PCB一般制作规范2011-4

PCB 制作规范

Purchasing Specification for PWB

Page

1.0 範圍(Scope) (2)

2.0 基本要求(General Requirements) (2)

3.0 線路完整性(Pattern Integrity) (5)

4.0 孔穴規範( Hole Integrity) (13)

5.0 鍍層規範(Plating) (19)

6.0 防焊(Solder Mask) (24)

7.0 文字印刷要求 (Legend ) (28)

8.0標示( Marking) (29)

9.0 V 型切槽( V-CUT ) & PUSH BACK (30)

10.0 光學點 (Fiducial Mark) (31)

11.0 包裝(Packing) (32)

12.0 信賴性試驗規範(Reliability test Specification) (33)

13.0 外型尺寸及誤差 (Dimensions and Tolerances) (34)

14.0 板面清潔度(Cleanliness) (37)

1.0 範圍(Scope)

1.1 本規範適用於所有硬性樹脂基材之單面,雙面及多層PWBs 之基本要求,

凡本公司所用之上述PWBs 板均須符合此規範要求。

This specification shall be applied to all single-sided, double-sided and multi-layer of rigid printed circuit boards.

1.2 本規範未列舉項目概以IPC-6012, IPC-A-600 最新版class2 等級及MIL-P-55110

2.0 基本要求(General Requirements)

2.1 所用之等級,型號,依本公司工程規格指定。

The ANSI class style of laminate should follow DELTA’s individual engineering specification.

2.2 須有UL 認可,防火等級在94V-0 且附有證明者。

PWB shall be UL approved, flame retardant conform to 94V-0 and register in UL license.

2.3 UL 認可耐溫等級(M.O.T)須為130℃或更好的。

The maximum operating temperature shall be 130℃or more than better.

2.4 UL 認可耐熱漂錫性必須符合溫度≧260℃且時間≧5 秒以上.

Solder Resist limits shall be UL approved and meet the temperature≧ 260℃for 5secs min.

2.5 介質(絕緣材料)起碼厚度若無明確規定其隔離尺度時,至少要≧0.09mm(

3.5mil)

以上,介質厚度計算以牙底至牙底(如Fig.1).

If not specified, the minimum dielectric thickness shall be 0.09mm.

2.6 介質層除特別規定外,疊層最少為2 張P.P。

If not otherwise specification the Dielectric shall be 2 ply .

2.7 PWB 應為原色,不得有焦黑,異色之現象。

PWB shall not discolors, any burn and weird color are not acceptable.

2.8 PWB 出現空泡,分層,白圈之現象須符合如下要求:

In the event of Blistering, Delamination and Haloing in PWB, it must

conform it as following:

◎缺點為不導電性的.

The fault does not conductance.

◎在導体間或通孔間尚未超過其間距之25%且出現面積不可超過每個板面1%。

There shall be no more than 25% reduction in space between conductors and

at the center through holes, Total board area affected shall not exceed 1% on

each side.

◎缺點經各項測試後未擴散者。

No propagation as a result of testing.

2.9 板面不得有金屬性物質陷入。

Plate surface shall be free from metallic matter.

2.10 板邊拉料不得深入超過一個板厚度,或造成線路下層懸空。

Edges are rough put not over one PWB thickness, or to cause happen trace damage.

2.11 板面不得有雜質,油脂,指印,殘餘助焊劑或其他污染物。

The surface of PWB should be free from dirt oil corrosion, fingerprint or other pollutants. 2.12 銅箔不得與PWB 脫離(Separation)

Copper foil shall stick to the PWB at all time.

2.12.1 壓合空洞須≦0.08mm 且未違反介質起碼間距。

Laminate voids are≦0.08mm and does not violate minimum dielectric spacing.

2.12.2 金屬層對通孔壁所讓出的間距不得小於0.1mm。

Metal plane setback is equal to or greater than 0.1mm.

2.12.3 內層板不得出現分層或起泡現象。

No evidence of de-lamination or blistering.

2.13 PWB 針孔,凹陷,刮痕,織紋顯露,白點,白斑之現象須符合如下要求:

In the event of Pin hole, Dents, Scratches, Weave exposure, Measling and Crazing

characteristics occur in PWB shall comply to the following below:

2.1

3.1 PWB 中纖維未被切斷,擾亂且纖維未裸露者。

The fiber in PWB do not separate or disrupted or exposed.

2.1

3.2 在兩導體間尚未搭連且符合起碼間距要求。

Defect shall no involves two separate conductor and shall not reduce the min.

conductor spacing requirements.

2.1

3.3 導體間或兩缺點間之介質未影響原要求。

Between conductor and defect does not interfere with requirement.

2.1

3.4 經組裝製程不可有擴大現象。

No propagation and degeneration after thermal process.

2.1

3.5 白點或白斑不可於不同電位區之導體間。

Measling or crazing cannot be at different electric potential conductors.

2.14 毒性(Toxicity)

PWB 本身必須滿足職業健康的需求﹐在製造過程中不能釋放有害的危險物

質。

PWB shall fulfill the requirements set by Occupational health

authorities. Printed boards shall not discharge harmful amounts of dangerous substance, vapor or gases during the manufacturing process.