PCB常见不良中英文对照电子厂专业术语
中英对照PCB专业术语精选全文
analog circuit
模拟电路
amplitude
电压幅度
amp-hour
安培小时
amperometric titration
电流滴定
ampere
安{培)
amorphous thin film
非晶薄膜
amorphous thin film
非晶薄膜
amorphous semiconductor material
单向导电膜安装，各向异性导电膜连接
anisotropic conductive contact
单向导电接触，各向异性导电接触
anisotropic conductive adhesives
单向导电黏结剂，各向异性导电黏结剂
angstrom unit
埃单位
angle rotor
角转头
angle of contact
烷基咪唑
alkaline permanganate solution
碱性高锰酸盐溶液
alkaline etchant
碱性蚀刻液
alkaline degreasing
化学除油
alkaline cleaner
破性清洗液
alkaline ammonia etchant
氨碱蚀刻液
ALIVH
任意层内导通孔
aliphatic solvent
adhesion promotion
增教处理，附着力增强
by-product
副产品，副产物
butt lead
搭接引线，对接引线
butting connector
对接引脚
butter coat
厚涂层，外表树脂层
不良中英文对照表
不良现象中英文对照表1.缺件(missing parts)2.错件(wrong parts)3.多件(excessive parts)4.短路(short)5.断路(open)6.线短(wire short)7.线长(wire long)8.拐线(wire poor ddress)9.冷焊(cold solder)10.包焊(excess solder)11.空焊(missing solder)12.锡尖(solder icicle)13.锡渣(solder splash)14.锡裂(soder crack)15.锡洞(pin hole)16.锡球(solder ball)17.锡桥(solder bridge)18.滑牙(screw loose)19.氧化(rust)20.异物(foreigner material)21.溢胶(excessive glue)22.锡短路(solder bridge)23.锡不足(solder insufficient)24.极性反(wrong polarity)25.脚未入(pin unseated)26.脚未出(pin unvisible)27.脚未剪(pin no cut)28.脚未弯(pin not bent)29.缺盖章(missing stamp)30.缺标签(missing label)31.缺序号(missing s/n)32.序号错(wrong s/n)33.标签错(wrong label)34.标示错(wrong mark)35.脚太短(pin short)36.j1不洁(j1 dirty)37.锡凹陷(solder scooped)38.线序错(w/l of wire)39.未测试(no test) 40.vr变形(vr deformed)43.零件沾胶(glue on parts)41.pcb翘皮(pcb peeling)42.pcb弯曲(pcb twist)44.零件脚长(parts pin long)45.浮件(parts lift)46.零件歪斜(parts tilt)47.零件相触(parts touch)48.零件变形(parts deformed)49.零件损坏(parts damaged)50.零件脚脏(pin dirty)51.零件多装(parts excess)52.零件沾锡(solder on parts)53.零件偏移(parts shift)54.包装错误(wrong packing)55.印章错误(wrong stamps)56.尺寸错误(dimension wrong)57.二极管坏(diode ng)58.晶体管坏(transistor ng)59.振荡器坏(x’tl ng)60.管装错误(tubes wrong)61.阻值错误(impedance wrong)62.版本错误(rev wrong)63.电测不良(test failure)64.版本未标(non rev lebel)65.包装损坏(packing damaged)66.印章模糊(stamps defective)67.标签歪斜(label tilt)68.外箱损坏(carton damaged)69.点胶不良(poor glue)70.ic座氧化(socket rust)71.缺ul标签(missing ul label)72.线材不良(wire failure)73.零件脚损坏(pin damaged)74.金手指沾锡(solder on golden fingers)75.包装文件错(racking doc wrong)76.包装数量错(packing q’ty wrong)77.零件未定位(parts unseated)78.金手指沾胶(glue on golden fingers)79.垫片安装不良(washer unseated)80.线材安装不良(wire unseated)81.立碑(tombstone)。
PCB及PCBA缺陷中英文对照表
PCB及PCBA缺陷中英文对照表PCB及PCBA缺陷中英文对照表1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F 5绿油剥离S/M peel off 45金手指发黑G/F too black6显影不净under developing 46字符印反inverse C/M7基材白点laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄S/M too thin29k孔内毛刺burrs in hole 69聚油excess solder mask 30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch 32露镍expose Ni 72绿油下杂物contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad 38绿油入孔solder mask in hole 78线路缺口nick on track 39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion 4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu9爆板measling 55孔内露基材laminate exposure in hole10粉红圈pinking ring 56焊盘脱落pad break off 11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu 16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping 24孔小hole undersize 38间隙小space too marrow 25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness PCB及PCBA常用度量衡单位换算所属目录：FASTPCBA靖邦公司资料发布时间：2009-01-01 1英尺=12英寸1英寸inch=1000密尔mil1mil=25.4um1mil=1000uin mil密耳有时也成英丝1um=40uin（有些公司称微英寸为麦，其实是微英寸）1OZ=28.35克/平方英尺=35微米H=18微米4mil/4mil=0.1mm/0.1mm线宽线距1ASD=1安培/平方分米=10.76安培/平方英尺1AM=1安培分钟=60库仑主要用于贵金属电镀如镀金1平方分米=10.76平方英尺1盎司=28.35克,此为英制单位1加仑(英制)=4.5升1加仑美制=3.785升1KHA=1000安小时1安培小时=3600库仑比重波美度=145-145/比重SG.SG.比重（克/立方厘米）=145/（145-波美PCB及PCBA行业专用名词PCB及PCBA行业专用名词BOM(Bill of material) 物料需求單Laminate 基板Copper foil 銅箔Solder mask(s/m) 防焊Bare Board 空板Microetching 微蝕Exposure 曝光Dry Film 干膜Matte side 毛面Rcc(Resin coated copper) 背膠銅箔Final shaping 成型Electrical test(ET) 電測Visual Inspection 外觀檢查Gold Finger(G/F) 金手指Legend 文字Post Cure 后烤Desmear 除膠渣Developing 顯影Pattern Plating 線路電鍍Panel Plating 全板電鍍Puddle Effect 水坑效應Oxide Coating 黑氧化Routing Bit 銑刀Tolerance 公差Post Treatment 后處理Adhesion 附著力Stripping 去膜Baking 烘烤AQL(acceptable quality level) 品質允收水準Optical Target 光學靶點Lay up 疊合Chromation 鉻化處理Undercut 側蝕Microvia 微孔Annular Ring 孔環Burr 毛頭Entek 有機保焊處理Conformal Mask 銅窗Drum Side 光面Diazo Film 偶氮棕片Cut Lamination 下料Sheets Cutting 裁板Inner Layer Drilling 內層鑽孔Outter Layer Drilling 一次孔2nd Drilling 二次孔PCB及PCBA专用名词Laser Drilling 雷射鉆孔Blind&Burried Hole Drilling 盲(埋)孔鉆孔screen printing 網版印刷silk screen 絲網印刷scum 透明殘膜skip printing 跳印漏印squeege 刮刀type 种類abietic acid 松脂酸air knife 風刀bridging 搭橋橋接flux 助焊劑product process 制程pre-process 制前solder bridge 錫橋soler bump 錫突solder plug 錫塞immersion gold 浸金(化金)thin core 薄基板twist 板翘, 板扭warp ,warpage 板彎weave eposure 織紋顯露wicking 燈蕊效應yield 良品abrasion resistance 耐磨性absorption 吸收accelerated test 加速實驗acceleration 速化反應accelerator 加速剂batch 批cold solder joint 冷焊點component side 零件面double side 雙面double side board 雙面板fiducial mark 基準記號finished board 成品板lot size 批量rack 掛架register mark 對準用標記solder side 錫鉛面thickness 厚度warehouse 仓库wet process 濕制程Beveling 斜邊chamfer 道角dimension 尺寸Fixture 治具interconnection 互相連通line space 線距line width 線寬misregistration 對不准mouse bite 蝕刻缺口nick 缺口master drawing 主圖print and etch board 印刷後及蝕刻後板crease 皺褶dent 凹陷glass fiber 玻璃纖維布pin hole 針孔pit 凹點target hole 靶孔PCBA及PCB专用名词(二)PCBA及PCB专用名词(二)Black Oxide Removal 黑化還原Plug Hole 塞孔Ink Print&precure 印刷及預烤Scrub 表面處理Spray Coating 靜電噴涂Printing of Legend 文字印刷Pumice ( Wet Blasting) 噴砂Immersion Ni/Au(Electoless Ni/Au) 浸鎳金Hot Air Solder Leveling 噴錫N/C routing 撈型Beveling of G/F 金手指斜边Cleanning&Baking 清洗及烘烤Fixture Testing 治具測試original A/W 客戶原稿working A/W 工作片working master 工作母片carlson pin 定位梢component hole(>30mil) 零件孔drill facet 鑽尖切削面drill pointer 鑽尖重磨機drilled blank board 已鑽孔的裸板hole diameter 孔徑hole location 孔位hole number 孔數lay back 刃角磨損margin 鑽頭刃帶open circuits 斷路runout 偏轉slot 開槽spindle 鑽軸tooling hole 工具孔stacking structure 疊板結構blow hole, void in PTH hole 吹孔孔破deburring 去毛頭electroless-deposition 無電鍍化etchback 回蝕air inclusion 氣泡chase 網框fabric 網布liquid 液態\狀mealing 泡點trim line 裁切線v-cut v型切槽golden board 標準板back lighting 背光crack 裂痕crazing 白斑dimension stability 尺寸安全性failure 故障fault 缺陷瑕疵gap 鑽尖分開gel time 膠化時間haloing 白邊白圈hardener 硬化劑hole counter 數孔機hook 外弧insulation resistance 絕緣阻抗ionizable(ionic) contaminants 離子性污染land 焊墊microsectioning 微切片法negative etchback 反回蝕overlap 鑽尖重曡peel strength 抗撕強度pink ring 粉紅圈REJ(reject) 拒收退貨release agent(sheets) 脫膜劑resin content 膠含量resin flow 膠流量resin recession 樹脂下限resin smear 膠渣rework 重工specification(spec.) 規範innerlayer&outlayer 內外層gold plating 鍍金QC(quality control) 品管back up 墊板blister 起泡局部分层caul plate 隔板, 钢板open circuits 断路sampling size 抽樣數edge spacing 板邊空地ground plane 接地層laminator 壓膜機M/T 磁帶disk 磁片。
PCB专业用语中英文对照
PCB专业用语中英文对照PCB，全称是Printed Circuit Board，即印制电路板，是电子器件中不可缺少的一部分。
在PCB的生产和使用过程中，有许多特定的专业术语，以下将列出一些常见的PCB专业用语的中英文对照，以帮助PCB行业的从业人员更好地了解和使用这些术语。
1. Pad - 表面贴装元件引脚焊盘2. Via - 通孔3. Trace - 线路走线4. Solder mask - 焊盘阻焊5. Silkscreen - 字体绘制6. Substrate - 基板7. RoHS - 过度有害物质限制指令8. PCB Assembly - PCB组装9. Panel - 夹板10. Gerber file - Gerber文件（PCB板图文件的一种）11. Copper weight - 铜箔厚度12. SMD - 表面贴装元件13. Through-hole - 贯通孔除此之外，还有一些专业用语需要注意：1. Blind via - 盲孔2. Buried via - 埋孔3. Soldering - 焊接4. Copper pour - 铜泡5. Annular ring - 环形垫片6. Plated through-hole - 化学镀铜孔7. Gold finger - 金手指（PCB板边部的带触点金属部件）8. OSP - 有机锡防护（一种PCB表面处理方法）以上仅列举了部分PCB专业用语的中英文对照，如需更全面的了解，需要从事相关行业或有专业经验的人士掌握更多知识。
在PCB制造和使用过程中，正确使用这些专业用语是非常重要的，它们不仅可以帮助我们更好地了解PCB的生产过程和使用方法，还可以提高工作效率和避免出现误解和错误。
不良描述中英文对照
不良描述中英文对照(五金,塑料,PCB) 1.Plastic parts 塑膠部件-Inspection Points /檢查要點: Abrasion/划痕,Bubbles/气泡, Burrs/毛刺,Bad Plating/電鍍不良, Contamination/雜質,Crack/爆裂,Combine Lines/結合線, Deformation/變形,Flow Marks/流痕,Greasy Dirt/油污,Haze/霧狀,Jelly/泠膠,Mold Marks/模痕, Melange Color/混色, Oppilation Hole/盲孔,Pull White/拉白,Pour Hole uneven/澆口不平, Wrong Stamping/字麥不符, Short Shots/缺料, Shrinkage/縮水,Stripped Screw/螺絲滑牙, Top White/頂白,Weld Lines/夾水紋,Wrong Dimension/尺寸不符, Wrong Texture/紋理錯誤, Light/發亮;-质量-2. Metal Parts 五金部件Inspection Points /檢查要點: Abrasion/划痕,Bad Weld/焊接不良,Burrs/毛刺,Bad Plating/電鍍不良, Bend angle/折彎角度, Contamination/雜質, Crack/爆裂,Deformation/變形,Dents/凹痕,Greasy Dirt/油污,Mold Marks/模痕, Missing Stamp/漏沖壓, Oppilation Hole/盲孔, Pressing Marks/壓痕,Rust/生鏽,Wrong Stamping/字麥錯誤, Short Shots/缺料,Stripped Screw/螺絲滑牙,Pits/疤痕,Specks/斑點Wrong Texture/紋理錯誤, Wrong Dimension/尺寸不符;bb3. Painting parts / SilkScreen parts 噴油/絲印部件Inspection Points /檢查要點: Bleeding/滲色,Bad Painting/噴油不良, Contamination/雜質,deviate position/偏位,Flow Marks/流痕,Missing paint/漏噴,Over Paint/肥油,Pits/疤痕,Poor Adhesion/附著力差,Print Words Leans/印刷字體傾斜, Pooring Paint/薄油,Silkscreen Haze/絲印模糊,Silkscreen Stamping Inconsistency/絲印字樣不一致,Scratch/划傷,Speck/斑點,Uneven Surface Oil/表面油層不均勻, Words Break Off/字体斷開,Wrong Color/錯誤顏色,Wrong Texture/紋理錯誤;-4. PCB 印制线路板Open/开路;Short/短路;Weave Texture/板料席纹; Foreign Residue/外来杂物; Delamination/爆板,分层;Dent/凹陷;Dent on G/F/金手指凹陷; Scratch/擦花;Misregistration/对位不正;Board Damage/板子损坏;C/M Illegible/白字不清;C/M on pad/白字上垫;Copper expoure/露铜;Solder Mask on Pad/绿油上垫; Uneven Solder Mask/绿油不平均; Solder Mask peeling off/绿油脱落; Missing Hole/漏孔; Excess Hole/多孔;Wrong Hole Size/孔径错误;Hole Breakout/崩孔;Nick Trace/线路缺口;Void on Trace/线路铜穿;Diskdown/线路不良/狗牙;Solder Mask inside hole/绿油入孔; Discolouration under Solder Mask/绿油颜色不良;Foreign matter under Solder Mask/绿油下杂物;Solder Mask skipping/不过油;Solder on Gold Finger/金手指上锡;Poor Bevelling/斜边不良;Gold Finger burrs/金手指损坏;Ping Ring/粉红圈.5. Electronic parts 电子元件No AVL/没AVL;not on AVL/不在AVL上;Mfg/Mfg P/N dis-match AVL/ 与AVL不符; D/C overdue/ D/C 过期;无D/C;wrong part/错料;no reel/无卷轴;bulk packing for chip/ 散装;No dry packing(HIC change color)/ 无真空包装(防潮卡变色);No ESD packing/无防静电包装;illegible marking/印字不清,wrong marking/印字错;deformation/变型;micro crack/裂料;damaged part/ 烂料;Lead bent(PTH/SMT)/脚弯;Solder balls damaged/锡球坏wrong lead form/脚型错;wrong pitch/脚距不符;coplanar problem/平整度不良; pad(lead) oxidization/锡垫(引脚)氧化; wrong direction in tape(tray)/带中(盘中)方向错;short pins/引脚短;failed in solderability/ 焊锡不良;size(dimensions) out of specification/ 尺寸超标;function fail/ 功能不良;no tolerance/无误差范围; contamination/杂质;wrong identification for pin1/ 第1脚标识错.Broker Buy/炒料;(巻装物料)巻带前无空余巻带No blank cover tape for feeder loading巻带粘力不足Not enough adhesive for the cover tape. 料盤变形Reel Deforming/卷带变型.。
PCB及PCBA缺陷中英文对照表
1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F5绿油剥离S/M peel off 45金手指发黑G/F too black6显影不净under developing 46字符印反inverse C/M7基材白点 laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花 track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄29k孔内毛刺burrs in hole 69聚油excess solder mask30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch32露镍expose Ni 72绿油下杂物 contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad38绿油入孔solder mask in hole 78线路缺口nick on track39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu55孔内露基材 laminate exposure in hole 10粉红圈pinking ring 56焊盘脱落pad break off11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping24孔小hole undersize 38间隙小space too marrow25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness。
PCB工程部专业英语词汇
PCB工程部专业英语词汇PCB 工程部专业英文词汇词汇1.板料: material2.最低限度: minimum 或者min.3.最大限度: maximum 或者max.4.基准点(零点) datum point5.周期Date code6.V-cut余厚V-cut remain thickness7.抢电铜皮（假铜）dummy copper8.实物板actual board9.外形及尺寸错误dimension error10.异常情形error data file11.焊锡面与零件面对位偏差misregistration12.孔塞plug hole13.要求requirement14.缺少miss15.偏公差uneven tolerance16.补偿compensation17.表面处理surface treatment18.无铅喷锡Lead free HAL19.金手指斜边bevel of G/F20.制程能力process capability21.建议,暗示suggest22.确保ensure23.满足,达到meet24.为了in order to25.交货期delivery date26.绿油桥solder mask bridge 或者solder mask dam27.根据according to28.单边3mil per side 3 mil29.直径diameter30.半径radius 31.小于3mil less than 3mil32.高于3mil more than 3 mil33.压合结构stacking structure 或者stack_up34.附件：attached file35.样品：sample36.文档：Document37.答复：answer; reply38.规格：spec39.与...同样的：the same as40.前版本：previous version(old version)41.生产：production42.确认：confirm43.再次确认：confirm again44.工程问题：engineering query（EQ）45.尽快：as soon as possible46.生产文件：production Gerber47.联系某人：contact somebody48.提交样板：submit sample49.交货期：delivery date50.电测成本：ET（electrical test）cost51.通断测试：Open and short testing52.参考：refer to53.IPC标准：IPC standard54.IPC二级：IPC class 255.可接受的：acceptable56.允许：permit57.制造：manufacture 或者fabricate58.修改：revision59.公差：tolerance60.忽略：ignore61.工具孔：tooling hole62.安装孔：mounting hole63.元件孔：component hole64.槽孔：slot hole65.邮票孔：snap off hole 或者stamp hole66.导通孔：via hole67.盲孔：blind via hole68.埋孔：buried via hole69.金属化孔：PTH(plated through hole)70.非金属化孔：NPTH( no plated through hole)71.孔位：hole location72.避免：avoid73.原设计：original design74.修改：modify75.按原设计：follow up original design76.附边：waste tab, waste area 或者breakaway tab77.铜条：copper strip78.拼板：panel drawing79.板厚：board thickness80.删除：remove(delete)81.削铜：shave the copper82.露铜：copper exposure 或者exposed copper83.光标点: fiducial mark84.不同：be different from(differ from)85.内弧：inside radius86.焊环：annular ring87.单板尺寸：single size88.拼板尺寸：panel size89.铣,锣：routing90.铣刀：router 或者Routing bit91.楔形掏槽V-cut 或者V scoring92.哑光：matt93.光亮的：glossy94.锡珠：solder ball(solder plugs)95.阻焊：solder mask(solder resist)96.阻焊开窗：solder mask opening 97.单面开窗：single side mask opening98.补油：touch up solder mask99.补线：track welds100.毛刺：burrs101.去毛刺：deburr102.镀层厚度：plating thickness103.清洁度：cleanliness104.离子污染：ionic contamination105.阻燃性等级：flammability retardant rating 106.黑化：black oxidation107.棕化：brown oxidation108.红化：red oxidation109.可焊性不良：poor solderability110.焊料：solder111.包装：packaging112.角标：corner mark113.特性阻抗：characteristic impedance 114.正像：positive 115.负片：negative116.镜像：mirror117.线宽：line width 或者trace width118.线距：line spacing 或者trace spacing 119.做样：buildsample120.按照：according to121.成品：finished122.做变更：make the change123.相类似：similar to124.规格：specification125.下移：shift down126.垂直地：vertically127.水平的：horizontally128.增大：increase129.缩小：decrease130.表面处理：Surface Finishing131.波峰焊：wave solder132.钻孔数据：drilling data133.标记：Logo134.Ul 标记：UL logo,或者Ul Marking135.蚀刻标记：etched marking136.周期：date code137.翘曲：bow and twist138.外层：outer layer 或者external layer139.内层：inner layer 或者internal layer140.顶层：top layer141.底层：bottom layer142.元件面：component side143.焊接面：solder side144.阻焊层：solder mask layer145.字符层：legend layer (silkscreen layer or over layer) 146.兰胶层：peelable SM layer147.贴片层：paste mask layer148.碳油层：carbon layer149.外形层：outline layer(profile layer)150.白油：white ink151.绿油：green ink152.喷锡：hot air leveling (HAL)153.电金,水金：flash gold154.插头镀金：plated gold edge-board contacts155.金手指：Gold-finger156.防氧化：Entek (OSP)157.沉金：Immersion gold (chem. Gold)158.沉锡：Immersion Tin(chem.Tin)159.沉银：Immersion Silver (chem. silver)160.单面板：single sided board161.双面板：double sided board162.多层板：multilayer board 163.刚性板：rigid board164.挠性板：flexible board165.刚挠板：flex-rigid board166.铣：CNC (mill , routing)167.冲：punching168.倒角：beveling169.斜面：chamfer170.倒圆角：fillet171.尺寸：dimension172.材料：material173.介电常数：Dielectric constant 174.菲林：film175.成像：Imaging176.板镀：Panel Plating177.图镀：Pattern Plating178.后清洗：Final Cleaning179.叠层：stacking structure (stack-up) 180.污染焊盘：contaminate pad181.分孔图：drill chart 或者drill map 182.度数：degree183.被…覆盖：be covered with184.负公差：minus tolerance185.标靶盘：target pad186.外形公差：routing tolerance 187.芯板：core188.半固化片Prepreg189.阻抗线：impedance trace190.评估estimate191.玻纤显露Fiber Exposure192.底铜base copper193.工作搞working Gerber194.原稿original art work195.放宽relax196.挖空blanking 或者cut-out197.一般性阻焊油墨general resist ink198.孔位错误mis hole location199.压合周期press cycle200.毛边serrated edges201.跳印skip printing202.气泡blistering203.隔离焊盘isolated pad204.泪滴tear drops205.箭头arrows206.加大Enlarge207.压合周期press cycle208.毛边serrated edges209.跳印,漏印skip printing210.宽度与厚度的比值width-to-thickness ratio 211.调整adjust212.铜箔基板copper claded laminates213.线路露铜copper exposure214.孔内异物dirty hole215.椭圆形elliptical set216.纤维突出fiber protrusion217.填充料filler218.互相连通interconnection219.改善方案implementation220.板料使用率material use factor221.回路,网络network222.缺口nick223.氧化oxidation224.剥离(剥落) peeling off225.补线不良poor touch-up226.品质等级quality classification227.对位孔registration228.拒收rejectable 229.树脂含量resin content230.排列电阻resistor network231.锣刀（铣刀）routing bit232.孔内沾文字S/L on hole233.孔内绿漆S/M on hole234.线路沾锡solder on trace235.金手指沾锡solder on G/F236.废框scrap237.封孔处理sealing238.间距不足spacing non-enough 239.靶位孔target hole240.测试线路test circuit241.热应力试验thermal stress242.厚度分布thickness distribution 243.薄基板,内层板thin core244.线路缺口及针孔track nick & pin hole 245.裁切线trim line246.真平整true leveling247.真正位置的孔true position248.万用型universal249.气化室vaporizer250.仓库warehouse251.契尖角wedge angle252.线细width reduce253.良率yield254.渗铜,渗入,灯芯效应wicking255.允收acceptable256.试样点coupon location257.经核准的，被认可的approved258.超越胜过,超过其他exceed259.牛皮纸kraft paper260.孔壁破铜Hole void261.孔位破出Hole breakoutPCB生产—经典流程—英文培训教程A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size) B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling) C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal ) d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au) J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling) j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation) N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired) N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )。
PCB缺陷英文对照
PCB缺陷中文名称
漏印字符 金粗 金簿 金手指缺口 金手指发黑 字符印反 金手指针孔 标志不清 标志错 绿油鬼影 手指印 补线不良 锡高 孔小 字符错 字符印偏 字符入孔 字符 重影 漏镀金手指 金手指发白 焊盘脱落 焊盘露铜 断绿油桥 塞孔 水迹 锡珠 砂孔 油薄 聚油 锡粗 线路上锡 绿油下杂物 焊盘损坏 焊盘翘起 偏位 漏钻孔 焊盘缺口 线路缺口 返工不良 绿油下氧化 焊盘翘起 漏钻孔 露布纹 钻偏孔 孔损害 基材分层 蚀刻过度 多孔 残铜 孔内露基材 焊盘脱落 焊盘凹痕 焊盘凸起 焊盘损坏 焊盘缺口 焊盘露铜 修理不良 铜薄 内层擦花
英文对照
skip Au too big Au too thin G/F voids/nick on G/F G/F too black inverse C/M G/F pinholes symbol unclear symbol wrong ghost in S/M finger print poor line repairing exessive solder hole undersize wrong C/M C/M misalignment C/M in hole C/M doubloe image missing plating G/F G/F gray pad break off/pad peel off pad expose cu missing S/M bridge block hole water print solder ball pitting
poor repairing s/m
pinhole paster stain burrs in hole solder in hole expose Cu expose Ni solder mask blister solder mask winbles G/F oxiding Au discoloration Au surface blister solder mask in hole board angle damafe warp open circuit short circuit circuit wist circuit nick circuit dent plating Bloody pad nick I/L white spot poor B.O measling pinking ring press blister misregistation shift no Cu on Pth hole burrs Cu on NPTH exposed laminate dent on Cu surface
PCB行业最常用术语之中英文对照
PCB行业最常用术语之中英文对照(按字母检索)A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electrochemical reactor 电化学反应器electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解拋光electrorefining 电解精炼electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程序exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金) immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)mylar 保护膜nail head 钉头NC drill 数字钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网络neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 噪声nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量nominal resin flow 标示胶流量nominal scaled flow thickness 标示比例流量厚度OA equip 办公室自动:化设备obsolescence factor 报废因素OEM 原设备制造商offset-list 补偿数据清单ohmmeter 欧姆计open 断路open circuits 断路open short testing 断短路测试opening 开口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀杀鸡overlap 钻尖重叠overlay entry 盖板overpotential 过电压oxidation 氧化oxide treatment 黑化处理oxided cytochrome 氧化性之细包色素oxygen evolution 氧气发生反应packed bed 充填床式pad 锡垫;圆配pad copper exposure pad露铜panel 小型板面;母板panel plating 一次铜电镀parasitic 寄生的part no. 料号pattern plating 二次铜电镀PCB ( print circuit board ) 印刷电路板pcs 片peel strength 抗撕强度peeling off 剥离(剥落) performance specification 性能规范permittivity 透电率perspectives on experience 经验透视PET 聚酯photodiode detector 发光二极管侦测器photo initiator 感光启始剂photoresist 光阻phototool 光具(指工作底片)piece 子板面pinceton applied research 腐蚀测定仪pink ring 粉红圈pit 凹点pitch 脚距planar 平面plating 电镀plating exposure 下镀层露出plug gauge 插规plug hole 孔塞PNL (panel) 排板polar-polar interaction 极性之间的吸力polyester 聚酯类polyglycols 聚乙二醇polyimide 聚亚醯氨poor bevelling 磨边加工引起突起,剥离poor drill 孔形不良poor HAL 喷锡不良poor marking 字体不良poor pad 锡垫不良poor printed 印刷偏差poor solderability 焊锡性不良poor touch-up 补线不良position control system 位置控制系统positive rake angle 正抠耙角power curve model 幕次曲线模式practice 工艺惯例preferred 良好premature tearing 提前撕裂prepolymer 预聚合物prepreg 胶片pre-process ( front-end) 制前press 压床press cycle 压合周期primary current distribution 一次电流分布primary 主要product lifetimes 生命周期product process 制程promoter 促进剂protocal 初步资料prussic acid 普鲁士酸PTF-based process 厚膜糊法PTH (plating though hole) 导通孔pull away 拉开pumice 浮石粉pumice scrub 喷砂清洁法pyrometallurgy 火烧法冶炼QC ( quality control) 品管QFP (quad flat pack ) 扁方型封装体qualification inspection 资格审查检验qualification testing 资格检定quality classification 品质等级quantitative 计量式测试rack 挂架radiometer 能量剂rake angle 抠耙角RAM [Random Access Memory 随机存取内存real time 关键时刻recessed trace process 凹槽线路法recovery tank 回收槽reduction 还原re-eninforcement 强化refraction 折光率reinforcement style 补强材料的型式register mark 对位用标记registration hole 对位孔registration pattern 长方形铜地REJ ( reject ) 退货;拒收rejectable 拒收release agent 脱模剂relief angle 浮离角remark 备注repair 修理resin content 树脂含量(胶含量)resin flow 胶流量resin flow percentage 树脂流量之百分率resin recession 树脂下陷resin smear 胶渣resist strippers 剥干膜剂resistor network 排列电阻resolution 解像度return on assets 资产报酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋转圆柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routing bit 铣刀runout 偏转S/L on hole 孔内沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error 防焊种类错误S/M on hole 孔内绿漆salt spray test 盐水喷雾试验sampling size 抽样数scope 范围scored 刻痕scoring 枢槽;刮线scrap 废框scratches 刮伤screen printing 网版印刷scum 透明残膜sealing 封孔处理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 钢隔板sequential lamination 渐成式压法serrated edges 毛边shatter 破碎short 短路shunt 分路silane treatment 硅烷处理silicone coupling agent 硅烷偶合剂silk screen 文字印刷simulator 仿真器single axis 单轴sizing 底片之伸缩补偿skip 漏印skip printing 跳印;漏印sliver 丝条slot 开槽slotting 开槽SMD ( surface mount device ) 表面黏着组件smear 胶渣SMT ( surface mount technology )表面黏着技术sodium carbonate monohydrate 结晶水碳酸钠soft tooling 软性工具solder 焊锡; 锡铅solder bridge 锡桥solder bump 锡突solder float 漂锡solder mask adhesion 绿漆附着力solder on G/F 金手指沾锡solder on trace 线路沾锡solder plug 锡塞solder side 焊锡面solderability 焊锡性solid carbide 实质碳化物spacing 间距spacing nonenough 间距不足SPC ( Statistical Process Control ) 统计生管specification 规范special considerations 特别考虑spin coating 旋转涂布spindle 钻轴spiral contractometer 螺旋收缩仪spot face 铣靶spray coating 喷涂Squeegee 刮刀stacking structure 叠板结构stamping 冲压standard hydraulic lamination标准液压法standardizing 标准化starvation 缺胶step tablet 格片数stock option 认股选择权strain 应度strength 强度stressmeter 应力计subtractive 减除法surface convex 表面突起surface examination 表面检查surface insulation resistance (SIR) 表面绝缘电阻surface mount 表面黏着方式surface roughness 表面粗慥度surges 突波switch circuit 开关线路tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 张性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法test point 测试点thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;内层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查V oid 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作范围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率。
不良现象中英文对照表（2）
41.PCB翘⽪（PCB PEELING） 42.PCB弯曲（PCB TWIST） 43.零件沾胶（GLUE ON PARTS） 44.零件脚长（PARTS PIN LONG） 45.浮件（PARTS LIFT） 46.零件歪斜（PARTS TILT） 47.零件相触（PARTS TOUCH） 48.零件变形（PARTS DEFORMED） 49.零件损坏（PARTS DAMAGED） 50.零件脚脏（PIN DIRTY） 51.零件多装（PARTS EXCESS） 52.零件沾锡（SOLDER ON PARTS） 53.零件偏移（PARTS SHIFT） 54.包装错误（WRONG PACKING） 55.印章错误（WRONG STAMPS） 56.尺⼨错误（DIMENSION WRONG） 57.⼆极管坏（DIODE NG） 58.晶体管坏（TRANSISTOR NG） 59.振荡器坏（X'TL NG） 60.管装错误（TUBES WRONG） 61.阻值错误（IMPEDANCE WRONG） 62.版本错误（REV WRONG） 63.电测不良（TEST FAILURE） 64.版本未标（NON REV LEBEL） 65.包装损坏（PACKING DAMAGED） 66.印章模糊（STAMPS DEFECTIVE） 67.标签歪斜（LABEL TILT） 68.外箱损坏（CARTON DAMAGED） 69.点胶不良（POOR GLUE） 70.IC座氧化（SOCKET RUST） 71.缺UL标签（MISSING UL LABEL） 72.线材不良（WIRE FAILURE） 73.零件脚损坏（PIN DAMAGED） 74.⾦⼿指沾锡（SOLDER ON GOLDEN FINGERS） 75.包装⽂件错（RACKING DOC WRONG） 76.包装数量错（PACKING Q'TY WRONG） 77.零件未定位（PARTS UNSEATED） 78.⾦⼿指沾胶（GLUE ON GOLDEN FINGERS） 79.垫⽚安装不良（WASHER UNSEATED） 80.线材安装不良（WIRE UNSEATED） 81.⽴碑（TOMBSTONE）。
PCB常见不良中英文对照(电子厂专业术语)
WINDOWS不能軟體關機 QAPLUS 當機 音效不良 VGA不良或螢冪雜訊 USB不良 凹痕
英文 CACHE MEMORY defect cann't read floppy IDE1 cann't read or error KEYBOARD LOCK error GspReEeEdNeerrroror ror cann't switch LED no light or error speaker error or disorder COM 1/2 defect LPT1 defect CMOS setting error time stopped ID 00 defect CARD defect WINDOWS hang up WINDOWS cann't boot from software QAPLUS hang up audio error VGA error or disorder USB defect sink mark
常見不良現象中英文對照表
英文 poor solder mask PAD defect forming defect board bent extra component component deform ICT test fail voltage defect no voltage wire open no boot BIOS flash error cann't flash BIOS cann't RESET battery no voltage
痘斑 樹脂流紋 樹脂脫落 凹陷 松垂 皂化 疤痕 廢料 廢料阻塞 刮傷/劃痕 深沖表面劃傷 裂痕 模口擠痕 充填不足
ห้องสมุดไป่ตู้
英文 mixed boards mixed versions component lead float illegible character float lead knee down lead doesn't penetrate incoming matrials defect lead longer solder hole solder splash solder tail extra soldering non-wetting hole clog
PCBA SMT 连结器常见品质不良中英文对照
變值： variation 電鍍不良：poor plating 排針假焊：pin false solder 鐵殼錯開：staggered shell 傾斜：slant 主體損壞：housing damage 橋堆短路：bridge rectifier short 來料少件：incomห้องสมุดไป่ตู้ng comp. missing 電容掉件：capacitor fall off 清除：clear 來料掉件：incoming comp. fall off 彈片不良：shrapnel defect
PCBA SMT 焊接常見品質不良中英文對照
損壞 damage 掉件: comp. fall off 假焊: false solder 更換: replacement 補件: comp. supplement 補焊: repair solder 連錫:solder bridge 清除錫點:clean solder joint 重測：re-inspect 撞件：comp. colliding 撞傷：impacting 誤測： misjudging 刮傷：scratch 彎腳： bent pin 少件： comp. missing 有錫渣： solder slag 短路：short 移位 : shifting 燈暗： dim 燒壞： burn 浮高：high position 反向： reverted 退 PIN: concessive pin 線反：wire wrong connection 低 PIN: flat pin 變形： deformation 少 PIN: missing pin 髒污：contamination 清除:clear 晶振不工作:crystal INOP 排針損壞：pins damage SD 卡損壞： SD card damage AUX 阻抗大：large AUX resistance MINIUSB 短路 MINIUSB short PIN 腳下陷：sunk pin
PCB专业术语中英文对照
1影響電性及外觀Affect upon electrical performance or appearance 2過度的Excessively3異常Abnormal4規格不符specification is below standard5品質異常quality is below standard6嚴格按照QC規定Strictly according to QC regulation7定期研磨To make regularly re-sharpen8設備device(另義:主動零件) \ machine \ equipment9參數設置錯誤parameters setting error10依保養計劃According to the maintaining plan11壓力過小lack of pressure12曝光不全\過度exposure-energy insufficient\excessive13間距不足spacing nonenough14線細width reduce15光強度Light Intensity16缺口nick\chipping17氣泡Bubble\blister\air inclusion18異物foreign particle \ foreign material（壓合異物）\dust(灰塵) 19被污染contaminated20干膜附著力不足 Poor adhesion of dry film21固定點開路fixed position open22固定點短路fixed position short23線路針孔trace pin-hole24孔破void in PTH hole\Barrel Crack25斷脖子Open near pad26靜置時間Holding time27識別方法identify method28膜屑反粘Contrary to adhere of scum29碎屑,殘材 Debris30顯影不潔Developing uncleanness31外觀不良Appearace defective32傳動\傳送速度convey speed33偏離deviation\shifted34單軸single axis35底片漲縮A/W expand or contract 36漏失率Loss Rate37補償compensation\balancing 38零件孔\面component hole\side39覆铜箔层压板\銅箔基板copper clad laminates (CCL)40線路露銅copper exposure 41織紋顯露weave exposure42光學點\基準標記fiducial mark43環氧樹脂epoxy44蝕刻速率etch rate45網布fabric46助焊劑不均勻flux coating uneven 47過濾filtration48電測治具fixture49鉆尖分離gap50標準板golden board1影響上件及外觀affect upon mounting or appearance2銅厚測量儀Copper thickness Measuring Instrument3佐證evidence4微蝕量microetching quantity5 濕度humidityinternal proofread cycle\calibration system cycle 6內部校正周期(校驗矯正)7板面刮傷Surface Scratch8制定handling 標準Define standard of handling9目視檢查\目檢visual inspection10規定頻率defined frequency11壓力計\表pressure gauge12工程程式designed program13超規格out of the tolerance14毛頭\去毛頭burr\deburring15影響下工序製作difficult to product in the following process16化學銅electroless plating17除膠速率desmearing rate18電流current19分層delamination\bulge20濕潤Damped21預浸Pre-dipped22活化液activator23速化accelerator24漂錫solder float25熱應力測試thermal stress test26孔環(焊墊)Lifted land\annular ring27熱水洗Hot water rinsing28震動馬達vibrating motor29銅渣copper residue (copper splash)\cosmetics island獨立銅渣30清潔濾網purifying filters31定期換水replace water regularly32回收槽recovery tank33加強管控to strengthen the control of sth.34酸洗\鹼洗acid\alkali rinse35定期分析濃度Analyze Conc. regularly36金屬雜質污染Contamination of metal impurities37碳化物carbide38碳處理carbon treatment39整流器(電流矯正)Current rectifier40銅厚測量儀Copper Thickness Measuring Instrument 41刷磨速度Brush Speed42速度控制器velocity controller43電流控制器current controller44吸水滾輪破舊water-absorptive roller worn-out45新水補充不足Insufficient for water replenishment46濾芯Filter element47化學藥液chemicals liquid48孔塞(孔內異物)dirty hole49多與\少與1mil厚Less\More than 1 mil Thickness 度50色差color variation1板面粘油墨屑(顯影段)sticky ink debris2擋水滾輪water apart roller3網板高度Screen height4網板張力不足Screen tension insufficient5刮刀行程Squeegee distance6刮刀刃鈍化Squeegee edge blunt7油墨黏度過大viscosity of ink too thick8張力應力tensile stress9后烤Post cure10印C面Printing Top(COMP) Side11印S面Printing (SOLD)Bottom Side12靜電噴涂Spray Coating13印可剝膠Peelable Solder Mask14風刀air knife15隔離環clearance16燒焦burning17化鎳金immersion nickel and gold18銅鎳層接著不良Poor combination the copper and nickel 19刷磨滾輪brush roller20刷幅測試brush breadth\width test21脫脂溫度Defatting Temp.22流量計flowmeter23執行\導電Conduct24助焊劑\熔合液rosin(天然松香)\flux\fusing fluids25錫粗Tin roughness26焊料中銅離子含量過高The cu2+ content out of upper in solder 27機臺異常machine-motion error28缺點標示卡nominal card of defects29程序\程式錯誤Programbug30人員疏忽operator's carelessness31日保養daily maintainance32人員技能不熟練Operator is not skilled33口頭考核examine orally34阻抗異常Impedance Abnormal35阻抗測量儀impedance measuring instrument36漏氣puncture37受潮moisture absorption38膜面污染film surface contaminated39漏檢Leaking inspection40二次元 2D(biaxial) dimension-measuring instrument 41工單run card\work order42飛針Flying Probe43目檢Visual Inspection44專用治具測試Dedicated Tester45特殊特性Critical Feature46重要特性Important Feature47銅箔厚度Copper foil Thickness48板彎翹Bow and Twist(warp)49尺寸(含對角)Size(Diagonal)\dimensions(成型)50拉力計\張力計tensile meter1棕化\黑化Brow\black oxide2循環水洗circulating water rinsing3PP膠片Prepreg4物理性質\化學性質physical\chemical character5暫存時間Temporary store time6鉚釘組合Eyelet7疊板結構stacking(lay up) structure8鉚釘rivet9熱熔機heat-melting machine10有用壽命useful life11印製電路板Printed Circuit Board(PCB)12根本原因\真因Root Cause13圍堵措施Containment Plan14現狀Current Status15原因分析Gap Analysis16內部稽核\外部稽核Internal\outside Audit17修改\變更Modify18無鹵素Halogen Free19更新\修訂Update/Revise20改進措施ure Plan21長期異常Chronic22突發異常Excursion23陶爾(壓力單位)Torr24靶孔距Space between target holes25層偏misalignment26組合線Combined producing line27鋼板\隔板steel plate\caul plate\separator28板厚測量儀Board-thickness measuring instrument 29鋼印機 steel seal machine30品質檢驗 quality examination31介質厚度dielectric thickness32吸水性moisture absorbability33耐磨性wear resistance34剝離強度stripping strength35焊錫耐熱性heat-resistant of solder36抗麻斑測試spot-resistant test37信賴性測試reliability test38介電常數測量儀dielectric constant measuring device 39包裝標籤packing tag40電子天平electrical balances41焊錫爐solder furnace42孔徑規calliper gauge43比色計color comparing meter44密度計density meter45蝕刻均勻性Etching uniformability46化驗單 laboratory list47出貨單manifest48雙面板\多層板 Reversible Board\Multi layer board 49定位孔 Location Hole50疊板數stack boards count1硝基戊烷amylnitrite2陽極泥anode slime (sludge)3液態光阻aqueous photoresist4縱橫比aspect ratio5預留在製品banked work in process 6貝他射線照射法beta backscattering7斜邊beveling8吹孔blow hole9黏結層bonding plies10焊橋solder bridge11接單生產Build To Order(BTO) 12金手指斜邊\倒角chamfering13網框chase14螯合劑chelator15化學鍵chemical bond16熱膨脹Thermal Expansion17同心圓concentric circle18密貼性conformance19消費類產品consumer products20庫倫定理coulombs law21喇叭孔countersink22試樣coupon\sample23覆蓋力covering power24挖空cut-outs25交期縮短cycle-time reduction 26專用型dedicated27縮錫dewetting28介質常數dielectric constant29孔黑\孔灰discolor hole30停機\稼動時間downtime\uptime31鉆針切削面drill facet32鉆針研磨機drill pointer33裸板(未鍍銅) blank board34延展性ductility\Elongation35留邊寬度edge spacing36金手指edge-board contact ( gold finger )\tab 37電化學反應器electrochemical reactor38脆性embrittlement39植PIN法\外部插梢法external pin method40織維突出fiber protrusion41成品final board42固著fixing43燃燒等級flammability rating44抗菌性\抗酶性fungus resistance45膠化時間gel time46一般阻焊油墨general resist ink47玻璃態轉換溫度glass transition temperature (Tg)48多孔\少孔Extra/Missing Hole49硬化劑hardener50空氣濾清器\過濾器hepa filter1規範specification\standard2銑靶spot face3衝壓\鋼印stamping4標準液壓法standard hydraulic lamination 5缺膠starvation6應力\應度strain7應力計stress meter8板面突起surface convex\swelling9板面檢查surface examination10板面粗糙度surface roughness11熱震蕩試驗thermal shock12厚度不均uneven thickness distribution 13抗污抗氧化劑tarnish and oxide resist14透光度transmittance15裁切線trim line16測試undercut17萬用型universal18有形庫存visible inventory19倉庫warehouse20濕化學制程wet chemistry process21燈芯\滲銅wicking22縱橫比width-to-thickness ratio23良率yield24點燈次數Times of Light switch25真空延遲時間Vacuum delayed time26+/-2 周The front or rear two weeks 27無塵室clean room28上噴壓Upper spray pressure29下噴壓Lower spray pressure30顯影劑developer31主軸轉速(RPM) Spindle Revolution Speed\Revolution Per MinuteRPM32光電耦合器(Charge Couple Device) CCD3390° 孔切破90 degree breakage34缺點偵測\檢測defect detection35聚焦focus36光校正calibration37極性Polarity38正極\陽極Positive39負極\陰極Negative40下鉆點\下刀點entry41量杯measuring cup42微切片Microsection43爆孔hole breakout(鑽孔)\hole overflow(防焊油墨) 44溫差temperature difference45文字不清marking(symbol) blurred46文字白點S/L white point47補充顯影additional developing48烘烤baking49確認檢修系統Visual Repair System(VRS)50圖表Diagram1腐蝕Corrosive2致癌物carcinogenic3有機體突變的Mutagenic4染色體錯位chromosome aberration5畸形teratogenic6有害氣體poisonous gas7易燃性Inflammability8爆炸性explosion9吸入\吸入劑inhalation10護目鏡goggle11棉手套Cotton glove12化學特性Chemical properties13熔點Melting point14抽樣檢查spot check15沸水boiling water16沖模Punching17氫溴化物hydrochloride18醇\酒精alcohol19持續改進continual improvement20糾正措施corrective action21環境因素\影響\方針environment aspect\impact\policy 22環境管理體系environment management system 23污染預防prevention of pollution24品質關鍵點critical to quality(CTQ)25客戶需求分析Customer Needs Mapping(CNM) 26質量功能分布Quality Function Deployment(QFD)27失效模式及後果分析Failure Mode & Effects Analysis(FMEA)28跨功能小組Cross-functional involvement 29傳感器sensor30點陣圖tally chart31全面品質管理Total Quality Management(TQM)如QC七大手法32柏拉圖Pareto Chart33因果圖\魚骨圖Cause and Effect diagrams34腦力激蕩Brainstorming35散布圖Scatter diagrams36全面設備保養Total Productive Maintenance(TPM)37控製圖Conttrol Chart38測定系統分析Gage Repeatability&Reproducibility(GRR)39印製電路板協會Institute of printed circuit(IPC)40有機保焊膜Organic Solderability Preservative(OSP)41進刀Feed42金鹽Potassium Gold Cyanide(金氰化鉀PGC)43輻射式紅外線焊Radiation(輻射) Infrared Rays(IR) Reflow(焊接)接44錫膏熔焊Reflow Soldering45縮錫Dewetting46錫爐浮渣Dross47錫尖Solder Icicle48錫球Solder Ball49電容器capacitor50波峰焊Wave Soldering1石油petroleum2線圈\纏繞coil3代理商agency4自由基Free Radical5鍍金Golden Plating6防焊阻劑Polymer coating(solder resistent) 7內層(外層)孔環Internal(external) Annular ring 8隧道式烤箱transmission toaster9直立式烤箱vertical toaster10光面\霧面油墨glossy\matte ink11晶片直接組裝Chip On Board(COB)12組裝密度packaging density13球狀陣列Ball Grid Array(BGA)14焊膏solder paste\solder cream15焊料粉末(焊粉)solder powder16觸變性thixotropy(粘度變化特性)17儲存壽命shelf life18網版(脫網)高度snap off distance19拉絲stringing20平移偏差shifting deviation21貼裝幾Placement equipment22虛焊點(焊點不佳)colder solder connection23焊盤起翹lifted land24錫珠solder ball25波峰焊wave soldering26迴流焊reflow soldering27離子清潔度ion cleaning28印製電路元件printed circuit assembly(PCA) 29特采Accept on Deviation\Use As It 30首件检验报告First Piece Inspection Report31工序变更通知Process Chang Notice（PCN）32孔銅厚度Barrel Copper thickness\Hole Copper Thickness 33面銅厚度Surface Copper Thickness34皺折wrinkle35置信區間Confidence interval36相關性Correlation37相關矩陣Correlation Matrix38任意抽樣法Haphazard Sampling39不合格品Nonconforming units40不合格Nonconformity41正態分布Normal Distribution42排列圖(柏拉圖)Pareto Chart43預測區間Prediction IntervalProbability Based Chart44基於概率的控制圖45制程能力Process Capability46二次函數Quadratic47隨機抽樣Random sampling48極差Range49合理子組Rational Subgroup50回歸控製圖Regression control chart1故障failure\breakdown2夾頭grip holder3解析度\解像度resolution4可靠度reliability5孔位錯誤(孔偏)mis hole location6孔徑\鉆孔直徑錯誤Hole Diameter error7離子污染度試驗ionic contamination testing8線距line space9線寬line width\trace width10感光油墨liquid photoimageable solder resist ink 11批batch\lotcrazing\mealing(白點)\Haloing(白邊) 12 裂痕\白斑\白點\白邊13對位不准misregistration14釘頭nail heading15數位鉆孔機NC drill16原稿底片original art work (A/W)17鉆針重疊overlap18氧化oxidation19剝離\抗撕強度peel strength20感光起始劑photo initiator21凹陷dent22塞孔plug hole\stuffing23補線不良poor touch-up24循環周期Periodically cycle25初始資料protocal26噴砂pumice scrub27對位孔registration hole28文字印刷silk screen printing\printing of legend 29膠渣resin smear30孔壁粗糙度roughtness31防焊文字S/L32毛邊serrated edges 33跳印skip printing34漂錫solder float35噴涂spray coating36刮刀Squeegee37孔規taped hole gauge 38薄基板\內層板thin core39工作片工作母片working gerberworking master gerber40粗化abrade41電流密度Current Density42風刀Air Knife43獲取資格的Qualify/qualified + n. or + to44現場locality(PD)45濃度偏低Conc. Lower46濃度偏高Conc. Higher47人員疏忽Operator careless48經緯向錯誤longitude and latitude contrary49上件不良failed componmt mounting50防呆孔Poka-Yoke hole\ mistake proofing hole1假性露銅unreal copper exposure2積墨ink accumulation3印偏ink printing deviated4遵照現場作業規範comply with the handling standardization 5放置時間Holding time6烘乾溫度不足Insufficient in dry temperature7設備故障breakdown of machine8壓膜滾輪 D/F laminated roller9sth. 受損或污染Damaged or contaminated10粘塵壓力sticky pressure11曝光燈管exposure fluorescent tube12光階 light step condition13曝偏Exposure misregistration14層間對準度alignment registration15吸氣不良vacuum treatment abnormal16曝光藏點Exposure shelter17人員動作不當improper handling18顯影Developing19蝕刻Etching20去膜stripping21Mylar 未撕Mylar non tearing off22教育訓練instruction and trainning23進行顯破點測試conduct developing point broken test 24噴壓Spraying pressure25蝕刻不潔Etching incompletely\underetch26蝕刻液Etchants27首件確認First article confirm28電性不良Electrical performance defective29去膜不凈Film stripping uncleanness30幾臺漏測Equipment test leaking31領班Foreman32主管Chief33穩定性Stability34誤判Misjudgement35混料Mixture36鋁粉濃度(火山灰)Aluminum percentage37超音波測試(錫箔Tin foil perforating test 紙)38水破測試water broken test39油墨黏度ink viscosity40黏度計viscosimeter41數孔機hole counter42振動馬達vibration motor43網版調偏net screen misregistration 44試印膜trial printing film45機臺未清潔worktable uncleaness46萬用塞孔墊板universal plugging back-up 47預烤Precure48上錫\焊錫性不良poor solderability49溫度均勻性Temp. uniformability 5010倍放大鏡10X magnifier1捲尺measuring tape2千分尺micrometer3剝離強度Peeling strength4尺寸安定性Dimensional stability5有害物質Hazardous substance6元素分析儀 element analyzing instrument7顯微鏡microscope8遊標卡尺vernier caliper9膜厚測量儀membrane thickness measuring intrument 10銑刀milling cutter\routing bit11鉆針drill bit12化學元素chemical elements13化學藥水chemical liquid14裁切刀具cutting tool15控制面板control panel16日點檢表daily check list17光面油墨glossy green ink\resist(阻焊劑防染劑) 18公差\誤差 tolerance\variance\bias(偏差)19量產mass production20白色文字white ident21成型外型routed outline22連片尺寸PNL drawing dimension23折斷邊break-away tabs24檢查表inspection sheet25記錄表data sheet\record chart26報表report forms27點檢表Check list28磨邊機Grind- edging machine\ Edger29打磨機polisher30板面光滑Board surface smooth31滴定法分析Titration analysis32溫度計Temp. meter\Thermograph33壓力計Pressure meter34能量格測試Energy-step tablet test35黏紙viscosity paper36六點測溫儀Six points Temp. uniformability test Instrument 37催化劑catalyst38穩定劑\安定劑stabilizer39硫酸銅回收機CuSO4 retrieve equipment40秒錶stopwatch41預熱preheat42計時器chronograph\timepiece43能量計energy meter44靶孔機target hole equipment45銅含量The contents of Cu46液體比重計hydrometer47比重測定法stereometry48殺菌劑sterilant49蝕刻因子Etching factor\value\element50自動光學檢測Automatical optical inspection(AOI)1精度Precision2棧板pallet3電動拖車\叉車electric trailer\fork lifter4針盤bit holder5放置架placement rack6靜止消泡時間static\rest defoaming time7轉板Transfer plate8水性筆Mark pen9尼龍\不織布\陶瓷nylon\non-woven fabric\ceramic10比色計chromo meter11濕度卡Humidity Indicator Cards12測溫儀Thermoscope13龍門吊gantry crane14搖擺\擺動swing15PIN孔重合pin hole superposing16首躺first cycle17中和洗neutralization cleaning18流量flow amount19除膠速率desmear rate20濕潤(電鍍)moisten21獲准供應商supplier warrant22供應商批准程序書Supplier Part Approval Process(SPAP) 23V-cut殘厚Remain thickness of V-cut24冷媒油refrigerant oil25壓力腳pressure foot26塊規block gauge27高度規vernier height gage28金剛砂carborundum\Emery29火山灰volcanic ash30高阻計high resistance meter31模具圖mold draw32支架Chassis33治具fixture34超音波浸洗ultrasonic dip35酸浸acid dipping36電流強度current amperage37化驗分析表Assay analysis report forms 38加壓水洗Pressurized water rinsing39酸洗acid rinsing40溢流水洗cascade water rinsing\overflow 41沉淀缸sediment tank42沖污水waste water rinsing43水柱式沖洗Jet cleaning44高壓水柱式沖洗High pressure rotating jet rinse 45清水洗Fresh water rinsing46干板組合Drying module47抗腐蝕測試accelerated corrosion test48速化反應acceleration49實際在製品active work in process50總量amount1高性能(電子)工業high performance industrial級2高延展性銅箔high temperature elongation copper(HTEC)3高溫樹脂high temperature epoxy (HTE)4孔數hole number5哈氏槽hull cell6水解hydrolysis7改善方案implementation8努普(硬度單位)Knoop(Hardness)9牛皮紙kraft paper10壓膜機laminator11刃角磨損lay back12牽引\定位螺絲lead screw13平整劑levelling additive14線性可變差動轉換器linear variable differential transformer(LVDL) 15 刷磨清潔法machine scrub16鉆頭刃帶margin17主圖\機構圖master drawing18基材利用率material use factor19濕度與絕緣電阻測試moisture and insulation resistance test20鋸齒\蝕刻缺口mouse bite21負片negative film22結瘤\銅瘤nodule23流膠量百分比resin flow percentage24膠含量resin content25報廢因素obsolescence factor26一銅panel plating27二銅pattern plating28透電率\介電常熟permittivity29極性吸引力polar-polar interaction30聚酯類polyester31孔變形poor drill32預聚合物prepolymer33原始資料protocal34噴砂清潔法pumice scrub35掛架rack36折光率refraction37對位元用標記register mark(對位點)38孔內沾文字S/L on hole39孔內防焊S/M on hole40干膜屑\透明殘膜scum41漏印\跳印skip printing42表面附著元件SMD ( surface mount device )43表面附著技術SMT ( surface mount technology ) 44錫突solder bump45漂錫solder float46油墨附著力solder mask adhesion47金手指上錫solder on G/F48線路沾錫solder on trace49錫塞solder plug50統計制程管控SPC ( Statistical Process Control )1自檢Self-examine2檸檬酸濃度Citric acid conc.3液位Liquid Level4析出物educt5垂直的perpendicular6噴砂能力pumice capability7閥門 Valve8外包加工contract-production 9退貨拒收REJ ( reject )10植PIN深度Depth of external pin 11上PIN beat PIN12精確度Precision13準確度accuracy14操作員技術不嫻熟operator technique unskilled15套环深度depth of sleeve-ring16精修(成型)finely couting17漏鉆\漏撈Leaking drilling\routing 18多鉆\多撈surplus drilling\routing 19排屑chip load20排屑槽flute21蜂鳴器check beeper22建立檔案資料(建檔)Archive data building 23合格qualified24電子稱Electronic scale25封口時間sealing time26超出範圍out of scope27微蝕速率Micro-etching ratio28變色\褪色discolor29破損breakage30電導率conductance ratio31履歷表biographic sketch32公式formula33擴孔針reaming drill bit34電木板bakelite board35允收水準general criteria36理想狀況Target Condition37模板\模具Template38基準孔reference holes39壓敏開關Piezo-switch40指示燈indicator41直方圖Histogram42并聯導體parallel conductors43導體連接處area of adjacent conductors44金屬導體Metal conductors45防焊側露(焊墊\線路)Adjacent isolated lands or conductors exposed 46有害物質公約Restriction of Hazardous Substances(RoHS) 47預防措施Precaution48生物可降解Biodegradability49生態環境ecologyDisposal50(垃圾\廢棄物)處理1浸焊Immersion Soldering2焊接點Solder Joint3焊錫絲Solder Wire4待工溫度Idle Temp.\+Time(空轉時間)5靜電釋放Electrostatic Discharge(ESD)6靜電壓力Electrostatic Overstress(ESO)7電阻係數Electrical Resistivity8內應力Internal Stress9導熱係數Thermal Conductivity10磷含量Phosphorous11顆粒大小Grain Size(μm)12X光測量X-ray Diffraction13抗拉強度Tensil Strength(N/mm2)14介面化合物Intermstallic Compound(IMC)15賈凡尼效應Galvanic Effect(不同金屬電位差加速腐蝕) 16高頻信號High Frequency Signal17肌膚效應Skin Effect(高頻線路沿道題表面傳輸)18阻隔效應Barrier Effect(合金層可有效減低離子遷移度) 19銀Silver20硫酸sulfuric acid21儀器Apparatus(測試用儀器)22拋光Polish23磨切片grind microsection24文件保存期限Documentation of age25內部管理政策Internal Policies26工資支付Salary payments27責任書Responsibility28法定最小年齡The legal minimum age29熟練\技能Facility30隱私權right to privacy31貪污\腐敗corruption32有效日期valid period33溫度循環實驗Temperature Cycling Test(TCT)34熱衝擊實驗Thermal Shock Test(TST)35離子遷移試驗Electrochemical Migration Test(ECM) 36絕緣電阻試驗Surface Insulation Resistance(SIR)37陽極燈絲Conductive Anode Filament(CAF)38爆板popcorn39生產車間Fabricating Plant40吊車crane41危隩物品hazardous substance42文字脫落symbol fading43鋸齒Worm-Eaten-Crack44經緯方向Grain Direction45V-cut Slit46幻燈片slide47預算budget48運輸工具transport49貨物cargo50容器vessel1殘差控製圖Residuals Control Chart2雙邊Bilateral3單邊(極致)unilateral4分布寬度Spread5標準差Standard Deviation6統計推斷Statistical Inference7變差Variation8區域分析Zone Analysis9可接受質量水平Accpet Quality Level(AQL)10物質安全品質表Material Safey Data Sheet(MSDS) 11錫渣Tin residue12外包商Subcontractor13結論conclusion14能力competence15工作關鍵表Job Element Sheets(JET)16目數mesh count171819202122232425262728293031 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50。
PCB专业术语中英文对照
1影响电性及外观Affect upon electrical performance or appearance2过度的Excessively3异常Abnormal4规格不符specification is below standard5品质异常quality is below standard6严格按照QC规定Strictly according to QC regulation7定期研磨To make regularly re-sharpen8设备device(另義:主動零件) \ machine \9参数设置错误parameters setting error10依保养计划According to the maintaining plan11压力过小lack of pressure12曝光不全\过度exposure-energy insufficient\excessive 13间距不足spacing nonenough14线细width reduce15光强度Light Intensity16缺口nick\chipping17气泡Bubble\blister\air inclusion18异物foreign particle \ foreign material（壓合異物）\dust(灰塵)19被污染contaminated20干膜附著力不足 Poor adhesion of dry film21固定点开路fixed position open22固定点短路fixed position short23线路针孔trace pin-hole24孔破void in PTH hole\Barrel Crack25断脖子Open near pad26静置时间Holding time27识别方法identify method28膜屑反粘Contrary to adhere of scum29碎屑,残材 Debris30显影不洁Developing uncleanness 31外观不良Appearace defective32传动\传送速度convey speed33偏离deviation\shifted34单轴single axis35底片涨缩A/W expand or contract 36漏失率 Loss Rate37补偿compensation\balancing 38零件孔\面component hole\side39覆铜箔层压板\铜箔基板copper clad laminates (CCL)40线路露铜copper exposure41织纹显露weave exposure42光学点\基准标记fiducial mark43环氧树脂epoxy44蚀刻速率etch rate45网布fabric46助焊剂不均匀flux coating uneven 47过滤filtration48电测治具fixture49钻尖分离gap50标准板golden board1影响上件及外观affect upon mounting or appearance2铜厚测量仪Copper thickness Measuring Instrument 3佐证evidence4微蚀量microetching quantity5 湿度humidity6内部校正周期(校验矫正)internal proofread cycle\calibrationsystem cycle7板面刮伤Surface Scratch8制定handling 标Define standard of handling 9目视检查\目检visual inspection10规定频率defined frequency11压力计\表pressure gauge12工程程式designed program13超规格out of the tolerance14毛头\去毛头burr\deburring15影响下工序制作difficult to product in the following process16化学铜electroless plating17除胶速率desmearing rate18电流current19分层delamination\bulge20湿润Damped21预浸Pre-dipped22活化液activator23速化accelerator24漂锡solder float25热应力测试thermal stress test26孔环(焊垫)Lifted land\annular ring 27热水洗Hot water rinsing28震动马达vibrating motor29铜渣copper residue (copper splash)\cosmetics island獨立銅渣30清洁滤网purifying filters31定期换水replace water regularly32回收槽recovery tank33加强管控to strengthen the control of sth.34酸洗\硷洗acid\alkali rinse35定期分析浓度Analyze Conc. regularly36金属杂质污染Contamination of metal impurities37碳化物carbide38碳处理carbon treatment39整流器(电流矫正)Current rectifier40铜厚测量仪Copper Thickness Measuring Instrument 41刷磨速度Brush Speed42速度控制器velocity controller43电流控制器current controller44吸水滚轮破旧water-absorptive roller worn-out45新水补充不足Insufficient for water replenishment 46滤芯Filter element47化学药液chemicals liquid48孔塞(孔内异物)dirty hole49多与\少与1mil厚度Less\More than 1 mil Thickness50色差color variation1板面粘油墨屑(显影段)sticky ink debris2挡水滚轮water apart roller3网板高度Screen height4网板张力不足Screen tension insufficient5刮刀行程Squeegee distance6刮刀刃钝化Squeegee edge blunt7油墨黏度过大viscosity of ink too thick8张力应力tensile stress9后烤Post cure10印C面Printing Top(COMP) Side11印S面Printing (SOLD)Bottom Side12静电喷涂Spray Coating13印可剥胶Peelable Solder Mask14风刀air knife15隔离环clearance16烧焦burning17化镍金immersion nickel and gold18铜镍层接著不良Poor combination the copper and nickel 19刷磨滚轮brush roller20刷幅测试brush breadth\width test21脱脂温度Defatting Temp.22流量计flowmeter23执行\导电Conduct24助焊剂\熔合液rosin(天然松香)\flux\fusing fluids25锡粗Tin roughness26焊料中铜离子含量过高The cu2+ content out of upper in solder 27机台异常machine-motion error28缺点标示卡nominal card of defects29程序\程式错误Programbug30人员疏忽operator's carelessness31日保养daily maintainance32人员技能不熟练Operator is not skilled33口头考核examine orally34阻抗异常Impedance Abnormal35阻抗测量仪impedance measuring instrument36漏气puncture37受潮moisture absorption38膜面污染film surface contaminated39漏检Leaking inspection40二次元 2D(biaxial) dimension-measuringinstrument41工单run card\work order42飞针Flying Probe43目检Visual Inspection44专用治具测试Dedicated Tester45特殊特性Critical Feature46重要特性Important Feature47铜箔厚度Copper foil Thickness48板弯翘Bow and Twist(warp)49尺寸(含对角)Size(Diagonal)\dimensions(成型) 50拉力计\张力计tensile meter1棕化\黑化Brow\black oxide2循环水洗circulating water rinsing3PP胶片Prepreg4物理性质\化学性质physical\chemical character5暂存时间Temporary store time6铆钉组合Eyelet7叠板结构stacking(lay up) structure8铆钉rivet9热熔机heat-melting machine10有用寿命useful life11印制电路板Printed Circuit Board(PCB)12根本原因\真因Root Cause13围堵措施Containment Plan14现状Current Status15原因分析Gap Analysis16内部稽核\外部稽核Internal\outside Audit17修改\变更Modify18无卤素Halogen Free19更新\修订Update/Revise20改进措施ure Plan21长期异常Chronic22突发异常Excursion23陶尔(压力单位)Torr24靶孔距Space between target holes25层偏misalignment26组合线Combined producing line27钢板\隔板steel plate\caul plate\separator28板厚测量仪Board-thickness measuring instrument 29钢印机 steel seal machine30品质检验 quality examination31介质厚度dielectric thickness32吸水性moisture absorbability33耐磨性wear resistance34剥离强度stripping strength35焊锡耐热性heat-resistant of solder36抗麻斑测试spot-resistant test37信赖性测试reliability test38介电常数测量仪dielectric constant measuring device 39包装标籤packing tag40电子天平electrical balances41焊锡炉solder furnace42孔径规calliper gauge43比色计color comparing meter44密度计density meter45蚀刻均匀性Etching uniformability46化验单 laboratory list47出货单manifest48双面板\多层板 Reversible Board\Multi layer board 49定位孔 Location Hole50叠板数stack boards count1硝基戊烷amylnitrite2阳极泥anode slime (sludge)3液态光阻aqueous photoresist4纵横比aspect ratio5预留在制品banked work in process 6贝他射线照射法beta backscattering7斜边beveling8吹孔blow hole9黏结层bonding plies10焊桥solder bridge11接单生产Build To Order(BTO)12金手指斜边\倒角chamfering13网框chase14螯合剂chelator15化学键chemical bond16热膨胀Thermal Expansion17同心圆concentric circle18密贴性conformance19消费类产品consumer products20库伦定理coulombs law21喇叭孔countersink22试样coupon\sample23覆盖力covering power24挖空cut-outs25交期缩短cycle-time reduction 26专用型dedicated27缩锡dewetting28介质常数dielectric constant29孔黑\孔灰discolor hole30停机\稼动时间downtime\uptime31钻针切削面drill facet32钻针研磨机drill pointer33裸板(未镀铜) blank board34延展性ductility\Elongation35留边宽度edge spacing36金手指edge-board contact ( gold finger )\tab 37电化学反应器electrochemical reactor38脆性embrittlement39植PIN法\外部插梢法external pin method40织维突出fiber protrusion41成品final board42固著fixing43燃烧等级flammability rating44抗菌性\抗酶性fungus resistance45胶化时间gel time46一般阻焊油墨general resist ink47玻璃态转换温度glass transition temperature (Tg)48多孔\少孔Extra/Missing Hole49硬化剂hardener50空气滤清器\过滤器hepa filter1规范specification\standard2铣靶spot face3衝压\钢印stamping4标准液压法standard hydraulic lamination 5缺胶starvation6应力\应度strain7应力计stress meter8板面突起surface convex\swelling9板面检查surface examination10板面粗糙度surface roughness11热震荡试验thermal shock12厚度不均uneven thickness distribution 13抗污抗氧化剂tarnish and oxide resist14透光度transmittance15裁切线trim line16测试undercut17万用型universal18有形库存visible inventory19仓库warehouse20湿化学制程wet chemistry process21灯芯\渗铜wicking22纵横比width-to-thickness ratio23良率yield24点灯次数Times of Light switch25真空延迟时间Vacuum delayed time26+/-2 周The front or rear two weeks 27无尘室clean room28上喷压Upper spray pressure29下喷压Lower spray pressure30显影剂developer31主轴转速(RPM) Spindle Revolution Speed\Revolution PerMinute RPM32光电耦合器(Charge Couple Device) CCD3390° 孔切破90 degree breakage34缺点侦测\检测defect detection35聚焦focus36光校正calibration37极性Polarity38正极\阳极Positive39负极\阴极Negative40下钻点\下刀点entry41量杯measuring cup42微切片Microsection43爆孔hole breakout(鑽孔)\hole overflow(防焊油墨)44温差temperature difference45文字不清marking(symbol) blurred46文字白点S/L white point47补充显影additional developing48烘烤baking49确认检修系统Visual Repair System(VRS)50图表Diagram1腐蚀Corrosive2致癌物carcinogenic3有机体突变的Mutagenic4染色体错位chromosome aberration5畸形teratogenic6有害气体poisonous gas7易燃性Inflammability8爆炸性explosion9吸入\吸入剂inhalation10护目镜goggle11棉手套Cotton glove12化学特性Chemical properties13熔点Melting point14抽样检查spot check15沸水boiling water16冲模Punching17氢溴化物hydrochloride18醇\酒精alcohol19持续改进continual improvement20纠正措施corrective action21环境因素\影响\方针environment aspect\impact\policy22环境管理体系environment management system23污染预防prevention of pollution24品质关键点critical to quality(CTQ)25客户需求分析Customer Needs Mapping(CNM)26质量功能分布Quality Function Deployment(QFD)27失效模式及后果分析Failure Mode & Effects Analysis(FMEA) 28跨功能小组Cross-functional involvement29传感器sensor30点阵图tally chart31全面品质管理Total Quality Management(TQM)如QC七大手法32柏拉图Pareto Chart33因果图\鱼骨图Cause and Effect diagrams34脑力激荡Brainstorming35散布图Scatter diagrams36全面设备保养Total Productive Maintenance(TPM)37控制图Conttrol Chart38测定系统分析Gage Repeatability&Reproducibility(GRR) 39印制电路板协会Institute of printed circuit(IPC)40有机保焊膜Organic Solderability Preservative(OSP) 41进刀Feed42金盐Potassium Gold Cyanide(金氰化鉀PGC)43辐射式红外线焊接Radiation(輻射) Infrared Rays(IR)Reflow(焊接)44锡膏熔焊Reflow Soldering45缩锡Dewetting46锡炉浮渣Dross47锡尖Solder Icicle48锡球Solder Ball49电容器capacitor50波峰焊Wave Soldering1石油petroleum2线圈\缠绕coil3代理商agency4自由基Free Radical5镀金Golden Plating6防焊阻剂Polymer coating(solder resistent) 7内层(外层)孔环Internal(external) Annular ring8隧道式烤箱transmission toaster9直立式烤箱vertical toaster10光面\雾面油墨glossy\matte ink11晶片直接组装Chip On Board(COB)12组装密度packaging density13球状阵列Ball Grid Array(BGA)14焊膏solder paste\solder cream15焊料粉末(焊粉)solder powder16触变性thixotropy(粘度變化特性)17储存寿命shelf life18网版(脱网)高度snap off distance19拉丝stringing20平移偏差shifting deviation21贴装几Placement equipment22虚焊点(焊点不佳)colder solder connection23焊盘起翘lifted land24锡珠solder ball25波峰焊wave soldering26迴流焊reflow soldering27离子清洁度ion cleaning28印制电路元件printed circuit assembly(PCA)29特采Accept on Deviation\Use As It30首件检验报告First Piece Inspection Report31工序变更通知Process Chang Notice（PCN）32孔铜厚度Barrel Copper thickness\Hole CopperThickness33面铜厚度Surface Copper Thickness34皱折wrinkle35置信区间Confidence interval36相关性Correlation37相关矩阵Correlation Matrix38任意抽样法Haphazard Sampling39不合格品Nonconforming units40不合格Nonconformity41正态分布Normal Distribution42排列图(柏拉图)Pareto Chart43预测区间Prediction Interval44基于概率的控制图Probability Based Chart45制程能力Process Capability46二次函数Quadratic47随机抽样Random sampling48极差Range49合理子组Rational Subgroup50回归控制图Regression control chart1故障failure\breakdown2夹头grip holder3解析度\解像度resolution4可靠度reliability5孔位错误(孔偏)mis hole location6孔径\钻孔直径错误Hole Diameter error7离子污染度试验ionic contamination testing8线距line space9线宽line width\trace width10感光油墨liquid photoimageable solder resist ink 11批batch\lot12 裂痕\白斑\白点\白边crazing\mealing(白點)\Haloing(白邊)13对位不准misregistration14钉头nail heading15数位钻孔机NC drill16原稿底片original art work (A/W)17钻针重叠overlap18氧化oxidation19剥离\抗撕强度peel strength20感光起始剂photo initiator21凹陷dent22塞孔plug hole\stuffing23补线不良poor touch-up24循环周期Periodically cycle25初始资料protocal26喷砂pumice scrub27对位孔registration hole28文字印刷silk screen printing\printing of legend29胶渣resin smear30孔壁粗糙度roughtness31防焊文字S/L32毛边serrated edges 33跳印skip printing34漂锡solder float35喷涂spray coating36刮刀Squeegee37孔规taped hole gauge 38薄基板\内层板thin core39工作片工作母片working gerberworking master gerber40粗化abrade41电流密度Current Density42风刀Air Knife43获取资格的Qualify/qualified + n. or + to44现场locality(PD)45浓度偏低Conc. Lower46浓度偏高Conc. Higher47人员疏忽Operator careless48经纬向错误longitude and latitude contrary49上件不良failed componmt mounting50防呆孔Poka-Yoke hole\ mistake proofing hole1假性露铜unreal copper exposure2积墨ink accumulation3印偏ink printing deviated4遵照现场作业规范comply with the handling standardization 5放置时间Holding time6烘乾温度不足Insufficient in dry temperature7设备故障breakdown of machine8压膜滚轮 D/F laminated roller9sth. 受损或污染Damaged or contaminated10粘尘压力sticky pressure11曝光灯管exposure fluorescent tube12光阶 light step condition13曝偏Exposure misregistration14层间对准度alignment registration15吸气不良vacuum treatment abnormal16曝光藏点Exposure shelter17人员动作不当improper handling18显影Developing19蚀刻Etching20去膜stripping21Mylar 未撕Mylar non tearing off22教育训练instruction and trainning23进行显破点测试conduct developing point broken test 24喷压Spraying pressure25蚀刻不洁Etching incompletely\underetch26蚀刻液Etchants27首件确认First article confirm28电性不良Electrical performance defective29去膜不净Film stripping uncleanness 30几台漏测Equipment test leaking31领班Foreman32主管Chief33稳定性Stability34误判Misjudgement35混料Mixture36铝粉浓度(火山灰)Aluminum percentage37超音波测试(锡箔纸)Tin foil perforating test 38水破测试water broken test39油墨黏度ink viscosity40黏度计viscosimeter41数孔机hole counter42振动马达vibration motor43网版调偏net screen misregistration 44试印膜trial printing film45机台未清洁worktable uncleaness46万用塞孔垫板universal plugging back-up 47预烤Precure48上锡\焊锡性不良poor solderability49温度均匀性Temp. uniformability5010倍放大镜10X magnifier1捲尺measuring tape2千分尺micrometer3剥离强度Peeling strength4尺寸安定性Dimensional stability5有害物质Hazardous substance6元素分析仪 element analyzing instrument7显微镜microscope8游标卡尺vernier caliper9膜厚测量仪membrane thickness measuring intrument 10铣刀milling cutter\routing bit11钻针drill bit12化学元素chemical elements13化学药水chemical liquid14裁切刀具cutting tool15控制面板control panel16日点检表daily check list17光面油墨glossy green ink\resist(阻焊劑防染劑) 18公差\误差 tolerance\variance\bias(偏差)19量产mass production20白色文字white ident21成型外型routed outline22连片尺寸PNL drawing dimension23折断边break-away tabs24检查表inspection sheet25记录表data sheet\record chart26报表report forms27点检表Check list28磨边机Grind- edging machine\ Edger29打磨机polisher30板面光滑Board surface smooth31滴定法分析Titration analysis32温度计Temp. meter\Thermograph33压力计Pressure meter34能量格测试Energy-step tablet test35黏纸viscosity paper36六点测温仪Six points Temp. uniformability testInstrument37催化剂catalyst38稳定剂\安定剂stabilizer39硫酸铜回收机CuSO4 retrieve equipment40秒錶stopwatch41预热preheat42计时器chronograph\timepiece43能量计energy meter44靶孔机target hole equipment45铜含量The contents of Cu46液体比重计hydrometer47比重测定法stereometry48杀菌剂sterilant49蚀刻因子Etching factor\value\element50自动光学检测Automatical optical inspection(AOI)1精度Precision2栈板pallet3电动拖车\叉车electric trailer\fork lifter4针盘bit holder5放置架placement rack6静止消泡时间static\rest defoaming time7转板Transfer plate8水性笔Mark pen9尼龙\不织布\陶瓷nylon\non-woven fabric\ceramic10比色计chromo meter11湿度卡Humidity Indicator Cards12测温仪Thermoscope13龙门吊gantry crane14摇摆\摆动swing15PIN孔重合pin hole superposing16首躺first cycle17中和洗neutralization cleaning18流量flow amount19除胶速率desmear rate20湿润(电镀)moisten21获准供应商supplier warrant22供应商批准程序书Supplier Part Approval Process(SPAP) 23V-cut残厚Remain thickness of V-cut24冷媒油refrigerant oil25压力脚pressure foot26块规block gauge27高度规vernier height gage28金刚砂carborundum\Emery29火山灰volcanic ash30高阻计high resistance meter31模具图mold draw32支架Chassis33治具fixture34超音波浸洗ultrasonic dip35酸浸acid dipping36电流强度current amperage37化验分析表Assay analysis report forms38加压水洗Pressurized water rinsing39酸洗acid rinsing40溢流水洗cascade water rinsing\overflow 41沉淀缸sediment tank42冲污水waste water rinsing43水柱式冲洗Jet cleaning44高压水柱式冲洗High pressure rotating jet rinse 45清水洗Fresh water rinsing46干板组合Drying module47抗腐蚀测试accelerated corrosion test48速化反应acceleration49实际在制品active work in process50总量amount1高性能(电子)工业级high performance industrial2高延展性铜箔high temperature elongation copper(HTEC) 3高温树脂high temperature epoxy (HTE)4孔数hole number5哈氏槽hull cell6水解hydrolysis7改善方案implementation8努普(硬度单位)Knoop(Hardness)9牛皮纸kraft paper10压膜机laminator11刃角磨损lay back12牵引\定位螺丝lead screw13平整剂levelling additive14线性可变差动转换器linear variable differential transformer(LVDL)15 刷磨清洁法machine scrub16钻头刃带margin17主图\机构图master drawing18基材利用率material use factor19湿度与绝缘电阻测试moisture and insulation resistance test 20锯齿\蚀刻缺口mouse bite21负片negative film22结瘤\铜瘤nodule23流胶量百分比resin flow percentage24胶含量resin content25报废因素obsolescence factor26一铜panel plating27二铜pattern plating28透电率\介电常熟permittivity29极性吸引力polar-polar interaction30聚酯类polyester31孔变形poor drill32预聚合物prepolymer33原始资料protocal34喷砂清洁法pumice scrub35挂架rack36折光率refraction37对位元用标记register mark(對位點)38孔内沾文字S/L on hole39孔内防焊S/M on hole40干膜屑\透明残膜scum41漏印\跳印skip printing42表面附著元件SMD ( surface mount device )43表面附著技术SMT ( surface mount technology )44锡突solder bump45漂锡solder float46油墨附著力solder mask adhesion47金手指上锡solder on G/F48线路沾锡solder on trace49锡塞solder plug50统计制程管控SPC ( Statistical Process Control )1自检Self-examine2柠檬酸浓度Citric acid conc.3液位Liquid Level4析出物educt5垂直的perpendicular6喷砂能力pumice capability7阀门 Valve8外包加工contract-production9退货拒收REJ ( reject )10植PIN深度Depth of external pin11上PIN beat PIN12精确度Precision13准确度accuracy14操作员技术不娴熟operator technique unskilled 15套环深度depth of sleeve-ring16精修(成型)finely couting17漏钻\漏捞Leaking drilling\routing18多钻\多捞surplus drilling\routing19排屑chip load20排屑槽flute21蜂鸣器check beeper22建立档案资料(建档)Archive data building23合格qualified24电子称Electronic scale25封口时间sealing time26超出范围out of scope27微蚀速率Micro-etching ratio28变色\褪色discolor29破损breakage30电导率conductance ratio31履历表biographic sketch32公式formula33扩孔针reaming drill bit34电木板bakelite board35允收水准general criteria36理想状况Target Condition37模板\模具Template38基准孔reference holes39压敏开关Piezo-switch40指示灯indicator41直方图Histogram42并联导体parallel conductors43导体连接处area of adjacent conductors44金属导体Metal conductors45防焊侧露(焊垫\线路)Adjacent isolated lands or conductorsexposed46有害物质公约Restriction of Hazardous Substances(RoHS) 47预防措施Precaution48生物可降解Biodegradability49生态环境ecology50(垃圾\废弃物)处Disposal理1浸焊Immersion Soldering2焊接点Solder Joint3焊锡丝Solder Wire4待工温度Idle Temp.\+Time(空轉時間)5静电释放Electrostatic Discharge(ESD)6静电压力Electrostatic Overstress(ESO)7电阻係数Electrical Resistivity8内应力Internal Stress9导热係数Thermal Conductivity10磷含量Phosphorous11颗粒大小Grain Size(μm)12X光测量X-ray Diffraction13抗拉强度Tensil Strength(N/mm2)14介面化合物Intermstallic Compound(IMC)15贾凡尼效应Galvanic Effect(不同金屬電位差加速腐蝕)16高频信号High Frequency Signal17肌肤效应Skin Effect(高頻線路沿道題表面傳輸)18阻隔效应Barrier Effect(合金層可有效減低離子遷移度) 19银Silver20硫酸sulfuric acid21仪器Apparatus(測試用儀器)22抛光Polish23磨切片grind microsection24文件保存期限Documentation of age25内部管理政策Internal Policies26工资支付Salary payments27责任书Responsibility28法定最小年龄The legal minimum age29熟练\技能Facility30隐私权right to privacy31贪污\腐败corruption32有效日期valid period33温度循环实验Temperature Cycling Test(TCT)34热衝击实验Thermal Shock Test(TST)35离子迁移试验Electrochemical Migration Test(ECM) 36绝缘电阻试验Surface Insulation Resistance(SIR) 37阳极灯丝Conductive Anode Filament(CAF)38爆板popcorn39生产车间Fabricating Plant40吊车crane41危险物品hazardous substance42文字脱落symbol fading43锯齿Worm-Eaten-Crack44经纬方向Grain Direction45V-cut Slit46幻灯片slide47预算budget48运输工具transport49货物cargo50容器vessel。
PCB及PCBA缺陷中英文对照表
PCB及PCBA缺陷中英文对照表PCB及PCBA缺陷中英文对照表1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F 5绿油剥离S/M peel off 45金手指发黑G/F too black6显影不净under developing 46字符印反inverse C/M7基材白点laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄S/M too thin29k孔内毛刺burrs in hole 69聚油excess solder mask 30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch 32露镍expose Ni 72绿油下杂物contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad 38绿油入孔solder mask in hole 78线路缺口nick on track 39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion 4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu9爆板measling 55孔内露基材laminate exposure in hole10粉红圈pinking ring 56焊盘脱落pad break off 11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu 16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping 24孔小hole undersize 38间隙小space too marrow 25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness PCB及PCBA常用度量衡单位换算所属目录：FASTPCBA靖邦公司资料发布时间：2009-01-01 1英尺=12英寸1英寸inch=1000密尔mil1mil=25.4um1mil=1000uin mil密耳有时也成英丝1um=40uin（有些公司称微英寸为麦，其实是微英寸）1OZ=28.35克/平方英尺=35微米H=18微米4mil/4mil=0.1mm/0.1mm线宽线距1ASD=1安培/平方分米=10.76安培/平方英尺1AM=1安培分钟=60库仑主要用于贵金属电镀如镀金1平方分米=10.76平方英尺1盎司=28.35克,此为英制单位1加仑(英制)=4.5升1加仑美制=3.785升1KHA=1000安小时1安培小时=3600库仑比重波美度=145-145/比重SG.SG.比重（克/立方厘米）=145/（145-波美PCB及PCBA行业专用名词PCB及PCBA行业专用名词BOM(Bill of material) 物料需求單Laminate 基板Copper foil 銅箔Solder mask(s/m) 防焊Bare Board 空板Microetching 微蝕Exposure 曝光Dry Film 干膜Matte side 毛面Rcc(Resin coated copper) 背膠銅箔Final shaping 成型Electrical test(ET) 電測Visual Inspection 外觀檢查Gold Finger(G/F) 金手指Legend 文字Post Cure 后烤Desmear 除膠渣Developing 顯影Pattern Plating 線路電鍍Panel Plating 全板電鍍Puddle Effect 水坑效應Oxide Coating 黑氧化Routing Bit 銑刀Tolerance 公差Post Treatment 后處理Adhesion 附著力Stripping 去膜Baking 烘烤AQL(acceptable quality level) 品質允收水準Optical Target 光學靶點Lay up 疊合Chromation 鉻化處理Undercut 側蝕Microvia 微孔Annular Ring 孔環Burr 毛頭Entek 有機保焊處理Conformal Mask 銅窗Drum Side 光面Diazo Film 偶氮棕片Cut Lamination 下料Sheets Cutting 裁板Inner Layer Drilling 內層鑽孔Outter Layer Drilling 一次孔2nd Drilling 二次孔PCB及PCBA专用名词Laser Drilling 雷射鉆孔Blind&Burried Hole Drilling 盲(埋)孔鉆孔screen printing 網版印刷silk screen 絲網印刷scum 透明殘膜skip printing 跳印漏印squeege 刮刀type 种類abietic acid 松脂酸air knife 風刀bridging 搭橋橋接flux 助焊劑product process 制程pre-process 制前solder bridge 錫橋soler bump 錫突solder plug 錫塞immersion gold 浸金(化金)thin core 薄基板twist 板翘, 板扭warp ,warpage 板彎weave eposure 織紋顯露wicking 燈蕊效應yield 良品abrasion resistance 耐磨性absorption 吸收accelerated test 加速實驗acceleration 速化反應accelerator 加速剂batch 批cold solder joint 冷焊點component side 零件面double side 雙面double side board 雙面板fiducial mark 基準記號finished board 成品板lot size 批量rack 掛架register mark 對準用標記solder side 錫鉛面thickness 厚度warehouse 仓库wet process 濕制程Beveling 斜邊chamfer 道角dimension 尺寸Fixture 治具interconnection 互相連通line space 線距line width 線寬misregistration 對不准mouse bite 蝕刻缺口nick 缺口master drawing 主圖print and etch board 印刷後及蝕刻後板crease 皺褶dent 凹陷glass fiber 玻璃纖維布pin hole 針孔pit 凹點target hole 靶孔PCBA及PCB专用名词(二)PCBA及PCB专用名词(二)Black Oxide Removal 黑化還原Plug Hole 塞孔Ink Print&precure 印刷及預烤Scrub 表面處理Spray Coating 靜電噴涂Printing of Legend 文字印刷Pumice ( Wet Blasting) 噴砂Immersion Ni/Au(Electoless Ni/Au) 浸鎳金Hot Air Solder Leveling 噴錫N/C routing 撈型Beveling of G/F 金手指斜边Cleanning&Baking 清洗及烘烤Fixture Testing 治具測試original A/W 客戶原稿working A/W 工作片working master 工作母片carlson pin 定位梢component hole(>30mil) 零件孔drill facet 鑽尖切削面drill pointer 鑽尖重磨機drilled blank board 已鑽孔的裸板hole diameter 孔徑hole location 孔位hole number 孔數lay back 刃角磨損margin 鑽頭刃帶open circuits 斷路runout 偏轉slot 開槽spindle 鑽軸tooling hole 工具孔stacking structure 疊板結構blow hole, void in PTH hole 吹孔孔破deburring 去毛頭electroless-deposition 無電鍍化etchback 回蝕air inclusion 氣泡chase 網框fabric 網布liquid 液態\狀mealing 泡點trim line 裁切線v-cut v型切槽golden board 標準板back lighting 背光crack 裂痕crazing 白斑dimension stability 尺寸安全性failure 故障fault 缺陷瑕疵gap 鑽尖分開gel time 膠化時間haloing 白邊白圈hardener 硬化劑hole counter 數孔機hook 外弧insulation resistance 絕緣阻抗ionizable(ionic) contaminants 離子性污染land 焊墊microsectioning 微切片法negative etchback 反回蝕overlap 鑽尖重曡peel strength 抗撕強度pink ring 粉紅圈REJ(reject) 拒收退貨release agent(sheets) 脫膜劑resin content 膠含量resin flow 膠流量resin recession 樹脂下限resin smear 膠渣rework 重工specification(spec.) 規範innerlayer&outlayer 內外層gold plating 鍍金QC(quality control) 品管back up 墊板blister 起泡局部分层caul plate 隔板, 钢板open circuits 断路sampling size 抽樣數edge spacing 板邊空地ground plane 接地層laminator 壓膜機M/T 磁帶disk 磁片。
电子电器产品不良缺陷对应英文描述
电子电器产品不良缺陷对应英文描述General Defect - 通用电器缺陷cord untied or irregularly tied电线未绑或绑的不规则exposed wires金属线外露brass wire in power cord exposed电源线的铜丝外露ground wire discontinuous地线间断burn down烧坏jam刮／卡死excessive noise噪音过多shock noise振动有噪音switch operated not smoothly开关不顺polarity reversed极性接反open circuited开路short circuited短路grounding continuity test failed接地失败Hi-pot test failed高压失败leakage current test failed漏电power supply dead无电源dielectric strength test failed介质强度测试失败current or wattage out ofspecification电流／电压不合规格live wire exposed火线外露General location - 电器通用缺陷位置jack插口AC-IN jack交流输入口DC-IN jack直流输入口socket插座socket cover插座盖plug插头plug foot插脚polarized plug极性插头coupling plug转化／耦合插头flat blade plug扁脚插头channel频道function key功能键nut螺母LCD液晶显示屏power LED indicator电源电子指示灯power cord电源线electrode plate电极片ON-Off switch开关adapter适配器transformer变压器remote control遥控器Lighting Fixture - 灯饰cold flow mark冷塑痕迹（拉痕）defective stamping冲压不良glass panel cut crooked玻璃切割弯曲glass panel out of square玻璃不规则（歪斜不直）gouge mark 凿痕holes improperly drilled孔眼钻的不对insufficient plating电镀不足lamp stand tilted after assembled安装后灯站立倾斜machining mark车痕screw stripped缺螺纹poor porosity holes疏松多孔poor rolling edge卷边不良rough planting镀层粗糙（镀前未抛光清洗）seam mark exposed少锡漏缝spinning lines旋压线wrong finish表面处理错误obvious shrinkage or deformation on surface of plastic or metal parts 金属／塑料表面有明显缩水或变形grinding mark磨痕bulbs on holder poorly assembled(灯座上）灯泡安装不良plug rusted插头生锈figures poorly shaped成形不佳incorrect sequence of color彩灯顺序不对scratch on color bulbs彩灯刮花bulb can on light up灯泡不亮flash light no function闪光灯无功能abnormal noise in music box音乐盒内有异常噪音wrong music melody音乐曲调不对live and neutral wires short in circuit火线和中线短路bulbs too dim灯泡过于黯淡broken light bulbs灯泡破incorrect size, watt and style ofbulbs used灯泡尺寸，瓦数，款式不对design finish, color of lamp andshadenot according orSPEC(smoked,white,ect)灯，灯罩的款式，表面处理及颜色SPEC不符（有烟熏或发白等）design and color not consistence for all lamps of same style 同一款式灯之间的设计及颜色不对floor lamps cannot stand vertically with leaning or falling over 落地灯站立不直，有倾斜或翻倒shade cannot fit bulb properly(loose)灯罩于灯泡不配（太松）missing UL label on product缺UL标smoking from light bulb or otherelectrical areas灯泡内或其它用电区域冒烟overheating过热assembled parts not secure配件组装不牢固glass not secured in shade灯罩内玻璃固定不牢sharp edges on shade灯罩有锐边stained glass pieces not neatlyplaced on shade灯罩彩色玻璃排列不整齐cup shade灯罩font灯罩底盘baffle灯罩障板harp灯罩架arm灯臂bobeche灯杯bulb灯泡bulb holder灯座sconce陶瓷壁灯座socket灯头socket cover灯头盖socket cap灯头帽ceramic socket陶瓷灯头cluster灯簇cluster stem灯簇柱goose neck鹅颈frosted glass磨砂玻璃frosted glass dome磨砂玻璃圆顶glass decoration玻璃装饰glass shield玻璃罩head joint（灯与柱）的连杆upper stem/pole上柱middle stem/pole中柱lower stem/pole下柱hardware pack附件sleeve套管candle sleeve蜡烛套管hurricane cup飓风杯（蜡烛套下之小灯杯）snuffer蜡烛套盖latch门闸Lucite panel塑料透明挂片mirror panel挂镜片mounting hole安装孔mounting plate安装板nipple螺纹套管nut螺母pipe管道plastic ring塑料环plastic support塑料支架／架plug塞子／插头power supply cord电源线protective glass防护玻璃protective ring保护环reflective panel反光面reflector反光镜adjusting handle调节手柄anchor膨胀螺丝back plate背板beveled glass edge玻璃斜边brass channeling铜条brass coupling铜连接头canopy天房盖ceiling pan吸顶盘chain链条clip夹片cone圆锥／锥面cord cover护线盖cross bar一字板／十字板curved tubing旋转管（花饰）／弯管dimmer switch微调开关distributor配线盒electric phenolic电木圈finial顶纽relamping label换灯标签rolled edge滚边tightening knob紧固旋纽screw collar loop螺纹套圈吊环screw collar nut螺纹环螺母securing knob固定旋纽set screw固定螺丝green ground screw接地绿螺丝wire nut接线螺帽wood screw木螺丝spiral ball麻花螺线球rubber washer胶垫片steel washer铁垫片spacer垫圈insulation pad绝缘垫tab薄片diffuser散射片ventilation slots散惹槽switch box开关电线盒swivel转动接头wire connector电线连接器spoke轮辐track轨道／路轨tray托盘top plate顶板adaptor功能适配器fitter机械适配器polarity test极性测试grounding test接地测试endurance test耐力测试assembly test组装测试Hi-pot test高压测试TV Set - 电视机infra-red sensor红外线感应器rod antenna棒状天线antenna mounting bracket天线支架prop up stand可折叠支架external antenna jack外部天线插口earphone jack耳机插口screen荧光屏picture电视画面vertical hold control (V-hold)图象垂直调整speaker喇叭control door面板门band switch波段开关selector switch选择开关TV system switch电视系统选择开关channel NO. knob频道纽TV tuning knob电视频道调节组preset预设纽sleep knob睡眠纽mute knob消音纽brightness control knob亮度控制纽color control knob颜色控制纽contrast control knob对比度控制纽Auto-search knob自动搜索纽UHF tuning knob-UHF超高频旋转纽VHF tuning knob-VHF特高频旋转纽UHF channel indicator-VHF超高频道指示表VHF channel indicator-VHF特高频道指示表strain relief test failed张拉力测试失败smoke of fire during operation运转时冒火烟poor quality or peelingsilkscreen/hotstamp丝印／火印不良或引导剥落knob control poor assembly旋纽控制装配不良AFC or manual tuning no function自动频率控制或手工调谐无功能horizontal/vertical linearitymisalignment水平线／垂直线定线不准picture not center properly图象集中不当dead or dead on one channel（某一频道）失灵no picture/audio output/howling无图象／音频输出／有振鸣volume, tume&balance control intermittent, noisy, faulty 音量，音调和平衡控制功能间歇，有杂音，出错misoperation of remote control遥控器失灵stereo channels reverse立体声频道接反clock/timer/sleep set no function 时钟／计时器／睡眠状态设置无功能sound distortion , hum, buzz, rattleor vibration声音失真，嗡鸣，咔哒生或颤音speaker damaged/faulty causedsound distortion, hum, buzz, rattle or vibration 喇叭损坏或故障导致声音失真，嗡鸣，咔哒声或振鸣speaker connection in wrong phase喇叭接线相位不对LED/LCD display with segmentmissing, excessive or uneven segment LED/LCD显示屏缺划，多划或划不均piture/brighteness&contras no function or int 图象／亮度和对比度无功能或功能间歇TV/CATV selection no function电视／有线电视选择无功能external aerials, DC adaptor or other accessories inoperative/intermittent 外接天线，直流转接器或其它附件无功能／功能间歇damaged/cracked PCB&CRT印刷电路＆阴极射线管损／裂poor soldering, dry joint,components bridging焊接／干接／组件搭接不良sensitivity out of limit(audio/vidio)音频／视频灵敏度超限mute recall no function弱音器／重叫记忆无功能radio signal unstable无线电接收信号不稳定frequency drift/off alignment频率飘移／不准snow noise on picture >59Db 图象有雪花噪声干扰（高于59分贝）screen not stable图象不稳定auto power no function自动电源无功能out of focus or focus poor alignment焦点未对准channel off alignment频道偏差Audio products-CD/Radio/CassettePlayer - 音频产品／唱碟机／收音机／盒式录放机buzz轻微颤音hum嗡嗡声FM/AM/SM oscillation接收不稳定no station received接收不到电台off calibration接收偏离刻度no sound无声FＭ stereo no separation立体声无分离L/R channels reversed 左／右声道接反low output输出弱dial pointer stop指针停pointer jump指针跳动poor sensitivity灵敏度差poor wow&flutter抖摆率差no tape protective无磁带保险eat tape吃带play distortion唱带失真playing delay放音延迟tape play fast放音快tape play slow放音慢vibration严重噪声tuning wobble, rubbing, noisy, slipping, malfunction 调谐不稳定，有磨擦，有噪音，滑动，功能失调display lens missing and/or windowsmisalignment缺显示镜或显示窗未对齐cabinet screw loose, stripped, missing ,rusted 外壳螺丝松动，螺丝齿有损，缺螺丝，螺丝gap between mating parts, balancing of twin cassette doors>0.8mm 配件间有缝隙，盒式磁带双门平衡差大于0.8mm flywheel mechanical noise,malfunction飞轮机械有噪音，有故障parts missing, loose parts/foreignbody inside缺部件，部件松，内有异物transformer mum/buzz noise变压器（火牛）有噪音CD/cassette door and/or flaps, hinges damaged inoperative, broken 唱碟／盒式磁带门盖，合页破损／不起作用mains cable damaged 2nd insulation layer and/or conductors exposed 电源线破损，第二绝缘层和／或导体／导线外露mains cable in wrong colorindication电源线颜色指示错sub-standard mains cable (failed torequired safety standard)电源线（次）不符合标准connecting wire pinched betweenmating part配件间接线受损discolor case外壳褪色molded marks, sink marks, flow lineon cabinet外壳有浇铸痕，缩痕，流水痕unit burnt smoke comes out产品冒烟operation malfunction, intermittentor shock noise with or without tapping the UN 功能故障／间歇故障（轻敲产品）时有噪声connecting jacks&plugs intermittentwhen moving the wire移动导线时插头和插口接触不良volume, equalizer&banlance control intermittent, noisy,faulty 音量／均衡器＆平衡控制功能有间歇／有噪音／出错stereo channels reversed立体声频道接反sound distortion ,hum, buzz, rattleor vibration声音失真，颤音，嗡鸣，咔哒声speaker damaged /faulty causedsound distortion, hum, buzz, rattle or vibration 扬声器有损／故障导致声音失真，颤音，嗡鸣，咔哒声speaker connection in wrong phase喇叭接线相位出错buzz noise from poor wiring, loose plastic parts, loose battery spring 接线不良，塑料配件松动，电池弹片松动导致嗡嗡声indicator light inoperative, dimmed,wrong color指示灯不起作用LED/LCD display with segment missing, excess, or uneven segment LED/LCD显示缺划，多划或划不均LCD display with obvious rainbowmarks LCD显示屏有明显的彩虹印earphone,headphone externalspeaker inoperative/intermittent耳机，头戴耳机无功能或间歇external aerials, DC adaptor or other accessories inoperative/intermittent 外接天线，直流转接器，或其它附件无功能或功能间歇damaged/cracked PCB印刷电路板损／坏poor wire dressing causing functionproblem电线外包皮不良导致功能问题poor solding, dry joint, componentsbridging焊接，干接，组件连接不良weak radio reception无线电台接收弱radio signal unstable无线电台信号不稳定frequency drift/off alignment频率飘移／不能对准tape record/playback distortion,weak磁带录音／重放失真，声弱tape chewed, jammed inside deckmechanism卡座内发生绞带／卡带carton materials too flimsy to besuitable for transportation纸箱材质太差不适合运输unit without polybag产品未套胶袋polyfoam endcap broken bur passeddrop test保丽龙端盖破但试摔通过AM调幅FM调频SM调波antenna天线sensor position遥控balance control左右平衡控制tone control音量控制treble control高音控制bass control低音控制stereo jack立体声控制dial lens刻度透镜dial pointer波段指示针dial pointer belt指示针带FM stereo indicator调频立体声指示灯speaker喇叭speaker box喇叭盒speaker grill喇叭网left channel左声道right channel右声道function selector功能选择纽tuning knob转动选台纽EQ knob均衡纽Hi-speed switch高速纽fast forward button快进纽record button录音纽play button放音纽pause button暂停纽stop/eject button停／出带纽search and skip backward button向后搜索及跳跃纽search and skip forward button向前搜索及跳跃纽volume knob音量纽volume down knob音量降低纽volume up button音量升高纽cassette knob卡座纽cassette卡座deck door AＡ门卡座deck door BＢ门卡座deck door lens卡座门镜battery spring电池弹簧backplate机背板connecting tab联结扣deck mechanism机芯handle提手head phone头戴耳机CD door唱碟门CD open/close button唱碟开／关纽CD play/pause button唱碟放音／暂停纽CD program button 唱碟程序纽CD repeat button唱碟重复纽CD stop button唱碟停止纽turntable黑胶唱盘rotate switch旋转开关power switch电源开关flashlight - 手电筒light bulb dead灯泡不亮foreign metal particles inside unit手电筒内有金属粒子foreign plastic particles inside unit手电筒内有塑胶粒子Dehumidifier - 干燥器Rena ware compact air cleaner -空气过滤器loose switches/control panel(poor assembly)开关／控制面板松动（组装不良）gap between two halves of thehousing机架两半之间有缝隙function indicators damaged功能指示器损坏incorrect color of functionalindicator功能指示器颜色不正常unit rock or wobble when sitting ona level surface置于水平平面上晃动不稳power cord is united or irregularlytied电源线未接上或接的不规则missing rating plate/label缺等级牌／标签missing S/N label缺序列号missing filters缺过滤器missing safety marks (such as UL. EMC or CE)on product 缺产品安全标志（如：UL, EMC, CE)poor tampo-printing on controlpanel控制面板上字体印刷不良brand logo or key instructions offposition标识或功能键指示功能移位filter poorly sealed过滤器密封不良papers in H.E.P.A filter broken or poorly glued H.E.P.A过滤器内纸破裂或粘贴不良key jammed/stuck按键卡住plug pins rusted/oxidized插头生锈／已氧化something inside 内有异物installation screws too loose安装螺丝太松keys too tight when pressing按键太紧incorrect brand name/model ofmotor马达品牌／型号不对rubber feet loosed out象胶支脚松掉incorrect style of supply cord电线型号不正确internal connection wires disheveled内部连限混乱smoking from the inside of theproduct产品内冒烟strain relief can not bear a force of15 LBS for 3 minutes张力不足以承受3分钟15磅overheating after running for hours数小时运行后机体过热no ionizer function无电离功能fan can not rotate风扇不转fan speed key malfunction风扇调速键故障difficult to assemble/reassemble装配／重装困难ionizer voltage measured does notmeet the minimum voltage电离电压不及最小电压值incorrect polarity极性错误abnormal noise异常噪声reliability test failed可靠性测试失败fan speed measured exceed thespecified range风扇速度测试超过规定速度air load exceed the specified range空气负载超过规定范围function indicators have no function功能指示器无功能fuse no function保险丝无功能master carton poorly tape-sealed卡通箱捆绑不良electric toothbrush - 电动牙刷dielectric strength test failed介电／绝缘强度测试失败overheating (enclosure melted)热度过高（外壳熔化）enclosure or parts broken or cracked外壳／附件破裂／破碎foreign particle inside the enclosure外壳内有异物significant noise噪音过大component loosen out duringoperation操作中部件松脱pushbutton switch or unit functionintermittent按钮开关或产品功能间歇button/switch stuck close按钮／开关卡住missing UL listing mark or European approval agency mark 缺UL标志或欧洲认可的代理机构的标志hard to assembly on brush head (tooloose)牙刷头难以安装poor assembly on brush head (tooloose)牙刷头装配不良poor alignment on brush head(uneven clearance)刷头上（刷毛）排列不匀brush head movement too fast or tooslow刷头转速过快／过慢wrong component is used用錯部件rust on battery contact insertliterature电池/充电器通电点生锈battery charger no function 电池无功能hard to assembly or disassemble thebattery电池拆装困难omission of , insufficient , incorrect, separately packed component or accessories 单独包装的部件/附件缺,数量不足或装错enclosure not secured in place orwith excessive gaps外壳未固定到位,间隙过大color mismatch or inconsistence颜色配错/颜色不一致IRON - 电熨斗damaged power supply cord电源线受损live wire exposed火线外露short circuited (external fuses burntout)产品短路(外保险丝烧毁) failure of thermo cut off自动调温器不能断电switch intermittent开关间歇thermostat malfunction自动调温器故障current or voltage out ofspecification电流,电压超出规定foreign metal particles inside theunit(EG solder)产品内有金属颗粒component loosen out duringoperation操作过程中部件松脱foreign plastic particles inside theunit产品内有塑料颗粒intermittent间歇wrong component used部件用错TELEPHONE - 电话loose name plate, logobadges,function inlays etc.商标,标牌,功能指使松脱excessive gap betweencabinets(>0.8mm)外壳空隙过大knobs missing ,wrong type ,wrong color ,loosened off during operation 缺旋钮/旋钮型号不对/颜色不对/操作中松脱knobs wobble , rubbing , poor alignment, fitted in wrong way 旋钮摇晃不稳/有磨擦/排列不齐/排列方式不对display lens missing and/or windowsmisalignment缺失显示屏/显示屏窗口未对准cabinet screw stripped外壳螺钉缺螺纹connecting wire pinched betweenmating part配件间接线受挤压ringer Hi/Lo/Off no function响铃无高／低／关切换功能long distance ringer no function远距离响铃无功能ringer distortion响铃失真ringer weak响铃弱sound poor reception声音接收不良sound poor transmission声音传送不良no dial tone sound无拨号音pulse dialing no function脉冲拨号无功能redial no function重拨无功能handfree no function免提无功能memory no function记忆无功能flash no function闪断无功能mute no function弱音器无功能speaker phone no function扬声器电话无功能memory setting no function记忆设置无功能clock/timer set no function闹钟／计时器设置无功能handset test out of limit听筒测试超出限制hold no music保持（不挂机无音乐）operation malfunction, intermittentor shock noise with/without tapping the unit 功能／功能间歇（轻敲产品时有噪音connecting jacks&plugs intermittent when moving the wire 移动电线时接线端子和接线塞子接触不良speaker sound distortion , hum, buzz, rattle, or vibration 扬声器（话筒声音失真／有蜂鸣／咔嗒声／咯咯声／有颤音power consumption & operatingvoltage out of limit功率消耗／工作电压超限buzz noise from poor wiring, loose plastic parts , loose battery spring 接线不良／塑料零件松脱／电池弹片松脱造成电话有蜂鸣indicator light inoperative, dimmed, wrong color 指示灯不亮／光线暗淡／颜色错误LED/LCD display with segment missing, excessive or uneven LED/LCD显示缺划／多划／划不均earphone , headphone, externalspeaker inopearative/function intermittent 耳机／头戴耳机扬声器无功能，功能间歇poor wire dressing causing functional problem 电线外包皮包裹不良导致功能问题poor soldering, dry joint ,components bridging焊接／干接／桥接不良sensitivity out of limit灵敏度超限keys/buttons stuck按键／按钮卡住polyfoam endcap broken but passdrop test泡沫塑料端盖破裂但通过试摔wall mounting hole墙安装孔storeage compartment储物箱desk lid平台盖hook挂钩memory记忆ornament ball装饰球ornament bell装饰铃microphone麦克风telephone line cord电话线line cord jack电话线插口handset听筒handset cord听筒线handset cord jack听筒线插口handset cradle听筒架receiver受话器tansmitter送话器memory记忆tone dialing音频拨号pulse dialing脉冲拨号dial board拨号盘dial mode knob拨号方式键ring control knob响铃控制键receiver volume knob受话音量控制钮dial buttons拨号钮flash knob flash键handfree knob免提键redial key重拨键reset key复位键hair dryer - 吹风机barrel桶clamp钳cool safety tip安全冷端grille网handle把heat section加热部位heatproof rim隔热圈hi/off/low switch高／关／低开关lower cabinet下壳top cabinet上壳plug插头plug foot插脚power cord电源线air concentrator吹风头air intake grille进气网air supply opening进气口ALCI漏电保护制reset button复位键thermostat malfunction自动调温器故障foreign (metal/plastic) particlesinside unit (E.G. solder)内有金属／塑料异物（如焊料）component loosed out duringoperation使用中部件松落damaged power supply cord电源线坏live wire exposed and accessible火线外露可触short-circuited (external fuses burnout)短路（保险丝烧坏）switch intermittent开关间歇current or wattage out ofspecification电流或瓦特数不合要求General - 电子通用extra segment多划missing segment少划display abnormal显示不正常display flash数字闪display显示屏function key功能键lens透镜number key数字键Clock watch - 钟表accuracy test精确度测试alarm闹钟back casing表壳背面front casing表壳正面bell铃ringer表带belt buckle表带扣belt lining表带内衬canopy钟罩clock mechanism机芯dial刻度盘dial cover刻度盘盖frame钟框hour hand时针minute hand分针second hand秒针pendulum钟摆time adjustable knob时间调节钮alarm activate earlier闹钟提前alarm delay闹钟延迟clock hands misalignment指针误差hands collide指针碰撞inaccuracy精确度差pendulum swung slowly钟摆摆慢unadjustable不能调节knob missing按钮缺失knob loosened off during operation操作过程中，旋钮松落knob wobble /rubbing/ pooralignment /fitted wrong way旋钮摇晃／有磨擦／未成一直线／装错data cord数据线disk磁碟disk protective clip磁碟保护金属片left button左键right button右键middle button中键pc/ms button pc/ms 钮Calculator - 计算器Camera - 相机view finder取景器lens镜头lens definition镜头清晰度mechanical shutter快门film counter胶卷计数器flash lamp闪光灯winder mechanism 卷带装置charging indicator充电指示灯rewinder倒带装置neck strap领带。
pcb行业常用语言中英文对照表.doc
Poste ntial Test
高压测试
是指采取比实际使用时更高的直流电压来进行各种电性 试验，以查岀所漏的电流大小。
Hook
切削刃缘不直，钻咀的钻尖部分是由四个表面所立体组 成，其中两个第一面是负责切削功用，两个第二面是负责 支持第一面的。其第一面的前缘就是切削动作的刀口。正 确的刀口应该很直， 翻磨不当会使刃口变成外宽内窄的弯 曲状，是钻咀的一种次要缺陷。
Hot Air Leveli ng
热风整平
也称喷锡。从锡炉中沾锡的板子，经过高压的热风，将其 多余的锡吹去。
Hybrid In tegrated Circuit
是一种在小型瓷质薄板上，以印刷方式施加贵重金属导电
油墨之线路，再经高温将油墨中的有机物烧走，而在板上 留下导体线路，并可以进行表面粘装零件的焊接。
Dime nsioned Hole
指线路板上的一些孔，其位置已经由其使用尺寸确定，不 用和栅格尺寸一致。
Double-SidePrin ted
Board
双面板
Drill body len gth
从钻咀的钻尖到钻咀直径与肩部角度交叉点处的距离。
E
Eyelet
铆眼
是一种青铜或黄铜制作的空心铆钉，当线路板上发现某一
I
cicle
锡尖
是指在组装板经过波峰焊后，板子焊锡面上所岀现的尖锥
状的焊锡，也叫Solder Projection。
.C Socket
集成电路块插座。
mage Tran sfer
图象转移
在电路板工业中是指将底片上的线路图象，以直接光阻”
的方式或间接印刷”的方式转移到板面上。
PCB-专用术语
85 吸嘴 86 定心爪 87 贴装精度 88 焊接 89 再流焊 90 波峰焊 91 气相焊接 92 组装密度 93 混装技术 94 引线 95 平移偏差 96 旋转偏差 97 贴装速度
98 低中高速贴装机 99 焊端 100 球栅阵列 101 贴装 102 贴装机 103 供料器 104 活化剂
七 、 机械加工成形术语
208 数控 209 电脑数控 210 垫板 211 盖板 212 钻套 213 钻柄 214 切削量 215 犁沟 216 树脂钻污 217 铜箔毛刺 218 玻璃纤维突出 219 碎屑 220 破出 221 磨钻头机 222 激光穿孔 223 牛皮纸 224 粘结层 225 滑移 226 缺胶
brushing,scrubbing scrubber mechanical cleaning
181 超声波清洗 182 喷射清洗 183 化学除油 184 溢流 185 去离子水(DI)
1六86 污化 、 检测术语
195 粘合强度 196 拉脱强度 197 剥离强度 198 弯曲强度 199 伸长率 200 抗扭强度
47 晕圈
haloing
48 粉红圈
pink ring
49 起泡
blister
50 夹杂物
incusion
51 槽边有毛刺
excessive burrs around cavity
52 白斑
measling
53 粉点
mealing
54 漏啤
missing punching
55 锣板不良
poor rounting
187 磨刷 188 磨刷机 189 机械清洗
alkali etchant under cut catalyzing rectifier plating rack anode
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WINDOWS不能軟體關機 QAPLUS 當機 音效不良 VGA不良或螢冪雜訊 USB不良 凹痕
英文 CACHE MEMORY defect cann't read floppy IDE1 cann't read or error KEYBOARD LOCK error GspReEeEdNeerrroror ror cann't switch LED no light or error speaker error or disorder COM 1/2 defect LPT1 defect CMOS setting error time stopped ID 00 defect CARD defect WINDOWS hang up WINDOWS cann't boot from software QAPLUS hang up audio error VGA error or disorder USB defect sink mark
電源短路 CPU速度不對 MEMORY不良 KEYBOARD不良 HIMEM ERROR或當機 凹孔 條狀痕 表面裂痕 橘皮狀表皮皺摺粗糙 波動 冒汗 扭曲 翹曲 波痕 熔塌 焊痕 白化 皺紋
pock mark resin streak resin wear riding sagging saponification scar scrap scrap jam scratch scuffing seam shock line short shot
英文 PCB defect soldering open short missing wrong component invert position shift component shift reverse tombstone component side up solder ball extra soldering poor soldering bar code defect
痘斑 樹脂流紋 樹脂脫落 凹陷 松垂 皂化 疤痕 廢料 廢料阻塞 刮傷/劃痕 深沖表面劃傷 裂痕 模口擠痕 充填不足
英文 mixed boards mixed versions component lead float illegible character float lead knee down lead doesn't penetrate incoming matrials defect lead longer solder hole solder splash solder tail extra soldering non-wetting hole clog
常見不良現象中英文對照表
英文 poor solder mask PAD defect forming defect board bent extra component component deform ICT test fail voltage defect no voltage wire open no boot BIOS flash error cann't flash BIOS cann't RESET battery no voltage
中文 防焊不良 PAD不良 成型不良 板彎板翹 多件 零件變形 ICT測試不良 電壓不良 無電壓顯示 燒斷線 不開機 BIOS燒錄不良 不能燒BIOS 不能RESET 電池沒電
常見不良現象中英文對照表
cold soldering reverse bounding defect component crash circuit defect skin inclusion galling glazing gloss grease pits grinding defect haircrack haze incrustation indentation internal porosity mismatch mottle necking nick orange peel overflow peeling pit pitting corrosion plate mark pock
中文 混板 混版 零件翹腳 文字面不良 浮高 折腳 腳未出 原材不良 腳長 錫洞 錫渣 錫尖 包焊 拒焊 孔塞
residue flux PCB surface dirty component broken overflowing component oxidized straightening aberration atomization bank mark bite blacking hole blacking scab blister blooming blushing body wrinkle breaking-in bubble burn mark burr burr(金屬) flash(塑件) camber center buckle check checking chipping clamp-off
G/F dent G/F scratch G/F residue glue G/PCB不良 空焊 短路 缺件 錯件 反向 位移 偏移 翻面 立碑 側立 錫球 錫多 吃錫不良 條碼不良
殘留助焊劑 板面不澍 零件破損 溢錫 零件氧化 矯直 色差 霧化 凸料紋 咬入 塗料孔(鑄疵) 塗料疤 起泡 起霜 泛白 皺紋 冒口帶肉 膜泡 糊斑 毛邊 毛邊 翹曲 表面中部波皺 細裂痕 龜裂 修整表面缺陷 鑄件凹痕
冷焊 反白 點膠不良 撞件 線路不良 表皮摺疊 毛邊 光滑 光澤 汙斑 磨痕 發裂 霧度 水銹 壓痕 內部氣孔 偏模/不吻合 斑點 縮頸 割痕 橘皮狀表面缺陷 溢流 剝離 坑 點狀腐蝕 模板印痕 麻點
塌陷 色斑 腐蝕 裂痕 龜裂 變形 切邊碎片 裂邊 退色 填充料斑 裂紋 凸緣起皺 刮傷 流痕
collapse color mottle corrosion crack crazing deformation edge edge crack fading filler speak fissure flange wrinkle flaw flow mark
中文 CACHE MEMORY不良 A磁碟機不讀 IDE1硬碟機不讀或不抓 KEYBOARD LOCK不良 GREEN不良 速度不對或不能切換 LED燈不亮或不良 喇叭不叫或亂叫 COM 1/2不良 LPT1不良 CMOS設定不良 時間不動 ID 00不良 CARD不良 WINDOWS當機
power short CPU frequency error MEMORY defect KEYBOARD defect HIMEM ERROR or hang up shrinkage pool streak surface check surface roughening surging sweat out torsion warpage waviness webbing weld mark whitening wrinkle
英文 Game Port defect cann't burn in Lan number Lan function test error 1394 error AMR FAIL CNR FAIL BEAR ERROR NUMBER LCD ERROR leakage current ACPI detect error Case Open defect SCR defect CHIP ID ERROR others G/F adhere stannum
中文 Game Port不良 不能燒網路號碼 網絡功能不良 1394不良 AMR FAIL CNR FAIL BEAR ERROR NUMBER LCD ERROR 漏電流 ACPI 偵側不良 Case Open不良 SCR不良 CHIP ID ERROR 其他 金手指沾錫
金手指凹陷 金手指刮傷 金手指殘膠 金手指缺口