® 255 Curing Agent should be stirred prior to use because some settling may occur during shipping and storage. The curing agent is reactive with atmospheric mois-ture so care should be exercised to limit exposure to air prior to use.PreParinG SurfaCeSIn applications requiring adhesion, priming will be required for the silicone encapsulants. See the Primer Selection Guide for the correct primer to use with a given product. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly air dried prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the Dow Corning litera-ture, “How To Use Dow Corning Primers and Adhesion Promoters” (Form No. 10-366) and in the information sheets specific to the individual primers.uSefuL TeMPeraTure ranGeSFor most uses, silicone elastomers should be operational over a temperature range of -45 to 200°C (-49 to 392°F) for long periods of time. However, at both the low and high temperature ends of the spectrum, behavior of the materials and performance in particular applications can become more complex and require additional considerations.For low-temperature performance, thermal cycling to conditions such as -55°C (-67°F) may be possible, but per-formance should be verified for your parts or assemblies. Factors that may influence performance are configuration and stress sensitivity of components, cooling rates and hold times, and prior temperature history. There are specialized products including Dow Corning® 3-6121 Low Temperature Elastomer that can perform at -65°C (-85°F) and below.At the high-temperature end, the durability of the cured silicone elastomer is time and temperature dependent. As expected, the higher the temperature, the shorter the time the material will remain usable.CoMPaTiBiLiTYCertain materials, chemicals, curing agents and plasticizers can inhibit the cure of Dow Corning silicone encapsulants. Most notable of these include:• Organotin and other organometallic compounds• Silicone rubber containing organotin catalyst• Sulfur, polysulfides, polysulfones or other sulfur-containing materials• Amines, urethanes or amine-containing materials• Unsaturated hydrocarbon plasticizers• Some solder flux residuesIf a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.Dow Corning 255 Elastomer is not subject to these inhibi-tion concerns but may experience reversion in sealed appli-cations at high temperature and pressure. rePairaBiLiTYIn the manufacture of electrical/electronic devices it is often desirable to salvage or reclaim damaged or defective units. With most non-silicone rigid potting/encapsulating materials, removal or entry is difficult or impossible without causing excessive damage to internal circuitry. Dow Corning silicone encapsulants can be selectively removed with relative ease, any repairs or changes accomplished, and the repaired area repotted in place with additional product.To remove silicone elastomers, simply cut with a sharp blade or knife and tear and remove unwanted material from the area to be repaired. Sections of the adhered elastomer are best removed from substrates and circuitry by mechani-cal action such as scraping or rubbing and can be assisted by applying Dow Corning®brand OS Fluids.Before applying additional encapsulant to a repaired device, roughen the exposed surfaces of the cured encapsulant with an abrasive paper and rinse with a suitable solvent. This will enhance adhesion and permit the repaired material to become an integral matrix with the existing encapsulant. Silicone prime coats are not recommended for adhering products to themselves.HandLinG PreCauTionSDow Corning 255 Elastomer curing agent and uncured catalyzed material will burn skin and eyes upon prolonged contact. In case of eye contact, flush with copious amounts of water for at least 15 minutes and seek medical attention at once. Skin contact areas should be washed with soap and water. Persistent irritation should receive medical attention.9Dow Corning and Sylgard are registered trademarks of Dow Corning Corporation.©2000-2008 Dow Corning Corporation. All rights reserved.Printed in USAAGP9336Form No. 10-898H -01Use only with adequate ventilation; if not available, use respiratory protection.PRODUCT SAFETY INFORMATION REQUIRED FOR SAFE USE IS NOT INCLUDED IN THIS DOCUMENT. BEFORE HANDLING, READ PRODUCT AND MATERI -AL SAFETY DATA SHEETS AND CONTAINER LABELS FOR SAFE USE, PHYSICAL AND HEALTH HAZARD INFORMATION. THE MATERIAL SAFETY DATA SHEET IS A V AILABLE ON THE DOW CORNINGWEBSITE AT , OR FROM YOUR DOW CORNING REPRESENTATIVE, OR DIS -TRIBUTOR, OR BY CALLING YOUR GLOBAL DOW CORNING CONNECTION.uSaBLe Life and SToraGeShelf life is indicated by the “Use By” date found on the product label.For best results, Dow Corning silicone encapsulants should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materi-als. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Dow Corning 255 Elastomer should be kept refrigerated (10°C/50°F) until use. Any special storage and handling in-structions will be printed on the product containers.PaCkaGinGIn general, Dow Corning silicone 1:1 mix ratio encapsulants are supplied in nominal 0.45-, 3.6-, 18- and 200-kg (1-, 8-, 40- and 440-lb) containers, net weight. Dow Corning silicone 10:1 mix ratio encapsulants are supplied in nominal 0.5-, 5-, 25- and 225-kg (1.1-, 11-, 55- and 495-lb) containers, net weight. Packaging options may vary by product. Consult Dow Corning Customer Service at (989) 496-6000 for addi-tional packaging options.LIMITATIONSThese products are neither tested nor represented as suitable for medical or pharmaceutical uses.HEALTH AND ENVIRONMENTAL INFORMATIONTo support customers in their product safety needs, Dow Corning has an extensive Product Stewardshiporganization and a team of Product Safety and Regulatory Compliance (PS&RC) specialists available in each area.For further information, please see our website, , or consult your local Dow Corning representative.LiMiTed WarranTY inforMaTion – PLeaSe read CarefuLLYThe information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution forcustomer’s tests to ensure that Dow Corning’s products are safe, effective, and fully satisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent.Dow Corning’s sole warranty is that the product will meet the Dow Corning sales specifications in effect at the time of shipment.Your exclusive remedy for breach of such warranty is limited to refund of purchase price or replacement of any product shown to be other than as warranted.DOW CORNING SPECIFICALL Y DISCLAIMSANY OTHER EXPRESS OR IMPLIED W ARRANTY OF FITNESS FOR A P ARTICULAR PURPOSE OR MERCHANTABILITY.DOW CORNING DISCLAIMS LIABILITY FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES.。

道康宁SiMB说明书

硅氧烷流体是高效的内/外润滑剂
Ø Limitations:
– Handling difficulties 储运/使用的困难 – Surface adhesion problems (migration) 后迁移导致表面附着问题
Ø Innovation from Multibase is use ultra high molecular weight PDMS (15,000,000 cSt) to eliminate these limitations. Ø Multibase创新使用超高分子量PDMS来消除这些缺陷及使用限制
Mw Mw Mw Mw Mw Mw Mw = = = = = = = 250 1 ,0 0 0 5 ,0 0 0 2 5 ,0 0 0 5 5 ,0 0 0 1 0 0 ,0 0 0 3 0 0 ,0 0 0 1 cS t 1 0 cS t 10 0 cSt 1 ,0 0 0 c S t 1 0 ,0 0 0 c S t 1 0 0 ,0 0 0 c S t 1 0 ,0 0 0 ,0 0 0 c S t
- Si富集于表面，但消除了加工后的喷霜及迁移。
PDF created with pdfFactory Pro trial version
Benefits of Siloxane Masterbatch
Ø Processing benefits (0.2 – 2% usage) 有助于加工 – Added at press, extruder or during compounding
PDF created with pdfFactory Pro trial version
PolyDiMethylSiloxane (PDMS)
CH3 CH3 CH3

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