TP5100中文datasheet

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SPMC65P2204A_2202A_数据手册_V1.1

SPMC65P2204A/2202A
目录
頁次
1. 总述.............................................................................................................................................................................................................. 4 2. 特性.............................................................................................................................................................................................................. 4 3. 芯片结构概览 ............................................................................................................................................................................................... 5 4. 信号描述....................................................................................................................................................................................................... 6

MMBT5401-TP;中文规格书,Datasheet资料

MMBT5401PNP Plastic Encapsulate TransistorFeatures• Collector Current:I CM =0.6A• Collector-Base Voltage:V (BR)CBO =160V• Operating And Storage Temperatures –55O C to 150O C • Capable of 0.3Watts of Power Dissipation • Marking:2LElectrical Characteristics @ 25OC Unless Otherwise SpecifiedSymbol ParameterMin Max Units OFF CHARACTERISTICSV (BR)CEO Coll e ctor -Emitter Breakdown Voltage (I C =1.0m Adc,I B =0)150--- Vdc V (BR)CBO Collector-Base Breakdown Voltage (I C =100uAdc,I E =0)160--- Vdc V (BR)EBO Emitter-Base Breakdown Voltage (I E =10uAdc,I C =0) 5.0--- VdcI CBO Collector Cutoff Current (V CB =120Vdc,I E =0)---0.1uAdcI EBOEmitter Cutoff Current (V EB =4.0Vdc,I C =0)---0.1uAdcON CHARACTERISTICSh FE-1DC Current Gain(V CE =5.0Vdc,I C =1.0mAdc)80------ h FE-2DC Current Gain(V CE =5.0Vdc,I C =10mAdc)100200--- h FE-3DC Current Gain(V CE =5.0Vdc,I C =50mAdc)50------V CE(sat)Collector-Emitter Saturation Voltage (I C =50mAdc,I B =5.0mAdc)---0.5Vdc V BE(sat)Base-Emitter Saturation Voltage (I C =50mAdc,I B =5.0mAdc)---1.0VdcSMALL-SIGNAL CHARACTERISTICSf TCurrent Gain-Bandwidth Product(I C =10mAdc,V CE =5.0Vdc, f=30MHz)100---MHzRevision: A 2011/01/01omp onents 20736Marilla Street Chatsworth! "# $ % ! "#Micro Commercial Componentswww.mccsemi .com1 of 2• Lead Free Finish/RoHS Compliant ("P" Suffix designates RoHS Compliant. See ordering information)• Epoxy meets UL 94 V-0 flammability rating • Moisure Sensitivity Level 1/Revision: A 2011/01/01Micro Commercial Componentswww.mccsemi .com2 of 23Ordering Information :***IMPORTANT NOTICE***Micro Commercial Components Corp. reserve s the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages.***LIFE SUPPORT***MCC's products are not authorized for use as critical components in life support devices or systems without the express writtenapproval of Micro Commercial Components Corporation.***CUSTOMER AWARENESS***Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on our web page cited below . Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine parts, have full traceability, meet MCC's quality standards for handling and storage. MCC will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. MCC is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.DevicePackingPart Number-T PTape&Reel;3Kpcs/Reel/分销商库存信息: MICRO-COMMERICAL-CO MMBT5401-TP。

HL5100-G;HL-5200;HL-5100;HL-5200-G;HL-5300;中文规格书,Datasheet资料

HL-5300
* HL-5000 Limit Switches are offered with a choice of ground terminal/M5 tapping on the rear side conforming to various standards. When placing an order, add the code to the model number to indicate if ground terminal/M5 tapping on the rear side is required. -G: with ground terminal/M5 tapping on the rear side.
(2) Ground Terminal Specifications
Blank : Without ground terminal G : With ground terminal/M5 tapping on the rear side
Ordering Information
Actuator Roller lever Adjustable roller lever Adjustable rod lever Sealed plunger Sealed roller plunger Coil spring Model
Dimensions and Operating Characteristics
Switches (Dimensions not shown are the same as roller lever models.)
Roller Lever HL-5000
58 ±0.8 53 ±0.8 39.5 ±0.8 40.3 ±0.8

TP05-1000-DBW中文资料

SPACE SAVING THICK FILM PLANAR RESISTORS!Series TP/TPS offer high power density in a lightweight design. Designed for switch mode power supplies, snubber circuits, heaters, in-rush limiters,dynamic braking, and other power applications, the planar construction offers significant PCB real estate savings over conventional resistors, especially in forced air applications. The unique design enables very low inductance and excellent surge capabilities. Series TP utilize alumina substrates for excellent heat dissipation. Series TPS utilize stainless steel substrates for even greater dissipation and durability. A special hi-temp/hi-voltage dielectric insulates the resistor and terminals from the metal substrate, enabling greater voltage and insulation compared to porcelain enameled models.OPTIONSSpecial marking, extended value range, custom sizes and shapes, burn-in and military screening,insulated leads, quick-disconnect terminals, multiple resistor circuits, etc. Consult factory for assistance.HIGH POWER PLANAR RESISTORS, 5W to 100WTP SERIES CERAMIC SUBSTRATE TPS SERIES STEEL SUBSTRATE1 Maximum Operating Voltage is DC or AC peak2 Expanded range available3 Available with 0.300” [7.62mm] pin spacing, specify opt.784 Available with 0.200” [5.08mm] pin spacing, specify opt.80 5Preliminary informationTYPICAL PERFORMANCE CHARACTERISTICSD C R e p y T e g a t t a W C °52@e g a t l o V .x a M g n i t a R 1d r a d n a t Se c n a t s i s e R e g n a R 2]m m [h c n I S N O I S N E M I D x a M A x a M B CD 50P T W 5V 0051ΩK 002o t ]8.52[510.1]31[215.10.±002.3]52.±80.5[3-70P T 5W 5.7V 0051ΩK 002o t ]8.52[510.1]4.91[567.10.±005.4,3]52.±7.21[-01P T W 01V 0051ΩK 003o t ]8.52[510.1]8.52[510.110.±008.3]52.±3.02[-51P T 5W 51V 0051ΩM 1o t Ω]13[22.1]62.23[72.1]5.±4.52[20.±00.1-52P T 5W 52V 0051ΩM 1o t Ω]03[81.1]93.65[22.2]5.±62.84[20.±09.1-05P T 5W 05V 0051ΩM 1o t Ω]66.75[72.2]93.65[22.2]5.±62.84[20.±09.1-05S P T W 05V 0525.0ΩK 01o t Ω]1.17[08.2]69.44[77.1]5.±4.52[20.±00.1]5.±65.53[20.±04.1001S P T W01V0035.0ΩK 02o t Ω]7.29[56.3]8.56[95.2]5.±20.33[20.±03.1]5.±81.34[20.±07.1)s r u o h 0001(e f i L d a o L %2±e c n a t s i s e R e r u t s i o M %1±e T p m e r u t a r e gn i l c y C %1±(d a o l r e v O )e g a t l o v x a m d e e c x e o t t o n S m 002,W d e t a r x 5ht g n e r t S c i r t c e l e i D )l i a v a V 057(C D V 005e c n a t s i s e R )c e s 5,C °062(t a e H r e d l o S o t %5.0±/m p p (t n e i c i f f e o C e r u t a r e p m e T )C °(C °m p p 001≥)m p p 002=%2er u t a r e p m e T g n i t a r e p O C °071o t C °55-=P T C °572o t C °55-=S P T r e w o P gn i t a r e D C °07>C °/%1=P T C°52>C °/%4.0=S P T FA048E Sale of this product is in accordance with GF-061. Specifications subject to change without notice.Space saving flame retardant design High power densityThin profile, and lightweightLow Inductance: 50nh typ at 1MHz Wide resistance range: 0.5Ω to 1M ΩExcellent transient withstanding capabilities Standard tolerances: as tight as ±0.5%.012 [.3]→0.1[2.54]←→ ← ||B|B|||B RCD Components Inc, 520 E.Industrial Park Dr, Manchester, NH, USA 03109 Tel: 603-669-0054 Fax: 603-669-5455 Email:sales@RESISTORS CAPACITOR S C OILS DELAY LINES68P/N DESIGNATION:Termination: W= Lead-free, Q= Tin/Lead (leave blank if either is acceptable)TP05 - 102 - J B WRCD TypePackaging : B = BulkTol. Code : D=0.5%, F=1%, G=2%, J=5%, K=10%, M=20%Options : assigned by RCD (leave blank for standard)Resis.Code 0.5%, 1%: 3 signif. figures & multiplier,e.g. 1R00=1Ω,10R0=10Ω,1000=100Ω,1001=1K, etc.Resis.Code 2%-10%: 2 signif. figures & multiplier,e.g. R50=.5Ω, 1R0=1Ω, 100=10Ω,101=100Ω,102=1K, etc.Term.W is RoHS compliant & 260°C compatible元器件交易网。

菲尼克斯5100说明书

菲尼克斯5100说明书菲尼克斯现货FL WLAN 5100 菲尼克斯现货FL WLAN 5100 WLAN接入点/端/中继器MIMO 3x3:2WLAN 02.11a、b、g、n2.4 GHz/5 GHz3根外置天线2x RJ 45尺寸（宽度 x 高度 x 深度）40 mm x 109 mm x 109 mm尺寸说明高度含天线插座，不含天线电缆FL WLAN以太网端口适配器是一款经济型工业WLAN 适配器，可将兼容以太网的设备连接到WLAN网络。

该以太网端口适配器外形紧凑，坚固耐用，内置无线模块和天线。

该设备防护等级达IP65，可直接现场安装，通过带M12连接器的以太网电缆连接到自动化设备。

优势：可直接在集成到应用以太网端口适配器的主要应用领域安装快捷轻松安装在现场以太网端口适配器是一种简易解决方案，可轻松将带以太网接口的工业自动化设备连接到WLAN网络。

该设备防护等级达IP65，可直接现场安装，通过带M12连接器的以太网电缆连接到自动化设备。

优势：内置天线的紧凑型IP65模块用于以太网和电力传输的M12接口轻松安装在现场自动组态，调试更简单安全通过Mode按钮轻松组态使用Mode按钮，无需组态即可轻松快速地构建安全的点到点网络和小型网络。

此外，也可通过网络浏览器轻松组态。

通过AT命令进行高级设置轻松组态和控制FL EPA 2在WLAN EPA模块运行过程中，可通过控制器发出的简单AT命令对其进行自动组态和控制。

这样就可以通过移动系统的控制器根据位置对漫游过程（即接入点之间的转换）进行控制。

FL EPA产品一览特性FL EPA 2FL EPA 2 RSMAWLAN标准IEEE 02.11a/b/gIEEE 02.11 a/b/g频段和道（*依不同国家而定）2.4 GHz，1-11道5 GHz：36-140道（端）5 GHz：36-4道（接入点）2.4 GHz，1-11道5 GHz：36-140道（端）5 GHz：36-4道（接入点）大数据速率（总值）54Mbps54 Mbps大数据流量（净值）< 20 Mbps< 20 Mbps运行模式端（单端网桥、多端网桥）（微型接入点）两个FL EPA模块之间的无线网桥端（单端网桥、多端网桥）（微型接入点）两个FL EPA模块之间的无线网桥大传输功率2.4 GHz：17 dBm（包括天线）5 GHz：15 dBm（包括天线）2.4 GHz：17 dBm（包括天线）5 GHz：15 dBm（包括天线）天线数1（内置）1（外置），RSMA接口安装后的防护等级IP65IP65环境温度（工作）-30°C … 60°C … 65°C电源9 … 30 V DC，大1.7 W9 …30 V DC，大1.7 W特殊性能双无线板：WLAN和蓝牙双无线板：WLAN和蓝牙功能强大的WLAN IEEE 02.11n模块，通范围更广采用新标准和MIMO技术，扩展通范围该设备有*的无线号，并采用符合IEEE 02.11n标准的MIMO（多点输入，多点输出）多天线技术，可在长距离范围内实现稳定、高速且可靠的无线通。

TP5410

RPROG （Ω） 10k 5k 1.2k 0.75k
IBAT 80mA 160mA 580mA 900 mA
个安全的电平，从而实现满电流充电。
0.68k
1000mA
当 BAT 引脚电压升至 2.9V 以上时，充
电器进入恒定电流模式，此时向电池提供恒
定的充电电流。当 BAT 引脚电压达到最终浮
充电压（4.2V）时，TP5410 进入恒定电压模
TP5410
工作原理
TP5410 是一款采用恒定电流/恒定电压对单节锂离子电池充电和升压放电控制器。它能够提供 1000mA 的充电电流（借助一个热设计良好的 PCB 布局）。升压电路内置了 NMOS 功率管，外部仅需一个电感和肖特基二极管及少量电容即可完成 5V 升压输出。
当 VOUT 端接入负载时，TP5410 可提供一个 5V 的稳压源，驱动能力达 1A。
● 150 200
250
mA
PROG 引脚电压
RPROG=1.2K，充电模式
● 0.9
1.0
1.1
V
5
南京拓微集成电路有限公司
TP5410
VCHRG
CHRG 引脚输出低电压 ICHRG =5mA
0.3
VSTDBY
引脚输出低电平 ISTDBY =5mA
0.3
ΔVRECHRG 再充电电池门限电压
VFLOAT-VRECHRG
mA
升压无负载，VBAT=3.8V
●
－10 －100 μA
涓流充电电流
VBAT<VTRIKL,RPROG=1.2K
● 120 130
140
mA
涓流充电门限电压
RPROG=1.5K,VBAT 上升

N50P111;中文规格书,Datasheet资料

DatasheetEasyPoint TMN50P111Navigation Module1 General DescriptionEasyPoint™ N50P111 is a miniature joystick module concept based on contact-less, magnetic movement detection. The integrated two-dimensional linear encoder monitors the movement of the magnet incorporated in the knob and provides directly the x and ycoordinates via I²C output. An integrated mechanical push button built in the module provides a “select” function.Figure 1. N50P111-xxxxx-H2 Key FeaturesXY coordinates direct read with 8-bit resolution 2.7V to 3.6V operating voltage Down to 1.7V I/O voltageLateral magnet movement radius up to 2.0mm High-speed I²C interfaceConfigurable interrupt output for motion detection Push button feature3 ApplicationsThe EasyPoint™ N50P111 is ideal for small form-factor manual input devices in battery operated equipment, such as Mobile phones, MP3 players, PDAs, GPS receivers, Gaming consoles and Analog joystick replacement.4 BenefitsHigh reliability due to magnetic non-contact sensing Low power consumption Two operating modes-Idle mode-Low Power modeN50P111Push button GNDI²C AddressGND: 0x40VDDp: 0x41AS5013Two-dimensional magnetic encoderContents1 General Description (1)2 Key Features (1)3 Applications (1)4 Benefits (1)5 Pin Assignments (4)5.1 Pin Descriptions (4)6 Absolute Maximum Ratings (5)7 Electrical Characteristics (6)7.1 Operating Conditions (6)7.2 Digital IO Pads DC/AC Characteristics (6)7.3 Switch Characteristics (7)7.4 Mechanical Specifications (8)7.5 Recommended Reflow Temperature Profile (8)8 Using the N50P111 Module (9)8.1 Powering up the Module (9)8.2 Registers Initialization (9)8.3 C Source Code Example (10)8.3.1 Initialization (10)8.3.2 Offset Calibration (10)8.3.3 Dead Zone area (11)8.3.4 Interrupt Routine (11)9 XY Coordinates Interpretation (12)9.1 EasyPoint Operating Principle (12)9.1.1 Knob Displacement and Register Value Relation (13)9.2 Operation Principle (14)10 I²C interface (15)10.1 Interface Operation (15)10.2 I²C Electrical Specification (16)10.3 I²C Timing (17)10.4 I²C Modes (18)10.4.1 Automatic Increment of Address Pointer (18)10.4.2 Invalid Addresses (18)10.4.3 Reading (18)10.4.4 Writing (18)10.4.5 High Speed Mode (21)10.4.6 Automatic Increment of Address Pointer (22)10.4.7 Invalid Addresses (22)10.5 SDA, SCL Input Filters (22)11 I²C Registers (23)11.1 Control Register 1 (0Fh) (23)11.2 X Register (10h) (25)11.3 Y_res_int Register (11h) (25)11.4 Xp Register (12h) (25)11.5 Xn Register (13h) (25)11.6 Yp Register (14h) (26)11.7 Yn Register (15h) (26)11.8 M_ctrl Register (2Bh) (26)11.9 J_ctrl Register (2Ch) (27)11.10 T_ctrl Register (2Dh) (27)11.11 Control Register 2 (2Eh) (27)11.12 Registers Table (28)12 Package Drawings and Markings (30)Datasheet - P i n A s s i g n m e n t s5 Pin Assignments5.1 Pin DescriptionsTable 1. Pin DescriptionsConnector Pin #Pin Type Description 1Power VDDp: IO power supply for SCL, SDA, INTn, 1.7V ~ 3.6V2Power VDD: Core power supply, 2.7V ~ 3.6V3Power GND4Bi-directional SDA: I²C bus data, open drain5Input SCL: I²C bus clock6Input RESETn: Reset input, active LOW0: GND → Reset, all registers return to their reset value 1: VDDp → Normal operation mode7Open drain INTn: Interrupt output, open drain: Active: LOWInactive: Hi-Z8Output SWITCHn: Push button signal output: Not pushed: OpenPushed: GND9Input ADDR: I²C Address selection input:0: GND → 0x401: VDDp → 0x411234J1VDDVDDpSCLSDAGNDDatasheet - A b s o lu t e M a x im u m R a ti n g s6 Absolute Maximum RatingsStresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Table 2. Absolute Maximum RatingsSymbol Parameter Min Max Units NotesV DD DC supply voltage-0.35VVDDp Peripheral supply voltage-0.35VDD + 0.3V SCL, SDA, RESETn, ADDRV IN Input pin voltage -0.3VDDp + 0.3VSCL, SDA, RESETn, ADDR - 3.6VI SCR Input current (latchup immunity)-100100mA Norm: JEDEC 78ESD Electrostatic discharge-±2kV All pins, Norm: MIL 883 E method 3015 T Strg Storage temperature-4085ºCHumidity non-condensing585%Degrees of protection IP5X Norm: IEC 605297 Electrical Characteristics7.1 Operating ConditionsT AMB = -20 to +70ºC, VDD = 3.3V 7.2 Digital IO Pads DC/AC CharacteristicsTable 3. Operating Conditions Symbol ParameterMin TypMax Units NotesVDDCore Supply voltage2.73.6VVDDp Peripheral Supply voltage 1.7VDD VInput: RESETnOpen drain outputs: SCL, SDA, INTn.External I²C pull up resistor to be connected to VDDp.IDD SMaximal average current consumption on VDD,Pulsed peaks = IDD fdepends on the sampling time ts[ms]3+3760/ts [ms]µAT AMB = -20 to +50 ºC10+3760/ts [ms]T AMB = 50 to +70 ºC IDD I Current consumption on core supply, Idle mode,no readout (ts = infinite)3µAT AMB = -20 to +50 ºC10T AMB = 50 to +70 ºC IDD f Current consumption on core supply,Full Power mode 10mA Continuous current pin VDD Maximum sampling ts = 450µs Tpua Power up time analog 1000µs Step on VDD to Data_Ready Tconv Conversion time 450µs Read X/Y coordinate I²C STOP condition to Data_Readyt P,W Nominal wakeup time 20320ms T AMBAmbient temperature range -20+70ºCResolution of XY displacement8Over 2*dx and 2*dy axisTable 4. Digital IO Pads DC/AC Characteristics Symbol ParameterMinMaxUnitsNotesInputs: SCL, SDAV IH High level input voltage 0.7 * VDDpV I²C V IL Low level input voltage 0.3 * VDDpV I²C I LEAK Input leakage current 1µA VDDp = 3.6V Inputs: ADDR, RESETn (JEDEC76)V IH High level input voltage 0.65 * VDDpV JEDEC V IL Low level input voltage 0.35 * VDDpV JEDEC I LEAK Input leakage current1µAVDDp = 3.6VOutputs: SDAV OHHigh level output voltageOpen drainLeakage current 1µA High level outputvoltage7.3 Switch CharacteristicsV OL1Low level output voltageVSS + 0.4V-6mA; VDDP > 2V;fast mode V OL3VDDP * 0.2V-6mA; VDDP ≤ 2V;fast mode V OL1VSS + 0.4V-3mA; VDDP > 2V;high speed V OL3VDDP * 0.2V -3mA; VDDP ≤ 2V;high speed C L Capacitive load 400pF standard mode ( 100 kHz )400pF fast mode ( 400 kHz )100pFhigh speed mode ( 3.4 MHz )Outputs: INTn (JEDEC76)V OH High level output voltage Open drain1µA Leakage current High level output voltageV OL Low level output voltageVSS + 0.2V -100µA VSS + 0.45-2mA C LCapacitive load30pFstandard mode ( 100 kHz )Table 5. Switch CharacteristicsParameterMinMax Units Notes Contact resistance of dome switch 750m ΩNorm: EIA-364-23Dielectric withstanding voltage100Vac Norm: EIA-364-20Insulation resistance 100m ΩNorm: EIA-364-21, 100VdcBouncing (On/Off)5msRate: 2 times/sec.Table 4. Digital IO Pads DC/AC Characteristics Symbol ParameterMinMax Units Notes7.4 Mechanical Specifications7.5 Recommended Reflow Temperature ProfileTable 6. Mechanical SpecificationsParameter Note Number of operating shaftsSingle shaft Shaft material LCP Housing material LCP & PA46Shell material Stainless Steel or Copper alloyTravel (XY operation)±2.00mm (±10%)Travel (Z push operation)0.22mm (±0.05mm)Directional operating force (XY direction)0.70N (±0.15N)Push operating force (Z direction)1.80N (±15%)Vibration10-500-10Hz 15 minutes, 12 cycles, 3 axes (total 36 cycles)Operating life – XY direction Each direction > 1 million cyclesOperating life – Push Z direction > 1 million cyclesShaft strength (XYZ direction)> 3.5 kgfFree fall Dispensing Glue40 drops(2X6 sides + 1X12 edges + 2X8 corners) @ 1.5m drop height to concrete surface, module is assembled to phone mechanics.Over forceDispensing Glue 1.5kgf > 100k cycles8 Using the N50P111 Module8.1 Powering up the ModuleThe N50P111 module has a Power ON Reset (POR) cell to monitor the VDD voltage at startup and reset all the internal registers. After the internal reset is completed, the POR cell is disabled in order to save current during normal operation.If VDD drops below 2.7V down to 0.2V, the POR cell will not be enabled back, and the registers will not be correctly reseted or can get random values.Note:It is highly recommended to control the external RESETn signal by applying a LOW pulse of >100ns once VDD has reached 2.7V and VDDp reached 1.7V.8.2 Registers InitializationAfter Power Up, the following sequence must be performed:1. VDD and VDDp Power up, and reached their nominal values (VDD>2.7V, VDDp>1.7V).2. Initialization:a. RESETn pulse LOW during >100ns, then RESETn HIGHb. Loop check register [0Fh] until the value F0h or F1h is present (reset finished, registers to default values)c. Write value 16h into register [2Dh]3. Perform an Offset Calibration (X and Y coordinate compensation for zero position)4. Configure the Dead Zone Area for Wake-up function (if needed)5. Configure the wanted Power Mode and INT function into register [0Fh] (Idle mode / Low Power Mode with Timebase configuration, INTfor Wake-up or Coordinates ready)6. X Y coordinates are ready to be read.8.3 C Source Code Example8.3.1 Initializationvoid EasyPoint_init (void){unsigned char Reset_status = 0;RESETn = 0;Delay_ms(1);// RESETn pulse after power upRESETn = 1; Delay_ms(1);while (Reset_status != 0xF0)// Check the reset has been done{Reset_status = I2C_Read8(0x40, 0x0F) & 0xFE;}I2C_Write8(0x40, 0x2E, 0x16); // Scaling factor for N50 (2.0mm knob travel) }8.3.2 Offset Calibrationvoid Offset_Calibrate (void){char i;int x_cal=0, y_cal=0;EA = 0;// Disable the MCU interruptsI2C_Write8(0x40, 0x0F, 0x00);// Low Power Mode 20msDelay_ms(1);I2C_Read8(0x40, 0x11); // Flush an unused Y_reg to reset the interruptfor (i=0; i<16; i++)// Read 16 times the coordinates and then average{while (INTn);// Wait until next interrupt (new coordinates)x_cal += (signed char) I2C_Read8(0x40, 0x10); // Read X positiony_cal += (signed char) I2C_Read8(0x40, 0x11); // Read Y position }// offset_X and offset_Y are global variables, used for each coordinate readout in the interrupt routineoffset_X = -(x_cal>>4); // Average X: divide by 16offset_Y = -(y_cal>>4); // Average Y: divide by 16EA = 1; // Enable the MCU interrupts}分销商库存信息: AMSN50P111。

TP5100中文数据手册

南京拓品微电子有限公司
TP5100
南京拓品微电子有限公司
NanJing Top Power ASIC Corp.
数据手册 DATASHEET
TP5100
器芯片
U
2A开关降压 8.4V/4.2V锂电池充电
南京拓品微电子有限公司
TP5100
概述
TP5100是一款开关降压型双节8.4V/单节4.2V锂电池充电管理芯片。其QFN16超小型封装与简单的外围电路，使得TP5100非常适用于便携式设备的大电流充电管理应用。同时， TP5100 内置输入过流、欠压保护、芯片过温保护、短路保护、电池温度监控、电池反接保护。 TP5100具有5V-18V宽输入电压，对电池充电分为涓流预充、恒流、恒压三个阶段，涓流预充电电流、恒流充电电流都通过外部电阻调整，最大充电电流达2A。 TP5100采用频率400kHz 的开关工作模式使它可以使用较小的外围器件，并在大电流充电中仍保持较小的发热量。 TP5100内置功率PMOSFET、防倒灌电路，所以无需防倒灌肖特基二极管等外围保护。
R R R R
PWR_ON-(引脚 6)：电源切换控制引脚。当芯片接电源时， PWR_ON- 被内部开关拉到低电平,驱动 PMOS 导通，当芯片不接电源时，PWR_ON-被内部开关拉到高电平为 BAT 端电池电压，驱动 PMOS 关断。此引脚可以用于电源供电切换，也可用作检测电源上电建立是否正常。 GND（引脚 7）：电源地。 VS（引脚 8）：输出电流检测的正极输入端。 BAT（引脚 9）：电池电压检测端。将电池的正端连接到此管脚。 VREG（引脚 10）：内部电源。VREG 是一个内部电源，它外接一个 0.1uF 旁路电容到地，可以最大驱动 5mA。 TS（引脚 11）：电池温度检测输入端。将 TS 管脚接到电池的 NTC（负温度系数热敏电阻）传感器的输出端。如果 TS 管脚的电压小于 VREG 的 45%或者大于 VREG 电压的 80%，意味着电池温度过低或过高，则充电被暂停。如果 TS 直接接 GND，电池温度检测功能取消，其他充电功能正常。

TPL0501EVM;中文规格书,Datasheet资料

User's GuideSLIU007–September2011TPL0501EVM User GuideContents1Features (2)2Introduction (2)3Mode Selection (2)4Jumper Connections (3)5Software Setup (4)6Operation (4)6.1Voltage Reference Mode (5)6.2Variable Gain Mode (5)7Layouts (7)8Bill of Materials (9)List of Figures1GUI for DPOT Control (4)2TPL0501Variable Gain (5)3TPL0501EVM Schematic (6)4Routing,Assembly and Silkscreen Top (7)5Layer2Ground Plane (7)6Layer3Power Plane (8)7Routing and Assembly Bottom (8)List of Tables1Description of Connectors and Jumpers (3)2430Boost-TPL0501EVM Bill of Material(DPOT Only) (9)Windows is a trademark of Microsoft Corporation.1 SLIU007–September2011TPL0501EVM User GuideSubmit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/Features 1Features•Works with low cost MSP430based LaunchPad platform•Simple GUI to control EVM•EVM can be operate two different modes–Adjustable Voltage reference mode–Variable gain mode•Board is entirely powered by USB2IntroductionThe TPL0501is a single channel,linear-taper digital potentiometer with256wiper positions.This devicecan be used as a three-terminal potentiometer or as a two-terminal rheostat.The TPL0501has an end–to-end resistance of100kΩ.The internal registers of the TPL0501can be accessed using aSPI-compatible interface.The TPL0501has a nominal temperature coefficient of35ppm/°C.The TPL0501is available in an8-pin SOT-23and8-microQFN package with a specified temperature range of–40°C to125°C.The TPL0501EVM is designed to operate with the Texas Instruments LaunchPad(MSP-EXP430G2).TheTPL0501EVM come with a preprogrammed MSP430G2553microcontroller which is to be inserted in theDIP socket on the LaunchPad.The LaunchPad can be separately purchased at /launchpad.The TPL0501EVM has two different evaluation modes:Mode1–Adjustable voltage reference mode–in this mode the TPL0501is used in conjunction with anLMV321op amp as an adjustable voltage reference circuit.Mode2–Variable gain mode–in this mode the TPL0501is configured as part of a variable gainnon-inverting amplifier.The gain of the amplifier can be controlled by a digital interface.This mode can beused to evaluate the bandwidth of the TPL0501.The EVM is operated by connecting the LaunchPad to a PC that has Windows™()via the USBPort.Other standard lab equipment such as Signal generator,multimeter,spectrum analyzer etc may berequired for detailed analysis of the TPL0501performance using this EVM.3Mode SelectionTo setup any of these two modes,begin by connecting the EVM to the LaunchPad.Note the location ofthe VCC and GND pins on headers J1and J2on both the LaunchPad and the EVM to ensure correctinstallation.1.Voltage reference modeConnect pins1and2of Jumper J7.Connect pins1and2of Jumper J5.Connect the LaunchPad and TPL0501EVM to a computer through the USB connector.2.Variable Gain modeConnect pins2and3of jumper J6.Connect pins1and2of jumper J7.Attach a signal generator to the EXT_IN connector.Connect the LaunchPad and TPL0501EVM to a computer through the USB connector 2TPL0501EVM User Guide SLIU007–September2011Submit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/ Jumper Connections4Jumper Connections1.J1&J2–LaunchPad HeadersThese connectors mate with the male headers on the LaunchPad.2.J5–Feedback loopFor the TPL0501to function as a voltage reference circuit the negative feedback loop must be shorted,placing a jumper across this header will short the inverting input to the output.3.J6–Inverting Op-amp selectWhen shorted across pins2and3,the wiper of TPL0501-100(U1)is connected to the inverting inputof the op-amp for evaluation of a non-inverting variable gain amplifier.This header can also be used asa pin out of the TPL0501-100(U1).Pin1is the H terminal,pin2is the W terminal but the L terminal isalways connected to ground.4.J7–Op-amp inputThis header controls the input to the non-inverting pin of the LMV321.When shorted across position1and2,the TPL0501-100(U2)in a voltage divider mode is attached to the non-inverting input of theLVM321.This setup is used to test the voltage reference setup.When shorted across pins2and3,theSMA connector is attached to the non-inverting input.Table1.Description of Connectors and JumpersLabel DescriptionJ1,J2Connectors to interface with LaunchPadJ3SMA/B Footprint for external inputJ5Control jumper to short feedback loopJ6Jumper to control inverting inputJ7Jumper to control input to Op-Amp3 SLIU007–September2011TPL0501EVM User GuideSubmit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/Software Setup 5Software SetupThe GUI software is available in a zip file located on the TPL0501product page on .Downloadthe zip file and extract its contents to a desired location on your PC.You will see an executable file calledTPL0501_GUI.exe in the extracted folder.Double click the file to open it and the GUI program shouldlaunch.IMPORTANT:Before launching the GUI please make sure the TPL0501EVM is setup in thedesired mode and connected to the PC through a USB port.6OperationFigure1.GUI for DPOT ControlThere are three methods to adjust the value of the TPL0501A/B.Start by clicking one of the buttonscircled in GREEN to select the corresponding TPL0501device.To adjust the tap value directly simply click the box that says tap and you will be prompted to input a tapvalue between0and127.After typing in the desired value press enter and the tap value will be sent tothe TPL0501A and the GUI will reflect the value you just entered.To adjust the TPL0501by inputting a wiper to low terminal resistance,click the box that says W-LResistance.You will then be prompted to input a value between0and10,000ohms;press enter after youhave input a value.The GUI will use the theoretical resistance values to find a tap that is closest to thevalue that was input.NOTE:All W-L resistance values are theoretical;the actual value will be within20%of the displayedvalue.4TPL0501EVM User Guide SLIU007–September2011Submit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/out Operation6.1Voltage Reference ModeMake sure the EVM is set up in Mode 1as described in Section 3.The TPL0501-100U2is used in the adjustable voltage reference mode.Select the corresponding device from the GUI.Change the value the DPOT using any of the methods described above.Measure the voltage on TP1using a multimeter.You will see the voltage change with the value of the TPL0501resistance.6.2Variable Gain ModeThe variable gain mode is primarily intended to test the bandwidth of the TPL0501.After setting up the EVM as described in Section 3,the circuit will look as follows:Figure 2.TPL0501Variable GainThe capacitor C6and the resistor R12are unpopulated and should be set by the user.R12will set the possible gain values and C6will keep the loop stable.Changing the value of the TPL0501works the same as described in the beginning of this section by selecting device TPL0501-100U1.5SLIU007–September 2011TPL0501EVM User GuideSubmit Documentation FeedbackCopyright ©2011,Texas Instruments Incorporated/OperationFigure3.TPL0501EVM Schematic6TPL0501EVM User GuideCopyright©2011,Texas Instruments Incorporated / Layouts 7LayoutsFigure4.Routing,Assembly and Silkscreen Topyer2Ground Plane7 SLIU007–September2011TPL0501EVM User GuideSubmit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/Layouts yer3Power PlaneFigure7.Routing and Assembly Bottom8TPL0501EVM User Guide SLIU007–September2011Submit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/ Bill of Materials 8Bill of MaterialsTable2.430Boost-TPL0501EVM Bill of Material(DPOT Only)Count RefDes Value Description Size Part Number MFR Notes 1TP15013Test Point,Orange,Thru Hole0.125x0.125inch5013Keystone DNI1TP25001Test Point,Black,Thru Hole0.100x0.100Inch5001Keystone DNI1TP35000Test Point,Red,Thru Hole0.100x0.100Inch5000Keystone DNI1TP45002Test Point,White,Thru Hole0.100x0.100Inch5002Keystone DNI1C1{VALUE}Capacitor,Ceramic,0805DNI1J3901-144-8RFX Connector,SMA,Straight,PC mount0.210sq inch901-144-8RFX,Amphenol DNI1408332-12R1-2{VALUE}Resistor,Chip,1/16W,5%0603DNI1U3LMV321IDBVR IC,Low Power,Single Op-Amp SOT23-5LMV321IDBVR TI1J5961102-6404-AR Header,Male2-pin,100mil spacing,0.100inch x2961102-6404-AR2J6-7961103-6404-AR Header,Male3-pin,100mil spacing,0.100inch x3961103-6404-AR2J1-2PPTC101LFBN-RC Header,Female10-pin100mil spacing0.100inch x10PPTC101LFBN-RC2U1-2TPL0501-10RSE IC,10KOhm,256Taps Single Chan QFN TPL0501-10RSE TIDigital W/SPI Interface9 SLIU007–September2011TPL0501EVM User GuideSubmit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/Evaluation Board/Kit Important NoticeTexas Instruments(TI)provides the enclosed product(s)under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATIONPURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.Persons handling theproduct(s)must have electronics training and observe good engineering practice standards.As such,the goods being provided arenot intended to be complete in terms of required design-,marketing-,and/or manufacturing-related protective considerations,including product safety and environmental measures typically found in end products that incorporate such semiconductorcomponents or circuit boards.This evaluation board/kit does not fall within the scope of the European Union directives regardingelectromagnetic compatibility,restricted substances(RoHS),recycling(WEEE),FCC,CE or UL,and therefore may not meet thetechnical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide,the board/kit may be returned within30days from the date of delivery for a full refund.THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BYSELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES,EXPRESSED,IMPLIED,OR STATUTORY,INCLUDINGANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods.Further,the user indemnifies TI from allclaims arising from the handling or use of the goods.Due to the open construction of the product,it is the user’s responsibility totake any and all appropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE,NEITHER PARTY SHALL BE LIABLE TO THE OTHERFOR ANY INDIRECT,SPECIAL,INCIDENTAL,OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products,and therefore our arrangement with the user is not exclusive.TI assumes no liability for applications assistance,customer product design,software performance,or infringement ofpatents or services described herein.Please read the User’s Guide and,specifically,the Warnings and Restrictions notice in the User’s Guide prior to handling theproduct.This notice contains important safety information about temperatures and voltages.For additional information on TI’senvironmental and/or safety programs,please contact the TI application engineer or visit /esh.No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine,process,orcombination in which such TI products or services might be or are used.FCC WarningThis evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATIONPURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.It generates,uses,andcan radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part15of FCC rules,which are designed to provide reasonable protection against radio frequency interference.Operation of thisequipment in other environments may cause interference with radio communications,in which case the user at his own expensewill be required to take whatever measures may be required to correct this interference.EVM Warnings and RestrictionsIt is important to operate this EVM within the input voltage range of0V to5.5V and the output voltage range of0V to5.5V.Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM.If there arequestions concerning the input range,please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to theEVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output.If there is uncertainty as to the loadspecification,please contact a TI field representative.During normal operation,some circuit components may have case temperatures greater than50°C.The EVM is designed tooperate properly with certain components above50°C as long as the input and output ranges are maintained.These componentsinclude but are not limited to linear regulators,switching transistors,pass transistors,and current sense resistors.These types ofdevices can be identified using the EVM schematic located in the EVM User's Guide.When placing measurement probes nearthese devices during operation,please be aware that these devices may be very warm to the touch.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments Incorporated/分销商库存信息: TITPL0501EVM。

MP5005-BP;MP506-BP;MP5010-BP;MP501-BP;MP502-BP;中文规格书,Datasheet资料

2. Pulse Test: Pulse Width 300usec, Duty Cycle 1%
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6

WLAN 5100说明书

2012/12WLAN 5100 使用说明修订号：V1.1作者：CCAX / HP菲尼克斯电气中国公司技术支持热线：+86-25-52102908南京江宁开发区菲尼克斯路36号电子邮件：CCAX@1.IP设置该设备可使用BootP工具（IPAssign或者Factory Manager）分配IP地址，本说明使用Factory Manager 为例说明。

1，打开软件，用网线连接电脑和5100设备。

2，在消息窗口即可看到bootp请求。

选中设备击右键添加设备。

3，在跳出的窗口中输入需要设定的IP地址和子网掩码，点击添加。

4，设备状态变为OK后，即可使用IP地址访问该设备。

2.进行参数设置1，点击Configuration下的Quick Setup，输入密码：private即可进入设置界面2，设置Country为China，操作模式按要求设定Access Point（接入点）或者Client（客户端），本例为接入点，设置SSID为需要的名称，本例为：PxC，设置Wlan band 为5GHz，Channel可设置为任意通道，注意客户端没有通道设置。

Wlan security为加密方式，Passkey为密码，设置完成后点击Apply and Save3，在客户端设置同样的SSID和密码即可连接到接入点设备，完成无线连接。

4，在Configuration—Advanced WLAN下可以选择通讯标准802.11 a\n、802.11 b\g\n、802.11 b、802.11 b\g、802.11 a.其中802.11 a\n和802.11 a为5GHz通讯频段，802.11 b\g\n、802.11 b和802.11 b\g为2.4GHz通讯频段。

802.11 a\n和802.11 b\g\n最大通讯带宽130Mbps，802.11 b\g最大通讯带宽54Mbps，802.11 b 最大通讯带宽11Mbps，802.11 a 最大通讯带宽54Mbps。

美孚佳特 5100 安全数据表说明书

修订日期: 18 三月 2021SDS 编号:7129386XCN 最初编制日期: 15 Dec 2016版本:4.01______________________________________________________________________________________________________________________化学品安全技术说明书产品产品名称: 美孚佳特 5100产品简介:基础油及添加剂产品代码: 201540105910, 609800推荐用途: 气缸油公司资料供应商:埃克森美孚( 中国 )投资有限公司美罗大厦17楼天钥桥路30号上海市 200030 中国二十四小时应急电话供应商联系电话电子邮件传真紧急情况概述:物理状态: 液体颜色: 褐色气味: 特有的根据法规指引（参阅第十五部分)，本产品不属于危险品。

高压射向皮肤可能会造成严重的损伤过度接触会造成眼部、皮肤或呼吸刺激。

根据法规指引（参阅第十五部分)，本产品不属于危险品。

含有: 磺酸钙可能产生过敏反应。

环境危害无明显危害注释: 在没有咨询专家的情况下,除第1部分规定的特定用途外,该产品不可用于其它任何目的。

健康研究已经表明,化学接触可能对人体健康造成潜在危害,这一点因人而异。

该产品被定义为混合物。

需要披露的有害物质或有害复合物名称CAS登记号#浓度*GHS 有害分类代码支链烷基苯酚和支链烷基苯酚钙保密 0.1 - < 1% H314(1C), H360(1B)(F),H400(M factor 10), H410(Mfactor 10)长链烷芳基磺酸钙 722503-68-6 0.1 - < 1% H317长链烷基苯酚硫化钙 68784-26-9 5 - < 10% H413碳酸钙(1:1) 471-34-1 1 - < 5%没有* 除气体外，所有组分的浓度均为重量百分比。

LM5100BSDNOPB;LM5101ASDNOPB;LM5100ASD;LM5100BMANOPB;LM5101BMANOPB;中文规格书,Datasheet资料

LLP 8 LLP 8
NSC Package Drawing M08A M08A
MRA08A MRA08A SDC10A SDC10A
M08A M08A SDC10A SDC10A M08A M08A SDC10A SDC10A MUY08A MUY08A MUY08A SDC08A SDC08A
Supplied As 95 units shipped in anti static rails
HI
High-side driver control input
LI
Low-side driver control input
VSS Ground return
LO
Low-side gate driver output
EP (LLP and PSOP and eMSOP packages)
Application Information
/
20203103

LM5100A/B/C, LM5101A/B/C
Input/Output Options
Part Number LM5100A LM5101A LM5100B LM5101B LM5100C LM5101C
Connection Diagrams
All signals are referenced to this ground.
Connect to the gate of the low-side MOSFET with a short, low inductance path.
Solder to the ground plane under the IC to aid in heat dissipation.
Connect to the gate of high-side MOSFET with a short, low inductance path.

MPXV5100DP中文资料

MPXV5100DP中⽂资料MPX5100Rev 10, 05/2005Freescale Semiconductor Technical DataFreescale Semiconductor, Inc., 2005. All rights reserved.Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated, and CalibratedThe MPX5100 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachiningtechniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.Features ? 2.5% Maximum Error over 0° to 85°CIdeally suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Available in Absolute, Differential and Gauge Configurations Durable Epoxy Unibody Element Easy-to-Use Chip Carrier Option Typical ApplicationsPatient Monitoring Process Control Pump/Motor ControlPressure Switching ORDERING INFORMATIONDevice TypeOptionsCase No.MPX Series OrderNumber Device MarkingUNIBODY PACKAGE (MPX5100 SERIES)Basic Elements Absolute 867MPX5100A MPX5100A Differential867MPX5100D MPX5100D Ported Elements Differential Dual Ports 867C MPX5100DP MPX5100DP Absolute, Single Port 867B MPX5100AP MPX5100AP Gauge, Single Port 867B MPX5100GP MPX5100GP Gauge, Axial PC Mount 867FMPX5100GSX MPX5100D Gauge, Axial Port, SMT 482A MPXV5100GC6U MPXV5100G Gauge, Axial Port, DIP 482CMPX5V100GC7U MPXV5100G Gauge, Dual Port, SMT1351MPXV5100DPMPXV5100MPX5100/MPXV5100SERIESINTEGRATED PRESSURE SENSOR0 to 100 kpa (0 to 14.5 psi)15 to 115 kPa (2.2 to 16.7 psi)0.2 to 4.7 V Output PIN NUMBER (1)1.Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin1 is noted by the notch in the lead.1N/C 5N/C 2V S 6N/C 3GND 7N/C 4V OUT8N/CPIN NUMBER (1)1.Pins 4, 5, and 6 are internal deviceconnections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.1V OUT 4N/C 2GND 5N/C 3V S6N/CMPX5100SensorsFigure 1. Fully Integrated Pressure Sensor SchematicTABLE 1. Maximum Ratings (1)1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.RatingSymbol Value Unit Maximum Pressure (P1 > P2)P MAX 400kPa Storage Temperature T STG -40° to +125°C °C Operating TemperatureT A-40° to +125°C°CTABLE 2. Operating Characteristics (V S = 5.0 V DC , T A = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.)CharacteristicSymbol Min Typ Max Unit Pressure Range (1)Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G Absolute: MPX5100A 1.0.1 kPa (kiloPascal) equals 0.145 psi.P OP015——100115kPaSupply Voltage (2)2.Device is ratiometric within this specified excitation range.V S 4.75 5.0 5.25V DC Supply CurrentI O —7.010mAdc Minimum Pressure Offset (3) (0 to 85°C)@ V S = 5.0 V 3.Offset (V OFF ) is defined as the output voltage at the minimum rated pressure.V OFF 0.0880.200.313V DC Full Scale Output (4)Differential and Absolute (0 to 85°C)@ V S = 5.0 V 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.V FSO 4.587 4.700 4.813V DC Full Scale Span (5)Differential and Absolute (0 to 85°C)@ V S = 5.0 V 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS — 4.500—V DC Accuracy (6)6.Accuracy (error budget) consists of the following:?Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled toand from the minimum or maximum operating temperature points, with zero differential pressure applied.Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimumor maximum rated pressure at 25°C.TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.TcOffset:Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C.?Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS at 25°C.———±2.5%V FSS Sensitivity V/P —45—mV/kPa Response Time (7)t R — 1.0—ms Output Source Current at Full Scale Output I O+—0.1—mAdc Warm-Up Time (8)——20—ms Offset Stability (9)——±0.5—%V FSSV SSensing ElementV OUTGain Stage # 2and Ground Reference Shift CircuitryPins 1 and 5 through 8 are NO CONNECTS for small outline packages GNDThin Film Temperature Compensation and Gain Stage # 1Pins 4, 5, and 6 are NO CONNECTS for unibody packagesMPX5100SensorsON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONINGFigure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0× to 85×C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range.Figure 3 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.The MPX5100 series pressure sensor operatingcharacteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensorperformance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2. Output Vs. Pressure DifferentialFigure 3. Cross Sectional Diagrams (Not to Scale)Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D inputof a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.)7.Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when sugected to a specified step change in pressure.8.Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9.Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.O u t p u t V o l t a b e (V )543MAX102030405060708090100210110S p a n R a n g e (T y p )O u t p u t R a n g e (T y p )OffsetPressure (kPa)(Typ)MINTYPV out = V S *(0.009*P+0.04)± (Pressure Error * Temperature Factor * 0.009 * V S V S = 5.0 V ± 0.25 Vdc PE = 2.5TM = 1TEMP = 0 to 85°CFluorosilicone Gel Die Coat Wire BondLead FrameDieEpoxy PlasticCaseDifferential/Gauge ElementDie BondFluorosilicone GelDie Coat Wire BondLead FrameDieStainless Steel Metal CoverEpoxy PlasticCase Die BondAbsolute ElementStainless Steel Metal Cover470 pFVs+5.0 V0.01 µF GNDV OUT1.0 µFIPSOUTPUTMPX5100SensorsTransfer Function (MPX5100D, MPX5100G, MPXV5100G Nominal Transfer Value:V OUT = VS (P x 0.009 + 0.04)± (Pressure Error x Temp. Mult. x 0.009 x V S )V S = 5.0 V ±5% P kPaTemperature Error MultiplierMPX5100D/MPX5100G/MPXV5100G SeriesTemp Multiplier4.03.02.00.01.0-40-2020406014012010080- 4030 to 85°C 1+125°3Break Points Temperature in °CNote: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Pressure Error BandPressure in kPa3.02.01.0-1.0-2.0-3.00.0020406080100120Pressure Error (max)0 to 100 kPa± 2.5 kPaE r r o r (k P a )Error Limits for PressureMPX5100D/MPX5100G/MPXV5100G SeriesMPX5100SensorsTransfer Function (MPX5100A)Nominal Transfer Value:V OUT = V S (P x 0.009 + 0.095)± (Pressure Error x Temp. Mult. x 0.009 x V S )V S = 5.0 V ±5% P kPaTemperature Error MultiplierMPX5100A Temp Multiplier 4.03.02.00.01.0-40-2020406013012010080140- 4030 to 85°C 1+125°3Break Points Temperature in °CNote: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.SeriesPressure Error BandPressure in kPa3.02.01.0-1.0-2.0-3.00.0020406080100130Pressure Error (max)15 to 115 kPa± 2.5 kPaE r r o r (k P a )Error Limits for PressureMPX5100A SeriesMPX5100SensorsPRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLEFreescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.The Pressure (P1) side may be identified by using Table 3 below.INFORMATION FOR USING THE SMALL OUTLINE PACKAGEMINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONSSurface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solderFigure5. Small Outline Package FootprintTABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLEPart NumberCase TypePressure (P1) Side IdentifierMPX5100A, MPX5100D 867Stainless Steel Cap MPX5100DP867C Side with Part Marking MPX5100AP, MPX5100GP 867B Side with Port Attached MPX5100GSX 867F Side with Port Attached MPXV5100GC6U 482A Side with Port Attached MPXV5100GC7U 482C Side with Port Attached MPXV5100DP 1351Side with Part MarkingPACKAGE DIMENSIONSCASE 482A-01ISSUE ASMALL OUTLINE PACKAGECASE 482C-03ISSUE BSMALL OUTLINE PACKAGEMPX5100 SensorsPACKAGE DIMENSIONSCASE 867-08ISSUE NUNIBODY PACKAGECASE 867B-04ISSUE FUNIBODY PACKAGE MPX5100SensorsPACKAGE DIMENSIONSCASE 867C-05ISSUE FUNIBODY PACKAGECASE 867F-03ISSUE D UNIBODY PACKAGE MPX5100SensorsPACKAGE DIMENSIONSCASE 1351-01ISSUE OSMALL OUTLINE PACKAGEMPX5100SensorsNOTESMPX5100 SensorsHow to Reach Us:Home Page:/doc/95f5dc1a52d380eb62946da2.htmlE-mail:support@/doc/95f5dc1a52d380eb62946da2.htmlUSA/Europe or Locations Not Listed: Freescale SemiconductorTechnical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224+1-800-521-6274 or +1-480-768-2130 support@/doc/95f5dc1a52d380eb62946da2.html Europe, Middle East, and Africa:Freescale Halbleiter Deutschland GmbHTechnical Information CenterSchatzbogen 781829 Muenchen, Germany+44 1296 380 456 (English)+46 8 52200080 (English)+49 89 92103 559 (German)+33 1 69 35 48 48 (French)support@/doc/95f5dc1a52d380eb62946da2.htmlJapan:Freescale Semiconductor Japan Ltd.HeadquartersARCO Tower 15F1-8-1, Shimo-Meguro, Meguro-ku,Tokyo 153-0064Japan0120 191014 or +81 3 5437 9125support.japan@/doc/95f5dc1a52d380eb62946da2.htmlAsia/Pacific:Freescale Semiconductor Hong Kong Ltd.Technical Information Center2 Dai King StreetTai Po Industrial EstateTai Po, N.T., Hong Kong+800 2666 8080/doc/95f5dc1a52d380eb62946da2.html @/doc/95f5dc1a52d380eb62946da2.html For Literature Requests Only:Freescale Semiconductor Literature Distribution Center P.O. Box 5405Denver, Colorado 802171-800-441-2447 or 303-675-2140Fax: 303-675-2150 LDCForFreescaleSemiconductor@/doc/95f5dc1a52d380eb62946da2.html Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages.“Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products forany such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale? and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners.Freescale Semiconductor, Inc. 2005. All rights reserved.MPX5100。

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W5100_Datasheet_v1.2.4

If you have something to ask about WIZnet Products, write down your ques tion on Q&A Board of „Support‟ menu in WIZnet website ( www.wiznet.co.k r). WIZnet Engineer will give an answer as soon as possible.
W5100 Datasheet
Document History Information
Version Ver. 1.0.0 Ver. 1.0.1 Date Dec. 21, 2006 Jan. 10, 2006 Descriptions Released with W5100 Launching LB bit in Mode register is not used . W5100 is used only in Big-endian ordering. Ver. 1.1.1 Jun. 19, 2007 Modified the OPMODE2-0 signals descriptions (P. 9) Modified the TEST_MODE3-0 signals description (P.10) Modified the Clock signals description (P.11) Modified the LINKLED signal description (P.11) Modified the explanation of RECV_INT in Sn_IR register (P. 26) Replaced the reset value of Sn_DHAR register (0x00 to 0xFF, P. 29) Modifted the explanation of Sn_DIPR, Sn_DPORT register(P. 30) Replaced the reset value of Sn_MSS register (0xFFFF to 0x0000, P. 30) Modified the Operating temperature (P. 62) Changed the typing error “MISO signal” (P. 9) Modified the SPI Timing diagram and description (P. 65) Modified the diagram (P. 39) Modified the Crystal Characteristics value (P. 66) Modified the SEN signals description (P. 9) Changed the typing error “SCLK” (P. 65) Changed the typing error “memory test mode” (P. 18) Changed the description & type of clock signals (P. 11) Modified DC characteristic value(p. 62) Add the power supply signal schematic (P. 11) Add Sn_TX_WR value changing condition Modify RD/WR timing diagram (P. 64, 65) Change the value of SOCK_ARP(0x01) state (P.30) Added the explanation of MF(MAC Filter) in Sn_MR (P. 25)

Agilent 5100 AFM Data Sheet

Agilent 5100 AFM/SPM MicroscopeData SheetFeatures and Benefits•High-performance atomic forcemicroscope designed for multi-ple-user labs and educationalenvironments•Cost-effective, modular solution offers easy upgrade path •Single multipurpose scanner with interchangeable nose cones makes setting up and switching imaging modes quick and simple •Open-top scanner affords easy video access•On-line training available to assist new users •Unobstructed optical view of the cantilever facilitates tip-sample alignment•Rigid mechanical design provides low noise floor for subnanometer resolution•Several sample-handling plates available to simplify sample preparation OverviewThe Agilent 5100 AFM/SPM micro-scope is a high-resolution systemthat provides excellent imagingcapabilities in an easy-to-upgradepackage. The 5100 offers researchersmany of the same features asAgilent’s sophisticated 5500AFM/SPM microscope at an entry-level price. Since user require-ments often grow, the Agilent 5100is fully upgradeable to the 5500.The Agilent 5100 AFM/SPM micro-scope delivers atomic-scale resolu-tion as well as direct video accessto the scan area. The 5100 comeswith Agilent’s multipurposescanner (Figure 1), offering a high-ly versatile system for a diverse setof applications. This modular scan-ner gives researchers the ability toswitch atomic force microscopy(AFM) imaging modes simply byexchanging nose cones. Two scanneroptions are available, covering therange from atomic resolution toalmost a tenth of a millimeter.The standard nose cone performscontact mode AFM and LFM (later-al force microscopy). Other imagingmodes, such as Agilent’s patentedMAC Mode®, acoustic AC (AAC)mode AFM, CSAFM (current sensingAFM), and STM (scanning tunnelingmicroscopy), are accomplished bysimply changing to the appropriatenose cone. Each scanner has anopen top, allowing unobstructedviewing with a video microscope(Figure 2). The advanced 5500microscope uses the same multi-purpose scanner as the 5100, thusminimizing the cost of an upgrade.Agilent is committed to providing upgrade paths for all of its instru-mentation users. Not only can the 5100 be upgraded to the 5500, the Agilent 4500 microscope can be upgraded to the Agilent 5100.Feel free to contact Agilent for more details.Whether starting a new lab or looking to expand the capabilities of an existing one, the Agilent 5100 AFM/SPM microscope may be the perfect solution right now —and it will certainly provide a solid foundation for the future.High-Quality Video AccessThe open-top design of the multipurpose scanner allows high-resolution video microscopy straight down the optical axis. The Agilent 5100 AFM/SPM microscope can be used with a standard high-performance video microscope without compromising the quality of results. Many video options are available for high-quality color imaging of the scan area.Combined with Agilent’s unique microtranslation, the 5100becomes a state-of-the-art video microscope and micropositioner.Environmental ControlThe hermetically sealed Agilent environmental isolation chamber allows high-resolution imaging of oxygen-sensitive materials, such as lithium film for battery research.The environmental control provid-ed by the EIC is also an essential requirement when working with a reactive gas, such as hydrogen in fuel cell research. When working with polymers, control of environ-mental parameters like humidity is key to achieving results.Furthermore, SPM studies that demand constant buffer concentra-tion and an oxygen-free environ-ment are important for research in electrochemistry (Figure 3)Additionally, the Agilent EIC is excellent for dry gas environments that remove moisture, prevent con-tamination, and reduce adhesion from capillary effects (as in forcemeasurement studies of proteins).In temperature-dependent studies,the EIC is crucial for condensation control. With the Agilent EIC, users are able to control vapor saturation and eliminate evaporation from sol-vents such as non-aqueous buffer.Temperature ControlAgilent’s temperature controller uses a patented thermal insulation and compensation design to deliv-er precise temperature control for high-resolution scanning probe microscopy (SPM). It allows imag-ing during temperature changes and is fully compatible with all imaging modes.The unique Agilent sample plates have built-in temperature control and offers excellent thermal stabil-ity for SPM imaging. The tempera-ture controller provides a rapid settling time, thereby allowing the sample plate to reach temperature quickly and hold constant temper-ature for long periods of time.Agilent’s temperature control design isolates the sample plate from the rest of the SPM system.An insulated ceramic fixture protects the surrounding appara-tus from the effects of heating or cooling, thus providing the most precise, stable temperature control available for SPM (Figure 4).Figure 2. Open-top design allows high-resolution video microscopy straight down the optical axis.Figure 3. Agilent 5100 AFM/SPMmicroscope with Agilent 5500 FlipStand and environmental control upgrades.Figure 1. Agilent multipurpose scanner with nose cones.Figure 4. Sample stages: (a) Hot MAC Mode, (b) cover slip with liquid cell, and (c) Petri dish.(a)(b)(c)Flexible ControllersThe Agilent 5100 AFM/SPMmicroscope works with Agilent’s state-of -the-art controllers. The controller design includes a modu-lar structure that allows simplified maintenance as well as stream-lined future upgrades of the controller electronics via plug-in board modules.The 5100 AFM/SPM standard controller provides:•Five 24-bit scan drives for high resolution and accuracy •Two 24-bit output channels for controlling imaging parameters •Five 16-bit input channels for data acquisition•Two 32-bit DSPs for scan & data •Built-in USB link for fast and reliable data transfer •Modular structure for easy addition of new capabilitiesFigure 5. AFM image of Au(111) surface showing monolayer terraces. 2µm x 2µm.Figure 6. AFM image of mica atoms at 200°C (FFT filtered). 16nm x 16nm.SoftwareAgilent’s new 32-bit Windows®-based PicoView™ is a highly stable software package that offers 3D rendering capabilities.PicoView, along with user-level scripting (C++, Microsoft® Visual Basic®, National Instruments LabVIEW™), allows completecontrol of all scanning parameters and provides the flexibility required for more complex experiments. An integratedscript editor and sample scripts are also included.(a)(b)(c)(a)(b)Figure 8. Surface charge induced order-disorder transition in an organic monolayer.Scan Size 40nm x 40nmCourtesy of: F Cunba, Nongjian Tao,Florida International University.Figure 7. (a) Height and (b) Friction Images ofPolystyrenepolybutadiene-polystyrene (PS-PB-PS) block copolymer. z range: 20 nm./find/afmFor more information on Agilent Technologies’products, applications or services, please contact your local Agilent office. The complete list is available at:/find/contactus Phone or FaxUnited States:(tel) 800 829 4444 (fax) 800 829 4433Canada:(tel) 877 894 4414 (fax) 800 746 4866China:(tel) 800 810 0189 (fax) 800 820 2816Europe:(tel) 31 20 547 2111Japan:(tel) (81) 426 56 7832 (fax) (81) 426 56 7840Korea:(tel) (080) 769 0800 (fax) (080) 769 0900Latin America:(tel) (305) 269 7500Taiwan:(tel) 0800 047 86 (fax) 0800 286 331Other Asia Pacific Countries:(tel) (65) 6375 8100 (fax) (65) 6755 0042Email:*****************Revised: 09/14/06Product specifications and descriptions in this document subject to change without notice.© Agilent Technologies, Inc. 2006Printed in USA, December 4, 20065989-6093ENAFM Instrumentation from Agilent TechnologiesAgilent Technologies offers high-pre-cision, modular AFM solutions for research, industry, and education.Exceptional worldwide support is provided by experienced application scientists and technical service personnel. Agilent’s leading-edge R&D laboratories ensure the continued, timely introduction and optimization of innovative,easy-to-use AFM technologies.Specifications:ScannersNote: Specifications shown are for open-loop operation. Closed-loop scanners are also available.Large multi-purpose scanner Scanning range 90µm x 90µm Z range 8µmVertical noise 0.5 Å RMS Small scannerScanning range 9µm x 9µm Z range 2µmVertical noise < 0.2 Å RMS Sample plate sizesKinematic mount translatable plate 4mm x 4mm ControllerInput Five 16-bit channels Two 32-bit DSPs for scan & data Drive 5 channels ±215 V, 24-bit Output 2 24-bit channels, ±10 V Interface USBPower 100 - 120 V AC or 220 - 240 V AC 1A; 50 - 60 Hz Facilities specifications Acoustic noise Less the 75dBcTemperature variation Does not exceed ±2°F Humidity variation Does not exceed ±20% RH。

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STDBY （引脚 14）：绿灯电池充电完成指示端。当电池充电完成时 STDBY 被内部开
关拉到低电平，表示充电完成。除此之外，
STDBY 管脚将处于高阻态。：红灯充电中状态指示 CHRG （引脚 15）端。当充电器向电池充电时， CHRG 管脚
被内部开关拉到低电平，表示充电正在进行；否则 CHRG 管脚处于高阻态。
RTRICK （引脚 12）：涓流预充电流设置端。将 RTRICK 引脚接地则预充电电流为 10% 设置恒流，通过外接电阻可以设置预充电电流。如果 RTRICK 悬空则预充电电流等于恒流电流。 CS（引脚 13）：锂离子状态片选输入端。CS 端高输入电平（VREG）将使 TP5100 处于锂离子电池充电 8.4V 关断电压状态。CS 端悬空使 TP5100 处于锂离子电池 4.2V 关断电压状态。低输入电平使 TP5100 处于停机状态。 CS 端可以被 TTL 或者 CMOS 电平驱动控制。
t RECHARGE
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南京拓品微电子有限公司
TP5100
典型性能指标（CS 设置为 8.4V 锂电池充电模式）
截止电压与电源电压关系
截止电压与环境温度关系
充电电流与电池电压关系
效率与电源电压关系
5
南京拓品微电子有限公司
南京拓品微电子有限公司
TanJing Top Power ASIC Corp.
数据手册 DATASHEET
TP5100
器芯片
U
2A开关降压 8.4V/4.2V锂电池充电
南京拓品微电子有限公司
TP5100
概述
TP5100是一款开关降压型双节8.4V/单节4.2V锂电池充电管理芯片。其QFN16超小型封装与简单的外围电路，使得TP5100非常适用于便携式设备的大电流充电管理应用。同时， TP5100 内置输入过流、欠压保护、芯片过温保护、短路保护、电池温度监控、电池反接保护。 TP5100具有5V-18V宽输入电压，对电池充电分为涓流预充、恒流、恒压三个阶段，涓流预充电电流、恒流充电电流都通过外部电阻调整，最大充电电流达2A。 TP5100采用频率400kHz 的开关工作模式使它可以使用较小的外围器件，并在大电流充电中仍保持较小的发热量。 TP5100内置功率PMOSFET、防倒灌电路，所以无需防倒灌肖特基二极管等外围保护。
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R
4.2V 锂离子电池 8.4V 锂离子电池 R S=0.1Ω ，恒流模式 R S =0.067Ω ，恒流模式
16 引脚 4mm*4mmQFN16 封装顶视图
（散热片可接地）
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南京拓品微电子有限公司
TP5100
TP5100 功能方框图
图 3 TP5100 功能框图
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南京拓品微电子有限公司
TP5100
电特性
表1 TP5100电特性能参数凡注●表示该指标适合 8.4V、4.2V模式，否则仅指 8.4V，T A =25℃，VIN=12V，除特别注明。
R
V UV
R
从V IN 低至高
R R
V UVHYS
R
V IN 欠压闭锁迟滞
R R
V ASD
R
V IN -V BAT 闭锁门限电压
R R R R
V IN 从低到高
R R
V IN 从高到低
R R
Vreg I TERM
R
内部电源 C/10 终止电流门限引脚输出低电压引脚输出低电平 TEMP 引脚高端关机电压 TEMP 引脚低端关机电压再充电电池门限电压芯片保护温度功率 FET“导通”电阻软启动时间再充电比较器滤波时间终止比较器滤波时间
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南京拓品微电子有限公司
TP5100
工作原理
TP5100 是专门为双节 8.4V/单节 4.2V 锂离子电池而设计的开关型大电流充电器芯片，利用芯片内部的功率晶体管对电池进行涓流、恒流和恒压充电。充电电流可以用外部电阻编程设定，最大持续充电电流可达 2A，不需要另加防倒灌二极管。TP5100 包含两个漏极开路输出的状态指示输出端，充电状态指示端 CHRG 和电池充满状态指示输出端 STDBY 。芯片内部的功率管理电路在芯片的结温超过 145℃时自动降低充电电流，这个功能可以使用户最大限度的利用芯片的功率处理能力，不用担心芯片过热而损坏芯片或者外部元器件。当输入电压大于芯片启动阈值电压和芯片使能输入端接高电平（VREG）或者悬空时，TP5100 开始对电池充电， CHRG 管脚输出低电平，表示充电正在进行。如果双节锂离子电池电压低于 5.8V （单节锂电子池电压低于 2.9V），充电器用小电流对电池进行涓流预充电（预充电电流通过外接电阻可调）。恒流充电电流由 VS 管脚和 VBAT 管脚之间的电阻确定。当双节锂离子电池电压接近 8.4V（单节锂离子电池接近 4.2V）时，距离充电截止电压约 50mV（根据不同的电路连接电阻与电池内阻电压不同），充电电流逐渐减小， TP5100 进入恒压充电模式。当充电电流减小到截止电流时，充电周期结束， CHRG 端输出高阻态， STDBY 端输出低电位。当电池电压降到再充电阈值（双节锂离子电池 8.1V/单节锂离子电池 4.05V）时，自动开始新的充电周期。芯片内部的高精度的电压基准源，误差放大器和电阻分压网络确保电池端截止电压的精度在+-1%以内，满足了锂离子电池的充电要求。当输入电压掉电或输入电压低于电池电压时，充电器进入低功耗的停机模式，无需外接防倒灌二极管 , 电池从芯片的漏电接近 1uA。图 4 受外部控制的 8.4V 锂离子电池充电状态与停机状态的切换截止电压的选择。当 CS 端连接高电位 VREG 时，为 8.4V 双节锂离子电池充电标准，截止电压 8.4V。当 CS 端悬空，为单节锂离子电池电池充电标准，截止电压 4.2V。当将 CS 端接低电平 GND 时，充电器停止充电。 TP5100 的 CS 端的复合设计，可以通过外部控制决定 TP5100 处于充电模式与停机模式的切换。当 CS 端悬空，表示 TP5100 为单节锂离子电池充电。 8.4V 双节锂离子电池充电状态与停机模式的切换。如图 4 所示，通过一个开漏输出端口与 CS 端连接，如果 NMOS 管栅极输入低电平，N1 截止，此时 CS 端接高电平，则充电截止电压为 8.4V，TP5100 为双节锂离子电池充电。当 NMOS 管栅极输入高电平， N1 导通，此时 CS 端被下拉到 GND，TP5100 为停机模式。VREG 引脚可以最大提供 5mA 驱动电流，上拉电阻可选 1k-100k。
R R R R
PWR_ON-(引脚 6)：电源切换控制引脚。当芯片接电源时， PWR_ON- 被内部开关拉到低电平,驱动 PMOS 导通，当芯片不接电源时，PWR_ON-被内部开关拉到高电平为 BAT 端电池电压，驱动 PMOS 关断。此引脚可以用于电源供电切换，也可用作检测电源上电建立是否正常。 GND（引脚 7）：电源地。 VS（引脚 8）：输出电流检测的正极输入端。 BAT（引脚 9）：电池电压检测端。将电池的正端连接到此管脚。 VREG（引脚 10）：内部电源。VREG 是一个内部电源，它外接一个 0.1uF 旁路电容到地，可以最大驱动 5mA 负载。 TS（引脚 11）：电池温度检测输入端。将 TS 管脚接到电池的 NTC（负温度系数热敏电阻）传感器的输出端。如果 TS 管脚的电压小于 VREG 的 45%或者大于 VREG 电压的 80%，意味着电池温度过低或过高，则充电被暂停。如果 TS 直接接 GND，电池温度检测功能取消，其他充电功能正常。
R R
BAT 引脚电流: I BAT
R
(电流模式测试条件是 CS=VREG、电池=7.5V)
待机模式，V BAT =8.4V
R R
VIN=0V ， V BAT =8.4V
R R
I TRIKL
R
涓流预充电电流 RTRICK 引脚接地振荡频率最大占空比最小占空比涓流充电门限电压（8.4V）涓流充电门限电压（4.2V）涓流充电迟滞电压 V IN 欠压闭锁门限
TP5100
引脚功能
VIN（引脚 1、4、5、16）：输入电压正输入端。此管脚的电压为内部电路的工作电源， VIN的变化范围在 5V至 18V之间，并通过一个 10uF和 0.1uF的电容进行旁路。当VIN和 V BAT 压差低于 30mv时， TP5100 进入停机模式，从而使I BAT 降至 1μ A。 LX（引脚 2、3）：内置 PMOSFET 功率管漏极连接点。LX 为 TP5100 的电流输出端与外部电感相连作为电池充电电流的输入端。