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fuchs ecocool al-plus b 成分

fuchs ecocool al-plus b 成分中括号：[FUCHS ECOCOOL ALPLUS B 成分]第一步：了解FUCHS ECOCOOL ALPLUS BFUCHS ECOCOOL ALPLUS B是一种多功能水溶性金属加工液，用于金属切削和磨削操作。

它是由FUCHS润滑油有限公司开发和生产的，并在产业界得到了广泛应用。

了解ECOCOOL ALPLUS B的成分是了解其性能和适用范围的重要一步。

第二步：主要成分ECOCOOL ALPLUS B的主要成分是水、添加剂、抑泡剂和生物抗菌剂。

1. 水：水是ECOCOOL ALPLUS B最主要的成分，它是这种金属加工液的基础。

水的使用可有效冷却工件和刀具，并稀释其他成分以实现最佳的切削和磨削性能。

2. 添加剂：ECOCOOL ALPLUS B含有各种添加剂，用于改善其润滑和冷却性能。

这些添加剂可以提供更低的表面张力，增加切削液的润滑性、冷却效果和清洗性能。

3. 抑泡剂：ECOCOOL ALPLUS B还包含抑泡剂，用于减少切削液在接触到空气时产生泡沫的趋势。

抑泡剂的添加可以提高金属加工液的稳定性和效率。

4. 生物抗菌剂：为了防止切削液在使用过程中受到细菌和微生物的污染，ECOCOOL ALPLUS B中添加了生物抗菌剂。

这些抗菌剂可以有效抑制细菌和微生物的繁殖，保持切削液的卫生和稳定性。

了解这些主要成分可以帮助我们更好地理解FUCHS ECOCOOL ALPLUS B的性能和适用范围。

它的水基配方和添加剂可以提供良好的润滑性能和冷却效果，从而改善金属切削和磨削的效率和质量。

另外，抑泡剂的添加可减少泡沫的产生，提高工作环境的安全性和舒适性。

生物抗菌剂的存在可以有效防止切削液受到微生物污染，保持切削液的稳定性和卫生。

总结：FUCHS ECOCOOL ALPLUS B是一种多功能水溶性金属加工液，其成分包括水、添加剂、抑泡剂和生物抗菌剂。

它以其良好的润滑性能、冷却效果和抗菌性能而在金属加工领域得到广泛应用。

Pepperl+Fuchs NBN40-U4K-N0-V1 产品说明书

12R e l e a s e da t e : 2 0 1 6 -12 -0 5 1 2 : 1 5 D a t e o f i s s u e : 2 0 1 7 -0 1 -0 2 2 13 8 3 9 _ e n g . x m lPinoutL+L-13421 BN2 B UWire colors in accordance with EN 60947-5-6(brown)(blue)3R e l e a s e d a t e : 2016-12-05 12:15D a t e o f i s s u e : 2017-01-02213839_e n g .x m lInstructionManual electrical apparatus for hazardous areas Device category 1Gfor use in hazardous areas with gas, vapour and mist EC-T ype Examination CertificateCE marking ATEX marking ¬ II 1G Ex ia IIC T6…T1 G aThe Ex-related marking can also be printed on the enclosed label.Standards EN 60079-0:2012+A11:2013 EN 60079-11:2012 Ignition protection "Intrinsic safety"Use is restricted to the following stated conditions Appropriate typeNBN40-U.K-N0...Effective internal inductivity C i≤ 105 nF ; a cable length of 10 m is considered.Effective internal inductance L i ≤ 300 µH ; a cable length of 10 m is considered.G eneralThe apparatus has to be operated according to the appropriate data in the data sheet and in this instruction manual. The EU-type examination certificate has to beobserved. The special conditions must be adhered to! Directive 94/9/EC and there-fore the EC-type-examination certificates generally apply only to the use of electrical apparatus under atmospheric conditions. The device has been checked for suitabil-ity for use at ambient temperatures of >60°C by the named certification authority. The surface temperature of the device remains within the required limits. If the equip-ment is not used under atmospheric conditions, a reduction of the permissible mini-mum ignition energies may have to be taken into consideration.Ambient temperatureDetails of the correlation between the type of circuit connected, the maximum per-missible ambient temperature, the temperature class, and the effective internal reac-tance values can be found on the EC-type examination certificate. Note: Use the temperature table for category 1 The 20 % reduction in accordance with EN 1127-1 has already been applied to the temperature table for category 1.Installation, commissioningLaws and/or regulations and standards governing the use or intended usage goal must be observed. The intrinsic safety is only assured in connection with an appro-priate related apparatus and according to the proof of intrinsic safety. The associated apparatus must satisfy the requirements of category ia.Due to the possible danger of ignition, which can arise due to faults and/or transient currents in the equipotential bonding system, galvanic isolation of the power supply and signal circuit is preferable. Associated apparatus without electrical isolation must only be used if the appropriate requirements of IEC 60079-14 are met. If the Ex-related marking is printed only on the supplied label, then this must be attached in the immediate vicinity of the sensor. The sticking surface for the label must be clean and free from grease. The attached label must be legible and indelible, including in the event of possible chemical corrosion. After opening the housing, you should check that the seal is in the correct position and is clean and intact before closing the housing again.Maintenance No changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible.Special conditionsThe connecting parts of the sensor must be set up in such a way that degree of pro-tection IP20, in accordance with lEC 60529, is achieved as a minimum. The maxi-mum allowable proportions of metallic materials in enclosure parts in accordance with IEC/EN 60079-0 have been exceeded. Check whether the device is suitable for the specific application, e.g., to prevent ignition hazards arising from impact or fric-tion.Protection from mechanical dangerWhen using the device in a temperature range of -60 °C to -20 °C, protect the sensor against the effects of impact by installing an additional enclosure. The information regarding the minimum ambient temperature for the sensor as provided in the datasheet must also be observed.Electrostatic chargeElectrostatic charges must be avoided on the mechanical housing components. Dangerous electrostatic charges on the mechanical housing components can be avoided by incorporating these in the equipotential bonding. Avoid electrostatic charges that can cause electrostatic discharge when installing or operating the device. Additional requirements for gas group IIC. Information on electrostatic haz-ards can be found in the technical specification IEC/TS 60079-32-1.4Releasedate:216-12-512:15Dateofissue:217-1-2213839_eng.xmlInstruction Manual electrical apparatus for hazardous areasDevice category 2G for use in hazardous areas with gas, vapour and mistEC-T ype Examination CertificateCE markingATEX marking ¬ II 1G Ex ia IIC T6…T1 G aThe Ex-related marking can also be printed on the enclosed label.Standards EN60079-0:2012+A11:2013,EN60079-11:2012Ignition protection "Intrinsic safety"Use is restricted to the following stated conditionsAppropriate type NBN40-U.K-N0...Effective internal inductivity C i≤ 105 nF ; a cable length of 10 m is considered.Effective internal inductance L i≤ 300 µH ; a cable length of 10 m is considered.G eneral The apparatus has to be operated according to the appropriate data in the data sheetand in this instruction manual. The EU-type examination certificate has to beobserved. The special conditions must be adhered to! Directive 94/9/EC and there-fore the EC-type-examination certificates generally apply only to the use of electricalapparatus under atmospheric conditions. The device has been checked for suitabil-ity for use at ambient temperatures of >60°C by the named certification authority.The surface temperature of the device remains within the required limits. If the equip-ment is not used under atmospheric conditions, a reduction of the permissible mini-mum ignition energies may have to be taken into consideration.Maximum permissible ambient temperature T amb Details of the correlation between the type of circuit connected, the maximum per-missible ambient temperature, the temperature class, and the effective internal reac-tance values can be found on the EC-type examination certificate.Installation, commissioning Laws and/or regulations and standards governing the use or intended usage goalmust be observed. The intrinsic safety is only assured in connection with an appro-priate related apparatus and according to the proof of intrinsic safety. If the Ex-relatedmarking is printed only on the supplied label, then this must be attached in the imme-diate vicinity of the sensor. The sticking surface for the label must be clean and freefrom grease. The attached label must be legible and indelible, including in the eventof possible chemical corrosion. After opening the housing, you should check that theseal is in the correct position and is clean and intact before closing the housingagain.Maintenance No changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible.Special conditions The connecting parts of the sensor must be set up in such a way that degree of pro-tection IP20, in accordance with lEC 60529, is achieved as a minimum.Protection from mechanical danger When using the device in a temperature range of -60 °C to -20 °C, protect the sensoragainst the effects of impact by installing an additional enclosure. The informationregarding the minimum ambient temperature for the sensor as provided in thedatasheet must also be observed.Electrostatic charge Electrostatic charges must be avoided on the mechanical housing components.Dangerous electrostatic charges on the mechanical housing components can beavoided by incorporating these in the equipotential bonding. Additional requirementsfor gas group IIC. Avoid electrostatic charges that can cause electrostatic dischargewhen installing or operating the device. Information on electrostatic hazards can befound in the technical specification IEC/TS60079-32-1.5R e l e a s e d a t e : 2016-12-05 12:15D a t e o f i s s u e : 2017-01-02213839_e n g .x m lInstructionManual electrical apparatus for hazardous areas Device category 3G (ic) for use in hazardous areas with gas, vapour and mist CertificateCE marking ATEX marking ¬ II 3G Ex ic IIC T6…T1 GcThe Ex-related marking can also be printed on the enclosed label.StandardsEN 60079-0:2012, EN 60079-11:2012 Ignition protection category "ic" Use is restricted to the following stated conditions Effective internal inductivity C i≤ 105 nF ; a cable length of 10 m is considered.Effective internal inductance L i≤ 300 µH ; A cable length of 10 m is considered.G eneralThe apparatus has to be operated according to the appropriate data in the data sheet and in this instruction manual. The data stated in the data sheet are restricted by this operating instruction!The special conditions must be observed!The ATEX Directive applies only to the use of apparatus under atmospheric condi-tions.If you use the device outside atmospheric conditions, consider that the permissible safety parameters should be reduced.Installation, commissioningLaws and/or regulations and standards governing the use or intended usage goal must be observed. The sensor must only be operated with energy-limited circuits, which satisfy the requirements of IEC 60079-11. The explosion group complies with the connected, supplying, power limiting circuit. If the Ex-relevant identification is printed exclusively on the adhesive label provided, this label must be affixed in the immediate vicinity of the sensor! The background surface to which the adhesivelabel is to be applied must be clean and free from grease! The applied label must be dura-ble and remain legible, with due consideration of the possibility of chemical corro-sion! After opening the housing, you should check that the seal is in the correct position and is clean and intact before closing the housing again.MaintenanceNo changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible. After opening the housing, you should check that the seal is in the correct position and is clean and intact before closing the housing again.Special conditionsfor Pi=34 mW, Ii=25 mA, T6 73 °C (163.4 °F) for Pi=34 mW, Ii=25 mA, T5 88 °C (190.4 °F) for Pi=34 mW, Ii=25 mA, T4-T1 100 °C (212 °F) for Pi=64 mW, Ii=25 mA, T6 66 °C (150.8 °F) for Pi=64 mW, Ii=25 mA, T5 81 °C (177.8 °F) for Pi=64 mW, Ii=25 mA, T4-T1 100 °C (212 °F) for Pi=169 mW, Ii=52 mA, T6 45 °C (113 °F) for Pi=169 mW, Ii=52 mA, T5 60 °C (140 °F) for Pi=169 mW, Ii=52 mA, T4-T1 89 °C (192.2 °F) for Pi=242 mW, Ii=76 mA, T6 30 °C (86 °F) for Pi=242 mW, Ii=76 mA, T5 45 °C (113 °F) for Pi=242 mW, Ii=76 mA, T4-T1 74 °C (165.2 °F)Protection from mechanical dangerThe sensor must not be mechanically damaged.When used in the temperature range below -20 °C the sensor should be protected from knocks by the provision of an additional housing.Electrostatic chargeWhen used in group IIC non-permissible electrostatic charges should be avoided on the plastic housing parts. Avoid electrostatic charges that can cause electrostatic dis-charge when installing or operating the device. Information on electrostatic hazards can be found in the technical specification IEC/TS 60079-32-1. Electrostatic charges must be avoided on the mechanical housing components. Dangerous electrostatic charges on the mechanical housing components can be avoided by incorporating these in the equipotential bonding.Connection partsThe connection parts are to be installed, such that a minimum protection class of IP20 is achieved, in accordance with IEC 60529.6Releasedate:216-12-512:15Dateofissue:217-1-2213839_eng.xml Instruction Manual electrical apparatus for hazardous areasDevice category 1D for use in hazardous areas with combustible dustEC-T ype Examination Certificate PTB 00 ATEX 2032 XATEX marking ¬ II 1D Ex ia IIIC T135°C DaThe Ex-related marking can also be printed on the enclosed label.Standards EN 60079-0:2012+A11:2013 EN 60079-11:2012Ignition protection "Intrinsic safety" Use is restricted to the following stated condi-tionsAppropriate type NBN40-U.K-N0...Effective internal inductivity C i≤ 105 nF ; a cable length of 10 m is considered.Effective internal inductance L i≤ 300 µH ; a cable length of 10 m is considered.G eneral The apparatus has to be operated according to the appropriate data in the data sheetand in this instruction manual. The EU-type examination certificate has to beobserved. The special conditions must be adhered to! The ATEX directive and there-fore the EU-type examination certificates are in general only applicable to the use ofelectrical apparatus operating at atmospheric conditions.The use in ambient temperatures of > 60 °C was tested with regard to hot surfacesby the mentioned certification authority.If the equipment is not used under atmospheric conditions, a reduction of the permis-sible minimum ignition energies may have to be taken into consideration. Permissible ambient temperature range Details of the correlation between the type of circuit connected, the maximum per-missible ambient temperature, the surface temperature, and the effective internalreactance values can be found on the EC-type-examination certificate. The maxi-mum permissible ambient temperature of the data sheet must be noted, inaddition, the lower of the two values must be maintained.Installation, commissioning Laws and/or regulations and standards governing the use or intended usage goalmust be observed. The intrinsic safety is only assured in connection with an appro-priate related apparatus and according to the proof of intrinsic safety. If the Ex-relatedmarking is printed only on the supplied label, then this must be attached in the imme-diate vicinity of the sensor. The sticking surface for the label must be clean and freefrom grease. The attached label must be legible and indelible, including in the eventof possible chemical corrosion. After opening the housing, you should check that theseal is in the correct position and is clean and intact before closing the housingagain.Maintenance No changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible. After opening the housing, you shouldcheck that the seal is in the correct position and is clean and intact before closing thehousing again.Special conditions The connecting parts of the sensor must be set up in such a way that degree of pro-tection IP20, in accordance with lEC 60529, is achieved as a minimum.Protection from mechanical danger When using the device in a temperature range of -60 °C to -20 °C, protect the sensoragainst the effects of impact by installing an additional enclosure. The informationregarding the minimum ambient temperature for the sensor as provided in thedatasheet must also be observed.Electrostatic charge Avoid electrostatic charges that can cause electrostatic discharge when installing oroperating the device. Information on electrostatic hazards can be found in the techni-cal specification IEC/TS60079-32-1. Electrostatic charges must be avoided on themechanical housing components. Dangerous electrostatic charges on the mechani-cal housing components can be avoided by incorporating these in the equipotentialbonding. Do not attach the nameplate provided in areas where electrostatic chargecan build up.。

CydXisasubunitof...

copper centers(Cu A and Cu B)and two hemes—low-spin heme a and high-spin heme a3.Despite many years of research,the individual absolute absorption spectra of the two hemes in the Soret band(420–460nm)have not yet been resolved because they overlap strongly. There is but a single classical work of Vanneste[1]reporting the absolute individual spectra of the reduced hemes a and a3.We revisited the problem with new approaches as summarized below.(1)Calcium binding to mitochondrial COX induces a small red shift of the absorption spectrum of heme a.Treating the calcium-induced difference spectrum as theﬁrst derivative(differential)of the ab-sorption spectrum of the reduced heme a,it is possible to reconstruct the line shape of the parent absolute spectrum of a2+by integration. The Soret band absolute spectrum of the reduced heme a obtained in this way differs strongly form that in ref.[1].It is fairly symmetric and can be easily approximated by two10nm Gaussians with widely split maxima at442and451nm.In contrast to Vanneste,no evidence for the~428nm shoulder is observed for heme a2+.(2)The overall Soret band of the reduced COX reveals at least5 more Gaussians that are not affected by Ca2+.Two of them at436 and443nm can be attributed to electronic B0transitions in heme a3, and two more can represent their vibronic satellites.(3)A theoretical dipole–dipole interaction model was developed [2]for calculation of absorption and CD spectra.The model allows to optimize parameters of the B x,y electronic transitions in the hemes a and a3to obtain bestﬁt to the experimental spectra.The optimized parameters agree with the characteristics of the reconstructed spectra of hemes a and a3.References[1]W.H.Vanneste,The stoichiometry and absorption spectra ofcomponents a and a-3in cytochrome c oxidase,Biochemistry,5 (1966)838–48.[2]A.V.Dyuba,A.M.Arutyunyan,T.V.Vygodina,N.V.Azarkina,A.V.Kalinovich,Y.A.Sharonov,and A.A.Konstantinov,Circular dichroism of cytochrome c oxidase,Metallomics,3(2011),417–432.doi:10.1016/j.bbabio.2014.05.171S9.P8Flavodiiron enzymes as oxygen and/or nitric oxide reductases Vera Gonçalves a,b,João B.Vicente b,c,Liliana Pinto a,Célia V.Romão a, Carlos Frazão a,Paolo Sarti d,e,f,Alessandro Giuffrèf,Miguel Teixeira a a Instituto de Tecnologia Química e Biológica António Xavier,Universidade Nova de Lisboa,Av.da República,2781–901Oeiras,Portugalb Metabolism and Genetics Group,Institute for Medicines and Pharmaceutical Sciences(iMed.UL),Faculty of Pharmacy,University of Lisbon,Av.Prof.Gama Pinto,1649–003Lisboa,Portugalc Department of Biochemistry and Human Biology,Faculty of Pharmacy, University of Lisbon,Av.Prof.Gama Pinto,1649-003Lisboa,Portugald Department of Biochemical Sciences,Sapienza University of Rome,Piazzale Aldo Moro5,I-00185Rome,Italye Fondazione Cenci Bolognetti—Istituto Pasteur,Italyf Institute of Biology,Molecular Medicine and Nanobiotechnology,National Research Council of Italy(CNR),ItalyE-mail:**************.ptThe Flavodiiron proteins(FDPs)are present in all life domains, from unicellular microbes to higher eukaryotes.FDPs reduce oxygen to water and/or nitrous oxide to nitrous oxide,actively contributing to combat the toxicity of O2or NO.The catalytic ability of FDPs is comparable to that of bonaﬁde heme–copper/iron O2/NO transmem-brane reductases.FDPs are multi-modular water soluble enzymes, exhibiting a two-domain catalytic core,whose the minimal functional unit is a‘head-to-tail’homodimer,each monomer being built by a beta-lactamase domain harbouring a diiron catalytic site,and a short-chainﬂavodoxin,binding FMN[1–3].Despite extensive data collected on FDPs,the molecular determi-nants deﬁning their substrate selectivity remain unclear.To clarify this issue,two FDPs with known and opposite substrate preferences were analysed and compared:the O2-reducing FDP from the eukaryote Entamoeba histolytica(EhFdp1)and the NO reductase FlRd from Escherichia coli.While the metal ligands are strictly conserved in these two enzymes,differences near the active site were observed.Single and double mutants of the EhFdp1were produced by replacing the residues in these positions with their equivalent in the E.coli FlRd.The biochemical and biophysical features of the EhFdp1WT and mutants were studied by potentiometric-coupled spectroscopic methods(UV–visible and EPR spectroscopies).The O2/NO reactivity was analysed by amperometric methods and stopped-ﬂow absorption spectroscopy.The reactivity of the mutants towards O2was negatively affected, while their reactivity with NO was enhanced.These observations suggest that the residues mutated have a role in deﬁning the substrate selectivity and reaction mechanism.References[1]C.Frazao,G.Silva,C.M.Gomes,P.Matias,R.Coelho,L.Sieker,S.Macedo,M.Y.Liu,S.Oliveira,M.Teixeira,A.V.Xavier,C.Rodrigues-Pousada,M.A.Carrondo,J.Le Gall,Structure of a dioxygen reduction enzyme from Desulfovibrio gigas,Nature Structural Biology,7(2000)1041–1045.[2]J.B.Vicente,M.A.Carrondo,M.Teixeira,C.Frazão,FlavodiironProteins:Nitric Oxide and/or Oxygen Reductases,in:Encyclopedia of Inorganic and Bioinorganic Chemistry,(2011).[3]V.L.Gonçalves,J.B.Vicente,L.M.Saraiva,M.Teixeira,FlavodiironProteins and their role in cyanobacteria,in: C.Obinger,G.A.Peschek(Eds.)Bioenergetic Processes of Cyanobacteria,Springer Verlag,(2011),pp.631–656.doi:10.1016/j.bbabio.2014.05.172S9.P9CydX is a subunit of Escherichia coli cytochrome bd terminal oxidase and essential for assembly and stability of the di-heme active siteJo Hoeser a,Gerfried Gehmann a,Robert B.Gennis b,Thorsten Friedrich ca Institut für Biochemie/Uni Freiburg,Germanyb Department of Biochemistry,University of Illinois at Urbana Champaign, USAc Albert-Ludwigs-Universitat Freiburg,GermanyE-mail:*****************.uni-freiburg.deThe cytochrome bd ubiquinol oxidase is part of many prokaryotic respiratory chains.It catalyzes the oxidation of ubiquinol to ubiqui-none while reducing molecular oxygen to water.The reaction is coupled to the vectorial transfer of1H+/e−across the membrane, contributing to the proton motive force essential for energy consum-ing processes.The presence of this terminal oxidase is known to be related to the virulence of several human pathogens,making it a very attractive drug target.The three heme groups of the oxidase are presumably located in subunit CydA.Heme b558is involved in ubiquinol oxidation,while the reduction of molecular oxygen is catalyzed by a di-nuclear heme center containing hemes b595and d [1].A severe change in Escherichia coli phenotype was noticed when a 111nt gene,denoted as cydX and located at the5′end of the cyd operon,was deleted.This small gene codes for a single transmem-brane helix obviously needed for the activity of the oxidase[2].WeAbstracts e98overproduced the terminal oxidase with and without the cydX gene product.The resulting enzyme was puriﬁed by chromatographic steps and the cofactors were spectroscopically characterized.We demon-strated that CydX tightly binds to the CydAB complex and is co-puriﬁed.The identity of CydX was determined by mass spectrometry. Additionally,the di-heme active site was only detectable in the variant containing CydX.Thus,CydX is the third subunit of the E.coli bd oxidase and is essential for the assembly and stability of the di-heme site[3].References[1]V.B.Borisov,R.B.Gennis,J.Hemp,M.I.Verkhovsky,The cytochromebd respiratory oxygen reductases,Biochim.Biophys.Acta.1807 (2011)1398–1413./10.1016/j.bbabio.2011.06.016.[2]C.E.VanOrsdel,S.Bhatt,R.J.Allen,E.P.Brenner,J.J.Hobson,A.Jamil,et al.,The Escherichia coli CydX protein is a member of the CydAB cytochrome bd oxidase complex and is required for cytochrome bd oxidase activity,J.Bacteriol.195(2013)3640–3650./10.1128/JB.00324-13.[3]J.Hoeser,S.Hong,G.Gehmann,R.B.Gennis,T.Friedrich,SubunitCydX of Escherichia coli cytochrome bd ubiquinol oxidase is essential for assembly and stability of the di-heme active site,FEBS Lett.(2014)./10.1016/j.febslet.2014.03.036.doi:10.1016/j.bbabio.2014.05.173S9.P10Characterization of the two cbb3-type cytochrome c oxidase isoforms from Pseudomonas stutzeri ZoBellMartin Kohlstaedt a,Hao Xie a,Sabine Buschmann a,Anja Resemann b, Julian nger c,Hartmut Michel ca MPI of Biophysics,Germanyb Bruker Daltonik GmbH,Germanyc Max-Planck-Institute of Biophysics,Department of Molecular Membrane Biology,GermanyE-mail:*****************************.deCytochrome c oxidases(CcOs)are the terminal enzymes of the respiratory chain and are members of the heme-copper oxidase superfamily(HCO).CcOs catalyze the reduction of molecular O2to water and couple this exergonic reaction with transmembrane proton pared to family A and B CcOs,the cbb3-type CcOs which represent the C-family,feature a distinctly different subunit composition,a reduced proton pumping stoichiometry and higher catalytic activity at low oxygen concentrations[1][2].The genome of Pseudomonas stutzeri ZoBell contains two independent cbb3-operons, encoding Cbb3-1(CcoNOP)and Cbb3-2(CcoNOQP).We generated variants with a focus on ccoQ whose function is unknown.The puriﬁed variants and the wildtype Cbb3were analyzed using UV–vis spec-troscopy,BN-and SDS-PAGE,O2reductase activity(ORA)and immunoblotting with an antibody speciﬁc for CcoQ.We found that the deletion of ccoQ has an inﬂuence on a b-type heme in the binuclear center,and that both the stability and the ORA are decreased without ccoQ compared to the WT.The O2afﬁnity(OA)of Cbb3was spec-trophotometrically determined with oxygenated leghemoglobin as an O2delivery system.The determined Km values for the recombinant Cbb3-1are similar to previously published data[2].The Km value of rec.Cbb3-2is about2-fold higher than the value of rec.Cbb3-1.In addition,the OA and ORA of different variants introduced into the O2-cavity of rec.Cbb3-1show signiﬁcant differences compared to the WT. In the structure of Cbb3,an additional transmembraneαhelix was detected but so far not assigned to any protein[3].We sequenced and identiﬁed the polypeptide chain using a customized MALDI-Tandem-MS-based setup and found a putative protein.The amino acid sequence of this proteinﬁts the electron density of the unknown helix and we are currently investigating the functional relevance of this protein.References[1]RS.Pitcher,NJ.Watmough The bacterial cytochrome cbb3oxidaseBiochim Biophys Acta,1655(2004),pp.388–399[2]O.Preisig,R.Zufferey,L.Thöny-Meyer,C.A.Appleby,H.HenneckeA high-afﬁnity cbb3-type cytochrome oxidase terminates thesymbiosis-speciﬁc respiratory chain of Bradyrhizobium japonicum J.Bacteriol,178(1996),pp.1532–1538[3]S.Buschmann,E.Warkentin,H.Xie,nger,U.Ermler,H.MichelThe structure of cbb3cytochrome oxidase provides insights into proton pumping Science,329(2010),pp.327–330.doi:10.1016/j.bbabio.2014.05.174S9.P11Expression of terminal oxidases under nutrient-limited conditions in Shewanella oneidensis MR-1Sébastien Le Laz a,Arlette Kpebe b,Marielle Bauzan c,Sabrina Lignon d, Marc Rousset a,Myriam Brugna aa BIP,CNRS,Marseille,Franceb BIP,CNRS/AMU,Francec CNRS,Aix-Marseille Université,Unitéde fermentation,FR3479,IMM, Franced CNRS,Aix-Marseille Université,Plate-forme Protéomique,FR3479,IMM, MaP IBiSA,FranceE-mail:***************.frShewanella species are facultative anaerobic bacteria renowned for their remarkable respiratory versatility that allows them to use,in addition to O2,a broad spectrum of compounds as electron acceptors. In the aerobic respiratory chain,terminal oxidases catalyze the last electron transfer step by reducing molecular oxygen to water.The genome of Shewanella oneidensis MR-1encodes for three terminal oxidases:a bd-type quinol oxidase and two heme-copper oxidases, a A-type cytochrome c oxidase(Cox)and a cbb3-type oxidase.In a previous study,we investigate the role of these terminal oxidases under aerobic and microaerobic conditions in rich medium using a biochemical approach[1].Our results revealed the particularity of the aerobic respiratory pathway in S.oneidensis since the cbb3-type oxidase was the predominant oxidase under aerobic conditions while the bd-type and the cbb3-type oxidases were involved in respira-tion at low-O2tensions.Against all expectation,the low-afﬁnity Cox oxidase had no physiological signiﬁcance in our experimental conditions.Do these data reﬂect a functional loss of Cox resulting from evolutionary mechanisms as suggested by Zhou et al.[2]?Is Cox expressed under speciﬁc conditions like the aa3oxidase in Pseudo-monas aeruginosa,maximally expressed under starvation conditions [3]?To address these questions,we investigated the expression pattern of the terminal oxidases under nutrient-limited conditions and different dissolved O2tensions by measuring oxidase activities coupled to mass-spectrometry analysis.In addition to the notable modulation of the expression of the bd-type and cbb3-type oxidases in the different tested conditions,we detected Cox oxidase under carbon-starvation conditions.This constitutes theﬁrst report of a condition under which the A-type oxidase is expressed in S.oneidensis. We suggest that Cox may be crucial for energy conservation in carbon-limited environments and we propose that Cox may be a component of a general protective response against oxidative stress allowing S.oneidensis to thrive under highly aerobic habitats.Abstracts e99。

关于PUCCH SR和CQI的设置指引

关于PUCCH SR和CQI的设置指引一. 介绍本文是关于LTE中PUCCH 的SR以及CQI设置的指引二. 适用范围TDD LTE L13B三. SR 和CQI相关门限1. 单DU能支持的最大PUCCH RB Pair2. 单小区能支持的最大SR和CQI四. SR和CQI的计算公式SR = (36*(N pucch-RB/N cell–X CQI ) – N CCEmax *N bundlingmax)*T SR*N SFpucch / 10 CQI = X CQI*N cap* T CQI*N SFpucch / 1036 是每对RB-pair能支持的最大SR和HARQN pucch-RB是DU能支持的最大PUCCH RB Pair，请参考表1.X CQI是CQI占用PUCCH RB Pair数N cell是DU上所开的小区个数N CCEmax 是某种CFI配置下的CCE最大个数，具体查下面表格：N bundlingmax是最大ACK/NACK束窗口，具体查下面表格T SR是SR的时间周期，默认是20msN SFpucch在某种上下行配比下PUCCH占用的子帧数N cap是每对PUCCH RB-pair能容纳的CQI资源，其值为4.T CQI是CQI的时间周期，默认为80ms10 是一个帧的时间10ms五. 关于小区合并在小区合并的情况下，每个sector都需要属于自己的PUCCH，与一个单独的小区一致。

例如一个室分站点，用5个RRU来合并成一个小区，那么在SR和CQI是配置上，公式中的N cell不是1，而是5.六. 具体举例1. 一个DUS31, 3个RRU 2TX，配置3个小区，3个小区的配置一致：上下行配比为2，CFIMODE 为4.那么公式为：SR = (36*(24/3 - X) - 55*4)*20*2/10CQI = X*4*80*2/10假如X为1，那么CQI 为64，SR为128.2. 一个DUS41, 3个RRU 2TX，配置3个小区，3个小区的配置一致：上下行配比为2，CFIMODE 为4.那么公式为：SR = (36*(36/3 - X) - 55*4)*20*2/10CQI = X*4*80*2/10假如X为1，那么CQI 为64，SR为704.但由于表格2的单小区上限为288的限制。

BCX51 52 53 PNP中间功率导电器SOT89数据手册说明书

Features• BV CEO > -45V, -60V & -80V• I C = -1A Continuous Collector Current • I CM = -2A Peak Pulse Current• Low Saturation Voltage V CE(sat) <************• Gain Groups 10 and 16• Complementary NPN Types: BCX54, 55, and 56• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen- and Antimony-Free. "Green" Device (Note 3)•For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAPcapable, and manufactured in IATF 16949 certified facilities),please contact us or your local Diodes representative.https:///quality/product-definitions/Mechanical Data• Case: SOT89• Case Material: Molded Plastic, “Green” Molding Compound; UL Flammability Rating 94V-0• Moisture Sensitivity: Level 1 per J-STD-020•Terminals: Matte Tin Finish Leads; Solderable per MIL-STD-202 Method 208•Weight: 0.052 grams (Approximate)Applications • Medium Power Switching or Amplification Applications • AF Driver and Output StagesOrdering Information (Note 4)Product Compliance Marking Reel Size (inches)Tape Width (mm)Quantity per ReelBCX51TA Standard AA 7 12 1,000 BCX51-13R Standard AA 13 12 4,000 BCX5110TA Standard AC 7 12 1,000 BCX5116TA Standard AD 7 12 1,000 BCX5116TC Standard AD 13 12 4,000 BCX52TA Standard AE 7 12 1,000 BCX5210TA Standard AG 7 12 1,000 BCX5216TA Standard AM 7 12 1,000 BCX53TA Standard AH 7 12 1,000 BCX5310TA Standard AK 7 12 1,000 BCX5316TA Standard AL 7 12 1,000 BCX5316TC Standard AL 13 12 4,000 BCX5316-13R Standard AL 13 12 4,000 BCX5110TC Standard AC 13 12 4,000 BCX51TC Standard AA 13 12 4,000 BCX5210TC Standard AG 13 12 4,000 BCX5216TC Standard AM 13 12 4,000 BCX52TC Standard AE 13 12 4,000 BCX5310TC Standard AK 13 12 4,000 BCX53TCStandardAH13124,000Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.2. See https:///quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.4. For packaging details, go to our website at https:///design/support/packaging/diodes-packaging/.Top View Device SymbolTop View Pin-Out SOT89E C BMarking InformationAbsolute Maximum Ratings (@ T A = +25°C, unless otherwise specified.)CharacteristicSymbol BCX51 BCX52 BCX53 Unit Collector-Base Voltage V CBO -45 -60 -100 V Collector-Emitter Voltage V CEO -45-60 -80V Emitter-Base Voltage V EBO -5 V Continuous Collector CurrentI C -1 A Peak Pulse Collector Current (Single pulse) I CM -2 Continuous Base CurrentI B -100 mAPeak Pulse Base Current (Single pulse) I BM-200Thermal Characteristics (@ T A = +25°C, unless otherwise specified.)CharacteristicSymbol Value Unit Power Dissipation(Note 5) P D1 W(Note 6) 1.5 (Note 7) 2.0 Thermal Resistance, Junction to Ambient Air (Note 5) R θJA 125 °C/W (Note 6) 83 (Note 7)60 Thermal Resistance, Junction to Lead (Note 8) R θJL 13 °C/W Thermal Resistance, Junction to Case (Note 9)R θJC 27 °C/W Operating and Storage Temperature Range T J, T STG-55 to +150°CESD Ratings (Note 10)CharacteristicSymbol Value Unit JEDEC ClassElectrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine ModelESD MM400VCNotes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state.6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper.7. Same as Note 5, except the device is mounted on 50mm x 50mm 1oz copper.8. Thermal resistance from junction to solder-point (on the exposed collector pad).9. Thermal resistance from junction to the top of the case.10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.xx = Product Type Marking Code, as follows:BCX51 = AA BCX52 = AEBCX53 = AH BCX5110 = AC BCX5210 = AG BCX5310 = AK BCX5116 = AD BCX5216 = AMBCX5316 = ALThermal Characteristics and Derating Information2550751001251500.00.20.40.60.81.0Derating CurveTemperature (°C) M a x P o w e r D i s s i p a t i o n (W )Transient Therm al Im pedanceT h e r m a l R e s i s t a n c e (°C /W )Pulse Width (s)Pulse Power DissipationPulse Width (s)M a x P o w e r D i s s i p a t i o n (W )Copper Area (sqmm)M a x i m u m P o w e r (W )Copper Area (sqmm)T h e r m a l R e s i s t a n c e (°C /W )Note:11. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.Typical Electrical Characteristics (@ T A = +25°C, unless otherwise specified.)-I , COLLECTOR CURRENT (A)C h ,D C C U R RE N T G A I NF E Fig. 2 Typical DC Current Gain vs. Collector CurrentDC Current Gain vs. Collector Current -V , COLLECTOR-EMITTER VOLTAGE (V)CE I , C O L L E C T O R C U R R E N T (A )CFig. 1 Typical Collector Current vs. Collector-Emitter VoltageCollector Current vs. Collector-Emitter Voltage -h FE V I CI C V V CETypical Electrical Characteristics (continued.)0.20.40.60.81.0-V , B A S E -E M I T T E R T U R N -O N V O L T A G E (V )B E (O N)-I , COLLECTOR CURRENT (A)C -V , C O L L E C T O R -E M I T T E R S A T U R A T I O N V O L T A G E (V )C E (S A T )Fig. 4 Typical Collector-Emitter Saturation Voltagevs. Collector Current 0.20.40.60.81.01.2-V , B A S E -E M I T T E R S A T U R A T I O N V O L T A G E (V B E (S AT )-I , COLLECTOR CURRENT (mA)C f , G A I N -B A ND W I D T H P R O D U C T (M H z )T Fig. 6 Typical Gain-Bandwidth Product vs. Collector Current V , REVERSE VOLTAGE (V)R C A P A C I T A N C E (p F )Fig. 7 Typical Capacitance Characteristics -V B E (s a t ), B A S E -E M I T T E R S A T U R A T I O N V O L T A G E )-V B E (o n ), B A S E -E M I T T E R T U R N -O N V O L T A G E (V )-V C E (s a t ) , C O L L E C T O R -E M I T T E RC v V RVCE(sat) V I Cf T V I CPackage Outline DimensionsPlease see /package-outlines.html for the latest version.SOT89SOT89Dim Min Max TypA 1.40 1.60 1.50B 0.50 0.62 0.56B1 0.42 0.540.48c 0.35 0.43 0.38D 4.40 4.60 4.50D1 1.62 1.83 1.733D2 1.61 1.81 1.71E 2.40 2.60 2.50E2 2.05 2.35 2.20e - - 1.50H 3.95 4.25 4.10H1 2.63 2.93 2.78L 0.90 1.20 1.05L1 0.327 0.527 0.427z 0.20 0.40 0.30All Dimensions in mmSuggested Pad LayoutPlease see /package-outlines.html for the latest version.SOT89Dimensions Value(in mm)C 1.500G 0.244X 0.580X1 0.760X2 1.933Y 1.730Y1 3.030Y2 1.500Y3 0.770Y4 4.530TOP VIEW。

PINK1 phosphorylates ubiquitin to activate Parkin E3 ubiquitin ligase activity

OMM proteins (Tanaka et al., 2010; Chan et al., 2011; Yoshii et al., 2011) and to selective autophagy of damaged mitochondria (Narendra et al., 2008), suggesting that PINK1 and Parkin mediate a mitochondrial quality control pathway. How PINK1 recruits Parkin to the OMM and what PINK1 kinase substrate is involved have been unclear. A leading candidate is Parkin itself, as PINK1 directly phosphorylates Parkin at serine 65 (S65; Kondapalli et al., 2012; Shiba-Fukushima et al., 2012). This model is consistent with data that PINK1 experimentally localized to peroxisomes or lysosomes can recruit Parkin to these locations (Lazarou et al., 2012). Here we show that PINK1 recruits Parkin to mitochondria despite mutation of S65 to alanine or individual mutation of all other Ser/Thr residues conserved between Drosophila and human Parkin. This indicates that another PINK1 substrate mediates Parkin translocation and activation. Using mass spectrometry we identified ubiquitin (Ub) as an endogenous PINK1 substrate and found that both a phosphomimetic mutant Ub in cells and phospho-Ub in vitro can activate Parkin. Interestingly, PINK1

DOT 科学公司 Dextran Sulfate 产品说明书

SECTION 1 - CHEMICAL IDENTIFICATIONPRODUCT NAME: Dextran SulfateCATALOG #: DSD20020SUPPLIER’S NAME: DOT SCIENTIFIC INC.SUPPLIERS ADDRESS: 4165 Lippincott, Burton, MI 48519EMERGENCY CONTACT: 1-800-424-9300(Reference Customer Number: 18739) OTHER INFORMATION: 1-800-878-1785OTHER INFORMATION: 800-878-1785SECTION 2 - HAZARDS IDENTIFICATION2.1 Classification of the substance or mixtureGHS Classification in accordance with 29 CFR 1910 (OSHA HCS)H315Skin corrosion/irritation Category 2 H319Serious eye damage/eye irritation Category 2 2.2 GHS Label elements, including Hazard and Precautionary Statement(s)PictogramSignal word: WarningHazard statement(s)H315Causes skin irritationH319Eye irritationPrevention, Response, Storage and Disposal Precautionary Statement(s)P264Wash skin thoroughly after handlingP280Wear protective gloves/protective clothing/eye protection/face protection.P302 + P352IF ON SKIN: Wash with plenty of soap and water.P305 + P351 + P338IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing.P321Specific treatment (see. on this label).P332 + P313If skin irritation occurs: Get medical advice/attention.P337+P313If eye irritation persists: Get medical advice/attention.P362 + P364Take off contaminated clothing and wash before reuse.SECTION 3- COMPOSITION/INFORMATION ON INGREDIENTSCAS Number: 9011-18-1SECTION 4 - FIRST-AID MEASURES4.1 Description of first aid measuresGeneral advice: Consult a doctor and show this safety data sheet.i.If inhaled: Remove to fresh air and monitor breathing. If breathing becomes difficult, give oxygen. If breathingstops, give artificial respiration. Consult a doctor.SAFETY DATA SHEETii.In case of skin contact: Immediately wash skin with copious amounts of soap and water for at least 15 minutes.Remove contaminated clothing and shoes and wash before reuse. Consult a doctor.iii.In case of eye contact: Flush with copious amounts of water for at least 15 minutes. Consult a doctor.iv.If swallowed: Rinse mouth with water. Do not induce vomiting unless directed to do so by medical personnel.Never give anything by mouth to an unconscious person. Consult a doctor.4.2 Most important symptoms and effects, both acute and delayed: To the best of our knowledge, the chemical, physical and toxicological properties have not been thoroughly investigated.4.3 Indication of immediate medical attention and special treatment needed: Show this safety data sheet to the doctor in attendance. Immediate medical attention is required.SECTION 5 - FIRE FIGHTING MEASURES5.1 Extinguishing mediaSuitable extinguishing media: Use water spray, alcohol-resistant foam, dry chemical or carbon dioxide5.2 Special hazards arising from the substance or mixture: Carbon oxides. Sulfur oxides.5.3 Precautions for fire-fighters: Wear suitable protective clothing to prevent contact with skin and eyes and self-contained breathing apparatus.5.4 Further information: No data available.SECTION 6 - ACCIDENTAL RELEASE MEASURES6.1 Personal precautions, protective equipment and emergency procedures: Do not take action without suitable protective clothing - see section 8 of SDS. Evacuate personnel to safe areas. Ensure adequate ventilation. Avoid breathing vapors, mist, dust or gas.6.2 Environmental precautions: Do not let product enter drains.6.3 Methods and materials for containment and cleaning up: Cover spillage with suitable absorbent material. Using non-spark tools, sweep up material and place in an appropriate container. Decontaminate spill site with 10% caustic solution and ventilate area until after disposal is complete. Hold all material for appropriate disposal as described under section 13 of SDS.6.4 Reference to other sections: For required PPE see section 8. For disposal see section 13.SECTION 7 - HANDLING AND STORAGE7.1 Precautions for safe handling: Use in a chemical fume hood, with air supplied by an independent system. Avoid inhalation, contact with eyes, skin and clothing. Avoid the formation of dust and aerosols. Use in a well-ventilated area. Keep away from sources of ignition. Avoid prolonged or repeated exposure.7.2Conditions for safe storage, including any incompatibilities: Store in cool, well-ventilated area. Keep away from direct sunlight. Keep container tightly sealed until ready for use. Keep in a dry place.7.3 Specific end use(s): Use in a laboratory fume hood where possible. Refer to employer's COSHH risk assessment.SECTION 8 - EXPOSURE CONTROLS/PERSONAL PROTECTION8.1 Control parametersComponents with workplace control parameters: Contains no substances with occupational exposure limit values.8.2 Exposure Controlsi.Appropriate engineering controls: Use in a fume hood where applicable. Ensure all engineering measuresdescribed under section 7 of SDS are in place. Ensure laboratory is equipped with a safety shower and eye wash station.8.3 Personal protective equipmenti.Eye/face protection: Face shield and safety glasses Use equipment for eye protection tested and approved underappropriate government standards such as NIOSH (US) or EN 166(EU).ii.Skin protection: Wear appropriate protective eyeglasses or chemical safety goggles as described by OSHA's eye and face protection regulations in 29 CFR 1910.133 or European Standard EN166iii.Body Protection: Wear appropriate protective clothing. Complete suit protecting against chemicals, The type ofprotective equipment must be selected according to the concentration and amount of the dangerous substance at the specific workplace.iv.Respiratory Protection: Follow the OSHA respirator regulations found in 29 CFR 1910.134 or European Standard EN 149. Use a NIOSH/MSHA or European Standard EN149 approved respirator if exposure limits are exceeded or if irritation or other symptoms are experienced.v.Control of environmental exposure: Do not let product enter drainsSECTION 9 - PHYSICAL AND CHEMICAL PROPERTIESInformation on basic physical and chemical propertiesVapor Pressure No Data Available Appearance White To Off-WhiteSolidOdor No Data Available Vapor Density No Data Available Odor Threshold No Data Available Relative Density No Data AvailablepH No Data Available Water Solubility No Data Available Melting / Freezing Point No Data Available Partition Coefficient No Data Available Initial Boiling Point Range No Data Available Auto-Ignition Temperature No Data Available Flash Point No Data Available Decomposition Temperature No Data Available Evaporation Rate No Data Available Viscosity No Data Available Flammability (Solid, Gas)No Data Available Explosive Properties No Data Available Upper / Lower FlammabilityNo Data Available Oxidizing Properties No Data AvailableOr Explosive LimitsSECTION 10 - STABILITY AND REACTIVITYStability: Stable under recommended storage conditions.Hazardous Decomposition Products: None under normal use condition.Conditions to avoid: Light.Incompatibilities: strong oxidizing agent.SECTION 11 - TOXICOLOGICAL INFORMATIONAcute ToxicityLD50 Oral LD50 Dermal LD50 Inhalation LD50 Intraperitoneal 20,600 mg/kg (Rat)Not Listed Not Listed Not ListedSECTION 12 - ECOLOGICAL INFORMATIONEco Toxicity: No data availablePersistence and degradability/ Bioaccumlative potential/ Mobility in soil: No data availableResults of PBT and vPvB assessment: No data availableOther adverse effects: No data availableChronic Toxicity: There are no known carcinogenic chemicals in this productSECTION 13 - DISPOSAL CONSIDERATIONSWhatever cannot be saved for recovery or recycling should be managed in an appropriate and approved waste disposal facility. Processing, use or contamination of this product may change the waste management options. State and local disposal regulations may differ from federal disposal regulations. Dispose of container and unused contents in accordance with federal, state and local requirements.SECTION 14 - TRANSPORT INFORMATIONDOT TDG IATA IMDG/IMO Not regulated Not regulated Not regulated Not regulatedSECTION 15 - REGULATORY INFORMATIONINTERNATIONAL INVENTORIESTSCA DSL NDSL ELINCS NLP PICCS ENCS AICS CHINA KECL Listed Listed----Listed Listed Listed ListedUSA FEDERAL REGULATIONTSCA 12(b)/ OSHA/ CERCLA: Not ApplicableSARA 313: Not ApplicableClean Water Act/Clean Air Act: Not ApplicableSARA 311/312 HAZARDOUS CATEGORIZATIONAcute Health Hazard Chronic HealthHazardFire Hazard Sudden Release OfPressure HazardReactiveHazardNo Yes No No NoCalifornia Proposition 65: This product does not contain any Proposition 65 chemicals.HMIS RatingHealth hazard Chronic Health Hazard Flammability Physical Hazard 0000NFPA RatingHealth hazard Chronic Health Hazard Flammability Reactivity Hazard 0000STATE RIGHT TO KNOWMassachusetts New Jersey Pennsylvania Illinois Rhode Island -Listed Listed--US DEPARTMENT OF TRANSPORTATIONREPORTABLE QUANTITY (RQ)DOT MARINE POLLUTANT DOT SEVER MARINE POLLUTANT No No NoU.S. DEPARTMENT OF HOMELAND SECURITY: This product does not contain any DHS chemicals.Canada: This product has been classified in accordance with the hazard criteria of the Controlled Products Regulations (CPR) and the SDS contains all the information required by the CPR.This SDS complies with the requirements of Regulation (EC).SECTION 16 - OTHER INFORMATIONThe above information is believed to be correct but does not purport to be all inclusive and shall be used only as a guide. DOT SCIENTIFIC INC. shall not be held liable for any damage resulting from handling or from contact with the above product. See reverse side of invoice or packing slip for additional terms and conditions of sale. This product is sold for laboratory research and development purposes use only. REV October 2015。

中央加速器Q-7S产品说明书

Central Rápida Q-7S¡Felicitaciones! Ud. ha adquirido una Central Rápida Q-7SESCANEAR CON CELULAR Características TécnicasTensión de alimentación 220 volts ACPotencia máxima de los accionamientos 1/2 HPVariación de frecuencia entre 10 y 100 HzRampa de arranque y frenadoSalida 12 VCC para alimentar periféricos de 40 mA MÁXIMOProgramación del tiempo de marcha del motorProgramación para acceso peatonalTiempo de pausa para el cierre automático de 15 segundosEntradas mediante opto-acopladores .Contacto de luz de cortesía, máximo 500 W, es una salida de relay libre de potencial, se debe alimentar con una fuente externa Bornera de ConexionesGND +12V LC LA IR ORD COM GANT CERR LUZ MIRÁ EL VIDEO PARAINSTALARLO ENYOUTUBE: GRUPO MOTICPaso 1 Conexión del Motor y Central Paso 2 Conexión de Accesorios OpcionalesFinales de Carrera (Recomendado)Para ello, liberar el eje del motor y abrir y cerrar manualmente el portón, con lo cual:*Se debe encender LdC cuando el portón está cerrado y apagarse cuando se empieza a abrir.** Se debe encender LdA cuando el portón está abierto y apagarse cuando se empieza a cerrar.En el caso en que se enciendan invertidos, invertir los cables LA y LC en la bornera.En caso de que LdA o LdC no enciendan o lo hagan intermitentemente, revise las conexiones y el Barrera Infrarroja (Opcional)Si no se emplea barrera infrarroja, dejar el Jumper "IR"colocado en la placa.Si se emplea barrera infrarroja, retirar el Jumper "IR" dela placa. Si la barrera infrarroja se activa durante el cierre,el motor se detiene y se vuelve a abrir.Electrocerradura (Opcional)Tener en cuenta que la central no permite alimentar unaelectrocerradura, es solo una salida de relay, por lo quese debe alimentar con fuente externa .Dejar el portón entreabierto y cortar la energía. Al habilitar laenergía nuevamente, al dar una orden con el pulsador o control,debe ABRIR. En caso de que CIERRE, invertir el sentido de girodel motor para corregirlo:Motor Trifásico: En caso de sentido de giro incorrecto,intercambiar los cables de motor S y T.Motor Fase Partida: En este caso, R es el común del motor.EN ESTA CENTRAL,¡LOS MOTORES JAMÁS DEBEN LLEVAR CAPACITOR!En caso de sentido de giro incorrecto, intercambiar los cables Sy T T G S M R NF 220VACTIERRA (JABALINA)T G S M R COMÚN N F 220VACTIERRA(JABALINA)GND +12V LC IR LA ORDCOM G ANT LdA LdC GND +12V LC IR LA ORDCOMCERR FUENTE EXTERNA 12V 1ARxProgramación de funciones mediante los dip switchLuz (Opcional)Botón de Orden (Opcional)LUZ LUZ 220V NF+12GND LUZLUZConexión de Led 12VccConexión de Lámpara 220 VAC pulsador NA GND+12V ORD LC LAProgramación de la apertura vehicularEsto le permitirá abrir el portón parcialmente para el paso peatonal por un tiempo de 10 segundos, tras lo cual se cerrará automáticamente, excepto que la barrera infrarroja esté interrumpida.Programación de los Controles Remotos para el Paso Peatonal1.Pulsar el botón T2, se encenderá el led Ld1.Programación de los Tiempos de Recorrido para apertura vehicularProgramación de apertura peatonal1/ BORRAR todos los controles.Mantener pulsar el botón T2por 6 segundos.El LED pr1 destellarávarias veces dando por T1T2LEDPR12/ GRABADO de los controles.Pulsar el botón T2 El LED pr1 quedaráencendido Si quiere grabarmás controlessiga pulsandolos botones delos controles Si terminó vuelva a pulsar el botón T2. El led pr1 se apagaráRecuerde que la electrónica sólo guarda en su memoria 60 electrónica no permite eliminar sólo un botón (eliminaratodos los controles).Pulsar el botón que quieragrabar T1T2T1T2LEDPR1El led PR1destellaráindicando el grabado del boton deseadoa/ Programación del tiempo del recorrido (sin decelere DIP Nº5 ON).Dejar el portón amitad del recorrido El LED pr1 se va a encender y al soltarlo, el portóncomenzará a cerrar Mantener pulsado elbotón T1 por 6”El portón cerraráy comenzará a abrir solo El portón volverá a cerrar dando porel programado T1T2nalizado el procedimiento 1Programación de los Tiempos de Recorrido para el Paso Peatonal CON FINALES DE CARRERAMOTIC Recomienda elegir los siguientes botones en cada control:Paso Total Paso Peatonal6.Ajuste de la velocidad del motorCon esta función, puede ajustar la velocidad del motor a gusto.Para aumentar la velocidad girar VR1 en sentido horario.Para disminuir la velocidad girar VR1 en sentido anti-horario.GND+12V LC LA IR ORD COM G ANT VR1IRPulsar el botón T2 El LED pr1 quedaráencendido Si quiere grabar más controles siga pulsandolos botones delos controles Si terminó suelte el boton T1,y pulse el boton T2.El led Ld1 se apagaráRecuerde que la electrónica sólo guarda en su memoria 60 electrónica no permite eliminar sólo un botón (eliminara todos los controles).Mantener pulsadoel botón T1 T1T2T1T2LED PR1El led PR1destellaráindicando elgrabado delboton deseado T1T2Pulsar el botón que quiera grabar Dejar el portón amitad del recorrido El portón se cierraautomáticamentey naliza la programaciónEl LED pr1 se va a encender y al soltarlo, el portón comenzará a cerrar hasta pisar el límite de cierre, luego abriráMantener pulsar el Antes de que el portón abra por completo,dar una orden con el botón del control remoto grabado donde se quiera iniciar el paso peatonalbotón T1 por 6”T1T2/ Mantenga alejados los controles y cables del alcance de niños y mascotas. El portón podría accionarse accidentalmente o sufrir lesiones./ Siempre corte el suministro eléctrico antes de operar manualmente el portón o realizar tareas de limpieza./ Evite aproximarse o caminar a través del portón. Su activación puede ocasionar accidentes./ Examine con frecuencia la instalación en busca de signos de desgaste o daño en los cables. Póngase en contacto con perso-nal autorizado en caso necesario.La garantía de los elementos o servicios vendidos por Grupo Motic SRL , (en adelante Motic ) aplica solo a los productos La garantía se reduce al reemplazo del producto defectuoso o a la reparación del mismo, dentro de un plazo de 10 días (dependiendo de la existencia de repuestos), a elección de Motic y a su solo criterio, no cubriendo las conse-cuencias ni costos ni daños emergentes ni daños contingentes que hubiera podido provocar o serles atribuidas a la falla.La garantía abarca única y explícitamente desperfectos de fabricación del equipo que no se encuentren relaciona-dos a errores en su aplicación, instalación, su uso en condiciones anormales o condiciones ambientales o meteo-rológicas extremas.La garantía se brinda en las instalaciones técnicas de Motic (su Domicilio Comercial) por lo que los equipos deben-dos o autorizados.Esta Garantía es Limitada y está sujeta a las condiciones y legislación vigente en la República Argentina,Para cualquier solicitud de cobertura de la Garantía, Reparaciones o Repuestos o cuestiones técnicas comunicar-se con Motic en Agüero 449, Teléfono (011) 4730-3222 en Villa Martelli (1603) Buenos Aires, Argentina. Este equipo está diseñado para uso residencial y no comercial, industrial o de alta demanda.Modelo de Equipo:Fecha de Compra: Lugar de Compra:Número de Factura de Compra:Número de Serie:garantíaPlazo de la Garantía para los motorreductores es de 2 (Dos) años a partir de la fecha de la factura. Las Controladoras electrónicas tienen 1 (Uno) año de garantía, los controles remotos 6 (Seis) meses, las pilas y otros consumibles no tienen garantía.。

Omega产品说明书

Where Do I Find Everything I Need for Process Measurement and Control?OMEGA…Of Course!Shop online at SMTEMPERATUREM U Thermocouple, RTD & Thermistor Probes, Connectors, Panels & AssembliesM U Wire: Thermocouple, RTD & ThermistorM U Calibrators & Ice Point ReferencesM U Recorders, Controllers & Process MonitorsM U Infrared PyrometersPRESSURE, STRAIN AND FORCEM U Transducers & Strain GagesM U Load Cells & Pressure GagesM U Displacement TransducersM U Instrumentation & AccessoriesFLOW/LEVELM U Rotameters, Gas Mass Flowmeters & Flow ComputersM U Air Velocity IndicatorsM U Turbine/Paddlewheel SystemsM U Totalizers & Batch ControllerspH/CONDUCTIVITYM U pH Electrodes, Testers & AccessoriesM U Benchtop/Laboratory MetersM U Controllers, Calibrators, Simulators & PumpsM U Industrial pH & Conductivity EquipmentDATA ACQUISITIONM U Communications-Based Acquisition SystemsM U Data Logging SystemsM U Wireless Sensors, Transmitters, & ReceiversM U Signal ConditionersM U Data Acquisition SoftwareHEATERSM U Heating CableM U Cartridge & Strip HeatersM U Immersion & Band HeatersM U Flexible HeatersM U Laboratory HeatersENVIRONMENTALMONITORING AND CONTROLM U Metering & Control InstrumentationM U RefractometersM U Pumps & TubingM U Air, Soil & Water MonitorsM U Industrial Water & Wastewater TreatmentM U pH, Conductivity & Dissolved Oxygen InstrumentsM0200/0117AC05-B, AC15-B,DC05-B, DC15-BSolid State Switch Modules and SSS-PC-B Series Backplanes e-mail:**************For latest product manuals: Shop online at SMUser’s G ui d eDI S C O N T I N U E D***********************Servicing North America:U.S.A. Omega Engineering, Inc.Headquarters: Toll-Free: 1-800-826-6342 (USA & Canada only)Customer Service: 1-800-622-2378 (USA & Canada only)Engineering Service: 1-800-872-9436 (USA & Canada only)Tel: (203) 359-1660 Fax: (203) 359-7700e-mail:**************For Other Locations Visit /worldwideThe information contained in this document is believed to be correct, but OMEGA accepts no liability for any errors it contains, and reserves the right to alter specifications without notice.WARRANTY/DISCLAIMEROMEGA ENGINEERING, INC. warrants this unit to be free of defects in materials and workmanship for a period of 13 months from date of purchase. OMEGA’s WARRANTY adds an additional one (1) month grace period to the normal one (1) year product warranty to cover handling and shipping time. T his ensures that OMEGA’s customers receive maximum coverage on each product.If the unit malfunctions, it must be returned to the factory for evaluation. OMEGA’s Customer Service Department will issue an Authorized Return (AR) number immediately upon phone or written request. Upon examination by OMEGA, if the unit is found to be defective, it will be repaired or replaced at no charge. OMEGA’s WARRANT Y does not apply to defects resulting from any action of the purchaser, including but not limited to mishandling, improper interfacing, operation outside of design limits, improper repair, or unauthorized modification. This WARRANTY is VOID if the unit shows evidence of having been tampered with or shows evidence of having been damaged as a result of excessive corrosion; or current, heat, moisture or vibration; improper specification; misapplication; misuse or other operating conditions outside of OMEGA’s control. Components in which wear is not warranted, include but are not limited to contact points, fuses, and triacs.OMEGA is pleased to offer suggestions on the use of its various products. However, OMEGA neither assumes responsibility for any omissions or errors nor assumes liability for any damages that result from the use of its products in accordance with information provided by OMEGA, either verbal or written. OMEGA warrants only that the parts manufactured by the company will be as specified and free of defects. OMEGA MAKES NO OTHER WARRANTIES OR REPRESENTATIONS OF ANY KIND W HATSOEVER, EXPRESSED OR IMPLIED, EXCEPT THAT OF TITLE, AND ALL IMPLIED W ARRANTIES INCLUDING ANY W ARRANTY OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE HEREBY DISCLAIMED. LIMITATION OF LIABILITY: The remedies of purchaser set forth herein are exclusive, and the total liability of OMEGA with respect to this order, whether based on contract, warranty, negligence, indemnification, strict liability or otherwise, shall not exceed the purchase price of the component upon which liability is based. In no event shall OMEGA be liable for consequential, incidental or special damages.CONDITIONS: Equipment sold by OMEGA is not intended to be used, nor shall it be used: (1) as a “Basic Component” under 10 CFR 21 (NRC), used in or with any nuclear installation or activity; or (2) in medical applications or used on humans. Should any Product(s) be used in or with any nuclear installation or activity, medical application, used on humans, or misused in any way, OMEGA assumes no responsibility as set forth in our basic WARRANTY / DISCLAIMER language, and, additionally, purchaser will indemnify OMEGA and hold OMEGA harmless from any liability or damage whatsoever arising out of the use of the Product(s) in such a manner.RETURN REQUESTS/INQUIRIESDirect all warranty and repair requests/inquiries to the OMEGA Customer Service Department. BEFORE RET URNING ANY PRODUCT (S) T O OMEGA, PURCHASER MUST OBT AIN AN AUT HORIZED RET URN (AR) NUMBER FROM OMEGA’S CUST OMER SERVICE DEPART MENT (IN ORDER T O AVOID PROCESSING DELAYS). T he assigned AR number should then be marked on the outside of the return package and on any correspondence.The purchaser is responsible for shipping charges, freight, insurance and proper packaging to prevent breakage in transit.OMEGA’s policy is to make running changes, not model changes, whenever an improvement is possible. This affords our customers the latest in technology and engineering.OMEGA is a registered trademark of OMEGA ENGINEERING, INC.© Copyright 2017 OMEGA ENGINEERING, INC. All rights reserved. This document may not be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form, in whole or in part, without the prior written consent of OMEGA ENGINEERING, INC.FOR WARRANTY RETURNS, please have the following information available BEFORE contacting OMEGA:1. Purchase Order number under which the product was PURCHASED,2. M odel and serial number of the product under warranty, and3. R epair instructions and/or specific problems relative to the product.FOR NON-WARRANTY REPAIRS, consult OMEGA for current repair charges. Have the following information available BEFORE contacting OMEGA:1. P urchase Order number to cover the COST of the repair,2. Model and serial number of the product, and 3. Repair instructions and/or specific problemsrelative to the product.。

拜伦克（澳大利亚）有限公司产品简介说明书

Dixon (Asia Pacific) Pty Ltd170 Francis Road Wingfield, SA 5013PO Box 2491 Regency Park, SA 5942AustraliaPhone(08) 8202 6000Fax (08) 8202 6099.auABN 35 075 100 239Through it's divisions and affiliated companies, Dixon is recognised as the premier manufacturer and supplier of hose fittings, pipe, valves, specialty mining products and accessories spanning a wide range of industrial uses. Dixon's reach includes products for food, dairy processing, beverage and brewery, mobile tankers, mining,construction, chemical processing, petroleum, oilfields, refining, nuclear and manufacturing.Dixon pays strict attention to the values that have formed the core of its success for decades: unmatched customer service, quality products, and the core values of responsibility, respect, caring, citizenship, trust and fairness.Shoulde r ed Piping Systems and Couplinged Piping Systems and Coupling Guide 2006Guide 200In today’s world of mining and mineral processing, the process of facility design and engineeringmoves at a rapid pace. Fast track construction is often the rule, not the exception. When it comes to piping,The Minsup™ Shouldered Piping System can help you manage those accelerated schedules whilst meeting or exceeding design standards, savingyou money in the process.The range comprises: shouldered pipe, shouldered valves, 2 and 4 bolt couplings, quick release couplings and the new interlock shouldered couplings.3Room 203Building 3, No. 1000 Xiechun Road Jiading DistrictShanghai PRC 201804Phone +86 021 6089 9980Fax+86 021 6992 2177River Place62 Havelock Road Apt #09-07Singapore 169659Phone +65 6693 5977*****************************.au******************************.auDixon Asia Pacific Private Limited6 Union Circuit Yatala QLD 4207Phone (07) 3807 1415Fax(07) 3807 1843Phone• No loose parts. Captive washer on the nut and the bolt is retained in the housing.• Suitable for pressure or vacuum applications. • Single bolt design.• ‘No Pinch’ housing design assures a positive gasket seal. • High pressure applications. • Patented design.• 3 simple steps to assemble freight costs.Housing: SG Iron - ISO 1083:400-250-15 SGI Lever: SG Iron - ISO 1083:400-250-15 SGI Side Plates: 4” & 6” - ISO 1083:400-250-15 SGI Other sizes are pressed mild steel. Gasket: Buna-N Finish: Zinc Plated- Offset Tee - Flanged Adaptor - Blank end - Setting Piece - Y piece - Concentric Reducers - CrossAlso available in theMinsup TM Shouldered Piping System range:Dimensional Characteristics* Australian pipe sizesMaterials: BS 1387:1985 - Standard specifications for screwed and socketed steel tubes and tubulars and for plain end steel tube suitable for welding and for screwing to BS21 pipe threads.Max Working Pressure: 3500 KPaHot Dip Galvanised: Min. 300g/m 2 coverage conforming to AS/NZS 4792 - Hot dipped galvanised (zinc) coating on ferrous hollow section, applied by a continuous or a specialised process.*Working pressure (capacity) as tested to AWWAC606 requirements for grooved and shouldered joints Safety factor of 3:1 on burst pressure.Material: SG iron to ISO 1083:400-250-15 SGI. Bolts & Nuts: Metric; grade 4.6 to AS1112.Working pressure (capacity) as tested to AWWA C606 requirements. Safety factor of 3:11 23Nominal Bore mm 50 80 100 150 200 250 300 350 400 450 500 600OD mm 60.3 88.9 114.3 165.1 219.1 273.1 323.9 355.6 406.4 457.0 508.0 609.6Working Pressure MPa psi 5.2 5.2 5.2 4.0 4.0 1.8 1.6 1.6 1.6 1.6 1.6 1.6755755755580580260230230230230230230Part #08/048/20/00008/048/20/00208/048/20/00308/048/20/00508/048/20/00608/048/20/00708/048/20/00808/048/20/02008/048/20/02108/048/20/02208/048/20/02308/048/20/024Pipe Size DN Pipe OD (mm) Part # Working PressureMPa PS I 50 80 100 150 20060.3 88.9 114.3 165.1 219.1FKG-502L-65 FKG-502L-88 FKG-502L-114 FKG-502L-165 FKG-502L-2193.5 3.5 3.5 2.5 2.5500 500 500 360 360O . D .Tee (equal)Adaptor ScrewedElbow 45°45°Elbow 90°90°Bolted CouplingQuick Release CouplingInterlock CouplingShouldered Mining PipeFront and Side view of Quick Release CouplingTop and Side view of Bolted CouplingInterlock Coupling and shouldered PipeBSP F x 2” Shouldered 2“ Shouldered x 2” Shouldered BSP F 1” x 2” Shouldered Shoulderd Lever Operated Butterfly Valve Part # 08/048/19/000G 08/048/19/002G 08/048/19/003G 08/048/19/005G 08/048/19/006G2.42.42.42.42.4Working* Pressure MPa NominalBore mm 50 80 100 150 200OD mm 60.3 88.9 114.3 165.1 219.1Quick Release CouplingsMaterial Specifications Material SpecificationsShouldered Piping Systems AccessoriesMinsup Ball Valve / Butterfly ValvesHousing Material Ductile iron to ISO 1083 Bolts High Tensile Finish Electro Galvanised Safety Factor3:1Specifications Shouldered Gate Valve。

华为MML查询命令大全

查询802.1x状态信息(DSP DOT1X)
查询DSCP到VLAN优先级的映射(DSP DSCPMAP)
查询E1/T1端口状态(DSP E1T1)
显示ECO配置(DSP ECO)
查询电子标签(DSP ELABEL)
查询环境监控单元状态(DSP EMU)
查询射频模块睡眠动态参数(DSP ENODEBAUTOPOWEROFF)
查询电调天线子单元动态信息(DSP RETSUBUNIT)
显示互调干扰检测(DSP RFTEST)
查询RHUB状态(DSP RHUB)
查询RRU/RFU动态信息(DSP RRU)
查询RRU链环动态信息(DSP RRUCHAIN)
查询RRU/RFU物理信息(DSP RRUCHAINPHYTOPO)
查询AARU动态信息(DSP AARU)
查询AAS动态信息(DSP AAS)
查询生效的访问控制列表规则信息(DSP ACLRULE)
查询空口软同步状态(DSP AISSSTAT)
查询天线设备版本信息(DSP ALDVER)
查询பைடு நூலகம்区下所有UE的基本信息(DSP ALLUEBASICINFO)
查询IPSec SA状态(DSP IPSECSA)
查询IPv6 IPSec SA状态(DSP IPSECSA6)
查询IPSec SA统计信息(DSP IPSECSADELSTAT)
查询IP报文收发统计信息(DSP IPSTAT)
查询License销售信息(DSP LICINFO)
查询E1/T1线路时钟状态(DSP LINECLK)
查询端口重定向信息(DSP PORTREDIRECT)

FS FORTH-SYSTEME GmbH Mod520C_2 产品说明书

Mod520C_2P.O. Box 11 03l D-79200 Breisach, Germany Kueferstrasse 8l D-79206 Breisach, Germany (+49 (7667) 908-0 l Fax +49 (7667) 908-200 l e-mail:****************Mod520C_2© Copyright 2004:FS FORTH-SYSTEME GmbHPostfach 1103, D-79200 Breisach a. Rh., GermanyRelease of Document:May 27, 2004Filename:Mod520C_2.docAuthor:Hans-Peter SchneiderAll rights reserved. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of FS FORTH-SYSTEME GmbH.2Mod520C_2 Table of Contents1.Introduction (4)2.Features (5)3.Functional Description (6)3.1.1.CPU AMD ÉlanSC520 (6)3.1.2.SDRAM stage (6)3.1.3.ROM stage (6)3.1.4.SRAM stage (6)3.1.5.32 I/O Ports (7)3.1.6.256 Byte EEPROM for BIOS and Applications on PIO30,31 (7)3.1.7.On-board Power Supply (7)3.1.8.Voltage Supervision, RESET Generation (7)3.1.9.Serial Ports (7)3.1.10.Fast Ethernet Controller Stage (8)3.1.11.Dual CAN Controller Stage (8)3.1.12.GP Bus used for ISA Bus (9)4.Connectors Of MOD520C (10)4.1.System Connector X2 (10)4.2.System Connector X4 (12)5.Application Notes (14)5.1.Power Supply (14)5.2.Important Signals (14)5.2.13.PCICLKRTN PCICLK PCICLKETHER (14)5.2.14.ISA-Bus Signals (14)5.2.15.CAN-Interrupt IRQ11 (15)6.Members of the MOD520C family (16)3Mod520C_21. IntroductionThe module MOD520C with its integrated and optional peripherals, based on the 32 Bit AMD ÉlanSC520 microcontroller, is designed for medium to high performance applications in telecommunication, data communication and information appliances on the general embedded market. It can easily be designed in customized boards.The AMD ÉlanSC520 microcontroller combines a low voltage 586 CPU running on 133 MHz, including FPU (Floating Point Unit) with a set of integrated peripherals: 32 Bit PCI controller, SDRAM controller for up to 256 MByte, GP (General Purpose) bus with programmable timing and ROM/Flash controller. Enhanced PC compatible peripherals like DMA controller, two UARTs and battery buffered RTC and CMOS, watchdog and software timers make this device a very fast system for both real time and PC/AT compatible applications. Insyde Software’s Mobile BIOS is available which offers serial and parallel remote features (video, keyboard, floppy). Furthermore FS FORTH-SYSTEME has adapted Datalight Sockets (TCP/IP Stack), ROM-DOS and the Flash File System FlashFX to this environment.The MOD520C offers the software engineer the possibility to reduce the time-to-market phase even more. FS FORTH-SYSTEME added several features on-board as SDRAM (up to 64 MByte), PCI Fast Ethernet controller to facilitate networking and remote control. A Strata-FLASH for booting and data is included on board. Two CAN Ports are additionally available for communication. 512 Kbyte SRAM is available for battery buffered data. The enhanced JTAG port for low-cost debugging is supported. This allows instruction tracing during execution. FS FORTH-SYSTEME has adapted Windows CE 3.0 to this platform and offers drivers and support. With Ethernet debugging the software designer has powerful means for fast debugging his applications.Due to the 16 MByte FLASH it is possible to build larger, complete systems on this module like Linux, QNX or VxWorks.4Mod520C_252. Features• 16 MByte STRATA-FLASH or 2 MByte AMD FLASH • 64 MByte or 16 MByte SDRAM • 512 KByte battery buffered SRAM• PCI Ethernet controller with EEPROM. Rx and Tx signals are providedon the System Connectors • Two CAN-Buses.• Enhanced JTAG port available on System Connector.• GP-Bus signals available on System Connector • PCI-Bus signals available on System Connector• BIOS for ÉlanSC520 by Insyde Software Inc. Including serial or parallelremote features (Video, Keyboard, Floppy).Mod520C_23. Functional Description3.1.1. CPU AMD ÉlanSC520The CPU AMD ÉlanSC520 is powered with 2.5V (core and analog path) and 3.3V (all other voltages) except VRTC, which is powered with about 3V either from battery or from on-board 3.3V. This voltage is limited to 3.3V, the other 3.3V power planes have a limit of 3.6V.The CPU is clocked with a 32.768 kHz quartz. An internal PLL derives from this frequency the RTC clock and DRAM refresh clock and the clocks for PC/AT compatible PIT (1.1882 MHz) and UARTs (18.432 MHz). All other stages (CPU, PCI, GP bus, GP DMA, ROM, SSI, timers) are fed from the second clock generator driven by a 33.33 MHz clock oscillator. SDRAM is clocked with 66.66 MHz.3.1.2. SDRAM stageThe SDRAM (up to 128 MByte on-board) has its own DRAM bus containing memory addresses MA0..12, memory data MD0..31 and control signals for up to four banks. Due to small load no buffering of clocks and signals is necessary.3.1.3. ROM stageROM or FLASH are driven by the general purpose address bus GPA0..25. It has three programmable chip selects with each up to 64 MByte range. The ROM Data bus is either the 32 bit general purpose bus GPD0..31 or the memory data bus MD0..31. Configuration pins decide, which bus at boot time is used. The bus size is selectable with 8, 16 or 32 bit. The MOD520C has a FLASH IC for up to 16 MByte 16 bit ROM or FLASH selected by BOOTCS# connected to MD0..15. 3.1.4. SRAM stageThe SRAM (512 KByte on-board) is buffered by VBAT. The Memory Location is defined in the System BIOS. ROMCS1# is used to access the SRAM.6Mod520C_23.1.5. 32 I/O PortsThe ÉlanSC520 CPU has 32 I/O ports. They have alternate functions. Most of them are control signals for GP bus (PIO0..26) used as ISA-bus. PIO27 (GPCS0#) is used as a programmable external chip select and PIO28,29 are not connected. PIO30,31 are used to drive a serial parameter EEPROM on-board. 3.1.6. 256 Byte EEPROM for BIOS and Applications on PIO30,31An on-board serial EEPROM with 256 byte and I2C bus is controlled by PIO30 (I2CDAT) and PIO31 (I2CCLK). 128 byte are used for non-volatile BIOS defaults, the remaining range may contain application specific data and parameters. The BIOS contains calls to read and write to this memory (see BIOS documentation).3.1.7. On-board Power SupplyThe 2.5V on-board voltage is generated from +5V.An external battery may be connected to the signal VBATIN. Battery status is controlled by BBATSEN, which sets a power fail bit in a status register for RTC, if BBATSEN is low at power-up.3.1.8. Voltage Supervision, RESET GenerationThree voltages are used on board: +2.5V, +3.3V and +5V. U2 controls +5V and U10 controls +3.3V. LBOUT or PWRGOOD will become low, if these voltages are out of tolerance. An external SRESET# is wired or-ed to U10. It can also be activated from extended JTAG signal SRESET# via X1. The wired OR of 1RESET# and 2RESET# control U10. Its output PWRGOOD is low (not active), if either the signals described above from U10 are low or +5V is out of tolerance. Typical length of PWRGOOD low is longer than 1 sec (minimum 790 msec).3.1.9. Serial PortsThe AMD ÉlanSC520 CPU has two internal asynchronous ports and one synchronous serial port. Both of this ports are available at the System Connectors.7Mod520C_23.1.10. Fast Ethernet Controller StageConnected to the PCI bus device 0 (REQ/GNT0#) of the Élan SC520 CPU, a Fast Ethernet Controller U7 supports 10/100Mbps transfer depending on driver software. X3 is a JST B5B-PH-SM3 5 pin connector. Parameters as physical address and power down modes are stored in a 64X16 bit Serial EEPROM controlled by U7. 2 status LEDs LE1, LE2 show the state of the Ethernet connection. For a more detailed hardware and software description see Intel 82559ER manual.3.1.11. Dual CAN Controller StageThe CAN Controller is selected via ROMCS1# and the Memory location is selectable in the BIOS Setup Screen. The CAN Interrupt provided by 82C900 is inverted by the onboard Lattice CPLD. Since the Interrupt asserted by the 82C900 is only a low active pulse of 0.2µs the CPLD holds the interrupt active until the software accesses the Memory at the location CAN-Base+1xxh. The BIOS routes this interrupt to IRQ11.8Mod520C_2 3.1.12. GP Bus used for ISA BusThe AMD ÉlanSC520 CPU contains an 8/16bit General Purpose Bus (GP bus) with 26 address lines (GPA0..25), 16 data lines (GPD0..15) and different control lines using PIO ports in their alternate GP bus function. Its timing is programmable for speeds up to 33MHz. This bus is to emulate a 16 bit ISA bus (PC/104) running with 8 MHz. ISA bus signal are connected without buffers directly to the lines of the CPU due to the 5V tolerance of the 3.3V signals.8 bit signals SMEMRD# and SMEMWR# (active only at addresses beyond 1 MByte) are not supported (GPMEM_RD# and GPMEM_WR# used).The AMD ÉlanSC520 CPU has only 4 DMA channels on GP bus. DMA channel 2 is used for Super-I/O (U2) on EVAMOD520. All four channels are connected to edge connector X2.Not supported ISA bus signals 0WS#, IOCHK#, IRQ15, REFRESH#, 8MHz and 14.318 MHz clocks, MASTER#.9Mod520C_24. Connectors Of MOD520C4.1. System Connector X2Pin Function I/O Pin Function I/O1+3.3V power2GND power 3+3.3V power4GND power 5GPD0I/O6TDP O7GPD1I/O8TDN O9GPD2I/O10not connected11GPD3I/O12RDP I13GPD4I/O14RDN I15GPD5I/O16not connected17GPD6I/O18DRQ0I19GPD7I/O20DRQ2I21GPD8I/O22DRQ5I23GPD9I/O24DRQ7I25GPD10I/O26DACK0#O27GPD11I/O28DACK2#O29GPD12I/O30DACK5#O31GPD13I/O32DACK7#O33GPD14I/O34GND power 35GPD15I/O36GPRESET O37GND power38GPIORD#O39GPA0O40GPIOWR#O41GPA1O42GPALE O43GPA2O44GPBHE#O45GPA3O46GPRDY I47GPA4O48GPAEN O49GPA5O50GPTC O51GPA6O52GPDBUFOE#O53GPA7O54GPIO_CS16#O55GPA8O56GPMEM_CS16#O57GPA9O58GPCS0#O59GPA10O60GPMEM_RD#O61GPA11O62GPMEM_WR#O63GPA12O64GND power 10Pin Function I/O Pin Function I/O65GPA13O66EXTRES#I67GPA14O68PWRGOOD O69BUFA15O70CLKTEST71BUFA16O72PRG_RESET73BUFA17O74GND power75BUFA18O76GPCS1#O77BUFA19O78GPCS2#O79BUFA20O80GPCS3#O81BUFA21O82GPCS4#O83BUFA22O84GPCS5#O85BUFA23O86GPCS6#O87BUFA24O88GPCS7#O89BUFA25O90VBATIN power91GND power92GND power93IRQ1I94RSTLD0I95IRQ3I96RSTLD1I97IRQ4I98RSTLD2I99IRQ5I100RSTLD3I101IRQ6I102RSTLD4I103IRQ7I104RSTLD5I105IRQ9I106RSTLD6I107IRQ10I108RSTLD7I109CANINT I110DBGDIS I111IRQ12I112INSTRC I113IRQ14I114DBGENTR I115SPEAKER O116not connected117+5V power118GND power119+5V power120GND power114.2. System Connector X4Pin Function I/O Pin Function I/O1PCICLKRTN I2GND power 3PCICLK O4PCICLKETHER I5AD0I/O6CBE0#I/O7AD1I/O8CBE1#I/O9AD2I/O10CBE2#I/O11AD3I/O12CBE3#I/O13AD4I/O14not connected15AD5I/O16not connected17AD6I/O18not connected19AD7I/O20not connected21AD8I/O22GND power 23AD9I/O24RXD1I25AD10I/O26TXD1O27AD11I/O28CTS1#I29AD12I/O30DCD1#I31AD13I/O32DSR1#I33AD14I/O34RIN1#I35AD15I/O36DTR1#O37AD16I/O38RTS1#O39AD17I/O40RXD2I41AD18I/O42TXD2O43AD19I/O44CTS2#I45AD20I/O46DCD2#I47AD21I/O48DSR2#I49AD22I/O50RIN2#I51AD23I/O52DTR2#O53AD24I/O54RTS2#O55AD25I/O56CANH1/TXD157AD26I/O58CANL1/RXD159AD27I/O60CANH2/TXD261AD28I/O62CANL2/RXD263AD29I/O64GND power 12Pin Function I/O Pin Function I/O65AD30I/O66SRESET#I67AD31I/O68GPRESET#O69GND power70TCK O71INTA#I72TMS73INTB#I74TDI I75INTC#I76TDO O77INTD#I78TRST#I79REQ0#I80CMDACK81REQ1#I82BR/TC83REQ2#I84GND Power85REQ3#I86STOP/TX87REQ4#I88TRIG/TRACE89GNT0#O90not connected91GNT1#O92ACTLED#O93GNT2#O94LILED#O95GNT3#O96SPEEDLED#O97GNT4#O98not connected99GND power100GND power101PAR I/O102SSI_CLK O103PERR#I/O104SSI_DO O105SERR#I106SSI_DI I107FRAME#I/O108not connected109TRDY#I/O110ISP_TDI I111IRDY#I/O112ISP_TDO O113STOP#I/O114ISP_TMS115DEVSEL#I/O116ISP_TCK I117RST#O118BSCAN#119GND power120GND power135. Application Notes5.1. Power SupplyThe MOD520C needs +3.3V and 5V power supply.3.3V worst case supply current is 1130 mA5V worst case supply current is 550 mABe sure to design your power supply for this current including large load transients.5.2. Important Signals5.2.13. PCICLKRTN PCICLK PCICLKETHERPCICLK is the clock source for the PCI-Bus. PCICLKETHER is the clock input for the Ethernet Controller. PCICLKRTN is the clock input of the AMD Élan Sc520. This pin is used to synchronize the CPU with the external PCI-Bus. Therefore it is important that all clock traces have the same length to provide each PCI-Target with the clock at the same time. Trace length of each of this clocks is 68mm on the module. If you do not plan to connect an additional PCI-Target on your board you just add a serial resistor 33R between PCICLK and PCICLKRTN and one between PCICLK and PCICLKETHER.5.2.14. ISA-Bus SignalsIf you use the ISA-Bus Signals you have to add some resistors to the following Signals:GPD0 – GPD15 4k7 pull upGPRDY1k pull downIRQ´s10k pull upDRQ´s10k pull down145.2.15. CAN-Interrupt IRQ11IRQ11 is used for the CAN-Controller 82C900 and is not sharable. Since the interrupt provided by 82C900 is a low active pulse with a length of 0.2µs the CPLD inverts this signal and holds it until the software acknowledges the interrupt. To acknowledge this interrupt the software has to access a memory location with the offset 1xxh to the CAN-Base. This memory access is just an access of the system memory, not an access of the CAN-Controller.156. Members of the MOD520C familyNumbe r Variant Flash SDRAM SRAM CAN CAN-DriverTemp.320MOD520C_0_V018M*16, Strata(=16 Mbyte)1*TM014452*4M*16(=16 Mbyte)2*TM01519512k*8Yes Yes0..70°321MOD520C_0_V021M*16, AMD(=2 Mbyte)1*TM015202*4M*16(=16 Mbyte)2*TM01519512k*8Yes Yes0..70°322MOD520C_0_V038M*16, Strata(=16 Mbyte)1*TM014452*16M*16(=64 Mbyte)2*TM01249512k*8Yes Yes0..70°334MOD520C_1_V01MOD520C_2_V018M*16, Strata(=16 Mbyte)1*TM014452*4M*16(=16 Mbyte)2*TM01519512k*8TM0Yes no0..70°335MOD520C_1_V02MOD520C_2_V021M*16, AMD(=2 Mbyte)1*TM015202*4M*16(=16 Mbyte)2*TM01519512k*8TM0Yes no0..70°336MOD520C_1_V03MOD520C_2_V038M*16, Strata(=16 Mbyte)1*TM014452*16M*16(=64 Mbyte)2*TM01249512k*8TM0Yes no0..70°184MOD520C_1_V048M*16, Strata(=16 Mbyte)1*TM014452*4M*16(=16 Mbyte)2*TM01519No No No0..70°16。

Lucius ReCom HPS DE Ballast 600W 800W 1000W说明书

THANK YOU FOR PURCHASING YOUR LUCIUS RECOM HPS DOUBLE ENDED BALLAST .Lucius ReCom HPS DE 600, 800 & 1000W Ballasts are designed to efﬁciently and effectively provide optimum levels of horticultural light.Lucius ReCom HPS DE Ballast operates a large selection of High Intensity Discharge (HID) L amps, Double Ended High Voltage (DE, HV/400V), High Pressure Sodium (HPS) and Metal-Halide (MH) lamps.All L ucius ReCom Ballasts can be controlled manually via the control knob or by the L ucius L ight Management Controller (LMC). Dimming function for up to 200 Lucius Ballast, ON or OFF ballast timing on multiple zones is all controlled remotely with one L MC. The L ucius L ight Management Controller is sold separately and includes many features described in the L ucius Light Management Controller instruction manual.The L ucius ReCom HPS DE Ballast is equipped with safety features that protect against overloading, short circuit, over temperature, over and under voltage protection and more. With a peak efﬁciency of 97% the Lucius ReCom HPS DE Ballast is the most efﬁcient and powerful HV Ballast on the market. It complies with international standard IEC and meets EMI/EMS requirements.The Lucius ReCom Ballast is tested and approved by internal and external QC departments.Lucius ReCom Ballasts are the ideal option for Remote or Combo application and compatible with all other reﬂectors and ballast.Please read and hang on to this instruction manual, to help in reducing the risk of damage to the ﬁxture, to yourself or others. Use the ﬁxture only as outlined in this manual.INTRODUCTIONINSTRUCTION MANUALRECOMHPS DE BALLASTtime before touching the lamp or reﬂector after use.Do not hold and carry any of the products by the power cords, or pull the power cord with excessive force.Do not use the ﬁxture outside the rated temperature range or outside the rated voltage range.Do not attempt to disassemble, repair, or modify the ﬁxture. Never power on the ballast without the lamp connected.Do not use any of the products if any damage is present.Do not turn the ballast on and off rapidly, as this can cause damage to the ballast and the lamp.This product complies with all necessary radio interference regulations; however, there may still be a radio interference effect on sensitive equipment.Avoid coiled cords. Coiled cords may lead to electromagnetic munication equipment operating between 9kHz – 1GHz. Relocate the ballast should any interference occur.Never stack ballasts. Operating ambient temperature of the ballast is -20 to 40°C (-4 to 104°F). By providing the ballast with ambient air temperature of less than 30°C (86°F), it can work more efﬁciently and avoid any damage.Before installation of the ballast, lamp & reﬂector, ensure the light kit is disconnected from any power and controller.Do not position the ﬁxture in the following locations:• Locations subject to direct water exposure• Locations subject to direct vibration or shock• Locations subject to excessive dust• Locations subject to direct sunlight• Locations subject to condensation or icing• Locations subject to corrosive or explosive gases• Locations subject to strong static electricity or harmonicsAU/NZS UK & EU5.1 Using the external timer box5.1.1 Set the control knob to the rated power.Note: Before d ensure the lamp is operated at the nominal power (100%) for at least 100 hours to stabilize the lamp. Failing to do so may lead to sub-optimal light levels and premature end of life failure of lamp.5.1.2 section 3 of this manual and lamp safety factors located on the lamp sleeve.5.1.3 Switch on the main power.Note: All Lucius ReCom ballasts are equipped withignition time delay to reduce the total inrush current. As a result, there is a small d elay before the lamp ignites.The L ucius ReCom HPS DE Ballasts can be operated by either external timer box or L ucius L ight Management Controller. After installing the light kit (ballast, bracket, reﬂector, and lamp) and ensuring the electrical connections are secure, follow below steps.PER ZONEPER ZONE 800W DE800W DEBefore operation, ensure all electrical connections are secure.• Connect the Lucius Light Management Controller to the Input AUX port of the ballast via the controller Jumper Cable (Signal Wire) .• Using the Jumper Cable, connect the output AUX port of the ﬁrst ballast to the input AUX port of the second ballast and repeat this process to connect up to 100 ballasts per controller port x 2 zones (Total 200 ballasts).1 Switch off main power.2 Ensure the lamp is properly installed. Never use the ﬁxturewithout a lamp or reﬂector.3 Ensure the reﬂector cable plug in ﬁrmly connected to theballast output plug.4 L ucius L ight Management Controller connections (ifapplicable):5 Ensure the power cord and the controller cable does nottouch the reﬂector.6 Connect the ballast input cable to the power outlet.Ensure power is off.7 If external switch gear is used to supply power to ﬁxture,ensure it can cope with the inrush current of the ﬁxture (see ballast speciﬁcations). Never use household timers to switch the ﬁxture.8 Always use an electrical contractor to ensure wiring cansupport the voltage and current requirements of the ﬁxture.Ballast input view (See Lucius Light Management Controller Instruction Manual for more details.)4. ELECTRICAL CONNECTIONS5. START UP5.2 Using the Lucius Light Management Controller (LMC)5.2.1 Switch off the main power of the ballast.Turn the control knob to the “L option.5.2.2 Connect the LMC power adaptor to theseparate power supply and turn the LMC on. Adjust all selection, dimming, timing, temperature settings, etc.) follow instructions on the power to the nominal values or 100%.5.2.3 Follow section 4.4connections.5.2.4 Switch on the main power. Thecontroller LED on the ballast will turn on when the connection is successful and the ballast is fully controlled by the LMC.Note: You will need to connect the ballast input plug to thepower supply or a distribution box.5.1.4 You can adjust the control knob to achieve thedesired light level.6. GENERAL MAINTENANCEDisconnect the product from all power before performing any maintenance. Regularly check the ﬁxture for dust or dirt build-up. Dust, dirt, and ﬁngerprint on the lamp, reﬂector and ballast may cause overheating and decreased performance.•Clean the lamp regularly with a soft, dry and clean cloth.•Clean the ballast and outside of the ﬁxture using a dry or damp cloth.•The lamp should be replaced every 5000 lighting hours or after 1 year’s operation.•L ucius recommends replacement of reﬂector after 5000 lighting hours to maintain maximum reﬂectivity. Depending on environment and lamp type the reﬂector will degrade. The Miro® aluminium cannot be cleaned without damage, therefore it is recommended that reﬂectors are changed once every year.•Do not clean the ﬁxture with detergents, abrasives, or other aggressive substances. Do not touch the inside of the reﬂector during installation and do not use water to clean it. This will damage the reﬂective coating on the surface.•Allow sufﬁcient time before connecting the light kit to the power supply after maintenance work has been conducted.•Regularly check the wiring of the product to ensure it is undamaged.Note: Before initial use, the lamp may have a black mark on the arc tube. Do not be concerned! This shows the light kit has been tested prior to packaging. This will disappear when the lamp runs at full power.7. STORAGE AND DISPOSAL•Store the ﬁxture in a dry and clean environment, with an ambient temperature of -40 to 70°C / -40 to 158°F.•The product must not be discarded as unsorted municipal waste, but must be collected separately for the purpose of treatment, recovery, and environmentally sound disposal.•The lamps are chemical hazardous waste (mercury) and must be delivered to the designated authorities.8. WARRANTYRefer to warranty on packaging. Lucius is not liable and the warranty will be void under the following circumstances:•Incorrect use of the product.•Not adhering to the warnings established in this instruction manual.•Improper storage and handling.•Unauthorised modiﬁcation of the product.•Use of unauthorised accessories or parts with the product.•Purchases from unauthorised retailers or dealers.Contact the retailer where the product was originally purchased for warranty claims and further information. .au | .au。

bcu材质成份

bcu材质成份BCu是一种铜基合金，根据不同的型号和用途，其成分会有所不同。

以下是几种常见的BCu合金的成分：1.BCu92P：成分P占7.5%～8.5%，铜为余量。

该合金的熔化温度在710℃～750℃之间，流动性较好，但比较脆。

它通常用于钎焊不受冲击载荷、无振动的铜和黄铜零件。

2.BCu93P（HL201/BCuP-2）：成分P占6.80%～7.50%，铜为余量。

该合金的熔化温度在710℃～793℃之间，流动性好，可以流入间隙很小的接头。

它同样具有脆性，一般用于机电和仪表工业中钎焊不受冲击载荷的铜和黄铜零件。

3.BCu89SnP（HL208）：成分P占6.80%～7.50%，锡占5.0%～6.0%，铜为余量。

该合金的熔化温度在620℃～660℃之间，熔点低，流动性好，可配合银钎剂钎焊铜、黄铜、青铜及低锌黄铜零件。

4.BCu86SnP：成分P占4.80%～5.80%，锡占7.00%～8.00%，镍占0.40%～1.20%，铜为余量。

该合金的熔化温度在620℃～670℃之间。

镍的加入增大了脆性，但提高了流动性，并且焊缝光亮。

它一般用于铜及黄铜钎焊。

请注意，这些合金的具体成分可能会因生产厂家和用途的不同而有所差异。

在使用前，建议查阅相关的技术文档或咨询专业人士以获取准确的信息。

BCu合金是一种广泛应用于各种工业领域的铜基合金。

根据不同的成分和特性，BCu合金可以用于多种不同的用途。

首先，BCu合金在电气行业中有着重要的应用。

由于铜具有良好的导电性，BCu合金常被用于制造电线、电缆、电器开关、接插件等电气元件。

这些元件需要良好的导电性能和稳定的机械性能，BCu合金能够满足这些要求。

其次，BCu合金也广泛用于制造各种机械零件和工具。

例如，BCu 合金可以用于制造轴承、齿轮、螺母、螺栓等机械零件，这些零件需要具有一定的耐磨性、耐腐蚀性和抗疲劳性能。

BCu合金还可以通过热处理和冷加工等工艺进一步提高其机械性能，以满足更为苛刻的使用条件。

华为c网mml查询命令大全

查询AARU动态信息(DSP AARU)查询AAS动态信息(DSP AAS)查询生效的访问控制列表规则信息(DSP ACLRULE)查询空口软同步状态(DSP AISSSTAT)查询天线设备版本信息(DSP ALDVER)查询小区下所有UE的基本信息(DSP ALLUEBASICINFO)查询天线端口动态信息(DSP ANTENNAPORT)查询应用(DSP APP)查询正在使用的设备证书的状态信息(DSP APPCERT)查询ARP表项(DSP ARP)查看ARP黑名单(DSP ARPSPOOFING)查询蓄电池安装日期(DSP BATINDT)查询蓄电池状态(DSP BATTERY)查询蓄电池测试结果(DSP BATTR)查询跨框基带互联实际情况(DSP BBPLNK)查询BBU框间业务数据链路质量的统计信息(DSP BBPLNKSTAT) 查询基带板业务能力(DSP BBPTC)查询波束赋形天线动态信息(DSP BFANT)查询波束赋形天线权值库文件(DSP BFANTDB)查询BFD会话状态(DSP BFDSESSION)查询BITS状态(DSP BITS)查询主备备份状态(DSP BKPSTATUS)查询单板(DSP BRD)查询单板制造信息(DSP BRDMFRINFO)查询扩展传输板的主管制式(DSP BRDRAT)查询单板温度(DSP BRDTEMP)查询单板版本信息(DSP BRDVER)查询网元工程状态(DSP BSSTATUS)查询机柜制造信息(DSP CABMFRINFO)查询CA小区集小区的动态参数(DSP CAGROUPCELL)查询CANBUS状态(DSP CANSTATE)查询CB(DSP CB)查询机柜控制单元状态(DSP CCU)查询小区动态参数(DSP CELL)查询小区广播运营商顺序(DSP CELLBROADCASTCNOPERATOR) 查询小区通道校正结果信息(DSP CELLCALIBRATION)查询小区当前的CSPC开通状态(DSP CELLCSPCSTATUS)查询小区MBMS信息(DSP CELLMBMSCFG)查询小区物理拓扑关系(DSP CELLPHYTOPO)查询小区RF智能关断状态(DSP CELLRFSHUTDOWN)查询小区模拟负载控制动态信息(DSP CELLSIMULOAD)显示上行CoMP协作小区列表(DSP CELLULCOMPCLUSTER)查询设备证书的状态信息(DSP CERTMK)查询证书同步信息(DSP CERTSYNCINFO)查询配置数据文件激活状态(DSP CFGFILEACTSTAT)查询配置管理统计数据(DSP CFGSTAT)查询CFM维护联盟状态(DSP CFMMA)查询CFM维护域运行状态(DSP CFMMD)查询CFM维护端点状态(DSP CFMMEP)查询CFM远端维护端点状态(DSP CFMRMEP)查询时钟DA值(DSP CLKDA)查询基站时钟互锁主制式(DSP CLKMUTUALLOCK)查询时钟历史状态(DSP CLKRECORD)查询参考时钟源状态(DSP CLKSRC)查询系统时钟状态(DSP CLKSTAT)查询时钟跟踪模式(DSP CLKTHD)查询时钟质量监控结果(DSP CLKTST)查询Cloud BB时钟源使能状态(DSP CLOUDSRC)查询CMP会话状态信息(DSP CMPSESSION)查询CP承载状态(DSP CPBEARER)查询CPRI线速率(DSP CPRILBR)查询CPRI端口动态信息(DSP CPRIPORT)查询CPRI误码率阈值(DSP CPRITHRESHOLD)查询CPU/DSP占有率(DSP CPUUSAGE)查询证书撤销列表的状态信息(DSP CRL)查询交叉证书状态信息(DSP CROSSCERT)查询BBU间的控制与时钟信号链路质量的统计信息(DSP CTRLLNKSTAT) 查询中心DA历史状态(DSP DARECORD)查询设备IP地址(DSP DEVIP)查询设备IPv6地址(DSP DEVIP6)查询远端维护通道自动建立Detect延时生效数据(DSP DHCPDETECT) 查询远端维护通道自动建立结果信息(DSP DHCPRSLT)查询诊断信息(DSP DIAGNOSE)查询油机状态(DSP DIESELGEN)查询802.1x状态信息(DSP DOT1X)查询DSCP到VLAN优先级的映射(DSP DSCPMAP)查询E1/T1端口状态(DSP E1T1)显示ECO配置(DSP ECO)查询电子标签(DSP ELABEL)查询环境监控单元状态(DSP EMU)查询射频模块睡眠动态参数(DSP ENODEBAUTOPOWEROFF)查询ENODEBFDD基带资源状态(DSP ENODEBFDDBBRES)查询ENODEBTDD基带资源状态(DSP ENODEBTDDBBRES)查询以太网时延状态(DSP ETHDM)查询以太网丢包测量(DSP ETHLM)查询以太网OAM 3AH状态(DSP ETHOAM3AH)查询以太网端口状态(DSP ETHPORT)查询以太网链路聚合组的状态(DSP ETHTRK)查询以太网链路聚合组成员端口状态(DSP ETHTRKLNK) 查询RRU的接收通道总功率(DSP EURTWP)查询BBU风扇板状态(DSP FAN)查询RHUB远供状态和级别(DSP FARPWRINFO)查询FLASH占用率(DSP FLASHUSAGE)查询泛洪攻击报文统计(DSP FLOODDEFEND)查询风扇监控单元状态(DSP FMU)查询参考源大频偏故障检测结果(DSP FREQDIFFRSLT)查询GERAN邻区的RIM状态信息(DSP GERANRIMINFO) 查询GPS状态(DSP GPS)查询卫星的信噪比(DSP GPSSNR)查询单板硬件在线测试结果(DSP HWOLTSTRESULT)查询单板硬件测试结果(DSP HWTSTRESULT)查询内部基带数据链路信息(DSP IBDLINFO)查询IKE基本状态(DSP IKECFG)查询IKE消息统计信息(DSP IKEMSGSTAT)查询IKE对等体状态(DSP IKEPEER)查询IPv6 IKE对等体状态(DSP IKEPEER6)查询IKE安全提议状态(DSP IKEPROPOSAL)查询IKE SA状态(DSP IKESA)查询IPv6 IKE SA状态(DSP IKESA6)查询IKE SA基本信息(DSP IKESTAT)查询IKEv1交换状态变更信息(DSP IKEV1EXCHSTAT)查询IKEv2交换状态变更信息(DSP IKEV2EXCHSTAT)查询互联时钟状态(DSP INTERCLK)查询框间互联拓扑(DSP INTERCONTOPO)查询非法报文(DSP INVALIDPKTINFO)查询IP时钟采样周期(DSP IPCLKALGO)查询IP时钟链路状态(DSP IPCLKLINK)查询IPv6接口状态(DSP IPITF6)查询IP Path状态(DSP IPPATH)查询IPv6 Path状态(DSP IPPATH6)查询分路路由状态(DSP IPPATHRT)查询IP PM会话状态(DSP IPPMSESSION)查询IP路由表(DSP IPRT)查询IPv6路由表(DSP IPRT6)查询IPSec逃生通道状态(DSP IPSECBYPASSCFG)查询IPSec双通道状态(DSP IPSECDTNL)查询IPSec安全策略状态(DSP IPSECPOLICY)查询IPv6 IPSec安全策略状态(DSP IPSECPOLICY6)查询IPSec安全提议状态(DSP IPSECPROPOSAL)查询IPSec SA状态(DSP IPSECSA)查询IPv6 IPSec SA状态(DSP IPSECSA6)查询IPSec SA统计信息(DSP IPSECSADELSTAT)查询IP报文收发统计信息(DSP IPSTAT)查询License销售信息(DSP LICINFO)查询E1/T1线路时钟状态(DSP LINECLK)查询LLDP本端全局状态信息(DSP LLDPGLOBALINFO)查询LLDP远端信息(DSP LLDPNEIGHBOR)查询LLDP本端端口信息(DSP LLDPPORT)查询LLDP统计信息(DSP LLDPSTAT)查询加载控制权(DSP LOADCTRL)查询近端维护网口状态(DSP LOCALETHPORT)查询近端维护IP地址状态(DSP LOCALIP)查询近端维护IPv6地址(DSP LOCALIP6)查询USB口状态(DSP LOCALUSBPORT)显示M2配置(DSP M2)查询基站MBMS信息(DSP MBMSPARA)查询内存占用率(DSP MEMUSAGE)查询网元当前状态(DSP MNTMODE)查询多链路PPP组状态(DSP MPGRP)查询多链路PPP组中PPP子链路状态(DSP MPLNK)查询组播IP地址(DSP MULTICASTIP)查询ND状态(DSP ND)查询NTP客户端状态(DSP NTPC)查询远端维护通道状态(DSP OMCH)查询IPv6远端维护通道状态(DSP OMCH6)查询包过滤统计结果(DSP PACKETFILTER)查询单板补丁(DSP PATCH)查询动态建立的辅小区(DSP PCCSCELLLIST)查询PeerClk状态(DSP PEERCLK)查询相位差(DSP PHASEDIFF)查询PMTU(DSP PMTU)查询电源监控模块状态(DSP PMU)查询端口重定向信息(DSP PORTREDIRECT)查询端口安全开关状态(DSP PORTSECURITY)查询PPP链路状态(DSP PPPLNK)查询小区主基带板调整(DSP PRIBBPADJUST)查询主基带板资源信息(DSP PRIBBPRESINFO)查询优选时钟等级(DSP PRICLASS)查询电源整流模块状态(DSP PSU)查询PUCCH配置动态信息(DSP PUCCHCFG)查询供电类型(DSP PWRTYPE)查询RACH配置动态信息(DSP RACHCFG)查询远程天线单元动态信息(DSP RAE)查询远程天线设备属性组动态信息(DSP RAEDEVICEDATA) 查询远程天线单元文件信息(DSP RAEFILE)查询远程天线子单元动态信息(DSP RAESUBUNIT)查询远程天线单元上的天线权值信息(DSP RAEWEIGHT)查询电调天线动态信息(DSP RET)查询电调天线设备属性组动态信息(DSP RETDEVICEDA TA)查询RET端口动态信息(DSP RETPORT)查询电调天线子单元动态信息(DSP RETSUBUNIT)显示互调干扰检测(DSP RFTEST)查询RHUB状态(DSP RHUB)查询RRU/RFU动态信息(DSP RRU)查询RRU链环动态信息(DSP RRUCHAIN)查询RRU/RFU物理信息(DSP RRUCHAINPHYTOPO)查询RRU时钟参考源(DSP RRUCLKSRC)查询传输资源组状态(DSP RSCGRP)查询RRU/RFU接收通道动态信息(DSP RXBRANCH)显示S1配置(DSP S1)查询S1接口(DSP S1INTERFACE)查询SCTP链路状态(DSP SCTPLNK)查询IPv6 SCTP链路状态(DSP SCTPLNK6)查询扇区状态(DSP SECTOR)查询光电模块动态信息(DSP SFP)查询网元软件管理状态(DSP SOFTSTATUS)查询SRS配置动态信息(DSP SRSCFG)查询SSL连接能力(DSP SSLCPB)查询SSL连接错误信息(DSP SSLERRINFO)查询倒换历史记录(DSP SWAPLOG)查询同步以太网时钟状态(DSP SYNCETH)查询基站支持的温控模式(DSP TCMODE)查询温控单元状态(DSP TCU)查询网元时间(DSP TIME)查询当前时间源(DSP TIMESRC)查询塔放动态信息(DSP TMA)查询塔放设备属性组动态信息(DSP TMADEVICEDATA)查询塔放子单元动态信息(DSP TMASUBUNIT)查询TOD状态(DSP TOD)查询信任证书的状态信息(DSP TRUSTCERT)显示输出时钟(DSP TSTCLKOUT)查询隧道状态(DSP TUNNEL)查询TWAMP客户端状态(DSP TWAMPCLIENT)查询TWAMP响应端协商结果信息(DSP TWAMPRESPONDER) 查询TWAMP响应端统计信息(DSP TWAMPRESPONDERSTA) 查询TWAMP发送端统计信息(DSP TWAMPSENDER)查询RRU/RFU发射通道动态信息(DSP TXBRANCH)查询UDP环回状态(DSP UDPLOOP)查询UDP会话状态(DSP UDPSESSION)查询指定UE在线信息(DSP UEONLINEINFO)查询BBU电源板状态(DSP UPEU)查询UTRAN邻区的RIM状态信息(DSP UTRANRIMINFO)查询UTRAN邻区的RIM小区负载状态信息(DSP UTRANRIMLOADINFO) 查询Uu接口数据测试信息(DSP UUDATATST)查询虚拟天线子单元动态信息(DSP VRETSUBUNIT)查询驻波测试结果(DSP VSWR)显示驻波检测任务(DSP VSWRTEST)显示X2配置(DSP X2)查询X2接口(DSP X2INTERFACE)结束批命令事务(END BATCHFILESN)导出设备档案文件(EXP DEVFILE)强制结束批命令事务(FOE BATCHFILESN)获取小区远程干扰数据(GET CELLRICDATA)安装License(INS LICENSE)锁定RRU/RFU通道最大发射功率(LOC RRUTC)查询AARU配置信息(LST AARU)查询AAS配置信息(LST AAS)查询调试消息(LST ABLMSG)查询访问控制列表配置信息(LST ACL)查询IPv6访问控制列表配置信息(LST ACL6)查询访问控制列表规则配置信息(LST ACLRULE)查询IPv6访问控制列表规则配置信息(LST ACLRULE6)查询空口软同步相关参数(LST AISS)查询算法默认参数(LST ALGODEFAULTPARA)查询活动告警(LST ALMAF)查询告警配置(LST ALMCFG)查询告警过滤参数(LST ALMFILTER)查询告警日志(LST ALMLOG)查询环境信号输入端口配置信息(LST ALMPORT)查询自动邻区关系算法(LST ANR)查询基站ANR测量相关参数(LST ANRMEASUREPARAM)查询天线端口配置信息(LST ANTENNAPORT)查询正在使用的设备证书的配置信息(LST APPCERT)查询登录认证方式(LST AUTHPOLICY)查询背板E1/T1端口配置信息(LST BACKE1T1)查询基带设备配置信息(LST BASEBANDEQM)查询XML批配置操作日志记录开关(LST BATCHCFGLOGSW)查询批命令事务(LST BATCHFILESN)查询蓄电池容量检测参数配置信息(LST BATCTPA)查询蓄电池配置信息(LST BATTERY)查询BBP配置(LST BBP)查询跨框基带互联配置(LST BBPLNK)查询BCCH配置信息(LST BCCHCFG)查询波束赋形天线配置信息(LST BFANT)查询BFD会话配置信息(LST BFDSESSION)查询BfMIMO自适应参数配置(LST BFMIMOADAPTIVEPARACFG)查询BITS配置信息(LST BITS)查询盲邻区配置优化参数(LST BLINDNCELLOPT)查询证书签发机构配置信息(LST CA)查询机柜配置信息(LST CABINET)查询CA小区集(LST CAGROUP)查询CA小区集小区(LST CAGROUPCELL)查询CA小区集辅小区配置(LST CAGROUPSCELLCFG)查询CA载波管理参数配置(LST CAMGTCFG)查询级联端口配置信息(LST CASCADEPORT)查询命令组包含的命令(LST CCG)查询命令组名称(LST CCGN)查询机柜控制单元配置信息(LST CCU)查询CDMA20001XRTT外部小区(LST CDMA20001XRTTEXTCELL)查询CDMA20001XRTT邻区关系(LST CDMA20001XRTTNCELL)查询CDMA20001XRTT预注册参数(LST CDMA20001XRTTPREREG)查询CDMA2000邻频段信息(LST CDMA2000BANDCLASS)查询CDMA2000邻频段服务小区运营商专有配置(LST CDMA2000BCSCELLOP) 查询CDMA2000HRPD外部小区(LST CDMA2000HRPDEXTCELL)查询CDMA2000HRPD邻区关系(LST CDMA2000HRPDNCELL)查询CDMA2000HRPD预注册参数(LST CDMA2000HRPDPREREG)查询CDMA2000HRPD参考小区(LST CDMA2000HRPDREFCELL)查询CDMA2000邻频点信息(LST CDMA2000NFREQ)查询小区静态参数(LST CELL)查询小区接入禁止信息(LST CELLACBAR)查询小区接入信息(LST CELLACCESS)查询小区级算法开关(LST CELLALGOSWITCH)查看小区从频带(LST CELLBAND)查询小区BF单双流控制参数信息(LST CELLBF)查询小区BfMIMO自适应参数配置(LST CELLBFMIMOPARACFG)查询小区信道功率配置信息(LST CELLCHPWRCFG)查询小区级CSPC配置参数(LST CELLCSPCPARA)查询下行Comp算法(LST CELLDLCOMPALGO)查询小区下行ICIC算法参数(LST CELLDLICIC)查询下行ICIC测量控制参数信息(LST CELLDLICICMCPARA)查询PDCCH下行功控算法参数(LST CELLDLPCPDCCH)查询PDSCH下行功控算法参数(LST CELLDLPCPDSCH)查询PDSCH功率控制PA相关参数(LST CELLDLPCPDSCHPA)查询PHICH下行功控参数(LST CELLDLPCPHICH)查询小区下行调度参数(LST CELLDLSCHALGO)查询小区级DRX参数(LST CELLDRXPARA)查询小区DSS配置(LST CELLDSS)查询小区动态接入禁止算法参数(LST CELLDYNACBARALGOPARA)查询小区增强干扰协调信息(LST CELLEICIC)查询小区扩展QCI(LST CELLEXTENDEDQCI)查询小区切换参数配置(LST CELLHOPARACFG)查询小区ID周期性调整算法(LST CELLIDPRDUPT)查询上行联合调度算法参数(LST CELLIICSPARA)查询小区低功耗模式参数(LST CELLLOWPOWER)查询小区MBMS配置(LST CELLMBMSCFG)查询测量控制参数信息(LST CELLMCPARA)查询小区MIMO参数配置(LST CELLMIMOPARACFG)查询负载平衡算法参数(LST CELLMLB)查询小区MLB切换参数配置(LST CELLMLBHO)查询小区移动性鲁棒性优化参数(LST CELLMRO)查询小区无话务量告警检测参数(LST CELLNOACCESSALMPARA) 查询小区运营商信息(LST CELLOP)查询小区功控算法参数(LST CELLPCALGO)查询PDCCH算法参数(LST CELLPDCCHALGO)查询PRB评估值负载平衡算法参数(LST CELLPRBVALMLB)查询小区预调度参数组(LST CELLPREALLOCGROUP)查询PUCCH算法参数(LST CELLPUCCHALGO)查询小区RACH算法参数(LST CELLRACHALGO)查询准入负载算法门限参数(LST CELLRACTHD)查询小区重选信息(LST CELLRESEL)查询CDMA2000小区重选(LST CELLRESELCDMA2000)查询GERAN小区重选(LST CELLRESELGERAN)查询UTRAN小区重选(LST CELLRESELUTRAN)查询小区RF智能关断参数(LST CELLRFSHUTDOWN)查询远程干扰消除算法(LST CELLRICALGO)查询小区选择信息(LST CELLSEL)查询小区业务差异化配置(LST CELLSERVICEDIFFCFG)查询载频智能关断参数(LST CELLSHUTDOWN)查询小区系统消息映射(LST CELLSIMAP)查询小区模拟负载控制配置参数(LST CELLSIMULOAD)查询小区标准QCI参数(LST CELLSTANDARDQCI)查询上行Comp算法(LST CELLULCOMPALGO)查询小区上行ICIC算法参数(LST CELLULICIC)查询上行ICIC测量控制参数信息(LST CELLULICICMCPARA)查询小区上行功控信息(LST CELLULPCCOMM)查询PUSCH功控专用协议参数(LST CELLULPCDEDIC)查询上行调度算法参数(LST CELLULSCHALGO)查询证书有效性检查任务配置信息(LST CERTCHKTSK)查询证书部署位置(LST CERTDEPLOY)查询证书文件(LST CERTFILE)查询设备证书配置信息(LST CERTMK)查询证书请求文件配置信息(LST CERTREQ)查询网元支持的设备证书应用类型(LST CERTTYPE)查询配置数据周期核查使能标志(LST CFGCHK)查询配置核查结果文件(LST CFGCHKRSLTFILE)查询备份配置数据文件(LST CFGFILE)查询CFM绑定IP地址配置信息(LST CFMBNDIP)查询CFM维护联盟配置信息(LST CFMMA)查询CFM维护域配置信息(LST CFMMD)查询CFM维护端点配置信息(LST CFMMEP)查询CFM远端维护端点配置信息(LST CFMRMEP)查询eNodeB CHR 输出模式(LST CHROUTPUTMODE)查询IP时钟数据记录(LST CLKDATARECORD)查询参考时钟源工作模式(LST CLKMODE)查询基站时钟同步模式(LST CLKSYNCMODE)查询Cloud BB时钟源配置信息(LST CLOUDSRC)查看运营商信息(LST CNOPERATOR)查询运营商相关扩展QCI配置(LST CNOPERATOREXTENDEDQCI) 查询运营商切换配置(LST CNOPERATORHOCFG)查看运营商IP Path(LST CNOPERATORIPPATH)查询运营商专用SPID配置(LST CNOPERATORSPIDCFG)查询运营商相关标准QCI配置(LST CNOPERATORSTANDARDQCI) 查看跟踪区域配置信息(LST CNOPERATORTA)查询运营商共享组配置(LST CNOPSHARINGGROUP)查询counter check的相关参数(LST COUNTERCHECKPARA)查询CP承载配置信息(LST CPBEARER)查询CPRI端口(LST CPRIPORT)查询CQI自适应参数配置(LST CQIADAPTIVECFG)查询证书撤销列表配置信息(LST CRL)查询CRL检查策略(LST CRLPOLICY)查询CRL周期性获取任务的配置信息(LST CRLTSK)查询交叉证书配置信息(LST CROSSCERT)查询盲切换异系统配置(LST CSFALLBACKBLINDHOCFG)查询CS FallBack切换参数(LST CSFALLBACKHO)查询CSFB切换策略配置(LST CSFALLBACKPOLICYCFG)查询CSPC特性级算法参数(LST CSPCALGOPARA)查询CSPC小区SRS测量邻区信息(LST CSPCCELLSRSMEASNCELL) 查询CSPC分簇信息(LST CSPCCLUSTER)查询CSPC分簇小区信息(LST CSPCCLUSTERCELL)查询控制链路配置信息(LST CTRLLNK)查询设备IP配置信息(LST DEVIP)查询设备IPv6地址配置信息(LST DEVIP6)查询DHCP Relay使能开关配置信息(LST DHCPRELAYSWITCH)查询DHCP服务器IP地址配置信息(LST DHCPSVRIP)查询远端维护通道自动建立开关的配置信息(LST DHCPSW)查询油机配置(LST DIESELGEN)查询差分服务优先级配置信息(LST DIFPRI)查询基于距离的切换配置(LST DISTBASEDHO)查询下载的BootROM包版本号(LST DLDBTRM)查询802.1x配置信息(LST DOT1X)查询非连续接收(LST DRX)查询DRX参数组(LST DRXPARAGROUP)查询DSCP到VLAN优先级的映射配置(LST DSCPMAP)查询直流电压告警开关状态(LST DVAS)查询E1/T1端口配置信息(LST E1T1)查询E1/T1高误码率门限配置信息(LST E1T1BER)查询能耗测量点(LST ECMP)查询ECO配置(LST ECO)查询紧急呼叫配置(LST EMC)查询EMS信息(LST EMS)查询环境监控单元配置信息(LST EMU)查询小区运营商级保留参数(LST ENBCELLOPRSVDPARA)查询小区相关QCI级保留参数(LST ENBCELLQCIRSVDPARA)查询小区级保留参数(LST ENBCELLRSVDPARA)查询运营商相关QCI级保留参数(LST ENBCNOPQCIRSVDPARA)查询运营商级保留参数(LST ENBCNOPRSVDPARA)查询License告警门限(LST ENBLICENSEALMTHD)查询QCI级保留参数(LST ENBQCIRSVDPARA)查询eNodeB级保留参数(LST ENBRSVDPARA)查询eNodeB级算法开关(LST ENODEBALGOSWITCH)查询射频模块睡眠静态参数(LST ENODEBAUTOPOWEROFF)查询eNodeB CHR 输出控制配置(LST ENODEBCHROUTPUTCTRL)查询eNodeB加密算法优先级配置(LST ENODEBCIPHERCAP)查询eNodeB连接状态定时器配置(LST ENODEBCONNSTATETIMER) 查询ENODEBFDD基带资源配置信息(LST ENODEBFDDBBRES)查询eNodeB业务流控参数(LST ENODEBFLOWCTRLPARA)查询eNodeB功能配置(LST ENODEBFUNCTION)查询eNodeB完整性保护算法优先级(LST ENODEBINTEGRITYCAP) 查询负载平衡算法基站级配置参数(LST ENODEBMLB)查询eNodeB IP Path应用类型(LST ENODEBPATH)查看基站共享模式(LST ENODEBSHARINGMODE)查询ENODEBTDD基带资源配置信息(LST ENODEBTDDBBRES)查询端节点到传输资源组的映射关系(LST EP2RSCGRP)查询端节点组配置信息(LST EPGROUP)查询网元设备配置(LST EQUIPMENT)查询设备序列号(LST ESN)查询以太网OAM配置(LST ETHOAM)查询以太网OAM 3AH配置信息(LST ETHOAM3AH)查询以太网端口配置信息(LST ETHPORT)查询以太网链路聚合组配置信息(LST ETHTRK)查询以太网链路聚合组成员端口配置信息(LST ETHTRKLNK)查询小区主基带绑定(LST EUCELLPRIBBEQM)查询小区扇区设备(LST EUCELLSECTOREQM)查询集中分簇节点使用的基带设备编号(LST EUCOSCHCFG)查询小区扇区设备组(LST EUSECTOREQMGROUP)查询扇区设备组中的扇区设备(LST EUSECTOREQMID2GROUP)查询EUTRAN外部小区(LST EUTRANEXTERNALCELL)查看EUTRAN外部小区从频带(LST EUTRANEXTERNALCELLBAND)查询EUTRAN外部小区PLMN列表(LST EUTRANEXTERNALCELLPLMN)查询EUTRAN异频邻区关系(LST EUTRANINTERFREQNCELL)查询EUTRAN异频相邻频点(LST EUTRANINTERNFREQ)查询EUTRAN同频邻区关系(LST EUTRANINTRAFREQNCELL)查询EUTRAN异频相邻频点运营商共享信息(LST EUTRANNFREQRANSHARE)查询EUTRAN相邻频点服务小区运营商专有配置(LST EUTRANNFREQSCELLOP)查询EUTRAN VoIP切换黑名单(LST EUTRANVOIPHOBLKLIST)查询扩展QCI(LST EXTENDEDQCI)查询FDD资源模式(LST FDDRESMODE)查询泛洪报文攻击防范和告警配置(LST FLOODDEFEND)查询风扇监控单元配置信息(LST FMU)查询载波有效带宽(LST FREQBWH)查询FTP客户端的参数(LST FTPSCLT)查询FTP客户端访问目的端口(LST FTPSCLTDPORT)查询GERAN外部小区(LST GERANEXTERNALCELL)查询GERAN外部小区PLMN列表(LST GERANEXTERNALCELLPLMN)查询GERAN干扰频点(LST GERANINTERFARFCN)查询GL Bufferzone优化参数(LST GERANINTERFCFG)查询GERAN邻区关系(LST GERANNCELL)查询GERAN相邻频点组服务小区运营商专有配置(LST GERANNFGROUPSCELLOP) 查询GERAN相邻频点组(LST GERANNFREQGROUP)查询GERAN BCCH相邻频点(LST GERANNFREQGROUPARFCN)查询GERAN相邻频点组运营商共享信息(LST GERANRANSHARE)查询全局流程开关(LST GLOBALPROCSWITCH)查询GPS配置信息(LST GPS)查询GPS位置信息(LST GPSPOS)查询GTPU配置信息(LST GTPU)查询基站全局传输参数(LST GTRANSPARA)查询传输主备保护组配置信息(LST HAGRP)查询切换公共参数(LST HOMEASCOMM)查询温控单元温差控制参数配置信息(LST HTCDPA)查询IKE基本配置信息(LST IKECFG)查询IKE对等体配置信息(LST IKEPEER)查询IPv6 IKE对等体配置信息(LST IKEPEER6)查询IKE安全提议配置信息(LST IKEPROPOSAL)查询互联时钟配置信息(LST INTERCLK)查询EUTRAN异频黑名单小区(LST INTERFREQBLKCELL)查询异频切换参数组(LST INTERFREQHOGROUP)查询跨PLMN切换配置(LST INTERPLMNHOLIST)查询异系统小区关断参数(LST INTERRATCELLSHUTDOWN)查询CDMA20001XRTT切换参数组(LST INTERRATHOCDMA1XRTTGROUP) 查询CDMA2000HRPD切换参数组(LST INTERRATHOCDMAHRPDGROUP) 查询异系统切换公共参数(LST INTERRATHOCOMM)查询异系统切换公共参数组(LST INTERRATHOCOMMGROUP)查询GERAN切换参数组(LST INTERRATHOGERANGROUP)查询UTRAN切换参数组(LST INTERRA THOUTRANGROUP)查询异系统策略配置组(LST INTERRATPOLICYCFGGROUP)查询EUTRAN同频黑名单小区(LST INTRAFREQBLKCELL)查询同频切换参数组(LST INTRAFREQHOGROUP)查询系统内切换参数(LST INTRARATHOCOMM)查询传输资源组IP地址映射配置信息(LST IP2RSCGRP)查询传输资源组IPv6地址映射配置信息(LST IP2RSCGRP6)查询IP时钟算法(LST IPCLKALGO)查询IP时钟链路配置信息(LST IPCLKLINK)查看IP安全策略(LST IPGUARD)查询IPv6接口配置信息(LST IPITF6)查询IP Path配置信息(LST IPPATH)查询IPv6 Path配置信息(LST IPPATH6)查询分路路由配置信息(LST IPPATHRT)查询IP PM会话配置信息(LST IPPMSESSION)查询静态路由配置信息(LST IPRT)查询IPv6静态路由配置信息(LST IPRT6)查询IPSec安全策略组绑定配置信息(LST IPSECBIND)查询IPv6安全策略组绑定配置信息(LST IPSECBIND6)查询IPSec逃生通道配置信息(LST IPSECBYPASSCFG)查询IPSec双通道配置信息(LST IPSECDTNL)查询IPSec安全策略配置信息(LST IPSECPOLICY)查询IPv6 IPSec安全策略配置信息(LST IPSECPOLICY6)查询IPSec安全提议配置信息(LST IPSECPROPOSAL)查询最近时间源同步成功时间(LST LATESTSUCCDATE)查询License文件信息(LST LICENSE)查询紧急状态开关(LST LICENSECTRL)查看License共享策略(LST LICENSESHARINGPOLICY)查询流量License比例(LST LICRATIO)查询License比例共享策略(LST LICRATIOSHAREPOLICY)查询E1/T1线路时钟配置信息(LST LINECLK)查询LLDP本端全局配置(LST LLDPGLOBALINFO)查询LLDP本端端口配置(LST LLDPPORT)查询基站的时钟质量等级(LST LOCALCLKQL)查询近端维护IP地址配置信息(LST LOCALIP)查询近端维护IPv6地址配置信息(LST LOCALIP6)查询本地化参数(LST LOCALPARA)查询本地敏感信息保护算法级别(LST LOCALSECSTORELVL) 查询USB口配置信息(LST LOCALUSBPORT)查询位置信息(LST LOCATION)查询日志文件列表(LST LOGFILE)查询线路侧速率配置信息(LST LR)查询M1配置(LST M1)查询M2配置(LST M2)查询基站MBMS参数(LST MBMSPARA)查询测量结果文件(LST MEASRST)查询MIMO自适应参数配置(LST MIMOADAPTIVEPARACFG) 查询负载平衡QCI参数组(LST MLBQCIGROUP)查询MME特性配置信息(LST MMEFEATURECFG)查询网元工程状态配置信息(LST MNTMODE)查询多链路PPP组配置信息(LST MPGRP)查询多链路PPP组中PPP子链路配置信息(LST MPLNK)查询移动性鲁棒性优化算法(LST MRO)查询网元配置属性(LST NE)查询设备上运行的端口信息(LST NETSTATE)查询市电无告警端口绑定(LST NMSABIND)查询NODE配置属性(LST NODE)查询NTP客户端信息(LST NTPC)查询按对象告警屏蔽条件(LST OBJALMSHLD)查询远端维护通道配置信息(LST OMCH)查询IPv6远端维护通道配置信息(LST OMCH6)查询OM连接安全策略(LST OMCONNPOLICY)查询网元在线域用户列表(LST ONLINEOP)查询操作员(LST OP)查询本地非默认帐户集体锁定状态(LST OPLOCK)查询本地用户管理功能激活状态(LST OPSW)查询操作日志(LST OPTLOG)查询输出端口（继电器）配置信息(LST OUTPORT)查询包过滤的配置信息(LST PACKETFILTER)查询补丁信息(LST PATCH)查询主载波频点配置(LST PCCFREQCFG)查询PCCH配置信息(LST PCCHCFG)查询PDCPROHCPARA(LST PDCPROHCPARA)查询PDSCH配置信息(LST PDSCHCFG)查询PeerClk配置信息(LST PEERCLK)查询PHICH配置信息(LST PHICHCFG)查询Ping过滤IP地址和掩码配置信息(LST PINGFILTER)查询Ping过滤模式(LST PINGFILTERMODE)查询IP Path丢包告警门限配置信息(LST PLRTHRESHOLD)查询PMTU探测全局配置(LST PMTUCFG)查询电源监控模块配置信息(LST PMU)查询端口安全开关配置信息(LST PORTSECURITY)查询PPP链路配置信息(LST PPPLNK)查询优先级到内部队列映射(LST PRI2QUE)查询优选时钟等级配置信息(LST PRICLASS)查询电源整流模块配置信息(LST PSU)查询PSU智能关断开关(LST PSUISS)查询PUCCH配置信息(LST PUCCHCFG)查询PUSCH配置信息(LST PUSCHCFG)查询随路偏置参数(LST PUSCHPARAM)查询密码安全策略(LST PWDPOLICY)查询RACH配置信息(LST RACHCFG)查询远程天线单元配置信息(LST RAE)查询远程天线设备属性组配置信息(LST RAEDEVICEDATA)查询远程天线子单元配置信息(LST RAESUBUNIT)查询系统频点优先级配置组(LST RATFREQPRIORITYGROUP)查询电调天线配置信息(LST RET)查询电调天线设备属性组配置信息(LST RETDEVICEDATA)查询RET端口配置信息(LST RETPORT)查询电调天线子单元配置信息(LST RETSUBUNIT)查询射频互联(LST RFCONNGRP)查询RHUB配置(LST RHUB)查询RLCPDCP参数组(LST RLCPDCPPARAGROUP)查询RLF定时器与常量参数组(LST RLFTIMERCONSTGROUP)查询UE控制定时器配置(LST RRCCONNSTATETIMER)查询RRU/RFU配置信息(LST RRU)查询RRU链环配置信息(LST RRUCHAIN)查询RRU联合通道校正参数配置(LST RRUJOINTCALPARACFG) 查询传输资源组配置信息(LST RSCGRP)查询传输资源组算法配置信息(LST RSCGRPALG)查询RRU/RFU接收通道配置信息(LST RXBRANCH)查询S1配置(LST S1)查询S1接口重建时长范围(LST S1REESTTIMER)查询辅载波频点配置(LST SCCFREQCFG)查询SCTP本端对象配置信息(LST SCTPHOST)查询端节点组的SCTP本端(LST SCTPHOST2EPGRP)查询SCTP链路配置信息(LST SCTPLNK)查询IPv6 SCTP链路配置数据(LST SCTPLNK6)查询SCTP对端对象配置信息(LST SCTPPEER)查询端节点组的SCTP对端(LST SCTPPEER2EPGRP)查询SCTP参数模板配置信息(LST SCTPTEMPLATE)查询安全日志(LST SECLOG)查询运营商共享组的从运营商列表(LST SECONDARYOP2GROUP)查询扇区配置信息(LST SECTOR)查询扇区设备配置信息(LST SECTOREQM)查询安全本端对象配置信息(LST SECURITYHOST)查询安全对端对象配置信息(LST SECURITYPEER)查询安全参数模板配置信息(LST SECURITYTEMPLATE)查询小区MBMS服务区列表中的服务区(LST SERVICEAREAID2LIST)查询基于业务的异频切换下行频点组(LST SERVICEIFDLEARFCNGRP) 查询基于业务的异频切换策略配置组(LST SERVICEIFHOCFGGROUP) 查询基于业务的异系统切换策略配置组(LST SERVICEIRHOCFGGROUP) 查询会话信息(LST SESSIONID)查询SFN辅站资源绑定关系(LST SFNAUXRESBIND)查询SFN辅站小区绑定关系(LST SFNCELLBIND)查询基站模拟负载配置(LST SIMULOAD)查询软件版本(LST SOFTWARE)查询SPID配置(LST SPIDCFG)查询新硬件软件包版本号(LST SPP)查询源IP地址路由配置信息(LST SRCIPRT)查询SRS自适应参数配置(LST SRSADAPTIVECFG)查询SRS配置静态信息(LST SRSCFG)查询SSL配置参数(LST SSLCONF)查询标准QCI(LST STANDARDQCI)查询子接口的配置信息(LST SUBIF)查询基于子网的VLAN映射(LST SUBNETVLAN)查询机框配置信息(LST SUBRACK)查询同步以太网时钟配置信息(LST SYNCETH)查询准入控制算法配置信息(LST TACALG)查询上行时间对齐定时器(LST TATIMER)查询TceId和IP之间的映射关系(LST TCEIPMAPPING)查询TCP ACK控制算法(LST TCPACKCTRLALGO)查询TcpAck限速算法(LST TCPACKLIMITALG)查询MSS控制算法(LST TCPMSSCTRL)查询温控单元配置信息(LST TCU)查询小区帧偏置模式配置静态信息(LST TDDCELLFRAMEOFFSET)查询TDL小区帧偏置(LST TDDFRAMEOFFSET)查询TDD资源模式开关(LST TDDRESMODESW)查询配置时间源(LST TIMESRC)查询传输负载状态算法配置数据(LST TLDRALG)查询传输链路故障恢复开关状态(LST TLFRSWITCH)查询塔放配置信息(LST TMA)查询塔放设备属性组配置信息(LST TMADEVICEDATA)查询塔放子单元配置信息(LST TMASUBUNIT)查询TOD配置信息(LST TOD)查询过载控制算法配置信息(LST TOLCALG)查询TPE算法参数(LST TPEALGO)。

低铅铜热水混合器商品说明书

Technical CharacteristicsMaterials: -Body: low-lead brass (<0.25% lead content) -Shutter, seats and sliding guides: PPO -Springs: stainless steel -Seals: peroxide-cured EPDM Suitable fluids: water, 30% max glycol solution Setting range (outlet temperature): 85–150°F (30–65°C) Tolerance: ±3°F (±2°C) Max. working pressure (static): 200 psi (14 bar) Max. operating differential pressure (dynamic): 75 psi (5 bar) Max. recommended differential pressure: 20 psi (1.5 bar) Max. hot water inlet temperature: 200°F (93°C) Max. inlet pressure ratio (H /C or C/H ) for optimum performance: 2:1 Min. temperature difference between hot water inlet and mixedwater outlet for optimum performance: 27ºF (15ºC) Min. flow rate to ensure optimal performance: 1.0 GPM (3.8 L/min)Lay length, hot to cold inlet: (½” & ¾” press connection) 3 5/8” (1” press connection) 4 1/8” (1 “ with inlet check valves) 7 ¼” Certified to: 1. ASSE 1017/CSA B125.3, certified by ICC-ES, file PMG-1357 2. NSF/ANSI/CAN 372-2011, Drinking Water System Components-Lead Content Reduction of Lead in Drinking Water Act, California Health and Safety Code 116875 S.3874, Reduction of Lead in Drinking Water Act, certified by ICC-ES, file 3. PEX crimp fittings certified to ASTM F 1807. 4. PEX expansion fittings certified to ASTM F 1960. PMG-1360.FunctionThe Caleffi MixCal™ three-way thermostatic mixing valve is used in systems producing domestic hot water or in hydronic and radiant heating systems. With the unique mixing chamber design, MixCal™produces very stable mixed water temperture as inlet temperaturesand pressures vary. Scale formation is minimized with anti-scale polymer sliding surfaces, preventing siezing or erratic mixed temperatures. O-ring seals made from durable peroxide-cured EPDM resist wear from common water treatment additives such as chlorine and chloramines.Product range521A Series Three-way thermostatic mixing valve:“C” models include inlet check valves. “41x, 51x, 61x” models include outlet gauge adapter. Connections: union thread NPT male, sizes ½”, ¾”, 1”; union sweat, sizes ½”, ¾”, 1”; union press, sizes ½” , ¾”, 1”; union PEX crimp, sizes ½” , ¾”, 1”; and union PEX expansion, sizes ½” , ¾”, 1”.MixCal™ Adjustable three-way thermostatic mixing valve521 series© Copyright 2023 CaleffiLEAVE THIS MANUAL FOR THE USER.CAUTION: If the thermostatic mixing valve is not installed, commissioned and maintained properly, according to the instructions contained in this manual, it may not operate correctly and may endanger the user.CAUTION: Make sure that all the connecting pipework is water tight.CAUTION: When making the water connections, make sure that the pipwork connecting the MixCal™ thermostatic mixing valve is not mechanically overstressed. Over time this could cause breakages, with consequent water losses which, in turn, could cause harm to property and/or people.CAUTION: Water temperatures higher than 100ºF (38ºC) can be dangerous. During the installation, commissioning and maintenance of the MixCal™ thermostatic mixing valve, take the necessary precautions to ensure that such temperatures do not endanger people.CAUTION: T o prevent any damage which will cause the electronic mixing valve to not operate correctly, treat highly aggressive water before entering the thermostatic mixing valve. Be sure water hardness is less than 10 grains.CAUTION: If installed in an ASSE 1017 application, check valves shall be used.SAFETY INSTRUCTIONCAUTION: All work must be preformed by qualified personnel trained in the proper application, installation, and maintenance of systems in accordance with all applicable codes and ordinances.This safety alert symbol will be used in this manual to draw attention to safety related instructions. When used, the safety symbol means ATTENTION! BECOME ALERT! YOUR SAFETY IS INVOLVED! FAILURE TO FOLLOW THESE INSTRUCTIONS MAY RESULT IN A SAFETY HAZARD.WARNING: is known to the State of California to cause cancer and birth defects or other reproductive harm. For more information go to .ATTENTION:Pour prévenir tout dommage qui provoque le mitigeur électronique à ne pas fonctionner correctement, le traitement de l’eau très agressive avant d’entrer dans le termostatico regolabile. Assurez-vous que la dureté de l’eau est inférieure à 10 grains.ATTENTION:S’il est installé dans un pays de ASSE 1017 application, vérifiez les robinets doivent être utilisés.CONSIGNE DE SÉCURITÉLAISSEZ CE MANUEL AVEC L’UTILISATEUR AVERTISSEMENT:plomb, qui est connu dans l’État de Californie pour causer le cancer, dommages à la naissance ou autre. Pour plus d’informations rendez-vous .Flow curveFlow should never exceed standards for pipe size and materials .Kv = 2.60.1100.0230.230.0460.0690.020.050.20.50.1152.30.460.691.152050∆p (ft of head)G (l /m i n ) (g p m )234.66.911.5460.010.10.020.030.0510.20.30.5(psi) (bar)102352010.10.20.50.051025200.0010.010.0020.0030.0050.10.020.030.051.00.20.30.5Cv = 3.09.20.0920.920.040.440.0040.040.45011516150 70 2.05.019070100140UseCaleffi MixCal series 521 thermostatic mixing valves are designed to be installed at the hot water heater . The Caleffi MixCal series 521 valve cannot be used for tempering water temperature atfixtures as a point-of-use valve. They are not designed to provide scald protection or anti-chill service. They should not be used where ASSE 1070 devices are required. Wherever a scald protection feature is required, Caleffi series TubMixer™ 5213 high performance mixing valve needs to be installed. For safety reasons, it is advisable to limit the maximum mixed water temperature to 120ºF .InstallationNOTE TO INSTALLER: The Caleffi MixCal series 521 thermostatic mixing valve should be installed by qualified personnel, in accordance with local codes and ordinances. It is the responsibility of the installer to properly select, install and adjust this thermostatic mixing valve as specified in these instructions. Before installing a Caleffi MixCal series 521 thermostatic mixing valve, the system must beinspected to ensure that it’s operating conditions are within the range of the thermostatic mixing valve checking, for example, the supply temperature, supply pressure, etc.Systems where the Caleffi MixCal series 521 thermostatic mixing valve is to be installed must be drained and cleaned out to remove any dirt or debris which may have accumulated duringinstallation. Failure to remove dirt or debris may affect performance and the manufacturer’s product guarantee. The installation of filters of appropriate capacity at the inlet of the water from the mains supply is always advisable. In area which are subject to highly aggressive water, arrangements must be made to treat the water before it enters the valve.Caleffi MixCal series 521 thermostatic mixing valves must be installed in accordance with the diagrams in this manual, taking into account all current applicable standards.Caleffi Mix Cal series 521 thermostatic mixing valves can be installed in any position, either vertical or horizontal.The following are shown on the mixer body:– Hot water inlet, color red and marker “HOT”.– Cold water inlet, color blue and marker “COLD”.– Mixed water outlet, marker “MIX”.Locking the settingPosition the handle to the number required with respect to the index point. Unscrew the it so that the handle fits into the internal slot of the knob. Tighten the head screw.Instantaneous production of hot waterCaleffi MixCal 521 series thermostatic mixing valves may be used with boilers or heaters providing instantaneous hot water as long as the heater is the type which is capable of modulating its output to handle low demand. A small amount of storage or piping length between the heat exchanger and mixing valve will improve stability of water delivery temperature.Check valvesIn order to prevent undersirable backsiphonage, separate check valves should be installed insystems with code “521 A” model thermostatic mixing valves (these models do not contain integral check valves in the hot and cold inlet ports). As a convenience for easier installations, the Caleffi code “521 AC” model series thermostatic mixing valves include integral check valves in the hot and cold inlet ports.NOTE TO INSTALLER: DO NOT TEST FIT OR INSTALL CHECK VALVES BEFORE SOLDERING. IF INSTALLED, REMOVAL WILL REQUIRE DAMAGING THE CHECK VALVE AND IT WILL NO LONGER BE USABLE.The diagram below shows the order in which everything goes together. Note that the check valves are installed on the hot and cold inlets, the mixed outlet does not require a check valve. Note that the O-ring is installed on to the groove of the check valve.After soldering the tailpieces into place, slide in the check valve into the tailpiece with o-ring going in first. It will click into place and then the screen will fit into the groove of the tailpiece with the domed end facing the mixing valve. Once the check valve and screen is installed in the tailpiece, insert the tailpiece into the union nut, thread on to body outlet port and tighten down the union nut untilmetal meets metal to compress the Posi-Stop union seal.CommissioningThe special purpose of the thermostatic mixing valve must be commissioned in accordance with cur-rent standards by qualified personnel using temperature measuring equipment. Caleffi MixCal codes 52141_A and AC, 52151_A and AC, and 52161_A, AC with integral outlet port temperature gauges provide a time-saving temperature setting process to get close to the desired temperture. Use of a digital thermometer is recommended for determining the final setting of the mixed water temperature.NOTE: Gauge adapters with 2” diameter, 30 - 210ºF (0 - 100ºC) scale, code NA10328 (1/2” sweat), NA10056 (3/4” sweat) or NA10058 (1” sweat) can be separately purchased and field installed to the Caleffi MixCal series 521 models sold without the integral gauge adapters.After installation, the valve must be tested and commisioned in accordance with instructions given below, taking into account current applicable standards.1)Ensure that the system is clean and free from dirt or debris before commissioning the thermostatic mixing valve.2)It is recommended that the temperature is set using a suitable calibrated digital thermometer. The valve must be commissioned by measuring the temperature of the mixed water emerging at the point of use.3)The maximum outlet temperature from the valve must be set taking account of the fluctuations due to simultaneous use. It is essential for these conditions to be stabilised before commissioning.4)Adjust the temperature using the adjusting knob on the valve. For safety reasons. it is advisable to limit the maximum mixed water temperature to 120ºF in domestic hot water systems.Temperature adjustmentThe temperature is set to the required value by means of the knob with a graduated scale, on the top of the valve.Pos.Min.1234567Max.T (°F)8190100111120127136145152T (°C)273238444953586367with: T HOT = 155°F (68°C), with: T cold = 55°F (13°C), P = 43 psi (13 bar)Recirculation with point-of-distribution thermostatic mixing valvesFor domestic recirculating water systems, that include a single ASSE 1017 point-of-distribution thermostatic mixing valve, such as the Caleffi MixCal™ 521 series, the piping installation in the application drawing on page 7 is recommended.In any recirculating hot water distribution system there will be times when the circulator is operating, but no hot water is being drawn at the fixtures. Under this condition, heat continually dissipates from the piping forming the recirculation loop. If the loop is relatively short, and well insulated, the rate of heat loss should be very small. If the loop is long, and uninsulated, the rate of heat loss could be substantially greater.To maintain the recirculating water at the desired delivery temperature the heat lost from the loop must be replaced. This requires some water flow between the loop and the hot water source. Ideally, this flow is adjusted so that the rate of heat transfer from the hot water source to the loop exactly balances the rate of heat loss from the loop’s piping.The figure (below) shows a “bypass valve” (1), and “return valve” (2), which regulate how much warm water from the return side of the recirculating loop flows back to the storage tank. When there is no demand for hot water at the fixtures, the flow of return water to the tank will equal the rate of hot water flow from the tank to the inlet port of the mixing valve. Ideally, this flow should be adjusted so that the rate of heat transfer from the tank to the recirculating loop exactly balances the rate of heat loss from the recirculating loop. This allows the water temperature leaving themixing valve to remain stable.The bypass valve (1) and possibly the return valve (2) must be adjusted when there is no domestic water draw on the recirculating loop (when all the fixtures are off). Begin with the bypass valve (1) fully closed, and the return valve (2) fully open. Turn on the recirculating circulator and let it run for several minutes. The supply water temperature leaving the mixing valve will likely be lower than the setting of the valve, since there is no return flow to the tank thus, no hot water to the hot port of the mixing valve.Slowly open the bypass valve (1) and monitor the temperature leaving the mixing valve. It will likely begin rising as some water returns to the tank, and an equal flow of hot water moves from the tank to the hot port of the mixing valve. When the temperature leaving the mixing valve remains stable, and is at or very close to the temperature set on the mixing valve, the bypass valve is correctly set.The return valve (2) can remain fully open unless a situation occurs where the bypass valve (1) is fully open, but the temperature leaving the mixing valve is still too low. If this occurs, partially close the return valve (2) to add flow resistance. This forces more flow through the bypass valve (1). Repeat the previously described procedure of slowly opening the bypass valve (1) until the water temperature leaving the mixing valve is stable.Replacement fittingsReplacement partsReplacement body.Meets requirements of NSF/ANSI/CAN 372.Certified to: ASSE 1017/CSA B125.3, Low lead, by ICC-ESfile PMG-1360.521101A.........................1" male union threadPoint of distribution mixed temperature gauge adaptor fits MixCal™ 521 series mixing valves. Threaded union mountingreplaces existing mixed outlet with ¾" or 1"sweat pipe connection.NA10328..........................½" sweat with gauge NA10056..........................¾" sweat with gauge NA10058...........................1" sweat with gauge NA10358 ................1" union thread with gauge 688003A.....Replacement gauge w/ pocket well R39591..............................Replacement gaugeNA10498.............................Pocket well, platedRemovable gauge fits into temperature well. Gauge dial is 2” diameter and dual-scale from 30—210ºF (0—100ºC).Refer to the current Caleffi Plumbing and Hydronics Catalog for replacement union nuts and tailpieces by size and connection style. NOTE: Sealing washers are not required for MixCal 521 series thermostatic mixing valves shipped after July 2023.TroubleshootingUnder normal operating conditions the Caleffi 521 thermostatic mixing valve will provide a very high level of performance. However, in some circumstances, where the following maintenance schedule is not followed problems may arise.Recommended maintenance schedule:Tests should be conducted regularly to monitor the thermostatic mixing valve performance, as deterioration of performance could indicate that the valve and/or the system require maintenance. If, during these tests, the temperature of the mixed water has changed significantly in comparison with the previous test, the details given in the installation and commissioning sections should be checked and maintenance conducted.The following should be checked regularly to ensure that the optimum performance levels of the valve are maintained. Check every 12 months at least, or more often if necessary.1) Check and clean the system filters.2) Check that any check valves positioned upstream of the Caleffi thermostatic mixing valve are operating correctly, without problems caused by impuritites.3) Limescale can be removed from internal components of the thermostatic mixing valve by immersion ina suitable de-scaling fluid.4) When the components which can be maintained have been checked, commission the valve.Dimensions*At minimum temperature position on adjusting knob. **Model with integral outlet temperature gauge.Laylength (press):sz ½ & ¾ inch: 3 5/8 "sz 1 inch: 4 1/8 "sz 1 inch w/ checks: 7¼"*At minimum temperature position on adjusting knob.**Model with integral outlet temperature gauge.30210*At minimum temperature position on adjusting knob.**Model with integral outlet temperature gauge.06-2023For Technical Support call 1-414-338-6338, or*******************************。

TsOH·H2O-Catalyzed_Friedel-Crafts_of_Indoles_of_3-

Modern Research in Catalysis, 2012, 1, 11-14doi:10.4236/mrc.2012.12002 Published Online July 2012 (/journal/mrc)TsOH·H2O-Catalyzed Friedel-Crafts of Indoles of3-Hydroxyisobenzofuran-1(3H)-One with Indoles: Highly Synthesis of 3-Indolyl-Substituted PhthalidesHongying Tang, Xinyu Zhang, Airu Song, Zhongbiao Zhang*Tianjin Key Laboratory of Water Resources and Environment, Tianjin Normal University, Tianjin, ChinaReceived April 5, 2012; revised May 3, 2012; accepted May 22,2012ABSTRACTAn efficient and facile method for the synthesis of 3-indolyl-substituted phthalides by Friedel-Crafts alkylation of in-doles with 3-hydroxyisobenzofuran-1(3H)-one has been developed. Using only 2 mol-% TsOH·H2O as the catalyst, various substituted indoles can react smoothly at room temperature to give the corresponding phthalides products in good to excellent yields (up to 96%).Keywords: Synthesis; 3-Indolyl-Substituted Phthalides; Friedel-Crafts Alkylation; 3-Hydroxyisobenzofuran-1(3H)-One;Indole1. IntroductionCurrently, the chemistry of phthalides has attracted much attention from many research groups, as they are the key skeleton for a number of synthetic and naturally occurr- ing bioactive molecules [1-5]. In particular, 3-substituted phthalide moieties are embodied in numerous natural pr- oducts. For examples, (-)-Alcyopterosin E which contai- ns phthalides bone shows mild cytotoxicity toward Hep-2 (human larynx carcinoma) cell line [6]; 3-Butylphthali- des isolated from the basidiomycete Phanerochaete velut- ina CL6387 appear to be specific for Helicobacter pylori [7]; and Cytosporone E has antifungal activities [8]; Fus- cinarin isolated from soil fungas was found to compete effecttively with macrophage inflammatory protein (MIP)-1αfor binding to human CCR5, an important anti HIV-1 target that interferes with HIV entry into cells [9]. On the other hand, the indole framework is a privileged structure motif in a large number of natural products and therapeutic agents [10,11]. The history of researches in indole and its derivatives has been more than 100 years, and this domain has become one of the hot research spot. And with the fresh and rapid development of life scien- ces, this research of indoles has drawn increasing atten- tion from organic chemists [12-15]. Furthermore, it is well known that there are more than 3000 kinds of indole derivatives in the nature. Among them, more than 40 kinds are treatment medicines [11]. The potential biolog- ical activities of phthalides and indoles promoted us to develop a synthesis of an interesting type of heterocyclic compounds via their combination. And it probably offers great opportunities for the lead compound discovery. However, due to the phthalides’ specific structure feature containing the activity lactone motif, the methodology for the synthesis of 3-indolylsubstituted phthalides has been rarely explored. Up to date, the synthesis of this type compounds is mainly restricted to the reaction of indoles with 2-forylbenzoic acids either at high tempera-ture (T > 100˚C) [16-18] or in the presence of an acidic cation exchange resin Amberlyst 15 [19]. The main drawbacks associated with these previously reported pro- cedures are the unavailability of the common starting materials, 2-forylbenzoic acids, and in some cases, harsh reaction conditions [20-23]. Therefore, the development of simple, highly efficient alternative approach for the synthesis of 3-indolyl substituted phthalides is highly desirable. Herein, we report an efficient substitution re-action of 3-hydroxyisobenzofuran-1(3H)-one [24-26], which can be easily prepared via the reduction of readily available phthalic anhydride, and indoles using the TsOH·H2O as a catalyst at room temperature for the syn-thesis of 3-indolyl substituted phthalides with high yields.2. Experimental2.1. General Information1H and 13C NMR spectra were recorded in CDCl3or DMSO on a Bruker AMX-300 or Varian 400 MHz instr- umental using TMS as an internal standard. Elemental*Corresponding author.H. Y. TANG ET AL. 12analyses were conducted on a Yanaco CHN Corder MT- 3 automatic analyzer. Melting points were determineed on a T-4 melting point apparatus. All temperatures were uncorrected.All solvents and chemicals were commercially avail-able and used without further purification unless other-wise stated.3-Hydroxyisobenzofuran-1(3H)-OneAccording to the literature [26,27], the solution of isob- enzofuran-1(3H)-one [25] 1.34 g (1 mmol), NBS 2.71 g (1.2 mmol), AIBN 0.03 g (0.2 mmol) in 15 mL CCl4 was heated to reflux until isobenzofuran-1(3H)-one disap- peared (monitored by TLC). After removal of the sol- vent, the residue was purified by column chromatogram- phy on silica gel (200 - 300 mesh, gradient elution with petroleum ether/ethyl acetate = 61) to afford 3-brom- oisobenzofuran-1(3H)-one 1.81 g, (85%). 3-bromoiso- benzofuran-1(3H)-one was heated to reflux in water for 2 h, then the mixture was cooled to room temperature, a white crystal was separated out, after filtration, the prod- uct 3-hydroxyisobenzofuran-1(3H)-one was got, 1.13 g (88%), mp. 98˚C.2.2. General Procedure for the Synthesis of3-Indolyl-Substituted Phthalides Catalyzedby TsOH·H2OThe solution of TsOH·H2O (0.02 mmol), 3-hydroxyiso- benzofuran-1(3H)-one (1.00 mmol), and indoles (1.20 mmol) in CHCl3 (2 mL) was stirred at ambient tempera- ture until the raw material disappeared (monitored by TLC). After removal of the solvent, the residue was puri- fied by column chromatography on silica gel (200 - 300 mesh, gradient elution with petroleum ether/ethyl acetate = 31) to afford the product.3a-3h, 3j, 3l and 3n are known products according to the literatures [16,18,19].2.2.1. 3-(5-Hydroxy-1H-indol-3-Yl)isobenzofuran-1(3H)-One (3i)White solid, yield: 89%, mp. 213.4˚C - 215.1˚C. 1H NMR (DMSO-d6, 400 MHz) δ:5.07 (s, OH), 6.56 (d, J = 8.0 Hz, 1 H), 6.78 (s, 1 H), 6.88 - 6.90 (m, 1 H), 7.10 (d, J = 7.6 Hz, 1 H), 7.29 (d, J = 8.0 Hz, 1 H), 7.50 (d, J = 7.6 Hz, 1 H), 7.62 (t, J = 7.2 Hz, 1 H), 7.80 (t, J = 7.2 Hz, 1 H), 8.08 (d, J = 7.6 Hz, 1 H), 10.18 (s, NH); 13C NMR (DMSO-d6, 100 MHz) δ: 171.2, 154.6, 150.2, 135.9, 132.3, 131.5, 129.8, 129.3, 128.0, 127.5, 124.5, 120.2, 114.3, 112.9, 105.5, 78.5; C16H11NO3 (265.07): calcd. C 72.45, H 4.18, N 5.28; found C 72.70, H 3.99, N 5.16. 2.2.2. 3-(6-(Benzyloxy)-1H-indol-3-Yl)isobenzofuran-1(3H)-One (3k)White solid, yield: 89%, mp. 194.5˚C - 195.7˚C. 1H NMR (CDCl3, 400 MHz), δ:5.19 (d, J = 3.2 Hz, 2H, CH2), 6.60 - 6.68 (m, 2 H), 6.84 (s, 1 H), 6.92 (d, J = 2.8 Hz, 1 H), 7.26 - 7.98 (m, 9 H), 8.00 (d, J = 8.8 Hz, 1 H), 10.24 (b, NH). 13C NMR (CDCl3, 100 MHz), δ:170.6, 154.3, 149.4, 137.7, 135.0, 132.3, 129.5, 128.6, 127.9, 127.6, 126.6, 126.1, 125.8, 125.3, 123.3, 122.9, 119.0, 113.0, 108.6, 82.5, 70.4; C23H17NO3 (355.12): calcd. C 77.73, H 4.82, N 3.94; found C 77.57, H 4.99, N 3.98.2.2.3.3-(6-Chloro-1H-indol-3-Yl)isobenzofuran-1(3H)-One (3m)White solid, yield: 88%, mp. 139.1˚C - 140.6˚C. 1H NMR (DMSO-d6, 400 MHz), δ:6.77 (d, J = 3.6 Hz, 1H), 6.91 (s, 1H), 7.04 (dd, J = 2.8 Hz, 9.2 Hz, 1 H),7.52-7.68 (m, 5H), 7.96 (d, J = 9.6 Hz, 1H), 8.83 (s, 1 H); 13C NMR (DMSO-d6, 100 MHz) δ:170.9, 150.7, 137.7, 135.6, 130.3, 128.7, 128.2, 127.4, 125.9, 124.4, 123.6, 119.4, 114.5, 111.9, 78.6; C16H10ClNO2 (283.04): calcd.C 67.74, H 3.55, N 4.94; found C 67.84, H 3.56, N 4.86.3. Results and DiscussionIn our initial studies, all kinds of experimental parame- ters, such as solvents, molar ratios of the two substrates and catalyst loadings, were thoroughly investigated in the model Friedel-Crafts alkylation of indole (2a) with3-hydroxyisobenzofuran-1(3H)-one (1) employing the TsOH·H2O as the catalyst. And the results are listed in Table 1.Solvent evaluation revealed that chloroalkanes (CH2Cl2 and CHCl3) favored this transformation in termsof high yield (Table 1, Entries 1 and 2), and CH2Cl2 isTable 1. Optimization of the reaction conditions a.EntryCatalyst(mol-%)SolventMolar ration(1:2)Time(h)Yield(%)b1 2 CHCl3 1:1.2 3 902 2 CH2Cl2 1:1.23 953 2 THF 1:1.2 3814 2 EA 1:1.2 3725 2 CH3OH 1:1.2 5 616 2 EtOH 1:1.2 5617 1 CH2Cl2 1:1.2 12 788 5 CH2Cl2 1:1.2 2 949 2 CH2Cl2 1.2:1 3 8310 2 CH2Cl2 1:1 3 8711 2 CH2Cl2 1:1.5 3 92a Reactions were performed on a 1 mmol scale of 1(3-hydroxyisobenzo- furan-1(3H)-one) with a concentration of 0.5 mol·L–1;b Isolated yield.H. Y. TANG ET AL.13the optimal solvent providing the corresponding Friedel- Crafts alkylation product with the highest yield of 95% (Table 1, Entry 2, 95%). Marked decrease in yields was observed in this reaction when using other solvents, such as THF, methanol, ethanol and ethyl acetate (Table 1, Entries 3-6). Moreover, it was found that a ring-opened product was obtained in the case of the methanol or ethanol as the solvent. In addition, the adjustment of the catalyst loading also brought out some influence both on the reaction rate and chemical yield. For example, using the great amount of catalyst, we could obtain the alkyla-tion product 3a in quite shorter time with almost the same high level yield (Table 1, Entry 8). Reducing the catalyst loading from 2 mol-% to 1 mol-% led to an ob-vious decrease both on reaction rate and yield. Further-more, the molar ratio of the two reactants was found to be an essential factor to the yield of the reaction. As shown in Table 1, the yield of 3a was enhanced with the decrease in the molar ratio of 1 to 2a, and the maximal yield of 95% was obtained when the molar ratio reached 1:1.2 (Table 1, Entry 2). Further decreased the molar ratio to 1:1.5 resulted in a lower yield of 3a(Table 1, Entry 10).On the basis of the optimal reaction conditions of in- dole 2a (2 mol-% TsOH·H2O as the catalyst, substrates molar ratio (1:2a = 1:1.2), 0.5 M 3-hydroxyisobenzofu- ran-1(3H)-one 1, at 20in CH℃2Cl2), a plethora of in- doles 2 were evaluated for the reaction with 3-hydroxy- isobenzofuran-1(3H)-one 1, and the results are summa- rized in Table 2.As shown in Table 2, the reaction has broad applica- bility with respect to the indoles. A wide range of indoles bearing either an electron-withdrawing or electrondona- ting substituent at various positions on the indole ring were included as the reaction partners, leading to the formation of the desired products in good to excellent yields (Table 2, Entries 2-14, in most cases, over 90% yields were obtained). Generally, electron-rich indoles exhibited a higher reactivity than those of electron-poor ones. It is worth noting that the most electron-deficient nitro-substituted indole 2n also worked well to affording the corresponding alkylation product 3n with satisfactory yield (Table 2, Entry 14). Subsequently, the reaction be- tween indole (2a) and 3-ethyl-3-hydroxyisobenzofuran- 1(3H)-one [23,27], an interesting reaction partner, since an oxygen-containing quaternary carbon will be created in the Friedel-Crafts alkylation reaction, was also inves-tigated. Unfortunately, no reaction occurred even at ele-vated reaction temperature (60˚C).4. ConclusionIn summary, we have developed an efficient and facile method for the synthesis of 3-indolyl-substituted phthalides by Friedel-Crafts alkylation of indoles with Table 2.The synthesis of 3-indolyl-substituted phthalides between 3-hydroxyisobenzofuran-1(3H)-one and indoles catalyzed by TsOH·H2O a.Entry Product R R’ Time (h) Yield (%)b1 3a c H H 3 952 3b c H CH3 3 933 3c c 2-CH3 H 3 964 3d c 2-Ph H 3 885 3e c 5-OCH3H 3 966 3f c 5-OBn H 12 927 3g c 5-F H 24 918 3h c 5-Cl H 24 929 3i 5-OH H 24 8910 3j c 5-Br H 24 9411 3k 6-OBn H 12 8912 3l c 6-F H 5 8913 3m 6-Cl H 24 8814 3n c 6-NO2 H 24 77a Reactions were performed on a 1 mmol scale of 1 with a concentration of0.5 mol·L–1; b solated yield; c According to the literatures [16,18,19].3-hydroxyisobenzofuran-1(3H)-one. Compared to the limited literature reports, this method is more attractive because of its high efficiency, mild reaction conditions, readily available starting materials as well as the cheap catalyst. 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