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Integrated Dell Remote Access Controller 6 (iDRAC6

Integrated Dell™ Remote Access Controller 6 (iDRAC6) Enterprise for Blade Servers Version 2.2 用户指南注和小心本说明文件中的信息如有更改，恕不另行通知。

未经 Dell Inc. 书面许可，严禁以任何形式复制这些材料。

本文中使用的商标：Dell 、DELL 徽标、OpenManage 和 PowerEdge 是 Dell Inc. 的商标；Microsoft 、Windows 、Windows Server 、Internet Explorer 、MS-DOS 、Windows Vista 、ActiveX 和 Active Directory 是 Microsoft Corporation 在美国和/或其它国家/地区的商标或注册商标；Red Hat 和 Red Hat Enterprise Linux 是 Red Hat, Inc. 在美国和其它国家/地区的注册商标；Novell 和 SUSE 是 Novell, Inc. 在美国和其它国家/地区的注册商标；Intel 是 Intel Corporation 在美国和其它国家/地区的注册商标；UNIX 是 Open Group 在美国和其它国家/地区的注册商标；Thawte 是 Thawte 及其子公司和分支机构在美国和其它国家/地区的注册商标；VeriSign 是 VeriSign, Inc. 及其子公司在美国和其它国家/地区的注册商标；Sun 和 Java 是 Sun Microsystems, Inc. 或其子公司在美国和其它国家/地区的商标或注册商标。

版权 1998-2009 The OpenLDAP Foundation 。

无论修改与否，以源代码和二进制的形式重新分发或使用都必须经过 OpenLDAP Public License 的授权许可。

Integrated Dell Remote Access Controller 6 (iDRAC6

Integrated Dell™ Remote Access Controller 6 (iDRAC6) Enterprise for Blade Servers 版本 2.1 用户指南注和小心本说明文件中的信息如有更改，恕不另行通知。

未经 Dell Inc. 书面许可，严禁以任何形式复制这些材料。

本文中使用的商标：Dell 、DELL 徽标、Dell OpenManage 和 PowerEdge 是 Dell Inc. 的商标；Microsoft 、Windows 、Windows Server 、Internet Explorer 、MS-DOS 、Windows Vista 、ActiveX 和 Active Directory 是 Microsoft Corporation 在美国和/或其它国家/地区的商标或注册商标；Red Hat 和 Linux 是 Red Hat, Inc. 的注册商标；Novell 和 SUSE 是 Novell Corporation 的注册商标。

Intel 是 Intel Corporation 的注册商标；UNIX 是 The Open Group 在美国和其它国家/地区的注册商标。

版权 1998-2009 The OpenLDAP Foundation 。

无论修改与否，以源代码和二进制的形式重新分发或使用都必须经过 OpenLDAP Public License 的授权许可。

此许可证的副本包括在分发目录顶层中的 LICENSE 文件中，您也可以在 /license.html 中找到。

OpenLDAP 是 The OpenLDAP Foundation 的注册商标。

一些单独文件和/或附送软件包的版权可能归其它方所有，受其它条款的制约。

此软件根据 University of Michigan LDAP v3.3 分发版本开发出来。

2019年托福核心词汇：integrated什么意思(附翻译及例句)

2019年托福核心词汇：integrated什么意思(附翻译及例句)integrated英[ntgretd] 美[ntɡretd]adj.完整的;整体的;结合的;(各组成部分)和谐的v.使一体化( integrate的过去式和过去分词 );使整合;使完整;使结合成为整体综合;内建;一体的;完全的双语例句1 . He thinks we are living in a fully integrated, supportive society.他认为我们生活在一个完全和谐、相互扶持的社会里。

来自柯林斯例句2 . There is, he said, a lack of an integrated national transport policy.他指出，当前缺乏一个统一的全国交通运输政策。

来自柯林斯例句3 . We believe that pupils of integrated schools will have more tolerant attitudes.我们相信在取消种族隔离的学校就读的学生会有更宽容的态度。

来自柯林斯例句4 . This computer program can be integrated with existing programs.这套计算机程序能够与现有的程序整合在一起.来自《简明英汉词典》5 . They soon became fully integrated into the local community.他们很快就完全融入了当地人的圈子.来自《简明英汉词典》网络释义-integrated1 . 综合integratedcircuitintegrated完整 , 整体 , 综合circuit 电路 , 联盟 , 轮演系统的戏院 , 线路 , 巡回 , 巡回裁判 , 巡回裁判区.2 . 内建图文 2.内建 AC'97 Digital Audio controller integrated. 系统BIOS 1. 配备SoftMenu III功能,以软体程式取代传统调整DIP Switches来设定CPU 2.支持随插即用(Plug.3 . 一体的Dongguan Tianxing Technology Co . , Ltd. is a and development , production , sales and service for the integratedenterprise , honesty , innovation and quality to win customer's trust and support .东莞市天兴科技有限公司是集研发、生产、销售、服务为一体的企业，以诚信、创新和优质服务赢得客户的信任与支持。

多元集成电路的定义

多元集成电路的定义
多元集成电路（Multi-Million Gate Integrated Circuits）是一种复杂且高度集成的电子器件。

它由数百万个晶体管、电容器、电感器和其他电子元件组成，并以内部相互连接的方式工作。

多元集成电路在现代电子设备中发挥着至关重要的作用，包括计算机、通信设备、嵌入式系统和其他高级电子产品。

多元集成电路广泛应用于各个领域，如通信、控制、图像处理、信息存储、医疗设备和军事系统等。

其定义包含了两个关键特征：高复杂度和高度集成。

多元集成电路的高复杂度指的是它可以容纳数百万个晶体管或其他电子元件。

这种高度复杂的架构能够实现复杂的计算、处理、存储和传输功能。

复杂电路的设计和制造是一项巨大的挑战，需要高度精确的工艺和材料。

多元集成电路的高度集成指的是将数百万个元件封装在一块小小的芯片上。

这种紧凑的设计可以极大地提高电路的性能和效率，同时减少了物理空间的占用。

通过采用微细制造工艺和先进的封装技术，多元集成电路可以在一个小型芯片上实现惊人的计算和通信能力。

多元集成电路的不断发展和进步，推动了现代科技和社会的发展。

它为我们提供了无数的便利和机遇，改变了我们的生活方式和工作方式。

从个人电子设备到企业级服务，多元集成电路的定义确保了我们能够利用最新的技术创新来满足日益增长的需求。

Unit+3+Integrated+skills+课件+牛津译林版2020)高中英语选择性必修第三册

3. “use stories and interesting comparisons to describe historical figures or events vividly, thus engaging the reader’s interest”.
4. “Reading popular history books is certainly a fantastic way to introduce people to the basics of history”.
Checking your writing
Remember to check your writing after you finish and exchange drafts between you and your partner. Pay attention to the following aspects.
Listening
My favourite popular history book
Influence on me • The author has inspired me to (7) d_o_m__o_r_e_r_e_s_e_a_r_c_h_ on certain topics. • I am eager to (8) _r_e_a_d_u_p__o_n__h_is_t_o_r_y__.
matter to the ordinary reader”.
Reading
B Alan has found an article about popular history books. Read the
article and answer the following questions.

Xplore Integrated 图像和数据管理产品说明书

XploreIntegrated image and data management product to support your drug & biomarker r esearch & discovery programTissue diagnostics and biomarker analytics are the keystones of cancer discovery. However, delivering on the promise of personalized medicine requires multiple data sources to be integrated and analyzed. Management and analysis of large volumes of tissue samples are crucial to realizing the potential of personalized medicine. To accomplish this, imaging and pathology informatics support will be essential to moving forward in an increasingly complex and multifaceted medical research environment.With the power of machine learning and the power of big data management tools, researchers can integrate data from multiple sources, including digital pathology and tissue imaging, enhancing their ability to glean critical insights into disease and identify novel biomarkers.Need for a cutting edge tool that addresses the problems of a modern tissue research laboratoryDigitizing slides will not automatically result in faster and more efficient research and investigative studies. There are several problems that a research product needs to address if digital pathology is to prove an effective tool for drug and biomarker discovery studies.• High volume of images: Virtual Slides – high quality images produced using a scanner – are typically several gigabytes in size. In the past, sharing these image files with colleagues has proven problematic due to their size and the lack of IT infrastructure supporting fast sharing and viewing of these images. Integrating tissue image archives across centers encourages multisite collaboration.• Vendor neutrality: There are few standards in digital pathology imaging, with over a dozen major scanning vendors, each typically using their own proprietary image file format. Each type of scanner usually has its own ‘Viewer’ (digital microscope) to look at these virtual slides. Pathologists therefore may require training with multiple different viewers in order to review all slides.• Multi-modality data management: Collating and organizing data from multiple data sources brings its own challenges. Data may all be stored in different files and across various locations.Spreadsheets, CSV/TSV files, LIMS, and in-house databases and applications are incapable of managing the quantity and variety of data that needs to be captured as part of a typical study.• Image analytics integration: Image analysis tools can quantify and qualify tissue cells and cell structures in a rapid and consistent manner. However, a range of image analysis applications is available– from commercial vendors, as well as in-house and openXploreTechnology backgroundersolutions. Managing slides that are used in multiple applications and the data produced by their algorithms can be difficult, due to limited interoperability.• TMA management: Tissue microarrays (TMAs) provide the means for high-throughput analysis of multiple tissues and cells. The issues involved in collating, organizing and associating data with whole sections of tissue is multiplied with a TMA, as a single TMA slide may contain 200 cores, each potentially representing a different patient. A TMA study of a single 20x10 block, with five stains, three scoring criteria per stain and two reviewing pathologists will result in six thousand ‘scores’. Mapping these scores to different patients, comparing scores and results, and identifying trends across different cohorts will be time-consuming and prone to human error. Data mining tools, detailed in the next section, are required to solve the challenges of conducting large biomarker investigative studies.• Cross study data management: Given the range and volume of datamentioned in the points above, and the high quantity of slides thatmay be part of a typical study, the organizing slides in different ways,and maintaining a link with the aforementioned data, will provechallenging. Slides may need to be included as part of severalstudies. Studies may also be organized in many different ways.• Lab ecosystem: There are many different platforms and applicationsin a lab today and there is a need to ensure flexibility andinteroperability through and image management system that canprovide some context. Labs also have differing views on deploymentmethods for applications.Key design principles that allow a solution to these problemsTo address the problems listed above, Xplore was designed in conjunction with key opinion leaders from across the pathologyspectrum, to impact and accelerate tissue-centric discovery in drug and biomarker research. There are four key design principals that the solution adheres to.An Open solution, allowing institutions to use slides from multiple scanner vendors in a single Viewer, but also launch multiple image analysis vendors.A Flexible solution, providing institutions with tools to manage research the way you want, allowing you to design, organize, manage, search, and interrogate studies in a variety of ways.An Integrated solution, allowing institutions to store image, analytic data with slides both within and across studies, with search and datamining tools to help retrieve important data quickly.A Connected solution, bringing together researchers across an organization, across multiple sites and across geographies, amplifying the expertise of all those involved anywhere.Let us explore in detail how some of the issues highlighted earlier in the biomarker research process can be addressed through an effective tissue research product.View virtual slides in a single digital viewerOur Solution – the Xplore ViewerXplore supports all major scanning vendors in a single web-based viewer, thereby reducing training needs across multiple platforms. Both bright field and fluorescent slides are supported, in addition to z-stacking and multi-regions.Ve n dor Exte n sion Philips .isyntax / .tiffHamamatsu .ndpi / .ndpisLeica / Ariol .scnPerkin Elmer .qptiffAperio .svsVentana .bif / .tif / .svsZeiss .cziOlympus .vsiOmnyx .rtsSakura .svs3DHistec h .mrsxHuron .tif Mikroscan.svsTrestle .tifVendor Neutrality - Support for all major scanning vendorsXplore offers a range of tools that you would expect in a modern digital pathology viewer, including the following features,extremely important in a research setting, Annotation & Measuring tools, Split screen (Sync up to four whole slide images or TMA Cores), Fluorescent multi-channel image adjustments, Counting tools to assist validating image analysis algorithms, Screenshots and Z-Stack (switch between different planes).Manage and organize images and data in ascalable user centric mannerOur Solution – Flexible Folder, Study & Slide Management The Philips Xplore product can ingest thousands of images in seconds, provides a database for easily organizing Whole Slide Images (WSI’s), documents, image analysis and slide associated metadata within aflexible hierarchical structure. Users are assigned as owners of a particular study with permissions to share slides and data within and across teams of researchers.Xplore’s configurable study-based folder hierarchy makes a very flexible product for research. Xplore has no fixed study hierarchy,Xplore - Key design principlesallowing multi-disciplinary research.Slides can be included as part of multiple studies, without duplicating/multiplying the large file sizes on disk. Slides can also be added to a hierarchy of the researcher’s choosing, for example stain, body site, sample ID or case ID or principal investigator. Slides can therefore be better organized to meet the context/purpose of the study.Maintain metadata and third party dataOur Solution – Datasets, import, barcodes and documentsDatasets can be created with custom fields and metadata. Image analysis data can be uploaded into Xplore and easily searched or interrogated for biomarker evaluation, case selection and correlations.1D, 2D, Datamatrix support, allows metadata on the slide to be automatically added to the Xplore database on slide acquisition. Xplore also has an import facility, to associate additional information not included in the barcode with slides and studies using CSV or TSV files. Data can be uploaded against the slide name or by TMA core position/ID, or by information collected on the barcode, for example Sample ID.The document management system allows supporting research material, journals, publications and presentations to be stored alongside studies.Manage high volumes of slides, identify trends and outliers and create cohortsOur Solution – Precision SearchXplore’s Search engine allows user to identify cohorts, based on searching a range of data across folders and slides, or studies, slides, cores and scoring data in the case of TMA’s.Search across system generated fields, barcode metadata, clinical/image analysis data uploaded via CSV, and manual scoring data, to perform a deep and detailed analysis of any study managed in Xplore, and get a better understanding of how biomarkers are expressing themselves on different TMA cores, whole slides and therefore patients.Use the results of Search to create additional research studies; create charts from Search results to more easily spot trends and outliers; save for future use; or export data for use in other 3rd partyapplications.Conduct large biomarker investigative and evaluation studiesOur Solution – Comprehensive TMA moduleXplore’s TMA (Tissue Microarray) module is designed to speed up research studies that require manual scores of TMA cores, thereby helping evaluate new tissue biomarkers in TMAs quickly and ing scoring templates, map templates, and an automated TMA de-arrayer, TMA cores can be segmented, identified, and sent out for scoring. Patient information (managed through datasets), scoring criteria and the TMA Core tissue are available through a single interface. The TMA Core tissue is locked to the question(s) being asked upon it, so the user is unable to answer scoring questions on a TMA Core that is not visible on screen.Virtual TMAThe Virtual TMA module in Xplore allows selected cores from multiple recipient blocks to be combined in a single, score-able Virtual TMA Study.Given there are discrepancies or anomalies in the data that has been captured through image analysis or manual scoring,individual TMA Cores from one or more TMA Slides or TMA StudiesCross study data management - Example Folder & Study structures in XploreThe Xplore Search interface can build complex queries across multi-modality dataTMA Management - TMA Scoring interface in Xplorecan be segmented into a new, composite, ‘Virtual TMA’ study. This study can then be sent out again for scoring, but only providing the researcher with the TMA Cores that need to be scored, rather than the several hundred that may be on a single slide. This greatly increases the efficiency of getting selected TMA Cores re-scored.Easily identify trends and spot outliersOur solution – ChartsThe Charts tools in Xplore will help researchers and pathologists more easily quantify data, and help spot trends and outliers in Xplore. The results of a study or advanced search can be opened in a variety of charts. Tools for the researcher allow him or her to directly open the relevant data point to obtain a full breakdown of the data that has been captured against a whole slide or TMA core.By providing a charts and graphing facility within Xplore, the link with the virtual slide and therefore tissue is maintained. The process of matching a data point in a spreadsheet or other application with the original tissue can be extremely difficult, but Xplore allows the researcher to click a data point and open the tissue in the viewer within seconds.Integrate with multiple imageanalysis vendorsOur solution – Image Analysis agnosticXplore’s open product structure offers interoperability with offerings from third party image analysis vendors, such as Visiopharm OncoTopix. Xplore’s advanced search engine provides tools for cohort and training set selection, allowing researchers to launch slides and associated annotations in third party applications.Image analysis results can then be imported back into Xplore, providing a central repository for virtual slides, clinical, genomic and molecular data and image analysis results. As before, any data captured alongside the slide can be searched upon, allowing both image analysis and manual scoring data to be queried alongside patient information.Embed in the lab eco systemOur solution Flexible platform that integrates and brings together expertise Xplore embeds easily with a lab ecosystem through the use of current lab credential systems with a single sign on capability. Xplore supports both cloud and on premise deployments.Connect your team to a shared archiveOur solution – Web-based technology and advancedsystem architectureXplore enables knowledge sharing and expertise across multiple research studies and centres by providing tools for sharing studies with colleagues.Entire studies, or parts of a study, can be shared with one or more individuals. Different access levels can be provided, to allow for review of study results, or collaborative studies, in which multiple pathologists can score and annotate slides.What Next?Digitizing slides without providing tools to manage the images and associated data will not automatically lead to efficiencies in pathological research studies. Xplore sits at the center of a research pathology workflow. Xplore will continue to develop with the vision of becoming the centerpiece for pathology informatics and data integration across the spectrum of tissue-centricdiscovery.© 2020 Koninklijke Philips N.V.All rights are reserved. Reproduction or transmission in whole or in part, in any form or by any means, electronic, mechanical or otherwise, is prohibited without the prior written consent of the copyright owner.4522 207 41601 - January 2020Visit us on: /computationalpathology or /digitalpathologyScatter Chart in Xplore with clickable data-points linking to the Viewer to view the tissue in more detail。

集成电路专业英语

集成电路专业英语一、单词1. Integrated Circuit (IC)- 英语释义：A set of electronic circuits on one small flat piece (chip) of semiconductor material, typically silicon.- 用法：常作为名词短语使用，可在句中作主语、宾语等。

例如：The development of integrated circuits has revolutionized the electronics industry.（集成电路的发展使电子工业发生了革命性的变化。

）2. Semiconductor- 英语释义：A material which has a conductivity between that of an insulator and that of most metals, either due to the addition of an impurity or because of temperature effects.- 用法：作名词，例如：Silicon is a widely used semiconductor in integrated circuit manufacturing.（硅是集成电路制造中广泛使用的半导体。

）3. Transistor- 英语释义：A semiconductor device used to amplify or switch electronic signals and electrical power.- 用法：作名词，如：The transistor is a keyponent in integrated circuits.（晶体管是集成电路中的一个关键元件。

）4. Chip- 英语释义：A small piece of semiconducting material (usually silicon) on which an integrated circuit is fabricated.- 用法：作名词，可指集成电路芯片。

集成电路的英文integrated

集成电路的英文：integrated circuit简称:IC集成电路的定义IC就是半导体元件产品的统称。

包括：1.集成电路板(integrated circuit，缩写：IC)；2.二、三极管；3.特殊电子元件。

再广义些讲还涉及所有的电子元件，象电阻，电容，电路版/PCB版，等许多相关产品。

集成电路产业发展与变革自1958年美国德克萨斯仪器公司(TI)发明集成电路（IC）后，随着硅平面技术的发展，二十世纪六十年代先后发明了双极型和MOS型两种重要的集成电路，它标志着由电子管和晶体管制造电子整机的时代发生了量和质的飞跃，创造了一个前所未有的具有极强渗透力和旺盛生命力的新兴产业集成电路产业。

回顾集成电路的发展历程，我们可以看到，自发明集成电路至今40多年以来，"从电路集成到系统集成"这句话是对IC产品从小规模集成电路（SSI）到今天特大规模集成电路（ULSI）发展过程的最好总结，即整个集成电路产品的发展经历了从传统的板上系统（System-on-board）到片上系统（System-on-a -chip）的过程。

在这历史过程中，世界IC产业为适应技术的发展和市场的需求，其产业结构经历了三次变革。

第一次变革：以加工制造为主导的IC产业发展的初级阶段。

70年代，集成电路的主流产品是微处理器、存储器以及标准通用逻辑电路。

这一时期IC制造商（ID M）在IC市场中充当主要角色，IC设计只作为附属部门而存在。

这时的IC设计和半导体工艺密切相关。

IC设计主要以人工为主，CAD系统仅作为数据处理和图形编程之用。

IC产业仅处在以生产为导向的初级阶段。

第二次变革：Foundry公司与IC设计公司的崛起。

80年代，集成电路的主流产品为微处理器（MPU）、微控制器（MCU）及专用IC（ASIC）。

这时，无生产线的IC设计公司（Fabless）与标准工艺加工线（Foundry）相结合的方式开始成为集成电路产业发展的新模式。

Integrated Circuits集成电路(英汉翻译)

Integrated Circuits集成电路The Integrated CircuitDigital logic and electronic circuits derive their functionality from electronic switches called transistor. （数字逻辑和电子电路由称为晶体管的电子开关得到它们的（各种）功能。

）Roughly speaking, the transistor can be likened to an electronically controlled valve whereby ener gy applied to one connection of the valve enables energy to flow between two other connections .By combining multiple transistors, digital logic building blocks such as AND gates and flip-flops ar e formed. Transistors, in turn, are made from semiconductors. （粗略地说，晶体管好似一种电子控制阀，由此加在阀一端的能量可以使能量在另外两个连接端之间流动。

通过多个晶体管的组合就可以构成数字逻辑模块，如与门和触发电路等。

而晶体管是由半导体构成的。

）Consult a periodic table of elements in a college chemistry textbook, and you will locate semicon ductors as a group of elements separating the metals and nonmetals.They are called semiconduct ors because of their ability to behave as both metals and nonmetals.（查阅大学化学书中的元素周期表，你会查到半导体是介于金属与非金属之间的一类元素。

Integrated Home Comfort 专业级电热水器说明书

Performance Features• O n demand, consistent and continuous hot water • C ompact and stylish with digitaltemperature control in increments of 1° ranging from 80°F to 140°F*• R obust copper immersion heating elements with brass top increases durability and are threaded for easy replacement • S imple Installation • D igital temperature display • E xternal controls to adjust temperature in increments of 1°*Average GPM Usage by A pplicationAverage Gallons Per Minute (GPM) based on 2010 Plumbing StandardsINTEGRATED HOME COMFORTIN Professional Classic ® tankless electric water heaters offer continuous hot waterRTEX-08, RTEX-11, RTEX-13RTEX-04, RTEX-06Unique Features: • E xternal Adjustable Digital Thermostatic Control with LED display (+/- 1 degree accuracy)• D urable Copper Immersion two heating elements, field serviceable • S imple Installation – 1/2 NPT adapters included; Side 1/2" compression water connectionsUnique Features:•E xternal Digital Display – showsoutlet temperature • D urable Copper Immersion single heating element, field serviceable • S imple Installation – Bottom 1/2" NPT water connectionsRTEX-18Unique Features: • E xternal Digital Thermostatic Control with LED display (+/- 1 degree accuracy)• Most advanced self-modulation, adjust power to meet hot water demand • D urable Copper Immersion two heating elements, field serviceable • S imple Installation – Bottom 3/4" NPT water connections RTEX-24, RTEX-27Unique Features: • E xternal Digital Thermostatic Control with LED display (+/- 1 degree accuracy)• M ost advanced self-modulation, adjust power to meet hot water demand • D urable Copper Immersion three heating elements, field serviceable • S imple Installation – Bottom 3/4" NPT water connections Unique Features: • E xternal Digital Thermostatic Control with LED display (+/- 1 degree accuracy)• M ost advanced self-modulation, adjust power to meet hot water demand • D urable Copper Immersion four heating elements, field serviceable • S imple Installation – Bottom 3/4" NPT water connectionsRTEX-36*RTEX-04 and RTEX-06 only show output temperature and are non-thermostatically controlledTested and certified by the Water Quality Association against NSF/ANSI 372 for lead free compliance.Standard Hand Sink 0.5 GPM Washing Machine 1 to 1.5 GPMW ater-Saver Shower Head 1.5 GPM Dishwasher 1 to 2 GPM Kitchen Sink1 to2 GPM Standard Shower Head 2.0 GPM Bath Tub ≥ 4 GPM Whole-HomeUp to 6 GPMWarranty• 5-Year heating chamber and 1-year parts limited warrantySee Residential Warranty Certificate for complete informationRTEX-08, RTEX-11,RTEX-13RTEX-18RTEX-24, RTEX-27RTEX-36RTEX-04, RTEX-06POINT -OF-USEFor 0.5 GPM to 2.0 GPM ApplicationsMULTIPLE APPLICATIONSFor 0.5 GPM to 6.0 GPM Applications2 | 800.374.8806Manufacturers National Service Department 400 Captain Neville Drive, Waterbury, CT 06705INTEGRATED HOME COMFORTIN In keeping with its policy of continuous progress and product improvement, Rheem reserves the right to make changes without notice.Specifications* 240V units can be used on 208V single phase with 25% reduced temperature output. Please note per UL standards the rating plate and installation instructions will all be according to a240V applied voltage. Check with local officials prior to derating the electrical infrastructure.Rated Pressure 25 PSI min., 150 PSI max. Certifications ETL Listed to UL 499 and CSA Std. Temp. Settings 120°F (Adjustable 80°F-140°F) Temp. Accuracy +/–1° at steady flowTurn-On0.3 GPMProductSpecifications (all models)Suggested SpecificationsUnit shall have copper clad immersion heating element(s) with brassterminations for increased durability. External temperature control and display adjustable in 1° increments with a range of 80°-140°F . Display shall be capable of displaying setpoint temperature in Celsius or Fahrenheit temperature scales. Unit shall utilize a flow meter with a 0.3 gpm activation point and manage power based on actual flow rate and inlet temperature. Values should be processed 60 times per second. Unit shall be WQA certified lead free, certified to UL499 and CSA C22.2 No.64.。

Integrated skills

Words & expression review
plan social social worker ponytail shy n. 打算，计划 adj. 社会的 n. 社会工作者 n. 马尾辫 adj. 害羞的
1. come from Hong Kong 2. an actor（演员） 3. a singer 4. be good at Chinese Kung Fu（功夫）
Conclusion and memory test
1. make friends with sb. 2. listen to people carefully 3. help people with their problems 4. make people happy 4.让人们开心 5. travel around the world 5.环游世界 6. I would like to be a social 6.当我长大了,我想当一名社会工作者 worker when I grow up. 7.在所有的中国画家之中 7. among all the Chinese artists 8.艺术品 8. works of art 9.将来有一天 9. some day 10. next to 10.紧挨着 1.和某人交朋友 2.仔细倾听人们 3.帮助人们解决难题
Task : Sandy is talking to Kitty about her future plans.
What would Sandy like to be when she grows up?
She would like to be an artist when she grows up.
She’s shy and quiet.

托福Integrated Writing范文5篇(中英双语)

托福Integrated Writing范文5篇（中英双语）第一篇：以下是一篇关于太阳能能源的托福Integrated Writing范文，包括阅读材料、听力材料以及中英双语翻译：题目（Topic）：阅读材料介绍了太阳能能源的优点，而听力材料提出了一些关于太阳能发电的担忧。

总结阅读材料和听力材料的观点，然后解释担忧如何影响阅读中的观点。

阅读材料（Reading Passage）：英文：Solar energy is considered a renewable source of energy with several advantages. Firstly, it is environmentally friendly, reducing greenhouse gas emissions and contributing to climate change mitigation. Secondly, the cost of solar panels has been continuously decreasing, making solar energy more economically viable. Additionally, solar power systems have long-term maintenance benefits as they require fewer mechanical components.中文翻译：太阳能被认为是一种可再生能源，具有多个优点。

首先，它对环境友好，减少温室气体排放，有助于减缓气候变化。

其次，太阳能电池板的成本持续降低，使太阳能更具经济可行性。

此外，太阳能电力系统具有长期的维护优势，因为其需要较少的机械部件。

听力材料（Listening Passage）：英文：However, some concerns have been raised regarding solar power generation systems. It is argued that the manufacturing of solar panels may result in the emission of harmful chemicals, potentially causing adverse environmental effects. Moreover, solar panels have a limited lifespan and typically need replacement within a few decades. The recycling and disposal of these panels also raise concerns due to their hazardous components.中文翻译：然而，关于太阳能发电系统，一些担忧也被提出。

Integrated_Circuits(集成电路)电子信息类专业英语、计算机类专业英语文章

Integrated Circuits(集成电路)The Integrated CircuitDigital logic and electronic circuits derive their functionality from electronic switches called transistor. Roughly speaking, the transistor can be likened to an electronically controlled valve whereby energy applied to one connection of the valve enables energy to flow between two other connections.By combining multiple transistors, digital logic building blocks such as AND gates and flip-flops are formed. Transistors, in turn, are made from semiconductors. Consult a periodic table of elements in a college chemistry textbook, and you will locate semiconductors as a group of elements separating the metals and nonmetals.They are called semiconductors because of their ability to behave as both metals and nonmetals. A semiconductor can be made to conduct electricity like a metal or to insulate as a nonmetal does. These differing electrical properties can be accurately controlled by mixing the semiconductor with small amounts of other elements. This mixing is called doping. A semiconductor can be doped to contain more electrons (N-type) or fewer electrons (P-type). Examples of commonly used semiconductors are silicon and germanium. Phosphorous and boron are two elements that are used to dope N-type and P-type silicon, respectively.A transistor is constructed by creating a sandwich of differently doped semiconductor layers. The two most common types of transistors, the bipolar-junction transistor (BJT) and the field-effect transistor (FET) are schematically illustrated in Figure 2.1.This figure shows both the silicon structures of these elements and their graphical symbolic representation as would be seen in a circuit diagram. The BJT shown is an NPN transistor, because it is composed of a sandwich of N-P-N doped silicon. When a small current is injected into the base terminal, a larger current is enabled to flow from the collector to the emitter.The FET shown is an N-channel FET, which is composed of two N-type regions separated by a P-type substrate. When a voltage is applied to the insulated gate terminal, a current is enabled to flow from the drain to the source. It is called N-channel, because the gate voltage induces an N-channel within the substrate, enabling current to flow between the N-regions.Another basic semiconductor structure is a diode, which is formed simply by a junction of N-type and P-type silicon. Diodes act like one-way valves by conducting current only from P to N. Special diodes can be created that emit light when a voltage is applied. Appropriately enough, these components are called light emitting diodes, or LEDs. These small lights are manufactured by the millions and are found in diverse applications from telephones to traffic lights.The resulting small chip of semiconductor material on which a transistor or diode is fabricated can be encased in a small plastic package for protection against damage and contamination from the out-side world.Small wires are connected within this package between the semiconductor sandwich and pins that protrude from the package to make electrical contact with other parts of the intended circuit. Once you have several discrete transistors, digital logic can be built by directly wiring these components together. The circuit will function, but any substantial amount of digitallogic will be very bulky, because several transistors are required to implement each of the various types of logic gates.At the time of the invention of the transistor in 1947 by John Bardeen, Walter Brattain, and William Shockley, the only way to assemble multiple transistors into a single circuit was to buy separate discrete transistors and wire them together. In 1959, Jack Kilby and Robert Noyce independently invented a means of fabricating multiple transistors on a single slab of semiconductor material. Their invention would come to be known as the integrated circuit, or IC, which is the foundation of our modern computerized world. An IC is so called because it integrates multiple transistors and diodes onto the same small semiconductor chip. Instead of having to solder individual wires between discrete components, an IC contains many small components that are already wired together in the desired topology to form a circuit.A typical IC, without its plastic or ceramic package, is a square or rectangular silicon die measuring from 2 to 15 mm on an edge. Depending on the level of technology used to manufacture the IC, there may be anywhere from a dozen to tens of millions of individual transistors on this small chip. This amazing density of electronic components indicates that the transistors and the wires that connect them are extremely small in size. Dimensions on an IC are measured in units of micrometers, with one micrometer (1mm) being one millionth of a meter. To serve as a reference point, a human hair is roughly 100mm in diameter. Some modern ICs contain components and wires that are measured in increments as small as 0.1mm! Each year, researchers and engineers have been finding new ways to steadily reduce these feature sizes to pack more transistors into the same silicon area, as indicated in Figure 2.2.When an IC is designed and fabricated, it generally follows one of two main transistor technologies: bipolar or metal-oxide semiconductor (MOS). Bipolar processes create BJTs, whereas MOS processes create FETs. Bipolar logic was more common before the 1980s, but MOS technologies have since accounted the great majority of digital logic ICs. N-channel FETs are fabricated in an NMOS process, and P-channel FETs are fabricated in a PMOS process. In the 1980s, complementary-MOS, or CMOS, became the dominant process technology and remains so to this day. CMOS ICs incorporate both NMOS and PMOS transistors.Application Specific Integrated CircuitAn application-specific integrated circuit (ASIC) is an integrated circuit (IC) customized for a particular use, rather than intended for general-purpose use. For example, a chip designed solely to run a cell phone is an ASIC. In contrast, the 7400 series and 4000 series integrated circuits are logic building blocks that can be wired together for use in many different applications.As feature sizes have shrunk and design tools improved over the years, the maximum complexity (and hence functionality) possible in an ASIC has grown from 5,000 gates to over 100 million.Modern ASICs often include entire 32-bit processors, memory blocks including ROM, RAM, EEPROM, Flash and other large buildingblocks. Such an ASIC is often termed a SoC (System-on-Chip). Designers of digital ASICs use a hardware description language (HDL), such as Verilog or VHDL, to describe the functionality of ASICs.Field-programmable gate arrays (FPGA) are the modern day equivalent of 7400 series logic and a breadboard, containing programmable logic blocks and programmable interconnects that allow the same FPGA to be used in many different applications. For smaller designs and/or lower production volumes, FPGAs may be more cost effective than an ASIC design. The non-recurring engineering cost (the cost to setup the factory to produce a particular ASIC) can run into hundreds of thousands of dollars.The general term application specific integrated circuit includes FPGAs, but most designers use ASIC only for non-field programmable devices and make a distinction between ASIC and FPGAs.HistoryThe initial ASICs used gate array technology. Ferranti produced perhaps the first gate-array, the ULA (Uncommitted Logic Array), around 1980. Customization occurred by varying the metal interconnect mask. ULAs had complexities of up to a few thousand gates. Later versions became more generalized, with different base dies customized by both metal and polysilicon layers. Some base dies include RAM elements.Standard cell designIn the mid 1980s a designer would choose an ASIC manufacturer and implement their design using the design tools available from the manufacturer. While third party design tools were available, there was not an effective link from the third party design tools to the layout and actual semiconductor process performance characteristics of the various ASIC manufacturers.Most designers ended up using factory specific tools to complete the implementation of their designs. A solution to this problem that also yielded a much higher density device was the implementation of Standard Cells. Every ASIC manufacturer could create functional blocks with known electrical characteristics, such as propagation delay, capacitance and inductance; that could also be represented in third party tools.Standard cell design is the utilization of these functional blocks to achieve very high gate density and good electrical performance. Standard cell design fits between Gate Array and Full Custom design in terms of both its NRE (Non-Recurring Engineering) and recurring component cost.By the late 1980s, logic synthesis tools, such as Design Compiler, became available. Such tools could compile HDL descriptions into a gate-level netlist. This enabled a style of design called standard-cell design. Standard-cell Integrated Circuits (ICs) are designed in the following conceptual stages, although these stages overlap significantly in practice.These steps, implemented with a level of skill common in the industry, almost always produce a final device that correctly implements the original design, unless flaws are later introduced by the physical fabrication process.A team of design engineers starts with a non-formal understanding of the required functions for a new ASIC, usually derived from requirements analysis.*The design team constructs a description of an ASIC to achieve these goals using an HDL. This process is analogous to writing a computer program in a high-level language. This is usually called the RTL (register transfer level) design.*Suitability for purpose is verified by simulation. A virtual system created in software, using a tool such as Virtutech’s Simics, can simulate the performance of ASICs at speeds up to billions of simulated instructions per second.*A logic synthesis tool, such as Design Compiler, transforms the RTL design into a large collection of lower-level constructs called standard cells. These constructs are taken from a standard-cell library consisting of pre-characterized collections of gates such as 2 input nor, 2 input nand, inverters, etc.The standard cells are typically specific to the planned manufacturer of the ASIC. The resulting collection of standard cells, plus the needed electrical connections between them, is called a gate-level netlist.*The gate-level netlist is next processed by a placement tool which places the standard cells onto a region representing the final ASIC. It attempts to find a placement of the standard cells, subject to a variety of specified constraints. Sometimes advanced techniques such as simulated annealing are used to optimize placement.*The routing tool takes the physical placement of the standard cells and uses the netlist to create the electrical connections between them. Since the search space is large, this process will produce a “sufficient” rather than “glo bally-optimal” solution. The output is a set of photomasks enabling semiconductor fabrication to produce physical ICs.*Close estimates of final delays, parasitic resistances and capacitances, and power consumptions can then be made. In the case of a digital circuit, this will be further mapped into delay information. These estimates are used in a final round of testing. This testing demonstrates that the device will function correctly over all extremes of the process, voltage and temperature. When this testing is complete the photomask information is released for chip fabrication.These design steps (or flow) are also common to standard product design. The significant difference is that Standard Cell design uses the manufacturer’s cell libraries that have been used in hundreds of other design implementations and therefore are of much lower risk than full custom design.Gate array designGate array design is a manufacturing method in which the diffused layers, i.e. transistors and other active devices, are predefined and wafers containing such devices are held in stock prior to metallization, in other words, unconnected.The physical design process then defines the interconnections of the final device. It is important to the designer that minimal propagation delays can be achieved in ASICs versus the FPGA solutions available in the marketplace. Gate array ASIC is a compromise as mapping a given design onto what a manufacturer held as a stockwafer never gives 100% utilization.Pure, logic-only gate array design is rarely implemented by circuit designers today, replaced almost entirely by field programmable devices such as FPGAs, which can be programmed by the user and thus offer minimal tooling charges, marginally increased piece part cost and comparable performance.Today gate arrays are evolving into structured ASICs that consist of a large IP core like a processor, DSP unit, peripherals, standard interfaces, integrated memories SRAM, and a block of reconfigurable uncommitted logic.This shift is largely because ASIC devices are capable of integrating such large blocks of system functionality and “system on a chip” requires far more than just logic blocks.Full-custom designThe benefits of full-custom design usually include reduced area, performance improvements and also the ability to integrate analog components and other pre-designed components such as microprocessor cores that form a System-on-Chip. The disadvantages can include increased manufacturing and design time, increased non-recurring engineering costs, more complexity in the CAD system and a much higher skill requirement on the part of the design team.However for digital only designs, “standard-cell” libraries together with modern CAD systems can offer considerable performance/cost benefits with low risk. Automated layout tools are quick and easy to use and also offer the possibility to manually optimize any performance limiting aspect of the design.Structured designStructured ASIC design is an ambiguous expression, with different meanings in different contexts. This is a relatively new term in the industry, which is why there is some variation in its definition. However, the basic premise of a structured ASIC is that both manufacturing cycle time and design cycle time are reduced compared to cell-based ASIC by virtue of there being pre-defined metal layers and pre-characterization of what is on the silicon.One definition states that, in a structured ASIC design, the logic mask-layers of a device are predefined by the ASIC vendor (or in some cases by a third party). Structured ASIC technology is seen as bridging the gap between field-programmable gate arrays and “standard-cell” ASIC designs.What makes a structured ASIC different from a gate array is that in a gate array the predefined metal layers serve to make manufacturing turnaround faster. In a structured ASIC the predefined metallization is primarily to reduce cost of the mask sets and is also used to make the design cycle time significantly shorter as well.Likewise, the design tools used for structured ASIC can substantially lower cost, and are easier to use than cell-based tools, because the tools do not have to perform all the functions that cell-based tools do.One other important aspect about structured ASIC is that it allows IP that is comm on to certain applications to be “built in”, rather than “designed in”. By building the IP directly into the architecture the designer can again save both time and money compared to designing IP into a cell-based ASIC.中文翻译：集成电路数字逻辑和电子电路由称为晶体管的电子开关得到它们的（各种）功能。

2019年托福专业词汇表：integrated什么意思(附翻译及例句)

2019年托福专业词汇表：integrated什么意思(附翻译及例句)integrated英[ntgretd] 美[ntɡretd]adj.完整的;整体的;结合的;(各组成部分)和谐的v.使一体化( integrate的过去式和过去分词 );使整合;使完整;使结合成为整体综合;内建;一体的;完全的双语例句1 . He thinks we are living in a fully integrated, supportive society.他认为我们生活在一个完全和谐、相互扶持的社会里。

来自柯林斯例句2 . There is, he said, a lack of an integrated national transport policy.他指出，当前缺乏一个统一的全国交通运输政策。

来自柯林斯例句3 . We believe that pupils of integrated schools will have more tolerant attitudes.我们相信在取消种族隔离的学校就读的学生会有更宽容的态度。

Intel Corporation

The Company also develops and sells software and services primarily focused on security and technology integration. Focused on 致力于；使聚焦于；对（某事或做某事）予以注意；把…作为兴趣中心集中测验大论坛；集中；集中于，集中研究；
Products
Intel corporation design and manufacture computing and communications components, such as microprocessors, chipsets, motherboards, and wireless and wired connectivity products, as well as platforms that incorporate these components.
Integration n.结合；整合；一体化；（不同肤色、种族、宗教信仰等的人的）混合；整合；集成；一体化；融译：该公司还开发和销售软件和服务，这些软件和服务主要集中在安全和技术集成方面。
In February 2014, M/A-COM Technology Solutions Holdings Inc announced that its subsidiary Mindspeed Technologies Inc completed the sale of assets of its wireless infrastructure business unit to Intel Corporation.
Announce vi.宣布参加竞选；当播音员 vt.宣布；述说；声称；预告通告；声称；披露；宣布，宣告 Subsidiary adj.附带的，附属的，次要的；助的，帮助的；补足的 n.附属事物，附属机构，子公司；附属者，附属品；子公司；辅助的；附属公司；副的

integrated business planning 集成业务计划文献

Integrated Business Planning（集成业务计划）一、什么是集成业务计划集成业务计划（Integrated Business Planning，IBP）是一种管理方法和过程，旨在帮助企业实现业务目标、协调各部门需求，并在不同时间范围内制定全面的计划。

这种集成的方法可以帮助企业在不同层面上对战略、营销、财务和运营计划进行整体性的优化和协调。

通过将不同计划和相关部门的信息整合在一起，集成业务计划可以帮助企业更好地应对市场变化、实现高效运营和持续增长。

集成业务计划主要包括以下关键元素：1.综合计划：集成业务计划将战略、营销、预测、销售、生产和供应链等各个计划环节整合在一起，形成综合计划，以确保各部门的工作和目标相互协调。

2.前瞻性规划：集成业务计划的核心是对未来的规划和预测。

通过收集和分析市场数据、客户需求、竞争环境等信息，企业可以制定前瞻性的规划，以应对未来的挑战和机遇。

3.交叉部门协同：集成业务计划打破了传统组织结构的壁垒，促进了各部门之间的协作和沟通。

不同部门的负责人可以共同参与制定集成计划，并在计划执行过程中进行实时的信息共享和协调。

二、集成业务计划的步骤和过程2.1 确定目标和制定战略计划作为集成业务计划的起点，企业需要明确自身的目标和战略方向。

在这一阶段，企业需要审视自身的优势和劣势，了解市场需求和竞争环境，并制定相应的战略计划。

2.2 收集和分析市场信息在制定综合计划之前，企业需要收集和分析大量的市场信息。

这包括市场需求、竞争情况、行业趋势等相关数据。

通过对市场信息的分析，企业可以更准确地预测市场的发展趋势，并为制定计划提供参考依据。

2.3 制定销售和运营计划销售计划是集成业务计划中的重要一环，它涉及到产品销售目标、市场开拓策略、销售渠道等方面。

运营计划则关注产品的生产和供应链管理，包括生产计划、物料采购、生产线优化等内容。

2.4 资源调配和优化资源调配是集成业务计划中的关键环节之一。

译林版高中英语选必一Unit2 Integrated skills 教案(雅礼版)

Unit 2 The universal languageIntegrated skills: Introducing your favourite singer or band◆内容分析：本板块围绕单元主题，以“介绍自己最喜爱的歌手或乐队”创设情境，展开一系列具有综合技能训练活动。

听力部分是一段校园广播节目，介绍了一档栏目的播出时间、主题以及听众的参与方式等；阅读部分是一篇有关“披头士”乐队的文章，作者在文章中讲述了自己和这支乐队之间的点点滴滴；说的部分要求学生在听和读的基础上，和同伴讨论自己最喜爱的歌手和乐队；最后要求学生写一篇文章，介绍自己最喜爱的歌手或乐队。

上述活动环环相扣，每个活动既有侧重点，又关联其他活动，组合成一个语言综合实践活动。

◆教学目标：By the end of this section, students will be able to:1.describe some details of a radio programme and Jack’s favourite band;2.talk about their favourite singer or band;3.write an article about their favourite band.◆教学重难点：1.To learn how to introduce the background of their favourite singer or band;2.To describe and write their personal stories about their favourite singer or band.◆教学过程：Step 1 Lead-inQ1: Who is your favourite Chinese singer or band?(Jay Chou, Faye Wong, Eason Chan; Heibao, Beyond, New Pants)Q2: Who is your favourite foreign singer or band?(Justin Bieber, Taylor Swift, Bruno Mars; the Beatles, Maroon 5, the Cranberries, One Republic)Q3: What types of music do you know in the world?(Classical, pop, jazz, country, rock&roll, blues, folk, R&B, rap, ... )Q4: Which type of music are you interested in? Why?Q5: How can you promote your favourite music, singer or band?(Listen to a school radio programme, and think about how it works to achieve this goal. Part A, Page 22)【设计意图：快速引入单元话题。

integrated brier scores

integrated brier scores什么是集成Brier分数？集成Brier分数是一种用于评估概率预测模型准确性的指标。

概率预测模型通常用于预测结果的概率，比如一件事件发生的概率或一个类别的概率。

Brier分数是评估概率预测模型的常用指标之一，它衡量了预测结果与实际结果之间的差异。

具体而言，Brier分数是预测值与实际结果之间的平方差的平均值。

一个完美的预测模型的Brier分数为0，而一个完全随机的模型的Brier分数为0.25。

然而，单个模型的Brier分数可能只反映了该模型的特定预测能力，而无法看到其在其他情况下的表现。

这时，就需要使用集成Brier分数。

集成Brier分数是通过将多个模型的预测结果进行组合来计算的。

集成模型是指通过结合多个个体模型的预测结果，以期望获得更准确的预测结果。

使用集成Brier分数可以帮助我们确定集成模型的预测能力。

它可以评估集成模型在不同场景下的表现，并与单个模型进行比较。

集成Brier分数可以更全面地评估集成模型的准确性和稳定性。

那么，如何计算集成Brier分数呢？计算集成Brier分数的一种常用方法是使用交叉验证。

交叉验证是一种将数据集分为若干个子集的方法，其中一部分用于训练模型，另一部分用于验证模型的准确性。

对于每个子集，我们可以计算出该子集上的Brier分数。

然后，将所有子集上的Brier分数进行平均，即可得到集成Brier分数。

具体步骤如下：1. 将数据集划分为k个子集，通常使用k-fold交叉验证。

每个子集都会轮流作为验证集，其余的k-1个子集作为训练集。

2. 对于每个验证集，使用各个模型进行预测，并计算出该验证集上的Brier 分数。

3. 对所有验证集上的Brier分数进行平均，即可得到集成Brier分数。

这种方法可以确保集成Brier分数不仅仅反映了模型的整体预测能力，还考虑了模型在不同数据集上的表现。

除了交叉验证，还有其他计算集成Brier分数的方法。