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The Introduction of Touch Panel Product
Touch panel product Dept. 2008.02.22
Contents
1. Category of Existing T/P.
2. The Introduction of Resistive TP.
3. Application for Resistive TP. 4. Design rule for FRTP 5. FRTP flow chart 6. The Introduction of Capacitive TP. 7. Capacitive TP Application. 8. Resistive TP vs Capacitive TP.
6~15%
0.6~1.8N
Surface Hardness
With circular polarizer By JISK5600 pencil hardness
3H (MIN)
Durability & Reliability of G/G TP
Item
Topic
Conditions Silicon rubber R=8.0mm Hardness 60° Hs / A60 Load= 2.5N Speed= twice / sec
7. Capacitive TP Application
QSlide™ Applications
Decoration Film Uppor PSA Adhesive
Uppor ITO film
ITO Glass ITO glass Adhesive Housing Housing Housing LCM
FPC / Connector
3. Application for Resistive TP
PRINTING
CURING
HOLE PUNCH
PROTECT FILM LAMINATE
5. FRTP flow chart
Bottom ITO Film Process
ITO FILM CUTTING
ITO FILM ANNEALING
LASER ETCHING
PRINTING
CURING
HOLE PUNCH
DC5V (MAX) -40 ° C ~ +85 ° C -30 ° C ~ +70 ° C
Linearity
Electrical performance Insulation resistance Chattering time Transparency Optical performance Haze value Transparency Cell only Cell only With circular polarizer Apply DC 25V
4.Design rule for FRTP
Boundary Design Suggestion for Plastic Resistive TP (FRTP)
4.05 mm 3.05 mm 7.0 mm 6.0 mm
B
4.05 mm 3.05 mm
A
C
A/A
4.05 mm 3.05 mm
D
A/A > 3.8“ A/A ≤ 3.8”
The Structure of Resistive FRTP.
DECO Film 0.188 mm Optical Clear Adhesive ITO Film 0.188 mm FPC/Heat Seal
ITO glass 1.1 / 0.7 mm
Total thickness: 1.65、1.25 mm ± 0.15
COATING SILICON
PACKING
INSPECTION
PROTECT FILM LAMINATE
FUNCTION TEST
LABEL PRINT
Construction of G/G TP
• Transparency
– Compared with the conventional glass-glass touch panel, our Product increase 83% to 85%.
Film + Film
Structure結構
Film + Film + Plastic Film + Glass
* Analog Capa(性能). & G+G TP are under developing(發育不全).
2. The Introduction of Resistive TP.
Resistive TP Working Principle原理
Dot Spacer Lower Glass (1.1 mm) Seal
Characteristics of G/G TP
Item Topic
Supply voltage Operation Storage Temp. range Operating Temp. range
Conditions
Description
Flat Resistive Touch Panel (FRTP type A)
Decoration Film Upper PSA Upper ITO film Bottom ITO film Bottom PSA PC sheet or Glass Housing Housing PC or glass Adhesive
Plastic Subtract: 0.5、0.8、1.0mm
3. Application for Resistive TP
Housing
Housing
百度文库
Film on Glass TP
FPC / Connector
3. Application for Resistive TP
3. Application for Resistive TP
Subtract 0.8 / 1.0 mm
Total thickness: 1.45、1.65mm ± 0.15
3. Application for Resistive TP
3. Application for Resistive TP
Flat Resistive Touch Panel (FRTP type B)
2. The Introduction of Resistive TP.
The Structure of Resistive TP.
Film / Film / Plastic Type
HC/ITO Film
FPC/Heat Seal ITO Film Optical Clear Adhesive光 學彩色粘著膠 Plastic Subtract塑料基板
Cover Glass / Plastic with Decorative Print
Housing Housing
Glass
PSA
Glass Housing
Pattern ITO coating
Anti Noise Managed
Customize Testing System
FPC / Driver / Connector
9. Resistive TP Specifications
1. Category(種類) of Existing(現有) T/P
Capacitive T/P Resistive T/P
Principle原理
*Analog Matrix矩陣 Digital Analog
* Glass + Glass
DCT LAMINATION
PSA LAMINATION
PROTECT FILM LAMINATE
5. FRTP flow chart
Back Process
UP and BOTTOM ASSEMBLY
PUNCH
FPC HOT PRESS
GLASS LAMINATION
DECORATION FILM LAMINATE
Decorative Area : A : FPC bonding side. B ~ D : trace side.
WINTEK
5. FRTP flow chart
Up ITO Film Process
ITO FILM CUTTING
ITO FILM ANNEALING
LASER ETCHING
-3 % ~ +3 %
20 MΩ or more 10 msec 83%(TYP) <1% 70~74%
Haze value
Operation Force Mechanical performance
With circular polarizer
Silicon rubber R=8.0mm Hardness 60° Hs / A60
Description
Durability
Rubber tapping life
1,000,000 times
Exposure to high temp. Exposure to heat/moisture Reliability Exposure to cold temp. Thermal cycle Reference: Wintek deviation of GQAS
85° C 500 hours 65° C 93% RH, 500hhours -40° C 500 hours -40° C...+-85° C 10 cycles
6. The Introduction of Capacitive TP.
Cover Lens Not only Decoration But also Electronic Component Hard to Hard Lamination Technology
Upper Glass (0.2 mm)
ITO FPC
• High reliability
– The upper glass structure make a high reliability products, this character is suitable for automotive applications.
3. Application for Resistive TP
Type A
PC lens
Type B
Bottom PSA
Bottom ITO film
ITO Glass
Upper ITO film Upper ITO film
Upper PSA DECO FILM Upper PSA DECO FILM
LCM
FPC / Connector
3. Application for Resistive TP
The Structure of Resistive FRTP.
ITO Film 0.188 mm Optical Clear Adhesive ITO Film 0.188mm
FPC/Heat Seal ITO Film 0.188mm Optical Clear Adhesive
3. Application for Resistive TP
TYPE B advantage
COST DOWN: Cancel bottom ITO film and OCA
Reduce CNC charge
STRUCTURE IMPROVE:
Substructure from PC change to glass Reduce total thickness
2. The Introduction of Resistive TP.
The Structure of Resistive TP.
Film / Glass Type
HC/ITO PET FPC/Heat Seal ITO Glass
ITO Glass: 0.5、0.7、1.1mm (Regular, Strengthen or AR Glass Option)
6. The Introduction of Capacitive TP.
Capacitive TP Working Principle
Finger Finger
Glass or Film FPC
ITO Pattern
Glass or Film
Parasitic Capacitance (CP) is generated by coupling from the touchpad to traces, ground plane, and any surrounding conductive material.
Touch panel product Dept. 2008.02.22
Contents
1. Category of Existing T/P.
2. The Introduction of Resistive TP.
3. Application for Resistive TP. 4. Design rule for FRTP 5. FRTP flow chart 6. The Introduction of Capacitive TP. 7. Capacitive TP Application. 8. Resistive TP vs Capacitive TP.
6~15%
0.6~1.8N
Surface Hardness
With circular polarizer By JISK5600 pencil hardness
3H (MIN)
Durability & Reliability of G/G TP
Item
Topic
Conditions Silicon rubber R=8.0mm Hardness 60° Hs / A60 Load= 2.5N Speed= twice / sec
7. Capacitive TP Application
QSlide™ Applications
Decoration Film Uppor PSA Adhesive
Uppor ITO film
ITO Glass ITO glass Adhesive Housing Housing Housing LCM
FPC / Connector
3. Application for Resistive TP
PRINTING
CURING
HOLE PUNCH
PROTECT FILM LAMINATE
5. FRTP flow chart
Bottom ITO Film Process
ITO FILM CUTTING
ITO FILM ANNEALING
LASER ETCHING
PRINTING
CURING
HOLE PUNCH
DC5V (MAX) -40 ° C ~ +85 ° C -30 ° C ~ +70 ° C
Linearity
Electrical performance Insulation resistance Chattering time Transparency Optical performance Haze value Transparency Cell only Cell only With circular polarizer Apply DC 25V
4.Design rule for FRTP
Boundary Design Suggestion for Plastic Resistive TP (FRTP)
4.05 mm 3.05 mm 7.0 mm 6.0 mm
B
4.05 mm 3.05 mm
A
C
A/A
4.05 mm 3.05 mm
D
A/A > 3.8“ A/A ≤ 3.8”
The Structure of Resistive FRTP.
DECO Film 0.188 mm Optical Clear Adhesive ITO Film 0.188 mm FPC/Heat Seal
ITO glass 1.1 / 0.7 mm
Total thickness: 1.65、1.25 mm ± 0.15
COATING SILICON
PACKING
INSPECTION
PROTECT FILM LAMINATE
FUNCTION TEST
LABEL PRINT
Construction of G/G TP
• Transparency
– Compared with the conventional glass-glass touch panel, our Product increase 83% to 85%.
Film + Film
Structure結構
Film + Film + Plastic Film + Glass
* Analog Capa(性能). & G+G TP are under developing(發育不全).
2. The Introduction of Resistive TP.
Resistive TP Working Principle原理
Dot Spacer Lower Glass (1.1 mm) Seal
Characteristics of G/G TP
Item Topic
Supply voltage Operation Storage Temp. range Operating Temp. range
Conditions
Description
Flat Resistive Touch Panel (FRTP type A)
Decoration Film Upper PSA Upper ITO film Bottom ITO film Bottom PSA PC sheet or Glass Housing Housing PC or glass Adhesive
Plastic Subtract: 0.5、0.8、1.0mm
3. Application for Resistive TP
Housing
Housing
百度文库
Film on Glass TP
FPC / Connector
3. Application for Resistive TP
3. Application for Resistive TP
Subtract 0.8 / 1.0 mm
Total thickness: 1.45、1.65mm ± 0.15
3. Application for Resistive TP
3. Application for Resistive TP
Flat Resistive Touch Panel (FRTP type B)
2. The Introduction of Resistive TP.
The Structure of Resistive TP.
Film / Film / Plastic Type
HC/ITO Film
FPC/Heat Seal ITO Film Optical Clear Adhesive光 學彩色粘著膠 Plastic Subtract塑料基板
Cover Glass / Plastic with Decorative Print
Housing Housing
Glass
PSA
Glass Housing
Pattern ITO coating
Anti Noise Managed
Customize Testing System
FPC / Driver / Connector
9. Resistive TP Specifications
1. Category(種類) of Existing(現有) T/P
Capacitive T/P Resistive T/P
Principle原理
*Analog Matrix矩陣 Digital Analog
* Glass + Glass
DCT LAMINATION
PSA LAMINATION
PROTECT FILM LAMINATE
5. FRTP flow chart
Back Process
UP and BOTTOM ASSEMBLY
PUNCH
FPC HOT PRESS
GLASS LAMINATION
DECORATION FILM LAMINATE
Decorative Area : A : FPC bonding side. B ~ D : trace side.
WINTEK
5. FRTP flow chart
Up ITO Film Process
ITO FILM CUTTING
ITO FILM ANNEALING
LASER ETCHING
-3 % ~ +3 %
20 MΩ or more 10 msec 83%(TYP) <1% 70~74%
Haze value
Operation Force Mechanical performance
With circular polarizer
Silicon rubber R=8.0mm Hardness 60° Hs / A60
Description
Durability
Rubber tapping life
1,000,000 times
Exposure to high temp. Exposure to heat/moisture Reliability Exposure to cold temp. Thermal cycle Reference: Wintek deviation of GQAS
85° C 500 hours 65° C 93% RH, 500hhours -40° C 500 hours -40° C...+-85° C 10 cycles
6. The Introduction of Capacitive TP.
Cover Lens Not only Decoration But also Electronic Component Hard to Hard Lamination Technology
Upper Glass (0.2 mm)
ITO FPC
• High reliability
– The upper glass structure make a high reliability products, this character is suitable for automotive applications.
3. Application for Resistive TP
Type A
PC lens
Type B
Bottom PSA
Bottom ITO film
ITO Glass
Upper ITO film Upper ITO film
Upper PSA DECO FILM Upper PSA DECO FILM
LCM
FPC / Connector
3. Application for Resistive TP
The Structure of Resistive FRTP.
ITO Film 0.188 mm Optical Clear Adhesive ITO Film 0.188mm
FPC/Heat Seal ITO Film 0.188mm Optical Clear Adhesive
3. Application for Resistive TP
TYPE B advantage
COST DOWN: Cancel bottom ITO film and OCA
Reduce CNC charge
STRUCTURE IMPROVE:
Substructure from PC change to glass Reduce total thickness
2. The Introduction of Resistive TP.
The Structure of Resistive TP.
Film / Glass Type
HC/ITO PET FPC/Heat Seal ITO Glass
ITO Glass: 0.5、0.7、1.1mm (Regular, Strengthen or AR Glass Option)
6. The Introduction of Capacitive TP.
Capacitive TP Working Principle
Finger Finger
Glass or Film FPC
ITO Pattern
Glass or Film
Parasitic Capacitance (CP) is generated by coupling from the touchpad to traces, ground plane, and any surrounding conductive material.