LQFPTQFPQFP封装尺寸图解及区别

LQFP,TQFP,QFP,CQFP封装尺寸表

D u m m y C o m p o n e n t sLQFPLow Profile Quad Flat PackLow Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footprint).LQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 256. Body sizes range from 5 x 5mm to 28 x 28mm. Copper lead-frames are used for the LQFP package. Lead pitches available for LQFP package are 0.65mm, 0.5mm, 0.4mm.Notes* = Available as an ExposedPad™ L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB. All LQFPs are standard in trays.LQFPs have a body thickness of 1.4mm. Tray quantity may vary. Tape type is plastic.Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.For recommended kits see pages58, 68, 71, 81, 73 and 70.Part Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn or SnCu or SnBi.LQFP48–7mm–.5mm–2.0Low Profile Quad Flat PackNumber of Pins Lead PitchBody SizeLead FootprintLQFP Low Profile Quad Flat Pack 1.4mm ThickPart NumberNumber of Pins Body Size Lead Pitch Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel AvailableLead-Free Finishes .4mm PitchLQFP64-7mm-.4mm-2.0647mm sq .4mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP80-10mm-.4mm-2.08010mm sq .4mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP120-14mm-.4mm-2.012014mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14mm-.4mm-2.012814mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP176-20mm-.4mm-2.017620mm sq .4mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP216-24mm-.4mm-2.021624mm sq .4mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP256-28mm-.4mm-2.025628mm sq .4mm 2444mm 40mm 500Sn, SnCu or SnBi .5mm PitchLQFP48-7mm-.5mm-2.0487mm sq .5mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP64-10mm-.5mm-2.06410mm sq .5mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-12mm-.5mm-2.08012mm sq .5mm 9024mm 20/24mm 1,000Sn, SnCu or SnBi LQFP100-14mm-.5mm-2.010014mm sq .5mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14x20mm-.5mm-2.012814 x 20mm .5mm 7244mm 32mm 500Sn, SnCu or SnBi LQFP128-20mm-.5mm-2.012820mm sq .5mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP144-20mm-.5mm-2.0*14420mm sq .5mm 6044mm 24mm 750Sn, SnCu or SnBi LQFP160-24mm-.5mm-2.016024mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP176-24mm-.5mm-2.0*17624mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP208-28mm-.5mm-2.0*20828mm sq .5mm 3644mm 40mm 500Sn, SnCu or SnBi .65mm PitchLQFP52-10mm-.65mm-2.05210mm sq .65mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-14mm-.65mm-2.08014mm sq .65mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP100-14x20mm-.65mm-2.010014x20mm .65mm 7244mm 32mm 500Sn, SnCu or SnBi .8mm PitchLQFP32-7mm-.8mm-2.0327mm sq .8mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP44-10mm-.8mm-2.04410mm sq .8mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP64-14mm-.8mm-2.06414mm sq.8mm9032mm24mm750Sn, SnCu or SnBiDaisy-Chain And Lead-Free Parts Available!For drawings, please visit our web site at .Dummy ComponentsTQFPThin Quad Flat PackThin Quad Flat Pack (TQFP) packages provide the same benefit of the metric QFP package, but are thinner (body thickness of 1.0mm) and have a standard lead-frame footprint (2.0mm lead footprint). TQFPs are help-ing to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are used for the TQFP package. Lead pitches available for TQFP package are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.Exposed Pad L/TQFP PackageTQFP PackageMold Die Up (Standard)Die AttachDie Down (Inverted)Notes* = Available as an Exposed Pad L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB.TQFP is available in die up configurations in 1.0mm thickness only. 5 x 5mm to 20 x 20mm body size (JEDEC Standard). 32 to 176 lead counts. Copper leadframes.1.0mm body thickness for TQFP. Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.Part Number System▪ Add “ePad” to beginning of part number when orderingExposedPad™ package.▪ Add “TR” to end of part number for Tape and Reel.▪ Add “LF” to end of part number for Lead-Free.Mold Die Up (Standard)TQFP Thin Quad Flat Pack 1.0mm ThickPart NumberNumber of Pins Body SizeLead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel A-TQFP32-5mm-.5mm-2.0*325mm sq .5mm 2.0mm 36016mm 12mm 1,000A-TQFP32-7mm-.8mm-2.0*327mm sq .8mm 2.0mm 25016mm 12mm 1,000A-TQFP40-5mm-.4mm-2.0*405mm sq .4mm 2.0mm 36016mm 12mm 1,000A-TQFP44-10mm-.8mm-2.0*4410mm sq .8mm 2.0mm 16024mm 16mm 1,000A-TQFP48-7mm-.5mm-2.0 *487mm sq .5mm 2.0mm 25016mm 12mm 1,000A-TQFP52-10mm-.65mm-2.0 *5210mm sq .65mm 2.0mm 16024mm 16mm 1,000A-TQFP64-7mm-.4mm-2.0*647mm sq .4mm 2.0mm 25016mm 12mm 1,000A-TQFP64-10mm-.5mm-2.0*6410mm sq .5mm 2.0mm 16024mm 16mm 1,000A-TQFP64-14mm-.8mm-2.0 *6414mm sq .8mm 2.0mm 9032mm 24mm 750A-TQFP80-12mm-.5mm-2.0 *8012mm sq .5mm 2.0mm 11924mm 24mm 1,000A-TQFP80-14mm-.65mm-2.0*8014mm sq .65mm 2.0mm 9032mm 24mm 750A-TQFP100-14mm-.5mm-2.0*10014mm sq .5mm 2.0mm 9032mm 24mm 750A-TQFP120-14mm-.4mm-2.0 *12014mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-14mm-.4mm-2.0*12814mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-20mm-.5mm-2.0 *12820mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP144-20mm-.5mm-2.0 *14420mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP176-20mm-.4mm-2.0 *17620mm sq.4mm2.0mm6044mm24mm500A-TQFP32-5mm-.5mm-2.0Thin Quad Flat PackBody SizeLead FootprintNumber of PinsLead PitchAmkorD u m m y C o m p o n e n t sNotesAll QFPs are standard in JEDEC trays. Tray quantities may vary. Carrier tape is plastic.SnCu, SnBi or 100% Sn finish.QFPQuad Flat PackQuad Flat Pack (QFP) components have four sides with leads extend-ing from the component body on all four sides. QFP componentscome packaged in trays or on tape and reel to protect the component leads that can be easily damaged. An important measurement for QFPs is coplanarity. When the first lead from the component is placedPart Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn, SnCu or SnBi.QFP44–10mm–.8mm–3.9mmQuadFlat PackNumber of Pins Lead Pitch Body SizeLead FootprintDaisy-Chain And Lead-Free Parts Available!QFP Plastic Quad Flat PackPart NumberNumber of Pins Body Size Body Thickness Lead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity 13" Reel AvailableLead-Free Finishes .40mm PitchQFP256-28mm-.4mm-2.625628mm sq 3.37mm .40mm 2.6mm 244440200Sn, SnCu or SnBi .50mm PitchQFP64-10mm-.50mm-3.26410mm sq 2.0mm .50mm 3.2mm 962424500Sn, SnCu or SnBi QFP64-10mm-.50mm-3.96410mm sq 2.0mm.50mm 3.9mm 962424500Sn, SnCu or SnBi QFP100-14mm-.5mm-3.210014mm sq 2.0/2.67mm .50mm 3.2mm 843224350Sn, SnCu or SnBi QFP100-14mm-.5mm-3.910014mm sq 2.67mm .50mm 3.9mm 843224350Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.212814 x 20mm 2.71mm .50mm 3.2mm 664432200Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.912814 x 20mm 2.71mm .50mm 3.9mm 664432200Sn, SnCu or SnBi QFP208-28mm-.5mm-2.620828mm sq 3.37mm .50mm 2.6mm 244440200Sn, SnCu or SnBi QFP208-28mm-.5mm-3.220828mm sq 3.37mm .50mm 3.2mm 244440200Sn, SnCu or SnBi QFP240-32mm-.5mm-2.624032mm sq 3.4mm .50mm 2.6mm 245644250Sn, SnCu or SnBi QFP304-40mm-.5mm-2.630440mm sq 3.8mm .50mm 2.6mm 12n/a n/a —Sn, SnCu or SnBi .65mm PitchQFP52-10mm-.65mm-3.25210mm sq 2.0mm .65mm 3.2mm 962424500Sn, SnCu or SnBi QFP52-10mm-.65mm-3.95210mm sq 2.0mm.65mm 3.9mm 962424500Sn, SnCu or SnBi QFP80-14mm-.65mm-3.28014mm sq 2.0/2.67mm .65mm 3.2mm 843224350Sn, SnCu or SnBi QFP80-14mm-.65mm-3.98014mm sq 2.67mm .65mm 3.9mm 843224350Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.210014 x 20mm 2.71mm .65mm 3.2mm 664432200Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.910014 x 20mm 2.71mm .65mm 3.9mm 664432200Sn, SnCu or SnBi QFP144-28mm-.65mm-2.614428mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP144-28mm-.65mm-3.214428mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-2.616028mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.216028mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.916028mm sq 3.37mm .65mm 3.9mm 244440200Sn, SnCu or SnBi .80mm PitchQFP44-10mm-.8mm-3.24410mm sq 2.0mm .80mm 3.2mm 962424500Sn, SnCu or SnBi QFP44-10mm-.8mm-3.94410mm sq 2.0mm.80mm 3.9mm 962424500Sn, SnCu or SnBi QFP64-14mm-.8mm-3.26414mm sq 2.0/2.67mm .80mm 3.2mm 843224350Sn, SnCu or SnBi QFP64-14mm-.8mm-3.96414mm sq 2.67mm .80mm 3.9mm 843224350Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.28014 x 20mm 2.71mm .80mm 3.2mm 664432200Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.98014 x 20mm 2.71mm .80mm 3.9mm 664432200Sn, SnCu or SnBi QFP120-28mm-.8mm-2.612028mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP120-28mm-.8mm-3.212028mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-2.612828mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-3.212828mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi 1.00mm PitchQFP52-14mm-1.0mm-3.25214mm sq 2.0/2.67mm 1.00mm 3.2mm 843224350Sn, SnCu or SnBi QFP52-14mm-1.0mm-3.95214mm sq 2.67mm 1.00mm 3.9mm 843224350Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.26414 x 20mm 2.71mm 1.00mm 3.2mm 664432200Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.96414 x 20mm2.71mm1.00mm3.9mm664432200Sn, SnCu or SnBion the PCB coplanarity is established. Coplanarity ensures the last lead can be placed on the board. The standard for QFP coplanarity is ±4 mils. Lead-free versions of QFPs are now available. Please call for additional information.Dummy ComponentsCQFPCeramic Quad Flat PackCQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 14 to 304, with lead pitch rangingPart Number Systemeither metal or ceramic. Lids are attached after die attach. This allows for a hermetically sealed environment for the die.from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be solder-coated by special request. Lids are optional for CQFPs, which are sealed over the package cavity at temperatures from 400° to 460° C.NotesCQFPs are available with or without combo lid. Pins are flat (sandwiched) with tie bar. Parts are packaged in non-JEDEC trays.Due to the custom nature of the package, body size and dimensions can change without notice.Parts available with a daisy-chain configuration upon request. Other ceramic packages available upon request. Glass or epoxy seal.Footprint compatible with plastic QFP packages. EIAJ and JEDEC standards.Lead-frames are embedded into the glass to create both internal die connection and external PCB connection.This surface mount package consists of a ceramic base that has metal-ized castellations/pads on the sides and bottom of the package. LCC packages have pads on all four sides of the package. Lids for LCCs can beCQFP Ceramic Quad Flat PackPart NumberNumber of Pins Body Size Pitch (Inch)(mm)52CQFP-19.0mm-1.27mm 52.750" sq 19.0mm sq 1.27mm 68CQFP-24.1mm-1.27mm 68.950" sq 24.1mm sq 1.27mm 84CQFP-16.5mm-.65mm 84.650" sq 16.5mm sq .65mm 100CQFP-19.0mm-.65mm 100.750" sq 19.0mm sq .65mm 132CQFP-24.1mm-.65mm 132.950" sq 24.1mm sq .65mm 144CQFP-26.6mm-.65mm 144 1.050" sq 26.6mm sq .65mm 172CQFP-29.2mm-.65mm 172 1.150" sq 29.2mm sq .65mm 196CQFP-32.0mm-.50mm1961.260" sq32.0mm sq.50mmNotesLCCs are available with or without combo lid.Gold castellations are standard, but can be solder-coated with 100% Sn or Sn/Cu alloy.Parts are packaged in non-JEDEC trays.upon request.LCC Leadless Ceramic CarrierPart NumberNumber of Castellations Body Size Pitch (Inch)(mm)16LCC-1.27mm-7.36x8.96mm 16.350" x .285"7.36 x 8.96mm 1.27mm 20LCC-1.27mm-8.90mm 20.350" sq 8.90mm sq 1.27mm 28LCC-1.27mm-11.5mm28.450" sq 11.50mm sq 1.27mm 32LCC-1.27mm-11.4x14.0mm 32.550" x .450"11.40 x 14.00mm 1.27mm 40LCC-1.00mm-10.1mm 40.400" sq 10.10mm sq 1.00mm 44LCC-1.27mm-16.5mm 44.650" sq 16.50mm sq 1.27mm 48LCC-1.00mm-14.2mm 48.560" sq 14.20mm sq 1.00mm 52LCC-1.27mm-19.0mm 52.750" sq 19.00mm sq 1.27mm 68LCC-1.27mm-24.11mm 68.950" sq 24.11mm sq 1.27mm 84LCC-1.27mm-29.2mm841.150" sq29.20mm sq1.27mmLCCLeadless Ceramic Carrier52CQFP–19.0mm–1.27mmI/O CountBody SizeLead PitchCeramic Quad Flat Pack20LCC–1.27mm–8.90mm Number of CastellationsPitch Body SizeLeadless Ceramic CarrierFor recommended kits see pages 71 and 55.。

LQFP,TQFP,QFP,CQFP封装尺寸表

D u m m y C o m p o n e n t sLQFPLow Profile Quad Flat PackLow Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footprint).LQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 256. Body sizes range from 5 x 5mm to 28 x 28mm. Copper lead-frames are used for the LQFP package. Lead pitches available for LQFP package are 0.65mm, 0.5mm, 0.4mm.Notes* = Available as an ExposedPad™ L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB. All LQFPs are standard in trays.LQFPs have a body thickness of 1.4mm. Tray quantity may vary. Tape type is plastic.Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.For recommended kits see pages58, 68, 71, 81, 73 and 70.Part Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn or SnCu or SnBi.LQFP48–7mm–.5mm–2.0Low Profile Quad Flat PackNumber of Pins Lead PitchBody SizeLead FootprintLQFP Low Profile Quad Flat Pack 1.4mm ThickPart NumberNumber of Pins Body Size Lead Pitch Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel AvailableLead-Free Finishes .4mm PitchLQFP64-7mm-.4mm-2.0647mm sq .4mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP80-10mm-.4mm-2.08010mm sq .4mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP120-14mm-.4mm-2.012014mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14mm-.4mm-2.012814mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP176-20mm-.4mm-2.017620mm sq .4mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP216-24mm-.4mm-2.021624mm sq .4mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP256-28mm-.4mm-2.025628mm sq .4mm 2444mm 40mm 500Sn, SnCu or SnBi .5mm PitchLQFP48-7mm-.5mm-2.0487mm sq .5mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP64-10mm-.5mm-2.06410mm sq .5mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-12mm-.5mm-2.08012mm sq .5mm 9024mm 20/24mm 1,000Sn, SnCu or SnBi LQFP100-14mm-.5mm-2.010014mm sq .5mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14x20mm-.5mm-2.012814 x 20mm .5mm 7244mm 32mm 500Sn, SnCu or SnBi LQFP128-20mm-.5mm-2.012820mm sq .5mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP144-20mm-.5mm-2.0*14420mm sq .5mm 6044mm 24mm 750Sn, SnCu or SnBi LQFP160-24mm-.5mm-2.016024mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP176-24mm-.5mm-2.0*17624mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP208-28mm-.5mm-2.0*20828mm sq .5mm 3644mm 40mm 500Sn, SnCu or SnBi .65mm PitchLQFP52-10mm-.65mm-2.05210mm sq .65mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-14mm-.65mm-2.08014mm sq .65mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP100-14x20mm-.65mm-2.010014x20mm .65mm 7244mm 32mm 500Sn, SnCu or SnBi .8mm PitchLQFP32-7mm-.8mm-2.0327mm sq .8mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP44-10mm-.8mm-2.04410mm sq .8mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP64-14mm-.8mm-2.06414mm sq.8mm9032mm24mm750Sn, SnCu or SnBiDaisy-Chain And Lead-Free Parts Available!For drawings, please visit our web site at .Dummy ComponentsTQFPThin Quad Flat PackThin Quad Flat Pack (TQFP) packages provide the same benefit of the metric QFP package, but are thinner (body thickness of 1.0mm) and have a standard lead-frame footprint (2.0mm lead footprint). TQFPs are help-ing to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are used for the TQFP package. Lead pitches available for TQFP package are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.Exposed Pad L/TQFP PackageTQFP PackageMold Die Up (Standard)Die AttachDie Down (Inverted)Notes* = Available as an Exposed Pad L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB.TQFP is available in die up configurations in 1.0mm thickness only. 5 x 5mm to 20 x 20mm body size (JEDEC Standard). 32 to 176 lead counts. Copper leadframes.1.0mm body thickness for TQFP. Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.Part Number System▪ Add “ePad” to beginning of part number when orderingExposedPad™ package.▪ Add “TR” to end of part number for Tape and Reel.▪ Add “LF” to end of part number for Lead-Free.Mold Die Up (Standard)TQFP Thin Quad Flat Pack 1.0mm ThickPart NumberNumber of Pins Body SizeLead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel A-TQFP32-5mm-.5mm-2.0*325mm sq .5mm 2.0mm 36016mm 12mm 1,000A-TQFP32-7mm-.8mm-2.0*327mm sq .8mm 2.0mm 25016mm 12mm 1,000A-TQFP40-5mm-.4mm-2.0*405mm sq .4mm 2.0mm 36016mm 12mm 1,000A-TQFP44-10mm-.8mm-2.0*4410mm sq .8mm 2.0mm 16024mm 16mm 1,000A-TQFP48-7mm-.5mm-2.0 *487mm sq .5mm 2.0mm 25016mm 12mm 1,000A-TQFP52-10mm-.65mm-2.0 *5210mm sq .65mm 2.0mm 16024mm 16mm 1,000A-TQFP64-7mm-.4mm-2.0*647mm sq .4mm 2.0mm 25016mm 12mm 1,000A-TQFP64-10mm-.5mm-2.0*6410mm sq .5mm 2.0mm 16024mm 16mm 1,000A-TQFP64-14mm-.8mm-2.0 *6414mm sq .8mm 2.0mm 9032mm 24mm 750A-TQFP80-12mm-.5mm-2.0 *8012mm sq .5mm 2.0mm 11924mm 24mm 1,000A-TQFP80-14mm-.65mm-2.0*8014mm sq .65mm 2.0mm 9032mm 24mm 750A-TQFP100-14mm-.5mm-2.0*10014mm sq .5mm 2.0mm 9032mm 24mm 750A-TQFP120-14mm-.4mm-2.0 *12014mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-14mm-.4mm-2.0*12814mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-20mm-.5mm-2.0 *12820mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP144-20mm-.5mm-2.0 *14420mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP176-20mm-.4mm-2.0 *17620mm sq.4mm2.0mm6044mm24mm500A-TQFP32-5mm-.5mm-2.0Thin Quad Flat PackBody SizeLead FootprintNumber of PinsLead PitchAmkorD u m m y C o m p o n e n t sNotesAll QFPs are standard in JEDEC trays. Tray quantities may vary. Carrier tape is plastic.SnCu, SnBi or 100% Sn finish.QFPQuad Flat PackQuad Flat Pack (QFP) components have four sides with leads extend-ing from the component body on all four sides. QFP componentscome packaged in trays or on tape and reel to protect the component leads that can be easily damaged. An important measurement for QFPs is coplanarity. When the first lead from the component is placedPart Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn, SnCu or SnBi.QFP44–10mm–.8mm–3.9mmQuadFlat PackNumber of Pins Lead Pitch Body SizeLead FootprintDaisy-Chain And Lead-Free Parts Available!QFP Plastic Quad Flat PackPart NumberNumber of Pins Body Size Body Thickness Lead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity 13" Reel AvailableLead-Free Finishes .40mm PitchQFP256-28mm-.4mm-2.625628mm sq 3.37mm .40mm 2.6mm 244440200Sn, SnCu or SnBi .50mm PitchQFP64-10mm-.50mm-3.26410mm sq 2.0mm .50mm 3.2mm 962424500Sn, SnCu or SnBi QFP64-10mm-.50mm-3.96410mm sq 2.0mm.50mm 3.9mm 962424500Sn, SnCu or SnBi QFP100-14mm-.5mm-3.210014mm sq 2.0/2.67mm .50mm 3.2mm 843224350Sn, SnCu or SnBi QFP100-14mm-.5mm-3.910014mm sq 2.67mm .50mm 3.9mm 843224350Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.212814 x 20mm 2.71mm .50mm 3.2mm 664432200Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.912814 x 20mm 2.71mm .50mm 3.9mm 664432200Sn, SnCu or SnBi QFP208-28mm-.5mm-2.620828mm sq 3.37mm .50mm 2.6mm 244440200Sn, SnCu or SnBi QFP208-28mm-.5mm-3.220828mm sq 3.37mm .50mm 3.2mm 244440200Sn, SnCu or SnBi QFP240-32mm-.5mm-2.624032mm sq 3.4mm .50mm 2.6mm 245644250Sn, SnCu or SnBi QFP304-40mm-.5mm-2.630440mm sq 3.8mm .50mm 2.6mm 12n/a n/a —Sn, SnCu or SnBi .65mm PitchQFP52-10mm-.65mm-3.25210mm sq 2.0mm .65mm 3.2mm 962424500Sn, SnCu or SnBi QFP52-10mm-.65mm-3.95210mm sq 2.0mm.65mm 3.9mm 962424500Sn, SnCu or SnBi QFP80-14mm-.65mm-3.28014mm sq 2.0/2.67mm .65mm 3.2mm 843224350Sn, SnCu or SnBi QFP80-14mm-.65mm-3.98014mm sq 2.67mm .65mm 3.9mm 843224350Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.210014 x 20mm 2.71mm .65mm 3.2mm 664432200Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.910014 x 20mm 2.71mm .65mm 3.9mm 664432200Sn, SnCu or SnBi QFP144-28mm-.65mm-2.614428mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP144-28mm-.65mm-3.214428mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-2.616028mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.216028mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.916028mm sq 3.37mm .65mm 3.9mm 244440200Sn, SnCu or SnBi .80mm PitchQFP44-10mm-.8mm-3.24410mm sq 2.0mm .80mm 3.2mm 962424500Sn, SnCu or SnBi QFP44-10mm-.8mm-3.94410mm sq 2.0mm.80mm 3.9mm 962424500Sn, SnCu or SnBi QFP64-14mm-.8mm-3.26414mm sq 2.0/2.67mm .80mm 3.2mm 843224350Sn, SnCu or SnBi QFP64-14mm-.8mm-3.96414mm sq 2.67mm .80mm 3.9mm 843224350Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.28014 x 20mm 2.71mm .80mm 3.2mm 664432200Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.98014 x 20mm 2.71mm .80mm 3.9mm 664432200Sn, SnCu or SnBi QFP120-28mm-.8mm-2.612028mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP120-28mm-.8mm-3.212028mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-2.612828mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-3.212828mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi 1.00mm PitchQFP52-14mm-1.0mm-3.25214mm sq 2.0/2.67mm 1.00mm 3.2mm 843224350Sn, SnCu or SnBi QFP52-14mm-1.0mm-3.95214mm sq 2.67mm 1.00mm 3.9mm 843224350Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.26414 x 20mm 2.71mm 1.00mm 3.2mm 664432200Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.96414 x 20mm2.71mm1.00mm3.9mm664432200Sn, SnCu or SnBion the PCB coplanarity is established. Coplanarity ensures the last lead can be placed on the board. The standard for QFP coplanarity is ±4 mils. Lead-free versions of QFPs are now available. Please call for additional information.Dummy ComponentsCQFPCeramic Quad Flat PackCQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 14 to 304, with lead pitch rangingPart Number Systemeither metal or ceramic. Lids are attached after die attach. This allows for a hermetically sealed environment for the die.from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be solder-coated by special request. Lids are optional for CQFPs, which are sealed over the package cavity at temperatures from 400° to 460° C.NotesCQFPs are available with or without combo lid. Pins are flat (sandwiched) with tie bar. Parts are packaged in non-JEDEC trays.Due to the custom nature of the package, body size and dimensions can change without notice.Parts available with a daisy-chain configuration upon request. Other ceramic packages available upon request. Glass or epoxy seal.Footprint compatible with plastic QFP packages. EIAJ and JEDEC standards.Lead-frames are embedded into the glass to create both internal die connection and external PCB connection.This surface mount package consists of a ceramic base that has metal-ized castellations/pads on the sides and bottom of the package. LCC packages have pads on all four sides of the package. Lids for LCCs can beCQFP Ceramic Quad Flat PackPart NumberNumber of Pins Body Size Pitch (Inch)(mm)52CQFP-19.0mm-1.27mm 52.750" sq 19.0mm sq 1.27mm 68CQFP-24.1mm-1.27mm 68.950" sq 24.1mm sq 1.27mm 84CQFP-16.5mm-.65mm 84.650" sq 16.5mm sq .65mm 100CQFP-19.0mm-.65mm 100.750" sq 19.0mm sq .65mm 132CQFP-24.1mm-.65mm 132.950" sq 24.1mm sq .65mm 144CQFP-26.6mm-.65mm 144 1.050" sq 26.6mm sq .65mm 172CQFP-29.2mm-.65mm 172 1.150" sq 29.2mm sq .65mm 196CQFP-32.0mm-.50mm1961.260" sq32.0mm sq.50mmNotesLCCs are available with or without combo lid.Gold castellations are standard, but can be solder-coated with 100% Sn or Sn/Cu alloy.Parts are packaged in non-JEDEC trays.upon request.LCC Leadless Ceramic CarrierPart NumberNumber of Castellations Body Size Pitch (Inch)(mm)16LCC-1.27mm-7.36x8.96mm 16.350" x .285"7.36 x 8.96mm 1.27mm 20LCC-1.27mm-8.90mm 20.350" sq 8.90mm sq 1.27mm 28LCC-1.27mm-11.5mm28.450" sq 11.50mm sq 1.27mm 32LCC-1.27mm-11.4x14.0mm 32.550" x .450"11.40 x 14.00mm 1.27mm 40LCC-1.00mm-10.1mm 40.400" sq 10.10mm sq 1.00mm 44LCC-1.27mm-16.5mm 44.650" sq 16.50mm sq 1.27mm 48LCC-1.00mm-14.2mm 48.560" sq 14.20mm sq 1.00mm 52LCC-1.27mm-19.0mm 52.750" sq 19.00mm sq 1.27mm 68LCC-1.27mm-24.11mm 68.950" sq 24.11mm sq 1.27mm 84LCC-1.27mm-29.2mm841.150" sq29.20mm sq1.27mmLCCLeadless Ceramic Carrier52CQFP–19.0mm–1.27mmI/O CountBody SizeLead PitchCeramic Quad Flat Pack20LCC–1.27mm–8.90mm Number of CastellationsPitch Body SizeLeadless Ceramic CarrierFor recommended kits see pages 71 and 55.。

元器件封装大全：图解文字详述

元器件封装类型：A.Axial轴状的封装（电阻的封装）AGP （Accelerate raphical Port）加速图形接口AMR(Audio/MODEM Riser) 声音/调制解调器插卡BBGA（Ball Grid Array）球形触点阵列，表面贴装型封装之一。

在印刷基板的背面按阵列方式制作出球形凸点用以代替引脚，在印刷基板的正面装配LSI 芯片，然后用模压树脂或灌封方法进行密封。

也称为凸点阵列载体(PAC)BQFP(quad flat package with bumper)带缓冲垫的四侧引脚扁平封装。

QFP封装之一，在封装本体的四个角设置突(缓冲垫)以防止在运送过程中引脚发生弯曲变形。

C 陶瓷片式载体封装C－(ceramic) 表示陶瓷封装的记号。

例如，CDIP 表示的是陶瓷DIP。

Cerdip 用玻璃密封的陶瓷双列直插式封装，用于ECL RAM，DSP(数字信号处理器)等电路。

带有玻璃窗口的Cerdip 用于紫外线擦除型EPROM 以及内部带有EPROM 的微机电路等。

CERQUAD(Ceramic Quad Flat Pack)表面贴装型封装之一，即用下密封的陶瓷QFP，用于封装DSP 等的逻辑LSI 电路。

带有窗口的Cerquad 用于封装EPROM 电路。

散热性比塑料QFP 好，在自然空冷条件下可容许1.5～2W 的功率CGA(Column Grid Array) 圆柱栅格阵列，又称柱栅阵列封装CCGA(Ceramic Column Grid Array) 陶瓷圆柱栅格阵列CNR是继AMR之后作为INTEL的标准扩展接口CLCC 带引脚的陶瓷芯片载体，引脚从封装的四个侧面引出，呈丁字形。

带有窗口的用于封装紫外线擦除型EPROM 以及带有EPROM 的微机电路等。

此封装也称为QFJ、QFJ－G COB(chip on board) 板上芯片封装，是裸芯片贴装技术之一，半导体芯片交接贴装在印刷线路板上，芯片与基板的电气连接用引线缝合方法实现，芯片与基板的电气连接用引线缝合方法实现，并用树脂覆盖以确保可靠性。

芯片封装类型图解

芯片封装类型图解本文介绍了常见的集成电路封装形式，包括BGA、CPGA、FBGA、JLCC、LDCC、LQFP100L、PCDIP、PLCC、PPGA、PQFP、TQFP100L、TSBGA217L、TSOP、CSP、SIP、ZIP、S-DIP、SK-DIP、PGA、SOP、MSP和QFP等。

SIP是单列直插式封装，引脚在芯片单侧排列，与DIP基本相同。

ZIP是Z型引脚直插式封装，引脚比SIP粗短些，节距等特征也与DIP基本相同。

S-DIP是收缩双列直插式封装，引脚在芯片两侧排列，引脚节距为1.778mm，芯片集成度高于DIP。

SK-DIP是窄型双列直插式封装，除了芯片的宽度是DIP的1/2以外，其它特征与DIP相同。

PGA是针栅阵列插入式封装，封装底面垂直阵列布置引脚插脚，插脚节距为2.54mm或1.27mm，插脚数可多达数百脚，用于高速的且大规模和超大规模集成电路。

SOP是小外型封装，表面贴装型封装的一种，引脚端子从封装的两个侧面引出，字母L状，引脚节距为1.27mm。

MSP是微方型封装，表面贴装型封装的一种，又叫QFI等，引脚端子从封装的四个侧面引出，呈I字形向下方延伸，没有向外突出的部分，实装占用面积小，引脚节距为1.27mm。

QFP是四方扁平封装，表面贴装型封装的一种，引脚端子从封装的两个侧面引出，呈L字形，引脚节距为1.0mm、0.8mm、0.65mm、0.5mm、0.4mm、0.3mm，引脚可达300脚以上。

SVP是一种表面安装型垂直封装，其引脚端子从封装的一个侧面引出，中间部位弯成直角并与PCB键合，适用于垂直安装，实装占有面积很小。

其引脚节距为0.65mm和0.5mm。

LCCC是一种无引线陶瓷封装载体，其四个侧面都设有电极焊盘而无引脚，适用于高速、高频集成电路封装。

PLCC是一种无引线塑料封装载体，适用于高速、高频集成电路封装，是一种塑料封装的LCC。

SOJ是一种小外形J引脚封装，其引脚端子从封装的两个侧面引出，呈J字形，引脚节距为1.27mm。

芯片封装类型图解

集成电路封装形式介绍(图解）BGA BGFP132CLCCCPGA DIP EBGA 680L FBGA FDIP FQFP 100L JLCC BGA160L LCCLDCC LGA LQFP LQFP100L Metal Qual100L PBGA217L PCDIP PLCC PPGAPQFP QFP SBA 192L TQFP100L TSBGA217L TSOPCSPSIP: 单列直插式封装.该类型的引脚在芯片单侧排列 ,引脚节距等特征与 DIP 基本相同封装 .该类型的引脚也在芯片单侧排列 ,只是引脚比 SIP 粗短些 , 节距等特征也与.ZIP:Z 型引脚直插式DIP 基本相同 .S-DIP: 收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为 1.778mm, 芯片集成度高于DIP.SK-DIP: 窄型双列直插式封装.除了芯片的宽度是DIP 的 1/2 以外 ,其它特征与DIP 相同 .PGA: 针栅阵列插入式封装 .封装底面垂直阵列布置引脚插脚, 如同针栅 . 插脚节距为 2.54mm 或 1.27mm, 插脚数可多达数百脚用于高速的且大规模和超大规模集成电路..SOP: 小外型封装 . 表面贴装型封装的一种,引脚端子从封装的两个侧面引出, 字母 L 状.引脚节距为1.27mm.MSP:微方型封装. 表面贴装型封装的一种,又叫 QFI 等,引脚端子从封装的四个侧面引出伸,没有向外突出的部分,实装占用面积小,引脚节距为 1.27mm.,呈 I 字形向下方延QFP: 四方扁平封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 L 字形 ,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300 脚以上 .SVP: 表面安装型垂直封装. 表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部与PCB 键合 ,为垂直安装的封装. 实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC: 无引线陶瓷封装载体. 在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速, 高频集成电路封装.PLCC: 无引线塑料封装载体.一种塑料封装的LCC. 也用于高速 ,高频集成电路封装.SOJ: 小外形 J 引脚封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 J 字形 ,引脚节距为1.27mm.BGA:球栅阵列封装 .表面贴装型封装的一种,在 PCB 焊球的节距通常为 1.5mm,1.0mm,0.8mm,的背面布置二维阵列的球形端子,而不采用针脚引脚与 PGA 相比 ,不会出现针脚变形问题..CSP: 芯片级封装 .一种超小型表面贴装型封装,其引脚也是球形端子,节距为 0.8mm,0.65mm,0.5mm等.TCP: 带载封装.在形成布线的绝缘带上搭载裸芯片,并与布线相连接的封装.与其他表面贴装型封装相比芯片更薄 ,引脚节距更小 ,达 0.25mm, 而引脚数可达500 针以上 .,介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容 )Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf 类元件Melf type Component [Cylinder]Sop 元件Small outline package 小外形封装TSop 元件Thin Sop 薄形封装SOJ 元件Small Outline J-lead Package具有丁形引线的小外形封装QFP 元件Quad Flat Package 方形扁平封装PLCC 元件Plastic Leaded Chip Carrier塑料有引线芯片载体BGABall Grid Array球脚陈列封装球栅陈列封装CSPChip Size Package 芯片尺寸封装2 特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC 卡连接器IC Card Connector附 BGA封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA 微小 BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积与封装面积之比越来越接近于 1 适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model多芯片组件)英汉缩语对照SMTSurface Mount Technology表面贴装技术SMDSurface Mounting Devices表面安装器件SMBSurface Mounting Printed Circuit Board表面安装印刷板DIP Dual-In-Line Package双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面： DIP 封装 (70 年代 )->SMT 工艺 (80 年代 LCCC/PLCC/SOP/QFP)->BGA封装(90 年代 )-> 面向未来的工艺 (CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－ >塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－ >表面组装－ >直接安装一． TO 晶体管外形封装TO（Transistor Out-line ）的中文意思是“晶体管外形”。

液晶显示器IC封装的多种形式

液晶显示器IC封装的多种形式
液晶显示器IC的封装有多种形式，主要有DIP、SOP、SOJ、QFP（PQFP、TQFP）、PLCC和BGA封装等，如图1所示。

图1液晶显示器常用集成电路的封装形式
1．DIP封装
DIP（DualIn-linePackage），即双列直插式封装，绝大多数中小规模集成电路均采用这种封装形式，其引脚数一般不超过100个。

DIP封装的芯片有两排引脚，分布于两侧，且成直线平行布置，引脚直径和间距为2。

54mm，需要插入到具有DiP结构的芯片插座上。

当然，也可以直接插在有相同焊孔数和几何排列的电路板上进行焊接。

DIP具有以下特点：
①适合在印制电路板（PCB）上穿孔焊接，操作方便。

②芯片面积与封装面积之间的比值较大，故体积也较大。

③除其夕卜形尺寸及引脚数之外，并无其他特殊要求。

但由于引脚直径和间距都不能太小，故PCB上通孔直径、间距以及布线间距都不能太小，故此种封装难以实现高密度安装。

目前，在液晶显示器中，只有部分集成电路采用DIP封装。

2．SOP封装
SOP（Small电源控制IC等很多集成电路都采用这种封装形式。

SOP封装引脚的判断方法是：IC的一角有一个黑点标记的，按逆时针方向数；没有标记的，将IC上的文字方向放正，从左下角开始逆时针方向数。

3．SOJ封装
S0J（SmallOut-LineJ-LeadedPackage），即J形引脚小尺寸封装，引脚从封装主体两侧引出向下呈J字形，直接粘贴在印制电路板的表面。

4．QFP封装
QFP（PlasTIcQuadFlatPackage），即四方扁平封装，这种封装的芯片引脚之间距离很小，。

封装参考

主控板和底板部分，主控芯片STM32F103VET6从机芯片STM32F103C8T6，两者均选用LQFP封装形式，在实验室用LQFP100-N型，引脚数目自己定义。

LQFP100-L LQFP100-M LQFP100-N可以看出没什么区别。

QFP LQFP TQFP封装形式：都是方形扁平封装，只是厚度不同。

LQFP和TQFP，如果引脚数相同，并且本体大小相同或引脚间距相同时，他们的PCB封装可以通用。

而QFP，footprint 一项与LQFP和TQFP都不能对应，所以QFP和LQFP，TQFP应该是不能通用的。

同是LQFP封装形式IC，由于芯片本身的规格的不同，引脚间距也不同，画封装要认真查阅资料。

实验室所用的都是一般规格的芯片，大多数可以通用。

MC1403，W25X16，MAX3232，SP485，MAX3491，TJA1050等一般用SO封装，根据引脚数目的不同选择引脚数目，例如SO8，SO14，SO16等。

SOP SO SOIC TSSOP SSOP由上图可以看出SOP 、SO、SOIC 三者管脚大小和间距是一样的，只是整体外形大小同，TSSOP和SSOP管脚大小和间距相同，管脚间距明显比SOP系列的要小。

至于那些其他形式的封装实验室没使用，或者用的很少就不介绍了。

要想了解自己查资料。

HT7533稳压芯片，实验室选用的是SOT-89封装，HT7533常用封装如下：SOT-89SOT-25TO-92二极管的一般封装：DO-35,DO-41玻封二极管；LL-34,LL-41玻封二极管；DO-41塑封二极管；SOD123，SOD323，SOD523塑封二极管；TO220封装。

SOT23贴片二极管。

DO-35 DO-41LL-34 LL-41DO-41 SOD123，SOD323，SOD523TO220 SOT23其对应的封装形式：TO220 DO-41DO-35 SOT23LL-34 LL-41 对应为1206贴片封装；SOD123对应为1206，SOD323对应为0805，SOD523对应为0603，一般的LED发光二极管用0805封装。

芯片封装类型图解

集成电路封装形式介绍(图解）BGA BGFP132 CLCCCPGA DIP EBGA 680LFBGA FDIP FQFP 100LJLCC BGA160L LCCLDCC LGA LQFPLQFP100L Metal Qual100L PBGA217LPCDIP PLCC PPGAPQFP QFP SBA 192LTQFP100L TSBGA217L TSOPCSPSIP:单列直插式封装.该类型的引脚在芯片单侧排列,引脚节距等特征和DIP基本相同.ZIP:Z型引脚直插式封装.该类型的引脚也在芯片单侧排列,只是引脚比SIP粗短些,节距等特征也和DIP基本相同.S-DIP:收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为1.778mm,芯片集成度高于DIP.SK-DIP:窄型双列直插式封装.除了芯片的宽度是DIP的1/2以外,其它特征和DIP相同.PGA:针栅阵列插入式封装.封装底面垂直阵列布置引脚插脚,如同针栅.插脚节距为2.54mm或1.27mm,插脚数可多达数百脚.用于高速的且大规模和超大规模集成电路.SOP:小外型封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,字母L状.引脚节距为1.27mm.MSP:微方型封装.表面贴装型封装的一种,又叫QFI等,引脚端子从封装的四个侧面引出,呈I字形向下方延伸,没有向外突出的部分,实装占用面积小,引脚节距为1.27mm.QFP:四方扁平封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈L字形,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300脚以上.SVP:表面安装型垂直封装.表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部和PCB键合,为垂直安装的封装.实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC:无引线陶瓷封装载体.在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速,高频集成电路封装.PLCC:无引线塑料封装载体.一种塑料封装的LCC.也用于高速,高频集成电路封装.SOJ:小外形J引脚封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈J字形,引脚节距为1.27mm.BGA:球栅阵列封装.表面贴装型封装的一种,在PCB的背面布置二维阵列的球形端子,而不采用针脚引脚.焊球的节距通常为1.5mm,1.0mm,0.8mm,和PGA相比,不会出现针脚变形问题.CSP:芯片级封装.一种超小型表面贴装型封装,其引脚也是球形端子,节距为0.8mm,0.65mm,0.5mm等.TCP:带载封装.在形成布线的绝缘带上搭载裸芯片,并和布线相连接的封装.和其他表面贴装型封装相比,芯片更薄,引脚节距更小,达0.25mm,而引脚数可达500针以上.介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容)Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf类元件Melf type Component [Cylinder]Sop元件Small outline package小外形封装TSop元件Thin Sop薄形封装SOJ元件Small Outline J-lead Package 具有丁形引线的小外形封装QFP元件Quad Flat Package方形扁平封装PLCC元件Plastic Leaded Chip Carrier 塑料有引线芯片载体BGABall Grid Array 球脚陈列封装球栅陈列封装CSPChip Size Package芯片尺寸封装2特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC卡连接器IC Card Connector附BGA 封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA微小BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积和封装面积之比越来越接近于1适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model 多芯片组件)英汉缩语对照SMTSurface Mount Technology 表面贴装技术SMDSurface Mounting Devices 表面安装器件SMBSurface Mounting Printed Circuit Board 表面安装印刷板DIP Dual-In-Line Package 双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board 印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration 大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面：DIP封装(70年代)->SMT工艺(80年代 LCCC/PLCC/SOP/QFP)->BGA封装(90年代)->面向未来的工艺(CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－>塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－>表面组装－>直接安装一．TO 晶体管外形封装TO（Transistor Out-line）的中文意思是“晶体管外形”。

集成电路封装外形及说明

集成电路封装外形及说明
说明：
常见的封装材料有：塑料、陶瓷、玻璃、金属等，现在基本采用塑料封装。

按封装形式分：普通双列直插式，普通单列直插式，小型双列扁平，小型四列扁平，圆形金属，体积较大的厚膜电路等。

按封装体积大小排列分：最大为厚膜电路，其次分别为双列直插式，单列直插式，金属封装、双列扁平、四列扁平为最小。

两引脚之间的间距分：普通标准型塑料封装，双列、单列直插式一般多为2.54±0.25 mm，其次有2mm（多见于单列直插式）、1.778±0.25mm（多见于缩型双列直插式）、1.5±0.25mm，或1.27±0.25mm(多见于单列附散热片或单列V 型)、1.27±0.25mm(多见于双列扁平封装)、1±0.15mm(多见于双列或四列扁平封装)、0.8±0.05～0.15mm(多见于四列扁平封装)、0.65
±0.03mm(多见于四列扁平封装)。

双列直插式两列引脚之间的宽度分：一般有7.4～7.62mm、10.16mm、12.7mm、15.24mm等数种。

双列扁平封装两列之间的宽度分（包括引线长度：一般有6～6.5±mm、7.6mm、10.5～10.65mm 等。

四列扁平封装40 引脚以上的长×宽一般有：10×10mm(不计引线长度)、13.6
×13.6±0.4mm(包括引线长度)、20.6×20.6±0.4mm(包括引线长度)、8.45×8.45±0.5mm(不计引线长度)、14×14±0.15mm（不计引线长度）等。

元器件封装_配实物图_DIP、PLCC、SOP、PQFP、SOJ、TQFP、TSSOP、BGA_

常见元器件封装(实物图)qqqDIPPLCCSOPPQFPSOJTQFPTSSOPBGA芯片封装技术知多少前言我们经常听说某某芯片采用什么什么的封装方式，在我们的电脑中，存在着各种各样不同处理芯片，那么，它们又是是采用何种封装形式呢？并且这些封装形式又有什么样的技术特点以及优越性呢？那么就请看看下面的这篇文章，将为你介绍个中芯片封装形式的特点和优点。

一、DIP双列直插式封装DIP(DualIn－line Package)是指采用双列直插形式封装的集成电路芯片，绝大多数中小规模集成电路(IC)均采用这种封装形式，其引脚数一般不超过100个。

采用DIP封装的CPU芯片有两排引脚，需要插入到具有DIP结构的芯片插座上。

当然，也可以直接插在有相同焊孔数和几何排列的电路板上进行焊接。

DIP封装的芯片在从芯片插座上插拔时应特别小心，以免损坏引脚。

DIP封装具有以下特点：1.适合在PCB(印刷电路板)上穿孔焊接，操作方便。

2.芯片面积与封装面积之间的比值较大，故体积也较大。

Intel系列CPU中8088就采用这种封装形式，缓存(Cache)和早期的内存芯片也是这种封装形式。

二、PQFP塑料方型扁平式封装和PFP塑料扁平组件式封装PQFP（Plastic Quad Flat Package）封装的芯片引脚之间距离很小，管脚很细，一般大规模或超大型集成电路都采用这种封装形式，其引脚数一般在100个以上。

用这种形式封装的芯片必须采用SMD（表面安装设备技术）将芯片与主板焊接起来。

采用SMD安装的芯片不必在主板上打孔，一般在主板表面上有设计好的相应管脚的焊点。

将芯片各脚对准相应的焊点，即可实现与主板的焊接。

用这种方法焊上去的芯片，如果不用专用工具是很难拆卸下来的。

PFP（Plastic Flat Package）方式封装的芯片与QFP方式基本相同。

唯一的区别是QFP一般为正方形，而PFP既可以是正方形，也可以是长方形。

芯片封装类型图解

集成电路封装形式介绍(图解）BGA BGFP132CLCCCPGA DIP EBGA 680L FBGA FDIP FQFP 100L JLCC BGA160L LCCLDCC LGA LQFP LQFP100L Metal Qual100L PBGA217L PCDIP PLCC PPGAPQFP QFP SBA 192L TQFP100L TSBGA217L TSOPCSPSIP: 单列直插式封装.该类型的引脚在芯片单侧排列 ,引脚节距等特征与 DIP 基本相同封装 .该类型的引脚也在芯片单侧排列 ,只是引脚比 SIP 粗短些 , 节距等特征也与.ZIP:Z 型引脚直插式DIP 基本相同 .S-DIP: 收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为 1.778mm, 芯片集成度高于DIP.SK-DIP: 窄型双列直插式封装.除了芯片的宽度是DIP 的 1/2 以外 ,其它特征与DIP 相同 .PGA: 针栅阵列插入式封装 .封装底面垂直阵列布置引脚插脚, 如同针栅 . 插脚节距为 2.54mm 或 1.27mm, 插脚数可多达数百脚用于高速的且大规模和超大规模集成电路..SOP: 小外型封装 . 表面贴装型封装的一种,引脚端子从封装的两个侧面引出, 字母 L 状.引脚节距为1.27mm.MSP:微方型封装. 表面贴装型封装的一种,又叫 QFI 等,引脚端子从封装的四个侧面引出伸,没有向外突出的部分,实装占用面积小,引脚节距为 1.27mm.,呈 I 字形向下方延QFP: 四方扁平封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 L 字形 ,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300 脚以上 .SVP: 表面安装型垂直封装. 表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部与PCB 键合 ,为垂直安装的封装. 实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC: 无引线陶瓷封装载体. 在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速, 高频集成电路封装.PLCC: 无引线塑料封装载体.一种塑料封装的LCC. 也用于高速 ,高频集成电路封装.SOJ: 小外形 J 引脚封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 J 字形 ,引脚节距为1.27mm.BGA:球栅阵列封装 .表面贴装型封装的一种,在 PCB 焊球的节距通常为 1.5mm,1.0mm,0.8mm,的背面布置二维阵列的球形端子,而不采用针脚引脚与 PGA 相比 ,不会出现针脚变形问题..CSP: 芯片级封装 .一种超小型表面贴装型封装,其引脚也是球形端子,节距为 0.8mm,0.65mm,0.5mm等.TCP: 带载封装.在形成布线的绝缘带上搭载裸芯片,并与布线相连接的封装.与其他表面贴装型封装相比芯片更薄 ,引脚节距更小 ,达 0.25mm, 而引脚数可达500 针以上 .,介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容 )Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf 类元件Melf type Component [Cylinder]Sop 元件Small outline package 小外形封装TSop 元件Thin Sop 薄形封装SOJ 元件Small Outline J-lead Package具有丁形引线的小外形封装QFP 元件Quad Flat Package 方形扁平封装PLCC 元件Plastic Leaded Chip Carrier塑料有引线芯片载体BGABall Grid Array球脚陈列封装球栅陈列封装CSPChip Size Package 芯片尺寸封装2 特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC 卡连接器IC Card Connector附 BGA封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA 微小 BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积与封装面积之比越来越接近于 1 适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model多芯片组件)英汉缩语对照SMTSurface Mount Technology表面贴装技术SMDSurface Mounting Devices表面安装器件SMBSurface Mounting Printed Circuit Board表面安装印刷板DIP Dual-In-Line Package双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面： DIP 封装 (70 年代 )->SMT 工艺 (80 年代 LCCC/PLCC/SOP/QFP)->BGA封装(90 年代 )-> 面向未来的工艺 (CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－ >塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－ >表面组装－ >直接安装一． TO 晶体管外形封装TO（Transistor Out-line ）的中文意思是“晶体管外形”。

最常用的各类封装含义

1.BGA：球栅阵列封装Ball Grid Array球形栅格阵列说明：为什么说是球栅，下图是横截面图，很直观的看出引脚轮廓是球形；栅格阵列封装，引脚大致分布如下图：就上图来说，四行四列引脚不是非要排满，如下图（引脚五行五列）左右的区别：实物图：实物图：（a）（b）2.CBGA：陶瓷球栅阵列封装（基板是陶瓷）Ceramic Ball Grid Array陶瓷的球形栅格阵列说明：引脚分布图和实物图都可参考上一说明。

GA：陶瓷圆柱栅格阵列封装（基板是陶瓷）Ceramic Column Grid Array陶瓷的圆柱栅格阵列说明：都是栅格阵列封装，不同就在于引脚形状，横截面如图：引脚是圆柱状。

4.PBGA：塑料球栅阵列封装（塑料焊球阵列封装）Plastic Ball Grid Array塑料的球形栅格阵列说明：引脚分布图和实物图都可参考BGA封装的说明。

CBGA和PBGA不同之处就在于它们的基板材质不同，一个是陶瓷，一个是塑料。

5.TBGA：载带球栅阵列封装Tape Ball Grid Array带子球形栅格阵列说明：引脚分布图和实物图都可参考BGA封装的说明。

不同之处在于它的基板为带状软质的1或2层的PCB电路板。

6.MicroBGA：缩微型球状引脚栅格阵列封装Micro Ball Grid Array微小的球形栅格阵列说明：M i croBGA封装的显存采用晶元嵌入式底部引线封装技术，具有体积小，连线短，耗电低，速度快，散热好的特点。

7.CSP：芯片尺寸封装Chip Scale Package芯片比例,尺寸包裹,封装说明：CSP封装，是芯片级封装的意思。

CSP封装最新一代的内存芯片封装技术，其技术性又有了新的提升。

CSP封装可以让芯片面积与封装面积之比超过1:1.14，已经相当接近1:1的理想情况，绝对尺寸也仅有32平方毫米，约为普通的BGA 的1/3，仅仅相当于TSOP内存芯片面积的1/6。

与BGA封装相比，同等空间下CSP封装可以将存储容量提高三倍。

LQFP,TQFP,QFP封装尺寸图解及区别

LQFP,TQFP,QFP封装尺寸图解及区别这个型号只有两种封装一种是TQFP32 一种是BGA48QFP(quad flat package)四侧引脚扁平封装。

表面贴装型封装之一，引脚从四个侧面引出呈海鸥翼(L)型。

基材有陶瓷、金属和塑料三种。

从数量上看，塑料封装占绝大部分。

当没有特别表示出材料时，多数情况为塑料QFP。

塑料QFP 是最普及的多引脚LSI 封装。

不仅用于微处理器，门陈列等数字逻辑LSI 电路，而且也用于VTR 信号处理、音响信号处理等模拟LSI 电路。

引脚中心距有1.0mm、0.8mm、0.65mm、0.5mm、0.4mm、0.3mm 等多种规格。

0.65mm 中心距规格中最多引脚数为304。

日本电子机械工业会对QFP 的外形规格进行了重新评价。

在引脚中心距上不加区别，而是根据封装本体厚度分为QFP(2.0mm～3.6mm 厚)、LQFP(1.4mm 厚)和TQFP(1.0mm 厚)三种。

LQFP指封装本体厚度为1.4mm的QFP。

TQFP指封装本体厚度为1.0mm的QFPBQFP(quad flat package with bumper)带缓冲垫的四侧引脚扁平封装。

QFP封装之一，在封装本体的四个角设置突起(缓冲垫)以防止在运送过程中引脚发生弯曲变形。

美国半导体厂家主要在微处理器和ASIC等电路中采用.此封装。

引脚中心距0.635mm，引脚数从84到196左右FQFP(finepitchquadflatpackage)小引脚中心距QFP。

通常指引脚中心距小于0.65mm的QFP(见QFP)。

部分导导体厂家采用此名称——仅供参考。

芯片封装类型图解

集成电路封装形式介绍(图解）BGA BGFP132 CLCCCPGA DIP EBGA 680L FBGA FDIP FQFP 100L JLCC BGA160L LCCLDCC LGA LQFPLQFP100L Metal Qual100L PBGA217L PCDIP PLCC PPGAPQFP QFP SBA 192L TQFP100L TSBGA217L TSOPCSPSIP:单列直插式封装.该类型的引脚在芯片单侧排列,引脚节距等特征与DIP基本相同.ZIP:Z型引脚直插式封装.该类型的引脚也在芯片单侧排列,只是引脚比SIP粗短些,节距等特征也与DIP基本相同.S-DIP:收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为1.778mm,芯片集成度高于DIP.SK-DIP:窄型双列直插式封装.除了芯片的宽度是DIP的1/2以外,其它特征与DIP相同.PGA:针栅阵列插入式封装.封装底面垂直阵列布置引脚插脚,如同针栅.插脚节距为2.54mm或1.27mm,插脚数可多达数百脚.用于高速的且大规模和超大规模集成电路.SOP:小外型封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,字母L状.引脚节距为1.27mm.MSP:微方型封装.表面贴装型封装的一种,又叫QFI等,引脚端子从封装的四个侧面引出,呈I字形向下方延伸,没有向外突出的部分,实装占用面积小,引脚节距为1.27mm.QFP:四方扁平封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈L字形,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300脚以上.SVP:表面安装型垂直封装.表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部与PCB键合,为垂直安装的封装.实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC:无引线陶瓷封装载体.在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速,高频集成电路封装.PLCC:无引线塑料封装载体.一种塑料封装的LCC.也用于高速,高频集成电路封装.SOJ:小外形J引脚封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈J字形,引脚节距为1.27mm.BGA:球栅阵列封装.表面贴装型封装的一种,在PCB的背面布置二维阵列的球形端子,而不采用针脚引脚.焊球的节距通常为1.5mm,1.0mm,0.8mm,与PGA相比,不会出现针脚变形问题.CSP:芯片级封装.一种超小型表面贴装型封装,其引脚也是球形端子,节距为0.8mm,0.65mm,0.5mm等.TCP:带载封装.在形成布线的绝缘带上搭载裸芯片,并与布线相连接的封装.与其他表面贴装型封装相比,芯片更薄,引脚节距更小,达0.25mm,而引脚数可达500针以上.介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容)Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf类元件Melf type Component [Cylinder]Sop元件Small outline package小外形封装TSop元件Thin Sop薄形封装SOJ元件Small Outline J-lead Package 具有丁形引线的小外形封装QFP元件Quad Flat Package方形扁平封装PLCC元件Plastic Leaded Chip Carrier 塑料有引线芯片载体BGABall Grid Array 球脚陈列封装球栅陈列封装CSPChip Size Package芯片尺寸封装2特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC卡连接器IC Card Connector附BGA 封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA微小BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积与封装面积之比越来越接近于1适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model 多芯片组件)英汉缩语对照SMTSurface Mount Technology 表面贴装技术SMDSurface Mounting Devices 表面安装器件SMBSurface Mounting Printed Circuit Board 表面安装印刷板DIP Dual-In-Line Package 双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board 印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration 大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面：DIP封装(70年代)->SMT工艺(80年代 LCCC/PLCC/SOP/QFP)->BGA封装(90年代)->面向未来的工艺(CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－>塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－>表面组装－>直接安装一．TO 晶体管外形封装TO（Transistor Out-line）的中文意思是“晶体管外形”。

元器件封装实物图.doc(实物图,DIP、PLCC、SOP、PQFP、SOJ、TQFP、TSSOP、BGA)

常见元器件封装实物图qqq芯片封装技术知多少前言我们经常听说某某芯片采用什么什么的封装方式，在我们的电脑中，存在着各种各样不同处理芯片，那么，它们又是是采用何种封装形式呢？并且这些封装形式又有什么样的技术特点以及优越性呢？那么就请看看下面的这篇文章，将为你介绍个中芯片封装形式的特点和优点。

一、DIP双列直插式封装DIP(DualIn－line Package)是指采用双列直插形式封装的集成电路芯片，绝大多数中小规模集成电路(IC)均采用这种封装形式，其引脚数一般不超过100个。

采用DIP封装的CPU芯片有两排引脚，需要插入到具有DIP结构的芯片插座上。

当然，也可以直接插在有相同焊孔数和几何排列的电路板上进行焊接。

DIP 封装的芯片在从芯片插座上插拔时应特别小心，以免损坏引脚。

DIP封装具有以下特点：1.适合在PCB(印刷电路板)上穿孔焊接，操作方便。

2.芯片面积与封装面积之间的比值较大，故体积也较大。

Intel系列CPU中8088就采用这种封装形式，缓存(Cache)和早期的内存芯片也是这种封装形式。

二、PQFP塑料方型扁平式封装和PFP塑料扁平组件式封装PQFP（Plastic Quad Flat Package）封装的芯片引脚之间距离很小，管脚很细，一般大规模或超大型集成电路都采用这种封装形式，其引脚数一般在100个以上。

用这种形式封装的芯片必须采用SMD（表面安装设备技术）将芯片与主板焊接起来。

采用SMD安装的芯片不必在主板上打孔，一般在主板表面上有设计好的相应管脚的焊点。

将芯片各脚对准相应的焊点，即可实现与主板的焊接。

用这种方法焊上去的芯片，如果不用专用工具是很难拆卸下来的。

PFP（Plastic Flat Package）方式封装的芯片与QFP方式基本相同。

唯一的区别是QFP一般为正方形，而PFP既可以是正方形，也可以是长方形。

QFP/PFP封装具有以下特点：1.适用于SMD表面安装技术在PCB电路板上安装布线。

元器件封装_配实物图_DIP、PLCC、SOP、PQFP、SOJ、TQFP、TSSOP、BGA_

常见元器件封装(实物图)qqqDIPPLCCSOPPQFPSOJTQFPTSSOPBGA芯片封装技术知多少前言我们经常听说某某芯片采用什么什么的封装方式，在我们的电脑中，存在着各种各样不同处理芯片，那么，它们又是是采用何种封装形式呢？并且这些封装形式又有什么样的技术特点以及优越性呢？那么就请看看下面的这篇文章，将为你介绍个中芯片封装形式的特点和优点。

一、DIP双列直插式封装DIP(DualIn－line Package)是指采用双列直插形式封装的集成电路芯片，绝大多数中小规模集成电路(IC)均采用这种封装形式，其引脚数一般不超过100个。

采用DIP封装的CPU芯片有两排引脚，需要插入到具有DIP结构的芯片插座上。

当然，也可以直接插在有相同焊孔数和几何排列的电路板上进行焊接。

DIP封装的芯片在从芯片插座上插拔时应特别小心，以免损坏引脚。

DIP封装具有以下特点：1.适合在PCB(印刷电路板)上穿孔焊接，操作方便。

2.芯片面积与封装面积之间的比值较大，故体积也较大。

Intel系列CPU中8088就采用这种封装形式，缓存(Cache)和早期的内存芯片也是这种封装形式。

二、PQFP塑料方型扁平式封装和PFP塑料扁平组件式封装PQFP（Plastic Quad Flat Package）封装的芯片引脚之间距离很小，管脚很细，一般大规模或超大型集成电路都采用这种封装形式，其引脚数一般在100个以上。

用这种形式封装的芯片必须采用SMD（表面安装设备技术）将芯片与主板焊接起来。

采用SMD安装的芯片不必在主板上打孔，一般在主板表面上有设计好的相应管脚的焊点。

将芯片各脚对准相应的焊点，即可实现与主板的焊接。

用这种方法焊上去的芯片，如果不用专用工具是很难拆卸下来的。

PFP（Plastic Flat Package）方式封装的芯片与QFP方式基本相同。

唯一的区别是QFP一般为正方形，而PFP既可以是正方形，也可以是长方形。