《微机电系统》PPT课件 (2)
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Technology, Richard Feynman gave a remarkably insightful lecture, “There is plenty of room at the bottom”. He tried to spur innovative miniature fabrication techniques for micromechannics, but he failed to generate a fundamentally new fabrication technique; ➢ In 1967, Invention of surface micromachining;
Definition:
MEMS is the integration of electrical elements, mechanical elements, sensor, actuators on a common silicon substrate through micro fabrication technology. These system can sense, control and actuate on the micro scale, and function individually or in Saernrsoaryssgattohergeinnfeorramtateioenfffreocm ttsheoennvmiraocnrmeontsctharloeug.h
MEMS support programs, AFOSR support basic research in materials and MEMS research, DARPA creates MUMPS foundry services with MCNC in 1993, NIST supports commercial foundries for CMOS and MEMS; ➢ In our country, “micron/nanometer manufacture technology national key laboratory” was founded in 1996; ➢ In 1992, Chris Pister (UCLA) creates first micromachined hinge, it’s features open possibilities for pseudo-3D structures and assembly; ➢ In 1992, MCNC starts the Multi User MEMS Process (MUMPS);
as Structural Material”, reference for material properties and etching data for silicon; ➢ In 1984, First polysilicon MEMS device;
➢ In 1980s, early experiments in surfacemicromachined polysilicon, first electrostatic comb drive actuators— micropositioning disc drive heads;
➢ In 1970, First silicon accelerometer demonstrated;
➢ In 1977, First capacitive pressure sensor; ➢ In 1980, "Silicon Torsional Scanning Mirror"; ➢ In 1982, Kurt Petersen published “silicon
CHAPTER ONE: Introduction of MEMS
Definition and fundamental concept of MEMS
MEMS history MEMS present MEMS prospect Applications of MEMS MEMS advantage
➢ In 1989, Lateral comb drive; ➢ In late 1980s, micromachining leverages
microelectronics industry, widespread experimentation and documentation increased public interest; Early transduction and actuation methods produce simple actuators; Micromachining methods aimed toward improving sensors, thermal and electrical isolation between layers with suspended structures; ➢ In early 1990s, Government agencies start
➢ In 1969, Westinghouse creates the “Resonant Gate FET” based on new microelectronics fabrication techniques;
➢ In 1970s, Bulk-etched silicon wafers used as pressure sensors;
measuring mechanical, thermal, biological, chemical, optical, and magnetic phenomena. The electronics then process the information derived from the sensors and through some decision making capability direct the actuators to respond by moving, positioning, regulating, pumping, and filtering, thereby controlling the environment for some desired outcome or purpose.
MEMS history
➢ In 1750s, First electrostatic motors; ➢ In 1958, Silicon strain gauges commercially
available; Hale Waihona Puke Baidu December 26, 1959, At California Institute of
Definition:
MEMS is the integration of electrical elements, mechanical elements, sensor, actuators on a common silicon substrate through micro fabrication technology. These system can sense, control and actuate on the micro scale, and function individually or in Saernrsoaryssgattohergeinnfeorramtateioenfffreocm ttsheoennvmiraocnrmeontsctharloeug.h
MEMS support programs, AFOSR support basic research in materials and MEMS research, DARPA creates MUMPS foundry services with MCNC in 1993, NIST supports commercial foundries for CMOS and MEMS; ➢ In our country, “micron/nanometer manufacture technology national key laboratory” was founded in 1996; ➢ In 1992, Chris Pister (UCLA) creates first micromachined hinge, it’s features open possibilities for pseudo-3D structures and assembly; ➢ In 1992, MCNC starts the Multi User MEMS Process (MUMPS);
as Structural Material”, reference for material properties and etching data for silicon; ➢ In 1984, First polysilicon MEMS device;
➢ In 1980s, early experiments in surfacemicromachined polysilicon, first electrostatic comb drive actuators— micropositioning disc drive heads;
➢ In 1970, First silicon accelerometer demonstrated;
➢ In 1977, First capacitive pressure sensor; ➢ In 1980, "Silicon Torsional Scanning Mirror"; ➢ In 1982, Kurt Petersen published “silicon
CHAPTER ONE: Introduction of MEMS
Definition and fundamental concept of MEMS
MEMS history MEMS present MEMS prospect Applications of MEMS MEMS advantage
➢ In 1989, Lateral comb drive; ➢ In late 1980s, micromachining leverages
microelectronics industry, widespread experimentation and documentation increased public interest; Early transduction and actuation methods produce simple actuators; Micromachining methods aimed toward improving sensors, thermal and electrical isolation between layers with suspended structures; ➢ In early 1990s, Government agencies start
➢ In 1969, Westinghouse creates the “Resonant Gate FET” based on new microelectronics fabrication techniques;
➢ In 1970s, Bulk-etched silicon wafers used as pressure sensors;
measuring mechanical, thermal, biological, chemical, optical, and magnetic phenomena. The electronics then process the information derived from the sensors and through some decision making capability direct the actuators to respond by moving, positioning, regulating, pumping, and filtering, thereby controlling the environment for some desired outcome or purpose.
MEMS history
➢ In 1750s, First electrostatic motors; ➢ In 1958, Silicon strain gauges commercially
available; Hale Waihona Puke Baidu December 26, 1959, At California Institute of