试题标准答案模版A4-数字集成电路设计A答案[1]
(完整版)数字电路试题及参考答案
《数字电路》试卷及答案一、【单项选择题】(本大题共20小题，每小题2分，共40分)在每小题列出的四个选项中只有一个选项是符合题目要求的，请将正确选项前的字母填在答题卷相应题号处。
1、对于钟控RS触发器，若要求其输出“0”状态不变，则输入的RS信号应为（ A ）。
[A] RS=X0 [B] RS=0X [C] RS=X1 [D] RS=1X2、以下各电路中，（ B ）可以产生脉冲定时。
[A] 多谐振荡器[B] 单稳态触发器[C] 施密特触发器[D] 石英晶体多谐振荡器3、下列逻辑电路中为时序逻辑电路的是（ C ）。
[A] 变量译码器[B] 加法器[C] 数码寄存器[D] 数据选择器4、同步时序电路和异步时序电路比较，其差异在于后者（ B ）。
[A] 没有触发器[B] 没有统一的时钟脉冲控制[C] 没有稳定状态[D] 输出只与内部状态有关5、当用专用输出结构的PAL设计时序逻辑电路时，必须还要具备有（ A ）。
[A] 触发器[B] 晶体管[C] MOS管[D] 电容6、能将输出端直接相接完成线与的电路有（ C ）。
[A] TTL与门[B] 或门[C] 三态门[D] 三极管非门7、TTL与非门的多余脚悬空等效于（ A ）。
[A] 1 [B] 0 [C] Vcc [D] Vee8、以下哪一条不是消除竟争冒险的措施（ B ）。
[A] 接入滤波电路[B] 利用触发器[C] 加入选通脉冲[D] 修改逻辑设计9、主从触发器的触发方式是（ D ）。
[A] CP=1 [B] CP上升沿[C] CP下降沿[D] 分两次处理10、组合型PLA是由（ A ）构成。
[A] 与门阵列和或门阵列[B] 一个计数器[C] 一个或阵列[D] 一个寄存器11、下列四个数中，最大的数是（ B ）。
[A] (AF)16[B] (001010000010)8421BCD[C] (10100000)2[D] (198)1012、触发器有两个稳态，存储8位二进制信息要（ B ）个触发器。
(完整版)数字电路基础考试题(附参考答案)
数字电子技术-考试复习题一、单项选择题1．(195)H 表示（ D ）。
(a) 二进制数 (b) 十进制数 (c)八进制数 (d) 十六进制数2．在TTL 门电路中，能实现“线与”的门电路是（ B ） (a) 与非门 (b) 集电极开路门 (c) 或非门 (d) 或非门3．用不同数制的数字来表示2007，位数最少的是 。
(a) 十六进制数 (b) 十进制数 (c) 八进制数 (d) 二进制数 4．十进制数36转换为十六进制数，结果为 。
（a ）26 （b ）24 （c ）22 （d ）20 5．8421BCD 码10000111表示的十进制数是 。
（a ） 131 （b ） 103 （c ） 87 （d ） 13 6．A/D 转换输出的二进制代码位数越多，其转换精度（ ） (a) 越高 (b) 越低 (c) 不变 (d) 无法确定 7．下列逻辑表示式正确的是（ ） (a) 1=++B A B A (b)B A B A A +=+(c)B A B A B A AB +=+ (d) B A AB +=8. 下列电路中，属于时序逻辑电路的是( ). (a) 数据选择器 (b) 编码器 (c) 计数器 (d) 译码器 9. 由8位寄存器组成的扭环移位寄存器可以构成 进制计数器。
(a) 4 (b) 8 (c) 16 (d) 无法确定10. 555集成定时器构成的单稳态触发器，其暂态时间t W ≈________。
(a) 0.7RC (b) RC (c) 1.1RC (d) 1.4RC11．十进制数24转换为二进制数，结果为 。
（a ）10100 （b ）10010 （c ）01100 （d ）1100012． (a) 13． (c) 14． (c) 15． (d) 12．=O )275(( )D ， 。
（a ）275 (b) 629 (c) 2750 (d) 220013．三态门的第三态是 。
（a ）低电平 （b ）高电平（c ） 高阻 （d ） 任意电平 14．具有8个触发器的二进制异步计数器最多可能有 种状态。
集成电路设计岗位招聘笔试题与参考答案(某大型集团公司)
招聘集成电路设计岗位笔试题与参考答案(某大型集团公司)(答案在后面)一、单项选择题（本大题有10小题，每小题2分，共20分）1、在集成电路设计中，以下哪种类型的设计通常负责处理数字逻辑功能？A、模拟集成电路B、数字集成电路C、混合信号集成电路D、射频集成电路2、以下哪种技术用于在集成电路设计中实现晶体管间的连接？A、光刻技术B、蚀刻技术C、键合技术D、离子注入技术3、在CMOS工艺中，P型MOSFET的阈值电压通常会随着温度的升高而：A. 增加B. 减少C. 不变D. 先增加后减少4、下列哪一项不是减少互连延迟的有效方法？A. 使用更细的金属线B. 使用更高介电常数的绝缘材料C. 减少金属层之间的距离D. 使用铜代替铝作为互连线材料5、集成电路设计中，以下哪种工艺主要用于制造CMOS（互补金属氧化物半导体）逻辑电路？A. 双极型工艺B. 金属氧化物半导体工艺C. 双极型/金属氧化物半导体混合工艺D. 双极型/CMOS混合工艺6、在集成电路设计中，以下哪个参数通常用来描述晶体管的开关速度？A. 饱和电压B. 输入阻抗C. 开关时间D. 集成度7、在集成电路设计中，用于描述电路逻辑功能的硬件描述语言不包括以下哪一种？A. VerilogB. VHDLC. C++D. SystemVerilog8、下列选项中，哪一个不是ASIC（专用集成电路）设计流程中的一个阶段？A. 逻辑综合B. 布局布线C. 系统集成D. 物理验证9、以下哪种工艺技术通常用于制造高性能的集成电路？A. 混合信号工艺B. CMOS工艺C. GaN（氮化镓）工艺D. BiCMOS工艺二、多项选择题（本大题有10小题，每小题4分，共40分）1、在CMOS工艺中，关于阱（well）的概念，下列说法正确的有：A. NMOS晶体管通常位于P型阱中B. PMOS晶体管通常位于N型阱中C. N阱用于隔离不同区域的晶体管，防止电流泄露D. P阱可以与N阱共存于同一层硅片上而不会相互影响2、关于集成电路版图设计中的DRC（Design Rule Check）规则，下列哪些陈述是正确的？A. DRC规则是为了确保电路性能优化B. DRC规则定义了最小特征尺寸、最小间距等制造限制C. 违反DRC规则可能会导致制造缺陷，如短路或开路D. DRC规则在所有半导体制造工艺中都是相同的3、关于集成电路设计，以下哪些是典型的电路设计类型？（）A、模拟电路设计B、数字电路设计C、混合信号电路设计D、射频电路设计E、光电子电路设计4、在集成电路设计中，以下哪些因素会影响电路的功耗？（）A、晶体管的工作状态B、电源电压C、电路的复杂度D、芯片的温度E、外部负载5、在集成电路设计过程中，下列哪些技术用于提高电路的性能？A. 使用更先进的制程技术B. 优化电路布局减少信号延迟C. 增加电源电压以提升速度D. 减少电路层数降低制造成本E. 应用低功耗设计方法6、下列哪些是实现CMOS逻辑门时需要考虑的关键因素？A. 输入电平的阈值B. 输出驱动能力C. 功率消耗D. 静态电流消耗E. 电路的工作频率7、以下哪些技术或方法属于集成电路设计中的模拟设计领域？（）A. 信号处理算法B. 逻辑门电路设计C. 模拟电路仿真D. 功耗分析E. 版图设计8、在集成电路设计中，以下哪些步骤是进行版图设计的必要阶段？（）A. 电路原理图设计B. 布局规划C. 逻辑分割D. 布局布线E. 版图检查9、在CMOS工艺中，影响MOSFET阈值电压的因素有哪些？A. 氧化层厚度B. 衬底掺杂浓度C. 栅极材料类型D. 源漏区掺杂浓度E. 温度F. 器件尺寸三、判断题（本大题有10小题，每小题2分，共20分）1、集成电路设计岗位的工程师需要具备扎实的数学基础和电子工程知识。
数字集成电路考题(2012)
集成电路考题一、填空题1、世界上第一个自动计算器是1832年。
2、Jack Kilby 提出IC 设想-—集成电路，由此获得诺贝尔奖,标志着数字时代的来临。
3、集成电路的发展按摩尔定律发展变化。
4、数字电路噪声进入的途径有电感耦合、电容耦合、电源和地的干扰。
5、N 型半导体的多子是自由电子，少子是空穴.6、P 型半导体的多子是空穴,少子是自由电子.7、二极管电流D I 与电压D V 的关系表达式为)1(/-=ΦT D V S D e I I 。
8、二极管的反向击穿类型有齐纳击穿和雪崩击穿。
9、互连线电容模型可用平行板电容模型等效，导线总电容的公式为10、互连线电容模型可用微带线模型等效，由平面电容和边缘电容构成。
11、导体为均匀的绝缘介质包围，可知一条导线的电容C 与电感L 的关系为u CL ε=。
12、CMOS 反相器噪声容限的定义有L NM 低电平噪声容限和H NM 高电平噪声容限.13、CMOS 反相器电路总功耗分为三部分,分别为dyn P 由充放电电容引起的动态功耗、dp P 直流通路电容引起的功耗、stat P 静态功耗。
14、静态CMOS 门由上拉网络PUN 和下拉网络PDN 构成。
15、CMOS 互补逻辑实现一个N 输入逻辑门所需MOS 管的个数为2N 个。
16、伪NMOS 逻辑实现一个N 输入逻辑门所需MOS 管的个数为N+1个。
17、动态逻辑实现一个N 输入逻辑门所需MOS 管的个数为N+2个。
18、动态逻辑电路工作过程分为预充电和求值两个阶段。
19、时序电路中与寄存器有关的参数分别为建立时间、维持时间、传播时间。
20、对于时钟偏差不敏感的触发器为Clocked CMOS （或为时钟控制CMOS ）。
21、2C CMOS 实现一个N 输入逻辑门所需MOS 管的个数为N+2个。
2223、半定制的电路设计方法分别是以单元为基础的设计方法和以阵列为基础的设计方法。
二、简答题1、画出双阱CMOS电路工艺顺序简化图.（P31)2、二极管的电流受工作温度的双重影响。
《数字集成电路》期末试卷(含答案)
浙江工业大学 / 学年第一学期 《数字电路和数字逻辑》期终考试试卷 A姓名 学号 班级 任课教师一、填空题（本大题共10小题，每空格1分，共10分）请在每小题的空格中填上正确答案。
错填、不填均无分。
1．十进制数（68）10对应的二进制数等于 ；2．描述组合逻辑电路逻辑功能的方法有真值表、逻辑函数、卡诺图、逻辑电路图、波形图和硬件描述语言（HDL ）法等，其中 描述法是基础且最直接。
3．1A ⊕可以简化为 。
4．图1所示逻辑电路对应的逻辑函数L 等于 。
A B L≥1&CYC图1 图25．如图2所示，当输入C 是（高电平，低电平） 时，AB Y =。
6．两输入端TTL 与非门的输出逻辑函数AB Z =，当A =B =1时，输出低电平且V Z =0.3V ，当该与非门加上负载后，输出电压将(增大，减小) 。
7．Moore 型时序电路和Mealy 型时序电路相比， 型电路的抗干扰能力更强。
8．与同步时序电路相比，异步时序电路的最大缺陷是会产生 状态。
9．JK 触发器的功能有置0、置1、保持和 。
10．现有容量为210×4位的SRAM2114，若要将其容量扩展成211×8位，则需要 片这样的RAM 。
二、选择题（本大题共10小题，每小题2分，共20分）在每小题列出的四个备选项中只有一个是符合题目要求的，请将其代码填写在题后的括号内。
错选、多选或未选均无分。
11．十进制数（172）10对应的8421BCD 编码是 。
【 】A ．（1111010）8421BCDB ．（10111010）8421BCDC ．（000101110010）8421BCD D ．（101110010）8421BCD12．逻辑函数AC B A C B A Z +=),,(包含 个最小项。
【 】A ．2B ．3C ．4D ．513．设标准TTL 与非门AB Z =的电源电压是+5V ，不带负载时输出高电平电压值等于+3.6V ，输出低电平电压值等于0.3V 。
《数字集成电路》期末试卷B(含答案)
浙江工业大学 / 学年第一学期 《数字电路和数字逻辑》期终考试试卷B姓名 学号 班级 任课教师一、填空题（本大题共10小题，每空格1分，共10分）请在每小题的空格中填上正确答案。
错填、不填均无分。
1．（1011111．01）2=（ ）102．若10010110是82421BCD 码的一组代码，则它对应的十进制数是________。
3．逻辑函数B A AB F +=的反函数F =________。
4．不会出现的变量取值所对应的最小项叫做 。
5．组合逻辑电路任何时刻的稳定输出仅仅只决定于__________各个输入变量的取值。
6．描述时序逻辑电路的逻辑表达式有驱动方程、________________和输出方程。
7．1K ×4位ROM ，有 位地址输入。
8．要把模拟量转化成数字量一般要经过四个步骤，分别称为采样、保持、________、编码。
9．D/A 转换器的主要参数有 、转换时间和转换精度。
10．集成单稳态触发电路的暂稳态维持时间取决于 。
二、选择题（本大题共10小题，每小题2分，共20分）在每小题列出的四个备选项中只有一个是符合题目要求的，请将其代码填写在题后的括号内。
错选、多选或未选均无分。
11．若已知Y XY YZ Z Y XY +=++，判断等式=+++))()((Z Y Z Y Y X Y Y X )(+成立的最简单方法是依据 规则。
【 】A ．代入规则B ．对偶规则C ．反演规则D ．互补规则12．F (A ,B ,C )的任意两个最小项之积等于 。
【 】 A ．0 B ．1 C ．ABC D ．ABC13．+0+1A A A ⋅⋅等于 。
【 】 A ．0 B ．1 C ． A D ．A 14．将TTL 与非门正常使用时，多余的输入端应 。
【 】 A ．全部接高电平 B ．部分接高电平，部分接地 C ．全部接地 D ．部分接地，部分悬空 15． S R 触发器不具有 功能。
数字集成电路测试题
A 衬底 B 扩散区 C 有源区 D 接触孔和通孔
© Digital Integrated Circuits2nd
提交
Inverter
单选题 1分 最符合阈值电压定义的说法是 。
A 漏端电流为1μA时的栅源电压
B 漏端电流10倍于泄露电流时的栅源电压
衬底载流子浓度和有源区载流子浓度相 C 等时的栅源电压
芯片中的金属线和PCB中的金属线一样， A 可以是多层的。
B
CMOS集成电路是在一块正方形的硅片 上制造的。
光刻机的作用是通过激光在硅片上刻画 C 集成电路版图。
光刻胶的作用是将集成电路所需的不同 D 材料层胶合在一起。
© Digital Integrated Circuits2nd
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Inverter
D MOgrated Circuits2nd
提交
Inverter
单选题 1分 电路互连线上的延时td 与长度L的关系是 。
A
td L
B
td L2
C
td L3/2
D
td L3
© Digital Integrated Circuits2nd
数字集成电路 ch1-ch4习题集
Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic
© Digital Integrated Circuits2nd
Inverter
单选题 1分
在集成电路0.25μm工艺中，晶体管的最小沟 道长度由 决定。
A 光刻精度 B 消费者和代工厂 C 电路工程师 D 电源电压
C 无穷大的“断开”电阻和有限的“导通”电阻。
© Digital Integrated Circuits2nd
集成电路设计原理考核试卷
4.描述模拟集成电路与数字集成电路在设计原则和实现技术上的主要区别，并给出一个实际应用中模拟集成电路的例子。
标准答案
一、单项选择题
1. B
2. B
3. D
4. D
5. B
6. D
7. C
8. C
9. B
10. D
17.在集成电路设计中，以下哪些方法可以提高电路的抗干扰能力？( )
A.采用差分信号传输
B.使用屏蔽技术
C.增加电源滤波器
D.提高工作频率
18.以下哪些类型的触发器在数字电路中常见？( )
A. D触发器
B. JK触发器
C. T触发器
D. SR触发器
19.以下哪些技术可以用于提高集成电路的数据处理速度？( )
3.以下哪些是数字集成电路的基本组成部分？( )
A.逻辑门
B.触发器
C.寄生电容
D.晶体管
4.以下哪些技术可以用于提高集成电路的频率？( )
A.减小晶体管尺寸
B.采用高介电常数材料
C.增加电源电压
D.优化互连线设计
5.在CMOS工艺中，以下哪些结构可以用来实现反相器？( )
A. PMOS晶体管
B. NMOS晶体管
11. C
12A
16. B
17. A
18. A
19. C
20. B
二、多选题
1. ABD
2. AB
3. AD
4. AB
5. AB
6. AB
7. ABCD
8. AB
9. ABCD
10. AC
11. ABC
数字电路试题五套(含标准答案)汇总
《数字电子技术》试卷填空(每空1分，共2 5分)1、(10110)2=( )10=( )16(28)10=( )2=( )16(56) 10= ( ) 8421BCD2、最基本的门电路是：_____ 、____ 、______ o3、有N个变量组成的最小项有______ 个。
4、基本RS触发器的特征方程为________ -约束条件是__.5、若存储器的容量是256MRAM,该RAM有_______存储单元，有_____ 字，字长____ 位，地址线________ 根o6、用N位移位寄存器构成的扭环形计数器的模是_________ .7、若令JK触发器的J=K=T则构成的触发器为 _______.&如图所示，丫= ______________ o9、如图所示逻辑电路的输出丫= ______________10、已知丫二AB BC ACD，则丫= _____________________________________------ ---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- O11、组合逻辑电路的特点是 _________ 、___________ 与组合逻辑电路相比，时序逻辑电路的输出不仅仅取决于此刻的_______ ;还与电路_____________________ 有关。
化简(每小题5分，共20分)1、公式法化简(1)Y= ABC ABC BC BC A(2) Y 二ABC A B C2、用卡诺图法化简下列逻辑函数(1) Y = BCD BC AC D ABD(2) Y m(134,9,11,12,14,15) ' =(5,6,7,13)三、设下列各触发器初始状态为0,试画出在CP作用下触发器的输出波形(10 分)fl 0四、用74LS161四位二进制计数器实现十进制计数器（15分）P Q AQ B Q C Q D C T 74LS161 LDCPA B C D CrQ A 、Q B 、Q C 、Q D :数据输出端; A 、B 、C 、D :数据输入端；P 、T :计数选通端； G :异步复位端； CP ：时钟控制输入端；L D :同步并置数控制端；C :位输出端；五、某汽车驾驶员培训班结业考试，有三名评判员，其中 A 为主评判员, 评判时，按照少数服从多数原则，但若主评判员认为合格也可以通过。
数字集成电路设计与系统分析答案
懂得1、Please illustrate the meaning of its voltage transfer characteristic to a logic gate, and describe the static behaviors showed in the voltage transfer characteristic curves.The electrical function of a gate is best expressed by its voltage transfer characteristic (VTC),which plots the output voltage as a function of the input voltage Vout=f(Vin).The high and low nominal voltage Voh and Vol;The gate or switching threshold voltage Vm,that is define as Vm=f(Vm)(The gate threshold voltage presents the midpoint of the switching characteristics,which is obtained when the output of a gate is short circuited to the input);The high and low input voltage Vih and Vil are defined by the point where the gain (=dVout/dVin)of the VTC equals -12、Please draw the voltage transfer characteristic curve of the inverter and label the static operation points in the VTC.3、Please describe the definition of noise margin and its physical significance(物理意义), then draw the figure of definition of noise margins.The noise margins represent the levels of noise that can be sustained(所允许的) when gates are cascaded. A measure of the sensitivity of a gate to noise is given by the noise margins NML(noise margin low) and NMH(noise margin high), which quantize the size of the legal “0” and “1”, respectively, and set a fixed maximum threshold on the noise value4、Please describe the meaning of the regenerative property and the conditions of a gate with regenerative property.A gate with regenerative property ensures that a disturbed signal converges back to a nominal voltage level after passing through a number of logical stages. The VTC should have a transient region (or undefined region) with a gain greater than 1 in absolute value, bordered by the two legal zones, where the gain should be less than 1 in absolute value5、What are the definitions of the fan-out and fan-in properties?The number that can be driven is termed the fan-out of circuit, that denotes the number of load gates N that are connected to the output of the driving gate. The fan-in of a gate is defined as the number of independent input nodes to the gate.6、How to describe the performance of a digital IC? Please illustrate the parameters used to characterize the transient performance of a logic family, and draw the associated figure of the definition of these parP ropagation delay time and rise/fall time can be used to characterize the transient performance of a logic family .Propagation delay time of a gate expresses the delay experienced by a signal when passing through a gate,which represent how quickly the gate responds to the changes at its inputs.Rise/fall time express how fast a signal transits between the different levels. Propagation delay time is defined as the period between the 50%transition points of the input and output signals.Rise/fall time is defined as the period between the 10% and 90% points of the total voltage transition at the output waveforms.1、Illustrate the basic structure and simple operation principle of MOS transistor.Four terminals:source, drain, gate, body; Vertical Structure: gate electrode, insulator, semiconductor substrate; Horizontal Structure: source region, channel region, drain region2、Illustrate the basic function of each terminal of MOS device, and describe the general terminal connections of NMOS and PMOS transistor, respectively.The source and the drain are the electrodes conducting the current. The gate electrode is thecontrolling terminal. The function of the body is secondaryIn NMOS devices, the source is defined as the n+ region which has a lower potential(电势) than the other n+ region, the drain. The source is the terminal with the higher potential in PMOS devices, The body is generally connected to a DC supply that is identical for all devices of the same type (GND for NMOS, VDD for PMOS).3、What does the transition (or input) characteristic of MOS transistor mean? And what conclusions we can find from the characteristic curve?It describes the relationship between the gate-source voltage and the drain-source current with the certain drain-source voltage .When the gate-source voltage is less than the threshold voltage, the conducting current is zero, that is, the NMOS transistor is in cutoff operation. When is larger than, the NMOS transistor is on.4、What does the current-voltage (or output) characteristic of MOS transistor mean? And what conclusions we can find from the I-V characteristic curve?.It describes the relationship between the drain-source voltage and the drain-source current with a certain gate-source voltageVgs > Vt , 0<VDS <VGS -VT : Linear modeThe inversion layer forms a continuous current path between the source and the drain.A drain current proportional to Vds will flow from the drain to the source through the conducting channel. The channel region acts as a voltage-controlled linear resister.5、Describe the operation modes of NMOS and PMOS transistors respectively, and define the corresponding ideal current equations.1、Explain the channel-length modulation, sub-threshold conduction, short-channel effect and narrow-channel effect. And illustrate their corresponding chief impacts on the device.This simple current equation prescribes a linear drain-bias dependence for the current in MOS transistors, determined by the empirical model parameter λ, called the channel-length modulation coefficientOne typical condition, which is due to the two-dimensional nature of channel current flow, is the sub-threshold conduction in small-geometry MOS transistors.As a working definition, a MOS transistor is called a short-channel device if its channel length is on the same order of magnitude as the depletion region thicknesses of the source and drain junctions.The short-channel effects that arise in this case are attributed to two physical phenomena: the limitations imposed on electron drift characteristics in the channel; the modification of the threshold voltage due to the shortening channel lengthMOS transistor that have channel widths on the same order of magnitude as the maxium depletion region thickness are defined as narrow channel devices.For MOSFET with small channel widths,the actual threshold voltage increases as a result of this extra depletion charge of the fringe depletion region.This fact is called narrow channel effect.2、Describe the three main components of the load capacitanceCL, when a logic gate is driving other fan-out gates. And sketch the capacitance model of NMOS transistor.Gate capacitances (of other inputs connected to out)Diffusion(or junction) capacitances (of drain/source regions)Routing capacitances (output to other inputs)1,Describe the basic structure and operation of a static CMOS inverter. Then draw theassociated transistor schematicThis structure consists of an enhancement-type NMOS transistor and an enhancement-type PMOS transistor, operating in complementary mode. So this configuration is called Complementary MOS (CMOS). The gate terminals of the PMOS and NMOS transistors are connected to form the inverter input. The drain terminals of the PMOS and NMOS transistors are connected to form the inverter output. The source and the substrate of the NMOS transistor are connected to the ground, while the source and body of PMOS transistor are connected to VDD The circuit topology is complementary push-pull in the sense that: For high input the NMOS transistor drives (pulls down) the output node while the PMOS transistor acts as the load, and for low input the PMOS transistor drives (pulls up) the output node while the NMOS transistor acts as the load.When the input is at VDD: The NMOS is on (conducting) while the PMOS is off (cut-off). A direct path exists between Vout and the ground node, resulting in a steady-state value of 0V at the output. When the input is at ground:The NMOS is off while the PMOS is on. A direct path exists between VDD and Vout, yielding a high output voltage (equal to VDD).Static CMOS logic:structure:The static CMOS style is really an extension of the static CMOS inverter to multiple inputs. A logic function in static CMOS must be implemented in both NMOS and PMOS transistors. It is the combination of the pull-up network(PUN) and the pull-down network(PDN). Each input always connects to PUN and PDN simultaneously. The function of the PUN is to provide a connection between the output and VDD anytime the output of the logic gate is meant to be 1 (based on the inputs). The function of the PDN is to connect the output to VSS when the output of the logic gate is meant to be 0.Opreation: The pull-down net should be “on” when the pull-up net is “off” and vice versa. For any given input combination, the output is connected either to VDD or to ground via a low-resistance path. A DC current path between the VDD and ground is not established for any of the input combinations. With the complementary nature of NMOS and PMOS, the pull-up or the pull-down is “on” alternately to implement the logic operation.Discuss the main problems for high fan-in static CMOS gates and the associated techniques for fast complex gates.tpHL = 0.69 Reqn(C1+2C2+3C3+4CL); Propagation delay deteriorates(恶化) rapidly as a function of fan-in quadratically in the worst case, Gates with a fan-in greater than 4 become excessively slow and must be avoided.tPLH increases linearly due to the linearly increasing value of the diffusion capacitance;tPHL increase quadratically due to the simultaneous increase the resistance and internal capacitance in serial part.Transistor sizing: as long as fan-out capacitance dominatesProgressive transistor sizing: This approach reduces the dominant resistance, while keeping the increase in capacitance within boundsTransfer gate:Configuration:The source and drain nodes serve as inputs and outputs, while the gate node serves as the control input, the body node is connected to the power/ground Operation: For NMOS transfer gate,it turns on while the gate control terminal goes high, and the input signal will be delivered to the output node; it turns off while the gate control terminal goes low, and the output node will be impedance.CMOS transmission gate:Configuration: The CMOS transmission gate consists of one NMOS and one PMOS transistor, with the source and drain connected in parallel; The gate voltages appliedto these two transistors are also set to be complementary signals. The substrate terminal of the NMOS transistor is connected to ground and the substrate terminal of the PMOS transistor is connected to Vdd.Operation: If the control signal C is logic-high (equal to Vdd), then both transistors are turned on and provide a low-resistance current path between the input and output nodes. If the control signal C is logic-low, then both transistors will be off, and the path between the input and output nodes will be in the high-impedance state. The weakness of one device is overcome by the strength of the other device, whether the output is transmitting a high or low value. This is a clear advantage of the CMOS transfer gate over the single transistor counterpart.DCVLS:Operation: Assume now that, for a given set of inputs, PDN1 conducts while PDN2 does not, and that Out and out are initially high and low, respectively. Turning on PDN1: Causes Out to be pulled down (below VDD−|VTP |); Out is in a high impedance state, as M2 and PDN2 are both turned off. At the point M2 turns on and starts charging out非to VDD — eventually turning off M1; This in turn enables Out to discharge all the way to GND.XOR/XNOR: When the signals A and B have the same values, there is one conducting path either AB or A非B非; Then the output F is pulled down;At the same time, the other pull-down paths connected to the F非are both turned off. When F is pulled down below VDD−|VTP |, M2 t urns on and starts charging F非to VDD —eventually turning off M1 and pulling down F to Gnd. When the signals A and B have the different values, there is one conducting path either AB非or A非B; Then the output F非is pulled down; At the same time, the other pull-down paths connected to the F are both turned off. When F非is pulled down below VDD−|VTP |, M1 turns on and starts charging F to VDD —eventually turning off M2 and pulling down F非to Gnd.Precharge-Evaluate dynamic CMOS:Operation: Precharge (when the clock signal Φ= 0)：The PMOS precharge transistor MP is conducting while the complementary NMOS transistor MN is off. The output load capacitance is precharged to VDD by MP, then VOH=VDD；The input voltages have no influence yet upon the output level since the complementary NMOS transistor MN is off. Evaluate (when the clock signal Φ=1)：The precharge transistor MP turns off while the NMOS evaluate transistor MN turns on. The output node voltage may now remain at the logic-high level or drop to a logic low, depending on the input voltage levels: If the input signals create a conducting path between the output node and the ground, PDN is on, and the output capacitance will discharge toward VOL=0;Otherwise, when PDN is off, the output voltage remains at VOH= VDD.Domino dynamic CMOS logic:When Φ=0, during precharge: The output of the n-type dynamic gate is charged up to VDD, and the output of the inverter is set to 0. When Φ=1, during evaluation: The dynamic gate conditionally discharges, and there are two possibilities: The output node of the dynamic CMOS stage is either discharged to a low level through the NMOS circuitry (1 to 0 transition), or it remains high. Consequently, the inverter output voltage can also make at most one transition during the evaluation phase, from 0 to 1.TSPC dynamic CMOS logic:Configuration:If one constrains a NORA stage to have only n-precharge gates, and not static gates, then a p-channel transistor can be eliminated from the clocked latch; The dynamic circuit technique to be presented in that it uses only one-phase clock signal, so no clock skew problem exists. The NORA design style can be simplified so that a single clock is sufficient. For the doubled n-C2MOS latch, when φ= 1, the latch is in the transparent evaluate mode and corresponds to 2 cascaded inverters (non-inverting); For the doubled n-C2MOS latch, when φ= 0, both inverters are disabled (hold mode) -- only the pull-up network is still active.Pipelined NORA dynamic CMOS system:Configuration: Consists of an np-CMOS logic sequence and a clocked CMOS output buffer; A pipelined system can be constructed by simply cascading alternating φ-section and φ -section, meaning that evaluation occurs during active φ and φ respectively;Operation:φ=0, during hold mode :N block performs the precharge operation and pulls node Out1 up to VDD through the p-type device Mp1, while p block performs the discharge operation and pulls the node Out2 down to zero through the n-type device Mn2; The clocked CMOS latch will not be in operation and the previous output voltage will be stored on the output load capacitor CL. φ=1, during evaluate mode:All cascaded NMOS and PMOS blocks evaluate output levels one after the other, and then the signal Out2 will be inversed to the output node by the clocked CMOS latch in operation;Operation Mode: Evaluate―Hold: All logic stages perform the precharge-discharge operation when the clock is high, and all stages evaluate output levels when the clock is low. Therefore, wewill call this circuit a section, meaning that evaluation occurs during active .Clocked CMOS dynamic circuit:Basic Structure:A pair of PMOS and NMOS transistors controlled by the complementary clock signals are cascaded in the pullup and pulldown paths of the static CMOS gate, respectively, then a CMOS logic gate can be synchronized with a clock. Operation: φ=1, during evaluation mode：The transistors Mp1 and Mp2 are both turned on, then this gate can evaluate normally as a CMOS inverter to generate the logic output In非; φ=0 , during hold mode: Both transistors Mp1 and Mp2 are off, decoupling the output from the input. The CMOS circuit cannot conduct and evaluate, then the output Q retains its previous value stored on the output capacitor CL.Sequential logic:Virtually all useful systems require storage of state information, leading to another class of circuits called sequential logic circuits. In these circuits, the output not only depends upon the current values of the inputs, but also upon preceding output values. In other words, a sequential circuit remembers some of the past history of the system; A sequential circuit consists of a combinational circuit and a memory block in the feedback loop.Combination logic:In all logic circuits described so far, the output is directly related to the input. Typically, there are no feedback loops between the output and the input in these circuits (also classified as non-regenerative circuits), so the outputs are always a logical combination of the inputs. As a class, these circuits are known as combinational logic circuits. Combinational logic circuits, described earlier, have the property that the output of a logic block is only a function of the current input values, assuming that enough time has elapsed for the logic gates to settle. Static storage:preserve state as long as the power is on;are built using positive feedback or regeneration with an intentional connection between the output and the input;useful when updates are infrequent (clock gating)Dynamic storage:store state on parasitic capacitors;only hold state for short periods of time (milliseconds);require periodic refresh to annihilate charge leakage;usually simpler, so higher speed and lower power;useful in datapath circuits that require high performance levels and are periodically clockedLatch: level sensitive circuit that passes inputs to Q when the clock is high (or low);input sampledon the falling edge of the clock is held stable when clock is low (or high)Register or Flip-flops (edge-triggered): edge sensitive circuits that only sample the inputs on a clock transitionpositive edge-triggered: 0- 1negative edge-triggered: 1 -0built using latches (e.g., master-slave flip-flops)。
数字集成电路第二版答案
数字集成电路第二版答案【篇一：《数字集成电路》期末试卷a(含答案)】考试试卷 a姓名学号班级任课教师一、填空题（本大题共10小题，每空格1分，共10分）请在每小题的空格中填上正确答案。
错填、不填均无分。
1．十进制数（68）10对应的二进制数等于；2．描述组合逻辑电路逻辑功能的方法有真值表、逻辑函数、卡诺图、逻辑电路图、波形图和硬件描述语言（hdl）法等，其中描述法是基础且最直接。
3．a?1可以简化为4．图1所示逻辑电路对应的逻辑函数l等于。
abc≥1lcy图1图25．如图2所示，当输入c是（高电平，低电平）时，y?ab。
6．两输入端ttl与非门的输出逻辑函数z?ab，当a=b=1时，输出低电平且vz=0.3v，当该与非门加上负载后，输出电压将(增大，减小)。
7．moore型时序电路和mealy型时序电路相比，型电路的抗干扰能力更强。
8．与同步时序电路相比，异步时序电路的最大缺陷是会产生 9．jk触发器的功能有置0、置1、保持和的ram。
二、选择题（本大题共10小题，每小题2分，共20分）在每小题列出的四个备选项中只有一个是符合题目要求的，请将其代码填写在题后的括号内。
错选、多选或未选均无分。
11．十进制数（172）10对应的8421bcd编码是。
【】a．（1111010）8421bcdb．（10111010）8421bcdc．（000101110010）8421bcd d．（101110010）8421bcd12．逻辑函数z(a,b,c)?ab?ac包含【】a．2 b．3c．4d．513．设标准ttl与非门z?ab的电源电压是+5v，不带负载时输出高电平电压值等于+3.6v，输出低电平电压值等于0.3v。
当输入端a、b电压值va=0.3v，vb=3.6v和va=vb=3.6v两种情况下，输出电压值vz分别为。
a．5v，5v c．3.6v，0.3v【】b．3.6v，3.6v d．0.3v ，3.6v14．图3所示电路的输出逻辑函数z1等于。
数字集成电路试题及答案
北京大学信息学院考试试卷考试科目： 数字集成电路原理 考试时间 姓名： 学号：题 号 一 二三四五六七八九 十总分分 数 阅卷人以下为答题纸，共 6 页一、填空1、（4分）CMOS 逻辑电路中NMOS 管是（ 增强 ）型，PMOS 管是（增强）型； NMOS 管的体端接（ 地 ），PMOS 管的体端接（ VDD ）。
2、（8分）CMOS 逻辑电路的功耗由3部分组成，分别是（ 动态功耗 ）、（开关过程中的短路功耗）和（ 静态功耗 ）；增大器件的阈值 电压有利于减小（ 短路功耗和静态 ）功耗。
3、（6分）饱和负载NMOS 反相器的3个主要缺点是：（ 输出高电平有阈值损失 ）,( 输出低电平不是0，与比例因子Kr 相关 ), ( 输出低电平时有静态功耗 ) 。
4、（3分）三态输出电路的3种输出状态是：（ 高电平 ）， （ 低电平 ）和（ 高阻态 ）。
二、（12分）画出实现ABC D C B A Y +++=)(的静态CMOS 电路，如果所有MOS管的导电因子都是K ,分析几个输入同步变化的等效反相器的导电因子（K Neff 和K Peff ），在什么输入状态下电路有最小的低电平噪声容限。
Kneff = 1/(1/3k + 1/k) + k/3 = 3k/4 + k/3 = （13/12）K;Kpeff = 1/(1/3k + 1/k) + k/3 = （13/12）K;当 D = 1 ，A、B、C 同步变化时，上拉通路3个串联的PMOS 管起作用，下拉支路所有NMOS 都起作用，Kneff 最大 ， Kpeff 最小，传输特性曲线在最左边。
三、（12分）分析下面2个电路的逻辑功能，若所有输入高电平都是5V、输入低电平都是0V，电源电压是5V，所有MOS 管的阈值电压绝对值都是0.8V，分析2个电路的输出高、低电平和主要优缺点。
（1） （2） 电路 1） ⎩⎨⎧=======+=VB A VB A Vol B A AB Y 2.4Voh 15Voh 0,0,时，时， ，电路 2） B A B A B A AB Y +=++=，低电平0V ，高电平 4.2V 电路1）结构简单，节省面积，逻辑电平与输入状态相关，驱动能力差，噪声容限小。
数字集成电路设计与系统分析答案
懂得1、Please illustrate the meaning of its voltage transfer characteristic to a logic gate, and describe the static behaviors showed in the voltage transfer characteristic curves.The electrical function of a gate is best expressed by its voltage transfer characteristic (VTC),which plots the output voltage as a function of the input voltage Vout=f(Vin).The high and low nominal voltage Voh and Vol;The gate or switching threshold voltage Vm,that is define as Vm=f(Vm)(The gate threshold voltage presents the midpoint of the switching characteristics,which is obtained when the output of a gate is short circuited to the input);The high and low input voltage Vih and Vil are defined by the point where the gain (=dVout/dVin)of the VTC equals -12、Please draw the voltage transfer characteristic curve of the inverter and label the static operation points in the VTC.3、Please describe the definition of noise margin and its physical significance(物理意义), then draw the figure of definition of noise margins.The noise margins represent the levels of noise that can be sustained(所允许的) when gates are cascaded. A measure of the sensitivity of a gate to noise is given by the noise margins NML(noise margin low) and NMH(noise margin high), which quantize the size of the legal “0” and “1”, respectively, and set a fixed maximum threshold on the noise value4、Please describe the meaning of the regenerative property and the conditions of a gate with regenerative property.A gate with regenerative property ensures that a disturbed signal converges back to a nominal voltage level after passing through a number of logical stages. The VTC should have a transient region (or undefined region) with a gain greater than 1 in absolute value, bordered by the two legal zones, where the gain should be less than 1 in absolute value5、What are the definitions of the fan-out and fan-in properties?The number that can be driven is termed the fan-out of circuit, that denotes the number of load gates N that are connected to the output of the driving gate. The fan-in of a gate is defined as the number of independent input nodes to the gate.6、How to describe the performance of a digital IC? Please illustrate the parameters used to characterize the transient performance of a logic family, and draw the associated figure of the definition of these parP ropagation delay time and rise/fall time can be used to characterize the transient performance of a logic family .Propagation delay time of a gate expresses the delay experienced by a signal when passing through a gate,which represent how quickly the gate responds to the changes at its inputs.Rise/fall time express how fast a signal transits between the different levels. Propagation delay time is defined as the period between the 50%transition points of the input and output signals.Rise/fall time is defined as the period between the 10% and 90% points of the total voltage transition at the output waveforms.1、Illustrate the basic structure and simple operation principle of MOS transistor.Four terminals:source, drain, gate, body; Vertical Structure: gate electrode, insulator, semiconductor substrate; Horizontal Structure: source region, channel region, drain region2、Illustrate the basic function of each terminal of MOS device, and describe the general terminal connections of NMOS and PMOS transistor, respectively.The source and the drain are the electrodes conducting the current. The gate electrode is thecontrolling terminal. The function of the body is secondaryIn NMOS devices, the source is defined as the n+ region which has a lower potential(电势) than the other n+ region, the drain. The source is the terminal with the higher potential in PMOS devices, The body is generally connected to a DC supply that is identical for all devices of the same type (GND for NMOS, VDD for PMOS).3、What does the transition (or input) characteristic of MOS transistor mean? And what conclusions we can find from the characteristic curve?It describes the relationship between the gate-source voltage and the drain-source current with the certain drain-source voltage .When the gate-source voltage is less than the threshold voltage, the conducting current is zero, that is, the NMOS transistor is in cutoff operation. When is larger than, the NMOS transistor is on.4、What does the current-voltage (or output) characteristic of MOS transistor mean? And what conclusions we can find from the I-V characteristic curve?.It describes the relationship between the drain-source voltage and the drain-source current with a certain gate-source voltageVgs > Vt , 0<VDS <VGS -VT : Linear modeThe inversion layer forms a continuous current path between the source and the drain.A drain current proportional to Vds will flow from the drain to the source through the conducting channel. The channel region acts as a voltage-controlled linear resister.5、Describe the operation modes of NMOS and PMOS transistors respectively, and define the corresponding ideal current equations.1、Explain the channel-length modulation, sub-threshold conduction, short-channel effect and narrow-channel effect. And illustrate their corresponding chief impacts on the device.This simple current equation prescribes a linear drain-bias dependence for the current in MOS transistors, determined by the empirical model parameter λ, called the channel-length modulation coefficientOne typical condition, which is due to the two-dimensional nature of channel current flow, is the sub-threshold conduction in small-geometry MOS transistors.As a working definition, a MOS transistor is called a short-channel device if its channel length is on the same order of magnitude as the depletion region thicknesses of the source and drain junctions.The short-channel effects that arise in this case are attributed to two physical phenomena: the limitations imposed on electron drift characteristics in the channel; the modification of the threshold voltage due to the shortening channel lengthMOS transistor that have channel widths on the same order of magnitude as the maxium depletion region thickness are defined as narrow channel devices.For MOSFET with small channel widths,the actual threshold voltage increases as a result of this extra depletion charge of the fringe depletion region.This fact is called narrow channel effect.2、Describe the three main components of the load capacitanceCL, when a logic gate is driving other fan-out gates. And sketch the capacitance model of NMOS transistor.Gate capacitances (of other inputs connected to out)Diffusion(or junction) capacitances (of drain/source regions)Routing capacitances (output to other inputs)1,Describe the basic structure and operation of a static CMOS inverter. Then draw theassociated transistor schematicThis structure consists of an enhancement-type NMOS transistor and an enhancement-type PMOS transistor, operating in complementary mode. So this configuration is called Complementary MOS (CMOS). The gate terminals of the PMOS and NMOS transistors are connected to form the inverter input. The drain terminals of the PMOS and NMOS transistors are connected to form the inverter output. The source and the substrate of the NMOS transistor are connected to the ground, while the source and body of PMOS transistor are connected to VDD The circuit topology is complementary push-pull in the sense that: For high input the NMOS transistor drives (pulls down) the output node while the PMOS transistor acts as the load, and for low input the PMOS transistor drives (pulls up) the output node while the NMOS transistor acts as the load.When the input is at VDD: The NMOS is on (conducting) while the PMOS is off (cut-off). A direct path exists between Vout and the ground node, resulting in a steady-state value of 0V at the output. When the input is at ground:The NMOS is off while the PMOS is on. A direct path exists between VDD and Vout, yielding a high output voltage (equal to VDD).Static CMOS logic:structure:The static CMOS style is really an extension of the static CMOS inverter to multiple inputs. A logic function in static CMOS must be implemented in both NMOS and PMOS transistors. It is the combination of the pull-up network(PUN) and the pull-down network(PDN). Each input always connects to PUN and PDN simultaneously. The function of the PUN is to provide a connection between the output and VDD anytime the output of the logic gate is meant to be 1 (based on the inputs). The function of the PDN is to connect the output to VSS when the output of the logic gate is meant to be 0.Opreation: The pull-down net should be “on” when the pull-up net is “off” and vice versa. For any given input combination, the output is connected either to VDD or to ground via a low-resistance path. A DC current path between the VDD and ground is not established for any of the input combinations. With the complementary nature of NMOS and PMOS, the pull-up or the pull-down is “on” alternately to implement the logic operation.Discuss the main problems for high fan-in static CMOS gates and the associated techniques for fast complex gates.tpHL = 0.69 Reqn(C1+2C2+3C3+4CL); Propagation delay deteriorates(恶化) rapidly as a function of fan-in quadratically in the worst case, Gates with a fan-in greater than 4 become excessively slow and must be avoided.tPLH increases linearly due to the linearly increasing value of the diffusion capacitance;tPHL increase quadratically due to the simultaneous increase the resistance and internal capacitance in serial part.Transistor sizing: as long as fan-out capacitance dominatesProgressive transistor sizing: This approach reduces the dominant resistance, while keeping the increase in capacitance within boundsTransfer gate:Configuration:The source and drain nodes serve as inputs and outputs, while the gate node serves as the control input, the body node is connected to the power/ground Operation: For NMOS transfer gate,it turns on while the gate control terminal goes high, and the input signal will be delivered to the output node; it turns off while the gate control terminal goes low, and the output node will be impedance.CMOS transmission gate:Configuration: The CMOS transmission gate consists of one NMOS and one PMOS transistor, with the source and drain connected in parallel; The gate voltages appliedto these two transistors are also set to be complementary signals. The substrate terminal of the NMOS transistor is connected to ground and the substrate terminal of the PMOS transistor is connected to Vdd.Operation: If the control signal C is logic-high (equal to Vdd), then both transistors are turned on and provide a low-resistance current path between the input and output nodes. If the control signal C is logic-low, then both transistors will be off, and the path between the input and output nodes will be in the high-impedance state. The weakness of one device is overcome by the strength of the other device, whether the output is transmitting a high or low value. This is a clear advantage of the CMOS transfer gate over the single transistor counterpart.DCVLS:Operation: Assume now that, for a given set of inputs, PDN1 conducts while PDN2 does not, and that Out and out are initially high and low, respectively. Turning on PDN1: Causes Out to be pulled down (below VDD−|VTP |); Out is in a high impedance state, as M2 and PDN2 are both turned off. At the point M2 turns on and starts charging out非to VDD — eventually turning off M1; This in turn enables Out to discharge all the way to GND.XOR/XNOR: When the signals A and B have the same values, there is one conducting path either AB or A非B非; Then the output F is pulled down;At the same time, the other pull-down paths connected to the F非are both turned off. When F is pulled down below VDD−|VTP |, M2 t urns on and starts charging F非to VDD —eventually turning off M1 and pulling down F to Gnd. When the signals A and B have the different values, there is one conducting path either AB非or A非B; Then the output F非is pulled down; At the same time, the other pull-down paths connected to the F are both turned off. When F非is pulled down below VDD−|VTP |, M1 turns on and starts charging F to VDD —eventually turning off M2 and pulling down F非to Gnd.Precharge-Evaluate dynamic CMOS:Operation: Precharge (when the clock signal Φ= 0)：The PMOS precharge transistor MP is conducting while the complementary NMOS transistor MN is off. The output load capacitance is precharged to VDD by MP, then VOH=VDD；The input voltages have no influence yet upon the output level since the complementary NMOS transistor MN is off. Evaluate (when the clock signal Φ=1)：The precharge transistor MP turns off while the NMOS evaluate transistor MN turns on. The output node voltage may now remain at the logic-high level or drop to a logic low, depending on the input voltage levels: If the input signals create a conducting path between the output node and the ground, PDN is on, and the output capacitance will discharge toward VOL=0;Otherwise, when PDN is off, the output voltage remains at VOH= VDD.Domino dynamic CMOS logic:When Φ=0, during precharge: The output of the n-type dynamic gate is charged up to VDD, and the output of the inverter is set to 0. When Φ=1, during evaluation: The dynamic gate conditionally discharges, and there are two possibilities: The output node of the dynamic CMOS stage is either discharged to a low level through the NMOS circuitry (1 to 0 transition), or it remains high. Consequently, the inverter output voltage can also make at most one transition during the evaluation phase, from 0 to 1.TSPC dynamic CMOS logic:Configuration:If one constrains a NORA stage to have only n-precharge gates, and not static gates, then a p-channel transistor can be eliminated from the clocked latch; The dynamic circuit technique to be presented in that it uses only one-phase clock signal, so no clock skew problem exists. The NORA design style can be simplified so that a single clock is sufficient. For the doubled n-C2MOS latch, when φ= 1, the latch is in the transparent evaluate mode and corresponds to 2 cascaded inverters (non-inverting); For the doubled n-C2MOS latch, when φ= 0, both inverters are disabled (hold mode) -- only the pull-up network is still active.Pipelined NORA dynamic CMOS system:Configuration: Consists of an np-CMOS logic sequence and a clocked CMOS output buffer; A pipelined system can be constructed by simply cascading alternating φ-section and φ -section, meaning that evaluation occurs during active φ and φ respectively;Operation:φ=0, during hold mode :N block performs the precharge operation and pulls node Out1 up to VDD through the p-type device Mp1, while p block performs the discharge operation and pulls the node Out2 down to zero through the n-type device Mn2; The clocked CMOS latch will not be in operation and the previous output voltage will be stored on the output load capacitor CL. φ=1, during evaluate mode:All cascaded NMOS and PMOS blocks evaluate output levels one after the other, and then the signal Out2 will be inversed to the output node by the clocked CMOS latch in operation;Operation Mode: Evaluate―Hold: All logic stages perform the precharge-discharge operation when the clock is high, and all stages evaluate output levels when the clock is low. Therefore, wewill call this circuit a section, meaning that evaluation occurs during active .Clocked CMOS dynamic circuit:Basic Structure:A pair of PMOS and NMOS transistors controlled by the complementary clock signals are cascaded in the pullup and pulldown paths of the static CMOS gate, respectively, then a CMOS logic gate can be synchronized with a clock. Operation: φ=1, during evaluation mode：The transistors Mp1 and Mp2 are both turned on, then this gate can evaluate normally as a CMOS inverter to generate the logic output In非; φ=0 , during hold mode: Both transistors Mp1 and Mp2 are off, decoupling the output from the input. The CMOS circuit cannot conduct and evaluate, then the output Q retains its previous value stored on the output capacitor CL.Sequential logic:Virtually all useful systems require storage of state information, leading to another class of circuits called sequential logic circuits. In these circuits, the output not only depends upon the current values of the inputs, but also upon preceding output values. In other words, a sequential circuit remembers some of the past history of the system; A sequential circuit consists of a combinational circuit and a memory block in the feedback loop.Combination logic:In all logic circuits described so far, the output is directly related to the input. Typically, there are no feedback loops between the output and the input in these circuits (also classified as non-regenerative circuits), so the outputs are always a logical combination of the inputs. As a class, these circuits are known as combinational logic circuits. Combinational logic circuits, described earlier, have the property that the output of a logic block is only a function of the current input values, assuming that enough time has elapsed for the logic gates to settle. Static storage:preserve state as long as the power is on;are built using positive feedback or regeneration with an intentional connection between the output and the input;useful when updates are infrequent (clock gating)Dynamic storage:store state on parasitic capacitors;only hold state for short periods of time (milliseconds);require periodic refresh to annihilate charge leakage;usually simpler, so higher speed and lower power;useful in datapath circuits that require high performance levels and are periodically clockedLatch: level sensitive circuit that passes inputs to Q when the clock is high (or low);input sampledon the falling edge of the clock is held stable when clock is low (or high)Register or Flip-flops (edge-triggered): edge sensitive circuits that only sample the inputs on a clock transitionpositive edge-triggered: 0- 1negative edge-triggered: 1 -0built using latches (e.g., master-slave flip-flops)。
《数字集成电路》期末试卷A(含答案)
浙江工业大学 / 学年第一学期 《数字电路和数字逻辑》期终考试试卷 A姓名 学号 班级 任课教师一、填空题（本大题共10小题，每空格1分，共10分）请在每小题的空格中填上正确答案。
错填、不填均无分。
1．十进制数（68）10对应的二进制数等于 ；2．描述组合逻辑电路逻辑功能的方法有真值表、逻辑函数、卡诺图、逻辑电路图、波形图和硬件描述语言（HDL ）法等，其中 描述法是基础且最直接。
3．1A⊕可以简化为 。
4．图1所示逻辑电路对应的逻辑函数L 等于 。
A B L≥1&CYC图1 图25．如图2所示，当输入C 是（高电平，低电平） 时，AB Y =。
6．两输入端TTL 与非门的输出逻辑函数AB Z =，当A =B =1时，输出低电平且V Z =0.3V ，当该与非门加上负载后，输出电压将(增大，减小) 。
7．Moore 型时序电路和Mealy 型时序电路相比， 型电路的抗干扰能力更强。
8．与同步时序电路相比，异步时序电路的最大缺陷是会产生 状态。
9．JK 触发器的功能有置0、置1、保持和 。
10．现有容量为210×4位的SRAM2114，若要将其容量扩展成211×8位，则需要 片这样的RAM 。
二、选择题（本大题共10小题，每小题2分，共20分）在每小题列出的四个备选项中只有一个是符合题目要求的，请将其代码填写在题后的括号内。
错选、多选或未选均无分。
11．十进制数（172）10对应的8421BCD 编码是 。
【 】A ．（1111010）8421BCDB ．（10111010）8421BCDC ．（000101110010）8421BCD D ．（101110010）8421BCD12．逻辑函数AC B A C B A Z +=),,(包含 个最小项。
【 】A ．2B ．3C ．4D ．513．设标准TTL 与非门AB Z =的电源电压是+5V ，不带负载时输出高电平电压值等于+3.6V ，输出低电平电压值等于0.3V 。
集成电路设计岗位招聘笔试题及解答(某大型国企)2024年
2024年招聘集成电路设计岗位笔试题及解答(某大型国企)(答案在后面)一、单项选择题（本大题有10小题，每小题2分，共20分）1、集成电路设计的主要目的是实现以下哪种功能？A、数据存储B、数据传输C、信号放大D、逻辑运算2、在CMOS工艺中，以下哪一项不是晶体管的工作状态？A、线性放大区B、饱和区C、截止区D、存储区3、在CMOS逻辑电路中，当输入信号从低电平变为高电平时，NMOS晶体管的工作状态会如何变化？A. 从导通变为截止B. 保持导通C. 从截止变为导通D. 保持截止4、在数字集成电路中，同步复位与异步复位的主要区别在于：A. 同步复位只在时钟边沿有效，而异步复位则与时钟无关。
B. 异步复位比同步复位更节省电力。
C. 同步复位需要额外的外部信号来触发。
D. 异步复位可以实现更快的数据处理速度。
5、集成电路设计中，以下哪种类型的逻辑门在数字电路中应用最为广泛？A. OR门B. AND门C. NOT门D. XOR门6、在集成电路设计中，以下哪个术语用于描述在模拟电路中，由于温度、电源电压等因素变化而导致的电路性能变化？A. 时钟抖动B. 静态功耗C. 温度系数D. 信号完整性7、在CMOS工艺中，哪种场效应管使用最为广泛？A、NMOS管B、PMOS管C、NMOS2管D、CMOS管8、在高速运算电路中，如何减小延迟时间？A、增加晶体管尺寸B、降低电源电压C、优化布局布线D、提高环境温度9、题目：下面哪个选项描述的是集成电路设计中常见的半导体材料？A. 硅和锗B. 钨和钼C. 氮气和氢气D. 金和银 10、题目：在集成电路设计中，下面哪个术语描述的是电路中模拟信号转换为数字信号的过程？A. 编译器B. 读取操作C. 模数转换（A/D转换）D. 命令二、多项选择题（本大题有10小题，每小题4分，共40分）1、关于CMOS逻辑门电路的描述，哪些是正确的？（多选）A. CMOS逻辑门在静态情况下几乎不消耗电流。
专升本《集成电路与数字系统设计工程》_试卷_答案
专升本《集成电路与数字系统设计工程》一、（共59题,共150分）1. 关于PROM和PLA的结构，下列叙述不正确的是（）（2分）A.PROM的与阵列固定不可编程B.PROM的或阵列可编程C.PLA的与、或阵列均可编程D.PROM的与、或阵列均不可编程.标准答案：D2. 一个多输入与非门，输出为0的条件是（）（2分）A.只要有一个输入为1，其余输入无关B.只要有一个输入为0，其余输入无关C.全部输入均为1D.全部输入均为0.标准答案：C3. 下列四种类型的逻辑门中，可以用（）实现三种基本运算买的商品数。
（2分）A.与门B.与非门C.或门D.非门.标准答案：B4. 设计一个四位二进制码的奇偶位发生器（假定采用偶检验码），需要（）个异或门。
（2分）A.2B.3C.4D.5.标准答案：B5. 寻址容量为的RAM需要（）根地址线。
（2分）A.4B.8C.14D.16.标准答案：C6. 对于如图所示波形,其反映的逻辑关系是（）。
（2分）A.与关系B.异或关系C.同或关系D.无法判断.标准答案：7. 已知逻辑表达式，与它功能相等的函数表达式（）（2分）A.F=ABB.F=AB+CC.D..标准答案：B 8. 一只四输入端与非门，使其输出为1的输入变量取值组合有（）种。
（2分）A.15B.8C.7D.1.标准答案：A9. 时序电路输出状态（）。
（2分）A.仅与该时刻输入信号的状态有关B.仅与时序电路的原状态有关C.与A、B皆有关D.与A、B、C皆有关.标准答案：D10. 对于标准的1P2M CMOS工艺，不能实现的器件是（）。
（2分）A.PMOSB.纵向BJTC.PIP电容D.NMOS.标准答案：C11. 下列公式中哪一个是错误的？（）。
（2分）A.0+A=A??B.A+A=A?C.?????D.A+BC=(A+B)(A+C).标准答案：C12. 如果将异或门当作反相器使用，各输入端应如何连接？（）（2分）A.异或门的一个输入端当作反相器的输入端，另一个输入端都接高电平B.异或门的一个输入端当作反相器的输入端，另一个输入端都接低电平C.异或门的一个输入端当作反相器的输出端，另一个输入端都接高电平D.异或门的一个输入端当作反相器的输出端，另一个输入端都接低电平.标准答案：A13. 数字系统中，采用（）可以将减法运算转化为加法运算。
数字电路答案大全(DOC)
数字电路试卷答案大全试卷A一、选择题（从每小题的四个备选答案中，选出一个正确答案，并将其号码填在括号内，每小题2分，共20分）1.将十进制数（18）10转换成八进制数是 [ ]① 20 ② 22 ③ 21 ④ 23 2. 三变量函数()BC A C B A F+=,,的最小项表示中不含下列哪项 [ ]① m2 ② m5 ③ m3 ④ m7 3.一片64k ×8存储容量的只读存储器（ROM ），有 [ ]①64条地址线和8条数据线 ②64条地址线和16条数据线 ③16条地址线和8条数据线 ④16条地址线和16条数据线4.下列关于TTL 与非门的输出电阻描述中，正确的是 [ ] ①门开态时输出电阻比关态时大 ②两种状态都是无穷大输出电阻 ③门关态时输出电阻比开态时大 ④两种状态都没有输出电阻5.以下各种ADC 中，转换速度最慢的是 [ ]① 并联比较型 ② 逐次逼进型 ③ 双积分型 ④ 以上各型速度相同6. 关于PAL 器件与或阵列说法正确的是 [ ]① 只有与阵列可编程 ② 都是可编程的③ 只有或阵列可编程 ④ 都是不可编程的7. 当三态门输出高阻状态时，输出电阻为 [ ]① 无穷大 ② 约100欧姆 ③ 无穷小 ④ 约10欧姆8.通常DAC 中的输出端运算放大器作用是 [ ]① 倒相 ② 放大③ 积分 ④ 求和 9. 16个触发器构成计数器，该计数器可能的最大计数模值是 [ ]① 16 ② 32 ③ 162 ④ 216 10.一个64选1的数据选择器有（ ）个选择控制信号输入端。
[ ]① 6 ② 16 ③ 32 ④ 64 二、填空题（把正确的内容填在题后的括号内。
每空1分，共15分。
）1．已知一个四变量的逻辑函数的标准最小项表示为()()13,11,9,8,6,4,3,2,0,,,m d c b a F ∑=，那么用最小项标准表示=*F ，以及=F ，使用最大项标准表示F。
F，以及==2．具有典型实用意义的可编程逻辑器件包括，，，。
最新《集成电路设计原理》试卷及答案
电科《集成电路原理》期末考试试卷一、填空题1.（1分） 年，第一次观测到了具有放大作用的晶体管。
2．（2分）摩尔定律是指 。
3.集成电路按工作原理来分可分为 、 、 。
4.（4分）光刻的工艺过程有底膜处理、涂胶、前烘、 、 、 、 和去胶。
5.（4分）MOSFET可以分为 、 、 、 四种基本类型。
6.（3分）影响MOSFET 阈值电压的因素有： 、 以及 。
7.（2分）在CMOS 反相器中，V in ，V out 分别作为PMOS 和NMOS 的 和 ； 作为PMOS 的源极和体端， 作为NMOS 的源极和体端。
8．（2分）CMOS 逻辑电路的功耗可以分为 和 。
9.（3分）下图的传输门阵列中5DD V V =,各管的阈值电压1T V V =，电路中各节点的初始电压为0，如果不考虑衬偏效应，则各输出节点的输出电压Y 1= V ，Y 2= V ，Y 3= V 。
DD 13210.（6分）写出下列电路输出信号的逻辑表达式：Y 1= ；Y 2= ；Y 3= 。
AB Y 1AB23二、画图题：（共12分）=+的电路图，要求使用的1．（6分）画出由静态CMOS电路实现逻辑关系Y ABD CDMOS管最少。
2.（6分）用动态电路级联实现逻辑功能Y ABC=,画出其相应的电路图。
三、简答题：（每小题5分，共20分）1.简单说明n阱CMOS的制作工艺流程，n阱的作用是什么？2.场区氧化的作用是什么，采用LOCOS工艺有什么缺点，更好的隔离方法是什么？3.简述静态CMOS 电路的优点。
4.简述动态电路的优点和存在的问题。
四、分析设计题：（共38分1.（12分）考虑标准0.13m μ CMOS 工艺下NMOS 管，宽长比为W/L=0.26/0.13m m μμ，栅氧厚度为2.6ox t nm =，室温下电子迁移率2220/n cm V s μ=，阈值电压T V =0.3V,计算 1.0GS V =V 、0.3DS V =V 和0.9V 时D I 的大小。
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三、计算题（共25分，第一题10分，第二题15分）
1．已知集成电路中Al1层参数如下：单位长度电容120aF/um；单位长度电阻Ω/um。计算在该层长为12cm的导线传播延时。为减小此导线的传播延时将此导线3等分并插入2个传播延时为80ps的反相器，计算在这种情况下各层上整个导线的传播延时。
解：1)
2．将每道大题得分和总分填入得分栏中。
共 页 第 页
.ห้องสมุดไป่ตู้
图1. 测试配置装置
解： 当R=30kΩ，
假设晶体管处于线性区。
证明该晶体管处于线性区。
四、设计题（共30分，每题10分）
1．使用互补CMOS电路实现逻辑表达式 ，当反相器的NMOS W/L=2, PMOS W/L=4时输出电阻相同，根据这个确定该网络中各个器件尺寸。
5简述静态CMOS电路的优缺点。
答：静态CMOS电路在电源的两条轨线之间电压的摆幅，即VOH=VDD，VOL=GND。由于上拉和下拉网络是互斥网络，因此电路没有静态功耗。但存在有两个主要问题：一是有N个输入的门uyao晶体管数目为2N个，大大增加了它的实现面积；二是静态CMOS门的传播延时随扇入数的增加而迅速增加。
因此，
3 考虑图3，
a．下面的CMOS晶体管网络实现什么逻辑功能反相器的NMOS W/L=4,
PMOS W/L=8时输出电阻相同，根据这个确定该网络中各个器件尺寸。
b．最初的输入模式是什么，必须采用哪一种输入才能取得最大传输延时
考虑在内部节点中的电容的影响。（给出分析过程）
图3
b. 放电——>充电；为了使延时最小，放电过程要求所有的内部电容全部放电，因此ABCDE=10101；充电过程要求所有的内部电容充电，因此ABCDE=10100；
共 页 第 页
说明：1。标准答案务必要正确无误。
络为对偶网络。
3.CMOS反相器的输入从0上升到电源电压，分析在这个过程中各个MOS晶体管工作状态的变化、以及输出的变化，画出CMOS反相器的电压传输曲线。
答：如图所示
4.简述导线的集总RC模型和分布rc线。说明两个模型的关系。
答：集总RC模型将整个导线用一个电容和电阻来代替；分布rc线是将导线的每一段等效单位电容和单位电阻，分布rc线比较复杂，但是精度高。
2．分析图2所示电路，分析其工作原理，并给出该电路实现的逻辑功能。
（给出分析过程）
图2
解：该电路有两部分组成，左侧为以传输门，右侧为一个两器件组成的电路。当B为高电平时，传输门关闭，右侧的电路成为一个反相器， ；当B为低电平时，传输门打开，右侧的电路成为一个性能较差的同向器（右侧电路有效，但不能把强A传输过来）， 。