SS52 THRU SS5200 SMA
SS14_datasheet
SS12 THRU SS110
SCHOTTKY BARRIER RECTIFIER
VOLTAGE：20-100V CURRENT：1.0A
FEATURES
·High reliability ·Low leakage ·Low forward voltage ·High current capability ·Super fast switching speed ·High surge capability ·Good for switching mode circuit
SS14 40 28 40
SS15 50 35 50
SS16 60 42 60
SS18 80 56 80
SS110 100 70 100
units V V V
1.Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A 2.Measured at 1MHz and applied reverse voltage of 4.0 volts
Ratings at 25℃ ambient temperature unless otherwise specified. Single phase, half wave, 60Hz,resistive or inductive load. For capacitive load, derate current by 20%. SYMBOL SS12 SS13 Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward rectified Currentat TA=55°C Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rate load (JEDEC method) Maximum Instantaneous forward Voltage at 1.0A DC Maximum DC Reverse Current at Rated DC Blocking Voltage TA=25°C Maximum Full Load Reverse Current Full Cycle Average,.375”(9.5mm) lead length at TL=75°C Typical Junction Capacitance (Note 2) Notes: IR CJ 15 10 pF 100 VF IFSM 0.45 0.55 0.6 1 µA 30 0.7 0.85 A V Io 1 A VRRM VRMS VDC 20 14 20 30 21 30
CS5520资料
AC Excitation 300 Hz; Gain = 25; Bipolar Mode; Rsource = 300Ω with a 4.7nF to AGND at AIN (see Note 1); unless otherwise specified.)
Parameter*
Min
Typ
Max Units
Specified Temperature Range
-40 to +85
°C
Accuracy
Linearity Error
-
0.0015 0.003 ±%FS
Differential Nonlinearity
-
±0.25
±0.5 LSB16
Unipolar Gain Error
CS5516 CS5520
16-Bit/20-Bit Bridge Transducer A/D Converter
Features
Description
l On-chip Instrumentation Amplifier l On-chip Programmable Gain Amplifier l On-Chip 4-Bit D/A For Offset Removal l Dynamic Excitation Options l Linearity Error: ±0.0015% FS
- 20-Bit No Missing Codes
l CMRR at 50/60 Hz > 200 dB l System Calibration Capability with calibration
SS58肖特基势垒整流器SMB(DO-214AA)二极管规格书
RATINGS AND CHARACTERISTIC CURVES SS52 THRU SS5200
AVERAGE FORWARD RECTIFIED CURRENT, AMPERES
PEAK FORWARD SURGE CURRENT, AMPERES
FIG. 1- FORWARD CURRENT DERATING CURVE
FIG. 3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS
FIG. 4-TYPICAL REVERSE CHARACTERISTICS
100
INSTANTANEOUS FORWARD CURRENT,AMPERES
10.0
10 TJ=100 C 1
1
TJ=75 C 0.1
0.060(1.52) 0.030(0.76)
0.008(0.203)MAX.
0.220(5.59) 0.205(5.21)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
0.087 (2.20) 0.071 (1.80)
0.155(3.94) 0.130(3.30)
0.180(4.57) 0.160(4.06)
CS5320资料
Preliminary Product InformationThis document contains information for a new product.Cirrus Logic reserves the right to modify this product without notice.Copyright © Cirrus Logic, Inc. 1999CS5320/21/2224-Bit Variable Bandwidth A/D Converter ChipsetFeaturesl CMOS A/D Converter Chipset l Dynamic Range-130 dB @ 25 Hz Bandwidth -121 dB @ 411 Hz Bandwidthl Delta-Sigma Architecture-Fourth-Order Modulator-Variable Oversampling: 64X to 4096X -Internal Track-and-Hold Amplifierl CS5321 Signal-to-Distortion: 115 dB l Clock Jitter Tolerant Architecture l Input Voltage Range: +4.5 V l Flexible Filter Chip-Hardware or Software Selectable Options -Seven Selectable Filter Corners (-3 dB)Frequencies: 25, 51, 102, 205, 411, 824 and 1650 Hzl Low Power Dissipation: <100 mWDescriptionThe CK5320 and CK5321 Chipsets function as a unique A/D converter intended for very high resolution measure-ment of signals below 1500 Hz. The CK5320 Chipset is a cost effective commercial grade solution for applica-tions which require a high dynamic range A/D converter.The chipsets perform sampling, A/D conversion, and anti-alias filtering.The CS5320 and CS5321 use Delta-Sigma modulation to produce highly accurate conversions. The ∆Σ modula-tor oversamples, virtually eliminating the need for external analog anti-alias filters. The CS5322 linear-phase FIR digital filter decimates the output to any one of seven selectable update periods: 16, 8, 4, 2, 1, 0.5and 0.25 milliseconds. Data is output from the digital fil-ter in a 24-bit serial format.ORDERING INFORMATION** Refer to Table 5Chip SetsKitsCS5320-KL & CS5322-KL CK5320-KL1CS5321-BL & CS5322-KL CK5321-KL1CS5321-BL & CS5322-BL CK5321-BL1RSEL V dd1AINR AIN+AIN-V ss1AGNDAnalog ModulatorMDATAMCLK MFLG RESETR/WH/SSCLK SID SOD ERROR DRDY ORCAL DECA DECB DECCCS CLKINSYNCVD+TDATAPWDNUSEORDGNDVD+DGND CSELDigital FilterCS5320/21CS5322V ss2DGNDV dd2LPWR OFSTMDATAHBRMSYNCVREF+VREF-OCT ‘99TABLE OF CONTENTS1. CHARACTERISTICS AND SPECIFICATIONS (4)CS5320 AND CS5321 ANALOG CHARACTERISTICS (4)CS5320 AND CS5321 SWITCHING CHARACTERISTICS (6)CS5320 AND CS5321 DIGITAL CHARACTERISTICS (7)CS5320 AND CS5321 RECOMMENDED OPERATION CONDITIONS (7)CS5320 AND CS5321 ABSOLUTE MAXIMUM RATINGS (7)CS5322 FILTER CHARACTERISTICS (8)CS5322 POWER SUPPLY (10)CS5322 SWITCHING CHARACTERISTICS (10)CS5322 DIGITAL CHARACTERISTICS (15)CS5322 RECOMMENDED OPERATION CONDITIONS (15)CS5322 ABSOLUTE MAXIMUM RATINGS (15)2. GENERAL DESCRIPTION (16)2.1. Analog Input (18)2.2. The OFST Pin (18)2.3. Input Range and Overrange Conditions (19)2.4. Voltage Reference (20)2.5. Clock Source (20)2.6. Low Power Mode (21)2.7. Digital Interface and Data Format (21)2.8. Performance (22)2.9. Power Supply Considerations (23)2.10. Power Supply Rejection Ratio (23)2.11. RESET Operation (23)2.12. Power-down Operation (23)2.13. SYNC Operation (24)2.14. Serial Read Operation (24)2.15. Serial Write Operation (25)2.16. Offset Calibration Operation (25)2.17. Status Bits (26)2.18. Board Layout Considerations (28)3. CS5320/21 PIN DESCRIPTIONS (29)Power Supplies (29)Analog Inputs (29)Digital Inputs (30)Digital Outputs (30)Contacting Cirrus Logic SupportFor a complete listing of Direct Sales, Distributor, and Sales Representative contacts, visit the Cirrus Logic web site at: /corporate/contacts/Preliminary product information describes products which are in production, but for which full characterization data is not yet available. Advance product infor-mation describes products which are in development and subject to development changes. Cirrus Logic, Inc. has made best efforts to ensure that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provid ed “AS IS” without warranty of any kind (express or implied). No responsibility is assumed by Cirrus Logic, Inc. for the use of this information, nor for infringements of patents or other rights of third parties. This document is the property of Cirrus Logic, Inc. and implies no license under patents, copyrights, trademarks, or trade secrets. No part of this publication may be copied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means (electronic, mechanical, photographic, or otherwise) without the prior written consent of Cirrus Logic, Inc. Items from any Cirrus Logic website or disk may be printed for use by the user. However, no part of the printout or electronic files may be copied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means (electronic, mechanical, photographic, or otherwise) without the prior written consent of Cirrus Logic, Inc. Furthermore, no part of this publication ma y be used as a basis for manufacture or sale of any items without the prior written consent of Cirrus Logic, Inc. The names of products of Cirrus Logic, Inc. or other vendors and suppliers appearing in this document may be trademarks or service marks of their respective owners which may be registered in some jurisdictions. A list of Cirrus Logic, Inc. trade-marks and service marks can be found at .4. CS5322 PIN DESCRIPTIONS (31)Power Supplies (31)Digital Outputs (31)Digital Inputs (32)5. ORDERING INFORMATION (34)6. PARAMETER DEFINITIONS (35)7. PACKAGE DIMENSIONS (36)LIST OF FIGURESFigure 1. Rise and Fall Times (6)Figure 2. CS5320 and CS5321 Interface Timing, HBR=1 (6)Figure 3. CS5322 Filter Response (8)Figure 4. CS5322 Digital Filter Passband Ripple f0 = 62.5 Hz (8)Figure 5. CS5322 Digital Filter Passband Ripple f0 = 125 Hz (8)Figure 6. CS5322 Digital Filter Passband Ripple f0 = 250 Hz (8)Figure 7. CS5322 Digital Filter Passband Ripple f0 = 500 Hz (9)Figure 8. CS5322 Digital Filter Passband Ripple f0 = 1000 Hz (9)Figure 9. CS5322 Digital Filter Passband Ripple f0 = 2000 Hz (9)Figure 10. CS5322 Digital Filter Passband Ripple f0 = 4000 Hz (9)Figure 11. CS5322 Impulse Response f0 = 62.5 Hz (9)Figure 12. CS5322 Impulse Response f0 = 1000 Hz (9)Figure 13. CS5322 Serial Port Timing (11)Figure 14. TDATA Setup/Hold Timing (12)Figure 15. DRDY Timing (13)Figure 16. RESET Timing (13)Figure 17. CS5320/21/CS5322 Interface Timing (14)Figure 18. CS5320/21 Block Diagram (16)Figure 19. CS5322 Block Diagram (17)Figure 20. System Connection Diagram (19)Figure 21. 4.5 Voltage Reference with two filter options (20)Figure 22. 1024 Point FFT Plot with -20 dB Input, 100 Hz Input, ten averages (22)Figure 23. 1024 Point FFT Plot with Full Scale Input, 100 Hz Input, ten averages ..22Figure 24. 1024 Point FFT Plot with Full Scale Input, 100 Hz Input, ten averages ..22 LIST OF TABLESTable 1.Output Coding for the CS5320/21 and CS5322 Combination (21)Table 2.Configuration Data Bits (24)Table 3.Status Data (from the SOD Pin) (26)Table 4.Bandwidth Selection: Truth Table (27)Table 5.Detailed Ordering Information (34)1. CHARACTERISTICS AND SPECIFICATIONSCS5320 AND CS5321 ANALOG CHARACTERISTICS (T A = (See Note 1); V ss1, V ss2 = -5V;V dd1, V dd2 = +5V; VD+ = 5V; AGND = DGND = 0V; HBR = V dd LPWR = 0, MCLK = 1.024MHz; Device connected as shown in Figure 20, CS5322 used for filtering; Logic 1 = VD+, Logic 0 = 0V; unless otherwise specified.)Notes: 1.CS5320-KL and CS5322-KL are guaranteed from 0o to 70o C. CS5322-BL is guaranteed from -40o to+85o C. CS5321-BL is guaranteed from -55o to +85o C.2.f O = CS5322 output word rate. Refer to “CS5322 FILTER CHARACTERISTICS” on page 8 for detailson the FIR Filter.3.Characterized with full scale input signal of 50Hz; fo = 500Hz.4.Characterized with input signals of 30 Hz and 50 Hz, each 6 dB down from full scale with fo = 1000 Hz.5.Specification is for the parameter over the specified temperature range and is for the CS5320/21 deviceonly (VREF = +4.5 V). It does not include the effects of external components; OFST = 0.6.Drift specifications are guaranteed by design and/or characterization.7.The offset after calibration specification applies to the effective offset voltage for a ±4.5 volt input to theCS5320/21 modulator, but is relative to the output digital codes from the CS5322 after ORCAL and USEOR have been made active.8.The CS5322 offset calibration is performed digitally and includes ± full scale (±4.5 volts intoCS5320/21). Calibration of offsets greater than ±5% of full scale will begin to subtract from the dynamic range.Parameter*CS5320CS5321Symbol MinTyp MaxMinTyp MaxUnitDynamic Performance Dynamic Range (Note 2)HBR = 1f O = 4000Hz OFST = 1f O = 2000Hz f O = 1000Hz f O = 500Hz f O = 250Hz f O = 125Hz f O = 62.5Hz HBR = 0f O = 4000Hz OFST = 1f O = 2000Hz f O = 1000Hz f O = 500Hz f O = 250Hz f O = 125Hz f O = 62.5HzDR--113-----------10311812112412712913099115118121124126127----------------116-----------10311812112412712913099115118121124126127--------------dB dB dB dB dB dB dB dB dB dB dB dB dB dBSignal-to-Distortion(Note 3)HBR = 1HBR = 0SDR100-110120--100110115120--dB dB Intermodulation Distortion (Note 4)IMD -105--110-dB dc Accuracy Full Scale Error (Note 5)FSE -1--1-%Full Scale Drift (Note 5,6)TC FS -5--5-ppm/°COffset(Note 5)V ZSE-10--10-mV Offset after Calibration (Note 7)-±100--±100-µV Offset Calibration Range (Note 8)-100--100-%F.S.Offset Drift(Note 5,6)TC ZSE-60--60-µV/°CCS5320 AND CS5321 ANALOG CHARACTERISTICS (Continued)Notes:9.The upper bandwidth limit is determined by the CS5322 digital filter.10.This input voltage range is for the configuration shown in Figure 20, the System Connection Diagram,and applies to signal from dc to f3 Hz. Refer to CS5322 Filter Characteristics for the values of f3.11.All outputs unloaded. All logic inputs forced to V dd or GND respectively.12.LPWR = 0.13.The CS5321 power dissipation can be reduced under the following conditions:a) LPWR=1; MCLK=512kHz, HBR=1 b) LWPR=1; MCLK=1.024MHz, HBR=014.Characterized with a 100 mVp-p sine wave applied separately to each supply.* Refer to Parameter Definitions (immediately following pin descriptions at the end of this data sheet).Specifications are subject to change without notice.Parameter*CS5320/21SymbolMin Typ Max Unit Input Characteristics Input Signal Frequencies (Note 9)BW dc -1500Hz Input Voltage Range (Note 10)V IN -4.5-+4.5V Input Overrange Voltage (Note 10)I OVR--5%F.S.Power SuppliesDC Power Supply Currents(Note 11)LPWR = 0 Positive SuppliesNegative SuppliesLPWR = 1 Positive SuppliesNegative Supplies--5.55.53.03.07.57.54.54.5mA mA mA mA Power Consumption(Note 11)Normal Operating Mode (Note12)Lower Power Mode (Note 13)P DN P DL --55307545mW mW Power DownP D-2-mW Power Supply Rejection(dc to 128 kHz) (Note 14)PSR -60-dBCS5320 AND CS5321 SWITCHING CHARACTERISTICS (T A = (See Note 1); V dd1, V dd2 =5V ± 5%; V ss1, V ss2 = -5V ± 5%; Inputs: Logic 0 = 0V Logic 1 = V+; C L = 50 pF (Note 15))Notes:15.Guaranteed by design, characterization, or test.16.If MCLK is removed, the modulator will enter the power down mode.17.Excludes MCLK input. MCLK should be driven with a signal having rise and fall times of 25 ns or faster.ParameterSymbol Min Typ Max Units MCLK Frequency (Note 16)f c0.250 1.024 1.2MHz MCLK Duty Cycle 40-60%MCLK Jitter (In-band)--300ps Rise Times:Any Digital Input (Note 17)Any Digital Output t risein t riseout ---50100200ns ns Fall Times:Any Digital Input (Note 17)Any Digital Outputt fallin t fallout ---50100200ns ns MSYNC Setup Time to MCLK rising t mss 20--ns MSYNC Hold Time after MCLK rising t msh 20--ns MCLK rising to Valid MFLG t mfh -140255ns MCLK rising to Valid MDATAt mdv-170300nsFigure 1. Rise and Fall TimesFigure 2. CS5320 and CS5321 Interface Timing, HBR=1CS5320 AND CS5321 DIGITAL CHARACTERISTICS (T A = (See Note 1); V dd1 = V dd2 =5.0V ± 5%; GND = 0V; measurements performed under static conditions)Notes:18.Device is intended to be driven with CMOS logic levels.19.Device is intended to be interfaced to CMOS logic. Resistive loads are not recommended on these pins.CS5320 AND CS5321 RECOMMENDED OPERATION CONDITIONS (Voltages withrespect to GND = 0V, See Note 20)Notes:20.The maximum voltage differential between the Positive Supply of the CS5320/21 and the PositiveDigital Supply of the CS5322 must be less than 0.25V.CS5320 AND CS5321 ABSOLUTE MAXIMUM RATINGS * (Voltages with respect toGND = 0V)Notes:21.Transient currents of up to 100 mA will not cause SCR latch up.*WARNING: Operation beyond these limits may result in permanent damage to the device. Normal operation isnot guaranteed at these extremes.ParameterSymbol Min Typ Max Units High-Level Input Drive Voltage (Note 18)V IH (V dd )-0.6--V Low-Level Input Drive Voltage(Note 18)V IL -- 1.0V High-Level Output Voltage IOUT = -40 µA (Note 19)V OH (V dd )-0.3--V Low-Level Output Voltage IOUT = +40 µA (Note 19)V OL --0.3V Input Leakage Current I LKG --±10µA Digital Input Capacitance C IN -9-pF Digital Output CapacitanceC OUT-9-pFParameterSymbolMin Typ Max Units DC Supply:Positive Negative V dd1,V dd2V ss1,V ss24.75-4.755.0-5.0 5.25-5.25V V Ambient Operating Temperature-KL -BLT A T A0-55--+70+85°C °CParameterSymbol Min Max Units DC Supply:Positive Negative V dd1,V dd2V ss1,V ss2-0.3+0.3 6.0-6.0V V Input Current, Any Pin Except Supplies (Note 21)I in -±10mA Output CurrentI out -25mA Total Power (all supplies and outputs)P t -1W Digital Input Voltage V IND -0.3(V dd )+0.3V Storage TemperatureT stg-65150°CCS5322 FILTER CHARACTERISTICS (T A = (See Note 1); VD+ = 5.0V; GND = 0V;CLKIN = 1.024 MHz; transfer function shown in Figure 3; unless otherwise specified.)Notes:22.G SB = -130 dB for all Output Word Rates.Output Word Ratef 0 (Hz)Passband f1(Hz)Passband Flatness R PB (dB)-3dB Freq. f2 (Hz)Stopband f3 (Hz)(Note 22)Group Delay(ms)40002000100050025012562.51500750375187.593.846.923.40.20.040.080.10.10.10.11652.5824.3411.9205.9102.951.525.72000100050025012562.531.257.2514.52958116232464Figure 4. CS5322 Digital Filter Passband Ripplef 0= 62.5 HzFigure 5. CS5322 Digital Filter Passband Ripplef 0 = 125 Hz Figure 6. CS5322 Digital Filter Passband Ripplef 0 = 250 HzFigure 7. CS5322 Digital Filter Passband Ripplef0 = 500 Hz Figure 8. CS5322 Digital Filter Passband Ripplef0= 1000 HzFigure 9. CS5322 Digital Filter Passband Ripplef0 = 2000 Hz Figure 10. CS5322 Digital Filter Passband Ripplef0 = 4000 HzFigure 11. CS5322 Impulse Response,f0 = 62.5 Hz Figure 12. CS5322 Impulse Response,f0 = 1000 HzCS5322 POWER SUPPLY (T A = (See Note 1); VD+ = 5V; CLKIN = 1.024 MHz)CS5322 SWITCHING CHARACTERISTICS (T A = (See Note 1); VD+ = 5V ± 5%; DGND = 0V;Inputs: Logic 0 = 0V Logic 1 = VD+; C L = 50 pF (Note 23)23.Guaranteed by design, characterization and/or test.ParameterCS5322-KCS5322-B Min Typ Max Min Typ Max Unit Power Supply Current:ID+(Note 11)- 2.24- 2.24mA Power Dissipation:(Note 11)PWDN Low PWDN High--110.6202.5--110.6202.5mW mWParameterSymbol Min Typ Max Units CLKIN Frequency f c0.512 1.024 1.2MHz CLKIN Duty Cycle 40-60%Rise Times:Any Digital Input Any Digital Output t rise ---50100100ns ns Fall Times:Any Digital Input Any Digital Outputt fall ---50100100ns ns Serial Port Read TimingDRDY to Data Validt ddv --25ns RSEL Setup Time before Data Valid t rss 50--ns Read Setup before CS Active t rsc 20--ns Read Active to Data Valid t rdv --50ns SCLK rising to New SOD bit t rdd --50ns SCLK Pulse Width High t rph 30--ns SCLK Pulse Width Low t rpl 30--ns SCLK Periodt rsp 100--ns SCLK falling to DRDY falling t rst --50ns CS High to Output Hi-Zt rch --20ns Read Hold Time after CS Inactive t rhc 20--ns Read Select Setup to SCLK fallingt rds 20--ns Serial Port Write TimingWrite Setup Before CS Active t wsc 20--ns SCLK Pulse Width Low t wpl 30--ns SCLK Pulse Width High t wph 30--ns SCLK Periodt wsp 100--ns Write Setup Time to First SCLK falling t wws 20--ns Data Setup Time to First SCLK falling t wds 20--ns Write Select Hold Time after SCLK falling t wwh 20--ns Write Hold Time after CS Inactive t whc 20--ns Data Hold Time after SCLK fallingt wdh20--nsSerial Port Read Timing(R/W = 1, CS = 0, RSEL = 1 DRDY Does not toggle if reading status, RSEL = 0)Figure 13. CS5322 Serial Port TimingCS5322 SWITCHING CHARACTERISTICS (continued)ParameterSymbol Min Typ Max Units Test Data (TDATA) TimingSYNC Setup Time to CLKIN rising t ss 20--ns SYNC Hold Time after CLKIN risingt sh 20--ns TDATA Setup Time to CLKIN rising after SYNC t tds -20-ns TDATA Hold Time after CLKIN rising t tdh -150-ns ORCAL Setup Time to CLKIN rising t os 20--ns ORCAL Hold Time after CLKIN rising t oh 20--ns DRDY TimingCLKIN rising to DRDY falling t df -140-ns CLKIN falling to DRDY rising t dr -150-ns CLKIN rising to ERROR change t ec -140-ns RESET TimingRESET Setup Time to CLKIN rising t rs 20--ns RESET Hold Time after CLKIN rising t rh 20--ns SYNC Setup Time to CLKIN rising tss 20--ns SYNC Hold Time after CLKIN risingt sh20--nsFigure 14. TDATA Setup/Hold TimingFigure 15. DRDY TimingFigure 16. RESET TimingCS5322 SWITCHING CHARACTERISTICS (continued)Notes:24.If MCLK is removed, the modulator will enter the power down mode.25.Excludes MCLK input. MCLK should be driven with a signal having rise and fall times of 25 ns or faster.26.Only the rising edge of MSYNC relative to MCLK is used to synchronize the device. MSYNC can returnlow at any time as long as it remains high for at least one MCLK cycle.ParameterSymbol Min Typ Max Units MCLK Frequency (Note 24)f c0.512 1.024 1.1MHz MCLK Duty Cycle 40-60%Rise Times:Any Digital Input (Note 25)Any Digital Output t rise ---50100200ns ns Fall Times:Any Digital Input (Note 25)Any Digital Outputt fall ---50100200ns ns SYNC Setup Time to CLKIN rising t ss 20--ns SYNC Hold Time after CLKIN rising t sh 20--ns CLKIN edge to MCLK edge t mss -30-ns MCLK rising to Valid MDATA t msh-50-ns MSYNC Delay from MCLK rising(Note 26)t msd-90-nsFigure 17. CS5320/21/CS5322 Interface TimingCS5322 DIGITAL CHARACTERISTICS (T A = (See Note 1); VD+ = 5.0V ± 5%; GND = 0V;measurements performed under static conditions)Notes:27.Device is intended to be driven with CMOS logic levels.28.Device is intended to be interfaced to CMOS logic. Resistive loads are not recommended on these pins.CS5322 RECOMMENDED OPERATION CONDITIONS (Voltages with respect to GND = 0V)Notes:29.The maximum voltage differential between the Positive Supply of the CS5320/21 and the PositiveDigital Supply of the CS5322 must be less than 0.25V.CS5322 ABSOLUTE MAXIMUM RATINGS * (Voltages with respect to GND = 0V)Notes:30.Transient currents of up to 100 mA will not cause SCR latch up.*WARNING: Operation beyond these limits may result in permanent damage to the device. Normal operation isnot guaranteed at these extremes.ParameterSymbol Min Typ Max Units High-Level Input Drive Voltage V IH (VD+)-0.3--V Low-Level Input Drive Voltage V IL--0.3V High-Level Input Threshold (Note 27)(VD+)-1.0--V Low-Level Input Threshold(Note 27)-- 1.0V High-Level Output Voltage IOUT = -40µA (Note 28)V OH (VD+)-0.6--V Low-Level Output Voltage IOUT = +1.6 mA (Note 28)V OL --0.4V Input Leakage Current All pins except MFLG, SODI LKG --±10µA Three-State Leakage CurrentI OZ --±10µA Digital Input Capacitance C IN -9-pF Digital Output Capacitance C OUT -9-pFParameterSymbolMinTypMaxUnitsDC Supply:(Note 29)Positive NegativeVD+VD- 4.75-4.75 5.0-5.0 5.25-5.25V V Ambient Operating Temperature-KL -BL T A T A0-40--+70+85°C °CParameterSymbolMinTypMaxUnitsDC Supply:(Note 29)Positive NegativeVD+VD--0.30.3--(VD+)+0.3-6.0V V Input Current, Any Pin Except Supplies (Note 30)I in --±10mA Digital Input Voltage VIND -0.3-(VD+)+0.3V Storage TemperatureT stg-65-150°C2. GENERAL DESCRIPTIONThe CS5320 and CS5321 are fourth-order CMOS monolithic analog modulators designed specifical-ly for very high resolution measurement of signals between dc and 1500 Hz. Configuring the CS5320or CS5321 with the CS5322 FIR filter results in a high resolution A/D converter system that performs sampling and A/D conversion with dynamic range exceeding 120 dB .The CS5320 and CS5321 use a fourth-order over-sampling architecture to achieve high resolution A/D conversion. The modulator consists of a 1-bit A/D converter embedded in a negative feedback loop. The modulator provides an oversampled seri-al bit stream at 256 kbits per second (HBR=1) and 128 kbits per second (HBR=0) operating with a clock rate of 1.024 MHz. Figure 18 illustrates the CS5320/CS5321 Block Diagram.The CS5322 is a monolithic digital Finite Impulse Response (FIR) filter with programmable decima-tion. The CS5322 and CS5320/CS5321 are intend-ed to be used together to form a unique high dynamic range ADC chipset. The CS5322 provides the digital anti-alias filter for the CS5320/CS5321modulator output. The CS5322 consists of: a multi-stage FIR filter, four registers (status, data, offset,and configuration), a flexible serial input and out-put port, and a 2-channel input data multiplexer that selects data from the CS5320/CS5321 (MDA-TA) or user test data (TDATA). The CS5322 deci-mates (64x to 4096x) the output to any of seven selectable up-date periods: 16, 8, 4, 2, 1, 0.5 and 0.25 milliseconds. Data is output from the digital filter in a 24-bit serial format. Figure 19 illustrates the CS5322 Block Diagram.Figure 18. CS5320/21 Block DiagramAINR V dd1ΣOsc.DetectAIN+AIN-VREF+VREF-D/AA/DDigitalControlMDATAMDATAClockGenerationMSYNC MCLK HBR MFLGOFST LPWR V ss1AGNDV dd2V ss2DGNDFigure 19. CS5322 Block Diagram2.1 Analog InputThe CS5320 and CS5321 modulators use a switched capacitor architecture for its signal and voltage reference inputs. The signal input uses three pins; AINR, AIN+, and AIN-. The AIN- pin acts as the return pin for the AINR and AIN+ pins. The AINR pin is a switched capacitor "rough charge" in-put for the AIN+ pin. The input impedance for the rough charge pin (AINR) is 1/fC where f is two times the modulator sampling clock rate and C is the internal sampling capacitor (about 40 pF). Us-ing a 1.024 MHz master clock (HBR = 1) yields an input impedance of about 1/(512 kHz)X(40 pF) or about 50 kΩ. Internal to the chip the rough charge input pre-charges the sampling capacitor used on the AIN+ input, therefore the effective input imped-ance on the AIN+ pin is orders of magnitude above the impedance seen on the AINR pin.The analog input structure inside the VREF+ pin is very similar to the AINR pin but includes addition-al circuitry whose operating current can change over temperature and from device to device. There-fore, if gain accuracy is important, the VREF+ pin should be driven from a low source impedance. The current demand of the VREF+ pin will produce a voltage drop of approximately 45 mV across the 200 Ω source resistor of Figure 20 and Figure 21 Option A with MCLK = 1.024 MHz, HBR = 1, and temperature = 25°C.When the CS5320/21 modulator is operated with a 4.5 V reference it will accept a 9 V p-p input signal, but modulator loop stability can be adversely af-fected by high frequency out-of-band signals. Therefore, input signals must be band-limited by an input filter. The -3 dB corner of the input filter must be equal to the modulator sampling clock divided by 64. The modulator sampling clock is MCLK/4 when HBR = 1 or MCLK/8 when HBR = 0. With MCLK = 1.024 MHz, HBR = 1, the modulator sampling clock is 256 kHz which requires an input filter with a -3 dB corner of 4 kHz. The bandlimit-ing may be accomplished in an amplifier stage ahead of the CS5320/21 modulator or with the RC input filter at the AIN+ and AINR input pins. The RC filter at the AIN+ and AINR pins is recom-mended to reduce the "charge kick" that the driving amplifier sees as the switched capacitor sampling is performed.Figure 20 illustrates the CS5320/21 and CS5322 system connections. The input components on AINR and AIN+ should be identical values for op-timum performance. In choosing the components the capacitor should be a minimum of 0.1 µF (C0G dielectric ceramic preferred). For minimum board space, the RC components on the AINR input can be removed, but this will force the driving amplifi-er to source the full dynamic charging current of the AINR input. This can increase distortion in the driving amplifier and reduce system performance. In choosing the RC filter components, increasing C and minimizing R is preferred. Increasing C reduc-es the instantaneous voltage change on the pin, but may require paralleling capacitors to maintain smaller size (the recommended 0.1 µF C0G ceram-ic capacitor is larger than other similar-valued ca-pacitors with different dielectrics). Larger resistor values will increase the voltage drop across the re-sistor as the recharging current charges the switched capacitor input.2.2 The OFST PinThe CS5320/21 modulator can produce "idle tones" which occur in the passband when the input signal is steady state dc signal within about±50 mV of bipolar zero. In the CS5320/21 these tones are about 135 dB down from full scale. The user can force these idle tones "out-of-band" by adding 100 mV of dc offset to the signal at the AIN input. Alternately, if the user circuitry has a low offset voltage such that the input signal is within ±50 mV of bipolar zero when no AC signal is present, the OFST pin on the CS5320/21 can be ac-tivated. When OFST = 1, +100 mV of input re-ferred offset will be added internal to the CS5320/21 and guarantee that any idle tones present will lie out-of-band. The user should be certain that when OFST is active (OFST =1) that the offset voltage generated by the user circuitry does not negate the offset added by the OFST pin.2.3 Input Range and Overrange Conditions The analog input is applied to the AIN+ and AINR pins with the AIN- pin connected to GND. The in-put is fully differential but for proper operation the AIN- pin must remain at GND potential.The analog input span is defined by the voltage ap-plied between the VREF+ and VREF- input pins. See the Voltage Reference section of this data sheet for voltage reference requirements.The modulator is a fourth order delta-sigma and is therefore conditionally stable. The modulator may go into an oscillatory condition if the analog input is overranged. Input signals which exceed either plus or minus full scale by more than 5 % can intro-duce instability in the modulator. If an unstable condition is detected, the modulator will be re-duced to a first order system until loop stability is achieved. If this occurs the MFLG pin will transi-tion from a low to a high will result in an error bit being set in the CS5322. The input signal must be reduced to within the full scale range of the con-verter for at least 32 MCLK cycles for the modula-tor to recover from this error condition.Figure 20. System Connection Diagram。
BCX51 52 53 PNP中间功率导电器SOT89数据手册说明书
Features• BV CEO > -45V, -60V & -80V• I C = -1A Continuous Collector Current • I CM = -2A Peak Pulse Current• Low Saturation Voltage V CE(sat) <************• Gain Groups 10 and 16• Complementary NPN Types: BCX54, 55, and 56• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen- and Antimony-Free. "Green" Device (Note 3)•For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAPcapable, and manufactured in IATF 16949 certified facilities),please contact us or your local Diodes representative.https:///quality/product-definitions/Mechanical Data• Case: SOT89• Case Material: Molded Plastic, “Green” Molding Compound; UL Flammability Rating 94V-0• Moisture Sensitivity: Level 1 per J-STD-020•Terminals: Matte Tin Finish Leads; Solderable per MIL-STD-202 Method 208•Weight: 0.052 grams (Approximate)Applications • Medium Power Switching or Amplification Applications • AF Driver and Output StagesOrdering Information (Note 4)Product Compliance Marking Reel Size (inches)Tape Width (mm)Quantity per ReelBCX51TA Standard AA 7 12 1,000 BCX51-13R Standard AA 13 12 4,000 BCX5110TA Standard AC 7 12 1,000 BCX5116TA Standard AD 7 12 1,000 BCX5116TC Standard AD 13 12 4,000 BCX52TA Standard AE 7 12 1,000 BCX5210TA Standard AG 7 12 1,000 BCX5216TA Standard AM 7 12 1,000 BCX53TA Standard AH 7 12 1,000 BCX5310TA Standard AK 7 12 1,000 BCX5316TA Standard AL 7 12 1,000 BCX5316TC Standard AL 13 12 4,000 BCX5316-13R Standard AL 13 12 4,000 BCX5110TC Standard AC 13 12 4,000 BCX51TC Standard AA 13 12 4,000 BCX5210TC Standard AG 13 12 4,000 BCX5216TC Standard AM 13 12 4,000 BCX52TC Standard AE 13 12 4,000 BCX5310TC Standard AK 13 12 4,000 BCX53TCStandardAH13124,000Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.2. See https:///quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.4. For packaging details, go to our website at https:///design/support/packaging/diodes-packaging/.Top View Device SymbolTop View Pin-Out SOT89E C BMarking InformationAbsolute Maximum Ratings (@ T A = +25°C, unless otherwise specified.)CharacteristicSymbol BCX51 BCX52 BCX53 Unit Collector-Base Voltage V CBO -45 -60 -100 V Collector-Emitter Voltage V CEO -45-60 -80V Emitter-Base Voltage V EBO -5 V Continuous Collector CurrentI C -1 A Peak Pulse Collector Current (Single pulse) I CM -2 Continuous Base CurrentI B -100 mAPeak Pulse Base Current (Single pulse) I BM-200Thermal Characteristics (@ T A = +25°C, unless otherwise specified.)CharacteristicSymbol Value Unit Power Dissipation(Note 5) P D1 W(Note 6) 1.5 (Note 7) 2.0 Thermal Resistance, Junction to Ambient Air (Note 5) R θJA 125 °C/W (Note 6) 83 (Note 7)60 Thermal Resistance, Junction to Lead (Note 8) R θJL 13 °C/W Thermal Resistance, Junction to Case (Note 9)R θJC 27 °C/W Operating and Storage Temperature Range T J, T STG-55 to +150°CESD Ratings (Note 10)CharacteristicSymbol Value Unit JEDEC ClassElectrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine ModelESD MM400VCNotes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state.6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper.7. Same as Note 5, except the device is mounted on 50mm x 50mm 1oz copper.8. Thermal resistance from junction to solder-point (on the exposed collector pad).9. Thermal resistance from junction to the top of the case.10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.xx = Product Type Marking Code, as follows:BCX51 = AA BCX52 = AEBCX53 = AH BCX5110 = AC BCX5210 = AG BCX5310 = AK BCX5116 = AD BCX5216 = AMBCX5316 = ALThermal Characteristics and Derating Information2550751001251500.00.20.40.60.81.0Derating CurveTemperature (°C) M a x P o w e r D i s s i p a t i o n (W )Transient Therm al Im pedanceT h e r m a l R e s i s t a n c e (°C /W )Pulse Width (s)Pulse Power DissipationPulse Width (s)M a x P o w e r D i s s i p a t i o n (W )Copper Area (sqmm)M a x i m u m P o w e r (W )Copper Area (sqmm)T h e r m a l R e s i s t a n c e (°C /W )Note:11. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.Typical Electrical Characteristics (@ T A = +25°C, unless otherwise specified.)-I , COLLECTOR CURRENT (A)C h ,D C C U R RE N T G A I NF E Fig. 2 Typical DC Current Gain vs. Collector CurrentDC Current Gain vs. Collector Current -V , COLLECTOR-EMITTER VOLTAGE (V)CE I , C O L L E C T O R C U R R E N T (A )CFig. 1 Typical Collector Current vs. Collector-Emitter VoltageCollector Current vs. Collector-Emitter Voltage -h FE V I CI C V V CETypical Electrical Characteristics (continued.)0.20.40.60.81.0-V , B A S E -E M I T T E R T U R N -O N V O L T A G E (V )B E (O N)-I , COLLECTOR CURRENT (A)C -V , C O L L E C T O R -E M I T T E R S A T U R A T I O N V O L T A G E (V )C E (S A T )Fig. 4 Typical Collector-Emitter Saturation Voltagevs. Collector Current 0.20.40.60.81.01.2-V , B A S E -E M I T T E R S A T U R A T I O N V O L T A G E (V B E (S AT )-I , COLLECTOR CURRENT (mA)C f , G A I N -B A ND W I D T H P R O D U C T (M H z )T Fig. 6 Typical Gain-Bandwidth Product vs. Collector Current V , REVERSE VOLTAGE (V)R C A P A C I T A N C E (p F )Fig. 7 Typical Capacitance Characteristics -V B E (s a t ), B A S E -E M I T T E R S A T U R A T I O N V O L T A G E )-V B E (o n ), B A S E -E M I T T E R T U R N -O N V O L T A G E (V )-V C E (s a t ) , C O L L E C T O R -E M I T T E RC v V RVCE(sat) V I Cf T V I CPackage Outline DimensionsPlease see /package-outlines.html for the latest version.SOT89SOT89Dim Min Max TypA 1.40 1.60 1.50B 0.50 0.62 0.56B1 0.42 0.540.48c 0.35 0.43 0.38D 4.40 4.60 4.50D1 1.62 1.83 1.733D2 1.61 1.81 1.71E 2.40 2.60 2.50E2 2.05 2.35 2.20e - - 1.50H 3.95 4.25 4.10H1 2.63 2.93 2.78L 0.90 1.20 1.05L1 0.327 0.527 0.427z 0.20 0.40 0.30All Dimensions in mmSuggested Pad LayoutPlease see /package-outlines.html for the latest version.SOT89Dimensions Value(in mm)C 1.500G 0.244X 0.580X1 0.760X2 1.933Y 1.730Y1 3.030Y2 1.500Y3 0.770Y4 4.530TOP VIEW。
浪潮服务器商品编码 部件产品名称 Q1对应编码 Q1对应配件名称
商品编码部件产品名称Q1对应编码Q1对应配件名称CPUSPT0CPU0002H Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4809v2(6C,105W,1.9GHz)Processor Option Kit BCX305XeonE7-4809v2(1.9GHz/6c)/6.4GT/12ML3 SPT0CPU0002I Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4820v2(8C,105W,2.0GHz)Processor Option Kit BCX306XeonE7-4820v2(2.00GHz/8c)/7.2GT/16ML3 SPT0CPU0002J Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4830v2(10C,105W,2.2GHz)Processor Option Kit BCX307XeonE7-4830v2(2.2GHz/10c)/7.2GT/20ML3 SPT0CPU0002K Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4850v2(12C,105W,2.4GHz)Processor Option Kit BCX308XeonE7-4850v2(2.3GHz/12c)/7.2GT/24ML3 SPT0CPU0002L Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4860v2(12C,130W,2.6GHz)Processor Option Kit BCX309XeonE7-4860v2(2.6GHz/12c)/8.0GT/30ML3 SPT0CPU0002M Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4870v2(15C,130W,2.3GHz)Processor Option Kit BCX310XeonE7-4870v2(2.3GHz/15c)/8.0GT/30ML3 SPT0CPU0002N Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4880v2(15C,130W,2.5GHz)Processor Option Kit BCX311XeonE7-4880v2(2.5GHz/15c)/8.0GT/37.5ML3 SPT0CPU0002O Inspur NF8460M3,NF8465M3Inbbb Xeon E7-4890v2(15C,155W,2.8GHz)Processor Option Kit BCX312XeonE7-4890v2(2.8GHz/15c)/8.0GT/37.5ML3 SPT0CPU0002P Inspur NF8460M3,NF8465M3Inbbb Xeon E7-8857v2(12C,130W,3.0GHz)Processor Option Kit XeonE7-8857v2-Xeon3_8.0G_30M_12CSPT0CPU0002Q Inspur NF8460M3,NF8465M3Inbbb Xeon E7-8850v2(12C,105W,3.0GHz)Processor Option Kit BCX437XeonE7-8850v2-Xeon2.3_7.2G_24M_12C SPT0CPU0002R Inspur NF8460M3,NF8465M3Inbbb Xeon E7-8870v2(15C,130w,2.3GHz)Processor Option Kit XeonE7-8870v2-Xeon2.3_8.0G_30M_15CSPT0CPU0002S Inspur NF8460M3,NF8465M3Inbbb Xeon E7-8891v2(10C,155W,3.2GHz)Processor Option Kit XeonE7-8891v2-Xeon3.2_8G_37.5M_10CSPT0CPU0002T Inspur NF8460M3,NF8465M3Inbbb Xeon E7-8893v2(6C,155W,3.4GHz)Processor Option Kit XeonE7-8893v2-Xeon3.4_8G_37.5M_6CSPT0CPU0002U Inspur NF8460M4,NF8465M4Inbbb Xeon E7-4809v3(8C,115W,2.0GHz)Processor Option Kit BCX377XeonE7-4809v3(2.0GHz/8c)/6.4GT/20ML3 SPT0CPU0002V Inspur NF8460M4,NF8465M4Inbbb Xeon E7-4820v3(10C,115W,1.9GHz)Processor Option Kit BCX376XeonE7-4820v3(1.9GHz/10c)/6.4GT/25ML3 SPT0CPU0002W Inspur NF8460M4,NF8465M4Inbbb Xeon E7-4830v3(12C,115W,2.1GHz)Processor Option Kit BCX375XeonE7-4830v3(2.1GHz/12c)/8.0GT/30ML3 SPT0CPU0002X Inspur NF8460M4,NF8465M4Inbbb Xeon E7-4850v3(14C,115W,2.2GHz)Processor Option Kit BCX374XeonE7-4850v3(2.2GHz/14c)/8.0GT/35ML3 SPT0CPU0002Y Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8860v3(16C,140W,2.2GHz)Processor Option Kit BCX373XeonE7-8860v3(2.2GHz/16c)/9.6GT/40ML3 SPT0CPU00030Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8870v3(18C,140W,2.1GHz)Processor Option Kit BCX372XeonE7-8870v3(2.1GHz/18c)/9.6GT/45ML3 SPT0CPU00032Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8880v3(18C,150W,2.3GHz)Processor Option Kit BCX371XeonE7-8880v3(2.3GHz/18c)/9.6GT/45ML3 SPT0CPU00033Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8890v3(18C,165W,2.5GHz)Processor Option Kit BCX370XeonE7-8890v3(2.5GHz/18c)/9.6GT/45ML3 SPT0CPU0002Z Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8867v3(16C,165W,2.5GHz)Processor Option Kit BCX369XeonE7-8867v3(2.5GHz/16c)/9.6GT45ML3 SPT0CPU00034Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8891v3(10C,165W,2.8GHz)Processor Option Kit BCX368XeonE7-8891v3(2.8GHZ/10c)/9.6GT/45ML3 SPT0CPU00035Inspur NF8460M4,NF8465M4Inbbb Xeon E7-8893v3(4C,140W,3.2GHz)Processor Option Kit BCX367XeonE7-8893v3(3.2GHz/4c)/9.6GT/45ML3 SPT0CPU00003Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2609v3(6C,85W,1.9GHz)Processor Option Kit BCX323E5-2609v3(1.9GHz/6c)/6.4GT/15ML3SPT0CPU00004Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2620v3(6C,85W,2.4GHz)Processor Option Kit BCX324E5-2620v3(2.4GHz/6c)/8GT/15ML3SPT0CPU00005Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2630v3(8C,85W,2.4GHz)Processor Option Kit BCX325E5-2630v3(2.4GHz/8c)/8GT/20ML3SPT0CPU00006Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2637v3(4C,135W,3.5GHz)Processor Option Kit E5-2637v3(3.5GHz/4c)/9.6GT/15ML3SPT0CPU00007Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2640v3(8C,90W,2.6GHz)Processor Option Kit BCX326E5-2640v3(2.6GHz/8c)/8GT/20ML3SPT0CPU00008Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2643v3(6C,135W,3.4GHz)Processor Option Kit BCX339E5-2643v3(3.4GHz/6c)/9.6GT/20ML3SPT0CPU00009Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2650v3(10C,105W,2.3GHz)Processor Option Kit BCX327E5-2650v3(2.3GHz/10c)9.6GT/25ML3SPT0CPU00010Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2660v3(10C,105W,2.6GHz)Processor Option Kit BCX328E5-2660v3(2.6GHz/10c)9.6GT/25ML3 SPT0CPU00011Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2667v3(8C,135W,3.2GHz)Processor Option Kit E5-2667v3(3.2GHz/8c)9.6GT/20ML3SPT0CPU00012Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2670v3(12C,120W,2.3GHz)Processor Option Kit BCX329E5-2670v3(2.3GHz/12c)9.6GT/30ML3 SPT0CPU00013Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2680v3(12C,120W,2.5GHz)Processor Option Kit BCX330E5-2680v3(2.5GHz/12c)9.6GT/30ML3 SPT0CPU00015Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2690v3(12C,135W,2.6GHz)Processor Option Kit BCX331E5-2690v3(2.6GHz/12c)9.6GT/30ML3 SPT0CPU00016Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2695v3(14C,120W,2.3GHz)Processor Option Kit BCX333E5-2695v3(2.3GHz/14c)9.6GT/35ML3 SPT0CPU00017Inspur NF5280M4Inbbb Xeon E5-2697v3(14C,145W,2.6GHz)Processor Option Kit BCX334E5-2697v3(2.6GHz/14c)9.6GT/35ML3SPT0CPU00018Inspur NF5280M4Inbbb Xeon E5-2698v3(16C,135W,2.3GHz)Processor Option Kit BCX335E5-2698v3(2.3GHz/16c)9.6GT/40MLSPT0CPU00019Inspur NF5280M4Inbbb Xeon E5-2699v3(18C,145W,2.3GHz)Processor Option Kit E5-2699v3(2.3GHz/18c)9.6GT/45ML3SPT0CPU00014Inspur NF5280M4,NF5270M4Inbbb Xeon E5-2683v3(14C,120W,2.0GHz)Processor Option Kit E5-2683v3(2.0GHz/14C)/9.6GT/35ML3 BCX438XeonE3-1220V5(3.0GHZ)/8M/4CBCX439XeonE3-1230V5(3.40GHZ)/8M/4CBCX440XeonE3-1240V5(3.50GHZ)/8M/4CBCX441XeonE3-1240LV5(2.10GHZ)/8M/4CBCX442XeonE3-1260LV5(2.90GHZ)/8M/4CBCX443XeonE3-1270V5(3.60GHZ)/8M/4CBCX444XeonE3-1280V5(3.70GHZ)/8M/4CBCX445i3-6320(3.9GHz)/4M/2CBCX446i3-6300T(3.3GHz)/4M/2CBCX447i3-6300(3.8GHz)/4M/2CBCX448i3-6100T(3.2GHz)/3M/2CBCX449i3-6100(3.7GHz)/3M/2CBCX450G4520(3.0GHz)/3M/2CBCX451G4500T(3.0GHz)/3M/2CBCX452G4500(3.5GHz)/3M/2CBCX453G4400(3.3GHz)/3M/2CBCX322E5-2603v3(1.6GHz/6c)/6.4GT/15ML3BCX401E5-2603v4(1.7GHz/6c)/6.4GT/15ML3BCX402E5-2609v4(1.7GHz/8c)/6.4GT/20ML3BCX403E5-2620v4(2.1GHz/8c)/8GT/20ML3BCX406E5-2630v4(2.2GHz/10c)/8GT/25ML3BCX408E5-2640v4(2.4GHz/10c)/8GT/25ML3BCX412E5-2650v4(2.2GHz/12c)9.6GT/30ML3BCX414E5-2660v4(2.0GHz/14c)9.6GT/35ML3 BCX416E5-2680v4(2.4GHz/14c)9.6GT/35ML3 BCX419E5-2690v4(2.6GHz/14c)9.6GT/35ML3 BCX404E5-2623v4(2.6GHz/4c)8.0GT/10ML3 BCX407E5-2637v4(3.5GHz/4c)/9.6GT/15ML3 BCX409E5-2643v4(3.4GHz/6c)/9.6GT/20ML3 BCX415E5-2667v4(3.2GHz/8c)9.6GT/25ML3 BCX417E5-2683v4(2.1GHz/16c)/9.6GT/40ML3 BCX420E5-2695v4(2.1GHz/18c)9.6GT/45ML3 BCX422E5-2697v4(2.3GHz/18c)9.6GT/45ML3 BCX421E5-2697Av4(2.6GHz/16c)9.6GT/40ML3 BCX423E5-2698v4(2.2GHz/20c)9.6GT/50ML BCX424E5-2699v4(2.2GHz/22c)9.6GT/55ML3 BCX405E5-2630LV4(1.8GHz/10c)8.0GT/25ML3 BCX411E5-2650LV4(1.7GHz/14c)9.6GT/35ML3 BCX410E5-2648LV4(1.8GHz/14c)9.6GT/35ML3 BCX413E5-2658V4(2.3GHz/14c)9.6GT/35ML3 BCX418E5-2687WV4(3.0GHz/12c)9.6GT/35ML3 BCX425XeonE7-4809v4(2.1GHz/8C)/6.4GT/20ML3 BCX426XeonE7-4820v4(2.0GHz/10C)/6.4GT/25ML3 BCX427XeonE7-4830v4(2.0GHz/14C)/8.0GT/35ML3 BCX428XeonE7-4850v4(2.1GHz/16C)/8.0GT/40ML3 BCX429XeonE7-8860v4(2.2GHz/18C)/9.6GT/45ML3 BCX430XeonE7-8855v4(2.1GHz/14C)/8.0GT/35ML3 BCX431XeonE7-8867v4(2.4GHz/18C)/9.6GT/45ML3 BCX432XeonE7-8870v4(2.1GHz/20C)/9.6GT/50ML3 BCX433XeonE7-8880v4(2.2GHz/22C)/9.6GT/55ML3 BCX434XeonE7-8890v4(2.2GHz/24C)/9.6GT/60ML3 BCX435XeonE7-8891v4(2.8GHz/10C)/9.6GT/60ML3 BCX436XeonE7-8893v4(3.2GHz/4C)/9.6GT/60ML3 DDR3内存SPT0MEM00006Inspur32GB DDR3L-1600LRDIMM SPT0MEM00007Inspur16GB DDR3-1866RDIMMSPT0MEM00008Inspur16GB DDR3-1600RDIMMSPT0MEM00009Inspur16GB DDR3L-1600RDIMMSPT0MEM0000A Inspur8GB DDR3-1600RDIMMSPT0MEM0000B Inspur8GB DDR3L-1600RDIMMSPT0MEM0000C Inspur4GB DDR3-1600RDIMMSPT0MEM0000D Inspur4GB DDR3L-1600RDIMMDDR4内存DDR4内存BMD1558G_DDR4_UDIMM-EUBMD15616G_DDR4_UDIMM-EUSPT0MEM00002Inspur8GB DDR4-2133MHz(1Rx4)RDIMM BMD1418G RDIMM DDR4内存SPT0MEM00001Inspur16GB DDR4-2133MHz(2Rx4)RDIMM BMD14216G RDIMM DDR4内存SPT0MEM00003Inspur16GB DDR4-2133MHz(1Rx4)RDIMMSPT0MEM00004Inspur32GB DDR4-2133MHz(2Rx4)RDIMM BMD14332G LRDIMM DDR4内存SPT0MEM00005Inspur32GB DDR4-2133MHz(4Rx4)LRDIMM3.5寸企业级SATA（含托架及包装）3.5寸企业级SATA（含托架及包装）SPT0STG35007Inspur3.5"1TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT0231TB SATA（企业级）SPT0STG35001Inspur3.5"2TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT0422TB SATA（企业级）SPT0STG35006Inspur3.5"3TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT0703TB SATA（企业级）SPT0STG35005Inspur3.5"4TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT0834TB SATA（企业级）SPT0STG35003Inspur3.5"6TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT1076TB SATA（企业级）SPT0STG35002Inspur3.5"8TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive8TB SATA（企业级）2.5寸企业级SATA（含托架及包装）2.5寸企业级SATA（含托架及包装）SPT0STG25006Inspur2.5"500GB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT062500GB SATA 2.5"（企业级）SPT0STG25005Inspur2.5"1TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive BHT0611TB SATA 2.5"（企业级）SPT0STG25004Inspur2.5''2TB7.2K Enterprise SATA6Gbps Hot Swap HardDrive2TB SATA 2.5"（企业级）2.5寸SAS（含托架及包装）2.5寸SAS（含托架及包装）7,200RPM7,204RPMSPT0STG25S03Inspur2.5"1TB7.2K Enterprise SAS12Gbps Hot Swap Hard Drive BSA0531TB SAS硬盘2.5"SPT0STG25S05Inspur2.5"1TB7.2K Enterprise SAS6Gbps Hot Swap Hard Drive BSA0531TB SAS硬盘2.5"SPT0STG25S01Inspur2.5"2TB7.2K Enterprise SAS12Gbps Hot Swap Hard Drive2TB SAS硬盘2.5"10,000RPM10,004RPMSPT0STG25001Inspur2.5"1.2TB10K Enterprise SAS12Gbps Hot Swap Hard Drive BSA0841.2T热插拔SAS硬盘(1万转)2.5" SPT0STG25002Inspur2.5"1.2TB10K Enterprise SAS6Gbps Hot Swap Hard Drive BSA0841.2T热插拔SAS硬盘(1万转)2.5"SPT0STG25S02Inspur2.5"1.8TB10K Enterprise SAS12Gbps Hot Swap Hard Drive BSA1091.8T热插拔SAS硬盘(1万转)2.5"SPT0STG25S0E Inspur2.5"300GB10K Enterprise SAS12Gbps Hot Swap Hard Drive BSA023300G热插拔SAS硬盘(1万转)2.5"SPT0STG25S0G Inspur2.5"300GB10K Enterprise SAS6Gbps Hot Swap Hard Drive BSA023300G热插拔SAS硬盘(1万转)2.5"SPT0STG25S08Inspur2.5"600GB10K Enterprise SAS12Gbps Hot Swap Hard Drive BSA036600G热插拔SAS硬盘(1万转)2.5"SPT0STG25S09Inspur2.5"600GB10K Enterprise SAS6Gbps Hot Swap Hard Drive BSA036600G热插拔SAS硬盘(1万转)2.5"SPT0STG25S04Inspur2.5"900GB10K Enterprise SAS12Gbps Hot Swap Hard Drive BSA057900G热插拔SAS硬盘(1万转)2.5"SPT0STG25S06Inspur2.5"900GB10K Enterprise SAS6Gbps Hot Swap Hard Drive BSA057900G热插拔SAS硬盘(1万转)2.5"15,000RPM15,004RPMSPT0STG25S0D Inspur2.5"300GB15K Enterprise SAS12Gbps Hot Swap Hard Drive BSA059300G热插拔SAS硬盘(1万5千转)2.5"希捷SPT0STG25S0F Inspur2.5"300GB15K Enterprise SAS6Gbps Hot Swap Hard Drive BSA059300G热插拔SAS硬盘(1万5千转)2.5"希捷SPT0STG25S07Inspur2.5"600GB15K Enterprise SAS12Gbps Hot Swap Hard Drive BSA108600G热插拔SAS硬盘(1万5千转)2.5"日立SPT0STG25003Inspur2.5"600GB15K Enterprise SAS6Gbps Hot Swap Hard Drive600G热插拔SAS硬盘(1万5千转)2.5"日立3.5寸SAS（含托架及包装）3.5寸SAS（含托架及包装）SPT0STG35S09Inspur3.5"1TB7.2K Enterprise SAS6Gbps Hot Swap Hard Drive TYP0231TB SAS硬盘SPT0STG35S08Inspur3.5"2TB7.2K Enterprise SAS6Gbps Hot Swap Hard Drive BSA0762TB SAS硬盘SPT0STG35S05Inspur3.5"2TB7.2K Enterprose SAS12Gbps Hot Swap Hard Drive BSA0762TB SAS硬盘SPT0STG35S07Inspur3.5"3TB7.2K Enterprise SAS6Gbps Hot Swap Hard Drive TCP0493TB SAS硬盘SPT0STG35S04Inspur3.5"3TB7.2K Enterprose SAS12Gbps Hot Swap Hard Drive TCP0493TB SAS硬盘SPT0STG35S06Inspur3.5"4TB7.2K Enterprise SAS6Gbps Hot Swap Hard Drive BSA1064TB SAS硬盘SPT0STG35S03Inspur3.5"4TB7.2K Enterprose SAS12Gbps Hot Swap Hard Drive BSA1064TB SAS硬盘SPT0STG35S01Inspur3.5"6TB7.2K Enterprose SAS12Gbps Hot Swap Hard Drive6TB SAS硬盘3.5寸硬盘托架，2.5寸SAS硬盘7,200RPM7,204RPMSPT0STG25S0N Inspur2.5"1TB7.2K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA0531TB SAS硬盘2.5"SPT0STG25S0P Inspur2.5"1TB7.2K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA0531TB SAS硬盘2.5"SPT0STG25S0H Inspur2.5"2TB7.2K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray2TB SAS硬盘2.5"10,000RPM10,004RPMSPT0STG25S0K Inspur2.5"1.2TB10K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA0841.2T热插拔SAS硬盘(1万转)2.5"SPT0STG25S0M Inspur2.5"1.2TB10K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA0841.2T热插拔SAS硬盘(1万转)2.5"SPT0STG25S0J Inspur2.5"1.8TB10K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA1091.8T热插拔SAS硬盘(1万转)2.5"SPT0STG25S11Inspur2.5"300GB10K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA023300G热插拔SAS硬盘(1万转)2.5" SPT0STG25S13Inspur2.5"300GB10K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA023300G热插拔SAS硬盘(1万转)2.5" SPT0STG25S0T Inspur2.5"600GB10K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA036600G热插拔SAS硬盘(1万转)2.5"SPT0STG25S0V Inspur2.5"600GB10K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA036600G热插拔SAS硬盘(1万转)2.5"SPT0STG25S0Q Inspur2.5"900GB10K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA057900G热插拔SAS硬盘(1万转)2.5"SPT0STG25S0R Inspur2.5"900GB10K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA057900G热插拔SAS硬盘(1万转)2.5"15,000RPM15,004RPMSPT0STG25S0Z Inspur2.5"300GB15K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA059300G热插拔SAS硬盘(1万5千转)2.5"希捷SPT0STG25S12Inspur2.5"300GB15K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray BSA059300G热插拔SAS硬盘(1万5千转)2.5"希捷SPT0STG25S0S Inspur2.5"600GB15K Enterprise SAS12Gbps Hot Swap HDD in3.5"Tray BSA108600G热插拔SAS硬盘(1万5千转)2.5"日立SPT0STG25S0U Inspur2.5"600GB15K Enterprise SAS6Gbps Hot Swap HDD in3.5"Tray600G热插拔SAS硬盘(1万5千转)2.5"日立3.5寸云盘和归档盘（含托架及包装）3.5寸云盘和归档盘（含托架及包装）SPT0STG3500A Inspur3.5"4TB7.2K Cloud Storage SATA6Gbps Hot Swap Hard Drive4T云盘（7200转）V03ZVSPT0STG3500E Inspur3.5"4TB5.9K Cloud Storage SATA6Gbps Hot Swap Hard Drive4T云盘（5900转）_W0CCP0B0000060053.5寸硬盘托架，2.5寸企业级SATA3.5寸硬盘托架，2.5寸企业级SATASPT0STG25008Inspur2.5"2TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive in3.5"tray2TB SATA 2.5"（企业级）SPT0STG25009Inspur2.5"1TB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive in3.5"tray1TB SATA 2.5"（企业级）SPT0STG2500A Inspur2.5"500GB7.2K Enterprise SATA6Gbps Hot Swap Hard Drive in3.5"tray500GB SATA 2.5"（企业级）PCIE SSD卡PCIE SSD卡BHD025400G MLC SSD PCIe接口BHD026600G MLC SSD PCIe接口BHD024800G MLC SSD PCIe接口BHD0231.2T MLC SSD PCIe接口BHD0272.4T MLC SSD PCIe接口其他硬盘及组件其他硬盘及组件BHE00264G SATA-DOM硬盘BHD02880G MLC SSD 2.5BHD029120G MLC SSD 2.5BHD004160G MLC SSD 2.5BHD030240G MLC SSD 2.5BHD010300G MLC SSD 2.5BHD016480G MLC SSD 2.5BHD009600G MLC SSD 2.5BHD019800G MLC SSD 2.5TYP004500GB SATA（桌面级）BPT0201T SATA（桌面级）BSA012300G热插拔SAS硬盘(1万5千转)RAID卡RAID卡SPT0POC00R06Inspur SAS3008iMR12Gbps PCIe Adapter BSS012INSPUR八通道高性能SAS3008卡IMR（可选Raid key)SPT0THR00K02Inspur RAID5Upgrate key for SAS3008iMR12Gbps PCIe Adapter BSS013INSPUR八通道高性能3008Raid KeySPT0POC00R02Inspur RAID1GB9271-8i6Gbps PCIe Adapter by Avago BRE028八通道SAS高性能RAID-9271（1G缓存)SPT0THR00D02Inspur iBBU09Battery Backup Unit Upgrade for RAID2208MR,9271-8i PCIe Adapter BDC020八通道SAS高性能RAID-9271电池SPT0THR00D05Inspur Supercapacitor Upgrade for RAID2208MR,9271-8i PCIe Adapter BDC022八通道SAS高性能RAID-9271缓存断电保护模块SPT0THR00K03Inspur RAID CacheCade Pro2.0Key for2208MR,3108MR,9271-8i,9361-8i BRE032RAID卡功能模块-CacheCade模块SPT0POC00R0G Inspur RAID2GB PM806012Gbps PCIe Adapter BDC027INSPUR八通道高性能SAS RAID卡RS0820P(2G缓存)SPT0THR00D01Inspur Supercapacitor for RAID PM8060(1GB,2GB)PCIe Adapter by Adaptec BRE038INSPUR八通道高性能SAS RS0810P缓存断电保护模块SPT0POC00R09Inspur RAID1GB9361-8i12Gbps PCIe Adapter by Avago BRE034八通道SAS高性能RAID-9361（1G缓存)SPT0THR00D03Inspur Supercapacitor Upgrade for RAID1GB9361-8i PCIe Adapter by LSI BDC026八通道SAS高性能RAID-9361（1G缓存)缓存断电保护模块SPT0POC00R08Inspur RAID2GB9361-8i12Gbps PCIe Adapter by Avago BRD036八通道SAS高性能RAID-9361（2G缓存)SPT0THR00D04Inspur Supercapacitor Upgrade for RAID9361-8i(2GB),3108MR(2GB,4GB)by LSI BDC025八通道SAS高性能RAID-9361（2G缓存)缓存断电保护模块SPT0POC00R07Inspur RAID4GB9364-8i12Gbps PCIe Adapter by Avago BRD037八通道SAS高性能LSI RAID-9364（4G缓存+缓存断电保护模块）SPT0POC00R0A Inspur RAID4GB3108MR12Gbps PCIe Adapter BRE040INSPUR八通道高性能SAS RAID卡RS0840L3(4G缓存)电源电源SPT0PSU00001Inspur CRPS800W Platinum Hot Swap Power SupplySPT0PSU00002Inspur CRPS1200W Platinum Hot Swap Power SupplySPT0PSU00003Inspur CRPS550W Platinum Hot Swap Power SupplySPT0PSU00004Inspur CRPS800W Titanium Hot Swap Power SupplySPT0PSU00005Inspur CRPS800W-48VDC Hot Swap Power SupplySPT0PSU00006Inspur CRPS800W336VDC Hot Swap Power SupplyBDY096300W电源适用于NP3020M4BDY097550W白金电源适用于NP3020M4光纤通道连接配件光纤通道连接配件SPT0POC00B01Inspur LPe1250Single Port8Gb Fibre Channel HBA by Emulex TAF019光纤通道HBA卡,FC8Gb,单端口,LC接口SPT0POC00B02Inspur LPe12002Dual Port8Gb Fibre Channel HBA by Emulex TAF021光纤通道HBA卡,FC8Gb,双端口,LC接口SPT0POC00B05Inspur QLE2560Single Port8Gb Fibre Channel HBA by Qlogic TAF019光纤通道HBA卡,FC8Gb,单端口,LC接口SPT0POC00B06Inspur QLE2562Dual Port8Gb Fibre Channel HBA by Qlogic TAF021光纤通道HBA卡,FC8Gb,双端口,LC接口SPT0POC00B03Inspur LPe16000B Single Port16Gb Fibre Channel HBA by Emulex TAF028光纤通道HBA卡,FC16Gb,单端口,LC接口SPT0POC00B07Inspur QLE2670Single Port16Gb Fibre Channel HBA by Qlogic TAF028光纤通道HBA卡,FC16Gb,单端口,LC接口SPT0POC00B04Inspur LPe16002B Dual Port16Gb Fibre Channel Adapter by Emulex TAF029光纤通道HBA卡,FC16Gb,双端口,LC接口转接卡转接卡BKZ013PCI-E转接卡套件（NF8460M3）PCI-E转接卡套件（NF8460M4）网卡及远程管理卡网卡及远程管理卡SPT0POC00W01Inspur I350PCIe1Gb2Port Base-T Ethernet Adapter BNT004双口千兆网卡（RJ45接口）SPT0POC00W02Inspur I350PCIe1Gb4Port Base-T Ethernet Adapter BNT010四口千兆网卡（RJ45接口）SPT0POC00W06Inspur I350PCIe1Gb4Port SPF Ethernet Adapter BNT042四口千兆网卡（光纤接口）SPT0POC00W07Inspur82599ES PCIe10Gb1Port with Multi-mode SFP+module Ethernet Adapter单口万兆网卡（光纤接口含多模模块）SPT0POC00W09Inspur MCX312B-XCCT PCIe10Gb2Port SFP+Ethernet Adapter BNT009双口万兆网卡（光纤接口）SPT0POC00W08Inspur82599ES PCIe10Gb2Port with Multi-mode SFP+module Ethernet Adapter双口万兆网卡（光纤接口含多模模块）SPT0POC00W0J Inspur X710PCIe x8+x110Gb2Port SFP+Ethernet Daughter Card出厂前升级INSPUR双口万兆FLOM网卡（光纤接口），不含光模块SPT0POC00W0H Inspur82599ES PCIe x8+x110Gb1Port SFP+Ethernet Adapter BNT034INSPUR单口万兆网卡（光纤接口），不含光模块SPT0POC00W0K Inspur CX3PCIe x8+110Gb1Port SFP+Ethernet Adapter BNT034INSPUR单口万兆网卡（光纤接口），不含光模块SPT0POC00W0G Inspur82599ES PCIe x8+x110Gb2Port SFP+Ethernet Adapter BNT035INSPUR双口万兆网卡（光纤接口），不含光模块SPT0POC00W0L Inspur CX3PCIe x8+110Gb2Port SFP+Ethernet AdapterSPT0THR00S01Inspur1Gb Single-Mode SPF+Optical Module INSPUR千兆网卡光模块（单模，搭配INSPUR万兆网卡使用）SPT0THR00S02Inspur1Gb Multi-Mode SFP+Optical Module INSPUR千兆网卡光模块（多模，搭配INSPUR万兆网卡使用）SPT0THR00S03Inspur10Gb Single-Mode SFP+Optical Module BNT036INSPUR万兆网卡光模块（单模，搭配INSPUR万兆网卡使用）SPT0THR00S04Inspur10Gb Multi-Mode SFP+Optical Module BNT037INSPUR万兆网卡光模块（多模，搭配INSPUR万兆网卡使用）SPT0POC00W0A Inspur T580-SO-CR PCIe40Gb2Port QSFP+Ethernet Adapter BNT039双口40GbE网卡光纤接口，不含光模块，需搭配40G网卡线缆使用SPT0POC00W03Inspur X540PCIe10Gb2Port Base-T Ethernet Adapter BNT030双口万兆网卡（RJ45接口）SPT0POC00W04Inspur I350PCIe x8+11Gb4Port Base-T Ethernet Adapter出厂前升级INSPUR四口千兆网卡（RJ45接口）SPT0POC00W05Inspur X540PCIe x8+110Gb2Port Base-T Ethernet Adapter INSPUR双口万兆网卡（RJ45接口）BNT002单口千兆网卡（光纤接口）BNT005双口千兆网卡（光纤接口）BNT008单口万兆网卡（光纤接口）BNT040双口40GbE CNA网卡光纤接口，不含光模块，需搭配40G网卡线缆使用BNT04140G网卡线缆，15米Infiniband card Infiniband cardSPT0POC00C01Inspur MCX353A-FCBT56Gb1Port with QSFP Module InfiniBand Adapter TAF027HCA卡(单口IB卡56GB)SPT0POC00C02Inspur MCX353A-FCBT56Gb2Port with QSFP Module InfiniBand Adapter HCA卡(双口IB卡56GB)软驱、光驱、刻录机软驱、光驱、刻录机BHU001U盘软驱MGQ002标准DVDBCD006DVD刻录机BCD017USB DVD刻录机BCD026SLIM DVD刻录机显卡显卡BXK039显卡K420（显存1G）BXK040显卡K620（显存2G）BXK041显卡K2200（显存4G）显示器显示器BOV01419.5寸液晶显示器BOV00921.5寸液晶显示器BOV01523.6寸液晶显示器RACK机柜及组件RACK机柜及组件BOG022浪潮42U标准服务器机柜（无PDU）/2000mm×1100mm×600mm（H×D×W）BPK0396口PDU国标万用插口/10ABPK03821口PDU国标万用插口/32ABTP00140公斤机柜托盘BTP002100公斤机柜托盘BOK001键盘B0M001鼠标BOQ008四合一切换器17寸液晶8口/USBBOQ009四合一切换器17寸液晶16口/USBBOQ0018口切换器BOQ00516口切换器其他其他BPT002配件，背板_INSPUR_SAS_2.5X8BPT017硬盘模组_2.5×8BPT003配件，背板_INSPUR_SAS12G_4X3.5BPT004配件，背板_INSPUR_SAS12G_8X2.5BPT008配件，SAS线BPT010配件，风扇BPT011配件，硬盘托架_2.5寸BPT012配件，硬盘托架_3.5寸BPT013配件，包装箱BPT014配件，电源线BPT015配件，服务器用户手册及睿捷服务器套件光盘BPL001NF5270M42U前面板V08WY0208000B014SPT0BKD00001Inspur Milestone42U3.5"x4Drive Backplane Kit SPT0BKD00002Inspur Milestone42U Rear2.5"x2Drive Backplane Kit SPT0BKD00003Inspur Milestone42U2.5"x8Drive Backplane Kit。
H3C S5800 版本说明书
H3C S5800_5820X-CMW520-R1810P16 版本说明书Copyright © 2018新华三技术有限公司版权所有，保留一切权利。
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目录1 版本信息 (1)1.1 版本号 (1)1.2 历史版本信息 (1)1.3 版本配套表 (4)1.4 ISSU版本兼容列表 (5)1.5 版本升级注意事项 (6)2 硬件特性变更说明 (6)2.1 R1810P16版本硬件特性变更说明 (6)2.2 R1810P13版本硬件特性变更说明 (6)2.3 R1810P12版本硬件特性变更说明 (6)2.4 R1810P10版本硬件特性变更说明 (6)2.5 R1810P08版本硬件特性变更说明 (7)2.6 R1810P06版本硬件特性变更说明 (7)2.7 R1810P05版本硬件特性变更说明 (7)2.8 R1810版本硬件特性变更说明 (7)2.9 R1809P11版本硬件特性变更说明 (7)2.10 R1809P10版本硬件特性变更说明 (7)2.11 R1809P09版本硬件特性变更说明 (7)2.12 R1809P06版本硬件特性变更说明 (7)2.13 R1809P05版本硬件特性变更说明 (7)2.14 R1809P03版本硬件特性变更说明 (7)2.15 R1809P01版本硬件特性变更说明 (7)2.16 R1808P27版本硬件特性变更说明 (8)2.17 R1808P25版本硬件特性变更说明 (8)2.18 R1808P23版本硬件特性变更说明 (8)2.19 R1808P22版本硬件特性变更说明 (8)2.20 R1808P21版本硬件特性变更说明 (8)2.21 R1808P17版本硬件特性变更说明 (8)2.22 R1808P15版本硬件特性变更说明 (8)2.23 R1808P13版本硬件特性变更说明 (8)2.24 R1808P11版本硬件特性变更说明 (8)2.25 R1808P08版本硬件特性变更说明 (8)2.26 R1808P06版本硬件特性变更说明 (8)i2.29 F1807P01版本硬件特性变更说明 (9)2.30 R1805P02版本硬件特性变更说明 (9)2.31 R1211P08版本硬件特性变更说明 (9)2.32 R1211P06版本硬件特性变更说明 (9)2.33 R1211P03版本硬件特性变更说明 (9)2.34 R1211P02版本硬件特性变更说明 (9)2.35 R1211版本硬件特性变更说明 (9)2.36 F1209P01版本硬件特性变更说明 (9)2.37 F1209版本硬件特性变更说明 (9)2.38 F1208版本硬件特性变更说明 (10)2.39 F1207版本硬件特性变更说明 (10)2.40 R1206版本硬件特性变更说明 (10)2.41 R1110P05版本硬件特性变更说明 (10)2.42 R1110P04版本硬件特性变更说明 (10)3 软件特性及命令行变更说明 (10)4 MIB变更说明 (10)5 操作方式变更说明 (16)5.1 R1810P16版本操作方式变更 (16)5.2 R1810P13版本操作方式变更 (16)5.3 R1810P12版本操作方式变更 (16)5.4 R1810P10版本操作方式变更 (16)5.5 R1810P08版本操作方式变更 (17)5.6 R1810P06版本操作方式变更 (17)5.7 R1810P05版本操作方式变更 (17)5.8 R1810版本操作方式变更 (17)5.9 R1809P11版本操作方式变更 (17)5.10 R1809P10版本操作方式变更 (17)5.11 R1809P09版本操作方式变更 (17)5.12 R1809P06版本操作方式变更 (17)5.13 R1809P05版本操作方式变更 (18)5.14 R1809P03版本操作方式变更 (18)5.15 R1809P01版本操作方式变更 (18)5.16 R1808P27版本操作方式变更 (18)5.17 R1808P25版本操作方式变更 (18)ii5.20 R1808P21版本操作方式变更 (18)5.21 R1808P17版本操作方式变更 (19)5.22 R1808P15版本操作方式变更 (19)5.23 R1808P13版本操作方式变更 (19)5.24 R1808P11版本操作方式变更 (19)5.25 R1808P08版本操作方式变更 (19)5.26 R1808P06版本操作方式变更 (19)5.27 R1808P02版本操作方式变更 (19)5.28 R1807P02版本操作方式变更 (20)5.29 F1807P01版本操作方式变更 (20)5.30 R1805P02版本操作方式变更 (20)5.31 R1211P08版本操作方式变更 (20)5.32 R1211P06版本操作方式变更 (21)5.33 R1211P03版本操作方式变更 (21)5.34 R1211P02版本操作方式变更 (21)5.35 R1211版本操作方式变更 (21)5.36 F1209P01版本操作方式变更 (21)5.37 F1209版本操作方式变更 (21)5.38 F1208版本操作方式变更 (21)5.39 F1207版本操作方式变更 (22)5.40 R1206版本操作方式变更 (22)5.41 R1110P05版本操作方式变更 (22)5.42 R1110P04版本操作方式变更 (23)6 版本使用限制及注意事项 (23)7 存在问题与规避措施 (23)8 解决问题列表 (24)8.1 R1810P16版本解决问题列表 (24)8.2 R1810P13版本解决问题列表 (24)8.3 R1810P12版本解决问题列表 (25)8.4 R1810P10版本解决问题列表 (26)8.5 R1810P08版本解决问题列表 (27)8.6 R1810P06版本解决问题列表 (28)8.7 R1810P05版本解决问题列表 (28)8.8 R1810版本解决问题列表 (28)iii8.11 R1809P09版本解决问题列表 (30)8.12 R1809P06版本解决问题列表 (31)8.13 R1809P05版本解决问题列表 (32)8.14 R1809P03版本解决问题列表 (33)8.15 R1809P01版本解决问题列表 (34)8.16 R1808P27版本解决问题列表 (36)8.17 R1808P25版本解决问题列表 (36)8.18 R1808P23版本解决问题列表 (38)8.19 R1808P22版本解决问题列表 (38)8.20 R1808P21版本解决问题列表 (39)8.21 R1808P17版本解决问题列表 (39)8.22 R1808P15版本解决问题列表 (40)8.23 R1808P13版本解决问题列表 (41)8.24 R1808P11版本解决问题列表 (42)8.25 R1808P08版本解决问题列表 (44)8.26 R1808P06版本解决问题列表 (44)8.27 R1808P02版本解决问题列表 (46)8.28 R1807P02版本解决问题列表 (49)8.29 F1807P01版本解决问题列表 (50)8.30 R1805P02版本解决问题列表 (50)8.31 R1211P08版本解决问题列表 (53)8.32 R1211P06版本解决问题列表 (53)8.33 R1211P03版本解决问题列表 (57)8.34 R1211P02版本解决问题列表 (57)8.35 R1211版本解决问题列表 (58)8.36 F1209P01版本解决问题列表 (62)8.37 F1209版本解决问题列表 (62)8.38 F1208版本解决问题列表 (63)8.39 F1207版本解决问题列表 (65)8.40 R1206版本解决问题列表 (65)8.41 R1110P05版本解决问题列表 (66)8.42 R1110P04版本解决问题列表 (68)9 相关资料 (70)9.1 相关资料清单 (70)iv10 技术支持 (70)附录 A 本版本支持的软、硬件特性列表 (71)A.1 版本硬件特性 (71)A.2 版本软件特性 (73)附录 B 版本升级操作指导 (84)B.1 简介 (84)B.2 软件加载方式简介 (84)B.3 BootRom界面加载 (85)B.3.1 BootRom界面介绍 (85)B.3.2 通过Console口利用XModem完成加载 (89)B.3.3 通过以太网口利用TFTP完成加载 (100)B.3.4 通过以太网口利用FTP完成加载 (103)B.4 命令行接口加载 (107)B.4.1 通过USB口实现软件加载 (107)B.4.2 通过FTP实现软件加载 (107)B.4.3 通过TFTP实现软件加载 (109)v表目录表1 历史版本信息表 (1)表2 版本配套表 (4)表3 ISSU版本兼容列表 (5)表4 MIB文件变更说明 (10)表5 S5800系列产品硬件特性 (71)表6 S5820X系列产品硬件特性 (72)表7 S5800系列产品软件特性 (73)表8 S5820X系列产品软件特性 (79)表9 交换机软件加载方式一览表 (84)表10 基本BOOT菜单说明 (86)表11 基本BOOT辅助菜单说明 (86)表12 扩展BOOT菜单说明 (87)表13 扩展BOOT辅助菜单说明 (89)表14 通过Console口利用XModem加载系统文件 (93)表15 BootRom升级选择菜单 (94)表16 协议选择及参数设置菜单 (95)表17 通过以太网口利用TFTP加载系统文件 (100)表18 TFTP协议相关参数的设置说明 (102)表19 通过以太网口利用FTP加载系统文件 (104)表20 FTP协议相关参数的设置说明 (105)vi本文介绍了H3C S5800_5820X-CMW520-R1810P16版本的特性、使用限制、存在问题及规避措施等，在加载此版本前，建议您备份配置文件，并进行内部验证，以避免可能存在的风险。
SS52中文资料
4000
SS53
CAPACITANCE, (pF)
10
SS54
1000
SS52-SS54
SS55-SS56
1.0
SS58-SS510
SS55-SS56
T J = 25°C
T J = 25°C f = 1 MHz
100 0.1
0.1 1 10 100 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 REVERSE VOLTAGE ,VOLTS INSTANTANEOUS FORWARD VOLTAGE, VOLTS
CHARACTERISTICS
Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current 0.375″（9.5mm) Lead Lengths Peak Forward Surage Current 8.3ms Single Half Sine-Wave Super Imposed on Rated Load(JEDEC Method) Maximum Forward Voltage at 5.0A DC Maximum DC Reverse Current at Rated DC Bolcking Voltage Typical Junction Capacitance (Note1) Typical Thermal Resistance (Note2) Operating Temperature Range Storage Temperature Range @TJ=25℃ @TJ=100℃ @TL=95 ℃
Tomato DualWAN已知支持下列设备
说明：支持VLAN一栏如果是Y的说明该设备的WAN2可以接有线网络或者无线网络，WAN2为原WAN旁边的LAN口；如果支持VLAN一栏是N的则该设备的WAN2只能接无线网络
刷非ND版的设备列表
型号
硬件版本
支持VLAN
固件文件名
备注
Linksys WRT54GS
Linksys WRH54G
Y
Tomato-ND.trx
需将Flash升级到4M或更大,内存升级到16M或更大
Linksys WRT54G2
Y
Tomato-ND.trx
需将Flash升级到4M或更大,内存升级到16M或更大，感谢leeanky提供信息
磊科NW 618
Y
Tomato-ND.trx
从Web升必须要从原版固件刷过来，否则可能变砖。用TFTP升则没有此问题，感谢拒绝飞翔的鸟提供此信息。
Y
Tomato.trx
DELL TrueMobile 2300
V2
Y
Tomato.trx
Buffalo WHR-HP-G54
Y
Tomato.trx
WAN2口为远离WAN口的LAN1口
Buffalo WVR-G54-NF
N
Tomato.trx
Asus WL-300G
V1.91
Y
Tomato.trx
WL-300G只有一个LAN口，只有实验性质，不具备实用价值
1.0, 2.0
Y
WRT54GS.bin
Linksys WRT54GS
1.1
Y
WRT54GS.bin
点此看21楼网友说WRT54GS V1.1支持vlan
各类现场总线光纤中继器进口型号对照表
PROFIBUS DP/FMS 总线转光纤：SIEMENS(西门子) OLM系列 VS 易控达YFP系列Repeater(6ES7972-0AA01-0xA0) 两端口总线隔离中继器 YHP3 三端口总线隔离中继器 OBT(6GK1500-3AAxx) 二对单模光纤接口 YFP2-S-STOLM V31系列产品对照OLM P11(6GK1502-2CAxx) 一对塑料纤维光口 可用YFP1代替,需换成玻璃光纤 OLM P12(6GK1502-3CAxx) 二对塑料纤维光口 可用YFP2代替,需换成玻璃光纤 OLM G11(6GK1502-2CBxx) 一对多模光纤接口 YFP1-M-STOLM G12(6GK1502-3CBxx) 二对多模光纤接口 YFP2-M-STOLM G12-EEC(6GK1503-2CDxx) 二对多模光纤接口 YFP2-M-STOLM G11-1300(6GK1502-2CCxx) 一对单模光纤接口 YFP1-S-STOLM G12-1300(6GK1502-3CCxx) 二对单模光纤接口 YFP2-S-STOLM V40系列产品对照OLM P11(6GK1503-2CAxx) 一对塑料纤维光口 可用YFP1代替,需换成玻璃光纤 OLM P12(6GK1503-3CAxx) 二对塑料纤维光口 可用YFP2代替,需换成玻璃光纤 OLM G11(6GK1503-2CBxx) 一对多模光纤接口 YFP1-M-STOLM G12(6GK1503-3CBxx) 二对多模光纤接口 YFP2-M-STOLM G12-EEC(6GK1503-2CDxx) 二对多模光纤接口 YFP2-M-STOLM G11-1300(6GK1503-2CCxx) 一对单模光纤接口 YFP1-S-STOLM G12-1300(6GK1503-3CCxx) 二对单模光纤接口 YFP2-S-STPROFIBUS DP/FMS 总线转光纤：HIRSCHMANN (赫斯曼)的OZD系列 VS 易控达YFP系列OZD Profi 12M P11(943 728-221) 一对塑料纤维光口 可用YFP1代替,需换成玻璃光纤 OZD Profi 12M P12(943 728-321) 二对塑料纤维光口 可用YFP2代替,需换成玻璃光纤 OZD Profi 12M G11(943 727-221) 一对多模光纤接口 YFP1-M-STOZD Profi 12M G12(943 727-321) 二对多模光纤接口 YFP2-M-STOZD Profi 12M G12-EEC(943 730-321) 二对多模光纤接口 YFP2-M-STOZD Profi 12M G11-1300(943 729-221) 一对单模光纤接口 YFP1-S-STOZD Profi 12M G12-1300(943 729-321) 二对单模光纤接口 YFP2-S-STOZD Modbus PLUS G12(943 740-021) 二对多模光纤接口 YFB2-M-ST OZD Modbus PLUS G12-1300(943 821-021) 二对单模光纤接口 YFB2-S-ST OZD Genius G12(933 989-021) 二对多模光纤接 YFG2-M-ST OZD Genius G12-1300(934 233-021) 二对单模光纤接 YFG2-S-ST CONTROLNET总线转光纤:ROCKWELL(罗克韦尔)，AB的1786系列 VS 易控达YFN系列YFN产品型号 1786-产品组合 功 能 描 述YFN1-M-ST 1786-RPA :11786-RPFS:1单光口短距离光纤链路模块,不同的是光纤介质不同,YFN1使用多模光纤YFN1-M-ST 1786-RPA :11786-RPFM:1单光口中距离光纤链路模块,多模光纤,3KMYFN1-S-ST -- 单光口长距离光纤链路模块,单模光纤,20KMYFN2-M-ST -- 具有环环冗余功能的多模光纤链路模块双光口,有自愈保护功能AB的产品中具有环网功能的仅有单模产品YFN2-S-ST 1786-RPA :11786-RPFRL:1具有环环冗余功能的单模光纤链路模块双光口,有自愈保护功能AB的产品传10KM,YFN2传20KMYFN2-S-ST1786-RPA :11786-RPFRXL:1具有环环冗余功能的单模光纤链路模块双光口,有自愈保护功能,传20KMYHN31786-RPT或1786-RPTD两端口协议型隔离中继器YHN31786-RPA:11786-RPCD:1+n多端口协议型隔离中继器YFN1-M-ST +YHN31786-RPA:11786-RPFM:1+n可组成多端口星型结构的光纤链路模块MODBUS PLUS总线转光纤/S908 RIO总线转光纤：Schneider(施耐德)，Modicon(莫迪康)的490系列 VS 易控达YFB/YFS系列YFB/YFS产品型号 Modicon产品 功 能 描 述 YFB1-M-ST 490NRP25300单光口Modbus PLUS(MB+)光纤链路模块,多模光纤,传输3公里YFB1-S-ST --单光口长距离Modbus PLUS(MB+)光纤链路模块,单模光纤,20KMYFB2-M-ST490NRP25400NWFR85D200 具有环环冗余功能的多模光纤链路模块 双光口,有自愈保护功能YFB2-S-ST --具有环环冗余功能的单模光纤链路模块双光口,有自愈保护功能,20KMYFS1-M-ST --单光口S908 TIO总线光纤链路模块,多模光纤,传输3公里YFS1-S-ST --单光口长距离S908 Remote IO光纤链路模块,单模光纤,20KMYFS2-M-ST490NRP95400NWFR89D200 具有环环冗余功能的S908 Remote IO光纤链路模块 多模双光口,有自愈保护功能YFS2-S-ST --具有环环冗余功能的单模光纤链路模块双光口,有自愈保护功能,传20KMYHB3/YHS3NWRR85001(RR85 Repeater)两端口协议型隔离中继器PROFIBUS DP/FMS总线转光纤Phinex(菲尼克斯)的PSI系列 VS 易控达YFP系列YFP产品型号 Modicon产品 功 能 描 述 YFP2-M-ST PSI-MOS-PROFIBUS/FO 850 T 双光口冗余，多模光纤 YFP2-S-ST PSI-MOS-PROFIBUS/FO 1300 T 双光口冗余，单模光纤 YFP1-M-ST PSI-MOS-PROFIBUS/FO 850 E 单光口，多模光纤YFP1-S-ST PSI-MOS-PROFIBUS/FO 1300 E 单光口，单模光纤 YHP3PSI-MOS-DNET CAN/FO 850/BM:27 08 08 3PSI-MOS-DNET CAN/FO 850/EM:27 08 096电缆中继隔离器CC-LINK总线转光纤:Mitsubishi(三菱)的AJ65BT系列 VS 易控达YFK系列NS24产品型号Mitsubishi产品 功 能 描 述 及 备 注YFK1-M-ST AJ65SBT-RPS单光口CC-Link光纤链路模块,多模光纤,传输2公里YFK1-S-ST AJ65SBT-RPG单光口长距离CC-Link光纤链路模块,单模光纤,20KMYFK2-M-ST--具有环环冗余功能的多模光纤链路模块,有自愈保护功能YFK2-S-ST--具有环环冗余功能的单模光纤链路模块双光口,有自愈保护功能,20KMYHK3AJ65BT-RPT两端口协议型隔离中继器。
海帆5300（5300-2）规格说明书
access via deck hatch.
ENGINE • Engine throttle in the cockpit with removable
handle, • Engine panel, • Sound insulation for engine compartment, • Access via removable companionway, • Diesel engine Yanmar 3YM20C - 21 HP,
control lines, • 2 winches Harken Performa for genoa and
spinnaker,
• 2 winches Harken Quattro on coachroof for halyards and control lines,
• 2 turning blocks for genoa sheets, • 2 tracks for genoa lead cars on sidedecks, • Chainplates for shrouds on side of hull, • Chainplates for backstay, • Deck Step for mast with blocks, • Handrails on coachroof.
positions.
STEERING • Double polyester rudders and stainless steel
rudder stocks, • Self-aligning rudder bearings.
RIGGING • Deck-stepped mast, • 2 levels of pushing spreaders - 19/20 fractional, • Stainless steel Dyform® shrouds, • Adjustable backstay with returns to each helm, • Forestay with hardware for hanked-on sail,
SS56肖特基势垒整流器SMB(DO-214AA)二极管规格书
SYMBOLS SS52 SS53
SS54 SS55
SS56
SS58 SS510 SS5150 SS5200 UNITS
VRRM VRMS VDC I(AV)
20 14 20
30 21 30
40 28 40
50 35 50
60 42 60 5.0
80 56 80
100 70 100
150 105 150
FIG. 3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS
FIG. 4-TYPICAL REVERSE CHARACTERISTICS
100
INSTANTANEOUS FORWARD CURRENT,AMPERES
10.0
10 TJ=100 C 1
1
TJ=75 C 0.1
0.1
SS52-SS54 SS55-SS56 SS58-SS5150 SS5200
0.01 TJ=25 C
Hale Waihona Puke 0.001020
40
60
80
100
0.01
PERCENT OF PEAK REVERSE VOLTAGE,%
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
FIG. 5-TYPICAL JUNCTION CAPACITANCE
RATINGS AND CHARACTERISTIC CURVES SS52 THRU SS5200
AVERAGE FORWARD RECTIFIED CURRENT, AMPERES
PEAK FORWARD SURGE CURRENT, AMPERES
FIG. 1- FORWARD CURRENT DERATING CURVE
SS1C资料
Symbols
SS1A
SS1B
SS1C
SS1DSLeabharlann 1ESS1GSS1J
SS1K
SS1M
Units
Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=100 Peak forward surge current, 8.3mS single half sine-wave superimposed on rated load (MIL-STD-750D 4066 method) Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current at rated DC blocking voltage TA=25 TA=100
元器件交易网
SS1A THRU SS1M
SURFACE MOUNT SUPER FAST RECOVERY RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere
Features
For surface mounted applications Low profile package Built-in strain relief Easy pick and place Superfast recovery times for high efficiency Plastic package has Underwriters Laboratory Flammability classification 94V-0 High temperature soldering: 260 /10 seconds at terminals
SS510肖特基势垒整流器SMB(DO-214AA)二极管规格书
10
100
1
0.1 0.01 0.1 1 10 100
10 0.1 1.0 10 100
REVERSE VOLTAGE,VOLTS
t,PULSE DURATION,sec.
0.060(1.52) 0.030(0.76)
0.008(0.203)MAX.
0.220(5.59) 0.205(5.21)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
0.087 (2.20) 0.071 (1.80)
0.155(3.94) 0.130(3.30)
0.180(4.57) 0.160(4.06)
0.012(0.305) 0.006(0.152)
0.096(2.44) 0.084(2.13)
MECHANICAL DATA
Case: JEDEC DO-214AA molded plastic body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight :0.003 ounce, 0.093 grams
精选较常用安全设备visio图标
演讲完毕，谢谢观看！
OLT
MD
Bridge
VOATM GW
NAS
TMG8000系列VOIP GW
MA5100
MA5200
ONU
AGW
Radium 8750
SIPP
路由器
VOIP功能路由器
MSR多业务交换机(ATM/IP/MPLS)
IAD
C&C08
MRS6000
AMG5000
SMⅠSMⅡ
iOLT
PBX
SIP Server
防火墙
安全网关
安全设备图标目前各厂商较为混杂，可以挑选符合自己要求的使用，符合形象即可
如有需要，可用做网闸
GEVPN网关
IDS
IPS
UTM
VPN网关
VPN客户端
网闸
机架式防火墙
防病毒网
USB key
证书
安全设备
4
流程图用网络符号
其他安全设备
IDS路由器
友商路由器.
中继器
AAA认证
防火墙
无线网卡
Cisco 经典图标
Router
Comm
Server
NetFlow
Router
SwitchProbe
三层交换机
MPLS
8850
三层交换机
Radium 8750
光纤符号
Cloud
Globe
二层交换机
Cisco CA
2D图标
策略管理服务器
ATM交换机
SGW信令网关
GK
AAA
Cach(缓存)
Metro
Lan Switch
语音设备
SS54肖特基势垒整流器SMB(DO-214AA)二极管规格书
0.087 (2.20) 0.071 (1.80)
0.155(3.94) 0.130(3.30)
0.180(4.57) 0.160(4.06)
0.012(0.305) 0.006(0.152)
0.096(2.44) 0.084(2.13)
MECHANICAL DATA
Case: JEDEC DO-214AA molded plastic body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight :0.003 ounce, 0.093 grams
10
100
1
0.1 0.01 0.1 1 10 100
10 0.1 1.0 10 100
REVERSE VOLTAGE,VOLTS
t,PULSE DURATION,sec.
SYMBOLS SS52 SS53
SS54 SS55
SS56
SS58 SS510 SS5150 SS5200 UNITS
VRRM VRMS VDC I(AV)
20 14 20
30 21 30
40 28 40
50 35 50
60 42 60 5.0
80 56 80
100 70 100
150 105 150
MDD Catalog Number
Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL(see fig.1) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 5.0A Maximum DC reverse current TA=25 C at rated DC blocking voltage TA=100 C Typical junction capacitance (NOTE 1) Typical thermal resistance (NOTE 2) Operating junction temperature range Storage temperature range
IBM Spectrum Control V5.2.12 快速入门指南说明书
IBM Spectrum ControlVersion 5.2.12Quick Start GuideInstalling the storage-management softwareGlobalization Version:To obtain the Quick Start Guide in other languages, print the language-specific PDF from the installation media.Product overviewIBM®Spectrum Control™offers licenses with the following features and pricing:IBM Spectrum Control™Standard Edition and IBM Spectrum Control Standard Select EditionIn addition to many other features, these licenses provide the following features:v Single dashboard view of the storage environment that you can use to manage storage systems, hypervisors,servers, and networksv Performance monitoring for storage systems and networksv Capacity and usage monitoring, as well as management and planning for the heterogeneous storage environmentv File provisioning for IBM Storwize®V7000 Unified and IBM Scale Out Network Attached Storagev Modeling of departments and applications to understand your environmentv VMware vCenter plug-in tool to help you manage and provision virtual storage in a vSphere environment, and viewreports about storage systems that are monitored by IBM Spectrum Controlv Reports from IBM Cognos®Business Intelligence that provide reporting and analytics informationThese licenses include a license for IBM Copy Services Manager, which manages 2-site replication, 3-site replication, and advanced copy services. You can learn more about how to plan for, download, and install Copy Services Manager at /support/knowledgecenter/SSESK4.IBM Spectrum Control Advanced Edition and IBM Spectrum Control Advanced Select EditionThese licenses contain all features of the IBM Spectrum Control Standard Edition license, and the following features:v Storage-consumption reports for scenarios like chargebackv Analytics-driven balancing and tiering that automatically move data to the most cost-effective tierv Storage pool balancing, block storage provisioning, file provisioning, and storage reclamationv Snapshot protection for applications that is offered by IBM Spectrum Protect™SnapshotThe IBM Spectrum Control Standard Edition and the IBM Spectrum Control Advanced Edition licenses are priced by the number of storage capacity units (SCUs) needed to cover the tebibytes of capacity that they manage. The IBM Spectrum Control Standard Select Edition and the IBM Spectrum Control Advanced Select Edition licenses are priced by the number of storage enclosures that they manage. To learn more about the pricing for licenses, see Product licenses (/support/ knowledgecenter/SS5R93_5.2.12/com.ibm.spectrum.sc.doc/fqz0_r_product_packages.html).If you choose to download and install IBM Copy Services Manager, follow the instructions in the IBM Copy Services Manager Knowledge Center (/support/knowledgecenter/SSESK4). To download and install IBMSpectrum Protect Snapshot, go to IBM Tivoli®Storage FlashCopy®Manager Knowledge Center (/ support/knowledgecenter/SS36V9).2Step 2: Evaluate the hardware configurationReview the hardware requirements. See the IBM Spectrum Control product documentation at Hardware requirements (/support/knowledgecenter/SS5R93_5.2.12/com.ibm.spectrum.sc.doc/fqz0_r_hw_requirements.html).IBM®3Step 3: Evaluate the system configuration and install the prerequisite software Review the software requirements:v Learn about the software requirements for the product at Software requirements (/support/knowledgecenter/SS5R93_5.2.12/com.ibm.spectrum.sc.doc/fqz0_r_sw_requirements.html).v Learn about the hardware, products, and operating systems that you can use with IBM Spectrum Control at/support/docview.wss?uid=swg21386446.4Step 4: Install DB2Before you install IBM Spectrum Control, you must install the version of IBM DB2®Enterprise Server Edition that isincluded with IBM Spectrum Control. IBM Spectrum Control stores the information that it collects about storageresources in a DB2 database.Follow the instructions in DB2 (/support/knowledgecenter/SS5R93_5.2.12/com.ibm.spectrum.sc.doc/ fqz0_t_installing_db2.html).5Step 5: Install IBM Spectrum ControlYou can use an installation program or a command line in silent mode to install IBM Spectrum Control. Follow theinstructions in Installing IBM Spectrum Control (/support/knowledgecenter/SS5R93_5.2.12/com.ibm.spectrum.sc.doc/fqz0_t_installing_tpc.html).6Step 6: (Optional) Install Cognos Business Intelligence reportsThe IBM Spectrum Control installation process includes the option to install IBM Cognos Business Intelligence (BI)reports and the product that is required to produce these reports: Jazz™for Service Management and its reportingservices (IBM Tivoli Common Reporting). Cognos BI produces scheduled reports from the data that is gathered by IBM Spectrum Control.Learn about Cognos BI reports at Reporting (/support/knowledgecenter/SS5R93_5.2.12/com.ibm.spectrum.sc.doc/fqz0_c_webbasedgui_rpting_ic_ov.html). Also learn about the components that you must install to use Cognos BI reports at Install Jazz for Service Management and Tivoli Common Reporting(/support/knowledgecenter/SS5R93_5.2.12/com.ibm.spectrum.sc.doc/fqz0_c_jazzsm_tcr.html).If you choose not to install Cognos BI, you can use the reporting features of the IBM Spectrum Control user interface to produce reports about the status, capacity, and performance of the storage resources that you want to monitor. If you have the Advanced Edition or Advanced Select Edition license, chargeback and consumer reports are available.7Step 7: Get startedFollow the tasks in Getting started with IBM Spectrum Control (/support/knowledgecenter/SS5R93_5.2.12/com.ibm.spectrum.sc.doc/fqz0_r_getting_started.html).More informationFor more information, see the following resources:v PDF product documentation: Printable documentation (/support/knowledgecenter/SS5R93_5.2.12/ com.ibm.spectrum.sc.doc/fqz0_r_printable_pdf_files.html)v Product support: https:///support/entry/myportal/product/tivoli/ibm_spectrum_control/ibm_spectrum_control_standard_edition?productContext=365750483IBM Spectrum Control Version 5.2.12 Licensed Materials - Property of IBM. © Copyright IBM Corp. 2014, 2016. US Government Users Restricted Rights - Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp.IBM, the IBM logo, and ®are trademarks or registered trademarks of International Business Machines Corp., registered in many jurisdictions worldwide. Other product and service names might be trademarks of IBM or other companies. A current list of IBM trademarks is available on the web at “Copyright and trademark information” (/legal/copytrade.shtml).Printed in Ireland。
Molex MXS连接器商品说明书
NOTES:1. MATERIALS: HOUSING: LIQUID CRYSTAL POLYMER (LCP) GLASS-FILLED, UL94V-0 TERMINALS: HIGH PERFORMANCE COPPER ALLOY2. FINISH: SELECTIVE GOLD IN SIGNAL AND U-SHIELD CONTACT AREA ONLY. SELECTIVE TIN ON PCB TAILS. NICKEL OVERALL.3. PARTS ARE MAKED WITH THE PART NUMBER, "MXS", AND A DATECODE.DATECODE FORMAT: 2 DIGIT YEAR, 3 DIGIT DAY (YYDDD), AND 2 DIGIT HOUR, MINUTE & SECONDS (HHMMSS).4. REFER TO MOLEX PRODUCT SPECIFICATION 1735109000-PS_PS FOR PERFORMANCE SPECIFICATIONS.5. PRODUCT WILL BE PACKAGED PER: 1736101000PDD_PK.6. MATES WITH IMPULSE DC RAF (RIGHT ANGLE FEMALE) UNGUIDED NUMBER: SEE TABLE.7. APPLICATION SPECIFICATION: 1735109997-AS_PS.8. REFER TO IMPULSE PCB ROUTING GUIDE 1735109999-AS_PS FOR ANTIPAD,ROUTING RECOMMENDATIONS, BACKDRILL, AND ADDITIONAL PCB INFORMATION.CA57.6REFERENCE19.10.62X8.5437.435.0MIN BOARD1.00TAIL LENGTH1.3012.07(CUTAWAY)2.37PIN T16PIN A116 COLUMN PART SHOWNPART NUMBER "MXS" DATECODE SEE NOTE 3MATERIAL NUMBER NUMBER OF COLUMNS NUMBER OF DIFFERENTIAL PAIRS DIMENSION "A"DIMENSION "B"DIMENSION "C"DIMENSION "D"ORTHOGONALORIENTATIONMATING DC RAF PART NUMBER PTH's173625-280586422.814.0024.015.4890°173540-70080.31MM 173625-2205129630.822.0032.023.4890°173631-10120.31MM 173625-24051411234.826.0036.027.4890°173620-10160.31MM 173625-26051612838.830.0040.031.4890°173505-10160.31MM 173625-280686422.814.0024.015.4890°173540-70480.26MM 173625-2206129630.822.0032.023.4890°173631-10520.26MM 173625-24061411234.826.0036.027.4890°173620-10560.26MM 173625-26061612838.830.0040.031.4890°173505-10560.26MM(SHIELD LENGTH)6.50+0.20-0.10REFERENCE25.52PITCH2.00PIN A1REFERENCE22.92 DIVISIONAL SYMBOLSFUNCTIONAL SYMBOLS =0=0=CURRENT REV DESC: ADD 0.26MM COMPLIANT PARTNUMBERSEC NO:675528DRWN:JMENDOZA012021/06/15CHK'D:JMENDOZA012021/09/01APPR:JMENDOZA012021/09/01THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm 3:1GENERAL TOLERANCES (UNLESS SPECIFIED)ANGULAR TOL±0.5 °4 PLACES±3 PLACES ±2 PLACES±0.13IMPULSE 8 PAIRORTHO DIRECT RAM - 90° - 2MM UNGUIDEDPRODUCT CUSTOMER DRAWINGDOCUMENT NUMBERDOC TYPE DOC PART REVISIONMML LKKJJHHG GFFEEDDCC BBDETAIL A SCALE 7:1ADKEEP-OUT ZONE SEE NOTE 1TYPICAL2.003.20 3.201.615.471.995.5335.20MAXIMUM 2.702X2.60UNPLATED SCREW HOLE2X2.45±0.05⌀PTH (32 HOLES PER COLUMN)0.31±0.05⌀⌖⌀0.10⌖⌀0.10(FULLY MATED)26.00ORTHO DIRECT RAM HOLE PATTERN(CONNECTOR SIDE)DC RAFREAR (NON-CONNECTOR SIDE)32.132X 8.38EVEN COLUMN DIMENSIONSODD COLUMN DIMENSIONS 0.002.204.006.208.0010.2012.0014.2016.0018.2020.0022.2024.0026.2028.00 1.003.205.007.209.0011.2013.0015.2017.0019.2021.0023.2025.0027.2029.001.003.205.007.209.0011.2013.0015.2017.0019.2021.0023.2025.0027.2029.002.004.206.008.2010.0012.2014.0016.2018.0020.2022.0024.2026.0028.20GND H1G1GND GND D1C1GND GND K1J1GND GND P1N1GND GND F1E1GND GND M1L1GND GND B1A1GNDR1GND GND M2L2GND GND K2J2GND GND P2N2GND GND H2G2GND GND GND D2C2GND GND B2A2GNDGND F2E2GND DC RAF PIN A1PIN T1PIN A1SIGNAL VIA GROUND VIAPCB EDGEDC RAF FIRST GND PIN0.31 SIGNAL & GROUND PTH's16 COLUMN PART SHOWNNOTES1. THESE DIMENSIONS REPRESENT THE AREA NEEDED TOACCOMMODATE CONNECTOR INSERTION AND REPAIR ON THE PCB. THIS IS REFERRED TO AS THE "CONNECTOR KEEP OUT ZONE" AND DOES NOT REPRESENT THE ACTUAL PERIMETER OF THE DC RAF PIN A1DIVISIONAL SYMBOLSFUNCTIONAL SYMBOLS =0=0=CURRENT REV DESC: ADD 0.26MM COMPLIANT PARTNUMBERSEC NO:675528DRWN:JMENDOZA012021/06/15CHK'D:JMENDOZA012021/09/01APPR:JMENDOZA012021/09/01THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm 3:1GENERAL TOLERANCES (UNLESS SPECIFIED)ANGULAR TOL±0.5 °4 PLACES±3 PLACES ±2 PLACES±0.13IMPULSE 8 PAIRORTHO DIRECT RAM - 90° - 2MM UNGUIDEDPRODUCT CUSTOMER DRAWINGDOCUMENT NUMBERDOC TYPE DOC PART REVISIONLLKKJJHHGGFFEEDDCC BBDETAIL C SCALE 7:1ADKEEP-OUT ZONE SEE NOTE 1TYPICAL2.003.20 3.201.615.471.995.5335.20MAXIMUM 2.702X2.60⌖⌀0.10UNPLATED SCREW HOLE2X2.45±0.05⌀⌖⌀0.10GROUND PTH (16 HOLES PER COLUMN)0.31±0.05⌀(FULLY MATED)26.00ORTHO DIRECT RAM HOLE PATTERN(CONNECTOR SIDE)DC RAFREAR (NON-CONNECTOR SIDE)32.132X 8.38EVEN COLUMN DIMENSIONSODD COLUMN DIMENSIONS 0.002.204.006.208.0010.2012.0014.2016.0018.2020.0022.2024.0026.2028.00 1.003.205.007.209.0011.2013.0015.2017.0019.2021.0023.2025.0027.2029.001.003.205.007.209.0011.2013.0015.2017.0019.2021.0023.2025.0027.2029.002.004.206.008.2010.0012.2014.0016.2018.0020.2022.0024.2026.0028.20GND H1G1GND GND D1C1GND GND K1J1GND GND P1N1GND GND F1E1GND GND M1L1GND GND B1A1GNDR1GND GND M2L2GND GND K2J2GND GND P2N2GND GND H2G2GND GND GND D2C2GND GND B2A2GNDGND F2E2GND DC RAF PIN A1PIN T1PIN A1SIGNAL VIA GROUND VIAPCB EDGEDC RAF FIRST GND PIN0.26 SIGNAL PTH's & 0.31 GROUND PTH's16 COLUMN PART SHOWNNOTES1. THESE DIMENSIONS REPRESENT THE AREA NEEDED TOACCOMMODATE CONNECTOR INSERTION AND REPAIR ON THE PCB. THIS IS REFERRED TO AS THE "CONNECTOR KEEP OUT ZONE" AND DOES NOT REPRESENT THE ACTUAL PERIMETER OF THE DC RAF PIN A1⌖⌀0.10SIGNAL PTH (16 HOLES PER COLUMN)0.26±0.05⌀DIVISIONAL SYMBOLSFUNCTIONAL SYMBOLS =0=0=CURRENT REV DESC: ADD 0.26MM COMPLIANT PARTNUMBERSEC NO:675528DRWN:JMENDOZA012021/06/15CHK'D:JMENDOZA012021/09/01APPR:JMENDOZA012021/09/01THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm 3:1GENERAL TOLERANCES (UNLESS SPECIFIED)ANGULAR TOL±0.5 °4 PLACES±3 PLACES ±2 PLACES±0.13IMPULSE 8 PAIRORTHO DIRECT RAM - 90° - 2MM UNGUIDEDPRODUCT CUSTOMER DRAWINGDOCUMENT NUMBERDOC TYPE DOC PART REVISIONLLKKJJHHGGFFEEDDCC BBMATED DIMENSIONSREFERENCE3.0REFERENCE35.9REFERENCE95.48 PAIR X 16 COLUMN ORTHO DIRECT RAM8 PAIR X 16 COLUMNDC RAFORTHO PIN MAPPING(DC RAF - ORTHO DIRECT RAM)T1-T2T2-R1T3-P2T4-N1T5-M2T6-L1T7-K2T8-J1T9-H2T10-G1T11-F2T12-E1T13-D2T14-C1T15-B2T16-A1R1-R2R2-T1R3-N2R4-P1R5-L2R6-M1R7-J2R8-K1R9-G2R10-H1R11-E2R12-F1R13-C2R14-D1R15-A2R16-B1P1-T4P2-R3P3-P4P4-N3P5-M4P6-L3P7-K4P8-J3P9-H4P10-G3P11-F4P12-E3P13-D4P14-C3P15-B4P16-A3N1-R4N2-T3N3-N4N4-P3N5-L4N6-M3N7-J4N8-K3N9-G4N10-H3N11-E4N12-F3N13-C4N14-D3N15-A4N16-B3M1-T6M2-R5M3-P6M4-N5M5-M6M6-L5M7-K6M8-J5M9-H6M10-G5M11-F6M12-E5M13-D6M14-C5M15-B6M16-A5L1-R6L2-T5L3-N6L4-P5L5-L6L6-M5L7-J6L8-K5L9-G6L10-H5L11-E6L12-F5L13-C6L14-D5L15-A6L16-B5K1-T8K2-R7K3-P8K4-N7K5-M8K6-L7K7-K8K8-J7K9-H8K10-G7K11-F8K12-E7K13-D8K14-C7K15-B8K16-A7J1-R8J2-T7J3-N8J4-P7J5-L8J6-M7J7-J8J8-K7J9-G8J10-H7J11-E8J12-F7J13-C8J14-D7J15-A8J16-B7H1-T10H2-R9H3-P10H4-N9H5-M10H6-L9H7-K10H8-J9H9-H10H10-G9H11-F10H12-E9H13-D10H14-C9H15-B10H16-A9G1-R10G2-T9G3-N10G4-P9G5-L10G6-M9G7-J10G8-K9G9-G10G10-H9G11-E10G12-F9G13-C10G14-D9G15-A10G16-B9F1-T12F2-R11F3-P12F4-N11F5-M12F6-L11F7-K12F8-J11F9-H12F10-G11F11-F12F12-E11F13-D12F14-C11F15-B12F16-A11E1-R12E2-T11E3-N12E4-P11E5-L12E6-M11E7-J12E8-K11E9-G12E10-H11E11-E12E12-F11E13-C12E14-D11E15-A12E16-B11D1-T14D2-R13D3-P14D4-N13D5-M14D6-L13D7-K14D8-J13D9-H14D10-G13D11-F14D12-E13D13-D14D14-C13D15-B14D16-A13C1-R14C2-T13C3-N14C4-P13C5-L14C6-M13C7-J14C8-K13C9-G14C10-H13C11-E14C12-F13C13-C14C14-D13C15-A14C16-B13B1-T16B2-R15B3-P16B4-N15B5-M16B6-L15B7-K16B8-J15B9-H16B10-G15B11-F16B12-E15B13-D16B14-C15B15-B16B16-A15A1-R16A2-T15A3-N16A4-P15A5-L16A6-M15A7-J16A8-K15A9-G16A10-H15A11-E16A12-F15A13-C16A14-D15A15-A16A16-B15PIN MAPA1R16THIS SHEET IS FOR128 DIFFERENTIAL PAIRS ONLYDIVISIONAL SYMBOLSFUNCTIONAL SYMBOLS =0=0=CURRENT REV DESC: ADD 0.26MM COMPLIANT PARTNUMBERSEC NO:675528DRWN:JMENDOZA012021/06/15CHK'D:JMENDOZA012021/09/01APPR:JMENDOZA012021/09/01THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm 2:1GENERAL TOLERANCES (UNLESS SPECIFIED)ANGULAR TOL±0.5 °4 PLACES±3 PLACES ±2 PLACES±0.13IMPULSE 8 PAIRORTHO DIRECT RAM - 90° - 2MM UNGUIDEDPRODUCT CUSTOMER DRAWINGDOCUMENT NUMBERDOC TYPE DOC PART REVISIONLLKKJJH HGGFFEED DCC BBORTHO PIN MAPPING(DC RAF - ORTHO DIRECT RAM)M1-T2M2-R1M3-P2M4-N1M5-M2M6-L1M7-K2M8-J1M9-H2M10-G1M11-F2M12-E1M13-D2M14-C1M15-B2M16-A1L1-R2L2-T1L3-N2L4-P1L5-L2L6-M1L7-J2L8-K1L9-G2L10-H1L11-E2L12-F1L13-C2L14-D1L15-A2L16-B1K1-T4K2-R3K3-P4K4-N3K5-M4K6-L3K7-K4K8-J3K9-H4K10-G3K11-F4K12-E3K13-D4K14-C3K15-B4K16-A3J1-R4J2-T3J3-N4J4-P3J5-L4J6-M3J7-J4J8-K3J9-G4J10-H3J11-E4J12-F3J13-C4J14-D3J15-A4J16-B3H1-T6H2-R5H3-P6H4-N5H5-M6H6-L5H7-K6H8-J5H9-H6H10-G5H11-F6H12-E5H13-D6H14-C5H15-B6H16-A5G1-R6G2-T5G3-N6G4-P5G5-L6G6-M5G7-J6G8-K5G9-G6G10-H5G11-E6G12-F5G13-C6G14-D5G15-A6G16-B5F1-T8F2-R7F3-P8F4-N7F5-M8F6-L7F7-K8F8-J7F9-H8F10-G7F11-F8F12-E7F13-D8F14-C7F15-B8F16-A7E1-R8E2-T7E3-N8E4-P7E5-L8E6-M7E7-J8E8-K7E9-G8E10-H7E11-E8E12-F7E13-C8E14-D7E15-A8E16-B7D1-T10D2-R9D3-P10D4-N9D5-M10D6-L9D7-K10D8-J9D9-H10D10-G9D11-F10D12-E9D13-D10D14-C9D15-B10D16-A9C1-R10C2-T9C3-N10C4-P9C5-L10C6-M9C7-J10C8-K9C9-G10C10-H9C11-E10C12-F9C13-C10C14-D9C15-A10C16-B9B1-T12B2-R11B3-P12B4-N11B5-M12B6-L11B7-K12B8-J11B9-H12B10-G11B11-F12B12-E11B13-D12B14-C11B15-B12B16-A11A1-R12A2-T11A3-N12A4-P11A5-L12A6-M11A7-J12A8-K11A9-G12A10-H11A11-E12A12-F11A13-C12A14-D11A15-A12A16-B116 PAIR X 16 COLUMNDC RAF8 PAIR X 12 COLUMN ORTHO DIRECT RAMPIN MAPA1R12REFERENCE3.0REFERENCE87.4REFERENCE27.9THIS SHEET IS FOR96 DIFFERENTIAL PAIRS ONLYMATED DIMENSIONSDIVISIONAL SYMBOLSFUNCTIONAL SYMBOLS =0=0=CURRENT REV DESC: ADD 0.26MM COMPLIANT PARTNUMBERSEC NO:675528DRWN:JMENDOZA012021/06/15CHK'D:JMENDOZA012021/09/01APPR:JMENDOZA012021/09/01THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm 2:1GENERAL TOLERANCES (UNLESS SPECIFIED)ANGULAR TOL±0.5 °4 PLACES±3 PLACES ±2 PLACES±0.13IMPULSE 8 PAIRORTHO DIRECT RAM - 90° - 2MM UNGUIDEDPRODUCT CUSTOMER DRAWINGDOCUMENT NUMBERDOC TYPE DOC PART REVISIONLLKKJJHHGGFFEED DCC BBORTHO PIN MAPPING(DC RAF - ORTHO DIRECT RAM)H1-T2H2-R1H3-P2H4-N1H5-M2H6-L1H7-K2H8-J1H9-H2H10-G1H11-F2H12-E1H13-D2H14-C1H15-B2H16-A1G1-R2G2-T1G3-N2G4-P1G5-L2G6-M1G7-J2G8-K1G9-G2G10-H1G11-E2G12-F1G13-C2G14-D1G15-A2G16-B1F1-T4F2-R3F3-P4F4-N3F5-M4F6-L3F7-K4F8-J3F9-H4F10-G3F11-F4F12-E3F13-D4F14-C3F15-B4F16-A3E1-R4E2-T3E3-N4E4-P3E5-L4E6-M3E7-J4E8-K3E9-G4E10-H3E11-E4E12-F3E13-C4E14-D3E15-A4E16-B3D1-T6D2-R5D3-P6D4-N5D5-M6D6-L5D7-K6D8-J5D9-H6D10-G5D11-F6D12-E5D13-D6D14-C5D15-B6D16-A5C1-R6C2-T5C3-N6C4-P5C5-L6C6-M5C7-J6C8-K5C9-G6C10-H5C11-E6C12-F5C13-C6C14-D5C15-A6C16-B5B1-T8B2-R7B3-P8B4-N7B5-M8B6-L7B7-K8B8-J7B9-H8B10-G7B11-F8B12-E7B13-D8B14-C7B15-B8B16-A7A1-R8A2-T7A3-N8A4-P7A5-L8A6-M7A7-J8A8-K7A9-G8A10-H7A11-E8A12-F7A13-C8A14-D7A15-A8A16-B7THIS SHEET IS FOR64 DIFFERENTIAL PAIRS ONLYMATED DIMENSIONSREFERENCE3.0REFERENCE19.9REFERENCE79.48 PAIR X 8 COLUMN ORTHO DIRECT RAMPIN MAPR8A14 PAIR X 16 COLUMNDC RAFDIVISIONAL SYMBOLSFUNCTIONAL SYMBOLS =0=0=CURRENT REV DESC: ADD 0.26MM COMPLIANT PARTNUMBERSEC NO:675528DRWN:JMENDOZA012021/06/15CHK'D:JMENDOZA012021/09/01APPR:JMENDOZA012021/09/01THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm 2:1GENERAL TOLERANCES (UNLESS SPECIFIED)ANGULAR TOL±0.5 °4 PLACES±3 PLACES ±2 PLACES±0.13IMPULSE 8 PAIRORTHO DIRECT RAM - 90° - 2MM UNGUIDEDPRODUCT CUSTOMER DRAWINGDOCUMENT NUMBERDOC TYPE DOC PART REVISIONLLKKJ JHHGGFFEED DCC BB。
SS52肖特基二极管DCY品牌厂家推荐
Unit：inch（mm）
特征 Features
·大电流承受能力。High Current Capability ·正向压降低。Low Forward Voltage Drop ·高温焊接保证 High temperature soldering guaranteed:
250℃/10 秒, 0.375" (9.5mm)引线长度。 250℃/10 seconds, 0.375" (9.5mm) lead length, ·引线可承受5 磅 (2.3kg) 拉力。 5 lbs. (2.3kg) tension
表面安装肖特基二极管
反向电压 20 ---200 V 正向电流 5.0 A
SS52 ...... SS520
Surface Mount Schottky Barrier Rectifier
Reverse Voltage 20 to 200 V Forward Current 5.0 A
¼½¾¿Á
特性曲线 Characteristic Curves
SS52 ...... SS520
1 015 &!0,11*08 00 9623&3 89 00 42
346291 402104 4!2 16*&! 00 ,6108
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Note: 1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 0.2x0.2 ”(5.0x5.0mm) copper pad areas
RATINGS AND CHARACTERISTIC CURVES SS52 THRU SS5200
0.067 (1.70) 0.051 (1.30)
0.110(2.80) 0.100(2.54)
0.177(4.50) 0.157(3.99) 0.012(0.305) 0.006(0.152)
0.096(2.42) 0.078(1.98)
MECHANICAL DATA
0.060(1.52) 0.030(0.76) 0.008(0.203)MAX.
0.208(5.28) 0.188(4.80)
Dimensions in inches and (millimeters)
Case: JEDEC DO-214AC molded plastic body Terminals: leads solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight:0.002 ounce, 0.07 grams
200 VOLTS 150 VOLTS 200 VOLTS Amps
IFSM VF IR CJ RθJA TJ, TSTG 0.55 20 0.70 0.5
125.0 0.85 10 200 50.0 -50 to +125 -50 to +150 -50 to +150 0.95 0.2 2.0
Amps Volts mA pF C/W C C
0
1
10
100
AMBIENT TEMPERATURE, C
NUMBER OF CYCLES AT 60 Hz
50
TJ=25 C
INSTANTANEOUS REVERSE CURRENT, MILLIAMPERES
FIG. 3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS
SS52 THRU SS5200
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Reverse Voltage - 20 to 200 Volts Forward Current - 5.0 Amperes
DO-214AC/SMA
FEATURES
The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Low reverse leakage Built-in strain relief,ideal for automated placement High forward surge current capability High temperature soldering guaranteed: 250 C/10 seconds at terminals
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
AVERAGE FORWARD RECTIFIED CURRENT, AMPERES
PEAK FORWARD SURGE CURRENT, AMPERES
FIG. 1- FORWARD CURRENT DERATING CURVE
5.0
FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT
FIG. 4-TYPICAL REVERSE CHARACTERISTICS
100
INSTANTANEOUS FORWARD CURRENT,AMPERES
10.0
10 TJ=100 C 1
1
TJ=75 C 0.1
0.1
SS52-SS54 SS55-SS56 SS58-SS5150 SS5200
0.01 TJ=25 C
150
4.0
Single Phase Half Wave 60Hz Resistive or inductive Load
120
3.0
956 SS58-SS5200
30
8.3ms SINGLE HALF SINE-WAVE (JEDEC Method)
0 0 25 50 75 100 125 150 175
MDD Catalog Number
Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL(see fig.1) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 5.0A Maximum DC reverse current TA=25 C at rated DC blocking voltage TA=100 C Typical junction capacitance (NOTE 1) Typical thermal resistance (NOTE 2) Operating junction temperature range Storage temperature range
0.001
0
20
40
60
80
100
0.01
PERCENT OF PEAK REVERSE VOLTAGE,%
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
FIG. 5-TYPICAL JUNCTION CAPACITANCE
TRANSIENT THERMAL IMPEDANCE, C/W
SYMBOLS SS52 SS53
SS54 SS55
SS56
SS58 SS510 SS5150 SS5200 UNITS
VRRM VRMS VDC I(AV)
20 14 20
30 21 30
40 28 40
50 35 50
60 42 60 5.0
80 56 80
100 70 100
150 105 150
INSTANTANEOUS FORWARD VOLEAGE, VOLTS
FIG. 6-TYPICAL TRANSIENT THERMAL IMPEDANCE
100
JUNCTION CAPACITANCE, pF
2000 1000 TJ=25 C
10
100
1
0.1 0.01 0.1 1 10 100
10 0.1 1.0 10 100
REVERSE VOLTAGE,VOLTS
t,PULSE DURATION,sec.