常见金属的腐蚀液配方
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4.2 micron/min
NaOH: Water
1:1
may be used at25 Cbut etches faster at a higher temperature
Aluminum (Al)
H3PO4
---
must be heated to120 C
Chromium (Cr)
HCl: Water
3:1
---
Chromium (Cr)
Material to be Etched
Chemicals
Ratio
Comments
Aluminum (Al)
H3PO4: Water : Acetic Acid : HNO3
16:2:1:1
PAN Etch;
200 nm/min @25 C;
600 nm/min @40 C
Aluminum (Al)
8:1
age for 1 hour;
use at70 C
Polysilicon(Si)
HNO3: Water : HF
50:20:1
remove oxide first;
540 nm/min @25C
Polysilicon(Si)
HNO3: HF
3:1
remove oxide first;
high etch rate:
5:1
---
Nickel (Ni)
HF: HNO3
1:1
---
Palladium (Pd)
HCl: HNO3
3:1
AquaRegia;
discard after use
Platinuபைடு நூலகம் (Pt)
HCl: HNO3: Water
3:1:4
use at95 C
Platinum (Pt)
HCl: HNO3
HCl:Glycerin
1:1
---
Copper (Cu)
HNO3: Water
5:1
---
Copper (Cu)
AmmoniumPersulphate
---
---
Gold (Au)
KI : I : Water
115 g:65 g: 100 ml
---
Gold (Au)
HCl: HNO3
3:1
AquaRegia;
discard after use
Iron (Fe)
HCl: Water
1:1
---
Iron (Fe)
HNO3: Water
1:1
---
Lead (Pb)
Acetic Acid : H2O2
1:1
for dissolving solder connections
Lead (Pb)
Acetic Acid : H2O2: Water
2:2:5
---
Molybdenum (Mo)
HCl: H2O2
1:1
---
Molybdenum (Mo)
H2SO4: HNO3: Water
1:1:1
---
Nichrome
H2SO4
---
use at100 C
Nichrome
HCl: HNO3: Water
1:1:3
---
Nickel (Ni)
HCl: HNO3
NaOH: Water
1:1
may be used at25 Cbut etches faster at a higher temperature
Aluminum (Al)
H3PO4
---
must be heated to120 C
Chromium (Cr)
HCl: Water
3:1
---
Chromium (Cr)
Material to be Etched
Chemicals
Ratio
Comments
Aluminum (Al)
H3PO4: Water : Acetic Acid : HNO3
16:2:1:1
PAN Etch;
200 nm/min @25 C;
600 nm/min @40 C
Aluminum (Al)
8:1
age for 1 hour;
use at70 C
Polysilicon(Si)
HNO3: Water : HF
50:20:1
remove oxide first;
540 nm/min @25C
Polysilicon(Si)
HNO3: HF
3:1
remove oxide first;
high etch rate:
5:1
---
Nickel (Ni)
HF: HNO3
1:1
---
Palladium (Pd)
HCl: HNO3
3:1
AquaRegia;
discard after use
Platinuபைடு நூலகம் (Pt)
HCl: HNO3: Water
3:1:4
use at95 C
Platinum (Pt)
HCl: HNO3
HCl:Glycerin
1:1
---
Copper (Cu)
HNO3: Water
5:1
---
Copper (Cu)
AmmoniumPersulphate
---
---
Gold (Au)
KI : I : Water
115 g:65 g: 100 ml
---
Gold (Au)
HCl: HNO3
3:1
AquaRegia;
discard after use
Iron (Fe)
HCl: Water
1:1
---
Iron (Fe)
HNO3: Water
1:1
---
Lead (Pb)
Acetic Acid : H2O2
1:1
for dissolving solder connections
Lead (Pb)
Acetic Acid : H2O2: Water
2:2:5
---
Molybdenum (Mo)
HCl: H2O2
1:1
---
Molybdenum (Mo)
H2SO4: HNO3: Water
1:1:1
---
Nichrome
H2SO4
---
use at100 C
Nichrome
HCl: HNO3: Water
1:1:3
---
Nickel (Ni)
HCl: HNO3