电子生产线作业指导书

DIP
TYPE III
Glue dot
Chip Components DIPs
Chip Components
SMT 生产作业网络
SMT 生产线布置
High Speed Chip Shooter - Fuji
Speed: 0.09 ~ 0.45 sec/pcs
Multi-purple chip shooter - Fuji
Screen printer
FUJI
GL-541
Glue dispenser
FCP-642 1.6M GATE
FIP-III
1M C/V
High-speed placer
Multi-purpose places
KOKI REFLOW
Reflow Oven
1M C/V UNLOADER
Line Layouts: • 1 x High-speed + 1 x Multi-purpose • 2 x High-speed + 1 x Multi-purpose • 2 x High-speed + 2 x Multi-purpose
电子产品与制程趋势
电子产品
PCB 基板 (Printed Circuit Board)
SMT 电子零件
电子构装组织模型
表面黏着制程 (Surface Mount Technology)
SMT
FORM ING
SMT
FORM ING
SMT
Fቤተ መጻሕፍቲ ባይዱRM ING
电子产品生产制程 (PCBA) • Final ass’s – 产品组装作业
R17
2
90
-6827 5732 -6727
5732
TOP
S
Q4
3
90
195 12410 195 12410 TOP
S
U1
16 180
-8338 12641 -8338 12641 TOP
S
.
.
.
ACM FILE CONTENT
Device No. Part NO
X- axis
Y-axis
Orientation
SMT生产线影像-1
SMT生产线影像-2
手焊与修检站
人工插件生产线
TYPE I
Solder paste SMT Complex FPT Simple
TYPE II
Spoaldsteer
电子构装类型 PLCC
Chip Components
SOIC
PLCC
Chip Components
SOIC
• Final test – 产品测试(功能性)
A BOARD (TOP)
INST.
W/S
POST SOLDER
PRE B/I TEST
• Packing – 产品包装作业
HANDLING
B BOARD (BOTTOM)
INST.
W/S
POST SOLDER
PRE B/I TEST
B/I (ESS)
SMT制程缺点与修护成本趋势
FUJI
MPM
Screen Printer AOI system High-speed Chip shooter
Multi-purpose Chip shooter
Reflow oven
制程缺点 50% ~70%
修护成本/缺点
SMT 生产线布置
MPM
LOADER
MPM UP2000
Speed: 1.65 ~ 2.00 sec/pcs
SMT 生产程序
Jobname: 18193r3/18193r3
Side: TOP Units: 10 Micro-meters
Date: Fri Aug 8
CD PN OR
X
Y
BX
BY
SD
MT
------------------------------------------------------------------------------------------------------------------------------------------------------
•允收(Acceptable) (1) 零件接着面在焊垫范围内，且50%以上
脚宽位于锡垫范围内。
•拒收(Rejected) (1) 焊锡未全部充满于零件接着面与焊垫上，
且零件50%以上脚宽超出焊垫范围。
SMT 检验标准
Preferred
Acceptable
SMT制程控制流程
表面黏着制造流程
•制程变异监控 •修正措施施行
作业指导书 (Working Instruction)
作业指导书类型
作业指导书乃用于指导作业员从事加工/组装作业程 序之文件，作业员须依据此文件进行作业。
电子业作业指导书一般包含：
FINAL ASS'Y
FINAL TEST
PACK ING
POST B/I TEST
HANDLING
SUB ASS'Y
SHIP
C BOARD (OPTIONAL)
INST.
W/S
POST SOLDER
Terms: • SMT – 表面黏着技术(制程) • Forming – 零件成型 • INST. – 人工插件 (Insertion) • W/S - 波焊制程 (Wave soldering) • Post solder – 接接后作业 (Such as touch-up, rework) • B/I – 烧机测试 (Burn-in)
电子生产线作业指导书
电子产品与制程趋势
多重应用功能(Multi-purpose Applications) 携带式与缩小化(Portable and Miniature)
. Mobile phone . PDA . Notebook …
可制性(Manufacturability) 构装自动化 (Automation in Assembly Process) 重复性与再现性(Repeatability and Reliability) 生产力与及时供货能力(Time to Market) 效率(Efficiency)
37,CRS1011J1M,R17,-6827,5732,90, 57,CTRRMPP01M,Q4, 195,12410,90, 21,CICA07474M,U1,-8338,12641,
零件黏贴
Ball screw
基版
传感器
送料器
取置头
焊性检验标准 (IPC STANDARDS) •标准(Preferred) (1) 零件脚位于焊垫中央。 (2) 零件端点与焊垫间皆充满足够的焊锡， 且呈平滑圆弧形。 (3) 零件脚与焊接面平贴于焊垫上。