USB2.0BF CONN耐久插拔力测试报告_AF

合集下载

手机USB线检验报告

手机USB线检验报告序号检验项目标准值或技术要求样品编号实测值单项判定1 外观USB线体表面应洁净，无气泡、划伤、擦伤等缺陷，绝缘应完整、不开裂。

插接件金属端子镀层光滑，不可有刮伤、氧化、黄斑、色差、变形等不良。

具体按下表要求检查。

规格型号是否符合线材长度是否符合线材印字是否清晰线材本体安规标识是否符合线材破损漏铜丝插头及线材本体刮伤、擦伤（插头外壳有感刮伤不允许，无感刮伤、擦伤于30cm目视3秒种看不到或看不清；线材本体刮伤有感不允许，无感允许长≤10mm，宽≤0.2mm）颜色光泽在自然光下与样品无明显偏差塑胶外被有金属杂质水泡/气泡/沙粒/麻点，单个直径不超过0.2mm披峰,插头外壳不允许,线材允许长≤2mm,厚≤0.5mm线材本体是否凹凸不平流纹/缩水(30cm目视不明显,不影响组装)端子不可有刮伤、氧化、黄斑、色差、变形等不良，线材捆扎方式是否符合2规格尺寸线材规格USB线线材应符合UL2725线规，线径、长度等应符合技术图纸要求。

UL2725 AWG28线材按表2要求检验。

3线材结构线材结构应符合图1要求。

4材料内部结构检查内部导体与两端端口连接部位不允许出现虚焊、断线、不导通故障现象，对于检查结果以实物图片存档输出为准。

5外径尺寸外被外径尺寸应符合下图尺寸要求平口袋不封口要符合下图尺寸要求6线芯排列线芯排列和顺序应符合技术图纸要求。

无短路、断路、绝缘、高压、错位。

7物理性能试验方法按UL 758-2006第14章的规定进行。

试验前后，绝缘、护套的抗张强度和断裂伸长率应符合下表要求。

老化前抗张强度测试护套： >1.05kgf/mm 2(等于10.3MPa)；绝缘(HDPE) ： >1.41kgf/mm 2(等于13.79MPa)老化后抗张强度测试老化条件：100℃±2℃，168h 护套：>70% ；绝缘(HDPE)：>70% 老化前断裂伸长率护套：> 100%；绝缘(HDPE): ：> 300% 老化后断裂伸长率老化条件：100℃±2℃，168h护套：> 65%；绝缘(HDPE) ：> 60%8 VW-1燃烧试验垂直试样在5次每次15秒施加标准试验火焰期间、施加火焰间隔或施加火焰以后a ）不得沿其长度传播火焰；b ）不得向附近的要燃性物质传播火焰。

USB可靠性测试规范update

富士康(昆山)電腦接插件有限公司Foxconn (Kun Shan) Computer Connector Co.,Ltd實驗室檢測報告Laboratory Test Report報告日期DATE :02/05/2007產品名稱 : USB CONN. FOR Krypton USB cablePart Name料號 : UB0012C-001-YFPart No.申請單位 : CEC MEApplicant報告類別: ■ 信賴性□ 精密量測□ 其它測試Report Type : Qualification Precision Measure Other Test接收日期 : 01/30/2007 檢測日期 : 01/30/2007Receive Date Test Date檢測人員 :林玉婷審核人員 :Tested by : Y.T. Lin Checked by ：核准人Approved by說明ILLUSTRATION1. 樣品標識與檢測報告編號一致.Specimen mark is the same as Testing No.2.本報告僅對樣品有效,未經許可,不得部分复制. The report only valid & responsible for specimen.Copy or using separately are prohibited without permission. 3.本報告共 10頁,分離使用無效.The report contains 11 page(s), invalid when used separately.1-1 APPLICANT: FCKB141-2 TESTED SAMPLES: 20PCS1-3 PURPOSEThis qualification test report contains the quality requirements, test procedures and testresults of a qualification test program on the FOXCONN’S PRODUCT UB0012C-001-YF.2.APPLICABLE DOCUMENTSTest method for electrical components: EIA-3643.TEST SEQUENCE3-1 TEST CONDITIONSUnless otherwise specified, tests and examinations are conducted under conditions within thefollowing ranges:Temperature:20~24℃Atmospheric pressure: 86 to 106kPaRelative Humidity: 40~65%3-2 QUALIFICATION TEST SEQUENCEITEM TEST DESCRIPTION TEST SEQUENCE TESTMETHODA B C D1 EXAMINATION OF PRODUCT 1,11,19 1,11 1,11 1 4-12 LOW LEVEL CONTACT RESISTANCE 2,8,16 2,7 2,7 4-23 CONTACT CURRENT RATING 3 4-34 INSULATION RESISTNCE 3,9,17 3,8 3,8 4-45 DIELECTRIC WITHSTANDING 4,10,18 4,9 4,9 4-56 CAPACITANCE 2 4-67 INSERTION FORCE EXTRACTIONFORCE 5,7,9,11,13,155,10 5,10 4-78 DURABILITY 6,8,10,12,14 4-89 MECHANICAL SHOCK 6 4-910 RANDOM VIBRATION 6 4-10SAMPLES SIZE PER TEST GROUP 5 555/4.TEST METHOD OF INSPECTION4-1 EXAMINATION OF PRODUCTThe test is performed in accordance with EIA-364-18A. Connectors& contacts shall have no evidence of physical defects or otherwise unfit for testing.4-2 LOW LEVEL CONTACT RESISTANCEThe test is performed in accordance with EIA-364-23A. Open circuit voltage is 20 mV maximum and test current is 100 mA maximum.4-3 CONTACT CURRENT RATINGThe test is performed in accordance with EIA 364-70A.. 1.5A at 250V AC minim when measured at an ambient temperature of 25℃, with power applied to the contacts, the ΔT must not exceed 30℃ at any point of the USB.4-4 INSULATION RESISTNCEThe test is performed in accordance with EIA-364-21C. Insulation resistance is measured between adjacent contacts after applying 500V DC.4-5 DIELECTRIC WITHSTANDING VOLTAGEThe test is performed in accordance with EIA-364-20C. A 500V AC is applied between two adjacent contacts of the test samples for 60 seconds.4-6 CONTACT CAPACITANCEThe test is performed in accordance with for EIA-364-30A. Using 1 kHz signal to the adjacent contacts of a unmated connector. Capacitance shall not exceed 2pF Max..4-7 INSERTION FORCE WITHDRAWAL FORCEThe test is performed in accordance with EIA-364-13B.At a maximum rate of 12.5mm per minute.4-8 DURABILITYThe test is performed in accordance with EIA-364-09C. Test samples are subjected to fully mating and unmating or a predetermined number of cycles. The durability rate is 200 cycles per hour. Record the first 10 and last 10cycles’s data,and during the durability test, record 10cycles’ data every 1000.4-9 MECHANICAL SHOCKThe test is performed in accordance with EIA-364-27B, test condition H. Mated samples are subjected to 3 Shocks in each direction along the three mutually perpendicular axes (18 shocks) complied, with half-sinewaveform which had a 30g’s peak level and a normal duration of 11 milliseconds. The test current is 100mA for all contacts, which are wired in series and attached to an electrical discontinuity monitor. Throughout the test,electrical discontinuity of 1 microsecond or longer shall not be allowed.4-10 RANDOM VIBRATIONThe test is performed in accordance with EIA-364-28D. Vibrations spectrum:0.02g2/Hz,5-2000Hz.Duration is 1.5 hrs on each axis. The test current is 100mA for all contacts, which are wired in series and attached to an electricaldiscontinuity monitor. Though out the test, electrical discontinuity of 1 microsecond or longer shall not be allowed.5.THE SUMMARY OF THE TEST RESULTSGROUP “A”TEST DESCRIPTION REQUIREMENT RESULT RATE1.EXAMINATION OF PRODUCT Connectors& contacts shall have noevidence of physical defects or otherwiseunfit for testing.Pass the specified requirement Pass2.LOW LEVEL CONTACT RESISTANCE 30mΩ Max.Max. Min. Avg. Pass Vender-1’s mating part (from customer) 22.99 14.01 19.39 Vender-2’s mating part (from foxconn DS) 23.29 13.63 19.23Unit: mΩ3.INSULATIONRESISTANCE5MΩ Min.＞9.26×107MΩPass4. DIELECTRICWITHSTANDINGVOLTAGENo breakdown and flashover. Pass the specified requirement Pass5. INSERTION FORCE WITHDRAWAL FORCE Vender-1’s mating part (from customer) Max. Min. Avg. Pass sample-1 insertion force :35N Max. 13.1 9.2 11.4 sample-1 withdrawal force : 10N Min. 17.8 16.5 17.0 sample-2 insertion force :35N Max. 13.6 9.9 11.4 sample-2 withdrawal force : 10N Min. 17.1 15.9 16.3 sample-3 insertion force :35N Max. 15.2 9.4 12.1 sample-3 withdrawal force : 10N Min. 21.4 16.0 19.8 sample-4 insertion force :35N Max. 17.4 10.8 14.1 sample-4 withdrawal force : 10N Min. 23.7 17.8 19.9 sample-5 insertion force :35N Max. 19.2 17.4 18.5 sample-5 withdrawal force : 10N Min. 22.8 21.5 22.3Unit:NVender-2’s mating part (from foxconn DS) Max. Min. Avg. sample-1 insertion force :35N Max. 12.7 10.4 11.3 sample-1 withdrawal force : 10N Min. 18.4 15.5 17.0 sample-2 insertion force :35N Max. 12.4 9.8 10.9 sample-2 withdrawal force : 10N Min. 15.9 11.9 14.2 sample-3 insertion force :35N Max. 14.7 9.9 11.9 sample-3 withdrawal force : 10N Min. 21.2 15.9 19.4 sample-4 insertion force :35N Max. 16.4 10.4 13.1 sample-4 withdrawal force : 10N Min. 22.7 15.4 19.3 sample-5 insertion force :35N Max. 12.4 9.4 10.8 sample-5 withdrawal force : 10N Min. 21.5 17.8 19.6Unit:N6.DURABILITY After 1000 cycles of durability test thesamples shall pass the requirements of thefollowing test itemsPass the specified requirement Pass7. INSERTION FORCE WITHDRAWAL FORCE Vender-1’s mating part (from customer) Max. Min. Avg. Pass sample-1 insertion force :35N Max. 15.1 9.6 12.7 sample-1 withdrawal force : 10N Min. 16.6 13.5 15.4 sample-2 insertion force :35N Max. 10.8 9.7 10.4 sample-2 withdrawal force : 10N Min. 12.1 11.4 11.7 sample-3 insertion force :35N Max. 17.9 13.9 16.4 sample-3 withdrawal force : 10N Min. 25.3 19.1 23.2 sample-4 insertion force :35N Max. 18.3 11.5 15.8 sample-4 withdrawal force : 10N Min. 19.5 16.6 18.4 sample-5 insertion force :35N Max. 16.3 12.8 14.7 sample-5 withdrawal force : 10N Min. 21.0 17.2 18.8Unit:Nsample-1 withdrawal force : 10N Min. 15.5 14.0 14.7sample-2 insertion force :35N Max. 11.4 10.0 10.9sample-2 withdrawal force : 10N Min. 12.9 11.7 12.4sample-3 insertion force :35N Max. 14.0 12.7 13.4sample-3 withdrawal force : 10N Min. 22.3 19.9 21.2sample-4 insertion force :35N Max. 15.0 12.4 14.1sample-4 withdrawal force : 10N Min. 17.0 15.0 16.5sample-5 insertion force :35N Max. 11.0 9.8 10.6sample-5 withdrawal force : 10N Min. 17.2 14.9 16.4Unit:N8.DURABILITY After 2000 cycles of durability test thesamples shall pass the requirements of thefollowing test itemsPass the specified requirement Pass9. INSERTION FORCE WITHDRAWAL FORCE Vender-1’s mating part (from customer) Max. Min. Avg. Pass sample-1 insertion force :35N Max. 16.3 15.8 16.0 sample-1 withdrawal force : 10N Min. 16.0 15.5 15.7 sample-2 insertion force :35N Max. 8.8 7.9 8.4 sample-2 withdrawal force : 10N Min. 10.8 10.2 10.6 sample-3 insertion force :35N Max. 17.1 16.5 16.8 sample-3 withdrawal force : 10N Min. 17.0 16.3 16.6 sample-4 insertion force :35N Max. 15.9 14.8 15.6 sample-4 withdrawal force : 10N Min. 16.2 15.0 15.8 sample-5 insertion force :35N Max. 16.8 14.6 15.8 sample-5 withdrawal force : 10N Min. 17.3 16.3 16.7Unit:NVender-2’s mating part (from foxconn DS) Max. Min. Avg. sample-1 insertion force :35N Max. 15.2 13.9 14.6 sample-1 withdrawal force : 10N Min. 16.2 14.8 15.4 sample-2 insertion force :35N Max. 10.0 8.8 9.3sample-2 withdrawal force : 10N Min. 11.4 10.5 10.8 sample-3 insertion force :35N Max. 16.2 14.9 15.7 sample-3 withdrawal force : 10N Min. 17.0 15.9 16.4 sample-4 insertion force :35N Max. 15.2 14.7 15.0 sample-4 withdrawal force : 10N Min. 16.1 14.2 15.1 sample-5 insertion force :35N Max. 13.9 12.8 13.3 sample-5 withdrawal force : 10N Min. 15.8 15.0 15.3Unit:N10.DURABILITY After 3000 cycles of durability test thesamples shall pass the requirements of thefollowing test itemsPass the specified requirement Pass11. INSERTION FORCE WITHDRAWAL FORCE Vender-1’s mating part (from customer) Max. Min. Avg. Pass sample-1 insertion force :35N Max. 18.2 17.4 17.7 sample-1 withdrawal force : 10N Min. 21.0 20.4 20.6 sample-2 insertion force :35N Max. 12.4 11.9 12.2 sample-2 withdrawal force : 10N Min. 13.5 13.2 13.4 sample-3 insertion force :35N Max. 11.8 11.5 11.7 sample-3 withdrawal force : 10N Min. 11.9 11.4 11.7 sample-4 insertion force :35N Max. 11.9 11.2 11.6 sample-4 withdrawal force : 10N Min. 12.4 11.3 11.8 sample-5 insertion force :35N Max. 16.2 15.7 15.9 sample-5 withdrawal force : 10N Min. 16.8 14.6 16.0Unit:NVender-2’s mating part (from foxconn DS) Max. Min. Avg.sample-2 insertion force :35N Max. 12.0 11.2 11.5sample-2 withdrawal force : 10N Min. 14.7 13.2 13.9sample-3 insertion force :35N Max. 12.9 12.1 12.5sample-3 withdrawal force : 10N Min. 12.8 11.5 12.2sample-4 insertion force :35N Max. 11.8 11.0 11.3sample-4 withdrawal force : 10N Min. 13.6 12.5 13.2sample-5 insertion force :35N Max. 9.7 9.0 9.4sample-5 withdrawal force : 10N Min. 13.8 11.9 13.1Unit:N12.DURABILITY After 4000 cycles of durability test thesamples shall pass the requirements of thefollowing test itemsPass the specified requirement Pass13. INSERTION FORCE WITHDRAWAL FORCE Vender-1’s mating part (from customer) Max. Min. Avg. Pass sample-1 insertion force :35N Max. 12.4 11.2 11.8 sample-1 withdrawal force : 10N Min. 17.9 17.1 17.4 sample-2 insertion force :35N Max. 12.2 11.5 11.9 sample-2 withdrawal force : 10N Min. 13.5 12.4 13.0 sample-3 insertion force :35N Max. 12.1 11.2 11.6 sample-3 withdrawal force : 10N Min. 12.7 11.8 12.2 sample-4 insertion force :35N Max. 11.1 10.2 10.6 sample-4 withdrawal force : 10N Min. 11.0 10.2 10.4 sample-5 insertion force :35N Max. 12.8 11.7 12.1 sample-5 withdrawal force : 10N Min. 14.5 13.5 14.1Unit:NVender-2’s mating part (from foxconn DS) Max. Min. Avg. sample-1 insertion force :35N Max. 12.3 11.5 11.9 sample-1 withdrawal force : 10N Min. 16.9 15.8 16.5 sample-2 insertion force :35N Max. 12.4 11.0 11.7 sample-2 withdrawal force : 10N Min. 13.5 11.9 12.7 sample-3 insertion force :35N Max. 11.8 10.9 11.2 sample-3 withdrawal force : 10N Min. 12.4 11.2 11.8 sample-4 insertion force :35N Max. 12.4 10.4 11.1 sample-4 withdrawal force : 10N Min. 12.7 11.9 12.2 sample-5 insertion force :35N Max. 11.9 10.7 11.3 sample-5 withdrawal force : 10N Min. 12.4 10.9 11.9Unit:N14.DURABILITY After 5000 cycles of durability test thesamples shall pass the requirements of thefollowing test itemsPass the specified requirement Pass15. INSERTION FORCE WITHDRAWAL FORCE Vender-1’s mating part (from customer) Max. Min. Avg. Pass sample-1 insertion force :35N Max. 17.5 16.9 17.1 sample-1 withdrawal force : 10N Min. 21.4 20.0 20.6 sample-2 insertion force :35N Max. 14.5 13.5 13.9 sample-2 withdrawal force : 10N Min. 17.1 16.5 16.8 sample-3 insertion force :35N Max. 13.7 12.9 13.3 sample-3 withdrawal force : 10N Min. 16.4 15.5 16.0 sample-4 insertion force :35N Max. 13.6 12.7 13.2 sample-4 withdrawal force : 10N Min. 14.6 13.2 14.0 sample-5 insertion force :35N Max. 11.5 11.1 11.3 sample-5 withdrawal force : 10N Min. 13.1 12.8 12.9Unit:NVender-2’s mating part (from foxconn DS) Max. Min. Avg. sample-1 insertion force :35N Max. 17.5 16.9 17.1sample-2 withdrawal force : 10N Min. 17.2 16.5 17.0 sample-3 insertion force :35N Max. 13.6 12.5 13.1 sample-3 withdrawal force : 10N Min. 16.2 15.0 15.6 sample-4 insertion force :35N Max. 13.2 11.0 12.0 sample-4 withdrawal force : 10N Min. 12.8 11.5 12.3 sample-5 insertion force :35N Max. 12.0 10.9 11.5 sample-5 withdrawal force : 10N Min. 12.0 11.5 11.8Unit:N16. LOW LEVEL CONTACT RESISTANCE No change greater than 10mΩThe change of resistance = R Final– R InitialMax. Min. Avg. PassVender-1’s mating part (from customer) 6.71 2.28 2.89 Vender-2’s mating part (from foxconn DS) 6.07 2.21 3.20Unit: mΩ17.INSULATIONRESISTANCE5MΩ Min.＞6.97×106MΩPass18. DIELECTRICWITHSTANDINGVOLTAGENo breakdown and flashover. Pass the specified requirement Pass19.EXAMINATION OF PRODUCT Connectors& contacts shall have noevidence of physical defects or otherwiseunfit for testing.Pass the specified requirement PassGROUP “B”TEST DESCRIPTION REQUIREMENT RESULT RATE1.EXAMINATION OF PRODUCT Connectors& contacts shall have no evidenceof physical defects or otherwise unfit for testing.Pass the specifiedrequirementPass2.LOW LEVEL CONTACT RESISTANCE 30mΩ Max.Max. Min. Avg. Pass24.54 16.85 20.40Unit: mΩ3.INSULATIONRESISTANCE5MΩ Min.＞9.99×107MΩPass4. DIELECTRIC WITHSTANDING VOLTAGE No breakdown and flashover. Pass the specifiedrequirementPass5. INSERTION FORCE WITHDRAWAL FORCEMax. Min. Avg. Pass sample-1 insertion force :35N Max. 16.7 11.7 13.7 sample-1 withdrawal force : 10N Min. 18.1 16.6 17.1 sample-2 insertion force :35N Max. 16.6 11.1 13.1 sample-2 withdrawal force : 10N Min. 21.0 18.5 19.9 sample-3 insertion force :35N Max. 15.1 9.8 12.1 sample-3 withdrawal force : 10N Min. 21.4 17.4 18.5 sample-4 insertion force :35N Max. 17.3 10.5 13.3 sample-4 withdrawal force : 10N Min. 21.1 18.0 19.4 sample-5 insertion force :35N Max. 14.7 11.2 12.5 sample-5 withdrawal force : 10N Min. 22.3 20.0 21.2Unit:N6.MECHANICAL SHOCK No electrical discontinuity greater than 1microsecond during the test. No physicaldamage.Pass the specifiedrequirementPass7.LOW LEVEL CONTACT RESISTANCE No change greater than 10mΩThe change of resistance = R Final– R InitialMax. Min. Avg. Pass5.32 1.90 2.80Unit: mΩ8.INSULATIONRESISTANCE5MΩ Min.＞1.99×106MΩPass9. DIELECTRIC WITHSTANDING VOLTAGE No breakdown and flashover. Pass the specifiedrequirementPass10. INSERTION FORCE WITHDRAWAL FORCEMax. Min. Avg. Pass sample-1 insertion force :35N Max. 15.4 11.8 13.7 sample-1 withdrawal force : 10N Min. 23.4 19.4 21.5 sample-2 insertion force :35N Max. 18.6 13.3 15.5 sample-2 withdrawal force : 10N Min. 22.7 18.6 21.0 sample-3 insertion force :35N Max. 16.9 13.7 15.5 sample-3 withdrawal force : 10N Min. 24.7 21.1 22.9 sample-4 insertion force :35N Max. 17.4 13.7 16.1 sample-4 withdrawal force : 10N Min. 26.1 21.6 24.1 sample-5 insertion force :35N Max. 17.6 13.2 15.3 sample-5 withdrawal force : 10N Min. 26.2 20.8 23.3Unit:N11.EXAMINATION OF PRODUCT Connectors& contacts shall have no evidenceof physical defects or otherwise unfit for testing.Pass the specifiedrequirementPassGROUP “C”TEST DESCRIPTION REQUIREMENT RESULT RATE1.EXAMINATION OF PRODUCT Connectors& contacts shall have no evidenceof physical defects or otherwise unfit for testing.Pass the specifiedrequirementPass2.LOW LEVEL CONTACT RESISTANCE 30mΩ Max.Max. Min. Avg. Pass24.85 16.39 20.55Unit: mΩ3.INSULATIONRESISTANCE5MΩ Min.＞9.99×107MΩPass4. DIELECTRIC WITHSTANDING VOLTAGE No breakdown and flashover. Pass the specifiedrequirementPass5. INSERTION FORCE WITHDRAWAL FORCEMax. Min. Avg. Pass sample-1 insertion force :35N Max. 18.4 17.9 18.3 sample-1 withdrawal force : 10N Min. 22.3 17.9 20.1 sample-2 insertion force :35N Max. 19.8 18.5 19.1 sample-2 withdrawal force : 10N Min. 23.0 21.2 22.0 sample-3 insertion force :35N Max. 17.8 16.2 17.2 sample-3 withdrawal force : 10N Min. 21.6 18.6 20.2 sample-4 insertion force :35N Max. 20.0 17.1 18.9 sample-4 withdrawal force : 10N Min. 23.9 21.0 22.0 sample-5 insertion force :35N Max. 24.4 15.1 20.1 sample-5 withdrawal force : 10N Min. 26.7 22.7 25.2Unit:N6.VIBRATION No electrical discontinuity greater than 1microsecond during the test. No physicaldamage. Pass the specifiedrequirementPass7.LOW LEVEL CONTACT RESISTANCE No change greater than 10mΩThe change of resistance = R Final– R InitialMax. Min. Avg. Pass7.90 1.49 3.03Unit: mΩ8.INSULATIONRESISTANCE5MΩ Min.＞4.97×106MΩPass9. DIELECTRIC WITHSTANDING VOLTAGE No breakdown and flashover. Pass the specifiedrequirementPass10. INSERTION FORCE WITHDRAWAL FORCEMax. Min. Avg. Pass sample-1 insertion force :35N Max. 19.4 13.6 16.8 sample-1 withdrawal force : 10N Min. 31.2 25.8 29.2 sample-2 insertion force :35N Max. 19.4 15.0 17.5 sample-2 withdrawal force : 10N Min. 29.4 23.9 26.9 sample-3 insertion force :35N Max. 19.3 13.3 16.8 sample-3 withdrawal force : 10N Min. 26.0 22.0 24.0 sample-4 insertion force :35N Max. 17.4 11.5 14.7 sample-4 withdrawal force : 10N Min. 24.6 22.9 23.8 sample-5 insertion force :35N Max. 20.7 13.3 16.8 sample-5 withdrawal force : 10N Min. 28.0 22.9 25.5Unit:N11.EXAMINATION OF PRODUCT Connectors& contacts shall have no evidenceof physical defects or otherwise unfit for testing.Pass the specifiedrequirementPassGROUP “D”TEST DESCRIPTION REQUIREMENT RESULT RATE1.EXAMINATION OF PRODUCT Connectors& contacts shall have no evidenceof physical defects or otherwise unfit for testing.Pass the specifiedrequirementPass2.CONTACTCAPACITANCE 2pF Max.Max. Min. Avg. Pass 1.64 1.04 1.30 Unit:pF3.CURRENT RATINGNo changes greater than 30℃1 2 3 4 5 Pass 5.0 6.1 6.3 5.4 5.5 Unit: ℃。

USB2.0成品线材高频性能测试报告(TDR)

Date:2019/08/31
(15:26: 01)
Tester: Bruce
Sign above
Sign above
P.N.:S001
.Test Equipments Information
ID Product and Serial Number
1 E5071C(MY46525218)
2
E5071C()
3
ENA-
Description with series number
S-parameter Network Analyzer Time Domain Reflector(TDR)
Data Timing Generator
Manufacture
Agilent Keysight Keysight
.Device Under Test(DUT) Information
Part Number of Length( m) Temper ature Batch Number Testing followin Comme nts Technici an
1.8 20 USB2.0
Bruce
Tested
Pairs
Humidit
t Result
P.N.:S001
Page 6 of 10
Date:2019/08/31
Tester: Bruce
P.N.:S001
Page 7 of 10
Date:2019/08/31
Tester: Bruce
P.N.:S001
Page 8 of 10
Date:2019/08/31
Tester: Bruce
Num Result Spc Max Spc Min value Value △Value Avg

USB2.0信号测试指导

USB 2.0 Compliance Testing with Agilent Infiniium OscilloscopesApplication Note 1400Who Should Read This Application Note?Digital designers and developers working towards USB 2.0 compliance.IntroductionUniversal Serial Bus (USB) burst on the scene in 1995 delivering a revolutionary way to connect personal computers and devices. Allowing hot-plug capability, USB has introduced ease-of-use to the PC device market by providing a simple connection scheme and protocol for a wide variety of computer devices, ranging from keyboards and mice to high-bandwidth devices such as printers, scanners, and cameras.USB has now successfullyreplaced aging serial and parallel ports as the connection of choice for both device manufacturers and end users. Whereas cable length and device expansionwere limitations with older serial and parallel connections, they are no issue for USB. Amazingly,it allows devices to exist up to 30-meters away from the host, and allows up to 127 devices to be connected to a single host and port at once through a series of USB hubs. The ability to talk directly to devices or to devices through hubs allows for this incredible expansion B 1.1 worked best for slower human-interface devices such as mice and keyboards, with low-speed operating at 1.5-Mb/s and full-speed operating at12-Mb/s. Higher-bandwidth devic-es were severely limited by these relatively slow data transfer rates. As a result, the USB-Implementers Forum (USB-IF) introduced the fully backward compatible USB 2.0 in May 2000, which resulted in a 40-fold increase in datathroughput for hi-speed over full-speed. USB 2.0 operates at 480-Mb/s—ideal for devices such as video-conferencing cameras and high-resolution printers. For more information, see the official USB-IF (USB Interoperability Forum) website at .Basic SpecificationsAs listed previously, USB 2.0 comprises three different data transfer rates—low-speed,full-speed, and hi-speed.Four wires compose the cable system—V BUS, D+, D-, and ground. Devices may be either bus-powered, with 500-mA maximum bus current withdraw, or self-powered, meaning they have their own power supply.D- and D+ is a differential signal pair that serves as the primary information carrier between the host, hubs, and devices. USB 2.0 supports three different types of data transfer: interrupt, bulk, or isochronous. Control packets containing commands or query parameters may also be sent by the host.The flexibility inherent in USB is a direct result of the specifica-tions above and the stringent regulations and compliance testing mandated by the USB-IF. There are three kinds of compliance tests: framework test,interoperability test, and electri-cal test. This document onlydiscusses Infiniium’s electricaltest solution.Low, full, and hi-speed USBrequire compliance with thesignal quality, in-rush currentcheck, droop/drop and backdrive voltage electrical tests. Hi-speed requires compliance withan additional suite ofelectrical tests—hi-speed sig-nal quality, receiver sensitivity,CHIRP timing, and packetparameters. Older methods ofcompliance testing included firstcapturing the signals on a scope,then moving the data to a PC so itcould be cropped, stored in a .tsvformat, and finally analyzed inMATLAB®. The Agilent InfiniiumUSB Test Option is the first scopesolution in the industry that uti-lizes the official USB-IF MATLABscript. As the result, it providesan affordable, trustworthy, single-box, compliance solution—allow-ing you to say, as did one of ourcustomers, “I know I’m going topass!”23Full/Low-Speed Test SuiteAgilent test equipment has beenapproved by the USB-IF.Figure 1. Agilent Infiniium at official USB-IF Plugfest.The basic USB 2.0 electrical test suite includes signal quality,in-rush current check, and droop/drop tests. A SQiDD (Signal Quality inrush Droop Drop) fix-ture must be used for these tests. Agilent provides a SQiDD boardFull/Low-Speed Test Fixturethat is orderedseparately as part numberE2646A. The USB-IF exclusively uses the Agilent SQiDD board for official compliance testing.Figure 2. Agilent SQiDD board.Wire loopWire loop‘B’ Socket‘A’ Socket‘B’ Socket‘B’ Socket‘A’ Socket‘A’ SocketSwitchSwitch4Signal Quality TestUsing an oscilloscope to measure transceiver characteristics, the signal quality test looks at:• Signal eye• End of Packet (EOP) width • Signaling Rate • Rise/Fall Times• Cross-over Voltage Range • Consecutive Jitter • Paired JK Jitter • Paired KJ JitterSignal quality testing can beperformed for either upstream data or downstream data. In the case of upstream testing, signals travelling from the device to the host are captured and analyzed. Downstream testing performs just the opposite, capturing signals travelling from the host towards the device or terminating hub. Figure 3 shows a captured down-stream packet on the Infiniiumscope with the USB Test Option.Figure 3. Captured downstream packet.Signal Quality Test (continued)launched, other conditions mustalso be set in the software. Forsignal quality tests, these addi-tional conditions include tierand near end/far end. The tierrefers to the distance between thedevice and the host computer. Ifthe device is connected directly tothe host computer, the tier equals1. If the device is separated fromthe host computer by 3 hubs, thetier equals 4. Compliance testingmandates that testing occur ata minimum tier of 6; therefore,Agilent recommends that testsalways be performed with a tierFigure 4. Infiniium USB test menu.of 6. Test results may be storedin a data file on the Infiniium’sC: drive, or may also be stored toa USB flash drive.Infiniium displays all test resultsin an html format, including theeye diagram.Figure 5. Infiniium signal quality test results.5In-Rush Current Checkdictates that a surge of currentwill occur, followed by a lessersteady-state current level, whenpower is applied to a device.The hot-pluggable nature of USBrequires that the total inrushsurge current be tested to ensurethat it remains within the limitsfor the device. If the inrushcurrent does not remain withinits limits (100 mA), not only canit cause damage to the device, butit can also take power from otherdevices connected to the sameport.The USB 2.0 specification out-lines a total inrush surge currentlimit of 50-uC. A waiver is grant-ed at 150 μC.Figure 7. In-rush current spike.67Droop and Drop TestingBack-Drive Voltage TestDroop and drop testing proce-dures vary based on whether the device is self-powered or bus powered.Hosts and Self-Powered Hubs Drop testing measures the DC voltage drop across each load board attached to the SQiDD board. To get a good indication of voltage drop, the test is per-formed under two conditions—no load and load. Under no load testing, all downstream ports remain open, while the V BUS voltage test points on the SQiDD board are probed. Load testing tests the V BUS voltage test points with 500-mA loads applied to all downstream ports. The lowest measured loaded value should be used for the droop test.Droop testing involves measuring the AC voltage drop on V BUS that occurs when all but one port are under 500-mA loads; The unload-ed port is then connected to the SQiDD board. Once the instantan-cous AC voltage drop is captured on the display, markers are used to bracket the area between the lowest point and steady-state voltage point of V BUS . Infiniium then uses the bracketed data toperform the droop test.Figure 8. Droop setup for hosts and self-powered hubs.The droop test for bus-powered hubs again uses the 100-mA-load board. This load board is con-nected to all but one port on the bus-powered device. The SQiDD board is then attached to the unloaded port. Once again,markers are used to bracket the area between the lowest point on the captured data and the steady-state voltage. TheInfiniium then uses the bracketed data to run the drop test.Bus-Powered HubsDrop tests for bus-powered hubs use 100-mA load boards instead of the 500-mA load boards used in the self-powered hub proce-dure. These 100-mA boards are connected to all downstream ports. The V BUS voltage is then measured at the hub upstream port and at each downstream port. The lowest measured downstream value is used for the drop test.The back-drive voltage test is performed to ensure that a device only draws and does not sourcecurrent from V BUS on its upstream facing port at all times. If a device supplies current at this port, a number of consequences can occur, including hub enumerationfailure, PC boot failure, and motherboard failure. This test measures the DC voltages ofV BUS , D+, and D- before and after device enumeration. The voltages are then recorded on the back-drive voltage fixture. Any voltage exceeding 400-mV is considered a failure.8On the hi-speed USB Test Bed Computer, the USB hi-speedElectrical Test Tool is required.Figure 9. USB-IF hi-speed electrical test tool.Hi-Speed Electrical Test SuiteAn additional suite of tests was added to the USB 2.0 compliance procedure to accommodate the new hi-speed mode. These tests include hi-speed signal quality, receiver sensitivity, CHIRP timing, and packet parameter.Hi-Speed Electrical Test Tool9The hi-speed signal quality test utilizes the hi-speed signal quality board, as shown in Figure 10.The nomenclatures of the test points differ between the Agilent hi-speed test fixture and the Intel test fixture. The official USB test procedure is written with reference to Agilent’s test fixtures. Refer to Table 5, the cross-reference chart, whenusing Intel’s test fixture.Figure 10. Hi-speed signal quality boards (Agilent fixture andIntel fixture—device signal quality test).Hi-Speed Test Fixture10Hi-Speed Signal Quality TestInvoke the Hi-speed Electrical Test Tool software on Electrical Test bed computer and select TEST_PACKET to perform the sig-nal quality test. Figure 11 shows a hi-speed test packet captured on an Infiniium oscilloscope.Prior to testing, it must be deter-mined if the device incorporates a captive cable, or if it contains a series B or mini-B connector. During upstream tests, captive cables require that tests be run at the far end. B-connector cables require that tests be run at the near end. Figure 12 shows a hi-speed eye pattern result displayed on an Infiniiumoscilloscope.Figure 11. Hi-speed test packet.Figure 12. Hi-speed signal quality eye diagram.MonotonicityMonotonicity tests if a transmit-ted signal increases or decreases in amplitude without reversal in the opposite direction. The monotonicity characteristic of a signal can be viewed using the hi-speed signal quality eye template (Figure 12). There is no indepen-dent monotonicity test mandated by the USB-IF.Receiver SensitivityThe receiver sensitivity tests verify sensitivity of the receivers of a device on both the upstream and downstream data ports in noisy environments. The Agilent 81130A/81134A Pulse/Pattern Generator is used to emulate IN commands from the port to the device address 1. IN commands are sent from the computer to the device under test, which should be in an unsquelched mode. The noise is represented by a pre-set level, whereby a signal meeting and exceeding this level responds to the IN command with anNAK. All packets from the data generator must be NAK’d by the port under test. The amplitude of the data generator packets is then reduced in 20-mV increments as the test is run. The amplitude of these packets should be reduced until the NAK packets become infrequent. The data generator amplitude is then immediately increased to the point where the Figure 14. Receiver sensitivity test.Data generator packet Device responsegenerator packetPacket Parameters TestAnother test using the hi-speedsignal quality board tests thedevice packet parameters. Thehi-speed signal quality test boardallows for better reception of thepackets coming from the device.This test measures parameterssuch as sync field length, end ofpacket (EOP) width, and inter-packet gap.Figure 13. Device inter-packet gap.NAK packets are not intermittent. This indicates the points of minimum receiver sensitivity levels before squelch.When the device receives IN packets with a signal amplitude in excess of 150-mV, all packets should be NAK’d. When the device receives IN packetswith a signal amplitude below 100-mV, all packets should be squelched. A waiver is granted for squelch at +/- 50-mV for each level.11CHIRP Timing TestThe CHIRP test utilizes thehi-speed signal quality test fixture to measure timing and voltage on both upstream and downstream ports. The deviceis hot-plugged to the port andis immediately enumerated to capture the CHIRP handshake. Within the handshake, the CHIRP-K duration is measured to verify that it is within the 1.0-ms and 7.0-ms allowable latency. After the CHIRP K-J, K-J, K-J sequence, the device responds by turning on its hi-speed termina-tions. A drop of amplitude from800-mV nominal to 400-mV nominal occurs. The time between the beginning of thelast J in the CHIRP K-J, K-J, K-J sequence and the time whenthe device turn on initiates its hi-speed terminations must be mea-sured to verify that it is less than or equal to 500-μs.In addition to measuring thetime between the last J in CHIRP and the initiation of hi-speed termination, the CHIRPtest also measures device suspend/resume/reset timing as well as the K and J amplitudes.Figure 15. CHIRP test.Device’s chip latency(2.5 µs <-> 3 ms)Device hi-speedtermination ONFigure 16. Time between last J in CHIRP and hi-speed termination initiation.CHIRP K(1 ms <-> 7 ms)12Impedance Measurements In this test, differential time domain reflectometer (TDR) mea-surements are taken tomeasure the impedance of the hi-speed signaling path andactive terminations of the device under test. The TDR measure-ments are compared with the USB-IF specification require-ments. The device under testis powered, placed in SE0-NAK mode, and isolated from the system. D+ and D- are measuredto verify that they are 0-V ±10-mV.A 400-ps edge is then driven into the device. The resulting wave-form indicates whether or not the termination impedance and the through impedance meet the requirements. The TDR measure-ment is not required for compli-ance testing. A PASS signal quality test will suffice for the TDR measurement.Figure 17. TDR measurement.USB connectorTermination resistor1314SummaryAgilent provides a comprehen-sive, easy-to-use solution for USB compliance testing. The compli-ance testing that once took days now takes only minutes. The indi-vidualized test boards provideflexibility and affordability for the laboratory choosing to test facets of the USB specification simultaneously.In conclusion, the AgilentInfiniium USB Test Option has been described this way:“The term ‘God Send’ comes to mind. Before the arrival of this scope, a USB test was something to be avoided! It often required half a day to set up the test and an additional 30 minutes to massage the numbers into anacceptable MATLAB format.Needless to say only the minimum number of tests required was ever actually performed.“In a nutshell, this product has revolutionized the way in which we look at USB. We now have a designated test system that is reliable and easy to use and fast. The main result is that we can now provide real-time feedback, and the amount of testing we perform is probably up 30-fold or more. And as you may have guessed, the additional testing has turned up a myriad of inter-esting opportunities for future improvements. Just for fun we have even started looking at our competitor’s products!”MATLAB ® is a U.S. registered trademark of Math Works, Inc.Windows ® is a U.S. registered trademark of Microsoft Corporation.Agilent Technologies OscilloscopesMultiple form factors from 20 MHz to >90 GHz | Industry leading specs | Powerful applications15Remove all doubtOur repair and calibration services will get your equipment back to you, performing like new, when promised. You will get full value out of your Agilent equipment throughout its lifetime. Your equipment will be serviced by Agilent-trained technicians using the latest factory calibration procedures, automated repair diagnostics and genuine parts. You will always have the utmost confidence in your measurements.Agilent offers a wide range of additionalexpert test and measurement servicesfor your equipment, including initialstart-up assistance, onsite educationand training, as well as design, systemintegration, and project management.For more information on repair andcalibration services, go to:/find/removealldoubt/find/openAgilent Open simplifies the process of connecting and programming test systems to help engineers design, validate and manufacture electronic products. Agilent offers open connectivity for a broad range of system-ready instruments, open industry software, PC-standard I/O and global support, which are combined to more easily integrate test system development./find/emailupdates Get the latest information on the products and applications you select./find/agilentdirect Quickly choose and use your test equipment solutions with confidence.Agilent Email UpdatesAgilent DirectLXI is the LAN-based successor to GPIB, providing faster, more efficient connectivity. Agilent is a founding member of the LXI consortium./ﬁ nd/usb2_compliance For more information on Agilent Technologies’ products, applications or services, please contact your local Agilent office. The complete list is available at:/ﬁ nd/contactusAmericasCanada (877) 894-4414 Latin America 305 269 7500United States (800) 829-4444Asia Paciﬁ c Australia 1 800 629 485China 800 810 0189Hong Kong 800 938 693India 1 800 112 929Japan 0120 (421) 345K orea 080 769 0800Malaysia 1 800 888 848Singapore 1 800 375 8100Taiwan 0800 047 866Thailand 1 800 226 008Europe & Middle EastAustria 01 36027 71571Belgium 32 (0) 2 404 93 40 Denmark 45 70 13 15 15Finland 358 (0) 10 855 2100France 0825 010 700* *0.125 €/minute Germany 07031 464 6333****0.14 €/minuteIreland 1890 924 204Israel 972-3-9288-504/544Italy 39 02 92 60 8484Netherlands 31 (0) 20 547 2111Spain 34 (91) 631 3300Sweden 0200-88 22 55Switzerland 0800 80 53 53United Kingdom 44 (0) 118 9276201Other European Countries: /ﬁ nd/contactusRevised: July 17, 2008Product speciﬁ cations and descriptions in this document subject to change without notice.© Agilent Technologies, Inc. 2008Printed in USA, August 1, 20085988-6219EN。

USB成品测试报告

2009101501
溫度Temp:23~26℃ 相對濕度R.H.:58%~62% 判定Judge 5 OK NG
测试记录Testing Result 1 2 3 4
1
测试电流直流低电阻测试仪 Test current:100mA DIGITAL MICRO满刻度电压 OHMMETER Full scale voltage:20mV YD2511 测试电压 Test voltage:500VDC 测试时间 Operation stated:2min 测试电压 Test voltage:500VAC 截止电流 Cut-off current:3mA 测试时间 Operation stated:1 min 绝缘电阻测试仪 ULTRA HIGH RESISTANCE METER TH2683 耐压测试机 BREAKDOWN TESTER CJ2671A
(
USB AF侧插铁壳，PBT BK
测试条件 Testing Conditions
測試日期 Date of Testing 樣品數量 Quantity 测试设备 Testing Equipment
2009.10.15 5PCS
规格 SPEC
報告編號 Report NO. 測試環境 Measuring Environment
可调温锡炉 SOLDERABILITY
OK
OK
OK
OK
OK
V
7
温度焊锡耐热性测试 Temperature: 200℃±5℃ 可调温锡炉 Resistance to 测试时间 SOLDERABILITY soldering heat test Duration:5±0.5sec
无异常 Normal
OK

接口插拔试验报告

质量及可靠性测试报告报告编号/Report. No: QA0012 日期/Date: 2015.11.17页/Sheet 1 to 3测试项目/条件（Test items /Conditions）接口插拔试验(Connector life Test)产品型号(Model No.)PWR-212-LED测试设备/工具(Test equipment/tool )Plug and Insert machine-TH1220S试验数量( Tested QTY )3pcs试验目的(Purpose)可靠性测试报告测试次数(Test times ) 5000客户(Customer)RA V测试参数(Test parameter) Test times：5000 实验室环境Testing environmenttemperature：20±5℃humidity: 45%~75%RH测试步骤Test Step 1.取3PCS MICRO USB定位座子通孔内100%有锡品确认其外观，确保其它外观PASS.2.插拔机设定好参数3.固定样品开始测试。

4.试验结束检查样品外观及测试其阻值测试结果/结论Test result/Conclusion 1.在试验之前检查样品的外观PASS2.在试验之后检查样品的外观及测试其阻值结果PASS接收标准Acceptance criteria试验后样品的外观及测试其阻值没有问题试验分析Tested analysisNATest Result：■ 1.合格(PASS); □2.不合格(FAIL) ; □3条件接收(CONDITION PASS) 制订/Prepared By:CJS审核/Reviewed By:批准/Approved By:日期/Date(DD/MM/YY) :2015.11.17日期/Date(DD/MM/YY): 日期/Date(DD/MM/YY) :Connector life Test Report 报告编号/Report No: QA0012页/Sheet 2 to 3Test Step:5. 1. 取3PCS MICRO USB定位座子通孔内100%有锡品确认其外观，确保其它外观PASS.2. 插拔试验结束检查外观及测试其阻值结果PASS.3、测试图片报告编号/Report. No QA0012Connector life Test Report页/Sheet 3 to 3 ----------------------------------------THE----END---------------------------------------------。

USB数据线硬件与可靠性测试规范图文稿

USB数据线硬件与可靠性测试规范图文稿U S B数据线硬件与可靠性测试规范文件管理序列号：[K8UY-K9IO69-O6M243-OL889-F88688] 常规检验标准要求硬件常规测试充电时间测试数据线可靠性试验要求与方法?1.本规范参考标准GB/T2423.1-1989电工电子产品基本环境实验规程实验A：低温试验方法GB/T2423.2-1989电工电子产品基本环境实验规程实验B：高温试验方法GB/T2423.3-1989电工电子产品基本环境实验规程实验Ca:恒定湿热实试验方法GB/T2423.8-1995电工电子产品环境实验第二部分：实验Ed:自由跌落GB/T2423.17-1993电工电子产品基本环境实验规程实验Ka:盐雾试验方法GB/T2423.29-1999电工电子产品环境实验第二部分：实验U:引出端及整体安装件强度2.概要：2.1测试条件标准：温度:+15～+35℃相对湿度:45%～75%(RH)气压:86～106kPa2.2试验前，应对样品外观和功能进行检验，发现不合格品时，应在同一批产品中随机抽取合格品替换。

同时对不合格品进行分析，找出原因，列入周期试验报告中，但不作为周期检验合格与否的依据2.3试验中发现不良时，应对不良品进行分析，并把不良情况列入周期检验报告中，且作为周期检合格与否的依据2.4试验后，样品不能作为正常产品入库使用4.5客户有特殊要求时，以客户要求为准。

3.环境可靠性要求及试验方法?3.1高温试验：3.1.1试验条件：在温度65±2℃的环境下保持24小时。

3.1.2试验方法：试验箱达到实验条件后，将产品裸露放入试验箱的内架上，试验完成，在常温下恢复2小时。

3.1.3试验后要求：金属部件无锈蚀、变形等可见损伤，注塑部件及线体无变形、发白、脱油，内芯线无外露和断线等情况发生；不干胶标贴不可翘起；使用线材测试仪测试电性能正常。

3.2低温测试：3.2.1试验条件：在温度－20±2℃的环境下保持24小时℃,低温点为-20℃，每个温度点保持60min，循环次数为12次。

USB 2.0测试

USB 2.0Pre-Compliance Physical Layer TestingBrief Introduction to USB 2.0fFour wire system (D+, D-, VBUS, GND)f USB2.0 provides the following speed selectionsfSelf powered and Bus powered devices VBUS supplies power to devices that driver their primary power from the host or hub. f The USB-IF has instituted a certification and marking program–Persuade developers to fully test their USB devices. –New USB trademark logo that indicates a device is certified and conforms to all applicable USB 2.0 specifications.500 ps 480 Mbps High Speed4 –20 ns 12 Mbps Full Speed75 to 300 ns 1.5 Mbps Low SpeedRise Time Data RateUSB2.0一致性测试4Three categories of Compliance testing 0Physical layer (Electrical Test)0Protocol layer0Interoperability testing0USB 2.0 legacy tests0Signal Quality Test0Droop & Drop Test0Inrush Current Test0HS Specific Tests0Chirp Test0Monotonic Test0Receiver sensitivity Test0Impedance Test (TDR)USB2.0 信号质量测试信号质量测试包括：f眼图测试(Eye-Diagram testing)f信号速率(Signal Rate)f包结尾宽度(End of Packet Width)f交叉点电压范围(Cross-over voltage range (for LS and FS)) f JK抖动(JK jitter)f KJ抖动(KJ jitter)f连续抖动(Consecutive jitter)f单调性测试(Monotonic test (for HS))f上升与下降时间(Rise and Fall times)测试环境需求f500 MHz PC with Windows 2000 (English) or XP OS f High-Speed Host Controllerf USB-IF furnished Test Mode Softwaref Good quality USB cablesf Good quality USB Hub– 1.1 –Belkin F5U100 / F5U101– 2.0 –Belkin F5u221 / IOGer GUH-204 ‘Gold’ATEN UH-204 ‘Gold’f Mouse (any listed on USB-IF mouse)当DUT为Host时所测试的信号均为Host设备发出，其信号方向为下行(Down Stream)测试项1. Signal Quality–High speed test 480Mbit/S–Full speed test 12Mbit/S–Low speed test 1.5Mbit/S2. Droop( 压落)3. Chirp (Shake Hands)Host High-Speed Signal Qualityconnector ,测Host High-Speed Signal Qualityf Win 2K (英文版) or XP PC 运行HSElecticalTestTool软件,选择HOST 然后按TEST.f进入下一个窗口在Port Control 内选择Test_packet, 在Port 内选择所要测试的Port 然后按EXECUTE.f Scope 执行TDSUSB2 软件,选择High Speed 然后将Signal quality 的六个项目全部点选.f Eye diagram, Signal rate, Rise time, Fall Time, EOP Width, Monotonic.f按下Configure 点选Configure 然后选择Tier 6, Down-stream, Near End. 点选Source 选择所要用的Input Channel.f点选RUN 的符号此时可看到TEST_PACKET 的波形f按下OK 既可完成测试Host High-Speed Signal QualityHost High-Speed Signal QualityRUNHost High-Speed Signal QualityÅWaveform Eye Diagram ÆHost High-Speed Signal Quality f Results: SummaryHost High-Speed Signal Quality f Results: DetailsReport GeneratorUtilities ÆReport GeneratorSelect 1. Tektronix Specific2. Plug-fest Specific3. CSV FormatFile nameHost Full-Speed Signal Quality1.1 HubSwitch set to INIT此connector直接,接到Hub1Host Full-Speed Signal Qualityf Win 2K ( ) or XP PC 不执行HSElecticalTestTool软f测试 , Switch 切 INITf Scope 执行TDSUSB2 软选择Full Speed 将Signal quality 项选.f Eye diagram, Signal Rate, Rise time, Fall Time, EOP Width, Paired JK Jitter, Paired KJJitter, Consecutive Jitter, Cross Overf Configure 选Configure 选择Tier 6, Down-stream, Far End. 选Source 选择Input Channel.f 选RUN 时 Full-Speedf OK 测试Host Full-Speed Signal QualityHost Full-Speed Signal QualityÅWaveform Eye DiagramÆHost Low-Speed Signal Quality此connector直接,接到待测口Host Low-Speed Signal Qualityf Win 2K (英文版) or XP PC 不可执行HSElecticalTestTool软件f执行TDSUSB2 软件,选择Low Speed 然后将Signal quality 的九个项目全部点选.f Eye diagram, Signal Rate, Rise time, Fall Time, EOP Width, Paired JK Jitter,Paired KJ Jitter, Consecutive Jitter, Cross Overf按下Configure 点选Configure 然后选择Tier 6, Down-stream, Far End。

USB 插拔力分析故障树-案例样表

水平1水平2水平3水平4管理项目基准频度工程管理标准作业标准外观毛刺，毛边外观无毛边倒刺全检尺寸偏大框口，舌片尺寸协会规格抽检尺寸偏小框口，舌片尺寸协会规格抽检不锈钢铁材不锈钢HV=310~340磷铜HV=190~210黄铜HV=170~190铁材HV=210~240凸包，加强筋尺寸0.1+/—0.03首末件倒角尺寸0.10Min首末件外观适配对插10次无高光划痕首末件插入角度145+/-2拔出角度142+/-24个主弹片高度0.64+/-0.03弹片力臂Ref 3.1Min主弹片宽度大端2.9；小端2.2弹片固定尺寸8-1.0Min 0.45+/-0.03毛刺，毛边尺寸公头尺寸不良公头外壳材质材质硬度对齐客户C硬度母头外壳材质抽检工程规格BNA.NA.工程规格B工程规格B弹片外观尺寸首末+巡检母头2个侧弹片高度0.45/0.03侧弹片力臂REF A 侧弹片宽度REF A 侧弹片固定尺寸REFA 框口尺寸12.5*5.12+/-0.04首末+巡检B尺寸Ref外形材料由0.25拍薄为0.10~0.15尺寸弹片形状高度0.82+/-0.05外形头部倒角0.15*0.3不纳入外壳与公头干涉外形母头弹片尖部不可内露工程规格预插拔标准手工预插拔3次测力速度12.5mm/分钟耐久速度200，500，1200次/小时测试行程往返插拔行程7.5mm初始力量插入力25NMax;拔出力10N Min 耐久后力量插入力25NMax;拔出力8N Min 耐久次数寿命1500，3000，5000次抽检人员专业程度人员专业专人测试机台选用机台带万向转头测试仪装夹手法操作手法NA.是否焊板测试耐久后是否更换公头测试过程是否吹粉屑公头选用标准依客户匹配公头对齐客户备注:A——作业指导书；B——检验标准；C——原材料及外购件清单B端子与胶芯干涉简支首末件参数设置工程规格不纳入依客户标准NA.AB对齐客户首末件对齐客户A实验室标准测试规范插拔力量不合规外壳与护套干涉表示需重点进行控制的管理项目。

USB2.0简介与测试

通信基礎
➢ USB數據傳輸
1.客户软体把要传输的资料放入资料缓冲区，并向usb驱动程式发出 IRP（I/O请求包），请求资料传输。
b驱动程式相应客户软体发出的请求，并将资料转化为具有usb格式的资料交易，然后向下传送。usb主控制器驱动负责为这些交易建立以框架为单位的资料交易列表。
b主控制器负责读取资料列表，并将资料以资讯包为单位以一定速率发送到总线上。
日常應用
日常應用
➢ 數據傳輸的媒介 ➢ 人性化設備的功能舞臺 ➢ Charge ➢ 數據交換的通道
Next
• USB基礎知識 • USB日常應用 • USB發展歷程 • USB接口類型 • USB信號介紹 • USB基本特性 • USB測試介紹 • USB前景展望
發展歷程
發佈時間 USB版本速率稱號
頻寬
速度
1996.1
USB1.0
低速 Low Speed
1.5Mbps
192KB/s
1998.9
USB1.1
全速 Full Speed
12Mbps
1.5MB/s
2000.4
USB2.0
高速
High Speed
480Mbps
60MB/s
2008.11
USB3.0
超高速
5Gbps
640MB/s
Super Speed
就可以使用。非0號端點：设备可以有除0以外的其它端點，这取决于这些设备的实现。除
缺省控制通道的缺省端點外，其它端點只有在设备被设置后才可使用。
通信基礎
➢ 管道
usb系統中，資料是在主機軟體與設備的各個端點之間直接進行的，他們之間建立的逻辑連接稱為管道；管道在配置過程中建立，是對主機和設備間通信流的抽象。表示主機的資料緩沖區和usb設備的端點存在邏輯資料傳輸。對於USB的通訊，我們可以將其視為一種虛擬管線的概念，如圖所示：

USB2.0测试标准1

在经过一个小时的蒸气老化后焊接端的覆盖率大于95%。
Humidity
抗潮性
168 hours minimum.The USB connectors under test must be tested in accordance with EIA 364-31.
大于168个小时。如EIA364-31测试
0.256 0.11
0.512 0.13
0.772 0.15
10.2
40.39
80.54
120.67
240.95
481.ห้องสมุดไป่ตู้5
961.9
2003.2
4005.8
Test Descriptio
Propagation Delay
传输延迟
See Section 7.1.1.1,Section 7.1.4,Section 7.1.16, and Table 7-9
Flammability
The manufacturer will require its thermoplastic resin vendor to supply a detailed C of C with each resin shipment.The C of C shal clearly show the resin’s Ul listing number,lot number,date code,etc.
在速度不超过每小时200个循环下经受1，500次插入与拨出。
Cable Pull-Out
电缆拉出
After the application of a steady state axial load of 40 N for one minute
固定后施加40N的轴向力,一分钟。

插拔力测试

插拔力测试1. 引言插拔力测试是一种用于评估插头、插座、连接器等插拔装置性能的测试方法。

在现代电子设备和通信系统中，插拔装置起到连接电源、传输信号或数据的重要作用。

因此，插拔力测试对于确保连接器的稳定性和可靠性至关重要。

插拔力测试通过测量插座或连接器在插入和拔出过程中所需的力量，以确定其与插头或插头之间的连接质量。

该测试可以帮助制造商评估产品的耐用性和可维护性，并确保其在日常使用中不会出现性能下降或断开连接等问题。

本文将介绍插拔力测试的基本原理、常用测试方法以及测试结果的分析和评估。

2. 插拔力测试原理插拔力测试的主要原理是通过测量插入或拔出插头所需的力量来评估插座或连接器的质量。

该测试使用力传感器或测力仪器测量力的大小，并将其与预设的标准或规范进行比较。

插入力是指在插头插入过程中所需的力量。

通常情况下，插入力不应过大，以确保用户可以轻松插入插头，并确保连接的牢固性。

插入力过大可能会导致用户操作困难或损坏插头或插座。

拔出力是指在拔出插头过程中所需的力量。

拔出力过大可能会导致插头损坏或连接器松动。

因此，拔出力应适中，既能保证插头不会意外脱落，又能让用户轻松拔出。

3. 常用的插拔力测试方法3.1 插入力测试插入力测试通常使用力传感器或测力仪器来测量插头插入插座所需的力量。

测试时，需要按照预设的速度和力度将插头插入插座，记录下所需的力量。

然后，将测量结果与标准或规范进行比较，以确定插入力是否符合要求。

3.2 拔出力测试拔出力测试也使用力传感器或测力仪器来测量从插座中拔出插头所需的力量。

测试时，需要按照预设的速度和力度将插头从插座中拔出，并记录下所需的力量。

然后，将测量结果与标准或规范进行比较，以确定拔出力是否符合要求。

3.3 循环插拔测试循环插拔测试是对连接器插拔性能的全面评估。

该测试通过反复插拔插头和插座，模拟真实使用情况下的插拔操作。

循环插拔测试可以帮助制造商评估连接器的耐久性和可靠性，并确定其在重复使用时是否会出现性能下降或连接松动的问题。

USB接口指标测试指导书的参考学习分享

USB接口指标测试指导书1、USB接口指标描述为了顺应市场的要求，目前的产品大部分都出的是USB2.0的接口，而且我们产品都是作为HOST端，USB2.0一共提供3种速率，如下表。

当我们的设备是作为HOST端是，数据方向是Down Stream，其关注的指标有：1、信号质量1) 眼图测试(Eye-Diagram testing)2)信号速率(Signal Rate)3)包结尾宽度(End of Packet Width)4)JK抖动(JK jitter)5)KJ 抖动(KJ jitter)6)连续抖动(Consecutive jitter)7)单调性测试(Monotonic test (for HS))8)上升与下降时间(Rise and Fall times)2、Droop(电压跌)3、Chirp (Shake Hands)2、USB接口指标测试方法(1) 信号质量测试由于我们的设备都是作为HOST端，在这里只介绍HOST端的接口指标测试方法。

1) USB High Speed信号质量测试方法a)连接好被测设备(DUT)、测试夹具和示波器，具体的连接示意图如图1所示。

Tektronix Oscilloscope with Application runningOOQOUJidertedHOST SQ Differential ProbeTest Fixture图1 High Speed信号质量测试连接示意图b) DUT上电，启动USB测试包，发送测试命令，使USB端口能够发送出测试码流，具体的码流波形如图2所示。

图2 High Speed信号质量测试波形ULTD5U写R工c)运行示波器上的USB测试软件，在Analyze菜单中选择USB2.0 Test启动后的界面如图3所示。

在软件的Measurements菜单中选择Select，然后选择High Speed，选择测试项，在这里可以点击Select All，将信号质量的测试项全部选上。

1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。

市科技有限公司
1. Result of electrical test 电气测试结果
2.Mating&Unmating Force 插入拔出力(N)
3.Visual Inspection 外观检验
23.424.623.324.223.519.318.920.419.718.916.117.516.317.615.913.714.913.312.213.3
Approval 核准：翟刚强
Checked 审核：杨继标王贻平
Producer 制作：刘伟
■ PASS 合格 □ NG 不合格
Initial （始）2. No appearance defects
OK
Finial （终）Note 备注
Insertion Force Withdrawal Force Judgement
OK
Result
Judgement 1. Dimension: OK
Judgement 综合判定
Test Requirement 测试要求
1. Insertion and withdrawal speed : 500cycles/hour. 插拔速度200次/小时；
2. Automatic cycling : 8000 cycles at 500 ±50 cycles per hour, Insertion force:35N {
3.5kgf} maximum Withdrawal force:10N {1.0kgf} minimum ,
自动插拔次数8000次，插入力35N {3.5kgf}最大，拔出力10N {1.0kgf} 最小
3. After test 8000 cycles ,DC 300V/10ms, conduction risistance: 3Ω max. insulation risistance: 10M Ω min. 测试8000次后，DC 电压300V/10ms, 导通阻抗≦3Ω，绝缘阻抗≧10M Ω;
OK 4#OK Initial （始）
Final （终）
Durability Insertion and Withdrawal Test
耐久性插拔力测试报告
Sample name 样品名称Supplier 供应商名称
/
Test date 测试日期Sample Q'ty 样品数量Part/No.产品料号
Test machine 测试设备温度：28℃/湿度：75%
Sample No.样品编号
Test result description 结果描述
Test Item 测试项目
Durability Insertion / Withdrawal Force Test 耐久性插拔力測試
Result of measurement 测试结果
5PCS /
2015-1-15
Full-automatic Insertion and Withdrawal test machine
插拔力全自动试验机 DJS-GU-358
Full-automatic integrative conduction test machine LX-750
全自动导通综合测试机LX-750Test environment
测试环境
Drawing NO.工程图号
USB2.0 BF CONN.
1#OK 2#OK 5#
OK
DC 300V/0.01s CR ≦3Ω IR ≧10M Ω Swing 30°
Match condition 符合条件Match condition 符合条件Match condition 符合条件Match condition 符合条件Match condition 符合条件
Judgement 判定
3# NO.报告编号：DJS-LQC-20150115A016
表单编号：DJS-QR-045。