半导体产业供应链PPT讲义课件

Assembly & Test
After 2000
Tester
eBusiness Architecture
Net Market
▪Who We Are: 最资深，有纵深的华人B2B软体顾问公司
▪1996年创立于柏克莱：电机、经济、企管、软体开发顾问群 ▪B2B Portal and Process Integration Leader in Asia since 1998 ▪RosettaNet Leader in Asia since 1999
Semiconductor Supply Chain
半导体产业供应链
以供应链垂直专工、虚拟整合领先世界的台湾半导体业
▪与半导体业+网络软件业的渊源
▪80年代美日半导体大战、90年代台湾异军突起靠产业政策与商业模式 ▪96年 Stanford+Berkeley Consortium on Enterprise Internet Uses
新经济演进：一波波的专工委外
经济生产是企业与市场交互运作的结果 新经济的一体两面就是电子化企业与电子市集 雾煞煞的新经济说穿了就是一波接一波的专工委外 B2B 的首要内容就是 eSourcing eSourcing 的演进先后包含企业市场化与市场企业化 电子业的先进经验可以帮助我们预见其他产业的未来
企业市场化：实体专工、虚拟整合
企业市场化有两面：实体专工、虚拟整合 实体分工古已有之，于今为烈
Adam Smith: “The division of labor is limited by the size of the market.”
全球联网扩大市场规模，促进细密分工
Robert Coase: The size of the firm is determined by market transaction cost.
Metal TOK Toppan
Masks
Equipment Package
Applied Materials
Tokyo Electron
Foundry
Assembly Test Probe
Fabless Device Mftr
Independent Device Mftr
TSMC UMC Chartered
互联网降低交易成本迫使整合组件厂委外代工
Network Allows Higher Level of Optimum Disintegration
企业市场化之一：垂直专工
新经济大赢家密诀：虚拟整合
虚拟整合是新经济盟主创造与争取价值的关键 晶圆代工厂，虚拟晶圆厂，虚拟整合厂 创造价值：虚拟整合厂比实体整合厂成本低 争取价值：价值链整合者掌握客户、主导分配 TSMC、DELL 的供应链整合 日月创造竞争优势
▪台积、日月光、华邦、联电、京元、威盛、世平、环电、明碁、 新宝… ▪IT enabled business excellence 虚拟晶圆厂、集团统合、虚拟仓储… ▪电子业企业信息团队立功升官的忠实伙伴与长期战友
Semiconductor Supply Chain (simplified)
Contract Assembly
& Test
1980s
1990s
IDM
System Design IC Design
Fab
Fabless EDA System
System Design
System Design
IC
IP
IC
Design
Design
Design Services
Assembly & Test
Semiconductor Manufacturing Supply Chain
Materials and equipment
Design
Masks Process Package
Fabrication Probe
Assembly/ packaging
Process coordination Shipping and logistics
Shipping and Logistics
Materials
Equipment
Foundry
Assembly Test Probe
Device Mftr
Distributor
To EC CEM/OEM industry
SM Supply chain
EC Supply chain
A single, contiguous supply chain from materials to systems
Amkor
Xilinx
ShippinAgSaEnd logistics
SPIL
Agere (Lucent) Agilent Intel
LSI Logic Micron Motorola National
Semiconductor NEC
Philips Samsung
Texas Instruments
Test and burn-in
To EC industry
It is much more complicated upstream from the device manufacturers
SM Board Members by Segment
Materials
Air Products JSR
Shin-Etsu Handotai Shinko Sumitomo Bakelite Sumitomo
企业市场化之二：虚拟整合
IDM
Intel TI ..
System/IC Design
Fab
Assembly & Test
IDM
Fabless
System Design IC Design
System Design IC Design
Fab
Taiwan
Foundries
Assembly & Test
Toshiba Winbond
半导体产业电子化观感分享
开宗明义
企业运筹 Logistics SCM
刘邦：『运筹策于帷帐之中，决胜于 千里之外，吾不如子房。』
如何帮助您的半导体企业在加速变动的世界 市场中运用知识来致胜赚钱。
一个粗浅的边做边学架构，愿能驾简驭繁。 教学超分工整合：经济 工工 B2B IC