载板制程封装介绍
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4. 無中介層, 壓模成型(Transfer Molding)
說明:先電鍍再上球, Sawing完後再封裝
5. 晶圓層級(Wafer-Level)
PI 聚亞矽氨
說明:所有封裝在Wafer完成後, 再Sawing
Unimicron Technology (SuZhou) Corp.
Do The Right Things. 13
Unimicron Technology (SuZhou) Corp.
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常見之封裝形式
二面出腳
DIP 挿件式 ( Dual In-Line Package )
四面出腳
PLCC ( Plastic Leaded Chip Carrier )
SOP SMD device ( Small Outline Package )
Chip
Single Chip Module
Unimicron Technology (SuZhou) Corp.
Chip
Chip
Chip
Chip
Multi Chip Module
Do The Right Things. 15
What is KGD?
* Known Good Die (KGD) is a which has been
1.0/1.27/1.5
Up / Down
Solder Column 10Sn / 90pb
1.0/1.27/1.5
Up / Down Metal Ball Solder / Gold
0.8/0.5
面積效率 7.2
5.3
4.5
(Chip=1)
Unimicron Technology (SuZhou) Corp.
應用產品:電腦、通訊、電子消費性產品
所需技術
電子、機械、物理、化學、材料、光學、可靠性工程、人 因工程…等多重之工程技術。
Unimicron Technology (SuZhou) Corp.
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電子構裝之分級
晶圓(Wafer) → 晶片(Chip) →第一階層封裝 → 第二階層封裝 → 第三階層封裝
Do The Right Things. 14
Multi Chip Module (MCM)
* Definition: Multi chip module is module or package which usually contains a high density interconnect substrate, several active and passive components, and a package which can be connected to the next level of interconnection.
Unimicron Technology (SuZhou) Corp.
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CSP之分類
1. 硬板中介層(Rigid Substrate Interposer)
2. 導線架形式(Leadframe Type)
3. 軟板中介層(Flex circuit Interposer)
21~40 mm 18~32 mm 32~42.5mm Chip Scale
晶片方向 錫球
Up / Down
Solder Ball 63Sn / 37pb
間距
1.0/1.27/1.5
Up Solder Ball 10Sn / 90pb
1.0/1.27/1.5
Up / Down Solder Ball 10Sn / 90pb
單晶片構裝之基本結構
膠體 ( Epoxy Molding Compound )
晶片(Chip)
金線(Gold Wire) 引腳(Lead)
晶片座(Die Pad)
優點:膠體對稱,不易產生翹曲
Unimicron Technology (SuZhou) Corp.
銀膠(Silver Epoxy) Do The Right Things. 6
覆晶(Flip Chip) 技術
* 小尺寸
*低電感
*高I / O
Chip Scale 構裝
表面黏著技術 (Surface Mount) * 標準化 *易於生產 *可測性 *可重工 *可靠性
Silicon
定義:
Package area Silicon area
≦ 1.2
說明:封裝體愈小愈好, CSP並非是封裝的名稱, 只是封裝中的一類; 不同於PBGA
* can be interconnected to its next level of packaging by wire bond, tape automated bonding, or flip-chip.
說明: 已知是好的Die封裝進度, Wafer sawing 無法100%
檢出IC是好是壞? 原因:
蘇州群策科技公司
載板封裝介紹
Unimicron Technology (SuZhou) Corp.
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電子構裝基礎概念
內容: 1. 構裝技術簡介 2. 最近十年之IC構裝
3. 資料來源:呂宗興 4. Cell phone :0932-936-106 5. clu0563@
3. 卷帶式接合(TAB—Tape Automatic Bonding)—使用金對金熱壓接合
Gold bond
註: TCP ( Tape Carrier Package ) 應用在LCD driver上。
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PBGA Assembly Process
Wafer Incoming
Taping
Wafer Grinding
De-Taping
Wafer Sawing
Substrate pre-bake
Die Bonding
Curing
Plasma Clean
Wire Bonding
單晶片構裝
多晶片模組
( MCM : Multi-Chips Module )
模組板 Module board
主機板(母板) Mother board
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電子構裝之主要功能
1. 有效供應電源 2. 提供信號傳輸 3. 協助排除耗熱 4. 保護電子零件 5. 建構人機介面
Wire Bonding
3D Packages
Wireless Bonding ( FCB , others ) COC (Chip on Chip)
Through Hole
CIB (Chip in Board)
疊Die後再鑽孔; 目前市場上 尚無此類產品。
Unimicron Technology (SuZhou) Corp.
4.5
1~1.4
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CSP(Chip Scale Package)
* Definition: Chip scale package (CSP) is a package whose package-to-silicon area ratio less than 120 percent. * CSP is derived from existing packages, that is, it can be any type of packages.
QFP ( Quad Flat Pack )
SOJ ( Small Outline J-Lead )
PGA ( Pin Grid Array )
PBGA (Plastic ball Grid Array)
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缺點:膠體不對稱,易產生翹曲
Through hole Ball mount 目的: 接地&散熱
Unimicron Technology (SuZhou) Corp.
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使用導線架(Leadframe)之單晶片構裝
1. L型引腳 (Lead)
2. J型引腳
3. I型引腳
單晶片構裝之演變
PTH → SMT → Area Array → Fine Pitch Area Array Direct Chip
Attach on Board
* 一定要使用較小的 IC (CTE過大易裂 )
BGA
PGA TCP
DIP
TO
QFP
1970
1980
1990
Chip Scale Package
Unimicron Technology (SuZhou) Corp.
Do The Right Things. 1
電子構裝之定義及範圍
定義:
微電子技術之發展日新月異, 電子零組件之尺寸不斷縮小, 零組件之間必須透過高效能、 高可靠性、 高密度及低成 本之互連 ( Interconnection ),才能建構成一個具有廣泛性功 能及實用價值之電子產品; 而建構此互連技術之相關工程 技藝,被統合稱為電子構裝技術。
manufactured and delivered in a bare, or minimally packaged die format, which
* has quality and reliability comparable to its functionally equivalent packaged component,
Interconnecting 完成 O/S Test or 3rd Vision Insp. Plasma Clean
Molding
Top Marking & Curing
Flux Clean
Singulation (Punch or Routing)
Ball Mount
Ball Scan
BGA(Ball Grid Array)構造
Second bonding
Bonding pattern
First bonding
Mold compound
Solder resist
Chip
Ag paste Gold wire
Solder balls
Ground Solder pattern Thermal via hole
1. 檢驗困難度高
2. 成本貴
3. 大部份的是IC封完後測出IC是好是壞?
Unimicron Technology (SuZhou) Corp.
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封裝製程介紹
IC Assembly Process Introduction
Unimicron Technology (SuZhou) Corp.
優點:散熱能力佳 Do The Right Things. 8
晶片互連技術(Chip Interconnection)
1. 焊線接合(Wire Bonding)—使用金線或鋁線, 以熱壓及超音波接合
2. 覆晶接合(Flip Chip Bonding)—使用錫鉛迴銲或(非)導電膠固化接合
Solder ball bond 不用打線
PBGA
基板 膠體結構
膠體尺寸
BT樹脂
Over mold Glob Top Cap
7~50 mm
Tape
TBGA
Polyimide
Ceramic
CBGA
多層陶瓷
CCGA
多層陶瓷
Micro BGA
Optional
Optional Cap
Optional Cap
Optional Cap
Over mold Glob Top Optional Cap
Wire Bond
↓
Flip Chip 的應用
1.電訊上的考慮(速度、 傳輸路徑短 )
2. IO數的考量(IO數 較Ball Pad受限)
2000
2010
Unimicron Technology (SuZhou) Corp.
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BGA構裝之分類
類別
Plastic
4. 無引腳 (Non Lead) QFN(Quad Flat Non-lead)
5. 晶片座 (Die Pad)
優點:1. 散熱能力佳 2. 面積小(無須預留接腳空間) 3. 傳輸距離短 4. 無腳彎翹風險
缺點:Molding 困難度較高 (不對稱,易發生翹曲 )
Unimicron Technology (SuZhou) Corp.