电路板术语
pcb常用的专业术语
pcb常用的专业术语PCB常用的专业术语PCB，即印刷电路板，是电子产品中不可或缺的一部分。
在PCB制造过程中，有许多专业术语需要了解。
本文将从材料、工艺、设计等方面介绍PCB常用的专业术语。
一、材料1.基板（Substrate）基板是指印刷电路板上的主体部分，通常由玻璃纤维和树脂复合材料构成。
基板的质量直接影响着整个PCB的性能。
2.铜箔（Copper Foil）铜箔是印刷电路板上最重要的导电层材料，其厚度通常为18um至105um之间。
铜箔的质量和厚度对于PCB的导电性能和可靠性有着重要影响。
3.覆铜板（Copper Clad Board）覆铜板是指在基板表面涂覆一层铜箔而成，通常有单面、双面和多层三种形式。
不同类型的覆铜板适用于不同种类的电路设计需求。
4.阻焊（Solder Mask）阻焊是一种涂在印刷电路板上以保护未焊接区域免受污染和短路的材料。
阻焊通常为绿色、红色或蓝色，具有良好的耐高温性和化学稳定性。
5.沉金（ENIG）沉金是一种表面处理技术，可以在印刷电路板上形成一层金属保护层，提高PCB的可靠性和耐腐蚀性。
沉金通常用于高端PCB产品中。
二、工艺1.蚀刻（Etching）蚀刻是印刷电路板制造中最重要的工艺之一，其目的是去除不需要的铜箔以形成电路图案。
蚀刻过程需要使用化学溶液和光敏树脂等材料。
2.钻孔（Drilling）钻孔是指在印刷电路板上钻洞以安装元器件或连接不同层之间的导线。
钻孔需要使用高速钻头和自动化设备完成。
3.压合（Lamination）压合是指将多个覆铜板通过热压技术粘合在一起形成多层PCB结构。
压合过程需要控制温度、压力和时间等参数，确保PCB质量符合要求。
4.喷锡（Soldering）喷锡是一种表面处理技术，可以在印刷电路板上形成一层锡保护层，提高PCB的可靠性和耐腐蚀性。
喷锡通常用于中端PCB产品中。
5.贴片（SMT）贴片是指将元器件直接安装在印刷电路板上的一种技术。
电路板设术语
电路板设术语1.信号完整性（Signal Integrity）：就是指电路系统中信号的质量,如果在要求的时间内,信号能不失真地从源端传送到接收端,我们就称该信号是完整的。
传输线（Transmission Line）：由两个具有一定长度的导体组成回路的连接线,我们称之为传输线,有时也被称为延迟线。
集总电路（Lumped circuit）：在一般的电路分析中,电路的所有参数,如阻抗、容抗、感抗都集中于空间的各个点上,各个元件上,各点之间的信号是瞬间传递的,这种理想化的电路模型称为集总电路。
分布式系统(Distributed System)：实际的电路情况是各种参数分布于电路所在空间的各处,当这种分散性造成的信号延迟时间与信号本身的变化时间相比已不能忽略的时侯,整个信号通道是带有电阻、电容、电感的复杂网络,这就是一个典型的分布参数系统。
上升/下降时间（Rise/Fall Time）：信号从低电平跳变为高电平所需要的时间,通常是量度上升/下降沿在10%-90%电压幅值之间的持续时间,记为Tr。
截止频率（Knee Frequency）：这是表征数字电路中集中了大部分能量的频率范围（0.5/Tr）,记为Fknee,一般认为超过这个频率的能量对数字信号的传输没有任何影响。
特征阻抗（Characteristic Impedance）：交流信号在传输线上传播中的每一步遇到不变的瞬间阻抗就被称为特征阻抗,也称为浪涌阻抗,记为Z0。
可以通过传输线上输入电压对输入电流的比率值(V/I)来表示。
传输延迟（Propagation delay）：指信号在传输线上的传播延时,与线长和信号传播速度有关,记为tPD。
微带线（Micro-Strip）：指只有一边存在参考平面的传输线。
带状线（Strip-Line）：指两边都有参考平面的传输线。
趋肤效应（Skin effect）：指当信号频率提高时,流动电荷会渐渐向传输线的边缘靠近,甚至中间将没有电流通过。
PCB专业术语大汇集
PCB专业术语大汇集PCB专业术语大汇集PCB是Printed Circuit Board的缩写，即印制电路板。
作为现代电子制造中不可或缺的一个组成部分，PCB技术已经成为电子制造的核心技术之一。
如果你在PCB制造领域工作或学习，那么理解并熟练掌握一些常见的PCB专业术语是非常重要的。
在这篇文章中，我们将罗列一些重要的PCB专业术语和技术名词，以帮助大家更好地理解PCB的制造和设计。
一、PCB制造基础1. PAD:焊盘，指印制电路板上用于焊接元器件的金属区域。
2. VIA:通孔，指在印制电路板上打开的金属通孔，连接不同层之间的电路。
3. Solder mask:焊膜，是一种覆盖在PCB表面的保护层，用于防止无意中的短路和腐蚀。
4. Silk screen:丝印，是印刷在印制电路板上的文字和图像，用于标记焊点、元器件和引脚等信息。
5. Cooper:铜箔，是一种用于制造PCB的材料。
6. Substrate:衬底，指PCB中负责固定和支撑电路的材料。
7. Copper weight:铜厚度，指PCB上铜箔的厚度，单位是oz。
8. Panel:板子，指PCB制造中一组连续的PCB，通常需要在单个板子上打印多个电路。
9. Plating:镀，指将金属材料沉积在印制电路板表面或内部的过程。
10. Tolerance:公差，指PCB制造和设计中可以接受的误差范围。
二、PCB设计技术1. Trace:走线，指印制电路板上的导线，用于连接不同的元器件和电路板上的不同部分。
2. Clearance:间隙，指PCB上不同元器件或电路之间的距离。
3. Net:网络，指一个电路的连接点集合，通常用来描述PCB上的一组连通电路。
4. Gerber:杰伯，是一种文件格式，通常用于将PCB设计转化为PCB生产所需的制造文件。
5. Footprint:插件，指印制电路板上元器件焊盘的设计，用于确保元器件和焊盘正确对齐和正确连接。
线路板常用术语
一、线路板常用术语1． Warp与Fill：经向(Warp),指大料(或Prepreg)的短方向，纬向(Fill)指大料(或Prepreg)的长方向。
2．横料与直料：多层板开料时将Panel长方向与大料长方向一致的称为直料；将Panel长方向与大料短方向一致的称为横料；3． Material Thickness(Board Thickness)：客户图纸或Spec无特别说明的均指成品厚度(Finished Thickness)，Material Thickn ess无Tolerance要求时, 选用厚度最接近的板料；4． Copper Thickness：客户图纸或Spec无特别说明情况下，均指成品线路铜厚度；5． Pitch：节距，相邻导体中心之间的距离；6． Solder Mask Clearance：绿油开窗的直径；7．LPI 阻焊油： Liquid Photo-Imaging 液态感光成像阻焊油,俗称湿绿油；8．SMOBC： Solder Mask On Bare Copper绿油丝印在光铜面上，一般有 SMOBC+HAL/Entek/ENIG等工艺；9．BGA： Ball Grid Array (BGA球栅列阵)：集成电路的封装形式，其输入输出点是在元件底面上按栅格样式排列的锡球；10． Blind via(盲孔)：PCB的外层与内层之间的导电连接，不继续通到板的另一面；Buried via(埋孔)：PCB的两个或多个内层之间的导电连接(即从外层看不见的)；11． Positive Pattern：正像图形、正片、照相原版、生产底版上的导电图形为不透明时的图形；12． Negative Pattern：负像图形，负片，照相原版、生产底版上的导电图形是透明时的图形。
我们一般称直蚀线路菲林、绿油挡墨菲林、干/UV绿油菲林为负片菲林；需要电镀线路菲林、湿绿油菲林、字符菲林、碳油菲林、兰胶菲林称为正片菲林；13． FPT： Fine-Pitch Technology 精细节距技术, 表面贴片元件包装的引角中心间隔距离为0.025”(0.0635mm)或更少；14． Lead Free：无铅；15． Halogen Free：无卤素，指环保型材料；16． RoHS：Restriction of Use of Hazardous Substances 危险物质的限制使用，禁铅、禁汞、禁镉（Cadmium）、禁六价铬（Hexava lent Chromium）与禁溴耐燃剂（Flame Retardents）；17． OSP： Organic Solderability Protector 防氧化；18． CTI： Comparative Tracking Index 相对漏电起痕指数，即材料表面能经受住50滴电解液而没有形成漏电痕迹的最高电压值；19． PTI： Proof Tracking Index 耐漏电起痕指数，即材料表面能经受住50滴电解液而没有形成漏电痕迹的耐电压值用V表示；20． Tg： Glass Transition temperature 玻璃态转化温度; 21．试孔纸：将各测试点、管位、以1：1打印出来的图纸; 22．测试点：一般指独立的PTH孔、SMT PAD、金手指、Bonding手指、IC手指、BGA焊接点、以及客户于插件后测试的测试点; 23．测试端点：线路网络中不能再向前延伸的测试点。
电路板术语总整理。
電路板術語總整理----A----A-Stage A 階段Abietic Acid 松脂酸Abrasion Resistance 耐磨性ABS 樹脂Absorption 吸收，吸入Accelerated Test (Aging) 加速老化Acceleration 速化反應Accelerator 加速劑，速化劑Acceptability，Acceptance 允收性，允收Access Hole 露出孔(穿露孔, 露底孔) Accuracy 準確度Acid Number(Acid Value) 酸值Acrylic 壓克力Actinic Light(or Intensity, or Radiation) 有效光Activation 活化Activator 活化劑Active parts(Devices) 主動零件Acutance 解像稅利度Addition Agent 添加劑Additive Process 加成法Adhesion 附著力Adhesion Promotor 附著力促進劑Adhesive 膠類或接著劑Admittavce 導納Aging 老化Air Inclusion 氣泡夾雜Air Knife 風刀Algorithm 演算法Aliphatic Solvevt 脂肪族溶劑Ambient Tamp. 環境溫度Amp-Hour 安培小時Amchoring Spurs 著力爪Ａngle of Attack 攻角Angle of Contact 接觸角Anion 陽向游子（陰離子）Anneal 韌化Annular Ring 孔環Anode 陽极Anode Sludge 陽极泥Anodizing 陽极化ANSI美國標準協會Anti-Pit Agent 抗凹劑AOI 自動光學檢驗AQL品質允收水準Arc Resistance 耐電弧性Array 排列，陣列Artwork底片ASIC 特定用途的積體電路器Aspect Ratio 縱橫比Assembly裝配、組裝、構裝A TE自動電測設備Autoclave 壓力鍋Axial-lead軸心引腳Azetrope 共沸混合液BB-Stage B階段Back Light(Back Lighting ) 背光法Back Taper 反錐斜角Back-up 墊板Backpanels, Backplanes支持板Bandability彎曲性，彎曲能力Banking Agent護岸劑Bare Chip Assembly 裸體晶片組裝Barrel 孔壁，滾鍍Base Material 基材Basic Grid基本方格Batch 批Baume波美度Beam Lead 光芒式的平行密集引腳Bed-of-Nail Testing 針訂測試Bellows Contact彈片式接觸Beta Ray Backscatter 貝他射線反彈散射Bevelling 切斜邊Bias斜張綱布,斜織法Binder 粘結劑Bits頭Black Oxide 黑氧化層Blanking 衝空斷開Bleach漂洗Bleeding溢流Blind Via Hole盲導孔Blister局部性分層或起泡Block Diagram電路系統塊圖Blockout封網Blotting 乾印Blotting Paper 吸水紙Blue Plaque 藍紋Blow Hole吹孔Bomb Sight彈標Bond Strength結合強度Bondability結合性Bonding Layer 結合層, 接著層Bonding Sheet(layer)結合線Bonding Wire結合線Bow, Bowing板彎Braid 編線Brazing硬焊Break-away panel可斷開板Break Point出像點,顯像點Breakdown V oltage崩潰電壓Break-Out破出Bridging搭橋、橋接Bright-Dip光澤浸漬處理Brightener光澤劑Brush Plating刷鍍Build-up 增厚,堆積Bulge 鼓起, 凸出Bump 突塊Buoyancy浮力Buried Via Hole埋導孔Burn-in 高溫加速老化試驗Burning 燒焦Burr毛頭Bus Bar匯電桿Butter Coat 外表樹脂層CCable 電纜CAD 電腦輔助設計Calendered Fabric軋平式網布Cap Lamination 帽式壓合法Capacitance 電容Capacitive Coupling電容耦合Capillary Action毛細作用Carbide 碳化物Carbon Arc Lamp 碳弧燈Carbon Treatment, Active 活性碳處理Card卡板Card Cages/Card Racks電路板構裝箱Carlson Pin卡氏定位梢Carrier 載體Cartridge濾芯Castallation堡型積體電路器Catalyzed Board, Catalyzed Substrate(or Material) 催化板材Catalyzing 催化Cathode 陰极Caul Plate 隔板Cavitation空泡化, 半真空Center-to-Center Spacing 中心間距Ceramics 陶瓷Cermet 陶金粉Certificate證明書CFC 氟氯碳化物Chamfer 倒角Characteristic Impedance特性阻抗Chase綱框Check List檢查清單Chelate螯合Chemical Milling化學研磨Chemical Resistance 抗化性Chemisorption化學吸附Chip晶粒、晶片、片狀Chip on Board 晶片粘著板Circumferential Separation環狀斷孔Clad/Cladding披覆Clean Room 無塵室、潔凈室Clinched Lead Terminal緊箱式引腳Clinched-wire Through Connection 通孔彎線連接法Clip Terminal繞線端接Co-Firing共燒Coat, Coating皮膜,表層Coaxial Cable同軸纜線Coefficient of Thermal Expansion 熱膨脹係數Cold Flow冷流Cold Solder Joint冷焊點Collimated Light平行光Colloid膠體Columnar Structure 柱狀組織Comb Pattern梳型電路Complex ion 錯離子Component Hole零件孔Component Orientation 零件方向Component Side組件面Composite, (CEM-1, CEM-3)復合板材Conditioning整孔Conductance 導電Conductive Salt導電鹽Conductivity導電度Conductor Spacing 導體間距Conformal Coating貼護層、護形Conformity吻合性，服貼性Connector 連接器Contact Angle接觸角Contact Area接觸區Contact Resistance 接觸電阻Continuity連通性Contract Service協力廠，分包商Conversion Coating轉化皮膜Coplanarity共面性Copolymer共聚物Copper Foil銅箔、銅皮Copper Mirror Test 銅鏡試驗Copper Paste 銅膏Corner Crack通孔斷角Corner Mark板角標記Counterboring 方型擴孔,埋頭孔Countersinking 錐型擴孔,喇叭孔Coupling Agent偶合劑Coupon, Test Coupon板邊試樣Coverlay / Covercoat表護層、保護層Crack 裂痕Crazing白斑Crease皺褶Creep潛變Crossection Area截面積Crosshatching十字交叉區Crosslinking ,Crosslinkage交聯，架橋Crosstalk雜訊、熟化Cure硬化、熱化Current Density電流密度Curtain Coating濂塗法Current-Carrying Capability載流能力DD-glass D玻璃Datum Reference基準參考Daughter Board子板Deburring去毛頭Declination Angle斜射角Definition邊緣逼真度Degradation劣化Degrasing 脫脂Deionized Water去離子水Delamination分層Dendritic Growth枝狀生長Denier丹尼爾Densitomer透光度計Dent凹陷Deposition皮膜處理Desiccator 乾燥器Desmearing除膠渣Desoldering解焊Developer顯像液，顯像機Developing顯像Deviation偏差Device電子元件Device縮錫Diazo Film偶氮棕片Dichromate重鉻酸鹽Dicyandiamide(Dicy)雙氰胺Die沖模,鑄模Die Bonding晶粒接著Die Stamping 沖壓Dielectric介質Dielectric Breakdown V oltage介質崩潰電壓Dielectric Constant,ε介質常數Dielectric Strength 介質強度Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法Diffusion Layer擴散層Digitizing數位化Dihedral Angle變反斜角Dimensional Stability呎度安定性Diode二极體DIP(Dual Inline Package)雙排腳封裝體Dip Coating 浸塗法Dip Soldering浸焊法Dipole偶极，雙极Direct Emulsion直接乳膠Direct/Indirect Stencil直間版膜Direct Plating直接電鍍，直接鍍板Discrete Compenent散裝零件Dish Down碟型下陷Dispersant分散劑Disspation Factor散逸因子Dog Ear狗耳Doping摻雜Double Layer電變層Double Treated Foil雙面處理銅箔Drag in /Drag out帶進／帶出Drag Soldering拖焊Drawbridging吊橋效應Drilled Blank已鑽孔的裸板Drill Facet鑽尖切削面Drill Pointer鑽針重磨機Dross 浮渣Drum Side銅箔光面Dry Film乾膜Dual Wave Soldering雙波焊接Ductillty展性Dummy ,Dummying假鍍片，假鍍Dummy Land假焊墊Durometer 橡膠硬度計EE-glass 電子級玻璃Eddy Current過電流Edge-Board Connector板邊（金手指）承接器Edge-Board Contact板邊金手指Edge-Dip Solderability Test板邊焊錫性測試Edge Spacing 板邊空地EDTA乙二胺四乙酸Effluent排放物Elastomer彈性體Electric Strength (耐)電性強度Electro-deposition電鍍Electro-Deposited Photo-resist電著光阻,電泳光阻Electro-migration電遷移Electro-phoresis電泳動，電滲Electro-tinning鍍錫Electro-winning電解冶煉Electroless-deposition無電鍍Electrolytic Cleaning電解清洗Electrolytic Tough Pitch電解銅Elongation延伸性，延伸率Embossing凸出性壓花EMF電動勢EMI電磁幹擾Emulsion乳化Encapsulating囊封、膠囊End Cap封頭Entrapment夾雜物Entry Material蓋板Epoxy Resin環氧樹脂Etchant蝕刻劑，蝕刻液Etchback回蝕Etch Factor蝕刻因子、蝕刻函數Etching Indicator蝕刻指標Etching Resist抗蝕阻劑Eutetic Composition共融組成Exposure曝光Eyelet鉚眼FFabric網布Face Bonding 反面朝下之結合Failure故障，損壞Farad法拉Farady 法拉第Fatigue Strength抗疲勞強度Fault缺陷，瑕疵Fault Plane斷層面Feed Through Hole導通孔Feeder進料器、送料器Fiber Exposure玻纖顯露Fiducial Mark基準記號Filament纖絲Filament緯向Filler填充料Fillet內圓填角Film底片Filter過濾器Fine Line細線Fineness純度、成色、粒度Finger 手指(板邊連續排列接點) Finishing終飾、終修First Article首產品First Pass-Yield初檢良品率Fixture夾具Flair第一面外緣變形，刃角變形Flame Resistant耐燃性Flammability Rate燃性等級Flare扇形崩口Flash Plating閃鍍Flashover閃絡Flat Cable扁平排線Flat Pack扁平封裝（之零件）Flexible Printed Circuit, FPC軟板Flexural Failure撓曲損壞Flexural Strength抗撓強度Flocculation絮凝，凝聚Flood Stroke Print覆墨衝程印刷Flow Soldering流焊Fluorescence螢光Flurocarbon Resin 碳氟樹脂Flush Conductor嵌入式線路，貼平式導體Flute退屑槽Flux助焊劑Foil Burr銅箔毛邊Foil Lamination銅箔壓板法Foot殘足Foot Print(Land Pattern)腳墊Foreign Material外來物，異物Form-to-List布線說明清單Free Radical自由基Frequency頻率Fully-Additive Process全加成法Fungus Resistance抗霉性Fused Coating熔錫層Fusing熔合GG-10Gage, Gauge量規Galvanic Series賈凡尼次序Galvanizing鍍鋅GAP第一面分離，是刃斷開Gel Time膠化時間Gelation Particle（膠凝點）Gerber Date，Gerber File格博檔案Ghost Image陰影Gilding鍍金Glass Fiber玻纖Glass Fiber Protrusion/Gouging ,Groove玻纖突出／挖破Glass Transition Temperature, Tg玻璃態轉化溫度Glouble Test球狀測試法Golden Board測試用標準板Grain Size結晶粒度Grid標準格Ground Plane(or Earth Plane)接地層Ground Plane Clearance接地空環Gull Wing Lead鷗翼引腳Grass Leak大漏Guide Pin導針HHalf Angle半角Halide鹵化物Haloing白圈、白邊Halon海龍Hard Anodizing硬陽极化Hard Chrome Plating鍍硬鉻Hard Soldering硬焊Hardener硬化劑（或Curing Agent）Hardness硬度Haring-Blum Cell海因槽Harness電纜組合Hay Wire跳線Heat Cleaning燒潔Heat Sink Plane散熱層Heatsink Tool散熱工具Hertz(HZ)赫Hi-Rel高可靠度Hipot Test高壓電測Holding Time停置時間Hole breakout孔位破出Hole Couter數孔機Hole Density孔數密度Hole Location孔位Hole Preparation通孔準備Hole V oid破洞Hook切削刃緣外凸Hot Air Levelling噴錫Hot Bar(Reflow)Soldering熱把焊接Hot gas Soldering熱風手焊HTE(High Temperature Elongation)高溫延伸必性Hull Cell哈氏槽Hybrid Integrated Circuit混成電路Hydraulic Bulge Test 液壓鼓起試驗Hydrogen Embrittlement氫脆Hydrogen Overvoltage氫超電壓，氫過電壓Hydrolysis水解Hydrophilic親水性Hygroscopic吸濕性Hypersorption超吸性－L－I．C．Socket積體電路器插座Icicle錫尖Illuminance照度Image Transfer影像轉移，圖像轉移Immersion Plating浸鍍Impedance阻抗，特性阻抗Impedance Match阻抗匹配In-Circuit Testing組裝板電測Inclusion異物、夾雜物Indexing Hole基準孔、參考Inductance(L)電感Infrared (IR)紅外線Input/Output輸入／輸出Insert 、Insertion插接、插裝Inspection Overlay套檢底片Insulation Resistance絕緣電阻Integrated Circuit(IC)積體電路器Interconnection互連Interface介面Intermatallic Compound(IMC)介面合金共化物Internal Stress 內應力Interstitial Via-Hole(IVH)局部層間導通孔Invar殷鋼Ion Exchange Resins 離子交換樹脂Ion Cleanliness離子清潔度Ionizable(Ionic) Contaimination離子性污染Ionization游離，電離Ionization Voltage(Corona Level)電離化電壓(電暈水準) IPC美國印刷電路板協會－J－J-LeadJ型接腳JEDEC聯合電子元件工程委員會Job Shop專業工廠，職業工廠Joule焦耳Jumper Wire跳線Just-In-Time(JIT)適時供應，及時出現－K－Kapton聚亞醯胺軟材Karat克拉，開Kerf切形，裁截Kevlar聚醯胺纖維Key鑰槽，電鍵Key Board鍵盤Kiss Pressure吻壓、低壓Knoop Hardness努普硬度Kovar科伐合金Kraft Paper牛皮紙－L－Laminar Flow 平流Laminar Structure片狀結構Laminate V oid 板材空洞Lamination V oid壓合空洞Laminate(s)基板、積層板Laminator壓膜機Land 孔環焊墊、表面(方型)焊墊Landless Hole無環通孔Laser Direct Imaging ,LDI雷射直接成像Laser Maching雷射加工法Laser Photogenerator(LPG)，Laser Photoplotter雷射曝光機Lay Back刃角磨損Lay Out佈線、佈局Lay Up疊合Layer to Layer Spacing層間距離Leaching焊散、漂出、溶出Lead Frame腳架Lead引腳，接腳Legend 文字標記、符號Leveling整平Lifted Land孔環(焊墊)浮起Ligand 錯離子附屬體Light Integrator光能累積器、光能積分器Light Emitting Diodes ,LED 發光二極體Light Intensity 光強度Limiting Current Density極限電流密度Liquid Crystal Display ,LCD 液晶顯示器Liquid Dielectrics液態介質Liquid Photoimagible Solder Mask,LPSM液態感光防焊綠漆Logic Circuit 邏輯電路Lot Size批量Luminance發光強度，耀度Lyophilic親水性膠體─M─Macro-Throwing Power巨觀分佈力Major Defect 嚴重缺點，主要缺點Margin刃帶、脈筋Marking標記Mask阻劑Mass Finishing大量整面、大量拋光Mass Lamination大型壓板(層板)Mass Transport質量輸送Master Drawing主圖Mat蓆Matte Side毛面Measling泡點Mechanical Stretcher機械式張網機Mechamical Warp機械性纏繞Mechanism機理Membrane Switch薄膜開關Meniscograph Test弧面狀沾錫試驗Meniscus彎月面，上凹面Mercury Vaper Lamp汞氯燈Mesh Count網目數Metal Halide Lamp金屬鹵素燈Metallized Fabric金屬化綱布Metallization金屬化Micro-electronics微電子Micro-etching 微蝕Microsectioning微切片法Microstrip微條Microthrowing Power 微分佈力Migration遷移Migration Rate遷移率Mil英絲Minimum Annular Ring孔環下限Minimum Electrical Spacing電性間距下限，最窄電性間距Misregistration對不準，對不準度Mixed Componmt Mounting Technology混合零件之組裝技術Mldem 調變及解調器，數據機Modification修改、改質Module模組Modulus of Elasticity 彈性係數Moisture and Insulation Resistance Test濕氣與絕緣電阻試驗Monofilament 單絲Mother Board 主機板、母板、主構板Mounting Hole安裝孔Mouse Bite鼠齧Multi-Chip-Module(MCM)多晶片(蕊片)模組Multi-wiring Board(or Discrete Wiring Board)復線板－N－Nail Head釘頭N.C.數值控制Near IR近紅外線Negative負片，鑽尖第一面外緣變窄Negative-Acting Resist負性作用之阻劑，負型阻劑Negative etch-back反回蝕Negative Stencil負性感光膜Network網狀元件Newton(N)牛頓Newton Ring牛頓環Newtonian Liquid牛頓流體Nick缺口Noble Metal Paste貴金屬印膏Node節點Nodule瘤Nomencleature 標示文字符號Nominal Cured Thickness標示厚度Non-circular Land非圓形孔環焊墊Non-flammable非燃性Non-wetting不沾錫Normal Distribution常態分配，常態分布Novolac 酯醛樹脂Nucleation，Nucleating核化Numerical Control數值控制，數控Nylon耐龍－O－O cclusion 吸藏Off-Contact架空Offset 第一面大小不均OFHC無氧高導電銅Ohm 歐姆OLB(Outer Lead Bond)外引腳結合Oligomer 寡聚物Omega Meter 離子污染檢測儀Omega Wave 振盪波Opaquer不透明劑，遮光劑Open Circuits 斷線Optical Comparater光學對比器(光學放大器) Optical Density光密度Optical Inspection光學檢驗Optical Instrument光學儀器Osmosis滲透Outgassing出氣，吹氣Outgrowth懸出，橫出，側出Output產生，輸出Overflow溢流Overhang總浮空Overlap鑽尖點分離Overlapotantial (Overvoltage)過電位，過電壓Oxidation氧化Oxygen Inhibitor氧氣抑制現象Ozone Depletion臭氣層耗損Packaging對裝，構裝Pad焊墊，圓墊Pad Master圓墊底片Palladium鈀Panel 製程板Panel plating全板鍍銅Panel Process全板電鍍法Paper Phenolic紙質酚醛樹脂（板材）Parting Agent 脫膜劑Passivation鈍化，鈍化處理Passive Device (component) 被動元素（零件）Paste膏，糊Pattern板面圖形Pattern Plating線路電鍍Pattern Process線路電鍍法Peak voltage 峰值電壓ｐeel Strength抗撕強度Periodic Reverse(PR)Current周期性反電流Peripheral過邊附屬設備Permeability透氣性，導磁率Permittivity誘電率，透電率Phenolic酚醛樹脂Photofugitive感光褪色Photographic Film感光成像之底片Photoinitiator 感光啟劑Photomask光罩Photoplotter，Plotter光學繪圖Photoresist光阻Photoresist Chemical Machinning(Milling)光阻式化學歷（銑刻）加工Phototool底片pick and place拾取與放置Piezoelectric 壓電性Pin Grid Array(PGA) 矩陣式針腳封裝Pinhole針孔Pin接腳，插梢，插針Pink Ring粉紅圈Plain Weave平織Plasma電將Plasticizers可塑劑．增塑劑Plated Through Hole ,PTH鍍通孔Platen 熱盤Plating 鍍Plotting標繪Plug插腳，塞柱Play層，股Pneumatic Stretcher氣動拉伸器Point Angle鑽尖角Point Source Light點狀光源Point鑽尖Poise泊Polar Solvent 极性溶劑Polarity電极性Polarization分极，极化Polarizing slot 偏槽Polyester Films聚酯類薄片Polyimide(PI) 聚亞醯胺Porosity Test疏孔度試驗Positive Acting Resist正性光阻劑Post Cure後續硬化，後烤Pot Life適用期，鍋中壽命Potting鑄封，模封Power Supply電源供應器Pre-tinning預先沾錫Preform預製品Preheat預熱Prepreg膠片，樹脂Press Plate鋼板Press-Fit Contact擠入式接觸Primary Image線路成像Probe探針Process Camera製程用照像機Profile輪廓、部面圖、升溫曲線圖稜線Propagation傳播Puddle Effect水坑效應Pull Away拉離Pulse Plating脈衝電鍍法Pumice powder浮石粉Punch衝切Purge ,Purging凈洗Purple Plague紫疫Post Separation後期分離．事後分離－Q －Quad Flat Pack(QFP) 方扁形封裝體Qualification Agency 資格認證機構Qualification Inspection資格檢驗Qualified Products list 合格產品嘗（供應者）名單Qualitative Analysis 定性分析Quality Conformance Test Circuitry(coupon) 品質符合之試驗線路（樣板）Quantitative Analysis 定量分析Quench 淬火，驟冷Quick Disconnect 快速接頭Quick 緯紗繞軸－R－Rack 掛架Radial lead 放射狀引腳Radiometer 輻射計，光度計Rake Angle 摳角，耙角Rated Temperature ,V oltage額定溫度，額定電壓Reactance 電抗Real Estate 底材面，基板面Reclaiming 再生，再製Reel to Reel 捲輪(盤)式操作Reference Dimension 參考呎度，參考尺寸Reference Edge 參考邊緣Reflow Soldering 重熔焊接，熔焊Refraction 折射Refractive Index 折射率Register Mark 對準用標記Registration 對準度Reinforcement 補強物Relaxation 剔退，拒收Relaxation 鬆馳，緩和Relay 繼電器Release Agent Release Sheets 脫模劑，離型膜Reliability 可靠度，信賴度Relief Angle 浮角Repair 修理Resin Content 膠含量，樹脂含量Resin Flow 膠流量，樹脂流量Resin Recession 樹脂下陷Resin Rich Area 樹脂豐富區，多膠區Resin Smear 膠糊渣，膠渣Resin Starved Area 樹脂缺乏區，缺膠區Resist 阻劑，阻膜Resistivity 電阻系數，電阻率Resistor電阻器，電阻Resistor Drift 電阻漂移Resolution 解像,解像度,解析度Resolving Power 解析力,解像力(分辯力)Reverse Current Cleaning 反電流(電解)精洗Reverse Etchback 反回蝕Reverse Image 負片影像(阻劑) Reversion 反轉、還原Revision 修正版,改訂版Rework(ing) 重工,再加工Rhology 流變學,流變性質Ribbon Cable 圓線纜帶Rigid-Flex Printed Board 硬軟合板Rinsing 水洗,沖洗Ripple 紋波Roadmap 線路與零件之佈局圖Robber 輔助陰极Roller Coating 輥輪塗佈Roller Cutter 輥切機(業界俗稱鋸板機) Roller Tinning 輥錫法,滾錫法Rosin 鬆香Rotary Dip Test 擺動沾錫試驗Routing 切外型Runout 偏轉,累積距差Rupture 迸裂Sacrificial Protection 犧牲性保護層Salt Spray 監霧試驗Sand Blast 噴砂Saponification 皂化作用Satin Finish緞面處理Scaled Flow Test比例流量試驗Schemetic Diagram電路概略圖Scratch 刮痕Screen Printing網版印刷Screenability 網印能力Scrubber磨刷機、磨刷器Scum透明殘膜Sealing封孔Secondary Side第二面Seeding下种Selective Plating選擇性電鍍Self-Extinguishing 自熄性Selvage布邊Semi-Additive Process半加成制程Semi-Conductor半導體Sensitizing敏化Separable Component Part可分離式零件Sequestering Lamination 接續性壓合法Sequestering Agent螯合劑Shadowing陰影，回蝕死角Shank鑽針柄部Shear Strength抗剪（力）強度Shelf Life 儲齡Shield 遮蔽，屏遮Shore Hardness蕭氏硬度Short短路Shoulder Angle肩斜角Shunt分路Side Wall側壁Siemens電阻值Sigma(Standard Deviation) 標準差Signal訊號Silane矽烷Silicon矽Silicone 矽酮Silk Screen 綱版，絲綱印刷Single-In-line Package(SIP) 單邊插腳封裝體Sizing 上膠，上Skin Effect 集膚效應Skip Printing ,Skip Plating 漏印，漏鍍Slashing 漿經Sleeve Jint 套接Sliver 邊絲,邊條Slot Slotting 槽口,開槽Sludge 沉澱物,淤泥Slump 塌散Slurry 稠漿,懸浮狀漿Small Hole 小孔Smear 膠糊渣,膠渣Snap-off 彈回高度Socket 插座Soler 銲錫Solderability 焊錫性,可焊性Solder Ball銲錫球，錫球Solder Bridging錫橋Solder Bump銲錫凸塊Solder Connection 焊接Solder Cost銲錫著層Solder Dam錫堤Solder Fillet填錫Solder Levelling噴錫、熱風整平Solder Mask(S/M)綠漆，防焊膜Solder Paste錫膏Solder Plug錫塞，錫柱Solder Preforms預銲料Solder Projection銲錫突點Solder Sag銲錫垂流物Solder Side 焊錫面Solder Spatter 濺錫Solder Spread Test 散錫試驗Solder Webbing錫網Solder Wicking銲錫之燈芯效應，滲錫Soldering軟焊，焊接Solder Fluid, Soldering Oil 助焊液，護焊油Solid Content 固體含量，固形份，固形物Solidus Line固相線Spacing間距Span 跨距Spark Over閃絡Specification (Spec.) 規範、規格Specimen樣品，試樣Spectrophotometry分光光度計檢測法Spindle 鑽軸，主軸Splay 斜鑽孔Spray Coating濆著涂裝，噴射涂裝Spur底片圖形邊緣突出Sputtering濺射Squeege刮刀Stalagometer滴管式表面張力計Stand-Off Terminals直立型端子Starvation缺膠Static Eliminator靜電消除器Steel Rule Die（鋼）刀模Stencil版膜Step and Repeat逐次重覆曝光Step Plating 梯階式鍍層Step Tablet 階段式(光密度)曝光表Stiffener 補強條，補強板Stop off 阻劑，防鍍膜Strain 變形，應變Strand 絞Stray Current 迷走電流，散雜電流Stress Corrosion 應力腐蝕Stress Relief 消除應力Strike 預鍍；打底Stringing 拖尾；牽絲Stripline 條線Stripper 剝除液，剝除器Substractive Process 減成法Substrate 底材Supported Hole （金屬）支助通孔Surface Energy 表面能Surface Insulation Resistance(SIR) 表面絕緣電阻Surface Mounting Technology 表面粘裝技術Surface Tension 表面張力Surface-Mount Device 表面粘裝零件Surfactant 表面潤濕劑Surge 突流；突壓Swaged Lead 壓扁式引腳Swelling Agents；Sweller 膨鬆劑Swimming 線路滑離Synthetic Resin 合成樹脂TTab接點；金手指Taber Abraser泰伯磨試器Tape Automatic Bonding(TAB) 捲帶自動結合Tape Test 撕膠帶試驗Tape Up Master 原始手貼片Tape Components 捲帶式連載零件Taper Pin Gauge 錐狀孔規Tarnish 污化Teflon 鐵氟龍Telegraphing 浮印，隱印Temperature Profile 溫度曲線Template 模板Tensile Strength 抗拉強度Tensiomenter 張力計Tenting 蓋孔法Terminal 端子Terminal Clearance 端子空環，端子讓環Tetrafunctional Resin 四功能樹脂Thermal Coefficient of Expansion(TCE) 熱膨脹系數Thermal Conductivity 導熱率Thermal Cycling 熱循環，熱震盪Thermal Mismstch 感熱失諧Thermal Relief 散熱式鏤空Thermal Zone 感熱區Thermocompression Bonding 熱壓結合Thermocouple熱電偶Thermode 發熱體Thermoplastic 熱塑性Thermosetting 熱固性Thermosonic Bonding 熱超音波結合Thermo-Via 導熱孔Thick Film Circuit 厚膜電路Thief 輔助陰极，藕流陰极Thin Copper Foil 薄銅箔Thin Core 薄基板Thin Film Technology 薄膜技術Thinner 調薄劑Thixotropy 抗垂流性，搖變性，搖溶性，靜凝性Three-Layer Carrier三層式載體Threshold Limit Value(TLV) 極限值Through Hole Mounting 通孔插裝Through Put 物流量，物料通過量Throwing Power 分布力Tie Bar 分流條Tin Drift 錫量飄失Tin Immersion 浸鍍錫Tin Pest 錫疫Tin Whishers 錫鬚Tinning 熱沾銲錫Tolerance 公差Tombstoning 墓碑效應Tooling Feature 工具標的物Torsion Strength 抗扭強度Touch Up 觸修、簡修Trace 線路、導線Traceability 追溯性，可溯性Transducer轉能器Transfer Bump 移用式突塊，轉移式突塊Transfer Laminatied Circuit 轉壓式線路Transfer Soldering 移焊法Transistor電晶體Transmission Line傳輸線Transmittance透光率Treament ,Treating 含浸處理Treeing 枝狀鍍物，鍍鬚Trim Line 裁切線Trimming 修整、修邊True Position真位Tungsten鎢Tungsten Carbide 碳化鎢Turnkey System包辦式系統Turret Solder Terminal塔立式焊接端子Twill Weave斜織法，菱織法Twist 板翹、板扭Two Layer Carrier 兩層式載體UUL Symbol “保險業試驗所”標誌Ultimate Tensile Strength(UTS) 極限抗拉強度Ultra High Freqrency(UHF) 特高頻率Ultra Violet Curing(UV Curing)紫外線硬化Ultrasonic Bonding超音波結合Ultrasonic Cleaning超音波清洗Undercut, Undercutting側蝕Underplate底鍍層Universal Tester 泛用型電測機Unsupported Hole 非鍍通孔Urea 尿素Urethane 胺基甲酸乙脂V-Cut V 型切槽Vacuum Evaporation(or Deposition) 真空蒸法Vacuum Lamination 真空壓合Van Der Waals Force 凡得瓦力Vapor Blasting 蒸氣噴砂Vapor Degreasing 蒸氣除油法Vapor Phase Soldering 氣相焊接Varnish 清潔、凡力水Very Large-Scale Integration (VLSI) 极大積體電路器Via Hole 導通孔Vickers Hardness 維氏硬度Viscosity 粘度,粘度Vision Systems視覺系統Visual Examination(Inspection) 目視檢查V oid 破洞，空洞V olatile Content 揮發份含量V oltage 電壓V oltage Breakdown （崩）潰電壓V oltage Drop 電壓降落V oltage Efficiency電壓效率V oltage Plane 電壓層V oltage plane clearance 電壓層的空環V olume resistivity 體積電阻率V olumetric Analysis 容量分析法Vulcanization 硫化，交聯－W－Wafer 晶圓Waive 不檢驗Warp ；Warpage 板彎Warp Size 漿經處理Washer 墊圈Waste Treatment 廢棄處理Water Absorption 吸水性Water Break 水膜破散．水破Water mark 水印Watt 瓦特Watts Bath瓦玆鍍鎳液Wave Guide導波管Wave Soldering 波焊Waviness 波紋，波度Wear Resistance耐磨度，耐磨性Weatherability耐候性Weave Exposure 織紋顯露；Weave Texture織紋隱見Web 蹼部Weft Yarn緯紗Welding熔接Wet Blasting 濕噴砂Wet Lamination濕壓膜法Wet Process濕式制程Wetting Agent潤濕劑Wetting Balance沾錫天平Wetting 沾濕，沾錫Whirl Brush旋渦式磨刷法Whirl Coating 旋渦涂布法Whisker 晶鬚White residue 白色殘渣White Spot 白點Wicking 燈芯效應Window 操作範圍, 傳動齒孔Wire Bonding 打線結合Wire Gauge 線規Wire Lead 金屬線腳Wire warp 繞線互連Wiring pattern 佈線圖形Working master 工作母片Working time(life) 堪用時間Workmanship 工藝水準.製作水準Woven Cable 扁平編線Wrought Foil 鍛碾金屬箔－X－X -axis X軸X-Ray Fluorescence X 射線瑩光, X 瑩光X-Ray X光－Y-Y-axis Y軸Yarn紗．線Yield 良品率,良率,產率－Z－Z-Axis Z軸Zig-zag In-line Package(zip) 鏈齒狀雙排腳對裝件Abrasives 磨料,刷材Acceptable Quality Level(AQL) 允收品質水準AC Impedance 交流阻抗Reactance;X l )Acoustic Microscope(AM) 感音成像顯微鏡Active Carbon活性炭Aerosol 噴霧劑，氣溶膠，氣懸體Aluminium Nitride(AIN)氮化鋁Amorpho 無定形，非晶形Analog Circuit /Analog Signal類比電路／類比訊號Anisotropic異向的，單向的Anti-Foaming Agent消泡劑Apertures開口，鋼版開口Aramid Fiber聚醯胺纖維Attenuation訊號衰減Balanced Transmission Lines 平衡式傳輸線Ball Grid Array球腳陣列（封裝）Bi-level Stencil 雙階式鋼板Blur Edge(Circle) 模糊邊模糊邊圈Brown oxide 棕氧化Build Up Process 增層法製程Bumping凸塊制程C4 Chip Joint C4晶片焊接C-Stage C階段Cation陰向游子Chip On Glass晶玻接裝(COG)(晶對對玻璃電路板的直接安裝)Chlorinated Solvent含氯溶劑,氯化溶劑Condensation Soldering凝熱焊接,液化放熱焊接Controlled Depth Drilling定深鑽孔Copper-Invar-Copper(CIC)綜合夾心板Core Material內層板材,核材CrossoveMounting Hole 組裝孔，機裝孔──是用螺絲或其他金屬扣件，將組裝板鎖牢固定在機器底座或外殼的工具孔，為直徑160mil左右的大孔．此種組裝孔早期均采兩面大型孔環與孔銅壁之PTH，后為防止孔壁在波焊中沾錫而影響螺絲穿過起見，新式設計特殊將大孔改成“非鍍通孔”（在PTH之間予以遮蓋或鍍銅之後再鑽二次孔），而於周圍環寬上另做數個小型通孔以強化孔環在板面的固著強度．由於NPTH十分麻煩，近來SMT板上也有將大孔只改回PTH者，其兩面孔環多半不相同，常將焊接面的大環取消而改成幾個獨立的小環，或改成馬蹄形不完整的大環，或擴充面積成異形大銅面，兼做為接地之用．Organic Solderability Preservatives(OSP)有機保焊劑──早期半間單面板節省滾錫之可焊處理層，改在裸銅待焊面上涂布一層油性的保護皮膜，稱為“預焊劑Preflux”，以別於下游焊接所用到的助焊劑Preflux．由於油性皮膜的粘手與妨礙電性測試，此種Preflux從未在雙面板與多面板業界使用過．Pits凹點──指在金屬表層上所呈現小面積下陷的凹點，當鍍光涌鎳制程管理不善（有機污染）時，在高電流區常出現密集的凹點，其原因是眾多氫氣聚集附著所致．一般業者常將此詞與“針孔PinHole”混為一談，事實上Pits是不見底的小孔，與見底的針孔並不相同．Pitch跨距，腳距，墊距，線距──Pitch純粹是指板面兩“單元”中心間之遠近距離，PCB業美式表達常用mil-pitch，即指兩焊墊中心線間的跨距mil而言．Pitch與Spacing不同，後者通常是指兩導體間的“隔離板面”，是面積而非長度．Pogo Pin伸縮探針──電測機以針床進行電測時（Bed of Nail Testing），其探針前段分為外套與內針兩部份．內部裝有彈簧，在設定壓力之針盤對準待測板面測點接觸時，可使上千支針尖同時保持其導通所需的彈力．此種伸縮性探針謂之Pogo Pin．此種探針又稱為Spring Probe，當QFP在256腳以上，腳跑密集到15mil時，必須采交錯式觸壓在測墊上，以避免探針本身搭靠短路十分不易．Popcorn Effect爆米花效應──原指以塑膠外體所封裝的IC，因其晶片安裝所用的銀膏會吸水，一旦未加範而逕行麉牢塑體后，在下游組裝焊接遭遇高溫時，其水分將因汽化壓力而造成封體的爆裂，同時還會發出有如爆米花般的聲響，故而得名．近來十分盛行PBGA的封裝元件，不但其中銀膠會吸水，且連載板之BT其材也會吸水，管理不良時也常出現爆米花現象．Print Through壓透，過度擠壓──多層板壓合時所采用之壓力強度(PSI)太大，使得許多樹脂被擠出板外，造成銅皮被直接壓在玻璃布上，甚至將玻璃布也壓扁變形，以致板厚不足，呎寸安定性不良，以及內層線路板被壓走樣等缺失．嚴重者線路根基常與玻纖布直接接觸，埋下“陽极性玻纖絲”漏電的隱憂(Conductive Anodic Filament；CAF)．根本解決方法是按比例流量（Scaled Flow）的原理，大面積壓合則使大的壓力強度，小板面使用小壓力強度，即以1.16PSI/in2或1.16LB/in4為基準，去計算現場操作的壓力強度(Pressure )與總壓力(Force)．Production Master生產底片──指1：1可直接用以生產電路板的原寸底片而言，至於各項諸元的呎寸與公差，則須另列於主圖上(Master Drawing亦即藍圖)．Roller Coating滾動涂布法──是一種采用滾筒，將液態涂料對水平輸送電路板的全面涂布法，此法有希望取代成本較貴的乾膜，而成為內層板直接蝕刻的而蝕光阻主流．為使雙面兩道涂布後才一次預熱固化起見，已涂之濕板只好采用V型輸送帶運送，這對大面薄板會有彎曲變形之可能．涂布用的上下滾筒(Roller，有金屬或橡皮等不同材質)可采精確“間距控制法”，或“筒面刻槽法”，以持續補充料，完成連續自動涂布作業．此法之涂料與機械目前均正在積极開發中．Scoring V型刻槽──數片小型板以藕斷絲連式薄材互接在一起，成為面積爓大的集合板，可方便下游焊接作業及提高其效率．於完成組裝後，再自原來薄材之V型刻槽界分處予以折斷分開．這種從兩面故意削薄以便於折斷之刻痕稱為Score或V-Cut．此項機械工作要恰到好處並不容易，必須保持上下刀口之適當間距與精確對準，使中心餘厚既可支持組裝作業還要方便折斷．其加工成效經常成為下游客戶挑剔之處，主要關鍵在加工機器的精密與性能．Separator Plate隔板，鋼板，鏡板──基材板或多層板進行壓合時，壓機每個開口(Opening ,Daylight)中用以分隔各板冊(Books)的硬質不銹鋼板(如410, 412等)即是．為防止沾膠起見，特將其表面處理至非常平坦光亮，故又稱為鏡板(Mirror Plate)．Silver Paste銀膏──指由重量比達70%之細小銀片與樹脂所調制的聚合物印膏，並加入少量高沸點溶劑做為調薄劑，以方便網版印刷之施工．一般板面追加的跳線(Jumper)或貫孔導通，均可采用銀膏以代替正統PTH，後者特稱為STH(Silver Through Hole)．本法有設備簡單、施工迅速、無廢水麻煩、導通品質不錯等優點，其電阻僅40mΩ/sq．一般STH成本不到PTH的三分之二，是低功率簡單功能電路板的寵兒，常用於各種遙控器或桌上電話機等電子機器．全球STH板類之生產多半集中在東南亞及韓國等地，所用銀膏則以日貨為主，如Fujikura、北陸等品牌．近年來板面跳線多已改成碳膠，而銀膏則專用於貫孔式雙面板之頌域．“銀貫孔”技術要做到客戶允收並不簡單，常會出現斷裂、鬆動、及“遷移”(Migration)等問題．可供參考的文獻不多，現場只有自求多福，以經驗為主去克服困難．Skip Solder缺錫，漏銲──指波焊中之待焊板面，由於出現氣泡或零件的阻礙或其他原因，造成應沾錫表面並未完全蓋滿，稱為Skip Solder，亦稱為Solder Shading．此種缺錫或漏焊情形，在徒手操作之烙鐵補焊中也常發生．Supper Solder超級焊錫──系日商古河電工與Harima化成兩家公司共同開發一種特殊錫膏之商品名稱．其配方中含金屬錫粒與有機酸鉛(RCOO-Pb)，及某些活性的化學品．當此錫膏被印著在裸銅焊墊上又經高溫熔銲時，則三者之間會迅速產生一連串復雜的“置換反應”．部份生成的金屬鉛會滲入錫粒中形成合金．，並焊接在銅面上，效果如同水平“噴錫層”一般，不但厚度十分均勻，而且只在銅面上生長．介於銅墊之間的底材表面將不會出現“牽拖”的焊錫．因此本法可做為QFP 极密墊距的焊料．目前國內已量產的P5筆記型電腦，用以承載CPU高難度小型8層板的Daughter Card，其320腳9.8mil密距及5mil窄墊者，系采SMT烙焊法，此種Supper Solder 錫膏法已成為良率高的少數制程．銅墊上L-type的Super Solder印膏內，於攝氏210度的重熔高溫中，在特殊活性化學品的促進下，其“有機酸鉛”與金屬鋼鐵粒兩者之間會產生一種轉置換反應，而令金屬錫氧化成“有機酸錫”(RCOO-Sn)，隨即也有金屬鉛被還原而附著在錫粒及銅面上，並同時滲入錫粒中形成銲錫．在此同時印膏中的活化劑也會在高溫中使金屬銅溶解成為鉛鹽，且參加上述的置換反應，而讓新生的銲錫成長於銅墊上．Tackiness粘著性，粘手性──在板面涂布液態感光綠漆(LPSM)後（如空網印刷、垂流、噴涂、垂直刮涂、與滾涂等方法），還要預烤以待曝光．這種預烤漆面在強光照射下仍會沾底片的性質稱為Tackiness．又下游各SMD焊墊上印著錫膏與放置零件后，在等待紅外線與熱風熔焊前，錫膏必須暫時呈現粘貼定位的功能，也稱為Tackiness．Tarnish污化，污著──指某些新加工金屬的光澤表面在空氣中放置一段時間后，由於氧化、硫化或外來雜物的附著，以致失去金屬光澤與變色(Discoloration)稱為Tarnish．此詞最常用於鍍銀表面的“污化”，為了確保鍍銀表面的美觀與實用功能起見，其Anti-Tarnish技術也成為鍍銀的重要課題．Thermal Via導熱孔，散熱孔──是分布在高功率（如5W以上）大型零件（如CPU或其他驅動IC）腹底板面上的通孔，此等通孔不具導電互連功能只做散熱用途．有時還會與較大的銅面連接，以增加直接散熱效果．此等散熱孔對Z方向熱應力具有舒緩的作用．精密Daught Card的8層小板，或在某些BGA 雙面板上，就常有這種格點排列的散熱孔，與兩面鍍金的“散熱座”等設計．Three Point Bending三點壓彎試驗──系將組裝板自下板面外側兩杆予以支持，再自上面中心第三點向下施力壓成板彎，然後觀察各貼焊點強度的一種試驗法．Trim 修整，修改數值，精修──碳膠質網印式電阻器(Resistor)，當硬化後之厚度與寬度固定時，則仍可用砂法或雷射法精確。
PCB电路板术语
PCB Jargon (PCB专业术语) AAbsorption 吸收、吸入Accelerated Test（Aging）加速试验、加速老化Accelerator 加速剂、速化剂Accept/Acceptance 允收Acceptable Quality Level（AQL）允收品质水准Accuracy 准确度ACF：Adhesive copper foil 有胶铜箔Activator 活化剂、添加剂比称为ActivatorActive parts（Devices）主动零件，指积体电路或电晶体Addition Agent 添加剂Additive Process 加成法、分全加成、半加成及部份加成Adhesion 附著力Adhesive 胶类或接著剂Aging 老化Air Knife 风刀Ambient Temperature 环境温度Ampere 安培Amp-Hour 安培小时Annular Ring 孔环Anode 阳极Anode Bag 阳极带ANSI: American National Standard Institute 美国标准协会Anti-Forming Agent 消泡剂AOI: Automatic Optical Inspection 自动光学检验Aperture 开口APQP: Advanced Product Quality PlanArray 排列、阵列Artwork 底片ASIC: Application Specific Integrated Circuit 特定用途的积体电路器Aspect Ratio 纵横比、板厚与孔径之比值Assembly 装配、组装ATE: Automatic Testing Equipment 自动电测设备AVL: Approved Vender List 合格供应商BBack Light（Back Lighting）背光法Back-UP 垫板Backpanels/ Backplanes 背板、支持板，厚度较厚，Ball Grid Array（BGA）球脚车列（封装）Barrel 孔壁Base Material 基材Batch 批（同时间发料某一数量的板子）Bevelling 切斜边Binder 黏结剂Black oxide 黑氧化层，另有棕氧化（Brown Oxide）Blind Via Hole 盲导孔Blister 局部性分层或起泡Blockout 封网，网板之空网处以水溶胶涂满Blow Hole 吹孔，PTH孔壁有破洞（void）所造成Boiler (Water Tube Boiler/ Fire Tube Boiler)BOM: Bill of Material 用料表Bond Strength 结合强度Bonding Sheet(Layer) 接合片、接著层，指PP Bonding Wire 结合线，IC之晶片与PCB之引线Bow 板弯Break-away Panel 可断开板或者说Break Away Tab Break Point 出像点、影像点Break-Out 破出（钻孔破出开成断环情形）Bridging 搭桥、桥接Brightener 光泽剂Brush Plating 刷镀BTU/British Thermal Unit 英制热量单位Bump 突块Buried Via Hole 埋导孔Burn-in 高温加速老化试验Burning 烧焦Burr 毛头Buy-off 认可CCAD: Computer Aided Design 电脑辅助设计CAM: Computer Aided Manufacturing 电脑辅助制造CAT: Computer Aided Testing 电脑辅助测试Capacitance 电容Carbide 碳化物、碳化钨钻头CAR: Corrective Action Report 改善报告Carbon Treatment 活性碳处理Card 卡板Carrier 载体Cartridge 滤芯Cathode 阴极CCL: Copper Clad Laminates 铜箔基板Ceramics 陶瓷Certificate 证明书CFC 氟氯碳化物Chloro-Fluoro-CarbonChamfer 倒角、去掉直角Characteristic Impedance 特性阻抗Cheek list 检察清单Chip 晶粒、晶片Chip On Board 晶片黏著板Clean Room 无尘室(Class 100)Cleanliness 清洁度Clearance 余隙、余环COB（Chip on Board）晶片在板上直接组装COC（Certificate of Compliance）出货合格书COF（Chip on Flexible PCB）COG（Chip glass）Coefficient of Thermal Expansion 热膨胀系数（CTE）Cold Solder Joint 冷焊点Component Hole 零件孔Component Side 组件面、零件面Conditioning 整孔Conductivity 导电度Connector 连接器Continuity Test 连通性试验Copper Foil 铜箔、铜皮Copper Ball 铜球Corner Crack 镀通孔转角断角Cp: Capability of Process 制程能力指数Crack 裂痕Crazing 白斑（基板外观上的缺点）Crosstalk 杂讯、串讯Cure/Curing 硬化、热化Current Density （C.D.）电流密度（1 ASD=9.1 ASF）Curtain Coating 液涂法DDatum 基准点Deburring 去毛头Defect 不良缺点Degreasing 脱脂Delamination 分层、爆板Dent 凹陷、缓和均匀的下陷Desmearing 除胶渣Developer 显像液Deviation 偏差Device 电子元件Dewetting 缩锡DFM: Design for Manufacturing/Dirty foreign Materials 异物、杂质Die 冲模Dielectric 介质Dielectric Constant 介质常数Dimensional Stability 尺度安定性DIP（Dual Inline Package）双排脚封装体Direct Plating 直接电镀DI Water 纯水(De-Ionize Water)DOE/Design of Experiment 实验计划法DPPM（Defect Parts Per Million）Drilling 钻孔Drill Bit 钻针Dry Film 干膜Dummy 假镀EECN: Engineering Change Notice 工程变更通知Elongation 延伸性EMI 电磁干扰Electromagnetic InterferenceENIG: Electroless Nickel Immersion Gold 化镍浸金Entek 有机护铜处理Entry Material 盖板E.T/Electric Test 电测、电气测试Epoxy Resin 环氧树脂ESD: Electro-Static Discharge 静电流量Etching 蚀刻Etchback 加蚀Etch Factor 蚀刻函数Etching Resist 抗蚀阻剂Expose Copper 漏铜Exposure 曝光Eyelet 铆钉RivetFFAAR（First Article Approval Report）Failure 故障、损坏Fault 缺陷、瑕疵FCC/Federal Communication Commission 美国联邦通讯委员会Fiber Exposure 玻织显露Fiducial Mark 基准记号、光学点Film 底片Filter 过滤器Fine Line 细线Finger 手指Finishing 制成品在外观上的最后处理First Article 试产的首件或首批小量产品First Pass-Yield 初检良品率Fixture 夹具、治具(Rig and Fixture)Flame Resistant 耐燃性（分HB、VO、V1及V2等四级）Flux 助焊剂Foil Burr 铜箔毛边Foot Pint（Land Pattern）脚垫Foreign Material 外来物、异物FR4/Flame Resistant Laminates 耐燃性积层板材Frequency 频率GGauge 量规Gel Time 胶化时间Gerber Data/Gerber File 格搏档案Glass Fiber 玻璃纤维Glass Fiber Protrusion 玻纤突出Glass Transition Temperature/Tg 玻璃态转化温度Golden Board 测试用标准板Grid 标准格Ground Plane 接地层Guide Pin 导针HHaloing 白圈、白边（在钻孔、开槽等机械动作一旦过猛时将造成内部树脂之破碎或微小分层裂开的现象）Hardener 硬化剂Hardness 硬度Heat Dissipation 散热Hertz（Hz）赫芝HEPA/High Efficiency Particulate Air Filter 高效空气尘粒过滤机Hipot Test 高压电测High Potential Test Hit 擎Holding Time 停区时间Hole Block 孔塞Hole Breakout 孔位破出，简称BreakoutHole counter 数孔机Hole Density 孔数密度Hole Pull Strength 孔壁强度Hole Void 破洞Hot Air Levelling 喷锡HASL/HALTHE(High Temperature Elongation) 高温延伸性II.C.Socket 积体电路插座Image Transfer 影像转移IMC: Inter-metallic compound 介面合金共化物Immersion Plating 浸镀Impedance 阻抗In-Circuit Testing 组装板电测，ICTIndexing Hole 基准孔Infrared(IR) 红外线Ink 油墨Inner Layer 内层Input/Output 输入、输出Insert/Insertion 插接、插装Insulation Resistance 绝缘电阻Integrated Circuit (IC) 积体电路器Interconnection互连Intermatallic Compound(IMC) 介面合金共化物Internal Stress 内应力Ion Cleanliness 离子清洁度Ionic Contamination 离子污染IPC: The Institute for Interconnecting and Packaging Electronic Circuits 美国印刷电路板协会ISO: International Organization for Standardization 国际标准组织Isolation 隔离性JJPCA/Japan Print Circuit Association 日本印刷电路工业会Just-In-Time(JIT) 适时供应KKeyboard 键盘Kraft Paper 牛皮纸LLaminate(s) 基板、积层板Laminator 压膜机Land 孔环焊垫、独立点Landless Hole 无环通孔Laser Direct Imaging/LDI 雷射直接成像Laser Photoplotter 雷射曝光机、绘图机Lay Out 布线、布局(configuration, general arrangement)Lay Up 叠合Lead Frame 脚架Lead 引脚、接脚Legend 文字标记Levelling 整平Light Intensity 光强度LMW: License Manufacturing Warehouse 保税厂Lot Size 批量LRR(Lot Reject Rate)MMajor Defect 严重缺点、主要缺点Marking 标记Mask 阻剂Mass Lamination 大型压板MCM/Multi-Chip Module 多晶片模组Measling 白点Membrane Switch 薄膜开关Microctching 微蚀Microsectioning 微切片法Migration迁移Mil 英丝0.001 inmisregistration 对不准、对不准度MLB/Multi-Layer Board 多层板Modem 调变及解调器、数据机Modification 修改、改变Module 模组Mother Board 主机板NNail Head 钉头N.C.数值控制（Numerical Control）Negative 负片Negative etch-back 反回蚀Nick 缺口Node 节点Nodule 瘤Non-Conformance 不合格品Non-flammable 非燃性Non-wetting 不沾锡Normal Distribution 常态分配NPI：New project introduction)NRE Charge-Non-Recurring Engineering Charge 不会重收的工程费用OOhm 欧姆Omega Meter 离子污染检测仪Open Circuits 断线Optical Density 光密度Optical Inspection 光学检验Organic Solderability Preservatives(OSP) 有机保焊剂Outgassing 出气、吹气Output 产出、输出Overflow 溢流Oxidation氧化Ozone Depletion 臭氧层耗损PPackaging 封装、购装Packing 包装Pad 配圈、孔环焊垫Panel Plating 全板镀铜Passive Parts 被动零件，如电阻、电容Past 膏（锡膏Solder Paste）Pattern Plating 线路电镀PCB/Printed Circuit Board 印刷电路板Peel Strength 抗撕强度Peripheral 周边附属设备Phototool 底片（一般指偶氮棕片Diazo Film）Pin Grid Array(PGA) 矩阵式针脚封装Pinhole 针孔Pin 接脚、插梢、插针Pink Ring 粉红圈Pits 凹点（小面积下陷）Pitch 脚距、垫距、线距Plasma 电浆Plated through Hole/PTH 镀通孔Plug 插脚、塞孔Polarization 分极、极化Polyimide(PI) 聚亚酸胺Popcorn Effect 爆米花效应Post Cure 疏孔度试验Power Plane 后续硬化、后烤Power Supply 电源层PPM/Parts Per Million 百万分之几Preheat 预热Prepreg 胶片、树脂片Press Plate 压合钢板Press-Fit Contact 挤入式接触Printing 印刷Probe 探针Profile 轮廓、部面图、升温曲线图积线Punch 横切、冲床QQIT(Quality improvement Team) 品质改善小组Qualified Products List 合格产品（供应者）名单RRadiometer 辐射计、光度计Radius 尺角、半径Reference Dimension 参考尺度、参考尺寸Reflow Soldering 重熔焊接、熔焊Registration 对准度Reject 剔退、拒收Reliability 可靠度、信赖度Repair 修理Resin Content 胶含量、树脂含量Resin Flow 胶流量、树脂流量Resist 阻剂、阻膜Resistor 电阻器、电阻Resolution 解像、解像度、解析度Resolving Power 解析力、解像力（分辨力）Rework(ing) 重工、再加工Ring 套环Roller Cutter 混切机（俗称锯板机）Roller Coating 滚动涂布法Routing 切外型、捞外型RRM: Revolutions per Minute 转速（每分钟）Run-out 偏转、绕转、累积距差SSCAR(Supplier CA Request) 供应商改善报告SCM: Supply chain Management 供应商管理系统Scratch 刮痕Screen Printing 网版印刷Scrubber 磨刷机、磨刷器Selective Plating 选择性电镀SEM/Scanning Electron Microscope 扫瞄式电子显微镜Semi-Conductor 半导体Shearing 剪、裁切Short 短路SIR(Surface Insulation Resistance) 表面绝缘电阻Side Wall 侧壁Sigma(Standard Deviation) 标准差Signal 讯号Silicon 矽Silk Screen 网版印刷、丝网印刷Skin Effect 集肤效应Skip Printing 漏印Slot 槽孔Smear 胶渣SMT/Surface Mount Technology 表面黏装技术Solder 焊锡Solderability 焊锡性Solder Ball 锡球Solder Bridging 锡桥Solder Bump 焊锡凸块Solder Dam 锡堤（IC脚间的防焊）Solder Levelling 喷锡、热风整平Solder Mask(S/M) 绿漆、防焊膜Solder Paste 锡膏Solder Plug 锡塞、锡柱Solder Pot 锡炉Solder Side 焊锡面Soldering Fluid/Soldering Oil 助焊液、护焊汕Solid Content 固体含量SOP(Standard Operation Procedure) 标准作业程序Spacing 间距SPC/Statistical Process Control 统计制程管制Specific Gravity SG比重Specification(Spec) 规范、规格Specimen 样品、试样Spindle 钻轴Spray Coating 喷著涂装Stencil 版膜、网版Storage condition 储存条件Stress Relief 消除应力Substrate 底材Surface Insulation Resistance(SIR) 表面绝缘电阻Surface Tenting 表面张力Surface-Mount Device 表面黏装零件Swelling Agents/Sweller 膨胀剂SWR(Special Working Request) 试产前之“特殊工作要求”TTab 接点、金手指Tape 撕胶带试验Teflon 铁氟龙Temperature Profile 温度曲线Template 模板Tensile Strength 抗拉强度Tenting 盖孔法Terminal 端子Thermal Stress 热应力Thermal Shock 热冲击Thin Copper Foil 薄铜箔Then film Technology 薄膜技术Throwing Power 分布力Tolerance 公差Touch Up 检修（简单的工具在手操作下即可进行的小规范的检修，称之T ouch Up或Rewok 有些类似）Trace 线路、导线Traceability 追溯性、可溯性Transistor 电晶体Transmission Line 传输线Twist 板翘、板扭UUL 保险业试验Underwriters Laboratories/INCUltra Violet Curing(UV Curing) 紫外线硬化Ultrasonic Cleaning 超音波清洗Undercut/Undercutting 侧蚀Universal Tester 万用型电测机VVacuum Lamination 真空压合Vacuum Packing 真空包装Viscosity 黏滞度、黏度Vision Systems 视觉系统Visual Examination(Inspection) 目视检查Voltage 电压WWafer 晶圆Warp/Warpage 板弯Warp and Twist 板弯翘Washer 垫圈Waste Treatment 废弃处理Water Absorption 吸水性Water Break 水膜破散、水破Watermark 水印Wave Soldering 波焊Weave Exposure 织纹显露Weave Texture 织纹隐现Welding 熔接Wet Process 湿式制程Wetting Balance 沾锡、沾湿White Spot 白点Wicking effect 灯芯效应Wire Bonding 打线结合WIP(Working Piece in Process) 在制品XX Axis X轴X-Ray X光YY-Axis Y轴Yield 良品率、良率、产率ZZ-Axis X轴OtherHDI-High Density inter-connect 高密度内连接SWOT Strengths Weaknesses Opportunities ThreatsCD: Compact DiscCPU: Central Process UnitDLD: Direct Laser Drilling (CO2 Laser, YAG Laser)DVD: Digital Versatile DiscEEPROM: Electrically Erasable Programmable Read Only MemoryEMS: Electronics Manufacturing ServiceGPS: Global Positioning ServiceHDD: Hard Disk DriveHDTV: High Density TVLCD: Liquid Crystal DisplayLED: Light Emitting DiodeVCD: Video Compact DiskQuality System Requirements QS-9000(質量體系要求)Advanced Product Quality Planning and Control Plan APQP (產品質量先期策劃和控制計劃) Measurement Systems Analysis MSA(測量系統分析)Potential Failure Mode and Effects Analysis FMEA(潜在失效模式與後果分析)Production Part Approval Process PPAP (生產件批准程序)Statistical Process Control SPC (統計過程控制)IPC-A-600Classification 分级Acceptance Criteria 允收规格Applicable Documents 参考资料Dimensions And Tolerances 尺度与公差Terms And Definitions 术语及定义Workmanship 工艺水准Externally Observable Characteristics 外观特性Board Edges 板边Burrs 看头、毛刺Nonmetallic Burrs 非金属性毛头Metallic Burrs 金属毛头Nicks 缺口Haloing 白边Base Material 基材Weave Exposure 织纹显露Weave Texture 织纹隐现Exposed/Disrupted Fibers 玻织曝露/扰乱Pits and Voids 凹点与凹坑Base Material Subsurface 基材次表面Measling白点Crazing白斑Delamination/Blister分层/起泡Foreign Inclusions外来夹杂物Solder Coatings and Fused Tin Lead喷锡板或熔锡板Nonwetting拒锡（不沾锡）Dewetting缩锡Holes-Plated-Through-General镀通孔概要Nodules/Burrs镀瘤/毛头Pink Ring粉红圈Voids-Copper Plating镀铜层破洞Voids-Finished Coating完工皮膜之镀层破洞Lifted Lands-(Visual)孔环浮离（目检）Holes-Unsupported未镀孔Haloing白圈Printed Contacts板边接触金手指Surface Plating-General表面镀层通则Surface Plating-Wire Bond Pads打线承垫之表面Burrs on Edge-Board Contacts板边接点之毛头Adhesion of Overplate表面镀层之附着力Marking标记Etched Marking蚀刻标记Screened or Ink Stamped Marking纲印或盖印之标记Solder Resist(Solder Mask)防焊绿漆Coverage Over Conductors (Skip Coverage) 边线表面之覆盖性（覆盖不全、跳印）Registration to Holes (All Finishes) 对孔之套准度（各种表处理层）Registration to Other Conductive Patterns 其他防焊的对准性Ball Grid Array (Solder Resist-Defined Lands) 球脚格列体之焊垫（绿漆设限之焊垫）Ball Grid Array (Copper-Defined Lands) 球脚格列体（铜面设限之焊垫）Ball Grid Array (Solder Dam) 球脚格列体（防焊堤）Blisters/Delamination起泡/分层Adhesion(Flaking or Peeling)附著力（破片或剥落）Waves/Wrinkles/Ripples起浪/起皱/纹路Tenting(Via Holes)盖孔（导通孔、过孔）Pattern Definition-Dimensional圆形尺度特性Conductor Width and Spacing线宽与间距Conductor Width线宽Conductor Spacing导线间距External Annular Ring-Measurement孔环测量External Annular Ring-Supported Holes有孔壁支援的外孔环External Annular Ring-Unsupported Holes无孔壁支援的外孔环Flatness平坦度Internally Observable Characteristics可观察到的内在特性Dielectric Materials介质材料Laminate Voids(Outside Thermal Zone)压板空洞（或热区之外）Registration/Conductors to Holes导体与通孔之间的对准度Clearance Hole/Unsupported/to Power/Ground Planes 针对电源层或接地层具隔环之非镀通孔Delamination/Blister分层/起泡Etchback回蚀Negative Etchback反回蚀Smear Removal除胶渣Dielectric Material/Clearance/Metal Plane for Supported Holes 金属层与通孔壁之介质隔距Layer-to-Layer Spacing层与层之间距Resin Recession树脂缩陷Conductive Patterns-General导线概论Etching Characteristics蚀刻特性Print and Etch印后即蚀刻（指正片法）Surface Conductor Thickness(Foil Plus Plating)表导体厚度（铜箔加电镀铜）Foil Thickness-Internal Layers内层箔厚Plated-Through Holes-General镀通孔概论Annular Ring-Internal Layers各内层之孔环Lifted Lands-(Cross-Sections)焊环浮起（切片上所见）Foil Crack-(Internal Foil)“C”Crack内层铜箔之裂纹Foil Crack-(External Foil)镀层破裂Plating Crack-(Barrel)“E”Crack孔壁镀层破裂Plating Crack-(Corner)“F”Crack孔角镀层破裂Plating Nodules镀层长瘤Copper Plating Thickness-Hole Wall孔壁镀铜厚度Plating Voids镀层破洞Solder Coating Thickness (Only When Specified) 焊锡皮膜厚度（当已规定检查者）Solder Resist Thickness绿漆厚度Wicking灯芯效应（指玻织束渗入化学铜）Wicking/Clearance Holes隔离孔之渗铜Innerlayer Separation-Vertical (Axial) Microsection 内层（环）分离-垂直（纵断面）微切片Innerlayer Separation-Horizontal (Transverse) Microsection 内层（环）分离-水平（横断面）微切片Material Fill of Blind and Buried Vias盲孔与埋孔之填充材料钻孔式镀通孔Plated-Through Holes-Drilled钻孔式镀通孔Burrs毛头Nailheading钉头Plated-Through Holes-Punched冲孔式镀通孔Roughness and Nodules粗糙与镀瘤Flare喇叭口Miscellaneous其他离顶Flexible And Rigid-Flex Printed Wiring软性及软硬合板Metal Core Printed Boards金属平心电路板Type Classifications型式分类Spacing Laminated Type间距压合板Insulation Thickness/Insulated Metal Substrate已绝缘金属底材之绝缘厚度Insulation Material Fill/Laminated Type Metal Core压合型金属平心之绝缘填料Cracks in Insulation Material Fill/Laminated Type压合型绝缘填充料之裂纹Core Bond to Plated-Through Hole Wall平心层与镀通孔之间的固著Flush Printed Boards表面全平板Flushness of Surface Conductor表面导线之平坦性Cleanliness Testing清洁度试验Solderability Testing焊锡性试验Plated-Through Holes镀通孔Electrical Integrity电性之完整平行光曝光机：Collimated ExposureCollimated Exposure二次元测量仪two dimension measuring instrument,镀层厚度测试仪Plating Thickness Tester电导率测试仪：Conductometer剥离强度测试仪peel strength TesterROHS检测仪ROHS TesterLCR测试仪LCR Tester喷砂机：sandblasting machine磨板机：Scrubbing立式圆角机Corner rounding Machine开短路测试机short circuit tester碱性蚀刻机：alkalineetchingmachine剪板机: steel plate shearer高温烤箱high-temperature oven飞针测试机：Flying Probe E-Test Machine铣边机edge milling machine超声波清洗机ultrasonic cleanersDES水平线DES level自私，让我们只看见自己却容不下别人。
PCB电子线路板专业术语
PCB电子线路板专业术语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board46、载芯片板：chip on board (COB)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (FFC)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glasscloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三、基材的材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI)38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、E玻璃纤维：E-glass fibre43、D玻璃纤维：D-glass fibre44、S玻璃纤维：S-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(CAD)7、计算机辅助制造：computer-aided manufacturing.(CAM)8、计算机集成制造：computer integrat manufacturing.(CIM)9、计算机辅助工程：computer-aided engineering.(CAE)10、计算机辅助测试：computer-aided test.(CAT)11、电子设计自动化：electric design automation .(EDA)12、工程设计自动化：engineering design automaton .(EDA2)13、组装设计自动化：assembly aided architectural design. (AAAD)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(MDF)27、机器描述格式数据库：MDF databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (CAD)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (PDP)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer No.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、V形盘：V-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (PTH)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (ALIVH)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referan更多的详细资料来源：。
pcb布线的术语解释
PCB（Printed Circuit Board，印刷电路板）布线时涉及一些专业术语。
以下是几个常见的 PCB 布线术语及其解释：1.走线（Routing）：指在 PCB 上布置电路连接的过程。
走线可以是手动进行的，也可以是通过自动布线工具实现的。
2.导线宽度（Trace Width）：指 PCB 上导线的宽度。
导线宽度通常根据电流要求和 PCB 层数来确定，以确保足够的电流通过并避免过热。
3.间距（Spacing）：指 PCB 上不同元件之间的距离。
间距通常是指导线之间或导线与元件之间的距离，用于确保电路的稳定性和可靠性。
4.平面（Plane）：指 PCB 上连接到电源或地的大型铜区域。
平面通常用于提供稳定的电源和地连接，并作为信号屏蔽。
5.过孔（Via）：指连接 PCB 不同层之间的通孔。
过孔可以是普通过孔，也可以是盲孔或埋孔，用于在多层 PCB 中进行信号传递。
6.阻抗控制（Impedance Control）：指控制 PCB 中信号线的电阻。
阻抗控制在高速数字信号和射频电路设计中至关重要，可以确保信号传输的稳定性和可靠性。
7.差分对（Differential Pairs）：指两条平行布线的信号线，用于传输差分信号。
差分对常用于高速数据传输和抗干扰设计。
8.盲孔（Blind Via）：指连接 PCB 表面层和内部层的通孔，但不连接到 PCB的另一侧。
盲孔通常用于高密度的 PCB 布线设计。
9.埋孔（Buried Via）：指完全位于 PCB 内部层中的通孔，不连接到 PCB 的任何一侧。
埋孔可以用于提高 PCB 布线的密度和可靠性。
这些术语是 PCB 布线设计过程中经常遇到的关键概念。
了解这些术语有助于工程师更好地理解 PCB 布线设计，并确保电路板的性能和可靠性。
电路板术语总整理1
電路東術語總整理----A----A-Stage A 階段----指膠片(Prepreg)製造過程中，其補強材料的玻纖布或棉紙，在通過膠水槽進行含浸工程時，該樹脂之膠水(Varnish，也譯為清漆水)，尚處於單體且被溶劑稀釋的狀態，稱為A-Stage。
相對的當玻纖布或棉紙吸入膠水，又經熱風及紅外線乾燥,將便樹脂分子量增大為複體或寡聚物(Oligomer)，再集附於補強材上形成膠片。
此時的樹脂狀態稱為B-Stage。
當再繼續函熱軟化，並進一步聚合成為最後高分子樹脂時，則稱為C-Stage。
Abietic Acid 松脂酸----是天然松香(Rosin)的主要成份，占其重量比的34%。
在焊接的高溫下，此酸能將銅面的輕微氧化物或鈍化物予以清除，使得清潔銅面可與熔錫產生“介面合金共化物”(IMC)而完成焊接。
此松脂酸在常溫很安定，不會腐蝕金屬。
Abrasion Resistance 耐磨性----在電路東工程中，常指防焊綠漆的耐磨性。
其詴驗方法是以1kg重的軟性砂輪，在完成綠漆的IPC-B-25樣東上旋轉磨刷50次，其梳型電路區不許磨破見銅(詳見電路東資訊雜誌第54期P.70)，即為綠漆的耐磨性。
某些規範也對金手指的耐磨性有所要求。
又，Abrasive是指磨料而言，如浮石粉即是。
ABS 樹脂----是由Acrylonitrile-Butadine-Styrane(丙烯腈-丁二烯-苯乙烯)所組成的三元混合樹脂，其中丁二烯之橡皮部份能被鉻酸所腐蝕而出現疏孔，可做為化學銅或化學鎳的著落點，因而得以繼續進行電鍍。
電路東上許多裝配的零伔，即為採購ABS鍍伔。
Absorption 吸收，吸入----指被吸收物會進入主體的內部，是一種化學式的吸入動作。
如光化反應中的光能吸收，或東材與綠漆對溶劑的吸入等。
另有一近似詞Adsorption則是指吸附而言，只附著在主體的表面，是一種物理式的親和吸附。
A ccelerated Test (Aging) 函速老化----也就是函速老化詴驗(Aging)。
电路板术语总整理
电路板术语总整理*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(试验). Acceleration速化反应.Accelerator 加速剂,速化剂.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光. Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号. Anchoring Spurs着力爪.Angle of Contack接触角.Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准.Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则 Be=145-(145÷Sp.Gr) 凡液体比重比水轻则 Be=140÷(Sp.Gr-130)*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值). Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射. Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图 .Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈).Bomb Sight弹标.Bond Strength结合强度.Bondability结合性.Bonding Layer结合层接着层.Bonding Sheet(Layer)接合片.Bonding Wire结合线.Bow, Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条).在425℃~870℃下进行熔接的方式).Break Point显像点.Break-away Panel可断开板.Breakdown Voltage崩溃电压.Break-out破出.Bridging搭桥.Bright Dip光泽浸渍处理.Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程.Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程.Buoyancy浮力.Buried Via Hole埋导孔.Burn-in高温加速老化试验.Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层.*****C*****C4 Chip JointC4芯片焊接.Cable电缆.CAD计算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination帽式压合法.Capacitance电容.Capacitive Coupling电容耦合.Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment, Active活化炭处理.Card卡板.Card Cages/Card Racks电路板构装箱.Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode阴极.Cation阴向离子, 阳离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心间距.Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性.Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent含氯溶剂,氯化溶剂. Circumferential Separation环状断孔.Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法 . Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材.Condensation Soldering凝热焊接,液化放热焊接. Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性, 服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻.Continuity连通性.Contract Service协力厂,分包厂. Controlled Depth Drilling定深钻孔. Conversion Coating 转化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜试验.Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板. Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记.Counterboring方型扩孔. Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon板边试样. Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积.Crosshatch Testing十字割痕试验. Crosshatching十字交叉区. Crosslinking, Crosslinkage交联,架桥. Crossover越交,搭交.Crosstalk噪声, 串讯.Crystalline Melting Point晶体熔点.C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力. Curtain Coating濂涂法.*****D***** Daisy Chained Design菊瓣设计.Datum Reference基准参考.Daughter Board子板.Debris碎屑,残材.Deburring去毛头.Declination Angle斜射角.Definition边缘逼真度.Degradation 劣化.Degrasing脱脂.Deionized Water去离子水.Delamination分离.Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位,定义9000米纱束所具有的重量(以克米计)).Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像 .Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压.Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀.Discrete Compenent散装零件.Discrete Wiring Board散线电路板,复线板.Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔.Drag In / Drag Out带[进/带出.Drag Soldering拖焊.Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接.Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片).Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器.Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试.EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度.Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸.Electroless-Deposition无电镀.Electrolytic Tough Pitch电解铜..Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯.End Tap封头.Entek有机护铜处理.Entrapment夹杂物.Entry Material盖板.Epoxy Resin环氧树脂.Etch Factor蚀刻因子.Etchant蚀刻剂(液).Etchback回蚀.Etching Indicator蚀刻指针.Etching Resist蚀刻阻剂.Eutetic Composition共融组成.Exotherm放热(曲线).Exposure曝光.Eyelet铆眼.*****F*****Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距.Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法.First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级.Flare扇形崩口.Flash Plating闪镀.Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板. Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数 . Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路 , 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).Galvanic Series贾凡尼次序(电动次序).Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所发展一系列完整的软件档案).Ghost Image阴影.Gilding镀金 (现为:Glod Plating).Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.Glass Transition Temperature, Tg玻璃态转化温度.Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H*****Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度).Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机. Hipot Test 高压电测.Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作).Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路.Hydraulic Bulge Test液压鼓起试验.Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压.Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I*****I.C. Socket绩体电路器插座.Icicle锡尖.Illuminance照度.Image Transfer影像转移.Immersion Plating浸镀.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing组装板电测.Inclusion异物,夹杂物.Indexing Hole基准孔.Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出.Insert, Insertion插接.Inspection Overlay套检底片.Insulation Resistance绝缘电阻.Integrated Circuit(IC)绩体电路器.Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物.Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染.Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J*****JEDEC(Joint Electronic Device 联合电子组件工程委员会.Engineering Council)J-LeadJ型接脚.Job Shop专业工厂.Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K*****Kapton聚亚醯胺软板.Karat克拉 (1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮纸.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片状结构.Laminate Void板材空洞.Laminate(s)基板.Lamination Void压合空洞.Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机. Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管.Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度.Liquid Crystal Display (LCD)液晶显示器.Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆. Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tangent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的复合材料.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面).Mealing泡点.Mean Time To Failure (MTTF)故障前可用之平均时数.Measling白点.Mechanical Stretcher机械式张网机.Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验.Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞.Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线.Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限.Minor Weave Direction次要织向.Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术. Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance Test湿气与绝缘电阻试验. Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).Multi-Chip-Module(MCM)多芯片芯片模块.Multiwiring Board (or Discrete Wiring Board)复线板.*****N*****N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄.Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂.Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯.Noble Metal Paste贵金属印膏.Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度. Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜.Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.)Optical Density光密度.Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压.Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P*****Packaging封装,构装.Pad焊垫,圆垫.Pad Master圆垫底片.Pads Only Board唯垫板.Palladium钯.Panel制程板.Panel Plating全板镀铜.Panel Process全板电镀法.Paper Phenolic纸质酚醛树脂(板材).Parting Agent脱膜剂.Passivation钝化 ,钝化外理.Passive Device (Component)被动组件(零件)Paste膏,糊.Pattern板面图形.Pattern Plating线路电镀.Pattern Process线路电镀法.Peak Voltage峰值电压.Peel Strength抗撕强度.Periodic Reverse (PR) Current周期性反电流.Peripheral周边附属设备.Permeability透气性,导磁率.Permittivity诱电率,透电率.pH Value酸碱值.Phase相.Phase Diagram相图.Phenolic酚醛树脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator感光启始剂.Photomask光罩.Photoplotter, Plotter光学绘图机.Photoresist光阻.Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工. Phototool底片.Pick and Place拾取与放置.Piezoelectric压电性.Pin 插脚,插梢,插针.Pin Grid Array (PGA)矩阵式针脚对装.Pinhole针孔.Pink Ring粉红圈.Pitch跨距,脚距,垫距,线距.Pits凹点.Plain Weave平织.Plasma电浆.Plasticizers可塑剂,增塑剂.Plated Through Hole镀通孔.Platen热盘.Plating镀.Plotting标绘.Plowing犁沟.Plug插脚,塞柱.Ply层,股.Pneumatic Stretcher气动拉伸器. Pogo Pin伸缩探针.Point 钻尖.Point Angle钻尖面.Point Source Light点状光源.Poise泊."粘滞度"单位=1dyne*sec/cm2. Polar Solvent极性溶剂.Polarity电极性.Polarization分极,极化.Polarizing Slot偏槽.Polyester Films聚酯类薄片.Polymer Thick Film (PTF)厚膜糊. Polymerization聚合.Polymide(PI)聚亚醯胺.Popcorn Effect爆米花效应.Porcelain瓷材,瓷面.Porosity Test疏孔度试验.Positive Acting Resist正性光阻剂. Post Cure后续硬化,后烤.Post Separation后期分离,事后公离. Pot Life运用期,锅中寿命.Potting铸封,模封.Power Supply电源供应器.Preform 预制品.Preheat预热.Prepreg胶片,树脂片.Press Plate钢板.Press-Fit Contact挤入式接触. Pressure Foot 压力脚.Pre-tinning预先沾锡.Primary Image线路成像.Print Through压透,过度挤压..Probe探针.Process Camera制程用照像机.Process Window操作范围.Production Master生产底片.Profile轮廓,部面图,升温曲线图棱线. Propagation传播.Propagation Delay传播延迟.Puddle Effect水坑效应.Pull Away拉离.Pulse Plating脉冲电镀法.Pumice Powder 浮石粉.Punch冲切.Purge, Purging净空,净洗.Purple Plague紫疫(金与铝的共化物层).Pyrolysis热裂解,高温分解.*****Q*****Quad Flat Pack (QFP)方扁形封装体.Qualification Agency资格认证机构.Qualification Inspection资格检验.Qualified Products List合格产品(供应者)名单.Qualitative Analysis定性分析.Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板). Quantitative Analysis定量分析.Quench 淬火,骤冷.Quick Disconnect快速接头.Quill纬纱绕轴.*****R*****Rack 挂架.Radial Lead放射状引脚.Radio Frequency Interference (RFI)射频干扰.Rake Angle抠角,耙角.Rated Temperature, Voltage额定温度,额定电压.Reactance电抗.Real Estate底材面,基板面.Real Time System 实时系统.Reclaiming再生,再制.Rediometer辐射计,光度计.Reel to Reel卷轮(盘)式操作.Reference Dimension参考尺度.Reference Edge参考边缘.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark对准用标记.Registration对准度.Reinforcement补强物.Rejection剔退,拒收.Relamination(Re-Lam)多层板压合.Relaxation松弛.缓和.Relay继电器.Release Agent, Release Sheets脱模剂,离模剂. Reliability可靠度,可信度.Relief Angle浮角.Repair修理.Resin Coated Copper Foil背胶铜箔.Resin Content胶含量,树脂含量.Resin Flow胶流量,树脂流量.Resin Recession树脂下陷.Resin Rich Area 多胶区,树脂丰富区.Resin Smear胶(糊)渣.Resin Starve Area缺胶区,树脂缺乏区.Resist阻膜,阻剂.Resistivity电阻系数,电阻率.Resistor电阻器,电阻.Resistor Drift电阻漂移.Resistor Paste电阻印膏.Resolution解像,解像度,分辨率.Resolving Power解析(像)力,分辨力.Reverse Current Cleaning反电流(电解)清洗. Reverse Etchback反回蚀.Reverse Image负片影像(阻剂).Reverse Osmosis (RO)反(逆渗透).Reversion反转,还原.Revision修正版.改订版.Rework(ing)重工,再加工.Rhology流变学,流变性质.Ribbon Cable圆线缆带.Rigid-Flex Printed Board硬软合板.Ring 套环.Rinsing水洗,冲洗.Ripple纹波(指整流器所输出电流中不稳定成分). Rise Time上升时间.Roadmap 线路与零件之布局图.Robber辅助阴极.Roller Coating辊轮涂布.Roller Coating滚动涂布法.Roller Cutter辊切机.Roller Tinning辊锡法,滚锡法.Rosin松香.Rotary Dip Test摆动沾锡试验.Routing切外型.Runout偏转,累绩距差.Rupture迸裂.*****S*****Sacrificial Protection牺牲性保护层. Salt Spray Test盐雾试验.Sand Blast喷砂.Saponification皂化作用.Saponifier皂化剂.Satin Finish缎面处理.Scaled Flow Test比例流量实验. Schemetic Diagram电路概略图.ScoringV型刻槽.Scratch刮痕.Screen Printing纲版印刷.Screenability纲印能力.Scrubber磨刷机,磨刷器.Scum透明残膜.Sealing封孔.Secondary Side第二面 .Seeding下种.Selective Plating选择性电镀.Self-Extinguishing自熄性.Selvage布边.Semi-Additive Process半加成制程. Semi-Conductor半导体.Sensitizing敏化.Separable Component Part可分离式零件. Separator Plate隔板, 钢板.Sequential Lamination接续性压合法. Sequestering Agent螯合剂.Shadowing阴影,回蚀死角.Shank钻针柄部.Shear Strength 抗剪强度.Shelf Life储龄.Shield遮蔽.Shore Hardness萧氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall侧壁.Siemens电阻值.Sigma (Standard Deviation)标准差. Signal讯号.Silane硅烷.Silica Gel硅胶砂.Silicon硅.Silicone硅铜.Silk Screen纲版印刷,丝纲印刷.Silver Migration银迁移.Silver Paste 银膏.Single-In-Line Package(SIP)单边插脚封装体.Sintering烧结.Sizing上胶,上浆.Sizing上浆处理.Skin Effect集肤效应 (高频下,电流在传递时多集中在导体表面,使得道线内部通过电流甚少, 造成内部导体浪费,并也使得表面导体部分电阻升高.Skip Printing, Skip Plating漏印,漏镀.Skip Solder 缺锡, 漏焊.Slashing浆经.Sleeve Jint套接.Sliver边丝,边余.Slot, Slotting槽口.Sludge于泥.Slump塌散.Slurry稠浆,悬浮浆.Small Hole小孔.Smear胶渣.Smudging锡点沾污.Snap-off弹回高度.Socket插座.Soft Contact轻触.Soft Glass 软质玻璃(铅玻璃).Solder焊锡.Solder Ball锡球.Solder Bridging锡桥.Solder Bump 焊锡凸块.Solder Column Package锡柱脚封装法.Solder Connection焊接.Solder Cost焊锡着层.Solder Dam锡堤.Solder Fillet填锡.Solder Levelling喷锡,热风整平.Solder Masking(S/M)防焊膜绿漆.Solder Paste锡膏.Solder Plug锡塞(柱).Solder Preforms预焊料.Solder Projection焊锡突点.Solder Sag 焊锡垂流物.Solder Side焊锡面.Solder Spatter溅锡.Solder Splash贱锡.Solder Spread Test散锡试验.Solder Webbing锡纲.Solder Webbing锡纲.Solder Wicking渗锡,焊锡之灯芯效应.Solderability可焊性.Soldering软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油.Solid Content固体含量,固形分.Solidus Line固相线.Spacing间距.Span跨距.Spark Over闪络.Specific Heat 比热.Specification (Spec)规范,规格.Specimen样品,试样.Spectrophotometry分光光度计检测法.Spindle主轴,钻轴.Spinning Coating自转涂布.Splay斜钻孔.Spray Coating喷着涂装.Spur底片图形边缘突出.Sputtering溅射.Squeege刮刀.Stagger Grid蹒跚格点.Stalagometer滴管式表面张力计.Stand-off Terminals直立型端子.Starvation缺胶.Static Eliminator静电消除器.Steel Rule Die(钢)刀模.Stencil版膜.Step and Repeat逐次重复曝光.Step Plating梯阶式镀层.Step Tablet阶段式曝光表.Stiffener补强条(板).Stop Off防镀膜, 阻剂.Strain变形,应变.Strand绞(指由许多股单丝集束并旋扭而成的丝束).Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失).Stress Corrosion应力腐蚀.Stress Relief消除应力.Strike预镀.Stringing拖尾.Stripline条线.Stripper剥除液(器).Substractive Process减成法.Substrate底材.Supper Solder超级焊锡.Supported Hole(金属)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面绝缘电阻. Surface Mount Device 表面粘装组件.Surface Mounting Technology (SMT)表面粘装技术. Surface Resistivity表面电阻率.Surface Speed钻针表面速度.Surface Tension表面张力.Surfactant表面润湿剂.Surge突流,突压.Swaged Lead压扁式引脚.Swelling Agents, Sweller膨松剂.Swimming 线路滑离.Synthetic Resin合成树脂.*****T*****Tab接点,金手指.Taber Abraser泰伯磨试器.Tackiness粘着性, 粘手性.Tape Automatic Bonding (TAB)卷带自动结合. Tape Casting 带状铸材.Tape Test撕胶带试验.Tape Up Master原始手贴片.Taped Components卷带式连载组件.Taper Pin Gauge锥状孔规.Tarnish污化.Tarnish 污化, 污着.Teflon铁氟龙(聚4氟乙烯).Telegraphing浮印,隐印.Temperature Profile温度曲线.Template模板.Tensile Strength抗拉强度.Tensiomenter张力计.Tenting盖孔法.Terminal端子.Terminal Clearance端子空环.Tetra-Etch氟树脂蚀粗剂.Tetrafunctional Resin四功能树脂.Thermal Coefficient of Expansion (TCE)热膨胀系数. Thermal Conductivity导热率.Thermal Cycling热循环,热震荡.Thermal Mismstch感热失谐.Thermal Relief散热式镂空.Thermal Via导热孔.Thermal Zone感热区.Thermocompression Bonding热压结合.Thermocouple热电偶.Thermode发热体.Thermode Soldering热模焊接法.Thermogravimetric Analysis, (TGA)热重分析法. Thermomechanical Analysis (TMA)热机分析法. Thermoplastic热塑性.Thermosetting热固性.Thermosonic Bonding热超音波结合.Thermount聚醯胺短纤席材.Thermo-Via导热孔.Thick Film Circuit厚膜电路.Thief辅助阳极.Thin Copper Foil薄铜箔.Thin Core薄基板.Thin Film Technology薄膜技术.Thin Small Outline Package(TSOP)薄小型绩体电路器. Thinner调薄剂.Thixotropy抗垂流性,摇变性.Three Point Bending三点压弯试验.Three-Layer Carrier三层式载体.Threshold Limit Value (TLV)极限值.Through Hole Mounting通孔插装.Through Put物流量,物料通过量.Throwing Power分布力.Tie Bar分流条.Tin Drift锡量漂飘失.Tin Immersion浸镀锡.Tin Pest锡疫(常见白色金属锡为"β锡",当温度低于13.2℃时则β锡将逐渐转变成粉末状灰色"α锡"称为"锡疫".Tin Whishers锡须.Tinning热沾焊锡.Tolerance公差.Tombstoning墓碑效应.Tooling Feature工具标示物.Topography表面地形.Torsion Strength抗扭强度.Touch Up触修,简修.Trace 线路,导线.Traceability追溯性,可溯性.Transducer转能器.Transfer Bump移用式突块.Transfer Laminatied Circuit转压式线路. Transfer Soldering移焊法.Transistor晶体管.Translucency半透性.Transmission Line传输线.Transmittance透光率.Treament, Treating含浸处理.Treeing枝状镀物,镀须.Trim修整, 精修.Trim Line裁切线.Trimming修整,修边.True Position真位.Tungsten钨Tungsten Carbide碳化钨.Turnkey System包办式系统.Turret Solder Terminal塔立式焊接端子.Twill Weave斜织法.Twist板扭.Two Layer Carrier两层式载体.*****U*****UL Symbol(UL.为Under-Writers 保俭业试验所标志. Laboratories,INC)Ultimate Tensile Strength (UTS)极限抗拉强度. Ultra High Frequency (UHF)超高频率.Ultra Violet Curing (UV Curing)紫外线硬化. Ultrasonic Bonding超音波结合.Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式传输线. Undercut, Undercutting侧蚀.Underplate底镀层.Universal Tester汛用型电测机.Unsupported Hole非镀通孔.Urea尿素.Urethane胺基甲酸乙脂.*****V*****Vacuoles焊洞.Vacuum Evaporation(or Deposition)真空蒸镀法. Vacuum Lamination真空压合.Van Der Waals Force凡得华力.Vapor Blasting蒸汽喷砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering气相焊接.Varnish凡力水,清漆(树脂之液态单体).V-cutV型切槽.Very Large-Scale Integration(VLSI)极大绩体电路器. Via Hole 导通孔.Vickers Hardness维氏硬度.Viscosity粘滞度,粘度.Vision Systems视觉系统.Visual Examination目视检验.Void 破洞,空洞.Volatile Content挥发份含量.Voltage电压.Voltage Breakdown崩溃电压.Voltage Drop 电压降落.Voltage Efficiency电压效率.Voltage Plane电压层.Voltage Plane Clearance电压层的空环.Volume Resistivity体绩电阻率.Volume Resistivity体绩电阻率.Volumetric Analysis容量分析法.Vulcanization交联,硫化.*****W*****Wafer晶圆.Waive暂准过关,暂不检查.Warp Size 浆经处理.Warp, Warpage板弯.Washer垫圈.Waste Treatment废弃处理.Water Absorption吸水性.Water Break水膜破散,水破.Water Mark水印.Watt瓦特.Watts Bath瓦兹镀镍液.Wave Guide导波管.Wave Soldering波焊.Waviness 波纹,波度.Wear Resistance耐磨性,耐磨度.Weatherability耐候性.Weave Eposure织纹显露.Weave Texture织纹隐现.Web蹼部.Wedge Bond 楔形结合点.Wedge Void楔形缺口(破口).Weft Yarn纬纱.Welding熔接.Wet Blasting湿喷砂.Wet Lamination湿压膜法.Wet Process湿式制程.Wetting Agent润湿剂.Wetting Balance沾锡天平.Wetting Balance沾锡,沾湿.Whirl Brush旋涡式磨刷法.Whirl Coating旋涡涂布法.Whisker晶须.White Residue白色残渣.White Spot白点.Wicking灯蕊效应.Window操作范围,传动齿孔.Wiping Action 滑动接触(导电).Wire Bonding打线结合.Wire Gauge线规.Wire Lead金属线脚.Wire Pattern布线图形.Wire Wrap绕线互连.Working Master工作母片.Working Time (Life)堪用时间.Workmanship 手艺,工艺水平,制作水准.Woven Cable扁平编线.Wrinkle皱折, 皱纹.Wrought Foil锻碾金属箔.*****X*****X AxisX轴.X-Ray X光.X-Ray FluorescenceX萤光.*****Y*****Yarn纱线.Y-AxisY轴.Yield良品率,良率,产率.Yield Point屈服点.*****Z*****Z-AxisZ轴.Zero Centering中心不变(叠合法).Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.=====================================================。
电路板术语集锦
电路板术语集锦时间:2006-07-24 来源: 作者: 点击：…… 字体大小:【大中小】*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(试验).Acceleration速化反应.Accelerator 加速剂,速化剂.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光.Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号. Anchoring Spurs着力爪.Angle of Contack接触角.Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准. Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则 Be=145-(145÷Sp.Gr) 凡液体比重比水轻则 Be=140÷(Sp.Gr-130)*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值). Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射.Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图 .Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈). Bomb Sight弹标.Bond Strength结合强度. Bondability结合性.Bonding Layer结合层接着层. Bonding Sheet(Layer)接合片. Bonding Wire结合线.Bow, Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条). 在425℃~870℃下进行熔接的方式). Break Point显像点.Break-away Panel可断开板. Breakdown Voltage崩溃电压.Break-out破出.Bridging搭桥.Bright Dip光泽浸渍处理. Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程.Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程. Buoyancy浮力.Buried Via Hole埋导孔.Burn-in高温加速老化试验.Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层.*****C*****C4 Chip JointC4芯片焊接.Cable电缆.CAD计算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination帽式压合法.Capacitance电容.Capacitive Coupling电容耦合.Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment, Active活化炭处理.Card卡板.Card Cages/Card Racks电路板构装箱. Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode阴极.Cation阴向离子, 阳离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心间距. Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性. Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent含氯溶剂,氯化溶剂. Circumferential Separation环状断孔.Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法 . Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材. Condensation Soldering凝热焊接,液化放热焊接. Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性, 服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻. Continuity连通性.Contract Service协力厂,分包厂. Controlled Depth Drilling定深钻孔. Conversion Coating 转化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜试验.Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板. Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记. Counterboring方型扩孔. Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon板边试样. Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积. Crosshatch Testing十字割痕试验. Crosshatching十字交叉区. Crosslinking, Crosslinkage交联,架桥. Crossover越交,搭交.Crosstalk噪声, 串讯.Crystalline Melting Point晶体熔点.C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力. Curtain Coating濂涂法.*****D*****Daisy Chained Design菊瓣设计.Datum Reference基准参考.Daughter Board子板.Debris碎屑,残材.Deburring去毛头.Declination Angle斜射角.Definition边缘逼真度.Degradation 劣化.Degrasing脱脂.Deionized Water去离子水.Delamination分离.Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位, 定义9000米纱束所具有的重量(以克米计)). Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像 .Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压. Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀.Discrete Compenent散装零件.Discrete Wiring Board散线电路板,复线板.Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔.Drag In / Drag Out带[进/带出.Drag Soldering拖焊.Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接.Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片).Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器. Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度. Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸.Electroless-Deposition无电镀.Electrolytic Tough Pitch电解铜..Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯.End Tap封头.Entek有机护铜处理.Entrapment夹杂物.Entry Material盖板.Epoxy Resin环氧树脂.Etch Factor蚀刻因子.Etchant蚀刻剂(液).Etchback回蚀.Etching Indicator蚀刻指针.Etching Resist蚀刻阻剂.Eutetic Composition共融组成.Exotherm放热(曲线).Exposure曝光.Eyelet铆眼.*****F*****Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距.Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法. First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级.Flare扇形崩口.Flash Plating闪镀.Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板. Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数 . Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路 , 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).Galvanic Series贾凡尼次序(电动次序).Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所发展一系列完整的软件档案).Ghost Image阴影.Gilding镀金 (现为:Glod Plating).Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.Glass Transition Temperature, Tg玻璃态转化温度.Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H*****Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度).Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机. Hipot Test 高压电测.Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作).Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性. Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路.Hydraulic Bulge Test液压鼓起试验. Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压. Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I*****I.C. Socket绩体电路器插座.Icicle锡尖.Illuminance照度.Image Transfer影像转移.Immersion Plating浸镀.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing组装板电测.Inclusion异物,夹杂物.Indexing Hole基准孔.Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出.Insert, Insertion插接.Inspection Overlay套检底片.Insulation Resistance绝缘电阻.Integrated Circuit(IC)绩体电路器.Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物. Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染.Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J*****JEDEC(Joint Electronic Device 联合电子组件工程委员会.Engineering Council)J-LeadJ型接脚.Job Shop专业工厂.Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K*****Kapton聚亚醯胺软板.Karat克拉 (1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮纸.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片状结构.Laminate Void板材空洞.Laminate(s)基板.Lamination Void压合空洞.Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机. Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管.Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度.Liquid Crystal Display (LCD)液晶显示器.Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆. Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tangent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的复合材料.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面). Mealing泡点.Mean Time To Failure (MTTF)故障前可用之平均时数. Measling白点.Mechanical Stretcher机械式张网机.Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验.Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞.Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线.Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限.Minor Weave Direction次要织向.Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术. Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance Test湿气与绝缘电阻试验. Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).Multi-Chip-Module(MCM)多芯片芯片模块.Multiwiring Board (or Discrete Wiring Board)复线板.*****N*****N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄.Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂.Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯. Noble Metal Paste贵金属印膏.Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度. Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜. Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.) Optical Density光密度.Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压. Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P*****Packaging封装,构装.Pad焊垫,圆垫.Pad Master圆垫底片.Pads Only Board唯垫板.Palladium钯.Panel制程板.Panel Plating全板镀铜.Panel Process全板电镀法.Paper Phenolic纸质酚醛树脂(板材). Parting Agent脱膜剂.Passivation钝化 ,钝化外理.Passive Device (Component)被动组件(零件) Paste膏,糊.Pattern板面图形.Pattern Plating线路电镀.Pattern Process线路电镀法.Peak Voltage峰值电压.Peel Strength抗撕强度.Periodic Reverse (PR) Current周期性反电流. Peripheral周边附属设备.Permeability透气性,导磁率.Permittivity诱电率,透电率.pH Value酸碱值.Phase相.Phase Diagram相图.Phenolic酚醛树脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator感光启始剂.Photomask光罩.Photoplotter, Plotter光学绘图机.Photoresist光阻.Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工. Phototool底片.Pick and Place拾取与放置.Piezoelectric压电性.Pin 插脚,插梢,插针.Pin Grid Array (PGA)矩阵式针脚对装.Pinhole针孔.Pink Ring粉红圈.Pitch跨距,脚距,垫距,线距.Pits凹点.Plain Weave平织.Plasma电浆.Plasticizers可塑剂,增塑剂.Plated Through Hole镀通孔.Platen热盘.Plating镀.Plotting标绘.Plowing犁沟.Plug插脚,塞柱.Ply层,股.Pneumatic Stretcher气动拉伸器.Pogo Pin伸缩探针.Point 钻尖.Point Angle钻尖面.Point Source Light点状光源.Poise泊."粘滞度"单位=1dyne*sec/cm2.Polar Solvent极性溶剂.Polarity电极性.Polarization分极,极化.Polarizing Slot偏槽.Polyester Films聚酯类薄片.Polymer Thick Film (PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亚醯胺.Popcorn Effect爆米花效应.Porcelain瓷材,瓷面.Porosity Test疏孔度试验.Positive Acting Resist正性光阻剂. Post Cure后续硬化,后烤.Post Separation后期分离,事后公离. Pot Life运用期,锅中寿命.Potting铸封,模封.Power Supply电源供应器.Preform 预制品.Preheat预热.Prepreg胶片,树脂片.Press Plate钢板.Press-Fit Contact挤入式接触. Pressure Foot 压力脚.Pre-tinning预先沾锡.Primary Image线路成像.Print Through压透,过度挤压..Probe探针.Process Camera制程用照像机. Process Window操作范围. Production Master生产底片.Profile轮廓,部面图,升温曲线图棱线. Propagation传播.Propagation Delay传播延迟.Puddle Effect水坑效应.Pull Away拉离.Pulse Plating脉冲电镀法.Pumice Powder 浮石粉.Punch冲切.Purge, Purging净空,净洗.Purple Plague紫疫(金与铝的共化物层). Pyrolysis热裂解,高温分解.*****Q*****Quad Flat Pack (QFP)方扁形封装体. Qualification Agency资格认证机构.Qualification Inspection资格检验.Qualified Products List合格产品(供应者)名单.Qualitative Analysis定性分析.Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板). Quantitative Analysis定量分析.Quench 淬火,骤冷.Quick Disconnect快速接头.Quill纬纱绕轴.*****R*****Rack 挂架.Radial Lead放射状引脚.Radio Frequency Interference (RFI)射频干扰.Rake Angle抠角,耙角.Rated Temperature, Voltage额定温度,额定电压.Reactance电抗.Real Estate底材面,基板面.Real Time System 实时系统.Reclaiming再生,再制.Rediometer辐射计,光度计.Reel to Reel卷轮(盘)式操作.Reference Dimension参考尺度.Reference Edge参考边缘.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark对准用标记.Registration对准度.Reinforcement补强物.Rejection剔退,拒收.Relamination(Re-Lam)多层板压合.Relaxation松弛.缓和.Relay继电器.Release Agent, Release Sheets脱模剂,离模剂.Reliability可靠度,可信度.Relief Angle浮角.Repair修理.Resin Coated Copper Foil背胶铜箔.Resin Content胶含量,树脂含量.Resin Flow胶流量,树脂流量.Resin Recession树脂下陷.Resin Rich Area 多胶区,树脂丰富区.Resin Smear胶(糊)渣.Resin Starve Area缺胶区,树脂缺乏区.Resist阻膜,阻剂.Resistivity电阻系数,电阻率.Resistor电阻器,电阻.Resistor Drift电阻漂移.Resistor Paste电阻印膏.Resolution解像,解像度,分辨率.Resolving Power解析(像)力,分辨力.Reverse Current Cleaning反电流(电解)清洗. Reverse Etchback反回蚀.Reverse Image负片影像(阻剂).Reverse Osmosis (RO)反(逆渗透).Reversion反转,还原.Revision修正版.改订版.Rework(ing)重工,再加工.Rhology流变学,流变性质.Ribbon Cable圆线缆带.Rigid-Flex Printed Board硬软合板.Ring 套环.Rinsing水洗,冲洗.Ripple纹波(指整流器所输出电流中不稳定成分). Rise Time上升时间.Roadmap 线路与零件之布局图.Robber辅助阴极.Roller Coating辊轮涂布.Roller Coating滚动涂布法.Roller Cutter辊切机.Roller Tinning辊锡法,滚锡法.Rosin松香.Rotary Dip Test摆动沾锡试验.Routing切外型.Runout偏转,累绩距差.Rupture迸裂.*****S*****Sacrificial Protection牺牲性保护层.Salt Spray Test盐雾试验.Sand Blast喷砂.Saponification皂化作用.Saponifier皂化剂.Satin Finish缎面处理.Scaled Flow Test比例流量实验. Schemetic Diagram电路概略图. ScoringV型刻槽.Scratch刮痕.Screen Printing纲版印刷. Screenability纲印能力.Scrubber磨刷机,磨刷器.Scum透明残膜.Sealing封孔.Secondary Side第二面 .Seeding下种.Selective Plating选择性电镀.Self-Extinguishing自熄性.Selvage布边.Semi-Additive Process半加成制程. Semi-Conductor半导体.Sensitizing敏化.Separable Component Part可分离式零件. Separator Plate隔板, 钢板.Sequential Lamination接续性压合法. Sequestering Agent螯合剂. Shadowing阴影,回蚀死角.Shank钻针柄部.Shear Strength 抗剪强度.Shelf Life储龄.Shield遮蔽.Shore Hardness萧氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall侧壁.Siemens电阻值.Sigma (Standard Deviation)标准差.Signal讯号.Silane硅烷.Silica Gel硅胶砂.Silicon硅.Silicone硅铜.Silk Screen纲版印刷,丝纲印刷.Silver Migration银迁移.Silver Paste 银膏.Single-In-Line Package(SIP)单边插脚封装体.Sintering烧结.Sizing上胶,上浆.Sizing上浆处理.Skin Effect集肤效应 (高频下,电流在传递时多集中在导体表面,使得道线内部通过电流甚少, 造成内部导体浪费,并也使得表面导体部分电阻升高.Skip Printing, Skip Plating漏印,漏镀.Skip Solder 缺锡, 漏焊.Slashing浆经.Sleeve Jint套接.Sliver边丝,边余.Slot, Slotting槽口.Sludge于泥.Slump塌散.Slurry稠浆,悬浮浆.Small Hole小孔.Smear胶渣.Smudging锡点沾污.Snap-off弹回高度.Socket插座.Soft Contact轻触.Soft Glass 软质玻璃(铅玻璃).Solder焊锡.Solder Ball锡球.Solder Bridging锡桥.Solder Bump 焊锡凸块.Solder Column Package锡柱脚封装法. Solder Connection焊接.Solder Cost焊锡着层.Solder Dam锡堤.Solder Fillet填锡.Solder Levelling喷锡,热风整平.Solder Masking(S/M)防焊膜绿漆.Solder Paste锡膏.Solder Plug锡塞(柱).Solder Preforms预焊料.Solder Projection焊锡突点.Solder Sag 焊锡垂流物.Solder Side焊锡面.Solder Spatter溅锡.Solder Splash贱锡.Solder Spread Test散锡试验.Solder Webbing锡纲.Solder Webbing锡纲.Solder Wicking渗锡,焊锡之灯芯效应. Solderability可焊性.Soldering软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油. Solid Content固体含量,固形分.Solidus Line固相线.Spacing间距.Span跨距.Spark Over闪络.Specific Heat 比热.Specification (Spec)规范,规格.Specimen样品,试样. Spectrophotometry分光光度计检测法. Spindle主轴,钻轴.Spinning Coating自转涂布.Splay斜钻孔.Spray Coating喷着涂装.Spur底片图形边缘突出.Sputtering溅射.Squeege刮刀.Stagger Grid蹒跚格点.Stalagometer滴管式表面张力计.Stand-off Terminals直立型端子.Starvation缺胶.Static Eliminator静电消除器.Steel Rule Die(钢)刀模.Stencil版膜.Step and Repeat逐次重复曝光.Step Plating梯阶式镀层.Step Tablet阶段式曝光表.Stiffener补强条(板).Stop Off防镀膜, 阻剂.Strain变形,应变.Strand绞(指由许多股单丝集束并旋扭而成的丝束).Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失).Stress Corrosion应力腐蚀.Stress Relief消除应力.Strike预镀.Stringing拖尾.Stripline条线.Stripper剥除液(器).Substractive Process减成法.Substrate底材.Supper Solder超级焊锡.Supported Hole(金属)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面绝缘电阻.Surface Mount Device 表面粘装组件.Surface Mounting Technology (SMT)表面粘装技术. Surface Resistivity表面电阻率.Surface Speed钻针表面速度.Surface Tension表面张力.Surfactant表面润湿剂.Surge突流,突压.Swaged Lead压扁式引脚.Swelling Agents, Sweller膨松剂.Swimming 线路滑离.Synthetic Resin合成树脂.*****T*****Tab接点,金手指.Taber Abraser泰伯磨试器.Tackiness粘着性, 粘手性.Tape Automatic Bonding (TAB)卷带自动结合. Tape Casting 带状铸材.Tape Test撕胶带试验.Tape Up Master原始手贴片.Taped Components卷带式连载组件.Taper Pin Gauge锥状孔规.Tarnish污化.Tarnish 污化, 污着.Teflon铁氟龙(聚4氟乙烯).Telegraphing浮印,隐印.Temperature Profile温度曲线.Template模板.Tensile Strength抗拉强度.Tensiomenter张力计.Tenting盖孔法.Terminal端子.Terminal Clearance端子空环.Tetra-Etch氟树脂蚀粗剂.Tetrafunctional Resin四功能树脂.Thermal Coefficient of Expansion (TCE)热膨胀系数. Thermal Conductivity导热率.Thermal Cycling热循环,热震荡.Thermal Mismstch感热失谐.Thermal Relief散热式镂空.Thermal Via导热孔.Thermal Zone感热区.Thermocompression Bonding热压结合.Thermocouple热电偶.Thermode发热体.Thermode Soldering热模焊接法.Thermogravimetric Analysis, (TGA)热重分析法. Thermomechanical Analysis (TMA)热机分析法. Thermoplastic热塑性.Thermosetting热固性.Thermosonic Bonding热超音波结合.Thermount聚醯胺短纤席材.Thermo-Via导热孔.Thick Film Circuit厚膜电路.Thief辅助阳极.Thin Copper Foil薄铜箔.Thin Core薄基板.Thin Film Technology薄膜技术.Thin Small Outline Package(TSOP)薄小型绩体电路器. Thinner调薄剂.Thixotropy抗垂流性,摇变性.Three Point Bending三点压弯试验.Three-Layer Carrier三层式载体.Threshold Limit Value (TLV)极限值.Through Hole Mounting通孔插装.Through Put物流量,物料通过量.Throwing Power分布力.Tie Bar分流条.Tin Drift锡量漂飘失.Tin Immersion浸镀锡.Tin Pest锡疫(常见白色金属锡为"β锡",当温度低于13.2℃时则β锡将逐渐转变成粉末状灰色"α锡"称为"锡疫". Tin Whishers锡须.Tinning热沾焊锡.Tolerance公差.Tombstoning墓碑效应.Tooling Feature工具标示物.Topography表面地形.Torsion Strength抗扭强度.Touch Up触修,简修.Trace 线路,导线.Traceability追溯性,可溯性.Transducer转能器.Transfer Bump移用式突块.Transfer Laminatied Circuit转压式线路.Transfer Soldering移焊法.Transistor晶体管.Translucency半透性.Transmission Line传输线.Transmittance透光率.Treament, Treating含浸处理.Treeing枝状镀物,镀须.Trim修整, 精修.Trim Line裁切线.Trimming修整,修边.True Position真位.Tungsten钨Tungsten Carbide碳化钨.Turnkey System包办式系统.Turret Solder Terminal塔立式焊接端子.Twill Weave斜织法.Twist板扭.Two Layer Carrier两层式载体.*****U*****UL Symbol(UL.为Under-Writers 保俭业试验所标志. Laboratories,INC)Ultimate Tensile Strength (UTS)极限抗拉强度.Ultra High Frequency (UHF)超高频率.Ultra Violet Curing (UV Curing)紫外线硬化. Ultrasonic Bonding超音波结合.Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式传输线. Undercut, Undercutting侧蚀.Underplate底镀层.Universal Tester汛用型电测机.Unsupported Hole非镀通孔.Urea尿素.Urethane胺基甲酸乙脂.*****V*****Vacuoles焊洞.Vacuum Evaporation(or Deposition)真空蒸镀法. Vacuum Lamination真空压合.Van Der Waals Force凡得华力.Vapor Blasting蒸汽喷砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering气相焊接.Varnish凡力水,清漆(树脂之液态单体).V-cutV型切槽.Very Large-Scale Integration(VLSI)极大绩体电路器. Via Hole 导通孔.Vickers Hardness维氏硬度.Viscosity粘滞度,粘度.Vision Systems视觉系统.Visual Examination目视检验.Void 破洞,空洞.Volatile Content挥发份含量.Voltage电压.Voltage Breakdown崩溃电压.Voltage Drop 电压降落.Voltage Efficiency电压效率.Voltage Plane电压层.Voltage Plane Clearance电压层的空环.Volume Resistivity体绩电阻率.Volume Resistivity体绩电阻率.Volumetric Analysis容量分析法.Vulcanization交联,硫化.*****W*****Wafer晶圆.Waive暂准过关,暂不检查.Warp Size 浆经处理.Warp, Warpage板弯.Washer垫圈.Waste Treatment废弃处理. Water Absorption吸水性. Water Break水膜破散,水破. Water Mark水印.Watt瓦特.Watts Bath瓦兹镀镍液.Wave Guide导波管.Wave Soldering波焊. Waviness 波纹,波度.Wear Resistance耐磨性,耐磨度. Weatherability耐候性.Weave Eposure织纹显露. Weave Texture织纹隐现.Web蹼部.Wedge Bond 楔形结合点. Wedge Void楔形缺口(破口). Weft Yarn纬纱.Welding熔接.Wet Blasting湿喷砂.Wet Lamination湿压膜法.Wet Process湿式制程. Wetting Agent润湿剂. Wetting Balance沾锡天平. Wetting Balance沾锡,沾湿. Whirl Brush旋涡式磨刷法. Whirl Coating旋涡涂布法. Whisker晶须.White Residue白色残渣. White Spot白点.Wicking灯蕊效应.Window操作范围,传动齿孔. Wiping Action 滑动接触(导电). Wire Bonding打线结合.Wire Gauge线规.Wire Lead金属线脚.Wire Pattern布线图形.Wire Wrap绕线互连.Working Master工作母片.Working Time (Life)堪用时间.Workmanship 手艺,工艺水平,制作水准.Woven Cable扁平编线.Wrinkle皱折, 皱纹.Wrought Foil锻碾金属箔.*****X*****X AxisX轴.X-Ray X光.X-Ray FluorescenceX萤光.*****Y*****Yarn纱线.Y-AxisY轴.Yield良品率,良率,产率.Yield Point屈服点.*****Z*****Z-AxisZ轴.Zero Centering中心不变(叠合法).Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.===================================================== [分享]PCB专业英译术语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制组件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board。
PCB电路板术语
PCB Jargon (PCB专业术语) AAbsorption 吸收、吸入Accelerated Test（Aging）加速试验、加速老化Accelerator 加速剂、速化剂Accept/Acceptance 允收Acceptable Quality Level（AQL）允收品质水准Accuracy 准确度ACF：Adhesive copper foil 有胶铜箔Activator 活化剂、添加剂比称为ActivatorActive parts（Devices）主动零件，指积体电路或电晶体Addition Agent 添加剂Additive Process 加成法、分全加成、半加成及部份加成Adhesion 附著力Adhesive 胶类或接著剂Aging 老化Air Knife 风刀Ambient Temperature 环境温度Ampere 安培Amp-Hour 安培小时Annular Ring 孔环Anode 阳极Anode Bag 阳极带ANSI: American National Standard Institute 美国标准协会Anti-Forming Agent 消泡剂AOI: Automatic Optical Inspection 自动光学检验Aperture 开口APQP: Advanced Product Quality PlanArray 排列、阵列Artwork 底片ASIC: Application Specific Integrated Circuit 特定用途的积体电路器Aspect Ratio 纵横比、板厚与孔径之比值Assembly 装配、组装ATE: Automatic Testing Equipment 自动电测设备AVL: Approved Vender List 合格供应商BBack Light（Back Lighting）背光法Back-UP 垫板Backpanels/ Backplanes 背板、支持板，厚度较厚，Ball Grid Array（BGA）球脚车列（封装）Barrel 孔壁Base Material 基材Batch 批（同时间发料某一数量的板子）Bevelling 切斜边Binder 黏结剂Black oxide 黑氧化层，另有棕氧化（Brown Oxide）Blind Via Hole 盲导孔Blister 局部性分层或起泡Blockout 封网，网板之空网处以水溶胶涂满Blow Hole 吹孔，PTH孔壁有破洞（void）所造成Boiler (Water Tube Boiler/ Fire Tube Boiler)BOM: Bill of Material 用料表Bond Strength 结合强度Bonding Sheet(Layer) 接合片、接著层，指PP Bonding Wire 结合线，IC之晶片与PCB之引线Bow 板弯Break-away Panel 可断开板或者说Break Away Tab Break Point 出像点、影像点Break-Out 破出（钻孔破出开成断环情形）Bridging 搭桥、桥接Brightener 光泽剂Brush Plating 刷镀BTU/British Thermal Unit 英制热量单位Bump 突块Buried Via Hole 埋导孔Burn-in 高温加速老化试验Burning 烧焦Burr 毛头Buy-off 认可CCAD: Computer Aided Design 电脑辅助设计CAM: Computer Aided Manufacturing 电脑辅助制造CAT: Computer Aided Testing 电脑辅助测试Capacitance 电容Carbide 碳化物、碳化钨钻头CAR: Corrective Action Report 改善报告Carbon Treatment 活性碳处理Card 卡板Carrier 载体Cartridge 滤芯Cathode 阴极CCL: Copper Clad Laminates 铜箔基板Ceramics 陶瓷Certificate 证明书CFC 氟氯碳化物Chloro-Fluoro-CarbonChamfer 倒角、去掉直角Characteristic Impedance 特性阻抗Cheek list 检察清单Chip 晶粒、晶片Chip On Board 晶片黏著板Clean Room 无尘室(Class 100)Cleanliness 清洁度Clearance 余隙、余环COB（Chip on Board）晶片在板上直接组装COC（Certificate of Compliance）出货合格书COF（Chip on Flexible PCB）COG（Chip glass）Coefficient of Thermal Expansion 热膨胀系数（CTE）Cold Solder Joint 冷焊点Component Hole 零件孔Component Side 组件面、零件面Conditioning 整孔Conductivity 导电度Connector 连接器Continuity Test 连通性试验Copper Foil 铜箔、铜皮Copper Ball 铜球Corner Crack 镀通孔转角断角Cp: Capability of Process 制程能力指数Crack 裂痕Crazing 白斑（基板外观上的缺点）Crosstalk 杂讯、串讯Cure/Curing 硬化、热化Current Density （C.D.）电流密度（1 ASD=9.1 ASF）Curtain Coating 液涂法DDatum 基准点Deburring 去毛头Defect 不良缺点Degreasing 脱脂Delamination 分层、爆板Dent 凹陷、缓和均匀的下陷Desmearing 除胶渣Developer 显像液Deviation 偏差Device 电子元件Dewetting 缩锡DFM: Design for Manufacturing/Dirty foreign Materials 异物、杂质Die 冲模Dielectric 介质Dielectric Constant 介质常数Dimensional Stability 尺度安定性DIP（Dual Inline Package）双排脚封装体Direct Plating 直接电镀DI Water 纯水(De-Ionize Water)DOE/Design of Experiment 实验计划法DPPM（Defect Parts Per Million）Drilling 钻孔Drill Bit 钻针Dry Film 干膜Dummy 假镀EECN: Engineering Change Notice 工程变更通知Elongation 延伸性EMI 电磁干扰Electromagnetic InterferenceENIG: Electroless Nickel Immersion Gold 化镍浸金Entek 有机护铜处理Entry Material 盖板E.T/Electric Test 电测、电气测试Epoxy Resin 环氧树脂ESD: Electro-Static Discharge 静电流量Etching 蚀刻Etchback 加蚀Etch Factor 蚀刻函数Etching Resist 抗蚀阻剂Expose Copper 漏铜Exposure 曝光Eyelet 铆钉RivetFFAAR（First Article Approval Report）Failure 故障、损坏Fault 缺陷、瑕疵FCC/Federal Communication Commission 美国联邦通讯委员会Fiber Exposure 玻织显露Fiducial Mark 基准记号、光学点Film 底片Filter 过滤器Fine Line 细线Finger 手指Finishing 制成品在外观上的最后处理First Article 试产的首件或首批小量产品First Pass-Yield 初检良品率Fixture 夹具、治具(Rig and Fixture)Flame Resistant 耐燃性（分HB、VO、V1及V2等四级）Flux 助焊剂Foil Burr 铜箔毛边Foot Pint（Land Pattern）脚垫Foreign Material 外来物、异物FR4/Flame Resistant Laminates 耐燃性积层板材Frequency 频率GGauge 量规Gel Time 胶化时间Gerber Data/Gerber File 格搏档案Glass Fiber 玻璃纤维Glass Fiber Protrusion 玻纤突出Glass Transition Temperature/Tg 玻璃态转化温度Golden Board 测试用标准板Grid 标准格Ground Plane 接地层Guide Pin 导针HHaloing 白圈、白边（在钻孔、开槽等机械动作一旦过猛时将造成内部树脂之破碎或微小分层裂开的现象）Hardener 硬化剂Hardness 硬度Heat Dissipation 散热Hertz（Hz）赫芝HEPA/High Efficiency Particulate Air Filter 高效空气尘粒过滤机Hipot Test 高压电测High Potential Test Hit 擎Holding Time 停区时间Hole Block 孔塞Hole Breakout 孔位破出，简称BreakoutHole counter 数孔机Hole Density 孔数密度Hole Pull Strength 孔壁强度Hole Void 破洞Hot Air Levelling 喷锡HASL/HALTHE(High Temperature Elongation) 高温延伸性II.C.Socket 积体电路插座Image Transfer 影像转移IMC: Inter-metallic compound 介面合金共化物Immersion Plating 浸镀Impedance 阻抗In-Circuit Testing 组装板电测，ICTIndexing Hole 基准孔Infrared(IR) 红外线Ink 油墨Inner Layer 内层Input/Output 输入、输出Insert/Insertion 插接、插装Insulation Resistance 绝缘电阻Integrated Circuit (IC) 积体电路器Interconnection互连Intermatallic Compound(IMC) 介面合金共化物Internal Stress 内应力Ion Cleanliness 离子清洁度Ionic Contamination 离子污染IPC: The Institute for Interconnecting and Packaging Electronic Circuits 美国印刷电路板协会ISO: International Organization for Standardization 国际标准组织Isolation 隔离性JJPCA/Japan Print Circuit Association 日本印刷电路工业会Just-In-Time(JIT) 适时供应Keyboard 键盘Kraft Paper 牛皮纸LLaminate(s) 基板、积层板Laminator 压膜机Land 孔环焊垫、独立点Landless Hole 无环通孔Laser Direct Imaging/LDI 雷射直接成像Laser Photoplotter 雷射曝光机、绘图机Lay Out 布线、布局(configuration, general arrangement) Lay Up 叠合Lead Frame 脚架Lead 引脚、接脚Legend 文字标记Levelling 整平Light Intensity 光强度LMW: License Manufacturing Warehouse 保税厂Lot Size 批量LRR(Lot Reject Rate)MMajor Defect 严重缺点、主要缺点Marking 标记Mask 阻剂Mass Lamination 大型压板MCM/Multi-Chip Module 多晶片模组Measling 白点Membrane Switch 薄膜开关Microctching 微蚀Microsectioning 微切片法Migration迁移Mil 英丝0.001 inmisregistration 对不准、对不准度MLB/Multi-Layer Board 多层板Modem 调变及解调器、数据机Modification 修改、改变Module 模组Mother Board 主机板Nail Head 钉头N.C.数值控制（Numerical Control）Negative 负片Negative etch-back 反回蚀Nick 缺口Node 节点Nodule 瘤Non-Conformance 不合格品Non-flammable 非燃性Non-wetting 不沾锡Normal Distribution 常态分配NPI：New project introduction)NRE Charge-Non-Recurring Engineering Charge 不会重收的工程费用OOhm 欧姆Omega Meter 离子污染检测仪Open Circuits 断线Optical Density 光密度Optical Inspection 光学检验Organic Solderability Preservatives(OSP) 有机保焊剂Outgassing 出气、吹气Output 产出、输出Overflow 溢流Oxidation氧化Ozone Depletion 臭氧层耗损PPackaging 封装、购装Packing 包装Pad 配圈、孔环焊垫Panel Plating 全板镀铜Passive Parts 被动零件，如电阻、电容Past 膏（锡膏Solder Paste）Pattern Plating 线路电镀PCB/Printed Circuit Board 印刷电路板Peel Strength 抗撕强度Peripheral 周边附属设备Phototool 底片（一般指偶氮棕片Diazo Film）Pin Grid Array(PGA) 矩阵式针脚封装Pinhole 针孔Pin 接脚、插梢、插针Pink Ring 粉红圈Pits 凹点（小面积下陷）Pitch 脚距、垫距、线距Plasma 电浆Plated through Hole/PTH 镀通孔Plug 插脚、塞孔Polarization 分极、极化Polyimide(PI) 聚亚酸胺Popcorn Effect 爆米花效应Post Cure 疏孔度试验Power Plane 后续硬化、后烤Power Supply 电源层PPM/Parts Per Million 百万分之几Preheat 预热Prepreg 胶片、树脂片Press Plate 压合钢板Press-Fit Contact 挤入式接触Printing 印刷Probe 探针Profile 轮廓、部面图、升温曲线图积线Punch 横切、冲床QQIT(Quality improvement Team) 品质改善小组Qualified Products List 合格产品（供应者）名单RRadiometer 辐射计、光度计Radius 尺角、半径Reference Dimension 参考尺度、参考尺寸Reflow Soldering 重熔焊接、熔焊Registration 对准度Reject 剔退、拒收Reliability 可靠度、信赖度Repair 修理Resin Content 胶含量、树脂含量Resin Flow 胶流量、树脂流量Resist 阻剂、阻膜Resistor 电阻器、电阻Resolution 解像、解像度、解析度Resolving Power 解析力、解像力（分辨力）Rework(ing) 重工、再加工Ring 套环Roller Cutter 混切机（俗称锯板机）Roller Coating 滚动涂布法Routing 切外型、捞外型RRM: Revolutions per Minute 转速（每分钟）Run-out 偏转、绕转、累积距差SSCAR(Supplier CA Request) 供应商改善报告SCM: Supply chain Management 供应商管理系统Scratch 刮痕Screen Printing 网版印刷Scrubber 磨刷机、磨刷器Selective Plating 选择性电镀SEM/Scanning Electron Microscope 扫瞄式电子显微镜Semi-Conductor 半导体Shearing 剪、裁切Short 短路SIR(Surface Insulation Resistance) 表面绝缘电阻Side Wall 侧壁Sigma(Standard Deviation) 标准差Signal 讯号Silicon 矽Silk Screen 网版印刷、丝网印刷Skin Effect 集肤效应Skip Printing 漏印Slot 槽孔Smear 胶渣SMT/Surface Mount Technology 表面黏装技术Solder 焊锡Solderability 焊锡性Solder Ball 锡球Solder Bridging 锡桥Solder Bump 焊锡凸块Solder Dam 锡堤（IC脚间的防焊）Solder Levelling 喷锡、热风整平Solder Mask(S/M) 绿漆、防焊膜Solder Paste 锡膏Solder Plug 锡塞、锡柱Solder Pot 锡炉Solder Side 焊锡面Soldering Fluid/Soldering Oil 助焊液、护焊汕Solid Content 固体含量SOP(Standard Operation Procedure) 标准作业程序Spacing 间距SPC/Statistical Process Control 统计制程管制Specific Gravity SG比重Specification(Spec) 规范、规格Specimen 样品、试样Spindle 钻轴Spray Coating 喷著涂装Stencil 版膜、网版Storage condition 储存条件Stress Relief 消除应力Substrate 底材Surface Insulation Resistance(SIR) 表面绝缘电阻Surface Tenting 表面张力Surface-Mount Device 表面黏装零件Swelling Agents/Sweller 膨胀剂SWR(Special Working Request) 试产前之“特殊工作要求”TTab 接点、金手指Tape 撕胶带试验Teflon 铁氟龙Temperature Profile 温度曲线Template 模板Tensile Strength 抗拉强度Tenting 盖孔法Terminal 端子Thermal Stress 热应力Thermal Shock 热冲击Thin Copper Foil 薄铜箔Then film Technology 薄膜技术Throwing Power 分布力Tolerance 公差Touch Up 检修（简单的工具在手操作下即可进行的小规范的检修，称之T ouch Up或Rewok 有些类似）Trace 线路、导线Traceability 追溯性、可溯性Transistor 电晶体Transmission Line 传输线Twist 板翘、板扭UUL 保险业试验Underwriters Laboratories/INC Ultra Violet Curing(UV Curing) 紫外线硬化Ultrasonic Cleaning 超音波清洗Undercut/Undercutting 侧蚀Universal Tester 万用型电测机VVacuum Lamination 真空压合Vacuum Packing 真空包装Viscosity 黏滞度、黏度Vision Systems 视觉系统Visual Examination(Inspection) 目视检查Voltage 电压WWafer 晶圆Warp/Warpage 板弯Warp and Twist 板弯翘Washer 垫圈Waste Treatment 废弃处理Water Absorption 吸水性Water Break 水膜破散、水破Watermark 水印Wave Soldering 波焊Weave Exposure 织纹显露Weave Texture 织纹隐现Welding 熔接Wet Process 湿式制程Wetting Balance 沾锡、沾湿White Spot 白点Wicking effect 灯芯效应Wire Bonding 打线结合WIP(Working Piece in Process) 在制品XX Axis X轴X-Ray X光YY-Axis Y轴Yield 良品率、良率、产率ZZ-Axis X轴OtherHDI-High Density inter-connect 高密度内连接SWOT Strengths Weaknesses Opportunities ThreatsCD: Compact DiscCPU: Central Process UnitDLD: Direct Laser Drilling (CO2 Laser, YAG Laser)DVD: Digital Versatile DiscEEPROM: Electrically Erasable Programmable Read Only MemoryEMS: Electronics Manufacturing ServiceGPS: Global Positioning ServiceHDD: Hard Disk DriveHDTV: High Density TVLCD: Liquid Crystal DisplayLED: Light Emitting DiodeVCD: Video Compact DiskQuality System Requirements QS-9000(質量體系要求)Advanced Product Quality Planning and Control Plan APQP (產品質量先期策劃和控制計劃) Measurement Systems Analysis MSA(測量系統分析)Potential Failure Mode and Effects Analysis FMEA(潜在失效模式與後果分析)Production Part Approval Process PPAP (生產件批准程序)Statistical Process Control SPC (統計過程控制)IPC-A-600Classification 分级Acceptance Criteria 允收规格Applicable Documents 参考资料Dimensions And Tolerances 尺度与公差Terms And Definitions 术语及定义Workmanship 工艺水准Externally Observable Characteristics 外观特性Board Edges 板边Burrs 看头、毛刺Nonmetallic Burrs 非金属性毛头Metallic Burrs 金属毛头Nicks 缺口Haloing 白边Base Material 基材Weave Exposure 织纹显露Weave Texture 织纹隐现Exposed/Disrupted Fibers 玻织曝露/扰乱Pits and Voids 凹点与凹坑Base Material Subsurface 基材次表面Measling白点Crazing白斑Delamination/Blister分层/起泡Foreign Inclusions外来夹杂物Solder Coatings and Fused Tin Lead喷锡板或熔锡板Nonwetting拒锡（不沾锡）Dewetting缩锡Holes-Plated-Through-General镀通孔概要Nodules/Burrs镀瘤/毛头Pink Ring粉红圈Voids-Copper Plating镀铜层破洞Voids-Finished Coating完工皮膜之镀层破洞Lifted Lands-(Visual)孔环浮离（目检）Holes-Unsupported未镀孔Haloing白圈Printed Contacts板边接触金手指Surface Plating-General表面镀层通则Surface Plating-Wire Bond Pads打线承垫之表面Burrs on Edge-Board Contacts板边接点之毛头Adhesion of Overplate表面镀层之附着力Marking标记Etched Marking蚀刻标记Screened or Ink Stamped Marking纲印或盖印之标记Solder Resist(Solder Mask)防焊绿漆Coverage Over Conductors (Skip Coverage) 边线表面之覆盖性（覆盖不全、跳印）Registration to Holes (All Finishes) 对孔之套准度（各种表处理层）Registration to Other Conductive Patterns 其他防焊的对准性Ball Grid Array (Solder Resist-Defined Lands) 球脚格列体之焊垫（绿漆设限之焊垫）Ball Grid Array (Copper-Defined Lands) 球脚格列体（铜面设限之焊垫）Ball Grid Array (Solder Dam) 球脚格列体（防焊堤）Blisters/Delamination起泡/分层Adhesion(Flaking or Peeling)附著力（破片或剥落）Waves/Wrinkles/Ripples起浪/起皱/纹路Tenting(Via Holes)盖孔（导通孔、过孔）Pattern Definition-Dimensional圆形尺度特性Conductor Width and Spacing线宽与间距Conductor Width线宽Conductor Spacing导线间距External Annular Ring-Measurement孔环测量External Annular Ring-Supported Holes有孔壁支援的外孔环External Annular Ring-Unsupported Holes无孔壁支援的外孔环Flatness平坦度Internally Observable Characteristics可观察到的内在特性Dielectric Materials介质材料Laminate Voids(Outside Thermal Zone)压板空洞（或热区之外）Registration/Conductors to Holes导体与通孔之间的对准度Clearance Hole/Unsupported/to Power/Ground Planes 针对电源层或接地层具隔环之非镀通孔Delamination/Blister分层/起泡Etchback回蚀Negative Etchback反回蚀Smear Removal除胶渣Dielectric Material/Clearance/Metal Plane for Supported Holes 金属层与通孔壁之介质隔距Layer-to-Layer Spacing层与层之间距Resin Recession树脂缩陷Conductive Patterns-General导线概论Etching Characteristics蚀刻特性Print and Etch印后即蚀刻（指正片法）Surface Conductor Thickness(Foil Plus Plating)表导体厚度（铜箔加电镀铜）Foil Thickness-Internal Layers内层箔厚Plated-Through Holes-General镀通孔概论Annular Ring-Internal Layers各内层之孔环Lifted Lands-(Cross-Sections)焊环浮起（切片上所见）Foil Crack-(Internal Foil)“C”Crack内层铜箔之裂纹Foil Crack-(External Foil)镀层破裂Plating Crack-(Barrel)“E”Cra ck孔壁镀层破裂Plating Crack-(Corner)“F”Crack孔角镀层破裂Plating Nodules镀层长瘤Copper Plating Thickness-Hole Wall孔壁镀铜厚度Plating Voids镀层破洞Solder Coating Thickness (Only When Specified) 焊锡皮膜厚度（当已规定检查者）Solder Resist Thickness绿漆厚度Wicking灯芯效应（指玻织束渗入化学铜）Wicking/Clearance Holes隔离孔之渗铜Innerlayer Separation-Vertical (Axial) Microsection 内层（环）分离-垂直（纵断面）微切片Innerlayer Separation-Horizontal (Transverse) Microsection 内层（环）分离-水平（横断面）微切片Material Fill of Blind and Buried Vias盲孔与埋孔之填充材料钻孔式镀通孔Plated-Through Holes-Drilled钻孔式镀通孔Burrs毛头Nailheading钉头Plated-Through Holes-Punched冲孔式镀通孔Roughness and Nodules粗糙与镀瘤Flare喇叭口Miscellaneous其他离顶Flexible And Rigid-Flex Printed Wiring软性及软硬合板Metal Core Printed Boards金属平心电路板Type Classifications型式分类Spacing Laminated Type间距压合板Insulation Thickness/Insulated Metal Substrate已绝缘金属底材之绝缘厚度Insulation Material Fill/Laminated Type Metal Core压合型金属平心之绝缘填料Cracks in Insulation Material Fill/Laminated Type压合型绝缘填充料之裂纹Core Bond to Plated-Through Hole Wall平心层与镀通孔之间的固著Flush Printed Boards表面全平板Flushness of Surface Conductor表面导线之平坦性Cleanliness Testing清洁度试验Solderability Testing焊锡性试验Plated-Through Holes镀通孔Electrical Integrity电性之完整平行光曝光机：Collimated ExposureCollimated Exposure二次元测量仪two dimension measuring instrument,镀层厚度测试仪Plating Thickness Tester电导率测试仪：Conductometer剥离强度测试仪peel strength TesterROHS检测仪ROHS TesterLCR测试仪LCR Tester喷砂机：sandblasting machine磨板机：Scrubbing立式圆角机Corner rounding Machine开短路测试机short circuit tester碱性蚀刻机：alkalineetchingmachine剪板机: steel plate shearer高温烤箱high-temperature oven飞针测试机：Flying Probe E-Test Machine铣边机edge milling machine超声波清洗机ultrasonic cleanersDES水平线DES level自私，让我们只看见自己却容不下别人。
pcb常用的专业术语
pcb常用的专业术语PCB（Printed Circuit Board，印刷电路板）是现代电子产品中不可或缺的组成部分。
作为电子元器件的载体，PCB承载着电子元器件的布局和连接，实现了电路的功能。
在PCB设计和制造过程中，涉及到许多专业术语和概念。
接下来，让我们逐一介绍一些常用的PCB专业术语。
1. 贴片技术（SMT，Surface Mount Technology）：贴片技术是一种将表面贴装元件（Surface Mount Device，SMD）焊接至PCB上的技术。
相比传统的插件技术，贴片技术具有体积小、重量轻、可以实现自动化生产等优点。
2. 过孔（Via）：过孔是连接PCB不同层的通孔，用于导电和信号传输。
根据其结构，可分为普通过孔和盲孔、埋孔。
3. 大地层（GND Plane）：大地层是PCB中用于连接地电位的铜层或导电层。
大地层可以提供可靠的电气连接和较低的电阻，以降低电磁干扰和杂散信号。
4. 线路宽度（Trace Width）：线路宽度是指PCB上导线的宽度。
其大小直接影响着导线的电流承载能力和电阻值。
通常，线路宽度越宽，其电流承载能力越大。
5. 线距（Trace Spacing）：线距是指PCB上两个导线之间的间距。
线距的大小对于防止导线之间的电气干扰和放电有重要作用。
6. 丝印（Silk Screen）：丝印是印刷在PCB表面的文字和图形标记。
它可以用于标注元件的位置、极性、参考设计ator等信息，以及产品品牌或商标。
7. 阻焊（Solder Mask）：阻焊是一层覆盖在PCB焊盘和丝印之上的保护层。
它可以防止焊接过程中的短路和氧化，提高焊接质量和可靠性。
8. 电气孔（Test Pad）：电气孔用于进行PCB电气测试，以验证电路的正确性和可靠性。
电气孔通常位于PCB的边缘，方便测试针对测试。
9. 焊盘（Pad）：焊盘是用于连接和固定元件引脚的金属区域。
焊盘通过焊锡与元件引脚焊接在一起，实现电气和力学连接。
电路板术语
电路板术语整理5Solder Splash贱锡.Solder Spread Test散锡试验.Solder Webbing锡纲.Solder Webbing锡纲.Solder Wicking渗锡,焊锡之灯芯效应.Solderability可焊性.Soldering软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油.Solid Content固体含量,固形分.Solidus Line固相线.Spacing间距.Span跨距.Spark Over闪络.Specific Heat 比热.Specification (Spec)规范,规格.Specimen样品,试样.Spectrophotometry分光光度计检测法.Spindle主轴,钻轴.Spinning Coating自转涂布.Splay斜钻孔.Spray Coating喷着涂装.Spur底片图形边缘突出.Sputtering溅射.Squeege刮刀.Stagger Grid蹒跚格点.Stalagometer滴管式表面张力计.Stand-off Terminals直立型端子.Starvation缺胶.Static Eliminator静电消除器.Steel Rule Die(钢)刀模.Stencil版膜.Step and Repeat逐次重复曝光.Step Plating梯阶式镀层.Step Tablet阶段式曝光表.Stiffener补强条(板).Stop Off防镀膜, 阻剂.Strain变形,应变.Strand绞(指由许多股单丝集束并旋扭而成的丝束).Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失).Stress Corrosion应力腐蚀.Stress Relief消除应力.Strike预镀.Stringing拖尾.Stripline条线.Stripper剥除液(器).Substractive Process减成法.Substrate底材.Supper Solder超级焊锡.Supported Hole(金属)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面绝缘电阻.Surface Mount Device 表面粘装组件.Surface Mounting Technology (SMT)表面粘装技术.Surface Resistivity表面电阻率.Surface Speed钻针表面速度.Surface Tension表面张力.Surfactant表面润湿剂.Surge突流,突压.Swaged Lead压扁式引脚.Swelling Agents, Sweller膨松剂.Swimming 线路滑离.Synthetic Resin合成树脂. *****T*****Tab接点,金手指.Taber Abraser泰伯磨试器.Tackiness粘着性, 粘手性.Tape Automatic Bonding (TAB)卷带自动结合.Tape Casting 带状铸材.Tape Test撕胶带试验.Tape Up Master原始手贴片.Taped Components卷带式连载组件.Taper Pin Gauge锥状孔规.Tarnish污化.Tarnish 污化, 污着.Teflon铁氟龙(聚4氟乙烯).Telegraphing浮印,隐印.Temperature Profile温度曲线.Template模板.Tensile Strength抗拉强度.Tensiomenter张力计.Tenting盖孔法.Terminal端子.Terminal Clearance端子空环.Tetra-Etch氟树脂蚀粗剂.Tetrafunctional Resin四功能树脂.Thermal Coefficient of Expansion (TCE)热膨胀系数.Thermal Conductivity导热率.Thermal Cycling热循环,热震荡.Thermal Mismstch感热失谐.Thermal Relief散热式镂空.Thermal Via导热孔.Thermal Zone感热区.Thermocompression Bonding热压结合.Thermocouple热电偶.Thermode发热体.Thermode Soldering热模焊接法.Thermogravimetric Analysis, (TGA)热重分析法.Thermomechanical Analysis (TMA)热机分析法.Thermoplastic热塑性.Thermosetting热固性.Thermosonic Bonding热超音波结合.Thermount聚醯胺短纤席材.Thermo-Via导热孔.Thick Film Circuit厚膜电路.Thief辅助阳极.Thin Copper Foil薄铜箔.Thin Core薄基板.Thin Film Technology薄膜技术.Thin Small Outline Package(TSOP)薄小型绩体电路器.Thinner调薄剂.Thixotropy抗垂流性,摇变性.Three Point Bending三点压弯试验.Three-Layer Carrier三层式载体.Threshold Limit Value (TLV)极限值.Through Hole Mounting通孔插装.Through Put物流量,物料通过量.Throwing Power分布力.Tie Bar分流条.Tin Drift锡量漂飘失.Tin Immersion浸镀锡.Tin Pest锡疫(常见白色金属锡为"β锡",当温度低于13.2℃时则β锡将逐渐转变成粉末状灰色"α锡"称为"锡疫".Tin Whishers锡须.Tinning热沾焊锡.Tolerance公差.Tombstoning墓碑效应.Tooling Feature工具标示物.Topography表面地形.Torsion Strength抗扭强度.Touch Up触修,简修.Trace 线路,导线.Traceability追溯性,可溯性.Transducer转能器.Transfer Bump移用式突块.Transfer Laminatied Circuit转压式线路.Transfer Soldering移焊法.Transistor晶体管.Translucency半透性.Transmission Line传输线.Transmittance透光率.Treament, Treating含浸处理.Treeing枝状镀物,镀须.Trim修整, 精修.Trim Line裁切线.Trimming修整,修边.True Position真位.Tungsten钨Tungsten Carbide碳化钨.Turnkey System包办式系统.Turret Solder Terminal塔立式焊接端子.Twill Weave斜织法.Twist板扭.Two Layer Carrier两层式载体. *****U*****UL Symbol(UL.为Under-Writers 保俭业试验所标志. Laboratories,INC)Ultimate Tensile Strength (UTS)极限抗拉强度.Ultra High Frequency (UHF)超高频率.Ultra Violet Curing (UV Curing)紫外线硬化.Ultrasonic Bonding超音波结合.Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式传输线.Undercut, Undercutting侧蚀.Underplate底镀层.Universal Tester汛用型电测机.Unsupported Hole非镀通孔.Urea尿素.Urethane 胺基甲酸乙脂. *****V*****V acuoles焊洞.Vacuum Evaporation(or Deposition)真空蒸镀法.Vacuum Lamination 真空压合.Van Der Waals Force凡得华力.Vapor Blasting蒸汽喷砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering气相焊接.Varnish凡力水,清漆(树脂之液态单体).V-cutV型切槽.Very Large-Scale Integration(VLSI)极大绩体电路器.Via Hole 导通孔.Vickers Hardness维氏硬度.Viscosity粘滞度,粘度.Vision Systems视觉系统.Visual Examination目视检验.V oid 破洞,空洞.V olatile Content 挥发份含量.V oltage电压.V oltage Breakdown崩溃电压.V oltage Drop 电压降落.V oltage Efficiency电压效率.V oltage Plane电压层.V oltage Plane Clearance电压层的空环.V olume Resistivity体绩电阻率.V olume Resistivity体绩电阻率.V olumetric Analysis容量分析法.Vulcanization 交联,硫化. *****W*****Wafer晶圆.Waive暂准过关,暂不检查.Warp Size 浆经处理.Warp, Warpage板弯.Washer垫圈.Waste Treatment废弃处理.Water Absorption吸水性.Water Break水膜破散,水破.Water Mark水印. Watt瓦特.Watts Bath 瓦兹镀镍液.Wave Guide导波管.Wave Soldering波焊.Waviness 波纹,波度.Wear Resistance耐磨性,耐磨度.Weatherability耐候性.WeaveEposure织纹显露.Weave Texture织纹隐现.Web蹼部.。
电 路 板 术 语
电路板术语----A----A-Stage A 阶段----指胶片(Prepreg)制造过程中，其补强材料的玻纤布或棉纸，在通过胶水槽进行含浸工程时，该树脂之胶水(Varnish，也译为清漆水)，尚处于单体且被溶剂稀释的状态，称为A-Stage。
相对的当玻纤布或棉纸吸入胶水，又经热风及红外线干燥,将便树脂分子量增大为复体或寡聚物(Oligomer)，再集附于补强材上形成胶片。
此时的树脂状态称为B-Stage。
当再继续加热软化，并进一步聚合成为最后高分子树脂时，则称为C-Stage。
Abietic Acid 松脂酸----是天然松香(Rosin)的主要成份，占其重量比的34%。
在焊接的高温下，此酸能将铜面的轻微氧化物或钝化物予以清除，使得清洁铜面可与熔锡产生“接口合金共化物”(IMC)而完成焊接。
此松脂酸在常温很安定，不会腐蚀金属。
Abrasion Resistance 耐磨性----在电路板工程中，常指防焊绿漆的耐磨性。
其试验方法是以1kg重的软性砂轮，在完成绿漆的IPC-B-25样板上旋转磨刷50次，其梳型电路区不许磨破见铜(详见电路板信息杂志第54期P.70)，即为绿漆的耐磨性。
某些规范也对金手指的耐磨性有所要求。
又，Abrasive是指磨料而言，如浮石粉即是。
ABS 树脂----是由Acrylonitrile-Butadine-Styrane(丙烯腈-丁二烯-苯乙烯)所组成的三元混合树脂，其中丁二烯之橡皮部份能被铬酸所腐蚀而出现疏孔，可做为化学铜或化学镍的着落点，因而得以继续进行电镀。
电路板上许多装配的零件，即为采购ABS镀件。
Absorption 吸收，吸入----指被吸收物会进入主体的内部，是一种化学式的吸入动作。
如光化反应中的光能吸收，或板材与绿漆对溶剂的吸入等。
另有一近似词Adsorption则是指吸附而言，只附着在主体的表面，是一种物理式的亲和吸附。
Accelerated Test (Aging) 加速老化---也就是加速老化试验(Aging)。
大陆电路板术语总整理
大陸電路板術語總整理(1)一般術語printed circuit 印制電路printed wiring 印制線路printed board 印制板single sided printed board 單面印制板double sided printed board 雙面印制板multiplayer printed board 多層印制板rigid printed board 剛性印制板rigid single-sided printed board剛性單面印制板rigid double-sided printed board 剛性雙面印制板rigid multiplayer printed board剛性多層印制板flexible printed board 撓性印制板flexible single-sided printed board 撓性單面印制板flexible double-sided printed board撓性雙面印制板flexible multiplayer printed board 撓性多層印制板flex-rigid printed board 剛撓印制板flex-rigid double-sided printed board剛撓雙面印制板flex-rigid multiplayer printed board 剛撓多層印制板flush printed board 齊平印制板metal core printed board 金屬芯印制板mother board 母板conductor 導線multi-wire printed board 多重布線印制板ceramic substrate printed board 陶瓷印制板printed component 印制元件grid 綱路component side 元件面solder side 焊接面1printing 印制板conductor side導線面flush conductor 齊平導線legend 字符pattern 圖形marking 標志conductive pattern 導電圖形non-conductive pattern 非導電圖形(2)基材種類的結構——metal-clad base material 覆金屬箔基材base material 基材copper-clad laminate 覆銅箔層壓板laminate, laminated sheet 層壓板single-sided copper-clad laminate單面覆銅箔層壓板double-sided copper-clad laminate雙面覆銅箔層壓板composite laminate 復合層壓板thin laminate 薄層壓板metal core copper-clad laminate金屬芯覆銅箔層壓板pre-preg，prelim-pregnated material 預浸材料bonding sheet 黏結片flexible copper-clad dielectric film撓性覆銅箔絕緣膜adhesive coated dielectric film 塗膠黏劑絕緣膜unsupported adhesive film 無支撐膠黏劑膜laminate for additive process 加成法用層壓板mass lamination panel，semi-manufactured mutilayerprinted board panel 預制內層覆箔板copper-clad surface 銅箔面foil removal surface 去銅箔面unclad laminate surface 層壓板面base film face 基膜面lengthwise direction （層壓板）縱向crosswise direction （層壓板）橫向cut-to-size panel 切割板cold punching 冷沖原材料——conductive foil 導電箔shiny side 光面electrodeposited copper foil 電解銅箔rolled copper foil 壓延銅箔annealed copper foil 退火銅箔matte side 粗糙面treated side 處理面stain proofing 防锈處理thin copper foil 薄銅箔adhesive coated foil 塗膠銅箔reinforcing material 增強材料e-glass fiber 玻璃纖維glass cloth 玻璃布warp-wise 經向non-woven fabric 非織布weft-wise，filling-wise 緯向thread count 織物經緯密度weave structure 織物組織plain weave 平紋組織size 浸潤劑coupling agent 偶聯劑impregnating insulation paper 浸漬絕缘紙aromatic polyamide paper 塗醯胺纖維紙non-woren polyester fabric 塗酯纖維非織布machine direction 縱向cross direction 橫向breaking length斷裂長height of capillary rise 吸水高度wet strength retention 濕強度保留率whiteness，brightness 白度poly-functional epoxy resin 多功能環氧樹脂brominated epoxy resin 溴化環氧樹脂a-stage resin a階樹脂b-stage resin b階樹脂c-stage resin c階樹脂polyimide resin 聚醯亞胺樹脂bismaleimied-triazine resin，BT雙馬來醯亞胺三泰樹脂perfluorinated ethylene-propylenecopolymer film，(fep film) 聚全氟乙烯丙烯薄膜weight per epoxy equivalent wpe 環氧當量epoxy value 環氧值dicyandiamide 雙氰胺binder 黏結劑flame retardant 阻燃劑abhesive 膠黏劑curing agent 固化劑bond enhancement treatment 黏結增強處理composite metallic material 複合金屬箔carrier foil 載體箔opaquer 遮光劑cure time 固化時間foil profile 箔輪廓finished fabric 處理織物bow 弓緯miss-picks 缺緯waviness 云緯fish eye 魚眼feather length 毛圈長mark厚薄段size content 浸潤劑含量twist 捻度size residue 浸潤劑殘留量split 裂縫d-glass fiber d 玻璃纖維grey fabric 壞布woven serin 稀松織物制造——impregnation 浸漬kiss pressure 接觸壓力impregnator；treater 浸漬機gel 凝膠體doctor knife 調節刮刀pot life 適用期clad 覆箔daylight 壓板間距laminating 層壓laminating 層合；復合multi-opening press 多層壓機high-pressure moulding 高壓壓制layup 疊層low-pressure moulding 低壓壓制release agent，parting agent 脫模劑release film 防黏膜press platen 壓板pressure pad 壓墊材料degassing 放氣laminate moulding plate 層壓模板moulding cycle 壓制周期post cure 后固化plate finish 原始光潔面matt finish 失光光潔面internal identification mark 內部識別標志(3) 設計schematic diagram 原理圖logic diagram 編輯圖printed wiring layout 印制總圖master drawing 布設總圖artwork master 照相底圖engineering drawing 工程圖printed wiring assembly drawing 印制線路組裝圖component density 元件密度hole density 孔密度blind via 盲孔packaging density 組裝密度via 導通孔interlayer connection 表面間連接plated through hole 鍍覆孔buried via 埋孔access hole 餘隙孔landless hole無連接盤孔component hole 元件孔mounting hole 安裝孔hole pattern 孔圖supported hole 支撐孔land pad 連接盤unsupported hole 非支撐孔clearance hole 隔離孔hole location 孔位dimensioned hole 注尺寸孔offset land 偏置連接盤nonfunctional land 非功能連接盤land pattern 連接盤圖形anchoring spur 盤趾annular ring 孔環conductor layer 導線層conductor layer no.1 第一導線層internal layer 內層external layer 外層layer -to-layer spacing 層間距signal plane 信號層span 跨距ground 接地ground plane 接地層ground plane clearance 接地層隔離voltage plane 電源層pitch 節距voltage plane clearance 電源層隔離heat-sink plane 散熱層heat shield 熱隔離edge spacing 邊距primary side 主面secondary side 輔面supporting plane 支撐面basic dimension 基準尺寸center to center spacing 中心距design spacing of conductors 導線設計間距design width of conductors 導線設計寬度conductor spacing 導線間距edge-board connector 板邊連接器right-angle edge connector 直角板邊連接器connector area 連接器區edge board contact 板邊接觸件printed contact 印制接觸件contact area 接觸面積component lead 元件引線component pin 元件引腳nonfunctional interfacial connection 非功能表面間連接jumper wire 跨度線reference edge 基準邊haywire 附加連線bus bar 匯流條crosshatching 開窗口routing 表線board thickness 印制板厚度datum reference 參考基準net list 綱表reference dimension 參考尺寸corner mark 角標trim line 外形線probe point 探測點keying slot 鍵槽polarizing slot 偏置定位槽register mark 對準標記micro-strip 微帶線transmission line 傳輸線layer 層characteristic impedance 特性阻抗strip-line 帶狀線crosstalk 串擾capacitive coupling 電容耦合continuity連通性digitizing 數字化current-carrying capacity 載流量minimum electrical spacing 最小電氣間距electromagnetic shielding 電磁屏蔽from-to-list 接線表placement 布局printed board cad 印制板計算機輔助設計design rule checking 設計規則檢查(4) 制造通用術語——manufacturing drawing 加工圖subtractive process 減成法additive process 加成法semi-additive process 半加成法tenting 掩蔽法solder mask on bare copper （SMOBC）裸銅覆阻劑工藝blank 壞料panel 在制板multiple printed panel 拼板multiple pattern 拼圖metallization 金屬化reworking 返工tuching up 修整repairing修復照相底版制作——original production master 照相原版production master 生產底版photo-tool，artwork 照相底版single-image production master 單板底版multiple –image production master 拼板底版photographic reduction dimension照相縮小尺寸photographic film照相底片silver film 銀藍底片diazo film重氮底片positive 正像positive pattern正像圖形negative 負像negative pattern 負像圖形photo plotting 光繪圖step-and-repeat步進重復emulsion side 乳膠面right reading正向definition清晰度resolution 分辨率density 密度（光密度）印制導線制作技術——photo resist 光致抗蝕劑dry film photo-resist，photopolymer film resist 干膜抗蝕劑liquid photo-resist 液體抗蝕劑positive-acting resist正性抗蝕劑negative-acting resist負性抗蝕劑plating resist耐電鍍抗蝕劑plated resist抗蝕鍍層permanent resist永久性保護層solder resist 阻焊劑solder masking 阻焊印料dry film solder mask 阻焊干膜liquid photosensitive solder mask液體光致阻焊劑step scale，gary scale 光梯尺，光密度尺exposure 曝光imaging 成像screen printing 綱印stencil 綱版thixotropic 熱變性outgroth 鍍層增寬etching 蝕刻etchant 蝕刻劑etching indicator 蝕刻指示圖bright dip 浸亮undercut 側蝕undercut in process 加工中側蝕etch factor 蝕刻系數overhang 鍍層突沿conductor width 導線寬度sliver 鍍層conductor base wise 導線底寬conductor base spacing 導線底距differential etching 差分蝕刻法鍍覆及其前后處理——hole cleaning 洗孔desmear 去鑽污etchback 凹蝕etchback shadowing 凹蝕死角negative etchback 負凹蝕pink ring 粉紅環wicking 芯吸作用electrolytic cleaning 電解清洗micro etch 微蝕刻activating 活化plating 鍍覆plating bath 鍍浴brightener 光亮劑wetting agent 潤濕劑leveling agent 整平劑strike 閃鍍throwing power 分散能力fusing 熱浴pattern plating 圖形電鍍bleeding 滲出panel plating 整板電鍍whiskers 晶鬚plating up 電鍍加厚overplating 外鍍層aspect ratio 板厚／孔徑比plating bar 工藝導線fusing fluid 熱熔液plating thief 分流陰極burned plating 燒焦鍍層solder levelling 焊料整平hot air levelling 熱風整平多層板壓制﹐機械加工——multiplayer lay up 多層疊層multiplayer laminating 多層壓制bonding layer 黏結層foil burr 毛刺adhesing promoting 黏合力增處理black oxidation 黑化deburr 去毛刺punching 沖切drilling 鑽孔chip load 切削量feed rate 進給速度feed rotation rate 進給轉給比peck drilling 啄鑽step drilling 分步鑽inspection overlay 覆蓋檢驗版resin smear 樹脂鑽污tooling hole 定位孔polarization 偏置定位chamfer 倒角tooling feature 定位特徵location mark 定位標記location notch 定位缺口location slot 定位槽location edge 定位邊(5)檢測通用術語——acceptance inspection 驗收檢驗production board 成品板test board 測試板test pattern 測試圖形composite test pattern 綜合測試圖形quality conformance test circuit質量一致性檢驗電路test coupon 附連測試板visual examination 目檢外觀和尺寸——blister 起泡﹑氣泡blow hole氣孔bulge 凸起delamination 分層circumferential separation 環形斷裂cracking 裂縫crack of foil 金屬箔裂縫crack of plating 鍍層裂縫crazing 微裂紋crazing conformal coating 敷形塗層微裂紋dent 凹痕﹔壓痕fiber exposure 露纖維extraneous copper 殘餘銅wrinkle 皺褶weave exposure 露織物haloing 暈圈weave texture 顯布紋hole breakout 破壞hole void 孔壁空洞inclusion 夾雜物lifted land 連接盤起翹measling 白斑nail heading 釘頭nick 缺口nodule 結瘤pin hole 針孔pit 麻點resin recession 樹脂凹縮scratch 劃痕void 空洞bump 凸瘤flare 錐口孔splay 斜孔conductor thickness 導線厚度minimum annular ring 最小環寬registration 重合度base material thickness 基材厚度metal-clad laminate thickness 覆箔板厚度resin-starved area 缺膠區resin-rich area 富膠區gelation particle 膠化顆粒treatment transter 處理物轉移total board thickness 印制板總厚度rectangularity 垂直度電性能——contact resistance 接觸電阻surface resistance 表面電阻surface resistivity 表面電阻率volume resistance 體積電阻volume resistivity 體積電阻率dielectric constant 介電常數dielectric dissipation factor 損耗因數dielectric strength 介電強度dielectric breakdown 介電擊穿comparative tracking index 相比起痕指數arc resistance 耐電弧度dielectric withstanding voltage 耐電壓非電性能——bond strength 黏合強度camber 彎度pull of strength 拉脫強度twist 扭曲pull-out strength 拉出強度bow 弓曲pael strength 剝離強度coefficient of thermal expansion（CTE）熱膨脹系數dimensional stability 尺寸穩定性solderability 可焊性nonwetring 不潤濕wetting 焊料潤濕dewetting 半潤濕ionizable（ionic）contaminat 離子污染microsectiong 顯微剖切plated-through hole structure test 覆孔結構試驗solder float test 浮焊試驗machinability 機械加工性heat resistance 耐熱性elongation伸長率flexural strength彎曲強度tensile strength 拉伸強度tensile modules of elasticity 拉伸彈性模量shear strengh 剪切強度tear stangth 撕列強度flexural fatgue 彎曲疲勞cold flow 冷流flammability可燃性flaming combustion 有焰燃烷glowing combustion 灼熱燃燒self extinguishing 自熄性oxygen index（OI）氧指數glass transition temperature 玻璃化溫度fungus resistance 防霉性chemical resistance耐化學性預浸材料系塗膠薄膜——volatile content 揮發物含量resin content樹脂含量gel time 膠化時間tack time 黏性時間cured thickness 預浸材料固化厚度differential scanning calorimeter 差示掃描量熱法resin flow 樹脂流動度thermal mechanical analysis 熱機分析(6) 裝聯printed board assembly 印制板組裝件packaging and interconnection assmbly 裝聯件through-hole mounting 通孔安裝packaging and interconnection structure 裝聯構件flat package 扁平封裝dual-in-line package（DIP）雙列直插式封裝surface-mount technology（SMT）表面安裝技術chip-on-board（COB）芯片直裝tape automated bonding（TAB）帶載自動安裝automatic placement systems (machine) 貼片機，捨放機contact angle 接觸角mixed component mounting technology 混合安裝技術solder wicking 芯帶吸焊taped components 帶載式元件surface-mount component 表面安裝元件chip carrier 芯片載體keying 定位鍵key 鍵bellows contact 扁簧式接觸件bifurcated contact 開槽接觸件press-fit contact 壓配合接觸件keying（V）鍵控定位axial lead 軸向引線swaged lead 擠壓引線dip soldering 浸焊lead extension 引線露出端lead projection引線伸出長度stress relief 消除應力clinched-wire through connection 穿線彎連mechanical warp 機械纏繞solderless warp繞接drag soldering 拖焊step soldering 分步焊接reflow soldering 重熔焊,再流焊infrared reflow soldering（IRS）紅外線熔焊vapor phase reflow soldering（VPS）汽相重熔焊solder 焊料solder fillet 焊縫dross 焊渣solder connection 焊點solder paste 焊膏outgassing 排氣pulse vacuum tin removal 真空吸錫法heat sink tool散熱工具flux 焊劑cold solder connection 冷焊點（虛焊點）disturbed solder connection 移位焊點Writed By Owen.W And Drgon.ZH （End）。
PCB专业词汇
PCB专业词汇PCB，即印刷电路板（Printed Circuit Board），是现代电子设备中不可缺少的一部分。
PCB由电气连接、信号传输、导线分布、电源供应等多个重要元件组成，为电子产品提供了可靠的基础支持。
在PCB工程设计和生产过程中，涉及到众多的专业词汇和术语，下面是一些常见的PCB专业词汇。
1. 线路(Trace) ：在电路板上绘制的导线，是电路板中最基本的元件。
2. 焊盘(Pad) ：电子元件连接至电路板上的部分，用于与焊料连接，以确保良好连接和固定。
3. 电路板层(PCB Layer) ：电路板的不同层，用于提供电路连接的支持和连接4. 焊接(Soldering) ：把焊料涂于焊盘上，使焊盘与电子元件连接，从而实现电路连接和固定。
5. 接地(Ground) ：电路板上用来消除干扰和防止静电等问题的虚接线，是一条“安全阀”。
6. 电源(Power) ：为PCB提供能量，使电子元件能够正常运行的部分。
7. 线路宽度(Trace Width) ：绘制线路的宽度，它是电路板设计和制造中的一个重要参数。
8. 间距(Spacing) ：PCB上电子元件之间的距离，影响电路板的紧凑程度和稳定性。
9. 材料(Materials) ：作为电路板构建和制造的基础材料，包括玻璃纤维、铜等常用材料。
10. 涂覆(Solder Mask) ：在PCB表面施加涂料，以保护电子元件和追踪线免受外部环境的影响以及缩短信号传输时间。
11. 丝印(Silk Screen) ：以文字或图形形式在PCB表面打印标记和标识的一种方法。
12. 经孔(Via) ：在电路板层之间进行电气联通的洞孔。
13. 环形电缆(Annular Ring) ：表示设备，尤其在PCB外围情况下元件的焊盘和电气测量的间距。
14. 层压板（Lamination) ：PCB层被压合为一个完整的电路板。
15. SMT (Surface mount technology)：一种电子元件表面焊接技术，大大提高了电子产品的制造效率和质量。
电路板(PCB)术语与线路板简字词典
宽 Grid 环 VLSI
为 100 mil 50 mil
积 25 mil 落
路
(IC) 则
梁 绝 为了 胀 缩 环(Clearance Ring 图 环) GND Vcc 了 若 理不 话 将 应 现 环(Clearance Ring) 内 环(Annular Ring) 不应该 过 过 了 39 Ground plane(or Earth Plane) 层 层 内层 层 层线路层 层 零 路 (Shielding) 热(Heatsinking) 传 例 ( )观 时 记 为 为识别) 顺 数 该 为 压层(Power Plane) 40 Hole Density 数 度 单 积 钻 数 41 Indexing Hole 路 行钻 当 转 称为 Indexing Hole Indexing Edge Slot 42 Inspection Overlay 检 线路阴 ( Diazo 绿 蓝 ) 试产 (First Article) 检 43 Key 钥 键 路 金 区 开 为了 阴 时不 弄 计 称为 Keying Slot 弹 开 44 Land 环 垫 ( ) 垫 SMT 传 零 时 层 环, (Terminal) 锥 来 行, Land 译为 环 垫 若译 兰岛 45 Landless Hole 环 组 许 线路 零 垫 对 不 层 线 仅 为层 导 导 (Via Hole)时 则
路 环 1985 年 内层 59 Panel
Board Panel Size 60 Pattern 图 路 导 图 导 图 当 对 蓝图 线路图 称为 Pattern 61 Photographic Film 路 线路图 载 称 (Art Work) Mylar 软 图 质 (Silver halid) (Diazo) 挡 线 挡 550nm 550nm 对 不 区 红 便 了 62 Photoplotter Plotter 绘图 单 传 状 数 脑辅 计 PCB 计 将 环 垫 线 资料 脑 Gerber File 纳 内 路 产 利 CAM 绘图 Photoplotter 现 律 雷 为绘图 为 (Flat Bed) 内圆 (Inner drum) 圆 (Outer Drum) 单独区 不 现 PCB
PCB电路板术语-特殊制法、制程
14、Electrolytic Cleaning 电解清洗
将待清洗的金属对象，挂在清洗槽液中(含清洁剂及表面湿润剂)的阴极或阳极上，在施加外电流中，可在阳极上产生氧气，在阴极上产生氢气。在利用槽液的清洁本性、气泡的鼓动，及掀起作用下，可使对象表面达到除污清洗的目的，称为电解清洗。在一般金属电镀流程中用途极广，甚至还可采用阴阳极交替的方式(Polarity Revesserse；P. R.)，非常方便及有效。
13、Dummy，Dummying 假镀片，假镀
各种电镀槽液在一段时间的操作后，都要进行活性炭处理以除去有机污染，同时也要加挂假镀片，以很低的电流密度对金属杂质加以析镀。这种假镀片通常是用大面的不锈钢片，按每吋宽的划分多格后，再以 60 度方向多次往复弯折成波浪型，刻意造成明显的高低电流区，来"吸镀"槽液中的金属杂质。这种假镀片平时也可用做镀液的维护工具。一般装饰性的光泽镀镍，必须时时进行这种维护性的假镀工作。
早期的焦磷铜的镀层中，常因有机物的累积，而造成其片状结晶铜层中产生局部黑色微薄的裂面，其原因是由于共同沉积的碳原子集中所致。从微切片的画面中可清楚看到弧形的黑线，称之为"断层"。
18、中所产生的固态粒子而加装的过滤设备，称之为过滤器。此字有时也指光学放大镜，特殊效果的滤光镜片而言。
15、Electrolytic Tough Pitch 电解铜
为铜材的一种品级，是将"转炉"中所治炼得的粗铜(即泡铜)，另挂在硫酸铜槽液中当成阳极，再以电解方式从阴极上得较纯的铜，即成为这种ETP电解铜(含氧0.025~0.05％)。若另将这种 ETP 铜放在还原性环境中再行冶炼，即可成为更好的"无氧铜"或"磷铜"，可做为电镀铜槽液中的阳极。
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A Assembly--裝配.組裝.構裝A-stage -- A階段ATE--自動電測設備Abietic Acid--松脂酸Autoclave--壓力鍋Abrasion Resistance--耐磨性Axial-lead--軸心引腳ABS--樹脂Azeotrope--共沸混合液Absorption--吸收,吸入abrasives--磨料,刷料abcceptable quality level(AQL)--允收品質水準Accelerated Test(Aging)加速試驗,加速老化Acceleration--速化反應AC impedance--交流阻抗Accelerator--加速劑,速化劑acoustic microscope(AM)-- 感音成像顯微鏡Acceptability,Acceptance--允收性,允收active carbon--活性炭Access Hole --露出孔(穿露孔,露底孔)aerosol -- 噴霧劑,氣溶膠,氣懸體Accuracy--準確度aluminium nitride(AIN)--氮化鋁Acid Number(Acid Value)--酸值amorphous--無定形,非晶形Acrylic--壓克力analog circuit/analog signal--類比電路/類比訊號anisotropic--異向的,單向的Actinic Light(Intensity,Radiation)--有效Activation--活化anti-foaming agent--消泡劑Activator--活化劑apertures--開口,鋼版開口Active parts(Devices)--主動零件aramid fiber--聚硫胺纖維Acutance--解像銳利度attenuation--訊號衰減Addition Agent--添加劑BAdditive Process--加成法back light (back lighting)--背光法Adhesion--附著力back taper--反錐斜角Adhesive--膠類或接著劑back up--墊板Admittance--導納backpanels, backplanes--支撐板Aging--老化bandability--彎曲性,彎曲能力Adhesion Promotor--附著力促進劑backing agent--護岸劑Air Inclusion--氣泡夾雜bare chip assembly--祼體晶片組裝Air Knife--風刀barrel--孔壁,滾鍍Algorithm--演算法base material--基材Aliphatic Solvent--脂肪族溶劑basic grid--基本方格Ambient Tamp--環境溫度batch--批Amp-Hour--安培小時baume--波美度Anchoring Spurs--著力爪beam lead--光芒式的平行密集弔腳Angle of Attack--攻角bed-of-natil testing--針床測試Angle of Contack--接觸角bellows contact--彈片式接觸Anion--陽向游子(陰離子)beta ray backscatter--貝他射線反彈散射Anneal--軔化bevelling--切斜邊Annular Ring--孔環bias--斜張網布,斜織法Anode--陽極binder--黏結劑Anode Sludge--陽極泥bits--頭Anodizing--陽極化black oxide--黑氧化層ANSI--美國標準協會blanking--沖空斷開Anti-Pit Agent--抗凹劑bleach--漂洗AOI--自動光學檢驗bleeding--溢流AQL--品質允收水準bling via hole--盲導孔Arc Resistance--耐電弧性blister--局部性分層或起泡Array--排列,陣列block diagram--電路系統塊圖Artwork--底片blockout--封網ASIC--特定用途的積體電路器blotting--乾印Aspect Ratio--緃橫比blotting paper--吸水紙blue plaque--藍紋carrier--載體blow hole--吹孔cartridge--濾芯bomb sight--彈標castallation--堡型積體電路器bond strength--結合強度catalyzed board,catalyzed substrate/material催bondability--結合性catalyzing--催化bonding layer--結合層,接著層cathode--陰極bonding sheet(layer)--接合片,接著層caul plate--隔板bonding wire--結合線cavitation--空泡化,半真空bow, bowing--板彎center-to-center spacing--中心間距braid--編線ceramics--陶瓷brazing--硬焊cermet--陶金粉break-away panel--可斷開板certificate--證明書break point --出像點,顯像點CFC--氟氯碳化物breakdown voltlage--崩潰電壓chamfer--倒角break out--破出characteristic impedance--特性阻抗bridging--搭橋,橋接chase--網框bright-dip--光澤浸漬處理check list--檢查清單brightener--光澤劑chelate--螫合brush plating--刷鍍chemical milling--化學研磨build-up--增厚,堆積chemical resistance--抗化性bulge--鼓起,凸出chemisorption--化學吸附bump--突塊chip--晶粒.晶片.片狀buoyancy--浮力chip on board--晶片黏著板buried via hole--埋導孔chisel--鑿刄burin-in--高溫加速老化試驗circumferential separation--環狀斷孔burning--燒焦clad/cladding--披覆burr--毛頭clean room--無塵室.潔淨室bus bar--滙電桿cleanliness--清潔度butter coat--外表樹脂層claearance--餘地.餘隙.餘環clinched lead terminal--緊箝式引腳balanced transmission lines--平衡式傳輸線ball grid array--球腳陣列(封裝)clinched -wire through connection--通孔彎鷥連接bi-level stencil--雙階式鋼版clip terminal--繞線端接blur edge(circle)模糊邊帶,模糊邊圈co-firing--共燒brown oxide--棕氧化coat,coating--皮膜,表層build up process--增層法製程coaxial cable--同軸纜線chip joint--晶片焊接coefficient of thermal expansion--熱膨脹係數C cold flow--冷流cable--電纜cold solder joint--冷焊點CAD--電腦輔助設計 collimated light--平行光calendered fabric--軋平式網布 colloid--膠體cap lamination--帽式壓合法columnar structure--柱狀組織capacitance--電容comb pattern--梳型電路capacitive coupling--電容耦合complex ion--錯離子caillary action--毛細作用component hole--零件孔carbide--碳化物component orientation--零件方向carbon arc lamp--硸弧燈component side--組件面carbon treatment, active--沽性炭處理composites,(CEM-1,CEM-3)--複合板材card--卡板conditioning--整孔card cages/card racks--電路板構裝箱conductance--導電carlson pin-- 卡氏定位梢conductive salt--導電鹽conductivity--導電度deburring --去毛頭conductor spacing--導體間距declination angle--斜射角conformal coating--貼護層.護形definition--邊緣逼真度conformity--吻合性,服貼性degradation--劣化connector--連接器degrasing--脫脂contact angle--接觸角deionized water--去離子水contact area--接觸區delamination--分層contact resistance--接觸電阻dendritic growth--枝狀生長continuity--連通性denier--丹尼爾contract service--協力廠,分包商densitomer--透光度計conversion coating--轉化皮嫫dent--凹陷coplanarity--共面性deposition--皮膜處理copolymer--共聚物desiccator--乾燥器copper foil--銅箔.銅皮desmearing--除膠渣copper mirror test--銅鏡試験desoldering--解焊copper paste--銅層developer--顯像液,顯像機copper paste--銅膏developing--顯像corner crack--通孔斷角deviation--偏差corner mark--板角標記device--電子元件counterboring--方型擴孔,埋頭孔dewetting--縮锡countersinking--錐型擴孔,喇叭孔diazo film--偶氮棕片coupling agent--偶合劑dichromate--重鉻酸鹽coupon,test coupon--板邊試樣dicyandiamide(dicy)雙氰胺coverlay/covercoat--表護層.保護層die--沖模,鑄模crack--裂痕diebonding--晶粒接著crazing--白斑die stamping--沖壓crease--皺褶dielectric breakdown voltage--介質崩潰creep--潛變dielectric constant--介質常數crossection area--截面積dielectric strength--介質強度crosshatching--十字交叉區differential scanning calorimetry(DSC)微差掃瞄crosslinking,crosslinkage--交聯,架橋diffusion layre--擴散層crosstalk--雜訊.串訊digitizing--數位化cure--硬化dihedral angle--雙反斜角current density--電流密度dimensional stability--尺度安定性curtain coating --濂塗法diode--二極體current-carrying capability--載流能力DIP(dual inline package)--雙排腳封裝體cation--陰向游子,陽離子dip coating--浸塗法chip interconnection--晶片互連dip soldering--浸焊法chip on glass--晶玻接裝dipole--偶極,雙極chlorinated solvent--含氯溶劑,氯化溶劑direct emulsion--直接乳膠direct/indirect stencil---直間版膜condensation soldering--凝熱焊接,液化放熱焊接controlled depth drilling--定深鑽孔direct plating--直接電鍍,直接鍍板copper-invar-copper(CIC)--綜合夾心板discrete compenent--散裝零件core material--內層板材,核材dish down--碟型下陷crossover--越交,搭交dispersant--分散劑crosshatch testing--十字割痕試驗disspation factor--散逸因子crystalline melting point--晶體溶點dog ear--狗耳D doping--摻雜datum reference--基準參考double layre--電雙層daughter board--子板double treated foif--雙面處理銅箔drag in/drag out--帶進/帶出entrapment--夾雜物drag soldering--拖焊entry material--蓋板drawbringing--吊橋效應epoxy resin--環氧樹脂drilled blank--已鑽孔的裸板etchant--蝕刻劑.蝕刻液drill facet--鑽尖切削面etchback--回蝕drill pointer--鑽針重磨機etch factor--蝕刻因子.蝕刻函數dross --浮渣etching indicator--蝕刻指標drum side --銅箔光面etching resist--抗蝕阻劑dry film--乾膜eutetic composition--共融組成dual wave soldering--雙波焊接exposure--曝光dutility--展性eyelet--鉚眼cummy,dummying--假鍍片,假鍍E-Beam(electron beam)--電子束dummy land--假焊墊electroforming--電鑄durometer--橡膠硬度計emulsion side--藥膜面daisy chained design--菊瓣環設計encroachment--沾污,侵犯debris --碎屑,殘材entek--有機護銅處理(指裸銅板)dicing--晶片分割exotherm--放熱(曲線)die attach--晶粒安裝Ffabric--網布discrete wiring board--散線電路板,複線板disturbed joint--受擾焊點face bonding--反面朝下之結合doctor blade--修平刀,刮平刀failure--故障,損壞drift--漂移farad--法拉dynamic flex(FPC)--動態軟板farady--法拉第一DYCOstrate--電漿蝕孔增層法fatique strength--抗疲勞強度E fault--缺陷.瑕疵eddy current--渦電流 fault plane--斷層面edge-board connector--板邊(金手指)承接器feed throught hole--導通孔edge-board contact--板邊金手指feeder--進料器.送料器edge-dip solderability test--板邊焊錫性fiber exposure--玻纖顯露edge spacing--板邊空地fiducial mark--基準記號EDTA--乙二胺四醋酸filament--纖絲effluent--排放物fill--緯向elastomer--彈性體filler--填充料electric strength--(耐)電性強度fillet--內圓填角electrodeposition--電鍍film--底片electro-deposited photoresist--電著光阻filter--過濾器.濾光鏡片electro-migration--電遷移fine line--細線electro-phoresis--電泳動,電滲fineness--純度.成色.粒度electro-tinning--鍍錫(老式說法)新式-tin finger--手指(板邊連續排列接點) electro-winning--電解治煉finishing--終飾.終修electroless-deposition--無電鍍first article--首產品electrolytic cleaning--電解清洗first pass-yield--初檢良品率electrolytic tough pitch--電解銅 fixture--夾具elongation--延伸性,延伸率flair--第一面外緣變形.刄角變形embossing--凸出性壓花flame resistant--耐燃性EMF--電動勢(electromotive force)flammability rate--燃性等級EMI--電磁干擾(electromagnetic interfere flare--扇形崩口emulsion--乳化flash platin--閃鍍encapsulatiog-- 囊封.膠囊flashover--閃絡end cap--封頭flat cable--扁平封裝(之零件) flexible printed circuit, fpc--軟板golden board--測試用標準板flexural failure--撓曲損壞grain size--結晶粒度flexural strength--抗撓強度grid--標準格flocculation--絮凝,凝聚ground plane(earth plane)--接地層flood stroke print--覆墨衝程印刷ground plane clearnce--接地空環flow soldering--流焊gull wing lead--鷗翼引腳fluorescence--螢光grass leak--大漏flurocarbon resin--碳氟樹脂guide pin--導針flush conductor--嵌入式線路,貼平式導體gallium arsenide(GaAs)--砷化鎵flute--退屑槽galvanic corrosion--賈凡尼式腐蝕flux--助焊劑gate array--閘極陣列,閘列foil burr--銅箔毛邊glaze--釉面,釉料foil lamination--銅箔壓板法glob top--圓頂封裝體foot --殘足glycol(ethylene glycol)--乙二醇foot print(land pattern)腳墊Hforeign material--外來物,異物half angle--半角form-to-list--佈線說明清單halide--卥化物free radical--自由基haloing--白圈.白邊frequency--頻率halon--海龍fully-additive process--全加成法hard anodizing--硬陽極化fungus resistance--抗霉性hard chrome plating--鍍硬銘fused coating--熔錫層hard soldering--硬焊fusing--熔合hardener--硬化劑(curing agent)hardness--硬度fan out wiring/fan in wiring --扇出佈線/扇入佈線film adhesive--接著膜,黏合膜haring-blum cell--海因槽finite element method--有限要素分析法harness--電纜組合fine pitch--密腳距,密線距,密墊距hay wire--跳線flame point--自燃點heat cleaning--燒潔flatness--平坦度heat sink plane--散熱層flexural module--彎曲模數,抗撓性模數heatsink tool--散熱工具flip chip--覆晶,扣晶hertz(Hz)--赫flush point--閃火點hi-rel--高可靠度(High potential test )four point twisting--四點扭曲法hit--擊freeboard--乾舷holding time--停置時間frit--玻璃熔料hole breakout--孔位破出fusing fluid--助熔液hole counter--數孔機G hole density--孔數密度gage,gauge--量規hole location--孔位galvanic series--費凡尼次序hole pull stength--孔壁強度galvanizing--鍍鋅hole void--破洞GAP--第一面分離,長刄斷開hook--切削刄緣外凸gel time--膠化時間hot air levelling--噴錫gelation particle--膠凝點hot bar(reflow)soldering--熱把焊接gerber date, gerber file--格博檔案hot gas soldering--熱風手焊ghost image--陰影HTE(high temperature elongation)-- 高溫延伸性gilding--鍍釒hul cell--哈氏槽glass fiber--玻纖hybrid integrated circuit--混成電路hydraulic bulge test--液壓鼓起試驗glass fiber protrusion/gouging ,groove玻glass transition temperature,Tg--玻璃態hydrogen embrittlement--氫脆gloube test--球狀測試法hydrogen overvoltage--氫超電壓，氫過電壓hydrolysis--水解junction--接(合)面,接頭hydrophilic--親水性Khygroscopic--吸濕性kapton--聚亞硫胺軟材hypersorption--超吸附karat--克拉,開halation--環暈kerf--切形,裁截heat dissipation--散熱kevlar--聚硫胺纖維key--鑰槽,電鍵heat distortion point(temp.)--熱變形點(溫度)heat sealing--熱封key board--鍵盤,鍵盤板heat transfer paste--導熱膏,傳熱膏kiss pressure--吻壓.低壓knoop hardness--努普硬度high efficiency particulate air filter(高效空氣塵粒過濾機I kovar--科伐合金I.C.Socket--積體電路器插座kraft paper--牛皮紙icicle--錫尖kaui-butanol value--考立丁醇值簡稱K.B.值illuminance--照度known good die(KGD)已知的良好晶片image transfer--影像轉移，圖像轉移Limmersion plating--侵鍍laminar flow--平流impedance--阻抗，特性阻抗laminar structure--片狀結構impedance match--阻抗匹配laminate void--板材空洞in0circuit testing--組裝板電測lamination void--壓合空泂inclusion--異物.夾雜物laminate--基板,積層板indexing hole --基準孔.參考孔laminator--壓膜機inductance(L)電感land --孔環焊墊.表面(方型)焊墊infrared(IR)--紅外線landless hole--無環通孔input/output--輸入/輸出laser direct imaging (LDI)--雷射直接成像insert.insertion--插接.插裝laser maching--雷射加工法inspection overlay--套檢底片laser photogenerator/photoplotter(LPG)--雷射曝insulation resistance--絕緣電阻lay back--刄角磨損integrated circuit(IC)--積體電路器lay out--佈線.佈局interconnection--互連lay up--疊合interface--介面layer to layer spacing--層間距離intermatallic compound(IMC)--介面合金共leaching--焊散.漂出.溶出internal stress--內應力lead frame--腳架lead--引腳.接腳interstitial via-hole(IVH)--局部層間導通invar--殷鋼legend--文字標記.符號ion exchange resins--離子交換樹脂leveling--整平lifted land--孔環(焊墊)浮起ionizable(Ionic)contaimination--離子性污ionization--游離,電離ligand--錯離子附屬體light integrator--光能累積器.光積分器ionization volatge(corona level)--電離化IPC(Instiute of printed circuits)--美國light emitting diodes (LED)--發光二極體impregnate--含浸light intensity--光強度interposer--互速導電物limiting current density--極限電流密度ion migration--離子遷移liquid crystal display(LCD)--液晶顯示器isolation--隔離性,隔絕性liquid dielectrics--液態介質J liquid photoimagible solder mask (LPSM)--液態感J-Lead--J型接腳logic circuit--邏輯電路JEDEC--聯合電子元件工程委員會lot size--批量job shop--專業工廠,職業工廠luminance--發光強度,耀度joule--焦耳lyophilic--親水性膠體jumper wire--跳線lamda wave--延伸平波just-in-time(JIT)--適時供應,及時出現laser soldering--雷射焊接法lead pitch--腳距multi-chip-module(MCM)--多晶片斷(芯片)leakage current--漏電電流multiwiring board/discret wiring board--複線板local area network--區域性網路major weave direction--主要織向logic--邏輯mean time to failure--故障前可用之平均時數loss tangent--損失正切micelle--微胞M microstrip line--微條線,微帶線macro-throwing power--巨觀分佈力microwave--微波major defect--嚴重缺點,主要缺點micro wire board--微封線(漆包線)板margin--刄帶.脈筋minor weave direction--次要織向marking--標記mole--摩爾,克分子,克原子mask --阻劑mold release--腳模劑,離型劑mass finishing--大量整面.大量拋光moulded circuit--模造立體電路板mass lamination--大型壓板(層壓)mounting hole--組裝孔,機裝孔mass transport--質量輸送Nmaster drawing--主圖nail head--釘頭mat--蓆N.C--數值控制(Numerically controlled/Numerical matte side--毛面near IR(Infra-Red)--近紅外線measling--白點negative--負片.鑽尖第一面外緣變窄mechanical stretcher--機械式張網機negative-acting resist--負性作用之阻劑,負型阻劑mechanical warp--機械性纏繞negative etch -back--反回蝕mechanism--機理negative stencil--負性感光膜membrane switch--薄膜開關network--網狀元件meniscograph test--弧面狀沾錫試驗newton(N)--牛頓 (1N/cm2=129 g/cm2)meniscus--彎月面,上凹面newton ring--牛頓環mercury vaper lamp--汞氣燈newtonian liquid--牛頓流體mesh count--網目數nick--缺口metal halide lamp--金屬卥素燈noble metal paste--貴金屬印膏metallized fabric--金屬化的網布node--節點metallization--金屬化nodule--瘤micro-electronios--微電子nomencleature--標示文字符號microetching--微蝕nominal cured thickness--標示厚度microsectioning--微切片法non0circular land--非圓形孔環焊墊microstrip--微條non-flammable--非燃性microthrowing power--微分佈力non-wetting--不沾錫migration--遷移normal distribution--常態分配,常態分佈migration rate--遷移率novolac--酯醛樹脂mil--英絲(千分之一英吋0.001 in)nucleation,nucleating--核化minimum annular ring--孔環下限numerical control--數值控制,數控nylon--耐龍.尼龍minimum electrical spacing--電性間距下限misregistration--對不準,對不準度N-Methyl phyrrolidine(NMP)--N甲基四氫吡咯normal concentration(strength)--標準濃度,當量濃mixed componmt mounting technology--混合modem--調變.解調器.數據機Omodification--修改.改質occlusion--吸藏module--模組off-contact--架空modulus of elasticity--彈性係數offset--第一面大小不均moisture and insulation resistancetest-OFHC(oxygen free high conductivity)--無monofilament--單絲ohm--歐姆mother board --主機板.主構板.母板OLB(outer lead bond)--外引腳結合mounting hole --安裝孔oligomer--寡聚物mouse bite--鼠齧omega meter--離子污染檢測儀omega wave--振盪波photoresist chemical machinning(milling)--光阻opaquer--不透明劑,遮光劑phototool--底片open circuits--斷線 pick and place--拾取與放置optical comparater--光學對比器(光學放大piezoelectric--壓電性optical density--光密度pin grid array(PGA)--矩陣式針腳封裝optical inspection--光學檢驗pinhole--針孔optical instrument--光學儀器pin--接腳,插梢,插針osmosis--滲透pink ring--粉紅圈outgassing--出氣,吹氣plain weave--平織outgrowth--懸出,橫出,側出plasma--電漿output--產出,輸出plasticizers--可塑劑,增塑劑overflow--溢流plated through hole ,PTH--鍍通孔overhang--總浮空platen--熱盤overlap--鑽尖點分離plating--鍍plotting--標繪overpotantial (overvoltage)--過電位,過電oxidation--氧化plug--插腳,塞柱oxygen inhibitor--氧氣抑制現象ply--層,股ozone depletion--臭氧層耗損pneumatic stretcher--氣動拉伸器oilcanning--蓋板彈動point angle--鑽尖角on-contact printing--密貼式印刷point soure light--點狀光源point--鑽尖organic solderability pressrvatives(OSP有機保焊劑p poise--泊packaging--封裝,構裝polar solvent-- 極性溶劑pad--焊墊,圓墊polarity--電極性pad master--圓墊底片polarization--分極,極化palladium --鈀polarizing slot--偏槽panel--製程板polyester films--聚酯類薄片panel plating--金板鍍銅polyimide(PI)--聚亞硫胺panel process--全板電鍍法porosity test--疏孔度試驗paper phenolic--紙質酚醛樹脂(板材）positive acting resist--正性光阻劑parting agent--脫膜劑post cure--後續硬化,後烤pot life--適用期,鍋中壽命passive device(component)--被動元件(零件paste--膏,糊potting--鑄封,模封pattern--板面圖形power supply--電源供應器pattern plating--線路電鍍pre-tinning--預先沾錫pattern process--線路電鍍preform--預製品pattern process--線路電鍍法preheat--預熱peak voltage--峰值電壓prepreg--膠片,樹脂片peel strength--抗撕強度press plate--鋼板periodic reverse(PR)current--週期性反電press-fit contact--擠入式接觸peripheral--週邊附屬設備primary image--線路成像 permeability--透氣性,導磁率probe--探針permittivity--誘電率,透電率process camera--製程用照像機phenolic--酚醛樹脂profile--輪廓.部面圖.升溫曲線圖稜線photofugitive--感光褪色propagation--傳播photographic film--感光成像之底片 puddle effect--水坑效應photoinitiator--感光啟始劑pull away 拉離photomask--光罩pulse plating--脈衝電鍍法photoplotter,plotter--光學繪圖機pumice powder--浮石粉photoresist--光阻punch--衝切purge,purging--淨空,淨洗relief angle--浮角purple plague--紫疫repair--修理post separation--後期分離,事後分離resin content--膠含量,樹脂含量PH value--酸鹼值resin recession--樹脂下陷phase--相resin rich area --樹脂豐富區,多膠區phase diagram-相圖rsin smear--膠糊渣,膠渣pits--凹點resist--阻劑,阻膜pitch--跨距,腳距,墊距,線距resistivity--電阻器,電阻plowing-犁溝resistor drift--電阻漂移pogo pin--伸縮探針resolution--解像,解像度,解析度polymerization--聚合resolving power--解析力,解像力(分辨力) polymer thick film(PTF)--厚膜糊reverse current cleanning--反電流(電解)清流popcorn effect--爆米花效應reverse etchback--反回蝕porcelain--瓷材,瓷面reverse image--負片影像(阻劑)pressure foot--壓力腳reversion--反轉.還原print through--壓透,過度擠壓revision--修正版.改訂版process window--操作範圍rework--重工,再加工production master--生產底片rhology--流變學,流變性質propagation delay--傳播延遲ribbon cable--圓線纜帶pyrolysis--熱裂解,高溫分解rigid-flex printed board--硬軟合板Q rinsing--水洗.沖洗quad flat pack(QFP)--方扁形封裝體ripple--紋波qualification agency--資格認證機構roadmap--線路與零件之佈局圖qualification inspection--資格檢驗robber--輔助陰極roller coating--輥輪塗佈qualified products list--合格產品(供應者)名單qualitative analysis--定性分析roller cutter--輥切機(業界俗稱鋸板機)roller tinning--輥錫法,滾錫法quality conformance test circuitry(coup品質符合試驗線路quantitative analysis--定量分析rosin--松香quench--淬火,驟冷rotary dip test--擺動沾錫試驗quill--緯紗繞軸routing--切外型R runout--偏轉,累積距差rack--掛架rupture--迸裂radial lead--放射狀引腳radio frequency interference(RFI)--射頻干擾radiometer--輻射計,光度計real time system--即時系統rake angle0--摳角,耙角reflection--反射relamination(Re-Lam)--多層板壓合rated temperature,voltage--額定溫度,額定電壓reactance--電抗resin coated copper foil--背膠銅箔real estate--底材面,基板面resistor paste--電阻印膏reclaiming --再生,再製reverse osmosis(RO)--逆滲透real to reel--捲輪(盤)式操作ring--套環reference dimension--參考邊緣rise time--上升時間reflow soldering--重熔焊接,熔焊roller coating--滾動塗佈法refraction--折射Srefractive index--折射率sacrificial protection--犠牲性保護層register mark--對準用標記salt spray test--鹽霧試驗reinforcement--補強物sand blast--噴砂rejection--剔退,拒收saponification--皂化作用relay--繼電器satin finish--緞面處理scaled flow test--比例流量試驗relaease agent,release sheets--脫模劑,離型膜reliability--可靠度,信賴度scratch--刮痕screen printing--網版印刷solder bridging--鍚橋screenability --網印能力solder bump--銲錫凸塊scrubber--磨刷機.磨刷器solder connection--焊接scum--透明殘膜solder cost--銲錫著層sealing--封孔solder dam--錫堤secondary side--第二面solder fillet--填錫seeding--下種solder levelling--噴錫.熱風整平selective plating--選擇性電鍍solder mask(S/M)--緣漆,防焊膜self-extinguishing--自熄性solder paste--錫膏selvage--布邊solder plug--錫塞,錫柱semi-additive process--半加成製程solder preforms--預銲料semi-conductor--半導體solder projection--銲錫突點sensitizing--敏化solder sag--銲錫垂流物separable component part--可分離式零件solder side--焊錫面`solder spatter--濺錫sequestering agent--整合劑solder spread test--散錫試驗shadowing--陰影,回蝕死角solder webbing--錫網shank--鑽針柄部solder wicking--銲錫之燈芯效應,滲錫shear strength--抗剪(力)強度soldering--軟焊,焊接shelf life--儲齡soldering fluidm, soldering oil--助焊液,護焊油shield--遮蔽,屏遮saponifier--皂化劑shoer hardness--蕭氏硬度scoring --V型刻槽short--短路separator plate--隔板,鋼板,鏡板shoulder ange--肩斜角silver paste--銀膏shunt--分路silica gel--矽膠砂side wall--側壁sintering--燒結siemens--電阻值sizing--上漿處理sigma(standard deviation)--標準差silver migration--銀遷移signal--訊號skp solder--缺錫,漏銲silane--矽烷smudging--錫點沾污silicon--矽soft contact--輕觸silicone--矽酮soft glass--軟質玻璃(鉛玻璃)silk screen--網版印刷,絲網印刷solder column package--錫柱腳封裝法solder splash--濺錫single-in-line package(SIP)--單邊插腳封裝體sizing--上膠,上漿solder webbing--錫網skin effect--集膚效應specific heat--比熱skip printing ,skip plating--漏印,漏鍍spinning coating--自轉塗佈slashing--漿經stagger gird--蹣跚格點sleeve jint--套接super solder--超級焊錫sliver--邊絲,邊條surface resistivity--表面電阻率slot,slotting--槽口,開槽surface speed--鑽針表面(切線)速度sludge--沉澱物,淤泥solid content--固體含量,固形份,固形物slump --塌散solidus line--固相線small hole--小孔spacing--間距smear--膠糊渣,膠渣span--跨距snap-off--彈回高度spark over--閃路socket--插座specification(Spec.)--規範.規格solder--銲錫specimen--樣品,試樣solderability--焊錫性,可焊性spectrophotometry--分光光度計檢測法solder bal--銲錫球,鍚球spindle--鑽軸,主軸splay--斜鑽孔template--模板spray coating--噴著塗裝,噴射塗裝tensile strength--抗拉強度spur--底片圖形邊緣突出tensiomenter--張力計supttering--濺射tenting--蓋孔法squeege--刮刀terminal--端子stalagometer--滴管式表面張力計terminal clearance--端子空環,端子讓環stand-off terminals--直立型端子tetrafuncitional resin--四功能樹脂starvation--缺膠thermal coefficient of expansion(TCE)--熱膨脹係static eliminator--靜電消除器thermal conductivity--導熱率steel rule die--(鋼)刀模thermal cycling--熱循環,熱震盪stencil--版膜thermal mismstch--感熱失諧step and repeat--逐次重覆曝光thermal relief--散熱式鏤空step plating--梯階式鍍層thermal zone--感熱區step tablet--階段式(光密度)曝光表thermocompression bonding--熱壓結合stiffener--補強條,補強板thermocouple--熱電偶stop off--阻劑,防鍍膜thermode--發熱體strain--變形,應變thermomechanical analysis(TMA)--熱機分析法strand--絞thermoplastic--熱塑性stray current--迷走電流,散雜電流thermosetting--熱固性stress corrosion--應力腐蝕thermosonic bonding--熱超音波結合stress relief-- 消除應力thermo-via--導熱孔strike --預鍍,打底thick film circuit--厚膜電路stringing--拖尾,牽絲thief--輔助陰極,竊流陰極stripline--條線thin copper foil--薄銅箔stripper--剝除液,剝除器thin core--薄基板substractive process--減成法thin film technology--薄膜技術substrate--底材thinner--調薄劑supported hole--(金屬)支助通孔thixotropy--抗垂流性,搖變性,搖溶性,靜凝性surface energy--表面能three-layer carrier--三層式載體threshold limit value(TLV)--極限值surface insulation resistance(SIR)--表面絕緣電阻through hole mounting--通孔插裝surface mounting technology--表面黏裝技術surface tension--表面張力through put--物流量,物料通過量surface-mount device--表面黏裝零件throwing power--分佈力surfactant--表面潤濕劑tie bar--分流條surge--突流,突壓tin drift--錫量漂飄失swelling agents;sweller--膨鬆劑tin immersion--浸鍍錫swimming--線路滑離tin pest-- 錫疫synthetic resin--合成樹脂tin whishers--錫鬚T tinning--熱沾銲錫tab--接點,金手指tolerance--公差,誤差值taber abraser--泰伯磨試器tombstoning--墓碑效應tooling feature--工具標的物tape automatic bonding(TAB)--捲帶自動結合tape test--撕膠帶試驗torsion strength--抗扭強度tape up master--原始手貼片touch up --觸修.簡修taped components--捲帶式速載零件trace--線路.導線taper pin gauge--錐狀孔規traceability--追溯性.可溯性tarnish--污化transducer--轉能器teflon--鐵氟龍transfer bump--移用式突塊,轉移式突塊telegraphing--浮印,隱印t4ransfer laminatied circuit--轉壓式線路temperature profile--溫度曲線transfer soldering--移焊法transistor--電晶體varnish--清漆,凡力水transimission line--傳輸線very large-scae integration(VLSI)--極大積體電路transmittance--透光率via hole --導通孔treament,treating--含浸處理vickers hardness--維氏硬度treeing--枝狀鍍物,鍍鬚viscosity--黏滯度,黏度trim line--截切線vision systems --視覺系統trimming--修整.修邊visual examination(Inspection)--目視檢查true position--真位void--空洞.破洞tungsten--鎢volatile content--揮發份含量tungsten carbide--碳化鎢voltage--電壓turnkey system--包辦式系統voltage breakdown--崩潰電壓turret solder terminal--塔立式焊接端子voltage drop--電壓隆落twill weave--斜織法,菱織法voltage efficiency--電壓效率twist--板翹.板扭voltage plane--電壓層two layer carrier--兩層式載體voltage plane clearance--電壓層的空環tackiness--黏著性,黏手性volume resistivity--體積電阻率tape casting--帶狀鑄材volumetric analysis--容量分析法tarnish --污化,污著vulcanization--硫化,交聯tetra-etch--氟樹脂蝕粗劑vacyikes--焊洞thermal via--導熱孔,散熱孔Wthermogravimetric analysis(TGA)--熱重分析法wafer--晶圓thermode soldering--熱模焊接法waive--暫准過關,暫不檢驗thermount--聚硫胺短織蓆材warp,warpage--板彎warp size--漿經處理thin small outline packange--薄小型積體電路器three point bending--表面地形washer--墊圈translucency--半透性waste treatment--廢棄處理trim--修整,修改數值,精修water absorption--吸水性U water break --水膜破散,水破UL symbol--保險業試驗所標誌watermark--水印watt--瓦特ultimate tensile strength(UTS)--極限抗拉強度ultra high frequency(UHF)--特高頻率watts bath--瓦茲鍍鎳液wave guide--導波管ultra violet curing (UV curing)--紫外線硬化ultrasonic bonding--超音波結合wave soldering--波焊ultrasonic cleaning--超音波清洗waviness--波紋,波度ultrasonic soldering--超音波焊接wear resistance--耐磨度,耐磨性undercut,undercutting--側蝕weatherability--耐候性underplate--底鍍層weave eposure--織紋顯露universal tester--汎用型電測機weave texture--織紋隱現unsupported hole--非鍍通孔web--蹼部urea--尿素weft yarn--緯紗urethane--胺基甲酸乙脂welding--熔接wet blasting--濕噴砂unbalanced transmission line--非平衡式傳輸線V wet lamination--濕壓膜法V-Cut-- V型切槽wet process--濕式製程wetting agant--潤濕劑vaccum evaporation/deposition--真空蒸鍍法vaccum lamination--真空壓合wetting balance--沾錫天平van der walls force--凡得瓦力wetting--沾濕,沾錫vapor blasting--蒸氣噴砂whirl brush--旋渦式磨刷法vapor degreasing--蒸氣除油法whirl coating--旋渦塗佈法vapor phase soldering--氣相焊接whisker--晶鬚white residue--白色殘渣white spot--白點補充wicking--燈芯效應drill--鉆孔window --操作範圍,傳動齒孔beveling dimension--磨邊尺寸wire bonding--打線結合bare copper--裸銅wire gauge--線規CuSO4--硫酸銅wire lead--金屬線腳KMnO4 --高錳酸鈉wire wrap--繞線互連wiring pattern--佈線圖形working master--工作母片working time--堪用時間workmanship--手藝,工藝水準,製作水準woven cable--扁平編線wrought foil--鍛碾金屬箔wedge void--楔形缺口(破口)wiping action--滑動接觸(導電)wrinkle--皺摺,皺紋XX Axis--X軸X-Ray--X光YY-Axis --Y 軸yarn--紗,線yield --良品率,良率,產率yield point--屈服點,降伏點ZZ-Axis--Z 軸zig-zag in-line package(ZIP)--鏈齒狀雙排腳封裝件zero centering--中心不變(疊合法)。