电子组装技术

表面安装技术
Internal Structure of MP-2
Internal Structure of Minimold
Internal Structure of MP-3Z, MP-25Z
SOP (Small Out-line L-Leaded Package)
characterized by gull-wing type leads which are drawn out from each package body in two directions, and can be mounted flat. The standard lead pitch is 1.27 mm (50 mil).
SSOP (Shrink Small Out-line
L-Leaded Package)
SOP packages with a lead pitch of less than 1.27 mm (50 mil) are called SSOP.
TSOP - TSSOP
(Thin Small Single Out-line L-Leaded Package)
陶瓷封装IC
Standard DIP
hermetic ceramic package. The lead pitch is 2.54 mm (100 mil) and the package body is made of ceramics. Metal or glass may be used as a sealing material.
CER-DIP [Glass Sealed]
called “CER-DIP” package.The lead pitch is 2.54 mm (100 mil), and the package body is molded with powder ceramics. The sealing material is glass.
电子组装技术
第一部分：电子组装工艺
通孔组装技术 表面贴装技术 电子元器件与电路板 波峰焊与回流焊 板上芯片技术 BGA技术 返修工艺技术
Surface Mount Technology (SMT) 表面贴装技术、表面组装技术
1 线路设计(protel等) 2 线路板PCB的制造：
（a）针头滴送SMT焊膏
（b）手工丝网印刷SMT焊膏
电子组装分类
按组装方法：
1) 通孔组装技术 THP 2) 表面组装技术 SMT 3) 特殊的组装技术
按材料分类：
1) 陶瓷封装——高可靠性 2) 塑料封装——低成本 (与陶瓷封装相比），更通 用
Mold Package
Glass Shield Packages
通孔组装技术Leabharlann Baidu
Internal Structure of TO-92
DlP---Standard(Dual In-line Package)
They are most widely used. The lead pitch is 2.54 mm(100 mil), and the spacing between terminal rows is 300, 400, or 600 mil.
DIP--Skinny
standard DIPs with spacing between terminal rows of 7.62 mm (300 mil) and with 20 or more pins.
DIP--Shrink
standard DIPs with a lead pitch reduced to 1.778mm (70 mil). They are smaller in external size than standard DIPs and suited to compact electronic equipment using high-pin-density IC packages.
ZIP (Zigzag In-line Package)
featured by the leads which are drawn out from each package body into a single row to allow vertical mounting with a lead pitch of1.27 mm (50 mil). The leads of each package are Zigzag folded, within thepackage surface thickness, into two rows. The Zigzag folding increases the lead pitch in each row to 2.54 mm (100 mil).
ultra thin SOPs with a package L-Leaded mounting height of less than 1.27 mm, and are suited to ultra-thin electronic equipment such as smart cards.
照相、腐蚀、叠层、打孔、切割、电镀、油漆等
3 表面贴装元件SMD的准备 4 焊膏印刷模板Stencil的准备
一种实验室用的SMT开发系统
5 焊膏印刷 6 表面贴装元件的放置和定位 7 再流焊Reflow 8 清洗 9 质量检验
（a）刮刀经过模板孔
（b）移开模板 模板印刷焊膏示意图
（c）印刷好的焊膏
PGA(Pin Grid Array)
featured by the leads which are drawn out vertically from each package body and arranged on the specified grid. The package body is made of ceramics, and the standard lead pitch is 2.54 mm (100 mil). PGA packages are suited to multipin packaging.