Bonding 邦定瓷嘴选型

毛细管设计,必须提供以下信息 For Deep Access Capillary desing, must provide the following info Value [units] 1.5 mil 连接电线直径 Bonding wire diameter 邦定焊盘间距 Bond Pad Pitch 尺寸 Bond Pad Opening 球径最大平均值 AVRG Ball dia 最大球径 MAX Ball dia 超过焊盘弧高 Loop height above pad 邦定模式 Bonder model 邦定精确度 Bonder accuracy Package carrier type 包装载体种类 height of left side wall (if relevant) 左边墙的高度(如相关) Distance A 距离A from left wall to center of 2nd bond location 从左墙的中心位置2nd债券 Distance B 距离B from left wall to right wall 从左至右墙 距离C Distance C height of right side wall (if relevant) 右边墙的高度(如相关) 距离D Distance D Remarks 注意 1 must indicate if the wire is bonding in FORWARD or UPWARD bonding cycle 必须指出如果线是在向前向上键键或循环吗 2 must indicate on which wall is the ball bonded 必须指出墙球纽带吗 3 must get tolerances of A, B, C & D 必须得到公差的A、B、C和D