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兩個導通孔和 防焊開窗的尺寸的大 小是一樣的﹐我們無 法作沒有焊環的導通 孔﹐
我們建議 以下 兩种方案A和B﹕
A﹕兩孔作非導 通孔﹐移去PAD﹐防 焊開窗每邊增大3mil
B﹕作兩個導通 孔﹐增大PAD保証焊 環為8mil,同時增大 防焊開窗保証PAD的
邊3mil. 9. We will build the rectangle slot (1.7*3.0mm) as a oval one, and internal radi to be 0.85mm ,
大于
artwork
底片
nonfunctional land
非功能性焊盤
layer to layer space
層間距
multilayer construction
多層板疊搆
base copper
基銅
an insulating epoxy glass laminate 絕緣層
laye to layer dimensions and
机构圖上郵票 孔的數量和的不一樣 ﹐我們將依制作PCB ﹐請确認﹗ 6 ﹒ There are some data on the drill chart are diferent from the cad data ,we will build the pcb
follow the cad data ,please confirm!
tolerance
絕緣層的平均厚度
any discrepancies found in the
film
blind via
盲孔
mounting hole
安裝孔
foil burr
箔毛刺
toucing hole
疊孔
electroless plating
無電鍍
aspect ratio
縱橫比
hole location hole base position hole breakout square hole noncircular/nonsquare hole
1.30mm*3.50mm, please confirm. 這兩個孔有相交的部 分﹐我司建議做一個 1.30mm*3.50mm槽 來代替﹐請确認﹒ 3.There are some duplicate holes in the cad data, if there is a smal l one and a big one ,We will retain the big one , if the two holes are the same size ,We will retain only one hole 在圖上有一些重孔﹐ 如果是一個小的和一 個大的﹐我們保留大 的那個﹐如果兩個 是相同的﹐我們只保 留一個﹐請确認﹗ 4﹒ The finish hole size on the drill chart is different from the cad data
詳盡 長方形 相同 精确 制造 布線 板邊 忽略
基材 浸材固化厚 返工 試驗板 蝕刻系數 加減 能力 絕緣層 假焊盤 偏移 隔离孔 絕緣層 電層隔离線 多層板疊搆
孔圖標示
特殊要求 鐕孔 元件孔 孔位 重孔 電鍍
鐕孔數据 孔璧粗糙度 孔徑精确度 位置公差 控制器性 孔徑
inner layer
內層
appear
openings. we couldn't build the PTH without annular ring ,we suggest to choose A or B:
A) build the two holes as NPTH ,and ewmove the pads ,enlarge the soldermask opening
plating thieves
solder plate stripping method drilling data for NC hole wdialml reoteurghing accuracy position tolerance hole machinability hole diameter internal layer thermal layer oval
detail retangle corresponding accuracy build routing board edge ihganlogreen green laminate bparespermegatceurrieadl thickness reworking prototype etch factore plus or minus facilities/capability isolation layer dummy pad off registration clearence hole dvioellteacgteripclane clearence multilayer lay up hole chart and location map noes and special requirements drilling component hole hole location duplication hole eletroplate
鐕孔國上的一些 數据和上不一樣﹐我 們將依制作PCB﹐請 确認﹗ 7﹒ We will use routing process to build the solts instead of drilling process,because the will take us a long time ,during our drilling process .but the tolerance of the slot is +/-0.05mm, for ease of our manufacture capability,we suggest to relax it to:+/-
鐕孔圖﹕ 2.000mm 尺寸﹕2.100mm
我們將依數据 制作PCB﹐請确認﹗ 5 ﹒The quantities of the stamp holes on the fab .drawing is different from the cad
follow the cad data ,please confirm.
我們將用成型制程代 替鐕孔制程﹐因為用 鐕孔制成這种長槽將 花費很長的時間﹒ 范圍是+/-0.05mm,為 了保証我們的制程能 力 ﹐我司建議將其 放寬為﹕+/确認﹗ 8﹒ The size of the two PTH holes (dia .1.6mm) is the same size as the pads and
出現
spuare
方形
positive
正的
adjacent
臨近的
provide
提供
confirm
同意
method
方法
avoid
避免
properly
适當的
residual
殘留的
batch
批
panel plating process
電鍍
repairing
修复
process flow
工藝流程
plus
加
is more than
圓形 負的 指明 附件 准确 修改 符合 殘留 基准參考 試驗板 外層曝光 首件 批量 減 小于 分隔線 層對准度 地層隔离線 成板厚度
成板厚度及公差 埋孔 注尺寸孔 近孔 郵票孔 一次蓋孔法 切片
]
我們的制程能力下制 作﹐我司建議將公差 范圍放寬到+/0.05mm,請确認﹒ 2. There is a small overlap between the two PTH ,We suggest to build the two holes as a slot :
to keep the clearance 3mil
B) build the two hຫໍສະໝຸດ Baidules as PTH ,and enlarg the pads to keep the annular ring
will enlarge the soldermask opening to keep the clearance 3mil each side with
1.The tolerance of NPTH :+0.05/-0mm is too tight to meet , We could not ensure this tolercane to NPTH at all ,
for ease of our manufacure capability , We suggest to relax it to :+/-0.05mm .please confirm. 非導通孔＋0.05/0mm的公差范圍太 小了﹐我們不能保証 這樣的公差﹐為了能
please confirm! 我們將用一個 內徑是0.85mm的橢 圓來代替1.7*3.0mm 的長方形槽﹐請确認
drill chart :0.60mm cad data :0.675mm
drill chart :2.00mm cad data :2.100mm
We will build the pcb follow the cad data ,please confirm.
鐕孔上的成孔 尺寸與圖上不一樣﹐
鐕孔圖﹕ 0.60mm 尺寸﹕0.675mm
內層 散熱層 橢圓
孔位 孔基准位 破孔 方形孔 非方形圓形孔
circular negative indicate attathment exact modify according to residue datum reference cpoatutperonn plating process first article lot size minus is less than slaeypearratotiolanyleirne rgergoiusntrdatpiolanne clearence finish board thickness profile dimensions and tolerance buried via dimensioned hole close hole perforated hole tenting microsectioning
我們建議 以下 兩种方案A和B﹕
A﹕兩孔作非導 通孔﹐移去PAD﹐防 焊開窗每邊增大3mil
B﹕作兩個導通 孔﹐增大PAD保証焊 環為8mil,同時增大 防焊開窗保証PAD的
邊3mil. 9. We will build the rectangle slot (1.7*3.0mm) as a oval one, and internal radi to be 0.85mm ,
大于
artwork
底片
nonfunctional land
非功能性焊盤
layer to layer space
層間距
multilayer construction
多層板疊搆
base copper
基銅
an insulating epoxy glass laminate 絕緣層
laye to layer dimensions and
机构圖上郵票 孔的數量和的不一樣 ﹐我們將依制作PCB ﹐請确認﹗ 6 ﹒ There are some data on the drill chart are diferent from the cad data ,we will build the pcb
follow the cad data ,please confirm!
tolerance
絕緣層的平均厚度
any discrepancies found in the
film
blind via
盲孔
mounting hole
安裝孔
foil burr
箔毛刺
toucing hole
疊孔
electroless plating
無電鍍
aspect ratio
縱橫比
hole location hole base position hole breakout square hole noncircular/nonsquare hole
1.30mm*3.50mm, please confirm. 這兩個孔有相交的部 分﹐我司建議做一個 1.30mm*3.50mm槽 來代替﹐請确認﹒ 3.There are some duplicate holes in the cad data, if there is a smal l one and a big one ,We will retain the big one , if the two holes are the same size ,We will retain only one hole 在圖上有一些重孔﹐ 如果是一個小的和一 個大的﹐我們保留大 的那個﹐如果兩個 是相同的﹐我們只保 留一個﹐請确認﹗ 4﹒ The finish hole size on the drill chart is different from the cad data
詳盡 長方形 相同 精确 制造 布線 板邊 忽略
基材 浸材固化厚 返工 試驗板 蝕刻系數 加減 能力 絕緣層 假焊盤 偏移 隔离孔 絕緣層 電層隔离線 多層板疊搆
孔圖標示
特殊要求 鐕孔 元件孔 孔位 重孔 電鍍
鐕孔數据 孔璧粗糙度 孔徑精确度 位置公差 控制器性 孔徑
inner layer
內層
appear
openings. we couldn't build the PTH without annular ring ,we suggest to choose A or B:
A) build the two holes as NPTH ,and ewmove the pads ,enlarge the soldermask opening
plating thieves
solder plate stripping method drilling data for NC hole wdialml reoteurghing accuracy position tolerance hole machinability hole diameter internal layer thermal layer oval
detail retangle corresponding accuracy build routing board edge ihganlogreen green laminate bparespermegatceurrieadl thickness reworking prototype etch factore plus or minus facilities/capability isolation layer dummy pad off registration clearence hole dvioellteacgteripclane clearence multilayer lay up hole chart and location map noes and special requirements drilling component hole hole location duplication hole eletroplate
鐕孔國上的一些 數据和上不一樣﹐我 們將依制作PCB﹐請 确認﹗ 7﹒ We will use routing process to build the solts instead of drilling process,because the will take us a long time ,during our drilling process .but the tolerance of the slot is +/-0.05mm, for ease of our manufacture capability,we suggest to relax it to:+/-
鐕孔圖﹕ 2.000mm 尺寸﹕2.100mm
我們將依數据 制作PCB﹐請确認﹗ 5 ﹒The quantities of the stamp holes on the fab .drawing is different from the cad
follow the cad data ,please confirm.
我們將用成型制程代 替鐕孔制程﹐因為用 鐕孔制成這种長槽將 花費很長的時間﹒ 范圍是+/-0.05mm,為 了保証我們的制程能 力 ﹐我司建議將其 放寬為﹕+/确認﹗ 8﹒ The size of the two PTH holes (dia .1.6mm) is the same size as the pads and
出現
spuare
方形
positive
正的
adjacent
臨近的
provide
提供
confirm
同意
method
方法
avoid
避免
properly
适當的
residual
殘留的
batch
批
panel plating process
電鍍
repairing
修复
process flow
工藝流程
plus
加
is more than
圓形 負的 指明 附件 准确 修改 符合 殘留 基准參考 試驗板 外層曝光 首件 批量 減 小于 分隔線 層對准度 地層隔离線 成板厚度
成板厚度及公差 埋孔 注尺寸孔 近孔 郵票孔 一次蓋孔法 切片
]
我們的制程能力下制 作﹐我司建議將公差 范圍放寬到+/0.05mm,請确認﹒ 2. There is a small overlap between the two PTH ,We suggest to build the two holes as a slot :
to keep the clearance 3mil
B) build the two hຫໍສະໝຸດ Baidules as PTH ,and enlarg the pads to keep the annular ring
will enlarge the soldermask opening to keep the clearance 3mil each side with
1.The tolerance of NPTH :+0.05/-0mm is too tight to meet , We could not ensure this tolercane to NPTH at all ,
for ease of our manufacure capability , We suggest to relax it to :+/-0.05mm .please confirm. 非導通孔＋0.05/0mm的公差范圍太 小了﹐我們不能保証 這樣的公差﹐為了能
please confirm! 我們將用一個 內徑是0.85mm的橢 圓來代替1.7*3.0mm 的長方形槽﹐請确認
drill chart :0.60mm cad data :0.675mm
drill chart :2.00mm cad data :2.100mm
We will build the pcb follow the cad data ,please confirm.
鐕孔上的成孔 尺寸與圖上不一樣﹐
鐕孔圖﹕ 0.60mm 尺寸﹕0.675mm
內層 散熱層 橢圓
孔位 孔基准位 破孔 方形孔 非方形圓形孔
circular negative indicate attathment exact modify according to residue datum reference cpoatutperonn plating process first article lot size minus is less than slaeypearratotiolanyleirne rgergoiusntrdatpiolanne clearence finish board thickness profile dimensions and tolerance buried via dimensioned hole close hole perforated hole tenting microsectioning