RB521S-30TE61;RB521S-30FTE61;中文规格书,Datasheet资料

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罗莫电子 Schottky 障碍管 RB521S-30说明书

Schottky Barrier DiodeRB521S-30●ApplicationsGeneral rectification●Features1)Ultra small mold type.（EMD2）2)Low V F3)High reliability●ConstructionSilicon epitaxial planar●Structure●Absolute maximum ratings (Ta=25°C)Symbol Unit V R V Io mA I FSM A Tj °C Tstg°C●Electrical characteristics (Ta=25°C)Symbol Min.Typ.Max.Unit Forward voltage V F--0.50V I F =200mA I R--30μAV R =10VParameter Limits Reverse voltage (DC)30Average rectified forward current 200Forward current surge peak (60Hz ・1cyc)1ConditionsJunction temperature 125Storage temperature-40 to +125Reverse currentParameterL a st0.010.1110100100010000100000102030FORWARD VOLTAGE：VF(mV)VF-IF CHARACTERISTICSF O R W A R D C U R R E N T :I F (m A )R E V E R S E C U R R E N T :I R (u A )REVERSE VOLTAGE：VR(V)VR-IR CHARACTERISTICSC A P A C I T A N C E B E T W E E N T E R M I N A L S :C t (p F )REVERSE VOLTAGE:VR(V)VR-Ct CHARACTERISTICSVF DISPERSION MAP F O R W A R D V O L T A G E :V F (m V )R E V E R S E C U R R E N T :V R (u A )IR DISPERSION MAPC A P A C I T A N C E B E T W E E N T E R M I N A L S :C t (p F )Ct DISPERSION MAPIFSM DISPERSION MAPP E A K S U R G E F O R W A R D C U R R E N T :I F S M (A )P E A K S U R G E F O R W A R D C U R R E N T :I F S M (A )NUMBER OF CYCLESIFSM-CYCLE CHARACTERISTICSP E A K S U R G E F O R W A R D C U R R E N T :I F S M (A )TIME:t(ms)IFSM-t CHARACTERISTICSTIME:(s)Rth-t CHARACTERISTICST R A N S I E N T T H A E R M A L I M P E D A N C E :R t h (℃/W )F O R W A R D P O W E R D I S S I P A T I O N :P f (W )AVERAGE RECTIFIED FORWARD CURRENT：Io(A)Io-Pｆ CHARACTERISTICSR E V E R S E P O W E R D I S S I P A T I O N P R (w )REVERSE VOLTAGE：VR(V)VR-P R CHARACTERISTICS10020030040050040041042043044045051015202530354045501011121314151617181920510152051011010005101101001010010000.0010.110100000.050.10.150.20.10.20.30.40.50.10.20.30.40.501020301101005101520L tAMBIENT TEMPERATURE：Ta(℃)Derating CurveﾞA V E R A G E R E C T I F I D E F O R W A R D C U R R E N T I o (A )A V E R A G E R E C T I F I E D F O R W A R D C U R R E N T I o (A )CASE TEMPARATURE：Tc(℃)Derating Curve00.10.20.30.40.502550751001250.10.20.30.40.50255075100125L a st Ti me Bu yNoticePrecaution on using ROHM Products1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If youintend to use our Products in devices requiring extremely high reliability (such as medical equipment(Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications.(Note1) Medical Equipment Classification of the Specific ApplicationsJAPAN USA EU CHINA CLASS Ⅲ CLASS Ⅲ CLASS ⅡbCLASS ⅢCLASS Ⅳ CLASS Ⅲ2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductorproducts can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures:[a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure3. Our Products are designed and manufactured for use under standard conditions and not under any special orextraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl 2, H 2S, NH 3, SO 2, and NO 2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering[h] Use of the Products in places subject to dew condensation4. The Products are not subject to radiation-proof design.5. Please verify and confirm characteristics of the final or mounted products in using the Products.6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability.7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actualambient temperature.8. Confirm that operation temperature is within the specified range described in the product specification.9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.Precaution for Mounting / Circuit board design1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect productperformance and reliability.2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mustbe used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specificationL a st Ti me Bu yPrecautions Regarding Application Examples and External Circuits1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of thecharacteristics of the Products and external components, including transient characteristics, as well as static characteristics.2. You agree that application notes, reference designs, and associated data and information contained in this documentare presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.Precaution for ElectrostaticThis Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take propercaution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).Precaution for Storage / Transportation1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time periodmay be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period.3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leadsmay occur due to excessive stress applied when dropping of a carton.4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products ofwhich storage time is exceeding the recommended storage time period.Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only.Precaution for DispositionWhen disposing Products please dispose them properly using an authorized industry waste company.Precaution for Foreign Exchange and Foreign Trade actSince concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export.Precaution Regarding Intellectual Property Rights1. All information and data including but not limited to application example contained in this document is for referenceonly. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of theProducts with other articles such as components, circuits, systems or external equipment (including software).3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or anythird parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior writtenconsent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in theProducts or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks ofROHM, its affiliated companies or third parties.L a st Ti me Bu yGeneral Precaution1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document.2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative.3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that allinformation contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.L a st Ti me Bu y。

FOSAN富信电子二极管 RB521S-30-产品规格书

安徽富信半导体科技有限公司ANHUI FOSAN SEMICONDUCTOR TECHNOLOGY CO.,LTD.RB521S-30SOD-523Schottky Barrier Diode 肖特基势垒二极管▉Internal Configuration&DeviceMarking 内部结构与产品打标Type 型号RB521S-30Pin 管脚Mark 打标▉AbsoluteMaximum Ratings 最大额定值Characteristic 特性参数Symbol 符号Rat 额定值Unit 单位DC Reverse Voltage 直流反向电压V R 30Forward Work Current 正向工作电流I O 200mA Peak Forward Surge Current 正向峰值浪涌电流I FSM1000mA Power dissipation 耗散功率P D (Ta=25℃)150mW Thermal Resistance J-A 结到环境热阻R θJA 668℃/W Junction and Storage Temperature 结温和储藏温度T J ,T stg-55to+125℃■Electrical Characteristics 电特性(T A =25℃unless otherwise noted 如无特殊说明，温度为25℃)Characteristic 特性参数Symbol 符号Min 最小值Max 最大值Unit 单位Reverse Breakdown Voltage 反向击穿电压(I R =100µA)V (BR)30—V Reverse Leakage Current 反向漏电流(V R =10V)I R —30µA Forward V oltage(I F =10mA)正向电压(I F =200mA)V F—0.350.5VANHUI FOSAN SEMICONDUCTOR TECHNOLOGY CO.,LTD.RB521S-30■Typical Characteristic Curve典型特性曲线ANHUI FOSAN SEMICONDUCTOR TECHNOLOGY CO.,LTD.RB521S-30■Dimension外形封装尺寸。

RM521学习型ASK功能接收模块说明书

RM521产品描述RM521是一款工作于315MHz/433.92MHZ的学习型ASK功能接收模块。

该模块集成解码，静噪，数据纠错，学习，对码等功能，且拥有4路互锁，点控，自锁以及多种组合输出方式。

该模块兼容多种固定码编码芯片，如EV1527,PT2262,PT2260,PT2240,SC2260等，并可以支持码宽范围覆盖100us~2000us。

Vx901M内置大容量EEPROM，可以支持学习多达80个遥控器。

该模块具有高灵敏度（-112dBm）、低功耗（＜5.5mA），高动态范围（＞80dB），同时该模块具有高抗干扰性能。

RM521正常工作电压范围 2.5~5.5V，正常工作电流5.5-6.0mA，接收灵敏度最高可达到-112dBm.该模块尺寸为27.3mm*12.3mm.特性工作频段315/433.92MHz数据率范围0.5-10kbps灵敏度-112dBm（3kbps）,0.1％BER兼容EV1527,PT2262,PT2260,PT2240,SC2260码宽范围覆盖100us~2000us无需震荡电阻支持4路输出支持学习80个遥控器不需跳线，不需手工编码供电电压，2.5–5.5V低功耗，5.5~6.0mA支持互锁，点控，自锁以及多种组合输出方式应用领域遥控门禁系统遥控风扇照明开关玩具遥控安防系统智能小家电目录产品描述 (1)特性 (1)应用领域 (1)1、脚位定义及说明 (1)1.1脚位示意图 (1)1.2脚位说明 (1)2、绝对最大额定值 (2)3、工作条件 (2)4、电特性参数 (3)5、模块尺寸 (4)6、功能说明 (5)6.1应用电路图 (5)6.2功能说明 (5)7、天线说明 (7)7.1315MHz天线 (7)7.2433.92MHz天线 (7)8、注意事项 (7)1、脚位定义及说明1.1脚位示意图图1RM521管脚示意图1.2脚位说明表1RM521管脚描述2、绝对最大额定值表2绝对最大额定值3、工作条件表推荐工作条件4、电特性参数表4接收器规格5、模块尺寸图2RM521尺寸示意图表尺寸数据表6、功能说明6.1应用电路图图3RM521应用电路示意图6.2功能说明如图3所示，RM521采用单个按键实现模式设置及学习功能，可以通过VT接口外接按键也可以直接使用模块上的按键，以下简称学习按键。

W25Q128BVEIG;中文规格书,Datasheet资料

Publication Release Date: April 18, 20123V 128M-BITSERIAL FLASH MEMORY WITH DUAL AND QUAD SPITable of Contents1.GENERAL DESCRIPTION (5)2.FEATURES (5)3.PACKAGE TYPES AND PIN CONFIGURATIONS (6)3.1Pad Configuration WSON 8x6-mm (6)3.2Pad Description WSON 8x6-mm (6)3.3Pin Configuration SOIC 300-mil (7)3.4Pin Description SOIC 300-mil (7)3.5Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) (8)3.6Ball Description TFBGA 8x6-mm (8)4.PIN DESCRIPTIONS (9)4.1Chip Select (/CS) (9)4.2Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) (9)4.3Write Protect (/WP) (9)4.4HOLD (/HOLD) (9)4.5Serial Clock (CLK) (9)5.BLOCK DIAGRAM (10)6.FUNCTIONAL DESCRIPTIONS (11)6.1SPI OPERATIONS (11)6.1.1Standard SPI Instructions (11)6.1.2Dual SPI Instructions (11)6.1.3Quad SPI Instructions (11)6.1.4Hold Function (11)6.2WRITE PROTECTION (12)6.2.1Write Protect Features (12)7.STATUS REGISTERS AND INSTRUCTIONS (13)7.1STATUS REGISTERS (13)7.1.1BUSY Status (BUSY) (13)7.1.2Write Enable Latch Status (WEL) (13)7.1.3Block Protect Bits (BP2, BP1, BP0) (13)7.1.4Top/Bottom Block Protect Bit (TB) (13)7.1.5Sector/Block Protect Bit (SEC) (13)7.1.6Complement Protect Bit (CMP) (14)7.1.7Status Register Protect Bits (SRP1, SRP0) (14)7.1.8Erase/Program Suspend Status (SUS) (14)7.1.9Security Register Lock Bits (LB3, LB2, LB1) (14)7.1.10Quad Enable Bit (QE) (15)7.1.11Status Register Memory Protection (CMP = 0) (16)7.1.12 Status Register Memory Protection (CMP = 1) (17)Publication Release Date: April 18, 20127.2 INSTRUCTIONS (18)7.2.1 Manufacturer and Device Identification ................................................................................ 18 7.2.2 Instruction Set Table 1 (Erase, Program Instructions) .......................................................... 19 7.2.3 Instruction Set Table 2 (Read Instructions) .......................................................................... 20 7.2.4 Instruction Set Table 3 (ID, Security Instructions) ................................................................ 21 7.2.5 Write Enable (06h) ............................................................................................................... 22 7.2.6 Write Enable for Volatile Status Register (50h) .................................................................... 22 7.2.7 Write Disable (04h) ............................................................................................................... 23 7.2.8 Read Status Register-1 (05h) and Read Status Register-2 (35h) ........................................ 24 7.2.9 Write Status Register (01h) .................................................................................................. 24 7.2.10 Read Data (03h) ................................................................................................................. 26 7.2.11 Fast Read (0Bh) ................................................................................................................. 27 7.2.12 Fast Read Dual Output (3Bh) ............................................................................................. 28 7.2.13 Fast Read Quad Output (6Bh) ............................................................................................ 29 7.2.14 Fast Read Dual I/O (BBh) ................................................................................................... 30 7.2.15 Fast Read Quad I/O (EBh) ................................................................................................. 32 7.2.16 Word Read Quad I/O (E7h) ................................................................................................ 34 7.2.17 Octal Word Read Quad I/O (E3h) ....................................................................................... 36 7.2.18 Set Burst with Wrap (77h) .................................................................................................. 38 7.2.19 Continuous Read Mode Bits (M7-0) ................................................................................... 39 7.2.20 Continuous Read Mode Reset (FFh or FFFFh) .................................................................. 39 7.2.21 Page Program (02h) ........................................................................................................... 40 7.2.22 Quad Input Page Program (32h) ........................................................................................ 41 7.2.23 Sector Erase (20h) ............................................................................................................. 42 7.2.24 32KB Block Erase (52h) ..................................................................................................... 43 7.2.25 64KB Block Erase (D8h) ..................................................................................................... 44 7.2.26 Chip Erase (C7h / 60h) ....................................................................................................... 45 7.2.27 Erase / Program Suspend (75h) ......................................................................................... 46 7.2.28 Erase / Program Resume (7Ah) ......................................................................................... 47 7.2.29 Power-down (B9h) .............................................................................................................. 48 7.2.30 Release Power-down / Device ID (ABh) ............................................................................. 49 7.2.31 Read Manufacturer / Device ID (90h) ................................................................................. 51 7.2.32 Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 52 7.2.33 Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 53 7.2.34 Read Unique ID Number (4Bh)........................................................................................... 54 7.2.35 Read JEDEC ID (9Fh) ........................................................................................................ 55 7.2.36 Read SFDP Register (5Ah) ................................................................................................ 56 7.2.37 Erase Security Registers (44h) ........................................................................................... 57 7.2.38 Program Security Registers (42h) ...................................................................................... 58 7.2.39 Read Security Registers (48h) . (59)8.ELECTRICAL CHARACTERISTICS (60)8.1Absolute Maximum Ratings (60)8.2Operating Ranges (60)8.3Power-up Timing and Write Inhibit Threshold (61)8.4DC Electrical Characteristics (62)8.5AC Measurement Conditions (63)8.6AC Electrical Characteristics (64)8.7AC Electrical Characteristics (cont’d) (65)8.8Serial Output Timing (66)8.9Serial Input Timing (66)8.10HOLD Timing (66)8.11WP Timing (66)9.PACKAGE SPECIFICATION (67)9.18-Pad WSON 8x6-mm (Package Code E) (67)9.216-Pin SOIC 300-mil (Package Code F) (68)9.324-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array) (69)9.424-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array) (70)10.ORDERING INFORMATION (71)10.1Valid Part Numbers and Top Side Marking (72)11.REVISION HISTORY (73)Publication Release Date: April 18, 20121. GENERAL DESCRIPTIONThe W25Q128BV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down.The W25Q128BV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128BV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.)The W25Q128BV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual Output and 280MHz (70MHz x 4) for Quad SPI when using the Fast Read Quad SPI instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation.A Hold pin, Write Protect pin and programmable write protection, with top, bottom or complement array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number.2. FEATURES• Family of SpiFlash Memories – W25Q128BV: 128M-bit/16M-byte – 256-byte per programmable page– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO 0, IO 1, /WP, /Hold– Quad SPI: CLK, /CS, IO 0, IO 1, IO 2, IO 3• Highest Performance Serial Flash– 104/70MHz Dual Output/Quad SPI clocks– 208/280MHz equivalent Dual /Quad SPI– 35MB/S continuous data transfer rate– Up to 5X that of ordinary Serial Flash– More than 100,000 erase/program cycles (1)– More than 20-year data retention• Efficient “Continuous Read Mode” – Low Instruction overhead– Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash • Low Power, Wide Temperature Range– Single 2.7 to 3.6V supply– 4mA active current, <1µA Power-down current – -40°C to +85/105°C operating range • Flexible Architecture with 4KB sectors– Uniform Sector/Block Erase (4K/32K/64K-Byte)– Program one to 256 bytes– Erase/Program Suspend & Resume• Advanced Security Features – Software and Hardware Write-Protect – Top/Bottom, 4KB complement array protection – Lock-Down and OTP array protection – 64-Bit Unique Serial Number for each device – Discoverable Parameters (SFDP) Register – 3X256-Byte Security Registers with OTP locks– Volatile & Non-volatile Status Register Bits• Space Efficient Packaging – 8-pad WSON 8x6-mm – 16-pin SOIC 300-mil – 24-ball TFBGA 8x6-mm– Contact Winbond for KGD and other options Note 1. More than 100k Block Erase/Program cycles for Industrial and Automotive temperature; more than 10k fullchip Erase/Program cycles tested in compliance with AEC-Q100.3.PACKAGE TYPES AND PIN CONFIGURATIONSW25Q128BV is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package code F) and two 24-ball 8x6-mm TFBGAs (package code B, C) as shown in Figure 1a-c respectively. Package diagrams and dimensions are illustrated at the end of this datasheet.3.1Pad Configuration WSON 8x6-mmFigure 1a. W25Q128BV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E)3.2Pad Description WSON 8x6-mmPAD NO. PAD NAME I/O FUNCTION1 /CS I Chip Select Input2 DO (IO1) I/O Data Output (Data Input Output 1)*1(IO2)I/O Write Protect Input ( Data Input Output 2)*23 /WP4 GND Ground5 DI (IO0) I/O Data Input (Data Input Output 0)*16 CLK I Serial Clock Input(IO3)I/O Hold Input (Data Input Output 3)*27 /HOLD8 VCC PowerSupply*1: IO0 and IO1 are used for Standard and Dual SPI instructions*2: IO0 – IO3 are used for Quad SPI instructionsPublication Release Date: April 18, 20123.3 Pin Configuration SOIC 300-milFigure 1b. W25Q128BV Pin Assignments, 16-pin SOIC 300-mil (Package Code F)3.4 Pin Description SOIC 300-milPIN NO.PIN NAMEI/OFUNCTION1 /HOLD (IO3)I/OHold Input (Data Input Output 3)*22 VCC Power Supply3 N/C No Connect4 N/C No Connect5 N/C No Connect6 N/C No Connect7 /CS I Chip Select Input8DO (IO1)I/O Data Output (Data Input Output 1)*19 /WP (IO2)I/OWrite Protect Input (Data Input Output 2)*210 GND Ground 11 N/C No Connect 12 N/C No Connect 13 N/C No Connect 14 N/C No Connect 15 DI (IO0) I/O Data Input (Data Input Output 0)*116CLKISerial Clock Input*1: IO0 and IO1 are used for Standard and Dual SPI instructions.*2: IO0 – IO3 are used for Quad SPI instructions, /WP or /HOLD functions are only available for Standard/Dual SPI.3.5Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)Figure 1c. W25Q128BV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code B, C)3.6Ball Description TFBGA 8x6-mmBALL NO. PIN NAME I/O FUNCTIONB2 CLK I Serial Clock InputB3 GND GroundSupplyB4 VCC PowerC2 /CS I Chip Select Input(IO2)I/O Write Protect Input (Data Input Output 2)*2C4 /WPD2 DO (IO1) I/O Data Output (Data Input Output 1)*1D3 DI (IO0) I/O Data Input (Data Input Output 0)*1(IO3)I/O Hold Input (Data Input Output 3)*2D4 /HOLDMultiple NC NoConnect*1: IO0 and IO1 are used for Standard and Dual SPI instructions.*2: IO0 – IO3 are used for Quad SPI instructions, /WP or /HOLD functions are only available for Standard/Dual SPI.Publication Release Date: April 18, 20124. PIN DESCRIPTIONS4.1 Chip Select (/CS)The SPI Chip Select (/CS) pin enables and disables device operation. When /CS is high the device is deselected and the Serial Data Output (DO, or IO0, IO1, IO2, IO3) pins are at high impedance. When deselected, the devices power consumption will be at standby levels unless an internal erase, program or write status register cycle is in progress. When /CS is brought low the device will be selected, power consumption will increase to active levels and instructions can be written to and data read from the device. After power-up, /CS must transition from high to low before a new instruction will be accepted. The /CS input must track the VCC supply level at power-up (see “Write Protection” and Figure 38). If needed a pull-up resister on /CS can be used to accomplish this.4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)The W25Q128BV supports standard SPI, Dual SPI and Quad SPI operation. Standard SPI instructions use the unidirectional DI (input) pin to serially write instructions, addresses or data to the device on the rising edge of the Serial Clock (CLK) input pin. Standard SPI also uses the unidirectional DO (output) to read data or status from the device on the falling edge of CLK.Dual and Quad SPI instructions use the bidirectional IO pins to serially write instructions, addresses or data to the device on the rising edge of CLK and read data or status from the device on the falling edge of CLK. Quad SPI instructions require the non-volatile Quad Enable bit (QE) in Status Register-2 to be set. When QE=1, the /WP pin becomes IO2 and /HOLD pin becomes IO3.4.3 Write Protect (/WP)The Write Protect (/WP) pin can be used to prevent the Status Register from being written. Used in conjunction with the Status Register’s Block Protect (CMP, SEC, TB, BP2, BP1 and BP0) bits and Status Register Protect (SRP) bits, a portion as small as a 4KB sector or the entire memory array can be hardware protected. The /WP pin is active low. When the QE bit of Status Register-2 is set for Quad I/O, the /WP pin function is not available since this pin is used for IO2. See Figure 1a-c for the pin configuration of Quad I/O operation.4.4 HOLD (/HOLD)The /HOLD pin allows the device to be paused while it is actively selected. When /HOLD is brought low, while /CS is low, the DO pin will be at high impedance and signals on the DI and CLK pins will be ignored (don’t care). When /HOLD is brought high, device operation can resume. The /HOLD function can be useful when multiple devices are sharing the same SPI signals. The /HOLD pin is active low. When the QE bit of Status Register-2 is set for Quad I/O, the /HOLD pin function is not available since this pin is used for IO3. See Figure 1a-c for the pin configuration of Quad I/O operation.4.5 Serial Clock (CLK)The SPI Serial Clock Input (CLK) pin provides the timing for serial input and output operations. ("See SPI Operations")5.BLOCK DIAGRAM ArrayFigure 2. W25Q128BV Serial Flash Memory Block Diagram分销商库存信息: WINBONDW25Q128BVEIG。

RB521S30

1.Product proﬁle1.1General descriptionPlanar Maximum Efﬁciency General Application (MEGA)Schottky barrier rectiﬁer with an integrated guard ring for stress protection,encapsulated in a SOD523(SC-79)ultra small and ﬂat lead Surface-Mounted Device (SMD) plastic package.1.2FeaturesI Average forward current: I F(AV)≤0.2A I Reverse voltage: V R ≤30V I Low reverse current: I R ≤30µA I AEC-Q101 qualiﬁedIUltra small and ﬂat lead SMD plastic package1.3ApplicationsI Low current rectiﬁcationI High efﬁciency DC-to-DC conversion I Switch Mode Power Supply (SMPS)I Reverse polarity protectionILow power consumption applications1.4Quick reference data[1]Device mounted on an FR4Printed-Circuit Board (PCB), single-sided copper, mounting pad for cathode 1cm 2.[2]Pulse test: t p ≤300µs;δ≤0.02.RB521S30200 mA low V F MEGA Schottky barrier rectiﬁerRev. 01 — 6 October 2009Product data sheetTable 1.Quick reference data T j =25°C unless otherwise speciﬁed.Symbol ParameterConditions Min Typ Max UnitI F(AV)average forward currentsquare wave;δ=0.5;f =20kHz T amb ≤120°C [1]--0.2A T sp ≤140°C--0.2A I R reverse current V R =10V - 2.530µA V R reverse voltage --30V V Fforward voltageI F =0.2A[2]-420500mV2.Pinning information[1]The marking bar indicates the cathode.3.Ordering information4.Marking5.Limiting valuesTable 2.PinningPin Description Simpliﬁed outline Graphic symbol1cathode [1]2anode21sym00112Table 3.Ordering informationType numberPackage NameDescriptionVersion RB521S30SC-79plastic surface-mounted package; 2leadsSOD523Table 4.Marking codesType numberMarking code RB521S30ZBTable 5.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit V R reverse voltage T j =25°C -30VI F(AV)average forward currentsquare wave;δ=0.5;f =20kHz T amb ≤120°C [1]-0.2A T sp ≤140°C-0.2A I FSMnon-repetitive peak forward current t p =8.3ms half sine wave;JEDEC method [2]-1AP tottotal power dissipationT amb ≤25°C[3][4]-275mW [3][1]-420mW [3][5]-500mW[1]Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm 2.[2]T j =25°C prior to surge.[3]Reﬂow soldering is the only recommended soldering method.[4]Device mounted on an FR4PCB, single-sided copper, tin-plated and standard footprint.[5]Device mounted on a ceramic PCB, Al 2O 3, standard footprint.6.Thermal characteristics[1]For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses P R are a signiﬁcant part of the total power losses.[2]Reﬂow soldering is the only recommended soldering method.[3]Device mounted on an FR4PCB, single-sided copper, tin-plated and standard footprint.[4]Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm 2.[5]Device mounted on a ceramic PCB, Al 2O 3, standard footprint.[6]Soldering point of cathode tab.T j junction temperature -150°C T amb ambient temperature −55+150°C T stgstorage temperature−65+150°CTable 5.Limiting values …continuedIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol ParameterConditions Min Max Unit Table 6.Thermal characteristics Symbol ParameterConditions Min Typ Max Unit R th(j-a)thermal resistance from junction to ambientin free air[1][2][3]--455K/W [4]--300K/W [5]--250K/W R th(j-sp)thermal resistance from junction to solder point[6]--90K/WFR4PCB, standard footprintFig 1.Transient thermal impedance from junction to ambient as a function of pulse duration; typical valuesFR4PCB, mounting pad for cathode 1cm 2Fig 2.Transient thermal impedance from junction to ambient as a function of pulse duration; typical values006aab710t p (s)10−310210310110−210−110210103Z th(j-a)(K/W)1duty cycle =10.750.50.330.250.20.10.050.020.01006aab711t p (s)10−310210310110−210−110210103Z th(j-a)(K/W)1duty cycle =10.750.50.330.250.20.10.050.020.017.Characteristics[1]Pulse test: t p ≤300µs;δ≤0.02.Table 7.CharacteristicsT j =25°C unless otherwise speciﬁed.Symbol Parameter ConditionsMin Typ Max Unit V Fforward voltage[1]I F =0.1mA -130190mV I F =1mA -190250mV I F =10mA -255300mV I F =100mA -355410mV I F =200mA-420500mV I R reverse current V R =10V- 2.530µA C ddiode capacitancef =1MHz; V R =1V-2025pF(1)T j =150°C (2)T j =125°C (3)T j =85°C (4)T j =25°C (5)T j =−40°C(1)T j =125°C (2)T j =85°C (3)T j =25°C (4)T j =−40°CFig 3.Forward current as a function of forward voltage; typical valuesFig 4.Reverse current as a function of reverse voltage; typical values006aab71210−210−3110−110I F (A)10−4V F (V)0.01.00.80.40.60.2(1)(2)(3)(4)(5)006aab713V R (V)030201010−210−310−410−510−610−710−8I R (A)10−9(1)(2)(3)(4)f =1MHz; T amb =25°C T j =150°C (1)δ=0.1(2)δ=0.2(3)δ=0.5(4)δ=1Fig 5.Diode capacitance as a function of reverse voltage; typical valuesFig 6.Average forward power dissipation as a function of average forward current; typical valuesT j =125°C (1)δ=1(2)δ=0.9(3)δ=0.8(4)δ=0.5FR4PCB, standard footprint T j =150°C (1)δ=1; DC (2)δ=0.5; f =20kHz (3)δ=0.2; f =20kHz (4)δ=0.1; f =20kHzFig 7.Average reverse power dissipation as a function of reverse voltage; typical valuesFig 8.Average forward current as a function of ambient temperature; typical valuesV R (V)0302010006aab71435C d (pF)51015202530I F(AV) (A)0.00.30.20.1006aab7150.050.100.15P F(AV)(W)0.0(1)(2)(3)(4)V R (V)0252010155006aab7160.175P R(AV)(W)0.1250.0750.0250.00.050.100.15(1)(2)(3)(4)T amb (°C)0501001501751257525006aab7170.10.20.3I F(AV)(A)0.0(1)(2)(3)(4)8.Test informationFR4PCB, mounting pad for cathode 1cm 2T j =150°C (1)δ=1; DC (2)δ=0.5; f =20kHz (3)δ=0.2; f =20kHz (4)δ=0.1; f =20kHzT j =150°C (1)δ=1; DC (2)δ=0.5; f =20kHz (3)δ=0.2; f =20kHz (4)δ=0.1; f =20kHzFig 9.Average forward current as a function of ambient temperature; typical values Fig 10.Average forward current as a function ofsolder point temperature; typical valuesT amb (°C)0501001501751257525006aab7180.10.20.3I F(AV)(A)0.0(1)(2)(3)(4)T sp (°C)0501001501751257525006aab7190.10.20.3I F(AV)(A)0.0(1)(2)(3)(4)(1)I R =1mAInput signal: reverse pulse rise time t r =0.6ns; reverse voltage pulse duration t p =100ns; duty cycle δ=0.05Oscilloscope: rise time t r =0.35nsFig 11.Reverse recovery time test circuit and waveformst rr(1)+ I Ftoutput signalt rt pt10 %90 %V Rinput signal V = V R + I F × R SR S = 50 ΩI FD.U.T.R i = 50 ΩSAMPLING OSCILLOSCOPEmga881The current ratings for the typical waveforms as shown in Figure 8,9 and 10 arecalculated according to the equations:with I M deﬁned as peak current, at DC, and with I RMS deﬁned as RMS current.8.1Quality informationThis product has been qualiﬁed in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualiﬁcation for discrete semiconductors , and is suitable for use in automotive applications.9.Package outlineFig 12.Duty cycle deﬁnitiont 1t 2Pt006aaa812duty cycle δ =t 1t 2I F AV ()I M δ×=I RMS I F AV ()=I RMS I M δ×=Fig 13.Package outline SOD523(SC-79)02-12-13Dimensions in mm1.651.55 1.251.150.170.110.340.260.650.580.850.751210.Packing information[1]For further information and the availability of packing methods, see Section 14.11.SolderingTable 8.Packing methodsThe indicated -xxx are the last three digits of the 12NC ordering code.[1]Type number Package Description Packing quantity 3000800010000RB521S30SOD5232mm pitch, 8mm tape and reel --315-4mm pitch, 8mm tape and reel-115--135Reﬂow soldering is the only recommended soldering method.Fig 14.Reﬂow soldering footprint SOD523(SC-79)solder lands solder resistoccupied areasolder paste Dimensions in mm0.6(2×)0.5(2×)2.151.10.7(2×)0.8(2×)1.2sod523_fr12.Revision historyTable 9.Revision historyDocument ID Release date Data sheet status Change notice Supersedes RB521S30_120091006Product data sheet--RB521S30_1© NXP B.V . 2009. All rights reserved.Product data sheet Rev. 01 — 6 October 200911 of 1213.Legal information13.1Data sheet status[1]Please consult the most recently issued document before initiating or completing a design.[2]The term ‘short data sheet’ is explained in section “Deﬁnitions”.[3]The product status of device(s)described in this document may have changed since this document was published and may differ in case of multiple devices.The latest product status information is available on the Internet at URL .13.2DeﬁnitionsDraft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modiﬁcations or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequences of use of such information.Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s)and title.A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the full data sheet shall prevail.13.3DisclaimersGeneral —Information in this document is believed to be accurate andreliable.However,NXP Semiconductors does not give any representations or warranties,expressed or implied,as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including withoutlimitation speciﬁcations and product descriptions, at any time and without notice.This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use —NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure ormalfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.Limiting values —Stress above one or more limiting values (as deﬁned in the Absolute Maximum Ratings System of IEC 60134)may cause permanent damage to the device.Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in theCharacteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale,as published at /proﬁle/terms , including those pertaining to warranty,intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conﬂict between information in this document and such terms and conditions, the latter will prevail.No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant,conveyance or implication of any license under any copyrights,patents or other industrial or intellectual property rights.Export control —This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.Quick reference data —The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.13.4TrademarksNotice:All referenced brands,product names,service names and trademarks are the property of their respective owners.14.Contact informationFor more information, please visit:For sales ofﬁce addresses, please send an email to:salesaddresses@Document status [1][2]Product status [3]DeﬁnitionObjective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.Product [short] data sheetProductionThis document contains the product speciﬁcation.15.Contents1Product proﬁle. . . . . . . . . . . . . . . . . . . . . . . . . . 11.1General description. . . . . . . . . . . . . . . . . . . . . . 11.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.4Quick reference data. . . . . . . . . . . . . . . . . . . . . 12Pinning information. . . . . . . . . . . . . . . . . . . . . . 23Ordering information. . . . . . . . . . . . . . . . . . . . . 24Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 26Thermal characteristics. . . . . . . . . . . . . . . . . . . 37Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 58Test information. . . . . . . . . . . . . . . . . . . . . . . . . 78.1Quality information . . . . . . . . . . . . . . . . . . . . . . 89Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 810Packing information. . . . . . . . . . . . . . . . . . . . . . 911Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 912Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1013Legal information. . . . . . . . . . . . . . . . . . . . . . . 1113.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . 1113.2Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1113.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 1113.4T rademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 1114Contact information. . . . . . . . . . . . . . . . . . . . . 1115Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.© NXP B.V.2009.All rights reserved.For more information, please visit: For sales office addresses, please send an email to: salesaddresses@Date of release: 6 October 2009Document identifier: RB521S30_1。

RB521G-30-TP;中文规格书,Datasheet资料

RB521G-30100 mASchottky Barrier Diode30 VoltsFeatures• High Reliability•Low Reverse Current and Low Forward Voltage. www.mccsemi .comTMMicro Commercial Components• Lead Free Finish/RoHS Compliant ("P" Suffixdesignates RoHS Compliant. See ordering information)Revision: A 2011/01/01 omp onents 20736 Marilla Street Chatsworth! "# $ % ! "#1 of 3• Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1/RB521G-30www.mccsemi .comRevision: A 2011/01/01Micro Commercial Components2 of 3/Revision: A 2011/01/01Micro Commercial Componentswww.mccsemi .com3 of 34DevicePackingPart Number-TP Tape&Reel: 8Kpcs/ReelOrdering Information :***IMPORTANT NOTICE***Micro Commercial Components Corp. reserve s the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages.***LIFE SUPPORT***MCC's products are not authorized for use as critical components in life support devices or systems without the express writtenapproval of Micro Commercial Components Corporation.***CUSTOMER AWARENESS***Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on our web page cited below . Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine parts, have full traceability, meet MCC's quality standards for handling and storage. MCC will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. MCC is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors./分销商库存信息: MICRO-COMMERICAL-CO RB521G-30-TP。

RB520S30T1G;中文规格书,Datasheet资料

© Semiconductor Components Industries, LLC, 2011 August, 2011 − Rev. 101Publication Order Number:RB520S30T1/DRB520S30T1G,RB520S30T5GSchottky Barrier DiodeThese Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand−held and portable applications where space is limited.Features•Extremely Fast Switching Speed•Extremely Low Forward V oltage 0.6 V (max) @ I F = 200 mA •Low Reverse Current•ESD Rating:Class 3B per Human Body ModelClass C per Machine Model•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS CompliantMAXIMUM RATINGSRating Symbol Value Unit Reverse Voltage V R30Vdc Forward Current DC I F200mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICSCharacteristic Symbol Max UnitTotal Device Dissipation FR−5 Board, (Note 1) T A = 25°CDerate above 25°C P D2001.57mWmW/°CThermal Resistance, Junction−to−Ambient R q JA635°C/W Junction and Storage Temperature Range T J, T stg−55 to +150°C 1.FR−5 Minimum Pad.ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted) Characteristic SymbolMin Typ Max Unit Reverse Leakage(V R= 10 V)I R−− 1.0m AForward Voltage(I F= 200 mA)V F−−0.60Vdc30 VOLT SCHOTTKYBARRIER DIODE12SOD−523CASE 502MARKING DIAGRAM5J= Device CodeM= Date Code*G= Pb−Free Package*Date Code orientation position may vary dependingupon manufacturing location.(Note: Microdot may be in either location)Device Package Shipping†ORDERING INFORMATIONRB520S30T1G SOD−523(Pb−Free)4 mm Pitch3000/T ape & ReelRB520S30T5G SOD−523(Pb−Free)2 mm Pitch8000/T ape & Reel†For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our T ape and Reel Packaging SpecificationsBrochure, BRD8011/D.2Notes: 1. A 2.0 k W variable resistor adjusted for a Forward Current (I F ) of 10 mA.2. Input pulse is adjusted so I R(peak) is equal to 10 mA.3. t p » trrV Rtrt10%90%II OUTPUT PULSE(I F = I R = 10 mA; measuredat i R(REC) = 1 mA)INPUT SIGNALFigure 1. Recovery Time Equivalent Test Circuit200V F , FORWARD VOLTAGE (VOLTS)101.00.110V R , REVERSE VOLTAGE (VOLTS)1.00.10.010.001140V R , REVERSE VOLTAGE (VOLTS)124205101530Figure 2. Forward Voltage Figure 3. Leakage CurrentFigure 4. Total Capacitance100100025206810I R , R E V E R S E C U R R E N T (m A )I F , F O R W A R D C U R R E N T (m A )C T , T O T A L C A P A C I T A N C E (p F )100PACKAGE DIMENSIONSSOD −523CASE 502−01ISSUE ENOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.4.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-TRUSIONS, OR GATE BURRS.DIM MIN NOM MAX MILLIMETERS D 1.10 1.20 1.30E 0.700.800.90A 0.500.600.70b 0.250.300.35c 0.070.140.20L 0.30 REF H 1.50 1.60 1.70E SIDE VIEW2XBOTTOM VIEWL2XL20.150.200.25*For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*RECOMMENDED2X2XON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION分销商库存信息: ONSEMIRB520S30T1G。

LRB521CS-30T5G

LESHAN RADIO COMPANY, LTD.
SCHOTTKY BARRIER DIODE
Applications Low current rectification Features
Extremelysmall surface mounting type. (SOD923) Low VF High reliability. We declare that the material of product compliance with RoHS requirements.
IR DISPERSION MAP
Ct DISPERSION MAP
20
10 Ifsm
10 Ifsm 8.3ms 8.3ms 1cyc
PEAK SURGE FORWARD CURRENT:IFSM(A)
PEAK SURGE FORWARD CURRENT:IFSM(A)
PEAK SURGE FORWARD CURRENT:IFSM(A)
75
100
125
CASE TEMPARATURE:Tc(℃) Derating Curveﾞ(Io-Tc)
3/4
LESHAN RADIO COMPANY, LTD.
LRB521S-30T5G SOD -923
D
−X− −Y− E
1
2
b
2X
0.08 (0.0032) X Y A
MILLIMETERS DIM MIN NOM MAX A 0.34 0.39 0.43 b 0.15 0.20 0.25 c 0.07 0.12 0.17 D 0.75 0.80 0.85 E 0.55 0.60 0.65 HE 0.95 1.00 1.05 L 0.05 0.10 0.15

ROHM RB521CS-30FH

RB521CS-30FHSchottky Barrier Diode(AEC-Q101 qualified)Data sheet ●OutlineV R30V I o100mA　I FSM0.5A　 ●Features●Inner CircuitHigh reliabilitySmall mold typeSuper Low V F●Application●Packaging SpecificationsSmall current rectification Packing Embossed T apeReel Size(mm)180T aping Width(mm)8●Structure Basic Ordering Unit(pcs)8000 Epitaxial planar T aping Code T2RAM arking F●Absolute Maximum Ratings (T a = 25ºC unless otherwise stated)Parameter Symbol Conditions Limits Unit Reverse voltage V R Rev erse direct v oltage30V100mA A verage rectified forward current I o Glass epoxy m ounted、60H z half sinwaveform、resistive load0.5A Peak forward surge current I FSM60H z half sin waveform、N on-repetitive、one cycle、T a=25℃Junction temperature T j-150℃Storage temperature T stg--40 ～ 150℃ ●Characteristics(T a = 25ºC unless otherwise stated)Parameter Symbol Conditions Min.Typ.Max.Unit Forward voltage V F I F=10mA--0.35V Reverse current I R V R=10V--10μA ※Caution：static electricityAttention●Dimensions(SOD-923 VMN2)●T aping (Unit:mm)NoticePrecaution on using ROHM Products1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications.2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductorproducts can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, whicha failure or malfunction of our Products may cause. The following are examples of safety measures:[a] Installation of protection circuits or other protective devices to improve system safety[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,H2S, NH3, SO2, and NO2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items[f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue offlux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaningresidue after soldering[h] Use of the Products in places subject to dew condensation4. The Products are not subject to radiation-proof design.5. Please verify and confirm characteristics of the final or mounted products in using the Products.6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability.7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use inthe range that does not exceed the maximum junction temperature.8. Confirm that operation temperature is within the specified range described in the product specification.9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.Precaution for Mounting / Circuit board design1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect productperformance and reliability.2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mustbe used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance.For details, please refer to ROHM Mounting specificationPrecautions Regarding Application Examples and External Circuits1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of thecharacteristics of the Products and external components, including transient characteristics, as well as static characteristics.2. You agree that application notes, reference designs, and associated data and information contained in this documentare presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.Precaution for ElectrostaticThis Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).Precaution for Storage / Transportation1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2[b] the temperature or humidity exceeds those recommended by ROHM[c] the Products are exposed to direct sunshine or condensation[d] the Products are exposed to high Electrostatic2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time periodmay be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period.3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leadsmay occur due to excessive stress applied when dropping of a carton.4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products ofwhich storage time is exceeding the recommended storage time period.Precaution for Product LabelA two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.Precaution for DispositionWhen disposing Products please dispose them properly using an authorized industry waste company.Precaution for Foreign Exchange and Foreign Trade actSince concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export.Precaution Regarding Intellectual Property Rights1. All information and data including but not limited to application example contained in this document is for referenceonly. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data.2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of theProducts with other articles such as components, circuits, systems or external equipment (including software).3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or anythird parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein.Other Precaution1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior writtenconsent of ROHM.3. In no event shall you use in any way whatsoever the Products and the related technical information contained in theProducts or this document for any military purposes, including but not limited to, the development of mass-destruction weapons.4. The proper names of companies or products described in this document are trademarks or registered trademarks ofROHM, its affiliated companies or third parties.Datasheet General Precaution1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document.2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative.3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that allinformation contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.。

RB521CS-30T肖特基二极管规格书

0.90 0.40
0.30
DIMENSIONS: MILLIMETERS

Rev.O 4/4
IR DISPERSION MAP
Ct DISPERSION MAP
20
10 Ifsm
10 Ifsm 8.3ms 8.3ms 1cyc
PEAK SURGE FORWARD CURRENT:IFSM(A)
PEAK SURGE FORWARD CURRENT:IFSM(A)
PEAK SURGE FORWARD CURRENT:IFSM(A)
D=1/2
0.06 0.04 0.02 0
0.06 0.04 0.02 0 D=1/2 DC Sin(θ＝180)
100
Mounted on epoxy board IM=10mA IF=100mA
1ms
time
300us
10 0.001
0.1
10
1000
0
TIME:t(s) Rth-t CHARACTERISTICS
Ta=25℃ IF=10mA n=30pcs
25 20 15 10 AVE:2.017uA 5 0
Ta=25℃ VR=10V n=30pcs
19 18 17 16 15 14 13 12 11 10 AVE:17.34pF
Ta=25℃ f=1MHz VR=0V n=10pcs
AVE:270.2mV
VF DISPERSION MAP
1cyc 8.3ms
15
Ifsm t
10
5
5
5 AVE:3.90A 0
0 1 IFSM DISRESION MAP 10 NUMBER OF CYCLES IFSM-CYCLE CHARACTERISTICS 100

二三极管规格书

达林顿管
2SD1626 2SD2170 BCV26 BCV27 BCV46 BST50 BST51 M M B TA 1 3 LT 1 M M B TA 1 4 LT 1 M M B TA 6 3 LT 1 M M B TA 6 4 LT 1 M M B TA 9 2 M M B TA 4 2 MMBT4403 MMBT4401 M M B TA 5 5 M M B TA 5 6 MMBT9013
复合三极管
1MD3A 1MX1 1MX2 1MX3 1MX4 1MX5 1MX6 1MX7 1MX8 1MX6 1MZ1A UMX1N UMX2N Rn1502 UMG6 UMG8 Xn2501 Xn4300 Xn4401 Xn4501 Xn4601 ……
带电阻三极管
D TA 11 4 E K A D TA 11 4 T K A D TA 1 4 3 E K A D TA 1 4 3 T K A D TA 1 4 3 X K A D TA 1 4 4 E K A D TA 1 4 4 T K A D TA 1 4 4 K X A D T C 11 4 E K A D T C 11 4 T K A D T C 11 4 E K A OTC124EKA DTK124TKA OTK143EKA DTK143TKA DTK143XKA DTK144EKA DTK144TKA DTK144XKA D TA 1 2 4 E K A D TA 1 2 4 T K A D TA 1 2 4 X K A D T B 11 4 E K A OTB123YKA O T D 11 4 E K A DTD123TKA DTD143TKA ……
PHILIPS
B B… B C V… B F… P M B T… B Z X 8 4… B A T… 系列

NuMaker-emWin-RDK-N9H30 用户手册说明书

ARM® ARM926EL-S Based32-bit MicroprocessorNuMaker-emWin-RDK-N9H30User ManualNUMAKER-EMWIN-RDK-N9H30 USER MANUALThe information described in this document is the exclusive intellectual property ofNuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton.Nuvoton is providing this document only for reference purposes of NuMicro microprocessor based systemdesign. Nuvoton assumes no responsibility for errors or omissions.All data and specifications are subject to change without notice.For additional information or questions, please contact: Nuvoton Technology Corporation.Table of Contents1Overview (3)2Board Feature List (4)3Function Description (5)System Block Diagram (5)System Power Scheme (6)I/O or Jumper Description (6)3.3.1Power-on Setting (6)3.3.2SD Connector (7)3.3.3UART Interfaces (7)3.3.4USB Port (8)3.3.5RS485 Interface (9)3.3.6CAN Interface (9)3.3.7Ethernet Port (9)3.3.8JTAG Port (10)4NuMaker-emWin-RDK-N9H30 Demo Board Schematic (11)Main Block (11)Flash Memory (12)NUMAKER-EMWIN-RDK-N9H30 USER MANUALLCD Interface (13)N9H30F61I (14)Power (15)UART (16)USB (17)ETH_PHY&CAN (18)5Revision History (19)1 OverviewThe NuMaker-emWin-RDK-N9H30 demo board is N9H30 series product. Users can use theboard to develop and verify the emWin application program easily.The N9H30 series embedded the ARM®926 core for HMI applications which need highcomputing power and rich communication interfaces. The CPU can run up to 300 MHz andequipped with USB2.0 high speed device, USB2.0 high speed host, Ethernet interfaces and otherrich peripherals, such as LCD, NAND, SD, ADC, UART, SPI, I²C, I²S, CAN, RTC…etc.NUMAKER-EMWIN-RDK-N9H30 USER MANUALFigure 1-1 NuMaker-emWin-RDK-N9H30 Demo Board2 Board Feature List1. Adopted Nuvoton ARM926EJS-based MPU N9H30F61I, it can run up to 300MHz.2. NAND Flash used Winbond W29N01GV 128MB with 8-bit data bus width.3. SPI Flash used W25Q128FVSG 16MB.4. Boot selection by NAND or SPI or USB.5. One DB9 RS232 port with N9H30 UART0 for debugging.6. One DB9 RS232 port with N9H30 UART2 for user application.7. Installed SN65HVD230 transceiver for CAN bus communication.8. Installed MAX3485 transceiver for RS485 device connection.9. USB supports both HS USB2.0 device with micro USB connector and HS USB 2.0 host withtype-A connector.10. Provided one Micro-SD/TF card slot for data storage with SD memory card.11. Used 7” TFT LCD and embedded that resistive type touch panel.12. Reserved an external coin-cell socket for RTC power backup with CR2032 battery.13. Provided one10/100Mb Ethernet RJ45 port.14. Provided one buzzer device for user application.15. JTAG interface is reserved for software development advanced.16. System powered could be supplied by DC-5V adaptor or USB VBUS. NUMAKER-EMWIN-RDK-N9H30 USER MANUAL3 Function DescriptionSystem Block DiagramNUMAKER-EMWIN-RDK-N9H30 USER MANUALSystem Power Scheme NUMAKER-EMWIN-RDK-N9H30 USER MANUALI/O or Jumper Description3.3.1 Power-on SettingSW1 Function Description:NuMaker-emWin-RDK-N9H30 provided system program code booting source from NAND Flash,SPI-NOR Flash or USB. In the board we have programmed a sample emWin code to NANDflash for demonstration.About USB booting purpose is for Flash memory programming through the NuWriter of PC utilitytool, regarding the NuWriter operation please refer the user manual to get for detail.NUMAKER-EMWIN-RDK-N9H30 USER MANUALSW1-1 SW1-2Boot FromON ON booting from USB for PC communicationON OFF booting from NAND Flash OFF OFFbooting from SPI Flash3.3.2 SD ConnectorJP7: NuMaker-emWin-RDK-N9H30 provided a micro SD connector for user use what program accesses or data storage.Note. N9H30 cannot support system booting.3.3.3 UART Interfaces●CON5: One DB-9 connector for RS232 communication, the UART signals are from N9H30UART0 TXD and RXD interfaces and through the RS232 transceiver, SP3232EEN. This port isdedicated for message debugging.●CON4: One DB-9 connector for RS232 communication, the UART signals are from N9H30UART2 TXD and RXD interfaces and through the RS232 transceiver, SP3232EEN. This port isreserved for user application.3.3.4 USB Port NUMAKER-EMWIN-RDK-N9H30 USER MANUAL●CON1: This is a Micro USB connector, it is for PC communication and the signals are fromN9H30 USB port-0●CON2: This is a Type-A USB HOST connector, it is for USB devices connection and the signalsare from N9H30 USB port-1Note. CON1 VBUS can power supplied for system if connected with PC or notebook.3.3.5 RS485 Interface●J5: NuMaker-emWin-RDK-N9H30 provided a two-pin terminal connector with 3.5mm pitch forRS485 device connection.Note. MAX3485 is RS485 (half-duplex communication) transceivers and built in to NuMaker-emWin-RDK-N9H30 demo board already.3.3.6 CAN InterfaceNUMAKER-EMWIN-RDK-N9H30 USER MANUAL●CON7: NuMaker-emWin-RDK-N9H30 provided a two-pin terminal connector with3.5mm pitch forCAN bus device communication with N9H30 CAN0 port.Note. CAN transceivers,SN65HVD230 have built in to NuMaker-emWin-RDK-N9H30 demoboard already.3.3.7 Ethernet Port●CON6: NuMaker-emWin-RDK-N9H30 provided a standard RJ-45 port for 10M/100M Ethernetcommunication.Note. NuMaker-emWin-RDK-N9H30 has built in the RMII-PHY, IC+ IP101GR on board already.3.3.8 JTAG PortJ2: NuMaker-emWin-RDK-N9H30 demo board provided one male header x6 connector with pitch NUMAKER-EMWIN-RDK-N9H30 USER MANUAL2.54mm for N9H30 JTAG signals; user can make that wiring connection with Keil- ICE forsoftware development advanced.NUMAKER-EMWIN-RDK-N9H30 USER MANUAL4 NuMaker-emWin-RDK-N9H30 Demo Board SchematicMain BlockLCDLCD DGND VDD33LVSYNC LHSYNC LCD_B[7:0]LCD_G[7:0]LCD_R[7:0]LCD_CLK Y+X-Y-X+PWM VDD5V N9H30F61IN9H30F61I485_TXEN 485_TXD 485_RXD UART0_TX UART0_RX 232TXD 232RXDPH0USB0_DM USB0_DP DP1DN1RTC_XO RTC_XI nRESET 12M_XO 12M_XI VDD18VDD12VDD33DGNDLVSYNC LHSYNC LCD_B[7:0]LCD_G[7:0]LCD_R[7:0]LCD_CLKSM_D[7:0]SM_RBn SM_REn SM_CS0n SM_CLE SM_ALE SM_WEn SM_WPn SPICS SPICLK SPIWp/D2SPIDo/D0SPIDi/D1SPIHOLD/D3RTCVD Y+Y-X+X-PWM SDCd SDCmd SDD[3:0]SDCLK PHY_MDIO PHY_MDC PHY_TXEN PHY_TXD0PHY_TXD1PHY_RXD0PHY_RXD1PHY_CRSDV PHY_RXERR MAC_REFCLKCAN_TX0CAN_RX0PHY_RSTPHY_RSTFLASHFlashSM_D[7:0]SM_RBn SM_REn SM_CS0n SM_CLE SM_ALE SM_WEn SM_WPnVDD33DGNDSPICS SPICLK SPIWp/D2SPIDo/D0SPIDi/D1SPIHOLD/D3SDD[3:0]SDCmd SDCd SDCLK UARTUART485_RXD 485_TXD 485_TXEN VDD33232RXD232TXD DGND UART0_RXUART0_TX FGND VDD5VVDD5VIN USBUSB USB0_DM USB0_DPPH0VDD5VIN FGNDDN1DP1POWERPowerVDD5VVDD33VDD12VDD18RTC_XO RTC_XI 12M_XI 12M_XO nRESETDGNDRTCVD PWM 485_TXEN 485_TXD 485_RXD UART0_TX UART0_RX 232TXD TitleSize Document Number Rev Date:SheetofMAIN_BLOCK1.0N9H30F51I_HMI_DEMOB18Tuesday , Nov ember 27, 2018232RXDPH0USB0_DM USB0_DP DP1DN1RTC_XO RTC_XI nRESET 12M_XO 12M_XI VDD18VDD12VDD33VDD33DGNDDGNDVDD5VIN FGND VDD5VFGNDVDD5VIN VDD5VLVSYNC LHSYNC LCD_B[7:0]VDD5VLCD_G[7:0]LCD_R[7:0]LCD_CLK DGND VDD33SDCd SM_D[7:0]SDCmd SM_RBn SM_REn SDD[3:0]SM_CS0n SM_CLE SM_ALE SM_WEn SM_WPn SDCLK ETH_PHY&CANETH_PHY&CANPHY_RXD0PHY_RXD1PHY_CRSDV PHY_MDIO PHY_MDC PHY_RXERRMAC_REFCLK PHY_TXEN PHY_TXD0PHY_TXD1VDD33DGNDCAN_TX0CAN_RX0FGND PHY_RSTPHY_MDIO SPICS PHY_MDC SPICLK PHY_TXEN SPIWp/D2SPIDo/D0SPIDi/D1PHY_TXD1PHY_TXD0PHY_RXD1PHY_RXD0PHY_CRSDV PHY_RXERR MAC_REFCLK CAN_TX0CAN_RX0SPIHOLD/D3DGNDVDD33RTCVD Y+VDD33DGND FGNDY-X+X-NUMAKER-EMWIN-RDK-N9H30 USER MANUALFlash MemoryNAND FLASHVDD33VDD33SM_D[7:0]VDD33SM_D[7:0]U1W29N01GVNC 1NC 2NC 3NC 4NC 5NC 6R/B 7RE 8CE 9NC 10NC 11Vcc 12Vss 13NC 14NC 15CLE 16ALE 17WE 18WP 19NC 20NC 21NC 22NC 48NC 47NC 46NC 45I/O744I/O643I/O542I/O441NC 40NC 39NC 38Vcc 37Vss 36NC 35NC 34NC 33I/O332I/O231I/O130I/O029NC 28NC 27NC 23NC 24NC 26NC25DGND R110KSM_D7SM_RBn SM_D6SM_REn SM _RBn SM_CS0nSM_REn SM_D5SM_CS0nSM_D4SM_CLE SM_ALE VDD33SM_WEn SM_ALE SM_CLE VDD33SM_WPnSM_WEn SM_D3R1410K SM_WPnSM_D2SM_D1R310K/N O PSM_D0VDD33VDD33C B10.1uFDGNDTitleSize Document Number Rev Date:SheetofFlash1.0N9H30F51I_HMI_DEMOA 38Tuesday , Nov ember 27, 2018SPICS SPICLK SPIWp/D2SPIDo/D0SPIDi/D1SPIHOLD/D3C210UF/25V C0805U2SRV05-4SOT23-6CH46CH23CH34Vn 2Vp 5CH11U3SRV05-4SOT23-6CH46CH23CH34Vn 2Vp 5CH11R2SDVD33VDD33DAT3C11UFC0603VDD33DGNDCB20.1uFSDD[3:0]SPI FalshR1810K JP7B8502A-13SB-HPA (T-Flash Card)DAT21DAT32CMD 3VDD 4CLK 5VSS 6DAT07DAT18CD9GND10GND 11GND 12GND 13R1910KSDD[3:0]R2010KR647SDD2R747DGND SDCmdSDD3DAT2R847U5W25Q128/CS 1Do/D12Wp/D23GND 4Di/D05CLK 6Hld/D37VCC 8SDVD33SDCmdSPICS CMD SPIHOLD/D3SPIDi/D1R1047SPIWp/D2SDCLKSPIDo/D0SPICLK CLK SDVSS R1347C3NC SDD0R1547DAT0L1600次@100M H ZL0603SDCdSDD1R1647DAT1SDVSSCDSDCdVDD33VDD33R1710KR510K DGNDVDD33R910KVDD33R410K R110DGND TF CARDVDD33R1210K SDCLKSDVD33DAT2CLKSDVSSDAT3CMDCDSDVD33DAT1SDVSS DAT0LCD InterfaceNUMAKER-EMWIN-RDK-N9H30 USER MANUALN9H30F61IU8N9H30F61I00000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000NUMAKER-EMWIN-RDK-N9H30 USER MANUALPowerTitleSize Document Number Rev Date:SheetofPower1.0N9H30F51I_HMI_DEMO A 68Tuesday , Nov ember 27, 2018VDD5VL10 4.7uHVDD33U9ZT7103TTSOT-25EN1GND 2SW 3Vin 4FB5C32470pFCB220.1uFDGND R50680KDGNDDGND R52150K32768H z C r y s t a l12M H z C r y s t a lDGNDDGNDVDD5VX1TXC-9H T9 SMD 32.768KHz 30ppmR5310KRTC_XI RTC_XOC3815pFC3915pFVDD5VL12 4.7uHU11ZT7103TTSOT-25EN1GND 2SW 3Vin 4FB5DGNDDGNDC361nFDGND R54120KC40NC DGNDR55120KDGND R561MDGND12M_XI12M_XO DGNDX212MHz CRYSXIN1GND 2GND 4XOUT 3VDD5VC4215pFR5710KC4515pFDGND VDD5VDGNDL13 4.7uHDGNDU12ZT7103TTSOT-25EN1GND 2SW 3Vin 4FB5DGNDC441nFC46NCDGND R58200KDGNDR59100KDGNDDGNDDGNDC3510UF/25V C0805C4110UF/25V C0805C4710UF/25V C0805C3710UF/25V C0805C4310UF/25V C0805VDD12JP8SIP/2P SW_PB2_B1_SMD12VDD18C3410UF/25V C0805VDD5VVDD33DGNDVDD12VDD18L18600次@100MHZL0603RTC_XIRTC_XO12M_XI12M_XOU10TLV809GND1/RESET 2VDD3R E S E TC 330.1uFVDD33R51R490DGNDL11600次@100MHZL0603nRESETnRESETDGNDRTCVDD12RB521S-3012VDD33D13RB521S-3012BT1CR2032BAT\CR2032-4-2\smdCB230.1uF DGNDDGNDRTCVDD9SMAJ5.0CAD10SMAJ5.0CAD11SMAJ5.0CALED1GREEN LED 12R601KVDD33DGNDNUMAKER-EMWIN-RDK-N9H30 USER MANUALUARTRS485RS232000000000000RS23200000NUMAKER-EMWIN-RDK-N9H30 USER MANUALUSBU S B 0 D e v i c eR6920K USB0_DMR704.7USB0_DPR714.7PH0UDO1UDO0PH0FGNDR7239KFGNDFGNDVDD5VINTitleSize Document Number Rev Date:SheetofUSB1.0N9H30F51I_HMI_DEMOA 88Tuesday , Nov ember 27, 2018D1-D1+FGNDFGNDVDD5VINVDD5VIN CON1USB MICRO-AB RECEP.MICRO_USB_AB_LSVBUS 1D-2D+3GND5ID 4Shield 6Shield 7Shield 8Shield9C 751uFL15600次@100MHZL0603D161N4148VBUSVDD5VINUSB HostL16600次@100M H Z 12CON2USB TYPE-A B4P_ATYPEVBUS 1D-2D+3GND4Shield 5Shield6VBUS1DN1R73 4.7DN1C 570.1uFDP1R74 4.7DP1L17600次@100M H Z12FGND FGNDC5610UF/25V C0805L14600次@100M H Z 12U16SRV05-4SOT23-6C H 46C H 23C H 34V n 2V p 5C H 11U17SRV05-4SOT23-6C H 46C H 23C H 34V n 2V p 5C H 11F1FUSE(6V/1A)NUMAKER-EMWIN-RDK-N9H30 USER MANUALETH_PHY&CANR940R0603VDD33DGND U20SN65HVD230SO-8D 1GND 2VCC 3R4Rs 8CANH 7CANL 6Vref5CAN_TX0DGND CAN_RX0CB270.1uF C0603DGNDCON7SIP\2P\5MM SIP/2P_3.5MM12CAN_TX0CAN_RX0R96120R0603CAN0H CAN0L50MClkiPHY_RST Phy AD3CRS TitleSize Document Number Rev Date:SheetofETH_PHY&CAN1.0N9H30F51I_HMI_DEMOB 28Tuesday , Nov ember 27, 2018CON6RJ-45 8P8C_LED R/ARJ45\8P\JA\LEDTX+1TX-2RX+3NC 4NC 5RX-6NC 7NC8Shield 13Shield 14LED-9LED+10LED-11LED+12R841M R0603CT210uFR8975R78Col Col C760.01uF/2KVCK05CRSCT310uFC657pF C0603C640.1uFR9075R795.1K R0603R835.1K R0603C637pF C0603R8210K R0603C62N.C.C0603R850R0603R9275C670.1uFC660.01uF U19TS8121CTX+16TX-14NC 13TD-3TD+1RD+6RD-8NC5RX-9RX+11CT 2NC 4CT 7CT 10NC12CT 15R766.19K +/-1%R0603U18IP101GR TxEr/FxSD 1Xi 2Xo 3Col/RMII 4TxEn 5TxD36TxD27TxD18TxD09TxClk/50MClki 10LED0/Phy AD011LED3/Phy AD312IOVDD 13RxClk/50M_Clko 14RxD315RxD216TestOn 24MDIO 23MDC 22RxEr/Int3221CRS/LEDMod 20RxDV/CRS_DV 19RxD018RxD117nRst 32AVD3331MDiTp 30MDiTn 29RegOut 28MDiRp 27MDiRn 26Iset 25R88330R0603RMii0TxD1RMii0TxD0RMii0MDC R9175RMii0RxD1RMii0RxD0CT110uFRMii0MDio RMiiRxErr RMii0CRSDV MDI_TN MDI_TP RMii0TxEn C680.01uFMDI_RP MDI_RNX325MHz CRYSXIN1GND 2GND 4XOUT 3EthX1R95 5.1KCB250.1uF R770R0603CT410uF C690.01uF/2KVR86330R0603EthX0R8110K R0603EthX1R805.1K R0603EthX0R935.1KCB260.1uF R870R0603PHY_RXD0Phy AD0PHY_MDIO PHY_CRSDV PHY_RXD1MAC_REFCLKPHY_RXERR PHY_MDCPHY_TXD0PHY_TXEN DGNDVDD33PHY_TXD1Phy AVD33PHY_RSTRegOut DGNDPhy IOVD33RegOutDGNDDGNDDGNDDGND DGNDDGNDVDD33DGNDPhy AVD33Phy IOVD33DGNDDGND Phy IOVD33DGNDVDD33VDD33DGNDDGNDFGNDDGNDFGNDDGNDDGND RMii0MDio RMiiRxErr DGND FGND VDD33VDD33DGNDFGND50MClki RMii0Ref Clk FGNDR10210K R0603PHY_RST RMii0CRSDV C771uF C0603DGNDRX+TX-RX-TX+MDI_TNMDI_TP Phy AD3Phy AD3MDI_RP MDI_RNE t h e r n e t T P o r tPhy AD0Phy AD05 Revision HistoryDate Revision Description2018.10.03 1.00 1. Initially.2018.11.27 2.00 1. PCB version 2.1, supports Ethernet and CAN2021.03.26 2.01 1. Rename NuMaker-emWin-RDK-N9H30Important NoticeNuvoton Products are neither intended nor warranted for usage in systems or equipment, any malfunction or failure of which may cause loss of human life, bodily injury or severe property damage. Such applications are deemed, “Insecure Usage”.Insecure usage includes, but is not limited to: equipment for surgical implementation, atomic energy control instruments, airplane or spaceship instruments, the control or operation of dynamic, brake or safety systems designed for vehicular use, traffic signal instruments, all types of safety devices, and other applications intended to support or sustain life.All Insecure Usage shall be made at customer’s risk, and in the event that third parties layclaimsto Nuvoton as a result of customer’s Insecure Usage, custome r shall indemnify thedamages and liabilities thus incurred by Nuvoton.NUMAKER-EMWIN-RDK-N9H30 USER MANUAL。

RB520CS30L,315;中文规格书,Datasheet资料

1.2 Features and benefits
Average forward current: IF(AV) ≤ 100 mA Reverse voltage: VR ≤ 30 V Low forward voltage: VF ≤ 450 mV Low reverse current: IR ≤ 0.5 μA AEC-Q101 qualified Leadless ultra small SMD plastic package
current
tp ≤ 8.3 ms
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -
[2] -
[4][3] [4][1] -
[4][5] -
Max Unit
30
V
100 mA
100 mA
3
A
315 mW 565 mW 865 mW
RB520CS30L
Product data sheet
Type number
Package
Name
Description
RB520CS30L
-
leadless ultra small plastic package; 2 terminals; body 1.0 × 0.6 × 0.5 mm
Version SOD882
4. Marking
Table 4. Marking codes Type number RB520CS30L
Conditions square wave; δ = 0.5; f = 20 kHz
Tamb ≤ 135 °C Tsp ≤ 145 °C n Typ Max Unit

FAIRCHILD RB521S30 Schottky Barrier Diodes 数据手册

•Green Mold CompoundAbsolute Maximum Ratings * T A =25°C unless otherwise noted* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.Thermal Characteristics* Device mounted on FR-4 PCB minimum land pad.Electrical Characteristics T A =25°C unless otherwise notedSymbolParameterValueUnitsV RRM Maximum Repetitive Reverse Voltage 30V I F(AV)Average Rectified Forward Current 200mA T J Operating Junction Temperature Range -55 to +125°C T STGStorage Temperature Range-55 to +125°CSymbolParameterValueUnitsP D Total Device Dissipation (T C =25°C)200mW R θJAThermal Resistance, Junction to Ambient500°C/WSymbolParameterTest ConditionMin.Typ.Max.UnitsBV R Breakdown Voltage I R =500μA 30V I R Reverse Leakage Current V R =10V 30μA V FForward VoltageI F =200mA0.5VSOD-523FBand Indicates CathodeRB521S30 Marking : 2BThe following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is notAccuPower¥Auto-SPM¥Build it Now¥CorePLUS¥CorePOWER¥CROSSVOLT¥CTL™Current Transfer Logic™ EcoSPARK®EfficentMax™ EZSWITCH™*™*®Fairchild®Fairchild Semiconductor®FACT Quiet Series™ FACT®FAST®FastvCore¥FETBench¥FlashWriter®*FPS¥F-PFS¥FRFET®Global Power Resource SMGreen FPS¥Green FPS¥ e-Series¥G max™GTO¥IntelliMAX¥ISOPLANAR¥MegaBuck™MICROCOUPLER¥MicroFET¥MicroPak¥MillerDrive™MotionMax™Motion-SPM™OPTOLOGIC®OPTOPLANAR®®PDP SPM™Power-SPM¥PowerTrenchPowerXS™Programmable Active Droop¥QFET®QS¥Quiet Series¥RapidConfigure¥™Saving our world, 1mW/W/kW at a time™SmartMax™SMART START¥SPM®STEALTH™SuperFET¥SuperSOT¥-3SuperSOT¥-6SuperSOT¥-8SupreMOS™SyncFET™Sync-Lock™®*The Power FranchiseTinyBoost¥TinyBuck¥TinyCalc¥TinyLogic®TINYOPTO¥TinyPower¥TinyPWM¥TinyWire¥TriFault Detect¥TRUECURRENT¥*P SerDes¥UHC®Ultra FRFET¥UniFET¥VCX¥VisualMax¥XS™* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systems which, (a) areintended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, orsystem whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.ANTI-COUNTERFEITING POLICYFairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, , under Sales Support.Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.PRODUCT STATUS DEFINITIONSDefinition of TermsDatasheet Identification Product Status Definition。

RBK30 网络产品说明书

Data SheetRBK30Whole Home AC2200 Tri-band WiFi SystemOverviewOrbi ™ is the simplest and smartest way to enjoy high-speed WiFi in every corner of your home. This Orbi WiFi System kit of two covers homes up to 3,500 square feet with strong WiFi signals. Innovative Tri-band WiFi helps maximize the Internet speeds available in your home, even as more devices connect. Enjoy better WiFi. Everywhere.FeaturesYour Home. Covered.This kit of two covers up to a 3,500 sq ft † home with high-performance AC2200 WiFi.Simple & Secure.Use the Orbi app or a web browser to create secure whole home WiFi in minutes. With no accounts to set up.Less Buffering and Dead Zones.Tri-band Mesh WiFi delivers powerful, seamless WiFi for whole home coverage.One WiFi Network.Enjoy the convenience of a single WiFi name for your whole home.Manage Your Kids’ Screen Time.Circle® Smart Parental Controls let you easily manage content & time online on any device.1Data SheetRBK30Whole Home AC2200 Tri-band WiFi SystemHouse DiagramF A ST L AN E 3 T EC H N O LO G YOrbi RouterOrbi Wall Plug Satellite3,500 Square Feet of Orbi WiFi CoverageInternet plan and devices that support these speeds are required.1Internet plan and devices that support these speeds are required.Simple setup from your smartphone or tablet.Use the Orbi app to set up and manage your network. To ﬁnd the app, scan one of the following QR codes or search for NETGEAR Orbi in the Apple App Store or Google Play Store.Data SheetRBK30Whole Home AC2200 Tri-band WiFi SystemOrbi Router (RBR40)Sync button Power buttonPlugs into existing modemPlugs into Ethernet-enabled devicesOrbi Wall Plug Satellite (RBW30)Data SheetRBK30Whole Home AC2200 Tri-band WiFi SystemTechnical Specifications• O rbi AC2200 Router & AC2200 Wall Plug Satellite (866+866+400Mbps)†• Simultaneous Tri-band WiFi - R adio 1: IEEE ® 802.11b/g/n 2.4GHz–256QAM supportThis product comes with a limited warranty that is valid only if purchased from a NETGEAR authorized reseller.* 90-day complimentary technical support following purchase from a NETGEAR authorized reseller.†M aximum wireless signal range derived from IEEE standard 802.11 specifications. Actual data throughput and data over distance will vary. Network conditions and environmental factors, including volume of network traffic, building material and construction, and network overhead, result in lower actual data throughput rate and wireless coverage.1Internet plan and devices that support these speeds are required.For indoor use only.For regulatory compliance information, visit /about/regulatoryNETGEAR, the NETGEAR Logo, FastLane3, and Orbi are trademarks of NETGEAR, Inc. Apple and the Apple logo are trademarks of Apple Inc., registered in the U.S. and other countries. App Store is a service mark of Apple Inc., registered in the U.S. and other countries. Google Play and the Google Play logo are trademarks of Google Inc. ©2020 NETGEAR, Inc. NETGEAR, Inc. 350 E. Plumeria Drive, San Jose, CA 95134-1911 USA, /supportD-RBK30-4Physical Specifications• Orbi Router (RBR40) - D imensions: 6.4 x 3.1 x 8.0 in - W eight: 1.65 lb• Orbi Wall Plug Satellite (RBW30) - D imensions: 3.3 x 3.0 x 6.34 in - W eight: 0.67 lbWhat’s In the Box?• One (1) Orbi Router (RBR40)• One (1) Orbi Wall Plug Satellite (RBW30)• One (1) 2m Ethernet cable• One (1) 12V/2.5A power adapter • Quick start guideWhat Do I Need for Orbi to Work?• High-speed Internet connection• Connect to existing modem or gateway- R adio 2: IEEE ® 802.11a/n/ac 5GHz–256QAM support - R adio 3: IEEE ® 802.11a/n/ac 5GHz–256QAM support • T x/Rx: 2x2 (2.4GHz) + 2x2 (5GHz) + 2x2 (5GHz) dedicated backhaul • I EEER 802.11a/b/g/n/ac • M U-MIMO capable for simultaneous data streaming • I mplicit & Explicit Beamforming for 2.4GHz & 5GHz bands • W iFi Security – WPA/PSK2• P rocessor – Router & Satellite - P owerful Quad-Core 710MHz processor each • M emory - R outer: 4GB Flash and 512MB RAM - S atellite: 256MB Flash and RAM • A ntenna - R outer & Satellite: Four (4) high performanceinternal antennas each • V oice Control - A mazon Alexa ™ - T he Google © Assistant • C ircle ® Smart Parental Controls manage content and time online for all your devices. Learn more at /circle。

RB521-30

产品规格书PRODUCTS SPECIFICATION机种名称(Model)：LW-FP32-CM012AG 32" LCDTV POWER SUPPLY 32" 液晶电视电源（VER：1.3）设计：王善富审核：宋开海确认：张其宇深圳市万源来电子有限公司 SHENZHEN WANYUANLAI ELEC. CO., LTD.地址：深圳市高新技术工业园中区深南花园 A 座 21AADD：21A/F,Building A,ShenNan Garden,Shenzhen Science & Technology Industry ParkTEL：26639508 26505158 E-mail:WANYUANLAI@FAX：26553187WYL产品规格书型号：LW-FP32-CM012AGTABLE OF CONTENTS1. ELECTRIC REQUIREMENT（电气要求） 1.1 INPUT CHARACTERISTICS（输入特性） 1.2 OUTPUT CHARACTERISTICS（输出特性） 1.2.1 OUTPUT VOLTAGE & CURRENT’S REGULATION（输出电压电流调整率） 1.2.2 DC OUTPUT RIPPLE & NOISE （输出纹波和噪声） 1.2.3 OUTPUT TRENDS RESPONSE （输出动态响应） 1.2.4 DC OUTPUT HOLD-UP TIME （输出保持时间） 1.2.5 DC OUTPUT OVERSHOOTING AT TURN ON & TURN OFF（输出超调） 1.2.6 DC OUTPUT VOLTAGE RISE TIME（输出上升时间） 1.3 REMOTE ON/OFF CONTROL（遥控功能） 1.4 PROTECTION CHARACTERISTICS(保护特征) 1.4.1 SHORT CIRCUIT PROTECTION(短路保护) 1.4.2 OVER VOLTAGE PROTECTION(过压保护) 1.4.3 OVER CURRENT PROTECTION（过流保护） 1.4.4 RESET AFTER SHUTDOWN（保护功能复位） 2.ISOLATION (绝缘性能) 2.1 LEAKAGE CURRENT/ ISOLATION IMPEDANCE(漏电流/绝缘阻抗) 2.2 DIELECTRIC STRENGTH：（HIPOT）(绝缘耐压) 3.SAFETY（安全规格） 3.1 LIGHTNING SURGE（雷击） 3.2 ELECTRON STATIC DISCHARGE（ESD）（静电） 3.3 EMC（电磁兼容） 3.4 SAFETY REQUIREMENT（安规要求） 4. ENVIRONMENT REQUIREMENT (环境要求) 5. MECHANISM DIMENSION(机械尺寸) 6. INPUT AC SOCKET TYPE（输入AC插座） 7. OUTPUT DC CONNECTION(输出DC连接器) 8. POWER SUPPLY INSTALLATION DIMENSION（安装尺寸） 1WYL产品规格书型号：LW-FP32-CM012AG1. ELECTRIC REQUIREMENT：（电气要求） 1.1 INPUT CHARACTERISTICS（输入特性） Item (主题) Rated Input Voltage 额定输入电压 Input Voltage Range 输入电压范围 Input Frequency Range 输入频率范围 Input Current 输入电流 Efficiency 效率 Standby Power Consumption 待机功耗 Power Factor 功率系数 Input Fuse 输入保险 Specification(规格) 100Vac TO 240Vac 90Vac TO 264Vac 47HZ TO 63HZ 90Vac，Full Load 264Vac，Full Load Full Load No Load For Input 220Vac 0.98Min. at 90-264Vac T5A/250Vac 3.0A Max. 1.5A Max. 81%Min. at 100Vac 84%Min. at 220Vac <1W Full Load1.2 OUTPUT CHARACTERISTICS（输出特性） 1.2.1 OUTPUT VOLTAGE ,CURRENT’S & REGULATION（输出调整率） Output Voltage 输出电压 +5VSB +5V +12V +24V Regulation 调整率 ±5% ±5% ±5% ±5% Min. current 最小电流 0.1A 0.1A 0.1A 0.1A Rated current 额定电流 0.5A 3.0A 3.0A 6.0A Peak current 峰值电流 1.0A 3.5A 5.0A 8.0AP.S.：The peak current or power should be tested when other output of DC overshoot rated load，and the peak current pulse widens within 100ms. 峰值电流或功率在其它额定负载时测试，且脉宽小于100 毫秒。

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Data Sheet
Schottky Barrier Diode
RB521S-30
Applications General rectification Dimensions (Unit : mm)
0.8±0.05 0.12±0.05
Land size figure (Unit : mm)
0.8 0.6
Data Sheet
0.5
0A 0V DC
Io
0.5
AVERAGE RECTIFIDE FORWARD CURRENT Io(A)
0.4 0.3 0.2 0.1 0 0
AVERAGE RECTIFIED FORWARD CURRENT Io(A)
t T
VR D=t/T VR=15V Tj=125℃
0A 0V DC
Io t T VR D=t/T VR=15V Tj=125℃
0.4 0.3 0.2 0.1 0
D=1/2
D=1/2
Sin(θ＝180)
Sin(θ＝180)
25 50 75 100 AMBIENT TEMPERATURE：Ta(℃) Derating Curveﾞ
125
0
25
50
75
100
125
CASE TEMPARATURE：Tc(℃) Derating Curve
1cyc 8.3ms
Ifsm
15
t
10
5
5
5 AVE:5.60A 0
0 1 IFSM DISPERSION MAP 10 NUMBER OF CYCLES IFSM-CYCLE CHARACTERISTICS 100
0 1 10 TIME:t(ms) IFSM-t CHARACTERISTICS 100
REVERSE POWER DISSIPATIONPR (w)
0.15
0.3 0.2 0.1 0 DC Sin(θ＝180) D=1/2
0.1
Sin(θ＝180)
1ms
time
0.05
300us
10 0.001
10 TIME:(s) Rth-t CHARACTERISTICS
0.1
1000
0 0 0.1 0.2 0.3 0.4 AVERAGE RECTIFIED FORWARD CURRENT：Io(A) Io-Pｆ CHARACTERISTICS 0.5
ROHM : EMD2 JEDEC :SOD-523 JEITA : SC-79 dot (year week factory)
Taping specifications(Unit : mm)
0.2±0.05 4.0±0.1 2.0±0.05 φ1.5±0.05
φ1.55±0.05
3.5±0.05
30
1 0 5 10 15 REVERSE VOLTAGE:VR(V) VR-Ct CHARACTERISTICS 20
450
50 Ta=25℃ IF=200mA n=10pcs 45 40 35 30 25 20 15 10 5 0 AVE:4.775uA Ta=25℃ VR=10V n=30pcs 20 19 Ta=25℃ f=1MHz VR=0V n=10pcs
FORWARD VOLTAGE:VF(mV)
REVERSE CURRENT:VR(uA)
440 430 420 410 AVE:421.0mV 400
CAPACITANCE BETWEEN TERMINALS:Ct(pF)
18 17 16 15 14 13 12 11 10 AVE:14.33pF
VF DISPERSION MAP
1000 100 10 1 0.1 0.01 0
Ta=75℃ Ta=25℃ Ta=-25℃
Ta=-25℃ Ta=25℃
CAPACITANCE BETWEEN TERMINALS:Ct(pF)
100
Ta=125℃
10000
10
10 20 REVERSE VOLTAGE：VR(V) VR-IR CHARACTERISTICS
Absolute maximum ratings(Ta=25°C) Parameter Reverse voltage (DC) Average rectified forward current Forward current surge peak (60Hz ・1cyc) Junction temperature Storage temperature
1.75±0.1
8.0±0.15
2.40 ±0.05 2.45±0.1
1.25 0.06 1.3±0.06 0
1.25 0.06 1.5 0.75 ±0.05
φ0.5 0.95±0.06 0.90 ±0.05 0 空ポケット Empty pocket 4.0±0.1 2.0±0.05
1000
TRANSIENT THAERMAL IMPEDANCE:Rth (℃/W)
0.2 Rth(j-a)
0.5 0.4 D=1/2 DC
FORWARD POWER DISSIPATION:Pf(W)
Rth(j-c) 100
Mounted on epoxy board IM=1mA IF=20mA
Symbol VF IR
Min. -
Typ. -
Max. 0.50 30
Unit V μA
Conditions IF=200mA VR=10V
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R1120A
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分销商库存信息:
ROHM RB521S-30TE61 RB521S-30FTE61
IR DISPERSION MAP
Ct DISPERSION MAP
20
10 Ifsm
10 Ifsm 8.3ms 8.3ms 1cyc
PEAK SURGE FORWARD CURRENT:IFSM(A)
PEAK SURGE FORWARD CURRENT:IFSM(A)
PEAK SURGE FORWARD CURRENT:IFSM(A)
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Notes
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0
10 20 REVERSE VOLTAGE：VR(V) VR-PR CHARACTERISTICS
30
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2011.03 - Rev.F
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RB521S-30
1.2±0.05
Features 1)Ultra small mold type. （EMD2） 2)Low VF 3)High reliability
1.6±0.1
EMD2
Construction Silicon epitaxial planar
0.3±0.05
Structure
0.6±0.1
Symbol VR Io IFSM Tj Tstg
Limits 30 200 1 125 -40 to +125
Unit V mA A °C °C
Electrical characteristics (Ta=25°C) Parameter Forward voltage Reverse current
1.7
RB521S-30
Data Sheet
1000
100000 Ta=125℃
100 f=1MHz
FORWARD CURRENT:IF(mA)
REVERSE CURRENT:IR(uA)
10 Ta=75℃ 1 0.1 0.01 0.001 0 100 200 300 400 FORWARD VOLTAGE：VF(mV) VF-IF CHARACTERISTICS 500