晶圆切割 开槽grove

Applications Example

Laser grooving kerf check function

During blade dicing, when low-k or copper layers are present in the street, which are difficult to cut, usually blade dicing is performed after laser grooving. Adding the kerf check function can optimize this process.

The kerf check can be performed relative to the width or position of the detected groove/kerf. Automatic kerf correction is also possible.

Conventional kerf check function

The grooved area and the kerf are sometimes misrecognized.

Laser grooving kerf check function

The laser groove and kerf are correctly

detected and recognized.

The kerf check can be performed relative to the width or position of the detected groove/kerf. Automatic kerf correction is also possible.

This function can be installed as a user-specified specification.

DISCO offers various kerf check methods for various applications. For details, please contact your DISCO sales representative.

Low-k Grooving

Makers employing Low-k material and copper in high-speed devices experience significant bottlenecks, as this material is difficult to blade-dice at standard speeds. Further, acceptable cut quality is hard to obtain. DISCO's engineers have developed an application that solves these issues.

Application

Laser grooving process First, the DFL7160 rapidly makes two laser grooves in the dicing street - either "Pi Laser Grooving" or

flash movie flash movie Application Example

Cross sectional view of dicing street Magnification of Low-k layer & metal

circuits

Pi (π) laser gr ooving followed by step cut blade dicing.

Little or no chipping and delamination.

Equipment

Precision and Ease of Use

The DFL7160 (300 mm compatible) Fully Automatic Laser Saw utilizes short pulse laser technology to

groove the streets of Low-k and Cu wafers with little or no heat damage. An LCD touch screen graphical user interface allows for excellent ease of operation.

Photo 1: DFL7160

Photo 2: Laser process

Laser

Cutting Quality

The DFL7160 focuses a short pulse UV laser on the surface of the wafer. Each pulse is absorbed by

the Low-k material. After successive laser pulses, sufficient energy is absorbed to cause the Low-k

material to vaporize. The vaporized material carries away the energy from the interaction, thereby minimizing heat transfer to the surrounding material.

Laser grooving

process

Laser grooving with long pulse

laser beam (material: silicon).

Recast and heat damage are

clearly visible.

Laser grooving with short pulse

laser beam (material: silicon).

Little or no recast or heat

damage is visible.