不良描述中英文对照
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不良描述中英文对照(五金,塑料,PCB) 1.Plastic parts 塑膠部件-
Inspection Points /檢查要點: Abrasion/划痕,Bubbles/气泡, Burrs/毛刺,
Bad Plating/電鍍不良, Contamination/雜質,
Crack/爆裂,
Combine Lines/結合線, Deformation/變形,
Flow Marks/流痕,
Greasy Dirt/油污,
Haze/霧狀,
Jelly/泠膠,
Mold Marks/模痕, Melange Color/混色, Oppilation Hole/盲孔,
Pull White/拉白,
Pour Hole uneven/澆口不平, Wrong Stamping/字麥不符, Short Shots/缺料, Shrinkage/縮水,
Stripped Screw/螺絲滑牙, Top White/頂白,
Weld Lines/夾水紋,
Wrong Dimension/尺寸不符, Wrong Texture/紋理錯誤, Light/發亮;-质量-
2. Metal Parts 五金部件
Inspection Points /檢查要點: Abrasion/划痕,
Bad Weld/焊接不良,
Burrs/毛刺,
Bad Plating/電鍍不良, Bend angle/折彎角度, Contamination/雜質, Crack/爆裂,
Deformation/變形,
Dents/凹痕,
Greasy Dirt/油污,
Mold Marks/模痕, Missing Stamp/漏沖壓, Oppilation Hole/盲孔, Pressing Marks/壓痕,
Rust/生鏽,
Wrong Stamping/字麥錯誤, Short Shots/缺料,
Stripped Screw/螺絲滑牙,
Pits/疤痕,
Specks/斑點
Wrong Texture/紋理錯誤, Wrong Dimension/尺寸不符;bb
3. Painting parts / SilkScreen parts 噴油/絲印部件
Inspection Points /檢查要點: Bleeding/滲色,
Bad Painting/噴油不良, Contamination/雜質,
deviate position/偏位,
Flow Marks/流痕,
Missing paint/漏噴,
Over Paint/肥油,
Pits/疤痕,
Poor Adhesion/附著力差,
Print Words Leans/印刷字體傾斜, Pooring Paint/薄油,
Silkscreen Haze/絲印模糊,
Silkscreen Stamping Inconsistency/絲印字樣不一致,
Scratch/划傷,
Speck/斑點,
Uneven Surface Oil/表面油層不均勻, Words Break Off/字体斷開,
Wrong Color/錯誤顏色,
Wrong Texture/紋理錯誤;-
4. PCB 印制线路板
Open/开路;
Short/短路;
Weave Texture/板料席纹; Foreign Residue/外来杂物; Delamination/爆板,分层;
Dent/凹陷;
Dent on G/F/金手指凹陷; Scratch/擦花;
Misregistration/对位不正;
Board Damage/板子损坏;
C/M Illegible/白字不清;
C/M on pad/白字上垫;
Copper expoure/露铜;
Solder Mask on Pad/绿油上垫; Uneven Solder Mask/绿油不平均; Solder Mask peeling off/绿油脱落; Missing Hole/漏孔; Excess Hole/多孔;
Wrong Hole Size/孔径错误;
Hole Breakout/崩孔;
Nick Trace/线路缺口;
Void on Trace/线路铜穿;
Diskdown/线路不良/狗牙;
Solder Mask inside hole/绿油入孔; Discolouration under Solder Mask/绿油颜色不良;
Foreign matter under Solder Mask/绿油下杂物;
Solder Mask skipping/不过油;
Solder on Gold Finger/金手指上锡;
Poor Bevelling/斜边不良;
Gold Finger burrs/金手指损坏;
Ping Ring/粉红圈.
5. Electronic parts 电子元件
No AVL/没AVL;
not on AVL/不在AVL上;
Mfg/Mfg P/N dis-match AVL/ 与AVL不符; D/C overdue/ D/C 过期;无D/C;
wrong part/错料;
no reel/无卷轴;
bulk packing for chip/ 散装;
No dry packing(HIC change color)/ 无真空包装(防潮卡变色);
No ESD packing/无防静电包装;
illegible marking/印字不清,
wrong marking/印字错;
deformation/变型;
micro crack/裂料;
damaged part/ 烂料;
Lead bent(PTH/SMT)/脚弯;
Solder balls damaged/锡球坏
wrong lead form/脚型错;
wrong pitch/脚距不符;
coplanar problem/平整度不良; pad(lead) oxidization/锡垫(引脚)氧化; wrong direction in tape(tray)/带中(盘中)方向错;
short pins/引脚短;
failed in solderability/ 焊锡不良;
size(dimensions) out of specification/ 尺寸超标;
function fail/ 功能不良;
no tolerance/无误差范围; contamination/杂质;
wrong identification for pin1/ 第1脚标识错.
Broker Buy/炒料;(巻装物料)巻带前无空余巻带
No blank cover tape for feeder loading巻带粘力不足
Not enough adhesive for the cover tape. 料盤变形
Reel Deforming/卷带变型.