TL084 中文版介绍资料
运放TL084
Examples : TL084CN, TL084CD
Output 1 1 Inverting Input 1 2 Non-inverting Input 1 3 VCC + 4 Non-inverting Input 2 5 Inverting Input 2 6 Output 2 7 + + + +
R L = 2kΩ T a m b = + 25 ° C S ee Fig ure 2
MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE VERSUS FREQUENCY
MAXIMUMPEAK-TO-PEAK OUTPUT VOLTAGE (V) 30 25 20 15 10 5 0 100 1K 10K 100K 1M 10M
®
TL084 TL084A - TL084B
GENERAL PURPOSEJ-FET QUAD OPERATIONAL AMPLIFIERS
. . . . . . .
WIDE COMMON-MODE (UP TO VCC+) AND DIFFERENTIAL VOLTAGE RANGE LOW INPUT BIAS AND OFFSET CURRENT OUTPUT SHORT-CIRCUIT PROTECTION HIGH INPUT IMPEDANCE J–FET INPUT STAGE INTERNAL FREQUENCY COMPENSATION LATCH UP FREE OPERATION HIGH SLEW RATE : 4 (Plastic Package)
D SO14 (Plastic Micropackage)
P TSSOP14 (Thin Shrink Small Outline Package)
TL084ACNSR中文资料
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9851501Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9851501QPA ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type5962-9851503QCAACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL081ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG 8TBD Call TI Call TITL081ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRG4ACTIVESOICD82500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL081CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW 8TBD Call TI Call TITL081ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081MFKB OBSOLETE LCCC FK 20TBD Call TI Call TI TL081MJG OBSOLETE CDIP JG 8TBD Call TI Call TI TL081MJGB OBSOLETE CDIP JG 8TBD Call TI Call TITL082ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDE4ACTIVESOICD875Green (RoHS &CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)TL082BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPSRG4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPW ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWE4ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW 8TBDCall TI Call TITL082CPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRG4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDG4ACTIVESOICD875Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL082IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK 20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeTL082MJG ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL082MJGB ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL084ACD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACN ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACNSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRG4ACTIVESOICD142500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL084BCN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084BCNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free CU NIPDAU N/A for Pkg Type 23-Apr-2007Orderable DeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)(RoHS)TL084MFK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MJ ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084MJB ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084QD ACTIVE SOIC D 1450TBD CU NIPDAU Level-1-220C-UNLIM TL084QDRACTIVESOICD142500TBDCU NIPDAULevel-1-220C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight inhomogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.23-Apr-2007TAPE AND REELINFORMATION3-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL081IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082ACPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082CPWR PW 8MLA 330127.0 3.6 1.6812Q1TL082IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082IDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082IPWR PW 8MLA 330127.0 3.6 1.6812Q1TL084ACDR D 14MLA 33016 6.59.0 2.1816Q1TL084ACDR D 14FMX 3300 6.59.0 2.1816Q1TL084ACNSR NS 14MLA 330168.210.5 2.51216Q1TL084BCDR D 14FMX 3300 6.59.0 2.1816Q1TL084CDR D 14FMX 3300 6.59.0 2.1816Q1TL084CNSR NS 14MLA 330168.210.5 2.51216Q1TL084CPWR PW 14MLA 330127.0 5.6 1.6812Q1TL084IDRD14FMX3306.59.02.1816Q13-May-2007TAPE AND REEL BOX INFORMATIONDevicePackagePins Site Length (mm)Width (mm)Height (mm)TL081ACDR D 8FMX 338.1340.520.64TL081BCDR D 8FMX 338.1340.520.64TL081CDR D 8FMX 338.1340.520.64TL081CPSR PS 8MLA 333.2333.228.58TL081IDR D 8FMX 338.1340.520.64TL082ACDR D 8FMX 338.1340.520.64TL082ACDR D 8MLA 338.1340.520.64TL082ACPSR PS 8MLA 333.2333.228.58TL082BCDR D 8FMX 338.1340.520.64TL082CDR D 8FMX 338.1340.520.64TL082CDR D 8MLA 338.1340.520.64TL082CPSR PS 8MLA 333.2333.228.58TL082CPWR PW 8MLA 338.1340.520.64TL082IDR D 8FMX 338.1340.520.64TL082IDR D 8MLA 338.1340.520.64TL082IPWR PW 8MLA 338.1340.520.64TL084ACDR D 14MLA 333.2333.228.58TL084ACDR D 14FMX 333.2333.228.58TL084ACNSR NS 14MLA 333.2333.228.58TL084BCDR D 14FMX 333.2333.228.58TL084CDR D 14FMX 333.2333.228.58TL084CNSR NS 14MLA 333.2333.228.58TL084CPWR PW 14MLA 338.1340.520.64TL084IDRD14FMX333.2333.228.583-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。
TL082中文资料——运放
PACKAGING INFORMATIONOrderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)5962-9851501Q2A ACTIVE LCCC FK201TBD Call TI Call TI5962-9851501QPA ACTIVE CDIP JG81TBD A42N / A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK201TBD Call TI Call TI5962-9851503QCA ACTIVE CDIP J141TBD Call TI Call TI TL081ACD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG8TBD Call TI Call TITL081ACP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081ACPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081BCD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081BCPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeAddendum-Page 1Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL081CD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081CPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081CPSR ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CPSRE4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CPSRG4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW8TBD Call TI Call TI TL081ID ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081IPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeAddendum-Page 2Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL081MFKB OBSOLETE LCCC FK20TBD Call TI Call TITL081MJG OBSOLETE CDIP JG8TBD Call TI Call TITL081MJGB OBSOLETE CDIP JG8TBD Call TI Call TITL082ACD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082ACPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082ACPSR ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACPSRE4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACPSRG4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAddendum-Page 3Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL082BCP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082BCPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG8TBD Call TI Call TITL082CP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CPSR ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPSRG4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPW ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWE4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWG4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW8TBD Call TI Call TITL082CPWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWRE4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWRG4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAddendum-Page 427-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL082ID ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG8TBD Call TI Call TITL082IP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082IPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082IPWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IPWRE4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IPWRG4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg Type TL082MJG ACTIVE CDIP JG81TBD A42N / A for Pkg Type TL082MJGB ACTIVE CDIP JG81TBD A42N / A for Pkg Type TL084ACD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084ACDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084ACNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084ACNSR ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACNSRE4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACNSRG4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084BCNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084CDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWG4ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRG4ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeTL084MFK ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg TypeTL084MFKB ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg TypeTL084MJ ACTIVE CDIP J141TBD A42N / A for Pkg TypeTL084MJB ACTIVE CDIP J141TBD A42N / A for Pkg TypeTL084QD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and27-Apr-2012 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF TL082, TL082M, TL084, TL084M :•Catalog: TL082, TL084•Automotive: TL082-Q1, TL082-Q1•Military: TL082M, TL084MNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects•Military - QML certified for Military and Defense ApplicationsTAPE AND REELINFORMATION *Alldimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081BCDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081CPSR SOPS 82000330.016.48.2 6.6 2.512.016.0Q1TL081IDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACPSR SOPS 82000330.016.48.2 6.6 2.512.016.0Q1TL082BCDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CPSR SOPS 82000330.016.48.2 6.6 2.512.016.0Q1TL082CPWR TSSOPPW 82000330.012.47.0 3.6 1.68.012.0Q1TL082IDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082IDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082IPWR TSSOPPW 82000330.012.47.0 3.6 1.68.012.0Q1TL084ACDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084ACDR SOIC D 142500330.016.4 6.59.0 14-Jul-2012DevicePackage Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL084ACNSR SONS 142000330.016.48.210.5 2.512.016.0Q1TL084BCDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084CDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084CNSR SONS 142000330.016.48.210.5 2.512.016.0Q1TL084CPWR TSSOPPW 142000330.012.4 6.9 5.6 1.68.012.0Q1TL084IDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084QDR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm)TL081ACDRSOIC D 82500340.5338.120.6TL081BCDRSOIC D 82500340.5338.120.6TL081CDRSOIC D 82500340.5338.120.6TL081CPSRSO PS 82000367.0367.038.0TL081IDRSOIC D 82500340.5338.120.6TL082ACDRSOIC D 82500340.5338.120.6TL082ACDRSOIC D 82500367.0367.035.0TL082ACPSRSO PS 82000367.0367.038.0TL082BCDRSOIC D 82500340.5338.120.6TL082CDR SOIC D 82500340.5338.120.6 14-Jul-2012DevicePackageType Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm)TL082CDRSOIC D 82500367.0367.035.0TL082CPSRSO PS 82000367.0367.038.0TL082CPWRTSSOP PW 82000367.0367.035.0TL082IDRSOIC D 82500367.0367.035.0TL082IDRSOIC D 82500340.5338.120.6TL082IPWRTSSOP PW 82000367.0367.035.0TL084ACDRSOIC D 142500333.2345.928.6TL084ACDRSOIC D 142500367.0367.038.0TL084ACNSRSO NS 142000367.0367.038.0TL084BCDRSOIC D 142500333.2345.928.6TL084CDRSOIC D 142500333.2345.928.6TL084CNSRSO NS 142000367.0367.038.0TL084CPWRTSSOP PW 142000367.0367.035.0TL084IDRSOIC D 142500333.2345.928.6TL084QDR SOIC D 142500367.0367.038.0 14-Jul-2012IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。
TL082ACDR,TL082ACDR,TL082ACDR,TL082IDR,TL082IDR,TL082IDR,TL081CDR,TL081CDR, 规格书,Datasheet 资料
Addendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)5962-9851501Q2A ACTIVE LCCC FK 201TBD Call TI Call TI5962-9851501QPA ACTIVE CDIP JG 81TBD A42N / A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK 201TBD Call TI Call TI 5962-9851503QCAACTIVE CDIP J 141TBDCall TICall TITL081ACD ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDE4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDG4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDR ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRE4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRG4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG 8TBD Call TICall TITL081ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081BCD ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDE4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDG4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDR ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRE4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRG4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081BCPE4ACTIVEPDIPP850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type芯天下--/Addendum-Page 2Orderable DeviceStatus(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp(3)Samples (Requires Login)TL081CD ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDE4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDG4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDR ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRE4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRG4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081CPSR ACTIVE SO PS 82000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPSRE4ACTIVE SO PS 82000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPSRG4ACTIVE SO PS 82000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW 8TBD Call TICall TITL081ID ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDE4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDG4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDR ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRE4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRG4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081IPE4ACTIVEPDIPP850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type芯天下--/Addendum-Page 3Orderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)TL081MFKB OBSOLETE LCCC FK 20TBD Call TI Call TI TL081MJG OBSOLETE CDIP JG 8TBD Call TI Call TI TL081MJGB OBSOLETE CDIP JG 8TBDCall TICall TITL082ACD ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDE4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDG4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDR ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRE4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRG4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082ACPSR ACTIVE SO PS 82000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACPSRE4ACTIVE SO PS 82000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACPSRG4ACTIVE SO PS 82000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCD ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDE4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDG4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDR ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRE4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRG4ACTIVESOICD82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM芯天下--/Addendum-Page 4Orderable DeviceStatus(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp(3)Samples (Requires Login)TL082BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CD ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDE4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDG4ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDR ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRE4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRG4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG 8TBD Call TICall TITL082CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CPSR ACTIVE SO PS 82000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPSRG4ACTIVE SO PS 82000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPW ACTIVE TSSOP PW 8150Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWE4ACTIVE TSSOP PW 8150Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWG4ACTIVE TSSOP PW 8150Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW 8TBD Call TICall TITL082CPWR ACTIVE TSSOP PW 82000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRE4ACTIVE TSSOP PW 82000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRG4ACTIVETSSOPPW82000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM芯天下--/27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL082ID ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG8TBD Call TI Call TITL082IP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082IPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082IPWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IPWRE4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IPWRG4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg Type TL082MJG ACTIVE CDIP JG81TBD A42N / A for Pkg Type TL082MJGB ACTIVE CDIP JG81TBD A42N / A for Pkg Type TL084ACD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084ACDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084ACNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084ACNSR ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACNSRE4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACNSRG4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084BCNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084CDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWG4ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRG4ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeTL084MFK ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg TypeTL084MFKB ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg TypeTL084MJ ACTIVE CDIP J141TBD A42N / A for Pkg TypeTL084MJB ACTIVE CDIP J141TBD A42N / A for Pkg TypeTL084QD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and27-Apr-2012 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF TL082, TL082M, TL084, TL084M :•Catalog: TL082, TL084•Automotive: TL082-Q1, TL082-Q1•Military: TL082M, TL084MNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects•Military - QML certified for Military and Defense ApplicationsTAPE AND REELINFORMATION*Alldimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081BCDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081CDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081CPSR SO PS 82000330.016.48.2 6.6 2.512.016.0Q1TL081IDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACPSR SO PS 82000330.016.48.2 6.6 2.512.016.0Q1TL082BCDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CPSR SO PS 82000330.016.48.2 6.6 2.512.016.0Q1TL082CPWR TSSOP PW 82000330.012.47.0 3.6 1.68.012.0Q1TL082IDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082IDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082IPWR TSSOP PW 82000330.012.47.0 3.6 1.68.012.0Q1TL084ACDR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1TL084ACDRSOICD142500330.016.46.59.02.18.016.0Q114-Jul-2012DevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL084ACNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1TL084BCDR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1TL084CDR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1TL084CNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1TL084CPWR TSSOP PW 142000330.012.4 6.9 5.6 1.68.012.0Q1TL084IDR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1TL084QDRSOICD142500330.016.46.59.02.18.016.0Q1*All dimensions are nominalDevice Package TypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)TL081ACDR SOIC D 82500340.5338.120.6TL081BCDR SOIC D 82500340.5338.120.6TL081CDR SOIC D 82500340.5338.120.6TL081CPSR SO PS 82000367.0367.038.0TL081IDR SOIC D 82500340.5338.120.6TL082ACDR SOIC D 82500340.5338.120.6TL082ACDR SOIC D 82500367.0367.035.0TL082ACPSR SO PS 82000367.0367.038.0TL082BCDR SOIC D 82500340.5338.120.6TL082CDRSOICD82500340.5338.120.614-Jul-2012Device PackageTypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)TL082CDR SOIC D 82500367.0367.035.0TL082CPSR SO PS 82000367.0367.038.0TL082CPWR TSSOP PW 82000367.0367.035.0TL082IDR SOIC D 82500367.0367.035.0TL082IDR SOIC D 82500340.5338.120.6TL082IPWR TSSOP PW 82000367.0367.035.0TL084ACDR SOIC D 142500333.2345.928.6TL084ACDR SOIC D 142500367.0367.038.0TL084ACNSR SO NS 142000367.0367.038.0TL084BCDR SOIC D 142500333.2345.928.6TL084CDR SOIC D 142500333.2345.928.6TL084CNSR SO NS 142000367.0367.038.0TL084CPWR TSSOP PW 142000367.0367.035.0TL084IDR SOIC D 142500333.2345.928.6TL084QDRSOICD142500367.0367.038.014-Jul-2012IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI 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TLC081中文资料
Copyright 2000−2004 Texas Instruments Incorporated
1
元器件交易网
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDEĆBANDWIDTH HIGHĆOUTPUTĆDRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
−40°C to 125°C
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLC084CDR).
2
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
D Wide Bandwidth . . . 10 MHz D High Output Drive D D D D D D D
基于TL084的电荷放大器的研制
情况，提出采用输入阻抗极高，增益频带较宽的四运放集成芯片 TL084 取代多 个单集成运放芯片的方案，提高了电路的集成度，使电荷放大器具有体积小、功 耗低、寄生因素少和抗干扰性能强的优点。 2. 在电荷转换部分设计了外部调零电路，以减少失调电压和失调电流，提
高测量准确度。在电荷转换成电压部分理论上分析了多量程的测量，便于测量不 同量级的加速度。 3. 本设计采用 TDA2030 芯片构成功率放大器， 实现电荷转换成电压信号的
证实验，得出实验结论。最后与标准电荷放大器的性能进行比较，验证了本设计 的可行性和可靠性。但是在屏蔽干扰、电路板设计工艺、元器件布局等方面仍有 待改进，以有利于进一步提高电荷放大器的性能。
关键词：压电加速度传感器，测量电路，电荷放大器，TL084
AbstraΒιβλιοθήκη tThe design of a charge amplifier based on TL084
Abstract
further enhance the charge amplifier performance. Keywords: Piezoelectric accelerometer, measurement circuit, charge amplifier, TL084
目录
目录
第一章 绪 论................................................................................................................ 1 1.1 传感器的意义.................................................................................................. 1 1.2 压电加速度传感器的地位与发展.................................................................. 1 1.3 压电加速度传感器振动测量技术的国内外发展.......................................... 3 1.4 本章小结......................................................................................................... 5 第二章 压电加速度传感器的研究.............................................................................. 6 2.1 压电加速度传感器的工作原理...................................................................... 6 2.2 压电加速度传感器的等效电路...................................................................... 7 2.3 压电加速度传感器性能参数.......................................................................... 8 2.3.1 压电加速度传感器灵敏度................................................................... 8 2.3.2 压电加速度传感器的频响特性........................................................... 9 2.3.3 压电加速度传感器的固有共振频率................................................. 10 2.3.4 影响压电加速度传感器的因素......................................................... 10 2.4 压电加速度传感器对前置放大器的要求及其测量电路............................ 11 2.4.1 电压放大器......................................................................................... 11 2.4.2 电荷放大器......................................................................................... 13 2.4.3 内置集成电路的压电传感器............................................................. 17 2.5 压电加速度传感器电缆线的选择................................................................ 18 2.6 本章小结........................................................................................................ 18 第三章 电荷放大器电路的硬件设计和制作............................................................ 19 3.1 引言................................................................................................................ 19 3.2 电荷放大器各模块的设计............................................................................ 20 3.2.1 电荷电压转换电路模块的设计......................................................... 20 3.2.2 归一化电路模块的设计..................................................................... 27 3.2.3 高通、低通滤波器的设计................................................................. 31 3.2.4 输出放大模块的设计......................................................................... 34 3.2.5 电源模块的设计................................................................................. 35 3.2.6 过载报警保护模块的设计................................................................. 37
TL084AC中文资料
Amplifiers and Comparators
In Brief . . .
For over two decades, Motorola has continually refined and updated integrated circuit technologies, analog circuit design techniques and processes in response to the needs of the marketplace. The enhanced performance of newer operational amplifiers and comparators has come through innovative application of these technologies, designs and processes. Some early designs are still available but are giving way to the new, higher performance operational amplifier and comparator circuits. Motorola has pioneered in JFET inputs, low temperature coefficient input stages, Miller loop compensation, all NPN output stages, dual–doublet frequency compensation and analog “in–the–package” trimming of resistors to produce superior high performance operational amplifiers and comparators, operating in many cases from a single supply with low input offset, low noise, low power, high output swing, high slew rate and high gain–bandwidth product at reasonable cost to the customer. Present day operational amplifiers and comparators find applications in all market segments including motor controls, instrumentation, aerospace, automotive, telecommunications, medical, and consumer products. Page Operational Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–2 Single . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–2 Dual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–3 Quad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–4 One Volt SMARTMOS™ Rail–to–Rail Dual Operational Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–6 High Frequency Amplifiers . . . . . . . . . . . . . . . . . . . . . . . 4.1–7 AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–7 Miscellaneous Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . 4.1–8 Bipolar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–8 CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–8 Comparators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Single . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Dual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Quad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Package Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–10
TL082中文资料_数据手册_参数
TL081, TL081A, TL081B, TL082, TL082A TL082B, TL084, TL084A, TL084B
SLOS081I – FEBRUARY 1977 – ontents
1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 5
TL08xI ........................................................................ 6 6.6 Electrical Characteristics for TL08xM and TL084x ... 7 6.7 Operating Characteristics.......................................... 7 6.8 Dissipation Rating Table ........................................... 8 6.9 Typical Characteristics .............................................. 9 7 Parameter Measurement Information ................ 13 8 Detailed Description ............................................ 14 8.1 Overview ................................................................. 14
常用运放芯片实物和引脚功能图_TL081-082-084运放引脚功能及贴片封装形式
常用运放芯片实物和引脚功能图_TL081/082/084运放引脚功能及贴片封装形式（1）运放芯片的3种型号序列（部分器件有此序列）如TL081、TL082、TL084，分别为8引脚单运放；8引脚双运放；14引脚四运放集成器件。
封装型式一般为塑封双列直插和贴片双列，环列封装形式比较少见。
图1 TL081/082/084运放引脚功能及贴片封装形式而常见常用，仅为下述两种器件。
世界上有几个人？有两个人，男人和女人，不失为一个智慧的回答。
常用运放芯片有几片，只有两片，8脚和14脚的双运放和四运放集成器件（8脚封装单运放器件和环列式封装器件应用较少），把此两种芯片引脚功能记住，检修中就不需要随时去查资料了。
图2 常用运放芯片实物和引脚功能图如上图。
其封装一般为塑封双列直插DIP8/DIP14和塑封贴片工艺封装SO8/SO14两种形式，随着电子线路板小型化精密化要求的提高，贴片元件的应用占据主流，直插式器件逐渐淡出人们的视野。
但无论何种封装模式，其引脚功能、次序都是一样的，所以仅需记准8脚（双运放）和14脚（四运放）两种运放的引脚功能就够了。
（2）运放芯片的3种温度序列任何一种集成IC器件，按应用温度范围不同，都可细分为3种器件，如LM358，实际上有LM158、LM258、LM358三种型号的产品，其引脚功能、内部结构、工作原理、供电电压等等都无差别，仅仅是应用温度范围差异甚大。
LM158 适应工作温度-50℃~125℃，军工用品（1类）；LM258 适应工作温度-25℃~85℃，工业用品（2类）；LM358 适应工作温度0℃~70℃，农用品（3类）。
单看参数，似乎LM258适用于山东地区，若用于东北地区，其参数有些不足。
而LM358仅能适用于江南地区。
而事实上并非如此，如低于2类品规格参数被淘汰到3类品的器件，可能是-24℃~84℃温度范围以内的产品，仅次于2类品，比3类品的温度指标实际上要高许多的。
在家电元件市场能购到的多为3类品。
ADC0804中文资料_数据手册_参数
TL080中文资料
元器件交易网IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductorproduct or service without notice, and advises its customers to obtain the latest version of relevant informationto verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable atthe time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques areutilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of eachdevice is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, orsevere property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TIproducts in such applications requires the written approval of an appropriate TI officer. Questions concerningpotential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, orinfringement of patents or services described herein. Nor does TI warrant or represent that any license, eitherexpress or implied, is granted under any patent right, copyright, mask work right, or other intellectual propertyright of TI covering or relating to any combination, machine, or process in which such semiconductor productsor services might be or are used.Copyright © 1995, Texas Instruments Incorporated。
TL084CNSLE中文资料
IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9851501Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9851501QPA ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type5962-9851503QCAACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL081ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG 8TBD Call TI Call TITL081ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRG4ACTIVESOICD82500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL081CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW 8TBD Call TI Call TITL081ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081MFKB OBSOLETE LCCC FK 20TBD Call TI Call TI TL081MJG OBSOLETE CDIP JG 8TBD Call TI Call TI TL081MJGB OBSOLETE CDIP JG 8TBD Call TI Call TITL082ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDE4ACTIVESOICD875Green (RoHS &CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)TL082BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPSRG4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPW ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWE4ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW 8TBDCall TI Call TITL082CPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRG4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDG4ACTIVESOICD875Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL082IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK 20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeTL082MJG ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL082MJGB ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL084ACD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACN ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACNSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRG4ACTIVESOICD142500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL084BCN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084BCNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free CU NIPDAU N/A for Pkg Type 23-Apr-2007Orderable DeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)(RoHS)TL084MFK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MJ ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084MJB ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084QD ACTIVE SOIC D 1450TBD CU NIPDAU Level-1-220C-UNLIM TL084QDRACTIVESOICD142500TBDCU NIPDAULevel-1-220C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight inhomogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.23-Apr-2007TAPE AND REELINFORMATION3-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL081IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082ACPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082CPWR PW 8MLA 330127.0 3.6 1.6812Q1TL082IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082IDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082IPWR PW 8MLA 330127.0 3.6 1.6812Q1TL084ACDR D 14MLA 33016 6.59.0 2.1816Q1TL084ACDR D 14FMX 3300 6.59.0 2.1816Q1TL084ACNSR NS 14MLA 330168.210.5 2.51216Q1TL084BCDR D 14FMX 3300 6.59.0 2.1816Q1TL084CDR D 14FMX 3300 6.59.0 2.1816Q1TL084CNSR NS 14MLA 330168.210.5 2.51216Q1TL084CPWR PW 14MLA 330127.0 5.6 1.6812Q1TL084IDRD14FMX3306.59.02.1816Q13-May-2007TAPE AND REEL BOX INFORMATIONDevicePackagePins Site Length (mm)Width (mm)Height (mm)TL081ACDR D 8FMX 338.1340.520.64TL081BCDR D 8FMX 338.1340.520.64TL081CDR D 8FMX 338.1340.520.64TL081CPSR PS 8MLA 333.2333.228.58TL081IDR D 8FMX 338.1340.520.64TL082ACDR D 8FMX 338.1340.520.64TL082ACDR D 8MLA 338.1340.520.64TL082ACPSR PS 8MLA 333.2333.228.58TL082BCDR D 8FMX 338.1340.520.64TL082CDR D 8FMX 338.1340.520.64TL082CDR D 8MLA 338.1340.520.64TL082CPSR PS 8MLA 333.2333.228.58TL082CPWR PW 8MLA 338.1340.520.64TL082IDR D 8FMX 338.1340.520.64TL082IDR D 8MLA 338.1340.520.64TL082IPWR PW 8MLA 338.1340.520.64TL084ACDR D 14MLA 333.2333.228.58TL084ACDR D 14FMX 333.2333.228.58TL084ACNSR NS 14MLA 333.2333.228.58TL084BCDR D 14FMX 333.2333.228.58TL084CDR D 14FMX 333.2333.228.58TL084CNSR NS 14MLA 333.2333.228.58TL084CPWR PW 14MLA 338.1340.520.64TL084IDRD14FMX333.2333.228.583-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。
集成运算放大器应用要点
图8-6 CF3140封装引） CF3140的输入级是MOSFET，在安装和焊接时应按MOSFET的 操作方法操作。 2） CF3140的最大允许差模电压为± 8V，为保护CF3140，一般应接 保护电路。输入回路电流不要超过1mA，一般在输入回路和反馈回 路应串接限流电阻，一般不小于3.9k。 3） 载电阻应不小于2k，否则会使负向输出动态范围变小。 4） 如果输出电流较大，要加散热片。
图8-2 CF124引脚排列和应用电路
3. 高输入阻抗运放CF355，CF356，CF357
图8-3 CF355/CF356/CF357
4． 高输入阻抗运放TL081，TL082，TL084
图8-4 TL082引脚图
5． 低失调低漂移运放OP-07
图8-5 OP07引脚及典型电路
6． 高精度高速运放OP-17 输入失调电压温漂、输入失调电流温漂、输入失调电压漂移温漂 和输入失调电流漂移温漂都很小，大约为CF357的十分之一。 OP-1的 封装、引脚和应用电路和CF357完全相同。
7． 超低噪声、高精度运放OP-27 噪声电压特别小 ，OP-27的速度高于OP-07的十倍。但OP-27允许 的差 模输入电压仅为± 0.7V，必须加输入保护电路。
8． 高输入阻抗运放CF3140和CF3130 CF3140的输入级和输出级都是MOSFET，其输入阻抗很高，达1012Ω， 输入偏流很小，约10pA，速度也比较高，常用于积分、保持电路。
单片机原理及应用技术
集成运算放 大器应用要点
集成运算放大器应用要点
继承运放的应用一般是稳态应用，包括放大或者处理 连续正弦波形成的复杂波形，这时应考虑如下两个方 面：
1、反馈， 2、闭环增益和带宽
1. CF741通用单运放
TL081IP中文资料
元器件交易网IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductorproduct or service without notice, and advises its customers to obtain the latest version of relevant informationto verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable atthe time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques areutilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of eachdevice is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, orsevere property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TIproducts in such applications requires the written approval of an appropriate TI officer. Questions concerningpotential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, orinfringement of patents or services described herein. Nor does TI warrant or represent that any license, eitherexpress or implied, is granted under any patent right, copyright, mask work right, or other intellectual propertyright of TI covering or relating to any combination, machine, or process in which such semiconductor productsor services might be or are used.Copyright © 1995, Texas Instruments Incorporated。
TL081中文PDF
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9851501Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-9851501QPA ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-9851503QCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type TL081ACD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG8TBD Call TI Call TITL081ACP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL081ACPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL081BCD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL081BCPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL081CD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL081CPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL081CPSR ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CPSRE4ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CPWLE OBSOLETE TSSOP PW8TBD Call TI Call TI TL081ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL081IDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL081IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TL081MFKB OBSOLETE LCCC FK20TBD Call TI Call TITL081MJG OBSOLETE CDIP JG8TBD Call TI Call TITL081MJGB OBSOLETE CDIP JG8TBD Call TI Call TITL082ACD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL082ACPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL082ACPSR ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACPSRE4ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL082BCPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL082CD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL082CDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG8TBD Call TI Call TITL082CP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL082CPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL082CPSR ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPSRG4ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWE4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW8TBD Call TI Call TITL082CPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWRE4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG8TBD Call TI Call TITL082IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL082IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL082IPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IPWRE4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082MFK OBSOLETE LCCC FK20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TL082MJG ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg TypeOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL082MJGB ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TL084ACD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084ACNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084ACNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084BCNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL084CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TL084MFK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TL084MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg TypeTL084MJ ACTIVE CDIP J141TBD A42SNPB N/A for Pkg TypeTL084MJB ACTIVE CDIP J141TBD A42SNPB N/A for Pkg TypeTL084QD ACTIVE SOIC D1450TBD CU NIPDAU Level-1-220C-UNLIM TL084QDR ACTIVE SOIC D142500TBD CU NIPDAU Level-1-220C-UNLIM (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to theaccuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and todiscontinue any product or service without notice. Customers should obtain the latest relevant informationbefore placing orders and should verify that such information is current and complete. All products are soldsubject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extentTI deems necessary to support this warranty. Except where mandated by government requirements, testingof all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsiblefor their products and applications using TI components. To minimize the risks associated with customerproducts and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patentright, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,or process in which TI products or services are used. Information published by TI regarding third-partyproducts or services does not constitute a license from TI to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents orother intellectual property of the third party, or a license from TI under the patents or other intellectualproperty of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices.Reproduction of this information with alteration is an unfair and deceptive business practice. TI is notresponsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI forthat product or service voids all express and any implied warranties for the associated TI product or serviceand is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotive/broadbandBroadbandDSP DigitalControl /digitalcontrol Interface Military /military Logic Power Mgmt Optical Networking /opticalnetworkSecurity /security Microcontrollers Low Power Wireless /lpw Telephony /telephonyVideo & Imaging /video/wirelessWirelessMailing Address: Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated。
TLC084资料
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments.
TLC080 and TLC081 AVAILABLE OPTIONS PACKAGED DEVICES TA 0°C to 70°C SMALL OUTLINE (D)† TLC080CD TLC081CD TLC080ID TLC081ID TLC080AID TLC081AID SMALL OUTLINE (DGN)† TLC080CDGN TLC081CDGN TLC080IDGN TLC081IDGN — — SYMBOL xxTIACW xxTIACY xxTIACX xxTIACZ — — PLASTIC DIP (P) TLC080CP TLC081CP TLC080IP TLC081IP TLC080AIP TLC081AIP
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
D Wide Bandwidth . . . 10 MHz D High Output Drive D D D D D D D
− IOH . . . 57 mA at VDD − 1.5 V − IOL . . . 55 mA at 0.5 V High Slew Rate − SR+ . . . 16 V/µs − SR− . . . 19 V/µs Wide Supply Range . . . 4.5 V to 16 V Supply Current . . . 1.9 mA/Channel Ultralow Power Shutdown Mode IDD . . . 125 µA/Channel Low Input Noise Voltage . . . 8.5 nV√Hz Input Offset Voltage . . . 60 µV Ultra-Small Packages − 8 or 10 Pin MSOP (TLC080/1/2/3)