最新无铅制程培训资料

Lead-Free Manufacturing Engineering Training module for Technicians

Chinese Rev

Translated By: HUA-ME Lead Free team

Oct, 2004

A dvanced M anufacturing E ngineering

Lead (Pb) Free’s Background, why to apply Lead free (推行无铅化的背景, 为什么要推行无铅化)

Pb is harmful for Human’s health and environment

(铅对环境及人体健康是有害的)

Marketing and Legislative require to apply Lead (Pb) free, Especially in Electronic and Equipment.

(市场及立法机构要求推行无铅化, 尤其是在电子电气设备中.

EU (European Union) requires to meet Rohs requirement from Jul.1,2006. Including Pb Free requirement

(欧盟要求从2006年7月1日起在电子电气设备中禁止使用包括铅在内的六种有害物质)

Industry standard for Lead Free is Less than 0.1% Pb by weight in a products.

(无铅的现有工业判定标准是产品中铅含量必须小于产品重量的0.1%.

Lead Free’s impact and affect to Electronics industry

(无铅化对电子电气工业的冲击与影响)

Solder material (焊接材料)

Solder material have to change from Sn/Pb alloy to Sn/Ag/Cu or Sn/Cu alloy mainly.

(焊接材料不得不从以锡铅合金为主转向以锡银铜合金或锡铜合金为主.)

Solder material changing lead to the overall changing and impact in Electronics Industry, due to high soldering

temperature of SAC alloy.

(因为锡银铜合金的高焊接温度导致电子工业的全面转变与影响)

From Component manufacturing and PCB assembly process, it has to do compatible changing for Lead Free

(从元件制造到PCB组装制程, 不得不作出同无铅化相一致与兼容的变更) Viewpoint from different aspect, we can say the root impact and change is sourced from the High soldering temperature

(从某种不同的角度看, 我们可以说根本性的冲击与变更来源于焊接高温)

EMS PCB Assembly production

(电子制造服务PCB组装生产)

Conception of PCB Assembly production

(PCB组装生产的概念)

To solder Component on PCB with solder material at high temperature.

(在高温条件下, 用焊接材料将元件焊接到印制电路板上)

PCB (print circuit board) (印制电路板)

Component (元件)

Solder material (焊料)

Conception of PCB Assembly production

(PCB组装生产的概念)

Component (元件)

SMD Component

(表面贴装元件)

THT Component

(通孔元件)

Conception of PCB Assembly production (PCB组装生产的概念)

Solder paste on PCB (印

制电路板的焊接材料--锡膏)

Conception of PCB Assembly production (PCB组装生产的概念)

Soldering (焊接)

Conception of PCB Assembly production (PCB组装生产的概念)

PCBA (印制电路板组装件)

Lead Free’s soldering temperature profile (无铅回流焊接的温度曲线)

Lead Free’s reflow soldering temperature profile

(无铅回流焊接的温度曲线)

Reflow soldering requirement for Sn3~4Ag0.5Cu:

(锡银铜类无铅合金锡膏的回流焊接要求)

SAC Alloy’s melting point:217C~220C

(锡银铜合金的熔点: 217C~220C)

Reflow Time above Melting point to peak temperature 235~245C: 45s~120s

(高于熔点温度到峰值235C~245C的回流焊接时间: 45~120秒)

Reflow Time above 230C for solder joint: Minimum 10s

(高于230度的焊点回流焊接时间: 最少维护持10秒)