不良现象中英对照表(Intel)
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English(Intel) Item 錯件 Wrong part 79 缺件 Missing Part 80 多件 Excess part 81 破件 Damaged 82 短路 Short, Solder bridge 83 断路 Open 84 線短 Wire Short 85 線長 Wire Long 86 拐線 Wire Poor Address 87 空焊 Open joint 88 錫未熔/冷焊 Cold Solder 89 包焊 Excess solder 90 折角 Lifted pin 91 錫尖 Solder Icicle 92 錫渣 Solder Splash 93 錫裂 Solder Crack 94 零件沾錫 Solder on Parts 95 錫洞 Pin Hole 96 錫球 Solder Ball 97 錫橋(錫短路) Solder Bridge 98 螺絲滑牙 Screw Stripped/Loose, Shift Screw 99 氧化 Oxdized/Rust 100 異物殘留 Foreign materials contanmination 101 溢錫 Solder Overflow 102 溢膠 Excessive Glue 103 錫不足/吃錫不良 Insufficient Solder 104
Chinese
Chinese English(Intel) 電晶體壞 Transistor Wrong 振盪器壞 Diode NG 管裝錯誤 Tubes Wrong 阻值錯誤 Impedance Wrong 版本錯誤 Rev. Wrong 電測不良 Test Failure 版本未標 Non Rev Label 包裝損壞 Packing Damage 印章模糊 Stamps Defective 標籤歪斜 Label Tilt 外箱損壞 Carton Damaged 點膠不良 Poor Glue IC座氧化 Socket Rust 缺UL標示 Missing UL Label 線材不良 Wire Failure 設計不良(H/W) Design Bug(Hardware) 設計不良(F/W) Design Bug(Firmware) 組裝不良 Assembling Fail 匹配不良 Compatibility Issue 加工不良 Fabricating Fail 設備不良 Equipment Fail 補線斷線 Broken Circuit after Repairing 零件不良 Component Fail/Defective materials 線材不良 Defective cables 配備機構件不良Periphral Unit Fail Excess Solder 多錫
55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78
Baidu Nhomakorabea
零件損壞 Parts Damaged 零件腳髒 Pin Contamination 包裝錯誤 Wrong Packing 印章錯誤 Wrong Stamps 尺寸錯誤 Dimension Wrong Placement Defect 置件不良 Joint Defect 焊點不良 無法修護報廢 Can't Be Repaired 畫記不良 Defecting Mark 翻面 Reversed Component 錫珠 Solder Ball 線路斷路 Trace/Circuit Open 原因不明 Unknown Reasons(Yellow Card) Misjudgement by Thermal Lssue 熱飄移 Test Program Error 程式問題 零件QVL及穩定性Component OQL and Stability Others 其他 SMT SMT Placement Defect 置件不良 Joint Defect 焊點不良 ICT-SMT ICT-SMT AOI AOI DIP DIP/後焊 二極體壞 Diode NG
Misoriented/Wrong Polarity Tombstone Shift /Skew Flux Contamination lead not through lead too long Pin Short Pin Unseated Pin Not Bent Missing Stamp Missing Label Missing S/N Wrong S/N Wrong Label Wrong Mark JI Dirty Solder Scooped W/L of Wire No Test VR Deformed PCB Peeling PCB Twist Glue On Parts Parts Pin Long Parts Tilted Lifted pin Parts Touch Parts Deformed
133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156
包裝 客戶 AOI ATS ATE 後裝/模組組裝 測試/單板測試 AGING ICT-DIP ATS ATE 後裝/模組組裝 測試/單板測試 AGING PCB 零件 設計 其他 系統組裝 系統前測 系統後測 工程/維修 進料檢驗 出貨檢驗
Packing Customer AOI ATS ATE Assembling Fail Function Test AGING ICT-DIP ATS ATE Assembling Fail Function Test AGING PCB Component / Part R/D, Design Others System Assembling System Pre-Test System Post-Test ENG/TS IQC OQC
105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132
置件位置錯誤 Wrong Location 機板模組不良 Module Fail 零件腳損壞 Pin Damaged 金手指沾膠 Solder On Golden Fingers 墊片安裝不良 Washer Unseated 線材安裝不良 Wire Unseated 蜂巢版 Bulk Partition 重組OK OK after Reassembling 誤判 NDF/False failure Clear CMOS/Setup Default Clear CMOS/Setup Default Rework 不良 Rework Fail 外觀不潔 Appearance Contamination 人為撞件/刮傷 Knocked off/Scratched(damaged) 零件/PCB燒毀 Component/PCB Burned-out 無法修護報廢 Can't Be Repaired 畫記不良 Defecting Mark 翻面 Reversed Component 錫珠 Solder Ball 線路斷路 Trace/Circuit Open 原因不明 Unknown Reasons(Yellow Card) Misjudgement by Thermal Issue 熱飄移 Test Program Error 程式問題 Component OQL and Stability 零件QVL及穩定性 Others 其他 SMT SMT DIP DIP/後焊 ICT-DIP ICT-DIP ICT-SMT ICT-SMT
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54
極反 立碑 偏移/傾斜 助焊劑殘留 零件腳不出 零件腳太長 零件腳太短 腳未入 腳未彎 缺蓋章 缺標籤 缺序號 序號錯 標籤錯 標示錯 JI 不潔 錫凹陷 線序錯 未測試 VR變形 PCB翹皮 PCB彎曲 零件沾膠 零件腳長 浮件 零件腳翹 零件相觸 零件變形
English(Intel) Item 錯件 Wrong part 79 缺件 Missing Part 80 多件 Excess part 81 破件 Damaged 82 短路 Short, Solder bridge 83 断路 Open 84 線短 Wire Short 85 線長 Wire Long 86 拐線 Wire Poor Address 87 空焊 Open joint 88 錫未熔/冷焊 Cold Solder 89 包焊 Excess solder 90 折角 Lifted pin 91 錫尖 Solder Icicle 92 錫渣 Solder Splash 93 錫裂 Solder Crack 94 零件沾錫 Solder on Parts 95 錫洞 Pin Hole 96 錫球 Solder Ball 97 錫橋(錫短路) Solder Bridge 98 螺絲滑牙 Screw Stripped/Loose, Shift Screw 99 氧化 Oxdized/Rust 100 異物殘留 Foreign materials contanmination 101 溢錫 Solder Overflow 102 溢膠 Excessive Glue 103 錫不足/吃錫不良 Insufficient Solder 104
Chinese
Chinese English(Intel) 電晶體壞 Transistor Wrong 振盪器壞 Diode NG 管裝錯誤 Tubes Wrong 阻值錯誤 Impedance Wrong 版本錯誤 Rev. Wrong 電測不良 Test Failure 版本未標 Non Rev Label 包裝損壞 Packing Damage 印章模糊 Stamps Defective 標籤歪斜 Label Tilt 外箱損壞 Carton Damaged 點膠不良 Poor Glue IC座氧化 Socket Rust 缺UL標示 Missing UL Label 線材不良 Wire Failure 設計不良(H/W) Design Bug(Hardware) 設計不良(F/W) Design Bug(Firmware) 組裝不良 Assembling Fail 匹配不良 Compatibility Issue 加工不良 Fabricating Fail 設備不良 Equipment Fail 補線斷線 Broken Circuit after Repairing 零件不良 Component Fail/Defective materials 線材不良 Defective cables 配備機構件不良Periphral Unit Fail Excess Solder 多錫
55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78
Baidu Nhomakorabea
零件損壞 Parts Damaged 零件腳髒 Pin Contamination 包裝錯誤 Wrong Packing 印章錯誤 Wrong Stamps 尺寸錯誤 Dimension Wrong Placement Defect 置件不良 Joint Defect 焊點不良 無法修護報廢 Can't Be Repaired 畫記不良 Defecting Mark 翻面 Reversed Component 錫珠 Solder Ball 線路斷路 Trace/Circuit Open 原因不明 Unknown Reasons(Yellow Card) Misjudgement by Thermal Lssue 熱飄移 Test Program Error 程式問題 零件QVL及穩定性Component OQL and Stability Others 其他 SMT SMT Placement Defect 置件不良 Joint Defect 焊點不良 ICT-SMT ICT-SMT AOI AOI DIP DIP/後焊 二極體壞 Diode NG
Misoriented/Wrong Polarity Tombstone Shift /Skew Flux Contamination lead not through lead too long Pin Short Pin Unseated Pin Not Bent Missing Stamp Missing Label Missing S/N Wrong S/N Wrong Label Wrong Mark JI Dirty Solder Scooped W/L of Wire No Test VR Deformed PCB Peeling PCB Twist Glue On Parts Parts Pin Long Parts Tilted Lifted pin Parts Touch Parts Deformed
133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156
包裝 客戶 AOI ATS ATE 後裝/模組組裝 測試/單板測試 AGING ICT-DIP ATS ATE 後裝/模組組裝 測試/單板測試 AGING PCB 零件 設計 其他 系統組裝 系統前測 系統後測 工程/維修 進料檢驗 出貨檢驗
Packing Customer AOI ATS ATE Assembling Fail Function Test AGING ICT-DIP ATS ATE Assembling Fail Function Test AGING PCB Component / Part R/D, Design Others System Assembling System Pre-Test System Post-Test ENG/TS IQC OQC
105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132
置件位置錯誤 Wrong Location 機板模組不良 Module Fail 零件腳損壞 Pin Damaged 金手指沾膠 Solder On Golden Fingers 墊片安裝不良 Washer Unseated 線材安裝不良 Wire Unseated 蜂巢版 Bulk Partition 重組OK OK after Reassembling 誤判 NDF/False failure Clear CMOS/Setup Default Clear CMOS/Setup Default Rework 不良 Rework Fail 外觀不潔 Appearance Contamination 人為撞件/刮傷 Knocked off/Scratched(damaged) 零件/PCB燒毀 Component/PCB Burned-out 無法修護報廢 Can't Be Repaired 畫記不良 Defecting Mark 翻面 Reversed Component 錫珠 Solder Ball 線路斷路 Trace/Circuit Open 原因不明 Unknown Reasons(Yellow Card) Misjudgement by Thermal Issue 熱飄移 Test Program Error 程式問題 Component OQL and Stability 零件QVL及穩定性 Others 其他 SMT SMT DIP DIP/後焊 ICT-DIP ICT-DIP ICT-SMT ICT-SMT
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54
極反 立碑 偏移/傾斜 助焊劑殘留 零件腳不出 零件腳太長 零件腳太短 腳未入 腳未彎 缺蓋章 缺標籤 缺序號 序號錯 標籤錯 標示錯 JI 不潔 錫凹陷 線序錯 未測試 VR變形 PCB翹皮 PCB彎曲 零件沾膠 零件腳長 浮件 零件腳翹 零件相觸 零件變形