wire_bonding__介绍
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PRESSURE
Ultra
Sonic
Vibration
pad
heat
lead
Formation of a first bond Base
PRESSURE
Ultra Sonic Vibration
pad
heat
lead
Capillary rises to loop height position
pad
WIRE BOND PROCESS INTRODUCTION
CONTENTS
ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
2nd Search Height
pad
Search Speed 2 Search Tol 2
leadpຫໍສະໝຸດ dleadCapillary rises to loop height position
pad
lead
Capillary rises to loop height position
pad
lead
Capillary rises to loop height position
pad
lead
Capillary rises to loop height position
Formation of a second bond Base
pad
heat
lead
pad
lead
pad
lead
pad
lead
Tail length
pad
lead
pad
lead
pad
lead
Disconnection of the tail
pad
lead
Disconnection of the tail
(SPT, GAISER, PECO, TOTO…)
Capillary Data
( Tip , Hole , CD , FA&OR , IC )
CAPILLARY (II)
Calculated
Wire Length
pad
lead
Calculated
Wire Length
pad
lead
SEARCH DELAY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
X Y Table
•Linear 3 phase AC Servo motor •High power AC Current Amplifier •DSP based control platform •High X-Y positioning accuracy of +/- 1 mm •Resolution of 0.2 mm
Bonding Process
PREHEAT
The Wire Bond Temp
BONDSITE
CU L/F200+/-10
AL L/F210+/-10
200+/-10
230+/-10
BGA
150+/-10
160+/-10
160+/-10 160+/-10
TFBGA150+/-10 LBGA 150+/-10
Thermal Compressure
Ultrasonic Energy (Power)
Bond Head ASSY
• Low impact force •Real time Bonding Force monitoring • High resolution z-axis position with 2.5 micron per step resolution • Fast contact detection • Suppressed Force vibration • Fast Force response • Fast response voice coil wire clamp
封裝簡介
晶片Die
金線 Gold Wire
導線架
Lead fram
封裝流程
Wafer Grinding
Wafer Saw
Die Bonding
toaster
Wire Bonding
Die Surface Coating
Molding
Laser Mark
BGA
Solder Ball Placement
pad
lead
Formation of a new free air ball
pad
lead
Material
Leadfram
Capillary
Gold Wire
Leadfram (I)
Leadfram ( II )
CAPILLARY (I)
Capillary Manufacturer
Eagle
MACHINE SPECIFICATIONS (II) •Vision System •Pattern Recognition Time 70 ms / point •Pattern Recognition Accuracy + 0.37 um •Lead Locator Detection 12 ms / lead (3 leads/frame) •Lead Locator Accuracy + 2.4 um •Post Bond Inspection First Bond, Second Bond Wire Tracing •Max. Die Level Different 400 – 500 um
lead
Formation of a first bond
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Formation of a first bond
IMPACT FORCE
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Formation of a first bond Contact
Eagle
MACHINE SPECIFICATIONS (I) •Bonding System •Bonding Method Thermosonic (TS) •BQM Mode Constant Current, Voltage, Power and Normal (Programmable) •Loop Type Normal, Low, Square & J •XY Resolution 0.2 um •Z Resolution (capillary travelling motion)2.5 um •Fine Pitch Capability 35 mm pitch @ 0.6 mil wire •No. of Bonding Wires up to 1000 •Program Storage 1000 programs on Hard Disk •Multimode Transducer System Programmable profile, control and vibration modes
pad
SEARCH SPEED1 SEARCH TOL 1
lead
Free air ball is captured in the chamfer
pad
SEARCH SPEED1 SEARCH TOL 1
lead
Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Capillary rises to loop height position
RH
pad
lead
Formation of a loop
RD (Reverse Distance)
pad
lead
Formation of a loop
pad
lead
pad
lead
WIRE CLAMP ‘CLOSE’
( 2nd Bond )
Gold wire
pad
lead
B.PRINCIPLE
PRESSURE VIBRATION AL2O3
CONTAMINATION GOLD BALL
MOISTURE
GLASS
Al SiO2 Si
銲接條件
HARD WELDING Pressure (Force) Amplify & Frequecy Welding Time (Bond Time) Welding Tempature (Heater) THERMAL BONING
NOT INCLUDE DEDICATE LINE
Free air ball is captured in the chamfer
pad
lead
Free air ball is captured in the chamfer
SEARCH HEIGHT
pad
lead
Free air ball is captured in the chamfer
Search Speed 2 Search Tol 2
lead
pad
Search Speed 2 Search Tol 2
lead
Formation of a second bond
pad
heat
lead
Formation of a second bond Contact
pad
heat
lead
Singulation
Solder Plating Dejunk TRIM
SURFACE MOUNTPKG
Dejunk TRIM
Packing
THROUGH
HOLE PKG
Solder
Plating
TRIM/
FORMING
Wire Bond 原理
Ball Bond
( 1st Bond ) Wedge Bond
•Facilities •Voltage 110 VAC (optional 100/120/200/210/ •220/230/240 VAC
Eagle
MACHINE SPECIFICATIONS (III)
•Material Handling System •Indexing Speed 200 – 250 ms @ 0.5 “ pitch •Indexer Resolution 1um •Leadframe Position Accuracy + 2 mil •Applicable Leadframe W = 17 – 75 mm @ bonding area in Y = 65mm = 17 – 90 mm @ bonding area in Y = 54mm L = 280 mm [Maximum] T = 0.075 – 0.8 mm •Applicable Magazine W = 100 mm (Maximum) L = 140 – 300 mm H = 180 mm (Maximum) •Magazine Pitch 2.4 – 10 mm (0.09” – 0.39 “) •Device Changeover < 4 minutes •Package Changeover < 5 minutes •Number of Buffer Magazine 3 (max. 435 mm)
W/H ASSY
• changeover •·Fully programmable indexer & tracks •·Motorized window clamp with soft close feature •·Output indexer with leadframe jam protection feature • Tool less conversion window clamps and top plate enables fast device
pad
lead
Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
pad
Ultra
Sonic
Vibration
pad
heat
lead
Formation of a first bond Base
PRESSURE
Ultra Sonic Vibration
pad
heat
lead
Capillary rises to loop height position
pad
WIRE BOND PROCESS INTRODUCTION
CONTENTS
ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
2nd Search Height
pad
Search Speed 2 Search Tol 2
leadpຫໍສະໝຸດ dleadCapillary rises to loop height position
pad
lead
Capillary rises to loop height position
pad
lead
Capillary rises to loop height position
pad
lead
Capillary rises to loop height position
Formation of a second bond Base
pad
heat
lead
pad
lead
pad
lead
pad
lead
Tail length
pad
lead
pad
lead
pad
lead
Disconnection of the tail
pad
lead
Disconnection of the tail
(SPT, GAISER, PECO, TOTO…)
Capillary Data
( Tip , Hole , CD , FA&OR , IC )
CAPILLARY (II)
Calculated
Wire Length
pad
lead
Calculated
Wire Length
pad
lead
SEARCH DELAY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
X Y Table
•Linear 3 phase AC Servo motor •High power AC Current Amplifier •DSP based control platform •High X-Y positioning accuracy of +/- 1 mm •Resolution of 0.2 mm
Bonding Process
PREHEAT
The Wire Bond Temp
BONDSITE
CU L/F200+/-10
AL L/F210+/-10
200+/-10
230+/-10
BGA
150+/-10
160+/-10
160+/-10 160+/-10
TFBGA150+/-10 LBGA 150+/-10
Thermal Compressure
Ultrasonic Energy (Power)
Bond Head ASSY
• Low impact force •Real time Bonding Force monitoring • High resolution z-axis position with 2.5 micron per step resolution • Fast contact detection • Suppressed Force vibration • Fast Force response • Fast response voice coil wire clamp
封裝簡介
晶片Die
金線 Gold Wire
導線架
Lead fram
封裝流程
Wafer Grinding
Wafer Saw
Die Bonding
toaster
Wire Bonding
Die Surface Coating
Molding
Laser Mark
BGA
Solder Ball Placement
pad
lead
Formation of a new free air ball
pad
lead
Material
Leadfram
Capillary
Gold Wire
Leadfram (I)
Leadfram ( II )
CAPILLARY (I)
Capillary Manufacturer
Eagle
MACHINE SPECIFICATIONS (II) •Vision System •Pattern Recognition Time 70 ms / point •Pattern Recognition Accuracy + 0.37 um •Lead Locator Detection 12 ms / lead (3 leads/frame) •Lead Locator Accuracy + 2.4 um •Post Bond Inspection First Bond, Second Bond Wire Tracing •Max. Die Level Different 400 – 500 um
lead
Formation of a first bond
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Formation of a first bond
IMPACT FORCE
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Formation of a first bond Contact
Eagle
MACHINE SPECIFICATIONS (I) •Bonding System •Bonding Method Thermosonic (TS) •BQM Mode Constant Current, Voltage, Power and Normal (Programmable) •Loop Type Normal, Low, Square & J •XY Resolution 0.2 um •Z Resolution (capillary travelling motion)2.5 um •Fine Pitch Capability 35 mm pitch @ 0.6 mil wire •No. of Bonding Wires up to 1000 •Program Storage 1000 programs on Hard Disk •Multimode Transducer System Programmable profile, control and vibration modes
pad
SEARCH SPEED1 SEARCH TOL 1
lead
Free air ball is captured in the chamfer
pad
SEARCH SPEED1 SEARCH TOL 1
lead
Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Capillary rises to loop height position
RH
pad
lead
Formation of a loop
RD (Reverse Distance)
pad
lead
Formation of a loop
pad
lead
pad
lead
WIRE CLAMP ‘CLOSE’
( 2nd Bond )
Gold wire
pad
lead
B.PRINCIPLE
PRESSURE VIBRATION AL2O3
CONTAMINATION GOLD BALL
MOISTURE
GLASS
Al SiO2 Si
銲接條件
HARD WELDING Pressure (Force) Amplify & Frequecy Welding Time (Bond Time) Welding Tempature (Heater) THERMAL BONING
NOT INCLUDE DEDICATE LINE
Free air ball is captured in the chamfer
pad
lead
Free air ball is captured in the chamfer
SEARCH HEIGHT
pad
lead
Free air ball is captured in the chamfer
Search Speed 2 Search Tol 2
lead
pad
Search Speed 2 Search Tol 2
lead
Formation of a second bond
pad
heat
lead
Formation of a second bond Contact
pad
heat
lead
Singulation
Solder Plating Dejunk TRIM
SURFACE MOUNTPKG
Dejunk TRIM
Packing
THROUGH
HOLE PKG
Solder
Plating
TRIM/
FORMING
Wire Bond 原理
Ball Bond
( 1st Bond ) Wedge Bond
•Facilities •Voltage 110 VAC (optional 100/120/200/210/ •220/230/240 VAC
Eagle
MACHINE SPECIFICATIONS (III)
•Material Handling System •Indexing Speed 200 – 250 ms @ 0.5 “ pitch •Indexer Resolution 1um •Leadframe Position Accuracy + 2 mil •Applicable Leadframe W = 17 – 75 mm @ bonding area in Y = 65mm = 17 – 90 mm @ bonding area in Y = 54mm L = 280 mm [Maximum] T = 0.075 – 0.8 mm •Applicable Magazine W = 100 mm (Maximum) L = 140 – 300 mm H = 180 mm (Maximum) •Magazine Pitch 2.4 – 10 mm (0.09” – 0.39 “) •Device Changeover < 4 minutes •Package Changeover < 5 minutes •Number of Buffer Magazine 3 (max. 435 mm)
W/H ASSY
• changeover •·Fully programmable indexer & tracks •·Motorized window clamp with soft close feature •·Output indexer with leadframe jam protection feature • Tool less conversion window clamps and top plate enables fast device
pad
lead
Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
pad