(完整版)手机结构设计检查表-checklist-重要

一. 塑胶件

Plastic components

1.有无做干涉检查?

If interference test

2.有无做draft检查?

If draft test

3.有无透明件背后丝印/喷涂要求?如果有,不能有任何特征在该面上.

If requirements of silk printing or painting in the back of the transparency components, and with no features on it.

4.壳体材料,

Housing material

5.壳体最小壁厚,侧面是否厚度小于1.2mm.

If the least thickness of the side wall of the housing less than 1.2mm

6.设计考虑的浇口位置,有无避位?

If anti-interference according with the gate

7.熔接线位置是否会是有强度要求的地方?

If weld line with requirements of intensity

8.壁厚突变1.6倍以上处有无逃料措施?

If wall thickness break over 1.6 times with slope transition

9.壳体对主板的定位是否足够(至少四点)

If housing locating to main board enough(at least with four points)

10.壳体对主板的固定方式,如果是螺丝柱夹持,是否会影响附近的键盘手感?

If the screw nipping method of housing to PCBA affect the near key click

11.壳体之间的固定及定位应该有四颗螺丝+每侧面两个卡扣+顶面两卡扣+周边唇边

If housing fixing and locating with four screws and each side with two snap fits and upper side two snap fits and lip around.

12.螺丝是自攻还是NUT?螺径?单边干涉量?配合长度?螺丝头的直径?( 机械螺钉锁3

牙，自攻螺钉5牙以上)

If screws manner, such as self-tapping or nut, the screw diameter? One side interference quantity? Matching length? The screw cap diameter?(Over 3 pitch assembly length mechanical screw, over 5 self-tapping screw)

13.螺柱的直径?孔的直径?螺柱壁厚?

The screw boss diameter? The boss hole diameter? The thickness of boss wall ?

14.螺丝面是定位面吗?测量基准是什么?

If screw surface locating surface? The measure benchmark?

15.唇边的宽度(1/2壁厚左右),高度?之间的配合间隙是否小于0.10mm?

The lip width(about1/2 wall thickness),height? If the assembling clearance less than 0.10mm

16.卡扣壁厚/宽度?公卡扣壁厚是否小于0.70mm?卡扣干涉量是否小于0.5mm?

The clip thickness/width? If male clip thickness less than 0.70mm, or clip interference less than 0.5mm

17.卡扣导入方向有无圆角或斜角?

If clip guide direction with R or bevel

18.卡扣斜销行位不得少于5mm.在此范围内有无其他影响行位运动的特征?

The clip slide pin not less than 5mm,within which if affect slide move 19.LCD周围有无定位/固定的特征rib?

If locating or fixing features around LCD

20.SPEAKER/RECEIVER/VIBRATOR周边有无定位/固定特征?

If locating or fixing features around SPEAKER/RECEIVER/VIBRATOR?

21.LENS周边有无对LEN浇口/定位柱/定位脚等的避位?

If anti-interference to gate/locating pole/locating foot around LENS 22.对电铸件斜边有无避位?

If anti-interference to the electroform components bevel edge

23.键盘周边有无定位柱?加强RIB?

If locating pole or reinforced rib

24.转轴处壁厚是否小于1.2mm?

If thickness at the hinge less than 1.2mm?

25.转轴处根部有无圆角?多少?

If root at the hinge with R? and what is the R?

26.唇边与卡扣的配合是否是反卡结构?是否还有空间增加反卡?

If the match between lip and clip counter-clip structure? If more space to add counter-clip?

27.外置天线处是否有防掰出反卡?

If outside antenna with anti-breaking off counter-clip

28.电池仓面是否设计了入网标签及其他标签的位置?深度?

If battery store surface with PTC label or other label, and what is depth?

29.外面拔模角度是否小于2度?

If pulling angle less than 2 degree

30.热熔柱直径大于0.8mm时是否考虑了防缩水的结构?(空心柱)

If protection to avoid shrinkage under melting pole diameter over 0.8mm(hollow pole)?

31.超声波焊接材料的匹配性是否与供应商沟通过?

If discuss with the supplier about the assembling quality of the ultrasonic weld material

32.超声波能量带的设计是否合理(三角形,0.4*0.4)?有无防溢胶设计?

If ultrasonic energy belt design (triangle, 0.4*0.4) reasonable? If with anti-spilling glue design?

33.螺柱/卡扣处是否会缩水?

If shrinkage at the screw boss and the snap

34.有无厚度小于0.5mm的大面(大于400平方mm)?

If big side(over 400 square mm) with thickness less than 0.5mm

35.筋条厚度与壁厚的比例是否小于0.75:1?

If the scale of thickness of the rib and the wall less than 0.75:1

36.铁料是否厚度/直径小于0.40mm?模具是否有尖角?

If metal thickness/diameter less than 0.40mm. If mould with sharp angle?

37.壳体喷涂区域的考虑,外棱边是否有圆角(大于1mm)以防掉漆?遮蔽夹具的精度?

If outside edge with R(over 1mm) to avoid paint falling about the housing