台虹科技TAIFLEX的散热铝基覆铜板DATASHEET
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Thermal Conductive Bonding Sheet
z Features:
1. Halogen & Sb Free.
2. Lower Thermal Impedance.
3. Higer Dimension Stability.
4. Higher Electrical Relibility.
during the laminating process, and etched both side of metal substrate before the test performed.
z Lamination:
1.Pre-treatment & Laminated Step:
Step 1 : Take off the releasing film
Step 2 : Pre-adhesive on the Al substrate by laminator (This step may be omitted.)
Step 3 : Laminated process
minated condition:
Parameters
Step Condition
0.5 Oz. 1.0 Oz.
Temperature (o C) 100 120
Pressure (Kg f /cm) 4 2 Pre-adhesive
Rate (m/min.) 0.5
1.0
Temperature (o C)
40 to 170
Pressure (Kg f /cm 2) 5 Per-Lamination
Time (min.)
30
Temperature (o
C) 170 Pressure (Kg f /cm 2)25 Lamination
Lamination
Time (min.)
90
Porfile of Laminated parameters
20
40
60
80
100
120
20
406080100120140
160180
Time (min.)
T e m p e r a t u r e (o
C )
0246810121416182022242628303234363840
Pressure (Kg f /cm 2
)