纳米BN-环氧树脂高导热绝缘复合材料

30~100W
Electronic packaging technology
MCM/SiP BGA/CSP PGA/BGA
05’s 00’s
miniaturization
QFP DIP
90’s 80’s

轻薄化 高性能化 多功能化 高可靠性 低成本
60-70’S
Electronic packaging technology
High thermal conductivity Good mechanical properties
BN nanosheets
Thermal conductivity and Mechanical properites of BN nanosheets
High thermal conductivity
AlN,Al2O3 Si3N4 ect,nanowire Branch,network
New generation thermally conductive insulating fillers
• • • • • • • Conventional Fillers Decent high thermal conductivity Cheap and easy fabrication Low aspect ratio（纵横比） Low effeciency New generation fillers High aspect ratio Ultra-high thermal conductivity Specially designed structure
h-BN particle
Thermal conductivity and Mechanical properites of BN nanotube
High thermal conductivity good mechanical properties BN nanotube
Thermal conductivity and Mechanical properites of BN nanosheets
Highly thermally conductive insulating polymer composites based on BN nanoparticles
————华桂祥
Highly powered electronic intel Core i7
Power~88W
Extensive applications
Metals
Ceramics
~400(copper)
36(Al2O3);＞100(AlN)
Potential thermally conductive fibbers
Thermal conductivity of polymer and Fillers
Fillers Micro size Al2O3 Micro size Si3N4 Micro size AlN Micro size h-BN BN nanotube BN nanosheet Thermal conductivity(W/mK) 36 45 60-320 60 3000(theory) 200-300(experiment) 100-1000
Thank you!
Low Low High
pure Impure Impure Impure
High
Impure
Ball-milling method
Pressurized vapor/ condenser (PVC) method
Noncovalent functionalization of BNNPs
• sonicating a mixture of 10 mg BNNP powder and 2mg 1pyrenecarboxilic acid in 5mL methanol for 2 h. • 30mL of distilled water was added to this mixture under ultrasonicating for 10 h. • left on a laboratory bench top for several days. • The solution was centrifuged repeatedly to remove uncombined PCA and methanol, and the resultant PBA-BNNP precipitation/complex was washed repeatedly with deionized water and fresh ethanol, respectively. • the PBA-functionalized BNNPs were dried in a vacuum oven at about 60 8C for 12 h for composite fabrication.
Schematicof the unimodal and bimodal distributions
AlN/BN-epoxy composite
AlN/BN-epoxy composite
Thermal conductivity and thermal diffusivity of the composite
Thermal conductivity and Mechanical properites of h-BN particle
High thermal conductivity good mechanical properties
Poor thermal conductivity and mechanical properties
• The BNNTs were dispersed ultrasonically for 5 h in acetone, and the epoxy resin was added to the BNNTs suspension and was subjected to 30 min of high-shear mixing to ensure good dispersion. • The residual solvent was removed at 50 8C in a vacuum oven and an aromatic diamine curing agent was added under continuous stirring in a ratio of epoxy to curing agent of 100:25 by weight. • The final mixture was cast into a metallic mold and cured under hot pressing at 100 8C for 2 h. • The subsequent post-cure was conducted at 150 8C for another 2 h. • A series of f-BNNP/epoxy composites containing 0, 2, 5, 8, and 10 wt.% f-BNNPs were prepared.
Characterization of f-BNNP
(a) Particle-size distribution; (b) HRTEM image (inset for SAED pattern); (c) Raman spectrum.
Preparation of BNNTs/epoxy composites
BN nanosheets
Synthesis Methods of BN nanotubes
Methods Arc discharge on boride electrode Laser heating High pressure Template synthesis CVD (chemical vapor deposition) Chemical reaction Sources Products W-B HfB2 BN-Ni c-BN B-Li-N2 CNT Al2O3 B-C-N-O B3N3H6 ZrB2+N H3 Tubes＜200nm+W Tubes＜700nm+Hf Tubes＜100nm+Ni Tubes＜30nm,short Tubes＜30nm+Li Tubes＜100nm+C Tubes＜100nm+Al2O3 Tubes＜100nm+C+O Tubes＜100nm Tubes＜10μm+ZrB2 yield` low Purity impure
Polymer matrix an源自文库 their low thermal conductivity
• Great processibility • Low cost • Thermal interface materials
Materials Polyethylene Polypropylene Polystyrene Thermal conductivity(W/mK) 0.42-0.51 0.1-0.22 0.14-0.17