L2000使用说明书

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数字调音台用户说明书

数字调音台用户说明书

本说明书的符号说明:危险:对高度危险要警惕。

警告:对中度危险要警惕。

注意:提供除危险或告诫的帮助信息。

符号说明本设备仅适用于在非热带气候条件下的地区使用不要丢弃,可回收使用产品安全接地标识本系列产品是专业设备,机器的输出连接方式和输出电压区别于普通民用设备,在连接机器电源或与其它设备连接时,一定要按照机器上面的说明严格操作,否则会有严重危险!本系列产品是专业设备,机器内部有高压带电设备,没有通过充分的专业培训并获得资格认证的人员,请勿试图打开机器改装或维修,那样可能遭到点击,会有生命危险!本设备仅适用于在海拔2000米以下的地区使用本产品仅适用于室内使用安全使用事项在使用本装置之前,请仔细阅读说明书,并遵守有关操作和使用的警言,本说明书要妥善保管以备日后查用。

◆电源:本装置只能使用说明书所标注的电源种类。

◆电源线保护:要注意避免电源线被重物压挤,特别要注意电源线的插头、装置上的出线处及方便插座处,切忌拉、抽电源线。

◆水口湿气:不能放在离水源较近的地方使用,例如:浴缸、洗漱池、厨房水槽、洗手盆潮湿的地下室、游泳池附近等处,否则会有遭受电击的可能。

◆温度:本装置必须远离热源。

例如:散热器、加热电阻、各种炉子及其它发热装置(包括放大器)。

◆电击:必须注意防止物品或水流掉进内芯。

如果掉进金属或其它导电物品,会使装置内部产生电击短路的危险。

◆火灾:不能将花瓶或其它盛有液体的容器摆放在机器上面,否则液体有可能流进机器内部产生短路而引起火灾。

◆盖板拆卸:因机内存有高压,非电子专业技术人员,切勿拆卸机壳,如果内部电子零件被非正常接触,可能发生严重电击事故。

此事件本公司概不负责。

◆清洁:不要使用挥发性溶液。

如:酒精、涂料稀释剂、汽油、挥发油等擦拭外壳,使用清洁的干布就行。

◆异常气味:当发现异常气味或浓烟时,应立即切断电源并拔出插头,与供货商或最近的维修部门联系,寻求维修服务。

◆长期闲置时:A.为安全起见,请切断电源开关,拔掉电源插头,以防发生火灾。

L2000D射频导纳开关

L2000D射频导纳开关
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2பைடு நூலகம்.时间延长
L2000D系列包括0-30秒可调时间延时,有延时开/延时关模式(参见图一).这种模式典型的用处是消除控制继电器的“抖动”,或者控制循环循序.
开始时延时控制设为零(反时针到底位置).当用延时来消除继电器抖动时,仅要求旋转最小的角度.延时将导致在工艺物位控制点的上面或下面摆动,但平均物位仍等于控制点.超过量和不到量与延时比例有关.
图1
故障报警/(失电保护)模式选择
故障报警工作反映大多数主要的故障情况,包括电源的故障,这将引起控制继电器释放电压,因此,继电器释放电压的状态被称为“报警”状态.这就意味着如果电源消失,也会发生报警.L2000D系列设备具有高位或低位故障报警.这个动作由靠近控制面板中央位置(延时调节左边)的一个小的跳接器完成.参见图一.“H”位置显示高位报警,“L”位置显示底位报警.
服务热线:086-21-64856742
传真:086-21-64856745
邮编:200233
概述
L2000D型射频导纳物料开关是基于射频电容技术。将无线电频率施加在探棒上,对周围环境进行连续分析,由于所有介质的介电常数和导电性均不同于空气,当探棒接触到介质时所引起的微小电容量的变化被电路检测并转换成开关信号输出。其电子线路采用了抗粘附电路,可以在探测真实物位的同时,清楚粘附和悬挂在探头周围的假物位信号影响。根据射频导纳传感工作原理,可探测各种容器中物料的有(高位)或无(低位)。可以设置成高位或低位模式的故障报警。可检测任何工艺物料。
技术参数
1.继电器容量:DPDT。额定10A,115VAC,或5A,220VAC
2.延时:0~30〞秒连续可调
3.电源:220VAC/24VDC
4.感应度:0.5pF

lipo 2000说明书

lipo 2000说明书

Lipofectamine™2000转染说明书IntroductionLipofectamine™ 2000 CD is a proprietary animal origin-free formulation for the transfection of nucleic acids into eukaryotic cells. A Drug Master File (DMF) has been submitted to the FDA. Contact Technical Service or your local Sales Representative for permission to cross-reference the DMF. Using Lipofectamine™ 2000 CD for transfection provides the following advantages:Highest transfection efficiency in many cell types and formats. Refer to the Cell Lines database at for a list of cell types transfected. he animalorigin-free formulation ensures that mammalian cell culture and bioproduction processes are free of animal-derived materials. DNA-Lipofectamine™ 2000 CD complexes can be added directly to cells in culture medium. It is not necessary to remove complexes or change/add medium after transfection, but complexes may be removed after 4-6 hours.Important Guidelines for Transfection1.Culture cells in serum-free media that are free of animal-derived components.Test serum-free media for compatibility with Lipofec tamine™ 2000 CD since some serum-free formulations (e.g. CD 293, 293 SFM II, CD Hybridoma)may inhibit cationic lipid-mediated transfection.2.For consistent animal origin-free transfection, use OptiPro™ SFM (Cat. No.12309-019) to dilute DNA and Lipofecta mine™ 2000 CD before complexing.3.Transfect cells at high cell density: For adherent cells, 90-95% confluence atthe time of transfection is recommended for high efficiency, high expressionlevels, and to minimize cytotoxicity. For suspension cultures, transfect cells ata density of 0.8-1.1 x 106 cells/ml. Optimization may be necessary. Maintainthe same seeding conditions between experiments.4.Do not add antibiotics to media during transfection as this causes cell death.5.Do not add Pluronic® or charged media extracts (e.g. dextran sulfate) tomedia during transfection as these reagents can inhibit transfection Transfecting Adherent CellsUse the following procedure to transfect mammalian cells in a 24-well format. For other formats, see Scaling Up or Down Transfections. Use the recommended Lipofectamine™ 2000 CD amount as a starting point, then optimize conditions for your cell line and serum-free medium, as needed. All amounts and volumes are given on a per well basis.1.One day before transfection, plate 0.5-2 x 105 cells in 500 μl of growthmedium without antibiotics so that they will be 90-95% confluent at the timeof transfection.2.For each transfection sample, prepare complexes as followso a. Dilute DNA in 50 μl of OptiPro™ SFM. Mix gen tly.o b. Mix Lipofectamine™ 2000 CD gently before use, then dilute the appropriate amount in 50 μl of OptiPro™ SFM. Incubate for 5 minutesat room temperature. Note: Combine diluted Lipofectamine™ 2000CD with diluted DNA within 30 minutes.o c. After 5 minute incubation, combine the diluted DNA with diluted Lipofectamine™ 2000 CD (total volume = 100 μl). Mix gently andincubate for 20 minutes at room temperature (solution may appearcloudy). Note: Complexes are stable for 6 hours at room temperature.3.Add the 100 μl of complexes to a well containing cells and medium. Mixgently by rocking the plate back and forth.4.Incubate cells at 37°C in a CO2 incubator for 18-48 hours prior to testing fortransgene expression. It is not necessary to change the medium, but mediummay be replaced after 4-6 hours.5.For stable cell lines: Passage cells at a 1:10 (or higher dilution) into freshgrowth medium 24 hours after transfection. Add selective medium thefollowing day.TOP Scaling Up or Down TransfectionsTo transfect cells in different tissue culture formats, vary the amounts of Lipofectamine™ 2000 CD, DNA, cells, and medium used in proportion to the relative surface area, as shown in the table. With automated, high-throughput systems, a complexing volume of 50 μl is recommended for transfections in 96- well plates.Culture vessel Surf. areaper well(cm2)Relativesurf. areavs. 24-wellVol. ofplatingmediumDNA (μg) inmedia vol. (μl)Lipofectamine™2000 CD (μl) inmedia vol. (μl)96-well 0.3 0.2 100 μl0.2 μg in 25 μl0.5 μl in 25 μl 24-well 2 1 500 μl0.8 μg in 50 μl 2.0 μl in 50 μl12-well 4 2 1 ml 1.6 μg in 100μl4.0 μl in 100 μl35-mm 10 5 4.0 μg in 250μl10 μl in 250 μl6-well 10 5 2 ml 4.0 μg in 250μl10 μl in 250 μl60-mm 20 10 5 ml 8.0 μg in 0.5ml20 μl in 0.5 ml10-cm 60 30 15 ml 24 μg in 1.5 ml 60 μl in 1.5 mlNote: Surface areas are determined from actual measurements of tissue culture vessels, and may vary depending on the manufacturer.Transfecting Cells in SuspensionUse the following procedure to transfect suspension cells at any scale. Before beginning, make sure that cells are healthy and > 90% viable.1.On the day of transfection, prepare a single cell suspension from stock cells at< 3 x 106 cells/ml. Seed cells at a density of 0.8-1.1 x 106 cells/ml in growthmedia without antibiotics.2.For each transfection sample, prepare complexes as in Step 2, using thefollowing reagent amounts and volumes for every ml of cells transfected:o Dilute 0.5-1.5 μg DNA in 34 μl of OptiPro™ SFMo Dilute 1-10 μl of Lipofectamine™ 2000 CD in 34 μl of OptiPro™ SFM3.Add the complexes to the flask containing cells and media.4.Incubate the cells at 37°C in a CO2 incubator on an orbital shaker rotating at125 rpm for 24-96 hours prior to testing for transgene expression.Optimizing TransfectionTo obtain the highest transfection efficiency and low non-specific effects, optimize transfection conditions by varying cell density and Lipofectamine™ 2000 CD concentrations.Quality ControlLipofectamine™ 2000 CD is tested for the absence of microbial contamination using blood agar plates, Sabaraud dextrose agar plates, and fluid thioglycolate medium, and functionally by transfection of CHO-K1 cells with a reporter plasmid.。

理光MP2000L打印扫描指南

理光MP2000L打印扫描指南

DDST Unit Type A / Type B操作说明书打印机/扫描仪参考使用本设备前请仔细阅读本手册,并妥善保存以备今后参考。

为了安全正确使用,务必在使用设备之前阅读“复印参考”中的“安全信息”。

准备使用安装软件使用打印机功能使用TWAIN 扫描仪功能故障排除附录123456简介本手册包含关于本设备操作和使用的详细说明和注意事项。

为了您的安全和利益,请在使用本设备前仔细阅读本手册。

为了便于参考,请将本手册存放在随手可取之处。

重要事项本手册的内容若有更改,恕不另行通知。

对于因操作和使用本设备而导致的直接、间接、特殊、偶然或必然损失,本公司概不负责。

切勿复印或打印法律禁止复制的任何项目。

地方法律通常禁止复印或打印下列项目:纸币、印花税票、债券、股票、银行汇票、支票、护照、驾驶执照。

上述列表仅供参考,未涵盖全部项目。

对其完整性或准确性,我们概不负责。

如果对于复印或打印某些项目的合法性有疑问,请与您的法律顾问联系。

注意:进行本手册中未明确说明的控制、调整或操作可能会受到危险的辐射。

本手册中采用两种尺寸单位。

本机采用公制。

商标Microsoft®、Windows®和Windows NT®是Microsoft Corporation在美国和/或其它国家的注册商标。

本手册涉及的其它产品名称只用作识别目的,有可能分别是相应公司的商标。

我们对这些标志没有任何或全部权利。

Windows操作系统的正规名称如下:• Windows® 98的产品名是Microsoft® Windows® 98• Windows® Me的产品名是Microsoft® Windows® Millennium Edition (Windows Me)• Windows® 2000的产品名如下:Microsoft® Windows® 2000 Advanced ServerMicrosoft® Windows® 2000 ServerMicrosoft® Windows® 2000 Professional• Windows® XP的产品名如下:Microsoft® Windows® XP ProfessionalMicrosoft® Windows® XP Home Edition• Windows Server TM 2003的产品名称如下:Microsoft® Windows Server TM 2003 Standard EditionMicrosoft® Windows Server TM 2003 Enterprise EditionMicrosoft® Windows Server TM 2003 Web Edition注:本手册中的某些图例可能与您所购买的设备略有不同。

PLM2000型锤式破碎机使用维护说明书

PLM2000型锤式破碎机使用维护说明书

PLM2000型锤式破碎机合格证5CD(Ⅲ)山西煤矿机械制造有限责任公司一.PLM2000型锤式破碎机技术参数1、破碎能力………………………………………………2000t/h2、最大输入块度………………………………………700×800mm3、最大输出粒度(调整粒度)………300(250,200,150)mm4、电动机型号…………………………………………YBS-160型5、电动机功率…………………………………………………160kW6、电动机电压……………………………………………660/1140V7、电动机转速……………………………………………1475r/min8、破碎主轴转速…………………………………………370r/min9、破碎锤头数…………………………………………………8个10、破碎锤头冲击速度………………………………………20m/s11.进口尺寸(宽×高)…………………………………820×87512.出口尺寸(宽×高)…………………………………780×53013、大小皮带轮节园直径………………………………1250/315mm14、三角带规格……………………………窄V带SPC-5600(8根)15、外形尺寸(长×宽×高)………………3540×1930×1730mm16、机器总重………………………………………………15921Kg二.检查项目:1.整机空载试验:1).空运转试验:破碎机组装后先点车试运转5次,各运动部位不发生干涉卡阻和敲击现象,进行2小时的空运转试验平稳无振动,无金属敲击声。

整机噪声不超过90dB。

2).密封试验:各密封处,结合处不得有渗漏现象。

3).温升试验:各部轴承温升不超过65°。

4).喷水器中导水体做压力为7.85MPa的压验,保压5分钟,无渗漏现象。

2.驱动装置1).运动平稳,不得漏油。

ECAT-2000 系列 EtherCAT 从站 I O 模块使用手册说明书

ECAT-2000 系列 EtherCAT 从站 I O 模块使用手册说明书

ECAT-2000 系列EtherCAT 從站I/O 模組使用手冊繁體中文 1.9版本, 2019年 09月承諾鄭重承諾: 凡泓格科技股份有限公司產品從購買後,開始享有一年保固,除人為使用不當的因素除外。

責任聲明凡使用本系列產品除產品品質所造成的損害,泓格科技股份有限公司不承擔任何的法律責任。

泓格科技股份有限公司有義務提供本系列產品詳細使用資料,本使用手冊所提及的產品規格或相關資訊,泓格科技保留所有修訂之權利,本使用手冊所提及之產品規格或相關資訊有任何修改或變更時,恕不另行通知,本產品不承擔使用者非法利用資料對第三方所造成侵害構成的法律責任,未事先經由泓格科技書面允許,不得以任何形式複製、修改、轉載、傳送或出版使用手冊內容。

版權版權所有 © 2018 泓格科技股份有限公司,保留所有權利。

商標文件中所涉及所有公司的商標,商標名稱及產品名稱分別屬於該商標或名稱的擁有者所持有。

聯繫我們如有任何問題歡迎聯繫我們,我們將會為您提供完善的咨詢服務。

Email:支援ECAT-2024/2028 ECAT-2045/2045-32ECAT-2050/2051/2051-32 ECAT-2052/2052-NPN ECAT-2053/2055/2055-32ECAT-2057/2057-NPN/2057-8P8N/2057-32 ECAT-2060 ECAT-2061目錄1.簡介 (4)1.1配件清單 (5)1.2產品資訊 (7)1.3選型指南 (9)2.硬體資訊 (11)2.1配置圖 (11)2.2規格 (15)2.2.1系統規格 (15)2.2.2I/O規格 (16)ECAT-2024/2028 (16)ECAT-2045/2045-32 (16)ECAT-2051/2051-32 (16)ECAT-2052/2052-NPN (17)ECAT-2053 (17)ECAT-2055/2055-32 (18)ECAT-2057/2057-NPN/2057-8P8N (18)ECAT-2057-32 (19)ECAT-2050 (19)ECAT-2060/2061 (20)2.3腳位定義 (21)EtherCAT介面 (21)ECAT-2024 (21)ECAT-2028 (21)ECAT-2045/2057/2057-NPN/2057-8P8N (22)ECAT-2051 (22)ECAT-2052/2052-NPN (22)ECAT-2053 (23)ECAT-2055 (23)ECAT-2060 (23)ECAT-2050 (25)ECAT-2045-32/2057-32 (25)ECAT-2051-32 (26)ECAT-2055-32 (26)ECAT-2061 (27)2.4接線圖 (28)輸入接線 (28)輸出接線 (29)2.5信號線連接至模組連接器 (30)2.6機構圖 (32)ECAT-2024/2028/2045/2050/2051/2052/2053/2055/2057/2060 系列 (32)ECAT-2045-32/2051-32/2055-32/2057-32/2061 系列 (32)3.啟用ECAT-2000模組 (33)3.1連接主站與電源 (33)3.2配置運作模式 (35)進入至EtherCAT網路 (35)4.OBJECT 說明及參數設定 (37)4.1標準O BJECT(0X1000-0X1FFF) (37)[ALL]Index 1000 Device Type (37)[ALL]Index 1008 Device Name (37)[ALL]Index 1009 Hardware Version (39)[ALL]Index 100A Software Version (39)[ALL]Index 1018 Identity (39)[ECAT-2050]Index 160n(0<=n<=3) DO Outputs Process Data Mapping (41)[ECAT-2055-32]Index 1600 DO Outputs Process Data Mapping (41)[ECAT-2045-32/2057-32]Index 1600 DO Outputs Process Data Mapping (42)[ECAT-2024/2028]Index 160n AO Outputs Process Data Mapping (43)[ECAT-2050]Index 1A0n(0<=n<=C) DI Outputs Process Data Mapping (43)[ECAT-2055-32]Index 1A00 DI Outputs Process Data Mapping (43)[ECAT-2051-32]Index 1A00 DI Outputs Process Data Mapping (44)[ALL]Index 1C00 Sync Manager Type (45)[ECAT-2050]Index 1C12 SyncManager 2 Assignment (45)[ECAT-2055-32/2045-32/2057-32]Index 1C12 SyncManager 2 Assignment (45)[ECAT-2024/2028]Index 1C12 SyncManager 2 Assignment (45)[ECAT-2055-32/2051-32]Index 1C13 SyncManager 3 Assignment (46)[ECAT-2050]Index 1C13 SyncManager 3 Assignment (46)4.2特定O BJECTS(0X6000-0X7FFF) (47)[ECAT-2050]Index 60n0(0<=n<=C) Digital Inputs (47)[ECAT-2055-32]Index 6000 Digital Inputs (47)[ECAT-2051-32]Index 6000 Digital Inputs (48)[ECAT-2050]Index 70n0(0<=n<=C) Digital Outputs (49)[ECAT-2055-32]Index 7000 Digital Outputs (49)[ECAT-2045-32/2057-32]Index 7000 Digital Outputs (50)[ECAT-2024/2028]Index 70n0 AO Outputs Channel (51)4.3特定O BJECTS(0X8000-0X8FFF) (51)ECAT-2024/2028處理資料流程圖 (51)校正計算 (52)[ECAT-2024/2028]Index 80n0 AO Channel Settings (54)[ECAT-2024/2028]Index 80nE AO Channel Internal Data (55)[ECAT-2024/2028]Index 80nF AO Channel Internal Data (55)附錄: 手冊修訂記錄 (56)1.簡介ECAT-2000 系列是工業EtherCAT Slave 遠端I/O 模組且支援了EtherCAT 協定,還能夠建構Daisy Chain 網路拓撲(如,星形、線形或環形),可簡化線路配置與維護的複雜度,降低佈線成本與交換器的需求,使安裝更具靈活性。

立林可视分机使用说明

立林可视分机使用说明

户户对讲系统使用说明书1.系统组成本系统可分为联网对讲系统和不联网对讲系统,在配置时可根据工程实际要求灵活配置,具体如下:1.1联网对讲系统组成序号型号名称说明1 JB-2000IIIML 户户可视联网主机黑白可视联网型2 JB-2000IIIMGL 户户可视联网刷卡主机黑白可视联网型带门禁3 JB-2000IIIMF 户户可视副主机黑白可视4 JB-2000IIIMGF 户户可视刷卡副主机黑白可视带门禁5 JB-2000IIIL 户户联网主机非可视联网型6 JB-2000IIIGL 户户联网刷卡主机联网型带门禁7 JB-2000IIIF 户户副主机非可视8 JB-2000IIIGF 户户刷卡副主机非可视带门禁9 JB-2004V-4/7 户户安保可视分机黑白可视10 JB-2003V 户户可视分机黑白可视11 JB-2003VW 外挂式免提可视分机黑白可视12 JB-2003VQ 嵌入式免提可视分机黑白可视13 JB-2004VW-4/7 外挂式免提安保可视分机黑白可视14 JB-2004VQ-4/7 嵌入式免提安保可视分机黑白可视15 JB-2004VF 户户安保可视副分机黑白可视16 JB-2003VF 户户可视副分机黑白可视17 JB-2004-4/7 户户安保分机非可视18 JB-2003 户户分机非可视19 JB-2004F 户户安保副分机非可视20 JB-2003F 户户副分机非可视21 JB-2000IIIG 户户隔离器 12V供电22 JB-2000F-3/5/9/13 视频分配放大器 18V供电23 JB-2000D 电源12V(带电池)功率30W,带UPS24 JB-2701KD 开关电源12V(带电池)功率60W,带UPS25 JB-2000DF 可视分机电源18V 功率40W,不带UPS26 JB-2702KD 开关电源18V 功率80W,不带UPS27 JB-2000DS 双路电源功率40W、DC12、DC18V28 JB-2400V 小区可视管理机带开关电源29 JB-2400 小区管理机带开关电源,16位LCD显示30 JB-2400F 小区副管理机带开关电源,四位LED显示31 JB-2400IIMF 社区围墙可视主机黑白可视(户户型)32 JB-2400IIF 社区围墙主机非可视33 JB-2400IIMGF 社区围墙可视刷卡主机黑白可视带门禁34 JB-2400IIGF 社区围墙刷卡主机非可视带门禁35 JB-2001S-2/9 视频切换器 12V供电36 JB-2001SZ-2 视频切换器以主机控制信号方式注:门口主机在型号后面加“C”即为彩色门口主机;室内分机型号后面加“C”即为彩色可视分机。

UTD2000L中文示波器使用说明书090818

UTD2000L中文示波器使用说明书090818
本保证不适用于由于意外、仪器部件的正常磨损、在产品规定的范围之外使用或使用不当或者维护保养不当或不 足而造成的任何缺陷、故障或损坏。UNI-T根据本保证的规定无义务提供以下服务:
a) 修理由非UNI-T服务代表人员对产品进行安装、修理或维护所导致的损坏; b) 修理由于使用不当或与不兼容的设备连接造成的损坏; c) 修理由于使用非UNI-T提供的电源而造成的任何损坏或故障; d) 维修已改动或者与其它产品集成的产品(如果这种改动或集成会增加产品维修的时间或难度)。 本保证由UNI-T针对本产品而订立,用于替代任何其它的明示或暗示的保证。UNI-T及其经销商拒绝对用于特殊目 的的适销性或适用性做任何暗示的保证。对于违反本保证的情况,UNI-T负责修理或更换有缺陷产品是提供给客户的 唯一和全部补救措施。无论UNI-T及其经销商是否被预先告知可能发生任何间接、特殊、偶然或必然的损坏,UNI-T及 其经销商对这些损坏均概不负责。
除易于使用之外,UTD2000L系列数字存储示波器 还具有更快完成各种测量任务所需要的高性能和强大 功能。通过1GS/s(UTD2052CEL、UTD2102CEL)、500MS/s (UTD2052CL)的实时采样和25GS/s的等效采样,可在 UTD2000L数字存储示波器上观察更快的信号。强大的触 发和分析能力使其易于捕获和分析波形。清晰的液晶显 示和数学运算功能,便于用户更快更清晰地观察和分析 信号问题。
触发状态显示
显示水平触发位置 显示中心刻度线的时间
通道1标志
对应不同的功能键, 菜单会有所不同。
通道2标志
显示通道垂直刻度系数
显示主时基设置
图1-3 显示界面说明图
波形显示窗口 4
UTD2000L 使用手册
一般性检查 当您有了一台新的UTD2000L数字存储示波器时, 建

凯普林2000 3000W光纤激光器 使用说明书

凯普林2000 3000W光纤激光器 使用说明书

2000/3000W光纤激光器使用说明书天津凯普林光电科技有限公司目录引言 (1)1.安全与维护 (2)1.1产品安全等级 (2)1.2产品安全及信息标识 (2)1.3产品使用安全与维护 (2)2.产品介绍 (4)2.1产品特性 (4)2.2拆箱及检查 (4)2.3技术参数 (5)2.4配置清单 (6)2.5产品面板说明 (6)2.6控制接口定义说明 (7)2.6.1控制模式 (7)2.6.3控制时序图 (9)2.7供电要求及接线定义 (9)3.安装与开启激光器 (10)3.1整机尺寸 (10)3.2安装注意事项 (11)3.3冷却系统要求 (11)3.4开启与关闭激光器 (13)3.5上位机的使用 (14)4.常见故障及解决措施 (19)5.质保及返修 (20)5.1 一般保修 (20)5.2 保修的限定性 (20)5.3 服务和维修 (20)附表表 1 产品安全及信息标识 (2)表 2 产品技术参数 (5)表3产品面板及定义说明 (6)表 4 RS-232通讯接口定义 (7)表 5 RS-232接口配置参数 (8)表 6 DB25控制接口的接线定义 (8)表7 冷却系统要求 (12)表8 不同环境湿度的结露点 (12)表9 激光器的常见故障及解决措施 (19)附图图 1 控制时序图-连续、脉冲 (9)图 2 产品前视图尺寸 (10)图 3 产品后视图尺寸 (10)图 4 产品俯视图尺寸 (11)图 5 上位机安装 (14)图 6 上位机安装指引 (15)图7 上位机图标 (15)图8 上位机软件中激光器没有连接串口提示 (15)图9 上位机主页面 (16)图10 报警指示灯界面详细信息 (17)图11 售后诊断界面 (17)图12 密码输入提示框 (18)引言欢迎您使用天津凯普林光电科技有限公司(以下简称“凯普林光电”或“本公司”)的连续光纤激光器,为了便于您更好地使用激光器,我们特地编制了本使用说明书。

L2000射频导纳物位控制器说明书

L2000射频导纳物位控制器说明书

灵敏度细调
灵敏度粗调
输出状出延 时指示
高低位 报警选择
+ 24 VDC
NC C NC NC C NC
NC C NC NC C NC
L2000-220VAC接线图
L2000-24VDC接线图
输出延 时指示
2
控制器外壳尺寸
L2000外壳尺寸图
探头尺寸(单位mm):
杆式标准探头L843
杆式防腐探头L843TS 注:防腐探头必须用法兰安装,法兰尺寸由用户自选,默认标准为DN15PN1.6。 杆式飞灰探头L853
杆式高温探头L864
注: 杆式高温陶瓷探头必须用法兰安装,石棉板隔热密封,法兰尺寸由用户自选, 默认标准为DN15PN1.6。 3
缆式探头L843W
缆式防腐探头L843TW
选型指南:
L2000 - XXX / XXX - XXmm - XXm
探头总长: 用户自选,标准为450mm, 杆式探头最长2.5米 缆式探头最长20米
保护套长: 用户自选,标准为150mm 以至少伸出容器内壁积料50mm为宜
探头型号: L843 (杆式标准探头) L843TS (杆式防腐探头) L853 (杆式飞灰探头) L864 (杆式高温探头) L843W (缆式标准探头) L843TW (缆式防腐探头) L890 (平板探头)
代理商:上海雄风自控工程有限公司 地址:上海市北青公路3585号 电话:86-21-39808151 传真:86-21-39808150 邮编:201705 网址:
Distributor Shanghai Xiongfeng Automation Control Engineering Co., Ltd. Address: No 3585, Beiqing Road, Shanghai Tel: 86-21-39808151 Fax: 86-21-39808150 Post Code: 201705 Web:

PSL 600_PSL620,PSL630_系列使用说明书V5.1

PSL 600_PSL620,PSL630_系列使用说明书V5.1

3
ห้องสมุดไป่ตู้
版本说明
目次
安全标准 ................................................................................................................................ 1
1. 装置介绍 .......................................................................................................................... 3
数字式线路保护 使用说明书
编写 审核 批准
版本:V5. 1
国电南京自动化股份有限公司 2006 年 3 月
2
版本声明
本技术说明书适用于以下版本的程序:
MMI 人机对话软件版本:
5.04
MMI 人机对话软件版本:
3.65
10
9
8
7
6
5
4
3
2
V5.1
1
V5.0
序号 说 明 书 版 本
产品说明书版本修改记录表
2.2.2.1 显示定值.......................................................................................................................................................................................... 15 2.2.2.2 打印定值.......................................................................................................................................................................................... 17 2.2.2.4 复制定值.......................................................................................................................................................................................... 18 2.2.2.5 整定定值.......................................................................................................................................................................................... 20 2.2.2.6 删除定值.......................................................................................................................................................................................... 22 2.2.2.7 切换运行定值区.............................................................................................................................................................................. 24

lip2000转染说明书

lip2000转染说明书

4. 哺乳动物细胞siRNA转染4.1 转染方法:将制备好的siRNA、siRNA表达载体或表达框架转导至真核细胞中的方法主要有以下几种:磷酸钙共沉淀;电穿孔法;DEAE-葡聚糖和polybrene;机械法;阳离子脂质体试剂。

目前用的最多的是阳离子脂质体法。

4.1.1 磷酸钙共沉淀将氯化钙,RNA(或DNA)和磷酸缓冲液混合,沉淀形成包含DNA且极小的不溶的磷酸钙颗粒。

磷酸钙-DNA复合物粘附到细胞膜并通过胞饮进入目的细胞的细胞质。

沉淀物的大小和质量对于磷酸钙转染的成功至关重要。

在实验中使用的每种试剂都必须小心校准,保证质量,因为甚至偏离最优条件十分之一个pH都会导致磷酸钙转染的失败。

4.1.2 电穿孔法电穿孔通过将细胞暴露在短暂的高场强电脉冲中转导分子。

将细胞悬浮液置于电场中会诱导沿细胞膜的电压差异,据认为这种电压差异会导致细胞膜暂时穿孔。

电脉冲和场强的优化对于成功的转染非常重要,因为过高的场强和过长的电脉冲时间会不可逆地伤害细胞膜而裂解细胞。

一般,成功的电穿孔过程都伴随高水平(50%或更高)的毒性。

4.1.3 DEAE-葡聚糖和polybrene带正电的DEAE-葡聚糖或polybrene多聚体复合物和带负电的DNA分子使得DNA 可以结合在细胞表面。

通过使用DMSO或甘油获得的渗透休克将DNA复合体导入。

两种试剂都已成功用于转染。

DEAE-葡聚糖仅限于瞬时转染。

4.1.4 机械法转染技术也包括使用机械的方法,比如显微注射和基因枪(biolistic particle)。

显微注射使用一根细针头将DNA,RNA或蛋白直接转入细胞质或细胞核。

基因枪使用高压microprojectile将大分子导入细胞。

4.1.5 阳离子脂质体试剂在优化条件下将阳离子脂质体试剂加入水中时,其可以形成微小的(平均大小约100-400nm)单层脂质体。

这些脂质体带正电,可以靠静电作用结合到DNA的磷酸骨架上以及带负电的细胞膜表面。

巴斯夫 Paliocrom Gold L 2000 安全技术说明书

巴斯夫 Paliocrom  Gold L 2000 安全技术说明书

安全技术说明书页: 1/8 巴斯夫安全技术说明书日期 / 修订: 14.09.2009版本: 5.0产品: Paliocrom* Gold L 2000(30047191/SDS_GEN_CN/ZH)印刷日期 23.09.20091. 物质/制剂及公司识别Paliocrom* Gold L 2000使用: 颜料用于涂漆,喷漆,和清漆工业。

公司:巴斯夫应用化工有限公司中国 上海浦东江心沙路300号邮政编码 200137电话: +86 21 3865-5265传真号: +86 21 3865-5268E-mail地址: ******************紧急情况资料:巴斯夫紧急热线中心(中国)电话: +86 21 5861-1199Company:BASF Auxiliary Chemicals Co., Ltd 300 Jiang Xin Sha RoadPu Dong Shanghai 200137, CHINATelephone: +86 21 3865-5265Telefax number: +86 21 3865-5268E-mail address: ******************Emergency information:Emergency Call Center (China):Telephone: +86 21 5861-11992. 危险性识别纯物质和混合物的分类:可燃固体: 分类3标签要素和警示性说明:巴斯夫安全技术说明书日期 / 修订: 14.09.2009版本: 5.0产品: Paliocrom* Gold L 2000(30047191/SDS_GEN_CN/ZH)印刷日期 23.09.2009警示词:警告危险性说明:可燃固体。

警示性说明(预防):地面接收容器或设备。

远离热源/火花/明火/热表面。

-禁止吸烟保持容器密封。

静电放电时采取预防措施。

使用防爆电气/通风/照明设备。

SL-2000-P 风管型烟感探测器使用说明书

SL-2000-P 风管型烟感探测器使用说明书

1应用和特点⚫ 源自Apollo ,型号SL-2000-P 。

安装在通风管道中,探测进入道内烟雾状况,结合防护区设计,有效探测进入风道空气中的烟雾量⚫ 感烟探测器采用光电技术对采样空气中的烟粒子进行探测,当空气中烟雾达到一定值时,探测器就会发出报警信号,同时可联动报警和关掉风扇/风机等系统,以阻止有毒气体和可燃气体进入防护区域⚫ 报警触点用于与控制器或其他设备联接(报警、启动),HVAC 控制及其它辅助功能。

探测器也为各种远程附件提供了输出端子,如喇叭、闪光灯、远程指示灯和测试/重置开关或按钮 ⚫ 探测器的上盖有漏装警示功能 ⚫ 采样管有多种长度可选,建议长度至少等于风道宽度的80%,或整体贯通风道,以达到较好采样功能技术指标传感器:光电式烟感探测器风管风速:0.5~20m/s (100~4000 ft/min) 应用环境:0~60°C, 0~90%RH(非冷凝/结冰)电源:24VDC/AC ,115/240VAC ,详细电源参数及供电电流负载参数见说明书 接线:4线灵敏度测试:参照产品标签 报警触点:2xSPDT ,10A@115VAC ,5A@230VAC ,5A@30VDC(阻性);1xSPST ,0.5A@230VAC ,2A@30VDC(阻性)故障触点: 1xSPDT ,10A@115VAC ,5A@230VAC ,5A@30VDC(阻性)电气连接:螺丝端子外壳:灰色PC 底盒及透明PC 上盖(UL94-V0) 外壳防护等级:NEMA1 重量:1.13kg(不含采样管) 认证:UL ,FM ,MEA本文为安装简要指南,由原厂英文说明书简写而来,仅适用于一般楼宇自控等基本监控应用,其他应用或具体安装说明请参考原厂原版英文说明书。

产品概述产品应用SL-2000-P风管型烟感探测器可应用于商业、工业和住宅等建筑内HVAC暖通空调设备供、回风管道空气中存在的烟雾或燃烧产物的早期烟雾检测。

NOBLES Speedshine 1200 1600 2000 120V 操作员和零件手册说明书

NOBLES Speedshine 1200 1600 2000 120V 操作员和零件手册说明书

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DESCRIPTION SCREW, 8–32X1 SPRING SLEEVE, LOCKING SCREW, 1/4–20X5/8 GRIP, CORD DCORD, 14/3X75’ YELLOW PLATE, BACKING SLEEVE, .44ODX.25BX.21L BUSHING, .50ODX.25BX.21L PIN, GROOVE 1/4X3/4 HANDLE, LATCH GRIP, LATCH HOOK, CORD WASHER, 1/4 EXT SCREW, 1/4–20X3/4 CHANNEL, LATCH HANDLE SPRING, HANDLE LATCH SCREW, 1/4–20X1 NUT, 1/4–20 KEP CORD, 14/3X57” BLACK BUSHING, STRAIN–RELIEF SPRING SCREW, 1/4–20X3/4 BRACKET, SPRING DBELT CLIP, STRAIN–RELIEF (OPTIONAL)

射频导纳料位说明书

射频导纳料位说明书

L2000-C射频导纳物位控制器说明书一、概述山东中煤工矿物资集团有限公司(原济宁中煤机械制造厂)生产的L2000-C系列射频导纳物位开关是一种新颖的物位测量仪表,它采用先进(抗粘附)射频导纳技术,克服了电容式物位计不能消除导电挂料影响的缺陷,仪表具有运行可靠,能抗挂料层的影响。

L2000-C标准探头中心信号杆采用直径10mm不锈钢,保护套长150mm,总长450mm,坚固实用。

有L890C平板探头,解决大固体物料冲击棒的问题。

有L863WC钢缆探头,使L2000C适用于几乎所有工业现场对液体;粉料;块料;高温场合的物位检测。

仪表还具有安装方便,免维护,价格低等特点。

仪表广泛用于石油、化工、冶金、医药、电力、食品、造纸等工业领域。

二、参数特点:开关控制,射频导纳原理,NULL-KOTE抗粘附电子线路。

继电器容量:DPDT,额定10A,115V/AC延时/模式:0~30秒可调/开关型电源:230Vac,3瓦或24V/DC<3瓦灵敏度:小于0.5Pf探头耐温:40℃~+80℃(可定制高温探头800C°)电路部份耐温;-40℃~+80℃失电保护(Fail—Safe)模式:采用高低模式,现场可调外壳:IP65,重型铸铝外壳三、选型指南1)在测非导电介质时,可以为水平或垂直安装,如需要垂直安装时,要求探头长至少大于控制位置6英寸左右。

2)在测导电液体时、泥浆或界面检测时,可以水平垂直安装,但探头穿过容器壁时,保护电极应比容器壁上的积料厚度长出2英寸。

如用户需要,我们可以提供液介质为Teflon或Kyanr材料的防腐探头(采用涂层法兰连接)。

校准1)灵敏度的校正当进行调节时,请注意这些总的规则:*将2个灵敏度调节电位器逆时针旋转增加灵敏度。

*当两个灵敏度控制调好后,红色灯亮,表示探头上“有”物料存在,绿色灯亮,表示(无)物料存在。

*安装方法有水平或垂直两种。

为保证设备稳定工作应有5分钟预热。

康宝莱l2000系列射频导纳式物位控制器用户手册说明书

康宝莱l2000系列射频导纳式物位控制器用户手册说明书

Combine L2000系列 射频导纳式物位控制器使用说明书I S O9001:2000认证合格单位Combine L2000系列射频导纳式物位控制器一、概述Combine L2000系列射频导纳式物位控制器是用于检测料仓、料槽或其它容器中带粘附性的液体、固体颗粒、粉尘、其它混合浆料等料位的位式控制仪表。

亦可用于两种不同液体之间界面测量,如油水界面测量。

Combine L2000系列射频导纳式物位控制器具有校准简单快捷、产品性能稳定、各种型号通用性强、安装方便、外形美观等优点。

可广泛用于石油、化工、冶金、电力、医药、食品、造纸、建材等工业领域。

且控制器可与PLC可编程控制器或DCS集散控制系统配套使用,实现工艺流程的自动检测和自动控制。

二、工作原理1. Combine L2000系列射频导纳物位控制器是利用高频技术,由电子线路产生一个小功率射频信号于探头上,探头作为敏感元件,将来自物位介电常数引起的信号变化反馈给电子线路;由于这些变化包括电容量和电导量的变化,因而电子线路中处理的是电抗(容抗和阻抗的综合变化的信号)信号;2.电抗的变化又引起了极棒上高频信号的相位发生变化。

因此极棒上的高频信号与电子线路中的基准信号的相位差也随之发生变化,该变化经处理后,驱动输出电路发出报警信号,从而达到检测料仓有无物料。

3. Combine L2000系列射频导纳物位控制器采用三端Cote – Shield 技术,排除探测极棒上粘附物料对控制作用的影响。

电子线路中产生的高频信号,一路直接送往探测极棒上,另一路经过一个RF电压跟随器送往防粘附保护套上。

其大小相位都是与加在探测极棒上的信号相同。

当有物料粘附在探头上时,由于保护套与仓壁之间构成一个电容,所以加在保护套上的高频信号就会使该电容趋向饱和,以致探头上的高频信号就无法通过粘附层流入容器壁,当容器内大量物料接触探头时,探头上的电流绕过饱和区流向容器壁,从而产生有物料存在的信号。

Keithley 2000 Series Multimeter说明书

Keithley 2000 Series Multimeter说明书

SPECIFICATIONAccuracy:0.03% rdg.Resolution:10 / 1 µV process Linearization Points:10 pointsTemperature Stability:50 ppm/°C process Display:4-digit, 7-segment LED,57.2 mm (2.25") with red, green and amber programmable colors.Input Types:Analog Voltage and Current Voltage:0 to 100 mV, 0 to 1 V (+100 mV),0 to 10 VdcInput Impedance: 10 MΩ for 100 mV 1 MΩ for 1 or 10 Vdc Current:0 to 20 mA (5 Ω load)Options: Communication RS-232 / RS-485 orExcitation 5Vdc @40mA, 10Vdc @60mAPower Supply:100-240 Vac ±10%, 50/60 Hz, 22.5 W Operating Temperature:0 to 40°C Storage Temperature:-20 to 60°C Relative Humidity:0 to 85%Protection:NEMA-4x (IP65)Dimensions:289 L x 137 W x 73 D mm(11.75” L x 5.375” W x 2.875” D)Panel Cutout:279.4 L x 116.8 W mm (11.00” L x 4.60” W)Weight:1,360 g (3 lbs)Approvals:per EN61010-1MQS3718/0818iLD24 Big Display Universal Strain & Process Monitor***********************The information contained in this document is believed to be correct, but OMEGA accepts no liability for any errors it contains, and reserves the right to alter specifications without notice.Servicing North America:U.S.A. Omega Engineering, Inc.Headquarters: Toll-Free: 1-800-826-6342 (USA & Canada only)Customer Service: 1-800-622-2378 (USA & Canada only) Engineering Service: 1-800-872-9436 (USA & Canada only) Tel: (203) 359-1660 Fax: (203) 359-7700 e-mail:**************For Other Locations Visit /worldwideWARRANTY/DISCLAIMEROMEGA ENGINEERING, INC. warrants this unit to be free of defects in materials and workmanship for a period of 61 months from date of purchase. OMEGA’s WARRANTY adds an additional one (1) month grace period to the normal five (5) year product warranty to cover handling and shipping time. T his ensures that OMEGA’s customers receive maximum coverage on each product.If the unit malfunctions, it must be returned to the factory for evalua-tion. OMEGA’s Customer Service Department will issue an Authorized Return (AR) number immediately upon phone or written request. Upon examination by OMEGA, if the unit is found to be defective, it will be repaired or replaced at no charge. OMEGA’s WARRANTY does not apply to defects resulting from any action of the purchaser, includ-ing but not limited to mishandling, improper interfacing, operation outside of design limits, improper repair, or unauthorized modifica-tion. This WARRANTY is VOID if the unit shows evidence of having been tampered with or shows evidence of having been damaged as a result of excessive corrosion; or current, heat, moisture or vibration; improper specification; misapplication; misuse or other operating conditions outside of OMEGA’s control. Components in which wear is not warranted, include but are not limited to contact points, fuses, and triacs.OMEGA is pleased to offer suggestions on the use of its vari-ous products. However, OMEGA neither assumes responsibil-ity for any omissions or errors nor assumes liability for any damages that result from the use if its products in accordance with information provided by OMEGA, either verbal or writ-ten. OMEGA warrants only that the parts manufactured by the company will be as specified and free of defects. OMEGA MAKES NO OTHER WARRANTIES OR REPRESENTATIONS OF ANY KIND WHATSOEVER, EXPRESSED OR IMPLIED, EXCEPT THAT OF TITLE, AND ALL IMPLIED WARRANTIES INCLUDING ANY W ARRANTY OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE HEREBY DISCLAIMED. LIMITATION OF LIABILITY: The remedies of purchaser set forth herein are exclusive, and the total liability of OMEGA with respect to this order, whether based on contract, warran-ty, negligence, indemnification, strict liability or otherwise, shall not exceed the purchase price of the component upon which liability is based. In no event shall OMEGA be liable for consequential, incidental or special damages.CONDITIONS: Equipment sold by OMEGA is not intended to be used, nor shall it be used: (1) as a “Basic Component” under 10 CFR 21 (NRC), used in or with any nuclear installation or activity; or (2) in medical appli-cations or used on humans. Should any Product(s) be used in or with any nuclear installation or activity, medical application, used on humans, or misused in any way, OMEGA assumes no responsibility as set forth in our basic WARRANT Y/DISCLAIMER language, and, additionally, purchaser will indemnify OMEGA and hold OMEGA harmless from any liability or damage whatsoever arising out of the use of the Product(s) in such a manner.RETURN REQUESTS/INQUIRIESDirect all warranty and repair requests/inquiries to the OMEGA Customer Service Department. BEFORE RE URNING ANY PRODUC (S) O OMEGA, PURCHASER MUS OB AIN AN AUTHORIZED RETURN (AR) NUMBER FROM OMEGA’S CUSTOMER SERVICE DEPART MENT (IN ORDER T O AVOID PROCESSING DELAYS). T he assigned AR number should then be marked on the outside of the return package and on any correspondence.FOR WARRANTY RETURNS, please have the followinginformation available BEFORE contacting OMEGA:1. Purchase Order number under which the product was PURCHASED,2.3. Model and serial number of the product under warranty, and Repair instructions and/or specific problems relative to the product.FOR NON-WARRANTY REPAIRS, consult OMEGA for current repair charges. Have the following information available BEFORE contacting OMEGA:1. P urchase Order number to cover the COST of the repair or calibration,2.3.Model and serial number of the product, and R epair instructions and/or specific problems relative to the product.OMEGA’s policy is to make running changes, not model changes, whenever an improvement is possible. This affords our customers the latest in technology and engineering.OMEGA is a trademark of OMEGA ENGINEERING, INC.© Copyright 2018 OMEGA ENGINEERING, INC. All rights reserved. T his document may not be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form, in whole or in part, without the prior written consent of OMEGA ENGINEERING, INC.Mounting Big Display Through Panel:ing the panel cutout diagram shown above, cut an opening in the panel.2.Remove six screws at the back of Big Display to remove back cover.3.Insert the unit into the opening from the front of the panel,so the gasket seals between the bezel and the front of the panel.4.Align back cover to Big Display and reinstall screws.Mounting Big Display on Bail:1.Mark the location of mounting screws on the flat surface.2.Be sure to leave enough room around the bail to allow for removal and rotation of the display.3.The display can be rotated for the best viewing angle.Disassembly Instruction:1.Remove all wiring connections from the rear of theinstrument, by unscrewing the power and input connectors.2.Remove six screws at the back of the display and back cover.3.Remove the Big Display from the panel.4.To remove the Big Display from the bail, unscrew the two knobs at each end of the mounting brackets.This Quick Start Reference provides information on setting up your instrument for basic operation. The latest complete Communication and Operational Manual as well as free Software and ActiveX Controls are available at or on the CD-ROM enclosed with your shipment .SAFETY CONSIDERATIONaccordance with EN61010-1:2001. Remember that the unit has no power-on switch. Building installation should include a switch or circuit-breaker that must be compliant to IEC 947-1 and 947-3.SAFETY:•Do not exceed voltage rating on the label located on the back of the instrument housing.•Always disconnect power before changing signal and power connections.•Do not use this instrument on a work bench without its case for safety reasons.•Do not operate this instrument in flammable or explosive atmospheres.EMC:•Whenever EMC is an issue, always use shielded cables.•Never run signal and power wires in the same conduit.•Use signal wire connections with twisted-pair cables.•Install Ferrite Bead(s) on signal wire close to the instrument if EMC problems persist.MOUNTING。

CL-2000i全自动化学发光免疫分析仪标准操作规程-SOP

CL-2000i全自动化学发光免疫分析仪标准操作规程-SOP

CL-2000i全自动化学发光免疫分析仪标准操作规程一、CL—2000i全自动化学发光免疫分析仪标准操作规程(开关机和使用程序)1 开机前检查注意:每天开始测试前,请将试剂盘盖上的防冷凝水塞子取下;否则,可能导致机械复位失败,试剂针被撞弯。

a. 检查电源,确认电源有电并且能够提供正确的电压。

b。

检查样本调度模块、操作部和输出部间的通讯线和电源线,确认已连接牢固且没有松动现象。

c。

检查打印机内是否有足够的打印纸。

若不够,请添加打印纸.d。

检查废液桶,查看桶内废液是否排空。

若未排空,请排空废液桶。

e。

检查废液连接,确保废液管无弯折,下水道排液口不高于仪器废液出口.f. 检查样本针、试剂针,确认无污物,无弯折.g 检查样本放入区、重测缓存区和样本回收区,确保无样本架和脏物;检查传送通道、常规通道和返回通道,确保通道上无障碍物。

h 检查试剂盘盘盖是否盖好;i. 检查分离液是否充足,如不够,请添加。

J 检查反应杯余量,如不足,请装载反应杯。

K 检查底物是否充足。

如不足,请更换底物。

L 检查固体废料箱和下料区反应杯托盘,清空废料箱的反应杯和下料区托盘。

2 开机按下列顺序依次打开电源开关:外置气泵(若选配)、仪器主电源开关、样本调度模块电源开关、分析模块电源开关、打印机、操作部显示器和主机电源、计算机显示器和主机电源.登录Windows操作系统后,系统会自动启动CL—2000i操作软件。

3 确认仪器状态确认系统状态(打印机状态、系统状态、和LIS连接状态)、分析模块状态、故障/报警状态、试剂/校准状态、维护报警状态,以及子系统状态。

4 装载试剂及耗材⏹装载免疫试剂仪器空闲状态下,打开试剂盘盖,在试剂盘上的试剂位放置相应的试剂.放完试剂后,盖好试剂盘盖。

注意:请勿将液体洒落在试剂盘控制按钮上,否则可能导致按钮损坏.⏹装载分离液同时可以装载两瓶分离液,当一瓶用完时,系统将自动切换到另外一瓶.打开分析部前门,拉开分离液抽屉;确认需更换的分离液瓶,一手轻轻按下瓶盖接头上的金属按钮,一手轻轻将90°直角接头脱开拿起,把接头挂在门后的卡扣上;将用完的分离瓶取下;将新分离液纸箱顶部开口剥离丢弃,将瓶口拉出,将瓶盖拧开丢弃;将空瓶上的瓶盖组件拧开后,整体装入新瓶中,装入过程中,一手将瓶口向上拎起,一手旋紧瓶盖。

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Instrumentation designedwith the user in mindINSTRUCTION MANUALPRINCO MODEL L2000POINT LEVEL CONTROLLERwith NULL-KOTE™PRINCO INSTRUMENTS INC.1020 INDUSTRIAL BLVD.SOUTHAMPTON, PA 18966TEL: 800-221-9237, 215-355-1500FAX: 215-355-7766WEB SITE: E-MAIL: info@Rev 1, 12 Nov 01Table of ContentsSection 1. DescriptionA. General Description 1-1B. Functional Description 1-1C. L840 Series Probe Description 1-3 Section 2. SpecificationsA. 1. L2000 Level Controller 2-1A. 2. L840 Series Probes 2-1 Section 3. InstallationA. Inspection 3-1B. Grounding 3-1C. Probe Mounting 3-1D. Electrical Connections 3-3E. Installation in Hazardous Areas 3-5 Section 4. Adjustments and OperationA. Initial Checkout 4-1B. Calibration 4-1C. Alarm Action 4-5D. Delay Operations and Adjustments 4-5E. Troubleshooting Guide 4-5 Section 5. Equipment Service 5-1 IllustrationsFigure 1-1. Typical Explosion-Proof Installation 1-3 Figure 1-2. Standard L843 Probe, Dimensional Drawing 1-4 Figure 1-3. Standard L843 Probe, Descriptive Drawing 1-5 Figure 3-1. Standard Installation 3-2 Figure 3-2. Extended Guard Installation 3-3 Figure 3-3. Electrical Connections, 115 Vac and 230 Vac Units 3-4 Figure 3-4. Electrical Connections, 24 Vdc Unit 3-4 Figure 3-5. Ground Continuity Test 3-5 Figure 4-1. L2000 Adjustment and Indicator Locations 4-1 Figure 4-2. Conductive Process Calibration Procedure 4-3 Figure 4-3. Non-Conductive Process Calibration Procedure 4-4A. General DescriptionThe Princo Model L2000 is a low-cost, adjustable, RF Impedance point level controller. It may be used, in conjunction with any Princo L840 Series Sensor Probe, to detect the presence or absence of process material within a storage vessel.The basic instrument consists of an electronic chassis within a heavy-duty, cast aluminum, weatherproof, explosion-proof housing. The housing has a removable lid which exposes the electronic chassis. The chassis is composed of two circular printed circuit boards which are held together by a removable system of mechanical spacers and electrical interconnects. The chassis is easily removed from the instrument housing, allowing convenient replacement, should troubleshooting be required.The housing, with internal electronic chassis, attaches directly to any one of the Princo L840 Series point level probes. An electrical and mechanical probe connection is made by simply screwing the housing directly onto the probe upper hub NPT fitting. The probe lower hub NPT fitting threads directly into the storage vessel, thus allowing probe entry into the vessel, as well as, mechanically and electrically fixturing the electronic housing and probe to the vessel construction.The electronic chassis performs the RF impedance measurement, and compares the measurement with a set-point established by the coarse and fine sensitivity adjustments on the top of the chassis. The set-point adjustment is established by making adjustments with actual presence and absence of process material in the storage vessel. When the vessel's condition changes relative to the set-point, two control relays are switched and the Probe Status LED changes state.B. F unctional DescriptionThe basic function of the device is to detect the presence or absence of process material within a storage tank or holding vessel, and to announce the process material detection in the form of an “alarmed” set of relay contacts.The Model L2000, used in conjunction with an L840 Series Sensor Probe, can detect the presence or absence of a wide variety of process materials, from electrical insulators with low dielectric constants, to highly conductive electrical conductors. The mechanical nature of these materials can range from dry powders or granulars, to liquid materials with virtually any consistency - even thick, viscous materials that severely coat the sensor probe.1. Basic Features• RF Impedance Sensing Measurement Technology with Null-Kote TMThe L2000 uses RF impedance technology proven in tens of thousands of applications. The principle of operation is very simple: an L840 Series Sensor Probe is mounted in the storage vessel. As the process material changes from not contacting the probe to contacting the probe, a corresponding change in electrical impedance occurs between the probe and the metal storage vessel wall. (For non-metallic storage vessels, a "dual element" probe is used. In this case, the impedance change occurs between the "active" and "ground"elements of the probe.)The highly sensitive impedance measurement circuits inside the L2000 detect and measure this impedance change by means of a low level, radio frequency current that flows from thesensor, through the process material and back to the electronics via the metal storage vessel wall (or via the probe ground element). This change in radio frequency current is converted to a proportional DC signal. The electronics compares this DC signal to a set-point determined by the coarse and fine sensitivity adjustments, and triggers a change in the state of the Probe Status LED and the Output Control Relay when the signal level traverses the set-point level.• Coating CancellationA coating of process material on a probe can effectively simulate a presence condition, evenwhen the process level is well below the probe. Princo point level probes incorporate a "guard" element which negates this problem. Driven by the electronic circuitry, the guard produces a correction signal, allowing the electronics to respond only to level changes above and below the "active" element of the probe. The unit must be calibrated with the probe coated for the guard to function correctly.• Heavy Duty Control RelayTwo sets of Form C (DPDT) contacts are provided via a terminal block located on the top printed circuit board of the L2000. The contacts are rated at 10 amps at 115 Vac.• Probe Status IndicatorThe status of the process material at the sensor probe is indicated by the color of the PROBE STATUS LED. The two color (Red/Green) LED is located on the top printed circuit board of the L2000. Green indicates material contacting the probe; Red indicates no contact.• Coarse and Fine Sensitivity AdjustmentsTwo linearly scaled, single turn potentiometers (SENS, C & F) are provided on the top printed circuit board of the L2000. These adjustments are used to establish a repeatable switch point that is calibrated to the given application.• Selectable Alarm ActionA jumper select switch is provided for programming the alarm action as either high acting, orlow acting. The Alarm Select (FAIL SAFE) is located on the top printed circuit board of the L2000.A high acting alarm condition occurs when the process material contacts the probe(presence). A low acting alarm condition occurs when the process material is removed from the probe (absence). In both cases the alarm condition is defined as a de-energized control relay.• Fail Safe Alarm ActionThe L2000 is in normal, non-alarmed state when its control relay is energized. If the unit were to lose power, the control relay would de-energize. Thus a power failure would produce an alarm condition, alerting the operator that a problem exists.• Time Delay AdjustmentThe L2000 senses the process material level change instantaneously. However, a delay can be inserted between the instant the instrument senses the level change, and the time the control relay correspondingly changes state. A single turn Time Delay (DLY) pot isprovided on the top printed circuit board of the unit. This potentiometer allows an adjustment of 0 to 30 seconds of time delay.The time delay feature is useful when process material wave action causes the control relay to continually change state. It can also be used to suit a particular control timing application.Note that the PROBE STATUS LED changes immediately, even when a delay is applied.Figure 1-1Typical Explosion-Proof Installation with L2000 DimensionsC. L840 Series Probe DescriptionL840 Series Sensor Probes are the probes commonly used with the L2000. (Refer to Figure 1-2 for a dimensional drawing of the standard L843 Probe.) These probes have three stainless steel electrical contacts - active, guard and ground - which are separated from each other by Teflon insulators. See Figure 1-3 for location of these contacts on the L843 probes. Electrical contact between the probe elements and the electronic unit is made by simply threading the probe into the electronic housing. The "active" element contacts the L2000 circuit board by means of the spring-loaded pin projecting from the top of the probe. The guard contact is made by means of a ½inch diameter sp r ing which projects from the bottom of the L2000 bottom circuit board. This spring fits concentrically around the spring-loaded pin and touches the guard contact on the probe. The hub of the probe serves as the ground element. It contacts both the electronic housing and the metal storage vessel through its threaded connections with them.The guard element cancels the effect of any process coating between the ground and active elements, allowing the electronics to respond only to changes in the process material level.All of the L840 Series Probes have these same three elements, varying only in physical dimensions and configuration as required for various applications.The L844 Probe (not shown) has a built-in ground reference and is referred to as a "dual element" probe. It is suitable for low viscosity liquids in various low dielectric and non-metallictank applications. The L844 has a ¾inch diameter stainless steel tube concentrically surrounding the standard active/guard rod. The tube itself serves as the ground element. Probes are available in custom guard lengths and overall lengths, above and below the standard lengths. Teflon and Kynar sheathed probes are available for applications where stainless steel is incompatible with the process material. Consult the factory for specific application questions.Figure 1-2Standard L843 Probe, Dimensional DrawingFigure 1-3Standard L843 Probe, Descriptive DrawingA. Specifications1. L2000 LEVEL CONTROLLER• TYPEPoint type (on/off), solid state electronic, high frequency (RF), impedance sensing, level controller.• POWER REQUIREMENTS95 to 135 Vac, 50 to 60Hz, 1.3 watts; or 205 to 250 Vac, 1.3 watts; or 17/34 Vdc, <1 Watt.• AMBIENT TEMPERATURE RANGE-40 to 150 °F (-40 to 66 °C)• SENSITIVITYSenses capacitance as low as 0.5pF and materials with dielectric constants as low as 1.5.Sensitivity may be decreased to approximately 500pF.• TEMPERATURE STABILITYTemperature coefficient of 0.025pf/°F (4.75 pf over ambient temperature range).• ALARM TYPESelectable as either High Acting or Low Acting.High Acting: Alarm occurs upon presence of process material.Low Acting: Alarm occurs upon absence of process material.• ALARM ACTIONFail Safe Alarm: Control relay de-energizes (drops out) upon alarm.• CONTROL RELAY CONTACTSTwo sets of form C contacts, rated at 10 amperes, 115 Vac or 26 Vdc, resistive load. • DELAY TIME AND MODEStandard delay time is adjustable from 0 to 30 seconds. Standard mode is delay both ways (turn-on alarm and turn-off alarm). Consult factory for optional times and modes.• ELECTRONIC HOUSINGHeavy duty, cast aluminum.Explosion-proof for: Class I, groups C & D; Class II, groups E, F & G.Weather proof: NEMA 4.2. L840 SERIES PROBES• TYPEPoint level, single or dual element.• PRESSURE / TEMPERATURE RATINGSPSI @ TEMP °F1000 @ -3001000 @ 100450 @ 300350 @ 4000 @ 500• WETTED SURFACESTeflon and 316 Stainless Steel are standard. Probes fully sheathed in Teflon or Kynar are also available.• VESSEL CONNECTION SIZE3/4" NPT.• PHYSICAL DIMENSIONSRefer to Figure 1-2.A. InspectionThe L2000 Level Controller is normally supplied with one of the Princo L840 Series Level Probes. The L2000 and probe are shipped in separate packages.Carefully remove each package's contents and check each item against the packing list. Inspect each item for shipping damage. In particular, check the spring-loaded pin, located on the threaded hub end of the probe (see Figure 1-3). This pin provides the necessary electrical connection from the L2000 bottom printed circuit board, to the active element of the probe. Make sure this pin is not missing, bent, jammed, or otherwise damaged.If the probe is Teflon or Kynar sheathed, then carefully inspect the condition of the sheathing. Make sure the sheathing forms a smooth, continuous coverage over the probe. Discontinuities in the sheathing material which breach through to the active element may render the probe useless in certain applications. Report any such damage immediately to the factory.CAUTION !Care must be exercised when handling probes which incorporate an insulating sheath. Do not allow the sheathed sensing element to come in contact with a rough or sharp surface, as this may cause a breach in the insulating sheath, and render the probe inoperable.B. GroundingReliable operation of the L2000 Level Controller will only occur through proper installation. The most important installation consideration is a proper sensor ground return.If the process storage tank is metal, and the probe is a single element type, the ground return connection is made when the probe is properly mounted in the vessel (see C. Probe Mounting).Dual-element probes are available for non-metallic tanks. They provide a built-in ground return rod. In this case, external grounding is not required.If the vessel is non-metallic (eg. plastic, concrete, etc.), and the probe is a single element type, a separate ground return should be provided. The ground return should consist of a metal rod, equal in length to the probe. The rod should be mounted parallel to the length of the probe, no greater than 6 to 8 inches from it.The ground return rod must be electrically connected to the L2000 housing or to the ground position of the terminal block with 18 AWG or heavier wire. See Figure 3-3 & 3-4. See Figure 3-5 for ground continuity testing.C. Probe MountingThe probe is mounted by its NPT hub or flange. Refer to Figure 1-1 for dimensions.If the process material in the storage vessel is electrically conductive, the probe can be mounted in either a vertical or horizontal orientation. If the probe is mounted vertically, and the process material is electrically conductive, the L2000 will be tip sensitive (i.e. the L2000 trip point will occur when the process material just contacts the tip of the probe).If the process material in the storage vessel is electrically non-conductive (i.e. non-conductive liquid, dry powder or granular), it is recommended that the probe be mounted in a horizontal orientation.A vertically installed probe in a non-conductive process material, may require up to six inches of probe immersion before a stable trip point is reached.In horizontal mount applications, it is recommended that the probe be mounted at a shallow downward angle (not critical) off the horizontal axis for optimum process liquid drainage (refer to Figure 3-1).In applications where the probe is installed through a nozzle, the guard element should extend two inches into the vessel, beyond any process material coating build-up on the vessel inner wall (see Figure 3-2).To mount the equipment, screw the NPT hub of the probe into the NPT mounting collar which is welded into the wall or top of the storage vessel.After mounting the probe, screw the electronic housing onto the terminal end of the probe. This is all the support it requires.NOTEDo not use any type of thread lubricant on the NPT probe mounting threads or the NPT threads which mount the electronic housing. Application of thread lubricant may cause faulty or improper ground connection. If required, Teflon tape may be used as a thread seal for either threaded connection. If Teflon tape thread sealant is used, the installer should make an electrical continuity check with a hand held ohm meter. Continuity should exist between the storage vessel and the equipment electronic housing. Less than 1 ohm resistance should exist between these two points. Refer to Figure 3-5.Figure 3-1Standard InstallationFigure 3-2Extended Guard InstallationD. Electrical ConnectionsRemove the lid of the L2000 electronic housing in preparation for connection of input and output wires. Before drawing wires into the equipment housing, it may be necessary to remove the electronic chassis. To do so, unfasten the two 8-32 mounting screws which are located on either side of the electronic chassis. Once screws are unfastened, the chassis may be lifted or removed from the housing. The power and relay contact wires may now be pulled through the ¾inch NPT wiring port.Connect the 115 Vac or 230 Vac power line wires: Hot (H), Neutral (N), and Ground (G) respectively, to the terminal block as shown in Figure 3-3. If the unit requires 24 Vdc for power, the terminal block is labeled as plus (+), minus (-) and ground (G). Connect 24 Vdc power accordingly (See Figure 3-4).Connect the normally open (NO), normally closed (NC) and common (C), relay wires to the terminal block as shown in Figure 3-3, and Figure 3-4, and as required by the specific circuit application.NOTEThe relay contact configuration, as shown on the terminal block labeling and in Figures 3-3 and 3-4, is identified as such with the relay in the de-energized (shelf) state. Fail safe operation requires relay to be normally in the energized (non-shelf) state. Upon alarm, configured as either HIGH or LOW, the relay then becomes de-energized (shelf state).Replace the electronic circuit board chassis with the flat side of the printed circuit boards facing the wiring port. Replace the 8-32 mounting screws and tighten.NOTEThe two 8-32 mounting screws MUST be fastened securely. These two screws provide the ground connection to the printed circuit board electronics. If not fastened securely, faulty equipment operation may occur.Verify that all connections were made correctly.Figure 3-3Electrical Connections, 115 Vac and 230 Vac UnitsFigure 3-4Electrical Connections, 24Vdc UnitE. Installation in Hazardous AreasThe outline which follows points out some of the major requirements of the NEC's (National Electric Code) Section 501, as it relates to typical level control installations.WARNING !For applications which MUST BE explosion-proof and/or weatherproof, it is the customer's responsibility to install the required conduit, seals, wiring, etc., which meet national, as well as applicable local and plant safety codes. See Figure 1-1.For Class 1 locations, rigid metal conduit must be used. At least five full threads of the conduit must be tightly engaged in the enclosure. Conduit seal fittings must also be used. These seal fittings, must be filled with an approved sealing compound and must be installed within 18 inches (or closer) of the enclosure. Conduit seals are also required when the conduit passes from a hazardous area into a non-hazardous area. Water drain seal fittings eliminate or minimize the effect of water which tends to collect in the conduit or enclosure due to condensation.Approved wire type, such as mineral-insulated wire, is required for use in Division 1 installations. Certain types of metal-clad cable or shielded non-metallic sheathed cable are permitted in Division 2 installations. When multiconductor cables are used in the conduit, the outer jacket must be cut away in such a manner that allows the sealing compound to surround each insulated wire as well as the jacket.The preceding information should act as guide to assist the customer/installer in satisfying their responsibility for producing safe installations in hazardous area.Ground Continuity Test:With unit power off, using an ohmmeter onthe lowest range, a check between thefollowing points should read less than oneohm.1. Point A (posts) to point B.2. Point B to point C.3. Point C to point D (except in non-metallic tank).Figure 3-5Ground Continuity TestA. Initial Checkout1. Refer to Figure 4-1 for L2000 adjustment and indicator locations.2. Install the L2000 Level Controller with Probe as presented in Section 3 of this manual.3. Apply power to the unit and allow a 15 minute warm-up time before performing thecalibration procedure as outlined below.4. Perform step H.1: Basic Electronic Checks.Figure 4-1L2000 Adjustment and Indicator LocationsB. CalibrationThe Coarse (C) and Fine (F) sensitivity (SENS) pots must be properly adjusted in order to establish a repeatable switch point that is calibrated to the given process material application.If the process material is electrically conductive, then adjustments can be made under simulated or "bench test" conditions.To make adjustments under simulated conditions, perform the following outlined procedure by raising and lowering the L2000, with attached probe, into and out of a small metallic vessel filled with the conductive process material. Perform the procedure making certain that nothing but the process material, contacts the probe. A clip lead must be connected from the L2000 metal housing to the metal wall of the vessel used.Whether adjustments are made under simulated conditions, or in the actual proper installation, the following procedure must be performed.NOTEA Green PROBE STATUS indicator denotes presence of material at the probe, and a Red indicator denotes absence of material at the probe, when sensitivity potentiometers are properly adjusted.1. ADJUSTMENT PROCEDURE - Conductive Process Materialsa) Refer to Figure 4-1 for adjustment and indicator locations. Refer to Figure 4-2 for a pictorialoutline of this procedure.b) Perform Section 4.A., Initial Checkout, as outlined above.c) Allow the unit to warm up (thermally stabilize) for approximately 15 minutes beforeproceeding with steps d through f below.d) Turn the Time Delay (DLY) pot to the fully counterclockwise position (No Delay).e) With process material NOT contacting the probe, adjust both the Coarse (C) and Fine (F)Sensitivity (SENS) pots fully counter-clockwise. The Probe Status LED should be Red.f). Immerse probe in process material. The LED should switch to Green and the relays shouldchange state upon contact with the process material. This completes the adjustment procedure.NOTEConductive process materials will tend to "trip" near the tip of the probe when the storage tank is metallic. This same procedure may be used even though the probe is to be mounted horizontally.Figure 4-2Conductive Process Calibration Procedure2. ADJUSTMENT PROCEDURE - Non-Conductive (Insulating) Process Materials:a) Refer to Figure 4-1 for adjustment and indicator locations. Refer to Figure 4-3 for a pictorialoutline of this procedure.b) Perform Section 4.A., Initial Checkout, as outlined above.c) Allow the unit to warm up (thermally stabilize) for approximately 15 minutes beforeproceeding with following steps.d) Preset the Fine (F) Sensitivity (SENS) pot full clockwise and the Coarse ( C ) pot to its mid-point position (12 o'clock).e) Turn the Time Delay (DLY) pot to the fully counter-clockwise position (No Delay).f) If a coating is likely to build up on the probe in actual use, pre-coat the probe with theprocess material before proceeding. The coating must cover the entire length of the probe, including the guard element. This may be done by raising the level or by other means.g) With process material NOT contacting the probe, adjust the Coarse (C) sensitivity such thatthe Probe Status LED "just turns" Green and stays. Don't touch the Coarse (C) sensitivity pot again.NOTEClockwise rotation increases sensitivity for both Coarse (C) and Fine (F) potentiometers.h). Adjust the Fine (F) sensitivity pot counter-clockwise, such that the PROBE STATUS LED"just turns" Red, and then back clockwise until it "just turns" Green. Mark the position of the Fine (F) sensitivity pot.i). Immerse probe in process material to the desired level of "trip point". For a verticallyinstalled sensor probe in a non-conductive process material, this trip point should typically be half way up the probe active section.NOTEHorizontal probe mounting is preferred (see Section 3C). The procedure must be done with the L2000 properly installed in the intended storage tank, and with the intended process material. All or most of the probe may need to be covered. The angle between the adjustment marks may be quite small with non-conductive process materials.j). With probe immersed, adjust the Fine (F) sensitivity pot counter-clockwise, such that the PROBE STATUS LED "just turns" Red and stays. Mark or mentally note position of screwdriver slot.k). Turn the Fine (F) sensitivity pot until the screwdriver slot is midway between the marks from steps h and j. The Probe Status LED should now be Green (probe immersed in same position). If not repeat steps d through k.Figure 4-3Non-conductive Process Calibration ProcedureC. Alarm ActionThe L2000 is in the normal “non-alarmed” state when it’s control relay is energized. The unit is in the “alarm” state when its internal control relay is de-energized. Hence, if the unit lost power, the internal control relay would de-energize, and an “alarm” condition would occur.This type of “Fail-Safe” operation is based on the fact that most major malfunctions, including a power failure, would cause the control relay to de-energize.1. Fail Safe Low Operation (Low Acting Alarm):The control relay contacts de-energize (shelf state) upon Low Alarm. When process material absence is detected, a Low Alarm condition occurs, and the relay changes from the normal "non-alarmed" (energized) state to the “alarmed” (de-energized) state.2. Fail Safe High Operation (High Acting Alarm):The control relay contacts de-energize (shelf state) upon High Alarm. When process material presence is detected, a High Alarm condition occurs, and the relay changes from the normal "non-alarmed" (energized) state to the “alarmed” (de-energized) state.This action is controlled by a small plastic jumper selector switch (FAIL SAFE) located on the top of the unit (see Figure 4-1). The L circuit pad designates Low Acting Alarm. The H circuit pad designates High Acting Alarm. The center pad is the common, and always connects to one position of the jumper selector.Unless otherwise specified this unit is set for High Acting Alarm operation. If Low Acting Alarm operation is desired, remove the jumper switch currently connected between center pin and H, and re-locate it between center pin and L.D. Delay Operations and AdjustmentsTime delay is useful in preventing control relay "chatter" caused by agitation of the process material within the storage vessel. It is also useful in certain process control timing applications. The three types of time delay are as follows: delayed turn-on alarm, delayed turn-off alarm, and delayed turn-on alarm/turn-off alarm.The first two modes are normally used to suit a particular timing application. The third mode (turn-on/turn-off) is best suited to prevent relay chatter. This mode (on/off) is factory configured in the standard L2000 unit.A single turn Time Delay (DLY) pot is provided on the L2000 (see Figure 4-1). Most applications require no time delay. Therefore, adjust the Time Delay pot to the maximum counterclockwise direction (zero time delay).If there is significant agitation of the process material within the storage vessel, then time delay may be required. In this case, adjust the Time Delay pot clockwise, just enough to prevent control relay chatter. Use the smallest amount of delay possible.The maximum standard delay time is 30 seconds full scale. Consult Factory for optional delay times and modes.H. Trouble-Shooting Guide1. Basic Electronic Checks。

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