栗村电磁屏蔽膜说明书(EMI shield film storage_handling)

Insulation + Conductive Adhesive
Conductive Adhesive Layer Protection Film
2 layer structure
Structure Carrier Film Insulation layer
Material / feature Release Matt PET Film Modified Resin based Modified Resin based (with metal filler) Release PET Film
2. Place on the FPCB.
Soldering iron
3. Pre-fixing the film using a device
Soldering iron Pre-fixing Condition Iron
150~190℃ 2sec
100~140℃ 2~5sec
▶The conditions may vary depending on the conditions of the working plate.
4. Release carrier film.
Press Conditions
Temperature Quick Press & Post Cure
160±10℃
Post Cure
Time Temperature
-
Force
25~45kgF/㎠
Time
-
More than 60min
▶The conditions may vary depending on the conditions of the press machine & cushioning material. Please check your preferred conditions before starting mass production.
6
7 8 9
0.6
0.5 0.5 0.4
Pass
Pass Pass Pass
15
16 17 18
0.4
0.4 0.4 0.4
Pass
Pass Pass Pass
9
200
140
60
18
200
140
100
Quick press conditions occur by the difference in quality. → Please check preferred conditions before starting mass production!
▶The conditions may vary depending on the conditions of the working plate.
How to use Quick press
[ How to Apply (Quick Press) ]
Recommended Lamination Condition 1. Release protection film from conductive layer. 2. Laminating on FPCB. (Tentative fastening) 3. Heat press on insulation layer side with Carrier film.
YOULCHON EMI Shield Film Storage & Handling
[ YES-A20 ]
2016. 03. 10
YOULCHON CHEMICAL R&D Center
Industry Materials R&D Team
EMI shield film Structure
Carrier Film Insulation Layer
Test 中
< Solder Bath > < Bubble & Delami check! >
▶Storage Warning & Shelf Life
- Store it in low temperature & humidity (temp.: 5± 3℃/ humidity: 40± 10%) away from direct sunshine.
Notices(Quick press condition)
Factors & Level Overview
Quick Press Factors & Level
Factor Unit Level +
1 2 3 4 Temp. 160 160 160 180 180 180 200 200 Force 100 120 140 100 120 140 100 120 Time 100 100 100 100 100 100 100 100 5 0.6 Pass 14 0.4 Pass order Conductivity (Ω) 1.3 1.0 0.9 0.9
Force Time
℃
bar sec
160
100 60
180
120
200
140 100
Test Design
order 1 2 3 4 5 6 7 8 Temp. 160 160 160 180 180 180 200 200 Force 100 120 140 100 120 140 100 120 Time 60 60 60 60 60 60 60 60 order 10 11 12 13 14 15 16 17
25℃
O O O O O △ △ X
40℃
O O O O △ X X X
- Conductivity : condition : Quick press (180℃, 120bar, 100sec) Baking(160℃, 3600s) - Solder Resistance (288℃, 10sec) - Peel strength (Cross Cut)
Test Result
Solder Test (Pass/NG) NG NG NG NG order 10 11 12 13 Conductivity (Ω) 0.9 0.8 0.7 0.5 Solder Test (Pass/NG) Pass Pass Pass Pass
1
2 3
Temperature
• Allow the refrigerated film with plastic wrap to stand at room temperature before using it. • By doing this, you can avoid deterioration from Dew condensation.
How to use Hot press
[ How to Apply (Only Press) ]
Recommended Lamination Condition
1. Release protection film from conductive layer. 2. Laminating on FPCB. (Tentative fastening) 3. Heat press on insulation layer side with Carrier film over 60 min
4. Release carrier film.
5. Post cure.(Baking)
Press Conditions
Temperature Quick Press & Post Cure
180±10℃
Post Cure
Time Temperature
160±10℃
Force
100~150bar
Time
More than 60min
More than 100sec
▶The conditions may vary depending on the conditions of the press machine & cushioning material. Please check your preferred conditions before starting mass production.
Thickness 50±5㎛
20±4㎛ (After Press)
Conductive adhesive layer
Protection Film
75±7㎛
EMI shield film Storage & Handling
[ Product stability with the storage conditions ]
Time for a stored film gets a room temperature, 25℃
Storage Temperature 0℃
Time
6 hr
5℃
5 hr
10℃
4 hr
▶Storage Warning & Shelf Life
- Please restore the EMI shield film back to room temperature for 6hours more with wrapping.
Байду номын сангаас
• From 150℃ to 190℃, use the available soldering iron temperature control.
• The tip of the soldering iron looks like the below picture is convenient for the operation
Retention period
0day 1day 2day 3day 4day 7day 10day 14day 1month 2month 3month 4month 5month 6month
Storage Temperature
5℃
O O O O O O O O
< Test method >
Pre-fixing
[ Recommended Pre-Fix Condition ]
Iron
• From 100℃ to 140℃, use the available iron temperature control. • Small iron is convenient.
Soldering iron
• Data is measured in the above, not guaranteed values. • Warranty : 3 months
EMI shield film Storage & Handling
[ Time to turn room temperature in the storage temperature ]
How to use for FPCB
Preparation Remove release film Pre-fix Hot press Remove protective film
[ EMI shield film ]
Carrier film Insulation Conductive adhesive Protection film Carrier film Insulation Carrier film Insulation Carrier film Insulation Insulation Conductive adhesive
Conductive adhesive
Conductive adhesive
Conductive adhesive
[ FPCB ]
Pre-fixing
[ Recommended Pre-Fix Condition ]
Iron
1.
Release protection film from conductive layer.