BiCMOS flow Introduction
振动特性外文
PowerMos Process Flow Presentation
30VP
60VP 20VP 40VP
nutch
lasermark nutch
PAD氧化300-B
步骤 PAD氧化300-B PAD进后PARTICLE测量 厚度測量-PADOX
PU Type GATEOX SURFSCAN ELLISO
Major parameter 2.RDS(on)=Rsource + Rch + RA+ RD + Rsub + Rwcml
Rsource=Source diffusion resistance Rch=Channel resistance RA=Accumulation resistance
RD=Drift region resistance
PU Type
WS ADE LASERMARK RCAA
程序1
程序2
. . PRO RCAA20F2FM
Wafer specification N-EPI: 0.14R5.0T-Wacker N-EPI: 0.14R5T-Wacker N-EPI: 0.2R5.5T-Wacker N-EPI: 0.32R7.0T-Wacker N-EPI: 0.68R8.8T-Wacker P-EPI: 0.65R6.7T-Wacker P-EPI: 0.65R6.7T-Wacker P-EPI: 0.5R6.5T-Wacker P-EPI: 1.8R9.0T-Wacker P-EPI: 0.35R6.0T-Wacker P-EPI: 0.68R7.3T-Wacker
程序1
*RETICLE *RLAYERD . . DESCUM30 BOE-360S .
Jolly ID Flow 入门指南说明书
Jolly Presents…ID FlowGetting Started Guide An Introduction to ID FlowContentsIntroducing ID Flow (3)Quick Start Options (4)Quick Start Option 1 (4)Quick Start Option 2 (6)Using ID Flow (8)Jolly Server Settings and Workstation Options (8)Installing Jolly Server (9)Connecting to a shared Jolly Server – Networking Multiple Copies (9)Jolly Server Settings (10)Workstation Options and Devices (11)ID Card Design (12)Design Screen (12)Working with Text (13)Working with Layers (14)Viewing Designs with Live Data (15)Working with Print Conditions (15)Saving a Design (16)Enrollment Configuration (16)Record Lookup Configuration (18)Report Center Configuration (19)Record Center (19)Configuring the Record Screen (21)Advanced Field Formatting (21)Configuring Language (22)- Page 2 -Introducing ID FlowID Flow is premier software for ID card design, production and data management. This guide provides basic understanding of product components and how to get started. This guide is a supplement to the Help Menu provided within the product. The built-in Help Menu provides comprehensive configuration details for each dialog.- Page 3 -Quick Start OptionsQuick Start Option 1ID Flow is preconfigured with several Workstation Profiles. These profiles allow users to select an application that resembles their intended use. Profiles are configured with sample badge designs, menu options and enrollment processes that are appropriate for the application.The Basic group has six data fields and a single-layer card design. The Advanced group has additional fields, including signature and fingerprint fields, and a multi-layered card design. These card designs are linked to a sample database that includes four sample records. The card designs, data and data fields may be modified.To use a pre-configured profile to get started, click on the profile and click Next. Getting to configurationConfiguration is done through the Setup button on the Main Menu or through the Admin Menu. Only users with Administrative Rights can change settings. After clicking Setup you may choose to configure Jolly Server Settings or Workstation Settings. There is a shortcut next to the Cardholder Group that will go directly to the Cardholder Group Properties dialog. The Record Center button takes you to the database view of all records.- Page 4 -Click on Record Center to see the fields that are pre-configured in the database. Editing Card DesignEach Cardholder Group has an associated ID card design. To edit the card design, open the Cardholder Group Properties, select the Card Printing tab and click Edit.This will launch the card designer.In the card designer, design objects may be moved and resized with the mouse, deleted by selecting delete while the object is highlighted and edited by double-clicking on the- Page 5 -object. Design Objects may be added using the design object toolbar on the left of the screen and by drawing the approximate object placement on the card with the mouse. To change the card size and orientation go to File -> Edit Page Setup. More details about ID Flow Designer follow on subsequent pages.After design modifications are finished click Exit and Save.For more information, refer to the Card Designer section later in this document.Other SettingsUse the Enrollment button on the Main Menu to enroll new cardholders. Modifications to the enrollment process, record look up and logs and reports are configured in the Cardholder Group Properties.See records by clicking the Record Center button. Sample records may be deleted, but it is suggested a new record be added first so that the data set is not empty.User Accounts and Locations are configured in Jolly Server Settings and workstation tasks are configured in Workstation Settings.Quick Start Option 2Select “Launch Setup Wizard” from the Configure Workstation dialog at start up or run from the Setup menu.Name the cardholder group; then choose the database:- Page 6 -- Page 7 -Select the card size and then click edit the badge design (see instructions below for ID Flow Designer):Then configure each tab of the Cardholder Group and Workstation Settings:Using ID FlowID Flow has been designed to simplify the day-to-day data entry and production of ID cards. It allows the user to enroll new cardholders, lookup an existing record and view reports of all actions that have occurred. The Record Center shows all database records and their ID card design.Card Issue Center is designed so that multiple locations may be networked through sharing a central Jolly Server. For this reason, there are two types of configuration settings: Jolly Server Settings and Workstation Options.To Setup, select the setup button on the Main Menu screen or from the Admin Menu. Only Administrators have setup ability.Jolly Server Settings and Workstation OptionsID Flow is designed to run across multiple locations in a networked environment. Shared settings such as cardholder groups and log data are stored on the Jolly Server while workstation specific options are configured in Workstation Options and Devices.- Page 8 -If ID Flow will be used in a standalone environment where it does not need to share data with other workstations, it can use the Internal Jolly Server, installed as part of ID Flow.Installing Jolly ServerJolly Server is installed separately from ID Flow. To install, run the Jolly Server installer that was provided to you when you purchased the software on the target server or workstation.Connecting to a shared Jolly Server – Networking Multiple CopiesWhen networking multiple copies of ID Flow, install the Jolly Server on a central server or shared workstation. All networked copies should point to the same Jolly Server.To connect to a Jolly Server, select File > Connect to Jolly Server.By default, the Internal Jolly Server is selected. When Internal Jolly Server is selected, the software will operate in standalone mode.To connect to a shared Jolly Server, click the Configure button.- Page 9 -Enter the name of the server or workstation where Jolly Server was installed.Jolly Server SettingsJolly Server Settings are settings that can be shared between workstations such as Cardholder Groups, Locations, Logs and Reports, Security Policy and User Accounts.Settings for Locations, Logs and Reports Security Policy and User Accounts are obvious when the dialog is open.Cardholder Group settings work in tandem with Workstation settings. Examples: 1. In order to capture a signature in the enrollment process, the signature field must be defined in the cardholder group’s Enrollment tab; 2. In order to lookup a record by email address, that field needs to be defined in Record Lookup tab; 3. In order to log the name and titles of cardholders, those fields must be defined in the Logs and Reports tab.- Page 10 -To configure the cardholder group’s settings, highlight the group and select edit.Workstation Options and DevicesWorkstation Options and Devices apply to only to a specific workstation. They include selecting the location, cardholder groups available at the location, selecting which tasks will be available to the user, configuring the tasks and capture devices, and selecting the language to be used a this location. Tasks are configured individually through the task’s blue hyperlink or together via the configure button:- Page 11 -- Page 12 -ID Card DesignEach Cardholder Group has an associated ID card design. To edit the card design, open the Cardholder Group Properties, select the Card Printing tab and click Edit.Design ScreenThe design screen contains four toolbars: general items, alignment tools, design objects and object formatting.- Page 13 -Cards are designed by selecting the design object on the left-hand toolbar and by drawing that object’s area on the card with the mouse. After the area drawn the object’s Properties dialog will appear. Click through the tabs to format the object.Objects may be resized at any time and Properties dialog re-accessed by double-click.Working with TextID Flow contains rich text editing. Regular text, database text, serial number, date and time may be combined within one text box. Type with a keyboard or use the + Field button for text selections.- Page 14 -There are three types of text formatting: Text Box, Flexible Text and Circular Text. Text Box will always place text within the bounds of the box drawn in the design: If larger, it will auto-reduce in font size or word wrap. Flexible Text will maintain font size regardless of the size of the box drawn. Circular Text formats text in a circle.Working with LayersLike other quality graphical design tools, ID Flow uses a layered design approach. Layers may contain different design objects of varying opacity. Using layers adds a rich depth to design and creates highly secure cards.To see the layers window click the Show Layers checkbox on the top menu bar. Layers are added using the [+] button at the bottom of the window. Use the arrow buttons to move layers above and below other layers. Click the Print checkbox on each layer to format its print condition. The active design layer is highlighted blue.Viewing Designs with Live DataAt any time the card design may be viewed with data by checking the Live Data button on the top menu bar:To view the full record set: go to File -> Database Setup or click the data icon on the topmenu bar:Working with Print ConditionsDesign objects or design layers may be set to print only if specific database conditions are met. Print conditions are set on the Print Conditions tab of the object’s properties dialog. K Panel (Black Panel) and UV Panel are also set on this tab.- Page 15 -Saving a DesignWhen you are done editing the card design, close the designer to return to the Card Issue Center.Enrollment ConfigurationUsers define the relevant workflow for enrollment. Available steps include Data Entry, Photo Capture, Signature Capture, Fingerprint Capture and Card Printing:1.2.3. 4.5.To configure photo capture, driver’s license scan, signature capture and fingerprint scan in enrollment, define the processes in the Cardholder Group Properties (Jolly Server Settings), and then enable the options and configure the devicese in the workstation settings:- Page 16 -The capture device specifications are configured by clicking the Options buttons in the Workstation Task Settings.Notes about capture devices:ID Flow supports TWAIN and WIA compatible cameras. The ability to capture a photo from within ID Flow and trigger the flash will depend upon the camera’s software. ID Flow is commonly used with web cams: When Microsoft WDM is invoked as the capture source, four photos are captured and the best may be chosen.ID Flow supports Topaz and Interlink USB signature and fingerprint pads.ID Flow support Card Scanning Solutions ScanShell 800, ScanShell 1000 and SnapShell camera for driver’s license and/or passport scanning. It does NOT support the 800N. Some device files and drivers may be found under “add-on modules” on the “Download” section of the website.- Page 17 -- Page 18 -Record Lookup ConfigurationRecord Lookup allows the user to quickly search for records. When multiple matches occur a selection dialog is shown. Strict matching may also be used if desired.To configure record lookup, first define the lookup fields in the Record Lookup tab of Cardholder Group Properties dialog found in Jolly Server Settings . The options can be further defined in the Advanced Options dialog.Report Center ConfigurationLogs and Reports shows activity on all actions that occur in the product: when a record was added, edited or deleted and when card was printed; by whom, at what time and location. Custom logs may be designed. Reports may be printed, exported and emailed.Four fields from a cardholder’s record may be configured in the Logs and Reports tab on the Cardholder Group Properties dialog. The Workstation Setting for Logs and Reports makes the item available or not.Record CenterRecord Center is used for the management of records. Records may be added, edited, deleted, printed and duplicated from this screen. The down-arrow button provides additional options.- Page 19 -Records may be viewed in single-record or spreadsheet view by selecting the buttons on the right of the toolbar.Records may be batch printed, deleted and edited by checking the box to the left of the record and selecting the appropriate action. Records may be sorted by clicking on column headers.The toolbar contains filter and sort buttons . Filters are used to create data subsets. Sorting allows for multiple field sort criteria.- Page 20 -Configuring the Record ScreenID Flow has drag-and-drop record screen formatting. Select Edit Record Layout from the down-arrow menu on the Record Screen: Size and move fields with the mouse.Advanced Field FormattingID Flow Premier Edition contains advanced field formatting. Fields may be made Visible, Required and Read Only. They may be given default values. Drop-down lists may be created. Text can be set to Capitalize, UPPER CASE or lower case. Image paths may be created to store variable images to file.- Page 21 -- Page 22 -Configuring LanguageID Flow is available in 10+ languages. Select the language in the Workstation Settings. A translation table allows the user to make changes to the translation or to translate into a language not yet provided by Jolly. After changing languages, restart the program.The information contained in this document represents the current view of Jolly Technologies on the issues discussed as of the date of this publication. This paper is for informational purposes only. Jolly Technologies makes no warranties, express or implied in this document. Jolly, Jolly Technologies, ID Flow, Lobby Track, and Command Line Utility are either trademarks or registered trademarks of Jolly, Inc. in the United States of America and/or other countries. The names of actual companies and products mentioned hereinmay be the trademarks of their respective owners.。
财务专业英语ppt课件
a. How does the description of accounting as the "language of business" relate to accounting as being useful for investors and creditors?
a. Information used to determine which products to produce. b. Information about economic resources, claims to those resources,
and changes in both resources and claims. c. Information that is useful in assessing the amount, timing, and
•Definition of Accounting: business language information system basis for decisions
•Types of Accounting Information: (1)Financial Accounting: •Internal users
篮球比赛是根据运动队在规定的比赛 时间里 得分多 少来决 定胜负 的，因 此，篮 球比赛 的计时 计分系 统是一 种得分 类型的 系统
Contents
Chapter One
Chapter Two
Chapter Three Chapter Four
流式软件 flowjo教程 基础
Introduction - FlowJo Basic Tutorial
FlowJo is an integrated environment for viewing and analyzing flow cytometric data, presented in the form of a Workspace. The Workspace contains a list of all of the data samples that you load, the gates, statistics and other analyses that you apply, and the table and graphical layout that you design. The Workspace is saved as a FlowJo document on your hard disk; when you reopen the document, you will see the status of your analysis as it was when it was last saved. This tutorial is designed to introduce you to the basics of the program. Reading through it, you will learn how to operate FlowJo. Run the program as you perform the steps in the tutorial so that you can get the best feel for how the program works. As you watch FlowJo perform various operations such as creating new graphs, statistics, tables, or graphical layouts, you will see how fast and easy FlowJo is to use. This tutorial is designed as an introduction to FlowJo. The 8-color PBMC Advanced Tutorial provides more detail on functionality. Furthermore, FlowJo is capable of much more that simply can’t be covered in an introduction such as this (for example, there are analysis platforms to perform DNA/Cell Cycle analysis, Kinetics analysis, Proliferation and Population Comparison). You can learn more about FlowJo through the online help tool. Whenever you ask for help from FlowJo by pressing the question mark button in the interface of any window, it launches a web browser and accesses help pages about the part of the program you are using. You can navigate through the help pages to find out more about all of the aspects of FlowJo. In addition, contains a page of FAQ’s (Frequently Asked Questions), tutorial videos on many FlowJo topics, and the Daily Dongle, a searchable blog discussing all things FlowJo. As a note, we are pleased to be able to frequently update FlowJo to provide new features and analysis capabilities. Therefore, it is possible that the graphics shown in this tutorial may not exactly match the windows that you see when you run the most recent version of FlowJo. You can always download the most recent version of FlowJo from: /download/index.html
Groundwater课件详解
Introduction to Visual MODFLOW
2020/9/25
1
1.软件安装；
2.软件介绍：MODFLOW是英文Modular Three-dimensional Finite -difference Ground-water Flow Model（模块化三维有 限差分地下水流动模型）的简称.
环境、水利、城乡发展规划等方面。
2020/9/25
6
Introduction to Visual MODFLOW
Visual MODFLOW is the most complete, and user-friendly, modeling environment for practical applications in three-dimensional groundwater flow and contaminant transport simulation. This fully-integrated package combines powerful analytical tools with a logical menu structure. Easy-to-use graphical tools allow you to:
➢quickly dimension the model domain and select units
➢conveniently assign model properties and boundary conditions
➢run model simulations for flow and contaminant transport
9
Introduction to Visual MODFLOW
MAX6814 低功耗看门犬电路说明书
General DescriptionThe MAX6814 is a low-power watchdog circuit in a tiny 5-pin SC70 package. This device improves system reliability by monitoring the system for software code execution errors. When the watchdog input detects a transitional edge, the internal watchdog timer clears and restarts, then begins counting again. If the watchdog timer exceeds the watchdog timeout period (1.6s typ), the active-low, push-pull watchdog output asserts for the watchdog pulse period (140ms min) to alert the system of the fault.The MAX6814 consumes only 4µA of supply current and is fully specified over the extended temperature range. Applications●Computers and Controllers●Embedded Controllers●Intelligent Instruments●Critical µP Monitoring Features●4µA Operating Current●Watchdog Timer with 1.6s Timeout●140ms (min) WDO Pulse Period●Push-Pull Active-Low WDO●Fully Specified Over Extended Temperature Range ●No External ComponentsDevices are available in both leaded and lead(Pb)-free/RoHS-compliant packaging. Specify lead-free by replacing “-T” with “+T” when ordering.PART TEMPRANGEPIN-PACKAGETOPMARK MAX6814XK-T-40°C to +85°C 5 SC70AEK19-2804; Rev 3; 7/14Pin ConfigurationTypical Operating CircuitOrdering InformationV CC .......................................................................-0.3V to +6.0V All Other Pins ...........................................-0.3V to (V CC + 0.3V)Input Current, WDI .............................................................20mA Output Current, WDO .........................................................20mA Continuous Power Dissipation (T A = +70°C)5-Pin SC70 (derate 3.1mW/°C above +70°C) .............247mWOperating Temperature Range ...........................-40°C to +85°C Storage Temperature Range ............................-65°C to +150°C Junction Temperature ......................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C(V CC = +2.25V to +5.5V, T A = T MIN to T MAX , T A = -40°C to +85°C, unless otherwise noted. Typical values are at T A = +25°C.) (Note 1)Note 1: Overtemperature limits are guaranteed by design, production testing performed at +25°C only.Note 2: WDO is low when V CC falls below the undervoltage threshold. When V CC rises above the undervoltage threshold, WDO goeshigh after the watchdog pulse period.Note 3: Watchdog pulse period occurs when the watchdog times out or after V CC rises above the undervoltage threshold.Note 4: The WDO short-circuit current is the maximum pullup current when WDO is driven low.Note 5: WDI is internally serviced within the watchdog period if WDI is left unconnected.Note 6: The WDI input current is specified as the average input current when the WDI input is driven high or low. The WDI input isdesigned to drive a three-stated output device with a 10µA maximum leakage current and a maximum capacitive load of 200pF. This output device must be able to source and sink at least 200µA when active.PARAMETERSYMBOL CONDITIONSMIN TYPMAX UNITS Operating Voltage Range V CC T A = 0°C to +70°C 2.255.5V Supply CurrentI SUPPLY WDI unconnected V CC = 5.5V 1024µA V CC = 2.5V412Undervoltage Lockout Threshol d UVLO (Note 2) 2.19V Watchdog Pulse Period t PP (Note 3)140200280ms WDO Output VoltageV OH I SOURCE = 30µA, V CC = 2.3V 0.8 × V CCV V OL I SINK = 1.2mA, V CC = 2.1V 0.3WDO Output Short-Circuit Current I SOURCE V CC = 3.6V (Note 4)400µA Watchdog Timeout Period t WD 1.12 1.602.40s WDI Pulse Widtht WDI V IL = 0.4V, V IH = 0.8 × V CC50ns WDI Input Voltage (Note 5)V IL 0.3 × V CC V V IH0.7 × V CCWDI Input Current (Note 6)WDI = V CC , time average 120160µAWDI = 0, time average-20-15Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Absolute Maximum RatingsElectrical Characteristics(V CC = +5V, T A = +25°C, unless otherwise noted.)PIN NAME FUNCTION1WDO Active-Low Watchdog Output. Pulses low for 140ms (min) when the watchdog timer exceeds the watchdog timeout period. WDO is low when V CC is below the UVLO threshold and remains low for 140ms (min) after V CC exceeds the UVLO threshold.2GND Ground3N.C.No Connection. Leave unconnected or connect to V CC .4WDIWatchdog Input. If WDI remains either high or low for longer than the watchdog timeout period, the internal watchdog timer runs out and a watchdog pulse period is triggered. The internal watchdog timer clearswhenever a watchdog pulse period is asserted, or whenever WDI sees a rising or falling edge. If WDI is left unconnected or is connected to a three-stated buffer output, the watchdog is disabled.5V CCSupply Voltage2.01.0-40-2040100WATCHDOG TIMEOUT PERIODvs. TEMPERATURE1.21.11.31.81.9 0TEMPERATURE (°C)W A T C H D O G T I M E O U T P E R I O D (s )02080601.61.71.41.5250150-40-2040100WDO PULSE PERIOD vs. TEMPERATURE170160180230240 0TEMPERATURE (°C)W D O P U L S E P E R I O D (m s )208060210220190200132654879-402040-2060801001200TEMPERATURE (°C)S U P P L Y C U R R E N T (m A )V CC SUPPLY CURRENT vs. TEMPERATUREPin DescriptionTypical Operating CharacteristicsDetailed DescriptionWatchdog InputIn the MAX6814, the watchdog circuit monitors the µP’s activity. If the µP does not toggle the watchdog input (WDI) within t WD (1.6s), WDO asserts. The internal 1.6s timer is cleared by either a WDO pulse or by toggling WDI, which detects pulses as short as 50ns. While WDO is asserted, the timer remains cleared and does not count. As soon as WDO is released, the timer starts counting (Figure 3).Disable the watchdog function by leaving WDI uncon-nected or by three-stating the driver connected to WDI. The watchdog input is internally driven low during the first 7/8 of the watchdog timeout period and high for the last 1/8 of the watchdog timeout period. When WDI is left unconnected, this internal driver clears the 1.6s timer every 1.4s. When WDI is three-stated or unconnected, the maximum allowable leakage current is 10µA and the maximum allowable load capacitance is 200pF.Applications InformationWatchdog Input CurrentThe MAX6814 WDI inputs are internally driven through a buffer and series resistor from the watchdog counter (Figure 1). When WDI is left unconnected, the watchdog timer is serviced within the watchdog timeout period by a low-high-low pulse from the counter chain. For minimum watchdog input current (minimum overall power consumption), leave WDI low for the majority of the watchdog timeout period, pulsing it low-high-low once within the first 7/8 of the watchdog timeout period to clear the watchdog timer. If WDI is externally driven high for the majority of the timeout period, up to 160µA can flow into WDI.Watchdog Software ConsiderationsOne way to help the watchdog timer monitor software execution more closely is to set and clear the watch-dog input at different points in the program, rather than pulsing the watchdog input high-low-high or low- high-low. This technique avoids a stuck loop, in which the watchdog timer would continue to be cleared inside the loop, keeping the watchdog from timing out.Figure 4 shows an example of a flow diagram where the I/O driving the watchdog input is set high at the beginning of the program, set low at the beginning ofevery subroutine or loop, then set high again when the program returns to the beginning. If the program should hang in any subroutine, the problem would quickly be corrected, since the I/O is continually set low and the watchdog timer is allowed to time out, causing an interrupt to be issued. This scheme results in higher time average WDI input current than does leaving WDI low for the majority of the timeout period and periodically pulsing it low-high-low (see the Watchdog Input Current section).PACKAGE TYPE PACKAGE CODE OUTLINE ND PATTERN NO.5 SC70X5+121-007690-0188Chip InformationTRANSISTOR COUNT: 607PROCESS: BiCMOSPackage InformationFor the latest package outline information and land patterns (footprints), go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.REVISION NUMBERREVISION DATE DESCRIPTIONPAGES CHANGED37/14No /V OPNs; removed Automotive reference from Applications section1Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.Revision HistoryFor pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at .。
魏笠教练
15
Wei Li
讲解示例：Analysis of models
(3)The Multi-Objective Function
Definitions: Basic Standards : •Saturated flow capacity •Average delay •Equity degree •Accident expectation •Device cost Count in Money : = − + +
10
Wei Li
讲解示例：Analysis of models
2.3 Analysis of models
(对文中模型进行逐一分析，理清楚每个模型中概念定义、模型 架构、模型适用的范围)
Assumptions：
• The geometric design of the traffic circle cannot be changed. • The traffic circle is a standard one (at grade) with all lanes on the ground, that is, no grade separation structure. • The incoming vehicle flow in a period we study (e.g. 24 hours) is known. • People drive on the left (since the example analyzed later is from the UK) • Since we are considering the traffic flow, the pedestrians are ignored. In fact, the model can be easily modified to take this factor into account. • Motorcycles move freely even in a traffic jam and are not taken into consideration
芯片制造基础知识PPT课件
• 光阻涂布的是否均 匀直接影响到将来 线宽的稳定性。
• 光阻分为两种：正 光阻和负光阻。
• 一般而言通常使用 正光阻。只有少数 层次采用负光阻。
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• 曝光 • Exposure • 曝光动作的目的是将光罩上的图形传送到晶园上。 • 0.13um，0.18um就是这样做出来的。 • 曝光所采用的机台有两种：Stepper和Scanner。
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• 采用铜导线的困难： • 当铜和硅接触的时候，会在硅中发生非常快速的扩散。 • 这种扩散还将改变制作在硅上面半导体三极管的电学特性，导致三极管 失效。
• IBM最终克服了这些困难(Damascene)： • 采用先做绝缘层，再做铜导线层的方法解决扩散问题。 • 在制作铜导线层的时候，IBM采用一种铜的多晶体，进一步限制铜在硅 中的扩散。
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• Poly Silicon Creation 2 • 采用一种叫做Trichlorosilane 的物质(SiHCl3)作为溶剂，氢气作为反应 环境，在钽(tantalum)电热探针指引下，经过初步提炼的硅形成晶体。 • 这种过程需要多次，中途还会用到氢氟酸(HF)这样剧毒的化学药品，硅的 纯度也随着这个过程而进一步被提高。 • 最后生成多晶硅的硅锭。
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• 对于不同层次的光阻移除， 采用的等离子体是不一样的。
• 例如：硅、硅化物、金属导 线等等。
• 另外，在去除光阻止后，通 常还需要有一步清洗，以保 证晶园表面的洁净度。
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2.7 金属蚀刻
• Metal Etch • 金属蚀刻用于制作芯片中的金属导线。 • 导线的形状由Photo制作出来。 • 这部分工作也使用等离子体完成。
cmosflow
Boron (+) Ions
Photoresist
N Well
-
P Well
Completed Shallow Trenches - Layout View:
Cross Section
Bare Silicon
Trench Oxide
Fall 2004
Semitec 181 Introduction to Microfabrication
Jozwiak
Basic CMOS Process Flow - Well Formation
Etch Nitride and Pad Oxide: A reactive ion etch (RIE) utilizing fluorine chemistry is used.
Photoresist Silicon Nitride
Silicon Epi Layer P
-
Silicon Substrate P+ Fall 2004 Semitec 181 Introduction to Microfabrication Jozwiak
~725 microns
Silicon Substrate P+ Fall 2004 Semitec 181 Introduction to Microfabrication Jozwiak
Basic CMOS Process Flow - Shallow Trench Formation
爱乐高ACS706ELC-05C双向1.5mΩ霍尔效应线性电流传感器IC电路使用手册说明书
NOTE: For detailed information on purchasing options, contact your local Allegro field applications engineer or sales representative.Allegro MicroSystems, Inc. reserves the right to make, from time to time, revisions to the anticipated product life cycle plan for a product to accommodate changes in production capabilities, alternative product availabilities, or market demand. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no respon-sibility for its use; nor for any infringements of patents or other rights of third parties which may result from its use.Recommended Substitutions:For existing customer transition, and for new customers or new appli-cations, refer to the ACS712.Bidirectional 1.5 mΩ Hall Effect Based Linear Current Sensor ICwith V oltage Isolation and 15 A Dynamic RangeACS706ELC-05CDate of status change: December 26, 2006These parts are in production but have been determined to beNOT FOR NEW DESIGN. This classification indicates that sale of this device is currently restricted to existing customer applications. The device should not be purchased for new design applications because obsolescence in the near future is probable. Samples are no longer available.Not for New DesignFeatures and Benefits• Small footprint, low-profile SOIC8 package• 1.5 m Ω internal conductor resistance• 1600 V RMS minimum isolation voltage between pins 1-4 and 5-8• 4.5 to 5.5 V, single supply operation • 50 kHz bandwidth• 133 mV/A output sensitivity and 15 A dynamic range • Output voltage proportional to ac and dc currents • Factory-trimmed for accuracy• Extremely stable output offset voltage • Near-zero magnetic hysteresis• Ratiometric output from supply voltageThe Allegro ACS706 family of current sensor ICs provides economical and precise solutions for current sensing in industrial, automotive, commercial, and communications systems. The device package allows for easy implementation by the customer. Typical applications include motor control, load detection and management, switch-mode power supplies, and overcurrent fault protection.The device consists of a precision, low-offset linear Hall circuit with a copper conduction path located near the surface of the die. Applied current flowing through this copper conduction path generates a magnetic field which the Hall IC converts into a proportional voltage. Device accuracy is optimized through the close proximity of the magnetic signal to the Hall transducer. A precise, proportional voltage is provided by the low-offset, chopper-stabilized BiCMOS Hall IC, which is programmed for accuracy at the factory.The output of the device has a positive slope (>V CC / 2) when an increasing current flows through the primary copper conduction path (from pins 1 and 2, to pins 3 and 4), which is the path used for current sampling. The internal resistance of this conductive path is typically 1.5 m Ω, providing low power loss. The thickness of the copper conductor allows survival of the device at up to 5× overcurrent conditions. The terminals of the conductive path are electrically isolated from the signal leads (pins 5 through 8). This allows the ACS706 to be used in applications requiring electrical isolation without the use of opto-isolators or other costly isolation techniques.The ACS706 is provided in a small, surface mount SOIC8 package. The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes. Internally, the flip-chip uses high-temperature Pb-based solder balls, currently exempt from RoHS. The device is fully calibrated prior to shipment from the factory.Use the following complete part number when ordering:Part NumberPackageACS706ELC-05CSOIC8 surface mountTÜV AmericaCertificate Number:U8V 04 12 54214 005AB S O L UTE MAX I M UM RAT I NGSSupply V oltage, V CC ..........................................16 V Reverse Supply V oltage, V RCC ........................–16 V Output V oltage, V OUT ........................................16 V Reverse Output V oltage, V ROUT ......................–0.1 V Output Current Source, I OUT(Source) ................. 3 mA Output Current Sink, I OUT(Sink) .......................10 mA Maximum Transient Sensed Current *, I R(max) ...100 A Operating Temperature, Maximum Junction, T J(max).......................165°C Storage Temperature, T S ......................–65 to 170°C*Junction Temperature, T J < TJ(max).*100 total pulses, 250 ms duration each, applied at a rate of1 pulse every 100 seconds.Nominal Operating Temperature, T A Range E ............................................–40 to 85ºC Overcurrent Transient Tolerance*, I P ................60 ABidirectional 1.5 m Ω Hall Effect Based Linear Current Sensorwith Voltage Isolation and 15 A Dynamic RangePackage LCPin 1: IP+Pin 2: IP+Pin 3: IP–Pin 4: IP–Pin 8: VCC Pin 7: VOUTPin 6: N.C.Pin 5: GNDPins 6 and 7 are internally connected in shipping product. For compatibility with future devices, leave pin 6 floating.Functional Block Diagram0.1 μFPERFORMANCE CHARACTERISTICS, over operating ambient temperature range, unless otherwise specifiedPropagation Time t PROP I P =±5 A, T A = 25°C– 3.15–μs Response Time t RESPONSE I P =±5 A, T A = 25°C–6–μs Rise Time t r I P =±5 A, T A = 25°C–7.45–μs Frequency Bandwidth f–3 dB, T A = 25°C; I P is 10 A peak-to-peak; no external filter–50–kHzSensitivity Sens Over full range of I P , I P applied for 5 ms; T A = 25°C–133–mV/A Over full range of I P , I P applied for 5 ms124–142mV/ANoise V NOISE Peak-to-peak, T A = 25°C, no external filter–90–mV Root Mean Square, T A = 25°C, no external filter–16–mVLinearity E LIN Over full range of I P , I P applied for 5 ms–±1±4.7% Symmetry E SYM Over full range of I P , I P applied for 5 ms98100104.5% Zero Current Output Voltage V OUT(Q)I P = 0 A, T A = 25°C–V CC / 2–VElectrical Offset Voltage V OE I P = 0 A, T A = 25°C–15–15mV I P = 0 A–65–65mVMagnetic Offset Error I ERROM I P = 0 A, after excursion of 5 A–±0.01±0.05ATotal Output Error1E TOT I P =±5 A, I P applied for 5 ms;T A = 25°C–±1.5–% I P = ±5 A, I P applied for 5 ms––±12.5%Characteristic Symbol Test Conditions Min.Typ.Max.Units ELECTRICAL CHARACTERISTICS, over operating ambient temperature range unless otherwise specifiedOptimized Accuracy Range I P–5–5A Linear Sensing Range I R–15–15A Supply Voltage V CC 4.5 5.0 5.5V Supply Current I CC V CC = 5.0 V, output open5810mA Output Resistance R OUT I OUT = 1.2 mA–12ΩOutput Capacitance Load C LOAD VOUT to GND––10nF Output Resistive Load R LOAD VOUT to GND 4.7––kΩPrimary Conductor Resistance R PRIMARY T A = 25°C– 1.5–mΩRMS Isolation Voltage V ISORMS Pins 1-4 and 5-8; 60 Hz, 1 minute16002500–V DC Isolation Voltage V ISODC–5000–V OPERATING CHARACTERISTICSTHERMAL CHARACTERISTICS2,3, T A = –40°C to 125°C, V CC = 5 V unless otherwise specified–Value–UnitsJunction-to-Lead Thermal Resistance RθJLMounted on the Allegro ASEK 70x evaluation board; additionalinformation about reference boards and tests is available on theAllegro Web site–5–°C/WJunction-to-Ambient Thermal Resistance RθJAMounted on the Allegro ASEK 70x evaluation board; additionalinformation about reference boards and tests is available on theAllegro Web site–41–°C/W1Percentage of I P, with I P = 5 A. Output filtered. Up to a 2.0% shift in E TOT may be observed at end-of-life for this device.2 The Allegro evaluation board has 1500 mm2 of 2 oz. copper on each side, connected to pins 1 and 2, and to pins3 and 4, with thermal vias connect-ing the layers. Performance values include the power consumed by the PWB. Further details on the board are available from the ACS704 Frequently Asked Questions document on our website. Further information about board design and thermal performance also can be found on pages 16 and 17 of this datasheet.3RθJA values shown in this table are typical values, measured on the Allegro evaluation board. The actual thermal performance depends on the board design, the airflow in the system, and thermal interactions between the device and surrounding components through the PCB and the ambient air. To improve thermal performance, see our applications material on the Allegro Web site.Typical Performance Characteristics-50-25255075100125150Supply Current versus Ambient TemperatureV CC = 5 VT A (°C)I C C (m A )4.54.64.74.84.95 5.15.25.35.45.5V CC (V)I C C (m A )8.008.058.108.158.208.258.308.358.408.458.50Supply Current versus Applied VCC11.01.52.02.53.03.54.0-9-8-7-6-5-4-3-2-10123456789V O U T (V )Output Voltage versus Primary CurrentV CC = 5 VI P (A)110115120125130135140145150160S e n s (m V /A )-9-8-7-6-5-4-3-2-1123456789I P (A)Sensitivity versus Primary CurrentV CC = 5 V-50-250255075100125150V O U T (Q ) (V )2.4702.5802.4902.5002.5102.5202.530Zero Current Output Voltage vs. Ambient TemperatureT A (°C)I P = 0 AZero Current Output Currrent versus Ambient Temperature(Data in above chart converted to amperes)I V O U T (Q ) (A )–0.3–0.2–0.10.10.20.3–50–25255075100125150T A (°C)V O M (m A )-1.0-0.8-0.6-0.4-0.200.20.40.60.81.0-50-25255075150100125T A (°C)Magnetic Offset Error versus Ambient TemperatureV CC = 5 V; I P= 0 A, after excursion to 5 A-50-25255075150100125T A (°C)00.51.01.52.02.53.0E L I N (%)Nonlinearity versus Ambient TemperatureV CC = 5 V I P= 5 ATypical Peak-to-Peak Noise of ACS706ELC-05C at T A =25°CStep Response of ACS706ELC-05C at T A =25°CACS706 Output (mV)5 A Excitation SignalTime = 10 μs/div.Excitation signal = 1.00 A/div.Output = 100 mV/div.Time = 20 μs/div.Noise = 20.0 mV/div.ACS706ELC-05C Noise Filtering and Frequency Response Performance Break Frequencyof Filter on Output(kHz)Resistance,R F (kΩ)Capacitance,C F (μF)NominalProgrammedSensitivity(mV/A)FilteredPeak-to-Peak Noise(mV)Resolutionwith Filtering(A)Rise Timefor 5A Step,Filtered(μs)Unfiltered––133 900.6777.45800.2000.01 75.90.5718.26500.32064.70.48610.08 400.39260.30.45311.39 200.80043.30.32617.56 10 1.628.90.21831.96 7.0 3.1518.30.13754.55 3.3 4.813.80.10481.77 0.626 1.90.015404.16 0.3530.760.00573732.89OUTTypical Application DrawingThe ACS706 outputs an analog signal, V Sig. that varies linearly with the bidirectional primarysensed current, I P, within the range specified. R F and C F, are recommended for noise management,with values that depend on the application, as shown in the noise filtering table.Sensitivity (Sens). The change in device output in response to a 1 A change through the primary conductor. The sensitivity is the prod-uct of the magnetic circuit sensitivity (G / A ) and the linear IC amplifier gain (mV/G). The linear IC amplifier gain is programmed at the factory to optimize the sensitivity (mV/A) for the full-scale current of the device.Noise (V NOISE ). The product of the linear IC amplifier gain (mV/G) and the noise floor for the Allegro Hall effect linear IC (≈1 G). The noise floor is derived from the thermal and shot noise observed in Hall elements. Dividing the noise (mV) by the sensitivity (mV/A) provides the smallest current that the device is able to resolve.Linearity (E LIN ): The degree to which the voltage output from the device varies in direct proportion to the primary current through its full-scale amplitude. Nonlinearity in the output can be attributed to the saturation of the flux concentrator approaching the full-scale current. The following equation is used to derive the linearity:Definitions of Accuracy Characteristics1001– [{[{V out_full-scale amperes –V OUT(Q)()2 (V out_half-scale amperes –V OUT(Q))100where V out_full-scale amperes = the output voltage (V) when the sensed current approximates full-scale ±I P .Symmetry (E SYM ). The degree to which the absolute voltage output from the device varies in proportion to either a positive or nega-tive full-scale primary current. The following formula is used to derive symmetry:Quiescent output voltage (V OUT(Q)). The output of the device when the primary current is zero. For a unipolar supply voltage, it nominally remains at V CC ⁄ 2. Thus, V CC = 5 V translates into V OUT(Q) = 2.5 V . Variation in V OUT(Q) can be attributed to the resolution of the Allegro linear IC quiescent voltage trim and thermal drift.Electrical offset voltage (V OE ). The deviation of the device output from its ideal quiescent value of V CC / 2 due to nonmagnetic causes. To convert this voltage to amperes, divide by the device sensitivity, Sens.Accuracy (E TOT ). The accuracy represents the maximum deviation of the actual output from its ideal value. This is also known as the total ouput error. The accuracy is illustrated graphically in the Output V oltage versus Current chart on the following page.Accuracy is divided into four areas:∙ 0 A at 25°C. Accuracy at zero current flow at 25°C, without the effects of temperature.∙ 0 A over Δ temperature. Accuracy at zero current flow including temperature effects.∙ Full-scale current at 25°C. Accuracy at the full-scale current at 25°C, without the effects of temperature.∙ Full-scale current over Δ temperature. Accuracy at full-scale current flow including temperature effects.Ratiometry . The ratiometric feature means that its 0 A output, V OUT(Q), (nominally equal to V CC /2) and sensitivity, Sens, are propor-tional to its supply voltage, V CC . The following formula is used to derive the ratiometric change in 0 A output voltage, ∆V OUT(Q)RAT (%):100V IOUT(Q)VCC /V IOUT(Q)5VV CC /5 VThe ratiometric change in sensitivity, ∆Sens RAT (%), is defined as:100Sens VCC /Sens 5V V CC /5 V ‰Output voltage vs. current, illustrating device accuracy at 0 A and at full-scale currentDefinitions of Dynamic Response CharacteristicsPropagation delay (t PROP): The time required for the device output to reflect a change in the primary cur-rent signal. Propagation delay is attributed to inductive loading within the linear IC package, as well as in the inductive loop formed by the primary conductor geometry. Propagation delay can be considered as a fixed time offset and may be compensated.Response time (t RESPONSE): The time interval between a) when the primary current signal reaches 90% of its final value, and b) when the device reaches 90% of its output corresponding to the applied current.Rise time (t r): The time interval between a) when the device reaches 10% of its full scale value, and b) when it reaches 90% of its full scale value. The rise time to a step response is used to derive the bandwidth of the device, in which ƒ(–3 dB) = 0.35 / t r. Both t r and t RESPONSE are detrimentally affected by eddy current losses observed in the conductive IC ground plane.Device Branding Key (Two alternative styles are used)ACS706T ELC05C YYWWA ACS Allegro Current Sensor706Device family numberT Indicator of 100% matte tin leadframe platingE Operating ambient temperature range codeLC Package type designator05C Primary sensed currentYY Manufacturing date code: Calendar year (last two digits) WW Manufacturing date code: Calendar weekA Manufacturing date code: Shift codeACS706T ELC05CL...L YYWWACS Allegro Current Sensor706Device family numberT Indicator of 100% matte tin leadframe platingE Operating ambient temperature range codeLC Package type designator05C Primary sensed currentL...L Manufacturing lot codeYY Manufacturing date code: Calendar year (last two digits)WW Manufacturing date code: Calendar week Standards and Physical SpecificationsParameter SpecificationFlammability (package molding compound)UL recognized to UL 94V-0Fire and Electric Shock UL60950-1:2003EN60950-1:2001CAN/CSA C22.2 No. 60950-1:2003Chopper Stabilization TechniqueChopper Stabilization is an innovative circuit technique that is used to minimize the offset voltage of a Hall element and an associated on-chip amplifier. Allegro patented a Chopper Stabilization technique that nearly eliminates Hall IC output drift induced by temperature or package stress effects. This offset reduction technique is based on a signal modulation-demodulation process. Modulation is used to separate the undesired dc offset signal from the magnetically induced signal in the frequency domain. Then, using a low-pass filter, the modu-lated dc offset is suppressed while the magnetically induced signal passes through the filter. As a result of this chopper stabilization approach, the output voltage from the Hall IC is desensitized to the effects of temperature and mechanical stress. This technique produces devices that have an extremely stable Electrical Offset V oltage, are immune to thermal stress, and have precise recoverability after temperature cycling.This technique is made possible through the use of a BiCMOS process that allows the use of low-offset and low-noise amplifiers in combination with high-density logic integration and sample and hold circuits.Concept of Chopper Stabilization TechniqueApplications InformationIn order to quantify transient common-mode voltage rejection for the ACS706, a device was soldered onto a printedcircuit board. A 0.1 μF bypass capacitor and a 5 V dc power supply were connected between VCC and GND (pins 8 and5) for this device. A 10 k Ω load resistor and a 0.01 μF capacitor were connected in parallel between the VOUT pin andthe GND pin of the device (pins 7 and 5).A function generator was connected between the primary current conductor (pins 1 thru 4) and the GND pin ofthe device (pin 5). This function generator was configured to generate a 10 V peak (20 V peak-to-peak) sinewave between pins 1-4 and pin 5. Note that the sinusoidal stimulus was applied such that no electrical currentwould flow through the copper conductor composed of pins 1-4 of this device.The frequency of this sine wave was varied from 60 Hz to 5 MHz in discrete steps. At each frequency, thestatistics feature of an oscilloscope was used to measure the voltage variations (noise) on the ACS706 outputin mV (peak to peak). The noise was measured both before and after the application of the stimulus. Transientcommon-mode voltage rejection as a function of frequency is shown in the following figure.Transient Common-Mode Voltage Rejection in the ACS706(kHz)Frequency of 20 V Peak-to-Peak Stimulus –60–55–50–45–40–35–30Tr a nsi e ntR ej ect i o n(d B)The Effect of PCB Layout on ACS706 Thermal PerformanceEight different PC boards were fabricated to characterize the effect of PCB design on the operating junction temperature of the Hall-effect IC inside of the ACS706. These PC boards are shown in the figure below. 2 oz. Cu on one side of board 2 oz. Cu on both sides of board An ACS706 device was soldered on to each PCB for thermal testing. The results of the testing are shown in the following table.Test Results on Eight Thermal Characterization PCBsTested at 15A, T A = 20°C, still air, 2 oz. copper traces, current carried on and off boardby 14 gauge wiresPC BoardsSides with Traces Trace Width (mm)Trace Length (mm)Temperature Rise Above Ambient (°C)1 450901.550Overheated 410481.5101102450531.550106410381.51054Improved PC Board DesignsThe eight PC boards in the figure above do not represent an ideal PC board for use with the ACS706. The ACS706 evaluation boards, for sale at the Allegro Web site On-Line Store, represent a more optimal PC board design (see photo below). On the evaluation boards, the current to be sensed flows through very wide traces that were fabricated using 2 layers of 2 oz. copper. Thermal management tests were conducted on the Allegro evaluation boards and all tests were performed using the same test conditions described in the bulleted list above. The results for these thermal tests are shown in the table below. When using the Allegro evaluation boards we see that even at an applied current of 20 A the junction temperature of the ACS706 is only ≈30 degrees above ambient temperature.Test Results on Eight Electrical Characterization PCBsTested at T A = 20°C, still airApplied Current(A)Temp Rise Above Ambient( C)1522 2031Allegro Current sensor IC evaluation board with ACS706 and external connections.The products described herein are manufactured under one or more of the following U.S. patents: 5,045,920; 5,264,783; 5,442,283; 5,389,889; 5,581,179; 5,517,112; 5,619,137; 5,621,319; 5,650,719; 5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pending.Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de p ar t ures from the detail spec i f i c a t ions as may be required topermit improvements in the per f or m ance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current.Allegro products are not authorized for use as critical components in life-support devices or sys t ems without express written approval.The in f or m a t ion in c lud e d herein is believed to be ac c u r ate and reliable. How e v e r, Allegro MicroSystems, Inc. assumes no re s pon s i b il i t y for its use; nor for any in f ringe m ent of patents or other rights of third parties which may result from its use.Copyright©2005, 2006 Allegro MicroSystems, Inc.Package LC, 8-pin SOICPreliminary dimensions, for reference onlyDimensions in millimetersU.S. Customary dimensions (in.) in brackets, for reference only(reference JEDEC MS-012 AA)Dimensions exclusive of mold flash, gate burrs, and dambar protrusionsExact case and lead configuration at supplier discretion within limits shownA Terminal #1 mark area。
电子信息工程专业英语教程_第5版 题库
《电子信息工程专业英语教程(第5版)》题库Section A 术语互译 (1)Section B 段落翻译 (5)Section C阅读理解素材 (12)C.1 History of Tablets (12)C.2 A Brief History of satellite communication (13)C.3 Smartphones (14)C.4 Analog, Digital and HDTV (14)C.5 SoC (15)Section A 术语互译Section B 段落翻译Section C阅读理解素材C.1 History of TabletsThe idea of the tablet computer isn't new. Back in 1968, a computer scientist named Alan Kay proposed that with advances in flat-panel display technology, user interfaces, miniaturization of computer components and some experimental work in WiFi technology, you could develop an all-in-one computing device. He developed the idea further, suggesting that such a device would be perfect as an educational tool for schoolchildren. In 1972, he published a paper about the device and called it the Dynabook.The sketches of the Dynabook show a device very similar to the tablet computers we have today, with a couple of exceptions. The Dynabook had both a screen and a keyboard all on the same plane. But Key's vision went even further. He predicted that with the right touch-screen technology, you could do away with the physical keyboard and display a virtual keyboard in any configuration on the screen itself.Key was ahead of his time. It would take nearly four decades before a tablet similar to the one he imagined took the public by storm. But that doesn't mean there were no tablet computers on the market between the Dynabook concept and Apple's famed iPad.One early tablet was the GRiDPad. First produced in 1989, the GRiDPad included a monochromatic capacitance touch screen and a wired stylus. It weighed just under 5 pounds (2.26 kilograms). Compared to today's tablets, the GRiDPad was bulky and heavy, with a short battery life of only three hours. The man behind the GRiDPad was Jeff Hawkins, who later founded Palm.Other pen-based tablet computers followed but none received much support from the public. Apple first entered the tablet battlefield with the Newton, a device that's received equal amounts of love and ridicule over the years. Much of the criticism for the Newton focuses on its handwriting-recognition software.It really wasn't until Steve Jobs revealed the first iPad to an eager crowd that tablet computers became a viable consumer product. Today, companies like Apple, Google, Microsoft and HP are trying to predict consumer needs while designing the next generation of tablet devices.C.2 A Brief History of satellite communicationIn an article in Wireless World in 1945, Arthur C. Clarke proposed the idea of placing satellites in geostationary orbit around Earth such that three equally spaced satellites could provide worldwide coverage. However, it was not until 1957 that the Soviet Union launched the first satellite Sputnik 1, which was followed in early 1958 by the U.S. Army’s Explorer 1. Both Sputnik and Explorer transmitted telemetry information.The first communications satellite, the Signal Communicating Orbit Repeater Experiment (SCORE), was launched in 1958 by the U.S. Air Force. SCORE was a delayed-repeater satellite, which received signals from Earth at 150 MHz and stored them on tape for later retransmission. A further experimental communication satellite, Echo 1, was launched on August 12, 1960 and placed into inclined orbit at about 1500 km above Earth. Echo 1 was an aluminized plastic balloon with a diameter of 30 m and a weight of 75.3 kg. Echo 1 successfully demonstrated the first two-way voice communications by satellite.On October 4, 1960, the U.S. Department of Defense launched Courier into an elliptical orbit between 956 and 1240 km, with a period of 107 min. Although Courier lasted only 17 days, it was used for real-time voice, data, and facsimile transmission. The satellite also had five tape recorders onboard; four were used for delayed repetition of digital information, and the other for delayed repetition of analog messages.Direct-repeated satellite transmission began with the launch of Telstar I on July 10, 1962. Telstar I was an 87-cm, 80-kg sphere placed in low-Earth orbit between 960 and 6140 km, with an orbital period of 158 min. Telstar I was the first satellite to be able to transmit and receive simultaneously and was used for experimental telephone, image, and television transmission. However, on February 21, 1963, Telstar I suffered damage caused by the newly discovered Van Allen belts.Telstar II was made more radiation resistant and was launched on May 7, 1963. Telstar II was a straight repeater with a 6.5-GHz uplink and a 4.1-GHz downlink. The satellite power amplifier used a specially developed 2-W traveling wave tube. Along with its other capabilities, the broadband amplifier was able to relay color TV transmissions. The first successful trans-Atlantic transmission of video was accomplished with Telstar II , which also incorporated radiation measurements and experiments that exposed semiconductor components to space radiation.The first satellites placed in geostationary orbit were the synchronous communication (SYNCOM ) satellites launched by NASA in 1963. SYNCOM I failed on injection into orbit. However, SYNCOM II was successfully launched on July 26, 1964 and provided telephone, teletype, and facsimile transmission. SYNCOM III was launched on August 19, 1964 and transmitted TV pictures from the Tokyo Olympics. The International Telecommunications by Satellite (INTELSAT) consortium was founded in July 1964 with the charter to design, construct, establish, and maintain the operation of a global commercial communications system on a nondiscriminatory basis. The INTELSAT network started with the launch on April 6, 1965, of INTELSAT I, also called Early Bird. On June 28, 1965, INTELSAT I began providing 240 commercial international telephone channels as well as TV transmission between the United States and Europe.In 1979, INMARSAT established a third global system. In 1995, the INMARSAT name was changed to the International Mobile Satellite Organization to reflect the fact that the organization had evolved to become the only provider of global mobile satellite communications at sea, in the air, and on the land.Early telecommunication satellites were mainly used for long-distance continental and intercontinental broadband, narrowband, and TV transmission. With the advent of broadband optical fiber transmission, satellite services shifted focus to TV distribution, and to point-to-multipoint and very small aperture terminal (VSAT) applications. Satellite transmission is currently undergoing further significant growth with the introduction of mobile satellite systems for personal communications and fixed satellite systems for broadband data transmission.C.3 SmartphonesThink of a daily task, any daily task, and it's likely there's a specialized, pocket-sized device designed to help you accomplish it. You can get a separate, tiny and powerful machine to make phone calls, keep your calendar and address book, entertain you, play your music, give directions, take pictures, check your e-mail, and do countless other things. But how many pockets do you have? Handheld devices become as clunky as a room-sized supercomputer when you have to carry four of them around with you every day.A smartphone is one device that can take care of all of your handheld computing and communication needs in a single, small package. It's not so much a distinct class of products as it is a different set of standards for cell phones to live up to.Unlike many traditional cell phones, smartphones allow individual users to install, configure and run applications of their choosing. A smartphone offers the ability to conform the device to your particular way of doing things. Most standard cell-phone software offers only limited choices for re-configuration, forcing you to adapt to the way it's set up. On a standard phone, whether or not you like the built-in calendar application, you are stuck with it except for a few minor tweaks. If that phone were a smartphone, you could install any compatible calendar application you like.Here's a list of some of the things smartphones can do:•Send and receive mobile phone calls•Personal Information Management (PIM) including notes, calendar and to-do list•Communication with laptop or desktop computers•Data synchronization with applications like Microsoft Outlook•E-mail•Instant messaging•Applications such as word processing programs or video games•Play audio and video files in some standard formatsC.4 Analog, Digital and HDTVFor years, watching TV has involved analog signals and cathode ray tube (CRT) sets. The signal is made of continually varying radio waves that the TV translates into a picture and sound. An analog signal can reach a person's TV over the air, through a cable or via satellite. Digital signals, like the ones from DVD players, are converted to analog when played on traditional TVs.This system has worked pretty well for a long time, but it has some limitations:•Conventional CRT sets display around 480 visible lines of pixels. Broadcasters have been sending signals that work well with this resolution for years, and they can't fit enough resolution to fill a huge television into the analog signal.•Analog pictures are interlaced - a CRT's electron gun paints only half the lines for each pass down the screen. On some TVs, interlacing makes the picture flicker.•Converting video to analog format lowers its quality.United States broadcasting is currently changing to digital television (DTV). A digital signal transmits the information for video and sound as ones and zeros instead of as a wave. For over-the-air broadcasting, DTV will generally use the UHF portion of the radio spectrum with a 6 MHz bandwidth, just like analog TV signals do.DTV has several advantages:•The picture, even when displayed on a small TV, is better quality.• A digital signal can support a higher resolution, so the picture will still look good when shown on a larger TV screen.•The video can be progressive rather than interlaced - the screen shows the entire picture for every frame instead of every other line of pixels.•TV stations can broadcast several signals using the same bandwidth. This is called multicasting.•If broadcasters choose to, they can include interactive content or additional information with the DTV signal.•It can support high-definition (HDTV) broadcasts.DTV also has one really big disadvantage: Analog TVs can't decode and display digital signals. When analog broadcasting ends, you'll only be able to watch TV on your trusty old set if you have cable or satellite service transmitting analog signals or if you have a set-top digital converter.C.5 SoCThe semiconductor industry has continued to make impressive improvements in the achievable density of very large-scale integrated (VLSI) circuits. In order to keep pace with the levels of integration available, design engineers have developed new methodologies and techniques to manage the increased complexity inherent in these large chips. One such emerging methodology is system-on-chip (SoC) design, wherein predesigned and pre-verified blocks often called intellectual property (IP) blocks, IP cores, or virtual components are obtained from internal sources, or third parties, and combined on a single chip.These reusable IP cores may include embedded processors, memory blocks, interface blocks, analog blocks, and components that handle application specific processing functions. Corresponding software components are also provided in a reusable form and may include real-time operating systems and kernels, library functions, and device drivers.Large productivity gains can be achieved using this SoC/IP approach. In fact, rather than implementing each of these components separately, the role of the SoC designer is to integrate them onto a chip to implement complex functions in a relatively short amount of time.The integration process involves connecting the IP blocks to the communication network, implementing design-for-test (DFT) techniques and using methodologies to verify and validate the overall system-level design. Even larger productivity gains are possible if the system is architected as a platform in such as way that derivative designs can be generated quickly.In the past, the concept of SoC simply implied higher and higher levels of integration. That is, it was viewed as migrating a multichip system-on-board (SoB) to a single chip containing digital logic, memory, analog/mixed signal, and RF blocks. The primary drivers for this direction were the reduction of power, smaller form factor, and lower overall cost. It is important to recognize that integrating more and more functionality on a chip has always existed as a trend by virtue of Moore’s Law, which predicts that the number of transistors on a chip will double every 18-24 months. The challenge is to increase designer productivity to keep pace with Moore’s Law. Therefore, today’s notion of SoC is defined in terms of overall productivity gains through reusable design and integration of components.。
SiGe BiCMOS工艺集成技术研究
SiGe BiCMOS工艺集成技术研究李红征【摘要】SiGe（硅锗合金）BiCMOS工艺集成技术，是在制造电路结构中的双极晶体管时，在硅基区材料中加入一定含量的锗，形成应变硅异质结构晶体管，以改善双极晶体管特性的一种硅基工艺集成技术。
对硅锗合金BiCMOS工艺的核心器件——锗硅异质结双极晶体管SiGe HBT的关键工艺模块，包括收集区、基区、发射区和深槽隔离的器件结构与制作工艺进行了研究与探讨。
对常用的3种SiGe BiCMOS工艺集成技术BBGate工艺、BAGate工艺和BDGate工艺，进行了工艺集成技术难点与关键工艺方面的研究，并比较了各种工艺流程的优缺点及其适用范围。
%SiGe HBT, the essential device of SiGe BiCMOS technology, is introduced. The process modules of the formation of Collector, Base and Emitter of the SiGe HBT are introduced. Also 3 types of process flow, BBGate, BAGate, BDGate, applied in different SiGe BiCMOS technology nodes, are discussed. The paper reviews the process development and integration methodology, presents the device characteristics, and shows how the development and device selection were geared toward usage in mixed-signal IC development.【期刊名称】《电子与封装》【年(卷),期】2015(000)012【总页数】4页(P34-37)【关键词】硅锗合金;BiCMOS工艺;异质结双极晶体管;BBGate工艺;BAGate工艺;BDGate工艺【作者】李红征【作者单位】中国电子科技集团公司第58研究所，江苏无锡 214035【正文语种】中文【中图分类】TN305SiGe（硅锗合金）BiCMOS工艺集成技术，是在制造电路结构中的双极晶体管时，在硅基区材料中加入一定含量的锗，形成应变硅异质结构晶体管，以改善双极晶体管特性的一种硅基工艺集成技术。
cadence innovus 物理设计流程指南说明书
mmmc.tcl
Netlist files
Verilog gate-level netlist(s)
Gates from the standard cell library
Design can be hierarchical or flat
Tcl commands:
set design_netlisttype verilog
Generate Mask Data
IC Mask Data
Design Rule Check
Calibre
Backannotate Schematic
Calibre
Layout vs. Schematic
Check
Calibre
ADiT/Eldo Simulation Model
Netlist-to-layout design flow
Abstract view of each cell (box, pins, obstructions) Includes metal layers for pins (read tech. library first!)
Tcl command:
set init_lef_file { \ */techlef/v.20160204/lef/bicmos8hp_6AM_31_tech.lef \ */std_cell/v.20130404/lef/IBM_BICMOS8HP_SC_1P2V_12T_RVT_091712.lef \ }
For * insert /class/ELEC6250/cmos8hp
Setting up MMMC analysis
# Multi-Mode/Multi-Corner (MMMC) Analysis Setup # Configure 1-corner single-model MMMC
使用说明手册-hyt flow说明书
fluid TimeHYT was born of a question. Time flows and only gains meaning through content. So why limit its measurement to indicating the now in splendid isolation, with needle-sharp hands or fleeting digital displays?Determined that its rebellion should make statements and waves, a multi-disciplinary think-tank set out to create timepieces that visibly connect the past, present and future. The HYT answer is a watch that overcomes the force of gravity to indicate the passage of time with liquids. Highly advanced technology took its cue from philosophy to mirror time’s intrinsic fluidity.Grégory DourdeCEOGUaRaNTEEIn this manual, you can find the basic instructions for using and maintaining your watch.Each HYT watch bears an individual identification number, which guarantees both its authenticity, and that all the work involved in its creation has been supervised by a master watchmaker.Each HYT watch is equipped with a fluidic module1. This device enables the time to be displayed via the meniscus2. The meniscus marks the boundary between the two immiscible fluids in the capillary4. The watch movement drives the module via the bellows3 fixed on the main plate. Only a professional watchmaker approved by HYT can replace this fluidic system. It bears a unique serial number.The card you received when you purchased your watch is the electronic guarantee certificate for your HYT watch.The QR Code on the front of your card gives you access to your watch’s userguide and offers you the possibility to activate the guarantee. You must present your activated guarantee card to be entitled to the guarantee.Your HYT watch is guaranteed against all manufacturing defects for five years from the date it was purchased, if the watch was purchased from an approved HYT retailer. This guarantee does not however cover damage caused by incorrect handling or improper use of the watch.For any service, repair or maintenance procedure, please ensure you only use retailers approved by HYT or our customer services.Y ou can find the list of our network of approved retailers on our website .Any repair or maintenance work carried out by third parties who have not been approved by HYT will automatically void the guarantee. Any damage caused will then have to be repaired at your expense.PRECaUTIONS fOR USEYour HYT watch is set and ready to be worn.Time is displayed with two liquids. One is colored, the second one is transparent. One shows the elapsed time, while the other liquid illustrates a time yet to come. Their meeting point is a meniscus in the capillary 4, aka the now.Important : If you plan to not wear the watch fora while, the colored liquid has to be stored in itsown reservoir (on the left bellow 3).To do this, pull the crown out to position B(time setting). Allow the colored liquid to moveinto “Zone II” until it starts rewinding. Once therewinding phase is complete (colored liquid in“Zone I”), ensure that the crown remains in thetime setting position B. Your watch is now ready tobe stopped for an extended period.The capillary 4 is then filled with transparentliquid (it is possible to still see some coloredliquid in “Zone I”).Produced and tested to stringent criteria, the constituent components of your HYT watch together form an exceptionally water resistant unit. To ensure these qualities are preserved, we recommend that you have the gaskets replaced during a service at an authorized retailer. Temperature variations, moisture, perspiration or repeated impacts may adversely affect its water resistance over the years.With its water resistant case, your HYT watch is fully washable. It should be cleaned regularly in lukewarm, soapy water, rinsed and then carefully dried with a soft cloth. After exposure to sea water, rinse your HYT watch in fresh water.QUICk GUIDE wINDING SETTING ThE TImE p.7p.8p.9p.10p.11POwER RESERvEINDICaTOR p.12DISPlay ExamPlES GlOSSaRy p.6SETTING ThE TImECOUNTER ClOCkwISE p.11PUSh-bUTTON CROwNaCTIvaTING ThE lIGhT SySTEmGlOSSaRy1. Fluidic module:To create a liquid time indicator that is compact, and wearable, HYT has developed a completely new high-tech concept, using two flexible bellows at each end of a capillary tube. The system is sealed in accordance with the most stringent standards used in the aerospace industry, with each bellow containing immiscible liquids. The exclusive patented fluidic module represents this complete system.2. Meniscus:The two liquids are separated by their intrinsic repulsive properties. The meniscus marks the surface separating the liquids in the tube, indicating the time.3. Bellows:The bellows are the two reservoirs located at 6 o’clock. They are made of a highly resistant, flexible alloy four times finer than a human hair. The movement compresses the left-hand bellow which is emptied of its colored liquid. The other bellow then fills, and vice versa, moving the liquid within the capillary, and with it the meniscus which indicates the time.4. Capillary:This tube, made from the best quality glass as used in the medical industry, is circular in shape and contains two immiscible liquids. A surface treatment is applied to the inside of the capillary, which enables the two liquids to move smoothly without adhering to the glass.5. Rewind:When the colored liquid gets to 6 o’clock (Zone II), it switches to rewind mode, flowing back to its original position (Zone I).1QUICk GUIDE1. Time display (hours)2. Minutes hand3. Seconds display4. Crown settings Pos A.: windingPos B.: setting the time (pulled out)5. Power reserve indicator(65 hours)6. Light systema.: wind the crown to chargethe light systemb.: press the pusher to activatethe light systemwINDINGPos A.INTRODUCTIONThis function ensures that the power required to drive your watch is stored by the movement.HOW TO USE• Wind the watch by turning the crown clockwise “A”SETTING ThE TImEPos B.INTRODUCTIONThis function allows the time shown on your watch to be set using the crown.IMPORTANT• The microfluids in the capillary are moved via the smooth turning of the crown.• • This means it should take three manipulations distance equivalent to 1 hour.HOW TO USE•Pull out the crown to position “B”• minutes hand is at the time requiredREWIND • The automatic return of the colored liquid (rewind)5speed is higher when the rewind starts in II” and is minimal when the liquid approaches starting point in “Zone I”.It is possible to set your watch counter clockwise.warning: counter clockwise movement of the crown must be stopped when the colored liquid reaches “Zone I”.DISPlay TImEExamPlES2) 10:353) 5:501) 6:00POwER RESERvEINDICaTORINTRODUCTIONThe display uses a small hand on the dial which travels in an arc from the “full” indicator (thick) to the “empty” indicator (thin)HOW TO USEFull(65 hours of power reserve)•To ensure optimal operation of the watch, we recommend that you check it is fully wound (see WINDING).PUSh-bUTTON CROwNaCTIvaTING ThE lIGhT SySTEmINTRODUCTIONThis function activates the light system for your watch.HOW TO USE• Wind the push-button by turning the crown clockwise “A”•Press the push-button on the crown to activate the light system by converting mechanical power into light “B”.If the generator has been fully wound, the light system can be activated several times by pressing the push-button, or it can be activated continuously by pressing and holding the push-button until the generator is drained.。
Circuit Analysis Lecture 3
• And that
16
Power and Energy
• And we know that Current is the rate of flow of charge (C/s or Amps)
• Gives,
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Topic 2.10
POWER
18
Power
By direct substitution of Ohm’s law the equation for power can be obtained in two other forms:
IS1 = 6 A
IS2 = 4 A
IS = 10 A
RT
Same Polarity!
IS1 = 5 A
IS2 = 4 A
IS = 1 A
RT
Opposite Polarity!
13
Topic 2.9
POWER AND ENERGY
14
Power and Energy
• Power is an indication of how much work can be done in a specified time • Power is the rate of doing work • The rate at which energy is delivered
Vs 5 6 30V
RL experiences the same current flow (IL) and therefore the same voltage drop (VL) when connected between ‘a’ and ‘b’ in both circuits
RS is constant Note: the direction of the arrow and positive terminal indicate the direction of current flow.
闫贝翻译 脉动缓冲器工作原理要点
UNDERSTANDING HOW PULSATION ACCUMULATORS WORKJ. C. Wachel and S. M. PriceEngineering Dynamics IncorporatedSan Antonio, Texas脉动缓冲器工作原理J. C. Wachel and S. M. Price工程动力公司San Antonio, TexasABSTRACTPulsation accumulators are used in reciprocating pump installations to reduce pump manifold pulsations and to attenuate pulsations transmitted into the piping. The pump and piping system form a complex acoustical system which has many acoustical and mechanical frequencies and the potential for high vibration and component failure problems .Many times the pulsation characteristics of the system are not calculated prior to installation．and an accumulator is selected based on pressure and flow rate criteria．In some cases ,this is acceptable as can be attested by the numerous installations that are installed and have operated successfully without problems．However，many installations do experience high vibrations ,piping and component failures，cavitations in the suction manifold，and generally poor reliability．These problems are often the result of the failure to consider the system’s acoustical characteristics when selecting an accumulator.摘要在往复泵中使用缓冲器旨在消减泵的主管线脉动并减缓脉动在管道内的传播。
Platts cFlow 商品流分析：原油运输分析指南说明书
INTRODUCTIONPlatts cFlow Commodity Flow module enables daily, transparent analysis of waterborne movements of crude oil by volume around the world. It provides Platts informed views/projections of what is currently moving between supply and demand centres and enables users to identify and take advantage of potential shifts.In order to understand how Commodity Flow calculates volumesfor Crude Oil, it is important to understand how the underlyingdata is handled.As tankers are tracked a record of their port history is kept. When a tanker visits a port, Platts cFlow automatically allocates an activityto that port calling based on a combination of vessel, port and jetty characteristic data stored in Platts cFlow. For example, if a crude tanker were to visit Ras Tanura in Saudi Arabia, a crude export terminal, then Platts cFlow would assign this port calling a tag of ‘Loading’.All automatically assigned tags for vessel greater than 80,000 tons are reviewed by Platts Trade Flow Data team to verify the activity at each port is accurate and that a load/discharge did in fact occur.Platts cFlow then groups a vessel’s port callings into its constituent voyages; a voyage is defined as the arrival at the first load port to the departure at the final discharge port.Along with port callings, Platts cFlow maintains a record of various other historic data on vessels including their reported draught.Key assumptions:■■Crude ton to bbl conversion factor:a. default = 7.33b. where crude grade is available, an appropriate conversionfactor is applied (based on crude API)■■Tons per centimetre immersion (TPC) = calculated per vessel,reverting to an average based on vessel weight class (approximatedefault values below):1. Panamax - 652. Aframax - 873. Suezmax – 1084. VLCC - 162■■A full vessel ‘Loading’ or ‘Discharging’ event = 98%of total vessel capacity, or as calculated by draughtThe following methods work in sequence to establish the volume thatPlatts cFlow believes a vessel has loaded or discharged at a port. Fora given month, the calculated volumes represent a reliable proxy fortotal actual volume imported or exported for a country.How is total volume for a voyage calculated?1. Volume derived from draught changeThe algorithm will consider the total draught change across all loadand discharge port callings within a single voyage. By consideringtotal draught change for both the export and import legs of thevoyage, a reliable total volume loaded/discharged for that voyage canbe established, in combination with using the TPC value.[Draught Change] x [TPC] = TonsAt this point, if a sensible total volume for a voyage cannot becalculated using draught, the algorithm will discard it and progress tothe second method.2. Volume derived from capacity of vesselThe algorithm will default to using a volume equal to 98% of thetanker capacity as total volume for a voyage.How is the calculated volume for a voyage attributed toindividual ports?1. Draught change at each portThe algorithm will consider the draught change at each port,relative to the total draught change for the whole load/discharge legof the voyage.For example, if a tanker loads and its total calculated loaded volumeis 1,000,000 bbls, the volume might be attributed as follows:Port A - 60% total load draught change = 600,000 bblsPort B - 40% total load draught change = 400,000 bbls2. Pro-rata based on Trade Flow analyst tagsIf method 1 cannot be used, the algorithm will look to attributevolume based on the activity at each port, as reviewed by PlattsTrade Flow analyst team.If a vessel loads 1,000,000 barrels over two ports that have beenreviewed as loading, the volume would be pro-rated as follows:Port A - 50% of loading = 500,000 bblsPort B - 50% of loading = 500,000 bbls3. Pro-rata based on Platts cFlow port characteristicsIf method 2 cannot be used, the algorithm will look to attribute volumebased on the import/export characteristics of the ports within the voyage.The volume attribution is then the same as method 2.4. Pro-rata based on country characteristicsIf method 3 cannot be used, the algorithm will look to attributevolume based on the import/export characteristics of the countrieswithin the voyage.The volume attribution is then the same as method 2.FREQUENTLY ASKED QUESTIONSHow is the current month forward curve calculated?For the current month volumes are calculated by extrapolatingthe volume discharged/loaded up to the current day acrossthe remainder of the month, constrained by upper and lower bounds. Current month calculations also include vessels inboundto ports, driven by Platts cFlow iDestination algorithm.Can you include vessels inbound to Port X in forward-looking monthly data?The Commodity Flow forward-looking month volumes are drivenby Platts cFlow iDestination, and are included as inferred loads/ discharges that contribute to monthly totals.Why do future months show the same import/export total as the current month?Future month volumes are initially capped at the current month total volume while a prediction is not possible.The actual import/export volume based on iDestination is available in the call-out and will change regularly to reflect the current state of incoming volumes.The shipments in the drill-down for future months will reflect the volume stated in the call-out.What are the Red, Amber or Green indicators on the graph? Where a public benchmark is not available for a given month, Platts cFlow provides a ‘Confidence Score’ along with our data by way of a coloured indicator on the graph. Green – data reviewed by our analysts.Amber – data partly reviewed by our analysts.Red – data has not been sufficiently reviewed by our analysts.For the current forward-looking month, a weighting factor is alsoincluded to adjust our confidence relative to the days through themonth.Why are fixtures not included?Fixtures are often ambiguous in date and reference routes such as‘Persian Gulf – Japan’. In reality, a vessel may call at any number ofports in the Persian Gulf over the fixture period, making associationsto specific port callings unreliable.My tanker loaded 1,700,000 bbls but Platts cFlow reports1,300,000 bbls. Why?Variance on a vessel-to-vessel basis is expected. Volumes areindicative estimates only and, overall, provide a reliable monthly total.It is possible to export Platts cFlow data for external review shouldyou wish to supplement it with your own.Country X exports crude oil by pipeline/truck also, how doesthis factor in to Platts cFlow volumetric reporting?Pipeline/truck/other volumes are excluded from Platts cFlowCommodity Flow data.Where available, data from reputable public sources (includinggovernment bodies, producers and operators) that enables the displayof waterborne-only data is used as a benchmark (e.g. China GAC).JODI does not provide a breakdown of crude data by waterborne,pipeline or otherwise as it does for LNG as is assumed to be totalvolume where displayed.I have noticed that historic data for both Platts cFlow and theJODI is occasionally retrospectively adjusted – why is this?Platts cFlow data is constantly under review by our analysts and is presentedas-is. Accompanied by a rationale and confidence scoring system, we aimto give the highest level of transparency possible in how a calculated import/export volume has been arrived at. JODI also occasionally reviews theirpublished figures as government bodies provide confirmed data.How are you using official published import/export statistics inyour algorithms?Official data is displayed in Platts cFlow only to serve as acomparison; it is not otherwise incorporated into Platts cFlow dataand does not form part of the algorithm. Platts cFlow monthly totalsare derived purely from cFlow data using our algorithm.Why don’t you have import and export figures for more countries?Before Platts cFlow data for a country is added to the Commodity Flowmodule, a large amount of analysis is carried out by our dedicatedTrade Flow team to ensure that Platts cFlow provides the best qualitydata possible. This process takes time and, as such, there is a delaybetween requests for new data and its addition to the system.We are working to add data for more countries on an on-going basis.What are the next countries that you will be adding to the tool?We value and encourage user feedback. Please contact us with thedata you need to see next in Commodity Flow.Contact:For further clarification around our methodology email us at:**************************.IMPORTS / EXPORTSCountry Export Import Official Stats Source Last Published Official Stats Platts Analysis Confidence Score Algeria Yes JODI Feb ModerateAngola Yes JODI Feb GoodAustralia Yes JODI Feb ModerateBrazil Yes JODI Feb ModerateBulgaria Yes JODI Feb ModerateCameroon Yes ModerateChina Yes General Administration of Customs (China)Feb GoodColombia Yes JODI Dec GoodCongo, Democratic Republic of Yes LowCongo, Republic Yes ModerateCote d'Ivoire Yes LowDenmark Yes Yes JODI Feb ModerateEcuador Yes JODI Feb GoodEquatorial Guniea YesFinland Yes JODI Feb GoodFrance Yes JODI Feb GoodGabon Yes ModerateGhana Yes ModerateGreece Yes JODI Feb ModerateIndia Yes JODI Feb GoodIndonesia Yes Yes JODI Aug LowIran (Islamic Rep.)Yes JODI Jan ModerateIraq Yes State Organisation for Marketing of Oil (Iraq)Mar GoodIreland Yes JODI Feb GoodItaly Yes JODI Feb GoodJapan Yes Ministry of Economy, Trade and Industry (Japan)Mar GoodKuwait Yes JODI Feb GoodLibya Yes JODI March 2014ModerateLithuania Yes JODI Feb GoodMalaysia Yes JODI Dec LowMexico Yes JODI Feb GoodNew Zealand Yes JODI Feb GoodNigeria Yes JODI Feb GoodNorway Yes JODI Feb GoodOman Yes JODI Feb 2016GoodPhilippines Yes JODI Jan ModeratePoland Yes ModeratePortugal Yes JODI Feb ModerateQatar Yes JODI Feb ModerateRomania Yes JODI Feb GoodRussia Yes ModerateSaudi Arabia Yes JODI Feb GoodSingapore Yes JODI Feb LowSouth Africa Yes South African Revenue Services Mar ModerateSouth Korea Yes Korea Customs Services Mar GoodSpain Yes JODI Feb GoodSudan Yes ModerateSweden Yes JODI Feb GoodThailand Yes JODI Jan ModerateTrinidad and Tobago Yes JODI Dec ModerateTunisia Yes Yes JODI Jan ModerateTurkey Yes Yes JODI (Import)Feb ModerateUnited Arab Emirates Yes JODI Sept ModerateUnited Kingdom Yes Yes JODI Feb ModerateUnited States of America Yes ModerateVenezuela Yes JODI Aug Moderate。
制程服务注意事项说明
• 如有任何問題歡迎與張文旭先生聯絡 • E-Mail：.tw • TEL：(03)5773693 ext.176
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ESD.5E PO.W.1.MM CTM.R.2 M6T.E.2 M6T.C.1 M6T.E.3 M6T. I .1 M1.A.1 PO.R.1 T.3
• -->技術資料，下載dummy pattern cell， • File name :T035MMDP001E_V_1.gds.gz • -->技術文件，下載dummy pattern使用說明文件， • File name : T035MMDP001_V_1.pdf • 如有任何疑問,請與鄧宗維先生聯絡 • Tel: (03)5773693#229 • Email: .tw
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T13L & T13RF製程差異說明
• CIC所提供之T13L並非一般Pure Logic，而是指應用於Mixed-Signal的Process 。
• T13L相容於一般Pure Logic製程，且金屬厚度完全相同，並且提供MIM電容 。
• CIC所提供之T13L的標準操作電壓為1.2V/3.3V，T13RF則是1.2V/2.5V • T13RF的Top Metal厚度為3.3um，T13L僅0.9um，因此兩者在Design Rule方面
在特定區域大小內，Nominal Vt MOS 沒有定義Body端 for MOS
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CIC 學生以Hierarchical的方式並無法檢查出佈局中的AM.W.1.M5錯誤! 一般驗証時可以Hierarchical進行驗証，由於CIC只接受Flat方式的驗証 結果，故繳交佈局檔時請以Flat方式進行最後驗証!