台湾芯片之王联发科的内部资料-手机Pcb设计建议_2010最新版

2010/8/16
12
Innovation Technology Product
Internal Use
Outline
▪ MT6253 PCB Footprint设计建议 ▪ PCB Layout建议(For SMT) ▪ PCB制作工艺需求
Copyright © MediaTek Inc. All rights reserved.
–
Layer definition:
• • • •
▪
6 Layer PCB
– Via type:
• • •
Blind via(1-2, 5-6) 0.1/0.3mm (4/12 mil) Buried via(2-5) 0.3/0.5mm (12/20mil) Through via(1-6) 0.3/0.5mm (12/20mil) Layer 1:Component/Signal/GND(无走线区域请铺GND plane) Layer 2: Signal/GND (无走线区域请铺GND plane) Layer 3: GND(主要的GND plane,请尽量避免走线) Layer 4:Signal/GND(无走线区域请铺GND plane) Layer 5: Signal/GND(无走线区域请铺GND plane) Layer 6: Component/Signal/GND(无走线区域请铺GND plane)
Copyright © MediaTek Inc. All rights reserved.
2010/8/16
11
Good toGreat
Innovation Technology Product
Fan out线宽建议
▪ Fan out最粗线宽建议0.2mm(8mil).
Internal Use
建议设计! Recommended Design
: trace in L2 : Pad(表层焊盘) : Blind Via (激光盲孔) drill/Land=0.1mm/0.3mm : Via在焊盘正中央 : Via不在焊盘中央
NG
Good
NG
建议将blind via下在pad正中央，可避免因pad变 形所造成的SMT不良影响
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制在+/-0.03mm 禁止在aQFN IC表层使用铺铜设计 为避免連錫的發生，RF GND间建议用8mil走線並打Blind via连通到内层的GND Plane Pad与Pad之间必須留有阻焊桥3mil以上 I/O Pad走線≦ 8mil Blind via必須打在Pad正中心
▪ Stencil Opening Suggestion (請參考P.5)
Solder Dam≈0.1mm(3.8mil) min. ≧0.075mm(3mil)
Solder Mask Opening 0.37mm(14.5mil)
•Pad一定要有阻焊环,而Pad与Pad之间必须也要有Solder Dam. •绿油印刷不可覆盖到Pad.
Copyright © MediaTek Inc. All rights reserved. 2010/8/16 15
Innovation Technology Product
Internal Use
PCB Layout基本规范
▪ ▪ Normal trace/spacing :0.1/0.1mm(4/4mil) 4 Layer PCB
– Via type:
• • •
Blind via(1-2, 3-4) 0.1/0.3mm (4/12 mil ) Buried via(2-3) 0.3/0.5mm (12/20 mil) Through via(1-4) 0.3/0.5mm (12/20 mil) Layer 1:Component/Signal/GND(无走线区域请铺GND plane) Layer 2: Signal/GND (无走线区域请铺GND plane) Layer 3: Signal/GND (无走线区域请铺GND plane) Layer 4:Component/Signal/GND (主要的GND plane,请尽量避免走线)
Copyright © MediaTek Inc. All rights reserved.
2010/8/16
2
Good toGreat
Innovation Technology Product
MT6253 Package Outline Drawing
Internal Use
附件为Pdf & dwg檔的格式
Good toGreat
Innovation Technology Product
Internal Use
MT6253 Composite Pattern
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2010/8/16
7
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Innovation Technology Product
Copyright © MediaTek Inc. All rights reserved. 2010/8/16 14
Good toGreat
Innovation Technology Product
Internal Use
The Solder Mask Size of I/O Pad 之设计规范
Internal Use
MT6253 PCB 设计建议
Version: 1.0
Copyright © MediaTek Inc.All rights reserved.
2010/8/16 CT/PCB
Internal Use
Outline
▪ MT6253 PCB Footprint设计建议 ▪ PCB Layout建议(For SMT) ▪ PCB制作工艺需求
Good toGreat
Innovation Technology Product
IC下方避免Top层面铺铜
Recommended Design
Internal Use
建议设计!
NG! (强烈不建议!)
在IC下方铺铜会造 成pad size过大， 容易发生连锡
RF Gnd区域，使用 0.2mm(8mil)连接并下via12(盲孔)至内层GND Plane即 可
建议拉线至绿油开窗外后再加粗
NG (强烈不建议!)
Pad变形
如果线宽≧Pad的size:0.27mm(10.6mil), 将会导致Pad变形以及无法制作出阻焊环， 并有可能的会造成SMT的不良影响.
Copyright © MediaTek Inc. All rights reserved.
无阻焊环
Good toGreat
– For E-pad area
• 建议采用0.1mm厚的钢网，钢网开口佔總面積40%. • 建议钢网开口边缘距离PCB 焊盘边缘0.2mm以上. • 钢网开口可视实际SMT需求微调
– For Signal Pad
• 建议采用 0.1mm厚的钢网， 开口直径為0.27mm • 建议将其开口外形制作成方形導R角(0.075mm)，並旋轉45 °
(1)建议钢网开口边缘距离PCB 焊盘边缘0.2mm以上. (2)钢wenku.baidu.com开口可视实际SMT需求微调.
Copyright © MediaTek Inc. All rights reserved. 2010/8/16 6
Item Material Fabrication method Thickness
Value Stainless steel Laser cut 0.1 mm
2010/8/16
13
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Innovation Technology Product
I/O Pad Size 之设计规范
Internal Use
0.27mm (10.6mil) +/- 0.03mm(1.2mil)
要求信号Pad size的直径是0.27mm(10.6mil)，和IC封装尺寸一样 大（1：1），其公差必须控制在+/-0.03mm(1.2mil)以内.
–
Layer definition:
• • • • • •
Copyright © MediaTek Inc. All rights reserved.
2010/8/16
9
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Innovation Technology Product
Internal Use
Recommendation of Blind Via on Pad
Copyright © MediaTek Inc. All rights reserved. 2010/8/16 5
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Innovation Technology Product
MT6253 Stencil Recommendation
Internal Use
GND E-Pad鋼網(Stencil)製作建議
Internal Use
Outline
▪ MT6253 PCB Footprint设计建议 ▪ PCB Layout建议(For SMT) ▪ PCB制作工艺需求
Copyright © MediaTek Inc. All rights reserved.
2010/8/16
8
Good toGreat
2010/8/16
4
Good toGreat
Innovation Technology Product
Internal Use
MT6253 Solder Mask Recommendation
绿油桥(Solder Dam)
Center Pad Mask Opening
Pad size
Solder Mask Opening (绿油开窗)
Copyright © MediaTek Inc. All rights reserved. 2010/8/16 3
Good toGreat
Innovation Technology Product
Internal Use
MT6253 PCB Land Pattern Drawing
Copyright © MediaTek Inc. All rights reserved.
Copyright © MediaTek Inc. All rights reserved. 2010/8/16 16
Good toGreat
Innovation Technology Product
Good toGreat
Innovation Technology Product
Internal Use
Summary
▪ PCB Layout Suggestion
– For E-pad
• 建议与IC接地焊盘相同尺寸 (即封装库1：1的面积比例)制作E-Pad
– For Signal Pad
• 建议制作直径为0.27mm的圆形焊盘(按封装库1:1制作)，實際PCB成品精度需控 • • • • •