焊线及焊线工艺介绍

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焊线及焊线工艺介绍 •lead
Capillary rises to loop height position
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焊线及焊线工艺介绍 •lead
Capillary rises to loop height position
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焊线及焊线工艺介绍 •lead
Capillary rises to loop height position
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•RD (Reverse Distance)
焊线及焊线工艺介绍 •lead
Formation of a loop
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焊线及焊线工艺介绍 •lead
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焊线及焊线工艺介绍 •lead
•WIRE CLAMP ‘CLOSE’
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•Calculated •Wire Length
焊线及焊线工艺介绍 •lead
焊线及焊线工艺介绍
Eagle
•MACHINE SPECIFICATIONS (I) •Bonding System
•Bonding Method Thermosonic (TS)
•BQM Mode Constant Current, Voltage, Power and Normal
•
(Programmable)
焊线及焊线工艺介绍
W/H ASSY
• changeover •·Fully programmable indexer & tracks •·Motorized window clamp with soft close feature •·Output indexer with leadframe jam protection feature • Tool less conversion window clamps and top plate enables fast device
焊线及焊线工艺介绍
X Y Table
•Linear 3 phase AC Servo motor •High power AC Current Amplifier •DSP based control platform •High X-Y positioning accuracy of +/- 1 mm •Resolution of 0.2 mm
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•Calculated •Wire Length
焊线及焊线工艺介绍 •lead
•SEARCH DELAY
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焊线及焊线工艺介绍 •lead
•TRAJECTOR Y
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焊线及焊线工艺介绍 •lead
•TRAJECTOR Y
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焊线及焊线工艺介绍 •lead
•TRAJECTOR Y
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焊线及焊线工艺介绍 •lead
Capillary rises to loop height position
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焊线及焊线工艺介绍 •lead
Capillary rises to loop height position
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•RH
焊线及焊线工艺介绍 •lead
Formation of a loop
封裝簡介
晶片 Die
金線 Gold
Wire
導線架
Lead fram
焊线及焊线工艺介绍
Wafer Grinding
封裝流程
•Wafer Saw
•Die Bonding
•toaster
• Wire Bonding
• Die Surface Coating
• Molding
• Laser Mark
• BG
焊线及焊线工艺介绍
Eagle
•MACHINE SPECIFICATIONS (III)
•Material Handling System
•Indexing Speed 200 – 250 ms @ 0.5 “ pitch
•Indexer Resolution 1um
•Leadframe Position Accuracy + 2 mil
•
Solder
Ball
A
•
• SURFA • PlaDceejmuneknt
CE
•
TRIM
• MOUNT
• PTHKRGOU •
GH
•
Solder Plating
• HOLE
• Singula tion
• Solder
• • Plating
TRIM/
•
• Dej unk
• Packing
• TRI M
焊线及焊线工艺介绍
Bonding Process
焊线及焊线工艺介绍
The Wire Bond •PREHEAT Temp
BONDSITE
•CU L/F200+/-10
200+/-10
•AL L/F210+/-10
230+/-10
•BGA 150+/-10
160+/-10
•TFBGA150+/-10
•
(3 leads/frame)
•Lead Locator Accuracy + 2.4 um
•Post Bond Inspection First Bond, Second Bond
•
Wire Tracing
•Max. Die Level Different 400 – 500 um
•Facilities •Voltage 110 VAC (optional 100/120/200/210/ •220/230/240 VAC
焊线及焊线工艺介绍
Wire Bond 原理
•Ball Bond •( 1st Bond )
•Wedge Bond •( 2nd Bond )
•Gold wire
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焊线及焊线工艺介绍
B.PRINCIPLE
•PRESSURE •VIBRATION
•AL2O3
•CONTAMINATION •GLASS
•No. of Bonding Wires up to 1000
•Program Storage 1000 programs on Hard Disk
•Multimode Transducer System
•
Programmable profile, control and vibration modes
•PRESSURE
•Ultra •Sonic •Vibration
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•heat
焊线及焊线工艺介绍 •lead
Formation of a first bond Base
•PRESSURE
•Ultra
•Sonic
•Vibratio n
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•heat
焊线及焊线工艺介绍 •lead
Capillary rises to loop height position
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焊线及焊线工艺介绍 •lead
•TRAJECTOR Y
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焊线及焊线工艺介绍 •lead
•TRAJECTOR Y
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焊线及焊线工艺介绍 •lead
•TRAJECTOR Y
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焊线及焊线工艺介绍 •lead
•TRAJECTOR Y
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焊线及焊线工艺介绍 •lead
•TRAJECTOR Y
•GOLD BALL
•A •SiOl2
•Si
•MOISTURE
焊线及焊线工艺介绍
銲接條件
HARD WELDING Pressure (Force) Amplify & Frequecy Welding Time (Bond Time) Welding Tempature (Heater) THERMAL BONING Thermal Compressure Ultrasonic Energy (Power)
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•SEARCH SPEED1 •SEARCH TOL 1
焊线及焊线工艺介绍 •lead
Free air ball is captured in the chamfer
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•SEARCH SPEED1 •SEARCH TOL 1
焊线及焊线工艺介绍
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Formation of a first bond
160+/-10
•LBGA 150+/-10
160+/-10
•NOT INCLUDE DEDICATE LINE
焊线及焊线工艺介绍
Free air ball is captured in the chamfer
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焊线及焊线工艺介绍
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Free air ball is captured in the chamfer
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•SEARCH SPEED1 •SEARCH TOL 1
焊线及焊线工艺介绍
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Formation of a first bond
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•IMPACT FORCE
•SEARCH SPEED1 •SEARCH TOL 1
焊线及焊线工艺介绍
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Formation of a first bond Contact
焊线及焊线工艺介绍
Bond Head ASSY
• Low impact force •Real time Bonding Force monitoring • High resolution z-axis position with 2.5 micron per step resolution • Fast contact detection • Suppressed Force vibration • Fast Force response • Fast response voice coil wire clamp
•
L = 140 – 300 mm
•
H = 180 mm (Maximum)
•Magazine Pitch 2.4 – 10 mm (0.09” – 0.39 “)
•Device Changeover < 4 minutes
•Package Changeover < 5 minutes
•Number of Buffer Magazine 3 (max. 435 mm)
焊线及焊线工艺介绍
2020/11/21
焊线及焊线工艺介绍
CONTENTS
ASSEMBLY FLOW OF PLASTIC IC
Wire Bond 原理
M/C Introduction
Wire Bond Process
Material
SPEC
Calculator
DEFECT
焊线及焊线工艺介绍
•Applicable Leadframe W = 17 – 75 mm @ bonding area in Y = 65mm
•ຫໍສະໝຸດ Baidu
= 17 – 90 mm @ bonding area in Y = 54mm
•
L = 280 mm [Maximum]
•
T = 0.075 – 0.8 mm
•Applicable Magazine W = 100 mm (Maximum)
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•SEARCH HEIGHT
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焊线及焊线工艺介绍
Free air ball is captured in the chamfer
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•SEARCH SPEED1 •SEARCH TOL 1
焊线及焊线工艺介绍
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Free air ball is captured in the chamfer
焊线及焊线工艺介绍
Eagle
•MACHINE SPECIFICATIONS (II)
•Vision System
•Pattern Recognition Time 70 ms / point
•Pattern Recognition Accuracy + 0.37 um
•Lead Locator Detection 12 ms / lead
•Loop Type Normal, Low, Square & J
•XY Resolution 0.2 um
•Z Resolution (capillary travelling motion)2.5 um
•Fine Pitch Capability 35 mm pitch @ 0.6 mil wire
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焊线及焊线工艺介绍 •lead
•TRAJECTOR Y
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焊线及焊线工艺介绍 •lead
•TRAJECTOR Y
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焊线及焊线工艺介绍 •lead
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•2nd Search Height
•Search Speed 2 •Search Tol 2
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•SEARCH SPEED1 •SEARCH TOL 1
焊线及焊线工艺介绍
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Free air ball is captured in the chamfer
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•SEARCH SPEED1 •SEARCH TOL 1
焊线及焊线工艺介绍
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Free air ball is captured in the chamfer