PFMEA

Core Team: QE(Alice wang) ME(wang xiao fei) TE(YG Yu)
Process Responsibility: Key Date:
2011.1.19
Process step /
Function ID
Requirements Product Process
Potential Failure Mode
bigger size to solve
this problem. Extra
label
should be removed
after SMT process.
SEV = Severity , OCC = Occurrence , DET = Detection , RPN = Risk Priority Number
8
Damaged /Block nozzle/different
package type
1. Weekly preventive maintenance
4
2. Follow dropped part dealing with
to same PN
procedure
to give FACA to top dropped parts
bridge,none/insufficient reflow
MPN solder paste etc.
5DX fail
6
ICT/FVT fail
escape to customer
1.Machine not calibrated;
1.Follow VA to set machine
2.Machine parameter is setting parameter
with VA.
3 0 None.
Dropped parts.
Components' wrong polarity
wrong fiducial mark catch
Missing / Extra part/bent pin/6shift
Wrong polarity
4
placement misalign
improperly
2.post-printing inspection
3.Squeeze selection is
3.Koh Young verification
improperly
,bottom side 20%,top side 100%
1.Support block is put not evenly 1.2 Check support block horizontal
Item:
Spyker
Model Year(s)/Program(s): 73-12514-03;73-12515-03;73-12516-03;73-12517-03;73-13456-03
Core Team: QE(Alice wang) ME(wang xiao fei) TE(YG Yu)
POTENTIAL FAILURE MODE AND EFFECT ANALYSIS
(PROCESS FMEA)
Item:
Spyker
Model Year(s)/Program(s): 73-12514-03;73-12515-03;73-12516-03;73-12517-03;73-13456-03
from supplier
1.Printing operator check solder
paste expired date and In-out
Paste used not within warm-up label when they pick up new jar
time or expiration limits
SC
EL
Potential Effect(s) of V A
Failure
.S
S
Potential Cause(s)/ Mechanism(s) of Failure
Current Process Controls (Prevention)
MPN 1 Spyker
misalignment,
poor sodering quality after
1
2. To IC & BGA, check the body mark
with VA.
4 0 None.
3. Receiving exchange to stick 1. To RLC, test with the tester pen of
two reels' labels
RLC.
2. To IC & BGA, check the body mark
to remout with wrong direction. before feed another tray or reel parts.
2. Issue VA to define the polarity
identified to tray
3.OP check polarity before put it back
2 0 None. 2 0 None.
2 32 None.
Vacuum process cause the glue
Program part with label Cause IC bent pin when drop f6rom last come out from
1. Change tray to reel.
with VA.
3
3 0 None.
4. RTS exchange to insert A part 1. To RLC, test with the tester pen of
to the pacage of B
RLC.
2
2. To IC & BGA, check the body mark
part
Responsibili ty & Target Completetio
n Date
Action Results
Ations Taken & effective
date
S ODR e c eP v c tN
3
3
3 2
3
3
2
2
8
1
Add SN label on the
center of PCB with
5
2. Remove label with mark on body,
4.Production will ensure support
block cleaning before production
1.accurate stencil aperture
improper stencil design
opening study with supplier
2..stencil buy off when coming
list
Responsibili ty & Target Completetio
n Date
Action Results
Ations Taken & effective
date
S ODR e ceP v ctN
1. To RLC, test with the tester pen of
2. Wrong来自百度文库part caused by supplier RLC.
BOM
5
3 0 None.
2. Make assure PLV full completed with
sheet
scanning
3. Manual double confirm the meet
during PLV scanned and the actual feed No. and
t4h. eAdPd/NPLV completed into FAI check
(Prevention)
C Controls T .
S
. (Detection) . N
.
1. Incorrect feeder location or 1. Feeder setup sheet loaded from the
Recommended Actions (s)
4
P/N on the set up
SN label is stick in the edge of PCB Bar code scanner and its a
small size label.
PFMEA Number: PFMEA Date (Orig.):
Prepared By: PFMEA Date (Rev): Approval (ME leader): Approval(QE Leader) :
25-QE2502-CISGEN-077-A 2011.1.19 Min jia zou A
xiaofei huang Ken liu
R O Current D . C Process E P C Controls T . . (Detection) . N
.
Recommended Actions (s)
Form # : 25-QS30-GEN-024-01A
Revision A B C D
Document type DFMEA
Process flow diagram Quality requirements
Engineering documents
Date xx/xx/xxxx
PFMEA revision history Originator(s)
2.Block height is improperly
and height before production,
3.Block location hole is incorrectly 3.Verify location hole before
4.Support block is dirty
using
into tray
1. Machine's problem.
1. Weekly preventive maintenance
2
2. Component pad/test point is 2.Review DFM to make sure keepout
close to fiducial mark
between component and fiducial mark2
1. Carelessness of incoming staff 1. Issue VA to reqeust OP do double
during kitting
confirm
4
2. OP load the tray with wrong
polarity
3.Put drop component into tray
GSM
2 Spyker
SMT
Potential Effect(s) of Failure
Wrong part placed.
SC
R
EL
O Current D .
VA
Potential Cause(s)/
Current Process Controls
C Process E P
.S
Mechanism(s) of Failure
POTENTIAL FAILURE MODE AND EFFECT ANALYSIS
(PROCESS FMEA)
Process Responsibility: Key Date:
2011.1.19
PFMEA Number: PFMEA Date (Orig.):
Prepared By: PFMEA Date (Rev): Approval (ME leader): Approval(QE Leader) :
25-QE2502-CISGEN-077-A 2011.1.19 Min jia zou A
xiaofei huang Ken liu
Process step /
Function ID
Requirements Product Process
Potential Failure Mode
Wrong part loaded.
Supporting documentation
Revision
Document number
Change Details Initial release.
Document owner
Printed Document is Reference Only
Form # : 25-QS30-GEN-024-01A
solder paste
2.Leader and QA auditor need
check solder paste when they
audit production line
SN Label application
SMT scanner cannot Board cannot be
catch
assembled further