FPC-专业词汇-中英文对照
FPC专业术语中英对照
FPC专业术语中英对照DDate Code ——周期代码，用来表明产品生产的时间。
Delamination ——基材中层间的分离，基材与铜箔之间的分离，或线路板中所有的平面之间的分离。
Delivered Panel(DP) ——为了方便下工序装配和测试的方便，在一块板上按一定的方式排列一个或多个线路板。
Dent ——导电铜箔的表面凹陷，它不会明显的影响到导铜箔的厚度。
Design spacing of Conductive ——线路之间的描绘距离，或者在客户图纸上定义的线路之间的距离。
Desmear ——除污，从孔壁上将被钻孔摩擦融化的树脂和钻孔的碎片移走。
Dewetting ——缩锡，在融化的锡在导体表面时，由于表面的张力，导致锡面的不平整，有的地方厚，有的地方薄，但是不会导致铜面露出。
Dimensioned Hole ——指线路板上的一些孔，其位置已经由其使用尺寸确定，不用和栅格尺寸一致。
Double-Side Printed Board ——双面板。
Drill body length ——从钻咀的钻尖到钻咀直径与肩部角度交叉点处的距离。
EEyelet ——铆眼，是一种青铜或黄铜制作的空心铆钉，当线路板上发现某一通孔断裂时，即可加装上这种铆眼，不但可以维持导电的功能，亦可以插焊零件。
不过由于业界对线路板品质的要求日严，使得铆眼的使用越来越少。
FFiber Exposure ——纤维暴露，是指基材表面当受到外来的机械摩擦，化学反应等攻击后，可能失去其外表所覆盖的树脂层，露出底材的玻璃布，称为纤维暴露，位于孔壁处则称为纤维突出。
Fiducial Mark ——基准记号，在板面上为了下游的组装，方便其视觉辅助系统作业起见，常在大型的IC于板面焊垫外缘的右上及左下各加一个圆状或其它形状的“基准记号“，以协助放置机的定位。
Flair ——第一面外形变形，刃角变形，在线路板行业中是指钻咀的钻尖部分，其第一面之外缘变宽使刃角变形，是因钻咀不当地翻磨所造成，属于钻咀的次要缺点。
FPC专业术语简介
FPC专业术语简介之前一兄弟毕业后干了两年电镀，决定出去见识见识，出去后与同事交流时被取笑不知道dummying为何物？所以呢这些术语不知道到底有多大的用处，但装逼绝对用的上。
PCB：Printed circuit board，印刷电路板；FPC：Flexible Printed circuit，柔性电路板，也称挠性电路板，俗称软板；CCL：Copper Clad Laminates，铜箔基材；FCCL：Flexible Copper Clad Laminates，柔性铜箔基材；RA：Roll Anneal Copper Foil，压延铜；ED：Electrolysis Desposition Copper Foil，电解铜；ADH：Adhesive，粘接剂，俗称胶；PI：Polyimide，聚亚酰胺；CVL：Cover lay，覆盖膜，日资厂称为保胶、有的厂称为包封等SR：Solder Resist，阻焊；EMI：电磁屏蔽膜；PP：Prepreg，半固化片，也称黏结片LCP：Liquid Crystal Polyme，液晶聚合物PTH：Plated Trough Holes，镀通孔NPTH：No Plated Trough Holes，BVH：Blind Via Holes盲孔ENIG：Electroless Nickel Immersion Gold无电解（化学）镍金ENEPIG：Electroless Nickel Electroless Palladium Immersion Gold无电解（化学）镍钯金OSP：Organic Solderability Preservatives，有机可焊性预处理；IC：Integrated Circuit，集成电路；AOI：Automatic Optic Inspection；自动光学检查；VCP：Vertical Continuous Plate，垂直连续电镀；A VI：SMT：Surface Mount Technology，表面贴装技术；DFM：Design For Manufacture，可制造性设计；DFSR：DES：Developing Etching Stripping显影、蚀刻、去膜。
FPC_中英文对照
Material原材料
Copper Foil(Cu)——铜箔 ED——Electro Deposit电解铜 RA——Rolled Annealed压延铜 CVL——Coverlay保护胶片 Base Material基材 FCCL——Flexible Copper Clad Laminate挠性覆 铜板
Testing of Electrical Performance电气性能 SIR——Surface Insulation Resistance表面层绝 缘电阻 Dielectric Withstanding Voltage of Surface Layers表面介质层耐电压强度 Withstanding承受 Testing of Mechanical Property机械性能测试 Peel Strength剥离强度
Registration of Stiffener to FPC 补强板与FPC的重合性
热固胶
Plating Thickness of Copper Plated-through Hole 镀通孔 的镀铜层厚度
Board Type
板S/S 单面板 Single Sided Flex Board
Pull-out Strength for Plain Holes and Footprints 孔和焊垫的拉脱强度 Footprints脚印，足迹 Plating Adhesion镀层附着力 (Ad)Adhesive接着
剂
Solderability可焊性 Flexural Endurance耐弯折性 Environmental Performance环境性能 Temperature Cycle 温度循环 Humidity Test湿度测试 Thermal Shock冷热冲击
PCB&FPC专业英语
PCB专用词语A aA.O.I(Automatic Optical Inspection) 自动光学检查Acceptable quality level (AQL) 可接受质量水平Accuracy 精确度Activating 活化Active carbon treatment 活性碳处理After Pressed Thickness 压板后之厚度Alignment 校直，结盟Annular ring 锡圈Anti-Static Bag 静电胶袋Apparatus 设备，仪器Area 面积Artwork 菲林Artwork Drawing 菲林图形Artwork Film 原装菲林Artwork Modification 菲林修改Artwork No. 菲林编号Assembly 组装，装配Axis 轴B bBackplane 背板Back-up 垫板Baking 烘板Ball Grid Array (BGA) 球栅阵列Bare board 裸板Base Copper 底铜Base material 基材Bevelling 斜边Black Oxide 黑氧化Blind via hole 盲孔Blistering 起泡/水泡Board Cutting 开料Board Thickness 板厚Bottom side 底层Breakaway tab 打断点Brushing 磨刷Build-up 积层Bullet pad 子弹盘Buried hole 埋孔C cC/M(Component Marking) 元件字符Carbon ink 碳油Carrier 带板Ceramic substrate 陶瓷Certificate of Compliance 合格证书Chamfer 倒角Chemical cleaning 化学清洗Chemical corrosion 化学腐蚀Chip Scale Package (CSP) 晶片比例包装Circuit 线路Clearance 间距/间隙Color 颜色Component Side(C/S) 元件面Composite layers 复合层Computer Aided Design (CAD) 电脑辅助设计Computer Aided Manufacturing (CAM) 电脑辅助制作Computer Numerial Control (CNC) 数控Conductor 导体Conductor width/space 导体线宽/线隙Contact 接点Copper area 铜面积Copper clad 铜箔Copper foil 铜箔Copper plating 电镀铜Corner 角线Corner mark 板角记号Corner REG.Hole 角位对位孔Cracking 裂缝Creasing 皱折Criteria 规格,标准Crossection area 切面Cu/Sn Plating 镀铜锡Current efficiency 电流效率Customer 客户Customer Drilling File 客户钻孔资料Customer P/N 客户产品编号D dD/F Registration Hole 干菲林对位孔D/F(Dry Film) 干膜Date Code 日期代号Datum hole 基准参考孔Daughter board 子板Deburring 去毛刺Defect 缺陷Definition 定义Delamination 分层Delay 耽搁Delivery 交货Densitomefer 透光度计Density 密度Department 部门Description 说明Design origin 设计原点Desmear 去钻污,除胶Dessicant 防潮珠Developer 显影液,显影机Diamond 钻石Diazo film 重氮片Dielectric breakdown 介电击穿Dielectric constant 介电常数Dielectric Thickness 介电层厚度Dielectric V oltage Test 绝缘测试Dimension 尺寸Dimensional stability 尺寸稳定性Direct/indirect 直接/间接Distribution 发放Document type 文件种类Documentation Control 文件控制Double sided board 双面板Drill bit 钻咀Drilling 钻孔Drilling Roughness 钻孔粗糙度Dry Film 干菲林Dry Film-Pattern 干膜线路Dynamic 动态E eECN(Engineering Change Notification) 工程更改通知Effective date 有效期Electrical Test Fixture 电测试针床Electro migration 漏电Electroconductive paste 导电胶Electroless 无电沉Electroless copper 无电沉铜Electroless Ni 无电沉镍Electroless Gold/Au 无电沉金Engineering drawing 工程图纸Entek 有机涂覆Epoxy glass substrate 环氧玻璃基板Epoxy resin 环氧基树脂Etch 蚀刻Etchback 凹蚀Etching 蚀刻E-Test Marking 电测试标记E-Test(Electrical Test) 电测试Exposure 曝光External layer 外层F fFiducial mark 基准点Filling 填充Film Fabrication 菲林制作Final QC 最终检查Finish Overall Board Thickness 成品总板厚度Fixture 夹具Flammability 可燃性Flash Gold 薄金Flexible 易曲的,能变形的Flux 助焊剂G gGeneral information 一般资料Ghost image 重影Glass transition temperature 玻璃化湿度Gold Finger(G/F) 金手指Golden board 金板Grid 网格Ground plane 地线层H hHAL(Hot Air Leveling) 热风整平Hand Rout 手锣Hardness 硬度Heat Sealed 热密封Heat Shrink-warp 热收缩Holding time 停留时间Hole 孔Hole breakout 破环Hole density 孔的密度Hole Diameter 孔径Hole location 孔位Hole Location Chart 孔位座标表Hole Position Tolerance 孔位误差Hole size 孔尺寸Hot Air Leveling(HAL) 热风整平Humidity 湿度IIdentification 标识,指标Image 影像Imaging transfer 图形转移Impedance 阻抗Impedance Test 阻抗测试Inner copper foil 内层铜箔Inspection 检验Insulation resistance Test 绝缘测试Inter Plane Separation 内层分离Interleave Paper 隔纸Internal layer 内层Internal stress 内应力Ionic cleanliness 离子清洁度Isolation 孤立Isolation Resistance 绝缘电阻Item 项目K kKEY board 按键盘Key slot 槽孔Kraft paper 牛皮纸L lLaminate 板材Laminate Thickness 材料厚度Lamination void 层间空洞Landless hole 破孔Laser plotter 激光绘图机Laser plotting 激光绘图Laser via hole 激光穿孔Layup 层压配本Lay-up Instruction 压板指示Legend 字符Legend Width 字符宽度Length 长度Lifted Lands 残铜Line Width 线宽Liquid 液体Logic diagram 逻辑图形Logo 唛头,标记Lot size 批卡Mesh 目数M mMark 标记Master drawing 菲林图形Material Thickness 材料厚度Material Type 材料类型Max. X-out 坏板上限Max.Board Thickness After Plating 电镀后总板厚度之上限Measling 白斑Mech Drawing No. 图纸编号Mechanical cleaning 机械清洗Metal 金属Method 方法MI(Manufacturing Instruction) 生产制作指示Microstrip 微条线Min Conductor Copper Thickness 最小线路铜厚Min Hole Wall Copper Thickness 最小孔壁铜厚Min. Gold Plating Thickness 最小金厚Min. Nickel Thickness 最小镍厚Min. Tin-Lead Thickness (After HAL) （喷锡后）最小锡厚Min.Annular Ring 最小环宽Min.Spacing between Line to Line 线与线之间的最小距离Min.Spacing between Line to Pad 线与焊盘之间的最小距离Min.Spacing between Pad to Pad 焊盘与焊盘之间的最小距离Minimum 最小Mirroring 镜像Missing 缺少Model No. 产品名称Molded 模塑Mother board 主板Moulding 模房Mounting hole 安装孔Multilayer 多层板Multi-layer Laminate 多层板材料N nNegative 反面的Net list 网络表Nick 缺口No. of holes 孔数No.of Array/Panel 每个拼板套板数No.of Panel per Stack 每叠板数No.of Panel/Sheet 每张大料拼板数No.of Pcs Per Bag 每包数量No.of Unit/Array 每套单元数Normal value标准值O oOblong 椭圆形的Offset 偏移Open/short 开路/短路Optimization(design) 最佳化(设计)Organic Solerability Peservatives(OSP) 有机保护剂Originator 原作者Outer copper foil 外层铜箔Outline 外形P pPacking 包装Packing 包装Pad 焊盘Panel Area 拼板面积Panel Plated Crack 板镀缺口Panel plating 整板电镀Panel Size 拼板尺寸Panel Size After Outerlayer Cutting 外层切板后拼板尺寸Panel Utilization 拼板利用率Pass rate 通过率Passivation 钝化Pattern 线路Pattern Inspection 线路检查Pattern plating 图形电镀PCB(Printed Circuit Board) 印制线路板Peck drilling 啄钻Peel strength 剥离强度Peelable 可剥性Peelable 剥离强度Peelable Mask 可脱油Peeling 剥离Permanent 永久性PH value PH值Photo plotting 图形输出Photo via hole 菲林过孔Photographers 照片靶标Photoplotler 光绘机Physical 物理的Pin hole 销定孔Pink ring 粉红环Pinning hole 钻孔管位Pitch 间距Placement 放置Plated Though Hole(PTH) 沉铜Plating 电镀Plating Crack 电镀裂缝Plating line 电镀线Plating rack 电镀架Plating V oid 电镀针孔Plug Hole 塞孔Polymer 聚合体Porosity 孔隙率Positive 绝对的Power plane 电源层Prepreg 半固化片Primary side 首面Print 印刷Probe point 针床测点Process 工序Process flow 工序流程Product Planning Dept. 生产计划部Production 生产板Profile 外形Profiling 外形加工Profiling Process 外形加工Project No. 产品编号PTH Thermal Seress Test PTH热冲击测试PTH(Plating Through Hole) 沉铜Pull away 拉离Punch 啤模Punching 冲切Punching Mould Drawing 啤模图形Q qQA Audit 品质审计QA(Quanlity Assurance) 品质部Quad Palt Pack (QFP) 四边扁平林整器件Quantity 数量R rRaw Material Utilization 原材料利用率Recall 回收Rectifier 整流器Register mark 对位点Registration 重合点Remark 备注Resin 树脂Resin Recession 流胶Resist 抗蚀剂Resolution 分辨率Rigid 精密的Roller coating 涂覆Roughening 粗化Round pad 圆盘Routing 外形加工,铣板S sS/M Material 绿油物料S/M(Solder Mask) 阻焊Sales 销售Sample 样板Sampling inspection 抽样检验Scaling factor 缩放比例因素Scope 范围Scoring 刻槽Scratch 划痕Secondary side 第二面Section Code 组别代号Section Code Change 组别代号更改Segment 部分,片段Separated 分离Sequence 顺序Sets 套Sheet Size 大料尺寸Shematic diagram 原理图Shiny 有光泽的,发光的Silk screen 丝印Silver film 银盐片Single/double 单层/双面Slot 槽,坑Solder Mask 阻焊Solder mask on bare copper (smobc) 裸铜覆盖阻焊膜Solder side 焊接面Solder Side C/M 阻焊面字符Solder Side Cir. 焊接面线路Solder Side Circuit 焊接面Solder Side S/M 焊接面阻焊Solderability 可焊性Solvent Test 可溶性测试Spacing 线距Special requirement 特殊要求Specification 详细说明，规范Spindle 主轴Split 裂片Square pad 方块Standard 标准值Static 静态Stencial 网版Step drilling 分布钻Step scale 光梯尺Store 货仓Supplier 供应商Supported hole 支撑点Surface 表面Surface mount technology 表面组装技术Swimming 滑移T tTack 堆起Tape Programming 铬带制作Tape Test 胶带测试Target Hole 目标孔Teardrop 泪珠Template 天平Tenting 封孔Test 测试Test coupon 图样Test Parameter 测试参数Test Pattern 测试孔Testing V oltage 电压Thermal shock 热冲击Thermal stress 热应力Thickness 厚度Tin Content 锡含量Tin/Lead Stripping 退铅锡Tin-lead plating 电镀铅锡Tolerance 公差Top side 板面Touch up 修理(执漏)Training 训练Transmission 传输线Transmittance 传送Trim line 修剪U uUltrasonic cleaning 超声波清洗Undercut 侧蚀Unit Arrangement 单元排版Unit Layout Per Panel 单元拼板图Uv-blocking 阻挡紫外线V vVacunm Pack 真空包装Vacuum lamination 真空压制V-Cut V- 坑View From…观察方向由…Visual & Warpage 可视性和翘曲度Visual inspection 目检V oltage 电压W wW/F(Wet Film) 湿膜Warp & Twist 翘曲和弯曲Wet Film 湿模Width 宽度Wiring 线路。
FPC常用术语中英文对照
FPC常用術語中英文對照AAccelerate Aging ——加速老化，使用人工的方法，加速正常的老化過程。
Acceptance Quality Level (AQL) ——一批產品中最大可以接受的缺陷數目，通常用於抽樣計劃。
Acceptance Test ——用來測定產品可以接受的試驗，由客戶與供應商之間決定。
Access Hole ——在多層線路板連續層上的一系列孔，這些孔的中心在同一個位置，而且通到線路板的一個表面。
Annular Ring ——是指保圍孔周圍的導體部分。
Artwork ——用於生產“Artwork Master”“production Master”,有精確比例的菲林。
Artwork Master ——通常是有精確比例的菲林，其按1：1的圖案用於生產“Production Master”。
BBack Light ——背光法，是一種檢查通孔銅壁完好與否得放大目檢方法，其做法是將孔壁外的基材自某一方向上小心的予以磨薄，再利用樹脂半透明的原理，從背後射入光線。
假如化學銅孔壁品質完好而無任何破洞或針孔時，則該銅層必能阻絕光線而在顯微中呈現黑暗，一旦銅壁有破洞時，則必有光點出現而被觀察到，並可放大攝影存證，稱為背光法，但只能看到半個孔。
Base Material ——絕緣材料，線路在上面形成。
（可以是剛性或柔性，或兩者綜合。
它可以是不導電的或絕緣的金屬板。
）。
Base Material thickness ——不包括銅箔層或鍍層的基材的厚度。
Bland Via ——導通孔僅延伸到線路板的一個表面。
Blister ——離層的一種形式，它是在基材的兩層之間或基材與銅箔之間或保護層之間局部的隆起。
Board thickness 是——指包括基材和所有在上面形成導電層在內的總厚度。
Bonding Layer ——結合層，指多層板之膠片層。
CC-Staged Resin ——處於固化最後狀態的樹脂。
FPC专业英语词汇
一综合词汇印制电路：printed circuit印制线路：printed wiring印制板：printed board印制板电路：printed circuit board (PCB)印制线路板：printed wiring board(PWB)印制元件：printed component 印制接点：printed contact印制板装配：printed board assembly板：board单面印制板：single-sided printed board(SSB)双面印制板：double-sided printed board(DSB)多层印制板：mulitlayer printed board(MLB)多层印制电路板：mulitlayer printed circuit board多层印制线路板：mulitlayer printed wiring board刚性印制板：rigid printed board 刚性单面印制板：rigidsingle-sided printed borad刚性双面印制板：rigiddouble-sided printed borad刚性多层印制板：rigid multilayer printed board挠性多层印制板：flexible multilayer printed board挠性印制板：flexible printed board挠性单面印制板：flexible single-sided printed board挠性双面印制板：flexible double-sided printed board挠性印制电路：flexible printed circuit (FPC)挠性印制线路：flexible printed wiring刚性印制板：flex-rigid printed board, rigid-flex printed board 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board齐平印制板：flush printed board 金属芯印制板：metal core printed board金属基印制板：metal base printed board多重布线印制板：mulit-wiring printed board陶瓷印制板：ceramic substrate printed board导电胶印制板：electroconductive paste printed board模塑电路板：molded circuit board模压印制板：stamped printed wiring board顺序层压多层印制板：sequentially-laminated mulitlayer散线印制板：discrete wiring board微线印制板：micro wire board 积层印制板：build-up printed board积层多层印制板：build-up mulitlayer printed board (BUM) 积层挠印制板：build-up flexible printed board表面层合电路板：surface laminar circuit (SLC)埋入击块连印制板：B2it printed board多层膜基板：multi-layered film substrate(MFS)层间全内导通多层印制板：ALIVH multilayer printed board 载芯片板：chip on board (COB) 埋电阻板：buried resistance board母板：mother board子板：daughter board背板：backplane裸板：bare board键盘板夹心板：copper-invar-copper board动态挠性板：dynamic flex board 静态挠性板：static flex board 可断拼板：break-away plane电缆：cable挠性扁平电缆：flexible flat cable (FFC)薄膜开关：membrane switch混合电路：hybrid circuit厚膜：thick film厚膜电路：thick film circuit薄膜：thin film薄膜混合电路：thin film hybrid circuit互连：interconnection导线：conductor trace line齐平导线：flush conductor 传输线：transmission line跨交：crossover板边插头：edge-board contact 增强板：stiffener基底：substrate基板面：real estate导线面：conductor side元件面：component side焊接面：solder side印制：printing网格：grid图形：pattern导电图形：conductive pattern 非导电图形：non-conductive pattern字符：legend标志：mark二基材：基材：base material层压板：laminate覆金属箔基材：metal-clad bade material覆铜箔层压板：copper-clad laminate (CCL)单面覆铜箔层压板：single-sided copper-clad laminate双面覆铜箔层压板：double-sided copper-clad laminate复合层压板：composite laminate薄层压板：thin laminate金属芯覆铜箔层压板：metal core copper-clad laminate金属基覆铜层压板：metal base copper-clad laminate挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film基体材料：basis material预浸材料：pre-preg粘结片：bonding sheet预浸粘结片：preimpregnated bonding sheer环氧玻璃基板：epoxy glass substrate函成法用层压板：laminate for additive process预制内层覆箔板：mass lamination panel内层芯板：core material催化板材：catalyzedboard ,coated catalyzed laminate涂胶催化层压板：adhesive-coated catalyzed laminate涂胶无催层压板：adhesive-coated uncatalyzed laminate粘结层：bonding layer粘结膜：film adhesive涂胶粘剂绝缘薄膜：adhesive coated dielectric film无支撑胶粘剂膜：unsupported adhesive film覆盖层：cover layer (cover lay) 增强板材：stiffener material铜箔面：copper-clad surface 去铜箔面：foil removal surface 层压板面：unclad laminate surface 基膜面：base film surface胶粘剂面：adhesive faec原始光洁面：plate finish粗面：matt finish纵向：length wise direction模向：cross wise direction剪切板：cut to size panel酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates超薄型层压板：ultra thin laminate陶瓷基覆铜箔板：ceramics base copper-clad laminates紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates 三基材的材料A阶树脂：A-stage resinB阶树脂：B-stage resinC阶树脂：C-stage resin环氧树脂：epoxy resin酚醛树脂：phenolic resin聚酯树脂：polyester resin聚酰亚胺树脂：polyimide resin 双马来酰亚胺三嗪树脂：bismaleimide-triazine resin丙烯酸树脂：acrylic resin三聚氰胺甲醛树脂：melamine formaldehyde resin多官能环氧树脂：polyfunctional epoxy resin溴化环氧树脂：brominated epoxy resin环氧酚醛：epoxy novolac氟树脂：fluroresin硅树脂：silicone resin硅烷：silane聚合物：polymer无定形聚合物：amorphous polymer结晶现象：crystalline polamer 双晶现象：dimorphism 共聚物：copolymer合成树脂：synthetic热固性树脂：thermosetting resin 热塑性树脂：thermoplastic resin 感光性树脂：photosensitive resin环氧当量：weight per epoxy equivalent (WPE)环氧值：epoxy value双氰胺：dicyandiamide粘结剂：binder胶粘剂：adesive固化剂：curing agent阻燃剂：flame retardant遮光剂：opaquer增塑剂：plasticizers不饱和聚酯：unsatuiated polyester聚酯薄膜：polyester聚酰亚胺薄膜：polyimide film (PI) 聚四氟乙烯：polytetrafluoetylene (PTFE)聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylene copolymer film (FEP)增强材料：reinforcing material 玻璃纤维：glass fiberE玻璃纤维：E-glass fibreD玻璃纤维：D-glass fibreS玻璃纤维：S-glass fibre玻璃布：glass fabric非织布：non-woven fabric玻璃纤维垫：glass mats纱线：yarn单丝：filament绞股：strand纬纱：weft yarn经纱：warp yarn但尼尔：denier经向：warp-wise纬向：weft-wise, filling-wise 织物经纬密度：thread count 织物组织：weave structure 平纹组织：plain structure坏布：grey fabric稀松织物：woven scrim弓纬：bow of weave断经：end missing缺纬：mis-picks纬斜：bias折痕：crease云织：waviness鱼眼：fish eye毛圈长：feather length厚薄段：mark裂缝：split捻度：twist of yarn浸润剂含量：size content浸润剂残留量：size residue 处理剂含量：finish level浸润剂：size偶联剂：couplint agent处理织物：finished fabric聚酰胺纤维：polyarmide fiber 聚酯纤维非织布：non-woven polyester fabric浸渍绝缘纵纸：impregnating insulation paper聚芳酰胺纤维纸：aromatic polyamide paper断裂长：breaking length 吸水高度：height of capillary rise湿强度保留率：wet strength retention白度：whitenness陶瓷：ceramics导电箔：conductive foil铜箔：copper foil电解铜箔：electrodeposited copper foil (ED copper foil)压延铜箔：rolled copper foil退火铜箔：annealed copper foil 压延退火铜箔：rolled annealed copper foil (RA copper foil)薄铜箔：thin copper foil涂胶铜箔：adhesive coated foil 涂胶脂铜箔：resin coated copper foil (RCC)复合金属箔：composite metallic material载体箔：carrier foil殷瓦：invar箔（剖面）轮廓：foil profile光面：shiny side粗糙面：matte side处理面：treated side防锈处理：stain proofing双面处理铜箔：double treated foil四设计原理图：shematic diagram逻辑图：logic diagram印制线路布设：printed wire layout布设总图：master drawing可制造性设计：design-for-manufacturability计算机辅助设计：computer-aided design.(CAD) 计算机辅助制造：computer-aided manufacturing.(CAM)计算机集成制造：computer integrat manufacturing.(CIM)计算机辅助工程：computer-aided engineering.(CAE)计算机辅助测试：computer-aided test.(CAT)电子设计自动化：electric design automation .(EDA)工程设计自动化：engineering design automaton .(EDA2)组装设计自动化：assembly aided architectural design. (AAAD)计算机辅助制图：computer aided drawing计算机控制显示：computer controlled display .(CCD)布局：placement布线：routing布图设计：layout重布：rerouting模拟：simulation逻辑模拟：logic simulation电路模拟：circit simulation时序模拟：timing simulation模块化：modularization布线完成率：layout effeciency 机器描述格式：machine descriptionm format .(MDF)机器描述格式数据库：MDF databse设计数据库：design database 设计原点：design origin优化（设计）：optimization (design)供设计优化坐标轴：predominant axis表格原点：table origin镜像：mirroring驱动文件：drive file中间文件：intermediate file制造文件：manufacturing documentation队列支撑数据库：queue support database元件安置：component positioning图形显示：graphics dispaly比例因子：scaling factor扫描填充：scan filling矩形填充：rectangle filling填充域：region filling实体设计：physical design逻辑设计：logic design逻辑电路：logic circuit层次设计：hierarchical design 自顶向下设计：top-down design 自底向上设计：bottom-up design线网：net数字化：digitzing设计规则检查：design rule checking走（布）线器：router (CAD)网络表：net list计算机辅助电路分析：computer-aided circuit analysis 子线网：subnet目标函数：objective function设计后处理：post design processing (PDP)交互式制图设计：interactive drawing design费用矩阵：cost metrix工程图：engineering drawing 方块框图：block diagram迷宫：moze元件密度：component density 巡回售货员问题：traveling salesman problem自由度：degrees freedom入度：out going degree出度：incoming degree曼哈顿距离：manhatton distance欧几里德距离：euclidean distance网络：network阵列：array段：segment逻辑：logic逻辑设计自动化：logic design automation分线：separated time分层：separated layer定顺序：definite sequence五形状与尺寸：导线（通道）：conduction (track) 导线（体）宽度：conductor width 导线距离：conductor spacing 导线层：conductor layer导线宽度/间距：conductorline/space第一导线层：conductor layer No.1圆形盘：round pad方形盘：square pad菱形盘：diamond pad长方形焊盘：oblong pad子弹形盘：bullet pad泪滴盘：teardrop pad雪人盘：snowman padV形盘：V-shaped pad环形盘：annular pad非圆形盘：non-circular pad隔离盘：isolation pad非凾能连接盘：mon-functional pad偏置连接盘：offset land腹（背）裸盘：back-bard land 盘址：anchoring spaur连接盘图形：land pattern连接盘网格阵列：land grid array 孔环：annular ring元件孔：component hole安装孔：mounting hole支撑孔：supported hole非支撑孔：unsupported hole导通孔：via镀通孔：plated through hole (PTH)余隙孔：access hole盲孔：blind via (hole)埋孔：buried via hole埋/盲孔：buried /blind via任意层内部导通孔：any layerinner via hole (ALIVH)全部钻孔：all drilled hole定位孔：toaling hole无连接盘孔：landless hole中间孔：interstitial hole无连接盘导通孔：landless via hole引导孔：pilot hole端接全隙孔：terminal clearomee hole准表面间镀覆孔：quasi-interfacing plated-through hole准尺寸孔：dimensioned hole在连接盘中导通孔：via-in-pad 孔位：hole location孔密度：hole density孔图：hole pattern钻孔图：drill drawing装配图：assembly drawing印制板组装图：printed board assembly drawing参考基准：datum referanAssembly line组装线 Layout 布置图 Conveyer流水线物料板Rivet table拉钉机 Rivet gun 拉钉枪 Screw driver起子Electric screw driver电动起子 Pneumatic screw driver气动起子worktable 工作桌 OOBA开箱检查 fit together组装在一起fasten锁紧(螺丝) fixture 夹具(治具) pallet栈板 barcode条码barcode scanner条码扫描器 fuse together熔合 fuse machine热熔机repair修理 operator作业员 QC 品管 supervisor 课长 ME制造工程师 MT制造生技 cosmetic inspect外观检查 inner parts inspect内部检查 thumb screw大头螺丝 lbs. inch镑、英寸 EMI gasket导电条front plate前板 rear plate后板 chassis 基座 bezel panel 面板power button电源按键 reset button重置键 Hi-pot test of SPS高源高压测试 sheet metal parts 冲件 plastic parts塑胶件 SOP制造作业程序material check list物料检查表 work cell工作间电源电压接拉键carton纸箱 sub-line支线 left fork叉车personnel resource department 人力资源部 production department生产部门 planning department企划部 QC Section品管科 stamping factory冲压厂 painting factory烤漆厂 molding factory成型厂common equipment常用设备 uncoiler and straightener 整平机punching machine 冲床robot机械手hydraulic machine油压机lathe车床planer |'plein| 刨床miller铣床grinder磨床driller??床linear cutting线切割electrical sparkle电火花welder电焊机staker=reviting machine铆合机position职务president董事长general manager总经理 special assistant manager特助factory director厂长 department director部长deputy manager | =vice manag er副理 section supervisor课长deputy section supervisor =vice section superisor副课长group leader/supervisor组长 line supervisor线长 assistant manager助理 to move, to carry, to handle 搬运 be put in storage入库pack packing凿装 to apply oil 擦油 to file burr 锉毛刺final inspection终检 to connect material接料 to reverse material 翻料wet station沾湿台 Tiana天那水 cleaning cloth抹布 to load material上料 to unload material卸料 to return material/stock t o退料scraped |'skræpid|报废 scrape ..v.刮;削 deficient purchase来料不良manufacture procedure制程 deficient manufacturing proc edure制程不良 oxidation |' ksi'dei n|氧化 scratch刮伤 dents压痕 defective upsiding down抽芽不良 defective to staking铆合不良embedded lump镶块 feeding is not in place 送料不到位stamping-missing漏冲 production capacity生产力education and training教育与训练 proposal improvement提案改善spare parts=buffer备件 forklift叉车 trailer=long vehicle拖板车compound die合模 die locker锁模器 pressure plate=plate pinch 压板bolt螺栓 name of a department部门名称 administration/general affair s dept总务部 automatic screwdriv er电动启子 thickness gauge 厚薄规 gauge(or jig)治具 power wire电源线 buzzle蜂鸣器 defective product lab el不良标签 identifying sheet list标示单screwdriver holder起子插座 pedal踩踏板 stopper阻挡器flow board流水板 hydraulic hand-jack油压板车 forklift叉车pallet栈板 glove(s)手套 glove(s) with exposed finger s割手套 thumb大拇指 forefinger食指 mid-finger 中指 ring finger无名指little finger小指 band-aid创可贴 iudustrial alcohol工业酒精alcohol container沾湿台 head of screwdriver起子头sweeper扫把 mop拖把 vaccum cleaner吸尘器rag 抹布 garbage container灰箕 garbage can垃圾箱garbage bag垃圾袋 chain链条 jack升降机 production line 流水线chain链条槽 magnetizer函磁器 lamp holder灯架to mop the floor拖地 to clean the floor扫地 to clean a table擦桌子air pipe 气管 packaging tool 打凿机 packaging打凿missing part漏件 wrong part 错件 excessive defects过多的缺陷critical defect极严重缺陷 major defect主要缺陷minor defect次要缺陷 not up to standard不合规格dimension/size is a little bigger 尺寸偏大(小) cosmetic defect 外观不良slipped screwhead/slippery scre w head螺丝滑头slipped screwhead/shippery scr ew thread滑手speckle斑点 mildewed=moldy=mouldy 发霉 rust生锈deformation变形 burr(金属)flash(塑件)毛边 poor staking 铆合不良excesssive gap间隙过大 grease/oil stains油污 inclusion杂质painting peel off脏污 shrinking/shrinkage缩水 mixed color杂色scratch划伤 poor processing 制程不良 poor incoming part事件不良fold of packaging belt打凿带折皱painting make-up补漆 discoloration羿色 water spots水渍polishing/surface processing表面处理 exposed metal/bare metal金属裸露 lack of painting烤漆不到位 safety安全 quality品质 delivery deadline交货程 die repair模修enterprise plan = enterprise ex pansion projects企划QC品管 die worker模工 production, to produce生产equipment设备 to start a press开机 stop/switch off a press关机classification整理 regulation整顿 cleanness清扫 conservation 清洁 culture教养 qualified products, up-to-g rade products良品defective products, not up-to-gr ade products不良品waste废料 board看板 feeder 送料机 sliding rack滑料架defective product box不良品箱 die change 换模 to fix a die装模to take apart a die拆模 to repair a die修模 packing material凿材basket蝴蝶竺 plastic basket胶isolating plate baffle plate; barr icade隔板 carton box纸箱to pull and stretch拉深to put material in place, to cut material, to input落料to impose lines压线 to compress, compressing 压缩character die字模 to feed, feeding送料 transportation运输(be)qualfied, up to grade合格 not up to grade, not qualifi ed不合格material change, stock change 材料变更 feature change 特性变更evaluation评估 prepare for, make preparati ons for 准备parameters参数 rotating speed, revolution转速manufacture management制造管理 abnormal handling异常处理production unit生产单位 lots of production生产批量steel plate钢板 roll material卷料 manufacture procedure制程operation procedure作业流程 to revise, modify修订to switch over to, switch---to th row--over switching over切换engineering, project difficulty 工程瓶颈 stage die工程模automation自动化 to stake, staking, reviting铆合add lubricating oil函润滑油 shut die架模 shut height of a die架模高度analog-mode device类模器die lifter举模器 argon welding 氩焊vocabulary for stamping模具专业英语[分享] 模具述语一、入水：gate进入位：gate location 水口大水口：edge gate 细水口： pin-point gate水口大小：gate size 转水口：switching runner/gate唧嘴口径：sprue diameter二、流道: runner热流道：hot runner,hot manifold 热嘴冷流道: hot sprue/cold runner唧嘴直流: direct sprue gate 圆形流道：round(full/half runner流道电脑分析：mold flow analysis 流道平衡:runner balance热嘴：hot sprue 热流道板：hot manifold发热管：cartridge heater 探针: thermocouples插头：connector plug 插座： connector socket 密封/封料： seal三、运水：water line塑胶管：plastic tube 快速接头：jiffy quick connector plug/socke r四、模具零件：mold components三板模：3-plate mold 二板模：2-plate mold边钉/导边：leader pin/guide pin 边司/导套：bushing/guide bushing中托司：shoulder guide bushing 中托边L：guide pin顶针板：ejector retainner plate 托板：support plate螺丝： screw 管钉：dowel pin 开模槽：ply bar scot内模管位：core/cavity inter-lock 顶针：ejector pin司筒：ejector sleeve 司筒针：ejector pin movable core,return core core puller扣机（尼龙拉勾）：nylon latch lock 斜顶：lifter模胚（架）： mold base 上内模：cavity insert下内模：core insert 行位（滑块）： slide镶件：insert 压座/斜鸡：wedge 耐磨板/油板：wedge wear plate 压条：plate 撑头: support pillar 唧嘴： sprue bushing挡板：stop plate 定位圈：locating ring 锁扣：latch扣鸡：parting lock set 推杆：push bar 栓打螺丝：S.H.S.B 顶板：eracuretun 活动臂：lever arm 分流锥：spure sperader水口司:bush 垃圾钉：stop pin 隔片：buffle弹弓柱：spring rod 弹弓:die spring 中托司：ejector guide bush针：pin 销子：dowel pin波子弹弓：ball catch 喉塞: pipe plug 锁模块：lock plate斜顶：angle from pin 斜顶杆：angle ejector rod尼龙拉勾：parting locks 活动臂：lever arm复位键、提前回杆：early return bar 气阀：valves斜导边：angle pin 术语：terms承压平面平衡：parting surface support balance 模排气：parting line venting回针碰料位：return pin and cavity interferen ce模总高超出啤机规格：mold base shut hight顶针碰运水：water line interferes withejector pin料位出上/下模：part from cavith (core) side 模胚原身出料位：cavity direct cut on A-plate,core direct cut on B-plate.不准用镶件： Do not use (core/cavity) i nsert用铍铜做镶件： use beryllium copper inser t初步（正式）模图设计：preliinary (final) mold design反呵：reverse core 弹弓压缩量：spring compressed length 稳定性好：good stability,stable 强度不够：insufficient rigidity均匀冷却：even cooling 扣模：sticking热膨胀：thero expansion 公差：tolorance 铜公(电极）：copper electrode常用塑料英语缩略语[分享]英文简称英文全称中文全称ABA Acrylonitrile-butadiene-acr ylate 丙烯腈/丁二烯/丙烯酸酯ABS Acrylonitrile-butadiene-styr ene 丙烯腈/丁二烯/苯乙烯共聚物AES Acrylonitrile-ethylene-styre ne 丙烯腈/乙烯/苯乙烯共聚物AMMA Acrylonitrile/methyl Met hacrylate 丙烯腈/甲基丙烯酸甲酯共聚物ARP Aromatic polyester 聚芳香酯AS Acrylonitrile-styrene resin 丙烯腈-苯乙烯树脂ASA Acrylonitrile-styrene-acryla te 丙烯腈/苯乙烯/丙烯酸酯共聚物CA Cellulose acetate 醋酸纤维塑料CAB Cellulose acetate butyrate 醋酸-丁酸纤维素塑料CAP Cellulose acetate propionat e 醋酸-丙酸纤维素CE Cellulose plastics, general 通用纤维素塑料CF Cresol-formaldehyde 甲酚-CMC Carboxymethyl cellulose 羧甲基纤维素CN Cellulose nitrate 硝酸纤维素CP Cellulose propionate 丙酸纤维素CPE Chlorinated polyethylene 氯化聚乙烯CPVC Chlorinated poly(vinyl chl oride) 氯化聚氯乙烯CS Casein 酪蛋白CTA Cellulose triacetate 三醋酸纤维素EC Ethyl cellulose 乙烷纤维素EMA Ethylene/methacrylic acid 乙烯/甲基丙烯酸共聚物EP Epoxy, epoxide 环氧树脂EPD Ethylene-propylene-diene 乙烯-丙烯-二烯三元共聚物EPM Ethylene-propylene polym er 乙烯-丙烯共聚物EPS Expanded polystyrene 发泡ETFE Ethylene-tetrafluoroethyle ne 乙烯-四氟乙烯共聚物EVA Ethylene/vinyl acetate 乙烯-醋酸乙烯共聚物EVAL Ethylene-vinyl alcohol 乙烯-乙烯醇共聚物FEP Perfluoro(ethylene-propyle ne) 全氟（乙烯-丙烯）塑料FF Furan formaldehyde 呋喃甲醛HDPE High-density polyethylen e plastics 高密度聚乙烯塑料HIPS High impact polystyrene 高冲聚苯乙烯IPS Impact-resistant polystyren e 耐冲击聚苯乙烯LCP Liquid crystal polymer 液晶聚合物LDPE Low-density polyethylene plastics 低密度聚乙烯塑料LLDPE Linear low-density polye thylene 线性低密聚乙烯LMDPE Linear medium-density polyethylene 线性中密聚乙烯零件英语零件类punch冲头 insert入块(嵌入件) deburring punch压毛边冲子groove punch压线冲子 stamped punch字模冲子round punch圆冲子 special shape punch异形冲子bending block折刀 roller滚轴 baffle plate挡块located block定位块 supporting block for loca tion 定位支承块air cushion plate气垫板 air-cushion eject-rod气垫顶杆trimming punch切边冲子 stiffening rib punch = sting er 函强筋冲子ribbon punch压筋冲子 reel-stretch punch卷圆压平冲子guide plate定位板 sliding block 滑块 sliding dowel block滑块固active plate活动板 lower sliding plate下滑块板upper holder block上压块 upper mid plate上中间板spring box弹簧箱 spring-box eject-rod弹簧箱顶杆spring-box eject-plate弹簧箱顶板 bushing block衬套cover plate盖板 guide pad导料块塑件&模具相关英文compression molding压缩成型 flash mold溢流式模具plasitive mold挤压式模具 split mold分割式模具cavity型控母模 core模心公模 taper锥拔 leather cloak仿皮革 shiver饰纹 flow mark流痕 welding mark溶合痕 post screw insert螺纹套筒埋值 self tapping screw自攻螺丝striper plate脱料板 piston活塞 cylinder汽缸套chip细碎物 handle mold手持式模具移转成型用模具encapsulation molding低压封装成型射出成型用模具 two plate两极式（模具） well type蓄料井insulated runner绝缘浇道方式 hot runner热浇道runner plat浇道模块 valve gate阀门浇口band heater环带状的电热器 spindle阀针spear head刨尖头 slag well冷料井cold slag冷料渣 air vent排气道welding line熔合痕 eject pin 顶出针 knock pin顶出销return pin回位销反顶针 sleave套筒 stripper plateinsert core放置入子 runner stripper plate浇道脱料板guide pin导销 eject rod (bar)（成型机）顶业捧subzero深冷处理 three plate 三极式模具runner system浇道系统 stress crack应力电裂orientation定向 sprue gate射料浇口，直浇口nozzle射嘴 sprue lock pin料头钩销(拉料杆)slag well冷料井 side gate侧浇口edge gate侧缘浇口 tab gate 搭接浇口 film gate薄膜浇口flash gate闸门浇口 slit gate缝隙浇口 fan gate扇形浇口 dish gate因盘形浇口 diaphragm gate隔膜浇口 ring gate环形浇口subarine gate潜入式浇口 tunnel gate隧道式浇口 pin gate针点浇口Runner less无浇道 (sprue less)无射料管方式long nozzle延长喷嘴方式 sprue浇口;溶渣冲压英语stamping, press冲压 punch press, dieing out pre ss冲床uncoiler & strainghtener整平机 feeder送料机rack, shelf, stack料架 cylinder 油缸robot机械手 taker取料机 conveyer belt输送带transmission rack输送架 top stop上死点 bottom stop下死点one stroke一行程 inch寸动 to continue, cont.连动to grip(material)吸料 location lump, locating piece , block stop 定位块reset复位 smoothly顺利 dent 压痕 scratch刮伤 deformationfilings铁削 to draw holes抽孔 inquiry, search for查寻to stock, storage, in stock库存 receive领取approval examine and verify审核 processing, to process函工delivery, to deliver 交货 to return delivenry to.to send delinery back to retrn of goods退货registration登记 registration card登记卡to control管制 to put forward and hand i n提报safe stock安全库存 acceptance = receive验收to notice通知 application form for purchas e请购单consume, consumption消耗 to fill in填写abrasion磨损 reverse angle = chamfer character die字模 to collect, to gather收集failure, trouble故障 statistics 统计 demand and supply需求career card履历卡 to take apart a die卸下模具to load a die装上模具 to tight a bolt拧紧螺栓to looser a bolt拧松螺栓 to move away a die plate 移走模板easily damaged parts易损件 standard parts标准件breaking.(be)broken,(be)cracke d 断裂 to lubricate润滑common vocabulary for die eng ineering模具工程常用词汇die 模具 figure file, chart file 图档cutting die, blanking die冲裁模 progressive die, follow (-on) die 连续模模 punched hole冲孔 panel board镶块 to cutedges=side cut=side scrap切边 to bending 折弯 to pull, to stretch拉伸 Line streching, line pulling线拉伸 engraving, to engrave刻印 upsiding down edges翻边 to stake铆合designing, to design设计 design modification设计变化die block模块 folded block折弯块sliding block滑块 location pin 定位销 lifting pin顶料销die plate, front board模adding block垫块 stepping bar垫条upper die base上模座 lower die base下模座upper supporting blank上承板 upper padding plate blank 上垫板spare dies模具备品 spring 弹簧 bolt螺栓击版印刷术语英语翻译摆版imposition 根据装订形式和套印方法的要求，将单块或联块印版按一定规范排列。
FPC专业术语简介
FPC专业术语简介FPC专业术语简介之前一兄弟毕业后干了两年电镀，决定出去见识见识，出去后与同事交流时被取笑不知道dummying为何物？所以呢这些术语不知道到底有多大的用处，但装逼绝对用的上。
PCB：Printed circuit board，印刷电路板；FPC：Flexible Printed circuit，柔性电路板，也称挠性电路板，俗称软板；CCL：Copper Clad Laminates，铜箔基材；FCCL：Flexible Copper Clad Laminates，柔性铜箔基材；RA：Roll Anneal Copper Foil，压延铜；ED：Electrolysis Desposition Copper Foil，电解铜；ADH：Adhesive，粘接剂，俗称胶；PI：Polyimide，聚亚酰胺；CVL：Cover lay，覆盖膜，日资厂称为保胶、有的厂称为包封等SR：Solder Resist，阻焊；EMI：电磁屏蔽膜；PP：Prepreg，半固化片，也称黏结片LCP：Liquid Crystal Polyme，液晶聚合物PTH：Plated Trough Holes，镀通孔NPTH：No Plated Trough Holes，BVH：Blind Via Holes盲孔ENIG：Electroless Nickel Immersion Gold无电解（化学）镍金ENEPIG：Electroless Nickel Electroless Palladium Immersion Gold无电解（化学）镍钯金OSP：Organic Solderability Preservatives，有机可焊性预处理；IC：Integrated Circuit，集成电路；AOI：Automatic Optic Inspection；自动光学检查；VCP：Vertical Continuous Plate，垂直连续电镀；A VI：SMT：Surface Mount Technology，表面贴装技术；DFM：Design For Manufacture，可制造性设计；DFSR：DES：Developing Etching Stripping显影、蚀刻、去膜。
FPC行业用语
英文缩写英文中文参考3M3M美国3M公司行业：多元工业ATCAccelerated Thermal Cycle加速热循环ATAcceptance Test验收试验ABSAcrylonitrile Butadiene Styrene (Plastic)丙烯腈-丁二烯-苯乙烯（塑胶）AMDActive Matrix Display动态矩阵显示器ADPCMAdaptive Differential Pulse Code Modulation自适应差分脉冲编码调制ARPAddress Resolution Protocol地址分辨率协定ACTSAdvanced Communications Technology Satellite先进的卫星通信技术ASMAdvanced Solder Mask先进焊接掩膜ANSIAmerican National Standards Institute美国国家标准系员会ASTMAmerican Society for Testing and Material美国测试和材料学会ASKAmplitude Shift Keying振幅变换调制AMPSAndvanced Mobile Phone Service高级移动电话业务ACFAnisotropic Conductive Film各向异性传导薄膜ACAAnisotropically Conductive Adhesive各向异性传导粘合剂ALIVHAny Layer Inner Via Hole任意层内通孔ATSApple Terminal Services Apple终端服务ASICApplication Specific Integrated Circuit特殊应用集成电路ACSAsynchronous Communication Server异步通讯伺服器ARSAudio Response System声音应答系统ACHAutomated Clearing House自动清算中心AOIautomated optical inspection自动光学检查ADSAutomatic Distribution System自动分配系统ARQAutomatic Request for Repetition自动要求重发ATMAutomatic Teller Machine自动出纳机,自动取款机ASStandards Associaton of Australia澳大利亚标准化协会标准Accenture百慕大群岛埃森哲公司行业：IT咨询及服务ATAccess Time 存取时间,访问时间accesshole余隙孔行业：印制电路ACHESON美国亚基逊公司ACRYLIC压克力，丙烯酸acrylic resin丙烯酸树脂行业：印制电路ATAddress Translation地址转换adesive胶粘剂行业：印制电路ADHESIVE接着剂（粘接剂）adhesive coated dielectric film涂胶粘剂绝缘薄膜行业：印制电路adhesive coated foil涂胶铜箔行业：印制电路adhesive faec胶粘剂面行业：印制电路adhesive-coated catalyzed laminate涂胶催化层压板行业：印制电路adhesive-coated uncatalyzed laminate涂胶无催层压板行业：印制电路ATAdvanced Technology先进技术Air Products & Chemicals美国气体化工产品有限公司行业：化工Aire Liquide Group法国爱乐力公司行业：化工Aisin Seiki日本爱信精机公司行业：汽车配件Akzo Nobel Group荷兰阿克苏诺贝尔公司行业：化工ALARM压力锅Alcan加拿大铝业公司行业：金属及矿藏ALCATEL阿尔卡特公司Alcoa美国铝业公司行业：金属及矿藏ALIVH multilayer printed board层间全内导通多层印制板行业：印制电路alldrilledhole全部钻孔行业：印制电路Alltel美国奥特技术公司行业：电信服务ATAlternative Tag交替标记,选择标记,备用标记Ameren美国阿莫林公司行业：公共电力ASMEAmerican society of mechanical engineers美国机械工程工程师协会ASCIIAmerican standard code for informarion美国信息互换标准码AMKOR安可公司amorphous polymer无定形聚合物行业：印制电路anchoringspaur盘址行业：印制电路ANDREW安德鲁公司Anglo American英国英美集团行业：金属及矿藏annealed copper foil退火铜箔行业：印制电路annularpad环形盘行业：印制电路annularring孔环行业：印制电路ALIVHanylayerinnerviahole任意层内部导通孔行业：印制电路APICAL日本钟渊公司PI商标APPLE苹果牌电脑Areva Group法国爱瑞华集团公司行业：金属及矿藏ARISAWA日本有泽公司aromatic polyamide paper聚芳酰胺纤维纸行业：印制电路array阵列行业：印制电路AAADassemblyaidedarchitecturaldesign组装设计自动化行业：印制电路assemblydrawing装配图行业：印制电路A-stage resinA阶树脂行业：印制电路AT&TAT&T美国电报电话公司行业：电信服务AT&T Wireless Services美国AT﹠T无线服务公司行业：无线通讯服务ATAttention注意ATAudit Trail审计跟踪(网络管理的工具)AUO友达光电公司Automatic Data Processing美国自动化数据处理公司行业：IT咨询及服务ATAutomatic Telephone自动电话APQP产品质量先期策划时代AFNOR法国标准化协会ACM异方性导电材料ADH接着剂行业：印制电路Acceleration 速化反应（台）加速反应行业：印制电路Accelerator 加速剂，速化剂（台）促进剂，催化剂行业：印制电路AQLAcceptable Quality Level允收品质水准（台）合格质量水平行业：印制电路Access hole 露出孔，穿露孔（台）余隙孔行业：印制电路Accuracy 露出孔，穿露孔（台）余隙孔行业：印制电路Acid Dip 浸酸（台）弱酸蚀行业：印制电路Acrylic（resin）压克力（台）丙烯酸（树脂）行业：印制电路Active Parts 主动零件（台）有源器件行业：印制电路Anisotropic Conductive Film（Adhesive）单向导接着膜（台）单向导电膜行业：印制电路Anneal 韧化（台）退火行业：印制电路ALIVHAny Layer Interstitial Via Hole 阿力制程（台）全层内部导通孔（工艺），任意层内部通孔（工艺）行业：印制电路Area Array Package 面积格列封装（台）面阵列封装行业：印制电路ASIC专用集成电路ADI美国模拟器件公司B2it printed board埋入凸块连印制板行业：印制电路BaanBaan公司行业：软件back-bardland腹（背）裸盘行业：印制电路backplane背板行业：印制电路BGABall Grid Array球式栅格阵列bare board裸板行业：印制电路base film底膜base film surface基膜面行业：印制电路base material基材行业：印制电路BASF Group德国巴斯夫集团行业：化工basis material基体材料行业：印制电路Bayer Group德国拜耳集团行业：化工BCE加拿大贝尔企业集团行业：电信服务BellSouth美国南方贝尔通信公司行业：电信服务BHP Billton澳大利亚及英国必和必拓公司行业：金属及矿藏bias纬斜行业：印制电路binder粘结剂行业：印制电路bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates双马来酰亚胺三嗪环氧玻璃布覆铜箔板行业：印制电路bismaleimide-triazine resin双马来酰亚胺三嗪树脂行业：印制电路Blister起泡blockdiagram方块框图行业：印制电路BMWBMW德国宝马公司行业：汽车Board板Boeing美国波音公司行业：航天及国防bonding接合bonding layer粘结层行业：印制电路bonding sheet粘结片行业：印制电路bottom-updesign自底向上设计行业：印制电路bow of weave弓纬行业：印制电路break-away planel可断拼板行业：印制电路breaking length断裂长行业：印制电路Bridgestone日本普利司通公司行业：汽车配件BSIBritish Standards Institute英国标准学会Broadband宽带brominated epoxy resin溴化环氧树脂行业：印制电路B-stage resinB阶树脂行业：印制电路BT Group英国电讯公司行业：电信服务BUMBuild up Multilayer Printed Cicuit Board积层法多层板，增层法Build-up 强化，增厚，堆积，增层build-up flexible printed board积层挠印制板行业：印制电路BUMbuild-up mulitlayer printed board 积层多层印制板行业：印制电路buile-up printed board积层印制板行业：印制电路bulletpad子弹形盘行业：印制电路BIPMBureau International des Poids et Mesures国际计量局buried resistance board埋电阻板行业：印制电路buried/blindvia埋/盲孔行业：印制电路buriedviahole埋孔行业：印制电路Buzzer蜂鸣器base material基材行业：印制电路black hole黑孔行业：印制电路Ball Grid Array 球脚阵列（台）球栅阵列行业：印制电路Bandability 可弯曲性（台）可挠性行业：印制电路Bandwidth 频带宽度，频宽（台）带宽行业：印制电路Banking Agent 护岸剂（台）护堤剂行业：印制电路Bare Board 空板，未装板（台）裸板行业：印制电路Bare Chip Assembly 裸体芯片组装（台）裸芯片安装行业：印制电路Basic Grid 基本方格（台）基本网络行业：印制电路Blanking 行空断开（台）落料行业：印制电路Bleeding 渗流（台）渗出行业：印制电路Block Diagram 电路系统整合图（台）方块框图行业：印制电路Blotting 干印（台）吸墨行业：印制电路BlowＨole 吹孔（台）气孔行业：印制电路Bond Strength 结合强度，固着强度（台）粘合强度行业：印制电路Bondability 结合性，固着性（台）粘合性行业：印制电路Bonding Sheet （Ply ，Layer）接合片，接着层（台）粘结片行业：印制电路Bonding Wire 结合线（台）键合线行业：印制电路Brazing 硬焊（台）钎焊行业：印制电路Breakaway Panel 可断开板（台）可断拼板行业：印制电路Breakdown Voltage 崩溃电压（台）击穿电压行业：印制电路Bright Dip 光泽浸渍处理（台）浸亮行业：印制电路Build - up 增厚，堆积，增层（台）积层行业：印制电路BUMBuild - up Multiayer增层法多层板（台）积层法多层板行业：印制电路Burr 毛头（台）毛剌行业：印制电路Bus Bar 汇电杆（台）汇流排行业：印制电路back-annotation数字背注BGA Ball Grid ArrayCOGChip On Glass玻璃衬底芯片COBChip-On-Board板上连接式芯片COFChip-on-Flexible柔性板上芯片CCContinuity Cell连贯单元cable电缆行业：印制电路Cable线头式CSACanadian Standards Association加拿大标准协会Canon日本佳能公司行业：办公室电子Card Edge板边卡板Career台湾嘉联益公司carrier foil载体箔行业：印制电路Carso Global Telecom墨西哥全球电信公司行业：电信服务Casio日本卡西欧catalyzed board ,coated catalyzed laminate催化板材行业：印制电路Caterpillar美国卡特彼勒公司行业：机械CRTCathode Ray Tube阴极射线管CFCenter/Carrier Frequency中心/载波频率/彩色滤光片CPUCentral Processing Unit中央处理器ceramic substrate printed board陶瓷印制板行业：印制电路ceramics陶瓷行业：印制电路ceramics base copper-clad laminates陶瓷基覆铜箔板行业：印制电路CVDChemical Vapor Deposition化学汽相沉积China Mobile(HK)中国香港中国移动公司行业：无线通讯服务China Telecom中国电信公司行业：电信服务China Unicom中国联通公司行业：无线通讯服务COBchip on board 载芯片板行业：印制电路CSPChip-scale packge芯片级封装Chubu Electric Power日本中部电力公司行业：公共电力Chugoku Electric Power日本中国电力公司行业：公共电力Chunghwa Telecom中国台湾中华电信行业：电信服务Cinergy美国辛纳杰公司行业：公共电力circitsimulation电路模拟行业：印制电路Circuitry电路Cisco Systems美国思科公司行业：通讯设备CMO奇美电子CTECoefficient of Thermal Expansion热膨胀系数Colgate-Palmolive美国高露洁棕榄集团行业：家居产品CGAColumn Grid Array圆柱栅格阵列CASCommunications Application Specification通讯应用规格component side元件面行业：印制电路componentdensity元件密度行业：印制电路componenthole元件孔行业：印制电路componentpositioning元件安置行业：印制电路composite laminate复合层压板行业：印制电路composite metallic material 复合金属箔行业：印制电路CATComputer Automated Testing电脑自动化测试CIMComputer Integrated Manufacturing电脑综合生产Computer Sciences美国计算机科学公司行业：IT咨询及服务computeraideddrawing计算机辅助制图行业：印制电路CCDcomputercontrolleddisplay计算机控制显示行业：印制电路CIMcomputerintegratmanufacturing计算机集成制造行业：印制电路CADComputer-Aided Design电脑辅助设计CAEComputer-Aided Engineering电脑辅助工程computer-aidedcircuitanalysis计算机辅助电路分析行业：印制电路CADcomputer-aideddesign计算机辅助设计行业：印制电路CAEcomputer-aidedengineering计算机辅助工程行业：印制电路CAMcomputer-aidedmanufacturing计算机辅助制造行业：印制电路CATcomputer-aidedtest计算机辅助测试行业：印制电路CNCComputerized Numerical Control电脑数控conduction(track)导线（通道）行业：印制电路conductive foil导电箔行业：印制电路conductive pattern导电图形行业：印制电路conductor side导线面行业：印制电路conductor trace line导线行业：印制电路conductorlayer导线层行业：印制电路conductorlayerNo.1第一导线层行业：印制电路conductorline/space导线宽度/间距行业：印制电路conductorspacing导线距离行业：印制电路conductorwidth导线（体）宽度行业：印制电路Consolidated Edison美国统一爱迪生公司行业：公共电力Constellation Energy Group美国联合能源公司行业：公共电力CEMAConsumer Electronics Manufacturers Association消费电子供应商协会,消费电子制造商协会CICControl Integrated Circuit控制集成电路copolymer共聚物行业：印制电路CCLCopper Clad Laminatas覆铜板，全称覆铜箔层压板copper foil铜箔行业：印制电路CCLcopper-clad laminate 覆铜箔层压板行业：印制电路copper-clad surface铜箔面行业：印制电路copper-invar-copper board键盘板夹心板行业：印制电路core material内层芯板行业：印制电路Cornig美国康宁costmetrix费用矩阵行业：印制电路couplint agent偶联剂行业：印制电路Covecat覆盖膜coverlaycover layer 覆盖层行业：印制电路Coverlay覆盖膜Crack破裂crease折痕行业：印制电路cross wise direction模向行业：印制电路crossover跨交行业：印制电路crystalline polamer结晶现象行业：印制电路C-stage resinC阶树脂行业：印制电路curing agent固化剂行业：印制电路cut to size panel剪切板行业：印制电路CENEuropean Committee for Normalization欧洲标准化委员会router（CAD）走（布）线器行业：印制电路CNGI国家下一代互联网示范工程CRM客户关系管理conductive导通的行业：印制电路carbon particles碳粒子行业：印制电路cascade Rinse循环水洗行业：印制电路concentration浓度行业：印制电路Cap Laminaton 帽式压合法（台）覆盖层压法行业：印制电路Cavity Down / Cavity Up 方凹区朝下/方凹区朝上（台）空腔区朝下/空腔区朝上行业：印制电路Cell Phone 行动电话（台）移动电话行业：印制电路Chase 网框（台）网框行业：印制电路Chemical Resistance 抗化性，耐化性（台）耐化学性行业：印制电路Chip 芯片，晶粒，片状（台）芯片行业：印制电路COBChip on Board晶板接装法（台）载芯片板行业：印制电路Chip Scale Package 芯片级封装（台）芯片级安装行业：印制电路Circumferential Separation 环状断孔（台）环开断裂行业：印制电路Clad / Cladding 披覆（台）覆箔行业：印制电路Clinched Lead Terminal 紧箱式引脚（台）折弯引脚行业：印制电路Clok Frequency 时脉速率（台）时钟频率行业：印制电路Coaxial Cable 同轴缆线（台）同轴电缆行业：印制电路Cold Solder Joint冷焊点（台）虚焊点行业：印制电路Comparative Tracking Index 比较性漏电指数（台）相比起痕指数行业：印制电路Complex Ion 错离子（台）络离子行业：印制电路Component Hole 零件孔（台）组件孔行业：印制电路Component Side 组件面（台）组件面行业：印制电路Condensation Soldering 凝热焊接，液化放热焊接（台）冷凝焊接行业：印制电路Conductive Anodic Filament 玻纤纱式漏电（台）阳极性玻纤丝的漏电行业：印制电路Conductor Spacing 导体间距（台）导线间距行业：印制电路Core （Board）核心板，核板（台）芯板行业：印制电路Core Material 内层板材，核材（台）内层芯材行业：印制电路Corner Crack 通孔断角（台）拐角裂缝行业：印制电路Corner Mark板角标记（台）拐角标记行业：印制电路Counterboring 垂直向下扩孔，埋头孔（台）沉头孔行业：印制电路Countersinking 锥型扩孔，喇叭孔（台）锥形孔行业：印制电路Coupling Agent 耦合剂（台）偶联剂行业：印制电路Coupon ， Test Coupon 板边试样（台）附连测试板行业：印制电路Coverlayer ，Coverlay 表护层（台）覆盖层行业：印制电路Crease 皱折（台）折痕行业：印制电路Creep 潜变（台）蠕变行业：印制电路Crosshatching 十字交叉区（台）开窗口行业：印制电路Crossover 越交，搭交（台）跨交行业：印制电路Crosstalk 杂讯，串讯（台）串扰行业：印制电路Cure硬化，熟化（台）固化，硫化行业：印制电路Current、Carrying Capability 载流能力（台）载流量行业：印制电路Curtain Coating 濂涂法（台）帘幕法行业：印制电路CAE计算机辅助工程CAD计算机辅助设计CAPP计算机辅助工艺CAM计算机机辅助制造CBGACeramic Ball Grid ArrayCSP Chip Scale PackageCSP BGAChip Scale Package Ball Grid ArrayCerDIPCeramic Dual Inline PackageCerDIP - Side or Bottom BrazedCerPAK - Gullwing LeadsCCMcmos camera module手机照相模组DIPDual-In-Line Package双列直插式封装DaimlerChrysler德国戴姆勒—克莱斯勒汽车公司行业：汽车datumreferan参考基准行业：印制电路daughter board子板行业：印制电路Deere & Co美国迪尔公司行业：机械definitesequence定顺序行业：印制电路degreesfreedom自由度行业：印制电路Dell Computer美国戴尔公司行业：计算机及辅设denier但尼尔行业：印制电路Denso日本电装公司行业：汽车配件Deplphi美国德尔菲公司行业：汽车配件designdatabase设计数据库行业：印制电路designorigin设计原点行业：印制电路designrulechecking设计规则检查行业：印制电路design-for-manufacturability可制造性设计行业：印制电路Deutsche Telekom德国电信公司行业：电信服务D-glass fibreD玻璃纤维行业：印制电路diamondpad菱形盘行业：印制电路dicyandiamide双氰胺行业：印制电路digitzing数字化行业：印制电路dimensionedhole准尺寸孔行业：印制电路dimorphism双晶现象行业：印制电路DSCDiqital Still Camera数码相机discrete wiring board散线印制板行业：印制电路Dominin Resources美国领土资源公司行业：公共电力double treated foil双面处理铜箔行业：印制电路double-sided copper-clad laminate双面覆铜箔层压板行业：印制电路DSBdouble-sided printed board双面印制板行业：印制电路Dow Chenmical美国陶氏化学公司行业：化工drilldrawing钻孔图行业：印制电路drivefile驱动文件行业：印制电路DTE Energy美国底特律能源公司行业：公共电力Duke Energy美国杜克能源公司行业：多元能源dynamic flex board动态挠性板行业：印制电路DRAMDynamic Random Access Memory动态随机存取存储器DUPONTEl DUPONT Nenmours美国杜邦公司化工drilling钻孔行业：印制电路double－side transmission双边传动行业：印制电路D/F film-laminatedD/F压膜行业：印制电路discrete light离散光行业：印制电路developing显影行业：印制电路Daisy Chaining 菊花瓣连垫（台）串推行业：印制电路Deburring 去毛头（台）去毛剌行业：印制电路Definition 边缘*真度（台）清晰度行业：印制电路Denier 丹尼尔（台）坦尼尔行业：印制电路Dent 凹陷（台）凹坑行业：印制电路Deposition 沉积，附积（台）沉积行业：印制电路Desmearing 除胶渣（台）去钻污行业：印制电路Dewetting 缩锡（台）半润湿行业：印制电路Diazo Film 偶氮棕片（台）重氮底片行业：印制电路Dicing 芯片分割（台）切片行业：印制电路Die Attach 晶粒安装（台）管芯安装行业：印制电路Die Bonding 晶料接着（台）管芯键合行业：印制电路Dielectric Breakdown 介质崩溃（台）介质击穿行业：印制电路Dielectrie Breakdown Voltage 介质崩溃电压（台）介质击穿电压行业：印制电路Dielectric Constant ，Dk or εr介质常数（台）介电常数行业：印制电路DSCDifferential Scanning Calorimetry微差扫瞄热卡分析法（台）示扫描量热法行业：印制电路Dimensional Stability 尺度安定性（台）尺寸稳定性行业：印制电路Direct / Indirect Stencil 直间版膜（台）直接/间接法网版行业：印制电路Discrete Component 散装零件（台）离散组件行业：印制电路DfDisspation Factor散失因素（台）损耗因素行业：印制电路Drill Facet 钻尖切削面（台）钻尖切削面行业：印制电路Dual Wave Soldering双波焊接（台）双波峰焊行业：印制电路FPCDynamic Flex动态软板（台）动态挠性板行业：印制电路DMADynamic Mechanical Analysis动态热机分析法（台）动态力学分析法，热机械分析法行业：印制电路DRC设计规则检查Dell戴尔DIP Dual Inline PackageE.On德国怡安能源公司Eastman Kodak美国柯达公司行业：休闲产品eCommerce电子商务edge-board contact板边插头行业：印制电路Edison International美国爱迪生国际公司行业：公共电力EDP-Electicidade de Portugal葡萄牙电力公司行业：公共电力E-glass fibreE玻璃纤维行业：印制电路EDAelectricdesignautomation电子设计自动化行业：印制电路electroconductive paste printed board导电胶印制板行业：印制电路EDelectrodeposited copper foil 电解铜箔行业：印制电路ED copper foilelectrodeposited copper foil 电解铜箔行业：印制电路Electrolux Group瑞典伊莱克斯公司行业：家居耐用品Electronic Data Systems美国电子数据系统公司行业：IT咨询及服务Eletrobras巴西中央电力公司行业：公共电力Emerson Electric美国爱默生电气公司行业：电力设备EnBW德国恩博公司行业：公共电力end missing断经行业：印制电路Endesa Group西班牙恩德萨电力公司行业：公共电力ENELENEL意大利国家电力公司行业：公共电力EDA2engineeringdesignautomaton工程设计自动化行业：印制电路engineeringdrawing工程图行业：印制电路Entergy美国安特吉公司行业：公共电力epoxyepoxide cellulose paper copper-clad laminates 环氧纸质覆铜箔板行业：印制电路epoxide cellulose paper core, glass cloth surfaces copper-clad laminates环氧玻璃布纸复合覆铜箔板行业：印制电路epoxide non woven/woven glass reinforced copper-clad laminates环氧玻璃布玻璃纤维复合覆铜箔板行业：印制电路epoxide synthetic fiber fabric copper-clad laminates环氧合成纤维布覆铜箔板行业：印制电路epoxide woven glass fabric copper-clad laminates环氧玻璃布基覆铜箔板行业：印制电路epoxy glass substrate环氧玻璃基板行业：印制电路epoxy novolac环氧酚醛行业：印制电路epoxy resin环氧树脂行业：印制电路epoxy value环氧值行业：印制电路euclideandistance欧几里德距离行业：印制电路Exelon美国爱克森公司行业：公共电力ERP企业资源管理electrolytic foil电解铜箔行业：印制电路exposure曝光行业：印制电路etching蚀刻行业：印制电路Eddy Current 涡电流（台）涡流行业：印制电路Edge -Board Connector 板边（金手指）承接器（台）板边连接器行业：印制电路Edge -Board Contact 板边金手指（台）板边插头行业：印制电路Edge Spacing板边空地，边宽（台）边距行业：印制电路EDTA 乙 = 胺四醋酸（台）乙 = 胺四乙酸行业：印制电路Electric Strength （耐）电性强度（台）电气强度行业：印制电路Electro - deposited Photoresist 电着光阻，电泳光阻（台）电沉积光致抗蚀剂行业：印制电路Electroless Deposition 无电镀，化学镀（台）无电电镀，化学镀，非电解电镀行业：印制电路Electro - phoresis 电泳动，电渗，电子构装（台）电泳行业：印制电路Etchback 回蚀（台）凹蚀阴影行业：印制电路Etch Factor 蚀刻因子，蚀刻函数（台）蚀刻系数行业：印制电路Etching Indicator 蚀刻指标（台）蚀刻指示图行业：印制电路Etching Resist 抗蚀阻剂（台）抗蚀刻行业：印制电路Eutetic Composition 共融组成（台）共晶组成行业：印制电路Excimer Lesar 准分子雷射（台）准分子激光行业：印制电路ERP企业资源管理ERC电学规则检查FC Feedback Control反馈控制feather length毛圈长行业：印制电路filament单丝行业：印制电路film adhesive粘结膜行业：印制电路finish level处理剂含量行业：印制电路finished fabric处理织物行业：印制电路First Data美国第一咨询公司IT咨询及服务FirstEnergy美国第一能源公司行业：公共电力fish eye鱼眼行业：印制电路flame retardant 阻燃剂行业：印制电路flexible copper-clad dielectric film 挠性覆铜箔绝缘薄膜行业：印制电路flexible double-sided printed board挠性双面印制板行业：印制电路FFCflexible flat cable 挠性扁平电缆行业：印制电路flexible multilayer printed board挠性多层印制板行业：印制电路flexible printed board挠性印制板行业：印制电路FPCflexible printed circuit 挠性印制电路行业：印制电路flexible printed wiring挠性印制线路行业：印制电路flexible single-sided printed board挠性单面印制板行业：印制电路flex-rigid double-sided printed board, rigid-flex double-sided printed刚性双面印制板行业：印制电路flex-rigid multilayer printed board, rigid-flex multilayer printed board软硬结合多层印刷电路板行业：印制电路flex-rigid printed board, rigid-flex printed board刚性印制板行业：印制电路fluroresin氟树脂行业：印制电路flush conductor齐平导线行业：印制电路flush printed board齐平印制板行业：印制电路foil profile箔（剖面）轮廓行业：印制电路foil removal surface去铜箔面行业：印制电路Ford Motor美国福特汽车公司行业：汽车FPL Group美国佛罗理达电力和照明集团行业：公共电力France Telecom法国电信公司行业：电信服务Fuji Photo Film日本富土胶卷公司行业：休闲产品fukuda日本福田金属有限公司行业：印制电路FCCLFlexible copper clad laminate柔性覆铜箔行业：印制电路Face Bonding 晶面朝下之结合（台）倒芯片键合行业：印制电路Fatingue Strength 抗疲劳强度（台）疲劳强度行业：印制电路Fibet Exposure玻织显露（台）露纤维行业：印制电路Fiducial Mark基准记号，光学靶标（台）基准标记行业：印制电路Film Adhesive 接着膜，粘合膜（台）粘结膜行业：印制电路Fine pitch 密脚距，密线距，密垫距（台）精细节距行业：印制电路fading衰落General Dynamics美国通用动力公司行业：航天及国防General Electric美国通用电气公司General Motors美国通用汽车公司行业：汽车GENERSOFT浪潮集团通用软件有限公司Gillette美国吉列公司行业：个人用品gitek深圳吉创公司行业：通讯设备glass fabric玻璃布行业：印制电路glass fiber玻璃纤维行业：印制电路glass mats玻璃纤维垫行业：印制电路graphicsdispaly图形显示行业：印制电路grey fabric坏布行业：印制电路grid网格行业：印制电路Gate Array 闸机阵列，闸列（台）门阵列行业：印制电路Gel Time胶性时间（台）胶化时间，凝胶时间行业：印制电路Gelation Particle 胶凝点（台）凝胶点行业：印制电路Ghost Image 阴影（台）重影行业：印制电路Glass Transition Temperature ， Tg 玻璃态转化温度（台）玻璃化温度，玻璃态转变温度行业：印制电路Grid 标准格（台）网格行业：印制电路Grid Wing Lead（台）契形引线（脚）行业：印制电路holeblindvia盲孔行业：印制电路height of capillary rise吸水高度行业：印制电路Henkel Group德国汉高公司行业：家居产品Hewlett-Packard美国惠普公司行业:计算机及辅设hierarchicaldesign层次设计行业：印制电路Hitachi日本日立公司行业：电子设备holedensity孔密度行业：印制电路holelocation孔位行业：印制电路holepattern孔图行业：印制电路Honda Motor日本本田汽车公司行业：汽车Honeywell美国霍尼韦尔公司行业：航天及国防HP Solutions惠浦公司行业：软件HRMS(e-HR)HRMS(e-HR)人力资源管理系统Hutchison Whampoa中国香港和记黄埔公司行业：多元工业hybrid circuit混合电路行业：印制电路Hyundai Motor韩国现代汽车公司行业：汽车hydrochloric acid盐酸行业：印制电路hydrogen peroxide solution过氧化氢行业：印制电路Halation 环晕（台）晕环行业：印制电路Hay Wire 跳线（台）附加线行业：印制电路Holding Time 停置时间（台）停留时间行业：印制电路Hole Breakout 孔位破出（台）破坏行业：印制电路Hole Density 孔数密度（台）孔密度行业：印制电路Hole Pull Strength 孔壁抗拉强度（台）孔拉脱强度行业：印制电路Hole Void 破洞（台）孔壁空洞行业：印制电路HASLHole Air Soldrt Levelling喷锡（台）热风整平行业：印制电路Hull Cell 哈尔槽（台）霍尔槽行业：印制电路HP惠普IC Integrated Circuit集成电路isolationpad隔离盘行业：印制电路Iberdrola西班牙伊比德罗拉电力公司行业：公共电力IBM SolutionsIBM公司行业：软件Illinois Tool Works美国伊利诺斯工具公司行业：机械impregnating insulation paper浸渍绝缘纵纸行业：印制电路incomingdegree出度行业：印制电路Infineon德国英飞凌Intel美国英特尔公司interactivedrawingdesign交互式制图设计行业：印制电路interconnection互连行业：印制电路intermediatefile中间文件行业：印制电路IBMInternational Business Machines美国IBM公司IETFInternet Engineering Task ForceInternet工程任务组interstitialhole中间孔行业：印制电路invar殷瓦行业：印制电路Insulator绝缘层行业：印制电路Icicle 锡尖（台）焊料毛剌行业：印制电路Imaging 成像处理（台）成像行业：印制电路Imperegnate 含浸（台）浸渍行业：印制电路IAInformation Appliance资讯家电（台）信息家电行业：印制电路ICIntegrated Circuit积体电路器（台）集成电路行业：印制电路Interface接口（台）界面行业：印制电路IR美国国家整流器公司Infineon英飞凌impairment信道损害J.D. EdwardsJ.D. Edwards公司行业：软件Japan Energy Corporation日本能源公司日本矿业有限公司(Nippon Mining Co.Ltd)和KYO －DO石油公司(Kyodo Oil Co.Ltd)合并而成JFE Holdings日本钢铁工程控股公司行业：金属及矿藏Johnson Controls美国江森自控公司行业：汽车配件J - Leand J 型接脚，弯钩型脚（台） J形引线行业：印制电路Jump Wire跳线（台）跨接线行业：印制电路JuiceSuzhou Juice Electronic Technology CO.; LTD.苏州泽成电子科技有限公司行业：印制电路KANEKA日本钟渊公司Kansai Electric Power日本关西力公司行业：公共电力Kao日本花王株式会社行业：家居产品KAPTONE美国杜邦公司PI商标KDDI日本KDDI公司行业：无线通讯服务Kimberly-Clark美国金佰利集团行业:家居产品Korea Electric Power韩国电力公司行业：公共电力KT韩国KT5公司行业：电信服务Kyocera日本京瓷公司行业：电子设备Kyushu Electric Power日本九州电力公司行业：公共电力Kapton 聚亚酰胺软材（台）聚酰亚胺薄膜行业：印制电路Kiss Pressure 吻压，低压（台）接能压力行业：印制电路LCDLiquid Crystal Display液晶显示器logicdesign逻辑设计行业：印制电路laminate层压板行业：印制电路laminate for additive process加成法用层压板行业：印制电路landgridarray连接盘网格阵列行业：印制电路landpattern连接盘图形行业：印制电路landlesshole无连接盘孔行业：印制电路landlessviahole无连接盘导通孔行业：印制电路layout布图设计行业：印制电路layouteffeciency布线完成率行业：印制电路LOCLead On Chip具引线的芯片行业：印制电路legend字符行业：印制电路length wise direction纵向行业：印制电路Lngersoll-Rand百慕大群岛美国英格索兰公司行业：多元工业Lockheed Martin美国洛克希德.马丁公司行业：航天及国防。
4.FPC 中英文名词对照
Visual Inspection Related to Stiffener Bonding
补强
Foreign Matter FPC与补强板之间的异物 Void 气泡
Chip-off 缺角
Deformation 变形
Affixed Substances on the Surface
Darkened Appearance (Blackening Discoloration) 变暗（变黑） Plated Expose Wetting 电镀露铜 Expose（暴露）—— exposure（曝光） Peeled Off 剥离 Plated Wicking 电镀渗入 No Plating 漏镀 Rough 电镀粗糙 Wicking 药水渗入
Coverlay Tacking贴保护膜 Abrade 粗化 Lamination 压着 Curing 熟化 Brushing 刷磨 Pre-treatment 前处理 Surface Treatment 表面处理 Dry up 干燥 Micro-etching 微蚀 Acid Cleaning 酸洗 Water Cleaning 水洗 Anti-corrosion Treatment 防锈处理 anti表示反对，抵抗
Marking
Thickness 厚度 Component Hole 元件孔 Via Hole 导通孔 Via Hole Misalign 导通孔偏移 Mounting Hole 组装孔 SMT(S-Surface；M-Mounting；T-Technology)
标记
Conductor Width 导体宽度 width（宽）length（长）height（高）thickness
FPC PCB 常用术语中英文对照
FPC常用术语中英文对照FPC常用术语中英文对照AAccelerate Aging －－加速老化，使用人工的方法，加速正常的老化过程。
Acceptance Quality Level (AQL) －－一批产品中最大可以接受的缺陷数目，通常用于抽样计划。
Acceptance Test －－用来测定产品可以接受的试验，由客户与供应商之间决定。
Access Hole －－在多层线路板连续层上的一系列孔，这些孔的中心在同一个位置，而且通到线路板的一个表面。
Annular Ring －－是指保围孔周围的导体部分。
Artwork －－用于生产“Artwork Master”“production Master”,有精确比例的菲林。
Artwork Master －－通常是有精确比例的菲林，其按1：1的图案用于生产“Production Master”。
BBack Light －－背光法，是一种检查通孔铜壁完好与否得放大目检方法，其做法是将孔壁外的基材自某一方向上小心的予以磨薄，再利用树脂半透明的原理，从背后射入光线。
假如化学铜孔壁品质完好而无任何破洞或针孔时，则该铜层必能阻绝光线而在显微中呈现黑暗，一旦铜壁有破洞时，则必有光点出现而被观察到，并可放大摄影存证，称为背光法，但只能看到半个孔。
Base Material －－绝缘材料，线路在上面形成。
（可以是刚性或柔性，或两者综合。
它可以是不导电的或绝缘的金属板。
）。
Base Material thickness －－不包括铜箔层或镀层的基材的厚度。
Bland Via －－导通孔仅延伸到线路板的一个表面。
Blister －－离层的一种形式，它是在基材的两层之间或基材与铜箔之间或保护层之间局部的隆起。
Board thickness 是－－指包括基材和所有在上面形成导电层在内的总厚度。
Bonding Layer －－结合层，指多层板之胶片层。
CC-Staged Resin －－处于固化最后状态的树脂。
电路板(pcb,fpc)中一些中英对照
1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark。
FPC基材物料中英文对照
FPC基材物料中英文对照1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板:single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料:prepreg14、粘结片：bonding sheet15、预浸粘结片:preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板:laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板:core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板:adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层:cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive face34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates 基材材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂:phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin 8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin 10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin 12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac 14、氟树脂：fluroresin15、硅树脂：silicone resin 16、硅烷：silane17、聚合物：polymer 18、无定形聚合物：amorphous polymer 19、结晶现象：crystalline polamer 20、双晶现象：dimorphism 21、共聚物：copolymer 22、合成树脂：synthetic23、热固性树脂：thermosetting resin 24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin 26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value 28、双氰胺：dicyandiamide29、粘结剂：binder 30、胶粘剂：adesive31、固化剂：curing agent 32、阻燃剂：flame retardant33、遮光剂：opaquer 34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester 36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI) 38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material 41、玻璃纤维：glass fiber42、E玻璃纤维:E-glass fibre 43、D玻璃纤维：D-glass fibre 44、S玻璃纤维：S-glass fibre 45、玻璃布：glass fabric46、非织布:non-woven fabric 47、玻璃纤维垫：glass mats 48、纱线：yarn 49、单丝：filament50、绞股：strand 51、纬纱：weft yarn52、经纱：warp yarn 53、但尼尔：denier54、经向：warp-wise 55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count 57、织物组织：weave structure58、平纹组织：plain structure 59、坏布：grey fabric60、稀松织物：woven scrim 61、弓纬：bow of weave62、断经：end missing 63、缺纬：mis-picks64、纬斜：bias 65、折痕：crease66、云织：waviness 67、鱼眼：fish eye68、毛圈长：feather length 69、厚薄段：mark70、裂缝：split 71、捻度：twist of yarn72、浸润剂含量：size content 73、浸润剂残留量：size residue 74、处理剂含量：finish level 75、浸润剂：size76、偶联剂：couplint agent 77、处理织物：finished fabric 78、聚酰胺纤维：polyarmide fiber 79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper 81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length 83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention 85、白度：whitenness86、陶瓷：ceramics 87、导电箔：conductive foil88、铜箔：copper foil 89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil 91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil 95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material 97、载体箔：carrier foil98、殷瓦：invar 99、箔（剖面）轮廓：foil profile100、光面：shiny side 101、粗糙面：matte side102、处理面：treated side 103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil。
FPC 中英文名词对照
Registration of Hole 孔的重合性 Registration of Outline 外形的重合性 Registration of Punched Outline to Conductor Pattern 冲外形与导体图形的重合性 Punch 冲切 Registration of Pressure Sensitive or Thermosetting Adhesive to FPC and Stiffener 压敏胶或热固胶与FPC 和补强板的重合性 Pressure Sensitive 压敏胶； or Thermosetting Adhesive
Thermosetting Adhesive 热固胶 PSA-Pressure Sensitive Adhesive压敏胶 Flux Residue 助焊剂残渣 Residue（残渣） Residue of Metal Powders 金属粉末残渣 Powder（粉末） Residue of Adhesive 粘结剂残渣
Quality begins with education, and ends up with education.
FPC名词中英对照
Manufacture Procedure制程
Material Preparation 材料准备 Panelization/Shear 下料 Drilling 钻孔 Copper Plating 镀铜 Electroless Copper Plating化学铜 Black Hole黒孔 Sensitive Dry Film 干膜贴合 Exposure 曝光 Developing 显像 Etching 蚀刻 DES Stripping 脱膜
Positional Accuracy
FPC 常见术语中英对照
FPC 常見術語1.軟板FPC: Flexible Printed Circuit2.保護膜Coverlay3.補強Stiffener4.絕緣層Insulator5.滾壓銅箔Rolled copper foil6.電解銅Electrolytic foil7.基材Base film8.鑽孔Drilling9.通孔Through hole10.黑孔Black hole11.黑影Black shadow12.導通的Conductive13.碳粒子Carbon particles14.石墨Graphite15.碳黑Carbon black16.整孔Conditioner17.選鍍Selecting Plating18.全面鍍Panel Plating19.負電的Negative electric change20.感光干膜Sensitive dry film21.曝光Exposure22.平行光Parallel light23.離散光Discrete light24.DES: Developing(顯影) Etching(蝕刻) Striping(剝膜)25.溫度Temperature26.溼度Humidity27.溫度表Thermometer28.壓力表Pressure29.速度表Speed gauge30.速度Speed31.濃度Concentration32.壓力Pressure33.噴淋壓力Spouting pressure34.鹽酸Hydrochloric acid35.過氧化氫Hydrogen peroxide solution36.阻焊Solder resist37.焊墊Solder paste/pads38.衝制Punch39.假貼pre-lamination40.熱壓Lamination41.噴砂Pumice42.加工Assembly43.貼膜Dry film lamination44.渡銅Copper plating45.PTH: Plating Through Hole46.LPI: Liquid Photo Impage-mask澲態感光型油墨47.OSP: Organic Solder ability Preservation48.SMT: Surface Mounted Technology 表面黏着技術49.檢驗Inspection50.研磨Scrubbing51.理論作業數量Theoretical Output Quantity52.五燈孔平均直徑Average diameter of the five holes53.標準色差Sample chromatics54.頻率Frequency55.首件First lot/article56.製程巡檢In-process inspection57.供應商Supplier58.測試盲點Undetectable Circuit59.測試底片Test negative machine60.計算測量技術Technology of calculation and measurement61.螢光燈Fluorescent lamp62.感光度Sensitivity63.隨機抽樣Random sampling64.拉帶Pull tab/belt65.電流Current66.樣品Sample/Specimens67.凹槽Fillister68.影響範圍impact range69.黑色奇異筆Black alcohol-base pen70.阻抗impedance71.絕緣阻抗Insulation resistance72.電壓voltage73.單面板Single side74.雙面板Double side75.多層板Multi side76.導通電阻變化率The variation of conductive resistance77.膠Adhesive/Glue78.鋼板Stencil79. 通孔附著性Adhesion of the through hole80.撕開Tear off81.外型Outline82.尺寸Dimension83.樣品階段sample stage84.量產Mass production。
FPC常用术语
印製線路板術語中英對照版AAccelerate Aging ──加速老化，使用人工的方法，加速正常的老化過程。
Acceptance Quality Level (AQL) ──一批產品中最大可以接受的缺陷數目，通常用于抽樣計畫。
Acceptance Test ──用來測定產品可以接受的試驗，由客戶與供應商之間決定。
Access Hole ──在多層線路板連續層上的一系列孔，這些孔的中心在同一個位置，而且通到線路板的一個表面。
Annular Ring ──是指保圍孔周遭的導體部分。
Artwork ──用于生產“Artwork Master”“production Master”,有精確比例的菲林。
Artwork Master ──通常是有精確比例的菲林，其按1︰1的圖案用于生產“Production Master”。
BBack Light ──背光法，是一種檢查通孔銅壁完好與否得放大目檢方法，其做法是將孔壁外的基材自某一方向上小心的予以磨薄，再利用樹脂半透明的原理，從背后射入光線。
假如化學銅孔壁品性完好而無任何破洞或針孔時，則該銅層必能阻絕光線而在顯微中呈現黑暗，一旦銅壁有破洞時，則必有光點出現而被觀察到，並可放大攝影存証，稱為背光法，但只能看到半個孔。
Base Material ──絕緣材料，線路在上面形成。
（可以是剛性或柔性，或兩者綜合。
它可以是不導電的或絕緣的金屬板。
）。
Base Material thickness ──不包括銅箔層或鍍層的基材的濃度。
Bland Via ──導通孔僅延伸到線路板的一個表面。
Blister ──離層的一種形式，它是在基材的兩層之間或基材與銅箔之間或保護層之間局部的隆起。
Board thickness 是──指包括基材和所有在上面形成導電層在內的總濃度。
Bonding Layer ──結合層，指多層板之膠片層。
CC-Staged Resin ──處于固化最後狀態的樹脂。
FPC-专业词汇-中英文对照
Scratches on Conductor
凹坑
Dents
变色
Discoloration
基底薄膜
Visual Inspection of Base Film
凹坑
Dents
划痕
Scratches on Base Film
覆盖层和覆盖涂层
Visual Inspection of Coverlay and Covercoat
丝印字符
Printing of Legend
贴补强板
Back Board Lamination
电性能测试
Electrical Inspection
贴胶纸
Double Faced Adhesive Tape
打孔
Punching
雷射切割
Laser Cut
自动光学检验
Automatic Optical Inspection（AOI）
压敏胶或热固胶与FPC和增强板的重合性
Registration of Pressure Sensitive or Heat Activated Adhesives to FPC and Stiffener
镀通孔的镀铜层厚度
Plating Thickness of Copper Panted-through Holes
FPC名词中英对照
1.目的
通过对行业标准的FPC工程名词引用及我司标准的整合，旨在为我司FPC名词的中英用语实现使用上的统一化
2.适用范围
规范FPC相关工程上出现之不良项目，生产使用之材料、设备、治具以及可靠性试验等中英文名词
3.定义
无
类别一：FPC不良项目名词
工程类别
FPC常用中英文术语对照表
FPC常用术语中英文对照A Accelerate Aging ——加速老化，使用人工的方法，加速正常的老化过程。
Acceptance Quality Level (AQL) —— 一批产品中最大可以接受的缺陷数目，通常用于抽样计划。
Acceptance Test ——用来测定产品可以接受的试验，由客户与供应商之间决定。
Access Hole ——在多层线路板连续层上的一系列孔，这些孔的中心在同一个位置，而且通到线路板的一个表面。
Annular Ring ——是指保围孔周围的导体部分。
Artwork ——用于生产 “Artwork Master ”“production Master”,有精确比例的菲林。
Artwork Master ——通常是有精确比例的菲林，其按1：1的图案用于生产 “Production Master”。
B Back Light ——背光法，是一种检查通孔铜壁完好与否得放大目检方法，其做法是将孔壁外的基材自某一方向上小心的予以磨薄，再利用树脂半透明的原理，从背后射入光线。
假如化学第 1 页铜孔壁品质完好而无任何破洞或针孔时，则该铜层必能阻绝光线而在显微中呈现黑暗，一旦铜壁有破洞时，则必有光点出现而被观察到，并可放大摄影存证，称为背光法，但只能看到半个孔。
Base Material ——绝缘材料，线路在上面形成。
（可以是刚性或柔性，或两者综合。
它可以是不导电的或绝缘的金属板。
）。
Base Material thickness ——不包括铜箔层或镀层的基材的厚度。
Bland Via ——导通孔仅延伸到线路板的一个表面。
Blister ——离层的一种形式，它是在基材的两层之间或基材与铜箔之间或保护层之间局部的隆起。
Board thickness 是——指包括基材和所有在上面形成导电层在内的总厚度。
Bonding Layer ——结合层，指多层板之胶片层 。
C C-Staged Resin ——处于固化最后状态的树脂。
FPC专业英语词汇
一综合词汇印制电路：printed circuit印制线路：printed wiring印制板：printed board印制板电路：printed circuit board (PCB)印制线路板：printed wiring board(PWB)印制元件：printed component 印制接点：printed contact印制板装配：printed board assembly板：board单面印制板：single-sided printed board(SSB)双面印制板：double-sided printed board(DSB)多层印制板：mulitlayer printed board(MLB)多层印制电路板：mulitlayer printed circuit board多层印制线路板：mulitlayer printed wiring board刚性印制板：rigid printed board 刚性单面印制板：rigidsingle-sided printed borad刚性双面印制板：rigiddouble-sided printed borad刚性多层印制板：rigid multilayer printed board挠性多层印制板：flexible multilayer printed board挠性印制板：flexible printed board挠性单面印制板：flexible single-sided printed board挠性双面印制板：flexible double-sided printed board挠性印制电路：flexible printed circuit (FPC)挠性印制线路：flexible printed wiring刚性印制板：flex-rigid printed board, rigid-flex printed board 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board齐平印制板：flush printed board 金属芯印制板：metal core printed board金属基印制板：metal base printed board多重布线印制板：mulit-wiring printed board陶瓷印制板：ceramic substrate printed board导电胶印制板：electroconductive paste printed board模塑电路板：molded circuit board模压印制板：stamped printed wiring board顺序层压多层印制板：sequentially-laminated mulitlayer散线印制板：discrete wiring board微线印制板：micro wire board 积层印制板：build-up printed board积层多层印制板：build-up mulitlayer printed board (BUM) 积层挠印制板：build-up flexible printed board表面层合电路板：surface laminar circuit (SLC)埋入击块连印制板：B2it printed board多层膜基板：multi-layered film substrate(MFS)层间全内导通多层印制板：ALIVH multilayer printed board 载芯片板：chip on board (COB) 埋电阻板：buried resistance board母板：mother board子板：daughter board背板：backplane裸板：bare board键盘板夹心板：copper-invar-copper board动态挠性板：dynamic flex board 静态挠性板：static flex board 可断拼板：break-away plane电缆：cable挠性扁平电缆：flexible flat cable (FFC)薄膜开关：membrane switch混合电路：hybrid circuit厚膜：thick film厚膜电路：thick film circuit薄膜：thin film薄膜混合电路：thin film hybrid circuit互连：interconnection导线：conductor trace line齐平导线：flush conductor 传输线：transmission line跨交：crossover板边插头：edge-board contact 增强板：stiffener基底：substrate基板面：real estate导线面：conductor side元件面：component side焊接面：solder side印制：printing网格：grid图形：pattern导电图形：conductive pattern 非导电图形：non-conductive pattern字符：legend标志：mark二基材：基材：base material层压板：laminate覆金属箔基材：metal-clad bade material覆铜箔层压板：copper-clad laminate (CCL)单面覆铜箔层压板：single-sided copper-clad laminate双面覆铜箔层压板：double-sided copper-clad laminate复合层压板：composite laminate薄层压板：thin laminate金属芯覆铜箔层压板：metal core copper-clad laminate金属基覆铜层压板：metal base copper-clad laminate挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film基体材料：basis material预浸材料：pre-preg粘结片：bonding sheet预浸粘结片：preimpregnated bonding sheer环氧玻璃基板：epoxy glass substrate函成法用层压板：laminate for additive process预制内层覆箔板：mass lamination panel内层芯板：core material催化板材：catalyzedboard ,coated catalyzed laminate涂胶催化层压板：adhesive-coated catalyzed laminate涂胶无催层压板：adhesive-coated uncatalyzed laminate粘结层：bonding layer粘结膜：film adhesive涂胶粘剂绝缘薄膜：adhesive coated dielectric film无支撑胶粘剂膜：unsupported adhesive film覆盖层：cover layer (cover lay) 增强板材：stiffener material铜箔面：copper-clad surface 去铜箔面：foil removal surface 层压板面：unclad laminate surface 基膜面：base film surface胶粘剂面：adhesive faec原始光洁面：plate finish粗面：matt finish纵向：length wise direction模向：cross wise direction剪切板：cut to size panel酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates超薄型层压板：ultra thin laminate陶瓷基覆铜箔板：ceramics base copper-clad laminates紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates 三基材的材料A阶树脂：A-stage resinB阶树脂：B-stage resinC阶树脂：C-stage resin环氧树脂：epoxy resin酚醛树脂：phenolic resin聚酯树脂：polyester resin聚酰亚胺树脂：polyimide resin 双马来酰亚胺三嗪树脂：bismaleimide-triazine resin丙烯酸树脂：acrylic resin三聚氰胺甲醛树脂：melamine formaldehyde resin多官能环氧树脂：polyfunctional epoxy resin溴化环氧树脂：brominated epoxy resin环氧酚醛：epoxy novolac氟树脂：fluroresin硅树脂：silicone resin硅烷：silane聚合物：polymer无定形聚合物：amorphous polymer结晶现象：crystalline polamer 双晶现象：dimorphism 共聚物：copolymer合成树脂：synthetic热固性树脂：thermosetting resin 热塑性树脂：thermoplastic resin 感光性树脂：photosensitive resin环氧当量：weight per epoxy equivalent (WPE)环氧值：epoxy value双氰胺：dicyandiamide粘结剂：binder胶粘剂：adesive固化剂：curing agent阻燃剂：flame retardant遮光剂：opaquer增塑剂：plasticizers不饱和聚酯：unsatuiated polyester聚酯薄膜：polyester聚酰亚胺薄膜：polyimide film (PI) 聚四氟乙烯：polytetrafluoetylene (PTFE)聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylene copolymer film (FEP)增强材料：reinforcing material 玻璃纤维：glass fiberE玻璃纤维：E-glass fibreD玻璃纤维：D-glass fibreS玻璃纤维：S-glass fibre玻璃布：glass fabric非织布：non-woven fabric玻璃纤维垫：glass mats纱线：yarn单丝：filament绞股：strand纬纱：weft yarn经纱：warp yarn但尼尔：denier经向：warp-wise纬向：weft-wise, filling-wise 织物经纬密度：thread count 织物组织：weave structure 平纹组织：plain structure坏布：grey fabric稀松织物：woven scrim弓纬：bow of weave断经：end missing缺纬：mis-picks纬斜：bias折痕：crease云织：waviness鱼眼：fish eye毛圈长：feather length厚薄段：mark裂缝：split捻度：twist of yarn浸润剂含量：size content浸润剂残留量：size residue 处理剂含量：finish level浸润剂：size偶联剂：couplint agent处理织物：finished fabric聚酰胺纤维：polyarmide fiber 聚酯纤维非织布：non-woven polyester fabric浸渍绝缘纵纸：impregnating insulation paper聚芳酰胺纤维纸：aromatic polyamide paper断裂长：breaking length 吸水高度：height of capillary rise湿强度保留率：wet strength retention白度：whitenness陶瓷：ceramics导电箔：conductive foil铜箔：copper foil电解铜箔：electrodeposited copper foil (ED copper foil)压延铜箔：rolled copper foil退火铜箔：annealed copper foil 压延退火铜箔：rolled annealed copper foil (RA copper foil)薄铜箔：thin copper foil涂胶铜箔：adhesive coated foil 涂胶脂铜箔：resin coated copper foil (RCC)复合金属箔：composite metallic material载体箔：carrier foil殷瓦：invar箔（剖面）轮廓：foil profile光面：shiny side粗糙面：matte side处理面：treated side防锈处理：stain proofing双面处理铜箔：double treated foil四设计原理图：shematic diagram逻辑图：logic diagram印制线路布设：printed wire layout布设总图：master drawing可制造性设计：design-for-manufacturability计算机辅助设计：computer-aided design.(CAD) 计算机辅助制造：computer-aided manufacturing.(CAM)计算机集成制造：computer integrat manufacturing.(CIM)计算机辅助工程：computer-aided engineering.(CAE)计算机辅助测试：computer-aided test.(CAT)电子设计自动化：electric design automation .(EDA)工程设计自动化：engineering design automaton .(EDA2)组装设计自动化：assembly aided architectural design. (AAAD)计算机辅助制图：computer aided drawing计算机控制显示：computer controlled display .(CCD)布局：placement布线：routing布图设计：layout重布：rerouting模拟：simulation逻辑模拟：logic simulation电路模拟：circit simulation时序模拟：timing simulation模块化：modularization布线完成率：layout effeciency 机器描述格式：machine descriptionm format .(MDF)机器描述格式数据库：MDF databse设计数据库：design database 设计原点：design origin优化（设计）：optimization (design)供设计优化坐标轴：predominant axis表格原点：table origin镜像：mirroring驱动文件：drive file中间文件：intermediate file制造文件：manufacturing documentation队列支撑数据库：queue support database元件安置：component positioning图形显示：graphics dispaly比例因子：scaling factor扫描填充：scan filling矩形填充：rectangle filling填充域：region filling实体设计：physical design逻辑设计：logic design逻辑电路：logic circuit层次设计：hierarchical design 自顶向下设计：top-down design 自底向上设计：bottom-up design线网：net数字化：digitzing设计规则检查：design rule checking走（布）线器：router (CAD)网络表：net list计算机辅助电路分析：computer-aided circuit analysis 子线网：subnet目标函数：objective function设计后处理：post design processing (PDP)交互式制图设计：interactive drawing design费用矩阵：cost metrix工程图：engineering drawing 方块框图：block diagram迷宫：moze元件密度：component density 巡回售货员问题：traveling salesman problem自由度：degrees freedom入度：out going degree出度：incoming degree曼哈顿距离：manhatton distance欧几里德距离：euclidean distance网络：network阵列：array段：segment逻辑：logic逻辑设计自动化：logic design automation分线：separated time分层：separated layer定顺序：definite sequence五形状与尺寸：导线（通道）：conduction (track) 导线（体）宽度：conductor width 导线距离：conductor spacing 导线层：conductor layer导线宽度/间距：conductorline/space第一导线层：conductor layer No.1圆形盘：round pad方形盘：square pad菱形盘：diamond pad长方形焊盘：oblong pad子弹形盘：bullet pad泪滴盘：teardrop pad雪人盘：snowman padV形盘：V-shaped pad环形盘：annular pad非圆形盘：non-circular pad隔离盘：isolation pad非凾能连接盘：mon-functional pad偏置连接盘：offset land腹（背）裸盘：back-bard land 盘址：anchoring spaur连接盘图形：land pattern连接盘网格阵列：land grid array 孔环：annular ring元件孔：component hole安装孔：mounting hole支撑孔：supported hole非支撑孔：unsupported hole导通孔：via镀通孔：plated through hole (PTH)余隙孔：access hole盲孔：blind via (hole)埋孔：buried via hole埋/盲孔：buried /blind via任意层内部导通孔：any layerinner via hole (ALIVH)全部钻孔：all drilled hole定位孔：toaling hole无连接盘孔：landless hole中间孔：interstitial hole无连接盘导通孔：landless via hole引导孔：pilot hole端接全隙孔：terminal clearomee hole准表面间镀覆孔：quasi-interfacing plated-through hole准尺寸孔：dimensioned hole在连接盘中导通孔：via-in-pad 孔位：hole location孔密度：hole density孔图：hole pattern钻孔图：drill drawing装配图：assembly drawing印制板组装图：printed board assembly drawing参考基准：datum referanAssembly line组装线 Layout 布置图 Conveyer流水线物料板Rivet table拉钉机 Rivet gun 拉钉枪 Screw driver起子Electric screw driver电动起子 Pneumatic screw driver气动起子worktable 工作桌 OOBA开箱检查 fit together组装在一起fasten锁紧(螺丝) fixture 夹具(治具) pallet栈板 barcode条码barcode scanner条码扫描器 fuse together熔合 fuse machine热熔机repair修理 operator作业员 QC 品管 supervisor 课长 ME制造工程师 MT制造生技 cosmetic inspect外观检查 inner parts inspect内部检查 thumb screw大头螺丝 lbs. inch镑、英寸 EMI gasket导电条front plate前板 rear plate后板 chassis 基座 bezel panel 面板power button电源按键 reset button重置键 Hi-pot test of SPS高源高压测试 sheet metal parts 冲件 plastic parts塑胶件 SOP制造作业程序material check list物料检查表 work cell工作间电源电压接拉键carton纸箱 sub-line支线 left fork叉车personnel resource department 人力资源部 production department生产部门 planning department企划部 QC Section品管科 stamping factory冲压厂 painting factory烤漆厂 molding factory成型厂common equipment常用设备 uncoiler and straightener 整平机punching machine 冲床robot机械手hydraulic machine油压机lathe车床planer |'plein| 刨床miller铣床grinder磨床driller??床linear cutting线切割electrical sparkle电火花welder电焊机staker=reviting machine铆合机position职务president董事长general manager总经理 special assistant manager特助factory director厂长 department director部长deputy manager | =vice manag er副理 section supervisor课长deputy section supervisor =vice section superisor副课长group leader/supervisor组长 line supervisor线长 assistant manager助理 to move, to carry, to handle 搬运 be put in storage入库pack packing凿装 to apply oil 擦油 to file burr 锉毛刺final inspection终检 to connect material接料 to reverse material 翻料wet station沾湿台 Tiana天那水 cleaning cloth抹布 to load material上料 to unload material卸料 to return material/stock t o退料scraped |'skræpid|报废 scrape ..v.刮;削 deficient purchase来料不良manufacture procedure制程 deficient manufacturing proc edure制程不良 oxidation |' ksi'dei n|氧化 scratch刮伤 dents压痕 defective upsiding down抽芽不良 defective to staking铆合不良embedded lump镶块 feeding is not in place 送料不到位stamping-missing漏冲 production capacity生产力education and training教育与训练 proposal improvement提案改善spare parts=buffer备件 forklift叉车 trailer=long vehicle拖板车compound die合模 die locker锁模器 pressure plate=plate pinch 压板bolt螺栓 name of a department部门名称 administration/general affair s dept总务部 automatic screwdriv er电动启子 thickness gauge 厚薄规 gauge(or jig)治具 power wire电源线 buzzle蜂鸣器 defective product lab el不良标签 identifying sheet list标示单screwdriver holder起子插座 pedal踩踏板 stopper阻挡器flow board流水板 hydraulic hand-jack油压板车 forklift叉车pallet栈板 glove(s)手套 glove(s) with exposed finger s割手套 thumb大拇指 forefinger食指 mid-finger 中指 ring finger无名指little finger小指 band-aid创可贴 iudustrial alcohol工业酒精alcohol container沾湿台 head of screwdriver起子头sweeper扫把 mop拖把 vaccum cleaner吸尘器rag 抹布 garbage container灰箕 garbage can垃圾箱garbage bag垃圾袋 chain链条 jack升降机 production line 流水线chain链条槽 magnetizer函磁器 lamp holder灯架to mop the floor拖地 to clean the floor扫地 to clean a table擦桌子air pipe 气管 packaging tool 打凿机 packaging打凿missing part漏件 wrong part 错件 excessive defects过多的缺陷critical defect极严重缺陷 major defect主要缺陷minor defect次要缺陷 not up to standard不合规格dimension/size is a little bigger 尺寸偏大(小) cosmetic defect 外观不良slipped screwhead/slippery scre w head螺丝滑头slipped screwhead/shippery scr ew thread滑手speckle斑点 mildewed=moldy=mouldy 发霉 rust生锈deformation变形 burr(金属)flash(塑件)毛边 poor staking 铆合不良excesssive gap间隙过大 grease/oil stains油污 inclusion杂质painting peel off脏污 shrinking/shrinkage缩水 mixed color杂色scratch划伤 poor processing 制程不良 poor incoming part事件不良fold of packaging belt打凿带折皱painting make-up补漆 discoloration羿色 water spots水渍polishing/surface processing表面处理 exposed metal/bare metal金属裸露 lack of painting烤漆不到位 safety安全 quality品质 delivery deadline交货程 die repair模修enterprise plan = enterprise ex pansion projects企划QC品管 die worker模工 production, to produce生产equipment设备 to start a press开机 stop/switch off a press关机classification整理 regulation整顿 cleanness清扫 conservation 清洁 culture教养 qualified products, up-to-g rade products良品defective products, not up-to-gr ade products不良品waste废料 board看板 feeder 送料机 sliding rack滑料架defective product box不良品箱 die change 换模 to fix a die装模to take apart a die拆模 to repair a die修模 packing material凿材basket蝴蝶竺 plastic basket胶isolating plate baffle plate; barr icade隔板 carton box纸箱to pull and stretch拉深to put material in place, to cut material, to input落料to impose lines压线 to compress, compressing 压缩character die字模 to feed, feeding送料 transportation运输(be)qualfied, up to grade合格 not up to grade, not qualifi ed不合格material change, stock change 材料变更 feature change 特性变更evaluation评估 prepare for, make preparati ons for 准备parameters参数 rotating speed, revolution转速manufacture management制造管理 abnormal handling异常处理production unit生产单位 lots of production生产批量steel plate钢板 roll material卷料 manufacture procedure制程operation procedure作业流程 to revise, modify修订to switch over to, switch---to th row--over switching over切换engineering, project difficulty 工程瓶颈 stage die工程模automation自动化 to stake, staking, reviting铆合add lubricating oil函润滑油 shut die架模 shut height of a die架模高度analog-mode device类模器die lifter举模器 argon welding 氩焊vocabulary for stamping模具专业英语[分享] 模具述语一、入水：gate进入位：gate location 水口大水口：edge gate 细水口： pin-point gate水口大小：gate size 转水口：switching runner/gate唧嘴口径：sprue diameter二、流道: runner热流道：hot runner,hot manifold 热嘴冷流道: hot sprue/cold runner唧嘴直流: direct sprue gate 圆形流道：round(full/half runner流道电脑分析：mold flow analysis 流道平衡:runner balance热嘴：hot sprue 热流道板：hot manifold发热管：cartridge heater 探针: thermocouples插头：connector plug 插座： connector socket 密封/封料： seal三、运水：water line塑胶管：plastic tube 快速接头：jiffy quick connector plug/socke r四、模具零件：mold components三板模：3-plate mold 二板模：2-plate mold边钉/导边：leader pin/guide pin 边司/导套：bushing/guide bushing中托司：shoulder guide bushing 中托边L：guide pin顶针板：ejector retainner plate 托板：support plate螺丝： screw 管钉：dowel pin 开模槽：ply bar scot内模管位：core/cavity inter-lock 顶针：ejector pin司筒：ejector sleeve 司筒针：ejector pin movable core,return core core puller扣机（尼龙拉勾）：nylon latch lock 斜顶：lifter模胚（架）： mold base 上内模：cavity insert下内模：core insert 行位（滑块）： slide镶件：insert 压座/斜鸡：wedge 耐磨板/油板：wedge wear plate 压条：plate 撑头: support pillar 唧嘴： sprue bushing挡板：stop plate 定位圈：locating ring 锁扣：latch扣鸡：parting lock set 推杆：push bar 栓打螺丝：S.H.S.B 顶板：eracuretun 活动臂：lever arm 分流锥：spure sperader水口司:bush 垃圾钉：stop pin 隔片：buffle弹弓柱：spring rod 弹弓:die spring 中托司：ejector guide bush针：pin 销子：dowel pin波子弹弓：ball catch 喉塞: pipe plug 锁模块：lock plate斜顶：angle from pin 斜顶杆：angle ejector rod尼龙拉勾：parting locks 活动臂：lever arm复位键、提前回杆：early return bar 气阀：valves斜导边：angle pin 术语：terms承压平面平衡：parting surface support balance 模排气：parting line venting回针碰料位：return pin and cavity interferen ce模总高超出啤机规格：mold base shut hight顶针碰运水：water line interferes withejector pin料位出上/下模：part from cavith (core) side 模胚原身出料位：cavity direct cut on A-plate,core direct cut on B-plate.不准用镶件： Do not use (core/cavity) i nsert用铍铜做镶件： use beryllium copper inser t初步（正式）模图设计：preliinary (final) mold design反呵：reverse core 弹弓压缩量：spring compressed length 稳定性好：good stability,stable 强度不够：insufficient rigidity均匀冷却：even cooling 扣模：sticking热膨胀：thero expansion 公差：tolorance 铜公(电极）：copper electrode常用塑料英语缩略语[分享]英文简称英文全称中文全称ABA Acrylonitrile-butadiene-acr ylate 丙烯腈/丁二烯/丙烯酸酯ABS Acrylonitrile-butadiene-styr ene 丙烯腈/丁二烯/苯乙烯共聚物AES Acrylonitrile-ethylene-styre ne 丙烯腈/乙烯/苯乙烯共聚物AMMA Acrylonitrile/methyl Met hacrylate 丙烯腈/甲基丙烯酸甲酯共聚物ARP Aromatic polyester 聚芳香酯AS Acrylonitrile-styrene resin 丙烯腈-苯乙烯树脂ASA Acrylonitrile-styrene-acryla te 丙烯腈/苯乙烯/丙烯酸酯共聚物CA Cellulose acetate 醋酸纤维塑料CAB Cellulose acetate butyrate 醋酸-丁酸纤维素塑料CAP Cellulose acetate propionat e 醋酸-丙酸纤维素CE Cellulose plastics, general 通用纤维素塑料CF Cresol-formaldehyde 甲酚-CMC Carboxymethyl cellulose 羧甲基纤维素CN Cellulose nitrate 硝酸纤维素CP Cellulose propionate 丙酸纤维素CPE Chlorinated polyethylene 氯化聚乙烯CPVC Chlorinated poly(vinyl chl oride) 氯化聚氯乙烯CS Casein 酪蛋白CTA Cellulose triacetate 三醋酸纤维素EC Ethyl cellulose 乙烷纤维素EMA Ethylene/methacrylic acid 乙烯/甲基丙烯酸共聚物EP Epoxy, epoxide 环氧树脂EPD Ethylene-propylene-diene 乙烯-丙烯-二烯三元共聚物EPM Ethylene-propylene polym er 乙烯-丙烯共聚物EPS Expanded polystyrene 发泡ETFE Ethylene-tetrafluoroethyle ne 乙烯-四氟乙烯共聚物EVA Ethylene/vinyl acetate 乙烯-醋酸乙烯共聚物EVAL Ethylene-vinyl alcohol 乙烯-乙烯醇共聚物FEP Perfluoro(ethylene-propyle ne) 全氟（乙烯-丙烯）塑料FF Furan formaldehyde 呋喃甲醛HDPE High-density polyethylen e plastics 高密度聚乙烯塑料HIPS High impact polystyrene 高冲聚苯乙烯IPS Impact-resistant polystyren e 耐冲击聚苯乙烯LCP Liquid crystal polymer 液晶聚合物LDPE Low-density polyethylene plastics 低密度聚乙烯塑料LLDPE Linear low-density polye thylene 线性低密聚乙烯LMDPE Linear medium-density polyethylene 线性中密聚乙烯零件英语零件类punch冲头 insert入块(嵌入件) deburring punch压毛边冲子groove punch压线冲子 stamped punch字模冲子round punch圆冲子 special shape punch异形冲子bending block折刀 roller滚轴 baffle plate挡块located block定位块 supporting block for loca tion 定位支承块air cushion plate气垫板 air-cushion eject-rod气垫顶杆trimming punch切边冲子 stiffening rib punch = sting er 函强筋冲子ribbon punch压筋冲子 reel-stretch punch卷圆压平冲子guide plate定位板 sliding block 滑块 sliding dowel block滑块固active plate活动板 lower sliding plate下滑块板upper holder block上压块 upper mid plate上中间板spring box弹簧箱 spring-box eject-rod弹簧箱顶杆spring-box eject-plate弹簧箱顶板 bushing block衬套cover plate盖板 guide pad导料块塑件&模具相关英文compression molding压缩成型 flash mold溢流式模具plasitive mold挤压式模具 split mold分割式模具cavity型控母模 core模心公模 taper锥拔 leather cloak仿皮革 shiver饰纹 flow mark流痕 welding mark溶合痕 post screw insert螺纹套筒埋值 self tapping screw自攻螺丝striper plate脱料板 piston活塞 cylinder汽缸套chip细碎物 handle mold手持式模具移转成型用模具encapsulation molding低压封装成型射出成型用模具 two plate两极式（模具） well type蓄料井insulated runner绝缘浇道方式 hot runner热浇道runner plat浇道模块 valve gate阀门浇口band heater环带状的电热器 spindle阀针spear head刨尖头 slag well冷料井cold slag冷料渣 air vent排气道welding line熔合痕 eject pin 顶出针 knock pin顶出销return pin回位销反顶针 sleave套筒 stripper plateinsert core放置入子 runner stripper plate浇道脱料板guide pin导销 eject rod (bar)（成型机）顶业捧subzero深冷处理 three plate 三极式模具runner system浇道系统 stress crack应力电裂orientation定向 sprue gate射料浇口，直浇口nozzle射嘴 sprue lock pin料头钩销(拉料杆)slag well冷料井 side gate侧浇口edge gate侧缘浇口 tab gate 搭接浇口 film gate薄膜浇口flash gate闸门浇口 slit gate缝隙浇口 fan gate扇形浇口 dish gate因盘形浇口 diaphragm gate隔膜浇口 ring gate环形浇口subarine gate潜入式浇口 tunnel gate隧道式浇口 pin gate针点浇口Runner less无浇道 (sprue less)无射料管方式long nozzle延长喷嘴方式 sprue浇口;溶渣冲压英语stamping, press冲压 punch press, dieing out pre ss冲床uncoiler & strainghtener整平机 feeder送料机rack, shelf, stack料架 cylinder 油缸robot机械手 taker取料机 conveyer belt输送带transmission rack输送架 top stop上死点 bottom stop下死点one stroke一行程 inch寸动 to continue, cont.连动to grip(material)吸料 location lump, locating piece , block stop 定位块reset复位 smoothly顺利 dent 压痕 scratch刮伤 deformationfilings铁削 to draw holes抽孔 inquiry, search for查寻to stock, storage, in stock库存 receive领取approval examine and verify审核 processing, to process函工delivery, to deliver 交货 to return delivenry to.to send delinery back to retrn of goods退货registration登记 registration card登记卡to control管制 to put forward and hand i n提报safe stock安全库存 acceptance = receive验收to notice通知 application form for purchas e请购单consume, consumption消耗 to fill in填写abrasion磨损 reverse angle = chamfer character die字模 to collect, to gather收集failure, trouble故障 statistics 统计 demand and supply需求career card履历卡 to take apart a die卸下模具to load a die装上模具 to tight a bolt拧紧螺栓to looser a bolt拧松螺栓 to move away a die plate 移走模板easily damaged parts易损件 standard parts标准件breaking.(be)broken,(be)cracke d 断裂 to lubricate润滑common vocabulary for die eng ineering模具工程常用词汇die 模具 figure file, chart file 图档cutting die, blanking die冲裁模 progressive die, follow (-on) die 连续模模 punched hole冲孔 panel board镶块 to cutedges=side cut=side scrap切边 to bending 折弯 to pull, to stretch拉伸 Line streching, line pulling线拉伸 engraving, to engrave刻印 upsiding down edges翻边 to stake铆合designing, to design设计 design modification设计变化die block模块 folded block折弯块sliding block滑块 location pin 定位销 lifting pin顶料销die plate, front board模adding block垫块 stepping bar垫条upper die base上模座 lower die base下模座upper supporting blank上承板 upper padding plate blank 上垫板spare dies模具备品 spring 弹簧 bolt螺栓击版印刷术语英语翻译摆版imposition 根据装订形式和套印方法的要求，将单块或联块印版按一定规范排列。
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丝印定位孔
Guide Hole for Screen Printing
孔环
Lifted Land
渗锡孔
StannizeHole
装配孔
Fitting Hole
制程
Manufacture Procedure
下料
Material Preparation
Bottom Silver Paste
银浆油墨
Sliver Ink
顶层线路
Top Circuits/Conductors
底层线路
Bottom Circuits/Conductors
半固化片
Bonding Film (BOD)
聚酰亚胺
Polyimide(PI)
聚酯
PolyesterFilm (PET)
FPC-专业词汇-中英文对照
FPC名词中英对照
1. 目的
通过对行业标准的FPC工程名词引用及我司标准的整合，旨在为我司FPC名词的中英用语实现使用上的统一化
2. 适用范围
规范FPC相关工程上出现之不良项目，生产使用之材料、设备、治具以及可靠性试验等中英文名词
3. 定义
无
类别一：FPC不良项目名词
工程类别
孔与焊盘的重合性
Registration of Hole to Land
覆盖层与焊盘的重合性
Registration of Coverlay (or Covercoat) to Land
增强板与FPC的重合性
Registration of Stiffener to FPC
孔的重合性
Registration of Holes
丝印字符
Printingof Legend
贴补强板
Back Board Lamination
电性能测试
Electrical Inspection
贴胶纸
Double Faced Adhesive Tape
打孔
Punching
雷射切割
Laser Cut
自动光学检验
Automatic Optical Inspection （AOI）
漏镀
No Plating
表面伤痕
Plating Scratch
电镀粗糙
Rough Plated
药水渗入
Wicking
外形和孔边缘
Visual Inspection of Edges of Outline and Holes
撕裂和缺口
Tears and Nicks
毛刺
Burrs
丝状毛刺
Thready Burrs
外形的重合性
Registration of Outlines
冲外形与导线图形的重合性
Registration of Punched Outline to Conductor Patterns
压敏胶或热固胶与FPC和增强板的重合性
Registration of Pressure Sensitive or Heat Activated Adhesives to FPC and Stiffener
前处理
Pre-treatment
刷板
Brushing
干燥
Dry up
电镀（金、锡、镍）
(Gold、Solder、Nickel) Plating
闪镀
(Gold ) Flash Plating/Strike Plating
局部电镀
Pattern Plate
化学镍金
Immersion Gold
有机保焊膜
Organic Solderability Preservatives(OSP)
钢片
Sheet Steel
玻璃纤维布
WovenGlassCloth
FR4补强板
Fiberboard
液态感光油墨
Liquid Photoimageable Resist Ink
压敏胶
孔
Holes
元件孔
Component Holes
导通孔
Via Holes
导通孔偏移
Via Hole Misalign
安装孔
Mounting Holes
导线宽度
Conductor Widths
导线之间的间距
Clearances Between Conductors
孔中心间距
Distance Between Hole Centers
导线分层
Conductor Delamination
裂纹
Cracks
导线划痕
Scratches on Conductor
凹坑
Dents
变色
Discoloration
基底薄膜
Visual Inspection of Base Film
凹坑
Dents
划痕
Scratches on Base Film
覆盖层和覆盖涂层
Exposure Jig
丝印网框
ScreenPrintingFrame
孔
Hole
曝光定位孔
Guide Hole for Exposure
模具定位孔
Guide Hole for Die
假贴定位孔
Guide Hole for Tacking
贴合定位孔
Guide Hole for Adhesive
电测定位孔
工程类别
中 文
英 文
板
Board Type
单面板
Single Sided Flex Circuits
单面双接触
Double Access or Back-bared Flex Circuits
双面板
Double Sided Flex Circuits
软硬结合板
Rigid-flex Circuits
模具
板边和导线之间的最小距离
Minimum Distance Between Board Edges and Conductors
标记错误
Wrong Marking
字符不清晰
Unclear Letter
定位精度Positional Accuracy
孔的定位精度
Positional Accuracy of Holes
贴保护膜
Tacking Coverlay
粗化
Abrade
层压
Lamination
固化(烘烤）
Curing
黑孔eatment
循环水洗
Cascade Rinse
微蚀
Micro-etch
酸洗
Acid Cleaning
水洗
Water Cleaning
防锈处理
Anti-corrosion Treatment
镀锡
Tin Plating
电镀金属或焊料的渗透
Penetration of Plated Metal or Solder
变暗（变黑）
Darkened Appearance (Blackening Discoloration)
镀铜孔内镀层空洞
Plating Voids in Plated-though Hole
镀通孔的镀铜层厚度
Plating Thickness of Copper Panted-through Holes
其它Other
短装
Shortage
混装
Mixed Stowage/Packing
离型纸脱落
Released Paper Peeled off
材料错误
Wrong Material
类别二：PFC工程用语
弯曲、变形
Warpage
微连筋不良
Poor Micro-joint
外形偏移
Outline Misalign
外形漏冲
NoOutline
反折偏位
Bending Line Misalign
增强板
Visual Imperfections Related to Stiffener Bonding
FPC与增强板之间的外来物
性能测试
ReliabilityTest
包装
Packing
原材料 Material
铜箔
Copper Foil(CU)
电解铜
Electro-deposited Copper Foil (ED)
压延铜
Rolled Annealed Copper Foil (RA)
保护膜
Coverlay (CVL)
基材
Base Material
Visual Inspection of Coverlay and Covercoat
凹坑
Dents on Coverlay and Covercoat
划痕
Scratches on Coverlay and Covercoat
空洞
Void
偏位
CoverlayMisalign
毛刺
CoverlayBurrs
镀金粗糙
Rough Gold
镀金白雾
Gold Discoloration
镀金变色
Gold Discoloration
镀金层龟裂
Gold Crack
镀金针孔
Gold Pinhole
电镀露铜
Plated Expose Wetting
剥离
Plated Peeled Off
电镀渗入
Plated Wicking
不良名称中文
英文
导线
Visual Inspection of Conductors